Electrostatic Chuck Device

Abstract

To provide an electrostatic chuck device capable of making the heat transferred from a heater element to a plate-shaped sample uniform in the plane.SOLUTION: An electrostatic chuck device includes an electrostatic chuck unit that electrostatically adsorbs a plate-shaped sample, a base unit that supports the electrostatic chuck unit, and a heater unit located between the electrostatic chuck unit and the base unit, the heater unit includes a heating layer, a first resin layer arranged on one side in the thickness direction of the heating layer, a second resin layer arranged on the other side in the thickness direction of the heating layer, a first adhesive layer that adheres the heating layer and the first resin layer, and a second adhesive layer that adheres the heating layer and the second resin layer, and the heating layer includes a band-shaped heater element that generates heat when a current flows, and a filling adhesive unit that is filled between the heater elements, and the first resin layer, the second resin layer, the first adhesive layer, and the second adhesive layer are made of sheet materials and the filled adhesive unit is made of fluid adhesive.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an electrostatic chuck device. [Background technology]

[0002] In the semiconductor manufacturing process, an electrostatic chuck device is used to hold a plate-shaped sample in a vacuum environment and maintain the plate-shaped sample at a desired temperature. For example, Patent Document 1 discloses a structure in which a thin plate-shaped heater element is disposed between an electrostatic chuck part and a base part. With such an electrostatic chuck device, it is possible to heat a relatively low-temperature area in the surface of the plate-shaped sample, thereby reducing the temperature difference that may occur in the surface of the plate-shaped sample. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5163349 Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional electrostatic chuck devices, if the adhesive layer that fixes the heater element is not uniform in thickness, there is a risk that the amount of heat transferred from the heater element to the plate-shaped sample will be uneven at various locations.

[0005] The present invention has been made in consideration of the above circumstances, and has an object to provide an electrostatic chuck device that makes the heat transferred from a heater element to a plate-shaped sample uniform within the surface. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems, one aspect of the present invention is an electrostatic chuck device comprising: an electrostatic chuck portion that electrostatically attracts the plate-shaped sample; a base portion that supports the electrostatic chuck portion; and a heater portion disposed between the electrostatic chuck portion and the base portion, wherein the heater portion comprises a heat generating layer, a first resin layer disposed on one side of the heat generating layer in a thickness direction, a second resin layer disposed on the other side of the heat generating layer in the thickness direction, a first adhesive layer that bonds the heat generating layer and the first resin layer, and a second adhesive layer that bonds the heat generating layer and the second resin layer, wherein the heat generating layer has a band-shaped heater element that generates heat when a current flows therethrough, and a filled adhesive portion that is filled between the heater elements, and the first resin layer, the second resin layer, the first adhesive layer, and the second adhesive layer are made of sheet materials.

[0007] In one aspect of the present invention, the filling adhesive portion may be made of a fluid adhesive.

[0008] In one aspect of the present invention, the first resin layer and the second resin layer may have irregular fillers dispersed therein.

[0009] In one aspect of the present invention, the materials constituting the first resin layer and the second resin layer may be of the same composition, and the materials constituting the first adhesive layer, the second adhesive layer and the filling adhesive portion may be of the same composition.

[0010] In one aspect of the present invention, the first resin layer and the second resin layer may have a modulus of elasticity greater than a modulus of elasticity of the first adhesive layer, the second adhesive layer and the filled adhesive portion.

[0011] In one aspect of the present invention, a side surface of the heater element may be a concave curved surface. Effect of the Invention

[0012] According to the present invention, it is possible to provide an electrostatic chuck device that makes the heat transferred from the heater element to the plate-shaped sample uniform within the surface. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a cross-sectional view of an electrostatic chuck device according to one embodiment. [Diagram 2] FIG. 2 is a schematic cross-sectional view of a heater portion of an electrostatic chuck device according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an electrostatic chuck device 1 according to the present invention will be described with reference to the drawings. Note that the drawings used in the following description show characteristic parts in an enlarged scale for convenience, and the dimensional ratios of each component may differ from the actual ones. In addition, the materials, dimensions, etc. exemplified in the following description are merely examples, and the present invention is not limited thereto, and may be appropriately changed without departing from the gist of the present invention.

[0015] FIG. 1 is a cross-sectional view of an electrostatic chuck device 1 of the present embodiment. The electrostatic chuck device 1 includes an electrostatic chuck portion 2 that electrostatically adsorbs a plate-shaped sample W, a temperature adjustment base portion (base portion) 3 that supports the electrostatic chuck portion 2, and a heater portion 8 that is disposed between the electrostatic chuck portion 2 and the temperature adjustment base portion 3.

[0016] In the following description, each part of the electrostatic chuck device 1 will be described with the side on which the plate-shaped sample W is mounted relative to the electrostatic chuck portion 2 as the upper side, and the side on which the temperature adjustment base portion 3 faces as the lower side. However, the up-down direction here is merely a direction used for the sake of simplicity of description, and does not limit the position of the electrostatic chuck device 1 during use.

[0017] The electrostatic chuck device 1 has a through hole 28 provided penetrating from the temperature adjustment base portion 3 to the electrostatic chuck portion 2 in the thickness direction thereof. For example, a lift pin for removing a plate-shaped sample is inserted into the through hole 28. In this case, a cylindrical insulator 29 is provided on the inner periphery of the through hole 28. A cooling gas for cooling the plate-shaped sample may be supplied to the through hole 28. The cooling gas supplied to the through hole 28 is ejected from the mounting surface 11a to cool the plate-shaped sample.

[0018] The electrostatic chuck portion 2 includes a mounting plate 11 having an upper surface serving as a mounting surface 11a on which a plate-shaped sample W such as a semiconductor wafer is placed, a support plate 12 which is integrated with the mounting plate 11 and supports the bottom side of the mounting plate 11, an electrostatic adsorption electrode (electrostatic adsorption internal electrode) 13 provided between the mounting plate 11 and the support plate 12, and an insulating layer 14 which insulates the periphery of the electrostatic adsorption electrode 13.

[0019] The mounting plate 11 and the support plate 12 are disk-shaped with the same shape of the overlapping surfaces and are made of an insulating ceramic sintered body that has mechanical strength and durability against corrosive gases and their plasma, such as an aluminum oxide-silicon carbide (Al2O3-SiC) composite sintered body, an aluminum oxide (Al2O3) sintered body, an aluminum nitride (AlN) sintered body, or an yttrium oxide (Y2O3) sintered body.

[0020] A plurality of protrusions 11b having a diameter smaller than the thickness of the plate-shaped sample are formed at predetermined intervals on the mounting surface 11a of the mounting plate 11. The protrusions 11b support the plate-shaped sample W.

[0021] The total thickness including the mounting plate 11, support plate 12, electrostatic attraction electrode 13 and insulating layer 14, that is, the thickness of the electrostatic chuck portion 2, is, for example, 0.7 mm or more and 5.0 mm or less.

[0022] For example, if the thickness of the electrostatic chuck portion 2 is less than 0.7 mm, it becomes difficult to ensure the mechanical strength of the electrostatic chuck portion 2. If the thickness of the electrostatic chuck portion 2 exceeds 5.0 mm, the heat capacity of the electrostatic chuck portion 2 becomes large, the thermal responsiveness of the plate-shaped sample W placed thereon deteriorates, and due to increased lateral heat transfer of the electrostatic chuck portion, it becomes difficult to maintain the in-plane temperature of the plate-shaped sample W at a desired temperature pattern. Note that the thicknesses of the various portions described here are merely examples and are not limited to the above ranges.

[0023] The electrostatic attraction electrode 13 is used as an electrode for electrostatic chuck for generating an electric charge and fixing the plate-shaped sample W by electrostatic attraction force, and its shape and size are appropriately adjusted depending on the application.

[0024] The electrostatic attraction electrode 13 is preferably formed from conductive ceramics such as an aluminum oxide-tantalum carbide (Al2O3-Ta4C5) conductive composite sintered compact, an aluminum oxide-tungsten carbide (Al2O3-W) conductive composite sintered compact, an aluminum oxide-silicon carbide (Al2O3-SiC) conductive composite sintered compact, an aluminum nitride-tungsten (AlN-W) conductive composite sintered compact, an aluminum nitride-tantalum (AlN-Ta) conductive composite sintered compact, an yttrium oxide-molybdenum (Y2O3-Mo) conductive composite sintered compact, or a high-melting point metal such as tungsten (W), tantalum (Ta), molybdenum (Mo), etc.

[0025] The thickness of the electrostatic attraction electrode 13 is not particularly limited, but may be, for example, 0.1 μm or more and 100 μm or less, and more preferably 5 μm or more and 20 μm or less.

[0026] If the thickness of the electrostatic attraction electrode 13 is less than 0.1 μm, it becomes difficult to ensure sufficient conductivity. If the thickness of the electrostatic attraction electrode 13 exceeds 100 μm, cracks are likely to occur at the bonding interfaces between the electrostatic attraction electrode 13 and the mounting plate 11 and the support plate 12 due to the difference in thermal expansion coefficient between the electrostatic attraction electrode 13 and the mounting plate 11 and the support plate 12.

[0027] The electrostatic attraction electrode 13 having such a thickness can be easily formed by a film forming method such as a sputtering method or a vapor deposition method, or a coating method such as a screen printing method.

[0028] The insulating layer 14 surrounds the electrostatic attraction electrode 13 to protect the electrode 13 from corrosive gas and its plasma, and also bonds and integrates the boundary between the mounting plate 11 and the support plate 12, i.e., the outer periphery region other than the electrostatic attraction electrode 13. The insulating layer 14 is made of an insulating material having the same composition or the same main component as the material constituting the mounting plate 11 and the support plate 12.

[0029] A power supply terminal 15 for applying a DC voltage to the electrostatic attraction electrode 13 is connected to the electrostatic attraction electrode 13. The power supply terminal 15 is inserted into a through hole 16 that penetrates the temperature adjustment base part 3, the heater part 8, and the support plate 12 in the thickness direction. An insulator 15a having insulating properties is provided on the outer periphery of the power supply terminal 15, and the power supply terminal 15 is insulated from the metallic temperature adjustment base part 3 by this insulator 15a.

[0030] The material of the portion (extraction electrode) of the power supply terminal 15 that is connected to the electrostatic attraction electrode 13 and inserted into the support plate 12 is not particularly limited as long as it is a conductive material with excellent heat resistance, but it is preferable that the thermal expansion coefficient is close to that of the electrostatic attraction electrode 13 and the support plate 12. For example, it is made of a conductive ceramic material such as Al2O3-TaC.

[0031] Of the power supply terminal 15, the portion inserted into the temperature adjusting base portion 3 is made of a metal material such as tungsten (W), tantalum (Ta), molybdenum (Mo), niobium (Nb), or a Kovar alloy.

[0032] The temperature adjustment base part 3 is a thick, disk-like member for adjusting the temperature of the electrostatic chuck part 2 to a desired temperature. As the temperature adjustment base part 3, for example, a water-cooled base having a flow path 3A formed therein for circulating water is suitable.

[0033] The material constituting the temperature adjustment base part 3 is not particularly limited as long as it is a metal having excellent thermal conductivity, electrical conductivity, and workability, or a composite material containing such a metal, and for example, aluminum (Al), an aluminum alloy, copper (Cu), a copper alloy, stainless steel (SUS), etc. are preferably used. At least the surface of the temperature adjustment base part 3 exposed to plasma is preferably anodized or has an insulating film such as alumina formed thereon.

[0034] FIG. 2 is a schematic cross-sectional view of the heater portion 8. As shown in FIG. The heater section 8 includes a heat generating layer 85, a first resin layer 81, a second resin layer 82, a first adhesive layer 83, and a second adhesive layer 84.

[0035] The first resin layer 81 is disposed on one side (upper side) of the heat generating layer 85 in the thickness direction. The second resin layer 82 is disposed on the other side (lower side) of the heat generating layer 85 in the thickness direction. The first adhesive layer 83 is disposed between the heat generating layer 85 and the first resin layer 81, and bonds the heat generating layer 85 and the first resin layer 81 together. The second adhesive layer 84 is disposed between the heat generating layer 85 and the second resin layer 82, and bonds the heat generating layer 85 and the second resin layer 82 together.

[0036] Although not shown, it is preferable that an adhesive layer be provided between the first resin layer 81 and the electrostatic chuck portion 2 to bond them together. Similarly, it is preferable that an adhesive layer be provided between the second resin layer 82 and the temperature adjustment base portion 3 to bond them together. Each layer of the heater section 8 will be described in detail below.

[0037] The heat generating layer 85 has a belt-shaped heater element 5 and a filled adhesive portion 86. The thickness of the heat generating layer 85 is, for example, about 30 μm to 60 μm. The thickness of the heater element 5 and the filled adhesive portion 86 is the same as the thickness of the heat generating layer 85.

[0038] The heater element 5 is composed of a strip-shaped resistance heating member. The heater element 5 is manufactured by processing a non-magnetic metal thin plate, such as an Inconel (registered trademark) thin plate, a titanium thin plate, a tungsten (W) thin plate, or a molybdenum (Mo) thin plate, into a desired heater shape, for example, by processing the overall outline of a meandering strip-shaped conductive thin plate into a circular shape by photolithography or laser processing. The heater element 5 is disposed in a meandering manner within the heat generating layer 85. The heater element 5 generates heat when a current flows through it.

[0039] Power supply terminals 17 are connected to both ends of the heater element 5. The power supply terminals 17 pass current through the heater element 5. A cylindrical insulating insulator 18 is attached to the outer circumferential surface of the power supply terminal 17, and the temperature adjustment base 3 and the power supply terminal 17 are insulated from each other.

[0040] The side surfaces 5a of the heater element 5 are concavely curved surfaces. Here, the side surfaces 5a of the heater element 5 refer to the surfaces facing both sides of the heater element 5 in the width direction.

[0041] The filling adhesive portion 86 is filled between the heater elements 5 which extend in a serpentine manner. The filling adhesive portion 86 has fluidity in an uncured state. That is, the filling adhesive portion 86 is made of a fluid adhesive. The filling adhesive portion 86 holds the heater elements 5 when cured. Furthermore, the filling adhesive portion 86 contributes to uniform heating of the heat generating layer 85 by filling the gaps between the heater elements 5.

[0042] The filling adhesive portion 86 contacts the side surface 5a of the heater element 5. As described above, since the side surface 5a is a concave curved surface, the filling adhesive portion 86 restricts the movement of the heater element 5 in the thickness direction. The heater element 5 is made of a metal material, and the filling adhesive portion 86 is made of a resin material. Therefore, there is a large difference between the thermal expansion coefficient of the heater element 5 and the thermal expansion coefficient of the filled resin portion 86. According to this embodiment, since the side surface 5a of the heater element 5 is a concave curved surface, even if stress occurs between the heater element 5 and the filling adhesive portion 86 due to the difference in thermal expansion coefficient, it is possible to suppress peeling between them.

[0043] The first resin layer 81 and the second resin layer 82 sandwich the heat generating layer 85 from both sides in the thickness direction. As a result, the first resin layer 81 and the second resin layer 82 increase the withstand voltage of the heater section 8.

[0044] The first resin layer 81 and the second resin layer 82 each have a thickness of about 40 μm. The first resin layer 81 and the second resin layer 82 are made of an insulating resin material. The first resin layer 81 and the second resin layer 82 are made of an adhesive resin material having heat resistance and insulating properties, such as polyimide resin, silicone resin, epoxy resin, etc.

[0045] The first resin layer 81 and the second resin layer 82 are dispersed with irregular filler 7. As the filler 7, irregular particles are preferably used, and calcium phosphate, aluminum nitride, silicon oxide, aluminum oxide, YAG, SmAlO3, etc. are suitable, and one or more of these can be selected. Here, irregular means that the shape and size of the dispersed filler 7 are not uniform. Each filler 7 has a volume equivalent to a diameter of 1 μm to 5 μm or less when converted into a sphere. In addition, each filler 7 has an aspect ratio of about 1.5 to 2. The filler 7 is preferably contained in the first resin layer 81 and the second resin layer 82 in an amount of 0.01 volume % or more and 5.0 volume % or less, and more preferably in an amount of 0.01 volume % or more and 3.0 volume % or less.

[0046] The first resin layer 81 and the second resin layer 82 contain the filler 7, and thus have higher thermal conductivity than when the filler 7 is not contained. According to this embodiment, the increased thermal conductivity of the first resin layer 81 allows the heat of the heat generating layer 85 to be efficiently transferred to the plate-shaped specimen W via the electrostatic chuck part 2. In addition, the increased thermal conductivity of the first resin layer 81 allows the heating responsiveness of the plate-shaped specimen W due to the heat generated by the heater element 5 to be improved. Furthermore, the increased thermal conductivity of the first resin layer 81 and the second resin layer 82 allows the cooling efficiency of the plate-shaped specimen W by the temperature adjustment base part 3 to be improved.

[0047] In the first resin layer 81 and the second resin layer 82, it is preferable that the major axis direction of the filler 7 is aligned along a direction (hereinafter referred to as a planar direction) perpendicular to the thickness direction of each layer. This enhances the heat transfer properties along the planar direction of the first resin layer 81 and the second resin layer 82, and can improve the thermal uniformity in the planar direction of the first resin layer 81 and the second resin layer 82. As a result, this can contribute to improving the thermal uniformity of the plate-shaped sample W mounted on the electrostatic chuck portion 2.

[0048] A part of the amorphous filler 7 contained in the first resin layer 81 is exposed at the interface with the first adhesive layer 83. As a result, fine irregularities are formed on the surface of the first resin layer 81, and an anchor effect is exerted to increase the bonding strength between the first resin layer 81 and the first adhesive layer 83. Similarly, since the second resin layer 82 contains the filler 7, fine irregularities are formed between the second resin layer 82 and the second adhesive layer 84, and the bonding strength with the second adhesive layer 84 is increased.

[0049] The first resin layer 81 and the second resin layer 82 are made of sheet material. Therefore, the first resin layer 81 and the second resin layer 82 have a uniform thickness throughout. The first resin layer 81 is formed in a sheet shape in advance, and is laminated and assembled on the first adhesive layer 83, which is the lower layer. Similarly, the second resin layer 82 is formed in a sheet shape in advance, and is laminated and assembled on the temperature adjusting base part 3, which is the lower layer.

[0050] The first adhesive layer 83 is provided to adhere the heat generating layer 85 including the heater element 5 to the first resin layer 81. Similarly, the second adhesive layer 84 is provided to adhere the heat generating layer 85 to the second resin layer 82. The first adhesive layer 83 and the second adhesive layer 84 each have a thickness of about 10 μm. The first adhesive layer 83 and the second adhesive layer 84 are made of an adhesive resin material having heat resistance and insulating properties, such as a fluororesin, a polyimide resin, a silicone resin, or an epoxy resin.

[0051] The first adhesive layer 83 and the second adhesive layer 84 do not contain a filler. That is, the heater section 8 has adhesive layers (the first adhesive layer 83 and the second adhesive layer 84) that do not contain a filler between the heat generating layer 85 and the first resin layer 81, and between the heat generating layer 85 and the second resin layer 82. Since the first adhesive layer 83 and the second adhesive layer 84 do not contain a filler, they are more flexible than when they contain a filler. Therefore, the first adhesive layer 83 can uniformly bond the heater element 5 and the first resin layer 81 by following the unevenness and undulations of the surfaces. Similarly, the second adhesive layer 84 can uniformly bond the heater element 5 and the second resin layer 82 by following the unevenness and undulations of the surfaces. This can suppress the decrease in thermal conductivity and the unevenness of thermal conductivity caused by uneven adhesion.

[0052] In this embodiment, not only the first adhesive layer 83 and the second adhesive layer 84 but also the filled adhesive portion 86 do not contain a filler and are more flexible than the first resin layer 81 and the second resin layer 82. That is, the elastic modulus of the first resin layer 81 and the second resin layer 82 is greater than the elastic modulus of the first adhesive layer 83, the second adhesive layer 84, and the filled adhesive portion 86. The filled adhesive portion 86 is made of an adhesive resin material having heat resistance and insulating properties, such as a fluororesin, a polyimide resin, a silicone resin, or an epoxy resin.

[0053] According to this embodiment, the first adhesive layer 83, the second adhesive layer 84, and the filled adhesive portion 86 have a low elastic modulus and flexibility, and therefore can sufficiently relieve thermal stress between the first resin layer 81 and the second resin layer 82 and the heater element 5. This makes it possible to suppress deformation (warping) of the heater portion 8 caused by thermal stress.

[0054] The first adhesive layer 83 and the second adhesive layer 84 are made of a sheet material. That is, the first adhesive layer 83 and the second adhesive layer 84 are sheet-like adhesives. Therefore, the first adhesive layer 83 and the second adhesive layer 84 have a uniform thickness over the entirety. The first adhesive layer 83 is formed in a sheet shape in advance, and is laminated and attached on the heating layer 85, which is the lower layer. Similarly, the second adhesive layer 84 is formed in a sheet shape in advance, and is laminated and attached on the second resin layer 82, which is the lower layer.

[0055] The first adhesive layer 83 and the second adhesive layer 84 are bonded by heat pressing in a state in which they are laminated together with the first resin layer 81, the heat generating layer 85, and the second resin layer 82. This allows the layers 81, the second resin layer 82, the first adhesive layer 83, and the second adhesive layer 84 to be bonded to one another while maintaining the uniformity of their thicknesses.

[0056] According to this embodiment, the first resin layer 81, the second resin layer 82, the first adhesive layer 83, and the second adhesive layer 84 are made of sheet materials, so that the variation in thickness is suppressed. As a result, the heat transferred from the heater element 5 to the plate-shaped sample W can be made uniform within the plane. In addition, when the plate-shaped sample W is cooled on the temperature adjustment base part 3, the heat transferred from the plate-shaped sample W to the temperature adjustment base part 3 can be made uniform within the plane, and the temperature distribution of the plate-shaped sample W can be made uniform.

[0057] In this embodiment, the materials constituting the first resin layer 81 and the second resin layer 82 have the same composition, and the materials constituting the first adhesive layer 83, the second adhesive layer 84, and the filling adhesive portion 86 have the same composition. Therefore, in the heater portion 8, the compositions of the layers disposed on one side and the other side in the thickness direction of the heat generating layer 85 match each other. For this reason, it is possible to suppress residual thermal stress inside the heater portion 8 when the heater portion 8 is bonded by heat pressing, and it is possible to increase the durability of the heater portion 8.

[0058] According to this embodiment, the material constituting the filling adhesive portion 86 has the same composition as the material constituting the first adhesive layer 83 and the second adhesive layer 84. Therefore, it is possible to suppress the occurrence of thermal stress at the boundary between the filling adhesive portion 86 and the first adhesive layer 83 and at the boundary between the filling adhesive portion 86 and the second adhesive layer 84, and to suppress peeling between the layers.

[0059] Although the embodiments of the present invention have been described above, each configuration and their combinations in the embodiments are merely examples, and addition, omission, substitution, and other modifications of the configurations are possible without departing from the spirit of the present invention. Furthermore, the present invention is not limited to the embodiments. [Explanation of symbols]

[0060] Reference Signs List 1...electrostatic chuck device, 2...electrostatic chuck portion, 3...temperature adjustment base portion (base portion), 5...heater element, 5a...side surface, 7...filler, 8...heater portion, 81...first resin layer, 82...second resin layer, 83...first adhesive layer, 84...second adhesive layer, 85...heat generating layer, 86...filled adhesive portion, W...plate-shaped sample

Claims

1. an electrostatic chuck portion that electrostatically attracts a plate-shaped sample; A base portion supporting the electrostatic chuck portion; a heater portion disposed between the electrostatic chuck portion and the base portion, The heater unit includes: A heating layer; a first resin layer disposed on one side of the heat generating layer in a thickness direction; a second resin layer disposed on the other side of the heat generating layer in the thickness direction; a first adhesive layer that bonds the heat generating layer and the first resin layer; a second adhesive layer that adheres the heat generating layer and the second resin layer, The heat generating layer is A strip-shaped heater element that generates heat when an electric current flows through it; and a filling adhesive portion filled between the heater elements, the first resin layer, the second resin layer, the first adhesive layer, and the second adhesive layer are made of sheet materials; Amorphous fillers are dispersed in the first resin layer and the second resin layer. Electrostatic chuck device.

2. An electrostatic chuck portion that electrostatically adsorbs a plate-shaped sample; A base portion supporting the electrostatic chuck portion; a heater portion disposed between the electrostatic chuck portion and the base portion, The heater unit includes: A heating layer; a first resin layer disposed on one side of the heat generating layer in a thickness direction; a second resin layer disposed on the other side of the heat generating layer in the thickness direction; a first adhesive layer that bonds the heat generating layer and the first resin layer; a second adhesive layer that adheres the heat generating layer and the second resin layer, The heat generating layer is A strip-shaped heater element that generates heat when an electric current flows through it; and a filling adhesive portion filled between the heater elements, the first resin layer, the second resin layer, the first adhesive layer, and the second adhesive layer are made of sheet materials; The elastic modulus of the first resin layer and the second resin layer is greater than the elastic modulus of the first adhesive layer, the second adhesive layer, and the filling adhesive portion. Electrostatic chuck device.

3. An electrostatic chuck portion that electrostatically adsorbs a plate-shaped sample; A base portion supporting the electrostatic chuck portion; a heater portion disposed between the electrostatic chuck portion and the base portion, The heater unit includes: A heating layer; a first resin layer disposed on one side of the heat generating layer in a thickness direction; a second resin layer disposed on the other side of the heat generating layer in the thickness direction; a first adhesive layer that bonds the heat generating layer and the first resin layer; a second adhesive layer that adheres the heat generating layer and the second resin layer, The heat generating layer is A strip-shaped heater element that generates heat when an electric current flows through it; and a filling adhesive portion filled between the heater elements, the first resin layer, the second resin layer, the first adhesive layer, and the second adhesive layer are made of sheet materials; The side surface of the heater element is a concave curved surface. Electrostatic chuck device.

4. The filling adhesive portion is made of a fluid adhesive. The electrostatic chuck device according to any one of claims 1 to 3.

5. the first resin layer and the second resin layer are made of the same material; The materials constituting the first adhesive layer, the second adhesive layer and the filling adhesive portion have the same composition. The electrostatic chuck device according to any one of claims 1 to 4.

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