High-precision polishing pad dressing tool

Abstract

This application relates to the field of CMP chemical mechanical polishing technology, and more particularly to a high-precision polishing pad dressing tool, which comprises a disc and a diamond sheet, the diamond sheet being connected to the disc, the surface of the diamond sheet having uniformly high protrusions, the diamond sheet comprising a main diamond, sub-diamonds and a center diamond, one center diamond being installed and located at the center of the disc, multiple main diamonds and sub-diamonds being installed, each main diamond arranged in an annular pattern, each sub-diamond arranged in an annular pattern, the main diamonds, sub-diamonds and center diamonds being arranged in multiple annular patterns, and the thickness of the main diamonds, sub-diamonds and center diamonds being the same. This application has the effect of improving the dressing accuracy of the dresser and facilitating the precision control of the product during the processing process.

Description

Technical Field

[0001] This application relates to the field of polishing technology by CMP (Chemical Mechanical Polishing), and particularly to a high-precision polishing pad dressing tool.

Background Art

[0002] Chemical Mechanical Processing (CMP) has become a wide-ranging applied technology for polishing any workpiece. In particular, the computer manufacturing industry strongly depends on the CMP process. In this polishing process, generally, a chip is abutted on a rotating pad made of a durable organic substance (e.g., polyurethane), and a chemical pulp containing a chemical solution capable of decomposing the chip substance and a large amount of abrasive grains capable of physically eroding the surface of the chip is added onto this rotating pad. This chemical pulp is continuously added to the rotary CMP pad, and the chip is polished in a desired manner by the dual chemical and mechanical forces applied thereto.

[0003] With the extensive application of the semiconductor CMP process, the market has put forward higher requirements for the dressing accuracy, service life, and reliability of the polishing pad dressing tool. The prior art can be mainly divided into two categories. One is the diamond polishing pad dresser of electroplating or brazing type. Here, diamond particles are electroplated or brazed onto the polishing pad dresser substrate, and the exposed part of the diamond crystal is used for polishing pad dressing. The disadvantages are that the height of the diamond exposure cannot be controlled, the dressing accuracy is greatly affected by the difference in the height of the diamond exposure, the diamond polishing pad dresser of electroplating or brazing type receives a lateral force during operation, there is a risk that small diamond grains will fall off, and when small diamond grains fall off and enter the wafer polishing position, it will cause the wafer to be discarded. Moreover, the service life of this type of product is also affected by the wear condition of the diamond particles in the exposed part.

[0004] The second type is a CVD diamond polishing dresser, in which uniform protrusions are engraved on the surface of a CVD single-crystal diamond, and a single-crystal CVD sheet is attached to the polishing pad dresser substrate. Generally, 6 to 8 CVD single-crystal diamonds are arranged in a ring. The advantages are that the height of the diamond protrusions can be controlled, the dressing accuracy is high, and the service life is better than polishing pad dressers for electroplating or brazing. The disadvantages are that the cost is high, the diamond spacing may be designed to be too large, and when the polishing pad dresser operates, gaps may occur when the CVD single-crystal diamonds dress alternately, which may affect the polishing pad dressing effect. Currently, the protrusions on the surface of CVD single-crystal diamonds are commonly seen in structures such as hexagonal protrusions, pyramidal protrusions, or truncated square protrusions. The sharp corners are prone to breakage during processing, and the dressing accuracy of the polishing dresser is affected by the flatness of the diamond sheet and protrusions.

[0005] Therefore, designing a dresser that offers high dressing accuracy and facilitates precision control of the product during the manufacturing process is an urgent issue that needs to be addressed. [Overview of the project] [Problems that the invention aims to solve]

[0006] This invention provides a high-precision polishing pad dressing tool to improve the dressing accuracy of a dresser and to facilitate precision control of the product during the machining process. [Means for solving the problem]

[0007] The high-precision polishing pad dressing tool provided in this application employs the following technical solutions.

[0008] The high-precision polishing pad dressing tool includes a disc and a diamond sheet, the diamond sheet being connected to the disc, and the surface of the diamond sheet having protrusions of uniform height. The diamond sheet includes a main diamond, a sub-diamond, and a center diamond, with one center diamond installed and located at the center of the disk, multiple main diamonds and sub-diamonds installed, each main diamond arranged in a ring, each sub-diamond arranged in a ring, the main diamond, sub-diamond and center diamond arranged in multiple rings, and the thickness of the main diamond, sub-diamond and center diamond is the same.

[0009] By employing the above technical solution, the center diamond, each main diamond, and each sub-diamond are mounted at corresponding positions on the disc during installation, ensuring that the main diamond, sub-diamond, and center diamond are distributed in a multi-ring pattern. The multi-ring layout of the main diamond, sub-diamond, and center diamond provides multi-point support during the ultra-fine polishing process, thereby improving the stability of the process. This positively impacts the improvement of dressing accuracy and also facilitates precision control of the product during the processing. Furthermore, the multi-ring layout design of the main diamond, sub-diamond, and center diamond effectively increases the dressing area of ​​the polishing pad. Compared to the conventional single-ring layout, a dressing disc designed with a multi-ring layout of main diamond, sub-diamond, and center diamond has a larger effective working area per runout, improving dressing efficiency.

[0010] Selectively, the projection is a double-tapered polygonal pyramidal cone projection.

[0011] By adopting the above technical solution, the double taper design makes it easier for the protrusion to penetrate into the polishing pad, and the double taper protrusion structure is more stable than a single conical structure, resulting in a stronger cutting capacity for the double taper polygonal conical cone protrusion when the polishing pad dresser is in operation.

[0012] Selectively, multiple sets of the projections are provided, each set of projections consists of multiple projections, and each set of projections is arranged in a ring at equal intervals or at equal angles, with the height of the projections located at the edges being smaller than the height of the projections located in the middle.

[0013] By employing the above technical solution, damage to the protrusion due to impact when it comes into contact with the polishing pad can be effectively avoided, and by setting a shift height, dressing accuracy can be guaranteed and the service life can be effectively improved.

[0014] Selectively, the projection on the outermost circumference has the lowest height, the projection on the second circumference is higher than the projection on the outermost circumference, the projection on the third circumference is higher than the projection on the second circumference, and the projections from the fourth circumference to the center are all the same height as the projection on the third circumference.

[0015] By employing the above technical solutions, a contoured protrusion design can be achieved, satisfying different polishing pad and dressing requirements.

[0016] Selectively, the outermost projection has the lowest height, the second projection is higher than the outermost projection, the third projection is higher than the second projection, the height of the fourth projection is the same as the height of the second projection, and the height of the third projection is the same as the height of the fifth projection.

[0017] By employing the above technical solution, it is possible to design protrusions with varying heights and undulations, thereby meeting different polishing pad and dressing requirements.

[0018] Selectively, the projection includes a base circular base, a cone apex plane, a first work surface, and a second work surface, each of which is formed in multiple quantities, each of which is formed between the base circular base and the cone apex plane and arranged alternately along the circumferential direction of the base circular base, the second work surface includes a first grinding surface and a second grinding surface, the second grinding surface is close to the cone apex plane, and the first and second grinding surfaces constitute a double taper structure.

[0019] By adopting the above technical solution, the double taper design facilitates insertion into the polishing pad and is less likely to damage the polishing pad.

[0020] Selectively further comprising a diamond base, the diamond base being mounted on the disc, and the diamond sheet being fixed to the diamond base.

[0021] By employing the above technical solution, the dressing effect of the polishing pad is guaranteed, and the use of CVD diamonds is reduced.

[0022] Selectively, the diamond base is designed with a circular shallow groove.

[0023] By adopting the above technical solution, thinner diamond sheets can be selected and processed, and the bottom of the diamond sheet is protected by the diamond base metal, making it more stable than a direct bonding structure.

[0024] Selectively, the main diamond, the sub-diamond, and the center diamond are all single-crystal diamonds, and all are formed with circular bevels.

[0025] By adopting the above technical solution, in the dressing operation of single-crystal diamond, sharp corners or right-angle cones do not contact the polishing pad, and it is possible to effectively avoid the single-crystal diamond from being damaged by external forces.

[0026] Optionally, the diameter of the main diamond is larger than the diameter of the center diamond, and the diameter of the center diamond is larger than the diameter of the sub-diamond.

[0027] The size of the diamond diameter is related to the dressing area, and the diamond position is related to the dressing trajectory. By adopting the above technical solution, the effect can be optimized.

Advantages of the Invention

[0028] As described above, the present application includes at least one of the following beneficial technical effects. 1. The present application provides a high-precision polishing pad dressing tool, which includes a stainless steel disk, a diamond alloy and a diamond sheet. The surface of the diamond sheet has protrusions with uniform height. The diamond sheet includes main diamonds, sub-diamonds and center diamonds. Among them, there are 4 to 6 main diamonds, 4 to 6 sub-diamonds, and 1 center diamond. The multi-ring layout design of the main diamonds, sub-diamonds and center diamonds can effectively increase the dressing range of the polishing pad, which is superior to the conventional single-ring layout. Moreover, the effective working area of one swing of the polishing pad dressing disk is larger, improving the dressing efficiency. Furthermore, the multi-ring layout of the main diamonds, sub-diamonds and center diamonds provides multi-point support for ultra-fine polishing in the processing process, making the stability of the processing process higher, which has a positive impact on improving the dressing accuracy. 2. In this application, the surface of the diamond sheet has multiple sets of double-tapered polygonal pyramidal cone projections. When the double-tapered polygonal pyramidal cone projections contact the polishing pad, the sides of the conical apex plane contact the polishing pad, first penetrating the polishing pad at a first angle, and then entering the polishing pad at a second angle. The double-tapered design makes it easier for the projections to penetrate the polishing pad, and the double-tapered projection structure is more stable than a single-cone structure. When the polishing pad dresser is in operation, the double-tapered polygonal pyramidal cone projections have stronger cutting ability and penetrate the polishing pad more easily. The design of the base cone makes the groove width and groove shape for dressing the polishing pad more orderly. 3. In conventional diamond dressing plates, diamonds are often directly welded or bonded to a stainless steel disc. Thick diamond sheets are often used to ensure that the diamonds protrude from the disc surface and to address the cause of stress-induced fracture. The diamond base in this application is designed with a circular shallow groove, which allows for the selection and processing of thinner diamond sheets. The bottom of the diamond sheet is protected by the diamond base, which is more stable than a direct bonding structure. This ensures the dressing effect of the polishing pad and saves CVD diamonds. [Brief explanation of the drawing]

[0029] [Figure 1] This is a plan view of the high-precision polishing pad dressing tool in this application. [Figure 2] This figure shows the attachment of the projection and diamond sheet in the present invention. [Figure 3] This figure shows the structure of the projection in the present invention. [Figure 4] This is a plan view of the projection in the present invention. [Figure 5] This figure shows the structure of the diamond base in the present invention. [Figure 6] This figure shows the structure of the disk in the present invention. [Modes for carrying out the invention]

[0030] The present invention will be described in more detail below with reference to Figures 1 to 6.

[0031] This invention discloses a high-precision polishing pad dressing tool, referring to Figures 1 and 2, comprising a disc 1 and a diamond sheet 2, the diamond sheet 2 being connected to the disc 1, and uniformly height polishing protrusions 3 being formed on the surface of the diamond sheet 2. The diamond sheet 2 comprises a main diamond 21, sub-diamonds 22 and a center diamond 23, with one center diamond 23 positioned at the center of the disc 1, and multiple main diamonds 21 and sub-diamonds 22 being present. Each main diamond 21 and each sub-diamond 22 are arranged in annular formations, and the main diamonds 21, sub-diamonds 22 and center diamond 23 are arranged in multiple annular formations.

[0032] By utilizing a special design with a multi-ring layout of the main diamond 21, sub-diamond 22, and center diamond 23, multi-point support can be provided during the ultra-fine polishing process, thereby improving the stability of the dressing process during the polishing pad dressing process. This has a positive impact on improving dressing accuracy and also facilitates precision control of the product during the processing. Furthermore, the multi-ring layout of the main diamond 21, sub-diamond 22, and center diamond 23 effectively increases the dressing area of ​​the polishing pad. Compared to a conventional single-ring layout, the effective working area of ​​the dressing plate designed with a multi-ring layout is larger, which improves dressing efficiency.

[0033] Specifically, referring to Figures 1 and 2, in this embodiment, the number of main diamonds 21 is preferably 4 to 6, and the number of sub-diamonds 22 is preferably 4 to 6. In this way, the dressing area can be maximized while ensuring the dressing effect. Naturally, in this embodiment, both the main diamonds 21 and sub-diamonds 22 are installed around the entire circumference, and a multi-ring layout can be implemented depending on the actual situation, and the number of main diamonds 21 and sub-diamonds 22 can be adjusted according to the actual situation. For example, 6 main diamonds 21, 4 sub-diamonds 22, and 1 center diamond 23 can be installed, so that each main diamond 21, each sub-diamond 22, and the center diamond 23 are of the same diameter. In this embodiment, the number of main diamonds 21 and sub-diamonds 22 is 4, and the main diamonds 21, sub-diamonds 22, and center diamond 23 are not of the same diameter. Naturally, depending on the actual situation, the main diamonds 21, sub-diamonds 22, and center diamond 23 can be used selectively, that is, only the combination of main diamonds 21 and center diamonds 23 can be used. Different combinations significantly improve product diversity.

[0034] Referring to Figures 1 and 2, the diameter of the main diamond 21 is larger than the diameter of the center diamond 23, and the diameter of the center diamond 23 is larger than the diameter of the sub-diamond 22. The size of the diameters of the main diamond 21 and the sub-diamond 22 are related to the dressing area, and the difference in diameters of the main diamond 21, sub-diamond 22 and center diamond 23 enables a rational layout of the diamond sheet 2 and improves the dressing effect. Naturally, the diamond positions are related to the dressing trajectory, and in this embodiment, the distance from the center of the main diamond 21 is 16 mm to 41 mm, and the distance from the center of the sub-diamond 22 is 13 mm to 41 mm, thus optimizing the effect.

[0035] Furthermore, it is preferable that the main diamond 21, sub-diamond 22, and center diamond 23 all use single-crystal diamonds with a diameter of 5 mm to 7 mm as the base material, and that the edge surface is free of cracks, polycrystalline, and crumbling, and that the thickness of the main diamond 21, sub-diamond 22, and center diamond 23 are the same. In this embodiment, the protrusions 3 are processed by laser engraving, and compared to welding small diamond grains (corresponding to small protrusions) by electroplating or brazing processes, the large-sized single-crystal diamonds are stronger, less likely to fall off, and the protrusion structure on the surface of the single-crystal diamonds is more stable.

[0036] The main diamond 21, sub-diamond 22, and center diamond 23 are all formed with circular chamfers, which makes the structures of the main diamond 21, sub-diamond 22, and center diamond 23 smoother. This prevents sharp corners or right-angled pyramids from coming into contact with the polishing pad during the dressing operation of the single-crystal diamond, effectively preventing the single-crystal diamond from being damaged by external forces.

[0037] Referring particularly to Figures 2 and 3, in this embodiment, projection 3 is a double-tapered polygonal pyramidal cone projection. When the double-tapered polygonal pyramidal cone projection contacts the polishing pad, its sides contact the polishing pad. The double-taper design is advantageous for projection 3 to penetrate the polishing pad, and the double-tapered projection structure is more stable than a single-cone structure. When the polishing pad dressing tool is in operation, the double-tapered polygonal pyramidal cone projection has stronger cutting ability, penetrates the polishing pad more easily, and therefore achieves a better dressing effect.

[0038] Specifically, referring to Figures 3 and 4, the projection 3 includes a base circular base 31, a conical apex plane 32, a first working surface 33, and a second working surface 34. Both the first working surface 33 and the second working surface 34 are formed in multiple quantities, and each first working surface 33 and each second working surface 34 are formed between the base circular base 31 and the conical apex plane 32 and are arranged alternately along the circumferential direction of the base circular base 31. The second working surface 34 includes a first grinding surface 341 and a second grinding surface 342. The second grinding surface 342 is close to the conical apex plane 32, and the first grinding surface 341 and the second grinding surface 342 constitute a double taper structure. This double taper design makes it easier for the projection 3 to penetrate into the polishing pad and less likely to damage the polishing pad.

[0039] Furthermore, referring to Figures 3 and 4, in this embodiment, four first work surfaces 33 are installed, and four second work surfaces 34 are installed, that is, four first grinding surfaces 341 and four second grinding surfaces 342 are installed. The first work surface 33 is a flat surface, while both the first grinding surfaces 341 and the second grinding surfaces 342 are curved surfaces. In this embodiment, the four first work surfaces 33 are the first flat surface 331, the second flat surface 332, the third flat surface 333 and the fourth flat surface 334, the four first grinding surfaces 341 are the first curved surface 3411, the second curved surface 3412, the third curved surface 3413 and the fourth curved surface 3414, and the four second grinding surfaces 342 are the fifth curved surface 3421, the sixth curved surface 3422, the seventh curved surface 3423 and the eighth curved surface 3424. The first surface 3411 and the fifth surface 3421 are located between the first plane 331 and the fourth plane 334, the second surface 3412 and the sixth surface 3422 are located between the first plane 331 and the second plane 332, the third surface 3413 and the seventh surface 3423 are located between the second plane 332 and the third plane 333, and the fourth surface 3414 and the eighth surface 3424 are located between the third plane 333 and the fourth plane 334.

[0040] Referring to Figures 3 and 4, the angular range between the first plane 331 and the third plane 333 is 90° to 130°, the angular range between the sixth curved surface 3422 and the eighth curved surface 3424 is 90° to 130°, and the angular range between the second curved surface 3412 and the fourth curved surface 3414 is 90° to 130°. Note that all three angles must avoid the angles of the diamond's cleavage planes, meaning that 70 degrees cannot be selected. If the selected angle is too large, it is disadvantageous for the insertion of the projection 3, and if the selected angle is too small, it is too sharp and prone to damaging the polishing pad surface.

[0041] Naturally, depending on the actual situation, the first grinding surface 341 and the second grinding surface 342 may be machined to be flat, and in this embodiment, curved surfaces are preferred.

[0042] Referring to Figures 2 and 3, multiple sets of projections 3 are installed, each set of projections 3 has multiple projections, and each set of projections 3 is arranged in a ring at equal intervals or at equal angles, with the height of the projections 3 located at the edges being smaller than the height of the projections 3 located in the middle. In this way, damage to the projections 3 due to impact when they come into contact with the polishing pad can be effectively avoided, and by installing a shift height, dressing accuracy can be guaranteed and the service life can be effectively improved.

[0043] The projection 3 on the outermost perimeter (1st rotation) is the smallest in height, the projection 3 on the 2nd rotation is taller than the projection 3 on the 1st rotation, the projection 3 on the 3rd rotation is taller than the projection 3 on the 2nd rotation, and the height of the projection 3 from the 4th rotation to the center is the same as the height of the projection 3 on the 3rd rotation; in other words, the height of the projection 3 from the 4th rotation to the center is the same.

[0044] Naturally, a design with undulating protrusions 3 that are higher and lower is also possible; that is, the outermost (first rotation) protrusion 3 has the smallest height, the second rotation protrusion 3 is higher than the outermost, the third rotation protrusion 3 is higher than the second, the height of the fourth rotation protrusion 3 is the same as the height of the second rotation protrusion 3, the height of the third rotation protrusion 3 is the same as the height of the fifth rotation protrusion 3, and so on.

[0045] Theoretically, under equivalent pressure conditions, the concentric protrusions 3 have a larger contact area with the polishing pad and therefore experience greater frictional force. Naturally, these two types of solutions can be selected according to different polishing pads and dressing requirements.

[0046] Referring to Figure 1, this embodiment further includes a diamond base 4, which is attached to the disc 1, and the diamond sheet 2 is fixed to the diamond base 4. The material of the diamond base 4 is preferably stainless steel. By using the design of the diamond base 4, the amount of diamond used can be significantly reduced.

[0047] Referring to Figures 1 and 5, conventional diamond dressing plates often directly weld or attach the diamond sheet 2 to the stainless steel disc 1. To ensure that the diamond sheet 2 protrudes from the disc surface and to account for the cause of stress-induced fracture of the diamond sheet 2, a thick diamond sheet 2 is often used. In this application, the diamond base plate 4 is designed with a circular shallow groove structure, which allows for the selection and processing of thinner diamond sheets 2. The bottom of the diamond sheet 2 is protected by the diamond base plate 4, making it more stable than a direct attachment structure. This ensures the dressing effect of the polishing pad and saves on the use of CVD diamonds.

[0048] Referring to Figures 5 and 6, the circular hole and the diamond base plate 4 are connected to the disc 1 by adhesive or welding. The single crystal diamond and the diamond base plate 4 can be bonded to the diamond sheet 2 using a highly corrosion-resistant epoxy resin adhesive.

[0049] The implementation principle of the high-precision polishing pad dressing tool of this invention is as follows. The high-precision polishing pad dressing tool includes a disc 1, a diamond base 4, and a diamond sheet 2. The diamond base 4 is fitted into the disc 1, and the diamond sheet 2 is connected to the diamond base 4. The diamond sheet 2 includes a main diamond 21, a sub-diamond 22, and a center diamond 23. Multiple main diamonds 21 and sub-diamonds 22 are installed, and one center diamond 23 is installed. The main diamonds 21, sub-diamonds 22, and center diamonds 23 are arranged in a multi-ring configuration. The multi-ring layout of the main diamonds 21, sub-diamonds 22, and center diamonds 23 provides multi-point support, thereby improving the stability of the machining process and contributing to improved dressing accuracy. Moreover, the multi-ring layout design can effectively increase the dressing range of the polishing pad, resulting in a larger effective working area per runout and improved dressing efficiency. The added diamond base 4 ensures the effectiveness of dressing the polishing pad and can significantly reduce the amount of diamond used. The surface of the diamond sheet 2 has multiple sets of double-tapered polygonal pyramidal cone protrusions. When the double-tapered polygonal pyramidal cone protrusions come into contact with the polishing pad, the sides of the conical apex plane 32 come into contact with the polishing pad, penetrating the polishing pad at a first angle and then entering the polishing pad at a second angle. The double-tapered design makes it easier for the protrusions 3 to penetrate into the polishing pad. Moreover, the double-tapered protrusion structure is more stable than a single-conical structure, and the double-tapered polygonal pyramidal cone protrusions 3 have stronger cutting ability and penetrate into the polishing pad more easily.

[0050] All of the above are preferred embodiments of the present application and do not limit the scope of protection of the present application. Therefore, equivalent changes due to the structure, shape, and principle of the present application should all be included within the scope of protection of the present application. [Explanation of Symbols]

[0051] 1…Disk, 2…Diamond sheet, 21…Main diamond, 22…Sub-diamond, 23…Center diamond, 3…Protrusion, 31…Bottom circular base, 32…Conical apex plane, 33…First working surface, 331…First plane, 332…Second plane, 333…Third plane, 334…Fourth plane, 34…Second working surface, 341…First grinding surface, 3411…First curved surface, 3412…Second curved surface, 3413…Third curved surface, 3414…Fourth curved surface, 342…Second grinding surface, 3421…Fifth curved surface, 3422…Sixth curved surface, 3423…Seventh curved surface, 3424…Eighth curved surface, 4…Diamond base metal.

Claims

1. The device includes a disc (1) and a diamond sheet (2), the diamond sheet (2) being connected to the disc (1), and the surface of the diamond sheet (2) having uniformly high protrusions (3) formed thereon. A polishing pad dressing tool characterized in that the diamond sheet (2) includes a main diamond (21), a sub-diamond (22), and a center diamond (23), one center diamond (23) is installed and located at the center of the disc (1), multiple main diamonds (21) and sub-diamonds (22) are installed, each main diamond (21) is arranged in an annular pattern, each sub-diamond (22) is arranged in an annular pattern, the main diamond (21), the sub-diamond (22), and the center diamond (23) are arranged in multiple annular patterns, and the thickness of the main diamond (21), the sub-diamond (22), and the center diamond (23) is the same.

2. The polishing pad dressing tool according to claim 1, characterized in that the projection (3) is a double-tapered polygonal pyramidal conical projection.

3. The polishing pad dressing tool according to claim 2, characterized in that multiple sets of projections (3) are provided, multiple projections (3) are provided in each set, the projections (3) in each set are arranged in a ring at equal intervals or at equal angles, and the height of the projections (3) located at the edges is smaller than the height of the projections (3) located in the middle.

4. The polishing pad dressing tool according to claim 3, characterized in that the outermost projection (3) has the lowest height, the second projection (3) is higher than the outermost projection (3), the third projection (3) is higher than the second projection (3), and the height of the projections (3) from the fourth to the center is the same as the height of the third projection (3).

5. The polishing pad dressing tool according to claim 3, characterized in that the outermost projection (3) has the lowest height, the second projection (3) is higher than the outermost projection (3), the third projection (3) is higher than the second projection (3), the height of the fourth projection (3) is the same as the height of the second projection (3), and the height of the third projection (3) is the same as the height of the fifth projection (3).

6. The polishing pad dressing tool according to claim 1, characterized in that the projection (3) includes a base circular base (31), a conical apex plane (32), a first working surface (33), and a second working surface (34), wherein both the first working surface (33) and the second working surface (34) are formed in multiple quantities, each of the first working surface (33) and each of the second working surface (34) is formed between the base circular base (31) and the conical apex plane (32) and is arranged alternately along the circumferential direction of the base circular base (31), the second working surface (34) includes a first grinding surface (341) and a second grinding surface (342), the second grinding surface (342) is close to the conical apex plane (32), and the first grinding surface (341) and the second grinding surface (342) constitute a double taper structure.

7. The polishing pad dressing tool according to claim 1, further comprising a diamond base (4), wherein the diamond base (4) is attached to the disc (1), and the diamond sheet (2) is fixed to the diamond base (4).

8. The polishing pad dressing tool according to claim 7, characterized in that the diamond base plate (4) is designed with a circular shallow groove.

9. The polishing pad dressing tool according to claim 1, characterized in that the main diamond (21), the sub-diamond (22), and the center diamond (23) are all single-crystal diamonds and all have circular bevels formed on them.

10. The polishing pad dressing tool according to claim 1, characterized in that the diameter of the main diamond (21) is larger than the diameter of the center diamond (23), and the diameter of the center diamond (23) is larger than the diameter of the sub-diamond (22).

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