Imaging device and method for cooling a heat source in an imaging device

Abstract

To provide an imaging device capable of efficiently cooling multiple heat sources, and a method for cooling heat sources in an imaging device. [Solution] The imaging device includes a fan that operates to draw in air from an intake port provided on the outer surface of the imaging device and discharge air from an exhaust port provided on the outer surface; a first flow path member having a first flow path between the intake port and the fan; a second flow path member having a second flow path between the intake port and the fan; a third flow path member having a third flow path between the fan and the exhaust port; a first heat source cooled by the air in the second flow path; and a second heat source cooled by the air in the third flow path.

Description

Technical Field

[0007] , ,

[0001] The present disclosure relates to an imaging device and a method for cooling a heat source in the imaging device.

Background Art

[0002] Conventionally, an imaging device having a cooling structure for cooling a heat source such as an IC has been known (for example, see Patent Document 1).

[0003] The imaging device of Patent Document 1 has an intake hole and an exhaust hole provided in a housing, and a fan that operates to suck air from the intake hole and discharge it from the exhaust hole. In this configuration, the intake hole has a first intake hole and a second intake hole, a first electronic component is provided in a first duct communicating with the first intake hole, and a second electronic component is provided in a second duct communicating with the second intake hole, thereby cooling a plurality of electronic components (heat sources).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] ]> However, it is required to more efficiently cool a plurality of heat sources.

[0006] An object of the present disclosure is to provide an imaging device and a method for cooling a heat source in the imaging device that can efficiently cool a plurality of heat sources.

Means for Solving the Problems

[0007] The imaging device according to this disclosure includes a fan that operates to draw in air from an intake port provided on the outer surface of the imaging device and discharge air from an exhaust port provided on the outer surface; a first flow path member having a first flow path between the intake port and the fan; a second flow path member having a second flow path between the intake port and the fan; a third flow path member having a third flow path between the fan and the exhaust port; a first heat source cooled by the air in the second flow path; and a second heat source cooled by the air in the third flow path.

[0008] The heat source cooling method for an imaging device according to this disclosure involves operating a fan to draw in air from an intake port provided on the outer surface of the imaging device and to discharge air from an exhaust port provided on the outer surface, thereby flowing air through a first flow path between the intake port and the fan, flowing air through a second flow path between the intake port and the fan to cool the first heat source, and flowing air through a third flow path between the fan and the exhaust port to cool the second heat source. [Effects of the Invention]

[0009] According to this disclosure, multiple heat sources can be cooled more efficiently. [Brief explanation of the drawing]

[0010] [Figure 1] Perspective view of the imaging device [Figure 2] Perspective view showing the area around the cover component. [Figure 3] A perspective view showing the configuration in Figure 2 with the cover member removed. [Figure 4] This is a perspective view showing the configuration in Figure 3 with the first support member further removed. [Figure 5] Figures 3 and 4 show schematic cross-sectional views illustrating the flow path configuration. [Figure 6] Figure 5 shows a more simplified diagram of the configuration. [Figure 7] Schematic diagram showing a modified example [Figure 8] Schematic diagram showing another modified example. [Modes for carrying out the invention]

[0011] The embodiments will be described in detail below, with reference to the drawings as appropriate. However, unnecessarily detailed explanations may be omitted. For example, detailed explanations of already well-known matters or redundant explanations of substantially identical configurations may be omitted.

[0012] The applicant provides the accompanying drawings and the following description so that a person skilled in the art can fully understand the disclosure, and not intends to limit the subject matter described in the claims.

[0013] (Embodiment) The imaging apparatus and the heat source cooling method in this embodiment will be described below with reference to the drawings.

[0014] Figure 1 is a perspective view showing the imaging device of this embodiment. As shown in Figure 1, the imaging device 2 of this embodiment comprises a main body 4, a lens barrel 6, a viewfinder 8, an imaging unit (not shown) having an image sensor that converts light into electrical signals, and a control unit (not shown) that controls these.

[0015] The main body part 4 constitutes the outer shell of the imaging device 2. Various switches and the like are provided on the exterior of the main body part 4, and various members such as an imaging part, a control part, and a fan are built into the inside of the main body part 4. The lens barrel 6 is a member that holds the lens 7 and is provided in front of the main body part 4 (on the subject side). The finder 8 is a member that enables the imaging state to be confirmed by an image displayed on a display part (not shown) for the information acquired by the imaging part (not shown). When the lens 7 side in the main body part 4 is taken as the front, it is provided behind the main body part 4. Note that the position of the finder 8 may be provided on the side surface of the main body part 4, for example, other than behind the main body part 4. Further, as the configuration of the finder 8, for example, a configuration in which the finder 8 has an eyepiece part or an eyepiece lens, a configuration in which, instead of providing the finder 8, a display part (for example, an LCD or the like) is provided, a configuration in which an external device (for example, a PC, a mobile phone, a smartphone, a tablet terminal, etc.) provided with a display part via a wired or wireless communication interface displays the content during imaging, or a configuration in which these are combined and provided, etc. may be mentioned.

[0016] As shown in FIG. 1, a cover member 10 is provided as a member that constitutes the outer surface of the main body part 4. Further, as a cooling structure for cooling a heat source, an air intake port 12 is formed behind the cover member 10, and an exhaust port 14 is formed in front of the cover member 10.

[0017] FIG. 2 is a perspective view in which the periphery of the cover member 10 is extracted.

[0018] As shown in FIG. 2, an intake block 16 and an exhaust block 18 are attached to the cover member 10. The intake block 16 is a block member having the air intake port 12, and the exhaust block 18 is a block member having the exhaust port 14.

[0019] A fan 20 is built into the inside of the cover member 10. In FIG. 2, the fan 20 is schematically shown by a dotted line.

[0020] Fan 20 operates to create an airflow to cool the heat source. When fan 20 is operating, air is drawn in through the intake port 12 (arrow A1), and the drawn-in air passes through the inside of the imaging device 2 and is discharged through the exhaust port 14 (arrow A2).

[0021] The imaging device 2 of this embodiment incorporates multiple heat sources, such as ICs and communication modules, and has a structure for efficiently cooling these heat sources. This structure will be explained using the drawings from Figure 3 onward.

[0022] Figure 3 is a perspective view showing the configuration shown in Figure 2 with the cover member 10 removed.

[0023] As shown in Figure 3, a first support member 22 is provided on the inside of the cover member 10.

[0024] The first support member 22 is a member that supports the substrate 24 and the communication module 26. The substrate 24 is a substrate on which the communication module 26 is mounted. The communication module 26 is a module that has a communication function and operates while mounted on the substrate 24. By attaching the substrate 24 to the support member 22, the substrate 24 and the communication module 26 are integrally supported by the support member 22. The first support member 22 in this embodiment has a plate-like shape.

[0025] To improve the communication function of the communication module 26, it is preferable to position the communication module 26 as far outside the imaging device 2 as possible without shielding it with a metal plate or the like. In this embodiment, only the cover member 10 is located outside the communication module 26, and the cover member 10 is made of resin and has low radio wave shielding function. This makes it possible to improve the communication function of the communication module 26.

[0026] As shown in Figure 3, an opening 28 is formed in the first support member 22. The opening 28 is a hole that creates an airflow to cool the communication module 26.

[0027] Figure 4 is a perspective view showing the configuration in which the first support member 22 has been further removed from the configuration shown in Figure 3.

[0028] As shown in Figure 4, the fan 20 (Figure 2) and the second support member 30 are positioned inside the first support member 22. The second support member 30 is a plate-shaped member that supports the fan 20.

[0029] The fan 20 has a fan inlet 32 ​​and a fan outlet 34.

[0030] The fan inlet 32 ​​is an opening that draws air into the fan 20, and the fan outlet 34 is an opening that discharges the air that has been drawn into the fan 20.

[0031] A heat dissipation member 36 is positioned opposite the fan outlet 34. The heat dissipation member 36 is a component to which multiple heat sources, such as the IC 38 described later, are thermally connected, and may also be called a "heat sink".

[0032] When the fan 20 is operating, the air drawn in from the intake port 12 flows mainly toward the fan inlet 32 ​​of the fan 20 (arrow A3) and is discharged from the fan outlet 34 (arrow A4). The air discharged from the fan outlet 34 flows along the surface of the heat dissipation member 36, which cools the heat dissipation member 36 and the heat sources such as the IC 38 that are thermally connected to the heat dissipation member 36.

[0033] As shown in Figure 3, another flow path is formed on the outside of the first support member 22, that is, in the space between the first support member 22 and the cover member 10. A portion of the air drawn in from the intake port 12 branches downward and flows along the plate-shaped member 39, then flows along the outer surface of the first support member 22 and flows into the opening 28 (arrow A5). This air flows along the surface of the communication module 26, cooling the communication module 26.

[0034] The flow path configuration shown in Figures 3 and 4 will be explained using Figures 5 and 6.

[0035] Figure 5 is a schematic cross-sectional view showing the flow path configuration shown in Figures 3 and 4, and Figure 6 is a diagram showing the configuration in Figure 5 in a more schematic manner.

[0036] As shown in Figure 5, IC38 and memory 40 are provided as heat sources that are thermally connected to the heat dissipation member 36. IC38 has the highest heat output among the heat sources built into the imaging device 2.

[0037] In this embodiment, both the IC38 and the memory 40 are mounted on the back surface of the second support member 30. The second support member 30 in this embodiment is made of a material with high thermal conductivity, such as metal, and functions as a heat transfer member. The IC38 and the memory 40 may also be mounted on the back surface of the second support member 30 via a heat transfer member.

[0038] In this specification, "heat transfer member" means a member formed from a material with high thermal conductivity, such as metal (e.g., a metal plate, a graphite sheet), and does not include a member formed from a material with low thermal conductivity, such as resin. Heat transfer members include TIM (Thermal Interface Material).

[0039] The fan 20 is not directly attached to the second support member 30, but is attached indirectly via an intermediate mounting member 37. The heat from the IC 38 and memory 40 is transferred mainly to the heat dissipation member 36, not to the fan 20.

[0040] Furthermore, a heat source (e.g., a storage medium) separate from the IC 38 and memory 40 may be thermally connected to the heat dissipation member 36.

[0041] As shown in Figures 5 and 6, the air flowing in from the intake port 12 flows through the first flow path B1. The first flow path B1 is a flow path that extends from the intake port 12 to the fan inlet 32 ​​and is defined by at least the first support member 22 and the second support member 30. The first support member 22 and the second support member 30 are first flow path members that define the first flow path B1.

[0042] An opening 42 is provided in the middle of the first flow path B1. The opening 42 is an opening that allows a portion of the air flowing through the first flow path B1 to flow into the second flow path B2. The second flow path B2 is a flow path that extends from the opening 42 to the opening 28 and is defined by at least the first support member 22 and the cover member 10. The first support member 22 and the cover member 10 are second flow path members that define the second flow path B2.

[0043] In this embodiment, the second channel B2 is a channel that branches off from the first channel B1 midway and then rejoins it.

[0044] As shown in Figures 5 and 6, the communication module 26, which acts as a heat source, is placed in the second channel B2. In contrast, the first channel B1 does not contain a heat source or a heat dissipation member thermally connected to the heat source. With this arrangement, the communication module 26 can be cooled by the airflow in the second channel B2, while the airflow in the first channel B1 can maintain a low temperature (generally room temperature). Therefore, even when the airflow from the second channel B2, which has absorbed heat from the communication module 26, merges with the first channel B1, the overall temperature rise can be suppressed, and low-temperature air can be sent to the fan 20.

[0045] In this embodiment, with respect to the second flow path B2, the area of ​​the upstream opening 42 is made smaller than the area of ​​the downstream opening 28.

[0046] By reducing the size of the upstream opening 42, it becomes easier to control the airflow from the first channel B1 to the second channel B2 to a relatively smaller volume. Since the communication module 26 generates less heat than the IC 38, by keeping the airflow in the second channel B2 low, the communication module 26 can be cooled with an appropriate airflow.

[0047] By increasing the size of the downstream opening 28, it becomes easier to control the air pressure at opening 42 to be higher than the air pressure at opening 28. This allows for a stable flow from opening 42 to opening 28, thereby suppressing backflow.

[0048] The air discharged from the fan outlet 34 flows through the third flow path B3. The third flow path B3 is a flow path that extends from the fan outlet 34 to the exhaust port 14 and is defined by at least the first support member 22 and the second support member 30. The first support member 22 and the second support member 30 are third flow path members that define the third flow path B3.

[0049] A heat dissipation member 36 is positioned in the third airflow channel B3. As mentioned above, the air drawn into the fan 20 is relatively cold, so the heat dissipation member 36 can be cooled by the large volume of cold air. This allows for strong cooling of the IC 38 and memory 40, which generate a lot of heat.

[0050] In the imaging device 2 having the above configuration and function, when the fan 20 is operated, an airflow is created in which air is drawn in from the intake port 12 and discharged from the exhaust port 14. In this airflow, air flows through the first flow path B1 and the second flow path B2 between the intake port 12 and the fan 20, and air flows through the third flow path B3 between the fan 20 and the exhaust port 14. Here, the air in the first flow path B1 does not cool the heat source, the air in the second flow path B2 cools the communication module 26 (first heat source), and the air in the third flow path B3 cools the IC 38 and memory 40 (second heat source). This makes it possible to efficiently cool each heat source according to the difference in the amount of heat generated by each heat source.

[0051] (Effects / Actions) As described above, the imaging device 2 of this embodiment includes a fan 20 that operates to draw in air from an intake port 12 provided on the outer surface of the imaging device 2 and discharge air from an exhaust port 14 provided on the outer surface; a first flow path member (e.g., a first support member 22, a second support member 30) having a first flow path B1 between the intake port 12 and the fan 20; a second flow path member (e.g., a first support member 22, a cover member 10) having a second flow path B2 between the intake port 12 and the fan 20; a third flow path member (e.g., a first support member 22, a second support member 30) having a third flow path B3 between the fan 20 and the exhaust port 14; a first heat source (e.g., a communication module 26) cooled by the air in the second flow path B2; and a second heat source (e.g., an IC 38) cooled by the air in the third flow path B3.

[0052] This configuration allows for efficient cooling of multiple heat sources.

[0053] Furthermore, in the imaging device 2 of this embodiment, the first channel B1 does not contain a heat source or a heat dissipation member 36 thermally connected to a heat source. With this configuration, the cooling effect of the second heat source can be enhanced by sending lower temperature air from the first channel B1 to the third channel B3.

[0054] Furthermore, in the imaging device 2 of this embodiment, the first heat source (for example, the communication module 26) is placed in the second flow path B2. With this configuration, the first heat source can be directly cooled, thereby enhancing the cooling effect of the first heat source.

[0055] Furthermore, the imaging device 2 of this embodiment further includes a heat dissipation member 36 that is thermally connected to the second heat source (for example, IC38), and the heat dissipation member 36 is arranged in the third flow path B3. With this configuration, the second heat source can be indirectly cooled via the heat dissipation member 36.

[0056] Furthermore, in the imaging device 2 of this embodiment, multiple second heat sources (for example, IC38, memory 40) are provided, and multiple second heat sources are thermally connected to the heat dissipation member 36. With this configuration, multiple second heat sources can be efficiently cooled by the airflow from the third flow path B3, which has a large airflow.

[0057] Furthermore, in the imaging device 2 of this embodiment, the first heat source includes the communication module 26. With this configuration, the communication module 26, which generates less heat than the IC 38 and the like, can be efficiently cooled by the airflow through the second channel B2.

[0058] Furthermore, in the imaging device 2 of this embodiment, the second flow channel member having the second flow channel B2 comprises a cover member 10 that constitutes the outer surface and a first support member 22 that is arranged inside the cover member 10 and supports the first heat source. With this configuration, the communication function of the communication module 26 can be improved by arranging the first heat source, including the communication module 26, close to the outer surface of the imaging device 2.

[0059] Furthermore, in the imaging device 2 of this embodiment, the second heat source includes IC38. With this configuration, the second heat source, which generates a large amount of heat, can be efficiently cooled by the airflow from the third flow path B3, which has a large airflow. The second heat source may include an imaging unit (not shown), or it may be thermally connected to the imaging unit.

[0060] Furthermore, in the imaging device 2 of this embodiment, the second heat source (e.g., IC38) generates more heat than the first heat source (e.g., communication module 26). With this configuration, the second heat source, which generates more heat, can be efficiently cooled by the airflow from the third channel B3, which has a large airflow.

[0061] Furthermore, in the imaging device 2 of this embodiment, the second channel B2 is a channel that branches off from the first channel B1 midway and rejoins it. With this configuration, the airflow can be easily adjusted, such as by relatively reducing the airflow in the second channel B2.

[0062] Furthermore, in the imaging device 2 of this embodiment, the second flow channel member having the second flow channel B2 has an upstream opening 42 (first opening) and a downstream opening 28 (second opening) that communicate with the first flow channel B1 of the first flow channel member, and the area of ​​the opening 42 is smaller than the area of ​​the opening 28. With this configuration, by narrowing the opening 42, the amount of air flowing into the second flow channel B2 is relatively reduced, while by widening the opening 28, a pressure difference is more easily created between the opening 42 and the opening 28, allowing air to flow stably into the second flow channel B2.

[0063] As described above, the heat source cooling method for the imaging device 2 of this embodiment involves operating the fan 20 to draw in air from the intake port 12 provided on the outer surface of the imaging device 2 and discharge the air from the exhaust port 14 provided on the outer surface, thereby flowing air through the first flow path B1 between the intake port 12 and the fan 20, flowing air through the second flow path B2 between the intake port 12 and the fan 20 to cool the first heat source (for example, the communication module 26), and flowing air through the third flow path B3 between the fan 20 and the exhaust port 14 to cool the second heat source (for example, the IC 38).

[0064] This method allows for efficient cooling of multiple heat sources. Within the scope of achieving this method, the positions of the air intake 12 and exhaust 14 in the imaging device 2 are not restricted. For example, the air intake 12 and exhaust 14 may be positioned in opposite directions. Furthermore, in the above-described embodiment, the air intake 12 and exhaust 14 are positioned front to back with respect to the imaging device 2, but they may be positioned in physically possible directions such as up and down, left and right, etc.

[0065] (Other embodiments) This disclosure is not limited to the embodiments described above, and various embodiments are conceivable.

[0066] In the above embodiment, the case in which the airflow rate of the air flowing through the three flow paths B1 to B3 is constant was described. However, the invention is not limited to this case, and an "airflow rate changing member" that allows the airflow rate to be changed may be provided. For example, in the example shown in Figure 7, an airflow rate changing member 100 is provided that allows the airflow rate of the air flowing through the second flow path B2 to be changed.

[0067] The airflow changing member 100 shown in Figure 7 is provided adjacent to the opening 42, which is the inlet of the second flow path B2, and is movable to change the amount of air flowing into the opening 42. Specifically, the airflow changing member 100 is movable between a first position that relatively increases the flow rate of air flowing into the second flow path B2 and a second position that relatively decreases the flow rate of air flowing into the second flow path B2. The movement of the airflow changing member 100 may be controlled electrically by a control unit (not shown), or by any other arbitrary method.

[0068] With this configuration, by controlling the position of the airflow changing member 100, the flow rate of air flowing into the second flow path B2 can be changed according to the usage status of the communication module 26, and multiple heat sources can be cooled more efficiently. For example, the position of the airflow changing member 100 may be controlled so that the flow rate of air flowing into the second flow path B2 is relatively small when the communication module 26 is not in use (low heat generation), and relatively large when the communication module 26 is in use (high heat generation).

[0069] Furthermore, although the above embodiment describes a case where the second flow path B2 branches off from the first flow path B1 and then rejoins, the embodiment is not limited to this case. For example, as shown in Figure 8, the first flow path B4 and the second flow path B5 may extend in parallel from the intake port 12 to the fan 20. The air drawn into the fan 20 is blown out toward the third flow path B6 and flows along the surface of the heat dissipation member 36 connected to a heat source such as IC38 (not shown).

[0070] Therefore, the components described in the attached drawings and detailed descriptions may include not only components essential for solving the problem, but also components that are not essential for solving the problem, provided that they illustrate the technology described above. For this reason, the mere presence of these non-essential components in the attached drawings and detailed descriptions should not be immediately assumed to mean that they are essential.

[0071] Furthermore, since the embodiments described above are for illustrative purposes of the technology described herein, various modifications, substitutions, additions, omissions, etc., can be made within the claims or their equivalents.

[0072] This disclosure is broadly applicable to imaging devices. [Explanation of Symbols]

[0073] 2. Imaging device 10 Cover member (second flow path member) 12 Air intake 14 Exhaust vents 16 Intake block 18 Exhaust block 20 Fans 22 First support member (first flow path member, second flow path member, third flow path member) 24 circuit boards 26 Communication Module 28 Aperture 30. Second support member (first flow path member, third flow path member) 32 Fan Entrance 34 Fan exit 36 Heat dissipation components 38 IC 40 memory 42 Aperture 100 Airflow changing component B1 First channel B2 Second channel B3 Third channel B4 First channel B5 Second channel B6 Third channel

Claims

1. A fan that operates to draw in air from an intake port provided on the outer surface of the imaging device and to discharge air from an exhaust port provided on the outer surface, A first flow path member having a first flow path between the air intake port and the fan, A second flow path member having a second flow path between the intake port and the fan, A third flow path member having a third flow path between the fan and the exhaust port, The first heat source is cooled by the air in the second flow path, An imaging device comprising a second heat source cooled by the air in the third flow channel.

2. The imaging apparatus according to claim 1, wherein no heat source or heat dissipation member thermally connected to a heat source is disposed in the first flow path.

3. The imaging apparatus according to claim 1, wherein the first heat source is arranged in the second flow path.

4. The system further comprises a heat dissipation member that is thermally connected to the second heat source, The imaging apparatus according to claim 1, wherein the heat dissipation member is arranged in the third flow path.

5. Multiple second heat sources are provided. The imaging apparatus according to claim 4, wherein a plurality of the second heat sources are thermally connected to the heat dissipation member.

6. The imaging apparatus according to claim 1, wherein the first heat source includes a communication module.

7. The imaging apparatus according to claim 6, wherein the second flow channel member comprises a cover member constituting the outer surface and a support member disposed inside the cover member and supporting the first heat source.

8. The imaging apparatus according to claim 1, wherein the second heat source includes an IC.

9. The imaging apparatus according to claim 1, wherein the second heat source has a higher heat output than the first heat source.

10. The imaging apparatus according to claim 1, wherein the second channel is a channel that branches off from the first channel midway and rejoins it.

11. The second flow channel member has an upstream first opening and a downstream second opening that communicate with the first flow channel of the first flow channel member. The imaging apparatus according to claim 10, wherein the area of ​​the first aperture is smaller than the area of ​​the second aperture.

12. The imaging apparatus according to claim 1, further comprising an airflow changing member that operates to change the amount of airflow through the second flow path.

13. By operating the fan, air is drawn in through an intake port provided on the outer surface of the imaging device, and the air is discharged through an exhaust port provided on the outer surface. Air is flowed through the first passage between the air intake and the fan. The first heat source is cooled by flowing air through the second passage between the intake port and the fan. A method for cooling a heat source in an imaging device, comprising flowing air through a third flow path between the fan and the exhaust port to cool the second heat source.

Images