Printed circuit board

Abstract

To provide a printed circuit board that can reduce the occurrence of cracks in the glass layer. [Solution] One embodiment of the present invention provides a printed circuit board 100 comprising a glass layer 111 having a first surface and a second surface facing each other in the thickness direction, and a side surface connected to the first surface and the second surface, a metal layer 112 disposed on the side surface of the glass layer 111, and a first insulating layer disposed on the first surface and the side surface of the glass layer 111, wherein the first insulating layer covers the metal layer on the side surface of the glass layer.

Description

Technical Field

[0004] , , ,

[0005] ,

[0001] The present invention relates to a printed circuit board.

Background Art

[0002] Recently, in order to improve the performance of printed circuit boards, larger areas, higher multi-layers, and finer circuits have been demanded. On the other hand, as the core layer included in a printed circuit board, CCL (Copper Clad Laminate) is used. However, due to its low modulus and high coefficient of thermal expansion, warpage is likely to occur, and furthermore, there is a limit to the realization of fine circuits. Therefore, the demand for new materials that can suppress warpage and facilitate the realization of fine circuits, such as glass substrates, is increasing. However, in the case of glass substrates, there are cases where the outer contour of the panel is damaged during the process of manufacturing the substrate due to handling during the process or equipment driving, and cracks may enter the unit area, resulting in a decrease in yield. [[ID=​​​​​​​​​​​​​​​​​​​In one embodiment, the metal layer may also be arranged on at least a portion of the first and second surfaces of the glass layer.

[0006] In one embodiment, the first insulating layer can also be placed in areas on the side surface of the glass layer where the metal layer is not located.

[0007] In one embodiment, the metal layer may have a larger area covering the side surface of the glass layer than the first insulating layer.

[0008] In one embodiment, the area of ​​the side surface of the glass layer in which the metal layer is not arranged may be inclined with respect to the thickness direction.

[0009] In one embodiment, the area of ​​the side surface of the glass layer in which the metal layer is not disposed may include a plurality of areas with different inclination angles with respect to the thickness direction.

[0010] In one embodiment, the area of ​​the side surface of the glass layer in which the metal layer is not arranged may have a shape in which the width of the glass layer increases from the first surface toward the second surface and then decreases.

[0011] In one embodiment, the region of the side surface of the glass layer in which the metal layer is not placed may be even more inclined with respect to the thickness direction than the region in which the metal layer is placed.

[0012] In one embodiment, the glass layer may further include a second insulating layer disposed on the second surface and side surface of the glass layer.

[0013] In one embodiment, the metal layer may have a larger area covering the side surface of the glass layer than the second insulating layer.

[0014] In one embodiment, the metal layer can be separated by the second insulating layer on the side surface of the glass layer.

[0015] In one embodiment, the region located on the side surface of the glass layer in the second insulating layer may include a plurality of regions that are separated from each other.

[0016] In one embodiment, the sides of the first insulating layer and the second insulating layer can be co-surfaces with each other.

[0017] In one embodiment, the first insulating layer and the second insulating layer contain the same material and can be in contact with each other while forming an interface.

[0018] In one embodiment, the glass layer may include protrusions formed on its side surface.

[0019] On the other hand, other embodiments of the present invention are: The present invention provides a printed circuit board comprising a glass layer having a first surface and a second surface facing each other in the thickness direction, and a side surface connected to the first surface and the second surface; a metal layer disposed in a first region of the side surface of the glass layer; and an insulating layer containing a material different from the glass layer and disposed in a second region of the side surface of the glass layer.

[0020] In one embodiment, the area of ​​the first region may be larger than the area of ​​the second region. [Effects of the Invention]

[0021] In the case of a printed circuit board according to an example of the present invention, cracks in the glass layer can be reduced and reliability can be improved. [Brief explanation of the drawing]

[0022] [Figure 1] This is a block diagram illustrating an example of an electronic equipment system. [Figure 2] This is a perspective view illustrating a typical example of an electronic device. [Figure 3] This is a schematic cross-sectional view showing an example of a printed circuit board. [Figure 4] This shows an example of the manufacturing process for printed circuit boards. [Figure 5] This shows an example of the manufacturing process of a printed circuit board. [Figure 6] This shows an example of the manufacturing process of a printed circuit board. [Figure 7] This shows an example of the manufacturing process of a printed circuit board. [Figure 8] This shows an example of the manufacturing process of a printed circuit board. [Figure 9] This shows an example of the manufacturing process of a printed circuit board. [Figure 10] This shows an example of the manufacturing process of a printed circuit board. [Figure 11] This shows an example of the manufacturing process of a printed circuit board. [Figure 12] This shows an example of the manufacturing process of a printed circuit board. [Figure 13] This shows another example of the manufacturing process of a printed circuit board. [Figure 14] This shows another example of the manufacturing process of a printed circuit board. [Figure 15] This is a cross-sectional view schematically showing another example of a printed circuit board. [Figure 16] This is a cross-sectional view schematically showing another example of a printed circuit board.

Embodiments for Carrying Out the Invention

[0023] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be deformed into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to ordinary technicians. Therefore, the shape and size of elements in the drawings can be exaggerated for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0024] Electronic device Figure 1 is a block diagram illustrating an example of an electronic equipment system.

[0025] Referring to the drawing, the electronic device 1000 houses the main board 1010. The main board 1010 is physically and / or electrically connected to chip-related components 1020, network-related components 1030, and other components 1040, etc. These are also coupled with other electronic components, which will be described later, to form various signal lines 1090.

[0026] The chip-related components 1020 include, but are not limited to, memory chips such as volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), and flash memory; application processor chips such as central processors (e.g., CPUs), graphics processors (e.g., GPUs), digital signal processors, cryptographic processors, microprocessors, and microcontrollers; and logic chips such as analog-to-digital converters and ASICs (application-specific ICs). It goes without saying that other different forms of chip-related electronic components may also be included. Furthermore, these chip-related components 1020 may be combined with each other. The chip-related components 1020 may also be in the form of a package that includes the chips and electronic components mentioned above.

[0027] Network-related component 1030 includes, but is not limited to, any other wireless and wired protocols designated as Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and later. It also includes any other diverse wireless or wired standards and protocols. Furthermore, it goes without saying that network-related component 1030 may be combined with chip-related component 1020.

[0028] Other components 1040 include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, LTCCs (low-temperature co-firing ceramics), EMI (electromagnetic interference) filters, MLCCs (multi-layer ceramic condensers), etc. However, they are not limited to these, and may also include other passive elements in chip component form used for various other applications. It goes without saying that other components 1040 may be combined with chip-related components 1020 and / or network-related components 1030.

[0029] Depending on the type of electronic device 1000, the electronic device 1000 may include other electronic components that are physically and / or electrically connected to the main board 1010 or not. Examples of other electronic components include, but are not limited to, audio codecs, video codecs, power amplifiers, compasses, accelerometers, gyroscopes, speakers, mass storage devices (e.g., hard disk drives), CDs (compact disks), DVDs (digital versatile disks), etc. Needless to say, other electronic components used for various purposes may also be included depending on the type of electronic device 1000.

[0030] The electronic device 1000 may be a smartphone, personal digital assistant, digital video camera, digital still camera, network system, computer, monitor, tablet, laptop, netbook, television, video game, smartwatch, or automobile. However, it is not limited to these, and it goes without saying that it may be any other electronic device that processes data.

[0031] Figure 2 is a schematic perspective view showing an example of an electronic device.

[0032] Referring to the drawings, the electronic device may be, for example, a smartphone 1100. Inside the smartphone 1100 is a motherboard 1110, to which various components 1120 are physically and / or electrically connected. Other components, such as a camera module 1130 and / or a speaker 1140, may or may not be physically and / or electrically connected to the motherboard 1110. Some of the components 1120 may be the chip-related components described above, and may, for example, be a component package 1121, but are not limited thereto. The component package 1121 may be in the form of a printed circuit board on which electronic components, including active and / or passive components, are surface-mounted. Alternatively, the component package 1121 may be in the form of a printed circuit board with the active and / or passive components built-in. On the other hand, it goes without saying that the electronic device is not necessarily limited to a smartphone 1100, but may be other electronic devices as described above.

[0033] Printed circuit board Figure 3 is a schematic cross-sectional view showing an example of a printed circuit board. Referring to Figure 3, the printed circuit board 100 according to this embodiment includes a glass layer 111, a metal layer 112, and a first insulating layer 113. Here, the metal layer 112 is arranged on the side surface of the glass layer 111, and the first insulating layer 113 is arranged on the first surface S1 and side surface of the glass layer 111, while the side surface of the glass layer 111 covers the metal layer 112. In addition, the printed circuit board 100 may further include a second insulating layer 114, via conductors 120, conductor layers 121, 122, 123, 124, connecting vias 131, 132, passivation layers 141, 142, etc. The above structure is a configuration that can reduce the propagation of cracks in the panel outer casing to the glass layer 111 of the unit substrate region (unit region) during the manufacturing process of the printed circuit board 100, and furthermore, the electromagnetic wave shielding effect can be improved by arranging the metal layer 112 on the side surface of the glass layer 111. The main components of the printed circuit board 100 will be described in detail below.

[0034] The glass layer 111 may include amorphous solid glass. The glass may include, for example, pure silicon dioxide (about 100% SiO2), soda-lime glass, borosilicate glass, aluminosilicate glass, etc. However, it is not limited to these, and alternative glass materials such as fluorine glass, phosphoric acid glass, and chalcogen glass can also be used. Furthermore, other additives may be included to form glass with specific physical properties. Such additives may include not only calcium carbonate (e.g., lime) and sodium carbonate (e.g., soda), but also magnesium, calcium, manganese, aluminum, lead, boron, iron, chromium, potassium, sulfur, and antimony, as well as carbonates and / or oxides of other elements. The glass layer 111 can be distinguished from insulating materials containing glass fibers (glass fiber, glass cloth, glass fabric), such as CCL (copper clad laminate) and PPG (prepreg). For example, the glass layer 111 may include a GC (Glass Plate).

[0035] The glass layer 111 has a first surface S1 and a second surface S2 facing each other in the thickness direction (vertical direction with respect to the drawing), as well as a side surface connected to the first surface S1 and the second surface S2, and the metal layer 112 is disposed on the side surface of the glass layer 111. Furthermore, the metal layer 112 can also be disposed on at least a portion of the first surface S1 and the second surface S2 of the glass layer 111, and in this embodiment, a structure is shown in which it is disposed on a portion of the first surface S1 and a portion of the second surface S2, respectively. The metal layer 112 is disposed on a portion of the side surface of the glass layer 111, while at least a portion of the remaining portion can have at least one of the first insulating layer 113 and the second insulating layer 114 disposed on it. In this case, the area of ​​the first region on the side surface of the glass layer 111 where the metal layer 112 is disposed may be larger than the area of ​​the second region where at least one of the first insulating layer 113 and the second insulating layer 114 is disposed. As will be described later, this is because the first insulating layer and the second insulating layers 113 and 114, which contain materials different from the glass layer 111, are formed in the bridge region B necessary during the manufacturing process of the glass layer 111, while the metal layer 112 can be formed in the remaining area on the side surface of the glass layer 111. By forming the metal layer 112 over a sufficiently large area, the electromagnetic wave shielding effect can be improved.

[0036] On the other hand, the metal layer 112 can be formed on the surface of the glass layer 111 by a plating process or the like, and can be realized as a multilayer structure including a seed layer and a plating layer. Examples of materials include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. Preferably, the metal layer 112 may include copper (Cu), but is not limited thereto. In this embodiment, the metal layer 112 can be formed in the manufacturing process described later on the side surface of the glass layer 111, excluding the bridge region connected to adjacent units or panel outer casings. By covering the side surface of the glass layer 111, the metal layer 112 can have an electromagnetic wave shielding function, thereby improving the reliability of the printed circuit board 100.

[0037] The first insulating layer 113 is arranged on the first surface S1 and the side surface of the glass layer 111, covering the metal layer 112 on the side surface of the glass layer 111. The first insulating layer 113 can also be arranged in areas on the side surface of the glass layer 111 where the metal layer 112 is not arranged. In this case, the area of ​​the metal layer 112 that covers the side surface of the glass layer 111 may be larger than that of the first insulating layer 113. The area on the side surface of the glass layer 111 where the metal layer 112 is not arranged may be inclined with respect to the thickness direction, and the first insulating layer 113 can be arranged in such an inclined area I1. As a more specific example, the area on the side surface of the glass layer 111 where the metal layer 112 is not arranged may include multiple areas I1, I2 with different angles of inclination with respect to the thickness direction. Furthermore, the area on the side surface of the glass layer 111 where the metal layer 112 is not arranged may have a shape in which the width of the glass layer 111 increases from the first surface S1 to the second surface S2 and then decreases. Furthermore, the areas of the side surface of the glass layer 111 where the metal layer 112 is not placed may be even more inclined with respect to the thickness direction than the areas where the metal layer 112 is placed. Such an inclined structure can be obtained by adjusting the shape of the through-holes in the bridge region B during the process of forming through-holes in the outer shell of the unit region, as will be described later.

[0038] However, as shown in the modified example in Figure 15, the area of ​​the side surface of the glass layer 111 where the metal layer 112 is not located may be formed as a substantially parallel surface rather than being inclined in the thickness direction, which can be achieved by adjusting the shape of the through-hole. Also, as shown in the modified example in Figure 16, the metal layer 112 on the side surface of the glass layer 111 may be formed as an inclined surface rather than a substantially parallel surface with respect to the thickness direction.

[0039] Referring again to Figure 3, the second insulating layer 114 can be positioned on the second surface S2 and the side surface of the glass layer 111. In this case, the metal layer 112 may cover a larger area of ​​the side surface of the glass layer 111 than the second insulating layer 114. Here, the second insulating layer 114 can cover a portion of the side surface of the glass layer 111, while the metal layer 112 can cover the entire remaining side surface of the glass layer 111. Alternatively, the metal layer 112 can be separated from the glass layer 111 by the second insulating layer 114 on the side surface. As a more specific example, the region of the second insulating layer 114 positioned on the side surface of the glass layer 111 can include multiple regions that are separated from each other, thereby separating the metal layer 112 into multiple regions. The second insulating layer 114 can be formed by filling with insulating material after the bridge region (B in Figure 6) where the glass layer 111 is connected to other adjacent units or outer panels is removed, as will be described in a later step.

[0040] As shown in the illustrated configuration, the sides of the first insulating layer and the second insulating layers 113 and 114 can be coplane. Such a coplane structure can be obtained in the process of cutting the first insulating layer and the second insulating layers 113 and 114 into unit units after they have been formed, as will be explained in a later step. The first insulating layer 113 and the second insulating layer 114 contain the same material and can be in contact with each other while forming an interface.

[0041] The first insulating layer 113 and the second insulating layer 114 may be made of a different material from the glass layer 111, for example, an organic insulating material. The organic insulating material may be a thermosetting resin such as epoxy resin, a thermoplastic resin such as polyimide, or may include an inorganic filler, an organic filler and / or glass fiber (glass cloth, glass fabric) together with the resin. For example, the organic insulating material may be, but is not limited to, PPG (Prepreg), ABF (Ajinomoto Build-up Film), PID (Photo Imageable Dielectric), SR (Solder Resist), etc. If necessary, the first insulating layer and the second insulating layers 113 and 114 may each be composed of multiple layers.

[0042] The first to fourth conductor layers 121, 122, 123, and 124 can each contain a metal. The metal can include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. Preferably, it can contain copper (Cu), but is not limited to this. The first to fourth conductor layers 121, 122, 123, and 124 can each perform various functions depending on the design. For example, they can include signal patterns, power patterns, ground patterns, etc. These patterns can each have various forms such as lines, planes, and pads. The first to fourth conductor layers 121, 122, 123, and 124 can each include a seed layer and a plating layer. The seed layer can be formed by electroless plating (e.g., chemical copper), and, if necessary, by a sputtering process. Alternatively, both methods can be used. The plating layer can be formed by electroplating (e.g., electroplated copper). The first to fourth conductor layers 121, 122, 123, and 124 can each be composed of multiple layers, corresponding to the first and second insulating layers 113 and 114 being composed of multiple layers. The first to fourth conductor layers 121, 122, 123, and 124 may protrude onto the first and second insulating layers 113 and 114, respectively, or they may be embedded in the first and third insulating layers 113 and 114, respectively.

[0043] The via conductor 120 may contain a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. Preferably, it may contain copper (Cu), but is not limited thereto. The via conductor 120 can be formed by filling a first through-hole (H1 in Figure 5) with a conductive material. The via conductor 120 can perform various functions depending on the design. For example, it may include signal vias, power vias, ground vias, etc. The via conductor 120 may be connected to the first conductor layer and the second conductor layers 121, 122, respectively. The via conductor 120 may include a seed layer and a plating layer. The seed layer may be formed by electroless plating (e.g., chemical copper) and, if necessary, by a sputtering process. Alternatively, both may be used. The plating layer may be formed by electroplating (e.g., electrolytic copper).

[0044] The first and second connecting vias 131 and 132 may each contain metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. Preferably, they may contain copper (Cu), but are not limited thereto. The first and second connecting vias 131 and 132 can each perform various functions depending on the design. For example, they may include signal vias, power vias, ground vias, etc. The first and second connecting vias 131 and 132 may each contain filled vias in which the via hole is filled with metal, but may also contain conformal vias in which metal is positioned along the wall of the via hole as needed. The first and second connecting vias 131 and 132 may each have a tapered shape in cross-section. For example, the first connecting via 131 may have a wider upper end than its lower end in cross-section, and the second connecting via 132 may also have a wider upper end than its lower end in cross-section. The first connecting via and the second connecting vias 131 and 132 may each similarly include the seed layer and the plating layer contained in the third and fourth conductor layers 123 and 124, respectively. There may be multiple first connecting vias and second connecting vias 131 and 132.

[0045] The first resist layer and the second resist layers 141 and 142 may have openings that open the conductor layer and may contain an organic insulating material. Here, the organic insulating material may be a thermosetting resin such as epoxy resin, a thermoplastic resin such as polyimide, or may contain an inorganic filler, an organic filler and / or glass fiber (glass cloth, glass fabric) together with the resin. For example, the organic insulating material may be, but is not limited to, PPG (Prepreg), ABF (Ajinomoto Build-up Film), PID (Photo Imageable Dielectric), SR (Solder Resist), etc.

[0046] The following describes an example of the manufacturing process of a printed circuit board with reference to Figures 4 to 12. First, the process of forming through holes in the glass layer 111 will be described with reference to Figures 4 to 6. Here, Figure 6 is a plan view of the glass layer 111 seen from above, and Figure 5 corresponds to a cross-sectional view of a part of Figure 6. After preparing the glass layer 111 (Figure 4), a first through hole H1 and a second through hole H2 are formed in the glass layer 111 as shown in Figures 5 and 6. The through holes H1 and H2 can be formed by processes such as etching, blasting, laser, or plasma. In the case of the first through hole H1, it is the region where the via conductor 120 is formed, and the second through hole H2 corresponds to the dicing region for separating into unit units U. Here, a bridge region B can be formed to support the unit region U, and the bridge region B corresponds to the region where the glass layer 111 remains without being completely penetrated in the thickness direction. Here, the side surface of the glass layer 111 in the bridge region B may be formed as an inclined surface.

[0047] The formation process of the metal layer 112 and via conductor 120 will be explained with reference to Figures 7 and 8. Figure 8 is a plan view of the glass layer 111 seen from above, and Figure 7 corresponds to a cross-sectional view of a part of Figure 8. A via conductor 120 is formed to fill the first through-hole H1 of the glass layer 111, and conductor layers 121 and 122 are formed on the upper and lower surfaces of the glass layer 111 (corresponding to the first and second surfaces described above, respectively). In addition, a metal layer 112 is formed to cover the side surfaces, upper and lower surfaces of the glass layer 111. In this case, a mask layer can be formed on top so that the metal layer 112 is not formed in the bridge region B, and then the metal layer 112 can be formed. As a result, the metal layer 112 can be separated by the bridge region B on the side surfaces of the glass layer 111. As will be described later, in the case of bridge region B, after it is removed in a subsequent process, a second insulating layer 114 is filled into the region, thereby obtaining a structure in which the metal layer 112 is separated by the second insulating layer 114.

[0048] Next, referring to Figure 9, a first insulating layer 113 is placed on the upper surface of the glass layer 111, in which case the first insulating layer 113 can be entirely filled into the second through-hole H2, including the bridge region B. Then, referring to Figure 10, a third through-hole H3 is formed such that at least a portion of the bridge region B is removed, thereby separating the glass layer 111 into units. Although not shown in the cross-sectional view of Figure 10, since there are multiple bridge regions B (two in this embodiment) per unit U, multiple third through-holes H3 can also be formed. After that, a second insulating layer 114 is formed on the lower surface of the glass layer 111 and in the third through-hole H3 (Figure 11), followed by the formation of conductor layers 123, 124, via conductors 131, 132, and passivation layers 141, 142 (Figure 12). Subsequently, a dicing process is performed along the cutting line D to separate the layers into units. In this case, the cutting line D is separated from the glass layer 111, and the first insulating layer 113 and the second insulating layer 114 can be cut.

[0049] Through the process described above, a printed circuit board 100 in the form shown in Figure 3 can be obtained, and a modified printed circuit board can also be realized by appropriately modifying the manufacturing method described above.

[0050] On the other hand, unlike the manufacturing process described above, it is possible to leave a portion of the bridge region B instead of removing it completely. This will be explained with reference to Figures 13 and 14. Figure 13 shows an example in which conductor layers 123, 124, via conductors 131, 132, and passivation layers 141, 142 are formed with the bridge region B remaining after the process in Figure 9. Subsequently, a dicing process is performed along the cutting line D to separate the board into units, and the cutting line D can be set to include the bridge region B as shown in Figure 13. Figure 14 shows a printed circuit board in an individualized state, and the glass layer 111 can include protrusions P formed on its side as the remaining area of ​​the bridge region B. By including protrusions P in the glass layer 111, the area of ​​the glass layer 111 is expanded, and warp characteristics and the like can be improved. In this case, since the size of the protrusions P is relatively small, it is difficult for cracks to propagate through the protrusions P.

[0051] In this invention, the expressions "cover" or "cover" can include not only cases of covering the entire surface but also cases of covering at least a part of it, and can include cases of covering not only directly but also indirectly. Furthermore, the expressions "fill" or "fill" can include not only cases of completely filling but also cases of filling at least a part of it, and also cases of almost filling it. For example, this can include cases where there are some gaps or voids. Also, the expressions "enclose" can include not only cases of completely enclosing but also cases of partially enclosing and generally enclosing. Furthermore, "expose" can include cases of completely exposing but also cases of partially exposing it, and "exposure" can mean exposing the structure from being embedded. For example, when an opening exposes a pad, it means exposing the pad from the resist layer, and a surface treatment layer or the like can be placed on the exposed pad.

[0052] In this invention, "placed within a through-hole or penetrating portion" includes not only cases where the object is completely placed within the through-hole or penetrating portion, but also cases where a portion of it protrudes upward or downward on the cross-section. For example, if the object is placed within a through-hole or penetrating portion on a plane, it can be interpreted in a broader sense.

[0053] In this invention, the determination can be made including process errors, positional deviations, and measurement errors that substantially occur during the manufacturing process. For example, "substantially perpendicular" can include not only cases where it is perfectly perpendicular, but also cases where it is nearly perpendicular. Similarly, "substantially coplane" can include not only cases where they are exactly on the same plane, but also cases where they are nearly on the same plane.

[0054] In this invention, "the same insulating material" can mean not only completely identical insulating materials, but also insulating materials of the same type. Therefore, although the composition of the insulating materials may be substantially the same, their specific compositional ratios may differ slightly.

[0055] In this invention, the term "cross-section" can refer to the cross-sectional shape when the object is cut vertically, or the cross-sectional shape when the object is viewed from the side. The term "plane" can refer to the planar shape when the object is cut horizontally, or the planar shape when the object is viewed from the top or bottom.

[0056] In this invention, terms such as "lower side," "lower part," and "bottom surface" are used for convenience to mean the downward direction relative to the cross-section in the drawing, while terms such as "upper side," "upper part," and "top surface" are used to mean the opposite direction. However, this is merely a definition of direction for explanatory purposes, and it goes without saying that the scope of rights in the patent claims is not particularly limited by such descriptions of direction, and the concepts of up / down can be changed at any time.

[0057] In this invention, "connected" is a concept that includes not only direct connection but also indirect connection via an adhesive layer or the like. Furthermore, "electrically connected" is a concept that includes both cases where they are physically connected and cases where they are not connected. In addition, expressions such as "first," "second," etc., are used to distinguish one component from another and do not limit the order and / or importance of the components. In some cases, within the scope of the rights, the first component may be named the second component, and similarly, the second component may be named the first component.

[0058] In this invention, "thickness, width, length, depth, line width, spacing, pitch, separation distance, surface roughness," etc., can be measured using a scanning microscope or optical microscope based on a cross-section obtained by polishing or cutting the printed circuit board. The cut cross-section can be a vertical or horizontal cross-section, and each value can be measured based on the required cut cross-section. For example, the width of the upper and / or lower ends of a via can be measured on a cross-section cut along the central axis of the via. In this case, if the values ​​are not constant, the values ​​can be determined by the average value of the values ​​measured at any five points.

[0059] The expression "example" as used in this invention does not mean that each embodiment is the same as another, but is provided to highlight and illustrate the unique and distinct features of each. However, the examples presented above do not preclude their realization in combination with features of other examples. For example, even if a matter described in a particular example is not described in another example, it can be understood as a description related to that other example, provided that there is no contradictory or contrary description of that matter in the other example.

[0060] The terms used in this invention are used merely to illustrate an example and are not intended to limit the invention. In this context, singular expressions include plural expressions unless the context clearly indicates otherwise. [Explanation of Symbols]

[0061] 1000:Electronic equipment 1010: Mainboard 1020: Chip-related components 1030: Network-related components 1040: Other parts 1050: Camera 1060: Antenna 1070: Display 1080: Battery 1090: Signal line 1100: Smartphone 1110: Motherboard 1120: Parts 1121: Parts Package 1130: Camera module 1140: Speaker 100: Printed circuit board 111: Glass layer 112: Metal layer 113, 114: Insulating layer 120: Via conductor 121, 122, 123, 124: Conductor layer 131, 132: Connection vias 141, 142: Passivation layer

Claims

1. A glass layer having a first surface and a second surface facing each other in the thickness direction, and a side surface connected to the first surface and the second surface, A metal layer disposed on the side surface of the glass layer, The glass layer includes a first insulating layer disposed on the first surface and side surface of the glass layer, The first insulating layer covers the metal layer on the side surface of the glass layer in a printed circuit board.

2. The printed circuit board according to claim 1, wherein the metal layer is also disposed on at least a portion of the first and second surfaces of the glass layer.

3. The printed circuit board according to claim 1, wherein the first insulating layer is also provided in areas on the side surface of the glass layer where the metal layer is not provided.

4. The printed circuit board according to claim 3, wherein the area of ​​the metal layer covering the side surface of the glass layer is larger than that of the first insulating layer.

5. The printed circuit board according to claim 1, wherein the region of the side surface of the glass layer in which the metal layer is not disposed is inclined with respect to the thickness direction.

6. The printed circuit board according to claim 5, wherein the region of the side surface of the glass layer in which the metal layer is not disposed includes a plurality of regions with different inclination angles with respect to the thickness direction.

7. The printed circuit board according to claim 6, wherein the region of the side surface of the glass layer in which the metal layer is not disposed has a shape in which the width of the glass layer increases from the first surface to the second surface and then decreases.

8. The printed circuit board according to claim 5, wherein the region of the side surface of the glass layer in which the metal layer is not disposed is inclined further in the thickness direction than the region in which the metal layer is disposed.

9. The printed circuit board according to claim 1, further comprising a second insulating layer disposed on the second surface and side surface of the glass layer.

10. The printed circuit board according to claim 9, wherein the metal layer has a larger area covering the side surface of the glass layer than the second insulating layer.

11. The printed circuit board according to claim 9, wherein the metal layer is separated by the second insulating layer on the side surface of the glass layer.

12. The printed circuit board according to claim 11, wherein the region disposed on the side surface of the glass layer in the second insulating layer includes a plurality of regions that are separated from each other.

13. The printed circuit board according to claim 9, wherein the sides of the first insulating layer and the second insulating layer are coplanes with each other.

14. The printed circuit board according to claim 9, wherein the first insulating layer and the second insulating layer contain the same material and are in contact with each other while forming an interface.

15. The printed circuit board according to claim 1, wherein the glass layer includes a protrusion formed on the side surface.

16. A glass layer having a first surface and a second surface facing each other in the thickness direction, and a side surface connected to the first surface and the second surface, A metal layer disposed in the first region of the side surface of the glass layer, A printed circuit board comprising: an insulating layer containing a material different from the glass layer and disposed in a second region on the side surface of the glass layer.

17. The printed circuit board according to claim 16, wherein the area of ​​the first region is larger than the area of ​​the second region.

Images