Inspection support device and inspection support method

Abstract

To disclose an inspection support device and an inspection support method capable of guiding an inspection object component necessary for inspection from among a plurality of components to be mounted on a substrate to be inspected.SOLUTION: An inspection support device includes a calculation part and a guide part. The calculation part calculates inspection priorities of a plurality of components to be mounted on a substrate to be inspected of future inspection schedule on the basis of a past inspection result obtained by inspecting a component state of at least one of a holding state and a mounted state of a component mounted on the substrate. The guide part guides an inspection object component necessary for inspection from among the plurality of components to be mounted on the substrate to be inspected on the basis of the inspection priorities calculated by the calculation part.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] This specification discloses techniques relating to an inspection support device and an inspection support method. [Background technology]

[0002] The substrate-related work result inspection device described in Patent Document 1 determines the procedure for the inspection work based on history information such as work device history information. For example, the substrate-related work result inspection device selects as inspection targets those that have been mounted using a nozzle with a high rate of mounting defects, those that involve feeders that have been used for a long time, and the like, as targets that are likely to have mounting defects, and performs the inspection work. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2003-124699 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the substrate-related operation result inspection device described in Patent Document 1, it is not clear which of a plurality of inspection objects should be inspected with priority.

[0005] In consideration of the above circumstances, this specification discloses an inspection support device and an inspection support method capable of guiding inspection target components that require inspection from among a plurality of components mounted on a board to be inspected. [Means for solving the problem]

[0006] This specification discloses an inspection support device including a calculation unit and a guidance unit. The calculation unit calculates inspection priorities of a plurality of components mounted on a board to be inspected in the future based on past inspection results of inspecting at least one of a holding state and a mounting state of the components mounted on the board. The guidance unit guides inspection-target components that require inspection from among the plurality of components mounted on the board to be inspected based on the inspection priorities calculated by the calculation unit.

[0007] This specification also discloses an inspection support method including a calculation step and a guidance step. The calculation step calculates inspection priorities of a plurality of components mounted on a board to be inspected in the future based on past inspection results of inspecting at least one of a holding state and a mounting state of the components mounted on the board. The guidance step guides inspection-target components that need to be inspected from among the plurality of components mounted on the board to be inspected based on the inspection priorities calculated by the calculation step. Effect of the Invention

[0008] The above-mentioned inspection support device includes a calculation unit and a guidance unit. Therefore, the inspection support device can guide the inspection target components that need to be inspected from among the multiple components mounted on the board to be inspected based on the inspection priority calculated by the calculation unit. What has been described above about the inspection support device can also be said about the inspection support method. [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is a diagram showing a configuration example of a substrate-related work line; [Diagram 2] FIG. 2 is a plan view showing a configuration example of a component mounting machine. [Diagram 3] FIG. 2 is a block diagram showing an example of a control block of the inspection support device. [Figure 4] 10 is a flowchart showing an example of a control procedure performed by the inspection support device. [Diagram 5]13 is a schematic diagram showing an example of calculation of inspection priority levels by scoring component states for each type of device and component; FIG. [Figure 6] 13 is a schematic diagram showing a display example in which an inspection target component is displayed in a board image; FIG. [Figure 7] FIG. 13 is a schematic diagram showing an example of a list display in which inspection target parts are displayed; [Figure 8] FIG. 13 is a schematic diagram showing an example of guidance for an inspection threshold value. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] 1. Embodiment 1-1. Example of circuit board work line WL0 configuration In the substrate-related work line WL0, a predetermined substrate-related work is performed on the substrate 90. The type and number of substrate-related work machines WM0 constituting the substrate-related work line WL0 are not limited. As shown in Fig. 1, the substrate-related work line WL0 in this embodiment is equipped with a plurality (five) of substrate-related work machines WM0, including a printer WM1, a print inspection machine WM2, a component mounting machine WM3, a reflow furnace WM4, and a visual inspection machine WM5, and the substrate 90 is transported in this order by a substrate transport device.

[0011] The printer WM1 prints solder at mounting positions of the multiple components 91 on the board 90. The print inspection machine WM2 inspects the printing condition of the solder printed by the printer WM1. As shown in FIG. 2, the component mounting machine WM3 mounts the multiple components 91 on the board 90 on which the solder has been printed by the printer WM1. There may be one component mounting machine WM3 or multiple component mounting machines WM3. When multiple component mounting machines WM3 are provided, the multiple component mounting machines WM3 can share the task of mounting the multiple components 91.

[0012] The reflow furnace WM4 heats the board 90 on which a plurality of components 91 have been mounted by the component mounting machine WM3, melts the solder, and performs soldering. The appearance inspection machine WM5 inspects the mounting state of the plurality of components 91 mounted by the component mounting machine WM3. In this manner, the board-related work line WL0 uses a plurality (five) of board-related work machines WM0 to transport the boards 90 in sequence and perform production processing including inspection processing to produce board products 900. The board-related work line WL0 can also include board-related work machines WM0 such as a function inspection machine, a buffer device, a board supply device, a board reversing device, a shield mounting device, an adhesive application device, and an ultraviolet ray irradiation device, as necessary.

[0013] The plurality of (five) substrate-related performing machines WM0 and the line management device LC0 that make up the substrate-related performing line WL0 are communicatively connected by a communication unit. The line management device LC0 and the management device HC0 are communicatively connected by a communication unit. The communication unit can communicatively connect them by wire or wirelessly, and various communication methods can be used.

[0014] In this embodiment, a local area network (LAN) is configured by the multiple (five) substrate-related performing machines WM0, the line management device LC0, and the management device HC0. Therefore, the multiple (five) substrate-related performing machines WM0 can communicate with each other via the communication unit. Also, the multiple (five) substrate-related performing machines WM0 can communicate with the line management device LC0 via the communication unit. Furthermore, the line management device LC0 and the management device HC0 can communicate with each other via the communication unit.

[0015] The line management device LC0 controls the multiple (five) substrate-related performing machines WM0 that make up the substrate-related performing line WL0, and monitors the operating status of the substrate-related performing line WL0. The line management device LC0 stores various control data for controlling the multiple (five) substrate-related performing machines WM0. The line management device LC0 transmits control data to each of the multiple (five) substrate-related performing machines WM0. In addition, each of the multiple (five) substrate-related performing machines WM0 transmits its operating status and production status to the line management device LC0.

[0016] The management device HC0 manages at least one line management device LC0. For example, the operating status and production status of the substrate-related performing operation machine WM0 acquired by the line management device LC0 are transmitted to the management device HC0 as necessary. The management device HC0 is provided with a storage device DS0. The storage device DS0 can store various acquired data acquired by the substrate-related performing operation machine WM0. For example, various image data captured by the substrate-related performing operation machine WM0 is included in the acquired data. Records (log data) of the operating status acquired by the substrate-related performing operation machine WM0 are included in the acquired data. The storage device DS0 can also store various production information related to the production of the board products 900.

[0017] 1-2. Example of component placement machine WM3 configuration The component mounting machine WM3 mounts a plurality of components 91 on a board 90. As shown in FIG 2, the component mounting machine WM3 includes a board transport device 11, a component supply device 12, a component transfer device 13, a component camera 14, a board camera 15 and a control device 16.

[0018] The board transport device 11 is, for example, configured with a belt conveyor or the like, and transports the board 90 in a transport direction (X-axis direction). The board 90 is a circuit board on which electronic circuits, electric circuits, magnetic circuits, etc. are formed. The board transport device 11 transports the board 90 into the component mounting machine WM3, and positions the board 90 at a predetermined position within the machine. After the component mounting machine WM3 has completed the mounting process of the multiple components 91, the board transport device 11 transports the board 90 out of the component mounting machine WM3.

[0019] The component supplying device 12 supplies a plurality of components 91 to be mounted on the board 90. The component supplying device 12 includes a plurality of feeders 121 arranged along the transport direction (X-axis direction) of the board 90. Each of the plurality of feeders 121 pitch-feeds a carrier tape on which the plurality of components 91 are stored, and supplies the components 91 so that they can be picked at a supply position located at the tip side of the feeder 121. The component supplying device 12 can also supply electronic components (e.g., lead components) that are relatively large compared to chip components and the like, arranged on a tray.

[0020] The component transfer device 13 includes a head driving device 131 and a moving table 132. The head driving device 131 is configured to be able to move the moving table 132 in the X-axis direction and the Y-axis direction by a linear motion mechanism. The mounting head 20 is detachably (replaceably) attached to the moving table 132 by a clamp member. The mounting head 20 uses at least one holding member 30 to pick up and hold a component 91 supplied by the component supply device 12, and mounts the component 91 on the board 90 positioned by the board transport device 11. The holding member 30 can be, for example, a suction nozzle, a chuck, or the like.

[0021] The component camera 14 and the board camera 15 may be made of a known imaging device. The component camera 14 is fixed to a base of the component mounting machine WM3 so that the optical axis faces upward in the vertical direction (Z-axis direction). The component camera 14 can capture an image of the component 91 held by the holding member 30 from below. The board camera 15 is provided on a moving stage 132 of the component transfer device 13 so that the optical axis faces downward in the vertical direction (Z-axis direction). The board camera 15 can capture an image of the board 90 from above. The component camera 14 and the board camera 15 capture images based on a control signal sent from the control device 16. Image data of the images captured by the component camera 14 and the board camera 15 are transmitted to the control device 16.

[0022] The control device 16 includes a known arithmetic unit and a storage device, and constitutes a control circuit. Information output from various sensors provided in the component mounting machine WM3, image data, etc. are input to the control device 16. The control device 16 sends control signals to each device based on a control program and predetermined mounting conditions that are set in advance.

[0023] For example, the control device 16 causes the board camera 15 to capture an image of the board 90 positioned by the board transport device 11. The control device 16 processes the image captured by the board camera 15 to recognize the positioning state of the board 90. The control device 16 also causes the holding member 30 to pick up and hold the component 91 supplied by the component supply device 12, and causes the component camera 14 to capture an image of the component 91 held by the holding member 30. The control device 16 processes the image captured by the component camera 14 to recognize the holding posture of the component 91.

[0024] The control device 16 moves the holding member 30 toward above the intended mounting position that is set in advance by a control program or the like. The control device 16 also corrects the intended mounting position based on the positioning state of the board 90, the holding attitude of the component 91, and the like, and sets the mounting position where the component 91 is actually mounted. The intended mounting position and the mounting position include a rotation angle in addition to the position (X-axis coordinate and Y-axis coordinate).

[0025] The control device 16 corrects the target position (X-axis coordinates and Y-axis coordinates) and rotation angle of the holding member 30 according to the mounting position. The control device 16 lowers the holding member 30 at the corrected rotation angle in the corrected target position to mount the component 91 on the board 90. The control device 16 repeats the above pick-and-place cycle to execute the mounting process of mounting a plurality of components 91 on the board 90.

[0026] 1-3. Configuration example of the inspection support device 70 For example, the mounting state of the components 91 mounted on the board 90 may be inspected using the board camera 15 of the component mounting machine WM3. This allows the component mounting machine WM3 to quickly find defects in the mounting state of the components 91. However, as the number of components 91 to be inspected increases, the time required for the inspection tends to increase, and the production time of the board product 900 by the component mounting machine WM3 tends to become longer.

[0027] Furthermore, in the substrate-related work line WL0, the operating rate of each of the multiple (five) substrate-related work machines WM0 is relatively high, and it is desirable to equalize the production time of the substrate products 900 in each of the multiple (five) substrate-related work machines WM0. Therefore, it is preferable for the component mounting machine WM3 to select the minimum number of components 91 as the inspection target components 91t. The above also applies to the case where, for example, the component camera 14 of the component mounting machine WM3 is used to inspect the holding state of the components 91 held by the holding member 30.

[0028] Therefore, the substrate-related work line WL0 of this embodiment is provided with an inspection support device 70. The inspection support device 70 guides inspection target components 91t that require inspection from among a plurality of components 91 mounted on a substrate to be inspected 90p. The inspection support device 70 can be provided in various computing devices. For example, the inspection support device 70 can be provided in the line management device LC0, the management device HC0, the control device 16 of the component mounting machine WM3, etc. The inspection support device 70 can also be formed on the cloud. As shown in FIG. 3, the inspection support device 70 of this embodiment is provided in the management device HC0.

[0029] When considered as a control block, the inspection support device 70 includes a calculation unit 71 and a guidance unit 72. The inspection support device 70 may also include a verification unit 73. As shown in FIG. 3, the inspection support device 70 of this embodiment includes the calculation unit 71, the guidance unit 72, and the verification unit 73.

[0030] Further, the inspection support device 70 of this embodiment executes control according to the flowchart shown in FIG. 4. The calculation unit 71 performs the process shown in step S11. The guidance unit 72 performs the process shown in step S12. The verification unit 73 performs the process shown in step S15. In this embodiment, when creating an inspection program, the guidance unit 72 performs the process shown in step S12. The inspection program creating device performs the process shown in step S13. As described above, the substrate-related work line WL0 performs the process shown in step S14.

[0031] 1-3-1. Calculation unit 71 The calculation unit 71 calculates the inspection priority of multiple components 91 to be mounted on a board 90p to be inspected in the future based on past inspection results of inspecting the component states, which are at least one of the holding state and mounting state, of the components 91 mounted on the board 90 (step S11 shown in Figure 4).

[0032] For example, the holding state of component 91 can be represented by the error between the target holding position of component 91 held by holding member 30 and the actual holding position. The error between the target holding position and the actual holding position includes at least one error among the position in the X-axis direction, the position in the Y-axis direction, and the rotation angle. These errors are calculated by image processing the image captured by component camera 14.

[0033] The mounting state of component 91 can be represented by the error between the target mounting position of component 91 mounted on board 90 and the actual mounting position. The error between the target mounting position and the actual mounting position includes at least one error among the position in the X-axis direction, the position in the Y-axis direction, and the rotation angle. These errors are calculated by image processing of the image captured by board camera 15. These errors can also be calculated by image processing of the image captured by the inspection camera of visual inspection machine WM5.

[0034] The inspection results of the component states can be stored in various storage devices. In this embodiment, the inspection results of the component states are stored in the storage device DS0 shown in Figs. 1 and 3. The component mounting machine WM3 or the visual inspection machine WM5 can sequentially store the inspection results of the component states in the storage device DS0 when the inspection results of the component states are obtained. In addition, the component mounting machine WM3 or the visual inspection machine WM5 can also store the states of a predetermined number of components in the storage device DS0 when the inspection results of the states of a predetermined number of components are obtained. The calculation unit 71 can acquire past inspection results from the storage device DS0.

[0035] The to-be-inspected board 90p is not limited as long as it is a board 90 for which past inspection results of component states can be utilized. For example, a board 90 of the same type as the board 90 inspected for component states is included in the to-be-inspected board 90p. A board 90 of a different board type from the board 90 inspected for component states, but on which components 91 of the same type as the components 91 inspected for component states are mounted, is included in the to-be-inspected board 90p.

[0036] For example, the greater the number of errors or the greater the error occurrence rate of a component 91 whose component state exceeded the inspection threshold in a past inspection, the greater the possibility that an error will occur on the to-be-inspected board 90p, and the greater the need for inspection. Therefore, the calculation unit 71 may calculate a higher inspection priority for a component 91 whose component state exceeded the inspection threshold in a past inspection, the greater the number of errors or the greater the error occurrence rate. This allows the calculation unit 71 to increase the inspection priority of a component 91 that has a large number of errors or a large error occurrence rate and requires inspection. The error occurrence rate is calculated by dividing the number of errors by the number of times the component 91 was picked or placed.

[0037] Furthermore, the greater the degree of variation in the component states of a component 91 across multiple boards 90 inspected in past inspections, the greater the possibility that the degree of variation in the component states will also be greater on the board to be inspected 90p, and the greater the need to inspect the component. Therefore, it is preferable for the calculation unit 71 to calculate a higher inspection priority for a component 91 across multiple boards 90 inspected in past inspections. This allows the calculation unit 71 to increase the inspection priority of a component 91 that has a large degree of variation in the component states and requires inspection.

[0038] For example, the degree of variation in the component states is represented by at least one of the average of errors between the target positions and actual positions of the components 91 and the variance of the actual positions of the components 91. Specifically, the degree of variation in the holding states of the components 91 is represented by the average of errors between the target holding positions and the actual holding positions described above. For example, if the above errors for 100 boards 90 are represented by errors ME1 to ME100, the degree of variation in the holding states of the components 91 is calculated by adding up errors ME1 to ME100 and dividing the sum by the number of boards 90, 100.

[0039] The degree of variation in the holding state of the components 91 can also be expressed by the variance of the actual holding positions described above. For example, when the actual holding positions in the X-axis direction of 100 boards 90 are expressed as holding positions X1 to X100, the degree of variation in the holding state of the components 91 is calculated as the variance of holding positions X1 to X100. What has been described above about the holding positions in the X-axis direction also applies to the holding positions in the Y-axis direction and the rotation angle.

[0040] Similarly, the degree of variation in the mounting state of components 91 is represented by the average of the errors between the target mounting positions and the actual mounting positions described above. The degree of variation in the mounting state of components 91 can also be represented by the variance of the actual mounting positions described above. In this way, the degree of variation in the component states can be represented by various statistical information.

[0041] Furthermore, even if the same type of component 91 was inspected in a past inspection, the inspection results may differ depending on the equipment UM0 used from picking the component 91 to mounting it on the board 90, the operating conditions of the equipment UM0, etc. Also, it is preferable that the inspection priority be set to one with high convenience.

[0042] Therefore, it is preferable that the calculation unit 71 calculates the inspection priority by scoring the component status for at least each type of component 91 among the types of component 91, the usage conditions of the used device UM0, and the component status used from the time the component 91 was picked to the time the component was mounted on the board 90. This allows the guidance unit 72 to obtain an inspection priority that matches the usage conditions of the used device UM0, and the usage conditions of the used device UM0, and at least each type of component 91 among the types of component 91, improving the convenience of the inspection priority compared to a case where the component status is not scored.

[0043] The use equipment UM0 is not limited as long as it is equipment used from picking up the component 91 to mounting it on the board 90. For example, the feeder 121, the holding member 30, the mounting head 20, the component camera 14, and the like shown in FIG. 2 are included in the use equipment UM0. In addition, the position (slot position) at which the feeder 121 is set in the component supplying device 12, the feed speed of the carrier tape of the feeder 121, the moving speed of the mounting head 20, the imaging conditions of the component camera 14 (for example, the type of light source, the direction of light irradiation, the exposure time, and the aperture value), and the like are included in the use conditions of the use equipment UM0. In addition, the ambient temperature, humidity, and the like of the substrate-related operating machine WM0 are included in the use conditions of the use equipment UM0. In addition, the type, model, vendor (manufacturer), production lot, and the like of the component 91 are included in the type of the component 91.

[0044] FIG. 5 shows an example of calculation in which the inspection priority is calculated by scoring the component status for each type of used equipment UM0 and component 91. Used equipment UM1 and used equipment UM2 shown in the figure are included in used equipment UM0. Component types P1, P2, and P3 are included in the types of components 91. Parameter PM1 is the degree of variation in the mounting state of components 91, and indicates the average error between the target mounting position and the actual mounting position. Parameter PM2 is the degree of variation in the mounting state of components 91, and indicates the variance of the actual mounting positions. Parameter PM3 indicates the number of times an error has occurred.

[0045] For example, component 91 of component type P1 mounted on board 90 using equipment UM1 has a component state score for parameter PM1 of 2 points, a component state score for parameter PM2 of 4 points, and a component state score for parameter PM3 of 20 points. The total score is 26 points (total of 2 points, 4 points, and 20 points), indicating that the inspection priority of component 91 is 26 points. The above can be similarly applied to other combinations of equipment UM0 and component types.

[0046] The number of errors or the error occurrence rate in past inspections indicates the occurrence of errors in past inspections, and is of higher importance than the degree of variation in the component states in the inspected plurality of boards 90. Therefore, the calculation unit 71 may assign a higher weight to the number of errors or the error occurrence rate in which the component state exceeded the inspection threshold in the past inspection, compared to the degree of variation in the component states in the inspected plurality of boards 90 in past inspections, and score the component state. This allows the calculation unit 71 to calculate an inspection priority that places importance on the number of errors or the error occurrence rate in past inspections.

[0047] For example, the degree of variation in the part state can be assigned a score between 0 and 5 points depending on the magnitude of the degree of variation. That is, the greatest degree of variation in the part state can be assigned a score of 5, and the smallest degree of variation can be assigned a score of 0. In contrast, for example, the number of times an error occurs can be assigned a score of 10 for each error occurrence. As a result of this weighting, as shown in FIG. 5, for any combination of the equipment used UM0 and the part type, the part state score for parameter PM3 is higher than the part state scores for parameters PM1 and PM2.

[0048] Furthermore, errors that are expected to affect the picking and mounting of other components 91 have a higher importance than other errors. Therefore, the calculation unit 71 may assign a higher weight to the occurrence count or occurrence rate of errors that are expected to affect the picking and mounting of other components 91 among errors that caused the component state to exceed the inspection threshold in past inspections, compared to other errors, and score the component state. This allows the calculation unit 71 to calculate an inspection priority that places emphasis on errors that are expected to affect the picking and mounting of other components 91.

[0049] For example, the shorter the distance between adjacent mounting sites, the smaller the degree of variation in the component state needs to be. In other words, in the above-mentioned adjacent mounting sites, the degree of variation in the holding state of the component 91 at one mounting site may affect the mounting process of the component 91 at the other mounting site. Similarly, the degree of variation in the mounting state of the component 91 at one mounting site may affect the mounting process of the component 91 at the other mounting site.

[0050] In such a mounting site, if at least one of the holding position in the X-axis direction, the holding position in the Y-axis direction, and the rotation angle exceeds the inspection threshold, it is likely to affect the picking and mounting of other components 91. The above also applies to an error in the adjacent mounting site where at least one of the mounting position in the X-axis direction, the mounting position in the Y-axis direction, and the rotation angle exceeds the inspection threshold.

[0051] 1-3-2. Information section 72 The guidance unit 72 guides the inspection target components 91t that require inspection from among the multiple components 91 mounted on the board to be inspected 90p, based on the inspection priority calculated by the calculation unit 71 (step S12 shown in FIG. 4).

[0052] The guidance unit 72 can guide the component 91 with a higher component condition score as the component to be inspected 91t. In the example shown in FIG. 5, the component 91 of the component type P1 mounted on the board 90 using the equipment UM2 to be used has a total score indicating the inspection priority of 47 points, which is the highest total score. The component 91 of the component type P1 mounted on the board 90 using the equipment UM1 to be used has a total score indicating the inspection priority of 26 points, which is the second highest total score after the above-mentioned component 91. The component 91 of the component type P3 mounted on the board 90 using the equipment UM2 to be used has a total score indicating the inspection priority of 25 points, which is the second highest total score after the above-mentioned two components 91. The other combinations of the equipment UM0 to be used and the component types have total scores indicating the inspection priority of less than 20 points.

[0053] Therefore, for example, when guiding parts 91 having a total score of 20 or more, which indicates the inspection priority, as parts to be inspected 91t, the guidance unit 72 guides the above-mentioned three parts 91 as parts to be inspected 91t. Note that the inspection priority can be divided into a plurality of classes. In the example shown in FIG. 5, the inspection priority is divided into three classes. Specifically, parts 91 having a total score of 40 or more, which indicates the inspection priority, are shown as judgment result A. Parts 91 having a total score of 20 or more and less than 40 points, which indicates the inspection priority, are shown as judgment result B. Parts 91 having a total score of less than 20 points, which indicates the inspection priority, are shown as judgment result C.

[0054] Judgment result A indicates that the necessity of inspection is higher than judgment result B, and that inspection is necessary for the board to be inspected 90p. Judgment result B indicates that the necessity of inspection is lower than judgment result A, but that inspection is recommended. Judgment result C indicates that the necessity of inspection is lower than judgment result B, and that inspection is not necessary.

[0055] For example, the guide unit 72 can display a board image IM0 on which a component 91 is mounted on the display device 80, and can display the inspection target component 91t in the board image IM0 displayed on the display device 80 so that the inspection target component 91t can be distinguished from the other components 91. A known display device can be used as the display device 80. The display device 80 can be provided in the management device HC0, the line management device LC0, the substrate-related operation machine WM0, etc. As shown in Figs. 1 and 3, the display device 80 of this embodiment is provided in the management device HC0.

[0056] FIG. 6 shows a display example in which an inspection target component 91t is displayed in the board image IM0. The component 91a in the figure indicates the component 91 of the component type P1 to be mounted on the board to be inspected 90p using the equipment to be used UM1 shown in FIG. 5. Similarly, the component 91b indicates the component 91 of the component type P2 to be mounted on the board to be inspected 90p using the equipment to be used UM1 shown in FIG. 5. The component 91c indicates the component 91 of the component type P3 to be mounted on the board to be inspected 90p using the equipment to be used UM1 shown in FIG. 5. The component 91d indicates the component 91 of the component type P1 to be mounted on the board to be inspected 90p using the equipment to be used UM2 shown in FIG. 5. The component 91e indicates the component 91 of the component type P2 to be mounted on the board to be inspected 90p using the equipment to be used UM2 shown in FIG. 5. The component 91f indicates the component 91 of the component type P3 to be mounted on the board to be inspected 90p using the equipment to be used UM2 shown in FIG. 5.

[0057] 5, three components 91 (component 91a, component 91d, and component 91f) are components to be inspected 91t. Therefore, the guide unit 72 displays the above-mentioned three components 91 (component 91a, component 91d, and component 91f) which are components to be inspected 91t in a manner that makes them distinguishable from the other components 91 in the board image IM0 displayed on the display device 80. In the figure, for convenience of illustration, the components to be inspected 91t are shown by solid lines, and the other components 91 are shown by dashed lines.

[0058] The display method is not limited as long as the guidance unit 72 can display the inspection target part 91t in a manner that allows it to be distinguished from the other parts 91. For example, the guidance unit 72 can differentiate the display method of the inspection target part 91t from the other parts 91 by at least one of a difference in display color, the presence or absence of a marker, and a difference in an icon.

[0059] The guidance unit 72 can display the inspection target part 91t in a display color (e.g., yellow, red, etc.) that is more easily noticeable by the worker than the display colors of the other parts 91. The same goes for the markers and icons, and the guidance unit 72 can display the inspection target part 91t in a manner that makes it distinguishable from the other parts 91 in various forms, such as a display color, form, movement within the display screen, or blinking display, that is more easily noticeable by the worker.

[0060] In Fig. 6, an arrow MK0 equivalent to a marker is displayed for an inspection target part 91t. Moreover, the image of the part 91 displayed on the display device 80 corresponds to an icon. Furthermore, a figure FP0 is attached to the inspection target part 91t. The figure FP0 corresponds to the icon described above. In the example shown in the figure, an exclamation mark is used as the figure FP0 to visually call attention.

[0061] In FIG. 6, character information for identifying the inspection target part 91t and the other parts 91 is further displayed. The character information for identifying the inspection target part 91t is displayed larger than the character information for identifying the other parts 91. The guidance unit 72 can display the character information in the same manner as the markers and icons. The guidance unit 72 can also display the number of errors or the error occurrence rate in past inspections when the operator places the pointer on the inspection target part 91t. Similarly, the guidance unit 72 can display the degree of variation in the part state in past inspections when the operator places the pointer on the inspection target part 91t.

[0062] The guidance unit 72 can divide the inspection priority into a plurality of classes, and can guide the inspection target parts 91t belonging to a class equal to or higher than a predetermined class in such a manner that they can be identified by class. As described above, in the example shown in Fig. 5, the inspection priority is divided into three classes, and the classes to which the inspection target parts 91t belong are indicated by the judgment results A and B. The guidance unit 72 uses the method described above to differentiate between the display method of the inspection target parts 91t (part 91d) belonging to the class indicated by the judgment result A and the display method of the inspection target parts 91t (parts 91a and 91f) belonging to the class indicated by the judgment result B.

[0063] For example, the guiding unit 72 can display the inspection target parts 91t (parts 91d) belonging to the class indicated by the judgment result A in red, and display the inspection target parts 91t (parts 91a and 91f) belonging to the class indicated by the judgment result B in yellow. Furthermore, two exclamation marks are used for the graphic FP0 attached to the inspection target parts 91t (part 91d) belonging to the class indicated by the judgment result A, and one exclamation mark is used for the graphic FP0 attached to the inspection target parts 91t (parts 91a and 91f) belonging to the class indicated by the judgment result B.

[0064] The guiding unit 72 can also cause the display device 80 to display a list LD0 of multiple components 91 to be mounted on the board to be inspected 90p, and cause the inspection target component 91t to be displayed in a manner distinguishable from the other components 91 in the list display LD0 displayed on the display device 80. Fig. 7 shows an example of a display in which the inspection target component 91t is displayed in the list display LD0. In this figure, components 91a to 91f are displayed in a list. Components 91a to 91f correspond to components 91a to 91f already described in the board image IM0.

[0065] In this case, the guiding unit 72 displays the above-mentioned three components 91 (component 91a, component 91d, and component 91f) which are the inspection target components 91t in the list display LD0 displayed on the display device 80 so as to be distinguishable from the other components 91. In the figure, for convenience of illustration, the inspection target components 91t are shown in solid lines, and the other components 91 are shown in dashed lines. Furthermore, the guiding unit 72 can display the inspection target components 91t in a manner distinguishable from the other components 91 in the same manner as the display method described above in the board image IM0. Furthermore, the guiding unit 72 can divide the inspection priority into a plurality of classes, and guide the inspection target components 91t belonging to a class equal to or higher than a predetermined class so as to be distinguishable by class.

[0066] The guidance unit 72 can also provide guidance on the inspection threshold TH0 for inspecting the component state of the inspection target component 91t, based on the degree of variation in the component states of multiple boards 90 inspected in past inspections. As described above, for example, the degree of variation in the component state can be represented by at least one of the average of the errors between the target position and the actual position of the component 91, and the variance of the actual position of the component 91.

[0067] FIG. 8 shows an example of guidance for the inspection threshold TH0. In the example of guidance shown in the figure, the current inspection threshold TH0, candidates for the inspection threshold TH0, and a selection box for selecting data for changing the inspection threshold TH0 are displayed for the inspection data of the predetermined inspection target part 91t. For example, data 1 is the allowable range of the mounting position in the X-axis direction of the predetermined inspection target part 91t. The current inspection threshold TH0 has a lower limit value of the inspection threshold TH11 and an upper limit value of the inspection threshold TH12. Data 2 is the allowable range of the mounting position in the Y-axis direction of the predetermined inspection target part 91t. The current inspection threshold TH0 has a lower limit value of the inspection threshold TH21 and an upper limit value of the inspection threshold TH22. Data 3 is the allowable range of the rotation angle of the predetermined inspection target part 91t. The current inspection threshold TH0 has a lower limit value of the inspection threshold TH31 and an upper limit value of the inspection threshold TH32.

[0068] For example, the guidance unit 72 calculates the degree of variation in the component states of multiple boards 90 for inspection results in which no errors occurred (inspection results for non-defective products) among past inspection results for the inspection target components 91t. The guidance unit 72 provides candidates for the inspection threshold value TH0 based on the calculated degree of variation. For example, if the above errors for 100 non-defective boards 90 are represented by errors DE1 to DE100, the degree of variation in the mounting state of the components 91 is calculated by adding up the errors DE1 to DE100 and dividing the sum by the number of boards 90, 100.

[0069] The guidance unit 72 calculates the upper limit and lower limit of the candidates for the inspection threshold TH0 so that the average value of the upper limit and lower limit of the candidates for the inspection threshold TH0 matches the degree of variation in the wearing state. Furthermore, when the difference between the absolute value of the average value of the upper limit and lower limit of the current inspection threshold TH0 and the absolute value of the average value of the upper limit and lower limit of the candidates for the inspection threshold TH0 is equal to or greater than a predetermined value, the guidance unit 72 may guide the candidates for the inspection threshold TH0. In the figure, for example, candidates for the inspection threshold TH0 for data 1 are guided. The candidates for the inspection threshold TH0 have a lower limit of the inspection threshold TH13 and an upper limit of the inspection threshold TH14.

[0070] In this embodiment, the operator can select the examination data to be changed by selecting the selection box shown in the figure. When the operator selects examination data and selects the Change button, the guidance unit 72 permits the change process of the examination data selected by the operator. When no examination data is selected or the operator selects the Back button, the guidance unit 72 does not permit the change process.

[0071] The guidance unit 72 can also permit the change processing of the examination data selected by the worker when approval is received from a manager who determines whether or not the change of the examination data is appropriate. Conversely, the guidance unit 72 can also disallow the change processing of the examination data selected by the worker when approval is not received from the manager. In this case, the guidance unit 72 can display a message indicating that approval from the manager has not been received and the change processing will not be performed.

[0072] In this embodiment, the guidance unit 72 guides the parts to be inspected 91t when creating an inspection program. This makes it easier to create an inspection program. Furthermore, when an operator selects the parts to be inspected 91t, there is a possibility that the parts to be inspected 91t selected will vary depending on the operator's experience and knowledge. In this embodiment, the parts to be inspected 91t are guided by the guidance unit 72, so that the parts to be inspected 91t can be uniquely selected.

[0073] Furthermore, the guidance unit 72 guides the parts 91 with higher component condition scores as parts to be inspected 91t. This makes it easier to omit less-necessary inspections, and the inspection support device 70 can reduce the number of inspection targets and prevent increases in inspection time. Also, parts 91 with a high probability of being erroneously mounted are more likely to be set as parts to be inspected 91t, allowing the inspection device (component mounting machine WM3 or visual inspection machine WM5) to detect erroneous mounting at an early stage.

[0074] Furthermore, it becomes easy to change the inspection target in accordance with changes in the production situation by switching the inspection program at the timing of switching the production program used by the substrate-related performing machine WM0 when producing the substrate product 900. For example, the guidance unit 72 can guide the inspection target component 91t based on information associated with the production program after the switch (such as the equipment to be used in the substrate 90p to be inspected, the usage conditions of the equipment, and information on the component 91 to be mounted on the substrate 90p to be inspected).

[0075] 6 and 7, the guidance unit 72 guides three parts 91 (parts 91a, 91d, and 91f) that are parts 91t to be inspected, and an inspection program is created. The inspection program is switched to the above-created inspection program, and the inspection targets are changed to the above-mentioned three parts 91 (parts 91a, 91d, and 91f).

[0076] The inspection program creation device creates an inspection program (step S13 shown in FIG. 4). Once the inspection program is created, the substrate-related operation machine WM0 executes production processing including inspection processing to produce substrate product 900. At this time, the inspection device (component mounting machine WM3 or visual inspection machine WM5) acquires various information including the inspection results and stores them in the storage device DS0 (step S14 shown in FIG. 4).

[0077] For example, the above information includes the holding state of component 91 (position in the X-axis direction, position in the Y-axis direction, and rotation angle), the mounting state of component 91 (position in the X-axis direction, position in the Y-axis direction, and rotation angle), and whether or not an error has occurred in which the component state has exceeded the inspection threshold. The above information includes the equipment UM0 used, the usage conditions of the equipment UM0 used, and the type of component 91. The above information includes the number of times component 91 has been mounted, and whether or not a component 91 that has once experienced an error has been remounted. In this way, past inspection results are accumulated.

[0078] The guidance unit 72 can also guide the inspection target parts 91t at times other than when creating the inspection program. For example, the guidance unit 72 can also guide the inspection target parts 91t when checking the production results in the line management device LC0. This allows the worker to easily check the production results of the inspection target parts 91t. In this way, the guidance unit 72 can also guide the inspection target parts 91t after the board product 900 has been produced.

[0079] 1-3-3. Verification Section 73 The verification unit 73 verifies whether the guidance of the inspection target part 91t by the guiding unit 72 is appropriate, based on the inspection result of the inspection target part 91t guided by the guiding unit 72 (step S15 shown in FIG. 4).

[0080] For example, it is assumed that the result of inspecting the inspection target part 91t guided by the guiding unit 72 is that the number of errors or the error occurrence rate is greater than that of the part 91 (corresponding to a non-defective product) that was not guided by the guiding unit 72. In this case, the verification unit 73 verifies that the guidance of the inspection target part 91t by the guiding unit 72 was appropriate. Conversely, it is assumed that the result of inspecting the inspection target part 91t guided by the guiding unit 72 is that the number of errors or the error occurrence rate is equivalent to that of the part 91 (corresponding to a non-defective product) that was not guided by the guiding unit 72. In this case, the verification unit 73 verifies that the guidance of the inspection target part 91t by the guiding unit 72 was inappropriate. The above also applies to the degree of variation in the part states.

[0081] When the verification unit 73 verifies that the guidance of the inspection target part 91t by the guidance unit 72 was inappropriate, the verification unit 73 can adjust the weighting when scoring the part state so that the inspection priority of the inspection target part 91t is lowered, for example. This makes it more difficult for the inspection target part 91t to be selected as an inspection target.

[0082] Also, for example, assume that as a result of a separate inspection of a part 91 that was not guided by the guidance unit 72, the number of errors or the error occurrence rate is equivalent to that of a defective product (higher than that of a non-defective product). In this case, the verification unit 73 verifies that the guidance unit 72 has omitted guidance of the inspection target part 91t. For example, the verification unit 73 can adjust the weighting when converting the part state into a score so that the inspection priority of the part 91 is increased. This makes the part 91 more likely to be selected as an inspection target.

[0083] 2. Inspection support method What has already been described about the inspection support device 70 also applies to the inspection support method. Specifically, the inspection support method includes a calculation step and a guidance step. The calculation step corresponds to the control performed by the calculation unit 71. The guidance step corresponds to the control performed by the guidance unit 72. The inspection support method may also include a verification step. The verification step corresponds to the control performed by the verification unit 73.

[0084] 3. Examples of Effects of the Embodiments The inspection support device 70 includes a calculation unit 71 and a guidance unit 72. Therefore, the inspection support device 70 can guide the inspection target components 91t that require inspection from among the multiple components 91 mounted on the board to be inspected 90p, based on the inspection priority calculated by the calculation unit 71. What has been described above about the inspection support device 70 also applies to the inspection support method. [Explanation of symbols]

[0085] 70: inspection support device, 71: calculation unit, 72: guidance unit, 73: verification unit, 80: display device, 90: board, 90p: board to be inspected, 91: parts, 91t: Part to be inspected, UM0: Equipment used, IM0: Board image, LD0: List display, TH0: Test threshold.

Claims

1. a calculation unit that calculates inspection priorities of a plurality of components to be mounted on a board to be inspected in the future based on past inspection results of inspecting at least one of a holding state and a mounting state of the components to be mounted on the board; a guidance unit that guides an inspection target component that needs to be inspected from among the plurality of components mounted on the board to be inspected based on the inspection priority calculated by the calculation unit; and Equipped with the calculation unit is an inspection support device that calculates the inspection priority by assigning a higher weight to the number of errors or the occurrence rate of errors that caused the component condition to exceed an inspection threshold in a past inspection, compared to the degree of variation in the component condition on a plurality of the boards inspected in a past inspection, for at least each of the equipment used from picking the components to mounting them on the board, the operating conditions of the equipment used, and the types of the components, to score the component condition.

2. 2 . The inspection support device according to claim 1 , wherein the calculation unit calculates the inspection priority to be higher for a component having a greater number of occurrences of errors in which the component state exceeded the inspection threshold in past inspections or a greater occurrence rate of the errors.

3. 3 . The inspection support device according to claim 1 , wherein the calculation unit calculates the inspection priority to be higher for a component having a greater degree of variation in the component states on the plurality of boards inspected in past inspections.

4. 4. The inspection support device according to claim 3, wherein the degree of variation in the component state is represented by at least one of an average error between a target position and an actual position of the component and a variance of the actual position of the component.

5. The inspection support device according to any one of claims 1 to 4, wherein the calculation unit assigns a higher weight to the number of occurrences or the occurrence rate of errors that are expected to affect the picking and mounting of other parts, among errors that caused the part condition to exceed the inspection threshold in a past inspection, compared to other errors, to score the part condition.

6. 6. The inspection support device according to claim 1, wherein the guidance unit is configured to guide a part having a higher score in the part condition as the part to be inspected.

7. An inspection support device as described in any one of claims 1 to 6, wherein the guidance unit displays an image of a board on which the component is mounted on a display device, and displays the component to be inspected in a manner distinguishable from other components in the board image displayed on the display device.

8. The inspection support device according to any one of claims 1 to 7, wherein the guidance unit causes a display device to display a list of the multiple components to be mounted on the board to be inspected, and causes the components to be inspected to be displayed in a manner distinguishable from other components in the list displayed on the display device.

9. 9. The inspection support device according to claim 7, wherein the guidance section divides the inspection priority into a plurality of ranks and guides the inspection target parts that belong to a predetermined rank or higher in a manner that allows them to be identified by rank.

10. The inspection support device according to any one of claims 1 to 9, wherein the guidance unit provides guidance on an inspection threshold value for inspecting the component state of the inspection target component based on the degree of variation in the component state in a plurality of the boards inspected in past inspections.

11. The inspection support device according to any one of claims 1 to 10, further comprising a verification unit that verifies whether the guidance of the inspection target part by the guidance unit is appropriate based on an inspection result of the inspection target part guided by the guidance unit.

12. a calculation step of calculating an inspection priority of a plurality of components to be mounted on a board to be inspected in the future based on a past inspection result of inspecting at least one of a holding state and a mounting state of the components to be mounted on the board; a guidance step of guiding an inspection target component that needs to be inspected from among the plurality of components mounted on the board to be inspected based on the inspection priority calculated in the calculation step; Equipped with The calculation step is an inspection support method in which the component conditions are scored and the inspection priority is calculated by weighting higher the number of errors or the occurrence rate of errors that caused the component conditions to exceed an inspection threshold in a past inspection compared to the degree of variation in the component conditions on a plurality of the boards inspected in a past inspection, for at least each of the equipment used from picking the components to mounting them on the board, the operating conditions of the equipment used, and the types of the components.

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