Pressure die equipment, upper die jig and crimping equipment

Abstract

To provide a pressure die device capable of solving the problem that a small pressure die does not have enough space to arrange a fixing member when the size of a crimping object is small. [Solution] The pressure mold device comprises a connecting means, a pressure mold means, a lower fixing member 3, and a temperature sensor 4. The connecting means is configured to have an axial rod 11 formed to surround a through hole 110 extending in the vertical direction, and a sleeve 12 formed with an axial hole 120 through which the axial rod 11 passes and attached so as to be inserted onto the axial rod 11. The pressure mold means is connected to the lower end of the axial rod 11 and has a pressure block 21. The lower fixing member 3 has a first passage 30 formed therein that communicates with the through hole 110 and in which the temperature sensor 4 is disposed, and the lower fixing member 3 is configured to fix the pressure block 21 to the through hole 110.

Description

[Technical Field]

[0001] The present invention relates to equipment used in chip packaging processes, and more particularly to a pressure die device, upper die jig and crimping equipment. [Background technology]

[0002] Conventional crimping equipment used in chip packaging processes includes, for example, a lower die jig in which multiple crimping targets are arranged in a matrix, and an upper die jig that moves up and down corresponding to the lower die jig to perform crimping on the crimping targets. Each crimping target has a rectangular cross section and is configured, from bottom to top, to include a substrate, a die, a thermal interface material, and a heat dissipation sheet. The upper die jig is provided with the same number of pressure die units as the crimping targets. Each pressure die unit corresponds to one crimping target. Under ideal circumstances, the pressure die units perform vertical crimping on the crimping targets from directly above them, thereby achieving excellent crimping quality for the crimping targets and contributing to the chip packaging process.

[0003] Furthermore, the pressure mold unit described in Patent Document 1 is configured such that the pressure mold is positioned below the crimping arm, and the temperature of the object to be crimped is detected by a temperature sensor inserted into the center of the pressure mold via the crimping arm. However, as a result, the fixing member fixed to the crimping arm of the pressure mold must be positioned around the temperature sensor, offset from the temperature sensor. Furthermore, since the size of the pressure mold varies depending on the size of the object to be crimped, there is a problem that if the size of the object to be crimped is small, there is not enough space to position the fixing member in a small pressure mold. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Taiwan Patent No. I804790 Specification Summary of the Invention [Problem to be solved by the invention]

[0005] In view of the above problems, the present invention aims to provide a pressure die device, an upper die jig and a crimping equipment that can solve at least one of the drawbacks of the prior art. [Means for solving the problem]

[0006] In order to achieve the above object, the present invention provides a pressure molding device comprising a connecting means, a pressure molding means, a lower fixing member, and a temperature sensor, The connecting means is configured to include a shaft formed to surround a through hole extending in the vertical direction, and a sleeve formed with an axial hole through which the shaft passes and attached so as to be fitted onto the shaft, The pressure mold means is connected to the lower end of the shaft and has a pressure block; A pressure mold device is provided in which the lower fixing member has a first passage formed therein that communicates with the through hole and in which the temperature sensor is disposed, and the lower fixing member is configured to fix the pressure block to the through hole.

[0007] The present invention also provides a pressurizing mold apparatus comprising: an upper mold table having the same number of installation areas as the pressurizing mold apparatuses, each pressurizing mold apparatus being disposed in one of the installation areas; Each of the pressure mold devices also provides an upper mold jig, which is configured so that when the sleeve engages with the installation area, the shaft is driven and can move in the vertical direction relative to the upper mold table in conjunction with the pressure mold means.

[0008] Furthermore, the present invention also provides a crimping equipment comprising the above-mentioned upper mold jig and a lower mold jig that corresponds to the upper mold jig and performs crimping processing on the crimping object using each of the pressure mold devices that the upper mold jig has. [Effects of the Invention]

[0009] The pressure die apparatus of the present invention having the above configuration can integrate the temperature sensor with the lower fixing member arranged on the shaft of the pressure block by arranging the temperature sensor in the first passage formed in the lower fixing member, and this unique and simplified configuration solves the problem of insufficient space for arranging the fixing member in small pressure dies when the size of the crimping object is small. In addition, the crimping equipment of the present invention has at least one pressure die device in the upper die jig, and this upper die jig corresponds to the lower die jig, so that at least one pressure die device can perform crimping on the corresponding crimping object, and can therefore function as a crimping equipment. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a perspective view of a pressurizing die device, an upper die jig, and a crimping device according to an embodiment of the present invention; [Figure 2] 1 is an exploded perspective view showing an embodiment of a pressure mold device of the present invention; [Figure 3] An embodiment of the pressure mold device of the present invention is shown in a cross-sectional view taken along line III-III in FIG. [Figure 4] An embodiment of the pressure mold device of the present invention is shown in a cross-sectional view taken along line IV-IV in FIG. [Figure 5] The cross-sectional view taken along line VV in FIG. 3 shows the configuration of the connecting means in the pressure mold device of the present invention. [Figure 6] 1 is a perspective view showing an embodiment of a crimping device according to the present invention; [Figure 7] 1 is a front view showing an embodiment of the crimping equipment of the present invention; [Figure 8] FIG. 2 is a partially exploded perspective view showing an embodiment of an upper mold jig of the present invention. [Figure 9] FIG. 2 is a partially exploded perspective view showing an embodiment of an upper mold jig of the present invention. [Figure 10] 1 is a partial top view showing an embodiment of an upper mold jig of the present invention; FIG. [Figure 11]FIG. 2 is a partial perspective view showing the configuration of the cable frame in the upper die jig of the present invention. [Figure 12] 1 is a cross-sectional view showing how the upper die jig driven by the jig driving means in the crimping equipment of the present invention moves downward to bring the pressurizing die device into pressurized contact with the object to be crimped; [Figure 13] 4 is a cross-sectional view showing a state in which a pressure mold device driven by a pressure mold driving means in the crimping equipment of the present invention moves downward to come into pressure contact with a crimping object; FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] In order to more clearly explain the objectives, technical means, and advantages of the embodiments of the present invention, the following will clearly and completely describe the technical means in the embodiments of the present invention in combination with the accompanying drawings of the embodiments of the present invention. It should be apparent that the described embodiments are only some embodiments of the present invention, and not all embodiments. Generally, the components of the embodiments of the present invention depicted and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the detailed description of the embodiments of the present invention provided below in the accompanying drawings does not constitute any limitation on the protection scope of the present invention, but merely represents selected embodiments of the present invention.

[0012] Also, in the following description, please note that elements that fulfill the same role or function are denoted by the same numbers even if they do not have exactly the same configuration.

[0013] 1 to 3 and 6, the upper mold jig O2 of this embodiment of the present invention includes the pressing mold apparatus O1 of the present invention, and the crimping equipment O3 of the present invention includes the upper mold jig O2 of the present invention. As shown in the figures, in this embodiment, the pressing mold apparatus O1 includes a connecting means 1, a pressing mold means 2 arranged below the connecting means 1, a lower fixing member 3 connecting and fixing the connecting means 1 and the pressing mold means 2, a temperature sensor 4 extending from the upper end of the connecting means 1 through the connecting means 1 and the pressing mold means 2 to the lower end of the pressing mold means 2, a pressure detection means 5 arranged above the connecting means 1, an upper fixing member 6 connecting and fixing the connecting means 1 and the pressure detection means 5, and an underlay member 7 sandwiched between the connecting means 1 and the pressure detection means 5.

[0014] As shown in Figures 3 to 5, the connection means 1 is configured to have an axial rod 11 formed to surround a through hole 110 extending in the vertical direction, a sleeve 12 formed with an axial hole 120 through which the axial rod 11 passes and attached so as to be extrapolated onto the axial rod 11, and two seal rings 13 arranged respectively at the upper and lower parts of the sleeve 12 adjacent to the axial rod 11.A notch 111 communicating with the through hole 110 is formed at the upper end of the axial rod 11, and the axial rod 11 and the sleeve 12 are spline-engaged with each other, allowing the axial rod 11 and the sleeve 12 to move relative to each other in the vertical direction.

[0015] As shown in Figures 2 to 4, the pressure mold means 2 is removably connected to the lower end of the shaft rod 11, and the pressure mold means 2 has a pressure block 21 that is removably fixed to the lower end of the through hole 110 by a lower fixing member 3, a heat insulating member 22 that is arranged on the pressure block 21, and a pressure mold 23 that is arranged at the lower end of the heat insulating member 22 and is configured to be able to apply pressure to the contact crimping object A0 (see Figure 12).

[0016] A lower fixing hole 210 is formed in the center of the pressure block 21, into which the lower fixing member 3 can be inserted, and the pressure block 21, the heat insulating member 22, and the pressure mold 23 can be connected to each other by well-known fixing means such as screws / bolts (not shown).

[0017] The pressure mold 23 is made of a material other than metal that can withstand high temperatures and pressures, and the object A0 to be bonded can be, for example, a workpiece with a heat dissipation sheet placed on it in a semiconductor manufacturing process. In this case, the object A0 to be bonded has, from bottom to top, a substrate, a die, a thermal interface material, and a heat dissipation sheet, but the object to be bonded used in this invention is not limited to this.

[0018] The lower fixing member 3 is formed with a first passage 30 that communicates with the through hole 110 and through which the temperature sensor 4 is disposed (inserted), and is configured to fix the pressurizing block 21 to the through hole 110. Furthermore, a second passage 220 that communicates with the first passage 30 is formed in the center of the heat insulating member 22, and a third passage 230 that communicates with the second passage 220 is formed in the center of the pressurizing mold 23, and the axial hole 120, the through hole 110, the first passage 30, the second passage 220, and the third passage 230 are formed coaxially in the vertical direction.

[0019] The temperature sensor 4 is formed in the shape of a wire and is inserted into the first passage 30 from the outside of the shaft 11 through the notch 111 and the through hole 110 formed in the shaft 11, and is further inserted through the second passage 220 and the third passage 230 and extended to the lower end of the pressure mold 23.

[0020] The pressure detection means 5 is arranged at the upper end of the shaft rod 11 and has a holder 51 connected to the shaft rod 11, and a pressure sensor 52 arranged on the upper part of the holder 51. The holder 51 has a holder portion 511 on which the pressure sensor 52 is arranged, and an attachment portion 512 that is fitted onto the shaft rod 11, and the holder portion 511 is formed with a width greater than that of the attachment portion 512. The attachment portion 512 is arranged and fixed to the upper end of the through hole 110 by the upper fixing member 6, and has a slit 510 that opens opposite the notch 111 formed in the shaft rod 11. With this configuration, when the attachment portion 512 is attached to the upper end of the shaft rod 11, the notch 111 (see FIG. 1) is not blocked from the outside.

[0021] As shown in FIG. 2, the support base 51 has two first side edges 513 that are parallel to each other, and the sleeve 12 has two second side edges 121 that are parallel to each other. A first axis 514 that is perpendicular to the two first side edges 513 and a second axis 122 that is perpendicular to the two second side edges 121 are not parallel to each other when projected onto an imaginary horizontal plane that is perpendicular to the up-down direction. In this embodiment, the imaginary line formed by projecting the first axis 514 and the second axis 122 onto the imaginary horizontal plane forms an angle of 45°. The underlay member 7 is disposed between the holder 51 and the sleeve 12, and has an opening 70 formed therein through which the shaft rod 11 is inserted.

[0022] 6 to 8, the upper mold jig O2 of the present invention in this embodiment includes an upper mold table 8 on which 50 pressurizing mold devices O1 of the present invention are placed, and 50 pressurizing mold driving means B0 for driving the pressurizing mold devices O1 in the vertical direction. In this embodiment, the specific configuration of each pressurizing mold driving means B0 is, for example, configured using a pneumatic cylinder, but the present invention is not limited to this.

[0023] 8 to 10, the upper mold table 8 has 50 installation areas 81 arranged in a 5 x 10 matrix of 5 rows and 10 columns, with one pressure mold device O1 disposed in each, and a total of 11 cable frames 82 arranged parallel to one of the columns of the installation areas 81 and sandwiching the five pressure mold devices O1 disposed in the five installation areas 81 aligned in each column. In this embodiment, each installation area 81 has a circular through-hole formed therein that penetrates the upper mold table 8 and allows one pressure mold device O1 to be attached.

[0024] With this configuration, a total of 50 pressure mold devices O1 are arranged in rows of five between two adjacent cable frames 82. Each pressure mold device O1 is sandwiched between two cable frames 82 by the corresponding sleeve 12 and attached to a circular through-hole in the corresponding installation area 81, but as shown in Fig. 9, by adopting an arrangement in which the attachment positions of the wide holding portions 511 of the pressure detection means 5 at the top of two adjacent pressure mold devices O1 are at different heights, the holding portions 511 of two adjacent pressure mold devices O1 are arranged to partially overlap in the vertical direction when viewed from above, as shown in Fig. 10, thereby realizing a more densely packed arrangement.

[0025] 9 and 11, each cable frame 82 has two side walls 821 that extend parallel to each other with a gap between them and in which cable holes 824 are formed, and a connecting plate 822 that is disposed between the lower portions of the two side walls 821 and connects them, thereby forming a generally dish-shaped cable passage 823 between the two side walls 821 and the connecting plate 822. With this configuration, cables required for constructing the temperature sensor 4, pressure sensor 52, etc. that each pressurizing mold device O1 has can be housed together in each cable passage 823 via the cable holes 824 formed in the side walls 821, or can extend from each cable passage 823 to the outside of the cable frame 82.

[0026] As shown in Figures 2, 8, and 9, in this embodiment, the pressurizing mold apparatus O1 is mounted on the upper mold table 8 in the following procedure. First, the lower part of the sleeve 12 of the connecting means 1 of each pressurizing mold apparatus O1 is inserted into the circular through-hole in the corresponding installation area 81, and the upper part of the sleeve 12 is engaged with the upper surface of the installation area 81, so that the upper part of the shaft 11 is exposed above the upper mold table 8, and the lower part of the shaft 11 is exposed below the upper mold table 8. Next, the pressurizing mold means 2 of each pressurizing mold apparatus O1 is fixed to the shaft 11 from the lower side to the upper side of the upper mold table 8. After the mounting of the connecting means 1 and pressurizing mold means 2 of the pressurizing mold apparatus O1 is completed, the installation of the cable frame 82 is completed. Finally, the underlay member 7 and pressure detection means 5 of each pressurizing mold apparatus O1 are sequentially mounted on the connecting means 1 from above the upper mold table 8.

[0027] The procedures described here are merely examples, and the present invention is not limited to this order. For example, the method of attaching the pressure mold device O1 to the upper mold table 8 can be changed depending on the dimensions of the installation area 81, the sleeve 12, the pressure mold means 2, etc.

[0028] 6, 7, and 12, the crimping equipment O3 of the present invention includes the upper die jig O2 of the present invention, a lower die jig 9 that performs crimping of the crimping target A0 using each pressure die device O1 included in the upper die jig O2 corresponding to the upper die jig O2, and a jig drive means C0 that drives the up and down movement of the upper die jig O2 to bring each pressure die device O1 in the upper die jig O2 into contact with the crimping target A0 to perform the pressurizing operation. That is, in the above embodiment, a total of 50 pressure die devices O1 are arranged in the upper die jig O2, and the lower die jig 9 is configured with a total of 50 lower dies 91 that correspond to the 50 pressure die devices O1, respectively. When a crimping target A0, such as a workpiece with a heat dissipation sheet arranged in a semiconductor manufacturing process, is placed on each lower die 91, the upper die jig O2 and the lower die jig 9 can simultaneously perform crimping of the 50 crimping targets A0. Incidentally, the specific configuration of each jig driving means C0 is configured using a pneumatic cylinder as an example, but the present invention is not limited to this.

[0029] 6, 12 and 13, when performing crimping on each crimping object A0 using the crimping equipment O3 of this embodiment of the present invention, first the upper die jig O2 is driven by the jig driving means C0 and moved closer to the lower die jig 9 until the pressurizing die 23 of each pressurizing die device O1 comes into contact with the upper surface of the corresponding crimping object A0. Here, the sleeve 12 of each pressurizing die device O1 is fixed to the upper die table 8, and the shaft 11 is capable of moving up and down relative to the sleeve 12, so that the pressurizing die means 2 moved by the shaft 11 can move up and down relative to the upper die table 8. In this way, when the pressure die 23 of each pressure die apparatus O1 comes into contact with the top surface of the corresponding crimping object A0, the slight upward movement of the shaft rod 11 relative to the upper die table 8 creates a gap D0 between the pressure detection means 5 and the underlay member 7, so that the pressure die drive means B0 of each pressure die apparatus O1 is operated to move the pressure detection means 5 and shaft rod 11 downward to eliminate this gap D0, and the crimping process is performed on the crimping object A0 using the pressure die means 2. In this crimping process on the crimping object A0, the upper die jig O2 and / or the lower die jig 9 heat the crimping object A0 to the temperature required for crimping, but the temperature sensor 4 in the pressure die apparatus O1, which extends to the pressure die 23 whose lower part comes into contact with the crimping object A0, can detect the temperature of the crimping object A0 in real time, so the temperature of the crimping object A0 being crimped can be appropriately controlled.

[0030] To summarize the above, the pressing die device O1, upper die jig O2, and crimping equipment O3 of the present invention integrate the temperature sensor 4 with the lower fixing member 3, which is disposed on the shaft 11 of the pressing block 21, by arranging the temperature sensor 4 in the first passage 30 formed in the lower fixing member 3, thereby giving the present invention a unique and simplified configuration. In addition, the upper die jig O2 of the crimping equipment O3 has at least one pressing die device O1, which corresponds to the lower die jig 9, and at least one pressing die device O1 can perform crimping on the corresponding crimping object A0, thereby fulfilling the role of the crimping equipment O3.

[0031] The above-described embodiments are illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Those skilled in the art may make slight changes or modifications to the above-described embodiments without departing from the spirit and scope of the present invention. Therefore, all changes and modifications made by those skilled in the art without departing from the gist of the present invention should be considered to fall within the scope of protection of the present invention. [Explanation of symbols]

[0032] 1. Connection Method 11 axis rod 110 Passing hole 111 Notch 12 sleeves 120 Axial hole 121 Second side edge 122 Second Axis 13 Seal ring 2. Pressure molding means 21 Pressure Block 210 Lower fixing hole 22 Heat insulating material 220 Second Passage 23 Pressure mold 230 Third Passage 3 Lower fixing member 30 First Passage 4 Temperature Sensor 5. Pressure detection means 51 Holding stand 510 Slit 511 Holding part 512 Mounting part 513 First side edge 514 First Axis 52 Pressure Sensor 6 Upper fixing member 7 Underlayment material 70 aperture 8 Upper mold stand 81 Installation area 82 Cable Frame 821 Side wall 822 Connection plate 823 Cable Passage 824 Cable port 9 Lower mold jig 91 Lower mold A0 Crimping target B0 Pressure mold driving means C0 Jig driving means D0 Gap O1 Pressure mold device O2 upper die jig O3 Crimping Equipment

Claims

1. A pressure mold device comprising a connecting means, a pressure mold means, a lower fixing member, and a temperature sensor, The connecting means is configured to include a shaft formed to surround a through hole extending in the vertical direction, and a sleeve formed with an axial hole through which the shaft passes and attached so as to be fitted onto the shaft, The pressure mold means is connected to the lower end of the shaft and has a pressure block; A pressure mold device in which a first passage is formed in the lower fixing member, the first passage communicating with the through hole and in which the temperature sensor is arranged, and the lower fixing member is configured to fix the pressure block to the through hole.

2. the pressure die means is removably connected to the lower end of the shaft; and the pressure mold means further includes a heat insulating member disposed on the pressure block, and a pressure mold disposed on the heat insulating member; a lower fixing hole into which the lower fixing member can be inserted is formed in the pressure block; a second passage communicating with the first passage is formed in the heat blocking member; 2. The pressure mold apparatus according to claim 1, wherein the pressure mold has a third passage formed therein that communicates with the second passage.

3. The pressurizing mold apparatus according to claim 2 , wherein the axial hole, the through hole, the first passage, the second passage, and the third passage are arranged to extend coaxially.

4. 4. The pressure mold apparatus according to claim 3, wherein the temperature sensor is formed in a wire shape and is arranged to extend through the through hole, the first passage, the second passage, and the third passage to the pressure mold.

5. a notch communicating with the passage hole is formed at the upper end of the shaft; The pressure mold apparatus according to claim 1 , wherein the temperature sensor is inserted into the first passage from outside the shaft rod via the notch and the through hole.

6. 2. The pressure mold apparatus according to claim 1, further comprising a pressure sensing means disposed above said shaft rod.

7. 7. The pressurizing mold apparatus according to claim 6, wherein the pressure detecting means comprises a holding table and a pressure sensor disposed above the holding table.

8. A pressure molding device as described in claim 7, wherein the holding base has a holding portion in which the pressure sensor is arranged and an attachment portion that is inserted onto the shaft rod, and the holding portion is formed so that its width is larger than that of the attachment portion.

9. The pressure mold apparatus according to claim 7 , further comprising an upper fixing member, wherein the holding table is fixed to the passage hole by the upper fixing member.

10. Further, an underlay member is provided between the holder and the sleeve, 8. The press mold apparatus according to claim 7, wherein the base member has an opening through which the shaft rod is inserted.

11. the support base has two first side edges parallel to each other, and the sleeve has two second side edges parallel to each other; A pressure mold apparatus as described in claim 7, wherein a first axis perpendicular to the two first side edges and a second axis perpendicular to the two second side edges are not parallel to each other when projected onto a virtual horizontal plane perpendicular to the vertical direction.

12. 2. The pressure mold apparatus according to claim 1, wherein said shaft and said sleeve are splined together.

13. A pressurizing mold apparatus according to any one of claims 1 to 12, and an upper mold table having the same number of installation areas as the pressurizing mold apparatuses, each pressurizing mold apparatus being disposed in one of the installation areas, Each of the pressure mold devices is an upper mold jig, configured so that when the sleeve engages with the installation area, the shaft is driven and can move in the vertical direction relative to the upper mold table in conjunction with the pressure mold means.

14. A crimping facility comprising an upper die jig as described in claim 13 and a lower die jig that corresponds to the upper die jig and performs crimping processing on a crimping target using each of the pressure die devices that the upper die jig has.

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