Electronic component embedded substrate and method for manufacturing the same

Abstract

This improves the connection reliability between the electrodes of an electronic component and the bottom of the first via conductor connected to the electronic component. [Solution] The electronic component embedded substrate of the present invention includes a core substrate, an electronic component housed in a through-hole of the core substrate and having electrodes on its upper surface, a through-hole provided in the core substrate and having electrodes on its upper surface, a first via conductor connected to the electrodes of the electronic component, and a second via conductor connected to the electrodes of the through-hole, wherein the length T of the first via conductor is longer than the length t of the second via conductor (T>t). In this electronic component embedded substrate, when the opening diameter of the first via conductor is D1 and the bottom diameter is D2, and the opening diameter of the second via conductor is d1 and the bottom diameter is d2, then D1>d1 and D2=d2.

Description

Technical Field

[0001] The present invention relates to a substrate with built-in electronic components having a structure of via conductors and a method for manufacturing the same.

Background Art

[0002] Conventionally, various types of substrates with built-in electronic components have been known (for example, Patent Document 1). FIG. 3 is a diagram showing an embodiment of a conventional substrate with built-in electronic components disclosed in Patent Document 1. In FIG. 3, a substrate 51 with built-in electronic components includes a core substrate 52, an electronic component 54 housed in a through-hole 53 of the core substrate 52 and having an electrode 54a on its upper surface, a through-hole 55 provided on the core substrate 52 and having an electrode 55a on its upper surface, a first via conductor 56 connected to the electrode 54a of the electronic component 54, and a second via conductor 57 connected to the electrode 55a of the through-hole 55.

[0003] In the conventional substrate 51 with built-in electronic components shown in FIG. 3, regarding the relationship between the first via conductor 56 and the second via conductor 57, in order to improve the connection reliability between the electrode 54a of the electronic component 54 housed in the through-hole 53 of the core substrate 52 and the first via conductor 56 connected to the electrode 54a, the length T of the first via conductor 56 is made longer than the length t of the second via conductor 57 (T>t). Also, when the opening diameter of the first via conductor 56 is D1 and the bottom diameter is D2, and the opening diameter of the second via conductor 57 is d1 and the bottom diameter is d2, D1 = d1 and D2 < d2.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the electronic component-embedded substrate 51 shown in Figure 3, under the condition D1=d1 in order to simultaneously form openings for via conductors, the length T of the first via conductor 56 is longer than the length t of the second via conductor 57. Therefore, the opening diameter D2 of the first via conductor 56 is smaller than the opening diameter d2 of the second via conductor 57. Consequently, the connection reliability between the electronic component 54 and the first via conductor 56 connected to the electronic component 54 was lower than the connection reliability between the through-hole 55 and the second via conductor 57 connected to the through-hole 55. [Means for solving the problem]

[0006] The present invention relates to an electronic component-embedded substrate which embeds an electronic component within the substrate, and includes a core substrate, an electronic component housed in a through-hole of the core substrate and having electrodes on its upper surface, a through-hole provided in the core substrate and having electrodes on its upper surface, a first via conductor connected to the electrodes of the electronic component, and a second via conductor connected to the electrodes of the through-hole, wherein the length T of the first via conductor is longer than the length t of the second via conductor (T>t), and when the opening diameter of the first via conductor is D1 and the bottom diameter is D2, and the opening diameter of the second via conductor is d1 and the bottom diameter is d2, then D1>d1 and D2=d2.

[0007] The present invention relates to a method for manufacturing an electronic component embedded substrate, comprising: forming openings for all via conductors in a resin insulating layer on the surface of the electronic component embedded substrate, with the opening diameter d1 of the second via conductor; measuring the bottom diameter X on the electrode of the electronic component in the opening for the first via conductor; predicting, from the measured bottom diameter X of the opening for the first via conductor, the conditions for forming the opening such that the bottom diameter D2 in the opening for the first via conductor is the same as the bottom diameter d2 in the opening for the second via conductor (D2=d2); and forming the opening for the first via conductor based on the predicted conditions for forming the opening. [Brief explanation of the drawing]

[0008] [Figure 1]This figure illustrates one embodiment of an electronic component embedded substrate according to the present invention. [Figure 2] (a) and (b) are diagrams illustrating a step in one embodiment of an electronic component embedded substrate according to the present invention. [Figure 3] This is a diagram illustrating one embodiment of a conventional electronic component-embedded circuit board. [Modes for carrying out the invention]

[0009] An embodiment of the electronic component-embedded substrate according to the present invention will be described with reference to the drawings. In the examples shown in Figures 1, 2(a), and 2(b), the dimensions of each component, particularly the height dimension, are described using dimensions different from the actual dimensions in order to better understand the features of the present invention. Furthermore, components that are normally present in printed circuit boards, such as wiring and bumps, are not described in order to better understand the features of the present invention.

[0010] <Regarding the electronic component-embedded substrate according to the present invention> Figure 1 is a diagram illustrating one embodiment of an electronic component embedded substrate according to the present invention. In the embodiment shown in Figure 1, the electronic component embedded substrate 1 includes at least a core substrate 2, an electronic component 4 housed in a through hole 3 of the core substrate 2 and having an electrode 4a on its upper surface, a through hole 5 provided in the core substrate 2 and having an electrode 5a on its upper surface, a first via conductor 6 connected to the electrode 4a of the electronic component 4, and a second via conductor 7 connected to the electrode 5a of the through hole 5. Furthermore, the length T of the first via conductor 6 is longer than the length t of the second via conductor 7 (T>t).

[0011] In the embodiment shown in Figure 1, a feature of the electronic component embedded substrate according to the present invention is that when the opening diameter of the first via conductor 6 is D1 and the bottom diameter is D2, and the opening diameter of the second via conductor 7 is d1 and the bottom diameter is d2, then D1 > d1 and D2 = d2.

[0012] In the above-described substrate 1 with built-in electronic components, by making the opening diameter D1 of the first via conductor 6 larger than the opening diameter d1 of the second via conductor 7 (D1 > d1), the bottom diameter D2 of the first via conductor 6 and the opening diameter D2 of the second via conductor 7 can be made the same diameter (D2 = d2). Therefore, compared with the conventional substrate with built-in electronic components (D2 < d2), the contact area between the electrode 4a of the electronic component 4 and the bottom of the first via conductor 6 connected to the electronic component 4 can be increased, and the connection reliability between the electrode 4a of the electronic component 4 and the bottom of the first via conductor 6 connected to the electronic component 4 can be improved.

[0013] In the above description, only the dimensional relationship of each part between the first via conductor 6 and the second via conductor 7, which is a feature of the present invention, has been described. For the forming methods of other members, for example, the core substrate 2, the electronic component 4 provided with the electrode 4a on the upper surface and housed in the through hole 3 of the core substrate 2, the through hole 5 provided on the core substrate 2 and provided with the electrode 5a on the upper surface, the first via conductor 6 connected to the electrode 4a of the electronic component 4, the second via conductor 7 connected to the electrode 5a of the through hole 5, etc., known methods can be used for the forming methods.

[0014] <Regarding the manufacturing method of the substrate with built-in electronic components according to the present invention> FIG. 2(a) and (b) are diagrams for explaining one step of an embodiment of the substrate with built-in electronic components according to the present invention. Hereinafter, according to FIGS. 2(a) and (b), the manufacturing method of the substrate with built-in electronic components according to the embodiment shown in FIG. 1 will be described.

[0015] First, as shown in FIG. 2(a), for the resin insulation layer 11 on the surface of the substrate 1 with built-in electronic components to be built in the electronic component 4 substrate, all openings for via conductors are formed with the opening diameter d1 of the second via conductor 7. Next, the bottom diameter X on the electrode 4a of the electronic component 4 in the opening 12 for the first via conductor 6 is measured. Next, from the measured bottom diameter X of the opening 12 for the first via conductor 6, in the opening 12 for the first via conductor 6, further processing for enlarging the opening 12 is performed to predict the opening formation condition where the bottom diameter D2 of the opening 12 for the first via conductor 6 becomes the same as the bottom diameter d2 in the opening 13 for the second via conductor 7 (D2 = d2).

[0016] Thereafter, based on the predicted opening formation conditions, by actually performing a process of further enlarging the opening 12 for the first via conductor 6, as shown in FIG. 2(b), the opening diameter D1 of the opening 12 for the first via conductor 6 is larger than the opening diameter d1 of the opening 13 for the second via conductor 7 (D1 > d1), and the bottom diameter D2 of the opening 12 for the first via conductor 6 and the bottom diameter d2 of the opening 13 for the second via conductor 7 are the same (D2 = d2), and an opening for forming a via conductor of a substrate with built-in electronic components can be formed. Then, by forming via conductors in the openings 12 and 13 according to a known method, the first via conductor 6 and the second via conductor 7 of the present invention can be formed.

Explanation of Signs

[0017] 1 Substrate with built-in electronic components 2 Core substrate 3 Through-hole 4 Electronic component 4a Electrode 5 Through-hole 5a Electrode 6 First via conductor 7 Second via conductor 11 Resin insulation layer 12 Opening for the first via conductor 13 Opening for the second via conductor D1 Opening diameter of the opening for the first via conductor D2 Bottom diameter of the opening for the first via conductor d1 Opening diameter of the opening for the second via conductor d2 Bottom diameter of the opening for the second via conductor X Opening diameter of the opening for the first via conductor in the manufacturing process

Claims

1. An electronic component-embedded substrate for embedding electronic components within a substrate, comprising: a core substrate; an electronic component housed in a through-hole of the core substrate and having electrodes on its upper surface; a through-hole provided in the core substrate and having electrodes on its upper surface; a first via conductor connected to the electrodes of the electronic component; and a second via conductor connected to the electrodes of the through-hole, wherein the length T of the first via conductor is longer than the length t of the second via conductor (T > t), If the opening diameter of the first via conductor is D1 and the bottom diameter is D2, and the opening diameter of the second via conductor is d1 and the bottom diameter is d2, then D1 > d1 and D2 = d2.

2. A method for manufacturing an electronic component embedded substrate according to claim 1, In the resin insulating layer on the surface of the electronic component-embedded substrate, which embeds the aforementioned electronic component within the substrate, openings for all via conductors are formed with the opening diameter d1 of the second via conductor. To measure the bottom diameter X on the electrode of the electronic component in the opening for the first via conductor, From the measured bottom diameter X of the opening for the first via conductor, predict the conditions for forming an opening such that the bottom diameter D2 in the opening for the first via conductor is the same as the bottom diameter d2 in the opening for the second via conductor (D2 = d2), Based on the predicted opening formation conditions, an opening for the first via conductor is formed. Includes.

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