Metal alloys for medical devices

Abstract

Medical devices partially or completely formed of a metal alloy, wherein the metal alloy is: a) a metal alloy containing at least 15 wt% rhenium; b) at least 60 wt% tungsten, at least 15 wt% rhenium, and at least 1 wt% molybdenum; c) at least 50 wt% rhenium, at least 20 wt% chromium, and 0.1 to 80 wt% additives; d) more than 50 wt% titanium, 15 to 45 wt% niobium, 1 to 10 wt% zirconium, and 1 to 15 wt% tantalum; e) more than 50 wt% titanium, 15 to A medical device comprising one of the following: 45 wt% niobium and 1-10 wt%, f) 30-60 wt% cobalt, 10-30 wt% chromium, 5-20 wt% iron, 5-22 wt% nickel, and 2-12 wt% molybdenum, g) 40-60 wt% zirconium and 40-60 wt% molybdenum, h) 90-99.5 wt% niobium and 0.5-10 wt% zirconium, or i) 55-75 wt% niobium, 18-40 wt% tantalum, 1-7 wt% tungsten, and 0.5-4 wt% zirconium.

Description

Technical Field

[0001] The present disclosure generally relates to medical devices and medical device applications, and more specifically to medical devices at least partially formed of a biocompatible metal alloy.

Background Art

[0002] Stainless steel, cobalt-chromium alloys, and TiAlV alloys are part of the more common metal alloys used in medical devices. These alloys have been successful in forming various medical devices, but these alloys have some drawbacks. Refractory metal alloys and alloys containing rhenium are also used to form medical devices partially or completely.

[0003] Many cardiovascular devices, such as stents, expandable heart valves, are inserted into a patient via the patient's vasculature and then expanded at the treatment site. These devices are typically coiled onto a catheter prior to insertion into the patient. The minimum diameter to which a cardiovascular device can be coiled onto a catheter maximizes the size of the cardiovascular access (e.g., blood vessel) through which the cardiovascular device can be inserted. A smaller coiled diameter can reduce damage to blood vessels and / or organs (e.g., the heart, etc.) when inserting and / or positioning the cardiovascular device at the treatment site. A smaller coiled diameter can also make it possible to place the cardiovascular device in blood vessels of a smaller diameter (e.g., blood vessels located within the brain, etc.).

[0004] The crimped diameter of an expandable cardiovascular device can be reduced by decreasing the thickness and / or size of the frame, struts, etc., of the cardiovascular device. However, such a reduction in size also affects the strength of the cardiovascular device after expansion. After expansion, the cardiovascular device must maintain its expanded shape within its therapeutic area; otherwise, the cardiovascular device may detach from the therapeutic area, potentially damaging the therapeutic area and / or not functioning properly within the therapeutic area. Therefore, cardiovascular devices formed from conventional materials, such as stainless steel (e.g., 316L: 17-19 wt% chromium, 13-15 wt% nickel, 2-4 wt% molybdenum, up to 2 wt% manganese, up to 0.75 wt% silicon, up to 0.03 wt% carbon, the rest iron) and cobalt-chromium alloys (e.g., MP35N: 19-21 wt% chromium, 34-36 wt% nickel, 9-11 wt% molybdenum, up to 1 wt% iron, up to 1 wt% titanium, up to 0.15 wt% manganese, up to 0.15 wt% silver, up to 0.025 wt% carbon, the rest cobalt), are required to maintain the size / thickness of the frame and / or strut, which determines the minimum size of the crimped diameter obtained by the crimped cardiovascular device. Other types of cobalt-chromium alloys used include Phynox and Elgiloy alloys (38–42 wt% cobalt, 18–22 wt% chromium, 14–18 wt% iron, 13–17 wt% nickel, 6–8 wt% molybdenum), and L605 alloy (18–22 wt% chromium, 14–16 wt% W, 9–11 wt% nickel, the remainder being cobalt). TiAlV alloys (e.g., Ti-6Al-4V; 5.5-6.5 wt% Al, 3.5-4.5 wt% V, and the rest Ti; 3.5-4.5 wt% vanadium, 5.5-6.75 wt% aluminum, up to 0.3 wt% iron, up to 0.2 wt% oxygen, up to 0.08 wt% carbon, up to 0.05 wt% nitrogen, up to 0.015 wt% hydrogen, up to 0.05 wt% yttrium, and the rest titanium) are also used in many medical devices.

[0005] Furthermore, conventional materials such as stainless steel (316L) and cobalt-chromium alloys (e.g., MP35N) exhibit some recoil after crimping and expanding, which can prevent obtaining the minimum crimped diameter and / or negatively affect the placement of expandable cardiovascular devices in the therapeutic area. During the crimping process, a crimping device is typically used to crimp the cardiovascular device onto the catheter. After the initial crimping process, conventional materials such as stainless steel and cobalt-chromium alloys recoil to a larger diameter, up to +9% from the minimum crimped diameter. Thus, cardiovascular devices must be crimped multiple times on the catheter in an attempt to obtain a smaller crimped diameter on the catheter. However, exposing a cardiovascular device to multiple crimps can result in damage to the cardiovascular device (e.g., damage to the frame and / or struts of the cardiovascular device, damage to the leaflet of an expandable heart valve, etc.). Similarly, when a cardiovascular device is expanded in the therapeutic area, the conventional material of the cardiovascular device recoils by +9% from its maximum expanded diameter. Thus, the inflatable balloon on the catheter must be pressurized multiple times to repeatedly expand the cardiovascular device in the therapeutic area to ensure proper expansion of the cardiovascular device. However, exposing a cardiovascular device to multiple balloon expansions can result in damage to the cardiovascular device (e.g., damage or breakage of the frame and / or struts) and / or damage to the therapeutic area (e.g., rupture of blood vessels, rupture of organ tissue, and / or puncture).

[0006] Given the current state of medical device technology, there is a need for improved medical devices that a) produce less recoil compared to medical devices made of stainless steel, cobalt-chromium alloy, or TiAlV alloy, and b) can form smaller crimp diameters compared to medical devices made of stainless steel, cobalt-chromium alloy, or TiAlV alloy. [Overview of the project] [Means for solving the problem]

[0007] This disclosure covers medical devices that are at least partially fabricated from metal alloys. These medical devices include orthopedic devices, PFO (patent foramen ovale) devices, stents, valves (e.g., heart valves, TAVR valves, mitral valve replacements, tricuspid valve replacements, pulmonary valve replacements, etc.), spinal implants, frames for use with spinal implants, and other structures, vascular implants, grafts, guidewires, sheaths, catheters, needles, stent catheters, electrophysiological catheters, hypotubes, staples, cutting devices, any type of implant, pacemakers, dental implants, dental crowns, orthodontic appliances, wires used in medical procedures, bone implants, artificial intervertebral discs, artificial spinal intervertebral discs, and bone (e.g., acromion, atlas, axis, calcaneus, carpal bones, clavicle, coccyx, lateral epicondyle of the humerus, medial epicondyle of the humerus). Artificial implants or devices for repairing, replacing, and / or supporting bones (such as the femur, fibula, frontal bone, greater trochanter, humerus, ilium, ischium, mandible, maxilla, metacarpals, metatarsals, occipital bone, olecranon, parietal bone, patella, phalanges, radius, ribs, sacrum, scapula, sternum, talus, tarsals, temporal bone, tibia, ulna, zygomatic bone, etc.), and / or other structural assemblies used in the body, such as the human body, animal body, etc., for supporting, fixing, and / or repairing structures within the body. In one non-limiting embodiment, the medical device includes an expandable frame (e.g., a stent, an artificial heart valve, etc.) that can be plastically deformed radially outward by an expansion mechanism (e.g., an inflatable balloon, etc.). In another non-limiting embodiment, the metal alloy is not a self-expanding alloy.

[0008] According to other and / or alternative non-limiting aspects of this disclosure, medical devices are provided that are partially or completely formed of metal alloys such as modified titanium alloys, modified cobalt-chromium alloys, modified zirconium alloys, modified niobium alloys, refractory metal alloys, and metal alloys containing at least 15 awt.% rhenium [e.g., standard stainless steel alloys containing at least 15 awt.% rhenium, standard CoCr alloys containing at least 15 awt.% rhenium, standard TiAlV alloys containing at least 15 awt.% rhenium, standard Al alloys containing at least 15 awt.% rhenium, standard Ni alloys containing at least 15 awt.% rhenium, standard Ti alloys containing at least 15 awt.% rhenium, standard W alloys containing at least 15 awt.% rhenium, standard Mo alloys containing at least 15 awt.% rhenium, and standard Cu alloys containing at least 15 awt.% rhenium].

[0009] As defined herein, standard stainless steel contains 10–28 wt% chromium, 0–35 wt% nickel, 0–4 wt% molybdenum, 0–2 wt% manganese, 0–0.75 wt% silicon, 0–0.3 wt% carbon, 0–5 wt% titanium, 0–10 wt% Cb, 0–5 wt% copper, 0–4 wt% aluminum, 0–10 wt% tantalum, 0–1 wt% Se, 0–2 wt% V, 0–2 wt% tungsten, 0–2 wt% Nb, and at least 50 wt% iron.

[0010] As defined herein, a standard CoCr alloy contains 15–32 wt% chromium, 1–36 wt% nickel, 2–18 wt% molybdenum, 0–18 wt% iron, 0–1 wt% titanium, 0–0.15 wt% manganese, 0–0.15 wt% silver, 0–0.025 wt% carbon, 0–16 wt% tungsten, 0–2 wt% %Si, 0–2 wt% Al, 0–1 wt% Fe, and 30–68 wt% cobalt.

[0011] As defined herein, a standard TiAlV alloy contains 5.5–6.75 wt% Al, 3.5–4.5 wt% V, 85–93 wt% Ti, 0–0.4 wt% iron, and 0–0.2 wt% carbon.

[0012] As defined herein, a standard Al alloy contains 80–99 wt% Al, 0–12 wt% Si, 0–5 wt% Mg, 0–1 wt% Mn, 0–0.5 wt% Sc, 0–0.5 wt% Be, 0–0.5 wt% Y, 0–0.5 wt% Ce, 0–0.5 wt% %Cr, 0–3 wt% Fe, 0–0.5, 0–9 wt% Zn, 0–0.5 wt% Ti, 0–3 wt% Li, 0–0.5 wt% Ag, 0–0.5 wt% Ca, 0–0.5 wt% Zr, 0–1 wt% Pb, 0–0.5 wt% Cd, 0–0.05 wt% Bi, 0–1 wt% Ni, 0–0.2 wt% V, 0–0.1 wt% Ga, and 0–7 wt% Cu.

[0013] As defined herein, a standard Ni alloy contains 30–98 wt% Ni, 5–25 wt% Cr, 0–65 wt% Fe, 0–30 wt% Mo, 0–32 wt% Cu, 0–32 wt% Co, 2–2 wt% Al, 0–6 wt% Ta, 0–15 wt% W, 0–5 wt% Ti, 0–6 wt% Nb, and 0–3 wt% Si.

[0014] As defined herein, a standard Ti alloy contains 80–99 wt% Ti, 0–6 wt% Al, 0–3 wt% Sn, 0–1 wt% Pd, 0–8 wt% V, 0–15 wt% Mo, 0–1 wt% Ni, 0–0.3 wt% Ru, 0–6 wt% Cr, 0–4 wt% Zr, 0–4 wt% Nb, 0–1 wt% Si, 0.0.5 wt% Co, and 0–2 wt% Fe.

[0015] As defined herein, a standard W alloy contains 85–98 wt% W, 0–8 wt% Ni, 0–5 wt% Cu, 0–5 wt% Mo, and 0–4 wt% Fe.

[0016] As defined herein, a standard Mo alloy contains 90–99.5 wt% Mo, 0–1 wt% Ni, 0–1 wt% Ti, 0–1 wt% Zr, 0–30 wt% W, 0–2 wt% Hf, and 0–2 wt% La.

[0017] As defined herein, a standard Cu alloy contains 55–95 wt% Cu, 0–40 wt% Zn, 0–10 wt% Sn, 0–10 wt% Pb, 0–1 wt% Fe, 0–5 wt% Si, 0–12 wt% Mn, 0–12 wt% Al, 0–3 wt% Be, 0–1 wt% Co, and 0–20 wt% Ni.

[0018] As defined herein, a refractory metal alloy is a metal alloy containing at least 20% by weight of one or more of the following: molybdenum, rhenium, niobium, tantalum, or tungsten. Non-limiting refractory metal alloys include MoRe alloys, ReW alloys, MoReCr alloys, MoReTa alloys, MoReTi alloys, WCu alloys, ReCr, molybdenum alloys, rhenium alloys, tungsten alloys, tantalum alloys, niobium alloys, and the like.

[0019] Below are some non-limiting examples of metal alloys that can be used to partially or completely form the frames of medical devices, listed by weight percentage.

[0020] Ingredients / Weight % Example 1 Example 2 Example 3 Example 4 Location 0-40% 0-40% 0-40% 0-40% Al 0-40% 0-40% 0-40% 0-40% Bi 0-40% 0-40% 0-40% 0-40% Cr 0-40% 0-40% 0-40% 0-40% Cu 0-40% 0-40% 0-40% 0-40% Co 0-60% 0-60% 0-60% 0-60% fe 0-80% 0-80% 0-80% 0-80% Hf 0-40% 0-40% 0-40% 0-40% There are 0-40% 0-40% 0-40% 0-40% Mg 0-40% 0-40% 0-40% 0-40% Mn 0-40% 0-40% 0-40% 0-40%. For 10–98% 20–95% 30–95% 40–95% Nb 0-80% 0-80% 0-80% 0-80% It is 0-60% 0-60% 0-60% 0-60%. Os 0-40% 0-40% 0-40% 0-40% Pt 0-40% 0-40% 0-40% 0-40% Re 5–98% 10–90% 20–80% 30–70% Rh 0-40% 0-40% 0-40% 0-40%. Yes 0-40% 0-40% 0-40% 0-40% Sn 0-40% 0-40% 0-40% 0-40% It is 0-80% 0-60% 0-80% 0-80%. Tc 0-40% 0-40% 0-40% 0-40%. Ti 0–60% 0–60% 0–60% 0–60% V 0-40% 0-40% 0-40% 0-40%. W 0-98% 0-98% 0-98% 0-98% Y 0-40% 0-40% 0-40% 0-40% Zr 0-40% 0-40% 0-40% 0-40%. Cs2O 0-1% 0-1% 0-1% 0-1%. La2O30-3% 0.1-2% 0-2% 0-2%. Y2O30-1% 0-1% 0.1-1% 0-1%. ZrO20-3% 0-3% 0-3% 0-3%. C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0021] Ingredients / Weight % Example 5 Example 6 Example 7 Example 8 Ag 0-20% 0-20% 0-20% 0-20% Al 0-35% 0-30% 5-30% 0-25% Bi 0-20% 0-20% 0-20% 0-20% Cr 10-40% 0-40% 0-40% 0-40% Cu 0-20% 0-20% 0-20% 0-20% Co 10-60% 0-60% 0-60% 0-60% Fe 0-80% 30-80% 0-80% 0-70% Hf 0-20% 0-20% 0-20% 0-20% Ir 0-20% 0-20% 0-20% 0-20% Mg 0-20% 0-20% 0-20% 0-20% Mn 0-20% 0-40% 0-20% 0-20% Mo 0-60% 0-60% 0-80% 0-70% Nb 0-60% 0-60% 0-65% 20-60% Ni 0-60% 5-55% 0-52% 0-50% Os 0-20% 0-20% 0-20% 0-20% Pt 0-20% 0-20% 0-20% 0-20% Re 4.5-98% 4.5-90% 4.5-80% 4.5-70% Rh 0-20% 0-20% 0-20% 0-20% Si 0-20% 0-20% 0-20% 0-20% Sn 0-20% 0-20% 0-20% 0-20% Ta 0-60% 0-60% 5-65% 0-60% Tc 0-20% 0-20% 0-20% 0-20% Ti 0-60% 0-55% 0-53% 0-50% V 0-20% 0-20% 2-20% 0-20% W 0-60% 0-60% 0-80% 0-70% Y 0-20% 0-20% 0-20% 0-20% Zr 0-20% 0-20% 0-20% 5-20% Cs2O 0-1% 0-1% 0-1% 0-1% La2O30 -3% 0.1-2% 0-2% 0-2% Y2O30 -1% 0-1% 0.1-1% 0-1% ZrO20 -3% 0-3% 0-3% 0-3% C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0022] Ingredients / Weight % Example 9 Example 10 Example 11 Example 12 advancing 0-5% 0-5% 0-5% 0-5% Al 0-5% 0-5% 1-15% 0-20% Bi 0-5% 0-5% 0-5% 0-5% Cr 1-28% 1-30% 0-5% 0-30% Cu 0-20% 0-5% 0-5% 0-25% Co 0-5% 1-60% 0-5% 0-60% Fe 10-80% 0-25% 0-5% 0-80% Hf 0-5% 0-5% 0-5% 0-5% Ir 0-5% 0-5% 0-5% 0-5% Mg 0-5% 0-5% 0-5% 0-5% Mn 0-5% 0-5% 0-5% 0-5% Mo 0-8% 0-25% 0-5% 0-98% Nb 0-5% 0-5% 0-5% 0-95% Ni 1-20% 1-45% 0-5% 0-50% Os 0-5% 0-5% 0-5% 0-5% Pt 0-5% 0-5% 0-5% 0-5% Re 5-20% 4.8-20% 4.5-20% 4.5-20% Rh 0-5% 0-5% 0-5% 0-5% Si 0-5% 0-5% 0-5% 0-5% Sn 0-5% 0-5% 0-5% 0-5% Ta 0-5% 0-5% 0-5% 0-98% Tc 0-5% 0-5% 0-5% 0-5% Ti 0-5% 0-5% 40-93% 0-93% V 0-5% 0-5% 1-10% 0-20% W 0-5% 0-20% 0-5% 0-98% Y 0-5% 0-5% 0-5% 0-5% Zr 0-5% 0-5% 0-5% 0-5% Cs2O 0-1% 0-1% 0-1% 0-1% La2O30 -3% 0.1-2% 0-2% 0-2% Y2O30 -1% 0-1% 0.1-1% 0-1% ZrO20 -3% 0-3% 0-3% 0-3% C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0023] Ingredients / Weight % Example 13 Example 14 Example 15 Example 16 Mo 40-80% 40-80% 40-80% 40-80% C 0.01-0.3% 0-0.3% 0-0.3% 0-0.3% Co ≦0.002% ≦0.002% ≦0.002% ≦0.002% Cs2O 0-0.2% 0-0.2% 0.01-0.2% 0-0.2% Fe ≦0.02% ≦0.02% ≦0.02% ≦0.02% H ≦0.002% ≦0.002% ≦0.002% ≦0.002% Hf 0.1-2.5% 0-2.5% 0-2.5% 0-2.5% O ≦0.06% ≦0.06% ≦0.06% ≦0.06% Os ≤ 1% ≤ 1% ≤ 1% ≤ 1% La2O30-32% 0.1-2% 0-2% 0-2% N ≦20ppm ≦20ppm ≦20ppm ≦20ppm Nb ≦0.01% ≦0.01% ≦0.01% ≦0.01% Pt ≤ 1% ≤ 1% ≤ 1% ≤ 1% Re 7-49% 7.5-49% 7.5-49% 7.5-49% S ≦0.008% ≦0.008% ≦0.008% ≦0.008% Sn ≦0.002% ≦0.002% ≦0.002% ≦0.002% Ta 0-50% 0-50% 0-50% 0-50% Tc ≤ 1% ≤ 1% ≤ 1% ≤ 1% Ti ≤ 1% ≤ 1% ≤ 1% ≤ 1% V ≤ 1% ≤ 1% ≤ 1% ≤ 1% W 0-50% 0-50% 0-50% 0.5-50% Y2O30 -1% 0-1% 0.1-1% 0-1% Zr ≤ 1% ≤ 1% ≤ 1% ≤ 1% ZrO20 -3% 0-3% 0-3% 0-3% CNT 0-10% 0-10% 0-10% 0-10% C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0024] Ingredients / Weight % Example 17 Example 18 Example 19 Mo 40-80% 40-80% 40-80% C 0-0.3% 0-0.3% 0-0.3% Co ≦0.002% ≦0.002% ≦0.002% Cs2O 0-0.2% 0-0.2% 0-0.2% H ≦0.002% ≦0.002% ≦0.002% Hf 0-2.5% 0-2.5% 0-2.5% O ≤0.06% ≤0.06% ≤0.06% Os ≤ 1% ≤ 1% ≤ 1% La2O30 -2% 0-2% 0-2% N ≤ 20 ppm ≤ 20 ppm ≤ 20 ppm Nb ≤0.01% ≤0.01% ≤0.01% Pt ≤ 1% ≤ 1% ≤ 1% Re 7-49% 7.5-49% 7.5-49% S ≦0.008% ≦0.008% ≦0.008% Sn ≦0.002% ≦0.002% ≦0.002% Ta 0-50% 0.5-50% 0-50% Tc ≤ 1% ≤ 1% ≤ 1% Ti ≤ 1% ≤ 1% ≤ 1% V ≤ 1% ≤ 1% ≤ 1% W 0-50% 0-50% 0-50% Y2O30 -1% 0-1% 0-1% ZrO2 0.1-3% 0-3% 0-3% CNT 0-10% 0-10% 0-10% C <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06

[0025] Ingredients / Weight % Example 20 Example 21 Example 22 Mo 45-78% 45-75% 45-70% C 0-0.3% 0-0.3% 0-0.3% Co ≦0.002% ≦0.002% ≦0.002% Cs2O 0-0.2% 0-0.2% 0-0.2% H ≦0.002% ≦0.002% ≦0.002% Hf 0-2.5% 0-2.5% 0-2.5% O ≤0.06% ≤0.06% ≤0.06% Os ≤ 1% ≤ 1% ≤ 1% La2O30 -2% 0-2% 0-2% N ≤ 20 ppm ≤ 20 ppm ≤ 20 ppm Nb ≤0.01% ≤0.01% ≤0.01% Pt ≤ 1% ≤ 1% ≤ 1% Re 7-49% 7.5-49% 7.5-49% S ≦0.008% ≦0.008% ≦0.008% Sn ≦0.002% ≦0.002% ≦0.002% Ta 0-50% 0.5-50% 0-50% Tc ≤ 1% ≤ 1% ≤ 1% Ti ≤ 1% ≤ 1% ≤ 1% V ≤ 1% ≤ 1% ≤ 1% W 0-50% 0-50% 0-50% Y2O30 -1% 0-1% 0-1% ZrO2 0.1-3% 0-3% 0-3% CNT 0-10% 0-10% 0-10% C <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06

[0026] Ingredients / Weight % Example 23 Example 24 Example 25 Example 26 Mo 35-80% 35-80% 35-70% 35-65% C 0.05-0.15% 0-0.15% 0-0.15% 0-0.15% Cs2O 0-0.2% 0-0.2% 0.04-0.1% 0-0.2% Hf 0.8-1.4% 0-2% 0-2.5% 0-2.5% La2O30 -2% 0.3-0.7% 0-2% 0-2% Re 7-49% 7-49% 7.5-49% 7.5-49% Ta 0-2% 0-2% 0-50% 0-50% W 0-2% 0-2% 0-50% 20-50% Y2O30 -1% 0-1% 0.3-0.5% 0-1% ZrO20 -3% 0-3% 0-3% 0-3%

[0027] Ingredients / Weight % Example 27 Example 28 Example 29 Mo 40-60% 35-60% 30-60% C 0-0.15% 0-0.15% 0-0.15% Cs2O 0-0.2% 0-0.2% 0-0.2% Hf 0-2.5% 0-2.5% 0-2.5% La2O30 -2% 0-2% 0-2% Re 7-60% 7.5-65% 7.5-70% Ta 0-3% 10-50% 0-40% W 0-3% 0-50% 0-40% Y2O30 -1% 0-1% 0-1% ZrO2 1.2-1.8% 0-3% 0-3%

[0028] Ingredients / Weight % Example 30 Example 31 Example 32 W 20-80% 60-80% 20-78% Re 7.5-47.5% 10-40% 8-47.5% Mo 0-47.5% <0.5% 1-47.5% Cu <0.5% <0.5% <0.5% C ≤ 0.15% ≤ 0.15% ≤ 0.15% Co ≦0.002% ≦0.002% ≦0.002% Cs2O ≤0.2% ≤0.2% ≤0.2% Fe ≤0.02% ≤0.02% ≤0.02% H ≦0.002% ≦0.002% ≦0.002% Hf <0.5% <0.5% <0.5% La2O3 <0.5% <0.5% <0.5% O ≤0.06% ≤0.06% ≤0.06% Os <0.5% <0.5% <0.5% N ≤ 20 ppm ≤ 20 ppm ≤ 20 ppm Nb ≤0.01% ≤0.01% ≤0.01% Pt <0.5% <0.5% <0.5% S ≦0.008% ≦0.008% ≦0.008% Sn ≦0.002% ≦0.002% ≦0.002% Ta <0.5% <0.5% <0.5% Tc <0.5% <0.5% <0.5% Ti <0.5% <0.5% <0.5% V <0.5% <0.5% <0.5% Y2O3 < 0.5% < 0.5% < 0.5% Zr <0.5% <0.5% <0.5% ZrO2 <0.5% <0.5% <0.5% CNT 0-10% 0-10% <0.5%. C <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06

[0029] Ingredients / Weight % Example 33 Example 34 Example 35 W 20-80% 60-80% 20-75% Re 7.5-47.5% 10-40% 7.5-47.5% Mo 0-47.5% <0.5% 1-47.5%

[0030] Ingredients / Weight % Example 36 Example 37 Example 38 W 50.1-80% 65-80% 50.1-79% Re 10-40% 10-35% 10-40% Mo 0-40% <0.5% 1-30%

[0031] Ingredients / Weight % Example 39 Example 40 Example 41 W 20-49% 20-49% 20-49% Re 7.5-60% 7.5-60% 7.5-60% Mo 0-40% 0-40% 0-39%

[0032] Ingredients / Weight % Example 42 Example 43 Example 44 Re 5-98% 60-95% 80-90% Mo 0-80% 0-40% 0-20% W 0-80% 0-40% 0-20%

[0033] Ingredients / Weight % Example 45 Example 46 Example 47 W 20-49% 20-49% 20-49% Re 6-40% 6-40% 6-39% Mo 20-60% 30-60% 40-60%

[0034] Ingredients / Weight % Example 48 Example 49 Example 50 W 20-40% 20-35% 20-30% Re 6-40% 6-40% 6-40% Mo 0-40% 10-40% 31-40%

[0035] Ingredients / Weight % Example 51 Example 52 Example 53 Example 54 Re 5-60% 5-60% 5-60% 5-60% Mo 0-55% 10-55% 10-55% 10-55% Bi 1-42 0-32 0-32 0-32 Cr 0-32 1-42 0-32 0-32 Ir 0-32 0-32 1-42 0-32 Nb 0-32 0-32 0-32 1-42 Ta 0-32 0-32 0-32 0-32 Ti 0-32 0-32 0-32 0-32 Y 0-32 0-32 0-32 0-32 Zr 0-32 0-32 0-32 0-32 C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0036] Ingredients / Weight % Example 55 Example 56 Example 57 Example 58 Re 5-60% 5-60% 5-60% 5-60% Mo 15-55% 15-55% 15-55% 15-55% Bi 0-32 0-32 0-32 0-32 Cr 0-32 0-32 0-32 0-32 Ir 0-32 0-32 0-32 0-32 Nb 0-32 0-32 0-32 0-32 Ta 1-42 0-32 0-32 0-32 Ti 0-32 1-42 0-32 0-32 Y 0-32 0-32 1-42 0-32 Zr 0-32 0-32 0-32 1-42 C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0037] Ingredients / Weight % Example 59 Example 60 Example 61 Example 62 Re 41-59% 41-59% 41-59% 41-59% Mo 18-45% 18-45% 18-45% 18-45% Bi 1-42 0-32 0-32 0-32 Cr 0-32 1-42 0-32 0-32 Ir 0-32 0-32 1-42 0-32 Nb 0-32 0-32 0-32 1-42 Ta 0-32 0-32 0-32 0-32 Ti 0-32 0-32 0-32 0-32 Y 0-32 0-32 0-32 0-32 Zr 0-32 0-32 0-32 0-32 C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0038] Ingredients / Weight % Example 63 Example 64 Example 65 Example 66 Re 41-59% 41-59% 41-59% 41-59% Mo 18-45% 18-45% 18-45% 18-45% Bi 0-32 0-32 0-32 0-32 Cr 0-32 0-32 0-32 0-32 Ir 0-32 0-32 0-32 0-32 Nb 0-32 0-32 0-32 0-32 Ta 1-42 0-32 0-32 0-32 Ti 0-32 1-42 0-32 0-32 Y 0-32 0-32 1-42 0-32 Zr 0-32 0-32 0-32 1-42 C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0039] Ingredients / Weight % Example 67 Example 68 Example 69 Example 70 Re 41-59% 41-59% 41-59% 41-59% Mo 18-45% 18-45% 18-45% 18-45% Bi 0-15 0-15 1-36 0-15 Cr 1-20 1-20 1-20 1-20 Ir 0-15 0-15 0-15 0-15 Nb 1-36 0-15 0-15 0-15 Ta 0-15 1-36 0-15 0-15 Ti 0-15 0-15 0-15 0-15 Y 0-15 0-15 0-15 0-15 Zr 0-15 0-15 0-15 1-36 C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0040] Ingredients / Weight % Example 71 Example 72 Example 73 Example 74 Re 41-59% 41-59% 41-59% 41-59% Mo 18-45% 18-45% 18-45% 18-45% Bi 1-36 0-15 0-15 0-15 Cr 1-20 1-20 1-20 1-20 Ir 0-15 1-36 0-15 0-15 Nb 0-15 0-15 0-15 0-15 Ta 0-15 0-15 0-15 0-15 Ti 0-15 0-15 1-36 0-15 Y 0-15 0-15 0-15 1-36 Zr 0-15 0-15 0-15 0-15 C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0041] Ingredients / Weight % Example 75 Example 76 Example 77 Example 78 Re 41-59% 41-59% 41-59% 41-59% Mo 18-45% 18-45% 18-45% 18-45% Bi 1-34 0-15 0-15 0-15 Cr 0-15 0-15 0-15 0-15 Ir 0-15 0-15 0-15 1-34 Nb 3-27 3-27 3-27 3-27 Ta 0-42 1-34 0-15 0-15 Ti 0-15 0-15 0-15 0-15 Y 0-15 0-15 0-15 0-15 Zr 0-15 0-15 3-27 0-15 C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0042] Ingredients / Weight % Example 79 Example 80 Example 81 Example 82 Re 41-59% 41-59% 41-59% 41-59% Mo 18-45% 18-45% 18-45% 18-45% Bi 0-15 0-15 0-15 0-15 Cr 0-15 0-15 0-15 0-15 Ir 0-15 1-34 0-15 0-15 Nb 0-15 0-15 0-15 0-15 Ta 1-34 0-15 3-27 0-15 Ti 0-15 0-15 0-15 0-15 Y 0-15 0-15 0-15 3-27 Zr 3-27 3-27 3-27 3-27 C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0043] Ingredients / Weight % Example 83 Example 84 Example 85 Example 86 Re 41-59% 41-59% 41-59% 41-59% Mo 18-45% 18-45% 18-45% 18-45% Bi 0-15 0-15 0-15 0-15 Cr 0-15 0-15 0-15 1-10 Ir 1-34 0-25 3-27 0-15 Nb 0-15 3-27 0-15 0-15 Ta 0-15 0-15 1-34 0-15 Ti 0-15 0-15 0-15 0-15 Y 3-27 3-27 0-15 0-15 Zr 0-15 0-15 3-27 1-12 C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0044] Ingredients / Weight % Example 87 Example 88 Example 89 Example 90 Re 50-75% 55-75% 60-75% 65-75% Cr 25-50% 25-45% 25-40% 25-35% Mo 0-25% 0-25% 0-25% 0-25% Bi 0-25% 0-25% 0-25% 0-25% Cr 0-25% 0-25% 0-25% 0-25% Ir 0-25% 0-25% 0-25% 0-25% Nb 0-25% 0-25% 0-25% 0-25% Yes 0-25% 0-25% 0-25% 0-25% V 0-25% 0-25% 0-25% 0-25% W 0-25% 0-25% 0-25% 0-25% Mn 0-25% 0-25% 0-25% 0-25% Tc 0-25% 0-25% 0-25% 0-25% About 0-25% 0-25% 0-25% 0-25% Rh 0-25% 0-25% 0-25% 0-25% Hf 0-25% 0-25% 0-25% 0-25% If 0-25% 0-25% 0-25% 0-25% With 0-25% 0-25% 0-25% 0-25% Ir 0-25% 0-25% 0-25% 0-25% Ti 0-25% 0-25% 0-25% 0-25% Y 0-25% 0-25% 0-25% 0-25% Zr 0-25% 0-25% 0-25% 0-25% At 0-25% 0-25% 0-25% 0-25% Al 0-25% 0-25% 0-25% 0-22% Co 0-25% 0-25% 0-25% 0-25% Fe 0-25% 0-25% 0-25% 0-25% Mg 0-25% 0-25% 0-25% 0-25% Nothing 0-25% 0-25% 0-25% 0-25% Pt 0-25% 0-25% 0-25% 0-25% Yes 0-25% 0-25% 0-25% 0-25% Sn 0-25% 0-25% 0-25% 0-25% Cs2O 0-1% 0-1% 0-1% 0-1% La2O30 -3% 0.1-2% 0-2% 0-2% Y2O30 -1% 0-1% 0.1-1% 0-1% ZrO20 -3% 0-3% 0-3% 0-3% C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0045] Ingredients / Weight % Example 91 Example 92 Example 93 Example 94 Re 50-72% 55-72% 60-72% 65-72% Cr 28-50% 28-45% 28-40% 28-35% Mo 0-25% 0-25% 0-25% 0-25% Bi 0-10% 0-10% 0-10% 0-10% Cr 0-10% 0-10% 0-10% 0-10% Ir 0-10% 0-10% 0-10% 0-10% Nb 0-10% 0-10% 0-10% 0-10% Ta 0-10% 0-10% 0-10% 0-10% V 0-10% 0-10% 0-10% 0-10% W 0-10% 0-10% 0-10% 0-10% Mn 0-10% 0-10% 0-10% 0-10% Tc 0-10% 0-10% 0-10% 0-10% Ru 0-10% 0-10% 0-10% 0-10% Rh 0-10% 0-10% 0-10% 0-10% Hf 0-10% 0-10% 0-10% 0-10% Os 0-10% 0-10% 0-10% 0-10% Cu 0-10% 0-10% 0-10% 0-10% Ir 0-10% 0-10% 0-10% 0-10% Ti 0-10% 0-10% 0-10% 0-10% Y 0-10% 0-10% 0-10% 0-10% Zr 0-10% 0-10% 0-10% 0-10% Location 0-10% 0-10% 0-10% 0-10% Al 0-10% 0-10% 0-10% 0-10% Co 0-10% 0-10% 0-10% 0-10% 0-10% 0-10% 0-10% 0-10% Mg 0-10% 0-10% 0-10% 0-10% Ni 0-10% 0-10% 0-10% 0-10% Pt 0-10% 0-10% 0-10% 0-10% Si 0-10% 0-10% 0-10% 0-10% Sn 0-10% 0-10% 0-10% 0-10% Cs2O 0-1% 0-1% 0-1% 0-1% La2O30 -3% 0.1-2% 0-2% 0-2% Y2O30 -1% 0-1% 0.1-1% 0-1% ZrO20 -3% 0-3% 0-3% 0-3% C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0046] Ingredients / Weight % Example 95 Example 96 Example 97 Example 98 Re 50-70% 55-70% 60-70% 65-70% Cr 30-50% 30-45% 30-40% 30-35% Mo 0-10% 0-10% 0-10% 0-10% Bi 0-10% 0-10% 0-10% 0-10% Cr 0-10% 0-10% 0-10% 0-10% Ir 0-10% 0-10% 0-10% 0-10% Nb 0-10% 0-10% 0-10% 0-10% Yes 0-10% 0-10% 0-10% 0-10% V 0-10% 0-10% 0-10% 0-10% W 0-10% 0-10% 0-10% 0-10% Mn 0-10% 0-10% 0-10% 0-10% Tc 0-10% 0-10% 0-10% 0-10% About 0-10% 0-10% 0-10% 0-10% Rh 0-10% 0-10% 0-10% 0-10% Hf 0-10% 0-10% 0-10% 0-10% If 0-10% 0-10% 0-10% 0-10% With 0-10% 0-10% 0-10% 0-10% Ir 0-10% 0-10% 0-10% 0-10% Ti 0-10% 0-10% 0-10% 0-10% Y 0-10% 0-10% 0-10% 0-10% Zr 0-10% 0-10% 0-10% 0-10% At 0-10% 0-10% 0-10% 0-10% Al 0-10% 0-10% 0-10% 0-10% Co 0-10% 0-10% 0-10% 0-10% Fe 0-10% 0-10% 0-10% 0-10% Mg 0-10% 0-10% 0-10% 0-10% Nothing 0-10% 0-10% 0-10% 0-10% Pt 0-10% 0-10% 0-10% 0-10% Yes 0-10% 0-10% 0-10% 0-10% Sn 0-10% 0-10% 0-10% 0-10% Cs2O 0-1% 0-1% 0-1% 0-1% La2O30 -3% 0.1-2% 0-2% 0-2% Y2O30 -1% 0-1% 0.1-1% 0-1% ZrO20 -3% 0-3% 0-3% 0-3% C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0047] Ingredients / Weight % Example 99 Example 100 Example 101 Example 102 Re 50-67.5% 55-67.5% 60-67.5% 65-67.5% Cr 32.5-50% 32.5-45% 32.5-40% 32.5-35% Mo 0-10% 0-10% 0-10% 0-10% Bi 0-10% 0-10% 0-10% 0-10% Cr 0-10% 0-10% 0-10% 0-10% Ir 0-10% 0-10% 0-10% 0-10% Nb 0-10% 0-10% 0-10% 0-10% Ta 0-10% 0-10% 0-10% 0-10% V 0-10% 0-10% 0-10% 0-10% W 0-10% 0-10% 0-10% 0-10% Mn 0-10% 0-10% 0-10% 0-10% Tc 0-10% 0-10% 0-10% 0-10% Ru 0-10% 0-10% 0-10% 0-10% Rh 0-10% 0-10% 0-10% 0-10% Hf 0-10% 0-10% 0-10% 0-10% Os 0-10% 0-10% 0-10% 0-10% Cu 0-10% 0-10% 0-10% 0-10% Ir 0-10% 0-10% 0-10% 0-10% Ti 0-10% 0-10% 0-10% 0-10% Y 0-10% 0-10% 0-10% 0-10% Zr 0-10% 0-10% 0-10% 0-10% Location 0-10% 0-10% 0-10% 0-10% Al 0-10% 0-10% 0-10% 0-10% Co 0-10% 0-10% 0-10% 0-10% 0-10% 0-10% 0-10% 0-10% Mg 0-10% 0-10% 0-10% 0-10% Ni 0-10% 0-10% 0-10% 0-10% Pt 0-10% 0-10% 0-10% 0-10% Si 0-10% 0-10% 0-10% 0-10% Sn 0-10% 0-10% 0-10% 0-10% Cs2O 0-1% 0-1% 0-1% 0-1% La2O30 -3% 0.1-2% 0-2% 0-2% Y2O30 -1% 0-1% 0.1-1% 0-1% ZrO20 -3% 0-3% 0-3% 0-3% C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0048] Ingredients / Weight % Example 103 Example 104 Example 105 Example 106 Re 50-67.5% 55-67.5% 60-67.5% 65-67.5% Cr 32.5-50% 32.5-45% 32.5-40% 32.5-35% My 0-5% 0-5% 0-5% 0-5% Be 0-5% 0-5% 0-5% 0-5% Cr 0-5% 0-5% 0-5% 0-5% Ir 0-5% 0-5% 0-5% 0-5% Nb 0-5% 0-5% 0-5% 0-5% Yes 0-5% 0-5% 0-5% 0-5% V 0-5% 0-5% 0-5% 0-5% W 0-5% 0-5% 0-5% 0-5% Mn 0-5% 0-5% 0-5% 0-5% Tc 0-5% 0-5% 0-5% 0-5% About 0-5% 0-5% 0-5% 0-5% Rh 0-5% 0-5% 0-5% 0-5% Hf 0-5% 0-5% 0-5% 0-5% If 0-5% 0-5% 0-5% 0-5% With 0-5% 0-5% 0-5% 0-5% Ir 0-5% 0-5% 0-5% 0-5% You 0-5% 0-5% 0-5% 0-5% Y 0-5% 0-5% 0-5% 0-5% Zr 0-5% 0-5% 0-5% 0-5% At 0-5% 0-5% 0-5% 0-5% Al 0-5% 0-5% 0-5% 0-5% Co 0-5% 0-5% 0-5% 0-5% Fe 0-5% 0-5% 0-5% 0-5% Mg 0-5% 0-5% 0-5% 0-5% Nothing 0-5% 0-5% 0-5% 0-5% Pt 0-5% 0-5% 0-5% 0-5% Yes 0-5% 0-5% 0-5% 0-5% Sn 0-5% 0-5% 0-5% 0-5% Cs2O 0-1% 0-1% 0-1% 0-1% La2O30 -3% 0.1-2% 0-2% 0-2% Y2O30 -1% 0-1% 0.1-1% 0-1% ZrO20 -3% 0-3% 0-3% 0-3% C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0049] Ingredients / Weight % Example 107 Example 108 Example 109 Example 110 Re 50-75% 55-72% 60-70% 62-70% Cr 24-49% 27-44% 29-39% 29-37% Mo 1-15% 1-10% 1-8% 1-5% Bi 0-15% 0-10% 0-8% 0-5% Cr 0-15% 0-10% 0-8% 0-5% Ir 0-15% 0-10% 0-8% 0-5% Nb 0-15% 0-10% 0-8% 0-5% Ta 0-15% 0-10% 0-8% 0-5% V 0-15% 0-10% 0-8% 0-5% W 0-15% 0-10% 0-8% 0-5% Mn 0-15% 0-10% 0-8% 0-5% Tc 0-15% 0-10% 0-8% 0-5% Ru 0-15% 0-10% 0-8% 0-5% Rh 0-15% 0-10% 0-8% 0-5% Hf 0-15% 0-10% 0-8% 0-5% Os 0-15% 0-10% 0-8% 0-5% Cu 0-15% 0-10% 0-8% 0-5% Ir 0-15% 0-10% 0-8% 0-5% Ti 0-15% 0-10% 0-8% 0-5% Y 0-15% 0-10% 0-8% 0-5% Zr 0-15% 0-10% 0-8% 0-5% Location 0-15% 0-10% 0-8% 0-5% Al 0-15% 0-10% 0-8% 0-5% Co 0-15% 0-10% 0-8% 0-5% Fe 0-15% 0-10% 0-8% 0-5% Mg 0-15% 0-10% 0-8% 0-5% Ni 0-15% 0-10% 0-8% 0-5% Pt 0-15% 0-10% 0-8% 0-5% Si 0-15% 0-10% 0-8% 0-5% Sn 0-15% 0-10% 0-8% 0-5% Cs2O 0-1% 0-1% 0-1% 0-1% La2O30 -1% 0-1% 0-1% 0-1% Y2O30 -1% 0-1% 0-1% 0-1% ZrO2O -1% 0-1% 0-1% 0-1% C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0050] Ingredients / Weight % Example 111 Example 112 Example 113 Example 114 Mo 40-95% 40-95% 40-95% 40-95% C 0.01-0.3% 0-0.3% 0-0.3% 0-0.3% Co ≦0.002% ≦0.002% ≦0.002% ≦0.002% Cs2O 0-0.2% 0-0.2% 0.01-0.2% 0-0.2% Fe ≦0.02% ≦0.02% ≦0.02% ≦0.02% H ≦0.002% ≦0.002% ≦0.002% ≦0.002% Hf 0.1-2.5% 0-2.5% 0-2.5% 0-2.5% O ≦0.06% ≦0.06% ≦0.06% ≦0.06% If ≦1% ≦1% ≦1% ≦1% La2O30-2% 0.1-2% 0-2% 0-2% N ≦20ppm ≦20ppm ≦20ppm ≦20ppm Nb ≦0.01% ≦0.01% ≦0.01% ≦0.01% Pt ≦1% ≦1% ≦1% ≦1% Re 5-40% 5-40% 5-40% 5-40% S ≦0.008% ≦0.008% ≦0.008% ≦0.008% Sn ≦0.002% ≦0.002% ≦0.002% ≦0.002% Yes 0-50% 0-50% 0-50% 0-50% Tc ≦1% ≦1% ≦1% ≦1% Ti ≦1% ≦1% ≦1% ≦1% V ≦1% ≦1% ≦1% ≦1% W 0-50% 0-50% 0-50% 0.5-50% Y2O30-1% 0-1% 0.1-1% 0-1% Zr ≦1% ≦1% ≦1% ≦1% ZrO20-3% 0-3% 0-3% 0-3% At 0-5% 0-5% 0-5% 0-5% Al 0-5% 0-5% 0-5% 0-5% Co 0-5% 0-5% 0-5% 0-5% Mg 0-5% 0-5% 0-5% 0-5% Nothing 0-5% 0-5% 0-5% 0-5% Yes 0-5% 0-5% 0-5% 0-5% Sn 0-5% 0-5% 0-5% 0-5% CNT 0-10% 0-10% 0-10% 0-10%

[0051] Ingredients / Weight % Example 115 Example 116 Example 117 Mo 40-95% 40-95% 40-95% C 0-0.3% 0-0.3% 0-0.3% Co ≦0.002% ≦0.002% ≦0.002% Cs2O 0-0.2% 0-0.2% 0-0.2% H ≦0.002% ≦0.002% ≦0.002% Hf 0-2.5% 0-2.5% 0-2.5% O ≤0.06% ≤0.06% ≤0.06% Os ≤ 1% ≤ 1% ≤ 1% La2O30 -2% 0-2% 0-2% N ≤ 20 ppm ≤ 20 ppm ≤ 20 ppm Nb ≤0.01% ≤0.01% ≤0.01% Pt ≤ 1% ≤ 1% ≤ 1% Re 5-40% 5-40% 5-40% S ≦0.008% ≦0.008% ≦0.008% Sn ≦0.002% ≦0.002% ≦0.002% Ta 0-50% 0.5-50% 0-50% Tc ≤ 1% ≤ 1% ≤ 1% Ti ≤ 1% ≤ 1% ≤ 1% V ≤ 1% ≤ 1% ≤ 1% W 0-50% 0-50% 0-50% Y2O30 -1% 0-1% 0-1% ZrO2 0.1-3% 0-3% 0-3% ad 0-5% 0-5% 0-5% Al 0-5% 0-5% 0-5% Fe 0-5% 0-5% 0-5% Mg 0-5% 0-5% 0-5% Ni 0-5% 0-5% 0-5% Si 0-5% 0-5% 0-5% CNT 0-10% 0-10% 0-10%

[0052] Ingredients / Weight % Example 118 Example 119 Example 120 Mo 60-95% 60-95% 60-90% C 0-0.3% 0-0.3% 0-0.3% Co ≦0.002% ≦0.002% ≦0.002% Cs2O 0-0.2% 0-0.2% 0-0.2% H ≦0.002% ≦0.002% ≦0.002% Hf 0-2.5% 0-2.5% 0-2.5% O ≤0.06% ≤0.06% ≤0.06% Os ≤ 1% ≤ 1% ≤ 1% La2O30 -2% 0-2% 0-2% N ≤ 20 ppm ≤ 20 ppm ≤ 20 ppm Nb ≤0.01% ≤0.01% ≤0.01% Pt ≤ 1% ≤ 1% ≤ 1% Re 5-40% 5-40% 10-40% S ≦0.008% ≦0.008% ≦0.008% Sn ≦0.002% ≦0.002% ≦0.002% Ta 0-50% 0.5-50% 0-50% Tc ≤ 1% ≤ 1% ≤ 1% Ti ≤ 1% ≤ 1% ≤ 1% V ≤ 1% ≤ 1% ≤ 1% W 0-50% 0-50% 0-50% Y2O30 -1% 0-1% 0-1% ZrO2 0.1-3% 0-3% 0-3% ad 0-5% 0-5% 0-5% Al 0-5% 0-5% 0-5% Fe 0-5% 0-5% 0-5% Mg 0-5% 0-5% 0-5% Ni 0-5% 0-5% 0-5% Si 0-5% 0-5% 0-5% CNT 0-10% 0-10% 0-10%

[0053] Ingredients / Weight % Example 121 Example 122 Example 123 Example 124 Mo 60-95% 60-95% 50-95% 40-80% C 0.05-0.15% 0-0.15% 0-0.15% 0-0.15% Cs2O 0-0.2% 0-0.2% 0.04-0.1% 0-0.2% Hf 0.8-1.4% 0-2% 0-2.5% 0-2.5% La2O30 -2% 0.3-0.7% 0-2% 0-2% Re 5-40% 5-40% 5-40% 5-40% Ta 0-2% 0-2% 0-50% 0-50% W 0-2% 0-2% 0-50% 20-50% Y2O30 -1% 0-1% 0.3-0.5% 0-1% ZrO20 -3% 0-3% 0-3% 0-3%

[0054] Ingredients / Weight % Example 125 Example 126 Example 127 Mo 97-95% 50-90% 60-95% C 0-0.15% 0-0.15% 0-0.15% Cs2O 0-0.2% 0-0.2% 0-0.2% Hf 0-2.5% 0-2.5% 0-2.5% La2O30 -2% 0-2% 0-2% Re 5-30 5-40% 5-40% Ta 0-3% 10-50% 0-40% W 0-3% 0-50% 0-40% Y2O30 -1% 0-1% 0-1% ZrO2 1.2-1.8% 0-3% 0-3%

[0055] Ingredients / Weight % Example 128 Example 129 Example 130 W 20-95% 60-95% 20-80% Re 5-47.5% 5-40% 5-47.5% Mo 0-47.5% <0.5% 1-47.5% Cu <0.5% <0.5% <0.5% C ≤ 0.15% ≤ 0.15% ≤ 0.15% Co ≦0.002% ≦0.002% ≦0.002% Cs2O ≤0.2% ≤0.2% ≤0.2% Fe ≤0.02% ≤0.02% ≤0.02% H ≦0.002% ≦0.002% ≦0.002% Hf <0.5% <0.5% <0.5% La2O3 <0.5% <0.5% <0.5% O ≤0.06% ≤0.06% ≤0.06% Os <0.5% <0.5% <0.5% N ≤ 20 ppm ≤ 20 ppm ≤ 20 ppm Nb ≤0.01% ≤0.01% ≤0.01% Pt <0.5% <0.5% <0.5% S ≦0.008% ≦0.008% ≦0.008% Sn ≦0.002% ≦0.002% ≦0.002% Ta <0.5% <0.5% <0.5% Tc <0.5% <0.5% <0.5% Ti <0.5% <0.5% <0.5% V <0.5% <0.5% <0.5% Y2O3 < 0.5% < 0.5% < 0.5% Zr <0.5% <0.5% <0.5% ZrO2 <0.5% <0.5% <0.5% ad 0-5% 0-5% 0-5% Al 0 - 5% 0 - 5% 0 - 5% Fe 0 - 5% 0 - 5% 0 - 5% Mg 0 - 5% 0 - 5% 0 - 5% Ni 0 - 5% 0 - 5% 0 - 5% Si 0 - 5% 0 - 5% 0 - 5% CNT 0 - 10% 0 - 10% <0.5%

[0056] Components / wt% Example 131 Example 132 Example 133 Example 134 W 1 - 94.9% 1 - 94.9% 1 - 94.9% 10 - 95% Cu 0.1 - 94% 0.1 - 94% 0.1 - 94% 1 - 84% C 0.01 - 0.3% 0 - 0.3% 0 - 0.3% 0 - 0.3% Co ≦0.002% ≦0.002% ≦0.002% ≦0.002% Cs2O 0 - 0.2% 0 - 0.2% 0.01 - 0.2% 0 - 0.2% Fe ≦0.02% ≦0.02% ≦0.02% ≦0.02% H ≦0.002% ≦0.002% ≦0.002% ≦0.002% Hf 0.1 - 2.5% 0 - 2.5% 0 - 2.5% 0 - 2.5% O ≦0.06% ≦0.06% ≦0.06% ≦0.06% Os ≦1% ≦1% ≦1% ≦1% La2O3 0 - 2% 0.1 - 2% 0 - 2% 0 - 2% Mo 0 - 5% 0.1 - 3% 0 - 2% 0 - 3% N ≦20ppm ≦20ppm ≦20ppm ≦20ppm Nb ≦0.01% ≦0.01% ≦0.01% ≦0.01% Pt ≦1% ≦1% ≦1% ≦1% Re 5 - 40% 5 - 40% 5 - 40% 6 - 40% S ≦0.008% ≦0.008% ≦0.008% ≦0.008% Sn ≦0.002% ≦0.002% ≦0.002% ≦0.002% Ta 0-50% 0-50% 0-50% 0-50% Tc ≤ 1% ≤ 1% ≤ 1% ≤ 1% Ti ≤ 1% ≤ 1% ≤ 1% ≤ 1% V ≤ 1% ≤ 1% ≤ 1% ≤ 1% Y2O30 -1% 0-1% 0.1-1% 0-1% Zr ≤ 1% ≤ 1% ≤ 1% ≤ 1% ZrO20 -3% 0-3% 0-3% 0-3% advancing 0-5% 0-5% 0-5% 0-5% Al 0-5% 0-5% 0-5% 0-5% Fe 0-5% 0-5% 0-5% 0-5% Mg 0-5% 0-5% 0-5% 0-5% Ni 0-5% 0-5% 0-5% 0-5% Si 0-5% 0-5% 0-5% 0-5% CNT 0-10% 0-10% 0-10% 0-10%

[0057] Ingredients / Weight % Example 135 Example 136 Example 137 W 20-96% 25-92% 30-88% Cu 2-74% 2-68% 5-62% C 0-0.3% 0-0.3% 0-0.3% Co ≦0.002% ≦0.002% ≦0.002% Cs2O 0-0.2% 0-0.2% 0-0.2% H ≦0.002% ≦0.002% ≦0.002% Hf 0-2.5% 0-2.5% 0-2.5% O ≤0.06% ≤0.06% ≤0.06% Os ≤ 1% ≤ 1% ≤ 1% La2O30 -2% 0-2% 0-2% Mo 0-3% 0-2% 0-1% N ≤ 20 ppm ≤ 20 ppm ≤ 20 ppm Nb ≤ 0.01% ≤ 0.01% ≤ 0.01% Pt ≤ 1% ≤ 1% ≤ 1% Re 6 - 40% 7 - 40% 8 - 40% S ≤ 0.008% ≤ 0.008% ≤ 0.008% Sn ≤ 0.002% ≤ 0.002% ≤ 0.002% Ta 0 - 50% 0.5 - 50% 0 - 50% Tc ≤ 1% ≤ 1% ≤ 1% Ti ≤ 1% ≤ 1% ≤ 1% V ≤ 1% ≤ 1% ≤ 1% Y2O3 0 - 1% 0 - 1% 0 - 1% ZrO2 0.1 - 3% 0 - 3% 0 - 3% Ag 0 - 5% 0 - 5% 0 - 5% Al 0 - 5% 0 - 5% 0 - 5% Fe 0 - 5% 0 - 5% 0 - 5% Mg 0 - 5% 0 - 5% 0 - 5% Ni 0 - 5% 0 - 5% 0 - 5% Si 0 - 5% 0 - 5% 0 - 5% CNT (Carbon Nanotube) 0 - 10% 0 - 10% 0 - 10%

[0058] Component / wt% Example 138 Example 139 Example 140 Example 141 W 25 - 88% 35 - 87% 40 - 86% 50 - 85% Cu 5 - 68% 5 - 57% 5 - 51% 5 - 40% C 0.05 - 0.15% 0 - 0.15% 0 - 0.15% 0 - 0.15% Cs2O 0 - 0.2% 0 - 0.2% 0.04 - 0.1% 0 - 0.2% Hf 0.8 - 1.4% 0 - 2.5% 0 - 2.5% 0 - 2.5% La2O3 7 - 20% 8 - 20% 9 - 20% 10 - 20% Re 0 - 40% 0 - 40% 0 - 40% 0 - 40% Ta 0 - 50% 0 - 50% 0 - 50% 0 - 50% Y2O30 -1% 0-1% 0.3-0.5% 0-1% ZrO20 -3% 0-3% 0-3% 0-3%

[0059] Ingredients / Weight % Example 142 Example 143 Example 144 W 55-88% 60-87% 70-86% Cu 1-34% 1-28% 1-17% C 0-0.15% 0-0.15% 0-0.15% Cs2O 0-0.2% 0-0.2% 0-0.2% Hf 0-2.5% 0-2.5% 0-2.5% La2O30 -2% 0-2% 0-2% Re 11-40% 12-40% 13-40% Ta 0-50% 10-50% 0-50% W 0-50% 0-50% 0-50% Y2O30 -1% 0-1% 0-1% ZrO2 1.2-1.8% 0-3% 0-3%

[0060] Ingredients / Weight % Example 145 Example 146 Example 147 Ti 55-66% 65-76% 70-76% Mo 20-41% 20-31% 20-26% Re 4-20% 4-20% 4-20% Yt <0.5% <0.5% <0.5% Nb <0.5% <0.5% <0.5% Co <0.5% <0.5% <0.5% Cr <0.5% <0.5% <0.5% Zr <0.5% <0.5% <0.5% C ≤ 0.15% ≤ 0.15% ≤ 0.15% O ≤0.06% ≤0.06% ≤0.06% N ≤ 20 ppm ≤ 20 ppm ≤ 20 ppm

[0061] Ingredients / Weight % Example 148 Example 149 Example 150 W 20-95% 60-85% 20-84% Re 5-47.5% 15-40% 5-47.5% Mo 0-47.5% <0.5% 1-47.5%

[0062] Ingredients / Weight % Example 151 Example 152 Example 153 W 50.1-93% 65-92% 70-90% Re 7-40% 8-35% 9-30% Mo 0-40% <0.5% 1-30%

[0063] Ingredients / Weight % Example 154 Example 155 Example 156 W 20-49% 20-49% 20-49% Re 5-40% 5-40% 5-39% Mo 20-60% 30-60% 40-60%

[0064] Ingredients / Weight % Example 157 Example 158 Example 159 W 20-40% 20-35% 20-30% Re 7-40% 10-40% 25-40% Mo 0-40% 10-40% 25-40%

[0065] Ingredients / Weight % Example 160 Example 161 Example 162 W 20-95% 60-93% 20-80% Re 5-47.5% 7-40% 5-47.5% Mo 0-47.5% <0.5% 1-47.5% Cu <0.5% <0.5% <0.5% C ≤ 0.15% ≤ 0.15% ≤ 0.15% Co ≦0.002% ≦0.002% ≦0.002% Cs2O ≤0.2% ≤0.2% ≤0.2% Fe ≤0.02% ≤0.02% ≤0.02% H ≦0.002% ≦0.002% ≦0.002% Hf <0.5% <0.5% <0.5% La2O3 <0.5% <0.5% <0.5% O ≤0.06% ≤0.06% ≤0.06% Os <0.5% <0.5% <0.5% N ≤ 20 ppm ≤ 20 ppm ≤ 20 ppm Nb ≤0.01% ≤0.01% ≤0.01% Pt <0.5% <0.5% <0.5% S ≦0.008% ≦0.008% ≦0.008% Sn ≦0.002% ≦0.002% ≦0.002% Ta <0.5% <0.5% <0.5% Tc <0.5% <0.5% <0.5% Ti <0.5% <0.5% <0.5% V <0.5% <0.5% <0.5% Y2O3 < 0.5% < 0.5% < 0.5% Zr <0.5% <0.5% <0.5% ZrO2 <0.5% <0.5% <0.5% ad 0-5% 0-5% 0-5% Al 0-5% 0-5% 0-5% Fe 0-5% 0-5% 0-5% Mg 0-5% 0-5% 0-5% Ni 0-5% 0-5% 0-5% Si 0-5% 0-5% 0-5% CNT 0-10% 0-10% <0.5%

[0066] Ingredients / Weight % Example 163 Example 164 Example 165 Example 166 Location 0-10% 0-10% 0-10% 0-10% Al 0-10% 0-10% 0-10% 2-10% B 0-10% 0-10% 0-10% 0-10% Bi 0-10% 0-10% 0-10% 0-10% Cr 2-30% 10-30% 0-20% 0-20% Cu 0-10% 0-10% 0-10% 0-10% Co 0-10% 32-70% 0-10% 0-10% Fe 50-80% 0-20% 0-10% 0-10% Hf 0-10% 0-10% 0-10% 0-10% Ir 0-10% 0-10% 0-10% 0-10% Day 0-10% 0-10% 0-10% 0-10% Mg 0-10% 0-10% 0-10% 0-10% Mn 0-20% 0-10% 0-10% 0-10% For 0-10% 0-30% 0-16% 0-16% Nb 0-10% 0-10% 0-10% 0-10% Ni 0.1-30% 0.1-40% 0-10% 0-10% Os 0-10% 0-10% 0-10% 0-10% Pt 0-10% 0-10% 0-10% 0-10% Re 5-40% 4.8-40% 4.5-80% 4.5-80% Rh 0-10% 0-10% 0-10% 0-10% Se 0-10% 0-10% 0-10% 0-10% Si 0-10% 0-10% 0-10% 0-10% Sn 0-10% 0-10% 0-12% 0-12% Ta 0-10% 0-10% 0-10% 0-10% Tc 0-10% 0-10% 0-10% 0-10% Ti 0-10% 0-10% 70-91.5% 70-91.5% V 0-10% 0-10% 0-10% 0.01-10% W 0-10% 0-20% 0-10% 0-10% Y 0-10% 0-10% 0-10% 0-10% Zr 0-10% 0-10% 0-10% 0-10% Cs2O 0-1% 0-1% 0-1% 0-1% La2O30 -3% 0.1-2% 0-2% 0-2% Y2O30 -1% 0-1% 0.1-1% 0-1% ZrO20 -3% 0-3% 0-3% 0-3% C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0067] Ingredients / Weight % Example 167 Example 168 Example 169 Example 170 Location 0-10% 0-10% 0-10% 0-10% Al 0-10% 0-10% 0-10% 0-10% B 0-10% 0-10% 0-10% 0-10% Bi 0-10% 0-10% 0-10% 0-10% Cr 0-10% 0-20% 0-20% 0-10% Cu 0-10% 0-10% 0-50% 0-10% Co 0-10% 0-10% 0-10% 0-10% 0-10% 0-10% 0-10% 0-10% Hf 0-10% 0-10% 0-10% 0-10% Ir 0-10% 0-10% 0-10% 0-12% La 0-10% 0-10% 0-10% 0-10% Mg 0-10% 0-10% 0-10% 0-10% Mn 0-10% 0-10% 0-10% 0-10% Mo 0-55% 40-93% 0-50% 0-20% Nb 0-10% 0-10% 0-10% 40-85% Ni 0-45% 0-10% 0-10% 0-10% Os 0-10% 0-10% 0-10% 0-10% Pt 0-10% 0-10% 0-10% 0-10% Re 14-40% 7-40% 7-40% 7-40% Rh 0-10% 0-10% 0-10% 0-10% Se 0-10% 0-10% 0-10% 0-10% Si 0-10% 0-10% 0-10% 0-10% Sn 0-10% 0-10% 0-10% 0-10% Ta 35-84% 0-50% 0-50% 0-35% Tc 0-10% 0-10% 0-10% 0-10% Ti 0-10% 0-10% 0-10% 0-10% V 0-10% 0-10% 0-10% 0-10% W 0.1-25% 0-50% 14-10% 0-15% Y 0-10% 0-10% 0-10% 0-10% Zr 0-10% 0-10% 0-50% 0-10% Cs2O 0-1% 0-1% 0-1% 0-1% La2O30 -3% 0.1-2% 0-2% 0-2% Y2O30 -1% 0-1% 0.1-1% 0-1% ZrO20 -3% 0-3% 0-3% 0-3% C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0068] Ingredients / Weight % Example 171 Example 172 Example 173 Example 174 Location 0-10% 0-10% 0-5% 0-5% Al 0-10% 0-10% 0-5% 5-7% B 0-10% 0-10% 0-5% 0-5% Bi 0-10% 0-10% 0-5% 0-5% Cr 0-10% 1-95% 12-28% 0-5% Cu 0-10% 0-10% 0-5% 0-5% Co 0-10% 0-10% 36-68% 0-5% Fe 0-10% 0-10% 0-18% 0-5% Hf 0-10% 0-10% 0-5% 0-5% Ir 0-10% 0-10% 0-5% 0-5% Day 0-10% 0-10% 0-5% 0-5% Mg 0-10% 0-10% 0-5% 0-5% Mn 0-10% 0-10% 0-5% 0-5% For 0-10% 0-20% 0-12% 0-5% Nb 0-10% 0-10% 0-5% 0-5% Ni 30-58% 0-10% 9-36% 0-5% Os 0-10% 0-10% 0-5% 0-5% Pt 0-10% 0-10% 0-5% 0-5% Re 5-40% 5-40% 4.8-40% 4.5-40% Rh 0-10% 0-10% 0-5% 0-5% Se 0-10% 0-10% 0-5% 0-5% Si 0-10% 0-10% 0-5% 0-5% Sn 0-10% 0-10% 0-5% 0-5% Ta 0-10% 0-10% 0-5% 0-5% Tc 0-10% 0-10% 0-5% 0-5% Tea 30-58% 0-40% 0-5% 70-91.5% V 0-10% 0-10% 0-5% 3-6% W 0-10% 0-10% 0-16% 0-5% Y 0-10% 0-10% 0-5% 0-5% Zr 0-10% 0-20% 0-5% 0-5% Cs2O 0-1% 0-1% 0-1% 0-1% La2O30 -3% 0.1-2% 0-2% 0-2% Y2O30 -1% 0-1% 0.1-1% 0-1% ZrO20 -3% 0-3% 0-3% 0-3% C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0069] Ingredients / Weight % Example 175 Example 176 Example 177 Example 178 Location 0-8% 0-8% 0-8% 0-8% Al 0-8% 0-8% 0-8% 2-10% B 0-8% 0-8% 0-8% 0-8% Bi 0-8% 0-8% 0-8% 0-8% Cr 2-30% 10-30% 0-20% 0-20% Cu 0-8% 0-8% 0-8% 0-8% Co 0-8% 32-70% 0-8% 0-8% Fe 50-80% 0-20% 0-8% 0-8% Hf 0-8% 0-8% 0-8% 0-8% Ir 0-8% 0-8% 0-8% 0-8% La 0-8% 0-8% 0-8% 0-8% Mg 0-8% 0-8% 0-8% 0-8% Mn 0-20% 0-8% 0-8% 0-8% Mo 0-8% 0-30% 0-16% 0-16% Nb 0-8% 0-8% 0-8% 0-8% Ni 0.1-30% 0.1-40% 0-8% 0-8% Os 0-8% 0-8% 0-8% 0-8% Pt 0-8% 0-8% 0-8% 0-8% Re 5-40% 4.8-40% 4.5-80% 4.5-80% Rh 0-8% 0-8% 0-8% 0-8% Se 0-8% 0-8% 0-8% 0-8% Si 0-8% 0-8% 0-8% 0-8% Sn 0-8% 0-8% 0-12% 0-12% Ha 0-8% 0-8% 0-8% 0-8% Tc 0-8% 0-8% 0-8% 0-8% Ti 0-8% 0-8% 70-91.5% 70-91.5% V 0-8% 0-8% 0-8% 0.01-10% W 0-8% 0-20% 0-8% 0-8% Y 0-8% 0-8% 0-8% 0-8% Zr 0-8% 0-8% 0-8% 0-8%

[0070] Ingredients / Weight % Example 179 Example 180 Example 181 Example 182 Location 0-8% 0-8% 0-8% 0-8% Al 0-8% 0-8% 0-8% 0-8% B 0-8% 0-8% 0-8% 0-8% Bi 0-8% 0-8% 0-8% 0-8% Cr 0-8% 0-20% 0-20% 0-8% Cu 0-8% 0-8% 0-50% 0-8% Co 0-8% 0-8% 0-8% 0-8% Fe 0-8% 0-8% 0-8% 0-8% Hf 0-8% 0-8% 0-8% 0-8% Ir 0-8% 0-8% 0-8% 0-12% La 0-8% 0-8% 0-8% 0-8% Mg 0-8% 0-8% 0-8% 0-8% Mn 0-8% 0-8% 0-8% 0-8% Mo 0-55% 40-93% 0-50% 0-20% Nb 0-8% 0-8% 0-8% 40-85% Ni 0-45% 0-8% 0-8% 0-8% Os 0-8% 0-8% 0-8% 0-8% Pt 0-8% 0-8% 0-8% 0-8% Re 14-40% 7-40% 7-40% 7-40% Rh 0-8% 0-8% 0-8% 0-8% Se 0-8% 0-8% 0-8% 0-8% Si 0-8% 0-8% 0-8% 0-8% Sn 0-8% 0-8% 0-8% 0-8% Ta 35-84% 0-50% 0-50% 0-35% Tc 0-8% 0-8% 0-8% 0-8% Ti 0-8% 0-8% 0-8% 0-8% V 0-8% 0-8% 0-8% 0-8% W 0.1-25% 0-50% 14-10% 0-15% Y 0-8% 0-8% 0-8% 0-8% Zr 0-8% 0-8% 0-50% 0-8%

[0071] Ingredients / Weight % Example 183 Example 184 Example 185 Example 186 advancing 0-5% 0-5% 0-5% 0-5% Al 0-5% 0-5% 0-5% 5-7% B 0-5% 0-5% 0-5% 0-5% Bi 0-5% 0-5% 0-5% 0-5% Cr 0-5% 1-95% 12-28% 0-5% Cu 0-5% 0-5% 0-5% 0-5% Co 0-5% 0-5% 36-68% 0-5% Fe 0-5% 0-5% 0-18% 0-5% Hf 0-5% 0-5% 0-5% 0-5% Ir 0-5% 0-5% 0-5% 0-5% La 0-5% 0-5% 0-5% 0-5% Mg 0-5% 0-5% 0-5% 0-5% Mn 0-5% 0-5% 0-5% 0-5% Mo 0-5% 0-20% 0-12% 0-5% Nb 0-5% 0-5% 0-5% 0-5% Ni 30-58% 0-5% 9-36% 0-5% Os 0-5% 0-5% 0-5% 0-5% Pt 0-5% 0-5% 0-5% 0-5% Re 5-40% 5-40% 4.8-40% 4.5-40% Rh 0-5% 0-5% 0-5% 0-5% Se 0-5% 0-5% 0-5% 0-5% Si 0-5% 0-5% 0-5% 0-5% Sn 0-5% 0-5% 0-5% 0-5% Ta 0-5% 0-5% 0-5% 0-5% Tc 0-5% 0-5% 0-5% 0-5% Ti 30-58% 0-40% 0-5% 70-91.5% V 0-5% 0-5% 0-5% 3-6% W 0-5% 0-5% 0-16% 0-5% Y 0-5% 0-5% 0-5% 0-5% Zr 0-5% 0-20% 0-5% 0-5%

[0072] Ingredients / Weight % Example 187 Example 188 Example 189 Example 190 advancing 0-5% 0-5% 0-5% 0-5% Al 0-5% 0-5% 0-5% 0-5% B 0-5% 0-5% 0-5% 0-5% While 0-5% 0-5% 0-5% 0-5%. Cr 0-5% 0-5% 0-5% 0-5%. Cu 0-5% 0-5% 0-5% 0-5%. With 0-5% 0-5% 0-5% 0-5%. Fe 0–5% 0–5% 0–5% 0–5%. Hf 0-5% 0-5% 0-5% 0-5%. There are 0-5% 0-5% 0-5% 0-5%. The 0-5% 0-5% 0-5% 0-5%. Mg 0-5% 0-5% 0-5% 0-5%. Mn 0-5% 0-5% 0-5% 0-5%. For 1–15% 2–10% 3–8% 0–5% Nb 0-5% 0-5% 0-5% 20-45%. It is 0-5% 0-5% 0-5% 0-5%. Os 0-5% 0-5% 0-5% 0-5% Pt 0-5% 0-5% 0-5% 0-5%. Re 0-5% 0-5% 0-5% 0-5% Rh 0-5% 0-5% 0-5% 0-5%. If 0-5% 0-5% 0-5% 0-5%. Yes 0-5% 0-5% 0-5% 0-5% Sn 0-5% 0-5% 0-5% 0-5%. It ranges from 0–5% 0–5% 0–5% 1–15%. Tc 0-5% 0-5% 0-5% 0-5%. Ti 51–70% 51–70% 55–70% 51–70% V 0-5% 0-5% 0-5% 0-5%. W 0-5% 0-5% 0-5% 0-5%. Y 0-5% 0-5% 0-5% 0-5%. Zr 20–40% 22–38% 27–33% 1–15%.

[0073] Ingredients / Weight % Example 191 Example 192 Example 193 Example 194 advancing 0-5% 0-5% 0-5% 0-5% Al 0-5% 0-5% 0-5% 0-5% B 0-5% 0-5% 0-5% 0-5% Bi 0-5% 0-5% 0-5% 0-5% Cr 0-5% 0-5% 0-5% 0-5% Cu 0-5% 0-5% 0-5% 0-5% Co 0-5% 0-5% 0-5% 0-5% Fe 0-5% 0-5% 0-5% 0-5% Hf 0-5% 0-5% 0-5% 0-5% Ir 0-5% 0-5% 0-5% 0-5% La 0-5% 0-5% 0-5% 0-5% Mg 0-5% 0-5% 0-5% 0-5% Mn 0-5% 0-5% 0-5% 0-5% Mo 0-5% 0-5% 0-5% 0-5% Nb 25-40% 30-40% 25-40% 26-32% Ni 0-5% 0-5% 0-5% 0-5% Os 0-5% 0-5% 0-5% 0-5% Pt 0-5% 0-5% 0-5% 0-5% Re 0-5% 0-5% 0-5% 0-5% Rh 0-5% 0-5% 0-5% 0-5% Se 0-5% 0-5% 0-5% 0-5% Si 0-5% 0-5% 0-5% 0-5% Sn 0-5% 0-5% 0-5% 0-5% Ta 2-8% 3-6% 5-15% 10-14% Tc 0-5% 0-5% 0-5% 0-5% Ti 51-70% 52-63% 51-68% 51-62% V 0-5% 0-5% 0-5% 0-5% W 0-5% 0-5% 0-5% 0-5% Y 0-5% 0-5% 0-5% 0-5% Zr 2-12% 4-8% 2-8% 2-6%

[0074] Ingredients / Weight % Example 195 Example 196 Example 197 Example 198 advancing 0-5% 0-5% 0-5% 0-5% Al 0-5% 0-5% 0-5% 0-5% B 0-5% 0-5% 0-5% 0-5% Bi 0-5% 0-5% 0-5% 0-5% Cr 0-5% 5-35% 10-30% 15-25% Cu 0-5% 0-5% 0-5% 0-5% Co 0-5% 20-55% 25-50% 35-45% Fe 0-5% 3-25% 0-5% 0-5% Hf 0-5% 0-5% 0-5% 0-5% Ir 0-5% 0-5% 0-5% 0-5% La 0-5% 0-5% 0-5% 0-5% Mg 0-5% 0-5% 0-5% 0-5% Mn 0-5% 0-5% 0-5% 0-5% Mo 0-5% 2-15% 3-12% 4-9% Nb 30-40% 0-5% 0-5% 0-5% Ni 0-5% 4-23% 5-20% 10-18% Os 0-5% 0-5% 0-5% 0-5% Pt 0-5% 0-5% 0-5% 0-5% Re 0-5% 0-5% 0-5% 0-5% Rh 0-5% 0-5% 0-5% 0-5% Se 0-5% 0-5% 0-5% 0-5% Si 0-5% 0-5% 0-5% 0-5% Sn 0-5% 0-5% 0-5% 0-5% Ta 1-3% 0-5% 0-5% 0-5% Tc 0-5% 0-5% 0-5% 0-5% Ti 51-67% 0-5% 0-5% 0-5% V 0-5% 0-5% 0-5% 0-5% W 0-5% 0-5% 0-5% 0-5% Y 0-5% 0-5% 0-5% 0-5% Zr 2-5% 0-5% 0-5% 0-5%

[0075] Ingredients / Weight % Example 199 Example 200 Example 201 Example 202 advancing 0-5% 0-5% 0-5% 0-5% Al 0-5% 0-5% 0-5% 0-5% B 0-5% 0-5% 0-5% 0-5% Bi 0-5% 0-5% 0-5% 0-5% Cr 0-5% 0-5% 0-5% 0-5% Cu 0-5% 0-5% 0-5% 0-5% Co 0-5% 0-5% 0-5% 0-5% Fe 0-5% 0-5% 0-5% 0-5% Hf 0-5% 0-5% 0-5% 0-5% Ir 0-5% 0-5% 0-5% 0-5% La 0-5% 0-5% 0-5% 0-5% Mg 0-5% 0-5% 0-5% 0-5% Mn 0-5% 0-5% 0-5% 0-5% Mo 30-65% 40-60% 45-55% 0-5% Nb 0-5% 0-5% 0-5% 55-99.75% Ni 0-5% 0-5% 0-5% 0-5% Os 0-5% 0-5% 0-5% 0-5% Pt 0-5% 0-5% 0-5% 0-5% Re 0-5% 0-5% 0-5% 0-5% Rh 0-5% 0-5% 0-5% 0-5% Se 0-5% 0-5% 0-5% 0-5% Si 0-5% 0-5% 0-5% 0-5% Sn 0-5% 0-5% 0-5% 0-5% Ta 0-5% 0-5% 0-5% 0-5% Tc 0-5% 0-5% 0-5% 0-5% Ti 0-5% 0-5% 0-5% 0-5% V 0-5% 0-5% 0-5% 0-5% W 0-5% 0-5% 0-5% 0-5% Y 0-5% 0-5% 0-5% 0-5% Zr 30-56% 40-60% 45-55% 0.25-45%

[0076] Ingredients / Weight % Example 203 Example 204 Example 205 Example 206 advancing 0-5% 0-5% 0-5% 0-5% Al 0-5% 0-5% 0-5% 0-5% B 0-5% 0-5% 0-5% 0-5% Bi 0-5% 0-5% 0-5% 0-5% Cr 0-5% 0-5% 0-5% 0-5% Cu 0-5% 0-5% 0-5% 0-5% Co 0-5% 0-5% 0-5% 0-5% Fe 0-5% 0-5% 0-5% 0-5% Hf 0-5% 0-5% 0-5% 0-5% Ir 0-5% 0-5% 0-5% 0-5% La 0-5% 0-5% 0-5% 0-5% Mg 0-5% 0-5% 0-5% 0-5% Mn 0-5% 0-5% 0-5% 0-5% Mo 0-5% 0-5% 0-5% 0-5% Nb 75-99.5% 95-99.25% 55-78.5% 68-74.25% Ni 0-5% 0-5% 0-5% 0-5% Os 0-5% 0-5% 0-5% 0-5% Pt 0-5% 0-5% 0-5% 0-5% Re 0-5% 0-5% 0-5% 0-5% Rh 0-5% 0-5% 0-5% 0-5% Se 0-5% 0-5% 0-5% 0-5% Si 0-5% 0-5% 0-5% 0-5% Sn 0-5% 0-5% 0-5% 0-5% Ta 0-5% 0-5% 20-35% 25-30% Tc 0-5% 0-5% 0-5% 0-5% Ti 0-5% 0-5% 0-5% 0-5% V 0-5% 0-5% 0-5% 0-5% W 0-5% 0-5% 1-8% 0-5% Y 0-5% 0-5% 0-5% 0-5% Zr 0.5-25% 0.75-5% 0.5-5% 0.75-3%

[0077] Element / Weight % Example 207 Example 208 Example 209 Example 210 Re 30-75% 40-75% 45-75% 45-70% Cr 25-70% 25-65% 25-55% 30-55% Mo 0-25% 0-25% 1-25% 2-25% Bi 0-25% 0-25% 0-25% 0-25% Cr 0-25% 0-25% 0-25% 0-25% Ir 0-25% 0-25% 0-25% 0-25% Nb 0-25% 0-25% 0-25% 0-25% Ta 0-25% 0-25% 0-25% 0-25% V 0-25% 0-25% 0-25% 0-25% W 0-25% 0-25% 0-25% 0-25% Mn 0-25% 0-25% 0-25% 0-25% Tc 0-25% 0-25% 0-25% 0-25% Ru 0-25% 0-25% 0-25% 0-25% Rh 0-25% 0-25% 0-25% 0-25% Hf 0-25% 0-25% 0-25% 0-25% Os 0-25% 0-25% 0-25% 0-25% Cu 0-25% 0-25% 0-25% 0-25% Ir 0-25% 0-25% 0-25% 0-25% Ti 0-25% 0-25% 0-25% 0-25% Y 0-25% 0-25% 0-25% 0-25% Zr 0-25% 0-25% 0-25% 0-25% C <0.06 <0.06 <0.06 <0.06 N <0.06 <0.06 <0.06 <0.06 O <0.06 <0.06 <0.06 <0.06

[0078] In Examples 1 to 210, it will be understood that all of the above ranges include any values ​​between the above ranges and any other ranges between the above ranges. Any of the above values ​​including the ≤ symbol include the range from 0 to the listed values, as well as all values ​​and ranges in between.

[0079] According to other and / or alternative non-limiting aspects of this disclosure, medical devices are generally designed to contain at least about 5 wt% (e.g., 5 to 100 wt%, and all values ​​and ranges in between) of a metal alloy. In one non-limiting embodiment of this disclosure, a medical device contains at least about 50 wt% of a metal alloy. In another non-limiting embodiment of this disclosure, a medical device contains at least about 95 wt% of a metal alloy. In one particular configuration, if the medical device includes an expandable frame, the expandable frame is formed of 50 to 100 wt% (and all values ​​and ranges in between) of a metal alloy, and typically 75 to 100 wt% of a metal alloy.

[0080] According to another and / or alternative non-limiting aspect of this disclosure, medical devices are provided which are partially or completely formed of a metal alloy containing a sufficient amount of rhenium to produce a “rhenium effect” in the metal alloy. As defined herein, the “rhenium effect” is a) an increase of at least 10% in ductility of a metal alloy caused by the addition of rhenium to the metal alloy, and / or b) an increase of at least 10% in tensile strength of a metal alloy caused by the addition of rhenium to the metal alloy. For many metal alloys, it has been found to result in improved ductility and / or tensile strength. It has been found that the addition of rhenium to a metal alloy can form a twisted alloy, and the reduction and / or work hardening of the metal alloy, including the addition of rhenium, increases the yield strength and tensile strength and increases the overall ductility of the metal alloy. The “rhenium effect” occurs when the atomic weight of rhenium in the metal alloy is at least 15% (e.g., 15 awt.% to 99 awt.% of rhenium in the metal alloy and all values ​​and ranges in between). For example, in the case of a standard stainless steel alloy, the "rhenium effect" may begin to appear when the stainless steel alloy is modified to contain at least 5–10 wt% rhenium (and all values ​​and ranges in between) of the stainless steel alloy. In the case of a standard CoCr alloy, the "rhenium effect" may begin to appear when the CoCr alloy is modified to contain at least 4.8–9.5 wt% rhenium (and all values ​​and ranges in between) of the CoCr alloy. In the case of a standard TiAlV alloy, the "rhenium effect" may begin to appear when the TiAlV alloy is modified to contain at least 4.5–9 wt% rhenium (and all values ​​and ranges in between) of the TiAlV alloy. As can be understood, the rhenium content in the above examples may be greater than the minimum amount required to produce the "rhenium effect" in a metallic alloy.

[0081] According to another and / or alternative non-limiting aspect of this disclosure, a medical device is provided in which a metal alloy is formed at 50–100% (and all values ​​and ranges in between) of a metal alloy containing a sufficient amount of rhenium to produce a “rhenium effect” in the metal alloy. In one non-limiting embodiment, the metal alloy comprises at least 15 awt.% of rhenium (e.g., 15 to 99.9 awt.%, and all values ​​and ranges between them), and at least 0.1 wt% (e.g., 0.1 wt% to 96 wt%, and all values ​​and ranges between them), one or more additives selected from the group consisting of aluminum, bismuth, calcium, carbon, cerium oxide, chromium, cobalt, copper, gold, hafnium, iridium, iron, lanthanum, lanthanum oxide, lead, magnesium, manganese, molybdenum, nickel, niobium, osmium, platinum, rare earth metals, rhodium, ruthenium, silver, tantalum, technetium, titanium, tungsten, vanadium, yttrium, yttrium oxide, zinc, zirconium, and / or zirconium oxide. In another non-limiting embodiment, the metal alloy comprises at least 15 awt.% of rhenium (e.g., 15 to 99.9 awt.% and all values ​​and ranges between them), and at least 0.1 wt% (e.g., 0.1 wt% to 96 wt%, all values ​​and ranges between them), and two or more additives selected from the group consisting of aluminum, bismuth, calcium, carbon, cerium oxide, chromium, cobalt, copper, gold, hafnium, iridium, iron, lanthanum, lanthanum oxide, lead, magnesium, manganese, molybdenum, nickel, niobium, osmium, platinum, rare earth metals, rhodium, ruthenium, silver, tantalum, technetium, titanium, tungsten, vanadium, yttrium, yttrium oxide, zinc, zirconium, and / or zirconium oxide.In another non-limiting embodiment, the metal alloy comprises at least 15 awt.% of rhenium (e.g., 15 to 99.9 awt.% and all values ​​and ranges between them), and at least 0.1 wt% (e.g., 0.1 wt% to 96 wt%, all values ​​and ranges between them), and three or more additives selected from the group consisting of aluminum, bismuth, calcium, carbon, cerium oxide, chromium, cobalt, copper, gold, hafnium, iridium, iron, lanthanum, lanthanum oxide, lead, magnesium, manganese, molybdenum, nickel, niobium, osmium, platinum, rare earth metals, rhodium, ruthenium, silver, tantalum, technetium, titanium, tungsten, vanadium, yttrium, yttrium oxide, zinc, zirconium, and / or zirconium oxide.

[0082] In other and / or alternative non-limiting embodiments of the present disclosure, the metal alloy optionally contains less than about 5 wt% (e.g., 0 to 4.999999 wt%, and all values ​​and ranges between them) of other metals and / or impurities, typically 0 to 1 wt%, more typically 0 to 0.1 wt%, even more typically 0 to 0.01 wt%, and even more typically 0 to 0.001 wt%. Higher purity levels of the metal alloy can form a more uniform alloy, which results in a more uniform density throughout the metal alloy and also yields a metal alloy with the desired yield and final tensile strength.

[0083] In another and / or alternative non-limiting aspect of the present disclosure, at least 30% by weight (e.g., 30 to 100% by weight, and all values ​​and ranges in between) of the metal alloy comprises one or more of molybdenum, niobium, rhenium, tantalum, or tungsten. In another non-limiting embodiment, at least 40% by weight of the metal alloy comprises one or more of molybdenum, niobium, rhenium, tantalum, or tungsten. In another non-limiting embodiment, at least 50% by weight of the metal alloy comprises one or more of molybdenum, niobium, rhenium, tantalum, or tungsten.

[0084] In another non-limiting embodiment, at least 50% by weight of the metal alloy (e.g., 50 to 100% by weight, and all values ​​and ranges between them) comprises one or more of molybdenum, niobium, rhenium, tantalum, titanium, zirconium, or tungsten, and 1 to 40% by weight of the metal alloy (and all values ​​and ranges between them) comprises one or more additives selected from the group consisting of aluminum, bismuth, calcium, carbon, cerium oxide, chromium, cobalt, copper, gold, hafnium, iridium, iron, lanthanum, lanthanum oxide, lead, magnesium, manganese, nickel, osmium, platinum, rare earth metals, rhodium, ruthenium, silver, technetium, vanadium, yttrium, yttrium oxide, zinc, and / or zirconium oxide.

[0085] According to another and / or alternative non-limiting aspect of the present disclosure, a metal alloy is provided in which at least 20% by weight (e.g., 20 to 99% by weight, and all values ​​and ranges between them) of the metal alloy contains rhenium. In one non-limiting embodiment, the metal alloy contains at least 20% by weight (e.g., 20 to 99.9% by weight, and all values ​​and ranges between them) of rhenium, and one or more additives selected from the group consisting of aluminum, bismuth, calcium, carbon, cerium oxide, chromium, cobalt, copper, gold, hafnium, iridium, iron, lanthanum, lanthanum oxide, lead, magnesium, manganese, molybdenum, nickel, niobium, osmium, platinum, rare earth metals, rhodium, ruthenium, silver, tantalum, technetium, titanium, tungsten, vanadium, yttrium, yttrium oxide, zinc, zirconium, and / or zirconium oxide, in an amount of 0.1 to 80% by weight (and all values ​​and ranges between them).

[0086] In another non-limiting aspect of this disclosure, the metals used to form the metallic alloy include rhenium and tungsten, and optionally, one or more alloying factors, for example, but not limited to, aluminum, bismuth, calcium, carbon, cerium oxide, chromium, cobalt, copper, gold, hafnium, iridium, iron, lanthanum, lanthanum oxide, lead, magnesium, manganese, molybdenum, nickel, niobium, osmium, platinum, rare earth metals, rhodium, ruthenium, silver, tantalum, technetium, titanium, vanadium, yttrium, yttrium oxide, zinc, zirconium, and / or zirconium oxide, and / or alloys of one or more such components (e.g., WRe, WReMo, etc.). In one non-limiting formulation, the metallic alloy contains up to 40 wt% rhenium and at least 60 wt% tungsten. In one non-limiting embodiment, the total weight percentages of tungsten and rhenium in the tungsten-rhenium alloy are at least about 95 wt%, typically at least about 99 wt%, more typically at least about 99.5 wt%, still more typically at least about 99.9 wt%, and even more typically at least about 99.99 wt. In another non-limiting formulation, the metallic alloy comprises up to 47.5 wt% rhenium and at least 20–80 wt% tungsten (and all values ​​and ranges between them) and 1–47.5 wt% molybdenum (and all values ​​and ranges between them).

[0087] According to another and / or alternative non-limiting aspect of this disclosure, at least 35% by weight (e.g., 35 to 75% by weight, and all values ​​and ranges between them) of the metal alloy contains rhenium, and the metal alloy also contains chromium. In one non-limiting embodiment, at least 25% by weight (e.g., 25 to 49.9% by weight, and all values ​​and ranges between them) of the metal alloy contains chromium. In another non-limiting embodiment, at least 30% by weight of the metal alloy contains chromium. In another non-limiting embodiment, at least 33% by weight of the metal alloy contains chromium. In another non-limiting embodiment, at least 50% by weight (e.g., 50–74.9% by weight and all values ​​and ranges between them) of the metal alloy contains rhenium, at least 25% by weight (e.g., 25–49.9% by weight and all values ​​and ranges between them) of the metal alloy contains chromium, and 0.1–25% by weight (and all values ​​and ranges between them) of the metal alloy contains one or more of molybdenum, bismuth, niobium, tantalum, titanium, vanadium, tungsten, manganese, zirconium, technetium, ruthenium, rhodium, hafnium, osmium, copper, yttrium, zirconium, and / or iridium. In another non-limiting embodiment, at least 55% by weight (e.g., 55–69.9% by weight and all values ​​and ranges between them) of the metal alloy contains rhenium, at least 30% by weight (e.g., 30–44.9% by weight and all values ​​and ranges between them) of the metal alloy contains chromium, and 0.1–15% by weight (and all values ​​and ranges between them) of the metal alloy contains one or more of molybdenum, bismuth, niobium, tantalum, titanium, vanadium, tungsten, manganese, zirconium, technetium, ruthenium, rhodium, hafnium, osmium, copper, yttrium, zirconium, and / or iridium.

[0088] According to another and / or alternative non-limiting aspect of the present disclosure, the metal alloy comprises 10 to 60 atomic percent (awt.%) of Re (and all values ​​and ranges between them), and one or more metals selected from the group consisting of Mo, Cr, Ta, Nb, Ti, and Zr. In one non-limiting embodiment, the metal alloy comprises 15 to 60 atw% of Re, and one or more metals selected from the group consisting of Cr, Ta, Nb, Ti, and Zr. In another non-limiting embodiment, the metal alloy comprises 15–60 awt% Re, and one or more metals selected from the group consisting of 0.5–70 awt% Cr (and all values ​​and ranges between them), 0.5–70 awt% Ta (and all values ​​and ranges between them), 0.5–70 at.% Nb (and all values ​​and ranges between them), 0.5–70 awt% Ti (and all values ​​and ranges between them), and 0.5–70 awt% Zr (and all values ​​and ranges between them).

[0089] According to another and / or alternative non-limiting aspect of this disclosure, the metal alloy comprises 0.5 to 50 awt.% Re (and all values ​​and ranges between them) and 0.5 to 70 awt.% Cr (and all values ​​and ranges between them).

[0090] According to another and / or alternative non-limiting aspect of this disclosure, the metal alloy includes 0.5 to 50 awt.% Re (and all values ​​and ranges between them) and 0.5 to 70 awt.% Ta (and all values ​​and ranges between them).

[0091] According to another and / or alternative non-limiting aspect of this disclosure, the metal alloy comprises 0.5 to 50 awt.% Re (and all values ​​and ranges between them) and 0.5 to 70 awt.% Nb (and all values ​​and ranges between them).

[0092] According to another and / or alternative non-limiting aspect of this disclosure, the metal alloy comprises 0.5 to 50 awt.% Re (and all values ​​and ranges between them) and 0.5 to 70 awt.% Ti (and all values ​​and ranges between them).

[0093] According to another and / or alternative non-limiting aspect of this disclosure, the metal alloy comprises more than 50 wt% titanium (e.g., 51–80 wt% and all values ​​and ranges between them), 15–45 wt% (and all values ​​and ranges between them) niobium, 1–10 wt% (and all values ​​and ranges between them) zirconium, and 1–15 wt% (and all values ​​and ranges between them) tantalum. In one non-limiting formulation, the metal alloy comprises 58–70 wt% titanium, 27–37 wt% niobium, 2–9 wt% zirconium, and 1–15 wt% tantalum.

[0094] According to another and / or alternative non-limiting aspect of this disclosure, the metal alloy comprises more than 50 wt% titanium (e.g., 51–80 wt% and all values ​​and ranges between them), 15–45 wt% niobium (and all values ​​and ranges between them), and 1–10 wt% molybdenum (and all values ​​and ranges between them). In one non-limiting formulation, the metal alloy comprises 58–69 wt% titanium, 27–33 wt% niobium, and 4–8 wt% molybdenum.

[0095] According to another and / or alternative non-limiting aspect of this disclosure, the metal alloy comprises 30–60 wt% cobalt (and all values ​​and ranges between them), 10–30 wt% chromium (and all values ​​and ranges between them), 5–20 wt% iron (and all values ​​and ranges between them), 5–22 wt% nickel (and all values ​​and ranges between them), and 2–12 wt% molybdenum (and all values ​​and ranges between them). In one non-limiting formulation, the metal alloy comprises 35–45 wt% cobalt, 15–25 wt% chromium, 12–20 wt% iron, 10–20 wt% nickel, and 5–9 wt% molybdenum.

[0096] According to another and / or alternative non-limiting aspect of this disclosure, the metal alloy comprises 40–60 wt% zirconium (and all values ​​and ranges between them) and 40–60 wt% molybdenum (and all values ​​and ranges between them). In one non-limiting formulation, the metal alloy comprises 45–55 wt% cobalt and 45–55 wt% molybdenum.

[0097] According to another and / or alternative non-limiting aspect of this disclosure, the metal alloy comprises 90–99.5 wt% niobium (and all values ​​and ranges between them) and 0.5–10 wt% zirconium (and all values ​​and ranges between them). In one non-limiting formulation, the metal alloy comprises 95–99.25 wt% niobium and 0.75–4 wt% niobium.

[0098] According to another and / or alternative non-limiting aspect of this disclosure, the metal alloy comprises 55–75 wt% niobium (and all values ​​and ranges between them), 18–40 wt% tantalum (and all values ​​and ranges between them), 1–7 wt% tungsten (and all values ​​and ranges between them), and 0.5–4 wt% zirconium (and all values ​​and ranges between them). In one non-limiting formulation, the metal alloy comprises 60–70 wt% niobium, 24–32 wt% tantalum, 2–5 wt% tungsten, and 0.75–3 wt% zirconium.

[0099] According to other and / or alternative non-limiting embodiments of this disclosure, the metal alloy contains less than about 5% by weight of other metals and / or impurities (e.g., 0 to 4.999999% by weight, and all values ​​and ranges in between). Higher purity levels of metal alloys allow for the formation of a more uniform alloy, which results in a more uniform density throughout the metal alloy and also leads to a metal alloy with the desired yield and final tensile strength. In one non-limiting embodiment, the metal alloy contains less than about 0.5% by weight of other metals and / or impurities. In another non-limiting embodiment, the metal alloy contains less than about 0.2% by weight of other metals and / or impurities. In another non-limiting embodiment, the metal alloy contains less than about 0.1% by weight of other metals and / or impurities. In another non-limiting embodiment, the metal alloy contains less than about 0.05% by weight of other metals and / or impurities. In another non-limiting embodiment, the metal alloy contains less than about 0.01% by weight of other metals and / or impurities.

[0100] According to other and / or alternative non-limiting aspects of this disclosure, medical devices are generally designed to contain at least about 5 wt% (e.g., 5 to 100 wt%, and all values ​​and ranges in between) of a metal alloy. In one non-limiting embodiment of this disclosure, a medical device contains at least about 50 wt% of a metal alloy. In another non-limiting embodiment of this disclosure, a medical device contains at least about 95 wt% of a metal alloy. In one particular configuration, if the medical device includes an expandable frame, the expandable frame is formed of 50 to 100 wt% (and all values ​​and ranges in between) of a metal alloy, and typically 75 to 100 wt% of a metal alloy.

[0101] According to other and / or alternative non-limiting aspects of this disclosure, metal alloys can be optionally nitrided, but this is not required. The nitrided layer on the metal alloy can act as a lubricating surface during optional drawing of the metal alloy when partially or completely forming a medical device. After the metal alloy has been nitrided, it is typically cleaned, but this is not required. During the nitriding process, the surface of the metal alloy is modified by the presence of nitrogen. The nitriding process can be by gas nitriding, salt bath nitriding, or plasma nitriding. In gas nitriding, nitrogen diffuses onto the surface of the metal alloy, thereby creating a nitrided layer. The thickness and phase composition of the resulting nitrided layer are selectable, and the process can be optimized to suit the required properties. During gas nitriding, the metal alloy is generally nitrided for at least 10 seconds at a temperature of at least about 400°C (e.g., 400–1000°C, and all values ​​and ranges in between) in the presence of nitrogen gas or a nitrogen gas mixture (e.g., 90–99% by volume N and 1–10% by volume H, etc.). In one non-restrictive nitriding process, the metal alloy is heated in the presence of nitrogen or a nitrogen-hydrogen mixture to a temperature of at least 400°C, and generally between approximately 400 and 800°C (and all values ​​and ranges in between), for at least 10 seconds (e.g., 10 seconds to 60 minutes, and all values ​​and ranges in between), and generally between approximately 1 and 30 minutes. In salt bath nitriding, nitrogen-containing salts such as cyanide salts are used. During salt bath nitriding, the metal alloy is generally exposed to a temperature of approximately 520 to 590°C. In plasma nitriding, the gas used is typically high-purity nitrogen. Plasma nitriding is often combined with a physical deposition (PVD) process, but this is not mandatory. Plasma nitriding of metal alloys generally occurs at temperatures between approximately 220 and 630°C (and all values ​​and ranges in between). The metal alloy can optionally be cleaned and / or preheated by exposure to argon and / or hydrogen gas before the nitriding process. These gases can be optionally used to clean oxide layers and / or solvents from the surface of metal alloys.During the nitriding process, the metal alloy can be optionally exposed to hydrogen gas to inhibit or prevent the formation of oxides on the surface of the metal alloy. The thickness of the nitrided surface layer is less than about 1 mm. In one non-limiting embodiment, the thickness of the nitrided surface layer is at least about 50 nanometers and less than about 1 mm (and all values ​​and ranges between them). In another non-limiting embodiment, the thickness of the nitrided surface layer is at least about 50 nanometers and less than about 0.1 mm. Generally, the weight percentage of nitrogen in the nitrided surface layer is between 0.0001 and 5 wt% nitrogen (and all values ​​and ranges between them). In one non-limiting embodiment, the weight percentage of nitrogen in the nitrided surface layer is generally less than one of the major components of the metal alloy, and typically less than each of the two major components of the metal alloy. For example, when a metal alloy is nitrided, the weight percentage of nitrogen in the nitrided surface layer is less than the weight percentage of rhenium in the nitrided surface layer. In one non-limiting composition of a nitrided surface layer on a metal alloy (e.g., 47–55 wt% rhenium, 10–46 wt% molybdenum, and 0.1–30 wt% additional metal alloying agent), the nitrided surface layer comprises at least 40 wt% rhenium, at least 8 wt% molybdenum, and 0.0001–5 wt% nitrogen (and all values ​​and ranges in between). In one non-limiting embodiment of the present disclosure, the surface of the metal alloy is nitrided before at least one throttling step for the metal alloy. In another non-limiting embodiment of the present disclosure, after the metal alloy has been annealed, the metal alloy is nitrided before throttling. In another and / or alternative non-limiting embodiment, the metal alloy is cleaned to remove nitride compounds from the surface of the metal alloy before the metal alloy is annealed. Nitride compounds can be removed by various steps, but are not limited, such as grit blasting and polishing. After the metal alloy has been annealed, the metal alloy can be nitrided again before one or more throttling steps, but this is not required. As can be understood, the entire outer surface of a metal alloy can be nitrided, or a portion of the outer surface of a metal alloy can be nitrided.By nitriding only selected portions of the outer surface of a metal alloy, different surface properties can be obtained on the metal alloy, although this is not mandatory. As can be understood, the final metal alloy may include a nitrided outer surface. By using a nitriding process on a metal alloy, the surface hardness and / or wear resistance of a medical device can be increased, and / or discoloration of the metal alloy (e.g., discoloration due to oxidation) can be inhibited or prevented. For example, a nitriding process can be used to increase the wear resistance of joint surfaces or surface wear on a metal alloy used in a medical device, thereby extending the life of the medical device, and / or increasing the wear life of mating surfaces on a medical device (e.g., polyethylene liners for joint implants such as knee, hip, and shoulder), and / or reducing particle generation from the use of the medical device, and / or maintaining the outer appearance of the metal alloy on the medical device.

[0102] According to another and / or alternative non-limiting aspects of this disclosure, a metal alloy may optionally be cleaned, polished, sterilized, nitrided, etc., for final treatment of the metal alloy immediately before or after it is partially or completely formed into a desired medical device. In one non-limiting embodiment of this disclosure, the metal alloy is electropolished. In one non-limiting aspect of this embodiment, the metal alloy is cleaned before exposure to the polishing solution, but this is not mandatory. The cleaning process (if used) can be achieved by a variety of techniques, including, but is not limited to, 1) wiping the metal alloy with a Kimwipe or other suitable towel using a solvent (e.g., acetone, methyl alcohol, etc.), and / or 2) at least partially immersing or immersing the metal alloy in the solvent and then ultrasonically cleaning the metal alloy. As can be understood, the metal alloy may be cleaned in other or additional ways. In another and / or alternative non-limiting aspect of this embodiment, the polishing solution may contain one or more acids. In yet another and / or alternative non-limiting embodiment of this embodiment, the metal alloy is rinsed with water and / or a solvent and dried to remove the abrasive solution from the metal alloy.

[0103] According to other and / or alternative non-limiting aspects of this disclosure, a medical device may optionally contain and / or coat one or more agents that readily produce favorable results in the medical device and / or therapeutic area. The term “agent” includes, but is not limited to, substances, pharmaceuticals, biological and veterinary products, drugs, and analogs or derivatives otherwise formulated and / or designed to prevent, inhibit and / or treat, and / or promote the healing of one or more clinical and / or biological events. Non-exclusive examples of clinical events that can be addressed by one or more drugs include viral, fungal and / or bacterial infections, vascular diseases and / or disorders, gastrointestinal diseases and / or disorders, reproductive diseases and / or disorders, lymphatic diseases and / or disorders, cancer, implant rejection, pain, nausea, swelling, arthritis, bone diseases and / or disorders, organ failure, immune diseases and / or disorders, cholesterol problems, blood disorders and / or disorders, lung diseases and / or disorders, heart diseases and / or disorders, brain diseases and / or disorders, neuralgia diseases and / or disorders, kidney diseases and / or disorders, ulcers, liver diseases and This includes, but is not limited to, disorders, intestinal diseases and / or disorders, gallbladder diseases and / or disorders, pancreatic diseases and / or disorders, psychological disorders, respiratory diseases and / or disorders, glandular diseases and / or disorders, skin diseases and / or disorders, hearing diseases and / or disorders, oral diseases and / or disorders, nasal diseases and / or disorders, eye diseases and / or disorders, fatigue, genetic disorders and / or disorders, burns, scars and / or wounds, trauma, weight disorders and / or disorders, toxic diseases and / or disorders, alopecia, convulsions, muscle spasms, tissue repair, nerve repair, nerve regeneration, and / or similar conditions. The types and / or amounts of drugs contained in and / or coated on a medical device may vary. When two or more drugs are contained in and / or coated on a medical device, the amounts of the two or more drugs may be the same or different.One or more agents can be coated and / or impregnated onto a medical device by various mechanisms, including, but not limited to, spraying (e.g., atomizing spray technology), flame spray coating, powder deposition, dip coating, flow coating, dip spin coating, roll coating (direct and reverse), sonication, brushing, plasma deposition, deposition by vapor deposition, MEMS technology, and rotational deposition. In other and / or alternative, non-limiting embodiments of this disclosure, the types and / or amounts of agents included on, within, and / or in conjunction with a medical device are generally selected for the treatment of one or more medical procedures. The amounts of two or more agents used on, within, and / or in conjunction with a medical device may be the same or different. One or more agents, when used on and / or within a medical device, may be released in an optional, controlled manner so that a desired dose of the agent is provided to the area of ​​the problem to be treated over a duration. As can be understood, controlled release of one or more agents on a medical device is not necessarily essential and / or desirable. Therefore, one or more drugs on and / or within a medical device may be released uncontrollably from the medical device during and / or after insertion into the therapeutic area. It can also be understood that one or more drugs on and / or within a medical device may be released controllably from the medical device, and one or more drugs on and / or within a medical device may be released uncontrollably from the medical device. It can also be understood that one or more drugs on and / or within one area of ​​a medical device may be released controllably from the medical device, and one or more drugs on and / or within a medical device may be released uncontrollably from another area of ​​the medical device.Therefore, a medical device can be designed so that 1) all drugs on and / or within the medical device are released in a controllable manner, 2) some drugs on and / or within the medical device are released in a controllable manner and some drugs on the medical device are released in an uncontrollable manner, or 3) none of the drugs on and / or within the medical device are released in a controllable manner. A medical device can also be designed so that the release rates of one or more drugs from the medical device are the same or different. A medical device can also be designed so that the release rates of one or more drugs from one or more areas on the medical device are the same or different. Non-limiting configurations that can be used to control the release of one or more drugs from a medical device include 1) at least partially coating one or more drugs with one or more polymers, 2) at least partially incorporating one or more drugs into one or more polymers and / or at least partially encapsulating them, and / or 3) inserting one or more drugs into pores, passages, cavities, etc., within the medical device and at least partially coating or covering such pores, passages, cavities, etc., with one or more polymers. As can be understood, other or additional configurations may be used to control the release of one or more drugs from a medical device. One or more polymers may be porous or nonporous when used to control, at least partially, the release of one or more drugs from a medical device. One or more drugs may be inserted into and / or coated onto one or more surface structures and / or microstructures on a medical device, and / or can be used to at least partially form one or more surface structures and / or microstructures on a medical device. Thus, one or more drugs on a medical device may 1) be coated onto one or more surface areas of the medical device, 2) be inserted into and / or impregnated into one or more surface structures and / or microstructures of the medical device, and / or 3) form or be included in at least a part of the structure of the medical device.When one or more drugs are coated onto a medical device, the one or more drugs can be 1) directly coated onto one or more surfaces of the medical device, 2) mixed with one or more coating polymers or other coating materials and then at least partially coated onto one or more surfaces of the medical device, 3) at least partially coated onto the surface of another coating material that is at least partially coated on the medical device, and / or 4) a) at least partially encapsulated between a surface or area of ​​the medical device and one or more other coating materials, and / or b) at least partially encapsulated between two or more other coating materials. As can be understood, many other coating configurations can be used additionally or alternatively. When one or more drugs are optionally inserted and / or impregnated into one or more internal structures, surface structures, and / or microstructures of the medical device, 1) one or more other coating materials can be at least partially applied onto one or more internal structures, surface structures, and / or microstructures of the medical device, and / or 2) one or more polymers can be combined with one or more drugs. Therefore, one or more agents can be 1) embedded within the structure of a medical device, 2) positioned within one or more internal structures of a medical device, 3) encapsulated between two polymer coatings, 4) encapsulated between a base structure and a polymer coating, 5) mixed within a base structure of a medical device containing at least one polymer coating, or 6) one or more combinations of 1, 2, 3, 4, and / or 5. In addition or alternatively, one or more coatings of one or more polymers on a medical device can include 1) one or more coatings of non-porous polymers, 2) one or more coatings of a combination of one or more porous polymers and one or more non-porous polymers, 3) one or more coatings of porous polymers, or 4) one or more combinations of options 1, 2, and 3.As can be understood, different drugs can be optionally located within and / or between different polymer coating layers, and / or on the structure of a medical device. Also as can be understood, many other and / or additional coating combinations and / or structures can be used. The release time, release rate, and / or dosage of one or more drugs can be controlled by combinations of the concentration of one or more drugs, the type of polymer, the type and / or shape of the internal structure within the medical device, and / or the coating thickness of one or more drugs, but other or additional combinations can be used. Thus, there can be a multitude of drug and polymer system combinations and locations on the medical device. Also as can be understood, one or more drugs can be deposited on the surface of a medical device to provide an uncontrolled initial burst effect of one or more drugs before 1) controlled release of one or more drugs through one or more layers of a polymer system containing one or more nonporous polymers, and / or 2) uncontrolled release of one or more drugs through one or more layers of the polymer system. One or more agents and / or polymers can be coated onto medical devices by various mechanisms, including, but not limited to, spraying (e.g., atomizing spray technology), dip coating, roll coating, ultrasonic treatment, brushing, plasma deposition, and / or vapor deposition.

[0104] According to other and / or alternative non-limiting aspects of this disclosure, various polymers can be optionally coated onto a medical device and / or used to form at least a part of the medical device. One or more polymers can be used on a medical device for a variety of reasons, including, but are not limited to, 1) forming a part of the medical device, 2) improving the physical properties of the medical device (e.g., improving strength, improving durability, improving biocompatibility, reducing friction, etc.), 3) forming a protective coating on one or more surface structures on the medical device, 4) forming one or more surface structures on the medical device at least partially, and / or 5) at least partially controlling the release rate of one or more drugs from the medical device. As can be understood, one or more polymers may have other or additional applications on a medical device. One or more polymers may be porous, non-porous, biostable, biodegradable (i.e., dissolving, decomposing, being absorbed, or any combination thereof) and / or biocompatible. If a medical device is coated with one or more polymers, the polymers may include 1) one or more coatings of non-porous polymers, 2) one or more coatings of a combination of one or more porous polymers and one or more non-porous polymers, 3) one or more coatings of one or more porous polymers and one or more coatings of one or more non-porous polymers, 4) one or more coatings of porous polymers, or 5) one or more combinations of options 1, 2, 3, and 4. The thickness of the one or more polymer layers may be the same or different. If the one or more polymer layers coat at least a portion of the medical device, the one or more coatings may be applied by a variety of techniques, but are not limited to, vapor deposition and / or plasma deposition, spraying, dip coating, roll coating, sonication, atomization, brushing, and / or similar, although other or additional coating techniques may be used.One or more polymers that can be coated onto a medical device and / or used to form at least partially a medical device may be polymers considered to be biodegradable, bioabsorbable, or bioerosive, polymers considered to be biostable, and / or polymers that can be made biodegradable and / or bioabsorbable by modification. The thickness of each polymer layer is generally at least about 0.01 μm and generally less than about 150 μm (e.g., 0.01 μm to 150 μm, and all values ​​and ranges in between), but other thicknesses can be used. In one non-limiting embodiment, the thickness of the polymer layer and / or drug layer is about 0.02 to 75 μm, more specifically about 0.05 to 50 μm, and even more specifically about 1 to 30 μm. Other thicknesses can be used, as can be understood.

[0105] According to other and / or alternative non-limiting aspects of this disclosure, a medical device may contain and / or be coated with one or more agents, if one or more agents are included and / or coated with one or more agents, such that they are the same or different in different areas of the medical device and / or in different amounts and / or concentrations in different areas of the medical device. For example, a medical device may 1) be coated with and / or contain one or more biological substances in at least one part of the medical device, and at least another part of the medical device may not be coated with an agent and / or contain an agent; 2) be coated with and / or contain one or more biological substances in at least one part of the medical device, different from the one or more biological substances in at least another part of the medical device, and / or 3) be coated with and / or contain one or more biological substances at a concentration in at least one part of the medical device different from the concentration of one or more biological substances in at least another part of the medical device.

[0106] According to other and / or alternative non-limiting aspects of the present disclosure, one or more parts of a medical device may optionally include: 1) the same or different agents; 2) the same or different amounts of one or more agents; 3) the same or different polymer coatings; 4) the same or different coating thicknesses of one or more polymer coatings; 5) one or more parts of the medical device may controllly and / or uncontrollably release one or more agents; and / or 6) one or more parts of the medical device may controllly release one or more agents and one or more parts of the medical device may uncontrollably release one or more agents.

[0107] According to another and / or alternative non-limiting aspect of this disclosure, a medical device may optionally include a marker material that facilitates the proper positioning of the medical device in a body passage. The marker material is typically designed to be visible to electromagnetic waves (e.g., X-rays, microwaves, visible light, infrared waves, ultraviolet waves, etc.), sound waves (e.g., ultrasound, etc.), magnetic waves (e.g., MRI, etc.), and / or other types of electromagnetic waves (e.g., microwaves, visible light, infrared waves, ultraviolet waves, etc.). The marker material may form all or part of the medical device and / or be coated on one or more parts of the medical device (e.g., a flared portion and / or a body portion, the end of the medical device, the transition between the body portion and the flared portion or near thereto). The location of the marker material may be one or more locations on the medical device. The size of the one or more areas containing the marker material may be the same or different. The marker materials may be spaced apart from each other at a specified distance to form ruler-like markings on the medical device to facilitate the positioning of the medical device in a body passage. The marker material may be rigid or flexible. The marker material may be biostable or biodegradable.

[0108] According to other and / or alternative non-limiting aspects of this disclosure, a medical device or one or more areas of a medical device may be optionally constructed by using one or more micro-electromechanical manufacturing (MEMS) techniques (e.g., microfabrication, laser microfabrication, microforming, etc.), but other or additional manufacturing techniques may be used.

[0109] According to other and / or alternative non-limiting aspects of this disclosure, a medical device may optionally include one or more surface structures (e.g., pores, passages, holes, ribs, slots, notches, projections, teeth, needles, depressions, holes, grooves, etc.). These structures can be formed at least partially by MEMS (e.g., microfabrication, etc.) technology and / or other types of technology.

[0110] According to other and / or alternative non-limiting aspects of this disclosure, a medical device may optionally include one or more microstructures on the surface of the medical device (e.g., structures such as microneedles, micropores, microcylinders, microcones, micropyramids, microtubes, microparallelohedrons, microprisms, microhemispheric structures, teeth, ribs, bumps, ratchets, hinges, zippers, and cable ties). As defined herein, “microstructure” is a structure having at least one dimension (e.g., average width, average diameter, average height, average length, average depth, etc.) which is about 2 mm or less, typically about 1 mm or less. As can be understood, if a medical device includes one or more surface structures, then 1) all surface structures may be microstructures, 2) all surface structures may be non-microstructures, or 3) some of the surface structures may be microstructures and some may be non-microstructures. Typically, microstructures (if formed) extend from or into the outer surface for approximately 400 microns (0.01 to 400 microns, and all values ​​and ranges in between), more typically less than approximately 300 microns, and more typically 15 to 250 microns, but other sizes may be used. Microstructures may be clustered together or dispersed across the entire surface of the medical device. Microstructures and / or surface structures of similar shapes and / or sizes may be used, or microstructures of different shapes and / or sizes may be used. If one or more surface structures and / or microstructures are designed to extend from the surface of the medical device, one or more surface structures and / or microstructures may be formed in extended locations and / or designed to extend from the medical device during and / or after deployment in the therapeutic area. Microstructures and / or surface structures may, but are not required, be designed to accommodate and / or fluidly connect to passages, cavities, etc. One or more surface structures and / or microstructures may be used to engage with and / or penetrate surrounding tissues or organs once the medical device is positioned on and / or within the patient, but this is not required.One or more surface structures and / or microstructures can be used to facilitate the formation and maintenance of the shape of a medical device. In one non-limiting embodiment, one or more surface structures and / or microstructures can be formed at least partially from a drug and / or from a polymer. One or more surface structures and / or microstructures can, but are not required, include one or more internal passages that can contain one or more materials (e.g., drugs, polymers, etc.). One or more coatings and / or one or more surface structures and / or microstructures of a medical device can be used for a variety of purposes, but are not limited to: 1) increasing the bonding and / or adhesion of one or more drugs, adhesives, marker materials, and / or polymers to the medical device; 2) changing the appearance or surface properties of the medical device; and / or 3) controlling the release rate of one or more drugs. One or more microstructures and / or surface structures may be biostable, biodegradable, etc. A medical device or one or more areas of a medical device may be at least partially covered and / or filled with a protective material to at least partially protect one or more areas of the medical device, and / or one or more microstructures, and / or surface structures of the medical device from damage. The protective material may include one or more polymers prior to identified above. The protective material may be 1) biostable and / or biodegradable, and / or 2) porous and / or nonporous.

[0111] According to other and / or alternative non-limiting aspects of this disclosure, a medical device may optionally be an expandable device that can be expanded by the use of several other devices (e.g., balloons). The expandable medical device may be manufactured from a material that has no or substantially no shape memory properties.

[0112] According to other and / or alternative non-limiting embodiments of this disclosure, a near-net process for frames or other metallic components of medical devices is optionally provided. In one non-limiting embodiment of this disclosure, a method is provided for powder pressurizing a material and increasing its strength after sintering by adding additional cold working. In one non-limiting embodiment, an unprocessed portion is pressurized and then sintered. The sintered portion is then pressurized again, and its mechanical strength is increased by applying cold working to the pressurized and sintered portion. Generally, the temperature during the pressurizing process after the sintering process is 20 to 100°C (and all values ​​and ranges between them), typically 20 to 80°C, and more typically 20 to 40°C. Cold working, as defined herein, is performed at temperatures below 150°C (e.g., 10 to 150°C, and all values ​​and ranges between them). It is necessary to determine the shape changes of the repressurized post-sintered part so that the final part (pressurized, sintered, and repressurized) meets the dimensional requirements of the final molded part. For metal alloys, a prepress pressure of 1–300 tsi (1 ton per square inch) (and all values ​​and ranges in between) can be used, followed by a sintering process at at least 1600°C (e.g., 1600–2600°C and all values ​​and ranges in between), and post-sintering pressurization at a pressure of 1–300 tsi (and all values ​​and ranges in between) at a temperature of at least 20°C (e.g., 20–100°C and all values ​​and ranges in between, 20–40°C, etc.). Processes are also provided to increase the mechanical strength of pressurized metal parts by repressurizing the post-sintered parts to impart additional cold working to the material, thereby increasing its mechanical strength. Processes are also provided to powder pressurize near-net or final parts using metal powder. In one non-limiting embodiment, the metal powder used to form a nearnet or final part comprises one or more elements from among rhenium, molybdenum, titanium, cobalt, iron, boron, nickel, tungsten, tantalum, aluminum, vanadium, chromium, niobium, silicon, manganese, carbon, zirconium, iridium, titanium, bismuth, and yttrium.

[0113] According to other and / or alternative non-limiting embodiments of this disclosure, pressurization of near-net or finished part composites is optionally provided. While processes for pressurizing metals into near-net finished parts are well established, pressurizing composite structures formed from metal powders and polymers for the purpose of creating complex part shapes and foam-like structures is novel. Similarly, using pressurization processes to impart specific biological substances to a metal matrix is ​​also novel. In one non-limiting embodiment, a process is provided for creating a beam or foam structure comprising mixing metal and polymer powders to create a metal part with predefined voids, pressurizing the powder into a finished part or a semi-finished green part, and then sintering the part under conditions where the polymer leaves the metal, through a polymer thermal decomposition process. The porosity of the resulting part relates to the size of the polymer particles and the uniformity of the mixture at pressurization before sintering. In another non-limiting embodiment, a process is provided on a metal substrate in which polymer residues are left after thermal decomposition, and these polymer residues have several desired biological effects (e.g., masking the metal from the body by encapsulation, cell binding, and growth promotion). Polymers and metal powders can be of various sizes to create multiple voids, some large to create pathways for cell growth, and some small to create a rough surface to promote cell adhesion. As can be understood, polymers can be dispersed uniformly or non-uniformly with metal powders. For example, if the final formed part will have a uniform density and pore structure, the polymer material may be uniformly dispersed with metal powders before the polymer and metal powders are bonded and pressurized together, and then the metal powders may be sintered together to form a metal part or medical device.Alternatively, if the formed metal part or medical device has one or more channels, passages, and / or voids on its exterior and / or within the formed part or medical device, at least a portion of the polymer will not be uniformly distributed with the metal powder, but instead, all of the regions that are one or more channels, passages, and / or voids will be concentrated or formed on the exterior and / or within the formed part or medical device, and when the polymer and metal powder are sintered, some or all of the polymer will decompose and be removed from the part or medical device, thereby forming one or more channels, passages, and / or voids on the exterior and / or within the formed part or medical device. Thus, the use of polymers in combination with metal powder, as well as subsequent pressurization and sintering, can be used to form novel and customized shapes for medical devices or near-net forms of medical devices. Generally, the polymer constitutes about 0.1–70 volume% (and all values ​​and ranges between them) of the bonded and pressurized material prior to the sintering step; typically, the polymer constitutes about 1–60 volume% of the bonded and pressurized material prior to the sintering step; more typically, the polymer constitutes about 2–50 volume% of the bonded and pressurized material prior to the sintering step; and even more typically, the polymer constitutes about 2–45 volume% of the bonded and pressurized material prior to the sintering step. Therefore, if the polymer constitutes about 5 volume% of the bonded and pressurized material prior to the sintering step, and at least 99% of the polymer is decomposed and removed from the part or medical device after the sintering step, the part may contain up to about 5 volume% of cavities and / or passages within the part or medical device. The type of polymer and the type of metal powder are not limiting. Polymers and metal powders can be of various sizes to create multiple voids / passages / channels, which can be used to create passages for cell proliferation, create rough surfaces to promote cell adhesion, have biological agents inserted into one or more of the voids / passages / channels, and have biological materials inserted into one or more of the voids / passages / channels.In one non-limiting embodiment, the average particle size of the polymer is larger than the average particle size of the metal powder.

[0114] According to another and / or alternative non-limiting aspect of the present disclosure, after the sintering process, at least 98 volume percent of the polymer is thermally decomposed and / or removed from the sintered material, typically at least 99 volume percent of the polymer is thermally decomposed and / or removed from the sintered material, more typically at least 99.5 volume percent of the polymer is thermally decomposed and / or removed from the sintered material, even more typically at least 99.9 volume percent of the polymer is thermally decomposed and / or removed from the sintered material, and even more typically at least 99.95 volume percent of the polymer is thermally decomposed and / or removed from the sintered material. The resulting component or medical device has porosity relating to the size of the polymer particles, as well as the uniformity of the mixture, when pressurized before sintering.

[0115] According to another and / or alternative non-limiting aspect of the present disclosure, after the sintering process, a portion of the polymer remains in the sintered portion of the medical device. The remaining polymer in the sintered portion of the medical device may optionally have several desired biological effects (e.g., masking the metal from the body by encapsulation, cell adhesion and proliferation promotion). The remaining polymer may optionally contain one or more biological agents that maintain activity after the sintering process. In one non-limiting embodiment, after the sintering process, about 5–97.5 volume% of the polymer (and all values ​​and ranges between them) is thermally decomposed and / or removed from the sintered material, typically about 10–95 volume% of the polymer is thermally decomposed and removed from the sintered material, and more typically about 10–80 volume% of the polymer is thermally decomposed and removed from the sintered material.

[0116] According to other and / or alternative non-limiting aspects of this disclosure, a metal alloy used to form at least partially a medical device is first formed into a blank, rod, tube, etc., and then finished to a final form by one or more finishing processes. Metal alloy blanks, rods, tubes, etc., can be formed by various techniques, but are not limited to: 1) melting the metal alloy and / or the metal forming the metal alloy (e.g., vacuum arc melting), and then extruding and / or casting the metal alloy into a blank, rod, tube, etc.; 2) melting the metal alloy and / or the metal forming the metal alloy to form a metal strip, and then rolling and welding the strip into a blank, rod, tube, etc.; or 3) fixing metal powder of the metal alloy and / or metal powder of the metal forming the metal alloy into a blank, rod, tube, etc. When the metal alloy is formed into a blank, the shape and size of the blank are non-limiting. In one non-limiting process, a near-net medical device, blank, rod, tube, etc., can be formed from one or more ingots of metal or metal alloy. In one non-limiting process, an arc melting process (e.g., a vacuum arc melting process) can be used to form near-net medical devices, blanks, rods, tubes, etc. In another non-limiting process, rhenium powder and tungsten powder, and optionally molybdenum powder, can be placed in a crucible (e.g., a silica crucible) and heated by an induction melting furnace under a controlled atmosphere (e.g., a vacuum environment, a carbon monoxide environment, a hydrogen and argon environment, helium, argon, etc.) to form near-net medical devices, blanks, rods, tubes, etc. It can be understood that metal alloys can be formed using other or additional processes. In one non-limiting embodiment, the average particle size of the metal powder is less than about 230 mesh (e.g., less than 63 microns). In another and / or alternative non-limiting embodiment, the average particle size of the metal powder is about 2 to 63 microns, more specifically about 5 to 40 microns. As can be understood, smaller average particle sizes can be used.The purity of the metal powder should be selected so that it contains very low levels of carbon, oxygen, and nitrogen. Typically, the carbon content of metal powder used to form metal alloys is less than about 100 ppm, the oxygen content is less than about 50 ppm, and the nitrogen content is less than about 20 ppm. Typically, the metal powder used to form metal alloys has a purity grade of at least 99.9, more typically at least about 99.95. The blend of metal powders is then pressurized together to form a solid solution of the metal alloy, which can be used for nearnet medical devices, blanks, rods, tubes, etc. Typically, the pressurization process is by an isostatic process (i.e., uniform pressure applied from all sides of the metal powder), but other processes can also be used. When metal powders are pressurized together isotropically, cold isotropic pressurization (CIP) is typically used to solidify the metal powders. However, this is not mandatory. The pressurization process can be carried out in an inert atmosphere, an oxygen-reduced atmosphere (e.g., hydrogen, argon, and hydrogen mixtures, etc.) and / or under vacuum, but this is not mandatory. The average density of nearnet medical devices, blanks, rods, tubes, etc., achieved by pressurizing metal powders together is approximately 80–95% (and all values ​​and ranges between them) of the final average density of nearnet medical devices, blanks, rods, tubes, etc., or approximately 70–96% (and all values ​​and ranges between them) of the minimum theoretical density of the metal alloy. A pressurizing pressure of at least approximately 300 MPa is commonly used. Typically, the pressurizing pressure is approximately 400–700 MPa, but other pressures can also be used. After the metal powders are pressurized together, the pressurized metal powders are sintered at a temperature of at least 1600°C (e.g., 1600–3500°C, and all values ​​and ranges between them) to partially or completely fuse the metal powders to form nearnet medical devices, blanks, rods, tubes, etc. Sintering of the fused metal powders can be carried out in an oxygen-reduced atmosphere (e.g., helium, argon, hydrogen, argon and hydrogen mixtures, etc.) and / or under vacuum, but this is not mandatory.At high sintering temperatures, a high hydrogen atmosphere reduces the amount of both carbon and oxygen in the formed near-net medical devices, blanks, rods, tubes, etc. Sintered metal powders generally have a sintered average density of about 90–99% of the minimum theoretical density of the metal alloy. Typically, sintered metal alloys have a final average density of at least about 5 gm / cc, usually at least about 8.3 gm / cc, and can be up to about 16 gm / cc or more, but this is not mandatory. The density of the formed near-net medical devices, blanks, rods, tubes, etc. generally depends on the type of metal alloy used.

[0117] According to other and / or alternative non-limiting aspects of this disclosure, nearnet medical devices, blanks, rods, tubes, etc., may optionally be cleaned and / or polished after they have been formed, but this is not mandatory. Typically, nearnet medical devices, blanks, rods, tubes, etc., are cleaned and / or polished before further processing, but this is not mandatory. If nearnet medical devices, blanks, rods, tubes, etc., are resized and / or annealed, the resized and / or annealed nearnet medical devices, blanks, rods, tubes, etc., are typically cleaned and / or polished before and / or after a series of resizing and / or annealing processes, but this is not mandatory. Cleaning and / or polishing of nearnet medical devices, blanks, rods, tubes, etc., is used to remove impurities and / or contaminants from the surface of nearnet medical devices, blanks, rods, tubes, etc. Impurities and contaminants may be incorporated into the metal alloy during processing of nearnet medical devices, blanks, rods, tubes, etc. The inadvertent incorporation of impurities and contaminants into nearnet medical devices, blanks, rods, tubes, etc., can result in undesirable amounts of carbon, nitrogen, and / or oxygen, as well as other impurities, in the metal alloy. The presence of impurities and contaminants in a metal alloy can lead to premature microcracks and / or adverse effects on one or more physical properties of the metal alloy (e.g., decreased tensile elongation, increased ductility, increased brittleness, etc.). Cleaning of metal alloys can be achieved by a variety of techniques, including, but are not limited to, 1) wiping the metal alloy with a Kimwipe or other suitable towel using a solvent (e.g., acetone, methyl alcohol, etc.), 2) at least partially immersing or soaking the metal alloy in a solvent, followed by ultrasonic cleaning, and / or 3) at least partially immersing or soaking the metal alloy in an acid pickling solution. As can be understood, metal alloys can be cleaned by other or additional methods.When metal alloys are polished, they are generally polished using polishing solutions that typically contain acidic solutions, although this is not mandatory.

[0118] According to other and / or alternative non-limiting aspects of this disclosure, nearnet medical devices, blanks, rods, tubes, etc., can be resized to desired dimensions of a medical device. In one non-limiting embodiment, the cross-sectional area or diameter of a nearnet medical device, blank, rod, tube, etc., is reduced to final dimensions of the nearnet medical device, blank, rod, tube, etc., by a single step or a series of steps. Reduction of the outer cross-sectional area or diameter of a nearnet medical device, blank, rod, tube, etc., is achieved by centerless grinding, turning, electropolishing, drawing processes, grinding, laser cutting, shaving, polishing, EDM cutting, etc. The outer cross-sectional area or diameter size of a nearnet medical device, blank, rod, tube, etc., can be reduced by using one or more drawing processes, but this is not required. During the drawing process, care must be taken to prevent the formation of microcracks in the nearnet medical device, blank, rod, tube, etc., while reducing the outer cross-sectional area or diameter of the nearnet medical device, blank, rod, tube, etc.

[0119] One non-limiting object of this disclosure is to provide a metal alloy according to this disclosure that can be used to partially or completely form a medical device.

[0120] Another and / or alternative non-limiting object of the present disclosure is to provide a medical device partially or completely formed of the metal alloy of the present disclosure, wherein the medical device improves surgical success rates.

[0121] Another and / or alternative non-limiting object of this disclosure is to provide a method and process for forming a metal alloy according to this disclosure that inhibits or prevents the formation of microcracks during processing of the metal alloy.

[0122] Another and / or alternative non-limiting object of this disclosure is to provide medical devices having improved physical properties, which are partially or completely formed from metal alloys as described herein.

[0123] Another and / or alternative non-limiting object of the present disclosure is to provide a medical device having increased strength and / or hardness, which is at least partially formed of a metal alloy according to the present disclosure.

[0124] Another and / or alternative non-limiting object of the present disclosure is to provide a medical device comprising, at least partially, a metal alloy as described herein, which enables the medical device to be formed with less material without sacrificing the strength of the medical device compared to conventional medical devices.

[0125] Another and / or alternative non-limiting object of this disclosure is to provide a method and process for forming a metal alloy according to this disclosure that inhibits or prevents the formation of microcracks during processing of the metal alloy into a medical device.

[0126] Another and / or alternative non-limiting object of this disclosure is to provide methods and processes for forming metal alloys according to this disclosure that inhibit or prevent crack propagation and / or fatigue fracture of the metal alloys.

[0127] Another and / or alternative non-limiting object of this disclosure is to provide a medical device having a nitriding process for forming a nitrided layer on the outer surface of a metal alloy.

[0128] Another and / or alternative non-limiting object of this disclosure is to provide medical devices in which a metal alloy has undergone swaging.

[0129] Another and / or alternative non-limiting object of this disclosure is to provide medical devices comprising a metal alloy, wherein the metal alloy has undergone a cold working process.

[0130] Another and / or alternative non-limiting object of this disclosure is to provide medical devices comprising metal alloys with increased strength and / or hardness compared to standard stainless steel, standard chromium-cobalt alloy, or standard titanium alloy.

[0131] Another and / or alternative non-limiting object of this disclosure is to provide a medical device comprising a metal alloy that requires a smaller amount of metal alloy to achieve similar strength compared to medical devices formed of different metals.

[0132] Another and / or alternative non-limiting object of this disclosure is to provide medical devices comprising metal alloys, wherein the medical device has a smaller crimp profile compared to medical devices formed of different metals.

[0133] Another and / or alternative non-limiting object of this disclosure is to provide a medical device comprising a metal alloy having thinner walls and further achieving similar or improved radial strength compared to a medical device with thicker walls formed of standard stainless steel, standard chromium-cobalt alloy, or standard titanium alloy.

[0134] Another and / or alternative non-limiting object of this disclosure is to provide medical devices comprising metal alloys having improved stress-strain properties, bendability properties, elongation properties, and / or flexibility properties compared to medical devices formed of stainless steel, titanium steel, or chromium-cobalt alloys.

[0135] Another and / or alternative non-limiting object of this disclosure is to provide medical devices comprising metal alloys that have an extended lifespan compared to medical devices formed from standard stainless steel, standard titanium steel, or standard chromium-cobalt alloys.

[0136] Another and / or alternative non-limiting object of this disclosure is to provide medical devices comprising a metal alloy, wherein the degree of recoil during the crimping and / or expansion of the medical device is reduced compared to stainless steel, chromium-cobalt alloy, or titanium alloy.

[0137] Another and / or alternative non-limiting object of this disclosure is to provide a medical device comprising a metal alloy that conforms better to irregularly shaped body passages when expanded within a body passage compared to a medical device formed of stainless steel, chromium-cobalt alloy, or titanium alloy.

[0138] Another and / or alternative non-limiting object of this disclosure is to provide medical devices comprising a metal alloy having improved fatigue ductility when cold-worked compared to cold-worked standard stainless steel, standard chromium-cobalt alloy, or standard titanium alloy.

[0139] Another and / or alternative non-limiting object of this disclosure is to provide medical devices comprising metal alloys having improved durability compared to standard stainless steel, standard chromium-cobalt alloys, and standard titanium alloys.

[0140] Another and / or alternative non-limiting object of this disclosure is to provide medical devices comprising metal alloys having improved hydrophilicity compared to standard stainless steel, standard chromium-cobalt alloys, and standard titanium alloys.

[0141] Another and / or alternative non-limiting object of this disclosure is to provide medical devices comprising a metal alloy, which reduces ion emission within the body passages compared to standard stainless steel, standard chromium-cobalt alloy, or standard titanium alloy.

[0142] Another and / or alternative non-limiting object of this disclosure is to provide medical devices comprising metal alloys that are less irritating to the body than standard stainless steel, or standard cobalt-chromium alloy, or standard titanium alloy, and thus may result in reduced inflammation, faster healing, and increased success rates of the medical device.

[0143] According to another and / or alternative non-limiting aspect of this disclosure, medical devices can be formed at least partially or completely by 3D printing.

[0144] According to other and / or alternative non-limiting aspects of the present disclosure, a unique combination of metals in the metal alloy of the present disclosure having a desired purity and composition and a desired grain size can provide: 1) a medical device having a desired high ductility at approximately room temperature; 2) a medical device having a desired amount of tensile elongation; 3) a homogeneous or solid solution of the metal alloy having high radiopaqueness; 4) reduction or prevention of microcrack formation and / or fracture of the metal alloy of the tube of the present disclosure when the tube is sized and / or cut to form a medical device or part of a medical device (e.g., a frame of a medical device); 5) reduction or prevention of microcrack formation and / or fracture of the medical device or part of a medical device (e.g., a frame of a medical device) when the medical device or part of a medical device (e.g., a frame of a medical device) is crimped; 6) when the medical device or part of a medical device (e.g., a frame of a medical device) is bent and / or expanded within a body passage. 1) A medical device that exhibits reduced or prevented formation of microcracks and / or breakage of the frame, etc. 7) a medical device having desired ultimate tensile strength and yield strength, 8) a medical device or part of a medical device (e.g., frame of a medical device) having a very thin wall thickness while also having desired radial force necessary to hold the medical device or part of a medical device (e.g., frame of a medical device) in an open state when expanded, 9) a medical device or part of a medical device (e.g., frame of a medical device) exhibiting less recoil when the medical device or part of a medical device (e.g., frame of a medical device) is crimped onto a delivery system and / or expanded within a body passage, 10) a medical device exhibiting improved conformity to the shape of the treatment area within a body passage when the medical device is expanded within a body passage, 11) a medical device exhibiting improved fatigue ductility, 12) a medical device exhibiting reduced shortening during expansion, and / or 13) a medical device exhibiting improved durability.

[0145] These and other advantages will become apparent to those skilled in the art upon reading and following this description.

[0146] Certain terms are used in the following description for clarity, but these terms are intended to refer only to specific structures of embodiments selected for illustration in the drawings and are not intended to define or limit the scope of this disclosure. In the drawings and the following description, similar numbering should be understood to refer to components of similar function.

[0147] The singular forms "a," "an," and "the" refer to multiple objects unless explicitly indicated otherwise in the context.

[0148] As used herein and in the claims, the term “comprising” may include embodiments that “consist of” and “consisting essentially of.” As used herein, the terms “comprise,” “include,” “having,” “has,” “can,” and “contain,” and their variations, are intended to be non-restrictive transitional phrases, terms, or words that require the presence of a specified component / step and permit the presence of other components / steps. However, such descriptions should also be interpreted as describing a composition or process as “consisting of” and “consisting essentially of” the enumerated components / steps, which permits the presence of only the specified component / step and excludes other components / steps, along with any unavoidable impurities that may arise therefrom.

[0149] It should be understood that the numerical values ​​in the specification and claims of this application include numerical values ​​that, when reduced to the same number of significant figures, result in the same numerical value, and numerical values ​​of the type described in this application that differ from the stated value by a numerical difference smaller than the experimental error of the conventional measurement techniques used to determine the value.

[0150] All ranges disclosed herein include the enumerated endpoints and are independently combinable (for example, the range "2 grams to 10 grams" includes the endpoints, 2 grams and 10 grams, as well as all intermediate values).

[0151] The terms "about" and "approximately" can be used to include any number that can change without altering the fundamental function of its value. When used with a range, "about" and "approximately" also disclose a range defined by the absolute values ​​of two endpoints; for example, "about 2 to about 4" also discloses a range of "2 to 4". Generally, the terms "about" and "approximately" can refer to plus or minus 10% of the indicated number.

[0152] Unless otherwise explicitly stated, the percentage of an element should be assumed to be the weight percentage of the element as stated.

[0153] While the operation of exemplary embodiments of the disclosed methods may be described in a specific sequential order for clarity, it should be understood that the disclosed embodiments may encompass orders of operation other than the specific sequential order disclosed. For example, operations described sequentially may be rearranged or performed simultaneously in some cases. Furthermore, the descriptions and disclosures provided in relation to one particular embodiment are not limited to that embodiment and may apply to any disclosed embodiment.

[0154] For the sake of simplification, the accompanying diagrams may not show the various ways in which the disclosed systems, methods, and apparatus can be used in combination with other systems, methods, and apparatus (which are readily identifiable to those skilled in the art based on this disclosure). In addition, the description may use terms such as “produce” and “provide” to describe the disclosed methods. These terms are abstractions of the actual actions that can be performed. The actual actions corresponding to these terms may vary depending on the specific implementation and are readily identifiable to those skilled in the art based on this disclosure.

[0155] Therefore, since the objectives described above can be efficiently achieved within the purposes revealed in the foregoing description, and specific modifications can be made to the described structures without departing from the spirit and scope of this disclosure, all matters contained in the foregoing description and shown in the accompanying drawings are intended to be construed as illustrative and not as restrictive. This disclosure has been described with reference to preferred and alternative embodiments. Modifications and changes will be apparent to those skilled in the art upon reading and understanding the detailed description of this disclosure provided herein. This disclosure is intended to include all such modifications and changes, insofar as they fall within the scope of this disclosure. It will also be understood that the following claims are intended to cover all general and specific features of this disclosure as described herein, as well as all descriptions of the scope of this disclosure that may be said to fall between them as a matter of language.

[0156] To help the Patent Office and readers of this application and any resulting patents interpret the claims attached herein, the applicant does not intend any of the attached claims or elements of the claims to invoke Section 112(f) of the United States Patent Act unless the words “means for” or “steps for” are expressly used in any particular claim.

[0157] (Note) (Note 1) A medical device partially or completely formed of a metal alloy, wherein the metal alloy is a) stainless steel containing at least 15 awt% rhenium, b) cobalt-chromium alloy containing at least 15 awt% rhenium, c) TiNi alloy containing at least 15 awt% rhenium, d) TiAlV alloy containing at least 15 awt% rhenium, e) Al alloy containing at least 15 awt% rhenium, f) Ni alloy containing at least 15 awt% rhenium, g) Ti alloy containing at least 15 awt% rhenium, h) W alloy containing at least 15 awt% rhenium, i) Cu alloy containing at least 15 awt% rhenium, j) beryllium-copper alloy containing at least 15 awt% rhenium, l) containing at least 30 wt% niobium, tantalum, titanium, cobalt, chromium, zirconium, or tungsten, and further containing at least 15 awt% rhenium. It contains at least 50 wt% of one or more of niobium, tantalum, titanium, cobalt, chromium, zirconium, or tungsten, and further contains 1 to 40 wt% of one or more of aluminum, bismuth, calcium, carbon, cerium oxide, copper, gold, hafnium, iridium, iron, lanthanum, lanthanum oxide, lead, magnesium, manganese, nickel, osmium, platinum, rare earth metals, rhodium, ruthenium, silicon, silver, technetium, tin, titanium, tungsten, vanadium, yttrium, yttrium oxide, zinc, and zirconium oxide, and further contains at least 15 wt% rhenium, m) at least 60 wt% tungsten, at least 15 wt% rhenium, n) at least 60 wt% tungsten, at least 15 wt% rhenium, and at least 1 wt% molybdenum, o) at least 50 wt% rhenium, at least 20 wt% chromium, and 0.One or more of the following in weights: 1-80% by weight of aluminum, bismuth, calcium, carbon, cerium oxide, chromium, cobalt, copper, gold, hafnium, iridium, iron, lanthanum, lanthanum oxide, lead, magnesium, manganese, molybdenum, nickel, niobium, osmium, platinum, rare earth metals, rhodium, ruthenium, silicon, silver, tantalum, technetium, tin, titanium, tungsten, vanadium, yttrium, yttrium oxide, zinc, zirconium, and zirconium oxide; p) more than 50% by weight of titanium, 15-45% by weight of niobium, 1-10% by weight of zirconium, and 1-15 Medical devices containing, or, in addition to, q) over 50 wt% tantalum, 15-45 wt% niobium, and 1-10 wt%, r) 30-60 wt% cobalt, 10-30 wt% chromium, 5-20 wt% iron, 5-22 wt% nickel, and 2-12 wt% molybdenum, s) 40-60 wt% zirconium, and 40-60 wt% molybdenum, t) 90-99.5 wt% niobium, and 0.5-10 wt% zirconium, or u) 55-75 wt% niobium, 18-40 wt% tantalum, 1-7 wt% tungsten, and 0.5-4 wt% zirconium.

[0158] (Note 2) The medical device as described in Appendix 1, wherein the metal alloy comprises 51-80% by weight of titanium, 15-45% by weight of niobium, 1-10% by weight of zirconium, and 1-15% by weight of tantalum.

[0159] (Note 3) The medical device as described in Appendix 1, wherein the metal alloy comprises 58-70% by weight of titanium, 27-37% by weight of niobium, 2-9% by weight of zirconium, and 1-15% by weight of tantalum.

[0160] (Note 4) The medical device as described in Appendix 1, wherein the metal alloy comprises 51-80% by weight of titanium, 15-45% by weight of niobium, and 1-10% by weight of titanium.

[0161] (Note 5) The medical device as described in Appendix 1, wherein the metal alloy comprises 58-69% by weight of titanium, 27-33% by weight of niobium, and 4-8% by weight of molybdenum.

[0162] (Note 6) The medical device as described in Appendix 1, wherein the metal alloy comprises 30-60% by weight of cobalt, 10-30% by weight of chromium, 5-20% by weight of iron, 5-22% by weight of nickel, and 2-12% by weight of molybdenum.

[0163] (Note 7) The medical device as described in Appendix 1, wherein the metal alloy comprises 35-45% by weight of cobalt, 15-25% by weight of chromium, 12-20% by weight of iron, 10-20% by weight of nickel, and 5-9% by weight of molybdenum.

[0164] (Note 8) The medical device as described in Appendix 1, wherein the metal alloy comprises 40-60% by weight of zirconium and 40-60% by weight of molybdenum.

[0165] (Note 9) The medical device according to Appendix 1, wherein the metal alloy comprises 45-55% by weight of cobalt and 45-55% by weight of molybdenum.

[0166] (Note 10) The medical device as described in Appendix 1, wherein the metal alloy comprises 90-99.5% by weight of niobium and 0.5-10% by weight of zirconium.

[0167] (Note 11) The medical device as described in Appendix 1, wherein the metal alloy comprises 95 to 99.25% by weight of niobium and 0.75 to 4% by weight of niobium.

[0168] (Note 12) The medical device as described in Appendix 1, wherein the metal alloy comprises 55-75% by weight of niobium, 18-40% by weight of tantalum, 1-7% by weight of tungsten, and 0.5-4% by weight of zirconium.

[0169] (Note 13) The medical device as described in Appendix 1, wherein the metal alloy comprises 60-70% by weight of niobium, 24-32% by weight of tantalum, 2-5% by weight of tungsten, and 0.75-3% by weight of zirconium.

[0170] (Note 14) The medical device according to Appendix 1, wherein the metal alloy comprises 10 to 60 atomic percent (awt.%) of Re, and one or more metals selected from the group consisting of Mo, Cr, Ta, Nb, Ti, and Zr.

[0171] (Note 15) The medical device as described in Appendix 1, wherein the metal alloy contains 0.5 to 50 awt.% Re and 0.5 to 70 awt.% Cr.

[0172] (Note 16) The medical device as described in Appendix 1, wherein the metal alloy contains 0.5 to 50 awt.% Re and 0.5 to 70 awt.% Ta.

[0173] (Note 17) The medical device as described in Appendix 1, wherein the metal alloy contains 0.5 to 50 awt.% Re and 0.5 to 70 awt.% Nb.

[0174] (Note 18) The medical device as described in Appendix 1, wherein the metal alloy comprises 0.5 to 50 awt.% Re and 0.5 to 70 awt.% Ti.

[0175] (Note 19) The medical device as described in Appendix 1, wherein the metal alloy comprises 50-75 wt.% Re, 24-49 wt% Cr, and 1-15 wt% Mo.

[0176] (Note 20) The medical device described in Appendix 1, wherein the medical device includes a) a medical device for implantation within a body passage, b) a medical device for implantation within the spine, and c) a medical device for implantation within bone.

[0177] (Note 21) The medical device described in any one of the appendices 2 to 19, wherein the medical device includes a) a medical device for implantation within a body passage, b) a medical device for implantation within the spine, and c) a medical device for implantation within bone.

[0178] (Note 22) The medical device according to Appendix 20, wherein the medical device includes an expandable frame that is at least partially formed of the metal alloy.

[0179] (Note 23) The medical device according to Appendix 21, wherein the medical device includes an expandable frame that is at least partially formed of the metal alloy.

[0180] (Note 24) The medical device according to Appendix 1, wherein at least one region of the medical device contains at least one biological agent.

[0181] (Note 25) A medical device according to any one of the appendices 2 to 23, wherein at least one area of ​​the medical device contains at least one biological agent.

[0182] (Note 26) The medical device according to Appendix 1, wherein at least one region of the medical device comprises at least one polymer.

[0183] (Note 27) A medical device according to any one of appendices 2 to 25, wherein at least one region of the medical device comprises at least one polymer.

[0184] (Note 28) The medical device according to Appendix 1, further comprising at least one microstructure on the outer surface of the medical device.

[0185] (Note 29) A medical device according to any one of the appendices 2 to 27, further comprising at least one microstructure on the outer surface of the medical device.

[0186] (Note 30) a) Stainless steel containing at least 15 awt% rhenium, b) Cobalt-chromium alloy containing at least 15 awt% rhenium, c) TiNi alloy containing at least 15 awt% rhenium, d) TiAlV alloy containing at least 15 awt% rhenium, e) Al alloy containing at least 15 awt% rhenium, f) Ni alloy containing at least 15 awt% rhenium, g) Ti alloy containing at least 15 awt% rhenium, h) W alloy containing at least 15 awt% rhenium, i) Cu alloy containing at least 15 awt% rhenium, j) Beryllium-copper alloy containing at least 15 awt% rhenium, k) containing at least 30 wt% niobium, tantalum, titanium, cobalt, chromium, zirconium, or tungsten, and further containing at least 15 awt% rhenium, l) containing at least 50 wt% niobium, tantalum It contains one or more of the following: titanium, cobalt, chromium, zirconium, or tungsten, and further contains 1 to 40 wt% of aluminum, bismuth, calcium, carbon, cerium oxide, copper, gold, hafnium, iridium, iron, lanthanum, lanthanum oxide, lead, magnesium, manganese, nickel, osmium, platinum, rare earth metals, rhodium, ruthenium, silicon, silver, technetium, tin, titanium, tungsten, vanadium, yttrium, yttrium oxide, zinc, and zirconium oxide, and further contains at least 15 wt% rhenium, m) at least 60 wt% tungsten, at least 15 wt% rhenium, n) at least 60 wt% tungsten, at least 15 wt% rhenium, and at least 1 wt% molybdenum, o) at least 50 wt% rhenium, at least 20 wt% chromium, and 0.One or more of the following in weights: 1-80% by weight of aluminum, bismuth, calcium, carbon, cerium oxide, chromium, cobalt, copper, gold, hafnium, iridium, iron, lanthanum, lanthanum oxide, lead, magnesium, manganese, molybdenum, nickel, niobium, osmium, platinum, rare earth metals, rhodium, ruthenium, silicon, silver, tantalum, technetium, tin, titanium, tungsten, vanadium, yttrium, yttrium oxide, zinc, zirconium, and zirconium oxide; p) more than 50% by weight of titanium, 15-45% by weight of niobium, 1-10% by weight of zirconium, and 1-1 A metal alloy containing 5 wt% tantalum, q) over 50 wt% titanium, 15-45 wt% niobium, and 1-10 wt%; r) 30-60 wt% cobalt, 10-30 wt% chromium, 5-20 wt% iron, 5-22 wt% nickel, and 2-12 wt% molybdenum; s) 40-60 wt% zirconium, and 40-60 wt% molybdenum; t) 90-99.5 wt% niobium, and 0.5-10 wt% zirconium; or u) 55-75 wt% niobium, 18-40 wt% tantalum, 1-7 wt% tungsten, and 0.5-4 wt% zirconium.

[0187] (Note 31) The metal alloy as described in Appendix 30, wherein the metal alloy comprises 51-80% by weight of titanium, 15-45% by weight of niobium, 1-10% by weight of zirconium, and 1-15% by weight of tantalum.

[0188] (Note 32) The metal alloy as described in Appendix 30, wherein the metal alloy comprises 58-70% by weight of titanium, 27-37% by weight of niobium, 2-9% by weight of zirconium, and 1-15% by weight of tantalum.

[0189] (Note 33) The metal alloy as described in Appendix 30, wherein the metal alloy comprises 51-80% by weight of titanium, 15-45% by weight of niobium, and 1-10% by weight of titanium.

[0190] (Note 34) The metal alloy as described in Appendix 30, wherein the metal alloy comprises 58-69% by weight of titanium, 27-33% by weight of niobium, and 4-8% by weight of molybdenum.

[0191] (Note 35) The metal alloy as described in Appendix 30, wherein the metal alloy comprises 30-60% by weight of cobalt, 10-30% by weight of chromium, 5-20% by weight of iron, 5-22% by weight of nickel, and 2-12% by weight of molybdenum.

[0192] (Note 36) The metal alloy as described in Appendix 30, wherein the metal alloy comprises 35-45% by weight of cobalt, 15-25% by weight of chromium, 12-20% by weight of iron, 10-20% by weight of nickel, and 5-9% by weight of molybdenum.

[0193] (Note 37) The metal alloy as described in Appendix 30, wherein the metal alloy contains 40-60% by weight of zirconium and 40-60% by weight of molybdenum.

[0194] (Note 38) The metal alloy as described in Appendix 30, wherein the metal alloy contains 45-55% by weight of cobalt and 45-55% by weight of molybdenum.

[0195] (Note 39) The metal alloy as described in Appendix 30, wherein the metal alloy contains 90 to 99.5% by weight of niobium and 0.5 to 10% by weight of zirconium.

[0196] (Note 40) The metal alloy as described in Appendix 30, wherein the metal alloy contains 95 to 99.25% by weight of niobium and 0.75 to 4% by weight of niobium.

[0197] (Note 41) The metal alloy as described in Appendix 30, wherein the metal alloy comprises 55-75% by weight of niobium, 18-40% by weight of tantalum, 1-7% by weight of tungsten, and 0.5-4% by weight of zirconium.

[0198] (Note 42) The metal alloy described in Appendix 30, wherein the metal alloy comprises 60-70% by weight of niobium, 24-32% by weight of tantalum, 2-5% by weight of tungsten, and 0.75-3% by weight of zirconium.

[0199] (Note 43) The metal alloy according to Appendix 30, wherein the metal alloy contains 10 to 60 atomic percent (awt.%) of Re, and one or more metals selected from the group consisting of Mo, Cr, Ta, Nb, Ti, and Zr.

[0200] (Note 44) The metal alloy as described in Appendix 30, wherein the metal alloy contains 0.5 to 50 awt.% of Re and 0.5 to 70 awt.% of Cr.

[0201] (Note 45) The metal alloy as described in Appendix 30, wherein the metal alloy contains 0.5 to 50 awt.% Re and 0.5 to 70 awt.% Ta.

[0202] (Note 46) The metal alloy as described in Appendix 30, wherein the metal alloy contains 0.5 to 50 awt.% of Re and 0.5 to 70 awt.% of Nb.

[0203] (Note 47) The metal alloy as described in Appendix 30, wherein the metal alloy contains 0.5 to 50 awt.% Re and 0.5 to 70 awt.% Ti.

[0204] (Note 48) The metal alloy as described in Appendix 30, wherein the metal alloy comprises 50-75 wt.% Re, 24-49 wt% Cr, and 1-15 wt% Mo.

Claims

1. A medical device partially or completely formed of a metal alloy, wherein the metal alloy is a) stainless steel containing at least 15 awt% rhenium, b) cobalt-chromium alloy containing at least 15 awt% rhenium, c) TiNi alloy containing at least 15 awt% rhenium, d) TiAlV alloy containing at least 15 awt% rhenium, e) Al alloy containing at least 15 awt% rhenium, f) Ni alloy containing at least 15 awt% rhenium, g) Ti alloy containing at least 15 awt% rhenium, h) at least 15 awt% rhenium i) a rhenium-containing alloy, i) a copper alloy containing at least 15 awt% rhenium, j) a beryllium-copper alloy containing at least 15 awt% rhenium, k) containing at least 30 wt% of one or more of niobium, tantalum, titanium, cobalt, chromium, zirconium, or tungsten, and further containing at least 15 awt% rhenium, l) containing at least 50 wt% of one or more of niobium, tantalum, titanium, cobalt, chromium, zirconium, or tungsten, and further containing 1 to 40 wt% of aluminum, bismuth, calcium, carbon, and cereal oxide. It comprises one or more of the following: rhenium, copper, gold, hafnium, iridium, iron, lanthanum, lanthanum oxide, lead, magnesium, manganese, nickel, osmium, platinum, rare earth metals, rhodium, ruthenium, silicon, silver, technetium, tin, titanium, tungsten, vanadium, yttrium, yttrium oxide, zinc, and zirconium oxide, and further comprises at least 15 awt% rhenium, m) at least 60 wt% tungsten and at least 15 awt% rhenium, n) at least 60 wt% tungsten and at least 15 awt% rhenium, and at least 1 wt% molybdenum, o) at least 50 wt% rhenium, at least 20 wt% chromium, and 0.1 to 80 wt% aluminum, bismuth, calcium, carbon, cerium oxide, chromium, cobalt, copper, gold, hafnium, iridium, iron, lanthanum, lanthanum oxide, lead, magnesium, manganese, molybdenum, nickel, niobium, osmium, platinum, rare earth metals, rhodium, ruthenium, silicon, silver, tantalum, technetium, tin, titanium, tungsten, vanadium, yttrium, yttrium oxide, zinc, zirconium,A medical device comprising one or more of the following: and zirconium oxide; p) more than 50 wt% titanium, 15 to 45 wt% niobium, 1 to 10 wt% zirconium, and 1 to 15 wt% tantalum; q) more than 50 wt% titanium, 15 to 45 wt% niobium, and 1 to 10 wt%; r) 30 to 60 wt% cobalt, 10 to 30 wt% chromium, 5 to 20 wt% iron, 5 to 22 wt% nickel, and 2 to 12 wt% molybdenum; s) 40 to 60 wt% zirconium, and 40 to 60 wt% molybdenum; t) 90 to 99.5 wt% niobium, and 0.5 to 10 wt% zirconium; or u) 55 to 75 wt% niobium, 18 to 40 wt% tantalum, 1 to 7 wt% tungsten, and 0.5 to 4 wt% zirconium.

2. The medical device according to claim 1, wherein the metal alloy comprises 51 to 80% by weight of titanium, 15 to 45% by weight of niobium, 1 to 10% by weight of zirconium, and 1 to 15% by weight of tantalum.

3. The medical device according to claim 1, wherein the metal alloy comprises 58 to 70% by weight of titanium, 27 to 37% by weight of niobium, 2 to 9% by weight of zirconium, and 1 to 15% by weight of tantalum.

4. The medical device according to claim 1, wherein the metal alloy comprises 51 to 80% by weight of titanium, 15 to 45% by weight of niobium, and 1 to 10% by weight of titanium.

5. The medical device according to claim 1, wherein the metal alloy comprises 58 to 69% by weight of titanium, 27 to 33% by weight of niobium, and 4 to 8% by weight of molybdenum.

6. The medical device according to claim 1, wherein the metal alloy comprises 30 to 60% by weight of cobalt, 10 to 30% by weight of chromium, 5 to 20% by weight of iron, 5 to 22% by weight of nickel, and 2 to 12% by weight of molybdenum.

7. The medical device according to claim 1, wherein the metal alloy comprises 35 to 45% by weight of cobalt, 15 to 25% by weight of chromium, 12 to 20% by weight of iron, 10 to 20% by weight of nickel, and 5 to 9% by weight of molybdenum.

8. The medical device according to claim 1, wherein the metal alloy comprises 40 to 60% by weight of zirconium and 40 to 60% by weight of molybdenum.

9. The medical device according to claim 1, wherein the metal alloy comprises 45 to 55% by weight of cobalt and 45 to 55% by weight of molybdenum.

10. The medical device according to claim 1, wherein the metal alloy comprises 90 to 99.5% by weight of niobium and 0.5 to 10% by weight of zirconium.

11. The medical device according to claim 1, wherein the metal alloy comprises 95 to 99.25% by weight of niobium and 0.75 to 4% by weight of niobium.

12. The medical device according to claim 1, wherein the metal alloy comprises 55 to 75% by weight of niobium, 18 to 40% by weight of tantalum, 1 to 7% by weight of tungsten, and 0.5 to 4% by weight of zirconium.

13. The medical device according to claim 1, wherein the metal alloy comprises 60 to 70% by weight of niobium, 24 to 32% by weight of tantalum, 2 to 5% by weight of tungsten, and 0.75 to 3% by weight of zirconium.

14. The medical device according to claim 1, wherein the metal alloy comprises 10 to 60 atomic percent (awt.%) of Re and one or more metals selected from the group consisting of Mo, Cr, Ta, Nb, Ti, and Zr.

15. The medical device according to claim 1, wherein the metal alloy comprises 0.5 to 50 awt.% Re and 0.5 to 70 awt.% Cr.

16. The medical device according to claim 1, wherein the metal alloy comprises 0.5 to 50 awt.% Re and 0.5 to 70 awt.% Ta.

17. The medical device according to claim 1, wherein the metal alloy comprises 0.5 to 50 awt.% Re and 0.5 to 70 awt.% Nb.

18. The medical device according to claim 1, wherein the metal alloy comprises 0.5 to 50 awt.% Re and 0.5 to 70 awt.% Ti.

19. The medical device according to claim 1, wherein the metal alloy comprises 50 to 75 wt.% Re, 24 to 49 wt% Cr, and 1 to 15 wt% Mo.

20. The medical device according to claim 1, wherein the medical device includes a) a medical device for implantation in a body passage, b) a medical device for implantation in the spine, and c) a medical device for implantation in bone.

21. The medical device according to any one of claims 2 to 19, wherein the medical device includes a) a medical device for implantation in a body passage, b) a medical device for implantation in the spine, and c) a medical device for implantation in bone.

22. The medical device according to claim 20, wherein the medical device includes an expandable frame formed at least partially of the metal alloy.

23. The medical device according to claim 21, wherein the medical device includes an expandable frame at least partially formed of the metal alloy.

24. The medical device according to claim 1, wherein at least one region of the medical device contains at least one biological agent.

25. The medical device according to any one of claims 2 to 23, wherein at least one region of the medical device contains at least one biological agent.

26. The medical device according to claim 1, wherein at least one region of the medical device comprises at least one polymer.

27. The medical device according to any one of claims 2 to 25, wherein at least one region of the medical device comprises at least one polymer.

28. The medical device according to claim 1, further comprising at least one microstructure on the outer surface of the medical device.

29. The medical device according to any one of claims 2 to 27, further comprising at least one microstructure on the outer surface of the medical device.

30. a) Stainless steel containing at least 15 awt% rhenium, b) Cobalt-chromium alloy containing at least 15 awt% rhenium, c) TiNi alloy containing at least 15 awt% rhenium, d) TiAlV alloy containing at least 15 awt% rhenium, e) Al alloy containing at least 15 awt% rhenium, f) Ni alloy containing at least 15 awt% rhenium, g) Ti alloy containing at least 15 awt% rhenium, h) W alloy containing at least 15 awt% rhenium, i) Cu alloy containing at least 15 awt% rhenium, j) k) a beryllium-copper alloy containing at least 15 wt% rhenium, l) containing at least 30 wt% one or more of niobium, tantalum, titanium, cobalt, chromium, zirconium, or tungsten, and further containing at least 15 wt% rhenium, l) containing at least 50 wt% one or more of niobium, tantalum, titanium, cobalt, chromium, zirconium, or tungsten, and further containing 1 to 40 wt% aluminum, bismuth, calcium, carbon, cerium oxide, copper, gold, hafnium, iridium, iron, lanthanum, lanthanum oxide, lead, ma It comprises one or more of the following: magnesium, manganese, nickel, osmium, platinum, rare earth metals, rhodium, ruthenium, silicon, silver, technetium, tin, titanium, tungsten, vanadium, yttrium, yttrium oxide, zinc, and zirconium oxide, and further comprises at least 15 wt% rhenium, m) at least 60 wt% tungsten and at least 15 wt% rhenium, n) at least 60 wt% tungsten, at least 15 wt% rhenium, and at least 1 wt% molybdenum, o) at least 50 wt% rhenium, p) more than 20% by weight of chromium, and 0.1 to 80% by weight of one or more of aluminum, bismuth, calcium, carbon, cerium oxide, chromium, cobalt, copper, gold, hafnium, iridium, iron, lanthanum, lanthanum oxide, lead, magnesium, manganese, molybdenum, nickel, niobium, osmium, platinum, rare earth metals, rhodium, ruthenium, silicon, silver, tantalum, technetium, tin, titanium, tungsten, vanadium, yttrium, yttrium oxide, zinc, zirconium, and zirconium oxide, p) more than 50% by weight of titanium,A metal alloy comprising 15-45 wt% niobium, 1-10 wt% zirconium, and 1-15 wt% tantalum; q) more than 50 wt% titanium, 15-45 wt% niobium, and 1-10 wt%; r) 30-60 wt% cobalt, 10-30 wt% chromium, 5-20 wt% iron, 5-22 wt% nickel, and 2-12 wt% molybdenum; s) 40-60 wt% zirconium, and 40-60 wt% molybdenum; t) 90-99.5 wt% niobium, and 0.5-10 wt% zirconium; or u) 55-75 wt% niobium, 18-40 wt% tantalum, 1-7 wt% tungsten, and 0.5-4 wt% zirconium.

31. The metal alloy according to claim 30, wherein the metal alloy comprises 51 to 80% by weight of titanium, 15 to 45% by weight of niobium, 1 to 10% by weight of zirconium, and 1 to 15% by weight of tantalum.

32. The metal alloy according to claim 30, wherein the metal alloy comprises 58 to 70% by weight of titanium, 27 to 37% by weight of niobium, 2 to 9% by weight of zirconium, and 1 to 15% by weight of tantalum.

33. The metal alloy according to claim 30, wherein the metal alloy comprises 51 to 80% by weight of titanium, 15 to 45% by weight of niobium, and 1 to 10% by weight of titanium.

34. The metal alloy according to claim 30, wherein the metal alloy comprises 58 to 69% by weight of titanium, 27 to 33% by weight of niobium, and 4 to 8% by weight of molybdenum.

35. The metal alloy according to claim 30, wherein the metal alloy comprises 30 to 60% by weight of cobalt, 10 to 30% by weight of chromium, 5 to 20% by weight of iron, 5 to 22% by weight of nickel, and 2 to 12% by weight of molybdenum.

36. The metal alloy according to claim 30, wherein the metal alloy comprises 35 to 45% by weight of cobalt, 15 to 25% by weight of chromium, 12 to 20% by weight of iron, 10 to 20% by weight of nickel, and 5 to 9% by weight of molybdenum.

37. The metal alloy according to claim 30, wherein the metal alloy comprises 40 to 60% by weight of zirconium and 40 to 60% by weight of molybdenum.

38. The metal alloy according to claim 30, wherein the metal alloy comprises 45 to 55% by weight of cobalt and 45 to 55% by weight of molybdenum.

39. The metal alloy according to claim 30, wherein the metal alloy comprises 90 to 99.5% by weight of niobium and 0.5 to 10% by weight of zirconium.

40. The metal alloy according to claim 30, wherein the metal alloy comprises 95 to 99.25% by weight of niobium and 0.75 to 4% by weight of niobium.

41. The metal alloy according to claim 30, wherein the metal alloy comprises 55 to 75% by weight of niobium, 18 to 40% by weight of tantalum, 1 to 7% by weight of tungsten, and 0.5 to 4% by weight of zirconium.

42. The metal alloy according to claim 30, wherein the metal alloy comprises 60 to 70% by weight of niobium, 24 to 32% by weight of tantalum, 2 to 5% by weight of tungsten, and 0.75 to 3% by weight of zirconium.

43. The metal alloy according to claim 30, wherein the metal alloy comprises 10 to 60 atomic percent (awt.%) of Re, and one or more metals selected from the group consisting of Mo, Cr, Ta, Nb, Ti, and Zr.

44. The metal alloy according to claim 30, wherein the metal alloy comprises 0.5 to 50 awt.% of Re and 0.5 to 70 awt.% of Cr.

45. The metal alloy according to claim 30, wherein the metal alloy comprises 0.5 to 50 awt.% of Re and 0.5 to 70 awt.% of Ta.

46. The metal alloy according to claim 30, wherein the metal alloy comprises 0.5 to 50 awt.% of Re and 0.5 to 70 awt.% of Nb.

47. The metal alloy according to claim 30, wherein the metal alloy comprises 0.5 to 50 awt.% of Re and 0.5 to 70 awt.% of Ti.

48. The metal alloy according to claim 30, wherein the metal alloy comprises 50 to 75 wt.% Re, 24 to 49 wt% Cr, and 1 to 15 wt% Mo.

Images