ACF application device and ACF application method

Abstract

The present invention provides an ACF (Acoustic Fiber) application device that can appropriately control the amount of tape fed by the tape feeding mechanism. [Solution] The ACF bonding apparatus 10 includes a cutting unit 22 that performs a cutting process to form ACF slices supported on a base layer, a pressing unit 24 that performs a pressing process to peel the ACF slices from the base layer and press them onto a substrate, an imaging unit 25 that performs an imaging process to generate an image by imaging the cut locations in the ACF layer supported on the base layer that have been cut by the cutting process before the pressing process is performed, a tape feeding mechanism 23 that feeds the tape containing the ACF slices supported on the base layer from a first position where the cutting process is performed to a second position where the imaging process is performed by a predetermined feed amount set based on distance information relating to the distance between the cutting unit 22 and the imaging unit 25, and an update unit 32 that updates the distance information based on the amount of deviation of the cut locations in the image from a predetermined position.

Description

Technical Field

[0001] The present invention relates to an ACF pasting device and an ACF pasting method for pasting an ACF (Anisotropic Conductive Film) on a substrate.

Background Art

[0002] Conventionally, there is a device for pasting an ACF as an adhesive member for adhering components to a substrate (see, for example, Patent Document 1). The device conveys the ACF by a tape conveyance unit, for example, and pastes the ACF on the substrate by a pressing tool provided in a pasting head.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The pasting of the ACF on the substrate is performed by forming ACF segments by cutting (half-cutting) the ACF supported by a base material at a predetermined interval, and pasting the ACF segments on the substrate by a pasting head. Here, the ACF is moved from the position where it is cut to the position where it is pasted on the substrate by a tape feeding mechanism, which is a mechanism for feeding the ACF like the above-described tape conveyance unit. In order for the ACF segments to be pasted at appropriate positions on the substrate, it is necessary for the ACF to be moved by an appropriate distance after being cut. In other words, the tape feeding mechanism needs to feed the tape with an appropriate feeding amount.

[0005] The present invention provides an ACF pasting device capable of appropriately controlling the feeding amount of a tape by a tape feeding mechanism, etc.

Means for Solving the Problems

[0006] An ACF bonding apparatus according to one aspect of the present invention includes: a supply unit for supplying a tape containing a base layer and an ACF (Anisotropic Conductive Film) layer; a cutting unit for performing a cutting process to form an ACF section supported on the base layer by cutting the ACF layer contained in the tape supplied from the supply unit; a pressing unit for performing a pressing process to peel the ACF section from the base layer and press it onto a substrate; an imaging unit for performing an imaging process to generate an image by imaging the cut portion of the ACF layer supported on the base layer that has been cut by the cutting process, before the pressing process is performed; a tape feeding mechanism for performing a tape feeding process to feed the tape containing the ACF section supported on the base layer from a first position where the cutting process is performed to a second position where the imaging process is performed by a predetermined feed amount set based on distance information relating to the distance between the cutting unit and the imaging unit; and an update unit for updating the distance information based on the amount of deviation of the cut portion from a predetermined position in the imaged image.

[0007] Furthermore, in one aspect of the present invention, an ACF application method is provided in which a cutting unit performs a cutting process to form an ACF section supported on the base layer by cutting the ACF layer contained in the tape supplied from a supply unit for supplying a tape containing a base layer and an ACF (Anisotropic Conductive Film) layer; a pressing unit performs a pressing process to peel the ACF section from the base layer and press it onto the substrate; an imaging unit performs an imaging process to generate an image by imaging the cut portion of the ACF layer supported on the base layer that has been cut by the cutting process before the pressing process is performed; a tape feeding mechanism performs a tape feeding process to feed the tape containing the ACF section supported on the base layer by a predetermined feed amount set based on distance information relating to the distance between the cutting unit and the imaging unit, from a first position where the cutting process is performed to a second position where the imaging process is performed; and an update unit updates the distance information based on the amount of deviation of the cut portion from a predetermined position in the imaged image. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide an ACF application device that can appropriately control the amount of tape fed by the tape feeding mechanism. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 shows the configuration of an ACF application device according to an embodiment. [Figure 2] Figure 2 is a front view showing the ACF attachment mechanism according to an embodiment. [Figure 3] Figure 3 is a side view showing the ACF attachment mechanism according to an embodiment. [Figure 4] Figure 4 is a top view showing the ACF attachment mechanism according to an embodiment. [Figure 5] Figure 5 is a flowchart showing the processing procedure of the ACF application device according to the embodiment. [Figure 6] Figure 6 is a diagram illustrating the specific processing steps of the pasting process and the imaging process in the ACF pasting apparatus according to the embodiment. [Figure 7] Figure 7 shows an image captured according to the embodiment. [Figure 8] Figure 8 is a flowchart showing a modified example of the processing procedure of the ACF application apparatus according to the embodiment. [Modes for carrying out the invention]

[0010] The embodiments of the present invention will be described in detail below with reference to the drawings. Note that the embodiments described below are all specific examples of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement and connection configurations of components, steps, and the order of steps shown in the following embodiments are examples only and are not intended to limit the present invention. Accordingly, components in the following embodiments that are not described in an independent claim will be described as optional components.

[0011] Furthermore, each figure is a schematic diagram and not necessarily a strictly accurate representation. Also, the same component is denoted by the same reference numeral in each figure.

[0012] Furthermore, in the following embodiments, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional Cartesian coordinate system. The vertical direction is referred to as the Z-axis direction or up-down direction, one direction on a plane perpendicular to the vertical direction is referred to as the Y-axis direction or depth direction, and the direction perpendicular to the Y-axis direction on that perpendicular plane is referred to as the X-axis direction, left-right direction, or lateral direction. Furthermore, in the following embodiments, the positive side of the Z-axis direction is upward or up, and the negative side of the Z-axis direction is downward or down. Furthermore, in the following embodiments, the positive side of the Y-axis direction is the back side or back, and the negative side of the Y-axis direction is the front side or front. Furthermore, in the following embodiments, the positive side of the X-axis direction is the right side or right, and the negative side of the X-axis direction is the left side or left.

[0013] Furthermore, in the following embodiments, the coordinates in the captured image are shown in a three-axis Cartesian coordinate system of the X1 axis, Y1 axis, and Z1 axis. For example, the X1 axis corresponds to the X axis, the Y1 axis corresponds to the Y axis, and the Z1 axis corresponds to the Z axis. Also, the positive and negative sides of the X1 axis, Y1 axis, and Z1 axis correspond to the positive and negative sides of the X axis, Y axis, and Z axis, respectively.

[0014] Furthermore, in the following embodiments, the terms "up" and "down" do not refer to the upward (vertically upward) and downward (vertically downward) directions in absolute spatial perception, but rather are used as terms defined by relative positional relationships.

[0015] Furthermore, the numerical values ​​in the following embodiments are merely examples, and other values ​​may be used.

[0016] Furthermore, in this specification, ordinal numbers such as "first" and "second" do not refer to the number or order of components unless otherwise specified, but are used to avoid confusion and to distinguish similar components.

[0017] In the following embodiments, for example, when described in comparison with a threshold value or more and less than the threshold value, it means being distinguished based on the threshold value, and may respectively mean greater than the threshold value and less than or equal to the threshold value.

[0018] (Embodiment) [Configuration] First, the configuration of the ACF pasting device according to the embodiment will be described.

[0019] FIG. 1 is a diagram showing the configuration of an ACF pasting device 10 according to the embodiment. FIGS. 2 to 4 are diagrams showing the specific configuration of the ACF pasting mechanism 20 according to the embodiment. Specifically, FIG. 2 is a front view showing the ACF pasting mechanism 20 according to the embodiment. FIG. 3 is a side view showing the ACF pasting mechanism 20 according to the embodiment. FIG. 4 is a top view showing the ACF pasting mechanism 20 according to the embodiment. Note that in FIG. 4, a part of the ACF pasting mechanism 20 is shown.

[0020] The ACF pasting device 10 is a device for pasting an ACF (more specifically, an ACF section tp3 peeled from the tape tp (see FIG. 6)) for adhering components to the substrate 3. Specifically, the ACF pasting device 10 pastes a section (ACF section tp3) of the ACF layer tp2 (see FIG. 6) included in the tape tp onto the substrate 3 placed on the stage 214 by the pasting head 223.

[0021] The ACF bonding apparatus 10 is part of a component mounting system for producing, for example, display panels. In this component mounting system, for example, the ACF bonding apparatus 10 attaches ACF slices tp3 to electrode portions 4 provided on a substrate 3, and a component crimping device (not shown) heat-presses the substrate 3 and the component via the ACF slices tp3. The ACF bonding apparatus 10 attaches ACF slices tp3 to a substrate 3 that has been transported from an upstream device by a transport unit that transports the substrate 3. The substrate 3 with the ACF slices tp3 attached is then transported by the transport unit to a component crimping device located downstream of the ACF bonding apparatus 10.

[0022] The tape tp includes a base layer tp1 (see Figure 6) and an ACF layer tp2. The base layer tp1 is a separator for supporting the ACF layer tp2. The base layer tp1 is a tape-shaped film made of, for example, a resin such as polyethylene terephthalate. The ACF layer tp2 is a tape-shaped layer made of ACF. The ACF section tp3 is a section formed by cutting the ACF layer tp2.

[0023] The ACF bonding apparatus 10 forms an ACF section tp3 by cutting (half-cutting) the ACF layer tp2 to a predetermined size so that it remains held in place by the base layer tp1 by the cutting unit 22. Furthermore, the ACF bonding apparatus 10 peels the ACF section tp3 from the base layer tp1 by moving the base layer tp1 while holding it between two peeling pins. Finally, the ACF bonding apparatus 10 adjusts the position of the substrate 3 placed on the stage 214 and uses the bonding head 223 to bond the ACF section tp3, which has been cut to a predetermined size, to the substrate 3.

[0024] An example of substrate 3 is a flexible film-like substrate formed from resin or the like. However, substrate 3 may also be a rigid substrate such as a glass substrate.

[0025] Examples of components that can be attached to the substrate 3 via the ACF section tp3 include electronic components such as ICs (Integrated Circuits), TCPs (Tape Carrier Packages), and FPCs (Flexible Printed Circuits).

[0026] The ACF application device 10 comprises an ACF application mechanism 20 and a control device 30.

[0027] The ACF attachment mechanism 20 is a mechanism that attaches ACF sections tp3 to substrates 3 brought in from upstream and then transports them downstream.

[0028] The ACF application mechanism 20 includes a supply unit 21, a cutting unit 22, a tape feeding mechanism 23, a crimping unit 24, and an imaging unit 25.

[0029] The supply unit 21 is a mechanism for supplying tape tp, which includes a base layer tp1 and an ACF layer tp2. For example, the supply unit 21 includes a tape supply reel 221.

[0030] The tape supply reel 221 is a reel that holds the tape tp. Specifically, the tape supply reel 221 is a reel around which the tape tp is wound. The tape tp is unwound from the tape supply reel 221 by the driving of one or more rollers. For example, the tape tp held on the tape supply reel 221 is fed to a predetermined position by the tape feeding mechanism 23. In this way, for example, the supply unit 21 supplies the tape tp in cooperation with the tape feeding mechanism 23.

[0031] The cutting unit 22 is a mechanism that performs a cutting process to form an ACF section tp3 supported by the base layer tp1 by cutting the ACF layer tp2 contained in the tape tp supplied from the supply unit 21. For example, the cutting unit 22 includes a tape cutting unit 225.

[0032] The tape cutting unit 225 is a mechanism for cutting the ACF layer tp2 contained in the tape tp. For example, the tape cutting unit 225 comprises a backing plate 225a and a cutter 225b. For example, the tape cutting unit 225 cuts the ACF layer tp2 of the tape tp unwound from the tape supply reel 221 by moving the cutter 225b in the vertical direction. In other words, the tape cutting unit 225 performs a half-cut on the tape tp. This cut forms an ACF segment tp3. Specifically, the cutter 225b cuts the ACF layer tp2 in the tape tp by a drive mechanism having a guide and motor (not shown) driven by the control device 30. More specifically, the cutter 225b, by rising, sandwiches the tape tp between itself and the backing plate 225a and cuts through the ACF layer tp2 of the tape tp. When the substrate 3 is supported by the adhesive backup stage 224, the peripheral edge of the substrate 3 is positioned between the adhesive head 223, the backing plate 225a, the tape tp, and the adhesive backup stage 224.

[0033] The tape feeding mechanism 23 is a mechanism that feeds the tape tp held in the supply unit 21. Specifically, the tape feeding mechanism 23 performs a tape feeding process to feed the tape tp, which includes the ACF section tp3 supported by the base layer tp1. Specifically, the tape feeding mechanism 23 performs a tape feeding process to feed the tape tp, which includes the ACF section tp3 supported by the base layer tp1, by a predetermined feed amount (a predetermined tape tp length) set based on distance information relating to the distance between the cutting unit 22 and the imaging unit 25, from the first position where the cutting process is performed to the second position where the imaging process is performed. For example, when the tape feeding mechanism 23 performs the tape feeding process, tape is supplied from the supply unit 21.

[0034] The distance information is information relating to the distance between the cutting unit 22 and the imaging unit 25. The distance information (specifically, the initial value of the distance information) indicates, for example, the distance between the position of the cutter 225b of the cutting unit 22 when the cutter 225b cuts the ACF layer tp2 and the position of the imaging center on the tape tp when the imaging unit 25 images the cutting position, but is not particularly limited and can be determined arbitrarily. For example, the position of the backing plate 225a of the cutting unit 22 may be used to calculate the initial value of the distance information, or the position of the camera 230 of the imaging unit 25 may be used.

[0035] The tape feeding mechanism 23 includes, for example, a feed roller 232, a press roller 233, a guide roller 234, and a tape retrieval section 222.

[0036] The feed roller 232 is a roller for feeding the tape tp. For example, the feed roller 232 comprises a roller and a motor that rotates the roller. The motor is, for example, a servo motor, but any type of roller may be used.

[0037] The retaining roller 233 is a roller for feeding the tape tp. In this embodiment, the tape tp is supported by being sandwiched between the feed roller 232 and the retaining roller 233, and the tape tp is fed in a predetermined direction by the rotation of the feed roller 232. The feed roller 232 and the retaining roller 233 are, for example, pinch rollers. Thus, for example, the tape feeding mechanism 23 is equipped with rollers for feeding the tape tp by rotating in contact with the tape tp.

[0038] The guide roller 234 is a roller that restricts the movement of the tape tp. Specifically, the guide roller 234 restricts the movement of the tape tp in the width direction (in this embodiment, the Y-axis direction).

[0039] The tape retrieval unit 222 is a mechanism for retrieving the tape tp. For example, the tape retrieval unit 222 has a suction mechanism for sucking up the tape tp, and retrieves the tape tp by sucking it up. Specifically, the tape retrieval unit 222 retrieves the base material layer tp1 that remains after the ACF layer tp2 has been attached to the substrate 3. The tape retrieval unit 222 may also be a mechanism that is rotated by a motor (not shown) to wind up the tape tp.

[0040] The crimping unit 24 is a mechanism that performs a crimping process to peel the ACF section tp3 from the base layer tp1 and crimp it onto the substrate 3. Specifically, the crimping unit 24 peels the ACF section tp3, which is supported by the base layer tp1 contained in the tape tp fed by the tape feeding mechanism 23, from the base layer tp1 and crimps it onto the substrate 3. For example, the crimping unit 24 includes a bonding head 223 and a bonding backup stage 224.

[0041] The adhesion head 223 is a head that peels the ACF section tp3 from the base layer tp1 and presses it onto the substrate 3. Below the adhesion head 223 is an adhesion backup stage 224. For example, the adhesion head 223 moves up and down, driven by a control device 30, through a drive mechanism having a guide and motor (not shown), thereby pressing the ACF section tp3 onto the substrate 3.

[0042] The adhesion backup stage 224 is a backup stage that supports the edge (in other words, the peripheral edge) of the substrate 3 from below. The substrate 3 is carried from upstream to the ACF attachment mechanism 20 by the substrate moving mechanism 210, and its edge is placed on the adhesion backup stage 224. Subsequently, the ACF section tp3 is attached to the substrate 3 by the attachment head 223. The substrate moving mechanism 210 moves the substrate 3 with the ACF section tp3 attached downstream.

[0043] The substrate moving mechanism 210 is a mechanism for moving the substrate 3. The substrate moving mechanism 210 comprises an X-axis table 211, a Y-axis table 212, a Z-axis table 213, and a stage 214.

[0044] The X-axis table 211 is a mechanism for moving the stage 214 in the X-axis direction. The Y-axis table 212 is a mechanism for moving the stage 214 in the Y-axis direction. The Z-axis table 213 is a mechanism for moving the stage 214 in the Z-axis direction. The X-axis table 211, Y-axis table 212, and Z-axis table 213 are equipped with drive mechanisms such as guides and motors for moving the stage 214, and the stage 214 can be moved arbitrarily in these three axes by the control of these drive mechanisms by the control device 30.

[0045] Stage 214 is the stage on which the substrate 3 is placed. The substrate 3 is placed such that its edges protrude from the stage 214 when viewed from above. These edges are supported from below by the attachment backup stage 224 when the ACF section tp3 is attached to the substrate 3.

[0046] The X-axis table 211 is, for example, rail-shaped and is positioned along the X-axis direction on the adhesive base 229. The Y-axis table 212 is, for example, rail-shaped and is positioned on the X-axis table 211 parallel to the Y-axis direction and moves freely in the X-axis direction. The Z-axis table 213 is positioned on the Y-axis table 212 and moves freely in the Y-axis direction, raising and lowering the stage 214 provided on top of it in the Z-axis direction and rotating it around the Z-axis.

[0047] The substrate 3 is placed on the stage 214 and held in place by suction. This substrate moving mechanism 210 moves the substrate 3, which is held in place by suction on the stage 214, in the X, Y, and Z directions, and further rotates the substrate 3 around the Z axis.

[0048] For example, the substrate moving mechanism 210 rotates and moves the substrate 3 such that the peripheral edge of the substrate 3, which is held by suction on its stage 214, is placed on the adhesive backup stage 224 and supported from below by the adhesive backup stage 224.

[0049] As the adhesive head 223 descends, it presses the tape tp, which is passed between it and the adhesive backup stage 224, against the peripheral edge of the substrate 3 supported by the adhesive backup stage 224. In other words, the adhesive head 223 presses the tape tp against the peripheral edge of the substrate 3 and the adhesive backup stage 224. At this time, ACF sections tp3 are formed on the underside of the base material layer tp1 of the tape tp being pressed. In addition, multiple electrode portions 4 are formed on the peripheral edge of the substrate 3. Therefore, the ACF sections tp3 are pressed against and adhered to the electrode portions 4 of the substrate 3 and peeled off from the base material layer tp1. The base material layer tp1 from which the ACF sections tp3 have been peeled off is collected by the tape recovery unit 222.

[0050] The imaging unit 25 is a camera that performs imaging processing to generate an image by imaging the cut portions of the ACF layer tp2, which is supported by the base layer tp1, before the crimping process is performed by the crimping unit 24. Specifically, the imaging unit 25 generates an image by imaging the cut portions of the ACF layer tp2, which is supported by the base layer tp1 and contained in the tape tp fed by the tape feeding mechanism 23, which is cut by the cutting process. For example, the imaging unit 25 includes a camera 230 and a camera 231.

[0051] Camera 230 is a camera that generates an image by capturing the cut portion of the ACF layer tp2, which is supported by the substrate layer tp1 contained in the tape tp fed by the tape feeding mechanism 23, that has been cut by the cutting process. After the ACF layer tp2 is cut by the cutting unit 22, the tape tp is fed by the tape feeding mechanism 23 from the position where the ACF layer tp2 is cut (first position) to the position where the cut portion is captured by the camera 230 (second position). Camera 230, for example, has a fixed position and captures the cut portion of the tape tp that has been fed to the second position. After that, for example, the tape tp is moved from the second position to the position where the ACF section tp3 is attached (pressed) to the substrate 3 by the attachment head 223 (third position).

[0052] Note that the second position and the third position may be the same or different. In this embodiment, the second position and the third position are the same. The first, second, and third positions are, for example, located in this order along the X-axis, and are the same in the Y-axis and Z-axis directions. In this embodiment, the tape tp is positioned at the first, second, and third positions described above, and is moved along the X-axis (in other words, the direction in which the tape extends) so as to pass through the first, second, and third positions described above.

[0053] Camera 231 is a camera that generates an image by imaging the ACF section tp3 attached to the substrate 3. Specifically, camera 231 images the cut area of ​​the ACF section tp3 attached to the substrate 3.

[0054] The images captured (generated) by cameras 230 and 231 are used, for example, to determine abnormalities in each mechanism of the ACF application device 10, or they are displayed on a display device (not shown) so that an operator can determine whether or not there is an abnormality. In this embodiment, the images generated by camera 230 are used to update the distance information. Details of the distance information update process will be described later.

[0055] In this embodiment, the ACF attachment mechanism 20 comprises two attachment mechanism units 220L and 220R, an X-axis rail mechanism 228, an attachment base 229, and a camera 231.

[0056] The adhesive base 229 is a base for supporting two adhesive mechanism units 220L and 220R.

[0057] The X-axis rail mechanism 228 is positioned along the X-axis direction on the upper surface of the adhesive base 229. Two adhesive mechanism units 220L and 220R are mounted on this X-axis rail mechanism 228, side by side, so as to be movable along the X-axis direction. The X-axis rail mechanism 228 also includes a mechanism for changing the distance between the two adhesive mechanism units 220L and 220R.

[0058] The two attachment mechanism units 220L and 220R are mechanisms for attaching the ACF section tp3 to the substrate 3, and each has the same configuration.

[0059] For example, the adhesive mechanism units 220L and 220R each include a tape supply reel 221, a tape retrieval unit 222, an adhesive head 223, an adhesive backup stage 224, a tape cutting unit 225, a camera 230, a feed roller 232, a press roller 233, and a guide roller 234.

[0060] For example, after multiple ACF sections tp3 are attached to the substrate 3 by the attachment mechanism units 220L and 220R, the substrate 3 is moved by the substrate moving mechanism 210 to a position where the camera 231 takes an image, and the camera 231 takes an image.

[0061] The adhesive mechanism unit 220L and the adhesive mechanism unit 220R may each attach ACF segments tp3 to the same substrate 3, or they may each attach ACF segments tp3 to different substrates 3. Furthermore, the ACF adhesive mechanism 20 may consist of one or three or more adhesive mechanism units.

[0062] The control device 30 is a computer that controls each component of the ACF application device 10 (specifically, each component of the ACF application mechanism 20). For example, these components, or the drive mechanisms for driving these components, are communicated with the control device 30 by wireless or control lines, and perform predetermined tasks under the control of the control device 30.

[0063] The control device 30 is implemented, for example, by a communication interface, a non-volatile memory where the program is stored, a volatile memory which is a temporary storage area for executing the program, input / output ports for sending and receiving signals, and a processor such as a CPU (Central Processing Unit) that executes the program.

[0064] The control device 30 comprises a control unit 31, an update unit 32, and a storage unit 33.

[0065] The control unit 31 is a processing unit that controls various operations (various tasks) of each component of the ACF attachment mechanism 20, such as the supply unit 21, cutting unit 22, tape feeding mechanism 23, crimping unit 24, and imaging unit 25.

[0066] For example, the control unit 31 repeatedly performs the cutting process by the cutting unit 22, the tape feeding process by the tape feeding mechanism 23, the crimping process by the crimping unit 24, and the imaging process by the imaging unit 25, thereby repeatedly imaging the cut area and repeatedly attaching the ACF section tp3 to the substrate 3.

[0067] The update unit 32 is a processing unit that updates distance information based on the captured image obtained by the imaging unit 25. Specifically, the update unit 32 updates distance information based on the amount of displacement (distance) from a predetermined position of the cutting point in the captured image generated by the imaging unit 25 (specifically, the camera 230).

[0068] Distance information is pre-stored in, for example, the memory unit 33. The update unit 32 updates the distance information stored in, for example, the memory unit 33.

[0069] For example, the control unit 31 or the update unit 32 calculates a predetermined feed amount based on the distance information stored in the storage unit 33. Also, for example, if the distance information is updated, the control unit 31 or the update unit 32 calculates a predetermined feed amount using the updated distance information.

[0070] Furthermore, the calculation method for determining a predetermined feed amount from distance information may be arbitrarily determined and is not particularly limited.

[0071] Furthermore, the predetermined location can be arbitrarily determined and is not particularly limited. Information indicating the predetermined location is stored in advance, for example, in the storage unit 33.

[0072] Furthermore, the update unit 32 may update the distance information based on multiple captured images. For example, the update unit 32 updates the distance information based on the amount of deviation from a predetermined position of the cutting point in each of the multiple captured images generated by repeatedly performing the cutting process by the cutting unit 22, the crimping process by the crimping unit 24, the imaging process by the imaging unit 25, and the tape feeding process by the tape feeding mechanism 23. For example, the update unit 32 calculates the average value of the amount of deviation from a predetermined position in each of the multiple images and updates the distance information based on the calculated average value.

[0073] Note that instead of the mean, the median, maximum, or minimum value may also be used.

[0074] Furthermore, the number of captured images can be two, three or more.

[0075] Furthermore, the update unit 32 may determine whether or not to update the distance information based on predetermined conditions. For example, the control unit 31 may control the operation of the crimping unit 24 based on the determination result of the update unit 32.

[0076] For example, the update unit 32 determines whether or not to update the distance information based on the variation in the amount of deviation of the cutting point from a predetermined position in each of the multiple captured images.

[0077] Note that while variability can be expressed as standard deviation, any value that shows the degree of variation in the amount of deviation, such as variance, may be used, and it may be calculated using any method.

[0078] For example, the update unit 32 updates the distance information if the variation is below a predetermined threshold. On the other hand, for example, the update unit 32 does not update the distance information if the variation is above a predetermined threshold. For example, if the variation is above a predetermined threshold, the update unit 32 outputs error information to notify the operator that the tape tp is not being fed at the appropriate rate. For example, the update unit 32 outputs the error information to a notification device described later, causing the notification device to notify the operator that the tape tp is not being fed at the appropriate rate.

[0079] The predetermined threshold can be arbitrarily determined and is not particularly limited. Information indicating the predetermined threshold is stored in advance in the storage unit 33, for example.

[0080] The control unit 31 or the update unit 32 may output captured images and error information to an external device. For example, the control unit 31 or the update unit 32 may output error information to a notification device such as a display and / or speaker, thereby notifying the operator with images and / or sound that the tape tp is not being fed at the appropriate rate.

[0081] The processing units, such as the control unit 31 and the update unit 32, are implemented, for example, by a processor and a control program stored in memory or the like that is executed by the processor.

[0082] The memory unit 33 is a storage device that stores various data such as the size of the substrate 3, the attachment position and direction of the ACF section tp3, the operation of each component, the timing of said operation, the timing for transferring the substrate 3 to a component crimping device located downstream of the ACF attachment device 10, a control program executed by the processing unit, and information used by the update unit 32 to determine whether or not there is an abnormality. The memory unit 33 is implemented by, for example, flash memory, HDD (Hard Disk Drive), etc.

[0083] [Processing Procedure] Next, the processing procedure of the ACF application device 10 according to the embodiment will be described in detail.

[0084] Figure 5 is a flowchart illustrating the processing procedure of the ACF application apparatus 10 according to the embodiment. Figure 6 is a diagram illustrating the specific processing procedures of the application process and the imaging process in the ACF application apparatus 10 according to the embodiment. Note that in Figure 6, only the components for illustrative purposes are shown, and some components of the ACF application mechanism 20, such as the application backup stage 224, are not shown.

[0085] First, the substrate moving mechanism 210 moves the substrate 3 (S110). Specifically, the control unit 31 controls the substrate moving mechanism 210 to place the edge of the substrate 3 onto the adhesive backup stage 224. More specifically, as shown in Figure 6(a), the substrate 3 is moved so that the first adhesive position, which is the position on the substrate 3 where the ACF section tp3 is to be attached, is located below the adhesive head 223. The first adhesive position is the position on the substrate 3 where the electrode section 4 is located, and from this position the ACF section tp3 will be attached.

[0086] Next, the cutting unit 22 performs a cutting process to form an ACF section tp3 supported by the base layer tp1 by cutting the ACF layer tp2 contained in the tape tp supplied from the supply unit 21, which includes a base layer tp1 and an ACF layer tp2 (S120). Specifically, the control unit 31 controls the cutting unit 22 to form an ACF section tp3 supported by the base layer tp1. More specifically, as shown in Figure 6(b), the ACF section tp3 is formed when the ACF layer tp2 is cut by the tape cutting unit 225.

[0087] Next, the tape feeding mechanism 23 performs a tape feeding process to feed the tape tp containing the ACF section tp3 supported by the substrate layer tp1, thereby positioning the cutting location (also simply called the cutting position) within the imaging area (within the imaging range) of the imaging unit 25 (specifically, the camera 230) (S130). Specifically, the control unit 31 controls the tape feeding mechanism 23 to feed the tape tp so that the cutting position is located within the imaging area of ​​the imaging unit 25. More specifically, as shown in Figure 6(c), the tape tp is moved so that the cutting location (the boundary between the ACF layer tp2 and the ACF section tp3 in Figure 6(c)) is located above the camera 230. The imaging area is, for example, the area within the field of view of the camera 230.

[0088] In this embodiment, the tape feeding mechanism 23 performs tape feeding processing to feed the tape tp, which includes the ACF section tp3 supported on the base layer tp1, from a first position where cutting is performed to a second position where imaging is performed, by a predetermined feed amount set based on distance information relating to the distance between the cutting unit 22 and the imaging unit 25. For example, the control unit 31 calculates a predetermined feed amount based on distance information stored in the storage unit 33 and controls the tape feeding mechanism 23 so that the calculated predetermined feed amount (predetermined length) of tape tp is fed.

[0089] Next, the control unit 31 causes the imaging unit 25 (specifically, the camera 230) to image the cutting position (S140). Specifically, the imaging unit 25 performs imaging processing to generate an image by imaging the cutting location in the ACF layer tp2 supported by the base material layer tp1 contained in the tape tp fed by the tape feeding mechanism 23. In this way, the imaging unit 25 images the cutting location in the ACF layer tp2 supported by the base material layer tp1 that has been cut by the cutting process before the crimping process is performed.

[0090] Next, the update unit 32 updates the distance information based on the captured image (S150). Specifically, the update unit 32 updates the distance information based on the amount of deviation of the cutting point from a predetermined position in the captured image.

[0091] Next, the tape feeding mechanism 23 further performs a tape feeding process to feed the tape tp containing the ACF segment tp3 supported by the substrate layer tp1, thereby positioning the ACF segment tp3 at the pressing position (S160). Specifically, the control unit 31 controls the tape feeding mechanism 23 to feed the tape tp so that the ACF segment tp3 moves to a position where it is pressed onto the substrate 3. More specifically, as shown in Figure 6(d), the ACF segment tp3 is moved between the adhesive head 223 and the first adhesive position.

[0092] In this example, the position of the ACF intercept tp3 shown in Figure 6(c) and the position of the ACF intercept tp3 shown in Figure 6(d) are the same. If the position of the ACF intercept tp3 when step S140 is performed is the same as the position of the ACF intercept tp3 when step S170, which will be described later, is performed, then step S160 may not be performed.

[0093] Next, the crimping unit 24 performs a crimping process to peel the ACF section tp3 from the base layer tp1 and crimp it onto the substrate 3 (S170). Specifically, the crimping unit 24 peels the ACF section tp3, which is supported by the base layer tp1 contained in the tape tp fed by the tape feeding mechanism 23, from the base layer tp1 and crimps it onto the substrate 3. More specifically, the control unit 31 controls the crimping unit 24 to peel the ACF section tp3, which is supported by the base layer tp1, from the base layer tp1 and crimp it onto the substrate 3. Even more specifically, as shown in Figure 6(e), the ACF section tp3 is attached to the first attachment position on the substrate 3. Also, for example, as shown in Figure 6(f), the substrate 3 is moved so that the ACF section tp3 attached to the substrate 3 is positioned below the camera 231, and imaging is performed by the camera 231.

[0094] Next, the control unit 31 determines whether all of the ACF sections tp3 have been attached to the substrate 3 (S180).

[0095] The control unit 31 terminates the process when it determines that all of the ACF segments tp3 have been attached to the substrate 3 (Yes in S180). For example, the control unit 31 controls the substrate moving mechanism 210 to transport the substrate 3 with the ACF segments tp3 attached downstream, brings in a new substrate 3 from upstream, and executes the process again from step S110.

[0096] On the other hand, if the control unit 31 determines that the attachment of all ACF segments tp3 on the substrate 3 has not been completed (No in S180), it returns the process to step S110 and moves the substrate 3 to a position where new ACF segments tp3 will be attached. For example, the substrate 3 is moved so that the second attachment position shown in Figure 6(f) is located below the attachment head 223. The second attachment position is the position on the substrate 3 where the electrode portion 4 is located, and from this position the ACF segments tp3 will be attached.

[0097] By repeating this process, in the next step S110 and subsequent steps, the distance information updated to an appropriate value can be used to perform step S130.

[0098] Furthermore, the order of processing for each step is just an example and can be rearranged as desired. For example, step S150 may be executed after step S140, after step S170, or at any arbitrary timing.

[0099] Furthermore, step S150 may be executed if step S140 has been performed a predetermined number of times. In this case, for example, if step S140 has not been performed a predetermined number of times, step S160 may be performed after step S140.

[0100] Figure 7 shows an image captured according to the embodiment. Specifically, Figure 7 is a specific example of an image captured by camera 230 in step S140. More specifically, Figure 7 shows an image captured when the cutting location of the ACF section tp3 located in the imaging area of ​​camera 230 is captured by camera 230.

[0101] For example, the update unit 32 determines whether the amount of deviation of the cutting position in the X1 axis direction in the captured image from the reference position is greater than a predetermined reference value determined based on a predetermined feed amount. The predetermined reference value is, for example, the reference deviation amount described above.

[0102] As shown in Figure 7, for example, a reference position is predetermined by a reference line at the center of the X1 axis direction in the captured image. Also, for example, the update unit 32 calculates a cutting line, which is a virtual line indicating the position of the cutting point (cutting position). For example, the update unit 32 calculates the cutting line as the straight line obtained when the shape of the cutting point in the captured image is approximated by a straight line. For example, the cutting point is the edge located on the ACF layer tp2 side of the ACF intercept tp3. In other words, the cutting position is the location of the edge located on the ACF layer tp2 side of the ACF intercept tp3. In this example, the cutting point is the edge located on the negative side of the X1 axis in the ACF intercept tp3 shown in Figure 7. The cutting line is, for example, a virtual line parallel to the edge located on the ACF layer tp2 side of the ACF intercept tp3. Specifically, the cutting line is a virtual line obtained when the cutting point is approximated by a straight line. In this example, the cutting line is the boundary line obtained by approximating the boundary between the ACF layer tp2 and the ACF intercept tp3 by a straight line.

[0103] For example, the update unit 32 calculates the distance in the X1 direction between the reference line and the cutting line as the amount of displacement.

[0104] The update unit 32 updates the distance information if it determines that the amount of deviation of the cutting position in the X1 axis direction in the captured image from the reference position is greater than a predetermined reference value. On the other hand, the update unit 32 does not update the distance information if it determines that the amount of deviation of the cutting position in the X1 axis direction in the captured image from the reference position is less than or equal to a predetermined reference value.

[0105] The predetermined reference value can be arbitrarily set in advance and is not particularly limited. Information indicating the predetermined reference value is stored in the memory unit 33 in advance, for example.

[0106] Furthermore, the predetermined reference value may be a single value or a value that specifies a range. In other words, for example, the update unit 32 may determine whether the amount of displacement is within a predetermined reference range determined based on a predetermined feed amount. For example, if the update unit 32 determines that the amount of displacement of the cutting position in the X1 axis direction in the captured image from the reference position is outside the predetermined reference range, it updates the distance information. On the other hand, if the update unit 32 determines that the amount of displacement of the cutting position in the X1 axis direction in the captured image from the reference position is within the predetermined reference range, it does not update the distance information.

[0107] Furthermore, the update unit 32 may determine whether or not to update the distance information based on the variation in the amount of displacement calculated from multiple captured images.

[0108] Figure 8 is a flowchart showing a modified example of the processing procedure of the ACF application device 10 according to the embodiment. In the explanation of Figure 8, the differences from the flowchart shown in Figure 5 will be explained in particular.

[0109] First, the substrate moving mechanism 210 moves the substrate 3 (S110).

[0110] Next, the cutting unit 22 performs a cutting operation to form an ACF section tp3 supported by the base layer tp1 by cutting the ACF layer tp2 contained in the tape tp supplied from the supply unit 21, which includes a base layer tp1 and an ACF layer tp2 (S120).

[0111] Next, the tape feeding mechanism 23 performs a tape feeding process to feed the tape tp containing the ACF section tp3 supported by the base layer tp1, thereby positioning the cutting location (also called simply the cutting position) within the imaging area (imaging range) of the imaging unit 25 (specifically, the camera 230) (S130).

[0112] Next, the control unit 31 causes the imaging unit 25 (specifically, the camera 230) to image the cutting position (S140).

[0113] Next, the update unit 32 determines whether the imaging unit 25 has captured images of the cutting position a predetermined number of times (S151). In other words, the update unit 32 determines whether the processes in steps S110 to S140 and S160 to S170 have been executed a predetermined number of times. That is, the update unit 32 determines whether the imaging unit 25 has generated a predetermined number of captured images.

[0114] If the update unit 32 determines that the imaging unit 25 has not imaged the cutting position a predetermined number of times (No in S151), the tape feeding mechanism 23 further performs a tape feeding process to feed the tape tp containing the ACF section tp3 supported by the base layer tp1, thereby positioning the ACF section tp3 at the crimping position (S160).

[0115] Next, the crimping section 24 performs a crimping process to peel the ACF section tp3 from the base material layer tp1 and crimp it onto the substrate 3 (S170).

[0116] Next, the control unit 31 determines whether all of the ACF sections tp3 have been attached to the substrate 3 (S180).

[0117] The control unit 31 terminates the process when it determines that all of the ACF sections tp3 have been attached to the substrate 3 (Yes in S180).

[0118] On the other hand, if the control unit 31 determines that the attachment of all ACF segments tp3 to the substrate 3 has not been completed (No in S180), it returns the process to step S110 and moves the substrate 3 to a position where new ACF segments tp3 can be attached.

[0119] As this process is repeated a predetermined number of times, for example, in step S151, if the update unit 32 determines that the imaging unit 25 has captured images of the cutting position a predetermined number of times (Yes in S151), it calculates the average value of the displacement amount calculated from each of the multiple captured images generated by the imaging unit 25 (S152).

[0120] Next, the update unit 32 determines whether the average value of the calculated deviation is greater than a predetermined reference value (S153).

[0121] If the update unit 32 determines that the average value of the calculated displacement is less than or equal to a predetermined reference value (No in S153), for example, the image count is initialized and the process moves to step S160. As a result, if the displacement is not greater than the predetermined reference value, the distance information is not updated and each process is executed repeatedly. For example, after imaging is performed a predetermined number of times, the processes in steps S152 and S153 are executed.

[0122] Here, if the update unit 32 determines that the average value of the calculated deviation amount is greater than a predetermined reference value (Yes in S153), it calculates the variability of the calculated deviation amount (S154).

[0123] Next, the update unit 32 determines whether the calculated variability is above a predetermined threshold (S155).

[0124] If the update unit 32 determines that the calculated variation is less than a predetermined threshold (No in S155), it updates the distance information based on the average value of the calculated variation (S156). Alternatively, for example, the update unit 32 initializes the image count, and the process moves to step S160.

[0125] On the other hand, if the update unit 32 determines that the calculated variation is above a predetermined threshold (Yes in S155), it outputs error information (S157). For example, when the control unit 31 outputs error information, it stops the cutting unit 22, the tape feeding mechanism 23, the crimping unit 24, and the imaging unit 25. As a result, the ACF attachment device 10 is stopped in an emergency, and various processes for attaching the ACF section tp3 to the substrate 3 are stopped.

[0126] Furthermore, after error information 157 is output, the process may proceed to step S160.

[0127] (Effects, etc.) The following describes examples of technologies that can be obtained from the disclosures in this specification, and explains the effects that can be obtained from these examples.

[0128] Technology 1 includes a supply unit 21 for supplying a tape tp containing a base layer tp1 and an ACF layer tp2; a cutting unit 22 for performing a cutting process to form an ACF section tp3 supported by the base layer tp1 by cutting the ACF layer tp2 contained in the tape tp supplied from the supply unit 21; a pressing unit 24 for performing a pressing process to peel the ACF section tp3 from the base layer tp1 and press it onto a substrate 3; and before the pressing process is performed, imaging the cut area in the ACF layer tp2 supported by the base layer tp1 that has been cut by the cutting process. The ACF pasting device 10 comprises an imaging unit 25 that performs imaging processing to generate an image, a tape feeding mechanism 23 that performs tape feeding processing to feed a tape tp containing an ACF section tp3 supported on a substrate layer tp1 by a predetermined feed amount set based on distance information relating to the distance between the cutting unit 22 and the imaging unit 25, from a first position where cutting processing is performed to a second position where imaging processing is performed, and an update unit 32 that updates the distance information based on the amount of deviation of the cutting location in the image from a predetermined position.

[0129] The distance between the cutting unit 22 and the imaging unit 25 is, for example, the distance used during the design of the ACF application device 10. Therefore, due to manufacturing errors in the ACF application device 10, the actual distance between the cutting unit 22 and the imaging unit 25 may differ from the design distance. In this case, the predetermined feed amount set based on the distance information indicating the design distance may not be the appropriate feed amount for applying the ACF section tp3 to the correct position on the substrate 3. Therefore, the update unit 32 updates the distance information based on the captured image. As a result, the distance information is updated to reflect the actual state of the ACF application device 10. Consequently, the predetermined feed amount set based on the distance information is changed to a feed amount that reflects the actual state of the ACF application device 10. Therefore, according to the ACF application device 10 of Technology 1, the amount of tape tp fed by the tape feeding mechanism 23 can be appropriately controlled.

[0130] The initial value of the distance information is, for example, the distance between the position of the cutter 225b of the cutting unit 22 when it cuts the ACF layer tp2 and the position of the imaging center on the tape tp when the imaging unit 25 images the cutting position, but it is not particularly limited and can be determined arbitrarily. For example, the position of the backing plate 225a of the cutting unit 22 may be used to calculate the initial value of the distance information, or the position of the camera 230 of the imaging unit 25 may be used.

[0131] Technology 2 is the ACF pasting apparatus 10 described in Technology 1, wherein the update unit 32 updates distance information based on the amount of displacement from a predetermined position of the cutting location in each of the multiple captured images generated by repeatedly performing the cutting process, crimping process, imaging process, and tape feeding process.

[0132] According to this, distance information is updated by multiple captured images, so the distance information can be updated to an even more appropriate value.

[0133] Technology 3 is the ACF pasting apparatus 10 described in Technology 2, wherein the update unit 32 determines whether or not to update the distance information based on the variation in the amount of deviation of the cutting point from a predetermined position in each of the multiple captured images.

[0134] If the variation in the amount of deviation is large, there is a high possibility that a problem other than the distance information is occurring, such as a malfunction in the tape feed mechanism 23 itself. Therefore, by determining whether or not to update the distance information based on the variation, it is possible to suppress unnecessary updates of the distance information.

[0135] Technology 4 is the ACF application device 10 described in Technology 3, wherein the update unit 32 updates the distance information when the variation is less than a predetermined threshold.

[0136] According to this, unnecessary updates of distance information can be suppressed.

[0137] Technology 5 involves the cutting unit 22 performing a cutting process to form an ACF section tp3 supported by the base layer tp1 by cutting the ACF layer tp2 contained in the tape tp supplied from the supply unit 21 for supplying tape tp containing a base layer tp1 and an ACF layer tp2 (S120), the crimping unit 24 performing a crimping process to peel the ACF section tp3 from the base layer tp1 and crimp it onto the substrate 3 (S170), and the imaging unit 25 capturing the cut portion of the ACF layer tp2 supported by the base layer tp1 that was cut by the cutting process before the crimping process is performed. This ACF pasting method involves performing an imaging process to generate an image (S140), a tape feeding mechanism 23 feeding the tape tp containing the ACF section tp3 supported on the base layer tp1 by a predetermined feed amount set based on distance information relating to the distance between the cutting unit 22 and the imaging unit 25, from a first position where the cutting process is performed to a second position where the imaging process is performed (S130), and an update unit 32 updating the distance information based on the amount of displacement of the cutting location in the image from a predetermined position (S150).

[0138] According to this, it will have the same effect as the ACF application device 10 related to Technology 1.

[0139] (Other embodiments) Although the ACF application device and the like according to this embodiment have been described above based on the above embodiment, the present invention is not limited to the above embodiment.

[0140] For example, the processing steps in the above embodiment do not necessarily have to be processed chronologically in the order described in the flowchart, and may include processes that are executed in parallel or individually.

[0141] Furthermore, for example, all or part of the components of the processing unit, such as the control unit and update unit, of the ACF pasting device may be configured with dedicated hardware, or they may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit, such as a CPU or processor, reading and executing a software program recorded on a recording medium such as an HDD or semiconductor memory.

[0142] Furthermore, the components of the processing unit of the ACF application device may consist of one or more electronic circuits. Each of these one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

[0143] One or more electronic circuits may include, for example, semiconductor devices, ICs, or LSIs (Large Scale Integrations). ICs or LSIs may be integrated on a single chip or on multiple chips. While referred to here as ICs or LSIs, the terminology may vary depending on the degree of integration; they might also be called system LSIs, VLSIs (Very Large Scale Integrations), or ULSIs (Ultra Large Scale Integrations). Field Programmable Gate Arrays (FPGAs), which are programmed after the LSI is manufactured, can also be used for the same purpose.

[0144] Furthermore, the present invention can be implemented not only as an ACF pasting device, but also as a program that includes the processing performed by each component of the ACF pasting device as steps, and as a recording medium such as a computer-readable DVD (Digital Versatile Disc) on which the program is recorded. In other words, the comprehensive or specific embodiments described above may be implemented as a system, device, integrated circuit, computer program, or computer-readable non-temporary recording medium, or as any combination of a system, device, integrated circuit, computer program, and recording medium.

[0145] Furthermore, the present invention also includes forms obtained by applying various modifications to each embodiment that a person skilled in the art could conceive, as well as forms realized by arbitrarily combining the components and functions of each embodiment without departing from the spirit of the present invention. [Industrial applicability]

[0146] This invention can be used in an ACF bonding apparatus for bonding ACF to a substrate. [Explanation of Symbols]

[0147] 3 circuit boards 4 Electrode section 10 ACF application device 20 ACF adhesive mechanism 21 Supply section 22 Cut section 23 Tape feed mechanism 24 Crimping section 25 Imaging Department 30 Control device 31 Control Unit 32 Update section 33 Storage section 210 Substrate moving mechanism 211 X-axis table 212 Y-axis table 213 Z-axis table 214 stages 220L, 220R Adhesion Mechanism Unit 221 Tape supply reel 222 Tape retrieval unit 223 Adhesive head 224 Adhesive backup stage 225 Tape Cutting Unit 225a backing plate 225b Cutter 228 X-axis rail mechanism 229 Adhesive base 230, 231 Camera 232 Feed roller 233 Pressing roller 234 Guide roller TP tape tp1 base material layer tp2 ACF layer tp3 ACF section

Claims

1. A supply unit for supplying a tape including a base layer and an ACF (Anisotropic Conductive Film) layer, A cutting unit performs a cutting process to form an ACF section supported on the base layer by cutting the ACF layer contained in the tape supplied from the supply unit, A crimping unit that performs a crimping process to peel the ACF section from the base material layer and press it onto the substrate, Before the aforementioned crimping process is performed, an imaging unit performs an imaging process to generate an image by imaging the cut portion of the ACF layer supported on the substrate layer that has been cut by the cutting process, A tape feeding mechanism that feeds the tape, including the ACF section supported on the substrate layer, from a first position where the cutting process is performed to a second position where the imaging process is performed, by a predetermined feed amount set based on distance information relating to the distance between the cutting section and the imaging section. The system includes an update unit that updates the distance information based on the amount of displacement of the cutting point from a predetermined position in the captured image. ACF application device.

2. The update unit updates the distance information based on the amount of displacement of the cutting location from the predetermined position in each of the multiple captured images generated by repeatedly performing the cutting process, the crimping process, the imaging process, and the tape feeding process. The ACF application device according to claim 1.

3. The update unit determines whether or not to update the distance information based on the variation in the amount of deviation of the cutting point from the predetermined position in each of the multiple captured images. The ACF application apparatus according to claim 2.

4. The update unit updates the distance information if the variation is less than a predetermined threshold. The ACF application device according to claim 3.

5. The cutting unit performs a cutting process to form an ACF (Anisotropic Conductive Film) section supported by the base layer by cutting the ACF layer contained in the tape supplied from the supply unit for supplying a tape containing a base layer and an ACF (Anisotropic Conductive Film) layer. The crimping section performs a crimping process that peels the ACF section from the base material layer and presses it onto the substrate. The imaging unit performs an imaging process to generate an image by imaging the cut portion of the ACF layer supported by the substrate layer that has been cut by the cutting process, before the crimping process is performed. The tape feeding mechanism performs a tape feeding process in which it feeds the tape, including the ACF section supported on the substrate layer, from the first position where the cutting process is performed to the second position where the imaging process is performed, by a predetermined feed amount set based on distance information relating to the distance between the cutting section and the imaging section. The update unit updates the distance information based on the amount of displacement of the cutting point from a predetermined position in the captured image. ACF application method.

Images