ACF application device and ACF application method

Abstract

The present invention provides an ACF attachment device that can improve the accuracy of the attachment position of ACF sections. [Solution] The ACF bonding apparatus 10 includes a first tape imaging unit 25A that performs a first tape imaging process to generate a first tape image by imaging the first cut locations cut by a first cutting process in the first ACF layer supported on a first substrate layer; a first crimping unit 24A that performs a first crimping process to crimp the first ACF section onto the substrate 3; a first tape feeding mechanism 23A that feeds the first tape from a first position where the first cutting process is performed to a second position where the first tape imaging process is performed, and feeds it by a predetermined first feed amount from the second position to a third position where the first crimping process is performed; a substrate imaging unit 26 that generates a first substrate image by imaging the first cut locations in the first ACF section crimped onto the substrate 3; and a modification unit 32 that changes a predetermined first feed amount based on the first tape image and the first substrate image.

Description

Technical Field

[0001] The present invention relates to an ACF (Anisotropic Conductive Film) attaching device and an ACF attaching method for attaching an ACF to a substrate.

Background Art

[0002] Conventionally, there is a device for attaching an ACF as an adhesive member for adhering a component to a substrate (see, for example, Patent Document 1). The device conveys the ACF by a tape conveyance unit, for example, and attaches the ACF to the substrate by a pressing tool provided on a sticking head.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Attachment of the ACF to the substrate is performed by forming an ACF piece by cutting (half-cutting) the ACF supported by a base material at a predetermined interval, and attaching the ACF piece to the substrate by a sticking head. Here, the ACF is moved from the position where it is cut to the position where it is attached to the substrate by a tape feeding mechanism, which is a mechanism for feeding the ACF, such as the above-described tape conveyance unit. In order for the ACF piece to be attached to an appropriate position on the substrate, it is necessary for the ACF to be moved by an appropriate distance after being cut. In other words, the tape feeding mechanism needs to feed the tape with an appropriate feeding amount.

[0005] The present invention provides an ACF attaching device that can appropriately control the feeding amount of a tape by a tape feeding mechanism.

Means for Solving the Problems

[0006] An ACF bonding apparatus according to one aspect of the present invention includes: a first supply unit for supplying a first tape comprising a first substrate layer and a first ACF (Anisotropic Conductive Film) layer; a first cutting unit for performing a first cutting process to form a first ACF section supported by the first substrate layer by cutting the first ACF layer contained in the first tape supplied from the first supply unit; a first tape imaging unit for performing a first tape imaging process to generate a first tape image by imaging the first cutting location cut by the first cutting process in the first ACF layer supported by the first substrate layer; and a first pressing process for peeling the first ACF section from the first substrate layer and pressing it onto a substrate. The first adhesive mechanism includes an attachment unit, a first tape feeding mechanism that performs a first feeding process to feed the first tape from a first position where the first cutting process is performed to a second position where the first tape imaging process is performed, and a second feeding process to feed the tape by a predetermined first feed amount from the second position to a third position where the first crimping process is performed, a substrate imaging unit that generates a first substrate image by imaging the first cutting location in the first ACF section crimped to the substrate, and a modification unit that changes the predetermined first feed amount based on the first tape image and the first substrate image.

[0007] Furthermore, an ACF bonding method according to one aspect of the present invention involves performing a first cutting process to form a first ACF section supported by the first substrate layer by cutting the first ACF layer included in a first tape comprising a first substrate layer and a first ACF (Anisotropic Conductive Film) layer; performing a first tape imaging process to generate a first tape image by imaging the first cutting location in the first ACF layer supported by the first substrate layer that was cut by the first cutting process; performing a first pressing process to peel the first ACF section from the first substrate layer and press it onto a substrate; performing a first feeding process to feed the first tape from a first position where the first cutting process is performed to a second position where the first tape imaging process is performed, and a second feeding process to feed the first tape by a predetermined first feeding amount from the second position to a third position where the first pressing process is performed; generating a first substrate image by imaging the first cutting location in the first ACF section pressed onto the substrate; and changing the predetermined first feeding amount based on the first tape image and the first substrate image. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide an ACF application device that can appropriately control the amount of tape fed by the tape feeding mechanism. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 shows the configuration of an ACF application device according to an embodiment. [Figure 2] Figure 2 is a front view showing the ACF attachment mechanism according to an embodiment. [Figure 3] Figure 3 is a side view showing the ACF attachment mechanism according to an embodiment. [Figure 4] Figure 4 is a top view showing the ACF attachment mechanism according to an embodiment. [Figure 5] Figure 5 is a flowchart showing the processing procedure of the ACF application device according to the embodiment. [Figure 6]Figure 6 is a diagram illustrating the specific processing steps of the pasting process and the imaging process in the ACF pasting apparatus according to the embodiment. [Figure 7] Figure 7 shows a tape image according to an embodiment. [Figure 8] Figure 8 shows an image of a substrate according to an embodiment. [Figure 9] Figure 9 is a flowchart showing a modified example of the processing procedure of the ACF application apparatus according to the embodiment. [Figure 10] Figure 10 is a diagram illustrating the specific processing procedure of the substrate imaging process in the ACF application apparatus according to the embodiment. [Modes for carrying out the invention]

[0010] The embodiments of the present invention will be described in detail below with reference to the drawings. Note that the embodiments described below are all specific examples of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement and connection configurations of components, steps, and the order of steps shown in the following embodiments are examples only and are not intended to limit the present invention. Accordingly, components in the following embodiments that are not described in an independent claim will be described as optional components.

[0011] Furthermore, each figure is a schematic diagram and not necessarily a strictly accurate representation. Also, the same reference numeral is used for the same component in each figure.

[0012] In the following embodiments, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional orthogonal coordinate system. The vertical direction is referred to as the Z-axis direction or the up-and-down direction, one direction in the plane perpendicular to the vertical direction is referred to as the Y-axis direction or the depth direction, and the direction perpendicular to the Y-axis direction in that perpendicular plane is referred to as the X-axis direction, the left-and-right direction, or the horizontal direction. Further, in the following embodiments, the plus side in the Z-axis direction is upward or above, and the minus side in the Z-axis direction is downward or below. Also, in the following embodiments, the plus side in the Y-axis direction is the back side or the back, and the minus side in the Y-axis direction is the front side or the front. Additionally, in the following embodiments, the plus side in the X-axis direction is the right side or the right, and the minus side in the X-axis direction is the left side or the left.

[0013] Also, in the following embodiments, the coordinates in the tape image are represented in a three-axis orthogonal coordinate system of the X1-axis, Y1-axis, and Z1-axis. For example, the X1-axis is the axis corresponding to the X-axis, the Y1-axis is the axis corresponding to the Y-axis, and the Z1-axis is the axis corresponding to the Z-axis. Also, the plus and minus sides of the X1-axis, Y1-axis, and Z1-axis correspond to the plus and minus sides of the X-axis, Y-axis, and Z-axis.

[0014] In addition, in the following embodiments, the coordinates in the substrate image are represented in a three-axis orthogonal coordinate system of the X2-axis, Y2-axis, and Z2-axis. For example, the X2-axis is the axis corresponding to the X-axis, the Y2-axis is the axis corresponding to the Y-axis, and the Z2-axis is the axis corresponding to the Z-axis. Also, the plus and minus sides of the X2-axis, Y2-axis, and Z2-axis correspond to the plus and minus sides of the X-axis, Y-axis, and Z-axis.

[0015] Moreover, in the following embodiments, the terms "above" and "below" do not refer to the upward (vertically above) and downward (vertically below) directions in absolute spatial recognition, but are used as terms defined by relative positional relationships.

[0016] Also, the numerical values in the following embodiments are all examples, and other numerical values may also be used.

[0017] In addition, in this specification, ordinal numbers such as "first" and "second" do not mean the number or order of components, unless otherwise specified, and are used for the purpose of avoiding confusion and distinguishing between components of the same kind.

[0018] In addition, in the following embodiments, for example, when described in contrast to "equal to or greater than the threshold value" and "less than the threshold value", it means being distinguished based on the threshold value, and may respectively mean "greater than the threshold value" and "less than or equal to the threshold value".

[0019] (Embodiment) [Configuration] First, the configuration of the ACF pasting device according to the embodiment will be described.

[0020] FIG. 1 is a diagram showing the configuration of an ACF pasting device 10 according to the embodiment. FIGS. 2 to 4 are diagrams showing the specific configuration of an ACF pasting mechanism 20 according to the embodiment. Specifically, FIG. 2 is a front view showing the ACF pasting mechanism 20 according to the embodiment. FIG. 3 is a side view showing the ACF pasting mechanism 20 according to the embodiment. FIG. 4 is a top view showing the ACF pasting mechanism 20 according to the embodiment. Note that FIG. 2 also shows an enlarged view schematically showing the layer structure of tapes tpL and tpR. In addition, in FIG. 4, a part of the ACF pasting mechanism 20 is shown.

[0021] The ACF bonding apparatus 10 is a device for bonding ACF (more specifically, ACF segments peeled off from tape) to a substrate 3 for bonding components. Specifically, the ACF bonding apparatus 10 uses an adhesive head 223L to bond ACF segments tp3L, which are segments of the ACF layer tp2L contained in tape tpL, to the substrate 3 placed on the stage 214. The ACF bonding apparatus 10 also uses an adhesive head 223R to bond ACF segments tp3R, which are segments of the ACF layer tp2R contained in tape tpR, to the substrate 3 placed on the stage 214. Thus, in this embodiment, the two ACF sections (ACF sections tp3L and tp3R) are attached to the substrate 3 at once (for example, simultaneously) by using the two attachment heads (attachment heads 223L and 223R) provided by the two attachment mechanisms (first attachment mechanism 220A and second attachment mechanism 220B).

[0022] The ACF bonding apparatus 10 is part of a component mounting system for producing, for example, display panels. In this component mounting system, for example, the ACF bonding apparatus 10 attaches ACF slices to electrode portions 4 provided on a substrate 3, and a component crimping device (not shown) heat-presses the substrate 3 and the component via the ACF slices. The ACF bonding apparatus 10 attaches ACF slices to a substrate 3 that has been transported from an upstream device by a transport unit that transports the substrate 3. The substrate 3 with the ACF slices attached is then transported by the transport unit to a component crimping device located downstream of the ACF bonding apparatus 10.

[0023] Tape tpL includes a base layer tp1L and an ACF layer tp2L. The base layer tp1L is a separator for supporting the ACF layer tp2L. The base layer tp1L is a tape-shaped film formed from, for example, a resin such as polyethylene terephthalate. The ACF layer tp2L is a tape-shaped layer made of ACF. The ACF section tp3L is a section formed by cutting the ACF layer tp2L. Base layer tp1L is an example of a first base layer. The ACF layer tp2L is an example of a first ACF layer. Tape tpL is an example of a first tape. The ACF section tp3L is an example of a first ACF section.

[0024] Tape tpR has the same structure as tape tpL. Specifically, tape tpR includes a base layer tp1R and an ACF layer tp2R. The base layer tp1R is a separator for supporting the ACF layer tp2R. The base layer tp1R is a tape-shaped film formed from, for example, a resin such as polyethylene terephthalate. The ACF layer tp2R is a tape-shaped layer made of ACF. The ACF section tp3R is a section formed by cutting the ACF layer tp2R. The base layer tp1R is an example of a second base layer. The ACF layer tp2R is an example of a second ACF layer. Tape tpR is an example of a second tape. The ACF section tp3R is an example of a second ACF section.

[0025] The ACF bonding apparatus 10 forms ACF sections tp3L and tp3R by cutting (half-cutting) the ACF layers tp2L and tp2R to a predetermined size so that they remain held in place by the base layers tp1L and tp1R by the cutting sections (first cutting section 22A and second cutting section 22B). Furthermore, the ACF bonding apparatus 10 peels the ACF sections tp3L and tp3R from the base layers tp1L and tp1R by gripping and moving the base layers tp1L and tp1R with two peeling pins. Finally, the ACF bonding apparatus 10 adjusts the position of the substrate 3 placed on the stage 214 and uses the bonding heads 223L and 223R to bond the ACF sections tp3L and tp3R, which have been cut to a predetermined size, to the substrate 3.

[0026] An example of substrate 3 is a flexible film-like substrate formed from resin or the like. However, substrate 3 may also be a rigid substrate such as a glass substrate.

[0027] Examples of components that can be attached to substrate 3 via ACF sections tp3L and tp3R include electronic components such as ICs (Integrated Circuits), TCPs (Tape Carrier Packages), and FPCs (Flexible Printed Circuits).

[0028] The ACF application device 10 comprises an ACF application mechanism 20 and a control device 30.

[0029] The ACF attachment mechanism 20 is a mechanism that attaches ACF sections tp3L and tp3R to the substrate 3 brought in from upstream and then transports it downstream.

[0030] The ACF attachment mechanism 20 comprises a first attachment mechanism 220A, a second attachment mechanism 220B, a substrate imaging unit 26, and a moving mechanism 27.

[0031] The first attachment mechanism 220A and the second attachment mechanism 220B have substantially the same configuration and are devices for attaching ACF sections to the substrate 3. Specifically, the first attachment mechanism 220A attaches ACF sections tp3L generated from tape tpL to the substrate 3. The second attachment mechanism 220B attaches ACF sections tp3R generated from tape tpR to the substrate 3. For example, the first attachment mechanism 220A is implemented by an attachment mechanism unit 220L, and the second attachment mechanism 220B is implemented by an attachment mechanism unit 220R. The attachment mechanism unit 220L and the attachment mechanism unit 220R are mechanisms for attaching ACF sections to the substrate 3, and have the same configuration as each other.

[0032] The first adhesive mechanism 220A includes a first supply unit 21A, a first cutting unit 22A, a first tape feeding mechanism 23A, a first crimping unit 24A, and a first tape imaging unit 25A. The second adhesive mechanism 220B includes a second supply unit 21B, a second cutting unit 22B, a second tape feeding mechanism 23B, a second crimping unit 24B, and a second tape imaging unit 25B.

[0033] The first supply unit 21A and the second supply unit 21B have the same configuration, the first cutting unit 22A and the second cutting unit 22B have the same configuration, the first tape feeding mechanism 23A and the second tape feeding mechanism 23B have the same configuration, the first crimping unit 24A and the second crimping unit 24B have the same configuration, and the first tape imaging unit 25A and the second tape imaging unit 25B have the same configuration.

[0034] The functional configurations of the first supply unit 21A, the first cutting unit 22A, the first tape feeding mechanism 23A, the first crimping unit 24A, and the first tape imaging unit 25A will be described below. The functional configurations of the second supply unit 21B, the second cutting unit 22B, the second tape feeding mechanism 23B, the second crimping unit 24B, and the second tape imaging unit 25B, which are common to these units, will be omitted or simplified.

[0035] The first supply unit 21A is a mechanism for supplying tape tpL, which includes a base layer tp1L and an ACF layer tp2L. For example, the first supply unit 21A includes a tape supply reel 221L.

[0036] The tape supply reel 221L is a reel that holds the tape tpL. Specifically, the tape supply reel 221L is a reel around which the tape tpL is wound. The tape tpL is unwound from the tape supply reel 221L by the driving of one or more rollers. For example, the tape tpL held on the tape supply reel 221L is fed to a predetermined position by the first tape feeding mechanism 23A. In this way, for example, the first supply unit 21A supplies the tape tpL in cooperation with the first tape feeding mechanism 23A.

[0037] The first cutting unit 22A is a mechanism that performs a cutting process (first cutting process) to form an ACF section tp3L supported by the base layer tp1L by cutting the ACF layer tp2L contained in the tape tpL supplied from the first supply unit 21A. For example, the first cutting unit 22A includes a tape cutting unit 225L.

[0038] The tape cutting unit 225L is a mechanism for cutting the ACF layer tp2L contained in the tape tpL. For example, the tape cutting unit 225L comprises a backing plate 225aL and a cutter 225bL. For example, the tape cutting unit 225L cuts the ACF layer tp2L of the tape tpL unfed from the tape supply reel 221L by moving the cutter 225bL in the vertical direction. In other words, the tape cutting unit 225L performs a half-cut on the tape tpL. This cut forms an ACF segment tp3L. Specifically, the cutter 225bL cuts the ACF layer tp2L in the tape tpL by a drive mechanism having a guide and motor (not shown) driven by the control device 30. More specifically, the cutter 225bL moves upward to sandwich the tape tpL between itself and the backing plate 225aL and cuts through the ACF layer tp2L of the tape tpL. When the substrate 3 is supported by the adhesive backup stage 224L, the peripheral edge of the substrate 3 is positioned between the adhesive head 223L, the backing plate 225aL, the tape tpL, and the adhesive backup stage 224L.

[0039] The first tape feeding mechanism 23A is a mechanism for feeding the tape tpL held in the first supply unit 21A. Specifically, the first tape feeding mechanism 23A performs a tape feeding process (first tape feeding process) to feed the tape tpL, which includes the ACF section tp3L supported by the base layer tp1L. More specifically, in the first tape feeding process, the first tape feeding mechanism 23A performs a first feeding process to feed the tape tpL from a first position where a cutting process (first cutting process) is performed towards a second position where a tape imaging process (first tape imaging process) is performed, and a second feeding process to feed the tape tpL from the second position towards a third position where a crimping process (first crimping process) is performed by a predetermined amount (predetermined first feeding amount). For example, when the first tape feeding mechanism 23A performs the first tape feeding process, the tape tpL is supplied from the first supply unit 21A.

[0040] The first tape feeding mechanism 23A includes, for example, a feed roller 232L, a press roller 233L, a guide roller 234L, and a tape retrieval section 222L.

[0041] The feed roller 232L is a roller for feeding the tape tpL. For example, the feed roller 232L comprises a roller and a motor that rotates the roller. The motor is, for example, a servo motor, but any type of roller may be used.

[0042] The retaining roller 233L is a roller for feeding the tape tpL. In this embodiment, the tape tpL is supported by being sandwiched between the feed roller 232L and the retaining roller 233L, and the tape tpL is fed in a predetermined direction by the rotation of the feed roller 232L. The feed roller 232L and the retaining roller 233L are, for example, pinch rollers. Thus, for example, the first tape feeding mechanism 23A is equipped with rollers for feeding the tape tpL by rotating in contact with the tape tpL.

[0043] The guide roller 234L is a roller that restricts the movement of the tape tpL. Specifically, the guide roller 234L restricts the movement of the tape tpL in the width direction (in this embodiment, the Y-axis direction).

[0044] The tape retrieval unit 222L is a mechanism for retrieving the tape tpL. For example, the tape retrieval unit 222L has a suction mechanism for sucking up the tape tpL, and retrieves the tape tpL by sucking it up. Specifically, the tape retrieval unit 222L retrieves the base material layer tp1L that remains after the ACF layer tp2L has been attached to the substrate 3. The tape retrieval unit 222L may also be a mechanism that is rotated by a motor (not shown) to wind up the tape tpL.

[0045] The first crimping unit 24A is a mechanism that performs a crimping process (first crimping process) in which the ACF section tp3L is peeled off from the base layer tp1L and crimped onto the substrate 3. Specifically, the first crimping unit 24A peels off the ACF section tp3L, which is supported by the base layer tp1L contained in the tape tpL fed by the first tape feeding mechanism 23A, from the base layer tp1L and crimps it onto the substrate 3. For example, the first crimping unit 24A includes a bonding head 223L and a bonding backup stage 224L.

[0046] The adhesive head 223L is a head that peels the ACF section tp3L from the base layer tp1L and presses it onto the substrate 3. Below the adhesive head 223L, an adhesive backup stage 224L is positioned. For example, the adhesive head 223L presses the ACF section tp3L onto the substrate 3 by moving up and down, driven by a control device 30, which has a drive mechanism having a guide and a motor (not shown).

[0047] The adhesion backup stage 224L is a backup stage that supports the edge (in other words, the peripheral edge) of the substrate 3 from below. The substrate 3 is transported from upstream to the ACF attachment mechanism 20 by the moving mechanism 27 (specifically, the substrate moving mechanism 210), and its edge is placed on the adhesion backup stage 224L. Subsequently, the ACF section tp3L is attached to the substrate 3 by the attachment head 223L.

[0048] Specifically, the adhesive head 223L descends, pressing the tape tpL, which is passed between it and the adhesive backup stage 224L, against the peripheral edge of the substrate 3 supported by the adhesive backup stage 224L. In other words, the adhesive head 223L presses the tape tpL against the peripheral edge of the substrate 3 and towards the adhesive backup stage 224L. At this time, an ACF section tp3L is formed on the underside of the base material layer tp1L of the tape tpL being pressed. In addition, multiple electrode portions 4 are formed on the peripheral edge of the substrate 3. Therefore, the ACF section tp3L is pressed against and adhered to the electrode portions 4 of the substrate 3 and peeled off from the base material layer tp1L. The base material layer tp1L from which the ACF section tp3L has been peeled off is collected by the tape recovery unit 222L. The moving mechanism 27 (specifically, the substrate moving mechanism 210) moves the substrate 3 with the ACF section tp3L attached downstream.

[0049] The first tape imaging unit 25A is a camera that performs tape imaging processing (first tape imaging processing) to generate a tape image (first tape image) by imaging the cut locations (first cut locations) that have been cut by the first cutting process in the ACF layer tp2L supported by the base layer tp1L, which is supported by the base layer tp1L, which is included in the tape tpL fed by the first tape feeding mechanism 23A. For example, the first tape imaging unit 25A includes a camera 230L.

[0050] Camera 230L is a camera that generates a first tape image by imaging the first cut location in the ACF layer tp2L, which is supported by the substrate layer tp1L contained in the tape tpL fed by the first tape feeding mechanism 23A, and which has been cut by the first cutting process. After the ACF layer tp2L is cut by the first cutting section 22A, the tape tpL is fed by the first tape feeding mechanism 23A performing a first feed process from the first position where the ACF layer tp2L was cut to the second position where the first cut location is imaged by the camera 230L. Camera 230L, for example, has a fixed position and images the first cut location in the tape tpL that has been fed to the second position. Thereafter, for example, the tape tpL is fed by the first tape feeding mechanism 23A performing a second feed process from the second position toward the third position where the ACF section tp3L is attached (pressed) to the substrate 3 by the attachment head 223L, by a predetermined first feed amount.

[0051] Note that the second position and the third position may be the same or different. In this embodiment, the second position and the third position are the same. The first, second, and third positions are, for example, located in this order along the X-axis, and are the same in the Y-axis and Z-axis directions. In this embodiment, the tape tpL is positioned at the first, second, and third positions described above, and is moved along the X-axis (in other words, the direction of extension of the tape tpL) so as to pass through the first, second, and third positions described above.

[0052] The substrate imaging unit 26 is a camera that generates a substrate image (first substrate image) by imaging the first cutting location in the ACF section tp3L pressed onto the substrate 3. The substrate imaging unit 26 includes, for example, a camera 231.

[0053] Camera 231 is a camera that generates a first substrate image by imaging the ACF section tp3L attached to the substrate 3. Specifically, camera 231 images the first cutting location in the ACF section tp3L attached to the substrate 3.

[0054] Images captured (generated) by cameras 230L and 231 (such as the first tape image and the first substrate image) are used, for example, to determine abnormalities in each mechanism of the ACF application device 10, or they are displayed on a display device (not shown) so that an operator can determine whether or not there is an abnormality. In this embodiment, the captured images generated by cameras 230L and 231 are used to change a predetermined first feed amount. Details of the process for changing the predetermined first feed amount will be described later.

[0055] In this embodiment, the ACF attachment mechanism 20 comprises two attachment mechanism units 220L and 220R, an X-axis rail mechanism 228, an attachment base 229, and a camera 231.

[0056] The adhesive base 229 is a base for supporting two adhesive mechanism units 220L and 220R.

[0057] The X-axis rail mechanism 228 is positioned along the X-axis direction on the upper surface of the adhesive base 229. Two adhesive mechanism units 220L and 220R are mounted on this X-axis rail mechanism 228, side by side, so as to be movable along the X-axis direction. The X-axis rail mechanism 228 also includes a mechanism for changing the distance between the two adhesive mechanism units 220L and 220R.

[0058] The two attachment mechanism units 220L and 220R are mechanisms for attaching ACF sections tp3L and tp3R to the substrate 3, respectively, and have the same configuration as each other.

[0059] For example, the adhesive mechanism units 220L and 220R each include a tape supply reel, a tape retrieval unit, an adhesive head, an adhesive backup stage, a tape cutting unit, a camera, a feed roller, a press roller, and a guide roller. Specifically, the adhesive mechanism unit 220L includes a tape supply reel 221L, a tape retrieval unit 222L, an adhesive head 223L, an adhesive backup stage 224L, a tape cutting unit 225L, a camera 230L, a feed roller 232L, a press roller 233L, and a guide roller 234L. The adhesive mechanism unit 220R includes a tape supply reel 221R, a tape retrieval unit 222R, an adhesive head 223R, an adhesive backup stage 224R, a tape cutting unit 225R, a camera 230R, a feed roller 232R, a press roller 233R, and a guide roller 234R.

[0060] The tape supply reel 221L and the tape supply reel 221R have the same structure. The tape retrieval unit 222L and the tape retrieval unit 222R have the same structure. The adhesive head 223L and the adhesive head 223R have the same structure. The adhesive backup stage 224L and the adhesive backup stage 224R have the same structure. The tape cutting unit 225L and the tape cutting unit 225R have the same structure. For example, the tape cutting unit 225R includes a backing plate 225aR and a cutter 225bR. The backing plate 225aL and the backing plate 225aR have the same structure. The cutter 225bL and the cutter 225bR have the same structure. The camera 230L and the camera 230R have the same structure. The feed roller 232L and the feed roller 232R have the same structure. Furthermore, the press roller 233L and the press roller 233R have identical structures. Similarly, the guide roller 234L and the guide roller 234R have identical structures.

[0061] For example, after multiple ACF sections tp3L and tp3R are attached to the substrate 3 by the attachment mechanism units 220L and 220R, the substrate 3 is moved by the substrate moving mechanism 210 to a position where the camera 231 takes an image, and the camera 231 takes an image.

[0062] The second adhesive mechanism 220B also has the same configuration as the first adhesive mechanism 220A, and the second adhesive mechanism 220B performs the same processing as the first adhesive mechanism 220A.

[0063] For example, the second supply unit 21B is a mechanism for supplying tape tpR, which includes a base layer tp1R and an ACF layer tp2R. For example, the second supply unit 21B includes a tape supply reel 221R.

[0064] The second cutting unit 22B is a mechanism that performs a cutting process (second cutting process) to form an ACF section tp3R supported by the base layer tp1R by cutting the ACF layer tp2R contained in the tape tpR supplied from the second supply unit 21B. For example, the second cutting unit 22B includes a tape cutting unit 225L.

[0065] The second tape feeding mechanism 23B is a mechanism that feeds the tape tpR held in the second supply unit 21B. Specifically, the second tape feeding mechanism 23B performs a tape feeding process (second tape feeding process) that feeds the tape tpR, which includes the ACF section tp3R supported by the base layer tp1R. More specifically, in the second tape feeding process, the second tape feeding mechanism 23B performs a third feeding process that feeds the tape tpR from the fourth position where the second cutting process is performed toward the fifth position where the tape imaging process (second tape imaging process) is performed, and a fourth feeding process that feeds the tape tpR from the fifth position toward the sixth position where the crimping process (second crimping process) is performed by a predetermined feed amount (predetermined second feed amount). For example, when the second tape feeding mechanism 23B performs the second tape feeding process, the tape tpR is supplied from the second supply unit 21B.

[0066] The second tape feeding mechanism 23B includes, for example, a feed roller 232R, a press roller 233R, a guide roller 234R, and a tape retrieval section 222R.

[0067] The second crimping unit 24B is a mechanism that performs a crimping process (second crimping process) in which the ACF section tp3R is peeled off from the base layer tp1R and crimped onto the substrate 3. Specifically, the second crimping unit 24B peels off the ACF section tp3R, which is supported by the base layer tp1R contained in the tape tpR fed by the second tape feeding mechanism 23B, from the base layer tp1R and crimps it onto the substrate 3. For example, the second crimping unit 24B includes a bonding head 223R and a bonding backup stage 224R.

[0068] The substrate 3 is transported from upstream to the ACF attachment mechanism 20 by the substrate moving mechanism 210, and its ends are placed on the attachment backup stages 224L and 224R. Subsequently, the ACF section tp3L is attached to the substrate 3 by the attachment head 223L, and the ACF section tp3R is attached to the substrate 3 by the attachment head 223R. The substrate moving mechanism 210 then moves the substrate 3, to which the ACF sections tp3L and tp3R have been attached, downstream.

[0069] For example, the substrate moving mechanism 210 rotates and moves the substrate 3 such that the peripheral edge of the substrate 3, which is held by suction on the stage 214, is placed on the adhesive backup stage 224L and the adhesive backup stage 224R and supported from below by the adhesive backup stage 224L and the adhesive backup stage 224R.

[0070] The second tape imaging unit 25B is a camera that performs tape imaging processing (second tape imaging processing) to generate a tape image (second tape image) by imaging the second cut location in the ACF layer tp2R supported by the base layer tp1R, which has been cut by the second cutting process. Specifically, the second tape imaging unit 25B generates a second tape image by imaging the second cut location in the ACF layer tp2R supported by the base layer tp1R, which is contained in the tape tpR fed by the second tape feeding mechanism 23B, which has been cut by the second cutting process. For example, the second tape imaging unit 25B includes a camera 230R.

[0071] After the ACF layer tp2R of the tape tpR is cut by the second cutting section 22B, the second tape feed mechanism 23B performs a third feed process to move the tape tpR from the fourth position where the ACF layer tp2R is cut to the fifth position where the second cut location is imaged by the camera 230R. The camera 230R, for example, has a fixed position and images the second cut location on the tape tpR that has been moved to the fifth position. Subsequently, for example, the tape tpR is moved by a predetermined second feed amount from the fifth position toward the sixth position where the ACF segment tp3R is attached (pressed) to the substrate 3 by the attachment head 223R, through a fourth feed process performed by the second tape feed mechanism 23B.

[0072] Note that the fifth position and the sixth position may be the same or different. In this embodiment, the fifth position and the sixth position are the same. The fourth position, the fifth position and the sixth position are, for example, located in this order along the X-axis, and are the same in the Y-axis and Z-axis directions. In this embodiment, the tape tpR is positioned at the fourth position, the fifth position, and the sixth position, respectively, and is moved along the X-axis (in other words, the direction of extension of the tape tpR) so as to pass through the fourth position, the fifth position, and the sixth position.

[0073] Furthermore, the substrate imaging unit 26 generates a substrate image (second substrate image) by imaging the second cutting location in the ACF section tp3R that is pressed onto the substrate 3.

[0074] Furthermore, the first substrate image and the second substrate image may be different images or the same image. In other words, the substrate imaging unit 26 may generate a substrate image by simultaneously imaging both the first and second cutting locations so that both the first and second cutting locations are visible.

[0075] Furthermore, the adhesive mechanism unit 220L and the adhesive mechanism unit 220R may each attach ACF segments tp3L and tp3R to the same substrate 3, or they may each attach ACF segments tp3L and tp3R to different substrates 3. In this embodiment, the adhesive mechanism unit 220L and the adhesive mechanism unit 220R each attach ACF segments tp3L and tp3R to the same substrate 3. Also, the number of adhesive mechanism units in the ACF adhesive mechanism 20 may be one or three or more.

[0076] The moving mechanism 27 is a mechanism for moving the substrate 3. The moving mechanism 27 is implemented, for example, by a substrate moving mechanism 210.

[0077] The substrate moving mechanism 210 is a mechanism for moving the substrate 3. The substrate moving mechanism 210 comprises an X-axis table 211, a Y-axis table 212, a Z-axis table 213, and a stage 214.

[0078] The X-axis table 211 is a mechanism for moving the stage 214 in the X-axis direction. The Y-axis table 212 is a mechanism for moving the stage 214 in the Y-axis direction. The Z-axis table 213 is a mechanism for moving the stage 214 in the Z-axis direction. The X-axis table 211, Y-axis table 212, and Z-axis table 213 are equipped with drive mechanisms such as guides and motors for moving the stage 214, and the stage 214 can be moved arbitrarily in these three axes by the control of these drive mechanisms by the control device 30.

[0079] Stage 214 is the stage on which the substrate 3 is placed. The substrate 3 is placed such that its edges protrude from the stage 214 when viewed from above. These edges are supported from below by the attachment backup stages 224L and 224R when the ACF sections tp3L and tp3R are attached to the substrate 3.

[0080] The X-axis table 211 is, for example, rail-shaped and is positioned along the X-axis direction on the adhesive base 229. The Y-axis table 212 is, for example, rail-shaped and is positioned on the X-axis table 211 parallel to the Y-axis direction and moves freely in the X-axis direction. The Z-axis table 213 is positioned on the Y-axis table 212 and moves freely in the Y-axis direction, raising and lowering the stage 214 provided on top of it in the Z-axis direction and rotating it around the Z-axis.

[0081] The substrate 3 is placed on the stage 214 and held in place by suction. This substrate moving mechanism 210 moves the substrate 3, which is held in place by suction on the stage 214, in the X, Y, and Z directions, and further rotates the substrate 3 around the Z axis.

[0082] For example, the substrate moving mechanism 210 rotates and moves the substrate 3 such that the peripheral edge of the substrate 3, which is held by suction on its stage 214, is placed on the adhesive backup stages 224L and 224R and supported from below by the adhesive backup stages 224L and 224R.

[0083] The control device 30 is a computer that controls each component of the ACF application device 10 (specifically, each component of the ACF application mechanism 20). For example, these components, or the drive mechanisms for driving these components, are communicated with the control device 30 by wireless or control lines, and perform predetermined tasks under the control of the control device 30.

[0084] The control device 30 is implemented, for example, by a communication interface, a non-volatile memory where the program is stored, a volatile memory which is a temporary storage area for executing the program, input / output ports for sending and receiving signals, and a processor such as a CPU (Central Processing Unit) that executes the program.

[0085] The control device 30 comprises a control unit 31, a modification unit 32, and a storage unit 33.

[0086] The control unit 31 is a processing unit that controls various operations (various tasks) of each component of the ACF attachment mechanism 20, such as the first attachment mechanism 220A, the second attachment mechanism 220B, the substrate imaging unit 26, and the moving mechanism 27.

[0087] Specifically, the control unit 31 causes the cutting process by the first cutting unit 22A and the second cutting unit 22B, the tape feeding process by the first tape feeding mechanism 23A and the second tape feeding mechanism 23B, the crimping process by the first crimping unit 24A and the second crimping unit 24B, and the tape imaging process by the first tape imaging unit 25A and the second tape imaging unit 25B. For example, the control unit 31 causes the cutting process, tape feeding process, crimping process, and tape imaging process to be repeatedly executed, thereby repeatedly imaging the cut area and repeatedly attaching the ACF sections tp3L and tp3R to the substrate 3.

[0088] Furthermore, for example, the control unit 31 causes the first adhesive mechanism 220A and the second adhesive mechanism 220B to perform the first and second crimping processes simultaneously. For example, the control unit 31 controls the first adhesive mechanism 220A and the second adhesive mechanism 220B collectively so that the first cutting unit 22A and the second cutting unit 22B perform the first and second cutting processes simultaneously, the first tape feeding mechanism 23A and the second tape feeding mechanism 23B perform the first and second tape feeding processes simultaneously, the first crimping unit 24A and the second crimping unit 24B perform the first and second crimping processes simultaneously, and the first tape imaging unit 25A and the second tape imaging unit 25B perform the first and second tape imaging processes simultaneously. The control unit 31 may also execute the first cutting process and the second cutting process, the first tape feeding process and the second tape feeding process, and the first tape imaging process and the second tape imaging process at any desired timing, and control the first adhesive mechanism 220A and the second adhesive mechanism 220B collectively so that the timing of the first crimping process and the second crimping process are synchronized.

[0089] The modification unit 32 is a processing unit that changes a predetermined feed amount based on the captured images obtained by the first tape imaging unit 25A, the second tape imaging unit 25B, and the substrate imaging unit 26. Specifically, the modification unit 32 changes a predetermined first feed amount based on the first tape image generated by the first tape imaging unit 25A and the first substrate image generated by the substrate imaging unit 26. Furthermore, for example, the modification unit 32 changes a predetermined second feed amount based on the second tape image generated by the second tape imaging unit 25B and the second substrate image generated by the substrate imaging unit 26.

[0090] For example, the modification unit 32 calculates the amount of deviation from a predetermined reference position of the ACF segment cutting location on the substrate 3 based on the substrate image. The modification unit 32 then changes (updates) a predetermined feed amount based on the calculated amount of deviation and positional information regarding the ACF segment cutting location in the tape image.

[0091] For example, the modification unit 32 acquires (calculates) positional information (first positional information) regarding the position of the first cutting point in the ACF section tp3L supported by the substrate layer tp1L, based on the first tape image.

[0092] The first position information can be any information relating to the position of the first cutting point, for example, it may be information indicating the coordinates of the first cutting point, or it may be information indicating the amount of deviation of the first cutting point from the reference position (tape reference position). The reference position can be arbitrarily determined in advance and is not particularly limited. Information indicating the reference position is stored in advance in the storage unit 33, for example.

[0093] Furthermore, for example, the modification unit 32 obtains (calculates) the amount of deviation (first deviation) from a predetermined reference position (predetermined first reference position) of the first cutting location in the ACF section tp3L pressed onto the substrate 3, based on the first substrate image. Also, for example, the modification unit 32 changes a predetermined first feed amount based on the first position information and the first deviation. The predetermined first reference position can be arbitrarily determined in advance and is not particularly limited. Information indicating the predetermined first reference position is stored in advance in the storage unit 33, for example.

[0094] Similarly, for example, the modification unit 32 acquires (calculates) positional information (second positional information) regarding the position of the second cutting point in the ACF section tp3R supported by the substrate layer tp1R, based on the second tape image.

[0095] The second position information can be any information relating to the position of the second cutting point, for example, it may be information indicating the coordinates of the second cutting point, or it may be information indicating the amount of deviation of the second cutting point from the reference position (second tape reference position). The reference position can be arbitrarily determined in advance and is not particularly limited. Information indicating the reference position is stored in advance in the storage unit 33, for example.

[0096] Furthermore, for example, the modification unit 32 acquires (calculates) the amount of deviation (second deviation) from a predetermined reference position (predetermined second reference position) of the second cutting location in the ACF section tp3R pressed onto the substrate 3, based on the second substrate image. Also, for example, the modification unit 32 changes a predetermined second feed amount based on the second position information and the second deviation. The predetermined second reference position can be arbitrarily determined in advance and is not particularly limited. Information indicating the predetermined second reference position is stored in advance in the storage unit 33, for example.

[0097] For example, the modification unit 32 changes a predetermined first feed amount before the first attachment mechanism 220A presses a new ACF segment tp3L onto the substrate 3. Similarly, for example, the modification unit 32 changes a predetermined second feed amount before the second attachment mechanism 220B presses a new ACF segment tp3R onto the substrate 3. In other words, for example, the modification unit 32 changes a predetermined first feed amount and a predetermined second feed amount before the first attachment mechanism 220A presses a new ACF segment tp3L onto the substrate 3 and before the second attachment mechanism 220B presses a new ACF segment tp3R onto the substrate 3. To put it another way, the modification unit 32 changes a predetermined feed amount after attaching an ACF segment but before attaching a new ACF segment, and the control unit 31 uses the changed predetermined feed amount to feed the tape and press the new ACF segment onto the substrate 3.

[0098] The control unit 31 may also output captured images, etc., to an external device. For example, the control unit 31 may output captured images, etc., to a notification device such as a display and / or speaker, thereby notifying the operator, with images and / or sound, that the tape tpL and / or tp3R are not being fed at the appropriate rate.

[0099] The processing units, such as the control unit 31 and the modification unit 32, are implemented, for example, by a processor and a control program stored in memory or the like that is executed by the processor.

[0100] The memory unit 33 is a storage device that stores various data such as the size of the substrate 3, the attachment positions and directions of the ACF sections tp3L and tp3R, the operation of each component, the timing of said operation, the timing for transferring the substrate 3 to a component crimping device located downstream of the ACF attachment device 10, a control program executed by the processing unit, and information used by the modification unit 32 to calculate the amount of displacement and position information. The memory unit 33 is implemented by, for example, flash memory, an HDD (Hard Disk Drive), etc.

[0101] [Processing Procedure] Next, the processing procedure of the ACF application device 10 according to the embodiment will be described in detail.

[0102] Figure 5 is a flowchart illustrating the processing procedure of the ACF application apparatus 10 according to the embodiment. Figure 6 is a diagram illustrating the specific processing procedures of the application process and the imaging process in the ACF application apparatus 10 according to the embodiment. Note that in Figure 6, only the configuration for illustrative purposes is shown, and some configurations of the ACF application mechanism 20, such as the application backup stage 224L, are not shown. In the explanation using Figures 5 and 6, the processing of the first application mechanism 220A will be described. The processing of the second application mechanism 220B is substantially the same as that of the first application mechanism 220A.

[0103] First, the substrate moving mechanism 210 moves the substrate 3 (S110). Specifically, the control unit 31 controls the substrate moving mechanism 210 to place the edge of the substrate 3 on the adhesive backup stage 224L. More specifically, as shown in Figure 6(a), the substrate 3 is moved so that the first adhesive position, which is the position on the substrate 3 where the ACF section tp3L is to be attached, is located below the adhesive head 223L. The first adhesive position is the position on the substrate 3 where the electrode section 4 is located, and from this position the ACF section tp3L will be attached.

[0104] Next, the first cutting unit 22A performs a first cutting process to form an ACF segment tp3L supported by the base layer tp1L by cutting the ACF layer tp2L contained in the tape tpL supplied from the first supply unit 21A, which includes a base layer tp1L and an ACF layer tp2L (S120). Specifically, the control unit 31 controls the first cutting unit 22A to form the ACF segment tp3L supported by the base layer tp1L. More specifically, as shown in Figure 6(b), the ACF segment tp3L is formed when the ACF layer tp2L is cut by the tape cutting unit 225L.

[0105] Next, the first tape feeding mechanism 23A performs a first tape feeding process (more specifically, a first feeding process) to feed the tape tpL containing the ACF section tp3L supported by the substrate layer tp1L, thereby positioning the position of the first cut location (also simply called the first cut location) within the imaging area (within the imaging range) of the first tape imaging unit 25A (specifically, the camera 230L) (S130). Specifically, the control unit 31 controls the first tape feeding mechanism 23A to feed the tape tpL so that the first cut location is located within the imaging area (tape imaging area) of the first tape imaging unit 25A. More specifically, as shown in Figure 6(c), the tape tpL is moved so that the first cut location (for example, the boundary between the ACF layer tp2L and the ACF section tp3L in Figure 6(c)) is located above the camera 230L. The imaging area (tape imaging area) is, for example, the area within the field of view of the camera 230L.

[0106] Next, the control unit 31 causes the first tape imaging unit 25A (specifically, the camera 230L) to image the first cutting position (S140). Specifically, the first tape imaging unit 25A performs a first tape imaging process to generate a first tape image by imaging the first cutting location cut by the first cutting process in the ACF layer tp2L supported by the base layer tp1L contained in the tape tpL fed by the first tape feeding mechanism 23A. In this way, the first tape imaging unit 25A images the first cutting location cut by the first cutting process in the ACF layer tp2L supported by the base layer tp1L before the first crimping process is performed.

[0107] Next, the first tape feeding mechanism 23A further performs a first tape feeding process (specifically, a second feeding process) to feed the tape tpL, which includes the ACF segment tp3L supported by the substrate layer tp1L, by a predetermined first feed amount, thereby positioning the ACF segment tp3L at the crimping position (S150). Specifically, the control unit 31 controls the first tape feeding mechanism 23A to feed the tape tpL so that the ACF segment tp3L moves to a position where it is crimped onto the substrate 3. More specifically, as shown in Figure 6(d), the ACF segment tp3L is moved between the crimping head 223L and the first crimping position.

[0108] In this example, the initial value of the predetermined first feed amount is 0. That is, at the start of implementation, the position of the ACF intercept tp3L shown in Figure 6(c) and the position of the ACF intercept tp3L shown in Figure 6(d) are the same. If the predetermined first feed amount remains 0 without being changed by the process described later, that is, if the position of the ACF intercept tp3L when step S140 is performed and the position of the ACF intercept tp3L when step S160 described later is performed are the same, then step S150 does not need to be performed.

[0109] Next, the first crimping unit 24A performs a first crimping process to peel the ACF section tp3L from the base layer tp1L and crimp it onto the substrate 3 (S160). Specifically, the first crimping unit 24A peels the ACF section tp3L, which is supported by the base layer tp1L contained in the tape tpL fed by the first tape feeding mechanism 23A, from the base layer tp1L and crimps it onto the substrate 3. More specifically, the control unit 31 controls the first crimping unit 24A to peel the ACF section tp3L, which is supported by the base layer tp1L, from the base layer tp1L and crimp it onto the substrate 3. Even more specifically, as shown in Figure 6(e), the ACF section tp3L is attached to the first attachment position on the substrate 3.

[0110] Next, the control unit 31 causes the substrate imaging unit 26 (specifically, the camera 231) to image the first cutting position (S170). Specifically, the substrate imaging unit 26 performs a first substrate imaging process to generate a first substrate image by imaging the first cutting location cut by the first cutting process in the ACF layer tp2L attached (i.e., pressed) to the substrate 3. For example, as shown in Figure 6(f), the substrate 3 is moved by the moving mechanism 27 so that the ACF section tp3L attached to the substrate 3 is positioned below the camera 231, and imaging is performed by the camera 231.

[0111] Next, the modification unit 32 acquires first position information and first displacement amount (S180). Specifically, the modification unit 32 acquires position information regarding the position of the first cutting location in the ACF section tp3L supported by the substrate layer tp1L based on the first tape image, and acquires the displacement amount of the first cutting location in the ACF section tp3L pressed onto the substrate 3 from a predetermined reference position based on the first substrate image.

[0112] Next, the control unit 31 determines whether all of the ACF segments tp3L have been attached to the substrate 3 (S190).

[0113] The control unit 31 terminates the process when it determines that all of the ACF segments tp3L have been attached to the substrate 3 (Yes in S190). For example, the control unit 31 controls the moving mechanism 27 to transport the substrate 3 with the ACF segments tp3L attached downstream, brings in a new substrate 3 from upstream, and executes the process again from step S110.

[0114] On the other hand, if the control unit 31 determines that the attachment of all ACF segments tp3L on the substrate 3 has not been completed (No in S190), it changes a predetermined first feed amount based on the first position information and the first displacement amount (S200).

[0115] Next, the control unit 31 returns the process to step S110 and moves the substrate 3 to a position where a new ACF section tp3L will be attached. For example, the substrate 3 is moved so that the third attachment position shown in Figure 6(f) is located below the attachment head 223L. The third attachment position is the position on the substrate 3 where the electrode section 4 is located, and from this position a new ACF section tp3L will be attached. For example, if a predetermined first feed amount is changed based on a first substrate image generated by imaging the first cutting location of the ACF section tp3L attached to the first attachment position, the ACF section tp3L attached to the third attachment position is an example of a new first ACF section.

[0116] Note that the order of processing in each step is just an example and can be rearranged as desired. For example, step S200 only needs to be executed before step S150 in the processing of the next step S110 and subsequent steps, and may be performed before the next step S110 or after the next step S110.

[0117] Furthermore, step S180 may be performed before step S200, or at any time.

[0118] Furthermore, the acquisition of the first position information and the acquisition of the first displacement amount may be performed at the same time or at different times.

[0119] Figure 7 shows a tape image according to an embodiment. Specifically, Figure 7 is a specific example of the first tape image generated by the camera 230L in step S140. More specifically, Figure 7 shows a specific example of the first tape image generated when the first cutting location in the ACF section tp3L, supported by the substrate layer tp1L and located in the imaging area (tape imaging area) of the camera 230L, is imaged by the camera 230L.

[0120] For example, the modification unit 32 calculates the amount of deviation of the first cutting position in the X1 axis direction in the first tape image from the tape reference position (first tape reference position).

[0121] As shown in Figure 7, for example, the tape reference position is predetermined by a reference line (tape reference line) at the center in the X1 axis direction of the first tape image. Also, for example, the modification unit 32 calculates a first cutting line, which is a virtual line indicating the position of the first cutting point (first cutting position). For example, the modification unit 32 calculates the first cutting line as a straight line obtained by approximating the shape of the first cutting point in the tape image with a straight line. For example, the first cutting point is the edge located on the ACF layer tp2L side of the ACF intercept tp3L. In other words, the first cutting position is the location of the edge located on the ACF layer tp2L side of the ACF intercept tp3L. In this example, the first cutting point is the edge located on the negative side of the X1 axis in the ACF intercept tp3L shown in Figure 7. The first cutting line is, for example, a virtual line parallel to the edge located on the ACF layer tp2L side of the ACF intercept tp3L. Specifically, the first cutting line is a hypothetical line obtained by approximating the first cutting point with a straight line. In other words, the first cutting line is the boundary line obtained by approximating the boundary between the ACF layer tp2L and the ACF intercept tp3L with a straight line.

[0122] For example, the modification unit 32 calculates the distance in the X1 direction between the tape reference line and the first cutting line as the amount of displacement. For example, the modification unit 32 calculates (acquires) this amount of displacement as position information (first position information).

[0123] Figure 8 shows a substrate image according to an embodiment. Specifically, Figure 8 is a specific example of a first substrate image generated by camera 231 in step S170. More specifically, Figure 8 shows a specific example of a first substrate image generated when the first cutting location of the ACF section tp3L pressed onto the substrate 3, located in the imaging area (substrate imaging area) of camera 231, is imaged by camera 231.

[0124] For example, the modification unit 32 calculates the amount of deviation of the first cutting position in the X2 axis direction in the first substrate image from the reference position (first reference position).

[0125] As shown in Figure 8, for example, a first reference position is predetermined by a reference line (first reference line) at the center in the X2 axis direction of the first substrate image. Also, for example, the modification unit 32 calculates a first cutting line. For example, the modification unit 32 calculates the first cutting line as the straight line obtained when the shape of the first cutting location in the first substrate image is approximated by a straight line. In this example, the first cutting location is the edge located on the negative side of the X2 axis in the ACF intercept tp3L shown in Figure 8. The first cutting line is, for example, a virtual line obtained when the first cutting location (the edge located on the negative side of the X2 axis in the ACF intercept tp3L shown in Figure 8) is approximated by a straight line.

[0126] For example, the modification unit 32 calculates the distance in the X2 direction between the first reference line and the first cutting line as the amount of displacement (first amount of displacement).

[0127] Figure 9 is a flowchart showing a modified example of the processing procedure of the ACF application apparatus 10 according to the embodiment. Note that (L, R) in steps S220, S230, S240, S270, and S280 shown in Figure 9 indicates that both the first application mechanism 220A (specifically, the application mechanism unit 220L) and the second application mechanism 220B (specifically, the application mechanism unit 220R) perform the processing. For example, in steps S220, S230, S240, S270, and S280, the control unit 31 controls both the first application mechanism 220A and the second application mechanism 220B together. Furthermore, for example, (L, R) in step S290 indicates that processing is performed on both the ACF section tp3L, which is pressed onto the substrate 3 by the first bonding mechanism 220A, and the ACF section tp3R, which is pressed onto the substrate 3 by the second bonding mechanism 220B.

[0128] First, in step S210, the substrate moving mechanism 210 moves the substrate 3. Specifically, the control unit 31 controls the substrate moving mechanism 210 to place the edges of the substrate 3 onto the adhesive backup stage 224L and the adhesive backup stage 224R.

[0129] Next, in step S220, the first cutting unit 22A performs a first cutting process to form an ACF section tp3L supported by the base layer tp1L by cutting the ACF layer tp2L contained in the tape tpL, which includes a base layer tp1L and an ACF layer tp2L, supplied from the first supply unit 21A, similar to step S120. The second cutting unit 22B performs a second cutting process to form an ACF section tp3R supported by the base layer tp1R by cutting the ACF layer tp2R contained in the tape tpR, which includes a base layer tp1R and an ACF layer tp2R, supplied from the second supply unit 21B. Specifically, the control unit 31 controls the first cutting unit 22A and the second cutting unit 22B to form an ACF section tp3L supported by the base layer tp1L and an ACF section tp3R supported by the base layer tp1R.

[0130] Next, in step S230, the first tape feeding mechanism 23A performs a first tape feeding process (specifically, a first feeding process) to feed the tape tpL containing the ACF section tp3L supported by the base layer tp1L, similar to step S130, thereby positioning the first cutting position within the imaging area (first tape imaging area) of the first tape imaging unit 25A. The second tape feeding mechanism 23B then performs a second tape feeding process (specifically, a third feeding process) to feed the tape tpR containing the ACF section tp3R supported by the base layer tp1R, thereby positioning the position of the second cutting location (also simply called the second cutting position) within the imaging area (second tape imaging area) of the second tape imaging unit 25B (specifically, the camera 230R). Specifically, the control unit 31 controls the first tape feeding mechanism 23A and the second tape feeding mechanism 23B to feed tape tpL so that the first cut position is located within the first tape imaging area of ​​the first tape imaging unit 25A, and to feed tape tpR so that the second cut position is located within the second tape imaging area of ​​the second tape imaging unit 25B.

[0131] Next, in step S240, for example, the control unit 31 and the modification unit 32 inspect the cutting position in the ACF section supported by the substrate layer. Specifically, the control unit 31 causes the first tape imaging unit 25A (specifically, the camera 230L) to image the first cutting position, similar to step S140. The control unit 31 also causes the second tape imaging unit 25B (specifically, the camera 230R) to image the second cutting position. Specifically, the second tape imaging unit 25B performs a second tape imaging process to generate a second tape image by imaging the second cutting location cut by the second cutting process in the ACF layer tp2R supported by the substrate layer tp1R contained in the tape tpR fed by the second tape feeding mechanism 23B. Furthermore, the modification unit 32 acquires first position information based on the first tape image. Specifically, the modification unit 32 acquires first position information relating to the position of the first cutting location in the ACF section tp3L supported by the substrate layer tp1L, based on the first tape image. Furthermore, the modification unit 32 acquires second position information relating to the position of the second cutting location in the ACF section tp3R supported by the substrate layer tp1R, based on the second tape image.

[0132] Next, in steps S250 and S260, the modification unit 32 corrects the predetermined first feed amount and the predetermined second feed amount. Note that at the start of implementation (when the process shown in Figure 9 is started), the first and second deviation amounts for correcting the predetermined first and second feed amounts have not been acquired, so steps S250 and S260 are not executed.

[0133] Next, in step S270, the first tape feeding mechanism 23A, similar to step S150, further performs a first tape feeding process (specifically, a second feeding process) to feed the tape tpL containing the ACF segment tp3L supported by the base layer tp1L by a predetermined first feeding amount, thereby positioning the ACF segment tp3L at the crimping position. Furthermore, the second tape feeding mechanism 23B further performs a second tape feeding process (specifically, a fourth feeding process) to feed the tape tpR containing the ACF segment tp3R supported by the base layer tp1R by a predetermined second feeding amount, thereby positioning the ACF segment tp3R at the crimping position. More specifically, the control unit 31 controls the first tape feeding mechanism 23A and the second tape feeding mechanism 23B to feed tape tpL so that the ACF segment tp3L moves to a position where it is pressed against the substrate 3, and to feed tape tpR so that the ACF segment tp3R moves to a position where it is pressed against the substrate 3.

[0134] Furthermore, if the predetermined first feed amount and the predetermined second feed amount are corrected in steps S250 and S260, the corrected predetermined first feed amount and the corrected predetermined second feed amount are used in step S270.

[0135] In this example, the initial values ​​of the predetermined first feed amount and the predetermined second feed amount are 0. If the predetermined first feed amount and the predetermined second feed amount remain 0 without being changed by steps S250 and S260, that is, if the positions of the ACF intercepts tp3L and tp3R when step S240 is performed are the same as the positions of the ACF intercepts tp3L and tp3R when step S280, which will be described later, is performed, then step S270 may not be performed.

[0136] Next, in step S280, the first crimping unit 24A performs a first crimping process, similar to step S160, to peel the ACF section tp3L from the base layer tp1L and crimp it onto the substrate 3. The second crimping unit 24B performs a second crimping process, to peel the ACF section tp3R from the base layer tp1R and crimp it onto the substrate 3. Specifically, the second crimping unit 24B peels the ACF section tp3R, which is supported by the base layer tp1R contained in the tape tpR fed by the second tape feeding mechanism 23B, from the base layer tp1R and crimps it onto the substrate 3. More specifically, the control unit 31 controls the first and second crimping sections 24A and 24B to peel off the ACF section tp3L supported by the base layer tp1L and press it to a first bonding position on the substrate 3, and peel off the ACF section tp3R supported by the base layer tp1R and press it to a second bonding position on the substrate 3 (see Figure 10). The second bonding position is the position on the substrate 3 where the electrode section 4 is located, and from this position the ACF section tp3R will be bonded.

[0137] Next, in step S290, the control unit 31 causes the substrate imaging unit 26 (specifically, the camera 231) to image the first cutting position, similar to step S170. The control unit 31 also causes the substrate imaging unit 26 to image the second cutting position. Specifically, the substrate imaging unit 26 performs a first substrate imaging process to generate a first substrate image by imaging the first cutting location cut by the first cutting process in the ACF section tp3L attached (i.e., pressed) to the substrate 3, and a second substrate imaging process to generate a second substrate image by imaging the second cutting location cut by the second cutting process in the ACF section tp3R attached (i.e., pressed) to the substrate 3.

[0138] Next, the modification unit 32 acquires the first and second displacement amounts (S300). For example, based on the first substrate image, the modification unit 32 acquires the first displacement amount, which is the displacement of the first cutting location in the ACF section tp3L pressed onto the substrate 3 from a predetermined first reference position. The modification unit 32 also acquires the second displacement amount, which is the displacement of the second cutting location in the ACF section tp3R pressed onto the substrate 3 from a predetermined second reference position, based on the second substrate image.

[0139] Next, the control unit 31 determines whether all of the ACF sections tp3L and ACF sections tp3R have been attached to the substrate 3 (S310).

[0140] The control unit 31 terminates the process when it determines that all of the ACF segments tp3L and ACF segments tp3R have been attached to the substrate 3 (Yes in S310). For example, the control unit 31 controls the moving mechanism 27 to transport the substrate 3 with the ACF segments tp3L and ACF segments tp3R attached downstream, brings in a new substrate 3 from upstream, and executes the process again from step S210.

[0141] On the other hand, if the control unit 31 determines that the attachment of ACF sections tp3L and tp3R to the substrate 3 has not been completed (No in S310), it returns the process to step S210.

[0142] Next, the control unit 31 moves the substrate 3 to the position where new ACF sections tp3L and tp3R will be attached. For example, the substrate 3 is moved so that the third attachment position shown in Figure 10 is located below the attachment head 223L, and the fourth attachment position (see Figure 10) is located below the attachment head 223R. The fourth attachment position is the position on the substrate 3 where the electrode section 4 is located, and from this position the new ACF section tp3R will be attached. For example, if a predetermined second feed amount is changed based on a second substrate image generated by imaging the second cutting location of the ACF section tp3R attached to the second attachment position, the ACF section tp3R attached to the fourth attachment position is an example of a new second ACF section.

[0143] Furthermore, in the next step S250, the modification unit 32 changes a predetermined first feed amount based on the first position information and the first displacement amount acquired in the previous step S300.

[0144] Furthermore, in the next step S260, the modification unit 32 changes a predetermined second feed amount based on the second position information and the second displacement amount acquired in the previous step S300.

[0145] As a result, in the next step S270, the control unit 31 controls the first tape feed mechanism 23A and the second tape feed mechanism 23B to feed tape tpL by a corrected predetermined first feed amount so that the ACF segment tp3L moves to a position where it is pressed against the substrate 3, and to feed tape tpR by a corrected predetermined second feed amount so that the ACF segment tp3R moves to a position where it is pressed against the substrate 3.

[0146] The first and second position information used in the following steps S250 and S260 may be the first and second position information acquired in the previous step S240 (the first step S240), or the first and second position information acquired in the following step S240 (the second step S240).

[0147] Furthermore, the order of processing in each step is just an example and can be rearranged as desired. For example, steps S250 and S260 only need to be executed before step S270 in the processing of the next step S210 and beyond, and may be performed before the next step S210 or after the next step S210.

[0148] Furthermore, steps S250 and S260 may be performed simultaneously, or step S260 may be performed before step S250.

[0149] Furthermore, after step S240 is performed at the start of implementation, step S250 may be performed using only the first position information, or step S260 may be performed using only the second position information.

[0150] Furthermore, step S300 may be performed before the following steps S250 and S260, and may be performed at any time. Also, the acquisition of the first position information, the acquisition of the second position information, the acquisition of the first displacement amount, and the acquisition of the second displacement amount may be performed at the same time or at different times.

[0151] Figure 10 is a diagram illustrating the specific processing procedure of the substrate imaging step in the ACF application apparatus 10 according to the embodiment. Specifically, Figure 10 is a diagram illustrating specific examples of steps S290 and S300.

[0152] For example, the control unit 31 first controls the moving mechanism 27 to move the substrate 3 so that the first cutting point (first cutting position) in the ACF section tp3L is located within the substrate imaging area of ​​the substrate imaging unit 26 (specifically, the camera 231), as shown in Figure 10(a).

[0153] Next, the control unit 31 causes the substrate imaging unit 26 to capture an image, thereby causing the substrate imaging unit 26 to generate a first substrate image. For example, the figure shown within the substrate imaging area in Figure 10(a) is a specific example of the first substrate image.

[0154] Next, the control unit 31 controls the moving mechanism 27 to move the substrate 3 so that the second cutting point (second cutting position) in the ACF section tp3R is located within the substrate imaging area of ​​the substrate imaging unit 26, as shown in Figure 10(b).

[0155] Next, the control unit 31 causes the substrate imaging unit 26 to capture an image, thereby causing the substrate imaging unit 26 to generate a second substrate image. For example, the figure shown within the substrate imaging area in Figure 10(b) is a specific example of the second substrate image.

[0156] For example, the modification unit 32 calculates the amount of deviation (second deviation) of the second cutting position in the X2 axis direction (the same direction as the X axis direction in Figure 10) from the reference position (second reference position) in the second substrate image.

[0157] For example, a second reference position is predetermined by a reference line (second reference line) at the center of the X2 axis direction in the second substrate image. Also, for example, the modification unit 32 calculates a second cutting line, which is a virtual line indicating the position of the second cutting location (second cutting position). For example, the modification unit 32 calculates the cutting line as the straight line obtained when the shape of the second cutting location in the second substrate image is approximated by a straight line. In this example, the second cutting location is the edge located on the negative side of the X2 axis in the ACF intercept tp3R. The second cutting line is, for example, a virtual line obtained when the second cutting location (the edge located on the negative side of the X axis in the ACF intercept tp3R shown in Figure 10) is approximated by a straight line.

[0158] For example, the modification unit 32 calculates the amount of deviation in the distance in the X2 axis direction between the second reference line and the second cutting line as the second deviation amount.

[0159] Furthermore, the first substrate imaging process (the process shown in Figure 10(a)) and the second substrate imaging process (the process shown in Figure 10(b)) may be performed in any order. Also, if the substrate imaging unit 26 includes a camera that images the first cutting location in the ACF section tp3L pressed onto the substrate 3 and a camera that images the second cutting location in the ACF section tp3R pressed onto the substrate 3, the first substrate imaging process and the second substrate imaging process may be performed simultaneously. Also, if the substrate imaging unit 26 includes a camera capable of imaging both the ACF section tp3L and the ACF section tp3R pressed onto the substrate 3, the first substrate imaging process and the second substrate imaging process may be performed simultaneously, and the first substrate image and the second substrate image may be realized as a single image.

[0160] (Effects, etc.) The following describes examples of technologies that can be obtained from the disclosures in this specification, and explains the effects that can be obtained from these examples.

[0161] Technology 1 includes: (i) a first supply unit 21A for supplying a first tape including a first substrate layer and a first ACF layer; (ii) a first cutting unit 22A for performing a first cutting process to form a first ACF section supported by the first substrate layer by cutting the first ACF layer contained in the first tape supplied from the first supply unit 21A; (iii) a first tape imaging unit 25A for performing a first tape imaging process to generate a first tape image by imaging the first cutting location cut by the first cutting process in the first ACF layer supported by the first substrate layer; and (iv) a first pressing process for peeling the first ACF section from the first substrate layer and pressing it onto the substrate 3. The ACF bonding apparatus 10 comprises: a first bonding section 24A; (v) a first tape feeding mechanism 220A having a first feeding process that feeds the first tape from a first position where a first cutting process is performed to a second position where a first tape imaging process is performed, and a second feeding process that feeds the tape by a predetermined first feeding amount from the second position to a third position where a first bonding process is performed; a substrate imaging section 26 that generates a first substrate image by imaging the first cutting location in the first ACF section pressed onto the substrate 3; and a modification section 32 that changes a predetermined first feeding amount based on the first tape image and the first substrate image.

[0162] The first substrate layer is, for example, substrate layer tp1L. The first ACF layer is, for example, ACF layer tp2L. The first tape is, for example, tape tpL. The first ACF section is, for example, ACF section tp3L.

[0163] According to this, the tape feed rate is changed based on the actual position of the ACF segment attached to the substrate 3. Therefore, the accuracy of the ACF segment attachment position is improved.

[0164] Technology 2 is an ACF bonding apparatus 10 as described in Technology 1, wherein the modification unit 32 acquires first position information relating to the position of a first cutting location in a first ACF section supported on a first substrate layer based on a first tape image, acquires a first displacement amount from a predetermined first reference position of the first cutting location in the first ACF section pressed onto the substrate 3 based on a first substrate image, and changes a predetermined first feed amount based on the first position information and the first displacement amount.

[0165] According to this, the tape feed rate can be changed based on the actual position of the ACF section attached to the substrate 3.

[0166] Technology 3 is an ACF bonding apparatus 10 as described in Technology 1 or 2, wherein the modification unit 32 changes a predetermined first feed amount before the first bonding mechanism 220A presses a new first ACF slice onto the substrate 3.

[0167] For example, if a predetermined first feed amount is changed based on a first substrate image generated by imaging the first cutting location in the ACF section tp3L attached to the first attachment position described above, the new first ACF section is, for example, an ACF section tp3L attached to the third attachment position described above.

[0168] According to this, even when ACF sections are repeatedly attached to the substrate 3, the accuracy of the attachment position of newly attached ACF sections can be improved.

[0169] Technology 4 is the ACF bonding apparatus 10 described in Technology 1, further comprising: (vi) a second supply unit 21B for supplying a second tape including a second substrate layer and a second ACF layer; (vii) a second cutting unit 22B for performing a second cutting process to form a second ACF section supported on the second substrate layer by cutting the second ACF layer contained in the second tape supplied from the second supply unit 21B; (viii) a second tape imaging unit 25B for performing a second tape imaging process to generate a second tape image by imaging the second cutting location cut by the second cutting process in the second ACF layer supported on the second substrate layer; (ix) a second pressing unit 24B for performing a second pressing process to peel the second ACF section from the second substrate layer and press it onto the substrate 3; and (x) a second tape, The system includes a second adhesive mechanism 220B having a second tape feeding mechanism 23B that performs a third feeding process that feeds the tape from a fourth position where cutting is performed towards a fifth position where second tape imaging is performed, and a fourth feeding process that feeds the tape by a predetermined second feed amount from the fifth position towards a sixth position where second crimping is performed, and a control unit 31 that controls the first adhesive mechanism 220A and the second adhesive mechanism 220B. The substrate imaging unit 26 further generates a second substrate image by imaging the second cutting location in the second ACF section crimped to the substrate 3, the modification unit 32 further changes a predetermined second feed amount based on the second tape image and the second substrate image, and the control unit 31 causes the first adhesive mechanism 220A and the second adhesive mechanism 220B to perform the first crimping process and the second crimping process together.

[0170] The second substrate layer is, for example, substrate layer tp1R. The second ACF layer is, for example, ACF layer tp2R. The second tape is, for example, tape tpR. The second ACF section is, for example, ACF section tp3R.

[0171] According to this method, when attaching ACF segments to multiple locations on the substrate 3 using multiple crimping sections, the tape feed amount of each of the multiple crimping mechanisms can be changed based on the actual position of each of the multiple ACF segments attached to the substrate 3, and multiple ACF segments can be attached simultaneously. Therefore, multiple ACF segments can be quickly and appropriately crimped onto the substrate 3. Consequently, productivity can be improved.

[0172] Technology 5 is an ACF bonding apparatus 10 as described in Technology 4, wherein the modification unit 32 acquires first position information relating to the position of a first cutting location in a first ACF section supported on a first substrate layer based on a first tape image, acquires a first displacement amount from a predetermined first reference position of the first cutting location in a first ACF section pressed onto a substrate 3 based on a first substrate image, changes a predetermined first feed amount based on the first position information and the first displacement amount, acquires second position information relating to the position of a second cutting location in a second ACF section supported on a second substrate layer based on a second tape image, acquires a second displacement amount from a predetermined second reference position of the second cutting location in a second ACF section pressed onto a substrate 3 based on a second substrate image, and changes a predetermined second feed amount based on the second position information and the second displacement amount.

[0173] According to this, the tape feed amount of each of the multiple adhesive mechanisms can be changed based on the actual position of each of the multiple ACF sections attached to the substrate 3.

[0174] Technology 6 is an ACF bonding apparatus 10 as described in Technology 4 or 5, wherein the modification unit 32 modifies a predetermined first feed amount and a predetermined second feed amount before the first bonding mechanism 220A presses a new first ACF slice onto the substrate 3 and before the second bonding mechanism presses a new second ACF slice onto the substrate 3.

[0175] According to this, even when ACF sections are repeatedly attached to the substrate 3 in each of the multiple attachment mechanisms, the accuracy of the attachment position of the newly attached ACF sections can be improved for each of the multiple attachment mechanisms.

[0176] Technology 7 performs a first cutting process (S120) to form a first ACF section supported by the first substrate layer by cutting the first ACF layer contained in the first tape which includes the first substrate layer and the first ACF layer, then performs a first tape imaging process (S140) to generate a first tape image by imaging the first cutting location cut by the first cutting process in the first ACF layer supported by the first substrate layer, and then performs a first pressing process (S160) to peel the first ACF section from the first substrate layer and press it onto the substrate 3, thereby forming the first tape This ACF bonding method involves performing a first feeding process (S130) to feed the ACF from a first position where a first cutting process is performed towards a second position where a first tape imaging process is performed, and a second feeding process (S150) to feed the ACF from the second position towards a third position where a first crimping process is performed by a predetermined first feeding amount. A first substrate image is generated by imaging the first cutting location in the first ACF section crimped onto the substrate 3 (S170), and a predetermined first feeding amount is changed based on the first tape image and the first substrate image (S200).

[0177] According to this, it will have the same effect as the ACF application device 10 related to Technology 1.

[0178] (Other embodiments) Although the ACF application device and the like according to this embodiment have been described above based on the above embodiment, the present invention is not limited to the above embodiment.

[0179] For example, in the above embodiment, the ACF adhesive device 10 is equipped with two adhesive mechanisms. The ACF adhesive device 10 may be equipped with one adhesive mechanism, or it may be equipped with three or more adhesive mechanisms. For example, if the ACF adhesive device 10 is equipped with three or more adhesive mechanisms, the predetermined feed amount is changed for each of the three or more adhesive mechanisms to allow the ACF slices to be attached all at once.

[0180] Furthermore, for example, the processing steps in the above embodiment do not necessarily have to be processed chronologically in the order described in the flowchart, and may include processes that are executed in parallel or individually.

[0181] Furthermore, for example, all or part of the components of the processing unit, such as the control unit and modification unit, of the ACF pasting device may be configured with dedicated hardware, or they may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit, such as a CPU or processor, reading and executing a software program recorded on a recording medium such as an HDD or semiconductor memory.

[0182] Furthermore, the components of the processing unit of the ACF application device may consist of one or more electronic circuits. Each of these one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

[0183] One or more electronic circuits may include, for example, semiconductor devices, ICs, or LSIs (Large Scale Integrations). ICs or LSIs may be integrated on a single chip or on multiple chips. While referred to here as ICs or LSIs, the terminology may vary depending on the degree of integration; they might also be called system LSIs, VLSIs (Very Large Scale Integrations), or ULSIs (Ultra Large Scale Integrations). Field Programmable Gate Arrays (FPGAs), which are programmed after the LSI is manufactured, can also be used for the same purpose.

[0184] Furthermore, the present invention can be implemented not only as an ACF pasting device, but also as a program that includes the processing performed by each component of the ACF pasting device as steps, and as a recording medium such as a computer-readable DVD (Digital Versatile Disc) on which the program is recorded. In other words, the comprehensive or specific embodiments described above may be implemented as a system, device, integrated circuit, computer program, or computer-readable non-temporary recording medium, or as any combination of a system, device, integrated circuit, computer program, and recording medium.

[0185] Furthermore, the present invention also includes forms obtained by applying various modifications to each embodiment that a person skilled in the art could conceive, as well as forms realized by arbitrarily combining the components and functions of each embodiment without departing from the spirit of the present invention. [Industrial applicability]

[0186] This invention can be used in an ACF bonding apparatus for bonding ACF to a substrate. [Explanation of symbols]

[0187] 3 circuit boards 4 Electrode part 10 ACF application device 20 ACF adhesive mechanism 21A 1st supply section 21B 2nd supply section 22A 1st cutting section 22B 2nd cutting section 23A First Tape Feed Mechanism 23B Second tape feed mechanism 24A First crimping section 24B Second crimping section 25A First Tape Imaging Unit 25B Second Tape Imaging Unit 26 Substrate imaging unit 27 Moving mechanism 30 Control device 31 Control Unit 32 Changes 33 Storage section 210 Substrate moving mechanism 211 X-axis table 212 Y-axis table 213 Z-axis table 214 stages 220A 1st attachment mechanism 220B 2nd attachment mechanism 220L, 220R Adhesion Mechanism Unit 221L, 221R Tape Supply Reels 222L, 222R Tape Retrieval Unit 223L, 223R adhesive head 224L, 224R Adhesive Backup Stage 225L, 225R Tape Cutting Unit 225aL, 225aR backing plate 225bL, 225bR cutter 228 X-axis rail mechanism 229 Adhesive base 230L, 230R, 231 Camera 232L, 232R feed rollers 233L, 233R Pressing roller 234L, 234R Guide Rollers tpL, tpR tape tp1L, tp1R base material layer tp2L, tp2R ACF layer tp3L, tp3R ACF section

Claims

1. A first supply unit for supplying a first tape including a first substrate layer and a first ACF (Anisotropic Conductive Film) layer, A first cutting unit performs a first cutting process to form a first ACF section supported by a first substrate layer by cutting the first ACF layer contained in the first tape supplied from the first supply unit, A first tape imaging unit performs a first tape imaging process to generate a first tape image by imaging the first cut location cut by the first cutting process in the first ACF layer supported on the first substrate layer, A first pressing unit that performs a first pressing process to peel the first ACF section from the first substrate layer and press it onto the substrate, A first adhesive mechanism having a first tape feeding mechanism that performs a first feeding process to feed the first tape from a first position where the first cutting process is performed toward a second position where the first tape imaging process is performed, and a second feeding process to feed the tape by a predetermined first feed amount toward a third position where the first crimping process is performed, A substrate imaging unit generates a first substrate image by imaging the first cutting location in the first ACF section pressed onto the substrate, The system includes a modification unit that modifies the predetermined first feed amount based on the first tape image and the first substrate image, ACF application device.

2. The aforementioned modified part is, Based on the first tape image, first position information relating to the position of the first cutting location in the first ACF section supported by the first substrate layer is obtained. Based on the first substrate image, the first displacement amount from a predetermined first reference position of the first cutting location in the first ACF section pressed onto the substrate is obtained. Based on the first position information and the first displacement amount, the predetermined first feed amount is changed. The ACF application device according to claim 1.

3. The modified part changes the predetermined first feed amount before the first bonding mechanism presses a new first ACF section onto the substrate. The ACF application device according to claim 1.

4. moreover, A second supply unit for supplying a second tape including a second base material layer and a second ACF layer, A second cutting unit performs a second cutting process to form a second ACF slice supported by the second substrate layer by cutting the second ACF layer contained in the second tape supplied from the second supply unit, A second tape imaging unit performs a second tape imaging process to generate a second tape image by imaging the second cut location in the second ACF layer supported on the second substrate layer that has been cut by the second cutting process, A second pressing unit that performs a second pressing process to peel the second ACF section from the second substrate layer and press it onto the substrate, A second adhesive mechanism having a second tape feeding mechanism that performs a third feeding process to feed the second tape from a fourth position where the second cutting process is performed toward a fifth position where the second tape imaging process is performed, and a fourth feeding process to feed the tape by a predetermined second feeding amount toward a sixth position where the second crimping process is performed. The system comprises a control unit that controls the first adhesive mechanism and the second adhesive mechanism, The substrate imaging unit further generates a second substrate image by imaging the second cutting location in the second ACF section pressed onto the substrate. The modification unit further modifies the predetermined second feed amount based on the second tape image and the second substrate image. The control unit causes the first bonding mechanism and the second bonding mechanism to perform the first crimping process and the second crimping process together. The ACF application device according to claim 1.

5. The aforementioned modified part is, Based on the first tape image, first position information relating to the position of the first cutting location in the first ACF section supported by the first substrate layer is obtained. Based on the first substrate image, the first displacement amount from a predetermined first reference position of the first cutting location in the first ACF section pressed onto the substrate is obtained. Based on the first position information and the first displacement amount, the predetermined first feed amount is changed. Based on the second tape image, second positional information is obtained regarding the position of the second cutting location in the second ACF section supported by the second substrate layer. Based on the second substrate image, the second displacement amount from a predetermined second reference position of the second cutting location in the second ACF section pressed onto the substrate is obtained. Based on the second position information and the second displacement amount, the predetermined second feed amount is changed. The ACF application device according to claim 4.

6. The modification portion modifies the predetermined first feed amount and the predetermined second feed amount before the first bonding mechanism presses a new first ACF section onto the substrate and before the second bonding mechanism presses a new second ACF section onto the substrate. The ACF application device according to claim 4.

7. A first cutting process is performed to form a first ACF slice supported by the first substrate layer by cutting the first ACF layer contained in a first tape which includes a first substrate layer and a first ACF (Anisotropic Conductive Film) layer. A first tape imaging process is performed to generate a first tape image by imaging the first cut location in the first ACF layer supported by the first substrate layer that has been cut by the first cutting process. A first pressing process is performed to peel the first ACF section from the first substrate layer and press it onto the substrate. The first tape is fed from a first position where the first cutting process is performed towards a second position where the first tape imaging process is performed, and the first tape is fed from the second position towards a third position where the first crimping process is performed by a predetermined first feed amount. A first substrate image is generated by imaging the first cutting location in the first ACF section pressed onto the substrate. Based on the first tape image and the first substrate image, the predetermined first feed amount is changed. ACF application method.

Images