Laser Processing Equipment

Abstract

To provide a laser machining device capable of suppressing adhesion of impurities.SOLUTION: A laser machining device 101 includes a laser emission unit 11, and a laser head 12. The laser emission unit 11 includes: a laser oscillator 23 generating fundamental waves; and a wavelength conversion part 24 generating harmonic waves having a higher frequency than that of the fundamental waves. The laser head 12 includes a beam expander 32, a focus adjustment part 33 and a scan part 34 as an optical member for irradiating a machining target W with laser beam LW. The laser head 12 includes a to-be-attached member 31a as an optical member not participating in transmission of the laser beam LW. The to-be-attached member 31a is disposed at a place having high-intensity laser beam LW.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a laser processing apparatus. [Background technology]

[0002] The laser processing device irradiates a laser beam onto an object to be processed, Processing object The laser processing device performs marking processing of characters or the like on the surface of an object (for example, see Patent Document 1). This laser processing device includes a laser light source that emits laser light, and optical components such as a galvanometer mirror that changes the direction of the laser light emitted from the laser light source based on the desired characters or the like to be marked and scans the object.

[0003] However, when impurities floating in the air, such as dust, adhere to optical components, the output of the laser light irradiated to the workpiece decreases, and the desired processing state may not be obtained. For this reason, it is required to suppress the adhesion of impurities to optical components. One method for suppressing the adhesion of impurities is to hermetically seal the case that houses the optical components (for example, see Patent Document 2). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2007-61843 A [Patent Document 2] JP 2006-54366 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, this method requires a sealing structure such as a hermetic seal, and while it is effective for small optical components such as semiconductor light-emitting elements (e.g., laser diodes), it is technically difficult to apply this method to large laser processing equipment. In addition, the airtight sealing method causes the problem of condensation due to moisture. In order to prevent condensation, it is necessary to place a desiccant in the housing chamber in which the optical components are placed and to replace the desiccant, which is time-consuming. [Means for solving the problem]

[0006] A laser processing apparatus according to one aspect of the present disclosure includes a laser light source that emits laser light for processing an object to be processed, a scanning unit that scans the laser light over the object to be processed, a control unit that controls the laser light source and the scanning unit, a dust collection unit having a member to be adhered that is transparent to the laser light, and a position change unit that changes the irradiation position of the laser light on the member to be adhered, and the member to be adhered is positioned on the path of the laser light transmitted by the optical member or at a position where the reflected laser light is irradiated. Effect of the Invention

[0007] According to one aspect of the present disclosure, a laser processing apparatus capable of suppressing adhesion of impurities can be provided. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic configuration diagram showing a laser processing apparatus according to the first embodiment. [Diagram 2] FIG. 2 is a schematic configuration diagram showing a laser processing apparatus according to the second embodiment. [Diagram 3] FIG. 3 is a schematic configuration diagram showing a laser processing apparatus according to the third embodiment. [Figure 4] FIG. 4 is a schematic configuration diagram showing a laser processing apparatus according to the fourth embodiment. [Diagram 5] FIG. 5 is a schematic configuration diagram showing a laser processing apparatus according to the fifth embodiment. [Figure 6]FIG. 6 is a schematic configuration diagram showing a laser processing apparatus according to the sixth embodiment. [Figure 7] FIG. 7 is a schematic configuration diagram showing a laser processing apparatus according to the seventh embodiment. [Figure 8] FIG. 8 is a schematic configuration diagram showing a laser processing apparatus according to the eighth embodiment. [Figure 9] FIG. 9 is a schematic configuration diagram showing a laser processing apparatus according to the ninth embodiment. [Figure 10] FIG. 10 is a schematic configuration diagram showing a laser processing apparatus according to the tenth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] (First embodiment) The first embodiment will be described below. 1 irradiates a workpiece W with laser light LW to process the workpiece W. This laser processing device 101 is, for example, a laser marking device that applies marking to the workpiece W. Processing using the laser light LW includes a process of removing (cutting, drilling, etc.) a part of the workpiece W, a process of discoloring or altering a part of the workpiece W by the heat of the laser light LW, and the like.

[0010] As shown in FIG. 1, the laser processing apparatus 101 includes a laser emission unit 11 and a laser head 12. The laser emission unit 11 has a control unit 21 and a laser light source 22. The control unit 21 controls the overall operation of the laser processing apparatus 101. The control unit 21 is electrically connected to the laser light source 22 and controls the driving of the laser light source 22. The control unit 21 is also electrically connected to the laser head 12 and controls the driving of the laser head 12.

[0011] The laser light source 22 emits laser light LW including a predetermined wavelength. This laser light LW is for processing the work-piece W. The wavelength included in this laser light LW is, for example, the wavelength of ultraviolet light (for example, 355 nm).

[0012] The laser light source 22 includes a laser oscillator 23 , a wavelength conversion unit 24 , and a filter 27 . The laser oscillator 23 generates a fundamental wave. The fundamental wave is a laser beam having a fundamental wavelength for generating the above-mentioned laser beam LW. The frequency of the fundamental wave is, for example, 1064 nm. The laser oscillator 23 is a laser light source such as a YAG laser, a CO2 laser, or a fiber laser.

[0013] The laser light source 22 is connected directly or via an optical fiber cable to the wavelength conversion unit 24. The wavelength conversion unit 24 converts the wavelength of the fundamental wave generated by the laser light source 22 to generate a harmonic wave having a higher frequency than that of the fundamental wave.

[0014] The wavelength conversion unit 24 of this embodiment includes a first conversion element 25 and a second conversion element 26. The first conversion element 25 is a wavelength conversion element that generates a second harmonic (SHG) having a higher frequency than the fundamental wave. The first conversion element 25 generates laser light including the fundamental wave and the second harmonic. The first conversion element 25 is a nonlinear optical crystal, for example, LBO (LiB3O3). Note that, The first conversion element 25 is Other nonlinear optical crystals may be used. The wavelength of the second harmonic is, for example, 532 nm.

[0015] The second conversion element 26 is a wavelength conversion element that generates a third harmonic (THG) having a higher frequency than the first harmonic. The second conversion element 26 generates laser light including a fundamental wave, a second harmonic, and a third harmonic. The second conversion element 26 is a nonlinear optical crystal, for example, LBO (LiB3O3). The second conversion element 26 is Other nonlinear optical crystals may be used. The wavelength of the third harmonic is, for example, 355 nm.

[0016] The filter 27 transmits laser light of a predetermined wavelength. The filter 27 of this embodiment is configured to transmit laser light of a wavelength band including the wavelength of the third harmonic. With this configuration, the laser light source 22 emits laser light LW of the above-mentioned predetermined wavelength (for example, 355 nm).

[0017] The laser head 12 includes a dust collector 31, a beam expander 32, a focus adjustment unit 33, a scanning unit 34, and a protective glass 35. The dust collecting section 31 has a member to be adhered 31a and a position changing section 31b. The member to be adhered 31a transmits the laser light LW. The member to be adhered 31a has, for example, a glass substrate and an anti-reflection film (AR coating) on ​​the surface of the glass substrate. The glass substrate is preferably made of a material that absorbs the laser light LW less. The glass substrate is made of, for example, fused quartz. The anti-reflection film reduces the amount of reflection (reflectance) of the laser light on the glass substrate and improves the amount of transmission (transmittance) of the laser light on the glass substrate. The anti-reflection film is a multi-layer film made of multiple thin films of materials such as oxides, metals, and rare earths. The anti-reflection film is made of, for example, thin films of aluminum oxide (Al2O3), tantalum pentoxide (Ta2O5), magnesium fluoride (MgF2), and the like. In the anti-reflection film of this embodiment, the outermost layer film contains titanium oxide (TiO2).

[0018] The adherend member 31a is preferably disposed in a location inside the laser head 12 where the intensity of the laser light LW is high. The laser light LW is emitted from the laser emission unit 11 as, for example, parallel light. The intensity of the laser light LW decreases along the path it travels. Therefore, the emission end of the laser emission unit 11, that is, the incident end of the laser light in the laser head 12, can be said to be a location with high intensity.

[0019] A beam expander 32, a focus adjustment unit 33, and a scanning unit 34, which will be described later, are optical members in the laser processing apparatus 101 that propagate the laser light LW emitted from the laser emission unit 11 toward the workpiece W. In contrast, the adherend member 31a can be said to be an optical member in the laser processing apparatus 101 that does not contribute to the propagation of the laser light LW.

[0020] The position changer 31b includes, for example, an actuator such as a motor. The position changer 31b is configured to change the location on the substrate 31a where the laser light LW passes (enters). For example, the position changer 31b rotates the substrate 31a or moves it in a predetermined direction, In the attachment member 31a The position where the laser light LW is irradiated is changed.

[0021] The beam expander 32 includes a plurality of lenses. For example, the beam expander 32 has a concave lens on the incident side and a convex lens on the exit side. The beam expander 32 expands the beam diameter of the incident laser light LW by a predetermined magnification. Laser light LW The beam expander 32 may have a convex lens on both the entrance side and the exit side.

[0022] The focus adjustment unit 33 has a lens unit 33a and a drive unit 33b. The lens unit 33a includes at least two lenses. The lenses are arranged along the path through which the laser light LW passes. At least one of the lenses included in the lens unit 33a is a linear slider or other not shown in the figure. support The lens is supported by a member so as to be movable along the passage path. The driving unit 33b moves the movably supported lens along the passage path under the control of the control unit 21. In this way, the focus adjustment unit 33 adjusts the focal position of the laser light LW.

[0023] The scanning unit 34 includes galvanometer mirrors 34X and 34Y and a driving unit 34b. The galvanometer mirrors 34X and 34Y reflect the laser light LW. The driving unit 34b rotates the galvanometer mirrors 34X and 34Y. The driving unit 34b is, for example, a motor, and is controlled by the control unit 21. The galvanometer mirrors 34X and 34Y and the driving unit 34b are configured to scan the laser light LW in two-dimensional directions. For example, the galvanometer mirror 34X and the driving unit 34b scan the laser light LW in the X-axis direction, and the galvanometer mirror 34Y and the driving unit 34b scan the laser light LW in the Y-axis direction.

[0024] The protective glass 35 is attached to the laser head 12. The laser head 12 has an opening through which the laser light LW passes. The protective glass 35 closes the opening. The protective glass 35 prevents dust and objects generated by processing (e.g., organic matter) from entering the inside of the laser head 12 through the opening of the laser head 12.

[0025] (action) Next, the operation of the laser processing apparatus 101 of this embodiment will be described. The laser processing device 101 has a laser emission unit 11 and a laser head 12. The laser emission unit 11 has a laser oscillator 23 that generates a fundamental wave, and a wavelength conversion section 24 that converts the wavelength of the fundamental wave to generate a harmonic wave having a higher frequency than the fundamental wave. The wavelength of the laser light LW output from the wavelength conversion section 24 is, for example, 355 nm. Such laser light LW is called a UV laser light. The workpiece W can be processed by this laser light LW.

[0026] The laser head 12 has a beam expander 32, a focus adjustment unit 33, and a scanning unit 34 as optical members for irradiating the laser light LW onto the workpiece W. The laser head 12 also has a member to be adhered 31a as an optical member that is not involved in the propagation of the laser light LW. The member to be adhered 31a is disposed in a location where the intensity of the laser light LW is high.

[0027] The gas inside the laser head 12 contains impurities. The impurities include minute liquid and solid particles. The impurities have the property of moving toward the laser light or the optical member irradiated with the laser light due to the migration effect and the like. The migration effect has a stronger migration force as the intensity of the laser light increases. Therefore, the impurities inside the laser head 12 move toward the portion of the adherend member 31a through which the laser light LW passes, and adhere to the adherend member 31a. This makes it possible to suppress the adhesion of impurities to other optical members, that is, the optical members for guiding the laser light LW to the workpiece W, such as the beam expander 32, the lenses constituting the focus adjustment unit 33, and the galvanometer mirrors 34X and 34Y. Also, it is possible to suppress a decrease in the intensity of the laser light LW emitted from the laser head 12 toward the laser processing device 101.

[0028] The adherend member 31a has a glass plate and an anti-reflection film formed on the surface of the glass plate. Therefore, impurities adhere to the entrance surface of the adherend member 31a where the laser light LW enters and the exit surface of the laser light LW. This allows impurities inside the laser head 12 to be efficiently adhered to the adherend member 31a.

[0029] The dust collecting section 31 has a substrate 31a and a position changing section 31b. The position changing section 31b is configured to change the position on the substrate 31a to which the laser light LW is irradiated. The control section 21 controls the position changing section 31b based on, for example, the operating time of the laser processing device 101, to change the irradiation position of the substrate 31a with the laser light LW. In other words, by changing the portion to which the impurities adhere, it is possible to collect impurities over a long period of time. To the attachment member 31a In other words, adhesion of impurities to other optical members can be suppressed for a long period of time, thereby enabling the operation of the laser processing apparatus 101 to be extended for a long period of time.

[0030] In addition, the laser processing apparatus 101 requires maintenance such as cleaning and replacement of the built-in optical members. In this embodiment, the adhesion of impurities to the optical members is reduced, so that the number of maintenance operations can be reduced and the maintenance intervals can be extended, that is, the operating time can be extended.

[0031] The adherend member 31a of this embodiment includes a glass substrate and an anti-reflection film on the surface of the glass substrate. In the anti-reflection film of this embodiment, the outermost layer of the film includes titanium oxide (TiO2). In addition to a general (normal) dust-collecting effect, this outermost layer of the film exhibits a photocatalytic effect when exposed to the irradiated laser light LW (UV laser light). Due to this photocatalytic effect, organic matter adhered to the adherend member 31a is decomposed. This makes it possible to reduce the impurities adhered to the adherend member 31a. This makes it possible to reduce the number of maintenance operations and lengthen the maintenance interval, i.e., to lengthen the operating time.

[0032] As described above, according to this embodiment, the following effects are achieved. (1-1) The laser processing apparatus 101 has a laser emission unit 11 and a laser head 12. The laser emission unit 11 has a laser oscillator 23 that generates a fundamental wave, and a wavelength conversion unit 24 that generates a harmonic wave having a higher frequency than the fundamental wave. The wavelength of the laser light LW output from the wavelength conversion unit 24 is, for example, 355 nm. Such laser light LW is called a UV laser light. The workpiece W can be processed by this laser light LW.

[0033] (1-2) The laser head 12 has a beam expander 32, a focus adjustment unit 33, and a scanning unit 34 as optical members for irradiating the laser light LW to the workpiece W. The laser head 12 also has a member to be adhered 31a as an optical member that is not involved in the propagation of the laser light LW. The member to be adhered 31a is disposed in a location where the intensity of the laser light LW is high. Impurities inside the laser head 12 move toward the portion of the member to be adhered 31a through which the laser light LW passes, and adhere to the member to be adhered 31a. This makes it possible to suppress adhesion of impurities to other optical members, that is, the beam expander 32, the lenses constituting the focus adjustment unit 33, and the galvanometer mirrors 34X and 34Y. This makes it possible to suppress a decrease in the intensity of the laser light LW emitted from the laser head 12 toward the laser processing device 101.

[0034] (1-3) The adherend member 31a has a glass plate and an anti-reflection film formed on the surface of the glass plate. Therefore, impurities adhere to the entrance surface of the adherend member 31a where the laser light LW enters and the exit surface of the laser light LW. This allows impurities inside the laser head 12 to be efficiently adhered to the adherend member 31a.

[0035] (1-4) The dust collecting unit 31 has a substrate 31a and a position changing unit 31b. The position changing unit 31b is configured to change the position on the substrate 31a to which the laser light LW is irradiated. The control unit 21 controls the position changing unit 31b based on, for example, the operating time of the laser processing device 101, to change the irradiation position of the laser light LW on the substrate 31a. In other words, by changing the part to which impurities adhere, it is possible to collect impurities over a long period of time. To the attachment member 31a In other words, adhesion of impurities to other optical members can be suppressed for a long period of time, thereby enabling the operation of the laser processing apparatus 101 to be extended for a long period of time.

[0036] (1-5) The laser processing apparatus 101 requires maintenance such as cleaning and replacement of the built-in optical members. In this embodiment, the adhesion of impurities to the optical members is reduced, so that the number of maintenance operations can be reduced and the maintenance intervals can be extended, that is, the operating time can be extended.

[0037] (1-6) The adherend member 31a includes a glass substrate and an anti-reflection film on the surface of the glass substrate. In the anti-reflection film of this embodiment, the outermost layer of the film contains titanium oxide (TiO2). This outermost layer exhibits a photocatalytic effect when irradiated with laser light LW (UV laser light). Due to this photocatalytic effect, organic matter adhered to the adherend member 31a is decomposed. This makes it possible to reduce impurities adhered to the adherend member 31a. This makes it possible to reduce the number of maintenance operations and lengthen the maintenance interval, i.e., to lengthen the operating time.

[0038] Second embodiment The second embodiment will be described below. In this embodiment, the same components as those in the above embodiment are denoted by the same reference numerals and the description thereof will be omitted.

[0039] As shown in FIG. 2, the laser processing apparatus 102 of this embodiment includes a beam expander 41. The beam expander 41 of this embodiment has a first lens 41a and a second lens 41b. The first lens 41a and the second lens 41b are convex lenses. That is, the beam expander 41 of this embodiment is a Keplerian beam expander. This beam expander 41 focuses the laser light LW between the first lens 41a on the incident side and the second lens 41b on the exit side. That is, the laser processing apparatus 102 of this embodiment has a focal position of the laser light LW inside the beam expander 41.

[0040] The adhered member 31a of the dust collection unit 31 is disposed inside the beam expander 41. More specifically, the adhered member 31a is disposed between a first lens 41a on the incident side and a second lens 41b on the exit side. The adhered member 31a is disposed at or near the focal position of the laser light LW between the first lens 41a and the second lens 41b.

[0041] The optimum position on the laser optical path for placing the adherend member 31a may vary depending on the type of impurity, such as "the focal position" being preferable or "a position slightly shifted from the focal position" being preferable depending on the impurity. Therefore, "the focal position or vicinity" includes "between the focal position of the laser light focused by the focusing lens and the focusing lens" and "the position on the opposite side of the focusing lens from the focal position" in addition to "the focal position" and "almost the focal position (a position that can be regarded as the focal position)" as the location of high light intensity.

[0042] By concentrating the laser light LW, the intensity of the laser light LW at the portion of the surface of the adherend member 31a where the laser light LW is irradiated becomes higher than the intensity of the laser light LW before being concentrated. Therefore, by using the beam expander 41 of this embodiment, the intensity of the laser light LW irradiated to the adherend member 31a can be increased. This makes it easier for impurities to adhere to the adherend member 31a. In other words, the adhesion of impurities to other optical members can be reduced.

[0043] As described above, according to the present embodiment, in addition to the effects of the first embodiment, the following effects are achieved. (2-1) The beam expander 41 using the first lens 41a and the second lens 41b, which are convex lenses, can increase the intensity of the laser light LW at the substrate 31a disposed between the first lens 41a and the second lens 41b. This makes it easier for impurities to adhere to the substrate 31a, and can further reduce the adhesion of impurities to other optical members.

[0044] Third embodiment The third embodiment will be described below. In this embodiment, the same components as those in the above embodiment are denoted by the same reference numerals and the description thereof will be omitted.

[0045] As shown in FIG. 3, the laser processing apparatus 103 of this embodiment includes a laser head 12, a beam splitter 42, a lens 43, and a damper 44. The beam splitter 42 is disposed between the laser light source 22 and the beam expander 32. The beam splitter 42 branches a part of the laser light LW emitted from the laser light source 22. The dumper 44 absorbs the branched laser light LW.

[0046] The lens 43 is disposed between the beam splitter 42 and the damper 44. The lens 43 is a convex lens, and is a condensing lens that condenses the laser light LW between the lens 43 and the damper 44. That is, the laser processing apparatus 103 of the present embodiment has a focal point of the laser light LW between the lens 43 and the damper 44.

[0047] The adhered member 31a of the dust collection unit 31 is disposed between the lens 43 and the damper 44. The adhered member 31a is disposed between the lens 43 and the damper 44 at or near the focal position of the laser light LW.

[0048] By concentrating the laser light LW, the intensity of the laser light LW at the portion of the surface of the adherend member 31a where the laser light LW is irradiated becomes higher than the intensity of the laser light LW before being concentrated. Lens 43 By using the laser beam LW, the intensity of the laser beam LW irradiated onto the adherend member 31a can be increased. This makes it easier for impurities to adhere to the adherend member 31a. In other words, the adhesion of impurities to other optical members can be reduced.

[0049] In the laser processing apparatus 103 of the present embodiment, the adherend member 31a is disposed in the path of the laser light LW split by the beam splitter 42. Therefore, the adherend member 31a can be disposed at a position different from the path of the laser light LW that processes the workpiece W. That is, the adherend member 31a can be disposed at any position inside the laser head 12. Therefore, by disposing the adherend member 31a near a location where impurities are generated inside the laser head 12 (for example, a location where an adhesive is applied), it is possible to further reduce adhesion of impurities to other optical members.

[0050] As described above, according to the present embodiment, in addition to the effects of the first embodiment, the following effects are achieved. (3-1) The laser processing apparatus 103 includes a beam splitter 42 that branches a part of the laser light LW emitted from the laser light source 22. The damper 44 absorbs the branched laser light. The lens 43 is disposed between the beam splitter 42 and the damper 44, and focuses the branched laser light. This makes it possible to easily form a place where the intensity of the laser light LW is high inside the laser head 12.

[0051] (3-2) The adherend member 31a of the dust collection unit 31 is disposed between the lens 43 and the damper 44. By concentrating the laser light LW, the intensity of the laser light LW at the portion of the surface of the adherend member 31a where the laser light LW is irradiated becomes higher than the intensity of the laser light LW before being concentrated. Therefore, by using the lens 43 of this embodiment, the intensity of the laser light LW irradiated to the adherend member 31a can be increased. This makes it easier for impurities to adhere to the adherend member 31a. In other words, the adhesion of impurities to other optical members can be further reduced.

[0052] (3-3) The adherend member 31a is disposed in the path of the laser light LW branched by the beam splitter 42. This allows the adherend member 31a to be disposed at any position inside the laser head 12. Therefore, by disposing the adherend member 31a near a location inside the laser head 12 where impurities are generated (for example, a location where an adhesive is applied), it is possible to further reduce adhesion of impurities to other optical members.

[0053] (Fourth embodiment) The fourth embodiment will be described below. In this embodiment, the same components as those in the above embodiment are denoted by the same reference numerals and the description thereof will be omitted.

[0054] 4, the laser processing apparatus 104 of the present embodiment has a lens 28 in the laser light source 22. The lens 28 is a convex lens, and collects the laser light LW transmitted through the filter 27. The laser light LW is collected between the laser light source 22 and the beam expander 32.

[0055] The adhered member 31a of the dust collection unit 31 is disposed between the laser light source 22 and the beam expander 32. The adhered member 31a is disposed between the laser light source 22 and the beam expander 32 at or near the focal position of the laser light LW.

[0056] By concentrating the laser light LW, the intensity of the laser light LW at the portion of the surface of the adherend member 31a where the laser light LW is irradiated becomes higher than the intensity of the laser light LW before being concentrated. Lens 28 By using the laser beam LW, the intensity of the laser beam LW irradiated onto the adherend member 31a can be increased. This makes it easier for impurities to adhere to the adherend member 31a. In other words, the adhesion of impurities to other optical members can be reduced.

[0057] As described above, according to the present embodiment, in addition to the effects of the first embodiment, the following effects are achieved. (4-1) The laser processing apparatus 104 has a lens 28 in the laser light source 22. The lens 28 is a convex lens, and collects the laser light LW transmitted through the filter 27. The laser light LW is collected between the laser light source 22 and the beam expander 32. This makes it possible to easily form a place where the intensity of the laser light LW is high inside the laser head 12.

[0058] (4-2) The adherend member 31a of the dust collection unit 31 is disposed between the laser light source 22 and the beam expander 32. The adherend member 31a is disposed at or near the focal position of the laser light LW between the laser light source 22 and the beam expander 32. By concentrating the laser light LW, the intensity of the laser light LW at the portion on the surface of the adherend member 31a where the laser light LW is irradiated becomes higher than the intensity of the laser light LW before being concentrated. Therefore, in this embodiment, Lens 28By using the laser beam LW, the intensity of the laser beam LW irradiated onto the adherend member 31a can be increased. This makes it easier for impurities to adhere to the adherend member 31a. In other words, the adhesion of impurities to other optical members can be reduced.

[0059] Fifth embodiment The fifth embodiment will be described below. In this embodiment, the same components as those in the above embodiment are denoted by the same reference numerals and the description thereof will be omitted.

[0060] 5, the laser light source 22 of the laser processing apparatus 105 of this embodiment has a laser oscillator 23 and a wavelength conversion unit 24, and does not have the filter 27 shown in Fig. 1 etc. With this configuration, the laser light source 22 emits laser light LA ​​including a fundamental wave and harmonics (second harmonic and third harmonic).

[0061] The laser head 12 of the above embodiment includes a filter 45. The filter 45 is disposed between the laser light source 22 and the beam expander 32. The adherend member 31a of the dust collection unit 31 is disposed between the laser light source 22 and the filter 45. Therefore, the adherend member 31a transmits the laser light LA ​​including the fundamental wave and the harmonic. The filter 45 transmits the laser light LW including the second harmonic of the laser light LA.

[0062] In the laser processing apparatus 105, the laser light LA ​​that passes through the workpiece 31a includes a fundamental wave and harmonics (second and third harmonics). Therefore, in this embodiment, impurities (e.g., organic compounds) due to the fundamental wave and the second harmonics in addition to the third harmonic can be attached to the workpiece 31a.

[0063] As described above, according to the present embodiment, in addition to the effects of the first embodiment, the following effects are achieved. (5-1) The laser light source 22 of the laser processing device 105 emits laser light LA ​​including a fundamental wave and harmonics (second harmonic and third harmonic). The laser light LA ​​including a fundamental wave and harmonics (second harmonic and third harmonic) is transmitted through the adherend member 31a. In this embodiment, impurities (e.g., organic compounds) due to the fundamental wave and the second harmonic in addition to the third harmonic can be adhered to the adherend member 31a. This can reduce the adhesion of impurities to other optical members.

[0064] Sixth embodiment The sixth embodiment will be described below. In this embodiment, the same components as those in the above embodiment are denoted by the same reference numerals and the description thereof will be omitted.

[0065] 6, the laser light source 22 of the laser processing apparatus 106 of this embodiment has a laser oscillator 23, a wavelength conversion unit 24, and a lens 28, and does not have the filter 27 shown in FIG. 1 etc. The lens 28 is a convex lens, and collects the laser light LA ​​generated by the wavelength conversion unit 24. The laser light LA ​​is collected between the laser light source 22 and the beam expander 32.

[0066] The laser head 12 in the above embodiment includes a filter 45. The filter 45 is disposed between the laser light source 22 and the beam expander 32. The adhered member 31a of the dust collection unit 31 is disposed between the laser light source 22 and the filter 45. The adhered member 31a is disposed between the laser light source 22 and the beam expander 32 at or near the focal position of the laser light LA.

[0067] By concentrating the laser light LA, the intensity of the laser light LA ​​at the portion of the surface of the adherend member 31a where the laser light LA ​​is irradiated becomes higher than the intensity of the laser light LA ​​before being concentrated. Therefore, by using the lens 28 of this embodiment, the intensity of the laser light LW irradiated to the adherend member 31a can be increased. This makes it easier for impurities to adhere to the adherend member 31a. In other words, the adhesion of impurities to other optical members can be reduced.

[0068] As described above, according to the present embodiment, in addition to the effects of the first and fifth embodiments, the following effects are achieved. (6-1) The laser processing apparatus 106 has a lens 28 in the laser light source 22. The lens 28 is a convex lens, and focuses the laser light LA. The laser light LA ​​is focused between the laser light source 22 and the beam expander 32. This makes it possible to easily form a location in the laser head 12 where the intensity of the laser light LA ​​is high.

[0069] (6-2) The adhered member 31a of the dust collecting unit 31 is disposed between the laser light source 22 and the filter 45. The adhered member 31a is disposed at or near the focal position of the laser light LA ​​between the laser light source 22 and the beam expander 32. By concentrating the laser light LA, the intensity of the laser light LA ​​at the portion of the surface of the adhered member 31a where the laser light LA ​​is irradiated becomes higher than the intensity of the laser light LA ​​before being concentrated. Therefore, by using the lens 28 of this embodiment, the intensity of the laser light LA ​​irradiated to the adhered member 31a can be increased. This makes it easier for impurities to adhere to the adhered member 31a. In other words, the adhesion of impurities to other optical members can be reduced.

[0070] (6-3) The laser light source 22 of the laser processing device 106 emits laser light LA ​​including a fundamental wave and harmonics (second and third harmonics). The laser light LA ​​including a fundamental wave and harmonics (second and third harmonics) is transmitted through the adherend member 31a. In this embodiment, impurities (e.g., organic compounds) due to the fundamental wave and the second harmonic in addition to the third harmonic can be adhered to the adherend member 31a. This can reduce the adhesion of impurities to other optical members.

[0071] Seventh embodiment The seventh embodiment will be described below. In this embodiment, the same components as those in the above embodiment are denoted by the same reference numerals and the description thereof will be omitted.

[0072] As shown in FIG. 7, the laser processing apparatus 107 of this embodiment includes a laser head 12 equipped with a mirror (reflection member) 46, a drive unit 47, a lens 43, and a damper 44. The mirror 46 is disposed between the laser light source 22 and the beam expander 32. The mirror 46 is supported so as to be switchable between a first position (position indicated by a two-dot chain line in FIG. 7) where the laser light LW emitted from the laser light source 22 irradiates the mirror 46, and a second position (position indicated by a solid line in FIG. 7) where the laser light LW is not irradiated. The drive unit 47 is an actuator for switchably arranging the mirror 46 between the first position and the second position. The control unit 21 controls the drive unit 47 to place the mirror 46 at the first position or the second position. The control unit 21 and the drive unit 47 constitute a position switching unit.

[0073] The mirror 46 disposed at the first position reflects the laser light LW. The damper 44 absorbs the laser light LW reflected by the mirror 46 (indicated by a two-dot chain line). The lens 43 is disposed between the mirror 46 and the damper 44. The lens 43 is a convex lens, and focuses the laser light LW between the lens 43 and the damper 44. That is, the laser processing apparatus 107 of the present embodiment has a focal point of the laser light LW between the lens 43 and the damper 44.

[0074] The adhered member 31a of the dust collection unit 31 is disposed between the lens 43 and the damper 44. The adhered member 31a is disposed between the lens 43 and the damper 44 at or near the focal position of the laser light LW.

[0075] By concentrating the laser light LW, the intensity of the laser light LW at the portion of the surface of the adherend member 31a where the laser light LW is irradiated becomes higher than the intensity of the laser light LW before being concentrated. Therefore, by using the lens 43 of this embodiment, the intensity of the laser light LW irradiated to the adherend member 31a can be increased. This makes it easier for impurities to adhere to the adherend member 31a. In other words, the adhesion of impurities to other optical members can be reduced.

[0076] In the laser processing apparatus 107 of the present embodiment, the adherend member 31a is disposed in the path of the laser light LW reflected by the mirror 46. Therefore, the adherend member 31a can be disposed at a position different from the path of the laser light LW that processes the workpiece W. That is, the adherend member 31a can be disposed at any position inside the laser head 12. Therefore, by disposing the adherend member 31a near a location where impurities are generated (for example, a location where an adhesive is applied) inside the laser head 12, it is possible to further reduce adhesion of impurities to other optical members.

[0077] As described above, according to the present embodiment, in addition to the effects of the first embodiment, the following effects are achieved. (7-1) The laser processing apparatus 107 includes a mirror 46 that reflects the laser light LW emitted from the laser light source 22. The damper 44 absorbs the laser light reflected by the mirror 46. The lens 43 is disposed between the mirror 46 and the damper 44 and collects the laser light LW. The adhered member 31a of the dust collection unit 31 is disposed between the lens 43 and the damper 44.

[0078] By concentrating the laser light LW, the intensity of the laser light LW at the portion of the surface of the adherend member 31a where the laser light LW is irradiated becomes higher than the intensity of the laser light LW before being concentrated. Lens 43 By using the laser beam LW, the intensity of the laser beam LW irradiated onto the adherend member 31a can be increased. This makes it easier for impurities to adhere to the adherend member 31a. In other words, the adhesion of impurities to other optical members can be reduced.

[0079] (7-2) The adhered member 31a is disposed in the path of the laser light LW reflected by the mirror 46. This allows the adhered member 31a to be disposed at any position inside the laser head 12. Therefore, by disposing the adhered member 31a near a location inside the laser head 12 where impurities are generated (for example, a location where an adhesive is applied), it is possible to further reduce adhesion of impurities to other optical members.

[0080] (7-3) The adherend member 31a is disposed in the path of the laser light LW reflected by the mirror 46 disposed at the first position. This allows the adherend member 31a to be disposed at any position inside the laser head 12. Therefore, by disposing the adherend member 31a near a location inside the laser head 12 where impurities are generated (for example, a location where an adhesive is applied), it is possible to further reduce adhesion of impurities to other optical members.

[0081] (7-4) The mirror 46 is supported so as to be switchable between a first position (position shown by a two-dot chain line in FIG. 7) where the laser light LW emitted from the laser light source 22 is irradiated onto the mirror 46, and a second position (position shown by a solid line in FIG. 7) where the laser light LW is not irradiated. Therefore, by switching the mirror 46 to the second position where the laser light LW is not irradiated, the laser light LW generated by the laser light source 22 can be irradiated onto the workpiece W without branching, and efficient processing can be performed.

[0082] Eighth embodiment The eighth embodiment will be described below. In this embodiment, the same components as those in the above embodiment are denoted by the same reference numerals and the description thereof will be omitted.

[0083] As shown in FIG. 8, the laser processing apparatus 108 of this embodiment includes a laser head 12, a wave plate 48, a drive unit 49, a polarizing beam splitter 50, a lens 43, and a damper 44. The wave plate 48 is a half wave plate that rotates the polarization direction of linearly polarized light. A driving unit 49 rotates the wave plate 48. The polarizing beam splitter 50 is disposed between the laser light source 22 and the beam expander 32. The polarizing beam splitter 50 is an optical member that transmits light in a first polarization direction and reflects light in a second polarization direction orthogonal to the first polarization direction. By combining the wave plate 48 and the polarizing beam splitter 50, the laser light LW emitted from the laser light source 22 can be effectively utilized.

[0084] By rotating the wave plate 48 to make the polarization direction of the laser light LW coincide with the first polarization direction of the polarizing beam splitter 50, the laser light LW emitted from the laser light source 22 passes through the polarizing beam splitter 50. The work-piece W can be processed by the transmitted laser light LW.

[0085] By rotating the wave plate 48 to make the polarization direction of the laser light LW coincide with the second polarization direction of the polarizing beam splitter 50, the laser light emitted from the laser light source 22 is reflected by the polarizing beam splitter 50. The damper 44 absorbs the laser light LW (indicated by a two-dot chain line) reflected by the polarizing beam splitter 50.

[0086] The lens 43 is disposed between the polarizing beam splitter 50 and the damper 44. The lens 43 is a convex lens, and focuses the laser light LW between the lens 43 and the damper 44. That is, the laser processing apparatus 108 of the present embodiment has a focal point of the laser light LW between the lens 43 and the damper 44.

[0087] The adhered member 31a of the dust collection unit 31 is disposed between the lens 43 and the damper 44. The adhered member 31a is disposed between the lens 43 and the damper 44 at or near the focal position of the laser light LW.

[0088] By concentrating the laser light LW, the intensity of the laser light LW at the portion of the surface of the adherend member 31a where the laser light LW is irradiated becomes higher than the intensity of the laser light LW before being concentrated. Therefore, by using the lens 43 of this embodiment, the intensity of the laser light LW irradiated to the adherend member 31a can be increased. This makes it easier for impurities to adhere to the adherend member 31a. In other words, the adhesion of impurities to other optical members can be reduced.

[0089] In the laser processing apparatus 108 of the present embodiment, the adherend member 31a is disposed in the path of the laser light LW reflected by the polarizing beam splitter 50. Therefore, the adherend member 31a can be disposed at a position different from the path of the laser light LW that processes the workpiece W. In other words, the adherend member 31a can be disposed at any position inside the laser head 12. Therefore, by disposing the adherend member 31a near a location where impurities are generated inside the laser head 12 (for example, a location where an adhesive is applied), it is possible to further reduce adhesion of impurities to other optical members.

[0090] As described above, according to the present embodiment, in addition to the effects of the first embodiment, the following effects are achieved. (8-1) The laser processing device 108 includes a polarizing beam splitter 50 that branches a portion of the laser light LW emitted from the laser light source 22. The damper 44 absorbs the branched laser light. The lens 43 is disposed between the polarizing beam splitter 50 and the damper 44, and focuses the branched laser light. This makes it possible to easily form a location in the laser head 12 where the intensity of the laser light LW is high.

[0091] (8-2) The adherend member 31a of the dust collection unit 31 is disposed between the lens 43 and the damper 44. By concentrating the laser light LW, the intensity of the laser light LW at the portion of the surface of the adherend member 31a where the laser light LW is irradiated becomes higher than the intensity of the laser light LW before being concentrated. Therefore, by using the lens 43 of this embodiment, the intensity of the laser light LW irradiated to the adherend member 31a can be increased. This makes it easier for impurities to adhere to the adherend member 31a. In other words, the adhesion of impurities to other optical members can be further reduced.

[0092] (8-3) The adhered member 31a is disposed in the path of the laser light LW reflected by the polarizing beam splitter 50. This allows the adhered member 31a to be disposed at any position inside the laser head 12. Therefore, by disposing the adhered member 31a near a location inside the laser head 12 where impurities are generated (for example, a location where an adhesive is applied), it is possible to further reduce adhesion of impurities to other optical members.

[0093] Ninth embodiment The ninth embodiment will be described below. In this embodiment, the same components as those in the above embodiment are denoted by the same reference numerals and the description thereof will be omitted.

[0094] As shown in FIG. 9, the laser processing apparatus 109 of this embodiment includes a laser head 12, a shutter 51, a drive unit 52, and a damper . The shutter 51 is disposed between the focus adjustment unit 33 and the scanning unit 34. The shutter 51 is supported so as to be switchable between a first position (indicated by a two-dot chain line) where the laser light LW is irradiated and a second position (indicated by a solid line) where the laser light is not irradiated. The driving unit 52 is an actuator (e.g., a motor) configured to switch the shutter 51 between the first position and the second position. The shutter 51 is configured to reflect the laser light LW. The laser light reflected by the shutter 51 is referred to as reflected light LR.

[0095] The damper 44 absorbs the reflected light LR (indicated by a two-dot chain line) reflected by the shutter 51. This reflected light LR is condensed between the shutter 51 and the damper 44 by the focus adjustment unit 33.

[0096] The adhered member 31a of the dust collection unit 31 is disposed between the shutter 51 and the damper 44. The adhered member 31a is disposed between the shutter 51 and the damper 44 at or near the focal position of the reflected light LR.

[0097] By concentrating the reflected light LR, the intensity of the reflected light LR at the portion of the surface of the adherend member 31a where the reflected light LR is irradiated becomes higher than the intensity of the laser light LW before being concentrated. Therefore, by using the focus adjustment unit 33, the intensity of the reflected light LR irradiated to the adherend member 31a can be made higher. This makes it easier for impurities to adhere to the adherend member 31a. In other words, the adhesion of impurities to other optical members can be reduced.

[0098] In the laser processing apparatus 109 of the present embodiment, the adherend member 31a is disposed in the path of the reflected light LR reflected by the shutter 51. Therefore, the adherend member 31a can be disposed in a position different from the path of the laser light LW that processes the workpiece W. In other words, the adherend member 31a can be disposed in any position inside the laser head 12. Therefore, by disposing the adherend member 31a near a location where impurities are generated inside the laser head 12 (for example, a location where an adhesive is applied), it is possible to further reduce adhesion of impurities to other optical members.

[0099] Furthermore, in the laser processing apparatus 109 of this embodiment, the adherend member 31a of the dust collection unit 31 is disposed at or near the focal position of the reflected light LR adjusted by the focal adjustment unit 33. In other words, the focal adjustment unit 33 is controlled to form the focal point of the reflected light LR at or near the position of the adherend member 31a of the dust collection unit 31. This makes it possible to easily form a location with high intensity of the reflected light LR at any position.

[0100] As described above, according to the present embodiment, in addition to the effects of the first embodiment, the following effects are achieved. (9-1) The laser processing apparatus 109 includes a shutter 51 that reflects the laser light LW emitted from the laser light source 22. The damper 44 absorbs the reflected light LR reflected by the shutter 51. The reflected light LR is focused between the shutter 51 and the damper 44 by the focus adjustment unit 33. The adhered member 31a of the dust collection unit 31 is disposed between the shutter 51 and the damper 44.

[0101] By concentrating the reflected light LR, the intensity of the reflected light LR at the portion of the surface of the adherend member 31a where the reflected light LR is irradiated becomes higher than the intensity of the laser light LW before being concentrated. Therefore, by using the beam expander 32 of this embodiment, the intensity of the reflected light LR irradiated to the adherend member 31a can be made higher. This makes it easier for impurities to adhere to the adherend member 31a. In other words, the adhesion of impurities to other optical members can be reduced.

[0102] (9-2) The adhered member 31a is disposed in the path of the reflected light LR reflected by the shutter 51. This allows the adhered member 31a to be disposed at any position inside the laser head 12. Therefore, by disposing the adhered member 31a near a location inside the laser head 12 where impurities are generated (for example, a location where an adhesive is applied), it is possible to further reduce adhesion of impurities to other optical members.

[0103] (9-3) The shutter 51 is supported so as to be switchable between a first position (position indicated by a two-dot chain line) where the laser light LW emitted from the laser light source 22 is irradiated onto the shutter 51, and a second position (position indicated by a solid line) where the laser light LW is not irradiated. Therefore, by switching the shutter 51 to the second position where the laser light LW is not irradiated, the laser light LW generated by the laser light source 22 can be irradiated onto the workpiece W without branching, and efficient processing can be performed.

[0104] (9-4) In the laser processing apparatus 109, the adherend member 31a of the dust collection unit 31 is disposed at or near the focal position of the reflected light LR adjusted by the focus adjustment unit 33. In other words, the focus adjustment unit 33 is controlled to form the focal point of the reflected light LR at or near the position of the adherend member 31a of the dust collection unit 31. This makes it possible to easily form a location with high intensity of the reflected light LR at any position.

[0105] Tenth embodiment The tenth embodiment will be described below. In this embodiment, the same components as those in the above embodiment are denoted by the same reference numerals and the description thereof will be omitted.

[0106] As shown in FIG. 10, the laser processing apparatus 110 of the present embodiment is provided with a damper 44 in the laser head 12. The laser head 12 of this embodiment is configured to have a detachable reflecting mirror (reflecting plate) 53. The reflecting mirror 53 attached to the laser head 12 reflects the laser light LW toward the galvanometer mirrors 34X and 34Y. The laser light reflected by the reflecting mirror 53 is referred to as reflected light LR. The galvanometer mirrors 34X and 34Y reflect the reflected light LR in a direction other than the focus adjustment unit 33.

[0107] The damper 44 absorbs the reflected light LR (indicated by a two-dot chain line) reflected by the reflecting mirror 53 and the galvanometer mirrors 34X and 34Y. Damper 44 The light is focused between

[0108] The adhered member 31a of the dust collection unit 31 is disposed between the galvanometer mirrors 34X, 34Y and the damper 44. The adhered member 31a is disposed at or near the focal position of the reflected light LR between the galvanometer mirrors 34X, 34Y and the damper 44.

[0109] By concentrating the reflected light LR, the intensity of the reflected light LR at the portion of the surface of the adherend member 31a where the reflected light LR is irradiated becomes higher than the intensity of the laser light LW before being concentrated. Therefore, by using the focus adjustment unit 33, the intensity of the reflected light LR irradiated to the adherend member 31a can be made higher. This makes it easier for impurities to adhere to the adherend member 31a. In other words, the adhesion of impurities to other optical members can be reduced.

[0110] In the laser processing apparatus 110 of this embodiment, the adherend member 31a is disposed in the path of the reflected light LR reflected by the reflecting mirror 53 and the galvanometer mirrors 34X and 34Y. Therefore, the adherend member 31a can be disposed in a position different from the path of the laser light LW that processes the workpiece W. In other words, the adherend member 31a can be disposed in any position inside the laser head 12. Therefore, by disposing the adherend member 31a near a location where impurities are generated (for example, a location where an adhesive is applied) inside the laser head 12, it is possible to further reduce adhesion of impurities to other optical members.

[0111] Furthermore, in the laser processing apparatus 110 of this embodiment, the adherend member 31a of the dust collection unit 31 is disposed at or near the focal position of the reflected light LR adjusted by the focal adjustment unit 33. In other words, the focal adjustment unit 33 is controlled to form the focal point of the reflected light LR at or near the position of the adherend member 31a of the dust collection unit 31. This makes it possible to easily form a location with high intensity of the reflected light LR at any position.

[0112] As described above, according to the present embodiment, in addition to the effects of the first embodiment, the following effects are achieved. (10-1) The laser processing apparatus 110 includes a reflecting mirror 53 that reflects the laser light LW emitted from the laser light source 22. The damper 44 absorbs the reflected light LR reflected by the reflecting mirror 53 and the galvanometer mirrors 34X and 34Y. The reflected light LR is focused between the galvanometer mirrors 34X and 34Y and the damper 44 by the focus adjustment unit 33. The adhered member 31a of the dust collection unit 31 is disposed between the galvanometer mirrors 34X and 34Y and the damper 44.

[0113] By concentrating the reflected light LR, the intensity of the reflected light LR at the portion of the surface of the adherend member 31a where the reflected light LR is irradiated becomes higher than the intensity of the laser light LW before being concentrated. Therefore, by using the beam expander 32 of this embodiment, the intensity of the reflected light LR irradiated to the adherend member 31a can be made higher. This makes it easier for impurities to adhere to the adherend member 31a. In other words, the adhesion of impurities to other optical members can be reduced.

[0114] (10-2) The adherend member 31a is disposed in the path of the reflected light LR reflected by the reflecting mirror 53 and the galvanometer mirrors 34X and 34Y. This allows the adherend member 31a to be disposed at any position inside the laser head 12. Therefore, by disposing the adherend member 31a near a location inside the laser head 12 where impurities are generated (for example, a location where an adhesive is applied), it is possible to further reduce adhesion of impurities to other optical members.

[0115] (10-3) In the laser processing apparatus 110, the adherend member 31a of the dust collection unit 31 is disposed at or near the focal position of the reflected light LR adjusted by the focal adjustment unit 33. In other words, the focal adjustment unit 33 is controlled to form the focal point of the reflected light LR at or near the position of the adherend member 31a of the dust collection unit 31. This makes it possible to easily form a location with high intensity of the reflected light LR at any position.

[0116] [Example of change] The explanations of the respective embodiments are merely examples of forms that the laser processing apparatus according to the present disclosure may take, and are not intended to limit the forms. In addition to the respective embodiments, the present disclosure may take forms including, for example, modified examples of the embodiments shown below, and combinations of at least two modified examples that are not mutually contradictory.

[0117] The wavelength of the fundamental wave in the laser oscillator 23 is changed appropriately. The wavelength converting unit 24 includes three or more conversion elements. For example, The wavelength conversion unit 24 is The conversion element generates a fourth harmonic having a frequency higher than the third harmonic, the wavelength of the fourth harmonic being, for example, 266 nm.

[0118] The adherend member 31a may be electrically charged. In this case, the electrophoretic effect is also added, so that impurities are more likely to adhere to the adherend member 31a, and the adherence of impurities to other optical members can be further reduced.

[0119] At least one of the temperature of the member to be adhered 31a and the temperature around the member to be adhered 31a may be adjusted. For example, the temperature around the member to be adhered 31a is set higher. Alternatively, the temperature of the member to be adhered 31a is set lower than the temperature around the member to be adhered. This makes it easier for impurities to adhere to the member to be adhered 31a, and further reduces the adhesion of impurities to other optical members.

[0120] A light receiving unit (light receiving element) may be provided instead of the damper 44 to detect the amount of received laser light LW that has passed through the adherend member 31a. In this case, the control unit 21 determines the state of the adherend member 31a, i.e., the state of the adhered impurities, based on the amount of received light from the light receiving unit. For example, the control unit 21 may store the amount of received light at the start of operation or immediately after the adherend member 31a is moved as a reference amount of received light, and move the adherend member 31a when the difference between the amount of received light during operation and the reference amount of received light (amount of decrease in the amount of received light) becomes equal to or greater than a predetermined value.

[0121] Also, when the difference between the amount of light received during operation and the reference amount of light received (amount of decrease in the amount of light received) becomes equal to or greater than a predetermined value, the control unit 21 may notify the outside of the laser processing device of that fact. In this case, the member 31a to be attached is moved manually or by an instruction to the control unit 21. This can reduce the number of maintenance operations and lengthen the maintenance interval, i.e., lengthen the operating time.

[0122] Although the above embodiment uses the laser light source 22 including the wavelength conversion unit 24, the laser processing apparatus may have a laser light source that does not include the wavelength conversion unit 24. For example, a fundamental wave generated by the laser oscillator 23 is supplied to the laser head 12. Here, in order to increase the intensity (laser power) of the laser light at the focal position (processing position, processing focus) on the processing object W, it is better to increase the beam width (more specifically, the beam width of the collimated light) of the laser light incident on the condenser lens (for example, each lens of the focus adjustment unit 33) that condenses the laser light. This is because the intensity of the laser light increases as the beam diameter increases. However, there are various requirements for the laser processing apparatus, such as the apparatus itself not being made larger than necessary and the apparatus itself being required to be compact. This places a limit on the size of the beam diameter, and the beam diameter is subject to constraints. For this reason, when attempting to achieve high output (high laser power), the power (output) of the laser light source itself is increased in the portion where the beam width cannot be changed. The higher the power (output) of the laser light source, the greater the problem of contamination of optical members such as lenses, that is, adhesion of impurities to the optical members. Therefore, for example, even in a laser processing device for processing a workpiece W using a fundamental wave, by providing a dust collecting unit 31 as in each of the above embodiments, adhesion of impurities to the optical members can be reduced. (Appendix 1) A laser light source that emits laser light for processing an object to be processed; an optical member having a scanning unit that scans the laser light over the object to be processed; A control unit that controls the laser light source and the scanning unit; a dust collecting unit having a workpiece that transmits the laser light and a position changing unit that changes an irradiation position of the laser light on the workpiece; Equipped with The attachment member is disposed on a path of the laser light transmitted by the optical member or at a position where the reflected laser light is irradiated. Laser processing equipment. (Appendix 2) 2. The laser processing apparatus according to claim 1, wherein the workpiece has a glass plate that transmits the laser light. (Appendix 3) 3. The laser processing apparatus according to claim 1, wherein the member to be adhered to has an anti-reflection film formed on a surface thereof. (Appendix 4) 4. The laser processing apparatus according to claim 3, wherein the anti-reflection coating is composed of a multi-layer film, and the outermost layer contains titanium oxide. (Appendix 5) The laser light source is A laser oscillator for generating a fundamental wave; A wavelength conversion unit that generates a harmonic wave having a frequency higher than that of the fundamental wave; having emitting the laser light including the harmonic wave; 5. The laser processing apparatus according to claim 1 , (Appendix 6) The wavelength converting portion is A first conversion element that generates a second harmonic having a frequency higher than that of the fundamental wave; a second conversion element that generates a third harmonic having a frequency higher than the second harmonic; Including, The laser light source emits the laser light including at least the third harmonic. 6. The laser processing apparatus according to claim 5. (Appendix 7) a beam expander disposed between the laser light source and the scanning unit to expand a beam diameter of the laser light; The member to be adhered is disposed between the laser light source and the beam expander. 7. The laser processing apparatus according to claim 1 , (Appendix 8) a beam expander disposed between the laser light source and the scanning unit to expand a beam diameter of the laser light; the beam expander includes a first lens onto which the laser light is incident, and a second lens onto which the laser light transmitted through the first lens is incident, The attachment member is disposed between the first lens and the second lens. 7. The laser processing apparatus according to claim 1 , (Appendix 9) a beam splitter that reflects a portion of the laser light; a focusing lens that focuses a portion of the laser light reflected by the beam splitter; Equipped with The workpiece is disposed at a focal position of the laser light focused by the focusing lens. 7. The laser processing apparatus according to claim 1 , (Appendix 10) a beam splitter that reflects a portion of the laser light; a focusing lens that focuses a portion of the laser light reflected by the beam splitter; Equipped with The adherend is disposed between the focusing lens and a focal position of the laser light focused by the focusing lens, or on the opposite side of the focusing lens with respect to the focal position. 7. The laser processing apparatus according to claim 1 , (Appendix 11) a light receiving unit that receives a portion of the laser light that has passed through the workpiece; The control unit determines a state of the target member based on an amount of light received by the light receiving unit. 11. The laser processing apparatus according to claim 9 or 10. (Appendix 12) A reflecting member that reflects the laser light; a position switching unit that switches the reflecting member between a first position where the laser light is irradiated and a second position where the laser light is not irradiated; Equipped with the attachment member is disposed on a path of the laser light reflected by the reflecting member disposed at the first position; 7. The laser processing apparatus according to claim 1 , (Appendix 13) A wave plate; a polarizing beam splitter onto which the laser light transmitted through the wave plate is incident; A drive unit that rotates the wave plate; Equipped with the driving unit is configured to switch between a first position where the laser light is reflected by the polarizing beam splitter and a second position where the laser light is transmitted through the polarizing beam splitter, the substrate is disposed on a path of the laser light reflected by the polarizing beam splitter; 7. The laser processing apparatus according to claim 1 , (Appendix 14) a focus adjustment unit disposed between the laser light source and the scanning unit and controlling a focus position of the laser light; a shutter disposed between the focus adjustment unit and the scanning unit and configured to reflect the laser light; a damper that absorbs the laser light reflected by the shutter; Equipped with The member to be adhered is disposed between the shutter and the damper at a focal position of the laser light adjusted by the focal adjustment unit. 7. The laser processing apparatus according to claim 1 , (Appendix 15) a focus adjustment unit disposed between the laser light source and the scanning unit and adapted to adjust a focus position of the laser light; a reflector attached to the object side of a protective glass that closes an opening through which the laser light is emitted toward the object, and that reflects the laser light that has passed through the protective glass; a damper that is disposed on a path of the laser light reflected by the reflector and then reflected by the scanning unit controlled to a predetermined angle by the control unit, and absorbs the laser light; Equipped with The attachment member is disposed between the reflector and the damper at a focal position of the laser light adjusted by the focal adjustment unit. 7. The laser processing apparatus according to claim 1 , (Appendix 16) the laser light source is configured to emit the laser light so that the laser light is incident on the optical member after being condensed; The substrate is disposed at a position where the laser light is focused. 7. The laser processing apparatus according to claim 1 , [Explanation of symbols]

[0123] 101~110 Laser processing equipment 11 Laser emission unit 12 Laser head 21 Control section 22 Laser light source 23 Laser Oscillator 24 Wavelength conversion section 25 First conversion element 26 Second conversion element 27 Filters 28 Lenses 31 Dust collection section 31a Part to be attached 31b Position change section 32 Beam Expander 33 Focus adjustment section 33a Lens section 33b Drive unit 34 Scanning section 34b Drive unit 34X Galvanometer Mirror 34Y Galvano Mirror 35 Protective Glass 41 Beam Expander 41a First lens 41b Second lens 42 Beam splitter 43 Lens 44 Damper 45 Filters 46 Mirror 47 Drive unit 48 Wave plate 49 Drive unit 50 Polarizing Beam Splitter 51 Shutter 52 Drive unit 53 Reflective Mirror LA Laser Light LR reflected light LW laser light W Processing object

Claims

1. a laser emission unit having a built-in laser light source that emits laser light for processing an object to be processed; a laser head having a built-in optical member for guiding the laser light to the workpiece; A control unit that controls driving of the laser light source and the laser head; A laser processing apparatus comprising: the optical member has a scanning unit that scans the laser light over the object to be processed, The laser head includes: a dust collecting unit having a substrate that transmits the laser light and a position changing unit that changes the irradiation position of the laser light on the substrate; The adherend member is disposed inside the laser head on a path of the laser light transmitted by the optical member or at a position where the reflected laser light is irradiated. Laser processing equipment.

2. The laser processing apparatus according to claim 1 , wherein the workpiece comprises a glass plate that transmits the laser light.

3. 3. The laser processing apparatus according to claim 1, wherein the substrate has an anti-reflection film formed on a surface thereof.

4. 4. The laser processing apparatus according to claim 3, wherein the anti-reflection film is made up of a multi-layer film, and the outermost layer contains titanium oxide.

5. The laser light source is A laser oscillator for generating a fundamental wave; A wavelength conversion unit that generates a harmonic wave having a frequency higher than that of the fundamental wave; having emitting the laser light including the harmonic wave; 2. The laser processing apparatus according to claim 1.

6. The wavelength converting portion is A first conversion element that generates a second harmonic having a frequency higher than that of the fundamental wave; a second conversion element for generating a third harmonic having a frequency higher than the second harmonic; Including, The laser light source emits the laser light including at least the third harmonic. The laser processing apparatus according to claim 5.

7. a beam expander disposed between the laser light source and the scanning unit to expand a beam diameter of the laser light; The member to be adhered is disposed between the laser light source and the beam expander.

2. The laser processing apparatus according to claim 1.

8. a beam expander disposed between the laser light source and the scanning unit to expand a beam diameter of the laser light; the beam expander includes a first lens onto which the laser light is incident, and a second lens onto which the laser light transmitted through the first lens is incident, The attachment member is disposed between the first lens and the second lens.

2. The laser processing apparatus according to claim 1.

9. a beam splitter that reflects a portion of the laser light; a focusing lens that focuses a portion of the laser light reflected by the beam splitter; Equipped with The workpiece is disposed at a focal position of the laser light focused by the focusing lens.

2. The laser processing apparatus according to claim 1.

10. a beam splitter that reflects a portion of the laser light; a focusing lens that focuses a portion of the laser light reflected by the beam splitter; Equipped with The adherend member is disposed between the focusing lens and a focal position of the laser light focused by the focusing lens, or on the opposite side of the focusing lens with respect to the focal position.

2. The laser processing apparatus according to claim 1.

11. a light receiving unit that receives a portion of the laser light that has passed through the workpiece; The control unit determines a state of the target member based on an amount of light received by the light receiving unit. The laser processing apparatus according to claim 9 or 10.

12. A reflecting member that reflects the laser light; a position switching unit that switches the reflecting member between a first position where the laser light is irradiated and a second position where the laser light is not irradiated; Equipped with the substrate is disposed on a path of the laser light reflected by the reflecting member disposed at the first position; 2. The laser processing apparatus according to claim 1.

13. A wave plate; a polarizing beam splitter onto which the laser light transmitted through the wave plate is incident; A drive unit that rotates the wave plate; Equipped with the driving unit is configured to switch between a first position where the laser light is reflected by the polarizing beam splitter and a second position where the laser light is transmitted through the polarizing beam splitter, the substrate is disposed on a path of the laser light reflected by the polarizing beam splitter; 2. The laser processing apparatus according to claim 1.

14. a focus adjustment unit disposed between the laser light source and the scanning unit and controlling a focus position of the laser light; a shutter disposed between the focus adjustment unit and the scanning unit and configured to reflect the laser light; a damper that absorbs the laser light reflected by the shutter; Equipped with The member to be adhered is disposed between the shutter and the damper at a focal position of the laser light adjusted by the focal adjustment unit.

2. The laser processing apparatus according to claim 1.

15. a focus adjustment unit disposed between the laser light source and the scanning unit and adapted to adjust a focus position of the laser light; a reflector attached to the object side of a protective glass that closes an opening through which the laser light is emitted toward the object, and that reflects the laser light that has passed through the protective glass; a damper that is disposed on a path of the laser light reflected by the reflector and then reflected by the scanning unit controlled to a predetermined angle by the control unit, and absorbs the laser light; Equipped with The attachment member is disposed between the reflector and the damper at a focal position of the laser light adjusted by the focal adjustment unit.

2. The laser processing apparatus according to claim 1.

16. the laser light source is configured to emit the laser light so that the laser light is incident on the optical member after being condensed; The substrate is disposed at a position where the laser light is focused.

2. The laser processing apparatus according to claim 1.

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