Electrical devices, interlayer plies including electrical devices, and methods for manufacturing the electrical devices and interlayer plies - Patents.com

Abstract

A method for manufacturing an electrical device is described, the method including the steps of: (i) providing a layer of interlayer material having a first major surface and a second opposing major surface, (ii) disposing at least a first electrically operable component on the first major surface of the first layer of interlayer material, the first electrically operable component being mounted on a first circuit board, and (iii) providing a layer of adhesive material, preferably as a liquid, covering at least a portion of the first major surface of the layer of interlayer material and at least a portion of the first electrically operable component, and / or at least a portion of the first circuit board, such that following step (iii), the first electrically operable component is secured to the layer of interlayer material by at least a portion of the layer of adhesive material. [Selection diagram] Figure 24

Description

[Technical field]

[0001] The present invention relates to electrical devices, interlayer plies incorporating electrical devices useful in making laminated glazing, and methods for making such electrical devices and interlayer plies.

[0002] It is known to incorporate electrical components between the two glass panes of laminated glazing.

[0003] US2016 / 0313587A1 describes a laminated automobile glazing in which an electrically powered functional assembly is inserted. WO2018 / 025051A1 describes a laminated glazing comprising first and second sheets of glazing material having at least one adhesive interlayer material, a first electrical actuator, and a first receiving coil therebetween in electrical communication with the first electrical actuator. A method of making such a laminated glazing is also described in WO2018 / 025051A1.

[0004] EP1534513B1 describes a laminated glazing panel comprising two glass plies, a plastic ply, and one or more light emitting diodes attached to a circuit board laminated between the glass plies. Such laminated glazing may be manufactured using a process that includes a step of preparing a cut-out area in the plastic ply to receive the circuit board prior to the lamination process. The circuit board and or more light emitting diodes may be at least partially coated with a material compatible with the material of the plastic ply. The circuit board is disposed in the cut-out area of ​​the plastic ply.

[0005] Another process for producing laminated glazing is also described in EP1534513B1, which comprises the steps of mating two plastic plies, preparing a cut-out area in the upper plastic ply to receive a circuit board on which one or more light emitting diodes are mounted, locating the circuit board in the cut-out area, bonding a further plastic ply to the mated plastic ply, thereby creating a composite ply, interleaving the composite ply between two glass plies, and laminating the plies. Both the circuit board and the one or more light emitting diodes may be at least partially coated with a material compatible with the material of the plastic plies, and preferably the overall thickness of the coated circuit board on which the one or more light emitting diodes are mounted is comparable to the thickness of the plastic ply in which it is located.

[0006] A problem with such manufacturing processes is that when a plastic ply with a cutout area is placed onto the first glass sheet, it can be difficult to insert a circuit board into the opening without risking stretching the cutout area and stretching the plastic ply. This problem can be even more pronounced when the first glass sheet is curved, as is often the case in the field of automotive glazing. Summary of the Invention

[0007] Thus, the present invention provides from a first aspect: (i) providing a layer of interlayer material having a first major surface and a second opposing major surface; (ii) disposing at least a first electrically operable component on a first major surface of the first layer of interlayer material, the first electrically operable component being mounted on a first circuit board; (iii) providing a layer of adhesive material covering at least a portion of the first major surface of the first layer of interlayer material and at least a portion of the first electrically operable component and / or at least a portion of the first circuit board; The present invention provides a method for manufacturing an electrical device comprising:

[0008] For the avoidance of doubt, the application of the layer of adhesive material during step (iii) may (a) cover at least a portion of the first major surface of the layer of intermediate layer material and at least a portion of the first electrically operable component, or (b) cover at least a portion of the first major surface of the first layer of intermediate layer material and at least a portion of the first electrically operable component and at least a portion of the first circuit board, or (c) cover at least a portion of the first major surface of the first layer of intermediate layer material and at least a portion of the first circuit board.

[0009] The layer of adhesive material provided in step (iii) is used to secure a first electrically operable component onto the layer of interlayer material following step (iii), i.e., following step (iii), the first electrically operable component is secured to the first layer of interlayer material by at least a portion of the layer of adhesive material.

[0010] The first electrically operable component has first and second electrical input terminals for connection to a suitable power source having first and second output terminals, such that power is provided to the at least one electrically operable component when the first input terminal of the at least one electrically operable component is placed in electrical communication with the first output terminal of the suitable power source and when the second input terminal of the first electrically operable component is placed in electrical communication with the second output terminal of the suitable power source.

[0011] An electrical device manufactured using the method according to the first aspect of the present invention may be used in the form so manufactured, or may be used as a parent electrical device for manufacturing a child electrical device therefrom, the parent device and the child device each having a respective first major surface and an opposing second major surface, and at least one of the first and second major surfaces of the child electrical device having a smaller area than the first or second major surface of the parent electrical device.

[0012] Preferably, the layer of interlayer material is provided as a sheet.

[0013] Preferably, the layer of interlayer material comprises a monolithic sheet or a multi-layer sheet.

[0014] Preferably, the interlayer material is polyvinyl butyral (PVB), ethylene vinyl acetate (EVA) Copolymers of ethylene such as or polyurethane, especially thermoplastic polyurethane (TPU) )of Prepare.

[0015] Preferably, the layer of interlayer material is a sheet of polyvinyl butyral (PVB), ethylene vinyl acetate (EVA) Sheets of ethylene copolymers such as , or polyurethane sheets, especially thermoplastic polyurethane (TPU) Sheet Equipped with.

[0016] Preferably, the first circuit board comprises a substrate having a first major surface and a second opposing major surface, wherein during step (ii) the second major surface of the substrate faces the layer of interlayer material, and wherein preferably the electrically operable component is attached to the first major surface of the substrate.

[0017] Preferably, in step (ii), the first circuit board is disposed on a first major surface of the layer of interlayer material such that the first circuit board is between the layer of interlayer material and the first electrically operable component.

[0018] Preferably, following step (iii), the layer of adhesive material is in direct contact with the first major surface of the layer of interlayer material and with the first electrically operable component and / or the first circuit board.

[0019] Preferably, the adhesive material is a plastic material.

[0020] Preferably, the adhesive material is polyvinyl butyral (PVB), ethylene vinyl acetate (EVA) Copolymers of ethylene such as or polyurethane, especially thermoplastic polyurethane (TPU) )of Prepare.

[0021] Preferably, in step (iii), the layer of adhesive material is provided as a liquid (i.e., in liquid form). By providing the layer of adhesive material in liquid form, the adhesive material can be poured or sprayed to cover at least a portion of the first major surface of the layer of interlayer material and at least a portion of the first electrically operable component and / or at least a portion of the first circuit board.

[0022] When the layer of adhesive material is initially provided in liquid form (i.e. as a liquid), the liquid preferably covers at least a portion of the first major surface of the layer of interlayer material and at least a portion of the first electrically operable component and / or at least a portion of the first circuit board, after which the liquid undergoes a solidification step. Preferably, the solidification step of the liquid comprises a solidification step and / or a curing step. Preferably, the solidification step of the liquid comprises a heating step and / or an irradiation step, preferably an ultraviolet irradiation step.

[0023] When the layer of adhesive material is initially provided as a liquid and then undergoes a solidification step, the surface of the solidified layer of adhesive material that does not face the layer of intermediate layer material is preferably textured and / or preferably provided with a coating.

[0024] When the layer of adhesive material is initially provided as a liquid, preferably the liquid comprises a two-component system comprising at least a first component and a second component, and preferably the first component is mixed with the second component before or after it is provided during step (iii).

[0025] When the layer of adhesive material is initially provided as a liquid, preferably the liquid is leveled to achieve a uniform thickness over the first layer of intermediate layer material, more preferably to achieve a uniform thickness over the first major surface and / or the second major surface of the first layer of intermediate layer material.

[0026] In some embodiments, the layer of adhesive material has a thickness of 0.3 mm to 3.0 mm, preferably 0.3 mm to 2.0 mm, more preferably 0.3 mm to 1.6 mm. Preferably, the layer of plastic material has a thickness of 0.38 mm, or 0.76 mm, or 1.14 mm or 1.52 mm.

[0027] Preferably, the layer of adhesive material has a uniform thickness.

[0028] Preferably, the layer of adhesive material is optically clear or pigmented.

[0029] Preferably, the layer of adhesive material covers the entire electrically operable component and / or the entire first circuit board.

[0030] In some embodiments, after step (i), a first barrier is provided on a first major surface of the layer of interlayer material or around an edge of the layer of interlayer material, and following step (ii), at least a portion of the first circuit board is inside the first barrier.

[0031] Preferably, the first barrier surrounds the first circuit board such that the entire first circuit board is inside the first barrier.

[0032] Preferably, a second barrier is also provided on the first major surface of the layer of interlayer material, the second barrier communicating with the first barrier to define a space into which at least a portion of the first circuit board is disposed in accordance with step (ii).

[0033] In some embodiments following step (ii), at least a second electrically operable component is disposed on the layer of interlayer material, the second electrically operable component being mounted on the first circuit board and spaced apart from the first electrically operable device.

[0034] Following step (ii), in some embodiments, at least a second electrically operable component is disposed on the layer of interlayer material, the second electrically operable component is mounted on a second circuit board, the second electrically operable component is spaced apart from the first electrically operable device, and / or the first circuit board is spaced apart from the second circuit board.

[0035] Preferably, the first electrically operable component is attached to a first circuit board and the second electrically operable component is attached to a second circuit board, and the first circuit board is spaced apart from the second circuit board when the first and second electrically operable components are disposed on the first layer of interlayer material.

[0036] In embodiments in which there is a first electrically operable component attached to a first circuit board and a second electrically operable component attached to a second circuit board, preferably a first barrier and a second barrier are provided on a first major surface of the layer of interlayer material, and following step (iii) the first circuit board is inside the first barrier and the second circuit board is inside the second barrier. Preferably the second barrier is not within the perimeter defined by the first barrier.

[0037] In embodiments in which a first electrically operable component is attached to a first circuit board and a second electrically operable component is attached to a second circuit board, preferably a first barrier is provided on a first major surface of the layer of interlayer material or around an edge of the layer of interlayer material, and following step (iii), the first and second circuit boards are inside the first barrier.

[0038] In embodiments in which the first electrically operable component is attached to a first circuit board and the second electrically operable component is attached to a second circuit board, preferably during step (iii), the layer of adhesive material also covers at least a portion of the second electrically operable component and / or at least a portion of the second circuit board, more preferably the layer of adhesive material also covers the entire second electrically operable component and / or the entire second circuit board.

[0039] In embodiments where the first electrically operable component is attached to a first circuit board and the second electrically operable component is attached to a second circuit board, preferably following step (iii), a second layer of adhesive material is provided covering at least a portion of the second electrically operated device and / or at least a portion of the second circuit board. Preferably, the second layer of adhesive material is provided as a liquid, preferably provided by injection or spraying. When the second layer is initially provided as a liquid, the liquid of the second layer of adhesive material preferably undergoes a subsequent solidification step. Preferably, the subsequent solidification step of the liquid of the second layer of adhesive material comprises a solidification step and / or a curing step. Preferably, the subsequent solidification step of the liquid of the second layer of adhesive material comprises a heating step and / or an irradiation step, preferably an ultraviolet irradiation step.

[0040] Preferably, the liquid of the second layer of adhesive material is leveled to achieve a uniform thickness relative to the first layer of intermediate layer material, more preferably a uniform thickness relative to the first major surface and / or the second major surface of the first layer of intermediate layer material.

[0041] In embodiments where the second layer of adhesive material is initially provided as a liquid and then undergoes a subsequent solidification step, the surface of the second layer of adhesive material that does not face the first layer of interlayer material is provided with a texture and / or coating.

[0042] In some embodiments, following step (iii), the first circuit board with the first electrically operable component attached thereto is removed from the layer of interlayer material, preferably by a cutting or punching step, thereby producing a child electrical device.

[0043] In some embodiments, when the first circuit board having the first electrically operable component attached thereto is removed from the layer of interlayer material, at least a portion of the first circuit board is between a portion of the layer of adhesive material and a portion of the layer of interlayer material, and at least a portion of the layer of interlayer material is bonded to at least a portion of the layer of adhesive material.

[0044] In some embodiments having a first electrically operable component attached to a first circuit board and a second electrically operable component attached to a second circuit board, following step (iii), the first circuit board is covered on one side by a first layer of intermediate layer and on the other side by at least a portion of a layer of adhesive material, and the second circuit board is covered on one side with the first layer of intermediate layer material and on the other side with at least a portion of the layer of adhesive material, where at least a portion of the layer of adhesive material contacts a first major surface of the layer of intermediate layer material securing the first and second circuit boards to the intermediate layer material, and where the first circuit board is spaced apart from the second circuit board, and preferably the method includes a separation step after step (iii) to separate the first electrically operable component and / or the second electrically operable component from the layer of intermediate layer material, thereby producing at least one child electrical device.

[0045] During the separation step, the entire first and / or second circuit boards with their respective first and second electrically operable components attached are preferably separated from the layer of interlayer material.

[0046] Preferably, during the separation step, a first electrically operable component mounted on the first circuit board and / or a second electrically operable component mounted on the second circuit board are separated from the layer of interlayer material, thereby producing a first daughter electrical device and / or a second daughter electrical device.

[0047] Preferably, the separating step comprises a cutting or punching step.

[0048] When the separating step comprises a cutting step, preferably the cutting step comprises at least one of a laser cutting step, a thermal cutting step, and a mechanical cutting step.

[0049] In other embodiments, the first layer of adhesive material is provided as a sheet of adhesive material, and following step (iii), the sheet of adhesive material is heated to fuse the sheet of adhesive material to portions of the first major surface of the layer of interlayer material and to portions of the first electrically operable device and / or portions of the first circuit board.

[0050] In some embodiments after step (iii), the method comprises incorporating an electrical device in the opening in the sheet of interlayer material, where incorporating the electrical device in the opening in the sheet of interlayer material comprises the steps of providing a sheet of interlayer material having a first major surface and a second opposing major surface, removing at least a first portion of the sheet of interlayer material to create an opening in the sheet of interlayer material, the opening in the sheet of interlayer material having at least a first wall between the first and second major surfaces of the sheet of interlayer material, disposing at least a portion of the electrical device in the opening, and securing the electrical device to at least a portion of the first and / or second major surfaces of the sheet of interlayer material and / or to at least a portion of the first wall of the opening in the sheet of interlayer material using a bonding means. For the avoidance of doubt, in such embodiments where the layer of interlayer material of step (i) is provided as a sheet of interlayer material, this sheet may be referred to as the first sheet of interlayer material and the sheet of interlayer material in which an opening is formed for incorporating the electrical device may be referred to as the second sheet of interlayer material.

[0051] In these embodiments, an interlayer ply is produced comprising a sheet of interlayer material and an electrical device according to an aspect of the invention which can be used in the subsequent production of laminated glazing, the laminated glazing comprising at least one sheet of glazing material, preferably glass, in particular soda-lime-silica glass, to which the interlayer ply is bonded.

[0052] The electrical device may be a parent electrical device or a child electrical device that has been manufactured from a parent electrical device, i.e., by detaching it from the parent electrical device by disconnection.

[0053] Bonding the electrical device to the first wall of the opening in the ply of interlayer material and / or to the first and / or second major surfaces of the sheet of interlayer material simplifies the subsequent lamination process with the sheet of glazing material.

[0054] Preferably, the first electrically operable component is at least partially disposed in an opening in the ply of interlayer material.

[0055] Preferably the joining means comprises an adhesive for attaching a first circuit board of the electrical device to a first major surface of the ply of interlayer material and / or to a first wall of the opening in the ply of interlayer material.

[0056] Preferably the attachment means comprises an adhesive for attaching the electrical device to the first major surface of the ply of interlayer material and / or to the first wall of the opening in the ply of interlayer material.

[0057] Preferably, the adhesive bonding means is initially provided as a liquid and then solidifies or hardens.

[0058] Preferably, the adhesive bonding means is polyvinyl butyral (PVB), ethylene vinyl acetate (EVA) Copolymers of ethylene such as or polyurethane, especially thermoplastic polyurethane (TPU) )of Prepare.

[0059] The first circuit board of the electrical device has a first major surface and an opposing second major surface, and preferably the entire first and / or second major surfaces of the first circuit board are covered with a layer of adhesive bonding means.

[0060] In another embodiment, the bonding means comprises a fusing step for fusing at least a portion of the layer of interlayer material of the electrical device to a wall of the opening in the ply of interlayer material and / or to the first and / or second major surfaces of the ply of interlayer material. Preferably, the fusing step comprises a heat fusing step. Preferably, the heat fusing step comprises a laser heating step.

[0061] In some embodiments prior to step (iii), the flexible circuit is disposed on the layer of interlayer material or the first circuit board, the flexible circuit comprising a base having a first major surface and an opposing second major surface, the first or second major surface of the flexible circuit substrate having a first electrical connector region thereon in electrical communication with a second electrical connector region on the first or second major surface of the flexible circuit substrate by a conductive track, and wherein the flexible circuit is positioned such that the second electrical connector region on the flexible circuit substrate is in electrical communication with the first electrical connector region on the first circuit board.

[0062] Preferably, the flexible circuit is positioned such that the second electrical connector region on the substrate of the flexible circuit is in mechanical communication with the first electrical connector region on the first circuit board.

[0063] Preferably, the flexible circuit substrate comprises a third electrical connector region on its first or second major surface in electrical communication with a fourth electrical connector region on the first or second major surface of the flexible circuit substrate by a conductive track, wherein the flexible circuit is arranged such that the fourth electrical connector region on the flexible circuit substrate is in electrical communication with the second electrical connector region on the first circuit board.

[0064] Preferably, the flexible circuit is positioned such that the fourth electrical connector region on the substrate of the flexible circuit is in mechanical communication with the second electrical connector region on the first circuit board.

[0065] The first electrically operable component has first and second electrical input terminals for connection to a suitable power source having first and second output terminals, such that power is provided to the at least one electrically operable component when the first input terminal of the at least one electrically operable component is placed in electrical communication with the first output terminal of the suitable power source and when the second input terminal of the first electrically operable component is placed in electrical communication with the second output terminal of the suitable power source.

[0066] A first electrical connector area on the first circuit board is in electrical communication with a first input terminal of the first electrically operable device, and a second electrical connector area on the first circuit board, if present, is in electrical communication with a second input terminal of the first electrically operable device. Upon electrical communication of the first electrical connector area on the first circuit board with a first output terminal of a suitable power source, and upon electrical communication of the second input terminal of the first electrically operable component with a second output terminal of a suitable power source (possibly via the second electrical connector area, if present), power is provided to the at least one electrically operable component.

[0067] The present invention also provides, from a second aspect, an electrical device comprising: a first circuit board having a first major surface and a second opposing major surface, at least one electrically operable component attached to the first circuit board; at least one layer of interlayer material having an outer major surface; and at least one layer of adhesive material having an outer major surface; wherein the first circuit board having the at least one electrically operable component attached thereto is between the outer major surface of the at least one layer of interlayer material and the outer major surface of the at least one layer of adhesive material; and The electrical device includes an electrical connector, the electrical connector comprising: a first outer surface and a second opposing outer surface, the first outer surface comprising an outer major surface of at least one layer of adhesive material; and a second outer surface comprising an outer major surface of at least one layer of adhesive material, the second outer surface comprising an outer major surface of at least one layer of adhesive material, or the first outer surface of the electrical device comprising an outer major surface of at least one layer of adhesive material.

[0068] Preferably, the at least one electrically operable component is between the first circuit board and the at least one layer of adhesive material.

[0069] The first circuit board has an edge and preferably at least one layer of adhesive material covers the first circuit board and extends beyond its edge to contact at least one layer of intermediate layer material for securing the first circuit board to the at least one intermediate layer material, and more preferably at least one layer of adhesive material covers the entire first circuit board and extends beyond its edge to contact at least one layer of intermediate layer material for securing the first circuit board to the at least one layer of intermediate layer material.

[0070] The at least one electrically operable component has first and second electrical input terminals for connection to a suitable power source having first and second output terminals, such that when the first input terminal of the at least one electrically operable component is placed in electrical communication with the first output terminal of the suitable power source, and when the second input terminal of the at least one electrically operable component is placed in electrical communication with the second output terminal of the suitable power source, power is supplied to the at least one electrically operable component.

[0071] Preferably, the first circuit board comprises a first electrical connector area in electrical communication with a first input terminal of the at least one electrically operable component, preferably by way of a first conductive track on the first circuit board.

[0072] Preferably, the first circuit board comprises a second electrical connector area in electrical communication with a second input terminal of the at least one electrically operable component, preferably by way of a second conductive track on the first circuit board.

[0073] Preferably, the first circuit board comprises a substrate, in particular a substrate comprising polyethylene terephthalate, the substrate having a first major surface and a second opposing major surface, and wherein preferably the first circuit board comprises first and second electrical connector areas on the first major surface of the substrate, the first electrical connector area on the substrate being in electrical communication with a first input terminal of the at least one electrically operable component by a first conductive track or a first conductive coating on at least a portion of the first or second major surface of the substrate, and the second electrical connector area on the substrate being in electrical communication with a second input terminal of the at least one electrically operable component by a second conductive track or a second conductive coating on at least a portion of the first or second major surface of the substrate.

[0074] In some embodiments having a first electrical connector region on a first circuit board in electrical communication with a first input terminal of at least one electrically operable component, preferably the electrical device comprises a flexible circuit, the flexible circuit comprising a substrate having a first major surface and an opposing second major surface, the first or second major surface of the substrate of the flexible circuit comprising a first electrical connector region thereon in electrical communication with a second electrical connector region on the first or second major surface of the substrate of the flexible circuit by a conductive track, the first electrical connector region on the substrate of the flexible circuit being in electrical and mechanical communication with the first electrical connector region on the first circuit board, such that upon electrical communication of the second input terminal of the at least one electrically operable component with a first output terminal of a suitable power source, and upon electrical communication of the second electrical connector region of the flexible circuit with a second output terminal of a suitable power source, power is provided to the at least one electrically operable component.

[0075] Preferably, the first electrical connector region of the flexible circuit and the second electrical connector region of the flexible circuit are on a second major surface of the substrate of the flexible circuit, and preferably the first electrical connector region of the flexible circuit is in electrical communication with the second electrical connector region of the flexible circuit by a conductive track on the second major surface of the substrate of the flexible circuit.

[0076] Preferably, the flexible circuit substrate comprises a third electrical connector region on the first or second major surface of the flexible circuit substrate in electrical communication with a fourth electrical connector region on the first or second major surface of the flexible circuit substrate by conductive tracks, the third electrical connector region on the flexible circuit substrate in electrical and mechanical communication with the second electrical connector region on the first circuit board, the second electrical connector region on the first circuit board in electrical communication with a second input terminal of the at least one electrically operable component, wherein upon electrical communication of the fourth electrical connector region of the flexible circuit with a first output terminal of a suitable power source and upon electrical communication of the second electrical connector region of the flexible circuit with the second output terminal of a suitable power source, power is supplied to the at least one electrically operable component.

[0077] Preferably, the third electrical connector region of the flexible circuit and the fourth electrical connector region of the flexible circuit are on a second major surface of the flexible circuit substrate, and preferably the third electrical connector region of the flexible circuit is in electrical communication with the fourth electrical connector region of the flexible circuit by a conductive track on the second major surface of the flexible circuit substrate.

[0078] Preferably, the second major surface of the flexible circuit substrate faces the first major surface of the first circuit board.

[0079] Preferably, the second major surface of the flexible circuit substrate is in direct contact with at least a portion of the first major surface of the first circuit board.

[0080] Preferably, a temporary adhesive means is between at least a portion of the first major surface of the first circuit board and the second major surface of the flexible circuit substrate, and preferably the temporary adhesive means is a repositionable adhesive.

[0081] In some embodiments, the electrical device is part of an interlayer ply, the interlayer ply being suitable for joining two glass sheets together, the interlayer ply comprising: a sheet of interlayer material having a first major surface and a second opposing major surface; an opening in the sheet of interlayer material, the opening having a wall extending between the first and second major surfaces of the sheet of interlayer material; and an electrical device disposed in the opening in the sheet of interlayer material and coupled to at least a portion of the wall of the opening and / or to at least a portion of the first and / or second major surfaces of the sheet of interlayer material.

[0082] Preferably, the sheets of interlayer material are made of polyvinyl butyral (PVB), ethylene vinyl acetate (EVA) or the like. Copolymers of ethylene such as or polyurethane, especially thermoplastic polyurethane (TPU) )of Prepare.

[0083] When the electrical device is part of an interlayer ply, the interlayer ply may be incorporated into the laminated glazing such that the interlayer ply is between a first sheet and a second sheet of glazing material, such as glass, by appropriate use of high temperature and pressure lamination conditions as are well known in the art. Between the electrical device and the first and / or second sheets of glazing material there may be one or more other plies of interlayer material (with or without the electrical device incorporated in an opening therein).

[0084] When the electrical device is part of the interlayer ply, the interlayer ply may be subsequently laminated to a single sheet of glazing material such as glass for use in a window, which may require the electrical device of the interlayer ply laminated to a second sheet of glazing material such as glass, or the single sheet of glazing material with the interlayer ply laminated thereto may be used as a window pane, e.g., a window pane having one or more panes, such as an insulating glazing unit. [Brief description of the drawings]

[0085] The invention will now be described with reference to the following figures (not to scale): [Figure 1] 1 shows a schematic isometric view of an electrically operable device useful in the present invention; [Diagram 2] 2 illustrates a plan view of the electrically operable device shown in FIG. 1; [Figure 3a] 1 shows a schematic side view of an electrically operable device on a sheet of interlayer material. [Figure 3b] FIG. 3b shows a schematic plan view of an electrically operable device on a sheet of interlayer material as shown in FIG. 3a. [Figure 4a] FIG. 2 shows a schematic side view of an electrically operable device on a sheet of interlayer material covered with a layer of liquid plastic. [Figure 4b] FIG. 4b shows a schematic plan view of an electrically operable device on a sheet of interlayer material covered with a layer of liquid plastic as shown in FIG. 4a. [Figure 5a] FIG. 1 shows a schematic side view of an electrically operable device on a sheet of interlayer material covered with a uniform layer of plastic. [Figure 5b] FIG. 5b shows a schematic plan view of an electrically operable device on a sheet of interlayer material covered with a uniform layer of liquid plastic as shown in FIG. 5a. [Figure 6a] FIG. 1 shows a schematic side view of a daughter electrical device cut out from a larger parent electrical device. [Figure 6b] FIG. 6b shows a schematic plan view of a daughter electrical device cut out from a larger parent electrical device as shown in FIG. 6a. [Figure 7] 1 shows a plurality of electrically operable devices on a sheet of interlayer material and illustrates manufacturing steps for producing a parent electrical device from which a child electrical device may be cut. [Figure 8] 1 shows a plurality of electrically operable devices on a sheet of interlayer material and illustrates manufacturing steps for producing a parent electrical device from which a child electrical device may be cut. [Figure 9]1 shows a plurality of electrically operable devices on a sheet of interlayer material and illustrates manufacturing steps for producing a parent electrical device from which a child electrical device may be cut. [Figure 10] 1 shows a plurality of electrically operable devices on a sheet of interlayer material and illustrates manufacturing steps for producing a parent electrical device from which a child electrical device may be cut. [Figure 11] 1 shows a plurality of electrically operable devices on a sheet of interlayer material and illustrates manufacturing steps for producing a parent electrical device from which a child electrical device may be cut. [Figure 12] 1 shows a plurality of electrically operable devices on a sheet of interlayer material and illustrates manufacturing steps for producing a parent electrical device from which a child electrical device may be cut. [Figure 13a] FIG. 1 is a schematic plan view of 16 electrically operable devices encapsulated in a layer of plastic and their subsequent removal therefrom. [Figure 13b] FIG. 1 is a schematic plan view of 16 electrically operable devices encapsulated in a layer of plastic and their subsequent removal therefrom. [Figure 13c] FIG. 1 is a schematic plan view of 16 electrically operable devices encapsulated in a layer of plastic and their subsequent removal therefrom. [Figure 14] 1 illustrates how an electrical device is positioned in an opening in a sheet of interlayer material. [Figure 15] 1 illustrates how an electrical device may be secured to an opening in a sheet of interlayer material to produce an interlayer ply according to one aspect of the present invention. [Figure 16] 1 illustrates how an electrical device may be secured to an opening in a sheet of interlayer material to produce an interlayer ply according to one aspect of the present invention. [Figure 17] 1 illustrates how an electrical device may be secured to an opening in a sheet of interlayer material to produce an interlayer ply according to one aspect of the present invention. [Figure 18] 1A-1D show schematic and exploded side views of different laminated glazing incorporating two glass sheets and an interlayer ply according to one embodiment of the present invention. [Figure 19] 1A-1D show schematic and exploded side views of different laminated glazing incorporating two glass sheets and an interlayer ply according to one embodiment of the present invention. [Figure 20] 1A-1D show schematic and exploded side views of different laminated glazing incorporating two glass sheets and an interlayer ply according to one embodiment of the present invention. [Figure 21] FIG. 1 is a schematic exploded isometric view of an electrically operable device between a sheet of interlayer material and a flexible circuit useful for powering an electrically operable device. [Figure 22] FIG. 22 is a schematic side view of FIG. 21. [Diagram 23] FIG. 22 is a schematic side view of FIG. 21 with an electrically operable device on the sheet of interlayer material and a flexible circuit on the electrically operable device. [Figure 24] Similar to FIG. 23, except that a barrier is provided in the sheet of interlayer material around the electrically operable devices and circuit board, and liquid plastic is poured into the area enclosed by the barrier. [Figure 25a] 1 shows a schematic side view of an electrical device according to one aspect of the present invention. [Figure 25b] FIG. 25b shows a schematic isometric view of the electrical device shown in FIG. 25a. [Figure 26a] FIG. 25 shows a schematic side view of an interlayer ply consisting of the electrical device shown in FIGS. 25a and 25b incorporated into an aperture in a sheet of interlayer material. [Figure 26b] A schematic isometric view of FIG. 26b is shown. [Figure 27] FIG. 26b shows a schematic side view of the interlayer ply of FIG. 26a incorporated into a laminated glazing. [Figure 28] FIG. 28 is an enlarged view of a portion of FIG. [Figure 29] FIG. 28 is a schematic side view of the end of the laminated glazing shown in FIG. 27, illustrating how a flexible circuit can be used to provide power to electrically operable components. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0086] Figure 1 shows a schematic isometric view of an electrically operable device 1 useful in the present invention. Figure 2 shows a plan view of the electrically operable device 1 as viewed in the direction of arrow 2.

[0087] The electrically operable device 1 comprises a substrate 3 having a first major surface 5 and an opposing second major surface 7. On the first major surface 5 of the substrate 3 is an electrically operable component 9, such as a light emitting diode or a sensor. Also on the first major surface 5 of the substrate 3 are first and second electrical connector regions 11, 13. The first electrical connector region 11 is in electrical communication with a first input terminal 19 of the electrically operable component 9 via a first conductive track 15. The second electrical connector region 13 is in electrical communication with a second input terminal 21 of the electrically operable component 9 via a second conductive track 17.

[0088] Upon connecting the first electrical connector region 11 and the second electrical connector region 13 to the output terminals of a suitable power supply, power may be provided to the electrically operable component 9, thereby switching the electrically operable component from a non-energized state to an energized state. For example, when the electrically operable component 9 is a light emitting diode and the first electrical connector region 11 is connected to the positive terminal of a suitable power supply and the second electrical connector region 13 is connected to the negative terminal of a suitable power supply, power is provided to the light emitting diode 9, which emits light therefrom. When disconnected from the suitable power supply, no light is emitted from the light emitting diode. Suitable switching means may be included as part of the electrically operable device 1 or may be separate therefrom, allowing for switching of the appropriate power supply.

[0089] There may be one or more electrically operable components 9 mounted on the substrate 3 .

[0090] A substrate 3 having at least one conductive track on its main surface is a circuit board. For example, a substrate 3 having first and second electrical connector regions 11, 13 and first and second conductive tracks 15, 17 on a first main surface 5 of the substrate 3 is a circuit board.

[0091] In FIG. 1, the arrow 2 is perpendicular to the first major surface 5 .

[0092] The substrate 3 is typically optically transparent and may be a plastic material such as polyethylene terephthalate (PET). In the example shown in Figures 1 and 2, the substrate is PET that is approximately 0.2 mm thick and is relatively flexible.

[0093] The first electrically operable component 9 may be attached to the first major surface 5 of the substrate 3 by a suitable adhesive. The first and second electrical connector regions 11, 13 and the first and second conductive tracks 15, 17 may be in the form of a conductive ink applied to the first major surface 5 by a screen printing process or the like.

[0094] The electrically operable component 9 may be attached to the second major surface 7 of the substrate 3, and at least one of the conductive tracks 15, 17 and / or the electrical connector regions 11, 13 may also be on the second major surface 7. For example, if the electrically operable component 9 is on the second major surface 7 of the substrate 3 and the first electrical connector region 11 is on the first major surface 5 of the substrate 3, the first conductive track 15 passes between the first and second major surfaces 5, 7 of the substrate 3 through a suitable opening therein.

[0095] Instead of the conductive tracks 15, 17, the electrically isolated coated regions may be in electrical communication with the electrical connector regions and the input terminals of the electrically operable component 9. For example, the substrate 3 may be a coated substrate having, for example, an electrically conductive coating on the first major surface 5. In such an example, the conductive coating on the first major surface 5 may have two electrically isolated regions, a first electrically isolated region in electrical communication with the first input terminal 19 of the electrically operable component, and a second electrically isolated region in electrical communication with the second input terminal 21 of the electrically operable component. Each electrically isolated region of the coating may be in electrical communication with a respective electrical connector region.

[0096] Figures 3-6 are used to explain the steps involved in the manufacture of an electrical device according to one embodiment of the present invention. In each of Figures 3-6, each view "a" is a side view and each view "b" is a plan view thereof, i.e. a cross-sectional view along line Z-Z'.

[0097] Figure 3a shows a schematic diagram of an electrically operable device 1a of the type shown in Figures 1 and 2 disposed on a major surface 22' of a sheet of interlayer material 22 (in this example a sheet of ethylene vinyl acetate (EVA) having a thickness of about 0.2 mm). Figure 3b shows a plan view of Figure 3a, i.e. a view in the direction of arrow 2a, which is perpendicular to major surface 22'. In Figure 3a, electrically operable device 1a is not yet fixed to the sheet of EVA 22. However, electrically operable device 1a may be fixed to the sheet of EVA 22 by using a suitable adhesive.

[0098] 4 is used to illustrate another step in the manufacture of an electrical device according to one embodiment of the present invention. An assembly of a sheet of EVA 22 having an electrically operable device 1a thereon is provided, and a layer 24 of liquid adhesive, in this example EVA, is deposited (i.e., by pouring) onto the electrically operable device 1a, thereby covering the electrically operable device 1a and also contacting a portion of a major surface 22' of the sheet of EVA 22. Other suitable materials for layer 24 include an epoxy material, which may be a suitable resin or a multi-component epoxy material.

[0099] In this example, a layer 24 of liquid EVA may be applied using a hot glue gun or the like, the EVA being initially in solid form and then melted for subsequent deposition onto the electrically operable device 1a as described above.

[0100] Due to the viscosity of EVA, layer 24 is not of uniform thickness across the sheet of EVA 22 (or across major surface 22' of the sheet of EVA 22), instead the layer has a convex surface and may be referred to in the art as a "blob," i.e., a blob of liquid EVA covering electrically operable device 1a. In the plan view shown in Figure 4b, the blob of liquid EVA is shown as having circular edges, although the shape of the edge of the blob of liquid EVA may be non-circular.

[0101] 5 is used to explain subsequent steps in the manufacture of an electrical device according to one embodiment of the present invention. Prior to solidifying the layer 24 of liquid EVA, a leveling means is applied to flatten the layer 24 and provide a layer 24a of liquid EVA having a uniform (or substantially uniform) thickness relative to the sheet of EVA 22. In this example, layer 24a has a thickness of 0.56 mm, such that thickness 27 is approximately 0.76 mm.

[0102] The layer of liquid EVA 24a is cured to form a solid layer of EVA. The layer of solid EVA 24a adheres and secures the electrically operable device 1a to the sheet of EVA 22, i.e., encapsulates the electrically operable device on the sheet of EVA 22.

[0103] In the configuration shown in Figure 5a, when layer 24a is a layer of solid EVA, the assembly of a sheet of EVA 22 with an electrically operable device 1a secured thereto by layer 24a of solid EVA may be used as an electrical device 28 according to one aspect of the invention. However, as will be explained in more detail below, it is preferred to use additional processing steps to reduce the dimensions of electrical device 28 for subsequent use. Thus, electrical device 28 is a parent electrical device from which child electrical devices may be manufactured.

[0104] FIG. 6 is used to explain another step in the manufacture of an electrical device according to one embodiment of the present invention.

[0105] 5 and 6, starting with an electrical device 28 (which is the parent electrical device), a smaller electrical device 30 (the child electrical device) may be removed therefrom by cutting, punching, or the like.

[0106] In this example, a knife was used to cut the electrical device 30 from the parent electrical device 28 leaving a hole (or opening) 23 extending through the solidified layer of EVA 24a and the sheet of EVA 22. Given that the electrically operable device 1a has been removed, portion 29 consisting of portion 22a of the sheet of EVA 22 and portion 24c of the solidified layer of EVA 24a bonded thereto is no longer capable of functioning as an electrical device, is redundant, and may be discarded.

[0107] Electrical device 30, which has been removed from original electrical device 28, consists of portion 24b of the solidified layer of EVA 24a covering and bonded to electrically operable device 1a. Portion 24b is also bonded to portion 22c of the sheet of EVA 22. The thickness of electrical device 30 is indicated by arrow 27 and is approximately 0.76 mm in this example (the same as electrical device 28).

[0108] Electrical device 30 has smaller overall dimensions than electrical device 28 and is therefore a child electrical device.

[0109] 3-6 show only one electrically operable device 1a disposed on the sheet of EVA 22, there may be more than one such device disposed on the sheet of EVA 22. In such an example, the layer of liquid 24 may extend over all the electrically operable devices or there may be more than one such layer of liquid covering each electrically operable device. That is, each electrically operable device may be covered by a respective layer of liquid, and two or more of the respective layers of liquid may be separated from one another.

[0110] Figures 7-9 show an example in which a plurality of electrically operable devices 1b (of the type shown with reference to Figures 1 and 2) are arranged on a sheet of a suitable interlayer material such as EVA. In this example there are 16 electrically operable devices 1b.

[0111] Referring to FIG. 7, FIG. 7a shows a schematic plan view of a sheet of EVA 32 arranged at the bottom of a suitable tray 33. Arranged on the sheet of EVA 32 are 16 electrically operable devices, only four of which are labelled 1b, and are of the type described with reference to FIGS. 1 and 2. There may be more or less electrically operable devices on the sheet of EVA 32. The electrically operable devices may be of the same type or different. In this example, the electrically operable devices are arranged on the sheet of EVA 32 in a grid-like manner, but the electrically operable devices may be arranged on the sheet of EVA 32 in any other configuration, which may be random.

[0112] Figure 7b shows a cross-section of the assembly shown in figure 7a along line A-A'. A sheet of EVA 32 has a thickness of about 0.2mm and is placed flat against the bottom of the tray 33.

[0113] The tray 33 has a peripheral wall 33a which extends upwardly from the base of the tray approximately 0.76 mm.

[0114] FIG. 8 shows a schematic diagram of the assembly shown in FIG. 7b when a volume of liquid plastic is deposited on the tray to cover the electrically operable devices 1b and the exposed parts of the sheet of EVA 32 (i.e., those parts of the sheet of EVA 32 that do not have electrically operable devices). The volume of liquid plastic forms a layer 34, and due to its viscosity, the thickness of the layer 34 may not be uniform with respect to the sheet of EVA 32. As shown in FIG. 9, using a suitable leveling means, the liquid can be leveled to the height of the peripheral wall 33a of the tray 33. The liquid plastic can then be hardened to form a solid layer of plastic 34' that encapsulates the electrically operable devices 1b. In this example, the combined thickness of the sheet of EVA 32 and the solid layer 34' is about 0.76 mm, substantially set by the height of the peripheral wall 33a of the tray 33.

[0115] While Figure 9 may be used to explain the assembly of Figure 8 when the liquid forming layer 34 is levelled, the same figure may be used to depict an assembly in which the liquid forming layer 34' has a relatively low viscosity, so that when the liquid is deposited (i.e., by pouring) onto the tray to cover the electrically operable device 1b and the sheet of EVA 32, the liquid naturally levels out to the height of the peripheral wall 33a of the tray 33.

[0116] Each electrically operable device 1b can then be removed from the assembly shown in Figure 9 by suitable cutting, punching, etc. It may be the case that it is not possible to remove part of the base of the tray 33 from the electrical device thus produced, and also that a layer of solidified liquid in the area of ​​the peripheral wall 33a of the tray may adhere to it and make separation therefrom difficult.

[0117] FIG. 10 illustrates steps of an alternative method for carrying out an embodiment of the present invention.

[0118] In Figure 10, a sheet of EVA 32 is placed on a suitable support or table (not shown). Electrically operable devices 1c (only two of which are labeled) are then placed in desired locations on the sheet of EVA 32.

[0119] A suitable barrier 36 is then placed on the sheet of EVA 32 around the electrically operable devices disposed on the sheet of EVA 32. The barrier 36 may be placed on the sheet of EVA 32 before the electrically operable devices are disposed thereon, in which case the electrically operable devices are disposed on the sheet of EVA 32 inside the barrier 36.

[0120] The barrier 36 may be formed of any suitable material, i.e., plastic, polyethylene, polycarbonate, and is suitably bonded to, and preferably forms a seal with, the upper surface of the sheet of EVA 32. The barrier 36 may be of unitary construction or may be formed from two or more suitable segments joined together.

[0121] FIG. 11 shows the assembly shown in FIG. 10 when a suitable liquid adhesive is poured into the area surrounded by the barrier 36. The liquid adhesive forms a layer 34a covering the electrically operable device 1c and the sheet of EVA 32. Depending on the viscosity of the liquid adhesive forming layer 34a, it may be necessary to level the liquid to form a layer 34a' of uniform thickness, as shown in FIG. 12. The layer 34a then hardens to form a solid layer 34a' sealing the electrically operable device 1c disposed on the sheet of EVA 32. Alternatively, the viscosity of the liquid may be low, in which case no additional leveling step is necessary. If necessary, the layer 34a may not be leveled before solidifying, and after solidification, the layer 34a is brought to a uniform thickness by using suitable grinding means or cutting.

[0122] 12 shows an assembly 38 of a sheet of EVA 32 having sixteen electrically operable devices 1c sealed by a solid layer 34a' and surrounded by a barrier 36. The assembly 38 may be used as an electrical device in accordance with an embodiment of the present invention. However, as described below, it is preferred to remove one or more of the electrically operable devices 1c from the assembly 38 for subsequent use. That is, the electrical device 38 is a parent electrical device for the subsequent fabrication of child electrical devices therefrom.

[0123] Figure 13a shows a plan view of the assembly 38 shown in Figure 12. The assembly 38 is used as a parent electrical device for preparing 16 child electrical devices, each of which is similar to the electrical device 30 shown in Figure 6.

[0124] Sixteen sealed electrically operable devices 1c (only one of which is labeled in FIG. 13a) are inside the barrier 36 in a central region 38a of the assembly 38. The central region 38a is removed from the assembly 38 by cutting along a line 38b just inside the barrier 36 but spaced from the electrically operable devices 1c. As shown in FIG. 13b, a suitable cutting step (such as laser cutting, mechanical cutting or thermal cutting) can be used to remove the central region 38a of the assembly 38, leaving a portion 39 that does not contain electrically operable devices. The removed portion 40 shown in FIG. 13c includes sixteen sealed electrically operable devices 1c (only one of which is labeled in this figure).

[0125] In this example, the electrically operable devices are arranged in linear rows and columns, as shown in Figure 13c. There are four rows a, b, c, d and four columns i, ii, iii, iv. Each electrically operable device 1c may be removed from portion 40 by cutting along the dotted lines shown in Figure 13c, for example, column a may be removed from portion 40 by cutting along dotted line C-C'.

[0126] In this example, rows a and d are the same height, and rows b and c are the same height. Columns i, ii, iii, and iv each have the same width, but can be different. Rows a, b, c, d can each be the same height.

[0127] By cutting along the dotted lines shown in Figure 13c, sixteen electrical devices of the type labelled 30 in Figure 6 are produced for subsequent use. Each electrical device so obtained is a child electrical device, since it was produced from assembly 38 (which is the parent electrical device).

[0128] Figure 14 is used to explain a method of using an electrical device 30 of the type shown in Figure 6 to form an interlayer ply comprising the electrical device 30 and a sheet of interlayer material 50, according to one embodiment of the present invention. Figure 14a is a plan view and Figure 14b is a cross-sectional view taken along line D-D'. As is apparent from the above, the electrical device 30 may be a sub-electrical device produced from an assembly of the type shown in Figure 13.

[0129] An opening 52 is created in the sheet of interlayer material 50 to leave a void therein. In this example, the void extends between both major surfaces of the sheet of interlayer material 50, although the void need not extend between both major surfaces of the sheet of interlayer material 50. The opening 52 has walls 52a extending between the major surfaces of the sheet of interlayer material 50.

[0130] A sheet of interlayer material 50 having an opening 52 therein is placed on a suitable support, or table (not shown). The electrical device 30 is then placed within the opening 52. The outer dimensions of the electrical device are slightly smaller than the major dimensions of the opening 52 so that the electrical device is not fixed within the opening 52.

[0131] Electrical device 30 is constructed so that its thickness (see label 27 in FIG. 6) is the same as or substantially the same as the thickness of the sheet of intermediate material 50, which may be between 0.38 mm and 0.76 mm.

[0132] According to one aspect of the invention, electrical device 30 is secured in an opening 52 in a sheet of interlayer material 50 using a suitable fastening means.

[0133] 15, a localized heat source is applied to the opening 52 and / or the top of the electrical device 30, i.e., the areas indicated by labels 53, 54. The localized heat locally softens and / or melts the interlayer material 50, thereby allowing the top of the electrical device 30 to be bonded to the wall 52a of the opening 52. The localized heat applied to the areas 53, 54 may also locally soften and / or melt the layer of adhesive 24b.

[0134] Similarly, localized heat may be applied to the lower end of opening 52 and / or electrical device 30, i.e., the areas indicated by labels 55, 56. Such localized heat may locally soften and / or melt interlayer material 50 and / or interlayer material 22c to bond the electrical device within opening 52.

[0135] 16, an adhesive is used to bond the electrical device 30 within the opening 52 in the sheet of interlayer material 50. When the electrical device 30 is placed in the opening 52 in the sheet of interlayer material 50, adhesive 57, 58 may be applied to the upper surface of the sheet of interlayer material 50 to contact at least a portion of the electrical device 30 and bond the electrical device to the opening 52. Similarly, adhesive 59, 60 may be applied to the lower surface of the sheet of interlayer material 50.

[0136] The adhesives 57, 58 may be applied as tie strips (i.e., adhesive tape) that connect the sheet of interlayer material 50 to the electrical device 30. In such embodiments, the tie strips need not extend across the entire major surface of the electrical device 30. However, in alternative embodiments, a sheet having a contact adhesive on its major surface may be used to connect the sheet of interlayer material 50 to the electrical device 30, in which case the sheet having the contact adhesive thereon may cover the entire electrical device 30 on one side to secure the electrical device 30 in the opening 52.

[0137] 16, the adhesive 59, 60 may extend into any gaps between the walls 52a of the opening 52 and the outer wall of the electrical device 30 to provide a bond therebetween. The amount of adhesive 59, 60 that extends into any gaps between the walls 52a of the opening 52 and the outer wall of the electrical device 30 may depend on the viscosity of the adhesive 59, 60.

[0138] 17 shows another embodiment in which layers of adhesive 61, 62 are used to bond electrical device 30 within an opening 52 in a sheet of interlayer material 50. The adhesive 61, 62 are applied to the exterior walls of electrical device 30 before the electrical device is placed in opening 52. The adhesive 61, 62 then contacts wall 52a of opening 52 to bond electrical device 30 thereto.

[0139] 14-17, the objective is to use a bonding means to secure electrical device 30 to an opening 52 in a sheet of interlayer material 50 to create an interlayer ply comprising the electrical device and the sheet of interlayer material. It is preferred to use a bonding means such as an adhesive to secure electrical device 30 to opening 52 in the sheet of interlayer material, however the adhesive may be a re-stickable adhesive such that electrical device 30 is releasably secured to opening 52.

[0140] Using an interlayer ply having an electrical device 30 secured to an opening 52 in a sheet of interlayer material as described above, a laminated glazing may be constructed as shown in Figures 18, 19 and 20. Each of Figures 18-20 is a schematic side view of the glazing.

[0141] In FIG. 18a, an interlayer ply 70 of the type shown in FIG. 15, 16, or 17 is shown between first and second sheets of glass 72, 74. The interlayer ply 70 bonds the first sheet of glass 72 to the second sheet of glass 74. Conventional lamination conditions, such as high temperature and pressure, may be used to produce the laminated glazing 76. The interlayer ply 70 provides an adequate adhesive bond to each of the first and second glass sheets 72, 74, in part because the major surfaces of the electrical device 30 are small compared to the major surfaces of the interlayer ply 70. Furthermore, the material forming the major surfaces of the electrical device 30 is itself adhesive.

[0142] Suitable glasses for the first and second sheets of glass 72, 74 include soda lime silica glass (often referred to as "soda lime silicate glass"). A typical soda lime silica glass composition is (by weight): SiO2 69-74%; Al2O3 0-3%; Na2O 10-16%; K2O 0-5%; MgO 0-6%; CaO 5-14%; SO3 0-2% and Fe2O3 0.005-2%. The glass composition may also contain other additives, such as refining aids and other colouring agents, which will typically be present in amounts up to 2%. The colour of transmitted glass may be measured according to recognised standards such as BS EN410.

[0143] For clarity, an exploded representation of the laminated glazing 76 is shown in Figure 18b.

[0144] In Figure 19a, an interlayer ply 70 of the type shown in Figures 15, 16 or 17 is shown between a first sheet of glass 72, 74 and a second sheet of glass 74. In addition, there is another ply (or sheet) of interlayer material 80, i.e., a ply (or sheet) of PVB, EVA, etc. The interlayer ply 80 is between the first sheet of glass 72 and the interlayer ply 70. The interlayer ply 70 is between a second sheet of glass 74 and the interlayer ply 80.

[0145] A first sheet of glass 72 is joined to a second sheet of glass 74 by an interlayer construction consisting of an interlayer ply 70 made in accordance with the present invention and a conventional ply of interlayer material 80. Conventional lamination conditions, such as high temperature and pressure, may be used to produce the laminated glazing 76'.

[0146] For clarity, an exploded view of the laminated glazing 76' is shown in Figure 19b.

[0147] In Figure 20a, an interlayer ply 70 of the type shown in Figures 15, 16, or 17 is shown between first and second sheets of glass 72, 74. Additionally, there is a first ply of interlayer material 80 and a second ply of interlayer material 80' between the first and second sheets of glass 72, 74.

[0148] A first interlayer ply 80 is between the first sheet of glass 72 and the interlayer ply 70. The interlayer ply 70 is between first and second conventional plies of interlayer material 80, 80'. A second interlayer ply 80' is between the interlayer ply 70 and the second glass sheet 74.

[0149] A first sheet of glass 72 is bonded to a second sheet of glass 74 by an interlayer structure consisting of an interlayer ply 70 made in accordance with the present invention arranged as described above, a first ply of interlayer material 80, and a second ply of interlayer material 80'. Conventional lamination conditions, e.g., high temperature and pressure, can be used to produce the laminated glazing 76''.

[0150] For clarity, an exploded view of the laminated glazing 76'' is shown in FIG. 20b.

[0151] In FIG. 19, the ply of interlayer material 80 may be replaced by another ply 70 made in accordance with an embodiment of the present invention.

[0152] In FIG. 20, either or both plies of interlayer material 80, 80' may be replaced with an interlayer ply made in accordance with one embodiment of the present invention.

[0153] If desired, additional plies of interlayer material (conventional or made in accordance with the present invention) may be used in the construction of the laminated glazing.

[0154] Figures 21-23 are used to explain how an additional flexible circuit 90 may be provided to assist in making electrical connections to electrically operable components mounted on a substrate, such as, for example, electrically operable devices of the type shown in Figures 1 and 2.

[0155] Figure 21 shows a schematic isometric view of the electrically operable device 1 shown in Figures 1 and 2 and described in the associated description. Figure 22 shows a schematic side view of Figure 21, i.e., looking in the direction of arrow 82.

[0156] 21 and 22, underlying the electrically operable device 1 is a sheet of EVA 22. The sheet of EVA 22 has a top major surface 22' and an opposite bottom major surface (not labeled). The electrically operable device 1 should be placed on the sheet of EVA 22 by moving the electrically operable device 1 in the direction of arrow 84 so that the electrically operable device 1 is in the position indicated by the dotted line 1' on the sheet of EVA. See also FIG. 3b.

[0157] After the electrically operable device 1 is placed on the sheet of EVA 22 , the flexible circuit 90 is placed over the electrically operable device 1 by moving the flexible circuit 90 in the direction of arrow 86 .

[0158] The flexible circuit 90 comprises a substrate 92 having a first major surface 92a and an opposing second major surface 92b. When the flexible circuit 90 is disposed on the electrically operable device 1, the second major surface 92b of the substrate 92 faces the first major surface 5 of the substrate 3.

[0159] At one end of the substrate 92 on its second major surface 92b are first and second electrical connector areas 94, 96. At an opposite end of the substrate 92 on its second major surface 92b are third and fourth electrical connector areas 98, 100.

[0160] The first electrical connector region 94 is in electrical communication with a third electrical connector region 98 via conductive tracks 102 on the second major surface 92b of the substrate 92 of the flexible circuit 90. The second electrical connector region 96 is in electrical communication with a third electrical connector region 100 via conductive tracks 104 on the second major surface 92b of the substrate 92 of the flexible circuit 90.

[0161] The conductive tracks 102, 104 may be screen printed conductive ink. Any or all of the first, second, third and fourth electrical connector regions 94, 96, 98, 100 may be screen printed conductive ink.

[0162] Substrate 92 of flexible circuit 90 is similar to substrate 3 of electrically operable device 1. However, substrate 92 is preferably more mechanically robust than substrate 3. For example, if the same material is used for substrate 3 and substrate 92, substrate 92 is typically thicker than substrate 3.

[0163] Alternatively, or similarly, substrate 3 and substrate 92 may be made of different materials, for example different plastic materials. In some embodiments, a useful property of substrate 92 is its ability to bend without breaking the conductive tracks 102, 104 on the second major surface 92b.

[0164] The flexible circuit 90 is used as an integral electrical connector to help provide power to the electrically operable components 9 of the electrically operable device 1 .

[0165] The first electrical connector region 94 on the substrate 92 of the flexible circuit 90 is positioned to align with the first electrical connector region 11 on the substrate 3 of the electrically operable device 1. The second electrical connector region 96 on the substrate 92 of the flexible circuit 90 is positioned to align with the second electrical connector region 13 on the substrate 3 of the electrically operable device 1 (indicated in FIG. 21 by a dotted line extending therebetween). When the flexible circuit 90 is positioned on the electrically operable device 1 as described above, power is provided to the electrically operable component 9 by providing power to the third and fourth electrical connector regions 98, 100 on the substrate 92 of the flexible circuit 90, because the first and second electrical connector regions 94, 96 on the substrate 92 are in electrical and mechanical communication with the respective first and second electrical connector regions 11, 13 on the substrate 3.

[0166] The third and fourth electrical connector regions 98, 100 are spaced from the first and second electrical connector regions 94, 96. The third and fourth electrical connector regions 98, 100 are also spaced from an edge of the substrate 92 such that it is possible to remove a portion of the substrate 92 by cutting along a line (shown as line M-M') between an edge of the substrate 92 and the third and fourth electrical connector regions 98, 100. The third and fourth electrical connector regions 98, 100 are also disposed on the substrate 3 in areas that are free of conductive regions or tracks on the first major surface of the substrate 3.

[0167] The connection between the first electrical connector area 94 on the substrate 3 of the flexible circuit and the first electrical connector area 11 on the substrate 5 of the electrically operable device 1 may be enhanced by known electrical bonding methods such as a localized spot of conductive adhesive, a localized application of anisotropic conductive adhesive, or the use of an anisotropic conductive adhesive film such as CP923CM25AC from Dexerials (http: / / www.dexerials.jp / en / products / ).

[0168] A schematic side view of the flexible circuit 90 on the electrically operable device 1 on a sheet of EVA 22 is shown in FIG. 23. In this figure, a space 105 is shown between the flexible circuit 90 and the electrically operable device 1. Referring to above, the space 105 is between the second major surface 92b of the substrate 92 of the flexible circuit 90 and the first major surface 5 of the substrate 3 of the electrically operable device 1. In an alternative embodiment, the second major surface 92b of the substrate 92 of the flexible circuit 90 or the first major surface 5 of the substrate 3 of the electrically operable device 1 may have a re-stickable adhesive thereon such that the substrate 92 is removably adhered to the substrate 3. In another alternative embodiment, there may be no space between the second major surface 92b of the substrate 92 of the flexible circuit 90 and the first major surface 5 of the substrate 3 of the electrically operable device 1.

[0169] In FIG. 23, the flexible circuit 90 is laminated at one end to an edge of the substrate 3 , however, the flexible circuit may extend beyond the edge of the substrate 3 of the electrically operable device 1 .

[0170] Figure 24 is used to explain how an electrical device according to one embodiment of the present invention is manufactured. Figure 24 is similar to Figure 12 above.

[0171] A plastic barrier 106 is disposed on the sheet of EVA 22. An airtight seal is created between the base of the barrier 106 and the first major surface 22' of the sheet of EVA 22. When viewed in plan view, in a similar manner as shown in FIG. 10, the barrier 106 completely surrounds the electrically operable device 1 with the flexible circuit 90 thereon.

[0172] A suitable liquid plastic is poured into the area enclosed by the barrier 106, completely covering the electrically operable device 1 having the flexible circuit 90 thereon. The layer of liquid plastic 108 is leveled to the level of the barrier 106 by a leveling step or by allowing the liquid to settle.

[0173] The layer of liquid plastic 108 is suitably cured to form a solid layer of plastic 108 that encapsulates the electrically operable device 1 having the flex circuit 90 thereon. That is, the electrically operable device 1 having the flex circuit 90 thereon is encapsulated between the solid layer of plastic 108 and the sheet of EVA 22. The solid layer of plastic 108 is also bonded to the first major surface 22' of the sheet of EVA 22. As will be readily appreciated, the liquid plastic is an adhesive.

[0174] As noted above, in Figures 23 and 24, a slight gap 105 is shown between the second major surface 92b of the substrate 92 and the first major surface 5 of the sheet of substrate 3 when the flexible circuit 90 is on the electrically operable device 1. The thickness of said gap 105 may be thin enough that when liquid plastic is poured into the area surrounded by the barrier 106, the viscosity of the liquid plastic prevents the liquid plastic from flowing into the gap. Alternatively, the flexible circuit 90 may be configured such that there is no gap between the second major surface 92b of the substrate 92 and the first major surface 5 of the substrate 3 when the flexible circuit board 90 is on the electrically operable device 1. Alternatively, or additionally, one or more regions of the second major surface 92b may be provided with a suitable re-stickable adhesive such that the substrate 92 is removably attached to the substrate 3 and / or the sheet of EVA 22 when the flexible circuit 90 is on the electrically operable device 1. A suitable re-stickable adhesive will help form a seal when the liquid plastic is poured onto the electrically operable device 1 .

[0175] The sealed electrically operable device 1 with the flexible circuit 90 thereon is used as a parent electrical device for the manufacture of a child electrical device. The electrically operable device 1 is fixed on the sheet of EVA 22 by the solid layer plastic 108 and is removed therefrom by cutting along the inner lines of the barrier 106, i.e. along the lines F-F' and G-G' shown in FIG. 24. The so manufactured electrical device 110 is shown in FIG. 25a. Here it can be seen that the electrically operable device 1 is substantially encapsulated between the portion 108' of the solidified plastic layer 108 and the portion 22'' of the sheet of EVA 22. If the child electrical device were manufactured by cutting along the line H-H' instead of along the line F-F', a subsequent cutting step would be required to access the flexible circuit 90, i.e. cutting substantially along the line F-F'.

[0176] In this example, the thickness 107 of the electrical device 110 is about 0.76 mm. A schematic isometric view of the electrical device 110 is shown in Figure 25b.

[0177] According to one aspect of the invention, an electrical device 110 may be incorporated into a large sheet of suitable interlayer material 112 having a thickness of about 0.76 mm in a manner similar to that described in connection with Figures 14-17. A schematic cross-sectional view of the interlayer ply 114 so produced is shown in Figure 26a, and a schematic isometric view of the interlayer ply 114 is shown in Figure 26b, where for clarity the electrical device 110 is shown removed from an opening 116 in the large sheet of suitable interlayer material 112.

[0178] The electrical device 110 may be coupled to the opening by using a suitable adhesive means as previously described, for example by using spots or strips of adhesive.

[0179] Although Figures 26a and 26b show only one electrical device 110 incorporated into a sheet of suitable interlayer material 112, there may be two or more such electrical devices incorporated into a sheet of suitable interlayer material 112.

[0180] The intermediate layer 114 may be used in the construction of laminated glazing of the type shown in Figures 18 to 20. A particular example that helps illustrate the advantage of the additional flexible circuit 90 is shown in Figure 27.

[0181] As is evident from Figures 26a and 26b, when electrical device 110 is incorporated into a sheet of suitable interlayer material 112, electrical device 110 may be manufactured by cutting along line H-H' instead of line F-F' shown in Figure 24, since an electrical device so manufactured will be completely surrounded by interlayer material 112 when in opening 116.

[0182] Figure 27 shows a schematic cross-section of a laminated glazing 120. The laminated glazing comprises a first sheet of soda-lime-silica glass 122 having a thickness of 2.1 mm and a second sheet of soda-lime-silica glass 124 also having a thickness of 2.1 mm. The first sheet of soda-lime-silica glass 122 is joined to the second sheet of soda-lime-silica glass by an interlayer ply 114 which includes an electrical device 110 fixed in an opening 116 in a sheet of suitable interlayer material 112.

[0183] An enlarged view of one end of the laminated glazing 120 is shown in FIG. 28. The portion 114' of the interlayer ply 114 extends beyond the edges of the first and second sheets of soda-lime-silica glass 122, 124. The portion 114' includes an end of the substrate 92 of the flexible circuit 90 having the third and fourth electrical connector regions 98, 100 thereon such that the third and fourth electrical connector regions 98, 100 are not between the first and second sheets of soda-lime-silica glass 122, 124. The first and second electrical connector regions 94, 96 are between the first and second sheets of soda-lime-silica glass 122, 124, as are the electrically operable components 9. A portion of the portion 114' is removed by cutting along line J-J', thereby providing access to the flexible circuit 90.

[0184] Because the bond between substrate 3 and substrate 92 is weak, for example to provide a re-adhesive adhesive to second major surface 92b of substrate 92 and / or first major surface 5 of substrate 3, in an electrically operable device as described above (or there may be no bond therebetween), a lower end of the electrical device may be folded downward (i.e., in the direction of arrow 117) thereby allowing access to third and fourth electrical connector regions 98, 100 on portion 92' of substrate 92 of flexible circuit 90.

[0185] Because the substrate 92 is mechanically stiffer and / or stronger and / or mechanically / chemically more robust than the substrate 3, the addition of the flexible circuit 90 may allow for a more reliable electrical connection to be made to provide power to the electrically operable components 9. For example, when an additional flexible circuit is not used and instead the first and / or second electrical connector regions 11, 13 extend beyond the edges of the first and second sheets of soda-lime-silica glass 122, 124, the first and / or second conductive tracks 15, 17 on the substrate 3 may be damaged unless the tracks are adequately mechanically robust. Furthermore, without providing the additional flexible circuit 90, a portion of the substrate 3 may be exposed, resulting in damage occurring with a risk of destroying the conductive tracks thereon. The provision of the flexible circuit 90 may reduce the occurrence of such damage because the substrate 92 of the flexible circuit 90 is mechanically stiffer and / or stronger and / or mechanically / chemically more robust than the substrate 3.

[0186] The present invention provides an electrical device and a method for manufacturing the electrical device. The electrical device may be incorporated into a sheet of interlayer material and the interlayer ply thus produced may be used in the manufacture of laminated glazing. Such laminated glazing may be flat or curved and finds particular application as vehicle and / or building windows.

Claims

1. 1. A method of manufacturing an electrical device, comprising the steps of: (i) providing a layer of interlayer material having a first major surface and a second opposing major surface; (ii) disposing at least a first electrically operable component on the first major surface of the layer of interlayer material, the first electrically operable component being mounted on a first circuit board; (iii) providing a layer of adhesive material to cover at least a portion of the first major surface of the layer of interlayer material and at least a portion of the first electrically operable component and / or at least a portion of the first circuit board; As a result, following step (iii), the first electrically operable component is secured to the layer of interlayer material by at least a portion of the layer of adhesive material; wherein prior to step (iii) a flexible circuit is disposed on said layer of interlayer material or said first circuit board, said flexible circuit comprising a substrate having a first major surface and an opposing second major surface, said first or second major surface of the substrate of said flexible circuit comprising a first electrical connector region thereon in electrical communication with a second electrical connector region on said first or second major surface of said substrate of said flexible circuit by means of a conductive track, wherein said flexible circuit is positioned such that said second electrical connector region on said substrate of said flexible circuit is in electrical, and preferably mechanical, communication with a first electrical connector region on said first circuit board.

2. 2. The method of claim 1 , wherein in step (ii), the first circuit board is disposed on the first major surface of the layer of interlayer material such that the first circuit board is between the layer of interlayer material and the first electrically operable component.

3. 3. The method according to claim 1 or claim 2, wherein in step (iii) the adhesive material is provided as a liquid, preferably by pouring or spraying to provide a layer of adhesive material.

4. 4. The method of claim 3, wherein step (iii) is followed by a solidification step, preferably wherein said solidification step of said liquid comprises a hardening and / or curing step, preferably wherein said solidification step of said liquid comprises a heating and / or irradiation step, preferably comprising an ultraviolet irradiation step.

5. 5. A method according to claim 3 or claim 4, wherein the liquid is levelled to achieve a uniform thickness over the first layer of interlayer material, more preferably to achieve a uniform thickness over the first major surface and / or the second major surface of the first layer of interlayer material.

6. 6. The method according to claim 4 or claim 5, wherein a surface of the solidified layer of adhesive material facing away from the first layer of interlayer material is textured and / or provided with a coating.

7. 7. The method of any one of claims 3 to 6, wherein the liquid comprises a two-component system comprising at least a first component and a second component, preferably wherein the first component is mixed with the second component before or after being subjected to step (iii).

8. 8. The method of claim 1, wherein the layer of adhesive material has a thickness of 0.3 mm to 3.0 mm, and / or the layer of interlayer material has a thickness of 0.3 mm to 2.0 mm, and / or the layer of adhesive material covers the entire electrically operable component and / or the entire first circuit board.

9. 9. A method according to any one of claims 1 to 8, wherein after step (i) a first barrier is provided on the first major surface of the layer of interlayer material or around a peripheral edge of the layer of interlayer material, and following step (ii) the first barrier surrounds the first circuit board such that at least a portion of the first circuit board is inside the first barrier, preferably the entire first circuit board is inside the first barrier.

10. 10. The method of claim 1, wherein following step (ii) at least a second electrically operable component is disposed on the layer of interlayer material, the second electrically operable component being mounted on a second circuit board, and the second electrically operable component being spaced apart from the first electrically operable device and / or the first circuit board being spaced apart from the second circuit board.

11. 11. The method of claim 10, wherein during step (iii), the layer of adhesive material also covers at least a portion of the second electrically operable component and / or at least a portion of the second circuit board, preferably wherein the layer of adhesive material also covers the entire second electrically operable component and / or the entire second circuit board, or following step (iii), a second layer of adhesive material is provided covering at least a portion of the second electrically operable component and / or at least a portion of the second circuit board, preferably wherein the second layer of adhesive material is provided as a liquid.

12. 12. The method of any one of claims 1 to 11, wherein following step (iii), at least a portion of the first circuit board having the first electrically operable component mounted thereon is removed from the layer of interlayer material, preferably by a cutting or punching step, to produce an electrical device which is a child electrical device.

13. 2. The method of claim 1, wherein the substrate of the flexible circuit comprises a third electrical connector region on its first or second major surface in electrical communication with a fourth electrical connector region on the first or second major surface of the substrate of the flexible circuit by a conductive track, and wherein the flexible circuit is positioned such that the fourth electrical connector region on the substrate of the flexible circuit is in electrical, and preferably mechanical, communication with a second electrical connector region on a first circuit board.

14. 14. A method according to any one of claims 1 to 13, further comprising, after step (iii), incorporating the electrical device into an opening in another sheet of interlayer material, wherein incorporating the electrical device into an opening in another sheet of interlayer material comprises: providing a sheet of interlayer material having a first major surface and a second opposing major surface; removing at least a first portion of the sheet of interlayer material to create an opening in the sheet of interlayer material, the opening in the sheet of interlayer material having at least a first wall between the first and second major surfaces of the sheet of interlayer material; positioning at least a portion of the electrical device in the opening; and fixing the electrical device to at least a portion of the first and / or second major surfaces of the sheet of interlayer material and / or to at least a portion of the first wall of the opening in the sheet of interlayer material using a bonding means.

15. The method of claim 14, wherein the electrical device is entirely within the opening and / or the coupling means comprises a fusion step and / or an adhesive.

16. 16. A method according to any one of the preceding claims, wherein in step (i) the layer of interlayer material is provided as a sheet of interlayer material.

17. 17. The method of any one of claims 1 to 16, wherein the interlayer material comprises polyvinyl butyral (PVB), a copolymer of ethylene such as ethylene vinyl acetate (EVA), or a polyurethane, in particular thermoplastic polyurethane (TPU), and / or the adhesive material comprises polyvinyl butyral (PVB), a copolymer of ethylene such as ethylene vinyl acetate (EVA), or a polyurethane, in particular thermoplastic polyurethane (TPU).

18. a first circuit board having a first major surface and a second opposing major surface, at least one electrically operable component mounted on the first circuit board; at least one layer of interlayer material having an outer major surface; at least one layer of adhesive material having an outer major surface; An electrical device comprising: wherein the first circuit board having the at least one electrically operable component attached thereto is between the outer major surface of at least one layer of interlayer material and the outer major surface of at least one layer of adhesive material; further comprising: the first circuit board being secured to the layer of interlayer material by at least the layer of adhesive material; the electrical device having a first exterior surface and a second opposing exterior surface; (a) the first exterior surface of the electrical device comprises the outer major surface of at least one layer of the interlayer material, and the second opposing exterior surface of the electrical device comprises the outer major surface of at least one layer of the adhesive material; or (b) the first exterior surface of the electrical device comprises the outer major surface of at least one layer of the adhesive material, and the second opposing exterior surface of the electrical device comprises the outer major surface of at least one layer of the interlayer material; wherein the electrically operable component has first and second input terminals for supplying power thereto, wherein a first circuit board comprises a first electrical connector area, the first electrical connector area of ​​the first circuit board being in electrical communication with the first input terminal of the electrically operable device, and further wherein the electrical device comprises a flexible circuit, the flexible circuit comprising a substrate having a first major surface and an opposing second major surface, the first or second major surface of the substrate of the flexible circuit comprising a first electrical connector area thereon in electrical communication with a second electrical connector area on the first or second major surface of the substrate of the flexible circuit by a conductive track, the first electrical connector area on the substrate of the flexible circuit being in electrical communication with a first electrical connector area on the first or second major surface of the substrate of the flexible circuit by a conductive track, and wherein said first electrical connector region of said flexible circuit is in electrical and mechanical communication with a first input terminal of said at least one electrically operable component, such that upon electrical communication of said second input terminal of said at least one electrically operable component with a first output terminal of a suitable power source and upon electrical communication of said second electrical connector region of said flexible circuit with a second output terminal of a suitable power source, preferably wherein said first electrical connector region of said flexible circuit and said second electrical connector region of said flexible circuit are on a second major surface of said substrate of said flexible circuit, and preferably wherein said first electrical connector region of said flexible circuit is in electrical communication with the second electrical connector region of said flexible circuit by a conductive track on said second major surface of said substrate of said flexible circuit.

1. An electrical device comprising:

19. The substrate of the flexible circuit comprises a third electrical connector region on the first or second major surface of the substrate of the flexible circuit in electrical communication with a fourth electrical connector region on the first or second major surface of the substrate of the flexible circuit by conductive tracks, the third electrical connector region on the substrate of the flexible circuit in electrical and mechanical communication with a second electrical connector region on the first circuit board, the second electrical connector region on the first circuit board in electrical communication with a second input terminal of at least one electrically operable component, wherein the fourth electrical connector region of the flexible circuit is connected to a first input terminal of a suitable power source.

20. The electrical device of claim 18, wherein when in electrical communication with an output terminal and when the second electrical connector region of the flexible circuit is in electrical communication with a second output terminal of a suitable power source, power is provided to at least one electrically operable component, preferably a third electrical connector region of the flexible circuit and the fourth electrical connector region of the flexible circuit are on the second major surface of the substrate of the flexible circuit, and preferably the third electrical connector region of the flexible circuit is in electrical communication with the fourth electrical connector region of the flexible circuit by a conductive track on the second major surface of the substrate of the flexible circuit.

20. 20. An electrical device as claimed in claim 18 or claim 19, wherein the second major surface of the substrate of the flexible circuit faces the first major surface of the first circuit board, preferably the second major surface of the substrate of the flexible circuit is in direct contact with at least part of the first major surface of the first circuit board and / or a temporary adhesive means is between at least part of the first major surface of the first circuit board and the second major surface of the substrate of the flexible circuit, preferably the temporary adhesive means is a re-stickable adhesive.

21. 21. The electrical device of any one of claims 18 to 20, wherein the electrical device is part of an interlayer ply, the interlayer ply suitable for joining two glass sheets together, the interlayer ply comprising a sheet of interlayer material having a first major surface and a second opposing major surface, the sheet of interlayer material having an opening therein, the opening having a wall extending between the first and second major surfaces of the sheet of interlayer material, the electrical device being disposed in the opening in the sheet of interlayer material and bonded to at least a part of the wall of the opening and / or to at least a part of the first and / or second major surfaces of the sheet of interlayer material, preferably the sheet of interlayer material comprises polyvinyl butyral (PVB), a copolymer of ethylene such as ethylene vinyl acetate (EVA), or a polyurethane, in particular thermoplastic polyurethane (TPU).

22. 22. The electrical device of any one of claims 18 to 21, wherein at least one of the at least one layer of interlayer material and the at least one layer of adhesive material comprises polyvinyl butyral (PVB), a copolymer of ethylene such as ethylene vinyl acetate (EVA), or a polyurethane, in particular thermoplastic polyurethane (TPU).

23. 23. A laminated glazing comprising at least one sheet of glazing material, preferably glass, and an electrical device according to any one of claims 18 to 22, wherein the electrical device is bonded to the at least one sheet of glazing material by the at least one interlayer material or by the at least one layer of adhesive material.

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