Electronic component transport system

Abstract

Remove any electronic components protruding from the pockets of the index table. [Solution] A contact sensor 60 is provided in the storage section 23 of the road track 20 to detect an electronic component W protruding from the pocket 12 of the index table 11 toward the road track 20. Based on the signal from the contact sensor 60, the electronic component W protruding toward the road track 20 is blown into the storage section 23 by air ejected from the air outlet 75.

Description

Technical Field

[0005] , , , , ,

[0001] The present disclosure relates to a transport system for electronic components that arranges and transports a large number of electronic components at predetermined intervals on an index table.

Background Art

[0002] All produced electronic components such as capacitors are subjected to a predetermined test, and only the non-defective products are shipped.

[0003] First, the electronic components are put into the storage section of a load truck, inserted from this storage section into the pockets of an index table, and an electrical test is performed on the electronic components in the pockets of the index table by an electronic component test device while the electronic components are inserted into the pockets. In this case, the electronic components may not be completely housed in the pockets of the index table, and the protruding electronic components from the pockets may contact the electronic component test device. When the electronic components contact the electronic component test device in this way, the electronic components, the index table, or the electronic component test device may be damaged.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] The present disclosure has been made in consideration of such points, and an object thereof is to provide a transport system for electronic components that can discharge an electronic component from a pocket when the electronic component put into the storage section of a load truck is not reliably filled in the pocket of the index table and protrudes from the pocket. [Means for solving the problem]

[0006] This disclosure relates to an electronic component transport system comprising: a base; a disc-shaped index table rotatably disposed on the base and having a plurality of pockets arranged circumferentially, each of which houses an electronic component; and a load track provided on the index table and having an arc-shaped storage section corresponding to the pockets and storing the electronic components, wherein a contact sensor is provided to detect the electronic components protruding from the pockets toward the load track, and an air nozzle is provided on the base downstream of the contact sensor to blow air onto the protruding electronic components based on the signal from the contact sensor and blow them into the storage section.

[0007] This disclosure relates to an electronic component transport system, further comprising an electronic component testing apparatus for performing electrical measurements on the aforementioned electronic components.

[0008] This disclosure relates to an electronic component transport system in which the contact sensor is provided on a road track cover that covers the road track, and the contact sensor has a contact pin that contacts the electronic component, a oscillating body that holds the contact pin and rotates around a rotation axis, and a proximity sensor that detects the rotation of the oscillating body.

[0009] This disclosure relates to an electronic component transport system, wherein an ejection inspection sensor is provided downstream of the air nozzle to detect whether or not the electronic component has been blown away by the air nozzle.

[0010] This disclosure relates to an electronic component transport system that includes a brush for scraping off the electronic components protruding from the pocket toward the road track into the storage section.

[0011] This disclosure relates to an electronic component transport system in which the brush is provided upstream of the contact sensor.

[0012] This disclosure relates to an electronic component transport system in which the storage section of the road track has an angular range of 90 to 110 degrees from the upstream end to the downstream end, and the contact sensor and the air nozzle are located within an angular range of 15 to 30 degrees from the downstream end of the storage section of the road track toward the upstream side. [Effects of the Invention]

[0013] As described above, according to this disclosure, if an electronic component placed in the storage section of the road track is not reliably filled into the pocket of the index table and protrudes from the pocket, the electronic component can be ejected from the pocket. [Brief explanation of the drawing]

[0014] [Figure 1A] Figure 1A is a schematic perspective view showing an embodiment of the electronic component transport system according to this disclosure. [Figure 1B] Figure 1B is a schematic front view showing an embodiment of the electronic component transport system according to the present disclosure. [Figure 2] Figure 2 is an enlarged view of section A of Figure 1B, showing the arrangement of the brush, contact sensor, air nozzle, and ejection inspection sensor, with the road track cover partially removed and the electronic component testing equipment cover removed for convenience. [Figure 3A] Figure 3A is a cross-sectional view taken along line III-III in Figure 2, showing a state where the electronic components do not protrude from the pocket. [Figure 3B] Figure 3B is a cross-sectional view taken along line III-III in Figure 2, showing the state in which the electronic component protrudes from the pocket. [Figure 3C] Figure 3C is a cross-sectional view taken along line III-III in Figure 2, illustrating how electronic components inside the pocket are being blown out by air from the air outlet. [Figure 4A] Figure 4A is a cross-sectional view of line IV-IV in Figure 2, showing the state in which the electronic components in the pocket are separated from the protective plate. [Figure 4B] Figure 4B is a cross-sectional view of line IV-IV in Figure 2, showing the state in which the electronic components in the pocket have collided with the protective plate. [Figure 5A] FIG. 5A is a cross-sectional view taken along line V-V of FIG. 2, showing a brush. [Figure 5B] FIG. 5B is an enlarged view of FIG. 5A. [Figure 6] FIG. 6 shows a load track provided on an index table. [Figure 7] FIG. 7 shows a connection structure between an index table and a load track. [Figure 8] FIG. 8 is a rear view showing a load track. [Figure 9] FIG. 9 shows a probe of an electronic component test apparatus. [Figure 10] FIG. 10 is a flowchart showing the operation of a transport system for electronic components.

Embodiments for Carrying out the Invention

[0015] Hereinafter, embodiments of a transport system for electronic components will be described with reference to the drawings. FIGS. 1 to 8 are diagrams showing embodiments of a transport system for electronic components.

[0016] First, the outline of a transport system 10 for electronic components will be described with reference to FIGS. 1A and 1B. <0​​​​​Such an electronic component transport system 10 includes a structure 10A having an inclined surface 10a, an index table 11 having a disc-shaped structure provided on the inclined surface 10a of the structure 10A and having pockets 12 arranged in multiple rows, for example, 8 rows, in a circumferential direction, each of which houses an electronic component W, an electronic component testing device 30A provided on the index table 11 and performing electrical testing on the electronic components W stored in the pockets 12 of the index table 11, an electronic component discharge unit 50 that discharges the electronic components W that have been electrically tested by the electronic component testing device 30A, and a recovery device 1 connected to the electronic component discharge unit 50 via a discharge path 51. The electronic component testing device 30A also includes a total of 12 electronic component testing device elements 42 provided along the circumferential direction on the index table 11, and an electronic component testing device cover 41 that covers these electronic component testing device elements 42.

[0019] In this embodiment, the inclined surface 10a of the structure 10A functions as a base that rotatably supports the index table 11. A heater (not shown) is provided within this inclined surface 10a for heating the electronic components W housed in the pockets 12 of the index table 11.

[0020] Of these, the inclined surface 10a of the structure 10A is inclined at approximately 60 degrees with respect to the horizontal plane, and the index table 11 rotates intermittently clockwise on this inclined surface 10a. Alternatively, instead of placing the index table 11 on the inclined surface 10a, it may be placed on the vertical surface (not shown) of the structure 10A, which is positioned perpendicular to the horizontal plane.

[0021] In this specification, "upper" or "lower" refers to the "upper" or "lower" direction when the electronic component transport system 10 is arranged as shown in Figures 1A and 1B. Also, in this specification, "upstream" or "downstream" refers to the "upstream" or "downstream" direction along the rotation direction of the index table 11, which rotates clockwise, in Figures 1A and 1B. Specifically, in Figures 1A and 1B, the index table 11 rotates from the "upstream" to the "downstream". In Figure 2, the "upstream" is located below Figure 2, and the "downstream" is located above Figure 2. Furthermore, in Figures 3A to 3B, the index table 11 moves from the "upstream" located below to the "downstream" located above.

[0022] Next, the electronic component testing apparatus 30A will be described with reference to Figure 9. As shown in Figure 9, the electronic component testing apparatus element 42 of the electronic component testing apparatus 30A has a plurality of probes 30 that perform electrical tests on electronic components W stored in the pockets 12 of the index table 11. Specifically, each probe 30 applies an electrical load to the electronic component W and performs an electrical test. Based on the test results, the electronic component W is sorted by the electronic component discharge unit 50 and sent to the recovery device 1. In this embodiment, the electronic component testing apparatus 30A is provided so as to cover the index table 11 on the inclined surface 10a of the structure 10A.

[0023] As described above, the multiple probes 30 of each electronic component testing device element 42 of the electronic component testing device 30A apply an electrical load to the electronic component W and perform an electrical test. The electrical tests or electrical loads performed by the probes 30 include the following:

[0024] For example, the electrical loads that probe 30 can handle include the following: If electronic component W is a capacitor, a DC voltage load of 2.5 times the rated voltage is possible; for example, if the rated voltage is 10V, a DC voltage load of 25V is possible. Also, if electronic component W is a capacitor, an AC voltage load of 2.5 times the rated voltage is possible; for example, if the rated voltage is 10V, a maximum AC voltage load of 25V, 50Hz is possible. Furthermore, if the electronic component is an inductor, a current load of 1.5 times the rated current is possible; for example, if the rated DC current is 1,000mA, a load of 1,500mA is possible.

[0025] In addition to its function of applying an electrical load, the probe 30 also has the function of performing electrical tests on electronic components W. If electronic component W is a capacitor, the probe 30 can also detect capacitance (C), loss factor (Df), and quality factor (Q: reciprocal of Df). Alternatively, the probe 30 can detect leakage current (insulation resistance is calculated from leakage current and applied voltage), capacitance under DC voltage bias (AC capacitance with DC voltage applied), dielectric breakdown voltage (BDV), and contact between the probe 30 and electronic component W due to inrush current. Alternatively, if electronic component W is an inductor, the probe 30 can also detect inductance (L), DC resistance (Rdc), and current withstand.

[0026] In this embodiment, the probe 30 of the electronic component testing device element 42 normally performs an electrical test on the electronic component W. Based on the results of this electrical test, the electronic component W is sorted by the electronic component discharge unit 50 and sent to the recovery device 1.

[0027] Next, the electronic component testing apparatus element 42 will be described further with reference to Figure 9. As described above, the electronic component testing apparatus element 42 has a plurality of probes 30 that perform electrical testing on electronic components W, and each probe 30 is provided corresponding to each electronic component W.

[0028] Furthermore, each probe 30 is held by a probe holder 31, as shown in Figure 9. Each probe 30 is made of a material with high thermal expansion, high thermal conductivity, and high electrical conductivity, such as a copper alloy such as beryllium copper.

[0029] On the other hand, the probe holder 31 that holds each probe 30 includes a multilayer, for example, three-layered probe holder body 32a, 32b, 32c and sheet materials 33a, 33b interposed between each probe holder body 32a, 32b, 32c. In this embodiment, the probe holder body 32a, 32b, 32c of the probe holder 31 are made of a material that has low thermal expansion, low thermal conductivity, and low electrical conductivity, such as photoveil material.

[0030] Furthermore, a probe heater 35 is provided inside the middle layer of the probe holder body 32b of the probe holder 31 to heat the entire probe holder 31. However, since the probe holder bodies 32a, 32b, and 32c have low thermal conductivity as a whole, it becomes difficult for heat from the probe heater 35 to be transferred to the entire probe holder 31.

[0031] In this embodiment, the sheet materials 33a and 33b interposed between the probe holder bodies 32a, 32b, and 32c are, for example, graphite sheet materials with high thermal conductivity and high electrical conductivity. The probe 30 can be used to apply an electrical load to the electronic component W and to perform electrical testing.

[0032] Furthermore, the sheet materials 33a and 33b, which are made of graphite sheet material, have high thermal conductivity and electrical conductivity. For this reason, in order to prevent electrical conductivity between the sheet materials 33a and 33b and the probe 30, it is preferable to form through-holes in the sheet materials 33a and 33b that are considerably larger than the outer diameter of the probe 30, and to place the probe 30 inside these through-holes.

[0033] As shown in Figure 9, below the probe 30 held by the probe holder 31, there is an electrode section 36A that performs electrical testing on the electronic component W in relation to the probe 30. This electrode section 36A is supported by the inclined surface (base) 10a of the structure 10A.

[0034] The electrode section 36A includes an electrode 36 that performs an electrical test with respect to the electronic component W in relation to the probe 30, and an electrode holder 37 that holds the electrode 36. A probe heater 38 for heating the electrode holder 37 is provided inside the electrode holder 37.

[0035] The probe heater 38 then heats the electrode 36, allowing the electronic component W to be heated from the electrode 36 side as well.

[0036] Furthermore, both the probe 30 held by the probe holder 31 and the electrode 36 of the electrode section 36A are connected to the electrical circuit 30a, and this electrical circuit 30a performs an electrical test on the electronic component W between the probe 30 and the electrode 36.

[0037] Furthermore, as shown in Figure 9, the electrical circuit 30a is connected to the control unit 40.

[0038] In this embodiment, the electronic component testing apparatus element 42 of the electronic component testing apparatus 30A is composed of a probe 30, a probe holder 31 that holds the probe 30 and includes a probe heater 35, an electrode portion 36A provided below the probe 30, and an electrical circuit 30a.

[0039] Next, the other components will be described further. As shown in Figures 1A and 1B, the electronic component discharge unit 50 has an electronic component discharge unit body 50a provided on the inclined surface 10a of the structure 10A, and a tubular discharge path 51 attached to the electronic component discharge unit body 50a for discharging electronic components W stored in the pockets 12 of the index table 11 to the outside. The recovery device 1 is connected to the tubular discharge path 51.

[0040] In this embodiment, an electrical load is applied to the electronic component W by the probe 30 of the electronic component testing device 30A, and an electrical test is performed. Based on the results of the electrical test by the probe 30, the electronic component W is sorted by the electronic component discharge unit 50 and sent from the discharge path 51 to a predetermined recovery device 1.

[0041] Specifically, the results of the electrical test performed by the probe 30 are sent from the electrical circuit 30a to the control unit 40. Based on these electrical test results, the control unit 40 performs air injection at the electronic component discharge unit 50 using an air injection mechanism (not shown) provided on the inclined surface 10a of the structure 10A, and sends the electronic components W in the pockets 12 of the index table 11 to a predetermined recovery device 1 via the discharge path 51. In this embodiment, multiple recovery devices 1 are installed for each sorting category of electronic components W that are sorted based on the results of the electrical test performed by the probe 30, for example, six devices. In this embodiment, each recovery device 1 is installed in the lower part of the structure 10A.

[0042] The electronic components W located in the pockets 12 of the index table 11 are sorted in the electronic component discharge section and sent to a predetermined recovery device 1 via the discharge path 51.

[0043] As shown in Figures 1A to 8, a load track 20 is provided on the inclined surface (base) 10a of the structure 10A, corresponding to the lower part of the index table 11. Furthermore, an electronic component supply unit 15 is connected to this load track 20 to supply electronic components W to the load track 20. The load track 20 has a load track body 21 and a plurality of wall surfaces 22 provided inside the load track body 21, and a storage section 23 for storing electronic components W is formed between the wall surfaces 22. The electronic components W that are stored in the corresponding pockets 12 of the index table 11 are stored in this storage section 23 (see Figures 6 and 7).

[0044] Furthermore, a supply feeder 18 is connected to the electronic component supply unit 15 to replenish the electronic component W to the electronic component supply unit 15.

[0045] The index table 11 rotates intermittently around the pivot axis 11a. The pivot axis 11a of the index table 11 is driven by a drive mechanism (not shown).

[0046] Furthermore, the aforementioned components, such as the drive mechanism of the index table 11, the supply feeder 18, the electronic component supply unit 15, the electronic component testing device element 42 of the electronic component testing device 30A, the probe 30, and the air injection mechanism of the electronic component discharge unit 50, are all driven and controlled by the control unit 40. In addition, a contact sensor 60, which will be described later, is connected to the control unit 40, and based on the signal from the contact sensor 60, the control unit 40 drives and controls the air ejection means 76, which will be described later, to eject air from the air outlet 75. Also, an ejection inspection sensor 80, which will be described later, detects whether or not an electronic component W has been blown out of the pocket 12, and the signal from the ejection inspection sensor 80 is sent to the control unit 40.

[0047] As described above, in this embodiment, an electrical test is performed on the electronic component W by the probe 30 of the electronic component testing device element 42 of the electronic component testing device 30A.

[0048] In this embodiment, a heater (not shown) is installed inside the inclined surface 10a of the structure 10A. As described above, a probe heater 35 is also provided in the probe holder 31 of the electronic component testing apparatus element 42. Heaters (not shown) are also installed on the inner surface of the load track body 21 of the load track 20 and on the inner surface of the electronic component discharge body 50a of the electronic component discharge section 50.

[0049] Next, with reference to Figures 1A to 8, we will describe the load track 20 provided on the index table 11, the electronic component supply unit 15 that supplies electronic components W to the load track 20, and the supply feeder 18 that replenishes the electronic component supply unit 15 with electronic components W.

[0050] As shown in Figures 6 and 7, the load track 20 has a storage section 23 for storing electronic components W on the index table 11, and this storage section 23 has 8 columns corresponding to the 8 columns of pockets 12 on the index table 11.

[0051] In other words, the load track 20 has a load track body 21 and a plurality of wall surfaces 22 provided inside the load track body 21, and eight arc-shaped storage sections 23 are formed between the wall surfaces 22 of the load track 20. Electronic components W, which are stored in the pockets 12 of the corresponding column of the index table 11, are stored in each storage section 23.

[0052] In this case, since the index table 8 has eight rows of pockets 12 arranged in a circular pattern, the walls 22 of the load track 20 and the storage section 23 formed between the walls 22 are also configured in an arc shape, corresponding to the eight rows of pockets 12.

[0053] The electronic component supply unit 15 also has a partition plate (not shown) which is shaped like a flat fan, and an opening is formed at the base of the partition plate. The electronic component supply unit 15 rotates so that the electronic components W accumulated in the partition plate are supplied from the opening into the desired storage section 23 (see Figure 1A).

[0054] Furthermore, as shown in Figure 1A, a supply feeder 18 is connected to the electronic component supply unit 15 to replenish the electronic component W within the electronic component supply unit 15, and a supply amount detection sensor (not shown) is provided at the outlet of this supply feeder 18 to detect the amount of electronic component supplied. The electronic component W replenished into the electronic component supply unit 15 from the supply feeder 18 is fed from the electronic component supply unit 15 through the opening 15a into the desired storage section 23, so the supply amount detection sensor functions to detect the amount of electronic component W supplied from the electronic component supply unit 15 to the storage section 23.

[0055] Incidentally, each storage section 23 of the load track 20 is positioned within at least a 45-degree range downstream from the lower end 11A of the index table 11. In this embodiment, each storage section 23 is positioned over an angular range α1 of 90 to 110 degrees downstream from the lower end 11A of the index table 11 (see Figure 6). Here, "upstream side" or "downstream side" refers to the "upstream side" or "downstream side" along the rotation direction of the index table 11, which rotates clockwise, as described above in Figures 1A and 1B. Specifically, in Figure 6, the index table 11 rotates clockwise from the "upstream side" to the "downstream side".

[0056] The load track 20 may be provided with an electronic component detection unit 25 that detects whether or not an electronic component W is stored in the pocket 12 at any position within an angular range α2 of 10 to 20 degrees downstream from the lower end 11A of the index table 11, in this embodiment, at a position of 15 degrees downstream from the lower end 11A of the index table 11.

[0057] The electronic component detection unit 25 provided on the road track 20 is provided in accordance with each storage section 23 as described above, and this electronic component detection unit 25 consists of either a transmissive sensor that emits light from a light-emitting unit on the back side and receives the light with a light-receiving sensor on the front side to detect the electronic component W in the pocket 12, or a reflective sensor that emits light from the front side onto the electronic component W in the pocket 12 and detects the reflected light from the electronic component W.

[0058] Incidentally, among the components mentioned above, the index table 11 that transports the electronic component W is made of synthetic resin, for example, and consists of a component that is relatively prone to thermal expansion.

[0059] On the other hand, the probe holder 31 of the electronic component testing apparatus 30A, the load track body 21, and the electronic component discharge body 50a of the electronic component discharge section 50 are all made of metal material, and are made of a material that is relatively resistant to thermal expansion, such as Invar material or Photoveil material (registered trademark).

[0060] Next, the load track 20 will be described further with reference to Figures 2 to 5B. The entire surface of the load track 20 is covered by a load track cover 27, as will be described later. A contact sensor 60 for detecting electronic components W protruding from the pocket 12 of the index table 11 toward the load track 20 is located downstream of the load track 20, and this contact sensor 60 is held in place by the load track cover 27. Furthermore, an air outlet 75 is provided on the base 10a downstream of the contact sensor 60, which, based on a signal from the contact sensor 60, is used by the control unit 40 to blow air at the electronic components W protruding from the pocket 12 and blow the electronic components W into the storage section 23.

[0061] Furthermore, the road track 20 is equipped with an air ejection inspection sensor 80 located further downstream of the air ejection port 75, which detects whether or not the electronic component W has been reliably blown away by the air ejected from the air ejection port 75.

[0062] Furthermore, a brush 90 is provided on the upstream side of the contact sensor 60 of the road track 20 to scrape down electronic components W protruding from the pocket 12 towards the road track 20 into the storage section 23.

[0063] In this embodiment, the road track 20 has a road track body 21 and a wall surface 22 provided on the road track body 21 that forms a storage section 23 (see Figure 8). The road track body 21 has an arc-shaped opening 21A, and the entire surface of the road track 20 is covered by a road track cover 27 (Figures 3A and 3B). The contact sensor 60, air outlet 75, and brush 90 described above are positioned in the road track body 21 corresponding to the opening 21A.

[0064] Next, we will describe the contact sensors 60 that detect electronic components W protruding from the pockets 12 of the index table 11 toward the load track 20. There are eight of these contact sensors 60, corresponding to the eight rows of pockets 12 in the index table 11. The eight contact sensors 60 have substantially the same structure. That is, as shown in Figures 3A and 3B, each contact sensor 60 is provided on the load track cover 27 that covers the load track 20.

[0065] In other words, each contact sensor 60 has a swinging body 63 that is provided on the road track cover 27 and is swingable around a rotation axis 62, and a contact pin 61 that is attached to the swinging body 63 and contacts an electronic component W that protrudes from the pocket 12 of the index table 11 toward the road track 20.

[0066] When an electronic component W protrudes from a pocket 12 of the index table 11, a contact pin 61 makes contact with the protruding electronic component W, causing the oscillating body 63 to oscillate around the rotation axis 62 until it is tilted upward from a horizontal position (see Figures 3A and 3B). At this time, a detection pin 64 provided on the oscillating body 63 moves away from the proximity switch 65, detecting that the electronic component W has protruded from the pocket 12.

[0067] Subsequently, when the electronic component W separates from the contact pin 61, the oscillating body 63 returns to its original horizontal position due to the force of the spring 69 (see Figure 3A).

[0068] Here, Figure 2 shows the road track 20 with the road track cover 27 removed for convenience, and Figures 3A and 3B are cross-sectional views of Figure 2 in the direction of line III.

[0069] Furthermore, as shown in Figures 3A and 3B, the base 10a is provided with an air outlet 75 located downstream of the contact sensor 60 (above Figures 3 and 3B) that blows air onto the electronic component W protruding from the pocket 12 based on a signal from the contact sensor 60, blowing the electronic component W into the storage section 23.

[0070] As shown in Figures 3A and 3B, an air outlet 75 is provided on the base 10a at a position corresponding to the pocket 12, and an air ejection means 76 is connected to this air outlet 75 via an air pipe 77. In this embodiment, a signal from the contact sensor 60 is sent to the control unit 40, which determines that the electronic component W is protruding from the pocket 12 toward the road track 20. At this time, the control unit 40 drives the air ejection means 76 to eject air from the air outlet 75 via the air pipe 77, thereby blowing away the electronic component W protruding from the pocket 12 and discharging it into the storage section 23.

[0071] In Figures 3A and 3B, a fixing body 79 is provided on the back surface of the base 10a, and the air pipe 77 is held in place by an air pipe holder 78 fixed to this fixing body 79.

[0072] Furthermore, the brushes 90 are located upstream of the contact sensor 60 on the load track 20, and these brushes 90 scrape off electronic components W protruding from the pockets 12 towards the load track 20 into the storage section 23. As shown in Figures 5A and 5B, eight brushes 90 are provided, corresponding to the eight rows of pockets 12 on the index table 11, and are specifically attached by a load track cover 27 that covers the surface of the load track 20.

[0073] The eight brushes 90 are held together by a brush holder 91, and the brush holder 91 is movable together by a cylinder 93 in the radial direction of Figure 2 (vertical direction of Figure 5A).

[0074] Furthermore, the movement of the brush holder 91 is restricted by a stopper screw 95. This stopper screw 95 is secured by a fastener 96 that is fixed to the road track body 21 of the road track 20.

[0075] Next, the operation of this embodiment, which has the above configuration, will be explained using the flowchart in Figure 10.

[0076] First, electronic components W, such as capacitors, in the electronic component supply unit 15 are supplied to a desired storage section 23 of the road track 20, and the electronic components W in each storage section 23 are stored within that storage section 23.

[0077] During this time, the index table 11 rotates clockwise one pitch at a time across the pockets 12, and the electronic components W stored in the storage section 23 are placed into each pocket 12 of the index table 11. In this case, since suction holes (not shown) are provided on the inclined surface (base) 10a located on the back side of the index table 11, the electronic components W in the storage section 23 are attracted by the suction holes on the inclined surface 10a and placed into each pocket 12 of the index table 11.

[0078] When electronic components W are supplied from the electronic component supply unit 15 into each storage section 23, the electronic components W are introduced into the storage section 23 from above, and the electronic components W introduced into the storage section 23 fall due to gravity and are stored in the lower part of each storage section 23.

[0079] As electronic components W are fed into each storage section 23 from the electronic component supply unit 15, the index table 11 rotates intermittently clockwise, as shown in Figures 1A and 1B. As a result, the electronic components W in each storage section 23 are stored in clumps centered around a position 15 degrees downstream from the lower end 11A of the index table 11, due to frictional force with the index table 11. The number of electronic components W stored in clumps in each storage section 23 is maximized at a position 15 degrees downstream from the lower end 11A, and the number of electronic components W gradually decreases to a position 45 degrees downstream, and similarly gradually decreases towards the lower end 11A upstream of the index table 11.

[0080] Thus, the number of electronic components W within each storage section 23 forms a mountain shape centered at a position 15 degrees downstream from the lower end 11A, with the number of electronic components W gradually decreasing down to a position 45 degrees downstream, and similarly gradually decreasing up to the lower end 11A upstream.

[0081] According to this embodiment, the number of electronic components W in each storage section 23 forms a mountain shape centered at a position 15 degrees downstream from the lower end 11A of the index table 11, and the electronic components W are distributed from a position 45 degrees downstream from the lower end 11A to the lower end 11A. Therefore, in the range from a position 45 degrees downstream from the lower end 11A to the lower end 11A, the electronic components W are stored in the pockets 12 of the index table 11.

[0082] In this embodiment, the load track 20 is provided with an electronic component detection unit 25 corresponding to each storage section 23, within an angular range α2 of 10 to 20 degrees downstream from the lower end 11A of the index table 11, preferably at a position of 15 degrees downstream from the lower end 11A. Therefore, the electronic component detection unit 25 can detect whether or not an electronic component W is stored in the pocket 12 at the set position of the electronic component detection unit 25.

[0083] By detecting the presence or absence of electronic components W in the pocket 12 using the electronic component detection unit 25, the appropriate amount of electronic components W can be supplied into the load track 20, as described later, ensuring that electronic components W are reliably supplied into the pocket 12.

[0084] In this way, the electronic components W in each storage section 23 are sequentially stored in the pockets 12 of the index table 11.

[0085] During this time, if the electronic components W are properly stored in the pockets 12 of the index table 11, then the electronic component testing device element 42 of the electronic component testing device 30A in the subsequent process can properly perform electronic component testing on the electronic components W.

[0086] On the other hand, if the electronic component W in the pocket 12 protrudes toward the road track 20, it is possible that the electronic component W may come into contact with the electronic component testing device 30A, as described later.

[0087] Specifically, the electronic component testing apparatus 30A includes an electronic component testing apparatus cover 41 that covers 12 electronic component testing apparatus elements 42, and a protective plate 43 for protecting the electronic components W is provided on the inner surface of this electronic component testing apparatus cover 41 (see Figures 1B and 4A to 4B).

[0088] In this embodiment, if the electronic component W in the pocket 12 protrudes toward the road track 20, the electronic component W protruding from the pocket 12 may come into contact with the protective plate 43 provided on the inner surface of the electronic component test device cover 41. In this case, the electronic component W may be damaged or the protective plate 43 may be damaged.

[0089] In this embodiment, electronic components W protruding from the pocket 12 toward the load track 20 are first scraped off by a brush 90 that protrudes into the storage section 23 of the load track 20 and fall into the storage section 23. In this case, the brush 90 corresponds to the eight rows of pockets 12 of the index table 11, and can scrape off electronic components W protruding from the pockets 12 of each row.

[0090] Next, when the electronic component W protruding from the pocket 12, which cannot be sufficiently scraped off by the brush 90, reaches the contact sensor 60, the electronic component W protruding from the pocket 12 makes contact with the contact pin 61. At this time, the oscillating body 63 that holds the contact pin 61 oscillates around the rotation axis 62 from a horizontal position (position shown in Figure 3A) to a position tilted upward (position shown in Figure 3B). At this time, the detection pin 64 provided on the oscillating body 63 moves away from the proximity switch 65, and the proximity switch 65 can detect that the electronic component W has protruded from the pocket 12.

[0091] In this embodiment, when the electronic component W protrudes 0.5 mm or more from the pocket 12, the electronic component W comes into contact with the contact pin 61, allowing the protruding state of the electronic component W to be detected.

[0092] Next, when the electronic component W separates from the contact pin 61, the oscillating body 63 returns to its original horizontal position due to the force of the spring (Figure 3A).

[0093] In Figure 3A, for convenience, the position perpendicular to the index table 11 is referred to as the horizontal position.

[0094] Next, when the proximity switch 65 of the contact sensor 60 detects that the electronic component W is protruding from the pocket 12, a signal from the proximity switch 65 is sent to the control unit 40, and the control unit 40 determines that the electronic component W is protruding from the pocket 12. The control unit 40 drives the air ejection means 76 and ejects air from the air nozzle 75 to blow the electronic component W protruding from the pocket 12 into the storage section 23 (see Figure 3C).

[0095] On the other hand, once the proximity switch 65 of the contact sensor 60 confirms that there is no abnormality in the electronic component W in the pocket 12, the electronic component W in the pocket 12 is transported to the electronic component testing device 30A, as described later, where an electrical test is performed on the electronic component W while applying an electrical load.

[0096] During this time, when the pocket 12 containing the protruding electronic component W reaches the ejection inspection sensor 80, the ejection inspection sensor 80 confirms whether the electronic component W protruding from the pocket 12 has been reliably blown into the storage section 23 by air from the air nozzle 75. If the ejection inspection sensor 80 confirms that the electronic component W protruding from the pocket 12 has been reliably blown into the storage section 23, the scraping action by the brush 90, the detection action of the electronic component W by the contact sensor 60, the air ejection action from the air nozzle 75, and the inspection action by the ejection inspection sensor 80 are repeated for the electronic component W in the pocket 12 of the index table 11.

[0097] On the other hand, if the ejection inspection sensor 80 cannot confirm that the electronic component W has been blown out of the pocket 12, the entire electronic component transport system 10 will stop.

[0098] Next, the electronic component W inserted from the load track 20 into the pocket 12 of the index table 11 is transported to the electronic component testing device 30A by the intermittent rotation of the index table 11.

[0099] In this embodiment, the index table 11 rotates in 100 equal increments. That is, the index table 11 rotates 3.6 degrees at a time and stops (1 step), and this operation is repeated sequentially.

[0100] After the index table 11 has operated for 50 steps, the electronic components W on the index table 11 reach the area of ​​the electronic component testing device 30A (an area of ​​approximately 180 degrees), and the index table 11 stops its intermittent rotation. At this time, the probe 30 of the electronic component testing device 30A performs an electrical test on all electronic components W within the area of ​​the electronic component testing device 30A (an area of ​​approximately 180 degrees) at once.

[0101] Alternatively, the probe 30 of the electronic component testing device 30A may first apply an electrical load to the electronic component W to cause a faulty electronic component W, and then perform an electrical test on the electronic component W using the probe 30.

[0102] Next, the electronic component W in the pocket 12 of the index table 11 is transported to the electronic component discharge section 50 as the index table 11 rotates intermittently. The electronic component W, which has been electrically tested by the probe 30, is discharged outwards from this electronic component discharge section 50.

[0103] Specifically, the electronic components W are sorted by the electronic component discharge unit 50 based on the results of electrical testing by the probe 30 and sent from the discharge path 51 to a predetermined recovery device 1.

[0104] In this case, first, the results of the electrical test performed by the probe 30 are sent from the electrical circuit 30a to the control unit 40. Based on these electrical test results, the control unit 40 performs air injection using an air injection mechanism (not shown) in the electronic component discharge unit 50, sending the electronic components W in the pockets 12 of the index table 11 to a predetermined recovery device 1 via the discharge path 51. In this embodiment, multiple recovery devices 1 are installed, for example, six units, for each sorting category of electronic components W that are sorted based on the results of the electrical test performed by the probe 30.

[0105] The electronic components W located in the pockets 12 of the index table 11 are sorted in the electronic component discharge section 50 and sent to a predetermined recovery device 1 via the discharge path 51.

[0106] As described above, according to this embodiment, if an electronic component W that has been placed in the pocket 12 of the index table 11 from the storage section 23 of the load track 20 protrudes from the pocket 12 toward the load track 20, the protruding electronic component W can first be scraped off by the brush 90 and dropped into the storage section 23. In this embodiment, the brush 90 is made of synthetic resin fibers, and therefore the electronic component W can be easily and simply removed from the pocket 12 by the brush 90, which has a simple structure.

[0107] Furthermore, any electronic components W that protrude from the pocket 12 and cannot be sufficiently scraped off by the brush 90 subsequently come into contact with the contact pins 61 of the contact sensor 60, allowing the contact sensor 60 to detect that the components are protruding from the pocket 12. Based on this signal from the contact sensor 60, the control unit 40 drives the air ejection means 76, which ejects air from the air nozzle 75 to blow the electronic components W out of the pocket 12 into the storage section 23.

[0108] Furthermore, the ejection inspection sensor 80 can confirm that the electronic component W has been blown out of the pocket 12 by the air from the air outlet 75.

[0109] In this embodiment, the electronic component W blown out of pocket 12 by air from air outlet 75 falls into storage section 23 through the gaps between contact pins 61 of contact sensor 60 and the gaps between brushes 90. Next, as the index table 11 rotates, the electronic component W that has fallen into storage section 23 is put back into the next pocket 12 of the index table 11.

[0110] In this manner, the electronic component W protruding from the pocket 12 of the index table 11 toward the load track 20 is removed from the pocket 12 and falls toward the storage section 23. As a result, the electronic component W protruding from the pocket 12 as the index table 11 rotates does not come into contact with the protective plate 43 provided on the inner surface of the electronic component test device cover 41 of the electronic component test device 30A. Consequently, the electronic component W and the protective plate 43 are not damaged (see Figure 4A).

[0111] In other words, if an electronic component W in the pocket 12 of the index table 11 does not fit into the pocket 12 and protrudes toward the load track 20, it is possible that the electronic component W protruding from the pocket 12 as the index table 11 rotates may come into contact with a protective plate 43 provided on the inner surface of the electronic component test device cover 41 of the electronic component test device 30A (see Figure 4B).

[0112] According to this embodiment, the electronic components W protruding from the pocket 12 toward the road track 20 are scraped off by the brush 90 or blown into the storage section 23 by air from the air outlet 75, so that the electronic components W protruding from the pocket 12 as the index table 11 rotates do not come into contact with the protective plate 43 of the electronic component testing device 30A.

[0113] Incidentally, as described above, the storage section 23 of the road track 20 has an angle range of 90 to 110 degrees downstream from the lower end 11A of the index table 11. The contact sensor 60 and the air nozzle 75 are located within an angle range of 15 to 30 degrees upstream from the downstream end of the storage section 23. Furthermore, an ejection inspection sensor 80 is provided further downstream of the air nozzle 75.

[0114] By concentrating the contact sensor 60 and air nozzle 75 on the downstream side of the storage section 23 of the road track 20 in this manner, the contact sensor 60 can detect the protruding state of the electronic component W in the pockets 12 located in a wide angular range (for example, 60 to 95 degrees) upstream of the contact sensor 60 in the storage section 23 of the road track 20, and the air from the air nozzle 75 can blow away the electronic component W. This ensures reliable detection of the electronic component W protruding from the pockets 12 located in a wide angular range upstream of the contact sensor 60, and by blowing it away from the pockets 12, damage to the electronic component W and damage to the protective plate 43 can be reliably prevented. [Explanation of Symbols]

[0115] 1. Recovery device 10 Electronic component transport systems 10A Structure 10a Inclined surface (base) 11 Index Table 11a Rotary shaft 12 pockets 15. Electronic Components Supply Department 18 Supply feeder 20 Road Track 21 Road Track Body 22 Wall surface 23 Storage Section 25 Electronic component detection unit 27 Road Track Cover 30 probes 30A Electronic Component Testing Equipment 30A electrical circuit 31 Probe holder 32a, 32b, 32c, 32d Probe holder body 33a, 33b Sheet material 35. Heater for probe 36 electrodes 36A electrode part 37 Electrode holder 38. Heater for probe 40 Control Unit 41 Electronic component test equipment cover 42 Electronic component testing equipment elements 43 Protective plate 50 Electronic component discharge section 51 Emission Routes 60 Contact Sensors 61 Contact pins 62 Rotation axis 63 Oscillating body 64 detection pins 65 Proximity Switch 75 Air outlet 76 Air ejection means 80 Spray Inspection Sensor 90 brushes 91 Brush holder 93 cubic W Electronic Components

Claims

1. Bass and, A disc-shaped index table is rotatably mounted on the base and has multiple pockets arranged around its circumference, each housing an electronic component. The system includes a road track provided on the index table, corresponding to the pockets, and having an arc-shaped storage section for storing the electronic components, An electronic component transport system comprising: a contact sensor for detecting the electronic component protruding from the pocket toward the road track side; and an air nozzle on the base downstream of the contact sensor for blowing air onto the protruding electronic component based on the signal from the contact sensor and blowing it into the storage section.

2. The electronic component transport system according to claim 1, further comprising an electronic component testing device for performing electrical measurements on the aforementioned electronic component.

3. The electronic component transport system according to claim 1 or 2, wherein the contact sensor is provided on a road track cover that covers the road track, and the contact sensor has a contact pin that contacts the electronic component, a oscillating body that holds the contact pin and rotates around a rotation axis, and a proximity sensor that detects the rotation of the oscillating body.

4. The electronic component transport system according to claim 1, wherein a ejection inspection sensor is provided downstream of the air nozzle to detect whether or not the electronic component has been blown away by the air nozzle.

5. The electronic component transport system according to claim 1, further comprising a brush for scraping off the electronic component protruding from the pocket toward the road track into the storage section.

6. The electronic component transport system according to claim 5, wherein the brush is provided upstream of the contact sensor.

7. The electronic component transport system according to claim 1, wherein the storage section of the road track has an angular range of 90 to 110 degrees from the upstream end to the downstream end, and the contact sensor and the air nozzle are located within an angular range of 15 to 30 degrees from the downstream end of the storage section of the road track toward the upstream side.

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