Water Cooling Heat Sink for Electronic / Computer Products

Abstract

To provide a liquid cooling heat sink for electronic / computer products that dissipates heat quickly, reduces costs, and eliminates the need for fans. [Solution] The top cover 1 includes a cold plate 11 and two cooling stands 12. The cold plate includes at least two sets of a flow path 1120 containing a refrigerant and a plurality of heat generating components 110. The cold plate has an outlet 1141 and an inlet 1142 facing each other at both ends and communicating with the flow path. A plurality of conduits 2 are installed at the outlet and the inlet, and a support stand 21 is provided at the top. The cooler 3 is installed on the support stand and has side frames on both sides. The cooler includes at least two cooling flow paths 31, a plurality of heat conducting plates 32, and a plurality of heat dissipation expansion sheets 33. The cold plate includes four overlapping bottom plates 111-114. The refrigerant evaporates and liquefies due to the heat source of the heat generating components, and circulation is generated by the siphon principle and pressure difference.

Description

[Technical field]

[0001] This invention relates to a heat dissipation device, and to a water-cooled heat sink for electronic / computer products that utilizes the siphon principle and pressure difference to allow a coolant in which the flow passages and heat-generating components are immersed to evaporate when absorbing heat and then liquefy as it dissipates heat, eliminating the need for an energy-consuming pump to circulate the liquid. [Background technology]

[0002] In the case of heat sinks for traditional electronic / computer products or Internet or surveillance systems or warehouse management or inventory management in the general market, the motherboard mainly has high-performance CPU and GPU parts installed on an aluminum extrusion, and multiple fins are installed on the upper and side of the aluminum extrusion. The heat source of the high-performance CPU and GPU parts is transferred to the fins with an increased heat dissipation area, and is exposed to the air through the fins, so that the heat source of the fins is absorbed by the air. The fins dissipate heat statically, so the heat dissipation effect is not good. In order to quickly dissipate the heat source of the fins into the air, a powerful fan is installed on the fins of the aluminum extrusion, strong wind is blown to the fins, and additional fins are installed on the outer circumference of the aluminum, which increases the cost of the heat sink and consumes more energy. The aluminum extrusion with fins is installed on the top and its periphery, and the fan is installed on the top, so the use of these components increases the cost and increases the occurrence of fan failure. Conventional products use aluminum extrusion fittings to contact high-performance CPUs and GPUs to conduct heat, but the effect is low and their practicality is greatly reduced. This is an area that industry players and consumers are trying to overcome as much as possible. Summary of the Invention [Problem to be solved by the invention]

[0003] In order to solve the above-mentioned technical shortcomings, the main objective of the present invention is to provide a water-cooled heat sink for electronic / computer products, which includes a cover, a conduit, and a cooler, and the cover includes a cold plate and a cooling rack installed on both sides of the cold plate. A flow path and a number of heat-generating components communicating with the flow path are installed within the cold plate. The cold plate is provided with an outlet and an inlet communicating with the flow path, and a conduit is installed at the top end. A cooler communicating with the conduit is installed at the top end of the conduit, thereby overcoming the difficulties in the existing technology.

[0004] Another objective of the present invention is to provide a water-cooled heat sink for electronic / computer products. When a heat-generating component is heated, the low-temperature liquid refrigerant in the flow passage will absorb the heat and vaporize, then rise through a conduit to the cooler, where it will be cooled and turned into liquid, and by utilizing the siphon principle and the generation of pressure difference, it will descend through the opposing conduit into the flow passage of the cold plate and circulate, absorbing the heat source of the heat-generating component.

[0005] Another objective of the present invention is to provide a water-cooled heat sink for electronic / computer products, which can effectively improve the convenience of use, eliminate the need for energy-consuming fans, and achieve rapid heat dissipation and cost reduction.

[0006] The problem that this invention aims to solve is that in the conventional heat sinks for electronic / computer products, Internet, surveillance systems, warehouse management, inventory management, etc. in the general market, high-performance CPU and GPU components on the motherboard are installed on an aluminum extrusion, and multiple fins are installed on the top and sides of the aluminum extrusion, and a separate powerful fan is installed on the fins, so that the heat source of the high-performance CPU and GPU components is in contact with the aluminum extrusion and is conducted to the fins which increase the heat dissipation area, or the heat source is removed by the fins or strong wind of the powerful fan, but the heat dissipation effect is poor. When fins or a powerful fan are installed on the top of the aluminum extrusion, the cost of the cooler and the cost of using this component increase, more energy is consumed, and the fan is easily broken, which greatly reduces its practicality.

[0007] As a technical means for solving the problem, in order to achieve the above object, the present invention provides a water-cooled heat sink for electronic / computer products, which includes the following components: a top cover includes a cold plate and two cooling stands, the cooling stands are installed on both sides of the cold plate, the cold plate is provided with a flow passage for receiving at least two sets of refrigerant, the cold plate also has a number of heat-generating components communicating with the flow passage, and both ends of the cold plate are provided with an outlet and an inlet, which are mutually intersecting, facing each other and communicating with the flow passage; a plurality of conduits are respectively installed at the outlet and the inlet of the cold plate of the top cover, and a support frame is installed at the upper end of each of the conduits and communicates with the outlet and the inlet; A cooler is mounted on the support frame of the conduit, and side frames are installed between both sides of the cooler and the upper end of the cold plate, the cooler includes at least two cooling channels, a number of heat conduction plates and a number of heat dissipation expansion sheets, both ends of the cooling channels are closed and each of the cooling channels is straddled and communicates with the support frame of the conduit, both ends of the heat conduction plate are installed to fit the cooling channels, and the heat dissipation expansion sheet is connected to the two opposing heat conduction plates by folding; When the heat-generating component is heated, the refrigerant in a low-temperature liquid state in the flow passage absorbs heat and vaporizes, and the refrigerant rises through the conduit to the cooler, where it is cooled to become liquid. By utilizing the siphon principle and the generation of a pressure difference, the refrigerant descends through the opposing conduit to generate a circulation and enters the flow passage of the cold plate.

[0008] Preferably, a number of heat dissipation sheets are installed on the outer side of the cooling rack of the top cover of the present invention.

[0009] Preferably, the cold plate of the present invention includes a first bottom plate, a second composite plate, a third metal plate and a fourth top plate stacked on each other, the second composite plate and the third metal plate are provided with at least two sets of channels for receiving a refrigerant, and the fourth top plate is provided with the channels communicating with the outlet and the inlet or the second composite plate and the third metal plate.

[0010] Preferably, the third metal layer of the cold plate of the present invention is an aluminum plate, but is not limited thereto.

[0011] Preferably, the top of the present invention is a metal top, but is not limited thereto.

[0012] Preferably, the metal top of the present invention is an extruded aluminum top, but is not limited thereto.

[0013] Preferably, the first layer bottom plate, the second layer composite plate, the third layer metal plate and the fourth layer top plate of the cold plate of the present invention are overlapped by welding technology.

[0014] Preferably, the heat generating components of the present invention are heat generating components of vehicle mounted electronic devices, heat generating components of computer peripheral devices, heat generating components of other computer peripheral devices, and heat generating components of control devices, but are not limited thereto. Effect of the Invention

[0015] Compared with the effects of the prior art, the present invention includes the top cover, the conduit, and the cooler, the top cover includes the cold plate and the cooling rack installed on both sides of the cold plate, the cold plate is equipped with the flow path and a number of heat-generating components connected to the flow path, the cold plate is equipped with the outlet and the inlet connected to the flow path, and has the conduit at its upper end, and the cooler is installed at the upper end of the conduit and connected to the conduit; further, when the heat-generating components are heated, the low-temperature liquid refrigerant in the flow path absorbs heat and vaporizes, and the conduit rises to the cooler and is cooled until it becomes liquid, and by utilizing the siphon principle and pressure difference, it descends through the opposing conduit to generate circulation and enters the flow path of the cold plate; effectively improving the convenience of use, eliminating the need for an energy-consuming fan, quickly dissipating heat, and reducing costs, and being inventive, practical and meeting the needs of users, it is fully expected to increase profits. [Brief description of the drawings]

[0016] [Figure 1] FIG. [Diagram 2] FIG. [Diagram 3] FIG. [Figure 4] FIG. 2 is another assembled cross-sectional view of the present invention. [Diagram 5]This is an example diagram showing how the refrigerant vaporizes and rises when the heat dissipation component of the present invention generates heat, passes through the outlet and enters the cooling passage of the cooler, where it dissipates heat and becomes liquid. It then flows into another conduit, descends, enters the inlet, and reaches the passage of the cold plate, generating a circulation by utilizing the siphon principle and the generation of a pressure difference. [Figure 6] FIG. 2 is a cross-sectional view showing another view of the present invention, in which the refrigerant is vaporized by heat and then cooled to liquid to generate circulation. [Figure 7] FIG. 3 is a diagram showing an embodiment in which a heat dissipation sheet is installed on the cooling stand of FIG. 2 according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] The present invention will be described in detail below in the form of an embodiment with reference to the accompanying drawings. The drawings used in the text are merely schematic in nature and are used to assist in the description, and do not necessarily represent the true proportions and precise layout of the present invention after it is put into practice. Therefore, the proportions and layouts of the accompanying drawings should not be used to limit the scope of the utility model claims in the actual implementation of the present invention, as will be explained in advance.

[0018] Please refer to Figures 1, 2, 3, 4, 5, 6 and 7. These figures are a three-dimensional exploded view of the present invention, a three-dimensional assembly view of the present invention, an assembly cross-sectional view of the present invention, another assembly cross-sectional view of the present invention, an embodiment diagram of the present invention in which the refrigerant evaporates and rises due to the heat generated by the heat dissipation component of the present invention, passes through the outlet and enters the cooling passage of the cooler, becomes liquid due to heat dissipation, flows into another conduit, descends, enters the inlet and reaches the passage of the cold plate, and generates circulation by utilizing the siphon principle and the generation of pressure difference, a cross-sectional view of the present invention in which the refrigerant evaporates and is cooled to liquid due to heat from another perspective, and an embodiment diagram of the present invention in which a heat dissipation sheet is installed on the cooling rack of Figure 2; one preferred embodiment of the water-cooled heat sink for electronic / computer products of the present invention includes a top cover 1, multiple conduits 2 and a cooler 3.

[0019] The one cover 1 includes a cold plate 11 and two cooling racks 12, the cold plate 11 is provided with the cooling racks 12 on both sides, the cold plate 11 is provided with at least two sets of a flow passage 1120 for receiving a refrigerant, and the cold plate 11 is also provided with a number of heat generating components 110 communicating with the flow passage 1120, the embodiment of the heat generating components 110 being a high-performance CPU or GPU, but this should not be construed as limiting the present invention; the cold plate 11 is provided with two cooling racks 12 on both sides. The cold plate 11 includes a first layer bottom plate 111, a second layer composite plate 112, a third layer metal plate 113 and a fourth layer top plate 114, which are overlapped with each other, and the second layer composite plate 112 is a fin, which is a fin, and the cold plate 11 includes a first layer bottom plate 111, a second layer composite plate 112, a third layer metal plate 113 and a fourth layer top plate 114, which are overlapped with each other, and the second layer composite plate 112 is a fin, which ... The plywood 112 and the third layer metal plate 113 are provided with at least two sets of flow passages 1120 for accommodating a refrigerant, the fourth layer top plate 114 is provided with the outlet 1141 and the inlet 1142 as well as the flow passages 1120 communicating with the second layer composite plate 112 and the third layer metal plate 113, the third layer metal plate 113 of the cold plate 11 is an aluminum plate in this embodiment, but this should not be construed as limiting the present invention; the top cover 1 is a metal top cover in this embodiment, but this should not be construed as limiting the present invention; the metal top cover is an aluminum plate in this embodiment, but this should not be construed as limiting the present invention; In the embodiment, the cold plate 11 is an aluminum extrusion cover, but the present invention should not be limited thereby; the first layer bottom plate 111, the second layer composite plate 112, the third layer metal plate 113 and the fourth layer top plate 114 of the cold plate 11 are overlapped by welding technology (as shown in Figures 1, 2, 3 and 4); in the embodiment, the heat-generating component 110 is a heat-generating component of an electronic device mounted on a vehicle, a heat-generating component of a computer peripheral device, a heat-generating component of other computer peripheral devices and a heat-generating component of a control device, but the present invention should not be limited thereby;The vehicle-mounted electronic equipment of the vehicle-mounted electronic equipment heat-generating parts can be, for example, electric vehicle charging management equipment, automatic driving computer management equipment, smart fleet vehicle management equipment, police vehicle management equipment, mass transit system movement and passenger information management equipment, commercial vehicle smart cockpit equipment, but this should not be limited to the present invention; the computer peripheral equipment of the computer peripheral equipment heat-generating parts can be, for example, mainframes, industrial computers, personal computers, laptop computers, servers, but this should not be limited to the present invention; the other computer peripheral equipment of the other computer peripheral equipment heat-generating parts can be, for example, POS (Point of The control device of the heat-generating component may be, for example, a license plate recognition system device, a vehicle face recognition control device, an outdoor image monitoring system device, a collection and monitoring control device for agricultural conditions (soil moisture, temperature, sunlight, air quality and other data), a collection and monitoring control device for livestock farming conditions (environmental conditions of livestock farms, data related to animal behavior and health conditions, etc.), and an FA control device, but this should not be construed as limiting the present invention;

[0020] The multiple conduits 2 are respectively installed at the outlet 1141 and the inlet 1142 of the cold plate 11 of the top cover 1, and a support stand 21 communicating with the outlet 1141 and the inlet 1142 is installed at the upper end of the conduit 2 (as shown in Figures 1, 2, 3 and 4).

[0021] The cooler 3 is mounted on the support frame 21 of the conduit 2, and a side frame 30 is installed between both sides of the cooler 3 and the upper end of the cold plate 11. The cooler 3 includes at least two cold channels 31, a plurality of heat conduction plates 32 and a plurality of heat dissipation expansion sheets 33. Both ends of the cold channels 31 are sealed and connected to the support frame 21 of the conduit 2 so as to straddle the support frame 21. Both ends of the heat conduction plates 32 are mounted on the support frame 21 so as to fit the cold channels 31, and the heat dissipation expansion sheets 33 are connected to the support frame 21. When the heat generating component 110 is heated, the low temperature liquid refrigerant in the flow passage 1120 absorbs heat and vaporizes, and the refrigerant rises up to the cooler 3 and becomes liquid, and then enters the flow passage 1120 of the cold plate 11 by utilizing the siphon principle and the generation of pressure difference, and the opposing refrigerant in the flow passage 1120 descends to generate circulation (as shown in Figures 5 and 6).

[0022] The present invention includes the cover 1, the conduit 2, and the cooler 3. The cover 1 includes the cold plate 11 and the cooling rack 12 installed on both sides of the cold plate 11. The cold plate 11 is provided with the flow passage 1120 and a number of heat generating components 110 communicating with the flow passage 1120. The cold plate 11 is provided with the outlet 1141 and the inlet 1142 communicating with the flow passage 1120. The conduit 2 is provided at the top end of the conduit 2, and the cooler 3 communicating with the conduit 2 is connected to the top end of the conduit 2. Furthermore, the heat generating components 110 generate heat. As a result, the low-temperature liquid refrigerant in the flow path 1120 absorbs heat and vaporizes, rises through the conduit 2 to the cooler 3, where it is cooled to become liquid, and then, utilizing the siphon principle and the generation of pressure difference, descends through the opposing conduit and circulates, entering the flow path 1120 of the cold plate 11, thereby absorbing the heat source of the heat-generating component 110; effectively improving the convenience of use, eliminating the need for an energy-consuming fan, allowing for fast heat dissipation and cost reduction, and with its progressiveness, practicality and meeting the needs of users, it is expected to generate increased profits.

[0023] As can be seen from the above, this invention has achieved the desired effect by breaking through the background technology, and the contents of this invention are not easily understood or known to those skilled in the art, and this invention has never been disclosed before the application. Its innovativeness and inventive step clearly meet the requirements for a utility model patent application, and we hereby submit a utility model patent application in accordance with the law. We hope that your office will approve this utility model application, thereby encouraging our inventions to have a sense of virtue.

[0024] The above examples are only intended to illustrate the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the content of the present invention and to implement it accordingly. Therefore, they should not be used to limit the scope of the utility model claims of the present invention; all equivalent changes or modifications made in accordance with the spirit of the present invention shall still be included in the scope of the utility model claims of the present invention. [Explanation of symbols]

[0025] 1...Top lid 11...Cold plate 110...Heat generating parts 111...First layer bottom plate 112...Second layer composite board 1120...Flow path 113...Third layer metal plate 114...Fourth layer top plate 1141...Exit 1142...Entrance 12...Cooling stand 121...Heat dissipation sheet 2...conduit 21...Support stand 3...Cooler 31...Cold flow path 32...Heat conductive plate 33...Heat dissipation expansion sheet

Claims

1. A water-cooled heat sink for an electronic / computer product, comprising: a top cover; a plurality of conduits; and a cooler; The upper cover includes a cold plate and two cooling stands, the cooling stands are installed on both sides of the cold plate, a flow path for accommodating at least two sets of refrigerant is installed on the cold plate, a plurality of heat generating components are also installed on the cold plate and communicate with the flow path, and an outlet and an inlet are respectively installed on both ends of the cold plate, intersecting and facing each other and communicating with the flow path, The plurality of conduits are respectively installed at the outlet and the inlet of the cold plate of the upper cover, and a support frame is installed at the upper end of the conduits and communicates with the outlet and the inlet; The cooler is installed on the support frame of the conduit, and a side frame is installed between both sides of the cooler and the upper end of the cold plate, the cooler includes at least two cold channels, a plurality of heat conduction plates and a plurality of heat dissipation expansion sheets, both ends of the cold channels are closed and connected to straddle the support frame of the conduit, both ends of the heat conduction plates are installed to fit the cold channels, and the heat dissipation expansion sheets are connected to the two opposing heat conduction plates in a folded manner, When a heat-generating component is heated, the low-temperature liquid refrigerant in the flow passage absorbs heat and vaporizes, rises through a conduit to the cooler where it is cooled to liquid form, and then, by utilizing the siphon principle and the generation of a pressure difference, descends through the opposing conduit to generate a circulation and enters the flow passage of the cold plate.

2. 2. The water-cooled heat sink for electronic / computer products according to claim 1, wherein a plurality of heat dissipation sheets are installed on the outer side of the cooling rack of the upper cover.

3. 2. The water-cooled heat sink for electronic / computer products as claimed in claim 1, wherein the heat-generating component is a heat-generating component of an electronic device mounted on a vehicle or a heat-generating component of a computer peripheral device.

4. The water-cooled heat sink for electronic / computer products described in any one of claims 1 to 3, characterized in that the cold plate includes a first layer bottom plate, a second layer composite plate, a third layer metal plate and a fourth layer top plate overlapping each other, the second layer composite plate and the third layer metal plate are provided with at least two sets of flow paths for accommodating a refrigerant, and the fourth layer top plate is provided with the flow paths communicating with the outlet, the inlet, the second layer composite plate and the third layer metal plate.

5. 5. The water-cooled heat sink for electronic / computer products as claimed in claim 4, wherein said third layer metal plate of said cold plate is an aluminum plate.

6. 2. The liquid cooling heat sink for electronic / computer products as claimed in claim 1, wherein said top cover is a metal top cover.

7. 7. The liquid-cooled heat sink for electronic / computer products as claimed in claim 6, wherein said metal cover is an extruded aluminum cover.

8. 5. The water-cooled heat sink for electronic / computer products as claimed in claim 4, wherein the first layer bottom plate, the second layer composite plate, the third layer metal plate and the fourth layer top plate of the cold plate are overlapped by welding technology.

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