Laminate, electronic component, and capacitor

Abstract

The present invention provides a multilayer body which has good water vapor barrier properties, while exhibiting excellent adhesion between a base material layer and a clay layer. A multilayer body 30 comprises a base material layer 33, a bonding layer 32 and a clay layer 31. The base material layer 33 contains a crystalline resin. The bonding layer 32 is arranged on one surface of the base material layer 33, while containing a resin that is different from the crystalline resin. The clay layer 31 is arranged on the one surface of the base material layer 33, with the bonding layer 32 being interposed therebetween. The adhesiveness exhibition temperature of the bonding layer 32 is 130°C or less.

Description

[Technical field]

[0001] The present disclosure relates to a laminate, an electronic component, and a capacitor, and more particularly to a laminate having a clay layer, and an electronic component and a capacitor including the laminate. [Background technology]

[0002] Patent Document 1 describes a method for producing a clay film. This method includes a first step of preparing a first clay material containing layers including octahedral sheets having an octahedral crystal structure mainly containing aluminum ions and / or magnesium ions and oxygen ions and / or hydroxide ions, and cations present between a plurality of the layers, a second step of obtaining a second clay material by substituting at least a portion of the cations with lithium ions, a third step of forming the second clay material into a film material, and a fourth step of subjecting the film material to a heat treatment to move at least a portion of the lithium ions from between the layers into the octahedral sheets.

[0003] Patent Document 2 describes a clay film composite. This clay film composite has a clay film composed of only clay or clay and an additive, and at least one side of the clay film has a water vapor permeability of 1.0 g / m 2 A water vapor barrier layer having a resistance of 0.1-day or less is provided, and the water vapor barrier layer and the clay film are fusion-bonded. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 4973856 [Patent Document 2] Patent No. 5563289 Summary of the Invention

[0005] An object of the present disclosure is to provide a laminate having good water vapor barrier properties and excellent adhesion between a substrate layer and a clay layer.

[0006] Another object of the present disclosure is to provide an electronic component and a capacitor using the laminate.

[0007] A laminate according to one embodiment of the present disclosure has a base layer, an adhesive layer, and a clay layer. The base layer contains a crystalline resin. The adhesive layer contains a resin different from the crystalline resin and is provided on one side of the base layer. The clay layer is provided on the one side of the base layer via the adhesive layer. The adhesive layer has a tackiness development temperature of 130° C. or lower.

[0008] An electronic component according to an aspect of the present disclosure includes an electronic component element and a barrier film covering at least a portion of a periphery of the electronic component element. The barrier film includes the laminate.

[0009] In a capacitor according to one aspect of the present disclosure, the electronic component element of the electronic component includes a capacitor element. [Brief description of the drawings]

[0010] [Figure 1] Fig. 1A is a cross-sectional view showing one embodiment of a laminate according to the present embodiment, Fig. 1B is a schematic perspective view showing an example of a mineral particle, and Fig. 1C is a schematic cross-sectional view showing an example of a clay layer. [Diagram 2] 2A to 2D are cross-sectional views showing an embodiment of the electronic component according to the present embodiment. [Diagram 3] 3A and 3B are cross-sectional views showing another embodiment of the electronic component according to the present embodiment. [Figure 4] Fig. 4A is a perspective view showing one step of a method for producing a wound capacitor element, and Fig. 4B is a perspective view of the wound capacitor element. [Diagram 5] Fig. 5A is a diagram (perspective view) showing one step of a method for manufacturing a multilayer capacitor element. Fig. 5B is a diagram (cross-sectional view) showing one step of a method for manufacturing a multilayer capacitor element. Fig. 5C is a partially cutaway perspective view of the multilayer capacitor element shown in Fig. 5B. Fig. 5D is a perspective view of the multilayer capacitor element. [Figure 6] FIG. 6 is a cross-sectional view showing a method for measuring the adhesiveness developing temperature. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] (1) Overview First, the process by which the laminate according to this embodiment was achieved will be described.

[0012] Clays such as smectite become clay films in which mineral particles are arranged in layers when left to dry, and exhibit high gas barrier properties. Therefore, clay films and clay film composites having clay layers have been proposed, as described in Patent Documents 1 and 2.

[0013] However, in Patent Document 1, heat treatment at about 350 to 500°C is required for several hours, which is a major limitation when using a film as a substrate. For example, polypropylene, which has a melting point around 160°C, cannot be used as a substrate in some cases. In addition, when a water-based binder is used as an additive, the properties may deteriorate due to the swelling of the binder under high temperature and high humidity conditions.

[0014] In addition, in Patent Document 2, the water vapor barrier layer, which is the base film, and the clay film are melt-bonded by thermocompression, but this requires thermocompression that exceeds the melting point of the base film, and the process is not simple. 2 Because the product uses base films with a production speed of 1000 sq. m or less, it was sometimes not possible to use cheaper, more versatile films.

[0015] Therefore, the laminate of this embodiment uses a base layer containing a crystalline resin with good water vapor barrier properties, thereby reducing the amount of water vapor that reaches the clay layer. This results in a laminate with good water vapor barrier properties. In addition, since the laminate of this embodiment has an adhesive layer between the base layer and the clay layer, the base layer and the clay layer can be bonded by a low-temperature process without melt-bonding them. This improves the adhesion between the base layer and the clay layer, and reduces the occurrence of abnormalities such as cracks in the clay layer.

[0016] (2) Details (2-1) Laminate As shown in FIG. 1A, the laminate 30 according to this embodiment has a base layer 33, an adhesive layer 32, and a clay layer 31. The base layer 33 contains a crystalline resin. The adhesive layer 32 contains a resin different from the crystalline resin contained in the base layer 33. The adhesive layer 32 is provided on one side (surface) of the base layer 33. The clay layer 31 is provided on one side of the base layer 33 via the adhesive layer 32. The laminate 30 has the form of, for example, a film, a sheet, or a plate.

[0017] <Base material layer> The base layer 33 contains a crystalline resin. Examples of resins used for the base layer 33 include polyethylene, polypropylene, polyethylene terephthalate, polyamide, fluororesin, acrylic resin, polyimide, polyethylene naphthalate, polymethylpentene, cycloolefin, polyarylate, polyether ether ketone, polyphenylene sulfide, syndiotactic polystyrene, and epoxy resin. The base layer 33 contains one or more of the above-mentioned crystalline resins. Among the above-mentioned crystalline resins, the base layer 33 preferably contains polypropylene, which has good water vapor barrier properties. Water vapor barrier properties refer to a property that makes it difficult for water vapor to pass through. For example, a polypropylene film has a water vapor permeability of 4 to 5 g / (m 2 d) and has good water vapor barrier properties.

[0018] The base layer 33 has a form such as a film, a sheet, a plate, etc. The thickness of the base layer 33 is appropriately set in consideration of electrical insulation properties, flexibility, etc., and is preferably several tens of μm, and more preferably 10 μm or more and 30 μm or less.

[0019] The base layer 33 is preferably a biaxially oriented polypropylene film, which can improve the water vapor barrier property more than the base layer 33 formed of a normal polypropylene film that is not biaxially oriented.

[0020] <Adhesive layer> The adhesive layer 32 is a layer for adhering the base layer 33 and the clay layer 31. The base layer 33 and the clay layer 31 are adhered to each other by the adhesive layer 32, and have excellent adhesion. Here, "excellent adhesion" means that the clay layer 31 does not peel off from the adhesive layer 32 and the base layer 33, as evaluated by a method (cross-cut method) conforming to JIS K 5600-5-6.

[0021] The adhesive layer 32 contains a resin different from the crystalline resin contained in the base layer 33. For example, when the crystalline resin contained in the base layer 33 is crystalline polypropylene, the adhesive layer 32 contains a resin other than crystalline polypropylene.

[0022] The adhesive layer 32 has a tackiness development temperature of 130° C. or less. The tackiness development temperature refers to the temperature at which the adhesive layer 32 develops tackiness. That is, the adhesive layer 32 develops tackiness by thermal melting, and when the tackiness is improved compared to before thermal melting, the temperature at which the adhesive layer 32 is thermally melted becomes the tackiness development temperature. Specifically, as shown in FIG. 6, a pair of test bodies having a base layer 33 and an adhesive layer 32 are sandwiched between a pair of hot plates H and heated at a predetermined temperature to thermocompress the adhesive layers 32 together. At this time, the pressure bonding force can be 0.3 MPa and the pressure bonding time can be 10 minutes. After this, when the bonded pair of test bodies are peeled off, if a finite peel strength is measured, it can be said that the heating temperature at the hot plates H is the tackiness development temperature. The method for peeling off the pair of test bodies can be a 180° peeling test in accordance with JIS Z 0237:2009. It is preferable that the tackiness development temperature of the adhesive layer 32 is lower than the thermal melting temperature of the base layer 33. This makes it possible to make the base layer 33 less likely to melt when heated to cause the adhesive layer 32 to become sticky. The lower limit of the adhesive layer 32's adhesiveness-producing temperature is not particularly set, but may be, for example, 80° C. or higher. For example, when the clay layer 31 is coated and mounted in a roll-to-roll process, if the adhesive layer 32 becomes sticky at the temperature in the process, there is a problem that the handleability is impaired.

[0023] In order to form an adhesive layer 32 having a tackiness developing temperature of 130° C. or less, the adhesive layer 32 contains a resin different from the crystalline resin contained in the base layer 33. A hot melt resin can be used as the resin different from the crystalline resin contained in the base layer 33. A hot melt resin is a resin that melts when heated and reversibly solidifies when the heat is removed. A hot melt resin with a low melting point is preferable. Examples of hot melt resins include EVA (ethylene vinyl acetate) resins, olefin resins, rubber resins, polyamide resins, nylon resins, polyurethane resins, and acrylic resins.

[0024] When the base layer 33 is formed of crystalline polypropylene, the adhesive layer 32 is preferably formed of an olefin resin that has a high affinity with crystalline polypropylene. As an olefin resin that has a high affinity with crystalline polypropylene, the adhesive layer 32 preferably contains an amorphous resin. When the base layer 33 is formed of crystalline polypropylene, the adhesive layer 32 is preferably formed of amorphous polypropylene that has a lower crystallinity than crystalline polypropylene. The amorphous polypropylene is a polypropylene that does not have a polar group and has many branches, or a polypropylene obtained by copolymerizing ethylene and butene. Amorphous polypropylene generally has a density of 0.855 g / cm 3 The following is the result.

[0025] In the case of polypropylene with low crystallinity and low melting point, the stability is low, so that polar groups (hydroxyl groups and carbonyl groups) are likely to be generated on the surface of the adhesive layer 32 during corona treatment. Therefore, when forming the clay layer 31, the wettability is improved when applying a treatment liquid containing clay, and the adhesion between the clay layer 31 and the adhesive layer 32 is improved.

[0026] The adhesive layer 32 preferably contains a resin having a polar group. As the resin having a polar group, modified polyolefin can be used, and for example, the modified polyolefin may be a modified polyolefin having modified polypropylene as the maximum content component. As the modified polyolefin, acid-modified polyolefin can be used. The acid-modified polyolefin is a polyolefin modified with an acid and its anhydride, and examples of the acid include maleic acid, maleic anhydride, fumaric acid, citraconic acid, citraconic anhydride, mesaconic acid, crotonic acid, itaconic acid, itaconic anhydride, aconitic acid, and aconitic anhydride. As the acid-modified polyolefin, a carboxylic acid anhydride-modified polyolefin can be used, and examples thereof include maleic anhydride-modified polyolefin, acrylic acid-modified polyolefin, and imine-modified polyolefin. In the case of modified polyolefin, even if the crystallinity is high, a polar group will be present due to the modification. Therefore, when forming the clay layer 31, the wettability when applying a treatment liquid containing clay is improved, and the adhesion between the clay layer 31 and the adhesive layer 32 is improved.

[0027] In this manner, since the laminate 30 according to this embodiment has the adhesive layer 32 as described above, the clay layer 31 has high adhesion to the adhesive layer 32 and the base layer 33 even without heat welding the clay layer 31 and the base layer 33. In particular, when the adhesive layer 32 is heated to a temperature equal to or higher than the adhesiveness developing temperature when forming the clay layer 31, the adhesion between the clay layer 31 and the adhesive layer 32 is further improved, and the clay layer 31 is less likely to fall off or break.

[0028] The thickness of the adhesive layer 32 is not particularly limited, but in consideration of performance such as adhesive strength, adhesion, and ease of formation, it is preferably 5 μm or less, and more preferably 1 μm or less.

[0029] <Clay layer> The clay layer 31 is formed in a layer shape containing clay. In the present disclosure, clay is an aggregate of a plurality of mineral particles 311. The clay may contain a small amount of water in the aggregate of a plurality of mineral particles 311. The mineral particles 311 contain one or more types selected from the group consisting of mica, vermiculite, montmorillonite, ferromontmorillonite, beidellite, saponite, hectorite, stevensite, and nontronite. Among these, it is preferable that the mineral particles 311 contain montmorillonite, which is a highly moisture-resistant clay material.

[0030] The crystal structure of montmorillonite is a single layer structure in which an octahedral structure with Al (aluminum atom) at its center is sandwiched between tetrahedral structures with Si (silicon atom) at its center. Specifically, some of the trivalent Al is replaced by divalent Mg or Fe, and the single layer is negatively charged. For this reason, Na + Or Ca 2+ The hydrates of cations such as the above are present in the crystal structure. When montmorillonite is dispersed in water, the hydration of the cations progresses, and the montmorillonite is easily separated into single layers. Therefore, when montmorillonite is dispersed in water, it is easy to separate into single layers. Therefore, montmorillonite is easily contained in the clay layer 31 in a state of being separated into single layers, and a labyrinth structure composed of mineral particles 311 is easily formed in the clay layer 31.

[0031] Montmorillonite has exchangeable cations between layers that can easily exchange with other inorganic or organic cations. This allows it to have affinity with organic solvents and to intercalate various compounds between the layers. In addition, the crystal end faces have hydroxyl groups, allowing them to be decorated with various silylating agents. To obtain high moisture resistance for the clay layer 31, it is preferable to make the clay layer 31 hydrophobic. For example, the exchangeable cations (Na + (e.g., cations with high affinity for water) have a high affinity for water, and if they are present between layers, they tend to be detrimental to the hydrophobicity of the clay layer 31. Therefore, it is considered to replace the exchangeable cations with Li and protons. For example, when montmorillonite is heat-treated, ions move to the inside and surface of the crystals, and the clay layer 31 tends to be hydrophobic.

[0032] FIG. 1B shows a schematic perspective view of one mineral particle 311. In this embodiment, the mineral particle 311 is a plate-like or flake-like particle. That is, the mineral particle 311 is a particle having a shape in which the thickness a is smaller than the width b. Here, the width b is the dimension of the longest part of the mineral particle 311 when the mineral particle 311 is viewed from the front (viewed directly in the thickness direction). If the mineral particle 311 is, for example, a disk, the diameter is the width b. The thickness a is the dimension in the direction perpendicular to the width b, and is the dimension between two opposing faces of the mineral particle 311.

[0033] In this embodiment, the mineral particle 311 has a high aspect ratio. That is, the aspect ratio defined as width b / thickness a is high. The aspect ratio is obtained by measuring the thickness a and width b of the mineral particle 311. The thickness a is measured, for example, by a transmission electron microscope (TEM). However, since the thickness of a single layer of the mineral particle 311 is almost uniform for each type, it is not necessary to measure a large number of mineral particles 311. For example, in the case of montmorillonite, the thickness a is about 1 nm. The width b is measured, for example, by an atomic force microscope (AFM). The longest dimension is estimated as the width b by observing a flat portion of the mineral particle 311.

[0034] FIG. 1C shows a schematic cross-sectional view of the clay layer 31. The clay layer 31 contains mineral particles 311 and a binder 312. That is, the clay layer 31 may be composed of the mineral particles 311 and the binder 312, or may contain the mineral particles 311, the binder 312, and other additives. The binder 312 includes one or more selected from the group consisting of polyethylene, polypropylene, polyethylene sulfide, polyimide, polyamide, polyethylene terephthalate, epoxy resin, fluororesin, polyester resin, polyurethane resin, acrylic resin, phenoxy resin, polyacetal, and polyvinyl alcohol. The binder 312 may also be a binder resin that can be used as a paint or a varnish for a slurry. Among these, the binder 312 is preferably a polyamide, polyimide, polyurethane resin, epoxy resin, or phenoxy resin, taking into consideration the ease of forming the clay layer 31 and the adhesion to the mineral particles 311. A suitable hardener (crosslinking agent) may also be used for the above resin. In this case, the binder 312 is formed of a cross-linked resin, and the moisture resistance of the clay layer 31 may be improved.

[0035] The clay layer 31 is formed by dispersing a plurality of mineral particles 311 in a binder 312. The mineral particles 311 are dispersed in a state in which their thickness direction is almost the same as the thickness direction of the clay layer 31. There are gaps between the plurality of mineral particles 311 adjacent to each other in the thickness direction, and the binder 312 is filled in the gaps. There are also gaps between the plurality of mineral particles 311 adjacent to each other in a direction perpendicular to the thickness direction, and the binder 312 is filled in the gaps. In this way, the clay layer 31 has a maze-like structure (maze structure) in which the spaces between the plurality of mineral particles 311 are formed as passages. That is, in the clay layer 31, the plurality of mineral particles 311 are dispersed in a state in which they are positioned almost randomly in the width direction while their thickness direction is the same as the thickness direction of the clay layer 31, so that the spaces between the adjacent mineral particles 311 are formed like zigzag passages. Therefore, when moisture W passes through the clay layer 31 in the thickness direction, it cannot move linearly, but must move in a zigzag manner between adjacent mineral particles 311 (see dotted lines in FIG. 1C). Therefore, moisture W is less likely to pass through the clay layer 31 than through a resin layer that does not contain mineral particles (a layer containing only a binder), and the moisture resistance of the capacitor 10 can be ensured even if the thickness of the laminate 30 is made thin. For example, even if the clay layer 31 is a clay layer having a thickness of several μm to several tens of μm, a capacitor 10 having moisture resistance equivalent to that of a 2 mm thick resin layer containing only epoxy resin can be obtained. Therefore, the capacitor 10 of this embodiment may have moisture resistance 1000 times or more higher than that of a laminate containing only resin.

[0036] The theoretical formula for the labyrinth structure of the clay layer 31 is given by the following formula (1).

[0037] P / P0=(1-Φ) / (1+0.5AΦ) …(1) In the above formula (1), "P / P0" represents the relative permeability. "Φ" represents the volume fraction of the mineral particles 311 in the clay layer 31. A represents the aspect ratio of the mineral particles 311.

[0038] The smaller the value of "P / P0" is, the more difficult it is for moisture to pass through the clay layer 31, and the larger the value is, the more easily moisture passes through it. Therefore, in formula (1), the larger the value of Φ is, the more difficult it is for moisture to pass through the clay layer 31, and the smaller the value of Φ is, the more easily moisture passes through the clay layer 31. Also, in formula (1), the larger the value of A is, the more difficult it is for moisture to pass through the clay layer 31, and the smaller the value of A is, the more easily moisture passes through the clay layer 31. Therefore, in order to obtain a laminate 30 through which moisture does not easily pass in order to improve the moisture resistance of the capacitor 10, it is preferable to increase the volume fraction of the mineral particles 311 in the clay layer 31, and it is also preferable to increase the content of mineral particles 311 with a high aspect ratio.

[0039] The aspect ratio of the mineral particles 311 is preferably 20 or more. In order to obtain a clay layer 31 that is difficult for moisture to pass through, it is preferable to use mineral particles 311 with a higher aspect ratio, but the above range is preferable when other performance properties of the clay layer 31, such as the strength, adhesion, and ease of formation of the clay layer 31, are also taken into consideration. The aspect ratio of the mineral particles 311 is more preferably 100 or more, and even more preferably 150 or more. There is no particular upper limit set for the aspect ratio of the mineral particles 311, and it is set appropriately taking into consideration the dispersibility of the mineral particles 311 in the clay layer 31, etc.

[0040] Furthermore, a combination of a high aspect ratio material and a low aspect ratio material may be used for the mineral particles 311. In this case, the low aspect ratio material (small diameter mineral grains) can easily enter between the high aspect ratio materials, improving the packing rate of the mineral particles 311 in the clay layer 31. When using a combination of a high aspect ratio material and a low aspect ratio material, it is preferable that at least half or more of the total amount of the mineral particles 311 contained in the clay layer 31 is made up of the high aspect ratio material.

[0041] It is preferable that the content of the mineral particles 311 in the clay layer 31 is 50 mass% or more with respect to the total amount. For example, when the clay layer 31 is composed of the mineral particles 311 and the binder 312, it is preferable that the content of the mineral particles 311 is 50 mass% or more and 95 mass% or less with respect to the total amount of the clay layer 31, and the content of the binder 312 is 5 mass% or more and 50 mass% or less with respect to the total amount of the clay layer 31. This makes it easier to obtain a clay layer 31 that is difficult for moisture to pass through while ensuring the performance of the clay layer 31, such as strength, adhesion, and ease of formation.

[0042] The thickness of the clay layer 31 is preferably 0.5 μm or more and 5 μm or less. In order to reduce the amount of moisture permeating through the clay layer 31, the thicker the clay layer 31, the more preferable, but in consideration of the performance of the clay layer 31 such as strength, adhesion, and ease of formation, the above range is preferable. The thickness of the clay layer 31 is more preferably 1.0 μm or more and 3 μm or less.

[0043] In addition, the clay layer 31 not only has low moisture permeability but also low gas permeability, so that the laminate 30 can easily ensure gas barrier properties.

[0044] <Manufacture of Laminate> The laminate 30 is produced by forming an adhesive layer 32 on the surface of a base layer 33 and forming a clay layer 31 on the surface of the adhesive layer 32 .

[0045] The adhesive layer 32 is obtained by supplying a treatment liquid containing the resin constituting the adhesive layer 32 onto the surface of the base layer 33, and drying the treatment liquid on the surface of the base layer 33. In the treatment liquid, the resin constituting the adhesive layer 32 is dispersed or dissolved in a solvent. As the solvent, water, an organic solvent, or a mixed solvent thereof can be used, but the solvent is preferably water from the viewpoint of ease of handling, such as waste liquid treatment.

[0046] When supplying the treatment liquid onto the surface of the base layer 33, a coating method such as gravure coating, roll coater, die coater, brush coating, spraying, dipping, etc., and an immersion method can be used. In this case, even if the surface of the base layer 33 is uneven, the treatment liquid can be easily supplied accordingly, and the adhesive layer 32 can be easily formed. When drying the treatment liquid, natural drying, heat drying, etc. can be used.

[0047] The clay layer 31 is obtained by supplying a treatment liquid containing mineral particles 311 and a binder 312 onto the surface of the adhesive layer 32 and drying the treatment liquid on the surface of the adhesive layer 32. In the treatment liquid, the mineral particles 311 and the binder 312 are dispersed in a solvent. As the solvent, water, an organic solvent, or a mixture of these can be used, but from the viewpoint of ease of handling in waste liquid treatment, etc., the solvent is preferably water.

[0048] When supplying the treatment liquid onto the surface of the adhesive layer 32, a coating method such as brush painting or spray painting, or an immersion method such as dipping can be used. In this case, even if the surface of the adhesive layer 32 is uneven, the treatment liquid can be easily supplied accordingly, and the clay layer 31 can be easily formed. When drying the treatment liquid, natural drying, heat drying, or the like can be used.

[0049] According to the manufacturing method as described above, it is possible to mount the clay layer 31 that can exhibit high moisture resistance even if it is a thin film (several to several tens of μm), and it is possible to ensure the moisture resistance of the laminate 30.

[0050] After forming the adhesive layer 32 on the base layer 33, it is preferable to perform a corona treatment on the adhesive layer 32 before forming the clay layer 31. As a result, polar groups (hydrophilic functional groups) are formed on the surface of the adhesive layer 32, improving the adhesion between the adhesive layer 32 and the clay layer 31. The corona treatment is performed by generating a corona discharge in the air. The corona discharge dissociates oxygen molecules into oxygen ions and oxygen radicals. The oxygen ions and oxygen radicals chemically react on the surface of the adhesive layer 32, and as a result, hydrophilic functional groups are generated on the surface of the adhesive layer 32. Examples of hydrophilic functional groups include a carbonyl group and a hydroxyl group.

[0051] The laminate 30 preferably has an aluminum layer or a polyvinyl alcohol layer on the other surface. The other surface is the surface on which the adhesive layer 32 and the clay layer 31 are not provided, among the two surfaces arranged in the thickness direction of the base layer 33. In other words, the laminate 30 preferably has an aluminum layer or a polyvinyl alcohol layer on the surface opposite to the surface on which the adhesive layer 32 and the clay layer 31 are provided of the base layer 33. This further reduces the moisture permeability of the laminate 30.

[0052] (2-2) Electronic Components 2A to 2D, the electronic component 1 according to this embodiment includes an electronic component element 2 and a barrier film. The barrier film includes the laminate 30. That is, the laminate 30 having the base layer 33, the adhesive layer 32, and the clay layer 31 is used as the barrier film.

[0053] The electronic component element 2 is a part or portion that enables the electronic component 1 to exhibit the intended function. The electronic component element 2 has external electrodes 24 on both ends.

[0054] The laminate 30 has a function of protecting the electronic component element 2. The laminate 30 has a function of protecting the electronic component element 2 from moisture. The laminate 30 may also have a function of protecting the electronic component element 2 from heat, light, electromagnetic waves, impact, chemicals, and the like. The laminate 30 covers at least a portion of the periphery of the electronic component element 2. The laminate 30 is formed so as to cover the entire electronic component element 2 except for the portion of the external electrode 24, for example. The laminate 30 can be provided in contact with the surface of the electronic component element 2.

[0055] The laminate 30 is preferably arranged with the clay layer 31 facing the electronic component element 2. That is, the laminate 30 preferably covers the periphery of the electronic component element 2 such that the clay layer 31 is located on the inside (towards the electronic component element 2) when viewed from the position of the base layer 33. In the laminate 30, the clay layer 31 has a higher adhesion to the electronic component element 2 than the base layer 33. Therefore, by arranging the laminate 30 with the clay layer 31 facing the electronic component element 2, the clay layer 31 and the electronic component element 2 are more likely to adhere to each other, and the infiltration of moisture into the electronic component element 2 is more likely to be reduced.

[0056] The electronic component 1 according to this embodiment may further include an exterior resin layer 4 that covers the electronic component element 2 and the laminate 30. The exterior resin layer 4 has a function of protecting the electronic component element 2 and the laminate 30 from moisture. The exterior resin layer 4 may also have a function of protecting the electronic component element 2 and the laminate 30 from heat, light, electromagnetic waves, impact, chemicals, and the like. The exterior resin layer 4 is formed of one or both of a case (container) and a molded resin.

[0057] The electronic component 1 according to this embodiment may further include a bus bar 6. The bus bar 6 is a terminal that electrically connects the electronic component 1 to a circuit board or the like. One end (base end) of the bus bar 6 is electrically and mechanically connected to an external electrode 24 of the electronic component element 2. The other end (tip end) of the bus bar 6 is located outside the exterior resin layer 4. The bus bar 6 is made of, for example, copper or a copper alloy and formed in a plate shape. The electronic component 1 according to this embodiment includes a pair of bus bars 6, and the tip end of each bus bar 6 protrudes outward (for example, upward) from the same surface (for example, the upper surface) of the exterior resin layer 4, but is not limited to such a shape and structure.

[0058] In the electronic component 1 according to this embodiment, the laminate 30 covering the electronic component element 2 has a clay layer 31 containing clay, so the amount of moisture passing through the laminate 30 is more likely to be reduced than a resin layer of the same thickness formed of resin alone. Therefore, less moisture reaches the electronic component element 2 from the outside of the electronic component 1, and moisture is less likely to act on the electronic component element 2, making it easier to obtain an electronic component 1 with excellent moisture resistance. In addition, the clay layer 31 can be formed on the surface of the base layer 33 by a simple means such as coating, so the manufacturing process of the electronic component 1 is less complicated and costs can be easily reduced.

[0059] (2-3) Capacitor Hereinafter, a case will be described in which the electronic component 1 is a capacitor 10. The electronic component 1, which is a capacitor 10, includes a capacitor element 20 as an electronic component element 2. In other words, the electronic component element 2 in the capacitor 10 is the capacitor element 20.

[0060] As the capacitor element 20, various capacitor elements are used depending on the type of the capacitor 10. In this embodiment, examples of the capacitor 10 include a film capacitor, a ceramic capacitor, and an electrolytic capacitor. Among these, the capacitor 10 is preferably a film capacitor, and among film capacitors, it is preferable to use a wound type capacitor element 20. In this case, the laminate 30 can be wound around the capacitor element 20 using the same device and procedure as in the manufacture of the wound type capacitor element 20, and the capacitor element 20 wound with the laminate 30 can be easily manufactured. The capacitor element 20 may be a laminate type film capacitor.

[0061] The capacitor element 20 has an external electrode 24 at each of both ends in the axial direction. The external electrode 24 is preferably formed by spraying a metal material. The external electrode 24 preferably contains 50% by weight or more of tin. This type of external electrode 24 is usually formed by spraying zinc, but the external electrode 24 made of zinc is likely to be porous, and moisture may penetrate through the porous material. Therefore, in this embodiment, the tin content of the external electrode 24 is increased, which makes the metal structure constituting the external electrode 24 dense, making it difficult for moisture to pass through the external electrode 24 and reducing the penetration of moisture into the capacitor element 20. Furthermore, when the tin content of the external electrode 24 is increased, the metal structure constituting the external electrode 24 becomes dense, which increases the adhesion between the laminate 30 and the external electrode 24, and further reduces the penetration of moisture into the capacitor element 20. The tin content of the external electrode 24 may be in the range of 50% by weight to 100% by weight.

[0062] The laminate 30 is a barrier film. That is, the laminate 30 has a function of protecting the capacitor element 20 from moisture. The laminate 30 may also have a function of protecting the capacitor element 20 from heat, light, electromagnetic waves, impact, chemicals, and the like.

[0063] As shown in FIG. 2A to FIG. 2D, the laminate 30 covers at least a part of the periphery of the capacitor element 20. The periphery of the capacitor element 20 means the circumference of the capacitor element 20 when the opposing direction of the pair of external electrodes 24 is taken as the axis. When the capacitor element 20 is substantially cylindrical, the laminate 30 is disposed so as to face the circumferential surface of the capacitor element 20. Therefore, the laminate 30 is formed so as to cover the entire capacitor element 20 except for the portion of the external electrodes 24. That is, the capacitor element 20 is almost entirely covered and protected by the laminate 30 except for the portion of the external electrodes 24. This makes it difficult for moisture to penetrate the capacitor element 20 from all around, improving the moisture resistance of the capacitor 10. In particular, since the circumferential surface (surface around the axis) of the capacitor element 20 often has a larger area than the end surface (surface in the axial direction), it is preferable to provide the laminate 30 so as to surround at least the circumferential surface of the capacitor element 20. As described above, the laminate 30 is provided so as to cover at least a portion of the periphery of the capacitor element 20, where "at least a portion" preferably means, for example, 80% or more of the surface area of ​​the outer face of the capacitor element 20 excluding the external electrodes 24.

[0064] The laminate 30 is preferably arranged to form a plurality of layers around the capacitor element 20. In other words, a plurality of laminates 30 are preferably arranged around the capacitor element 20 in a state where they are stacked in the thickness direction. In this case, a plurality of clay layers 31 are stacked, and the moisture resistance of the capacitor 10 is improved compared to a single clay layer 31. Even if the clay layer 31 has defects such as pinholes, the defects can be covered by the overlapping other clay layers 31, and the moisture resistance of the capacitor 10 is less likely to be impaired.

[0065] The exterior resin layer 4 covers at least a part of the capacitor element 20 and the laminate 30. The exterior resin layer 4 preferably covers the entire capacitor element 20 and the laminate 30, and in this case, the entire capacitor element 20 and the laminate 30 are sealed with the exterior resin layer 4. The clay layer 31 and the exterior resin layer 4 are laminated. That is, the clay layer 31 and the exterior resin layer 4 are arranged opposite to each other in the thickness direction of the laminate 30. The thickness of the exterior resin layer 4 is preferably larger than that of the clay layer 31. This makes it easier to protect the clay layer 31, which is thin and easily cracked, with the exterior resin layer 4. The thickness of the exterior resin layer 4 is preferably 1 mm or more and 6 mm or less. This makes it easier for the moisture permeability of the clay layer 31 to decrease not only in the clay layer 31 but also in the exterior resin layer 4, improving the moisture resistance of the capacitor 10. The thickness of the exterior resin layer 4 is more preferably 1 mm or more and 4.5 mm or less, and even more preferably 1 mm or more and 3 mm or less.

[0066] Examples of the resin contained in the exterior resin layer 4 include epoxy resin, unsaturated polyester resin, and polyimide resin, but epoxy resin is preferred in consideration of formability when covering the capacitor element 20. The exterior resin layer 4 may be formed only from a resin, but may also be formed from a composite material containing a resin and a filler. In this case, for example, silica can be used as the filler, and the content of the filler relative to the total amount of the exterior resin layer 4 should be 1 mass% or more and 99% or less. mass % or less.

[0067] Fig. 3A shows a capacitor 10 in which the position of the laminate 30 is different from that in Fig. 2A. This capacitor 10 includes a laminate 30 and an exterior resin layer 4, but the laminate 30 does not contact the surface of the capacitor element 20 and is provided so as to cover the periphery of the exterior resin layer 4. In this case, the exterior resin layer 4 is located between the capacitor element 20 and the laminate 30. Therefore, the exterior resin layer 4 is located closer to the electronic component element 2 (capacitor element 20) than the laminate 30. The laminate 30 is in contact with the surface of the exterior resin layer 4.

[0068] In this capacitor 10, capacitor element 20 is covered with laminate 30 via exterior resin layer 4, and laminate 30 makes it difficult for moisture to reach capacitor element 20, reducing the moisture absorption of capacitor element 20 and improving the moisture resistance of capacitor 10.

[0069] Fig. 3B shows a capacitor 10 in which the position of the laminate 30 is different from that in Figs. 2A and 3A. This capacitor 10 has a laminate 30 on both the surface of the capacitor element 20 and the surface of the exterior resin layer 4. That is, the laminate 30 has a first laminate 30a arranged in contact with the surface of the capacitor element 20, and a second laminate 30b arranged in contact with the surface of the exterior resin layer 4. Therefore, the exterior resin layer 4 is provided between the first laminate 30a and the second laminate 30b.

[0070] In this capacitor 10, capacitor element 20 is covered with first laminate 30a, second laminate 30b, and exterior resin layer 4, and the two laminates 30 make it difficult for moisture to reach capacitor element 20, further reducing the moisture absorption of capacitor element 20 and improving the moisture resistance of capacitor 10.

[0071] (2-4) Manufacturing method for electronic components (capacitors) The method for manufacturing the electronic component 1 includes a step of forming the electronic component element 2, and a step of winding the laminate 30 at least partially around the electronic component element 2. When the electronic component 1 is a capacitor 10, the method for manufacturing the capacitor 10 includes a step of forming the capacitor element 20, and a step of winding the laminate 30 at least partially around the capacitor element 20. The method for manufacturing the electronic component 1 or capacitor 10 according to this embodiment may further include a step of covering the capacitor element 20 with an exterior resin layer 4.

[0072] The manufacture of wound capacitor element 7, which is capacitor element 20, includes the steps of winding metallized films 71, 72 to form wound body 73, winding laminate 30 at least partially around wound body 73, and spraying a metal material onto both ends of wound body 73 formed by winding laminate 30 to form external electrodes 24. Specifically, wound capacitor element 7 can be manufactured as follows.

[0073] First, first metallized film 71 and second metallized film 72 are prepared (see FIG. 4A). First metallized film 71 has first dielectric film 701 and first conductive layer 711. First dielectric film 701 is an elongated object. First conductive layer 711 is formed on one side of first dielectric film 701, except for first margin portion 721. First margin portion 721 is an exposed portion of first dielectric film 701, and is formed in a strip shape narrower than first conductive layer 711 along one long side of first dielectric film 701.

[0074] Second metallized film 72 is formed in the same manner as first metallized film 71. That is, second metallized film 72 has second dielectric film 702 and second conductive layer 712. Second dielectric film 702 is an elongated object having the same width as first dielectric film 701. Second conductive layer 712 is formed on one side of second dielectric film 702, except for second margin portion 722. Second margin portion 722 is a portion where second dielectric film 702 is exposed, and is formed in a strip shape narrower than second conductive layer 712 along one long side of second dielectric film 702.

[0075] The first dielectric film 701 and the second dielectric film 702 are made of the same type of resin as the base layer 33 of the laminate 30. For example, the first dielectric film 701 and the second dielectric film 702 are made of polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyphenyl sulfide, polystyrene, or the like. The first conductive layer 711 and the second conductive layer 712 are formed by a method such as a vapor deposition method or a sputtering method. The first conductive layer 711 and the second conductive layer 712 are made of, for example, aluminum, zinc, magnesium, or the like.

[0076] Next, as shown in FIG. 4A, first metallized film 71 and second metallized film 72 are overlapped with their two long sides aligned. At this time, first dielectric film 701 or second dielectric film 702 is interposed between first conductive layer 711 and second conductive layer 712. Furthermore, the long side on which first margin portion 721 is formed and the long side on which second margin portion 722 is formed are reversed. By winding first metallized film 71 and second metallized film 72 in an overlapped state in this manner, cylindrical wound body 73 can be obtained. Next, laminate 30 is wound around the outer periphery of wound body 73 to cover wound body 73 with laminate 30. At this time, laminate 30 may be wound only once (one turn) or multiple times. Next, the sides of wound body 73 are pressed from both sides to process wound body 73 with an oval cross section (see FIG. 4B). By flattening in this manner, space can be saved. In this manner, the element body 2 a made of the wound body 73 can be covered with the laminate 30 .

[0077] Next, a first external electrode 21 and a second external electrode 22 are formed as external electrodes 24 on both ends of the wound body 73 by metallicon (metal spraying method), thereby obtaining a wound type capacitor element 7. The first external electrode 21 is electrically connected to a first conductive layer 711 (first internal electrode). The second external electrode 22 is electrically connected to a second conductive layer 712 (second internal electrode). The first conductive layer 711 and the second conductive layer 712 form a pair of internal electrodes. The first external electrode 21 and the second external electrode 22 are formed of, for example, tin, zinc, or a metal material containing these as main components.

[0078] 4B, the first bus bar 61 is electrically connected to the first external electrode 21, and the second bus bar 62 is electrically connected to the second external electrode 22. Examples of the connection method include solder welding, resistance welding, ultrasonic welding, etc. The first bus bar 61 and the second bus bar 62 are formed into a plate shape from, for example, copper or a copper alloy.

[0079] In the case of wound capacitor element 7, following the step of winding metallized films 71, 72, laminate 30 is wound around wound body 73, making the process rational and simple. Furthermore, if it is necessary to remove metal chips attached to areas other than the locations where external electrodes 24 are formed (for example, the periphery of capacitor element 20) after the step of spraying a metal material, since base layer 33 of laminate 30 is wound around capacitor element 20 so as to be positioned at the outermost position, metal chips attached to base layer 33 can be easily removed. Such metal chip removal is performed by scrubbing polishing or the like.

[0080] On the other hand, stacked capacitor element 8, which is capacitor element 20, can be manufactured, for example, as follows: First, first metallized film 81 and second metallized film 82 are prepared (see FIG. 5A).

[0081] First metallized film 81 has first dielectric film 801 and first conductive layer 811. First dielectric film 801 is rectangular. First conductive layer 811 is formed on one side of first dielectric film 801, except for first margin portion 821. First margin portion 821 is formed in a strip shape narrower than first conductive layer 811 along one side of first dielectric film 801.

[0082] Second metallized film 82 is formed in the same manner as first metallized film 81. That is, second metallized film 82 has second dielectric film 802 and second conductive layer 812. Second dielectric film 802 has a rectangular shape of the same size as first dielectric film 801. Second conductive layer 812 is formed on one side of second dielectric film 802, except for second margin portion 822. Second margin portion 822 is formed in a strip shape narrower than second conductive layer 812 along one side of second dielectric film 802.

[0083] The first dielectric film 801 and the second dielectric film 802 are made of the same type of resin as the base layer 33 of the laminate 30. For example, the first dielectric film 801 and the second dielectric film 802 are made of polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyphenyl sulfide, polystyrene, or the like. The first conductive layer 811 and the second conductive layer 812 are formed by a method such as a vapor deposition method or a sputtering method. The first conductive layer 811 and the second conductive layer 812 are made of, for example, aluminum, zinc, magnesium, or the like.

[0084] 5A and 5B, first metallized film 81 and second metallized film 82 are alternately stacked with their four sides aligned. At this time, first dielectric film 801 or second dielectric film 802 is interposed between first conductive layer 811 and second conductive layer 812. Furthermore, one side on which first margin portion 821 is formed and one side on which second margin portion 822 is formed are aligned with each other. is on the opposite sideIn FIG. 5A, first margin portion 821 is disposed at the rear, and second margin portion 822 is disposed at the front. In this manner, a plurality of first metallized films 81 and second metallized films 82 are stacked and integrated to obtain laminate 83 as shown in FIGS. 5B and 5C. Laminate 83 is covered with protective film 84 except for its front and rear surfaces. Protective film 84 is an electrically insulating film. Protective film 84 may be formed of laminate 30.

[0085] Next, a first external electrode 21 and a second external electrode 22 are formed on the front and rear surfaces of the laminate 83 by metallicon (metal spraying method), respectively, to obtain a multilayer capacitor element 8 (see FIG. 5D). The first external electrode 21 is electrically connected to a first conductive layer 811 (first internal electrode). The second external electrode 22 is electrically connected to a second conductive layer 812 (second internal electrode). The first conductive layer 811 and the second conductive layer 812 form a pair of internal electrodes. The first external electrode 21 and the second external electrode 22 are formed of, for example, zinc.

[0086] 5D, the first bus bar 61 is electrically connected to the first external electrode 21, and the second bus bar 62 is electrically connected to the second external electrode 22. Examples of the connection method include solder welding, resistance welding, ultrasonic welding, etc. The first bus bar 61 and the second bus bar 62 are formed into a plate shape from, for example, copper or a copper alloy.

[0087] After the capacitor element 20 is formed as described above, a step of forming the exterior resin layer 4 is performed. In the step of forming the exterior resin layer 4, the capacitor element 20 to which the bus bar 6 is connected is sealed with a resin to form the exterior resin layer 4. Examples of the resin include epoxy resin, unsaturated polyester resin, polyimide resin, urethane resin, and silicone resin. Examples of the molding method for covering the capacitor element 20 include transfer molding, compression molding, and laminate molding. The capacitor element 20 may be housed and sealed in a case having the exterior resin layer 4. The exterior resin layer 4 is formed so as to cover the entire capacitor element 20 except for the connection portion of the capacitor element 20 with the bus bar 6. The tip portion of the bus bar 6 is located outside the exterior resin layer 4 (opposite the capacitor element 20). After the exterior resin layer 4 is formed, a laminate 30 is provided on the surface of the exterior resin layer 4 as necessary.

[0088] In this manner, a capacitor 10 using the laminate 30 as a barrier film is obtained.

[0089] (2-5) Modifications Although the above describes a case where the electronic component is a capacitor, this is not limited thereto. The present disclosure is also applicable to a case where the electronic component is a passive component or an active component other than a capacitor. A passive component or an active component other than a capacitor includes a passive element or an active element corresponding to the type of the electronic component, respectively, instead of a capacitor element.

[0090] In the above, the laminate 30 is described as covering the wound body 73 before the first external electrode 21 and the second external electrode 22 are formed by metal spraying (metallicon), but this is not limited thereto, and the wound body 73 may be covered with the laminate 30 after the first external electrode 21 and the second external electrode 22 are formed. When covering the periphery of the first external electrode 21 and the second external electrode 22 with the laminate 30, the first external electrode 21 and the second external electrode 22 may be formed on the wound body 73, and then the wound body 73 and the first external electrode 21 and the second external electrode 22 may be covered with the laminate 30.

[0091] Furthermore, even when the periphery of the first external electrode 21 and the second external electrode 22 are covered with the laminate 30, the laminate 30 may cover the wound body 73 before the first external electrode 21 and the second external electrode 22 are formed. In this case, the width of the laminate 30 is made 1 to 2 mm larger than the width of the metallized films 71, 72 forming the wound body 73, and the end of the laminate 30 is made to protrude beyond the axial end face of the wound body 73. The formation of the first external electrode 21 and the second external electrode 22 by metal spraying is performed on the axial end face of the wound body 73 within a space surrounded by the end of the laminate 30.

[0092] (3) Summary The laminate (30) according to the first embodiment has a base layer (33), an adhesive layer (32), and a clay layer (31). The base layer (33) contains a crystalline resin. The adhesive layer (32) contains a resin different from the crystalline resin, and is provided on the one surface of the base layer (33). The clay layer (31) is provided on the one surface of the base layer (33) via the adhesive layer (32). The adhesive layer (32) has a tackiness developing temperature of 130°C or lower.

[0093] According to this embodiment, the laminate (30) has the advantage that the base layer (33) containing the crystalline resin has good water vapor barrier properties, and the adhesive layer (32) provides excellent adhesion between the base layer (33) and the clay layer (31).

[0094] The second aspect is the laminate (30) according to the first aspect, wherein the adhesive layer (32) contains an amorphous resin.

[0095] This embodiment has the advantage that the adhesion between the base layer (33) and the clay layer (31) can be easily improved without heat fusion.

[0096] A third aspect is the laminate (30) according to the first aspect, in which the adhesive layer (32) contains a resin having a polar group.

[0097] This embodiment has the advantage that the adhesion between the base layer (33) and the clay layer (31) can be easily improved without heat fusion.

[0098] A fourth aspect is the laminate (30) according to any one of the first to third aspects, in which the crystalline resin is polypropylene.

[0099] According to this embodiment, there is an advantage that the water vapor barrier properties of the laminate (30) can be improved.

[0100] A fifth aspect is the laminate (30) according to any one of the first to fourth aspects, in which the base layer (33) is a biaxially oriented polypropylene film.

[0101] According to this embodiment, there is an advantage that the water vapor barrier properties of the laminate (30) can be improved.

[0102] A sixth aspect is the laminate (30) according to any one of the first to fifth aspects, which has an aluminum layer or a polyvinyl alcohol layer on the other surface of the base layer (33).

[0103] According to this embodiment, there is an advantage that the water vapor barrier properties of the laminate (30) can be improved.

[0104] The electronic component (1) according to a seventh aspect includes an electronic component element (2) and a barrier film that covers at least a part of the periphery of the electronic component element (2). The barrier film includes a laminate (30).

[0105] According to this embodiment, the laminate (30) can reduce moisture reaching the electronic component element (2), and there is an advantage in that an electronic component (1) with high moisture resistance and reliability can be easily obtained.

[0106] A capacitor (10) according to an eighth aspect includes an electronic component element (2) of the electronic component (1) according to the seventh aspect, which includes a capacitor element (20).

[0107] According to this embodiment, the laminate (30) can reduce the amount of moisture that reaches the capacitor element (20), which has the advantage that it is easy to obtain a capacitor (10) with high moisture resistance and reliability.

[0108] A ninth aspect is a capacitor (10) according to the eighth aspect, wherein the capacitor element (20) has a pair of metallized films (71, 72, 81, 82) each having a conductive layer (711, 712, 811, 812) formed on a dielectric film (701, 702, 801, 802), the pair of metallized films (71, 72, 81, 82) being wound such that the conductive layers (711, 712, 811, 812) face each other via the dielectric film (701, 702, 801, 802), 0 1, 7 0 2, 8 0 1, 8 0 2) is made of the same type of resin as the base layer (33).

[0109] This embodiment has the advantage that a capacitor (10) having excellent electrical insulation properties and water vapor barrier properties can be obtained. EXAMPLES

[0110] (Examples 1 and 2) Kunipia F (Kunimine Industries) was used as the clay material. Water-soluble nylon A-90 (Toray) was used as the binder. A treatment liquid (clay coating liquid) was prepared by mixing the clay material, binder, and solvent. The treatment liquid contained 6 wt% clay material and binder in total, 81 wt% water, and 13 wt% ethanol. The mixture ratio (weight ratio) of the clay material and binder is shown in Table 1.

[0111] Next, a polypropylene film (thickness 24 μm) having a base layer and an adhesive layer was subjected to a corona treatment, after which a treatment liquid was applied to the surface of the adhesive layer with an applicator, and then dried. The thickness of the clay layer after drying was 1 μm. The adhesive layer was made of low-melting polypropylene, with a melting point of 130°C and a tackiness development temperature of 90°C. The drying conditions were changed in each example as shown in Table 1.

[0112] Then, the film adhesion of the clay layer was evaluated (based on JIS K 5600-5-6). That is, the clay layer was cut at 2 mm intervals and peeled off with tape. Only cases where the clay layer did not peel off (classification 0) were marked as ◯, and all other cases were marked as ×.

[0113] (Comparative Examples 1 and 2) Film adhesion evaluation was carried out in the same manner as in Examples 1 and 2, except that a polypropylene film (only the base layer) having no adhesive layer was used.

[0114] [Table 1]

[0115] As is clear from Table 1, in Examples 1 and 2 having an adhesive layer, the adhesion of the clay layer was improved compared to Comparative Examples 1 and 2 not having an adhesive layer. In addition, in Examples 1 and 2, the adhesion of the clay layer was ensured by natural drying without heating. Furthermore, in Examples 1 and 2, the adhesion of the clay layer was ensured even when dried at a temperature below the adhesiveness manifestation temperature. [Explanation of symbols]

[0116] 1. Electronic Components 10 Capacitor 2. Electronic components 20 Capacitor element 30 Laminate 31 Clay Layer 32 Adhesive layer 33 Base material layer 71, 72, 81, 82 Metallized film 701, 702, 801, 802 Dielectric Film 711, 712, 811, 812 Conductive layer

Claims

1. A substrate layer containing a crystalline resin; an adhesive layer including a resin different from the crystalline resin and provided on one surface of the base layer; A clay layer provided on the one surface of the base layer via the adhesive layer; The base layer comprises crystalline polypropylene, The adhesive layer contains an amorphous polyolefin having a lower crystallinity than the crystalline polypropylene, The adhesive layer has a tackiness temperature of 130° C. or lower. Laminate.

2. The adhesive layer comprises a resin having a polar group. The laminate according to claim 1 .

3. The substrate layer is a biaxially oriented polypropylene film. The laminate according to claim 1 or 2.

4. The other surface of the base layer has an aluminum layer or a polyvinyl alcohol layer. The laminate according to any one of claims 1 to 3.

5. An electronic component element; a barrier film covering at least a portion of the periphery of the electronic component element; The barrier film comprises the laminate according to any one of claims 1 to 4. Electronic components.

6. The electronic component element of the electronic component according to claim 5 includes a capacitor element. Capacitor.

7. The capacitor element has a pair of metallized films having a conductive layer formed on a dielectric film, the pair of metallized films are wound such that the conductive layers face each other via the dielectric film, The dielectric film is made of the same resin as that constituting the base layer. The capacitor of claim 6.

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