Structural improvement of industrial computer cases

Abstract

The present invention provides an improved structure for an industrial computer case that can reduce interference between a main component and an expansion component when they simultaneously perform high-speed calculations through heat dissipation, thereby allowing both components to maintain good calculation efficiency. [Solution] The structural improvement of the industrial computer case of this invention comprises an industrial computer case 1 comprising a base plate 11, a back panel 12, a front panel 13, a set of side panels 14, a partition plate 15, and a cover plate 16. The partition plate is mainly used to divide the internal space of the case into two sections, allowing the large main components and expansion components that require heat dissipation to be located separately and heat dissipation devices to be configured for each.

Description

[Technical Field]

[0001] This invention relates to an improved structure for industrial computer cases, which divides the interior of the computer case into layers and establishes heat dissipation channels. [Background technology]

[0002] Conventional industrial computer cases are mainly 1U (rack unit, RU or U, case height 4.445cm, defined by the Electronic Industries Alliance) or 2U (height 8.89cm) cases (hereinafter referred to as 1U or 2U cases). Financial institutions and the semiconductor industry are also pursuing smaller cases, and many are adopting 1U industrial computers to save space and costs. Summary of the Invention [Problem to be solved by the invention]

[0003] However, the expandability of a 1U case is not as good as that of a 2U industrial computer case, and it is very difficult to design the internal space of a 1U case. Therefore, the conventional solution is to improve the internal space of the 1U industrial computer case to increase the number of expansion cards that can be installed, but this has a very limited effect on the heat dissipation of the 1U case, which can easily affect the computer's performance.

[0004] Furthermore, with the development of technologies such as cryptocurrency mining and artificial intelligence (AI), the demand for expansion cards (e.g., graphics processing units (GPUs), network cards, network interface controllers (NICs)) has increased significantly to accommodate large amounts of data processing. Furthermore, the central processing unit (CPU), motherboard, expansion cards, and memory all need to be overclocked to perform calculations, which increases the need for heat dissipation. While 2U cases for industrial computers offer more space than 1U cases, allowing for the addition of more components and expansion cards, the construction and layout of 2U cases does not utilize the space efficiently. Furthermore, considering the high-performance computing elements, it is necessary to add or strengthen the heat dissipation system to address turbulence and resonance issues caused by the high-performance computing elements.

[0005] Further improvements to the conventional computer case have been made by dividing the case (so-called PC case) into a computing layer and a storage layer to maximize the amount of storage media within a limited space, but the expansion cards (so-called external interface cards) and the central processing unit are installed on the same layer, which has not effectively solved the heat dissipation problem.

[0006] Therefore, the present inventors believed that the above drawbacks could be improved, and after extensive research, they came up with the present invention, which effectively improves the above issues through rational design.

[0007] The present invention was developed in light of the above-mentioned problems and is the result of extensive research by the present inventors, and its purpose is to provide an improved structure for industrial computer cases, namely, by reorganizing the internal space of the industrial computer case and adjusting the positions of the main components and expansion components, it is possible to overcome the limited heat dissipation effect of conventional industrial computer cases and effectively maintain good computing efficiency. [Means for solving the problem]

[0008] In order to achieve the above object, the structural improvement of the industrial computer case according to one aspect of the present invention is that the industrial computer case has at least one expansion card and a motherboard separately arranged therein, and the industrial computer case has: The industrial computer case comprises a board, a front panel and a back panel that are disposed adjacent to the board and parallel to each other, a pair of side panels that are disposed adjacent to the board and parallel to each other, and a partition plate and a cover plate that are disposed parallel to the board, wherein the internal space of the industrial computer case is bounded by the partition plate, and a main element storage space and an expansion element storage space are formed in the internal space; a power supply and the motherboard are arranged in the main component accommodating space, the motherboard is arranged on the substrate in the main component accommodating space by combining a plurality of locking members and a plurality of fasteners, and the motherboard and the power supply are electrically connected; At least one expansion card is arranged in the expansion element storage space, and the expansion card is arranged on the partition plate of the expansion element storage space by combining each of the locking members and each of the fasteners; a first end of at least one cable is connected to the expansion slot of the motherboard, and at least one first opening is opened in the partition plate; a second end of each of the cables passes through the first opening and is locked onto the partition plate of the expansion element receiving space by combining each of the locking members and each of the fasteners, thereby forming a connection between the second end and the expansion card; At least one first heat dissipation device is configured in the main element storage space, and at least one second heat dissipation device is configured in the extended element storage space, and the first heat dissipation device and the second heat dissipation device are each electrically connected to the power supply. [Effects of the Invention]

[0009] This invention mainly uses a partition to divide the internal space of the case into two layers, upper and lower, so that the motherboard and expansion cards each have their own separate spaces and independent heat dissipation systems, preventing the heat dissipation effects of the upper and lower layers from interfering with each other and reducing interference caused by resonance.

[0010] At least the following points will become clear from the description and drawings to be described later. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a schematic diagram illustrating the structural improvement of an industrial computer case according to the present invention; [Figure 2] 1 is an exploded view showing the structural improvement of the industrial computer case according to the present invention; [Figure 3] 1 is a schematic diagram showing an embodiment of the structural improvement of an industrial computer case according to the present invention; FIG. [Figure 4] 1 is a cross-sectional perspective view showing the structural improvement of an industrial computer case according to the present invention; [Figure 5] 1 is a schematic diagram showing the interior of the improved industrial computer case according to the present invention; FIG. [Figure 6] 2 is a schematic diagram showing the interior of the improved industrial computer case according to the present invention. [Figure 7] 1 is a partial enlarged view (1) showing the structural improvement of the industrial computer case according to the present invention. [Figure 8] 2 is a partial enlarged view (II) showing the structural improvement of the industrial computer case according to the present invention. [Figure 9] FIG. 2 is a schematic diagram showing a second embodiment of the structural improvement for an industrial computer case according to the present invention. [Figure 10] 1 is a schematic diagram showing an embodiment of the structural improvement of an industrial computer case according to the present invention; FIG. [Figure 11] 1 is a schematic diagram showing the structural improvement of an industrial computer case in accordance with a preferred embodiment of the present invention; FIG. [Figure 12]2 is a schematic diagram showing the structural improvement of an industrial computer case according to a preferred embodiment of the present invention; FIG. [Figure 13] 1 is a schematic diagram (III) illustrating the structural improvement of an industrial computer case according to a preferred embodiment of the present invention. [Figure 14] 4 is a schematic diagram showing the structural improvement of an industrial computer case according to a preferred embodiment of the present invention; FIG. [Figure 15] 5 is a schematic diagram showing the structural improvement of an industrial computer case according to a preferred embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0012] The present invention will be described below with reference to the accompanying drawings, in which: FIG. 1 is a block diagram of a conventional optical fiber cable; FIG. 2 is a block diagram of a conventional optical fiber cable;

[0013] First, an example of a specific embodiment of an industrial computer case 1 according to the present invention will be described with reference to FIGS.

[0014] The industrial computer case 1 of the present invention includes a circuit board 11, a back panel 12 and a front panel 13 arranged parallel to each other on the circuit board 11, a pair of side panels 14 also arranged parallel to each other on the circuit board 11, and a partition plate 15 and a cover plate 16 arranged relative to the circuit board 11. The partition plate 15 is composed of a first partition plate 151 and a second partition plate 152 arranged relative to each other. The first partition plate 151 has at least one first opening 1513, and the second partition plate 152 has at least one fourth opening 1523. The back panel 12 has a plurality of second openings 121 and a plurality of first heat dissipation holes 122. The front panel 13 has a plurality of third openings 131 and a plurality of second heat dissipation holes 132, and the third opening 131 has a plurality of I / O ports. Preferably, there are two third openings 131 (universal serial bus, USB), and the outer surface of the side panel 14 has a plurality of sliding structures 141. The sliding structures 141 allow the device to be slidably installed in a cabinet rack, and the cover plate 16 has a plurality of third heat dissipation holes 161 on the surface adjacent to the back panel 12.

[0015] 3, the first partition plate 151 of the partition plate 15 has at least one first protrusion 1511 and at least one first connecting portion 1512 on one side thereof facing away from the back panel 12. The second partition plate 152 has at least one second protrusion 1521 and at least one second connecting portion 1522 on one side thereof facing away from the front panel 13. The first partition plate 151 and the second partition plate 152 are horizontally movable in the lateral direction, and the first protrusion 1511 and the second protrusion 1521 can be joined to the corresponding second connecting portion 1522 and the first connecting portion 1512 in the lateral direction, respectively. After the joining is completed, the partition plate 15 is further screwed to the side panel 14 to strengthen the fixation.

[0016] 4, the interior space of the industrial computer case 1 is divided into a main component storage space S1 and an expansion component storage space S2, with the partition plate 15 as the boundary. The height of the industrial computer case 1 is 2U, and the heights of the main component storage space S1 and the expansion component storage space S2 are both 1U.

[0017] As shown in Fig. 5, at least one power supply 21, a motherboard 22, at least one cable 23, and at least one first heat dissipation device (26, 26a, etc.) are arranged in the main component storage space S1. The power supply 21 is electrically connected to the motherboard 22, and the motherboard 22 is arranged on the board 11 of the main component storage space S1 by combining a plurality of locking members and a plurality of fasteners. One end of the cable 23 is connected to the motherboard 22, and the first heat dissipation device 26 is installed on the board 11. As shown in Fig. 6, the first opening 1513 of the partition plate 15 allows the cable 23 to be introduced from the main component storage space S1 into the expansion component storage space S2. At least one expansion card 25 is arranged on the first partition plate 151 of the partition plate 15, and at least one second heat dissipation device 27 is arranged on the second partition plate 152. The first heat dissipation device (26, 26a) and the second heat dissipation device 27 may each be an air-cooled heat dissipation device or a water-cooled heat dissipation device. Preferably, the first heat dissipation device 26 is an air-cooled heat dissipation device that introduces external cool air into the interior, and the other first heat dissipation device 26a may be a water-cooled heat dissipation device for cooling the CPU (central processing unit) of the motherboard 22. The second heat dissipation device 27 is an air-cooled heat dissipation device, and a fourth opening 1523 opened at a corresponding position on the second partition plate 152 diverts the airflow of the second heat dissipation device 27. Preferably, the second heat dissipation device 27 is a turbofan (commonly known as a vortex fan), and the second heat dissipation device 27 diverts the airflow from the main component housing space S1 through the fourth opening 1523 and directs it toward the expansion card 25 in the expansion component housing space S2 to dissipate heat.

[0018] 7, multiple power supplies 21 are arranged in parallel on the board 11 in the main component storage space S1, and the side adjacent to the back panel 12 has a pull ring 211 for convenient and quick attachment and detachment. Preferably, there are two power supplies 21 to provide different voltages or currents. A motherboard 22 is arranged on the board 11 and adjacent to the other side panel 14, and has multiple expansion slots 221 for connecting a first end 231 of at least one cable 23. Preferably, there are four expansion slots 221 to allow simultaneous connection of four cables (e.g., 23).

[0019] 7 and 8, the back panel 12 has a plurality of second openings 121 for installing at least one expansion card (e.g., 25, 25a) in the expansion device storage space S2. The expansion card 25 may be a graphics processing unit (GPU), and the other expansion card 25a may be a network interface controller (NIC). The expansion card 25 has a slot port end 251 and a connection port end 252. The slot port end 251 may be a high-speed I / O slot, and the connection port end 252 can be configured in the second opening 121. Preferably, four second openings 121 are provided, each consisting of two second openings 121, and the two sets are spaced apart from each other on both sides of the surface of the back panel 12 to install four one-slot expansion cards (e.g., 25, 25a). The first partition plate 151 of the partition plate 15 has at least one first opening 1513 for passing the cable 23 therethrough and connecting the second end 232 to the slot port end 251 of the expansion card 25. The multiple fasteners (24, 24a, etc.) are located close to the back panel 12 and are divided into two sets, one set of which is located on the partition plate 15 so as to be spaced apart from the motherboard 22 and close to the side panel 14, and the other set of which is located on the partition plate 15 so as to be close to the other side panel 14. Preferably, the expansion slot 221 of the motherboard 22, the first end 231 and second end 232 of the cable 23, and the slot port end 251 of the expansion card 25 all comply with the PCIe (Peripheral Component Interconnect Express) x16 standard, the length of the first opening 1513 of the first partition plate 151 of the partition plate 15 is longer than the length of the expansion slot 221 (the length of PCIe x16 is 89 mm), and the fasteners (24, 24a, etc.) may be, for example, positioning pins, such as straight type, large head type, press-fit type, female thread type, male thread type, or other different types of positioning pins, or a combination thereof.Preferably, the fasteners (24, 24a, etc.) include female-threaded straight positioning pins, and are configured so that the threads are screwed together within the height of the 1U case.

[0020] 8 and 9 , a first end 231 of a cable 23 is connected in a first direction Y to one expansion slot 221 of the motherboard 22, and a second end 232 is locked in a second direction X on a fastener (24, 24a, etc.) by a locking member 241, and a slot port end 251 of an expansion card 25 is connected in the second direction X to the second end 232 of the cable 23. The locking member 241 may be a screw, such as a machine screw, a tapping screw, a self-drilling screw, or any other type of screw. The first direction Y and the second direction X are mutually perpendicular, and the first direction Y and the second direction X are respectively horizontal or vertical. Preferably, the first direction Y is perpendicular to the motherboard 22, and the second direction X is parallel to the motherboard 22.

[0021] 10 , by installing the partition plate 15, a main component accommodating space S1 and an expansion component accommodating space S2 are formed in the industrial computer case 1, and the motherboard 22 and the expansion card 25 are respectively installed in different spaces. Cool air is introduced into the industrial computer case 1 through the second heat dissipation holes 132 by the first heat dissipation device 26, and then diverted by the second heat dissipation device 27 and introduced into the expansion component accommodating space S2, forming a first convection channel F1 in the main component accommodating space S1 and a second convection channel F2 in the expansion component accommodating space S2. The cool air passes through the first convection channel F1 and the second convection channel F2 to absorb the waste heat from the motherboard 22 and the expansion card 25, respectively, before being discharged to the outside of the industrial computer case 1 through the first convection channel F1 of the first heat dissipation holes 122 on the lower layer and the second convection channel F2 of the first heat dissipation holes 122 and the third heat dissipation hole 161 on the upper layer. It supports overclocking of the motherboard 22 and expansion card 25, prevents the convection between the two spaces (S1, S2) from interfering with each other, effectively prevents turbulence, and maintains good computing efficiency. By mounting the motherboard 22 and expansion card 25 on the circuit board 11 and the partition plate 15, respectively, it simultaneously reduces resonance and noise.

[0022] 11 and 12, in this embodiment, an air-cooled heat dissipation device is used, and the partition plate 15 is composed of a first partition plate 151 and a third partition plate 153 mutually configured, and a bottom plate 1531, an inclined plate 1532, and a top plate 1533 are sequentially formed by the third partition plate 153. The bottom plate 1531 is similar to the second partition plate (see FIG. 3) of the preceding embodiment, and is configured with the bottom plate 1531 and the first partition plate 151, and has at least one third protrusion and at least one third connection portion joined to correspond to the first connection portion 1512 and the first protrusion 1511, respectively, and similarly has at least one opening for dividing the second heat dissipation device (see FIG. 14). The inclined plate 1532 is inclined upward toward the front panel 13, and its height from the board 11 is no higher than 2U. A large-area air-cooled heat dissipation device can be installed in the space formed by the top plate 1533 and the board 11, achieving even more favorable heat dissipation effects.

[0023] As shown in FIG. 13 , the primary component housing space S1 is equipped with a first heat dissipation device 26 and a third heat dissipation device 28, both of which are air-cooled. Preferably, the first heat dissipation device 26 is a 4-cm fan, and the third heat dissipation device 28 is an 8-cm fan. As shown in FIGS. 11 and 14 , the inclined plate 1532 and top plate 1533 of the third partition plate 153 allow the third heat dissipation device 28 to be installed in a 2U space within the split-layer structure. The inclined plate 1532 also presses the airflow generated by the third heat dissipation device 28 into the first heat dissipation device 26, creating a turbine effect that compresses and accelerates the airflow. Similarly, the second heat dissipation device 27 diverts the airflow and introduces it into the extended component housing space S2, forming a first convection channel F1 in the primary component housing space S1 and a second convection channel F2 in the extended component housing space S2. The cool air is discharged to the outside of the industrial computer case 1 after absorbing the waste heat of the motherboard 22 and the expansion card 25 through the first convection channel F1 and the second convection channel F2, respectively.

[0024] 15 , in this embodiment, a plurality of data storage devices 29 can be installed between the first heat dissipation device 26 and the third heat dissipation device 28, and are installed on the board 11 by locking the corresponding fasteners 24b with the plurality of locking members 241a. The data storage devices 29 may be one of SSDs (solid state disks, solid state drives), HDDs (hard disk drives), SRAMs (static random access memories), and DRAMs (dynamic random access memories). Preferably, the plurality of data storage devices 29 are two M.2 SSDs and an HDD. The two M.2 SSDs are installed on the board 11 by one-to-one correspondence between the two locking members 241a and the two fasteners 24b, and the HDD can be installed on the base 17. In this way, when converting a server originally equipped with a water-cooled cooling device into a management information system (MIS) server, this invention can remove the water-cooled cooling device without affecting the layout of the existing components, and add multiple M.2 SSDs and HDDs in the existing space, thereby reusing the server case and saving the cost of replacing the server.In addition, by simply replacing the partition kit, an 8cm cooling fan can be installed, which, together with the original 4cm cooling fan, creates a turbine-like cooling effect and achieves the same flow-diverting effect.

[0025] As described above, the present invention mainly relies on the layout of the internal space of the industrial computer case to install partitions and separately arrange large expansion cards and motherboards for heat dissipation, thereby solving the problem of turbulence that occurs in conventional 2U industrial computer cases when dissipating heat and effectively maintaining good computing efficiency.As described above, by organizing the internal space of the industrial computer case and adjusting the positions of the main components and expansion components, the present invention can remedy the problem of limited heat dissipation in conventional industrial computer cases and effectively provide an industrial computer case that achieves the goal of effectively maintaining good computing efficiency.

[0026] Although the embodiment of the present invention has been described above in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and design modifications and the like are also included within the scope of the present invention without departing from the gist of the present invention. [Explanation of symbols]

[0027] 1 Industrial Computer Case 11 Circuit Board 12 Back Panel 121 Second Opening 122 1st heat radiation hole 13 Front Panel 14 Side Panel 131 Third Opening 141 Slide structure 132 2nd heat radiation hole 15 Divider 16 Cover Plate 151 First partition 161 3rd heat radiation hole 1511 First convex part 1512 First connection part 1513 First Opening 152 Second partition 1521 Second convex part 1522 Second connection part 1523 4th opening 153 Third partition 1531 Bottom plate 1532 Inclined plate 1533 Top plate 17 Base S1 Main element storage space S2 expansion element storage space F1 First convection channel F2 Second convection channel 21 Power Supply 22 Motherboard 211 Pull Ring 221 Expansion Slots 23 Cable 24 Fasteners 24a Fastener 24b Fastener 231 1st end 241 Locking member 241a Locking member 232 2nd end 25 Expansion Cards 25a expansion card 26 1st heat dissipation device 26a 1st heat dissipation device 251 Slot port end 252 connection port end 27 Second heat dissipation device 28 Third heat dissipation device 29 Data Storage Devices Y 1st direction X 2nd direction

Claims

1. A structural improvement of an industrial computer case, wherein at least one expansion card and a motherboard are separately arranged in the industrial computer case, and the industrial computer case comprises: The industrial computer case comprises a board, a front panel and a back panel that are disposed adjacent to the board and parallel to each other, a pair of side panels that are disposed adjacent to the board and parallel to each other, and a partition plate and a cover plate that are disposed parallel to the board, wherein the partition plate defines an internal space of the industrial computer case, and a main component storage space and an expansion component storage space are formed in the internal space; a power supply and the motherboard are arranged in the main component accommodating space, the motherboard is arranged on the substrate in the main component accommodating space by combining a plurality of locking members and a plurality of fasteners, and the motherboard and the power supply are electrically connected; the at least one expansion card is arranged in the expansion element storage space, and the expansion card is arranged on the partition plate of the expansion element storage space by combining each of the locking members and each of the fasteners; a first end of at least one cable is connected to the expansion slot of the motherboard, and the partition plate has at least one first opening; a second end of each of the cables passes through the first opening and is locked onto the partition plate of the expansion element receiving space by combining the locking members and the fasteners, thereby forming a connection between the second end and the expansion card; A structural improvement to an industrial computer case, characterized in that at least one first heat dissipation device is configured in the main component storage space, and at least one second heat dissipation device is configured in the extended component storage space, and the first heat dissipation device and the second heat dissipation device are each electrically connected to the power supply.

2. 2. A structural improvement of an industrial computer case as described in claim 1, characterized in that the partition plate is composed of a first partition plate and a second partition plate mutually constructed, and the first partition plate has at least one first protrusion and at least one first connection portion on one side away from the back panel, and the second partition plate has at least one second protrusion and at least one second connection portion on one side away from the front panel, and the first protrusion and the second protrusion are respectively joined to the corresponding second connection portion and the first connection portion so as to be able to move laterally.

3. 2. The structural improvement of the industrial computer case according to claim 1, wherein the partition plate has at least one fourth opening for diverting the second heat dissipation device.

4. 2. The structural improvement of the industrial computer case of claim 1, wherein the first end of the cable is connected to the expansion slot of the motherboard in a first direction, and the second end is locked onto the partition plate in a second direction, and the first direction and the second direction are perpendicular to each other.

5. 2. The structural improvement of the industrial computer case as claimed in claim 1, wherein the height of the main component receiving space and the extended component receiving space are each 1U.

6. 2. The structural improvement of the industrial computer case as claimed in claim 1, wherein the first heat dissipation device is an air-cooled heat dissipation device or a water-cooled heat dissipation device.

7. 2. The structural improvement of the industrial computer case as claimed in claim 1, wherein the second heat dissipation device is an air-cooled heat dissipation device or a water-cooled heat dissipation device.

8. 2. A structural improvement of an industrial computer case as described in claim 1, characterized in that the partition plate is composed of a first partition plate and a third partition plate mutually configured, the third partition plate being composed of a bottom plate, an inclined plate, and a top plate, the first partition plate having at least one first protrusion and at least one second connection portion on one side away from the back panel, the bottom plate having at least one third protrusion and at least one third connection portion on one side away from the front panel, the first protrusion and the third protrusion being laterally movably joined to the corresponding third connection portion and the corresponding first connection portion, respectively.

9. The structural improvement of the industrial computer case as described in claim 8, characterized in that the inclined plate is inclined upward toward the front panel, and a third heat dissipation device can be configured between the top plate and the board.

10. 10. The structural improvement of the industrial computer case as claimed in claim 9, wherein the first heat dissipation device and the third heat dissipation device are air-cooled heat dissipation devices.

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