Electronic component packaging

Abstract

To provide an electronic component package in which stability of a position or an orientation of an electronic component inside a recessed part of the electronic component package is improved.SOLUTION: An electronic component package includes a base tape having a plurality of recessed parts, an inner surface of the recessed part is provided with a projection part that can come into contact with the electronic component stored inside the recessed part, and the electronic component includes a rectangular parallelepiped-shaped laminate and an external electrode provided on two end faces of the laminate.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to an electronic component package for containing an electronic component. [Background technology]

[0002] Patent Document 1 discloses a carrier tape (electronic component packaging) that aims to prevent electronic components from sticking to a top tape. However, no consideration is given to the stability of the position and orientation of the electronic components inside the recesses for accommodating the electronic components in the electronic component packaging. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2021-155077 A Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide an electronic component packaging body in which the stability of the position and orientation of an electronic component inside a recess of the electronic component packaging body is improved. [Means for solving the problem]

[0005] The electronic component packaging body according to the present invention comprises: An electronic component packaging body comprising a base tape having a plurality of recesses, a protrusion that can come into contact with an electronic component accommodated inside the recess is provided on an inner surface of the recess, The electronic component includes a rectangular parallelepiped laminate and external electrodes provided on two end surfaces of the laminate. Effect of the Invention

[0006] According to the present invention, it is possible to provide an electronic component packaging body in which the stability of the position and orientation of the electronic component inside the recess of the electronic component packaging body is improved. [Brief description of the drawings]

[0007] [Figure 1] 1 is a perspective view showing a series of electronic components including an electronic component packaging body according to an embodiment of the present invention; [Diagram 2] 1 is a perspective view showing an electronic component accommodated in an electronic component packaging according to an embodiment of the present invention; [Diagram 3] 2 is a cross-sectional view of the electronic device packaging body shown in FIG. 1 along line II. [Figure 4] FIG. 4 is a plan view of a recess in an embodiment of the present invention. [Diagram 5] 2 is a cross-sectional view for explaining oblique chucking, which corresponds to the cross-sectional view taken along line II in FIG. 1. FIG. [Figure 6] FIG. 2 is a cross-sectional view for explaining a suction error, which corresponds to the cross-sectional view taken along line II in FIG. [Figure 7] 2 is a cross-sectional view for explaining the causes of oblique suction and suction errors, which corresponds to the cross-sectional view taken along line II in FIG. 1 . FIG. [Figure 8] FIG. 2 is a cross-sectional view for explaining a diagonal lock, which corresponds to the cross-sectional view taken along line II in FIG. [Figure 9] FIG. 2 is a cross-sectional view for explaining the cause of diagonal lock, which corresponds to the cross-sectional view taken along line II in FIG. [Figure 10] FIG. 13 is a plan view of a recess in another embodiment of the present invention. [Figure 11] 13A to 13C are diagrams illustrating examples of lengths of each part in another embodiment of the present invention. [Figure 12] 1. FIG. 4 is a cross-sectional view showing a recess in another embodiment of the present invention, which corresponds to the cross-sectional view taken along line II-II in FIG. [Figure 13] 13A to 13C are diagrams illustrating examples of lengths of each part in another embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] <First embodiment> Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Note that the same or corresponding parts in each drawing are denoted by the same reference numerals. The electronic component packaging body 20 of this embodiment is a member that constitutes a part of the series of electronic components 10. First, the series of electronic components 10 will be described.

[0009] <Electronic Components Association> As shown in Fig. 1, the electronic component series 10 includes an electronic component packaging body 20 and an electronic component 40 accommodated in the electronic component packaging body 20. The electronic component series 10 has an elongated shape. Fig. 1 shows an XYZ orthogonal coordinate system. The electronic component packaging body 20 is transported in the X direction.

[0010] <Electronic component packaging> The electronic component packaging body 20 includes a base tape 22 and a cover tape 28 .

[0011] <Base tape> The base tape 22 has recesses 50 and feed holes 24. Electronic components 40 are accommodated in the recesses 50. The feed holes 24 are used when the electronic component packages 20 are automatically transported by an automatic component feeder.

[0012] <Concave> The recesses 50 are arranged in a row at predetermined intervals along the longitudinal direction of the electronic component packaging 20, i.e., along the transport direction of the electronic component packaging 20. The longitudinal direction of the electronic component packaging 20 is indicated as direction X in FIG. The recesses 50 are disposed offset to one side in the short-side direction of the base tape 22. The short-side direction of the electronic component packaging body 20 is indicated as direction Y in FIG. A substantially rectangular parallelepiped space is formed inside the recess 50. The recess 50 will be described in detail later.

[0013] <Feed holes> The feed holes 24 are holes that engage with teeth for automatic transport of an automatic component feeder. The electronic component train 10 is transported by the engagement of the feed holes 24 with the teeth.

[0014] <Base tape materials> The base tape 22 is made of paper or resin. When the base tape 22 is made of resin, the resin is preferably one of polystyrene, polyethylene terephthalate, polycarbonate, and polypropylene. By using such a material, it becomes easier to mold the recess 50. In addition, it becomes possible to carry out the work in a clean room.

[0015] <Cover tape> The cover tape 28 is attached to the surface of the base tape 22 so as to cover the recessed portion 50. The cover tape 28 is attached to the base tape 22 via a sealing material provided in the sealing portion 30. The cover tape 28 is also positioned so as not to block the feed holes 24, which will be described later.

[0016] <Cover tape materials> The cover tape 28 is made of, for example, polyethylene terephthalate. The cover tape 28 may be made of the same material as the base tape 22. The cover tape 28 is preferably made of a material with low electrical resistance, which can prevent the cover tape 28 from becoming charged.

[0017] <Electronic Components 40> The electronic components 40 contained in the electronic component packaging 20 are, for example, resistors, capacitors, inductors, switches, connectors, coils, etc. As an example of the electronic components 40, a multilayer ceramic capacitor 401 will be described. Note that, although multilayer ceramic capacitor 401 will be described below as an example of electronic component 40, electronic component 40 is not limited to multilayer ceramic capacitor 401.

[0018] <Multilayer ceramic capacitors> As shown in FIG. 2, multilayer ceramic capacitor 401 includes a laminate having a rectangular parallelepiped outer shape, and external electrodes 44 provided mainly on two opposing surfaces of laminate .

[0019] <Definition of laminate plane and direction> Here, the two faces of the laminate 42 on whose entire surfaces the external electrodes 44 are provided are defined as end faces LS. Moreover, of the four faces perpendicular to the end faces LS, two opposing faces are defined as side faces WS and main faces TS, respectively. The direction in which the two end faces LS face each other is defined as the length L direction, the direction in which the two side faces WS face each other is defined as the width W direction, and the direction in which the two main faces TS face each other is defined as the stacking direction T.

[0020] <End face external electrodes and folded external electrodes> The external electrode 44 includes an end face external electrode 441 and a folded external electrode 442 . The end surface external electrode 441 refers to a portion of the external electrode 44 that is provided on the end surface LS. The end surface external electrode 441 is provided on the entire surface of the end surface LS. The external electrode 44 is also provided on a part of the side surface WS and a part of the main surface TS. The folded external electrode 442 refers to the part of the external electrode 44 that is provided on the side surface WS or the main surface TS. The external electrode 44 provided on the side surface WS or the main surface TS extends from the end surface external electrode 441. The folded external electrode 442 is provided not on the entire surfaces of the side surface WS and the main surface TS but on parts thereof.

[0021] <Size of multilayer ceramic capacitor> Regarding the external shape of the multilayer ceramic capacitor 401 including the external electrodes 44, the length in the length direction L is defined as T1, and the length in the width direction W is defined as T2. The multilayer ceramic capacitor 401 has a thickness T1 of, for example, 0.25 mm or more and 3.20 mm or less, and a thickness T2 of, for example, 0.125 mm or more and 2.50 mm or less. Moreover, the length of the multilayer ceramic capacitor 401 in the lamination direction T is, for example, not less than 0.125 mm and not more than 2.50 mm.

[0022] <Dimensions of folded external electrode> The length of the folded external electrode 442 in the longitudinal direction L is denoted by T3, and the thickness of the folded external electrode 442 is denoted by T4. Furthermore, the length in the longitudinal direction L of a portion of the side surface WS or the main surface TS of the laminate 42 where the folded external electrode 442 is not provided is denoted by T5. The length T3 and the length T4 can be appropriately set depending on the type of the multilayer ceramic capacitor 401. For example, the length T3 indicating the width of the folded external electrode 442 can be set to 0.20 mm or more and 0.90 mm or less, and the length T4 indicating the thickness of the folded external electrode 442 can be set to 0.010 mm or more and 0.048 mm or less. <Features of the Electronic Part Packaging Body of the Present Embodiment>

[0023] In electronic component packaging 20 of the present embodiment, protrusions 70 are provided in recesses 50. First, recesses 50 will be described.

[0024] <Definition of the shape and direction of the recess> As shown in FIG. 1, the recess 50 has a substantially rectangular parallelepiped shape. 1 shows an XYZ orthogonal coordinate system. The direction indicated by the coordinate axis X is the short side direction X of the recess 50, the direction indicated by the coordinate axis Y is the long side direction Y of the recess 50, and the direction indicated by the coordinate axis Z is the depth direction Z of the recess 50.

[0025] <Opening of recess> The recess 50 has an opening 52 on one surface in the depth direction Z. The opening 52 is substantially rectangular in a plan view. Here, the plan view means that the opening 52 is viewed from the depth direction Z. The appearance of the opening 52 in a plan view corresponds to a plan view of the opening 52.

[0026] <Concave surface> As shown in FIG. 1, recess 50 includes five interior surfaces. 3 and 4, the inner surface includes four side walls 54 and a bottom surface 56. The bottom surface 56 is a surface facing the opening 52. The side walls 54 are surfaces extending from the bottom surface 56 to the opening 52.

[0027] <Outline of protrusions> 3 and 4, the recess 50 is provided with two protrusions 70. The protrusions 70 refer to portions that protrude from the inner surface of the recess 50 toward the inside of the recess 50.

[0028] <Side wall protrusions and bottom protrusions> The protrusion 70 includes a side wall protrusion 71 and a bottom surface protrusion 72 . The side wall protrusion 71 refers to the protrusion 70 provided on the side wall 54 of the inner surface of the recess 50. On the other hand, the bottom surface protrusion 72 refers to the protrusion 70 provided on the bottom surface 56 of the inner surface of the recess 50.

[0029] <Side wall protrusion> In this embodiment, as the protrusion 70, a side wall protrusion 71 is provided in the recess 50. The side wall protrusion 71 will be described below. <Arrangement of recesses in the longitudinal direction> 4, the side wall protrusion 71 is provided on a side wall 54 extending in the longitudinal direction Y of the recess 50. The side wall protrusion 71 is provided on each of the two opposing side walls 54. Each side wall protrusion 71 is provided in a central portion of the side wall 54 in the longitudinal direction Y. Therefore, the two side wall protrusions 71 face each other in the short side direction X of the recess 50. Furthermore, side wall protrusion 71 has a generally triangular pyramid shape, with the base of the pyramid located on the opening 52 side and the apex of the pyramid located on the bottom surface 56 side.

[0030] <Arrangement of recesses in the depth direction> 3, the side wall protrusion 71 is provided on the side wall 54 on the opening 52 side. That is, the side wall protrusion 71 extends from the opening 52 in the direction of the bottom surface 56. Moreover, the length of the side wall protrusion 71 in the short direction X becomes shorter from the opening 52 toward the bottom surface 56. This is because the triangular pyramid shape of the side wall protrusion 71 has an apex on the side of the bottom surface 56. The length of the side wall protrusion 71 in the short direction X indicates the height of the side wall protrusion 71.

[0031] <Details of protrusions> The side wall protrusion 71 will be described in more detail below. <Position definition> 4, when the side wall protrusion 71 is viewed in plan, the outermost position of the recess 50 in the short direction X is defined as an outer end 712. On the other hand, when the side wall protrusion 71 is viewed in plan, the innermost position of the recess 50 in the short direction X is defined as an inner end 714. 3, when the sidewall protrusion portion 71 is viewed in cross section from the Y direction, the position closest to the bottom surface 56 in the depth direction Z is defined as a bottom end portion 716.

[0032] <Depth of protrusion> First, the length of the side wall protrusion 71 in the depth direction Z will be described with reference to FIG. As shown in FIG. 3, the length in the depth direction Z from the opening 52 to the bottom surface 56 is designated as D1, the length in the depth direction Z from the opening 52 to the bottom end 716 of the recess 50 is designated as D2, and the length in the depth direction Z from the bottom end 716 of the recess 50 to the bottom surface 56 is designated as D3. D2 is longer than D3 in the sidewall protrusion 71. That is, the sidewall protrusion 71 extends from the opening 52 toward the bottom surface 56 by more than half the depth D1 of the recess 50. The relationship between D2 and D3, which indicate the length of the sidewall protrusion 71 in the depth direction Z, is preferably D2>D3, and can be, for example, D2:D3=6:4.

[0033] <Length of the protrusion in the short direction> Next, the length of the side wall protrusion 71 in the short side direction will be described with reference to FIG. 4, the length of the opening 52 in the short-side direction X is defined as W1, and the length of the side wall protrusion 71 in the short-side direction X from the outer end 712 to the inner end 714 is defined as W2. Furthermore, for the two opposing side wall protrusions 71, the length in the short-side direction X between the two inner ends 714 is defined as W3, and the length of the bottom surface 56 in the short-side direction X is defined as W4. In the side wall protrusion 71, the length W2 indicating the height of the side wall protrusion 71 is preferably 0.01 mm or more and 1.00 mm or less. Moreover, the ratio of W1 to W3, which indicates the degree to which the width of the opening 52 is narrowed by the protrusion 70, is preferably in the range of 1:0.80 to 1:0.95.

[0034] <Relationship with folded external electrode> The length W2 can be set to be approximately the same as the thickness T4 of the folded outer electrode 442 of the multilayer ceramic capacitor 401 or greater. Specifically, the length W2, which indicates the height of the side wall protrusion portion 71, can be made greater than at least one of the thickness T4 of the folded external electrode 442 on the main surface TS and the thickness T4 of the folded external electrode 442 on the side surface WS. As a result, in the multilayer ceramic capacitor 401 having the folded external electrode 442, the positional deviation of the multilayer ceramic capacitor 401 inside the recess 50 and the tilt of the multilayer ceramic capacitor 401 can be effectively prevented.

[0035] <Length of protrusion in the longitudinal direction> Next, the length of the side wall protrusion 71 in the longitudinal direction Y will be described with reference to FIG. First, the length of the opening 52 in the longitudinal direction Y is defined as L1, and the length of the side wall protrusion 71 in the longitudinal direction Y is defined as L2. For example, the length of L2 is preferably 0.4 mm or more and 1.0 mm or less. Moreover, the ratio of L1 to L2, which indicates the degree of the size of the protrusion 70 relative to the length of the opening 52, is preferably in the range of 1:0.01 to 1:0.20, for example. <Method of forming protrusions>

[0036] The protrusions 70, including the bottom surface protrusions 72 described later, can be provided by the mold used when forming the recess 50, or the like. For example, when the base tape 22 is made of paper, a shape corresponding to the protrusions 70 is formed in a compression mold used to form the recesses 50. Then, the compression mold is pressed into the base tape 22, whereby the recesses 50 with the protrusions 70 can be formed. As described above, when the base tape 22 is formed from paper, the side wall protrusions 71 and the bottom surface protrusions 72 can be realized by a compression mold having a predetermined shape.

[0037] Furthermore, when the base tape 22 is made of resin, a shape corresponding to the protrusions 70 is formed in a mold used for resin molding. Then, the base tape 22 is molded based on the mold for resin molding, whereby the base tape 22 including the recesses 50 with the protrusions 70 can be formed. As described above, when the base tape 22 is formed from resin, the side wall protrusions 71 and the bottom surface protrusions 72 can be realized by a molding die having a predetermined shape.

[0038] <Effects> With the above-described configuration, the electronic component packaging body 20 of the present embodiment can improve the stability of the position and orientation of the electronic component 40 inside the recess 50 of the electronic component packaging body 20. This is because the electronic component 40 is less likely to change position or orientation due to contact with the side wall protrusions 71 inside the recess 50. This makes it possible to suppress the occurrence of problems when the electronic component 40 is sucked by the nozzle 90 and removed from inside the recess 50. Representative problems will be described below.

[0039] <Diagonal pickup> First, the oblique pickup will be described with reference to FIG. The removal of electronic component 40 from recess 50 by suction proceeds in the order of state (A), state (B), and state (C), that is, the sub-diagrams (A), (B), and (C) in FIG. In the state (A), the electronic component 40 is housed in the recess 50 . In state (B), the cover tape 28 is peeled off in the direction of arrow B. Then, the nozzle 90 advances in the direction of arrow D to pick up the electronic component 40. During pick-up, for example, if the position of the electronic component 40 inside the recess 50 is misaligned, the electronic component 40 may be picked up in a rotated state, as shown by arrow R. Then, as shown in state (C), while electronic component 40 is being picked up in a rotated state, the nozzle moves in the direction of arrow U. This is oblique pick-up.

[0040] <Adsorption error> Next, a pickup error will be described with reference to FIG. The removal of electronic component 40 from recess 50 by suction proceeds in the order of state (A), state (B), state (C), and state (D), that is, the sub-diagrams (A), (B), (C), and (D) in FIG. State (A) to state (C) are the same as the oblique chucking shown in FIG. When the electronic component 40 is obliquely picked up as in state (C), for example, if the rotation angle of the electronic component 40 is large, the electronic component 40 may fall off the nozzle 90. State (D) shows a state in which the electronic component 40 falls from the nozzle 90 in the direction of the arrow D. This is a suction error.

[0041] <Causes of oblique pickup and pickup errors> Next, the causes of this oblique pickup and pickup errors will be described with reference to FIG. For example, when the series of electronic components 10 is transported by an automatic component feeder, the electronic components 40 may become displaced or tilted inside the recess 50 due to vibrations. If the nozzle 90 attempts to pick up the electronic component 40 when the electronic component 40 is misaligned or tilted, the above-mentioned oblique pick-up or pick-up error is likely to occur.

[0042] In particular, as shown in FIG. 7, when the inside of the recess 50 is configured to widen in a tapered shape from the bottom surface 56 to the opening 52, oblique chucking and chucking errors are likely to occur. 7, the sidewall 54 extends from the bottom surface 56 to the opening 52 while expanding in the direction of the arrow a. Therefore, the width W1 of the opening 52 is wider than the width W4 of the bottom surface 56. If the inside of the recess 50 is shaped to expand toward the opening 52, the electronic component 40 may easily become misaligned or tilted inside the recess 50. As a result, oblique pick-up and pick-up errors are more likely to occur.

[0043] <Adsorption error due to diagonal lock> Next, a pickup error due to diagonal locking will be described with reference to Fig. 8. A pickup error due to diagonal locking is another problem that occurs when the nozzle 90 picks up the electronic component 40. The removal of electronic component 40 from recess 50 by suction proceeds in the order of state (A), state (B), and state (C), that is, the sub-diagrams (A), (B), and (C) in FIG. In the state (A), the electronic component 40 is accommodated in the recess 50. However, the electronic component 40 is accommodated in the recess 50 in an inclined state. In state (B), the cover tape 28 is peeled off in the direction of arrow B, and the nozzle 90 advances in the direction of arrow D to pick up the electronic component 40 by suction. Then, as shown in state (C), the nozzle moves in the direction of the arrow U without picking up the electronic component 40. This is a pickup error due to diagonal lock. In state (A), since the electronic component 40 was rotating inside the recess 50, the electronic component 40 was stuck between two opposing side walls 54 of the recess 50. Therefore, the suction force of the nozzle 90 was not sufficient to pick up the electronic component 40, resulting in a suction error due to diagonal lock.

[0044] Cases where diagonal lock is likely to occur will be described with reference to FIG. 9, the diagonal length of electronic component 40 is indicated by arrow b, and the width in short direction X of recess 50 at the middle part in depth direction Z is indicated by arrow c. When the length of the arrow b and the length of the arrow c are close to each other, the electronic component 40 is likely to become stuck in the recess 50. As a result, the above-mentioned diagonal lock is likely to occur.

[0045] <Recess of this embodiment> In the recess 50 of the present embodiment, the above-mentioned problems are unlikely to occur. First, oblique pick-up and pick-up errors will be described. In the recess 50 of the present embodiment, a side wall protrusion 71 is provided near the opening 52. Therefore, even if the inside of the recess 50 has a tapered shape as shown in Fig. 7, the electronic component 40 is unlikely to shift position or tilt inside the recess 50. As a result, oblique suction or suction errors are unlikely to occur.

[0046] Diagonal locking is also unlikely to occur. As described with reference to Fig. 9, diagonal locking is likely to occur when the diagonal length b of electronic component 40 and the width c in the short direction X at the middle part in the depth direction Z of recess 50 are close to each other. In order to avoid this, it is conceivable to widen the width c. However, if the width c is increased, the electronic component 40 is likely to become misaligned or tilted inside the recess 50. For this reason, it is difficult to increase the width c. In this regard, in the recess 50 of the present embodiment, a side wall protrusion 71 is provided in the vicinity of the opening 52. Therefore, even if the width c is increased, it is possible to suppress displacement of the electronic component 40 and tilt of the electronic component 40 inside the recess 50. Therefore, by widening the width c, it is possible to suppress the occurrence of diagonal lock while suppressing the occurrence of oblique pickup and pickup errors.

[0047] <Second embodiment> Next, a second embodiment of the electronic component packaging body 20 will be described with reference to Fig. 10. In the following description, differences from the first embodiment will be mainly described. 10, in this embodiment, unlike the first embodiment, two recesses 50 are provided on each of the opposing side walls 54, totaling four recesses 50. Also, the shape of the side wall protrusion 71 is substantially rectangular in plan view.

[0048] <Arrangement of recesses in the longitudinal direction> As shown in FIG. 10, the side wall protrusions 71 are provided on each side wall 54 in the longitudinal direction Y, two of which are provided on each side wall 54, for a total of four. Here, when one sidewall protrusion 71 is focused on, of the two outlines in the short direction X of the bottom surface 56, the outline closer to the sidewall protrusion 71 is set as the reference outline. For example, attention is focused on the side wall protrusion 71A in Fig. 10. The reference outline in this case is shown as the reference outline 56A. Moreover, of the outer ends 712 of the side wall protrusion 711 under consideration, the outer end 712 closest to the reference outer shape line 56A is set as the reference outer end 712A. The length between the reference outer end 712A and the reference outline 56A in the longitudinal direction Y is defined as L3. L3 indicates the length from the end of the bottom surface 56 to the side wall protrusion 71.

[0049] In this embodiment, L2 is equal to L3. That is, the length of the side wall protrusion 71 in the longitudinal direction Y and the length from the end of the bottom surface 56 to the side wall protrusion 71 are equal. Further, two side wall protrusions 71 having a similar positional relationship are provided on each of the two side walls 54 extending in the longitudinal direction Y, that is, four in total. The ratio of L2 to L3 is not limited to 1:1, but may be in the range of 1:1.5 to 1.5:1, for example.

[0050] <Relationship with folded external electrode> Moreover, the values ​​of L 2 and L 3 can be set to be approximately equal to the length T 3 of the folded outer electrode 442 in the longitudinal direction L of the multilayer ceramic capacitor 401 . As a result, for the multilayer ceramic capacitor 401 having the folded external electrode 442, it is possible to effectively prevent the multilayer ceramic capacitor 401 from being displaced or tilted inside the recess 50.

[0051] <Effects> In electronic component packaging body 20 of the second embodiment, for multilayer ceramic capacitor 401, particularly for multilayer ceramic capacitor 401 having external electrodes 44 extending to side surfaces WS and main surface TS on both opposing end faces LS, the stability of the position and orientation of multilayer ceramic capacitor 401 inside recess 50 can be further improved.

[0052] <Three-dimensional structure of side wall protrusion> In the first embodiment, the side wall protrusion 71 has a substantially triangular pyramid shape. In contrast, in the present embodiment, the side wall protrusion 71 has a substantially triangular prism shape. 10, the side wall protrusion 71 has a rectangular shape in a plan view. That is, in the same plane as the opening 52, the side wall protrusion 71 has a rectangular shape. The width W2 of the sidewall protrusion 71 becomes smaller from the opening 52 toward the bottom end 716 of the sidewall protrusion 71. At the bottom end 716, the width W2 becomes zero. As described above, the side wall protrusion 71 has a rectangular shape when viewed in cross section from the depth direction Z, and a triangular shape when viewed in cross section from the longitudinal direction Y, and has a three-dimensional structure like a triangular prism.

[0053] In this embodiment, the three-dimensional structure of the side wall protrusion 71 is a triangular prism, which can further improve the stability of the position and orientation of the multilayer ceramic capacitor 401 inside the recess 50. The three-dimensional structure of the side wall protrusion 71 is not limited to a triangular pyramid or a triangular prism, and various other three-dimensional structures are possible.

[0054] <Example> FIG. 11 shows a preferred relationship between the outer lengths T1 and T2 of the multilayer ceramic capacitor 401 accommodated in the recess 50 and the lengths D2 and W2 of each portion of the side wall protrusion 71.

[0055] <Third embodiment> Next, a third embodiment of the electronic component packaging body 20 will be described with reference to Fig. 12. In the following description, differences from the above-described embodiments will be mainly described. The third embodiment differs from the first embodiment in that the protrusions 70 are provided on the bottom surface 56 instead of the side walls 54.

[0056] <Bottom protrusion> 12, in this embodiment, a protrusion 70 is provided on the bottom surface 56. This protrusion 70 provided on the bottom surface 56 is referred to as a bottom surface protrusion 72. In the bottom surface protrusion 72, at least a portion of the bottom surface 56 is raised in the direction of the opening 52. The bottom protrusion 72 has a substantially rectangular shape in a cross-sectional view from the short side direction X. The surface of the bottom protrusion 72 facing the opening 52 is defined as a bottom protrusion top surface 721. The bottom protrusion top surface 721 is substantially parallel to the bottom surface 56.

[0057] <Arrangement of bottom protrusions> 12, the bottom surface protrusion 72 is provided in the center portion of the bottom surface 56 in the longitudinal direction Y. Moreover, the bottom surface protrusion 72 is not provided over the entire range of the bottom surface 56 in the longitudinal direction Y. Therefore, the recess 50 has a bottom surface 56 on which the bottom surface protrusion 72 is not provided. The bottom surface 56 on which the bottom surface protrusion 72 is not provided exists on both sides of the bottom surface protrusion 72 in the longitudinal direction Y, that is, between both ends of the bottom surface protrusion 72 and the bottom surface 56.

[0058] Here, the length in the longitudinal direction Y of the bottom surface 56 of the recess 50 is defined as L6. The length in the longitudinal direction Y of the bottom surface protrusion 72 is defined as L4. The length in the longitudinal direction Y of the portion of the bottom surface 56 where the bottom surface protrusion 72 is not provided is defined as L5. Also, the length in the depth direction Z from bottom surface 56 to bottom protrusion top surface 721 is designated as D4.

[0059] <Length of bottom protrusion> The length L5 of the bottom projection 72 can be, for example, not less than 0.50 mm and not more than 3.00 mm.

[0060] <Relationship with folded external electrode> Moreover, the length L5 can be set to be approximately equal to or smaller than the length T5 of the multilayer ceramic capacitor 401 accommodated in the recess 50. As described above, the length T5 is the length in the longitudinal direction L of the portion of the laminate 42 where the folded external electrode 442 is not provided. By making length L5 approximately the same as or smaller than length T5, it is possible to make it difficult for positional deviation or tilt of multilayer ceramic capacitor 401 to occur inside recess 50. This is because bottom surface protrusion top surface 721 abuts against a portion of laminate 42 where folded external electrode 442 is not provided, thereby improving the stability of multilayer ceramic capacitor 401.

[0061] Furthermore, the ratio of length L6 to length L5, which indicates the proportion of the length of the bottom surface 56 over which the bottom surface protrusion 72 is provided, can be, for example, 1:0.4 to 1:0.7. Also, the ratio of lengths L5 and L4 may be, for example, between 1:0.5 and 1:0.8.

[0062] <Height of bottom protrusion> The length D4 indicating the height of the bottom projection 72 can be set to, for example, 0.01 mm or more and 0.10 mm or less.

[0063] <Relationship with folded external electrode> This length D4 can be approximately equal to or greater than the length T4 of the multilayer ceramic capacitor 401 accommodated in the recess 50. As described above, the length T4 is a length equivalent to the thickness of the folded external electrode 442 provided on the multilayer body 42. Specifically, the length D4, which indicates the height of the bottom protrusion 72, can be made greater than at least one of the thickness T4 of the folded external electrode 442 on the main surface TS and the thickness T4 of the folded external electrode 442 on the side surface WS. By making the length D4 approximately the same as or greater than the length T4, it is possible to make it difficult for the multilayer ceramic capacitor 401 to become displaced or tilted inside the recess 50. Setting the length D4 as described above makes it easy to bring both the bottom surface 56 and the bottom protrusion top surface 721 into contact with the multilayer ceramic capacitor 401. Specifically, it makes it easy to bring the bottom surface 56 into contact with the folded external electrode 442 and the bottom protrusion top surface 721 into contact with a portion of the laminate 42 where the folded external electrode 442 is not provided. This improves the stability of the multilayer ceramic capacitor 401.

[0064] <Example> FIG. 13 shows a preferred relationship between the outer lengths T1 and T2 of the multilayer ceramic capacitor 401 accommodated in the recess 50 and the lengths L5 and D4 of each portion of the bottom protrusion 72.

[0065] <Protrusions and bottom protrusions> The recess 50 may be provided with both the side wall protrusion 71 and the bottom surface protrusion 72. Alternatively, only one of them may be provided. For example, an electronic device package in which recess 50 is provided with only bottom surface protrusion 72 can be expressed as follows. That is, the electronic device packaging body is An electronic component packaging body comprising a base tape having a plurality of recesses, The recess has an opening and a bottom surface parallel to the opening, a bottom surface protrusion protruding from the bottom surface toward the opening portion; The electronic component includes a laminate having a rectangular parallelepiped shape and external electrodes provided on two end faces of the laminate.

[0066] It should be noted that the embodiments of the present invention are not limited to the above-mentioned contents. In other words, various modifications can be made to the above-described embodiments in terms of mechanism, shape, material, quantity, position, arrangement, etc., without departing from the scope of the technical idea and purpose of the present invention, and such modifications are included in the present invention. For example, the side wall protrusion 71 may be provided on the side wall 54 in the short direction X of the recess 50. Also, the side wall protrusion 71 may be provided on both the side wall 54 in the longitudinal direction Y of the recess and the side wall 54 in the short direction X. Also, the side wall protrusion 71 does not have to be provided at opposing positions on two opposing side walls 54. Also, the numbers of side wall protrusions 71 provided on two opposing side walls 54 do not have to be the same.

[0067] The electronic component packaging body of the present invention comprises: An electronic component packaging body comprising a base tape having a plurality of recesses, a protrusion that can come into contact with an electronic component accommodated inside the recess is provided on an inner surface of the recess, The electronic component includes a laminate having a rectangular parallelepiped shape and external electrodes provided on two end faces of the laminate.

[0068] According to the above-mentioned configuration, the inner surface of the recess is provided with the protrusion that can come into contact with the electronic component, thereby making it possible to provide an electronic component packaging body with improved stability in the position and orientation of the electronic component inside the recess.

[0069] The electronic component packaging body of the present invention comprises: The inner surface includes a sidewall and a bottom surface; The protrusion may be provided on the side wall.

[0070] According to the above configuration, the protrusion is provided on the side wall, so that, for example, even if the recess has a shape that widens toward the opening, it is possible to improve the stability of the position and orientation of the electronic component inside the recess.

[0071] The electronic component packaging body of the present invention comprises: The recess includes an opening. The protrusion provided on the side wall may extend from the opening in the side wall.

[0072] According to the above configuration, the protrusion extends from the opening, so that it is possible to prevent the electronic component from floating up towards the opening inside the recess.

[0073] The electronic component packaging body of the present invention comprises: The protrusion may be provided on at least one of the side wall and the bottom surface.

[0074] According to the above configuration, for example, when the protrusion is provided on the bottom surface, the shape of the bottom surface can be adapted to the shape of the electronic component to be housed, thereby further improving the stability of the position and orientation of the electronic component.

[0075] The electronic component packaging body of the present invention comprises: The recess includes an opening. The protrusion provided on the bottom surface may have a surface parallel to the opening.

[0076] According to the above-mentioned configuration, the protrusion on the bottom surface has a surface parallel to the opening, which makes it possible to further improve the stability of the position and orientation of an electronic component having a step on its surface.

[0077] The electronic component packaging body of the present invention comprises: The laminate has two main surfaces that are perpendicular to the end faces and opposed to each other, and two side surfaces that are perpendicular to the end faces and opposed to each other, The external electrode extends from the end surface to at least a part of the main surface, Extending from the end surface to at least a portion of the side surface, The height of the protrusion may be greater than at least one of the thickness of the external electrode on the main surface and the thickness of the external electrode on the side surface.

[0078] According to the above configuration, the height of the protrusion is greater than the thickness of the external electrode on the main surface, etc. Therefore, it is possible to further improve the stability of the position and orientation of an electronic component in which external electrodes are formed on surfaces other than the end faces.

[0079] The electronic component packaging body of the present invention comprises: The tape may be made of a resin.

[0080] According to the above-mentioned configuration, the tape is made of resin, which makes it easy to use the electronic device package in a clean room. [Explanation of symbols]

[0081] 10 Electronic Components 20 Electronic component packaging 22 Base Tape 24 Sprocket holes 28 Cover Tape 30 Seal part 40 Electronic Components 401 Multilayer ceramic capacitor 42 Laminate 44 External electrode 441 Edge external electrode 442 Folded outer electrode 50 Recess 52 Opening 54 Side wall 56 Bottom 56A Standard outline 70 Protrusion 71 Side wall protrusion 712 Outer edge 714 Inner end 716 Bottom end 72 Bottom protrusion 721 Bottom protrusion top surface 90 Nozzles LS end face WS side TS Main surface L Length direction T Stacking direction W Width direction X Short direction Y Longitudinal direction Z depth direction D1: The length of the recess in the Z direction D2: Length of the protrusion in the depth direction Z D3 Length from the bottom end of the protrusion to the bottom D4 Length of the bottom protrusion in the depth direction Z L1 Length of the opening in the longitudinal direction Y L2 Length of the protrusion in the longitudinal direction Y L3 Length from the bottom edge to the protrusion L4 Length of the bottom protrusion in the longitudinal direction Y W1 Length of the opening in the short direction X W2 Length of the protrusion in the short direction X W3 Length between inner ends of protrusions W4 Short side length of the bottom surface T1 Length of the multilayer ceramic capacitor in the longitudinal direction T2 Width of the multilayer ceramic capacitor T3 Length of folded outer electrode in the longitudinal direction L T4 Thickness of folded outer electrode T5: The length in the longitudinal direction L of the portion of the laminate where no external electrodes are provided

Claims

1. An electronic component packaging body comprising a base tape having a plurality of recesses, A protrusion is provided on the inner surface of the recess, the protrusion being capable of coming into contact with an electronic component accommodated inside the recess. It has been The electronic component includes a rectangular parallelepiped laminate and external electrodes provided on two end faces of the laminate. Equipped with the ultimate At least a part of the protrusions and the electronic components are disposed apart from each other, The inner surface includes a sidewall and a bottom surface; The recess includes an opening. The inside shape of the recess is tapered from the bottom surface to the opening, The protrusions are provided on the side walls and the bottom surface, The protrusion provided on the side wall extends on a portion of the side wall from the opening to the bottom surface. Electronic component packaging.

2. The recess includes an opening. The protrusion provided on the bottom surface has a surface parallel to the opening. The electronic component packaging body according to claim 1 .

3. The laminate has two main surfaces that are perpendicular to the end surface and opposed to each other, and a surface perpendicular to the end surface, and two opposing side surfaces, The external electrode extends from the end surface to at least a part of the main surface, Extending from the end surface to at least a portion of the side surface, The height of the protrusion is determined by the thickness of the external electrode on the main surface and the thickness of the external electrode on the side surface. the thickness of the electrode; The electronic component packaging body according to claim 1 or 2.

4. The base tape is formed of a resin. The electronic component packaging body according to claim 1 .

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