Enhanced control using AI in devices with IR camera heat detection systems

Abstract

A method for bonding electronic components to electronic boards in an apparatus includes: (1) transporting the electronic boards through a chamber housing having a tunnel penetrating a plurality of processing zones; (2) detecting the temperature of the electronic boards passing in close proximity with a thermal detection system having at least one temperature sensor coupled to the chamber housing; (3) receiving temperature data from the thermal detection system using a controller coupled to the plurality of processing zones, the conveyor, and the thermal detection system; (4) the controller determining, in relation to the detected temperature of the electronic boards, adjustments to at least one of (a) a heat setting of a heating element in the chamber housing, (b) a speed of the conveyor, and (c) an operating speed of a blower in the chamber housing; and (5) implementing the determined adjustments.

Description

[Technical Field]

[0001] This application relates generally to the surface mounting of electronic components to printed circuit boards by utilizing assembly processes such as reflow, wave soldering, and / or selective soldering processes, and more particularly to devices designed to control the heat applied to printed circuit boards during the assembly process. [Background technology]

[0002] In the manufacture of printed circuit boards, electronic components are often surface mounted to bare boards by a process known as "reflow soldering." In a typical reflow soldering process, a pattern of solder paste is deposited on a circuit board, and the leads of one or more electronic components are inserted into the deposited solder paste. The circuit board is then passed through an oven, where the solder paste is reflowed (i.e., heated to a melting or reflow temperature) in a heated zone and then cooled in a cooling zone, electrically and mechanically connecting the leads of the electronic components to the circuit board. The terms "circuit board" or "printed circuit board," as used herein, include any type of substrate assembly of electronic components, including, for example, wafer substrates.

[0003] As mentioned above, modern reflow ovens have a heating chamber and a cooling chamber. To achieve a consistent reflow process profile, the heat applied to the electronic components and circuit board is precisely controlled to ensure proper mechanical and electrical connection of the electronic components to the circuit board.

[0004] Additionally, in the manufacture of printed circuit boards, electronic components can be mounted to the circuit boards by a process known as "wave soldering." In a typical wave soldering machine, a circuit board is moved up a ramp by a conveyor, passing through a fluxing station, a preheating station, and finally a wave soldering station. At the wave soldering station, a wave of solder is ejected upward (by a pump) through a wave solder nozzle and contacts the portion of the printed circuit board to be soldered. Like reflow ovens, wave soldering machines (and selective soldering machines) require precise control of the heat in each zone to ensure proper mechanical and electrical connection of the electronic components to the circuit board.

[0005] For both reflow ovens and wave (and selective) solder machines, controlling heat in each equipment zone is critical for optimal performance. For example, unwanted temperature fluctuations can cause warping of the circuit board and unreliable connections between electronic components and the circuit board. Summary of the Invention

[0006] One aspect of the present disclosure relates to a reflow oven configured to bond electronic components to electronic substrates. In one embodiment, the reflow oven includes a chamber housing having a tunnel penetrating multiple processing zones, a conveyor configured to transport the electronic substrates in the tunnel through the multiple processing zones, and a thermal detection system including at least one temperature sensor coupled to the chamber housing. The at least one temperature sensor is configured to detect the temperature of the electronic substrates passing in close proximity to the at least one temperature sensor. The reflow oven further includes a controller coupled to the multiple processing zones, the conveyor, and the thermal detection system. The controller is configured to receive temperature data from the thermal detection system.

[0007] The reflow oven embodiment may further include the at least one temperature sensor having at least one sensor assembly. The at least one sensor assembly may include a support structure, a support bracket coupled to the support structure, and an IR camera secured to the support bracket. The support structure may include a shroud mounted on the mounting plate. The shroud may be configured to surround an opening in the top of the tunnel to enable the IR camera to sense the temperature of the tunnel. The support bracket may include a port for connecting to an inert gas source. The support bracket may include a glass cover to protect the IR camera. The support bracket may be configured to mount the IR camera at the top of the tunnel at a desired height and orientation to achieve a complete field of view. The at least one sensor assembly may include multiple IR cameras to measure two or more distinct selected locations within the tunnel. The thermal detection system may be configured with the controller to provide closed-loop control of zone temperatures of the multiple processing zones using the sensor assemblies. The at least one sensor assembly can be configured to acquire temperature data within a particular processing zone of the reflow soldering oven at a specific electronic board level. The temperature data can be used to provide electronic board traceability, where data regarding a specific electronic board is provided on a display associated with the controller. The temperature data can be used to locate hot spot zones / levels within the reflow soldering oven. The temperature data can be used to optimize performance of the reflow soldering oven, and / or provide downstream input for processing equipment, and / or determine start and end times for scans performed by the at least one sensor assembly on an electronic board, and / or generate electronic board profiles above and below the electronic board. The closed-loop control can include controlling the speed of the conveyor within the multiple processing zones.The electronic boards can each include a barcode that is scanned by a barcode scanner, and the controller can be configured to implement a scan mode to measure temperatures of components on the electronic boards as they move on the conveyor through the reflow soldering oven.

[0008] Another aspect of the present disclosure relates to a method for joining electronic components to electronic substrates in a reflow oven. In one embodiment, the method includes transporting an electronic substrate through a chamber housing having a tunnel passing through a plurality of processing zones, detecting a temperature of the electronic substrate passing proximate to a thermal detection system having at least one temperature sensor coupled to the chamber housing, and receiving temperature data from the thermal detection system using a controller coupled to the plurality of processing zones, the conveyor, and the thermal detection system.

[0009] Embodiments of the method may further include scanning a barcode associated with each board with a barcode scanner and / or controlling the reflow soldering oven to implement a scan mode that measures temperatures of components on the electronic boards as the electronic boards move on the conveyor through the reflow soldering oven. The thermal detection system may be configured with the controller to provide closed-loop control of zone temperatures of the multiple processing zones using the sensor assemblies. The at least one sensor assembly may be configured to acquire temperature data within a particular processing zone of the reflow soldering oven at a specific electronic board level location. The temperature data may be used to provide electronic board traceability, where data regarding a specific electronic board is provided on a display associated with the controller. The temperature data may be used to locate hot spot zones / levels within the reflow soldering oven. The temperature data may be used to optimize performance of the reflow soldering oven and / or provide downstream input for processing equipment and / or determine start and end times for scans performed by the at least one sensor assembly on an electronic board and / or generate electronic board profiles above and below the electronic board. The closed-loop control can include controlling a speed of the conveyor within the plurality of processing zones. The method can further include scanning a barcode associated with each board with a barcode scanner. The method can further include controlling the reflow soldering oven to implement a scan mode that measures temperatures of components on the electronic board as the electronic board moves on the conveyor through the reflow soldering oven.

[0010] Yet another aspect of the present disclosure relates to a wave soldering machine or selective soldering machine configured to bond electronic components to electronic boards. In one embodiment, the reflow oven includes a chamber housing with a tunnel penetrating multiple processing zones, a conveyor configured to transport electronic boards in the tunnel through the multiple processing zones, and a thermal detection system including at least one temperature sensor coupled to the chamber housing. The at least one temperature sensor is configured to detect the temperature of the electronic board passing in close proximity to the at least one temperature sensor. The wave soldering machine or selective soldering machine further includes a controller coupled to the multiple processing zones, the conveyor, and the thermal detection system. The controller is configured to receive temperature data from the thermal detection system. The at least one temperature sensor can include at least one sensor assembly. The at least one sensor assembly can include a support structure, a support bracket coupled to the support structure, and an IR camera secured to the support bracket. The support structure can include a mounting plate positioned on top of the tunnel and a shroud attached to the mounting plate. The shroud can be configured to surround an opening in the mounting plate to enable the IR camera to sense the temperature of the tunnel. The support bracket can include a port for connection to an inert gas source. The support bracket can include a glass cover to protect the IR camera. The support bracket can be configured to mount the IR camera at the top of the tunnel at a desired height and orientation to achieve a complete field of view. The at least one sensor assembly can include multiple IR cameras to measure two or more distinct selected locations within the tunnel. The heat detection system can be configured with the controller to provide closed-loop control of zone temperatures of the multiple processing zones using the at least one sensor assembly.The at least one sensor assembly can be configured to acquire temperature data within a particular processing zone of the reflow soldering furnace at a specific electronic board level. The temperature data can be used to provide electronic board traceability, where data regarding a specific electronic board is provided on a display associated with the controller. The temperature data can be used to identify hot spot zones / levels within the wave soldering machine or selective soldering machine. The temperature data can be used to optimize performance of the wave soldering machine or selective soldering machine, provide downstream input for processing equipment, determine start and end times for scans performed by the at least one sensor assembly on the electronic board, and / or generate electronic board profiles above and below the electronic board. The closed-loop control can include controlling the speed of the conveyor within the multiple processing zones. Each electronic board can have a barcode that is scanned by a barcode scanner. The controller can be configured to implement a scan mode to measure temperatures of components on the electronic board as the electronic board moves on the conveyor through the wave soldering machine or selective soldering machine.

[0011] Another aspect of the present disclosure relates to a method for joining electronic components to electronic substrates in a wave or selective solder machine. In one embodiment, the method includes transporting an electronic substrate through a chamber housing having a tunnel passing through a plurality of processing zones, detecting a temperature of the electronic substrate passing proximate a thermal detection system having at least one temperature sensor coupled to the chamber housing, and receiving temperature data from the thermal detection system using a controller coupled to the plurality of processing zones, the conveyor, and the thermal detection system.

[0012] Embodiments of the method may further include scanning a barcode associated with each board with a barcode scanner and / or controlling the machine to implement a scan mode that measures the temperature of components on the electronic board as the electronic board moves on the conveyor through the machine. The thermal detection system may be configured with the controller to provide closed-loop control of zone temperatures of the multiple processing zones using the sensor assemblies. The at least one sensor assembly may be configured to acquire temperature data within a particular processing zone of the machine at a specific electronic board level location. The temperature data may be used to provide electronic board traceability, where data regarding a specific electronic board is provided on a display associated with the controller. The temperature data may be used to find hot spot zones / levels within the machine. The temperature data may be used to optimize performance of the machine and / or provide downstream input for processing equipment and / or determine start and end times for scans performed by the at least one sensor assembly on an electronic board and / or generate electronic board profiles above and below the electronic board. The closed-loop control may include controlling the speed of the conveyor within the multiple processing zones.

[0013] Another aspect of the present disclosure relates to an apparatus configured to bond electronic components to electronic substrates. In one embodiment, the apparatus includes a chamber housing having a tunnel extending through multiple processing zones, a conveyor configured to transport electronic substrates in the tunnel through the multiple processing zones, and a thermal detection system including at least one temperature sensor coupled to the chamber housing. The at least one temperature sensor is configured to detect the temperature of the electronic substrates passing in close proximity to the at least one temperature sensor. The apparatus further includes a controller coupled to the multiple processing zones, the conveyor, and the thermal detection system. The controller is configured to receive temperature data from the thermal detection system.

[0014] Yet another aspect of the present disclosure relates to a method for bonding electronic components to electronic substrates in an apparatus, in one embodiment, the method includes transporting an electronic substrate through a chamber housing having a tunnel passing through a plurality of processing zones, detecting a temperature of the electronic substrate passing proximate a thermal detection system having at least one temperature sensor coupled to the chamber housing, and receiving temperature data from the thermal detection system using a controller coupled to the plurality of processing zones, the conveyor, and the thermal detection system.

[0015] Another aspect of the present disclosure relates to a method for bonding electronic components to electronic substrates in an apparatus. In one embodiment, the method includes: (1) transporting an electronic substrate through a chamber housing having a tunnel penetrating multiple processing zones; (2) detecting the temperature of the electronic substrate passing proximate to a thermal detection system having at least one temperature sensor coupled to the chamber housing; (3) receiving temperature data from the thermal detection system using a controller coupled to the multiple processing zones, the conveyor, and the thermal detection system; (4) the controller determining, in relation to the detected temperature of the electronic substrate, adjustments to at least one of: (a) a heat setting of a heating element in the chamber housing; (b) a speed of the conveyor; and (c) an operating speed of a blower in the chamber housing; and (5) implementing the determined adjustments. Yet another aspect of the present disclosure relates to a corresponding apparatus. Yet another aspect of the present disclosure relates to a corresponding computer program product.

[0016] The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component shown in each figure is represented by a like reference numeral. For purposes of clarity, not every component may be labeled in every drawing. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. 1 is a perspective view of a reflow soldering furnace according to one embodiment of the present disclosure. [Figure 2] FIG. 2 is a schematic diagram of the reflow soldering furnace shown in FIG. [Figure 3] 1 is a perspective view of a portion of a reflow soldering furnace illustrating a thermal detection system according to one embodiment of the present disclosure. [Figure 4] FIG. 4 is a perspective view of an IR camera assembly of the thermal detection system shown in FIG. 3. [Figure 5] FIG. 1 is a perspective view of an IR camera assembly mounted on the top wall of a tunnel in a reflow soldering furnace. [Figure 6] FIG. 10 is a perspective view of an IR camera mounted on a gantry of another embodiment of a thermal detection system. [Figure 7] FIG. 1 is a schematic diagram of a wave soldering machine according to one embodiment of the present disclosure. [Figure 8] FIG. 2 is a side view of the wave solder machine with the outer packaging removed to reveal the internal components of the wave solder machine. [Figure 9] FIG. 1 is a perspective view of an IR camera assembly of a thermal detection system associated with a wave soldering machine. [Figure 10] FIG. 10 is a perspective view of the IR camera assembly shown in FIG. [Figure 11] 1A-1C are block diagrams illustrating systems, devices, computer program products, and associated data structures according to various embodiments of the present disclosure. [Figure 12] 1 is a flowchart illustrating a method according to various embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0018] Solder paste is routinely used in the assembly of printed circuit boards, where it is used to join electronic components to the circuit board. Solder paste includes solder for joint formation and flux for preparing the metal surface for solder attachment. Solder paste can be deposited onto metal surfaces (e.g., electronic pads) provided on the circuit board by using any number of application methods. In one example, a stencil printer may utilize a squeegee to force the solder paste through a metal stencil placed on the exposed circuit board surface. In another example, a dispenser may dispense the solder paste material onto specific areas of the circuit board. The leads of the electronic component are aligned with the solder deposit and stamped into it to form the assembly. In the reflow soldering process, the solder is then heated to a temperature sufficient to melt the solder and cooled to permanently bond the electronic component to the circuit board electrically and mechanically. Solder typically includes an alloy having a melting temperature lower than that of the metal surfaces being joined. Also, the temperature must be low enough so as not to cause damage to the electronic components. In certain embodiments, the solder may be a tin-lead alloy. However, solders utilizing lead-free materials may also be used.

[0019] Temperature control of the soldering process is very important. In one embodiment of the present disclosure, a thermal detection system having several infrared (IR) cameras is used to precisely measure the temperature of circuit boards in strategic locations in a reflow soldering oven. Information obtained from the IR cameras of the thermal detection system can be used to provide closed-loop control of the reflow oven to ensure proper connections between electronic components and circuit boards. Other types of temperature measurement devices can be utilized instead of IR cameras. For example, laser temperature sensors can be used as part of the thermal detection system. Furthermore, the techniques described herein can be used in other types of circuit board processing equipment, such as wave soldering machines and selective soldering machines, to achieve improved temperature control.

[0020] For purposes of illustration only, and not by way of limitation of generality, the present disclosure will now be described in detail with reference to the accompanying drawings. The present disclosure is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the drawings. The principles set forth in this disclosure are capable of other embodiments and of being practiced or carried out in various ways. Furthermore, the terminology and terminology used herein is for purposes of description and should not be regarded as limiting. The use of "including," "comprising," "having," "containing," "involving," and variations thereof herein is intended to encompass the previously listed items and equivalents thereof, as well as additional items.

[0021] Reflow Soldering Oven During the reflow process, the printed circuit board is heated according to a predetermined temperature profile for approximately 3 to 5 minutes. The complete assembly (including the board material, components, and solder paste) should reach the minimum reflow temperature but not overheat, which can damage the components and cause solder defects. To achieve this heating curve, reflow soldering ovens contain multiple heating and cooling zones. These zones direct hot or cold gases toward the circuit board. The gas temperature set points of these zones, combined with the conveyor speed, define the final heating profile of the circuit board assembly.

[0022] To ensure that a reflow soldering oven operates properly, thermocouples are attached to the printed circuit board to record the temperature of the circuit board over time. Thermocouples are placed on the hottest and hottest locations of the circuit board assembly and on critical components to ensure that the components do not overheat. Once the set points and conveyor speeds are determined to be within acceptable specifications, the oven includes controls and heat probes to maintain the zone temperatures within acceptable limits. During production, the circuit boards with thermocouples can be run through the reflow soldering oven to ensure that all predetermined conditions are still within acceptable specifications. A drawback of existing process controls is the lack of temperature control for the circuit board assembly during the reflow process. Inspection of the circuit board components and solder joints is performed after soldering, but is not verified during the time the circuit board is being heated.

[0023] Existing process controls involve maintaining zone temperatures and conditions within specifications using heat probes that measure gas temperatures but not the actual temperature at the circuit board assembly. Thermal profiling hardware is available with software tools to help define, measure, monitor, and improve thermal processes for electronic manufacturing services. These systems enable smarter reflow soldering ovens with better process control, resulting in fewer defects. Intelligent software makes changes to oven settings when necessary to ensure consistent board temperatures and solder quality.

[0024] Despite the intelligent systems and process controls of the reflow soldering oven, the actual temperature of the circuit board assembly is not verified during soldering. Implementing a thermal detection system that can capture a thermal image of the circuit board assembly during reflow would add value to process control to prevent component damage and reduce solder defects.

[0025] An embodiment of the present disclosure relates to a thermal detection system in which several IR camera assemblies are strategically positioned within a reflow soldering furnace to obtain closed-loop temperature control of the furnace. In one embodiment, the lenses of the IR camera assemblies are kept clean to enable accurate temperature images to be produced. The IR camera assemblies are equipped with a special chamber in front of the lens, which is purged with nitrogen to create an overpressure and prevent flux-contaminated gases from condensing on the lens. Another method disclosed herein to maintain clean lenses from flux residues is to have a transparent foil in front of the lens on a roll system. When the foil becomes contaminated, the roll is turned to reveal a new, clean, transparent spot. Additionally, the reflow soldering furnace can contain a catalyst to purify the gases within the zone.

[0026] An embodiment of the thermal detection system involves the use of thermal images that become part of a closed-loop system that controls the reflow process. Data from the thermal images is integrated into the intelligent control system of the reflow soldering oven. The camera can be a 3D thermal camera or a typical 2D camera. The data generated (temperatures of different areas, components, solder paste, and board materials) can be used for traceability and corrective action. There can be multiple cameras in the reflow process. A thermal image scan is a snapshot of the reflow process. However, if multiple cameras are installed, a collection of snapshots can be used to calculate critical process parameters such as time above liquidus and peak temperature. This data can be correlated to defect levels, and preventative action can be sent to a printer, dispenser, or pick-and-place machine to make any necessary changes.

[0027] The image scan can also signal deviations, allowing the reflow soldering oven to respond accordingly. If the temperature is too low or too high, various actions can be taken, such as changing the conveyor speed or adjusting the fan speed of one or more heating zones to increase or decrease heat transfer. Other ways to make temperature corrections include temporarily stopping the circuit board to allow for a higher temperature, or forcing the circuit board through a zone to achieve a shorter heating time when the circuit board is too hot. These minor corrections require free space between the circuit boards. If the board is too cold, an IR lamp can be installed in the zone behind the scanner to heat that particular circuit board more quickly to bring it within specifications. The oven transport tracking system should track the position of the circuit board within the reflow soldering oven so that scanning occurs at the appropriate moment. Typically, the conveyor has an encoder or other device that controls the speed and defines the position of the circuit board. In one embodiment, an additional sensor can be installed near the scanner to locate the circuit board. The circuit board may be configured with a bar code, RFID tag, or some other type of identification traceability.

[0028] Embodiments of the thermal detection system are configured to acquire image scans to indicate component alignment during the reflow process and analyze component movement defects. For example, if multiple scanners are present in a reflow soldering oven, positions within the reflow soldering oven can be defined by where the component moves, which can help avoid this type of defect. Further action can include replacing fans or reducing fan speed in specific zones of the oven.

[0029] Embodiments of the thermal detection system are further configured to obtain a temperature profile of the circuit board at strategic points within the reflow soldering oven. This is more accurate than thermocouple profiling, which only returns the temperature of the probe. The probe location may not be the most critical point on the circuit board assembly, and second, thermocouple attachment is very important. While thermocouples may come loose after several runs, the IR camera maintains accuracy over time and is not limited by the number of samples, provided the lens remains clean.

[0030] One embodiment of an exemplary reflow soldering apparatus for soldering circuit board assemblies is shown in FIG. 1. Such an apparatus is sometimes referred to as a reflow oven or reflow soldering oven in the field of printed circuit board manufacturing and assembly. The reflow soldering oven is generally designated 10 in FIG. 1 and includes a reflow oven chamber 12 in the form of an insulated tunnel defining a passage for preheating, reflowing, and then cooling solder on a circuit board passing therethrough. The reflow oven chamber 12 extends across multiple heating zones, including, in one example, three preheat zones 14, 16, and 18, followed by three soak zones 20, 22, and 24, each equipped with a top heater 26 and a bottom heater 28, respectively. The soak zones 20, 22, and 24 are followed, for example, by four spike zones 30, 32, 34, and 36, also equipped with heaters 26 and 28. And finally, the spike zones 30, 32, 34, 36 are followed by three cooling zones 38, 40, 42. Other reflow soldering furnace configurations can be provided.

[0031] Circuit board assemblies 44, including deposited solder paste and electronic components, pass through each zone (e.g., from left to right in FIG. 1 ) of the insulated reflow furnace chamber 12 on a fixed-speed conveyor (shown in dashed lines at 46 in FIG. 1 ), allowing for progressive control of the preheating, reflow, and post-reflow cooling of the circuit board assemblies. It should be understood that the fixed-speed conveyor 46 can be divided between zones to embody a variable-speed conveyor. In the preliminary preheat zones 14, 16, 18, the board assemblies are heated from ambient temperature to a flux activation temperature, which can range from about 130°C to about 150°C for lead-based solders and can be higher for lead-free solders.

[0032] In the soak zones 20, 22, and 24, temperature fluctuations across the circuit board assembly stabilize, allowing time for the activated flux to clean the component leads, electronic pads, and solder powder prior to reflow. Additionally, VOCs in the flux are vaporized. Temperatures in the soak zones 20, 22, and 24 are typically between about 140°C and about 160°C for lead-based solders and higher for lead-free solders. In certain embodiments, the circuit board assembly can spend between about 30 seconds and about 45 seconds passing through the soak zones 20, 22, and 24.

[0033] In the spike zones 30, 32, 34, and 36, the temperature is quickly raised above the melting point of the solder to reflow the solder. The melting point of eutectic or near-eutectic tin-lead solder is approximately 183°C, and the reflow spike is typically set to about 25°C to about 50°C above the melting point to exceed the paste range of the molten solder. For lead-based solders, typical maximum temperatures in the spike zones are in the range of about 200°C to about 220°C. Temperatures above about 225°C can cause flux baking, potentially damaging components and / or compromising joint integrity. Temperatures below about 200°C can prevent the joint from fully reflowing. In one embodiment, the circuit board assembly is typically maintained above the reflow temperature in the spike zones 30, 32, 34, and 36 for about one minute.

[0034] Next, in the cooling zones 38, 40, 42, the temperature drops below the reflow temperature and the circuit board assembly is cooled sufficiently to solidify the joints and maintain joint integrity before the circuit board assembly leaves the reflow furnace chamber 12.

[0035] A flux extraction / filtration system (not shown) may be provided to remove contaminants from the gases generated by the reflow soldering furnace 10. In one embodiment, an input gas duct may be connected to or between selected zones to provide fluid communication from the reflow furnace chamber 12 to the flux extraction / filtration system. An output gas duct may be connected to or between selected zones to provide fluid communication from the flux extraction / filtration system back to the reflow furnace chamber 12. In operation, vapor flow is drawn from the reflow furnace chamber 12 through the input gas duct, through the system, and then through the output gas duct back to the reflow furnace chamber. Similar configurations of input gas duct, system, and output gas duct may likewise be positioned to draw vapor flow from or between other zones of the reflow soldering furnace 10.

[0036] The reflow soldering furnace 10 further includes a controller 50 that automates the operation of the several stations of the reflow soldering furnace in a known manner, including, but not limited to, the preheat zones 14, 16, 18, the soak zones 20, 22, 24, the spike zones 30, 32, 34, 36, and the top heaters 26 and bottom heaters 28 associated with the cool down zones 38, 40, 42. As shown, the controller 50 can include a display 52 that provides a user interface by which an operator of the reflow soldering machine 10 can control the operation of the machine.

[0037] In certain embodiments, the controller 50 can be configured to use a personal computer having a suitable operating system, such as the Microsoft Windows® operating system from Microsoft Corporation, along with application-specific software to control the operation of the reflow soldering oven 10. The controller 50 can be networked with a master controller used to control the production line for manufacturing the circuit boards. As described in more detail below, information obtained by the thermal detection system can be used by the controller 50 to optimize the performance of the reflow soldering oven 10. This optimization includes elimination of warpage and better, more reliable fixation of electronic components onto the circuit board assembly.

[0038] 3 , the reflow soldering furnace 10 includes a thermal detection system, generally designated 60, configured to detect heat within the furnace zones. In the illustrated embodiment, the thermal detection system 60 includes several, e.g., three, sensor assemblies, such as IR camera assemblies, each generally designated 62. In this example, a first IR camera assembly 62a is positioned between the third zone (preheat zone) and the fourth zone (soak zone) of the reflow soldering furnace 10, a second IR camera assembly 62b is positioned between the sixth zone (soak zone) and the seventh zone (spike zone), and a third IR camera assembly 62c is positioned between the ninth zone (spike zone) and the tenth zone (cool down zone). It should be understood that the IR camera assemblies 62 may be positioned anywhere within the reflow soldering furnace 10 to optimize the performance of the reflow soldering furnace.

[0039] Each IR camera assembly 62 is strategically positioned to measure the temperature of the circuit board assembly 44 as it passes between zones to ensure the circuit board assembly is properly conditioned prior to processing. Information obtained from each IR camera assembly 62 is communicated to the controller 50, which is configured to provide closed-loop processing of subsequent circuit board assemblies passing through the reflow soldering furnace 10.

[0040] 4 and 5 for a reflow soldering furnace application, each IR camera assembly 62 includes a shroud 64 mounted on a top wall 66 of the chamber 12 of the reflow soldering furnace 10. The shroud 64 is configured to extend through an opening formed in the top wall 66 of the chamber 12 to allow the IR camera assembly 62 to sense the temperature of the tunnel. The support structure further includes a support bracket 68 mounted on the shroud 64 at the top of the shroud. The support bracket 68 includes a port 70 for connecting to a nitrogen (N2) source to provide an inert atmosphere within the shroud 64. The support bracket 68 also includes an input port 72 for connecting a sensor to the support bracket.

[0041] The IR camera assembly 62 further includes a temperature sensor embodied as an IR camera 74, which is supported in an operational position by the support bracket 68. A cable 76 is secured to the input port 72 and connects the IR camera 74 to the controller 50. As described above, any type of temperature sensor may be utilized to measure the temperature of the circuit board assemblies moving through the tunnel (chamber 12) of the reflow soldering furnace 10. The IR camera 74 is configured to have a field of view directed through the shroud 64 toward the tunnel (chamber 12) of the reflow soldering furnace 10. This configuration is such that the IR camera 74 of the IR camera assembly 62 is configured to detect the temperature of the circuit board assemblies moving through the tunnel (chamber 12) of the reflow soldering furnace 10 and communicate this information to the controller 50. Data obtained from the thermal detection system 60 can be used for various purposes, which will be described in more detail below.

[0042] 6, an alternative embodiment of a sensor assembly is generally indicated at 80. As shown, sensor assembly 80 includes a gantry 82 and a temperature sensor embodying an IR camera 84 connected to the gantry and controller 50. In this configuration, gantry 82, under the control of controller 50, is configured to move IR camera 84 along the width of the tunnel (chamber 12) to acquire temperature data across the width of the printed circuit board assembly as it passes through reflow soldering furnace 10. Sensor assembly 80 may further include a shroud (not shown) to maintain IR camera 84 within an inert (clean) atmosphere.

[0043] Wave Soldering Machine In the wave soldering process, there are several process steps. There is a fluxing step in which the printed circuit board assembly is cleaned by spraying flux onto the solder side (bottom) of the printed circuit board assembly. After the flux is applied, the printed circuit board assembly is transferred to a preheating unit. The preheating unit can embody various concepts, such as convection or radiant heaters. The purpose is to heat the printed circuit board assembly to a predetermined temperature, typically measured on the solder destination side (top board). The preheater activates the flux, and the circuit board assembly is heated to a temperature high enough that the solder does not solidify until it reaches the top board. The printed circuit board assembly then enters the solder wave. The soldering process consists of a heated tank of solder maintained at the temperature required for the soldering process. Within the tank, a solder wave is set up, and the printed circuit board assembly passes over the solder wave so that the underside of the circuit board assembly contacts the solder wave.

[0044] The temperature of the circuit board assembly during preheating is typically measured using a pyrometer. This is usually done after the circuit board assembly has passed through the last preheat unit and just before entering the solder wave station. However, the pyrometer's spot is limited, so the data only covers one small area of ​​the entire board.

[0045] An embodiment of the thermal detection system having an IR camera can scan the entire printed circuit board assembly to obtain temperature data from the printed circuit board assembly.

[0046] An embodiment of the thermal detection system includes an IR camera in conjunction with the wave soldering machine, after the final preheat unit. Data provided by the IR camera can be used for closed-loop process control. If the IR camera is installed above the printed circuit board assemblies in the preheat unit, the IR camera can provide information to modify the unit's preheater so that a specified temperature is achieved for subsequent boards before they enter the wave soldering station. As a result, the printed circuit board assemblies can achieve an optimal temperature when they are soldered, thereby minimizing the risk of defects. Data is recorded and can be combined with board identification information (such as a barcode or RFID) for traceability, which can be correlated to defects during assembly or field failures.

[0047] Referring to FIG. 7 , an exemplary wave soldering machine is generally designated 100. Wave soldering machines are used to apply wave solder to printed circuit board assemblies. As mentioned above, the wave soldering machine 100 is one of several machines in a printed circuit board manufacturing / assembly line. As shown, the wave soldering machine 100 includes a housing or frame 102 adapted to house the machine's components. In this configuration, a conveyor 104 delivers printed circuit board assemblies 44 for processing by the wave soldering machine 100.

[0048] Each circuit board assembly 44 enters the wave soldering machine 100 and travels along a ramp (e.g., 6 degrees from horizontal) along a conveyor 104 through a tunnel 106. The wave soldering machine 100 includes a fluxing station, generally indicated at 108, and a preheating station, generally indicated at 110, for conditioning the printed circuit board assembly for wave soldering. Once conditioned (i.e., heated), the circuit board assembly 44 travels along the conveyor 104 to a wave soldering station (generally indicated at 112), which applies solder material to the printed circuit board assembly. A controller 114 is provided for automating the operation of several stations of the wave soldering machine 100, including, but not limited to, the fluxing station 108, the preheating station 110, and the wave soldering station 112, in a known manner.

[0049] Like the controller 50 associated with the reflow soldering oven 10, the controller 114 for the wave soldering machine 100 can be configured to use a personal computer having a suitable operating system, such as the Microsoft Windows® operating system from Microsoft Corporation, along with application-specific software to control the operation of the wave soldering machine. The controller 114 can be networked with a master controller used to control the production line for manufacturing circuit boards. As with the reflow soldering oven 10, information obtained by the thermal detection system can be used by the controller 114 to optimize the performance of the wave soldering machine 100. This optimization includes elimination of warpage and better, more reliable fixation of electronic components onto circuit board assemblies.

[0050] Referring to FIG. 8 , the flux application station 108 is configured to apply flux to printed circuit board assemblies moving on the conveyor 104 through the wave soldering machine 100. The preheating station 110 includes several preheaters (e.g., preheaters 110a, 110b, and 110c) designed to gradually increase the temperature of printed circuit board assemblies moving through the tunnel 106 and along the conveyor 104 to prepare the printed circuit board assemblies for the wave soldering process. The wave soldering station 112 includes a wave solder nozzle assembly in fluid communication with a reservoir of solder material. A pump is provided within the reservoir to deliver molten solder material from the reservoir to the wave solder nozzle assembly. Once soldered, the printed circuit board assemblies exit the wave soldering machine 100 via the conveyor 104 to another station in the manufacturing line, such as a pick-and-place machine.

[0051] In some embodiments, the wave soldering machine 100 can further include a flux management system, generally designated 116, that removes volatile contaminants from the tunnel 106 of the wave soldering machine. As shown in FIG. 2, the flux management system 116 is located below the preheat station 110. In one embodiment, the flux management system 116 is supported by the housing 102 within the wave soldering machine 100 and is in fluid communication with the tunnel 106, which is shown schematically in FIG. 2. The flux management system 116 is configured to receive contaminated gas from the tunnel 106, treat the gas, and return clean gas to the tunnel. The flux management system 116 is particularly configured to remove volatile contaminants from the gas, particularly in an inert atmosphere.

[0052] 9 and 10, the wave soldering machine 100 includes a thermal detection system configured to detect heat within zones of the machine, for example, between the preheat station 110 and the wave soldering station 112. The thermal detection system includes a sensor assembly embodying an IR camera assembly, generally designated 120. The IR camera assembly is strategically positioned to measure the temperature of the circuit board assembly 44 as it passes between the zones to ensure that the circuit board assembly is properly conditioned prior to processing. Information obtained from the IR camera assembly 120 is communicated to a controller 114, which is configured to provide closed-loop processing of subsequent circuit board assemblies passing through the wave soldering machine 100.

[0053] For wave soldering machine applications, the IR camera assembly 120 includes a support structure having a mounting plate 122 positioned on top of the tunnel 106 of the wave soldering machine 100 and a shroud 124 mounted on the mounting plate. The shroud 124 is configured to surround an opening in the mounting plate 122 to enable the IR camera assembly to sense the temperature of the tunnel 106. The support structure further includes a support bracket 126 mounted on the shroud 124 at the top of the shroud. The support bracket 126 includes a port 128 for connecting to a nitrogen (N2) source to provide an inert atmosphere within the shroud. The support bracket 126 also includes an input port 130 for connecting a sensor to the support bracket.

[0054] The IR camera assembly 120 further includes an IR camera 132 that is supported in an operating position by the support bracket 126. A cable 134 is secured to the input port 130 and connects the IR camera 132 to the controller 114. As described above, any type of temperature sensor may be utilized to measure the temperature of the circuit board assembly within the tunnel 106 of the wave soldering machine 100. The IR camera 132 is configured to have a field of view that is directed through the shroud 124 toward the tunnel 106 of the wave soldering machine 100. This configuration is such that the IR camera 132 of the IR camera assembly 120 is configured to detect the temperature of the circuit board assembly within the tunnel 106 of the wave soldering machine 100 and communicate this information to the controller 114.

[0055] Selective Soldering Machine The selective soldering process involves several process steps. First, there is a flux application station where the printed circuit board assembly is cleaned by spraying flux onto the solder side (bottom) of the printed circuit board assembly. After the flux is applied, the printed circuit board assembly is transferred to a preheating unit. The preheating unit can be configured to include various heating concepts, such as convection or radiant heaters. The purpose of this process step is to heat the printed circuit board assembly to a predetermined temperature, typically measured on the solder-tip side (top) of the printed circuit board assembly. This activates the flux, and the printed circuit board assembly is heated to a temperature high enough that the solder does not solidify until the selective soldering process is performed. Prior to implementing the thermal detection system of the present disclosure, the temperature of the printed circuit board assembly during preheating can be measured by a pyrometer, but the pyrometer generates very limited thermal information about the printed circuit board assembly.

[0056] After preheating, the printed circuit board assembly is transferred to a solder area where one of two soldering processes can occur: in one soldering process, the solder is applied using a small solder nozzle configured for a point-to-point soldering process, or in another soldering process, the solder is applied by a multi-wave plate that creates the solder joints in a single dip.

[0057] An embodiment of the thermal detection system can include an IR camera (2D or 3D) in the selective soldering process. Data provided by this camera can be used for closed-loop process control. If a camera is installed above the printed circuit board assembly during the preheating process, the temperature data obtained from the camera can provide information to change the power of the unit so that a specified temperature is achieved when the selective soldering machine is ready to transfer the board to the soldering station. As a result, the printed circuit board assembly can achieve an optimal temperature when soldered, thereby minimizing the risk of defects. Data can be recorded and combined with board identification information, such as barcodes or RFID tags, for traceability that can be correlated to defects during assembly or field failures.

[0058] An IR scanner can also be implemented at the solder station. In the case of a multi-wave dip process, a 2D or 3D camera can be configured to measure the temperature of the solder joints. Such a configuration can identify whether the solder is solidified (below its melting point) before the printed circuit board assembly is moved to avoid stresses in the solder joints. This data can also be used for traceability and process optimization purposes.

[0059] For point-to-point soldering processes, it can be beneficial to mount an IR scanner above the solder station to record the condition of the printed circuit board assembly and verify that temperatures are within temperature tolerances. This information can be used to reduce defects and allow for better process control.

[0060] Other Aspects of the Heat Detection System In some embodiments, the support bracket includes an IR camera glass that protects the IR camera. Referring to FIG. 9 , a lens 140 is provided to protect the IR camera 132. While shown with the IR camera assembly 120 of the wave soldering machine 100, it should be understood that the lens 140 or camera glass may be provided with the IR camera assembly 62 associated with the reflow soldering oven 10. Other types of materials may be provided to create a protective cover. The IR camera glass is positioned such that pressurized air moves across the IR camera glass to create an "air curtain" that prevents obstruction of the IR camera. In one embodiment, a movable film may be provided to protect the IR camera.

[0061] The lens 140 may be applied to the IR camera 74 associated with the reflow soldering furnace 10 .

[0062] In some embodiments, the shroud can be configured to be connected to another source of inert fluid.

[0063] In some embodiments, a shroud can be configured around the temperature controlled fluid source to protect the IR camera.

[0064] In some embodiments, the support bracket can be configured to mount the IR camera at a desired height and orientation to achieve a complete field of view. In the illustrated configuration, the IR camera is mounted on the top of the reflow soldering oven tunnel. However, the IR camera can also be mounted on the side of the reflow soldering oven tunnel. In the case of side mounting, mirrors can be utilized to view the top and bottom of the circuit boards passing through the tunnel.

[0065] In some embodiments, the IR camera can be mounted on a support structure that acts as a gantry to move the camera across the circuit board. The IR camera may be positioned inside or outside the tunnel of the reflow soldering oven.

[0066] In some embodiments, the IR camera assembly may include multiple IR cameras to measure two or more separate locations within a selected position within the tunnel of the reflow soldering furnace.

[0067] In some embodiments, a one-dimensional line scan camera can be used to detect the circuit board temperature.

[0068] In some embodiments, a two-dimensional camera can be used to detect the circuit board temperature.

[0069] In some embodiments, an existing reflow soldering oven can be upgraded with a retrofit kit that includes components of a thermal detection system including multiple IR camera assemblies, including, for example, a mounting plate, a shroud, a support bracket, a nitrogen connection, an IR camera cable, and an IR camera. Software updates can be provided for the reflow soldering oven controller.

[0070] In some embodiments, the thermal detection system is configured with a controller to provide closed-loop control of zone temperatures using an IR camera assembly or other temperature detection device, allowing an operator to monitor circuit board temperatures and locate hot spots on the circuit board, both on the top and bottom of the circuit board.

[0071] In some embodiments, the controller is configured with executable software that allows for closed-loop control of the various zones of the reflow soldering furnace.

[0072] In some embodiments, information obtained from the heat detection system is collected and analyzed for future action.

[0073] In some embodiments, the IR camera assembly of the thermal detection system is configured to acquire temperature data within a particular zone of the reflow soldering furnace at a specific board-level location.

[0074] In some embodiments, the IR camera assembly of the thermal detection system is configured to provide data to a controller for process control of downstream parameters associated with the production line and / or to address equipment problems.

[0075] In some embodiments, the printed circuit boards have bar codes that are scanned by a bar code scanner or other type of identification system to track data for each circuit board.

[0076] In some embodiments, the IR camera assembly of the thermal detection system is configured to acquire temperature data that is used by the controller to provide closed-loop localized heating to the required board zones, allowing real-time zone-to-zone temperature adjustments to be made for circuit board temperature uniformity or a desired temperature profile.

[0077] In some embodiments, closed-loop processing of circuit boards can include controlling a conveyor to control conveyor speed in one or more zones to optimize heat transfer. Fan blower speed can also be controlled. In one embodiment, the conveyor can include multiple sections corresponding to multiple zones, with each conveyor section controlled by a controller to control the speed of the conveyor section and, therefore, the temperature applied to the circuit board. Localized heating of the circuit board is achieved through this configuration.

[0078] In some embodiments, data obtained from the thermal detection system can be used for various purposes. For example, the data can be communicated to a customer. The data can be used to provide circuit board traceability where data about a particular circuit board is correlated to a customer. The data can be used to find hot spot zones / levels within a reflow soldering oven. The data can be used to optimize the performance of a reflow soldering oven. The data can be used to provide downstream input for processing equipment. The data can be used to determine the start and end times of a scan performed by an IR camera assembly on a circuit board. The data can be used to generate circuit board profiles above and below the circuit board to determine certain board zones or levels. The data can be used by the customer for other analyses and stored on a customer server / network or on the cloud.

[0079] In some embodiments, the controller can be configured to implement a scan mode to measure the temperature of all components on the board as it moves on a conveyor through a reflow soldering oven.

[0080] In some embodiments, the thermal detection system is configured to perform thermal imaging during Moire analysis (strain / stress analysis) to correlate between thermal hot spots and warpage response.

[0081] In some embodiments, the thermal detection system is configured to find hot spots and cold spots during reflow soldering, wave soldering, SRT rework, and selective soldering.

[0082] In some embodiments, a thermal detection system can be used to provide analysis to improve board design and functionality.

[0083] In some embodiments, a thermal detection system can be used to reduce voids in the reflow process.

[0084] In some embodiments, the thermal detection system provides improved temperature control to reduce defects.

[0085] In some embodiments, the thermal detection system incorporates integrated closed-loop control of reflow soldering furnace zone temperatures by utilizing multiple infrared (IR) camera assemblies in strategic locations to reduce warpage, identify hot spots, determine component overheating, obtain profile verification, and reduce voids.

[0086] In some embodiments, the heat detection system is configured to include self-sensing equipment with settings that self-adjust based on ambient conditions and the product being produced, thereby increasing visibility, productivity, traceability and response time while reducing costs.

[0087] In some embodiments, the heat detection system enables visibility and prescriptive real-time analytics with proactive actionable intelligence across the supply chain.

[0088] In some embodiments, the thermal detection system increases flexibility by managing complexity within a closed-loop system.

[0089] In some embodiments, connectivity is improved through an open architecture for developing standard or custom interfaces and data outputs. The architecture is configured to support several MEMS.

[0090] In some embodiments, automation is improved by providing automatic replacement and replenishment of consumables to reduce operator error and manpower.

[0091] In some embodiments, the thermal detection system is configured to achieve self-optimization by reducing operator intervention in machine parameters and providing closed-loop control to facilitate higher yields.

[0092] In some embodiments, improved maintenance is achieved by applying predictive maintenance items based on the actual needs of the reflow soldering oven or wave solder machine, and improved maintenance replaces or reduces maintenance-based planning time.

[0093] In some embodiments, a controller associated with a reflow soldering oven or wave soldering machine includes a controller adapted to control the operation of the oven or machine based on operating parameters acquired by the controller. The controller can be configured to communicate with a controller associated with the production line. In one embodiment, the controller can be configured to communicate with another controller, for example, a controller associated with the production line, via a Controller Area Network (CAN) bus or other type of network. In other embodiments, a master controller can be provided to control the operation of the controllers of individual pieces of equipment associated with the production line. The controller can include a display operably coupled to the controller. The display is adapted to display operating parameters of the reflow soldering oven or wave soldering machine, such as, but not limited to, temperature data through zones of the oven or machine, or data associated with the solder level of the machine. Appropriate sensors can be provided to acquire such information. Alternatively or additionally, the operating parameters may be displayed on a display provided within the reflow soldering oven, a display provided within the wave soldering machine, and / or a display associated with the production line.

[0094] In other embodiments, material identification for an article, such as a circuit board moving through a reflow soldering oven or wave soldering machine, can include a device for manipulating the article and a scanner for scanning and identifying the article. For example, the reflow soldering oven or wave soldering machine can be configured with a pinch wheel that rotates the circuit board to align a code or predetermined identification mark provided on the circuit board with a scanner provided on the oven or machine. The system is configured to link material identification information associated with the circuit board to a recipe, production time, etc. for the reflow soldering oven or wave soldering machine. In one embodiment, a barcode can be implemented to identify the article. For example, the barcode can include a 1D scanner for a UPC code, a 2D scanner for a QRC code, a printed label applied to the article, or a laser-etched label etched on the article. In another embodiment, an RFID system can be implemented to identify the article. For example, the RFID system can include an RFID tag applied to the article and an RFID reader associated with the reflow soldering oven or wave soldering machine. Line-of-sight between the reader and the article is not required for an RFID system. Furthermore, scanning is not required to identify all items within the mobile cart. In another embodiment, an imaging or vision system can be implemented to identify the items.

[0095] In some embodiments, a database is provided to track articles processed through a reflow soldering oven or wave soldering machine. In one embodiment, the database can include an open application (app) architecture and can be configured to push data to the reflow soldering oven or wave soldering machine. The oven or machine can be configured to communicate with the oven or machine to push / pull data to the oven or machine and / or production line, or to communicate directly with the production line. The database can include job information or material information. The database can further communicate with a manufacturing execution system (MES) associated with the production line, the reflow soldering oven, and / or the wave soldering machine. The MES system can be configured to know which materials are needed for a production run. The mobile cart can be configured to communicate with the MES system to coordinate delivery of articles to the reflow soldering oven or wave soldering machine.

[0096] The database can be further configured to retrieve information about the item based on identification information, such as a bar code number. In one embodiment, a central management system can be provided in which a reflow soldering oven or wave soldering machine is programmed to accept material arriving from a mobile cart. The reflow soldering oven or wave soldering machine is programmed to update the database as circuit boards are processed through the oven or machine from a network, the network being tied to an MES system.

[0097] The database may be further configured to store additional information, such as temperature data, number of circuit boards processed, and / or material consumption associated with the reflow soldering oven or wave solder machine. The database may be configured to store information locally or remotely and may be configured to store data associated with one or more production runs.

[0098] The database can be configured to share predictive data as new production runs are envisioned or programmed. For example, with respect to storing information regarding temperature processing efficiency, the database can be configured to do one or more of the following: store information regarding temperature zone data, the number and type of circuit boards being processed when paste consumables need replenishment; trigger alarms and / or reports; signal inventory control systems associated with reflow soldering ovens, wave solder machines, and / or production lines; perform analysis regarding consumable usage based on operating parameters and actual usage and upstream / downstream equipment activity; predict replacement or maintenance; and correlate across multiple sites to predict future production run parameters.

[0099] The database can be configured to store data associated with lot traceability. Additionally, RFID or mechanical keying of circuit boards is provided to ensure proper alignment / orientation / direction / front-to-back / top-to-bottom (up-and-down) when these items are inserted into a reflow soldering oven or wave solder machine for processing. Low-cost readers can perform this function.

[0100] Controller Feedback 11 illustrates an exemplary system 200 according to various embodiments. System 200 includes a tunnel 202 within a chamber housing 203 having a conveyor 204, a plurality of temperature sensors 210 (shown as temperature sensors 210a, 210b, and 210c), a heater 212 (shown as heaters 212a and 212b), and a blower 214 (shown as blowers 214a and 214b). System 200 also includes a controller 250. It should be understood that the term "blower" can include any type of device configured to move air, including a fan.

[0101] In some embodiments, the system 200 can be a single device contained within a single housing. In other embodiments, the controller 250 can be housed separately from the chamber housing 203.

[0102] In some embodiments, the chamber housing 203 can be part of the reflow oven 10. In other embodiments, the chamber housing 203 can be part of the wave solder machine housing 102. In yet other embodiments, the chamber housing 203 can be part of a selective solder machine housing.

[0103] An electronic board assembly or circuit board assembly 44 passes through tunnel 202 along a conveyor 204 (e.g., conveyor 46, 104) driven by a motor (or other drive mechanism) 205 through a temperature detection zone 216 (shown as temperature detection zones 216a, 216b, 216c) and a processing zone 218 (shown as processing zones 218a, 218b).

[0104] The circuit board assembly 44 includes a plurality of electronic components 206 mounted on an underlying circuit board. The electronic components 206 may include, for example, integrated circuit chips 207, solder 208, and other components such as traces (not shown), as well as the underlying board itself. While only one circuit board assembly 44 is shown passing through the tunnel 202, it should be understood that multiple circuit board assemblies 44 can pass through the tunnel 202 at a time. In some embodiments, several circuit board assemblies 44 can pass side-by and side-by-side.

[0105] In some embodiments, the processing zones 218 may include, for example, one or more of the preheat zones 14, 16, 18, soak zones 20, 22, 24, spike zones 30, 32, 34, 36, and cool down zones 38, 40, 42, as described above with respect to the reflow soldering furnace 10. Each processing zone 218 may include one or more of a heater 212 (e.g., top heater 26 or bottom heater 28) and a blower 214, as well as any other processing components, depending on the purpose of that processing zone 218.

[0106] Each temperature detection zone 216 includes one or more temperature sensors 210 (e.g., IR camera assemblies 62). A temperature sensor 210N can be configured to detect the temperature of various different components of the circuit board assembly 44 that pass through its corresponding temperature detection zone 216N.

[0107] Although the temperature detection zones 216 and the processing zones 218 are shown separately, in some embodiments, the temperature detection zones 216 can be combined with the processing zones 218. Although only three temperature detection zones 216 and two processing zones 218 are shown, there can be any number of temperature detection zones 216 and processing zones 218, preferably at least two of each. Although the temperature detection zones 216 and processing zones 218 are shown alternating, there can be multiple different processing zones 218 interposed between consecutive temperature detection zones 216.

[0108] The controller 250 (e.g., controller 50, 114) is configured to control the heater 212 and / or blower 214 (and any other processing components) in the processing zone 218 and to receive feedback from the temperature sensor 210 in the temperature detection zone 216. In some embodiments, the controller 250 can also control the drive speed of the conveyor 204.

[0109] Controller 250 can be any type of computing device, such as, for example, a personal computer, laptop, workstation, server, enterprise server, tablet, smartphone, integrated system, etc. Controller 250 includes processing circuitry 236, communication interface circuitry 234, and memory 240. In some embodiments, controller 250 can also include user interface (UI) circuitry 238 for connecting to a UI input device (not shown) and a display device (not shown). Controller 250 can also include various additional features, such as, for example, an interconnection bus, as are well known in the art.

[0110] Processing circuitry 236 may include any type of processor or set of processors configured to perform operations, such as, for example, a microprocessor, a multi-core microprocessor, a digital signal processor, a system on a chip (SoC), a collection of electronic circuits, a similar controller, or any combination thereof.

[0111] The communications interface circuitry 234 may include one or more networking devices (e.g., an Ethernet card, a cellular modem, a Fibre Channel (FC) adapter, an InfiniBand adapter, a wireless networking adapter, etc.) and / or a local bus port (e.g., USB, Firewire, serial bus, parallel bus, etc.) for connecting the heater 212, the blower 214, the temperature sensor 210, and / or other controllable devices of the chamber housing 203, such as the conveyor motor 205.

[0112] UI circuitry 238 may include any circuitry needed to communicate with and connect to one or more user input devices and a display screen, including, for example, a keyboard controller, a mouse controller, a touch controller, serial bus ports and controllers, universal serial bus (USB) ports and controllers, wireless controllers and antennas (e.g., Bluetooth), graphics adapters and ports, etc.

[0113] Memory 240 may include any type of digital system memory, such as, for example, random access memory (RAM), and stores an operating system (OS) (not shown, e.g., Linux, UNIX, Windows, Mac OS, or a similar operating system) and various drivers, as well as other applications and software modules configured to run on processing circuitry 236.

[0114] The memory 240 stores a set of modules 282 , 284 , 290 , 296 configured to execute on the processing circuitry 236 .

[0115] Feedback module 282 is configured to receive temperature readings, such as temperature maps 280 (shown as zone temperature maps 280a, 280b, and 280c), from temperature sensors 210 as one or more circuit board assemblies 44 pass through tunnel 202 along conveyor 204. In one embodiment, zone a temperature map 280a is a two-dimensional (or three-dimensional) map of temperatures within temperature detection zone 216a recorded by IR camera assembly 62 of temperature sensor 210a, while zone b temperature map 280b is a two-dimensional (or three-dimensional) map of temperatures within temperature detection zone 216b recorded by IR camera assembly 62 of temperature sensor 210b, and zone c temperature map 280c is a two-dimensional (or three-dimensional) map of temperatures within temperature detection zone 216c recorded by IR camera assembly 62 of temperature sensor 210c.

[0116] In some embodiments, the feedback module 282 may be configured to convert each zone temperature map 280X into one or more component-level temperature maps 281 (shown as component-level temperature maps 281-1, 281-2, ...) that include the temperatures of every electronic component 206 on the particular circuit board assembly 44 that passes through zone X. In some embodiments, the component-level temperature map 281 may record both the minimum and maximum temperatures measured for each component 206. The component-level temperature map 281 may be created with respect to a board configuration 260 entered by a user via the UI circuitry 238. The board configuration 260 may include the dimensions of the particular circuit board assembly 44 design and the location, size, and shape of each component 206 on the particular circuit board assembly 44 design.

[0117] Comparison module 284 is configured to compare component-level temperature map 281 to one or more predicted component-level temperature maps 285 (shown as predicted maps 285a, 285b, ...). A predicted component-level temperature map 285X defines a predicted temperature range for each component 206 of a particular circuit board assembly 44 design in a particular temperature detection zone 216X.

[0118] The optimization module 290 is configured to generate a set of adjustments 294 to be made to the set of current settings 270 based on the differences detected by the comparison module 284. The current settings 270 may include, for example, a conveyor speed 272, a temperature setting 274 and a blower speed 276 for each processing zone 218 (shown as temperature setting 274a and blower speed 276a for processing zone 218a). The adjustments 294 are communicated by a control module 296 to various devices, such as the heater 212, blower 214, and conveyor motor 205, for adjustment. The adjustments 294 are also used to update the current settings 270.

[0119] In some embodiments, optimization module 290 includes a trained machine learning model (MLM) 292. Trained MLM 292 can be any type of machine learning model, such as a neural network (e.g., ResNet50, EfficientNet B7, EfficientNet, MobileNet V3, etc.), a Bayesian network, a support vector machine, a decision tree, a random forest, a regression model, etc. Trained MLM 292 can include as many input nodes (not shown) as current settings 270 plus two-dimensional or three-dimensional input nodes for temperature map 280 or 281 or a map of variance (not shown) calculated by comparison module 284. Trained MLM 292 can also include as many output nodes (not shown) as current settings 270, which can be adjusted. In embodiments where trained MLM 292 is a neural network or a Bayesian network, trained MLM 292 can also include one or more hidden layers having multiple hidden nodes (not shown). In an exemplary embodiment, there may be between 10 and 1 billion hidden nodes.

[0120] In some embodiments, the trained MLM 292 can be initially trained by passing one or more circuit board assemblies 44 through the tunnel 202 using supervised learning. Prior to such a pass, the board configurations 260 for those circuit board assemblies 44 can also be input into the training node of the trained MLM 292. In some embodiments, the thermal properties 262 of each type of component 206 can also be input. The thermal properties 262 of a particular type of component 206N can include, for example, the thermal conductivity, density, specific heat, and thermal diffusivity of that particular type of component 206N. In some embodiments, the maximum safe temperature 264 (e.g., the temperature at which the board warps; the temperature at which the chip burns; etc.) and the minimum operating temperature 266 for each type of component 206N can also be input. The “operating temperature” for a particular component 206N is defined as the maximum temperature that the component 206N reaches during its passage through the tunnel 202. One exemplary minimum operating temperature 266 is the melting point of the solder (or the temperature at which the solder is sufficiently melted to ensure a reliable bond).

[0121] Memory 240 may also store various other data structures used by the OS, modules 282, 284, 290, 296, trained MLM 292, and various other applications and drivers. In some embodiments, memory 240 may also include a persistent storage portion. The persistent storage portion of memory 240 may be comprised of one or more persistent storage devices, such as, for example, a magnetic disk, a flash drive, a solid-state storage drive, or other types of storage drives. The persistent storage portion of memory 240 is configured to store programs and data even while controller 250 is powered off. The OS, modules 282, 284, 290, 296, trained MLM 292, and various other applications and drivers are typically stored in this persistent storage portion of memory 240 so that they can be loaded into the system portion of memory 240 upon system restart or as needed. The OS, modules 282, 284, 290, 296, trained MLM 292, and various other applications and drivers each form a computer program product when stored in non-transitory fashion in either a volatile or persistent portion of memory 240. Processing circuitry 236 executing one or more applications thus forms dedicated circuitry constructed and arranged to perform the various processes described herein.

[0122] FIG. 12 illustrates an exemplary method 300 performed by the system 200 for joining electronic components to electronic substrates in an apparatus such as a reflow soldering oven 10, a wave soldering machine 100, or a selective soldering machine. Whenever software (e.g., OS, modules 282, 284, 290, 296, trained MLM 292, etc.) is described as performing a method, process, step, or function, this should be understood to mean that the computing device on which the software is running (e.g., controller 250) performs the method, process, step, or function when executing the software on its processing circuitry 236. It should be understood that one or more of the steps or sub-steps of method 300 may be omitted in some embodiments. Similarly, in some embodiments, one or more steps or sub-steps may be combined with one another or performed in a different order. Dashed lines indicate that a step or sub-step is optional or represents an alternative embodiment or use case.

[0123] In some embodiments, the trained MLM 292 can be initially trained using supervised learning in step 305. In step 305, a plurality of circuit board assemblies 44 having different board configurations 260, thermal characteristics 262, maximum safe temperatures 264, and minimum operating temperatures 266 are transported through the tunnel 202 of the chamber housing 203 to train the trained MLM 292. The trained MLM 292 is configured to adjust the current settings 270 for each different type of circuit board assembly 44 until each component 206 of each different type of circuit board assembly 44 reliably reaches its minimum operating temperature 266 (if the minimum operating temperature 266 is applicable to that component 206) while passing through the tunnel 202 without exceeding the maximum safe temperature 264 for that component 206 during the pass (and, in some embodiments, for at least a minimum amount of time). The thermal characteristics 262 can be used to help identify how to adjust the current settings 270 for each pass. At the end of step 305, an initial set of current settings 270 for at least one particular circuit board assembly 44 design is output. In some embodiments, the trained MLM 292 can be generalizable for use with any particular circuit board assembly 44 design given as input the board configuration 260, thermal characteristics 262, and maximum safe temperatures 264 and minimum operating temperatures 266 for each component 206. In other embodiments, a separate trained MLM 292 can be generated in the training phase for each different circuit board assembly 44 design. In some embodiments, step 305 can be performed as an explicit training process using test workpieces. In some embodiments, step 305 can include a pre-run of a non-test circuit board assembly 44, allowing the machine learning to refine its behavior as more runs are performed.

[0124] In step 310, a plurality of circuit board assemblies 44 are transported through a chamber housing 203 including a tunnel 202 that penetrates a plurality of processing zones 218. In sub-step 315, the system 200 detects the temperature of the electronic boards 44 as they pass in close proximity to a thermal detection system including at least one temperature sensor 210 coupled to the chamber housing 203. In some embodiments, in sub-step 316, the system 200 detects the temperature of a plurality of components 206 of the electronic boards 44 at each of a plurality of locations along the tunnel 202 (e.g., successive temperature detection zones 216) (e.g., using an IR camera assembly 62 in each temperature detection zone 216). It should be understood that step 310 is a general operational step and, as such, can operate in parallel or simultaneously with the remaining steps.

[0125] The remainder of method 300 can be used in various embodiments. In one embodiment associated with steps 320, 370 (hereinafter the “Run-by-Run embodiment” or “RBR embodiment”), a first circuit board assembly 44-1 is passed through tunnel 202 using initial current settings 270, adjustments 294 are determined and applied, and then a second circuit board assembly 44-2 of the same design is passed through tunnel 202 using updated current settings 270. In another embodiment associated with steps 330, 380, 390 (hereinafter the “Real-Time embodiment”), as a particular circuit board assembly 44 is passed through tunnel 202, current settings 270 are adjusted in real time so that subsequent processing zones 218 can adjust their operation as needed.

[0126] In step 320 of the RBR embodiment, a first circuit board assembly 44-1 is transferred through the chamber housing 203. Although reference is made only to the first circuit board assembly 44-1, it should be understood that there may be several first circuit board assemblies 44-1 passing through the tunnel 202 simultaneously. It should be understood that step 315 operates on the first circuit board assembly (or multiple first circuit board assemblies) 44-1 as it is being transferred through the chamber housing 203.

[0127] In step 330 of the real-time embodiment, as a particular circuit board assembly 44 is being transported through the chamber housing 203, a first of the at least two temperature sensors (e.g., temperature sensor 210a) detects the temperature of the multiple components 206 of that particular circuit board assembly 44 (e.g., by imaging the circuit board assembly 44 using the first IR camera assembly 62) at a first location along the tunnel 202 (e.g., a location within the temperature detection zone 216a).

[0128] In step 340, a feedback module 282 operating on the controller 250 receives temperature data (e.g., one or more zone temperature maps 280) from the thermal detection system, since the controller 250 is coupled to multiple processing zones 218, conveyor motors 205, and the thermal detection system (i.e., temperature sensors 210).

[0129] In the RBR embodiment, in step 340, the zone temperature maps 280 from all of the temperature detection zones 216 are received in sequence as the first circuit board assembly 44-1 passes through each respective temperature detection zone 216.

[0130] In a real-time embodiment, in step 340, one zone temperature map 280 from its respective temperature detection zone 216 is received as a particular circuit board assembly 44-1 passes through that temperature detection zone 216.

[0131] In step 350, the controller 250 determines, in relation to the detected temperature of the electronic board(s) 44 (e.g., one zone temperature map 280 in a real-time embodiment, or all zone temperature maps 280 in an RBR embodiment), adjustments 292 to at least one of (a) the heat setting of the heating element 212 in the chamber housing 203, (b) the speed of the conveyor 204, and (c) the operating speed of the blower 214 in the chamber housing 203.

[0132] Step 350 may include sub-steps 352 and 354. In sub-step 352, comparison module 284 compares each detected temperature of each part 206 (e.g., with one or more of part-level temperature maps 281 generated from one or more of zone temperature maps 280) at each location (in the case of an RBR embodiment) or first location (in the case of a real-time embodiment) along tunnel 202 (e.g., temperature detection zone 216). Thereafter, in sub-step 354, optimization module 290 performs an optimization operation configured to adjust current hardware settings 270 in one or more of processing zones 218 to reduce (lower, reduce) the set of variances calculated by comparison module 284. In the case of an RBR embodiment, adjustment 292 may affect one or more of processing zones 218. In a real-time embodiment, the adjustment 292 affects one or more processing zones 218 located after the first location (e.g., processing zone 218a after temperature detection zone 216a or processing zone 218b after temperature detection zone 216b).

[0133] In some embodiments, sub-step 354 includes a further sub-step 355 in which optimization module 290 runs trained MLM 292 on processing circuitry 236 to perform the optimization.

[0134] In some embodiments, if the temperature of a particular component 206 is higher than expected, the optimization module 290 can determine that the adjustment is at least one of: (1) lowering the heat setting of the heating element 212, (2) adjusting the speed of the conveyor 204, and (3) increasing the operating speed of the blower 214. In the case of an RBR embodiment, if the temperature of a particular component 206N on the first electronic board 44-1 exceeds the maximum safe temperature 264N for that component 206N in the temperature detection zone 216X, the optimization module 290 can determine that the adjustment is at least one of: (1) lowering the heat setting of the heating element 212 located in the processing zone 218 preceding the temperature detection zone 216X, (2) increasing the speed of the conveyor 204, and (3) increasing the operating speed of the blower 214 located in the processing zone 218 preceding the temperature detection zone 216X. In the case of a real-time embodiment, if the temperature of a particular component 206N of a particular electronic board 44 exceeds the predicted temperature for that component 206N (e.g., from the predicted temperature map 285X) in the temperature detection zone 216X but has not yet exceeded the maximum safe temperature 264N for that component 206N, the optimization module 290 can determine that the adjustment is at least one of: (1) lowering the heat setting of the heating element 212 located in the processing zone 218 after the temperature detection zone 216X; (2) increasing or decreasing the speed of the conveyor 204; and (3) increasing the operating speed of the blower 214 located in the processing zone 218 after the temperature detection zone 216X.

[0135] In some embodiments, if the temperature of a particular component is lower than expected, the optimization module 290 can determine that an adjustment is to at least one of (1) increase the heat setting of the heating elements 212, (2) adjust the speed of the conveyor 204, and (3) reduce the operating speed of the blower 214. In the case of an RBR embodiment, if the temperature of a particular component 206N on the first electronic board 44-1 has not reached a minimum temperature to ensure that the solder component is melted for that component 206N by the end of the tunnel 202, the optimization module 290 can determine that an adjustment is to at least one of (1) increase the heat setting of the heating elements 212 located in one or more processing zones 218, (2) reduce the speed of the conveyor 204, and (3) reduce the operating speed of the blower 214 located in one or more processing zones 218. In the case of a real-time embodiment, if the temperature of a particular component 206N of a particular electronic board 44 is lower than expected (e.g., with respect to the expected temperature map 285X) for that component 206N in the temperature detection zone 216X, the optimization module 290 can determine that the adjustment is at least one of: (1) increasing the heat setting of the heating element 212 located in the processing zone 218 after that temperature detection zone 216X; (2) increasing or decreasing the speed of the conveyor 204; and (3) decreasing the operating speed of the blower 214 located in the processing zone 218 after that temperature detection zone 216X.

[0136] After step 350, in step 360, the controller 250 updates the current settings 270 and implements the determined adjustment(s) 294 by sending the adjustment(s) 294 to the appropriate devices 212, 214, 205 via the control module 296 and the communications interface circuitry 234.

[0137] In the case of an RBR embodiment, in step 370, the second circuit board assembly 44-2 is transferred through the chamber housing 203, this time using the updated current settings 270 after applying the adjustment(s) 292. Although reference is made only to the second circuit board assembly 44-2, it should be understood that there may be several second circuit board assemblies 44-2 passing through the tunnel 202 simultaneously. It should be understood that step 315 operates on the second circuit board assembly (or second circuit board assemblies) 44-2 as it is being transferred through the chamber housing 203.

[0138] In a real-time embodiment, in step 380, the particular circuit board assembly 44 continues to be transported through at least one processing zone 218 of the chamber housing 203 after the first temperature sensor (e.g., processing zone 218a after temperature sensor 210a, processing zone 218b after temperature sensor 210b, etc.). Thereafter, in step 390, the system 200 detects the temperature of the plurality of components 206 of the particular circuit board assembly 44 (e.g., by imaging the circuit board assembly 44 with the second IR camera assembly 62) at a second location after the processing zone 218 passed through in step 380 along the tunnel 202 (e.g., a location within temperature detection zone 216b or 216c). Operation can then return to step 340 as the particular circuit board assembly 44 continues to pass through the tunnel 202. Having thus described several aspects of at least one embodiment of the present disclosure, it will be apparent to those skilled in the art that various alterations, modifications, and improvements can be readily made. Such alterations, modifications, and improvements are intended to be part of this disclosure and are intended to be within the spirit and scope of this disclosure. Accordingly, the foregoing description and drawings are by way of example only. While various embodiments are described as methods, it should be understood that software embodying these methods is also included. Thus, one embodiment includes a tangible computer-readable medium (e.g., a hard disk, floppy disk, optical disk, computer memory, flash memory, etc.) programmed with instructions that, when executed by a computer or set of computers, cause the performance of one or more of the methods described in the various embodiments. Another embodiment includes a computer programmed to perform one or more of the methods described in the various embodiments.

[0139] Furthermore, it should be understood that all embodiments that have been described can be combined with each other in all possible combinations, except where combinations are expressly excluded.

[0140] Finally, nothing herein should be construed as an admission of any kind. Even if a technique, method, apparatus, or other concept is specifically labeled as "background" or "prior art," applicant is not admitting that such technique, method, apparatus, or other concept is in fact prior art under 35 U.S.C. § 102 or 103; such a determination is a legal determination that depends on many factors, not all of which may be known to applicant at this time.

Claims

1. 1. A method for bonding an electronic component to an electronic substrate in an apparatus, comprising: transporting the electronic substrate through a chamber housing, the chamber housing having tunnels passing through a plurality of processing zones; detecting a temperature of the electronic board passing in close proximity with a thermal detection system, the thermal detection system comprising at least one temperature sensor coupled to the chamber housing; receiving temperature data from the thermal detection system with a controller coupled to the plurality of processing zones, the conveyor, and the thermal detection system; the controller determining, in relation to the detected temperature of the electronics board, an adjustment to at least one of: (a) a heat setting of a heating element within the chamber housing; (b) a speed of the conveyor; and (c) an operating speed of a blower within the chamber housing; implementing the determined adjustment; and A method comprising:

2. determining the adjustment occurs after transferring a first electronic substrate through the chamber housing; performing the determined adjustment occurs prior to transferring a second electronic substrate through the chamber housing. The method of claim 1.

3. 3. The method of claim 2, wherein determining the adjustment includes determining, in response to determining that the temperature of a component on the first electronic board exceeds a maximum safe temperature for that component, that the adjustment is at least one of: (1) decreasing the heat setting of the heating element; (2) increasing the speed of the conveyor; and (3) increasing the operating speed of the blower.

4. 3. The method of claim 2, wherein determining the adjustment includes determining that the adjustment is at least one of: (1) increasing the heat setting of the heating element; (2) decreasing the speed of the conveyor; and (3) decreasing the operating speed of the blower in response to determining that the temperature of the solder components on the first electronic board has not reached a minimum temperature to reliably melt the solder components.

5. the heat detection system includes a plurality of temperature sensors sequentially arranged along the tunnel; detecting the temperature includes detecting temperatures of a plurality of components of the first electronic board at each of a plurality of locations along the tunnel; determining the adjustment comparing each detected temperature of each component at each location with an expected temperature for that component at that location to obtain a set of variances; performing an optimization operation configured to adjust hardware settings in the plurality of processing zones to reduce the set of variances; The method of claim 2 , comprising:

6. The method of claim 5 , wherein performing the optimization operation comprises running a trained machine learning model.

7. Operating the trained machine learning model includes: initial hardware settings in the plurality of processing zones that are in effect while the first electronic board is passing through the chamber housing; a configuration of components on the first electronic board; thermal properties of the components of the first electronic board; a maximum safe temperature for at least one component of the first electronic board; and a minimum operating temperature for at least one component of the first electronic board; and 7. The method of claim 6, comprising inputting into the trained neural network:

8. The method further includes training the machine learning model using supervised learning before transferring the first electronic substrate through the chamber housing; training the machine learning model using supervised learning includes transporting a plurality of electronic boards having different configurations, thermal properties, maximum safe temperatures, and minimum operating temperatures through the chamber housing; The method of claim 7.

9. the plurality of temperature sensors include a plurality of infrared (IR) cameras; detecting temperatures of the components of the first electronic board at each of the plurality of locations along the tunnel includes imaging the components of the first electronic board at each of the plurality of locations along the tunnel using one IR camera of the plurality of IR cameras; The method of claim 5.

10. the thermal detection system includes at least two temperature sensors arranged in sequence along the tunnel, with at least one processing zone interposed between the at least two temperature sensors; For a particular electronic substrate being transferred through the chamber housing, determining the adjustment for the particular electronic board is performed after sensing temperatures of a plurality of components of the particular electronic board at a first location along the tunnel with a first of the at least two temperature sensors; performing the determined adjustments prior to transporting the particular electronic substrate through the at least one processing zone; The method of claim 1.

11. the at least two temperature sensors include a first infrared (IR) camera and a second IR camera; detecting the temperature of the components of the particular electronic board at the first location along the tunnel includes imaging the components of the first electronic board at the first location along the tunnel using the first IR camera; 11. The method of claim 10, further comprising detecting temperatures of the plurality of components of the particular electronic board at a second location along the tunnel after transporting the particular electronic board through the at least one processing zone by imaging the plurality of components with the second IR camera.

12. 1. An apparatus configured to bond an electronic component to an electronic substrate, comprising: a chamber housing having a tunnel passing through a plurality of processing zones; a conveyor configured to transport electronic substrates within the tunnel through the plurality of processing zones; a thermal detection system comprising at least one temperature sensor coupled to the chamber housing, the at least one temperature sensor configured to detect a temperature of the electronic board passing in close proximity to the at least one temperature sensor; a controller coupled to the plurality of processing zones, the conveyor, and the heat detection system, receiving temperature data from the thermal detection system; determining an adjustment to at least one of: (a) a heat setting of a heating element within the chamber housing; (b) a speed of the conveyor; and (c) an operating speed of a blower within the chamber housing in relation to the detected temperature of the electronics board; implementing the determined adjustment; and a controller configured to: An apparatus comprising:

13. the controller is configured to determine the adjustment after transferring a first electronic substrate through the chamber housing; the controller is configured to perform the determined adjustment prior to transferring a second electronic substrate through the chamber housing.

13. The apparatus of claim 12.

14. 14. The apparatus of claim 13, wherein determining the adjustment comprises determining, in response to determining that a temperature of a component on the first electronic board exceeds a maximum safe temperature for that component, that the adjustment is at least one of: (1) decreasing the heat setting of the heating element; (2) increasing the speed of the conveyor; and (3) increasing the operating speed of the blower.

15. 14. The apparatus of claim 13, wherein determining the adjustment comprises determining that the adjustment is at least one of: (1) increasing the heat setting of the heating element; (2) decreasing the speed of the conveyor; and (3) decreasing the operating speed of the blower in response to determining that the temperature of the solder components on the first electronic board has not reached a minimum temperature to reliably melt the solder components.

16. the heat detection system includes a plurality of temperature sensors sequentially arranged along the tunnel; detecting the temperature includes detecting temperatures of a plurality of components of the first electronic board at each of a plurality of locations along the tunnel; determining the adjustment comparing each detected temperature of each component at each location with an expected temperature for that component at that location to obtain a set of variances; performing an optimization operation configured to adjust hardware settings in the plurality of processing zones to reduce the set of variances; 14. The apparatus of claim 13, comprising:

17. The apparatus of claim 16 , wherein performing the optimization operation comprises running a trained machine learning model.

18. the plurality of temperature sensors include a plurality of infrared (IR) cameras; detecting temperatures of the components of the first electronic board at each of the plurality of locations along the tunnel includes imaging the components of the first electronic board at each of the plurality of locations along the tunnel using one IR camera of the plurality of IR cameras; 17. The apparatus of claim 16.

19. the thermal detection system includes at least two temperature sensors arranged in sequence along the tunnel, with at least one processing zone interposed between the at least two temperature sensors; For a particular electronic substrate being transferred through the chamber housing, the controller is configured to determine the adjustment for the particular electronic board after detecting temperatures of a plurality of components of the particular electronic board at a first location along the tunnel with a first of the at least two temperature sensors; the controller is configured to implement the determined adjustments prior to transferring the particular electronic substrate through the at least one processing zone.

13. The apparatus of claim 12.

20. the at least two temperature sensors include a first infrared (IR) camera and a second IR camera; detecting a temperature of the components of the first electronic board at the first location along the tunnel includes imaging the components of the first electronic board at the first location along the tunnel using the first IR camera; the second IR camera is configured to detect temperatures of the plurality of components of the particular electronic board at a second location along the tunnel after transporting the particular electronic board through the at least one processing zone by imaging the plurality of components.

20. The apparatus of claim 19.

21. 1. A computer program product comprising a non-transitory computer-readable medium storing instructions that, when executed by processing circuitry of a controller device coupled to an apparatus configured to bond an electronic component to an electronic substrate, operating the apparatus to transport an electronic substrate through a chamber housing, the chamber housing having tunnels passing through a plurality of processing zones; operating the apparatus to detect the temperature of the electronic board passing in close proximity to a thermal detection system, the thermal detection system comprising at least one temperature sensor coupled to the chamber housing; receiving temperature data from the thermal detection system; determining an adjustment to at least one of: (a) a heat setting of a heating element within the chamber housing; (b) a speed of a conveyor within the chamber housing; and (c) an operating speed of a blower within the chamber housing in relation to the detected temperature of the electronics board; operating the device to implement the determined adjustment; a computer program product that causes the controller device to perform the following:

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