Vacuum bonding device

Abstract

To provide a vacuum bonding device capable of making the properties of the adhesive uniform.SOLUTION: A vacuum bonding device 1 includes: a vacuum chamber 5 capable of accommodating a lower member (lower board K2) and an upper member (upper board K1) in a vacuum environment; a lower table 4 on which the lower member is placed in the vacuum chamber; an upper table 3 that holds the upper member in the vacuum chamber; a table temperature control mechanism 60 that adjusts the temperature of either or both of the lower table and the upper table for each arbitrarily set area; a vertical movement mechanism (pin vertical movement mechanism 80) that moves the upper table in the vertical direction; and a vacuum pump mechanism P0 that executes vacuuming to discharge the gas inside the vacuum chamber to the outside.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a vacuum lamination apparatus. [Background technology]

[0002] Conventionally, there has been a vacuum lamination system in which two components, one of which has an adhesive applied thereto, are arranged opposite each other, and the surroundings of the two components are put into a vacuum state, and then the pressure is returned to atmospheric pressure to bond the two components together (see, for example, Patent Documents 1 and 2). Here, the vacuum lamination system will be described as being used in a substrate assembly system that bonds an upper substrate (glass substrate) and a lower substrate (glass substrate) together to assemble a substrate such as a liquid crystal panel.

[0003] A vacuum bonding system used as a substrate assembly system comprises a vacuum bonding device (substrate assembly device) that assembles substrates by bonding an upper substrate and a lower substrate together in a vacuum chamber, a control device that controls the operation of the vacuum bonding device, and a transport device that transports the upper substrate and the lower substrate into the vacuum chamber of the vacuum bonding device and transports substrates assembled by the vacuum bonding device out of the vacuum chamber.

[0004] The vacuum lamination device has a vacuum chamber in which an upper chamber and a lower chamber can be freely joined and separated, a vacuum pump mechanism for removing gas from the vacuum chamber, and an upper table and a lower table arranged vertically opposite each other in the vacuum chamber. The vacuum lamination device holds an upper substrate on the upper table so that the upper substrate faces the lower table, and holds a lower substrate on which liquid crystal has been dropped on the lower table. An adhesive is applied to one of the upper and lower substrates. The vacuum lamination device operates the vacuum pump mechanism with the upper and lower chambers joined together to create a vacuum in the vacuum chamber, and pressurizes the upper and lower substrates with the upper table in the vacuum, thereby bonding the upper and lower substrates together with the adhesive applied to one of the substrates. Hereinafter, the operation of creating a vacuum in the vacuum chamber is referred to as "vacuum drawing".

[0005] After that, the vacuum lamination device opens the inside of the vacuum chamber to the atmosphere, and pressurizes the upper and lower substrates at atmospheric pressure to crush the adhesive, and finally bonds the upper and lower substrates together until a predetermined cell gap is reached. In this way, the vacuum lamination system assembles substrates such as liquid crystal panels. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent No. 4379435 [Patent Document 2] Patent No. 5837247 Summary of the Invention [Problem to be solved by the invention]

[0007] However, as will be described below, there is still room for improvement in the conventional vacuum lamination apparatus in terms of making the adhesive properties uniform from area to area.

[0008] For example, circuits and wiring of various configurations are embedded in each area of ​​the board, and therefore the amount of heat stored and the efficiency of heat transfer differ from area to area on the board. In an atmospheric environment where the surroundings are at atmospheric pressure, air convection occurs around the substrate. Therefore, even if the heat storage amount and heat transfer efficiency of the substrate differ from area to area, the heat stored in each area of ​​the substrate is transferred to the surroundings and diffused by air convection. As a result, in an atmospheric environment, the surface temperature of the substrate becomes almost uniform over the entire area. However, in a vacuum environment where the surroundings are in a vacuum state, there is no air convection around the substrate, and the heat stored in each area of ​​the substrate is not transferred to the surroundings by air convection, resulting in the surface temperature of the substrate differing greatly from area to area.

[0009] Incidentally, in bonding the upper and lower substrates together, in response to recent demands for assembling a wide variety of substrates, it is sometimes necessary to use an adhesive whose properties, such as viscosity, vary significantly with temperature. However, in a vacuum environment, the surface temperature of the substrate varies greatly from area to area, causing the adhesive's properties, such as viscosity, to vary significantly, which can result in, for example, the amount of the adhesive collapsing varying from area to area.

[0010] In conventional vacuum bonding devices, when using an adhesive whose viscosity and other properties vary greatly with temperature, there was a possibility that when the adhesive was crushed by applying pressure to the upper and lower substrates at atmospheric pressure, it would be impossible to bond the upper and lower substrates together until the specified cell gap was reached uniformly across the entire area.

[0011] The present invention has been made to solve the above-mentioned problems, and has as its main object to provide a vacuum lamination apparatus that can make the properties of the adhesive uniform. [Means for solving the problem]

[0012] In order to achieve the above object, the present invention includes a vacuum chamber capable of storing a lower member and an upper member under a vacuum environment, a lower table on which the lower member is placed within the vacuum chamber, an upper table which holds the upper member within the vacuum chamber, a temperature sensor which detects the temperature of one or both of the lower table and the upper table for each arbitrarily set area, and a control unit which controls each of the parts, the control unit including a memory unit which stores set temperature determination data which specifies a set temperature at which the temperature of each of the areas detected by the temperature sensor under a vacuum environment becomes uniform, and a table temperature adjustment mechanism which adjusts the temperature of each of the areas to a set temperature determined by the set temperature determination data stored in the memory unit based on the temperature of each of the areas detected by the temperature sensor under a vacuum environment. When cooling a table whose temperature is to be adjusted, the temperature of the table temperature adjustment mechanism is equal to or higher than (room temperature -10)°C and equal to or lower than room temperature. It is a vacuum lamination device.

[0013] The vacuum lamination device of the present invention can adjust the temperature of the table for each area, so that the adhesive properties can be made uniform in all areas. This makes it possible to make the amount of adhesive crushing uniform in all areas, for example. Other means will be described later. Effect of the Invention

[0014] According to the present invention, the adhesive properties can be made uniform. [Brief description of the drawings]

[0015] [Figure 1] FIG. 1 is a diagram showing a configuration of a vacuum bonding system according to a first embodiment. [Diagram 2] FIG. 1 is a diagram (1) showing a schematic configuration of a table temperature adjustment mechanism of a vacuum lamination apparatus according to the first embodiment. [Diagram 3] FIG. 2 is a diagram (2) showing a schematic configuration of a table temperature adjustment mechanism of the vacuum lamination apparatus according to the first embodiment. [Figure 4] FIG. 3 is a diagram showing a schematic configuration of a table temperature adjustment mechanism of the vacuum lamination apparatus according to the first embodiment. [Diagram 5] FIG. 4 is a schematic diagram showing the configuration of a table temperature adjustment mechanism of the vacuum lamination apparatus according to the first embodiment; [Figure 6] FIG. 2 is a diagram showing the configuration of a control device used in the first embodiment. [Figure 7] 4 is a flowchart showing the operation of the vacuum bonding system according to the first embodiment. [Figure 8] FIG. 4 is a diagram showing an example of a temperature detection location. [Figure 9] FIG. 13 is a diagram showing an example of temperature changes in each area of ​​the lower table. [Figure 10] FIG. 1 is a schematic diagram (1) showing an example of correction of dimensions of a substrate in the first embodiment. [Figure 11] FIG. 2 is a schematic diagram showing an example of correction of dimensions of a substrate in the first embodiment; [Figure 12] FIG. 11 is a diagram showing a schematic configuration of a vacuum lamination apparatus according to a second embodiment. [Figure 13] FIG. 11 is a schematic diagram (1) showing an example of correction of dimensions of a substrate in the second embodiment. [Figure 14] FIG. 13 is a schematic diagram (2) showing an example of correction of dimensions of a substrate in the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Hereinafter, an embodiment of the present invention (hereinafter referred to as "the present embodiment") will be described in detail with reference to the drawings. Note that each drawing is merely a schematic illustration to allow a sufficient understanding of the present invention. Therefore, the present invention is not limited to the illustrated examples. In addition, in each drawing, common or similar components are given the same reference numerals, and duplicated explanations thereof will be omitted.

[0017] [Embodiment 1] <Overall configuration of the vacuum lamination system> Hereinafter, the configuration of the vacuum lamination system 1000 according to the first embodiment will be described with reference to Fig. 1. Fig. 1 is a diagram showing the configuration of the vacuum lamination system 1000. Here, the vacuum lamination system 1000 will be described as being used in a substrate assembly system for assembling substrates such as liquid crystal panels. In addition, the member (upper member) arranged on the upper side will be described as an upper substrate K1 (glass substrate), and the member (lower member) arranged on the lower side will be described as a lower substrate K2 (glass substrate).

[0018] As shown in FIG. 1, a vacuum bonding system 1000 according to the first embodiment includes a vacuum bonding apparatus (substrate assembly apparatus) 1, a control device 100, and a transport device 200. The vacuum bonding system 1000 includes a vacuum bonding apparatus (substrate assembly apparatus) 1, a control device 100, and a transport device 200.

[0019] The vacuum bonding apparatus 1 is an apparatus that places two components, one of which has an adhesive applied thereto, facing each other, creates a vacuum around the two components, and then returns the pressure to atmospheric pressure, thereby bonding the two components together. The control device 100 is a device that controls the operations of the vacuum bonding device 1 and the transport device 200. The conveying device 200 is a device that carries the upper substrate K1 (glass substrate) and the lower substrate K2 (glass substrate) into the vacuum chamber 5 of the vacuum bonding device 1, and carries substrates such as liquid crystal panels assembled by the vacuum bonding device 1 out of the vacuum chamber 5. The conveying device 200 includes a holding unit that holds the upper substrate K1 and the lower substrate K2.

[0020] <Configuration of Vacuum Lamination Equipment> The vacuum lamination device 1 has a stand 1a and an upper frame 2. The stand 1a is placed on an installation surface (such as a floor surface). The upper frame 2 is provided above the stand 1a and is capable of vertical movement (movement upward and downward). A Z-axis drive mechanism 20, which is a mechanism for moving the upper frame 2 up and down, is attached on the stand 1a. The upper frame 2 is attached on the Z-axis drive mechanism 20 via a load cell 20d. In this embodiment 1, two Z-axis drive mechanisms 20 and two load cells 20d are arranged in the X-axis direction and two in the Y-axis direction, and the vacuum laminating device 1 is described as having a total of four Z-axis drive mechanisms 20 and a total of four load cells 20d.

[0021] The vacuum lamination apparatus 1 is provided with an upper table 3 and a lower table 4 . The upper table 3 is fixed to the upper frame 2 via multiple upper shafts 2a. In this embodiment 1, the upper table 3 has a back plate 30 and a cushion sheet 31. The back plate 30 is a plate material that supports the cushion sheet 31 and is made of a rigid material. The back plate 30 is attached to the upper shafts 2a and moves up and down integrally with the upper frame 2. The cushion sheet 31 is a sheet material made of an elastic material.

[0022] The lower table 4 is attached to the base 1a via an XYθ movement unit 40. The XYθ movement unit 40 is a unit that arbitrarily moves the lower table 4 in the X-axis direction, moves the lower table 4 in the Y-axis direction, and rotates the lower table 4 around the Z-axis. The XYθ movement unit 40 is configured to be independently movable in two mutually perpendicular axial directions (X-axis and Y-axis) with respect to the base 1a. The XYθ movement unit 40 is also configured to be rotatable around the Z-axis with respect to the base 1a.

[0023] The upper table 3 and the lower table 4 are rectangular with their length and width along the Y-axis and X-axis directions, respectively. The lower flat surface (upper substrate surface 3a) of the upper table 3 and the upper flat surface (lower substrate surface 4a) of the lower table 4 face each other.

[0024] In this embodiment 1, the direction of the upper frame 2 relative to the stand 1a is defined as the Z-axis direction (vertical direction), the direction of one axis perpendicular to the Z-axis is defined as the X-axis direction (horizontal direction), and the direction of one axis perpendicular to the Z-axis and X-axis is defined as the Y-axis direction (vertical direction).

[0025] The upper frame 2 is attached to the stand 1a via four Z-axis drive mechanisms 20 and four load cells 20d. Each Z-axis drive mechanism 20 has a ball screw mechanism 20b that moves a ball screw shaft 20a extending in the Z-axis direction (vertical direction) up and down. The ball screw shaft 20a is rotated by an electric motor 20c and moved up and down by the ball screw mechanism 20b.

[0026] An upper table 3 is fixed to the upper frame 2 via multiple upper shafts 2a. The upper frame 2 and upper table 3 move up and down together. An upper chamber 5a is disposed around the upper table 3. The upper chamber 5a is configured so that it is open downward (toward the base 1a), and is disposed so as to cover the top and sides of the upper table 3.

[0027] The upper chamber 5 a is attached to the upper frame 2 via a hanging mechanism 6 . The hanging mechanism 6 has a support shaft 6a extending downward from the upper frame 2, and a locking portion 6b formed by expanding the lower end portion of the support shaft 6a into a flange shape. The upper chamber 5a is provided with a hook 6c. The hook 6c is movable up and down around the support shaft 6a. The hook 6c engages with a locking portion 6b at the lower end of the support shaft 6a.

[0028] The upper shaft 2a passes through the upper chamber 5a. The space between the upper shaft 2a and the upper chamber 5a is sealed by a vacuum seal (not shown). When the upper frame 2 moves upward (moves upward), the hook 6c engages with the locking portion 6b of the support shaft 6a, and the upper chamber 5a moves upward together with the upper frame 2. When the upper frame 2 moves downward (moves downward), the hook 6c moves downward by its own weight, and the upper chamber 5a moves downward accordingly.

[0029] A plurality of suction holes (not shown) are opened in the lower substrate surface 4a of the lower table 4. Each suction hole of the lower table 4 is connected to a vacuum pump P3. When the vacuum pump P3 is driven, the lower substrate K2 placed on the lower substrate surface 4a is sucked and held by the lower table 4 (lower substrate surface 4a).

[0030] A lower chamber 5b is disposed around the lower table 4. The lower chamber 5b is supported by a plurality of lower shafts 1b attached to the stand 1a. The lower shafts 1b protrude into the lower chamber 5b. The space between the lower chamber 5b and the lower shafts 1b is sealed by a vacuum seal (not shown). The lower chamber 5b is configured so as to be open at the top (the upper frame 2 side), and is disposed so as to cover the lower side and sides of the lower table 4. The XYθ movement unit 40 is attached to the lower shaft 1b protruding into the lower chamber 5b and supports the lower table 4.

[0031] The upper chamber 5a and the lower chamber 5b join their open portions to form the vacuum chamber 5. That is, the upper chamber 5a moves downward and engages with the lower chamber 5b from above, so that the opening of the lower chamber 5b is closed by the upper chamber 5a. The connection between the upper chamber 5a and the lower chamber 5b is sealed with a seal ring (not shown), ensuring the airtightness of the vacuum chamber 5.

[0032] The upper frame 2 can move further downward than the state in which the upper chamber 5a contacts the lower chamber 5b. In other words, the upper frame 2 can move further downward than the state in which the downward movement of the upper chamber 5a is restricted by the lower chamber 5b. In the hanging mechanism 6, the upper frame 2 moves further downward than that state, and the engagement between the locking portion 6b and the hook 6c is released. At this time, the upper chamber 5a is placed on the lower chamber 5b by its own weight. An upper table 3 and a lower table 4 are disposed inside the vacuum chamber 5.

[0033] The vacuum lamination apparatus 1 is equipped with a vacuum pump mechanism P0. The vacuum pump mechanism P0 is connected to the vacuum chamber 5, and exhausts the gas inside the vacuum chamber 5 to the outside, creating a vacuum state inside the vacuum chamber 5. In other words, when the vacuum pump mechanism P0 is driven, the inside of the vacuum chamber 5 becomes a vacuum environment.

[0034] The vacuum pump mechanism P0 is configured by combining a low vacuum pump (not shown) and a high vacuum pump (not shown). The low vacuum pump is used to make the inside of the vacuum chamber 5 atmospheric pressure (101,300 (Pa) ≈ 10 5 A high vacuum pump is a pump that can change the internal state of the vacuum chamber 5 from a low vacuum state (MPa) (Pa). For example, a dry pump or the like can be used as the low vacuum pump. A high vacuum pump is a pump that can change the internal state of the vacuum chamber 5 from a low vacuum state to an extremely high vacuum state. For example, a turbo molecular pump or the like can be used as the high vacuum pump.

[0035] The upper table 3 moves downward inside the vacuum chamber 5 in association with the downward movement of the upper frame 2. This downward movement of the upper table 3 pressurizes the upper substrate K1 held on the upper table 3 and the lower substrate K2 held on the lower table 4 in the vacuum. An adhesive is applied to one of the upper substrate K1 and the lower substrate K2. Therefore, the upper substrate K1 and the lower substrate K2 are bonded together by the adhesive applied to one of the substrates.

[0036] As described above, the upper table 3 is fixed to the upper frame 2 via a plurality of upper shafts 2a. Therefore, the load when the upper substrate K1 and the lower substrate K2 are pressed by the downward movement of the upper table 3 is detected by the load cell 20d. The detection signal of the load cell 20d is input to the control device 100. The control device 100 specifies the load applied to the substrate from the upper table 3 based on the detection value detected by the load cell 20d. In this embodiment 1, since the vacuum bonding device 1 has four load cells 20d, the total value of the detection values ​​detected by the four load cells 20d is the total load value of the entire device. In other words, the total value of the detection values ​​detected by the four load cells 20d is the value of all the loads applied to the substrate from the upper table 3. The control device 100 manages the load applied to the substrate from the upper table 3. The control device 100 also manages the Z-axis height (Z-axis coordinate) of the upper table 3 which is moved up and down by the Z-axis driving mechanism 20.

[0037] The vacuum lamination apparatus 1 has a suction mechanism 7. The suction mechanism 7 is a mechanism for sucking up the upper substrate K1 with suction pins 7a and for moving the suction pins 7a up and down. The suction mechanism 7 is attached to the upper frame 2.

[0038] The suction mechanism 7 includes a plurality of suction pins 7a, one or more suction pin pads 7b, and a pin up-down movement mechanism 70. The suction pin 7a is a tubular member extending in the vertical direction, and is provided so as to be able to move up and down independently of the upper table 3.

[0039] Each suction pin 7a is attached to one or more suction pin pads 7b. Multiple suction pins 7a are attached to each suction pin pad 7b. Each suction pin 7a moves up and down simultaneously as the suction pin pad 7b moves up and down. The suction pin pad 7b is disposed between the upper chamber 5a and the upper table 3. The suction pin pad 7b moves up and down by a pin up and down movement mechanism 70.

[0040] In the first embodiment, the pin up-down movement mechanism 70 is assumed to be configured by a ball screw mechanism. The pin up-down movement mechanism 70 has a ball screw shaft 71 extending rotatably in the Z-axis direction, an electric motor 73 that rotates the ball screw shaft 71, and a ball screw mechanism 72 that moves up and down with the rotation of the ball screw shaft 71. The electric motor 73 rotates the ball screw shaft 71. The ball screw shaft 71 moves the ball screw mechanism 72 up and down by rotating. The ball screw mechanism 72 is attached to a suction pin pad 7b. The suction pin pad 7b moves up and down together with the ball screw mechanism 72 with the up and down movement of the ball screw mechanism 72.

[0041] When not moving downward, the suction pins 7a are disposed above the upper substrate surface 3a of the upper table 3, and when moved downward, they protrude below the upper substrate surface 3a. When the suction pins 7a move upward from the downward state, they are pulled upward from the upper substrate surface 3a.

[0042] The suction pin 7a has a hollow tubular shape. The suction pin pad 7b also has a hollow tubular shape. The hollow portion of the suction pin 7a communicates with the hollow portion of the suction pin pad 7b. A vacuum pump P1 is connected to the hollow portion of the suction pin pad 7b. When the vacuum pump P1 is driven, a vacuum is created in the hollow portions of the suction pin 7a and the suction pin pad 7b, and the upper substrate K1 is vacuum-adsorbed to the suction pin 7a.

[0043] The vacuum bonding apparatus 1 has an adhesive holding mechanism 8. The adhesive holding mechanism 8 is a mechanism for adhesively sucking the upper substrate K1 with adhesive pins 8a and for moving the adhesive pins 8a up and down. The adhesive holding mechanism 8 is attached to the upper frame 2.

[0044] The adhesive holding mechanism 8 includes a plurality of adhesive pins 8a, one or more adhesive pin plates 8b, and a pin up-down movement mechanism 80. The adhesive pins 8a are tubular members extending in the vertical direction, and are provided so as to be able to move up and down independently of the upper table 3 and the suction pins 7a.

[0045] Each adhesive pin 8a is attached to one or more adhesive pin plates 8b (base portion). Multiple adhesive pins 8a are attached to each adhesive pin plate 8b. Each adhesive pin plate 8b can move up and down independently (perpendicular to the upper substrate surface 3a). As the adhesive pin plate 8b moves up and down, each adhesive pin 8a moves up and down simultaneously as a unit of adhesive pin plate 8b. The adhesive pin plate 8b is disposed between the upper chamber 5a and the upper table 3. The adhesive pin plate 8b moves up and down by a pin up and down movement mechanism 80.

[0046] In the first embodiment, the pin up-down movement mechanism 80 is assumed to be configured by a ball screw mechanism. The pin up-down movement mechanism 80 has a ball screw shaft 81 extending rotatably in the Z-axis direction, an electric motor 83 that rotates the ball screw shaft 81, and a ball screw mechanism 82 that moves up and down in association with the rotation of the ball screw shaft 81. The electric motor 83 rotates the ball screw shaft 81. The ball screw shaft 81 moves the ball screw mechanism 82 up and down by rotating. The ball screw mechanism 82 is attached to an adhesive pin plate 8b. The adhesive pin plate 8b moves up and down together with the ball screw mechanism 82 in association with the up and down movement of the ball screw mechanism 82.

[0047] When not moved downward, the adhesive pins 8a are disposed above the upper substrate surface 3a of the upper table 3, whereas when moved downward, the adhesive pins 8a protrude below the upper substrate surface 3a. When the adhesive pins 8a move upward from the downward state, they are pulled upward from the upper substrate surface 3a.

[0048] The adhesive pins 8a have, at their tips, adhesive portions 8c made of an elastic material and having adhesiveness. The adhesive pins 8a are hollow tubular. The adhesive pin plate 8b is also hollow tubular. The hollow portions of the adhesive pins 8a communicate with the hollow portions of the adhesive pin plate 8b. A vacuum pump P2 is connected to the hollow portions of the adhesive pin plate 8b. When the vacuum pump P2 is driven, a vacuum is created in the hollow portions of the adhesive pins 8a and the adhesive pin plate 8b, and the upper substrate K1 is vacuum-adsorbed to the adhesive pins 8a.

[0049] During this process, the adhesive pins 8a suck the upper substrate K1 by vacuum when the vacuum pump P2 is driven to create a vacuum in the hollow portion, and then attach and hold (adhesively hold) the vacuum-sucked upper substrate K1 to the adhesive portions 8c. The adhesive pins 8a hold the upper substrate K1 when protruding from the upper substrate surface 3a.

[0050] A gas supply means (not shown) is connected to the hollow portion of the adhesive pin plate 8b. The gas supply means is driven in response to a command from the control device 100 to supply a predetermined gas (air, nitrogen gas, etc.) to the hollow portion of the adhesive pin plate 8b. The pressure in the hollow portion of the adhesive pin 8a is increased by the supplied gas. As a result, the upper substrate K1 that was attached to the adhesive portion 8c of the adhesive pin 8a is peeled off from the adhesive portion 8c.

[0051] The vacuum bonding apparatus 1 has a table temperature adjustment mechanism 60. The table temperature adjustment mechanism 60 is a mechanism that adjusts the temperature of the table (the lower table 3 in the first embodiment) for each arbitrarily set area.

[0052] The configuration of the table temperature adjustment mechanism 60 will be described below with reference to Figs. 2 to 5. Figs. 2 to 5 are diagrams each showing a schematic configuration of the table temperature adjustment mechanism 60. Fig. 2 shows a schematic configuration of the table temperature adjustment mechanism 60 as viewed from the side. Fig. 3 shows a schematic configuration of the table temperature adjustment mechanism 60 as viewed from above. Fig. 4(a) shows an example of the table temperature adjustment mechanism 60 as viewed from above, and Fig. 4(b) shows the main part as viewed from the side. Fig. 5(a) shows another example of the table temperature adjustment mechanism 60 as viewed from above, and Fig. 5(b) shows the main part as viewed from the side.

[0053] 2, the table temperature adjustment mechanism 60 is configured to include a flow path 61 through which liquid such as water or oil flows, and a heater 62 that heats the liquid flowing through the flow path 61. Note that, in this example, the liquid used is water. Also, the heater 62 is described as including a heating mechanism that heats the liquid and a pressurizing mechanism that pressurizes the liquid and sends it out.

[0054] 3, the lower table 4 is divided into four areas Ar1 to Ar4 in two rows and two columns. The table temperature adjustment mechanism 60 is configured to include a flow path 61 and a heater 62 for each area. Specifically, the table temperature adjustment mechanism 60 is configured to include a flow path 61a and a heater 62a for the upper left area Ar1, a flow path 61b and a heater 62b for the upper right area Ar2, a flow path 61c and a heater 62c for the lower left area Ar3, and a flow path 61d and a heater 62d for the lower right area Ar4.

[0055] The number of areas can be increased or decreased as desired depending on the specifications of the vacuum laminating apparatus 1. Also, the shape and size of the areas can be changed for each area depending on the specifications of the vacuum laminating apparatus 1.

[0056] The flow path 61 is formed of a hollow pipe. As shown in Fig. 3 and Fig. 4(a), the flow path 61 is configured to turn back multiple times, and is arranged over almost the entire surface of each area divided into areas of the lower table 4. Also, as shown in Fig. 4(b), the flow path 61 is embedded inside the lower table 4. The flow paths 61 preferably have a uniform inner diameter over the entire area, and are preferably arranged at equal intervals at the same height inside the lower table 4.

[0057] The flow path 61 is drawn from the inside of the lower table 4 to the outside via the non-mounting surface of the lower substrate K1 on the lower table 4. In the example shown in Fig. 4(a), the lower table 4 is divided into four areas of two rows and two columns, and each area of ​​the lower table 4 has a side surface exposed to the outside. Therefore, the flow path 61 is drawn to the outside from the side surface of each area of ​​the lower table 4 exposed to the outside.

[0058] However, the number of areas on the lower table 4 can be increased or decreased, for example, it can be made nine, with three rows and three columns. If the number of areas is made nine, for example, the central area of ​​the lower table 4 will be configured so that none of the sides are exposed to the outside. It is preferable to configure such areas where none of the sides are exposed to the outside so that the flow path 61 is drawn out from the underside to the outside.

[0059] The flow path 61 drawn out to the outside is connected to a heater 62. The heater 62 sends liquid such as water out while heating it inside. As a result, the heated liquid flows inside the flow path 61 along the direction of the arrows shown in Figures 3 and 4(a), for example. As a result, the liquid passes through the inside of the lower table 4 while heating the lower table 4 with its own heat, and then returns to the heater 62.

[0060] As shown in FIG. 4(a), the flow path 61 is preferably configured such that the straight portion is made of a straight pipe and the folded portion is made of a U-shaped pipe, with the U-shaped pipe being connected to the two straight pipes. This allows the flow path 61 to be configured such that only the straight portion is embedded inside the lower table 4 in advance, and the folded portion is attached to the straight portion later. Although this configuration results in the folded portion protruding outside the lower table 4, it can be easily manufactured. However, the folded portion can also be configured so as not to protrude outside the lower table 4 (i.e., the folded portion can be configured to be embedded inside the lower table 4 in advance).

[0061] In addition, as in the present embodiment 1, the temperature of the table temperature adjustment mechanism 60 (here, the temperature of the liquid flowing inside the flow path 61) when heating a table to be temperature adjusted (here, the lower table 4) is preferably at least room temperature and at most (room temperature + 50)° C. The reason for this is that if the liquid is heated to a temperature higher than (room temperature + 50)° C., it may affect the circuits and wiring, or the liquid may evaporate, making it difficult to adjust the temperature of the lower table 4.

[0062] <Another example of a table temperature control mechanism> The table temperature adjustment mechanism 60 can be configured, for example, as shown in Fig. 5. In the example shown in Fig. 5, the table temperature adjustment mechanism 60 is configured to include a heating wire 63 instead of the flow path 61, and a heater 64 instead of the heater 62. The heating wire 63 is a metal wire that is heated by a heater 64 . The heater 64 is a device that heats the heating wire 63. Unlike the heater 62 shown in FIG. 4, the heater 64 does not include a pressurizing mechanism that pressurizes the liquid and sends it out, but only includes a heating mechanism that heats the heating wire 63.

[0063] As shown in Fig. 5(a), the heating wire 63 is configured to be folded back multiple times, and is arranged over almost the entire surface of each area divided into areas of the lower table 4. Also, as shown in Fig. 5(b), the heating wire 63 is embedded inside the lower table 4. The heating wire 63 preferably has a uniform width over the entire area, and is preferably arranged at equal intervals on a single plane inside the lower table 4.

[0064] <Control device configuration> Each part of the vacuum laminating apparatus 1 is controlled by a control device 100. The configuration of the control device 100 will be described below with reference to Fig. 6. Fig. 6 is a diagram showing the configuration of the control device 100.

[0065] As shown in FIG. 6, the control device 100 has a control unit 110, a storage unit 160 such as a ROM, RAM, or HDD, a display unit 180 such as a liquid crystal display, and an input unit 190 such as a touch panel, numeric keypad, or keyboard.

[0066] The control unit 110 is configured by a CPU, and functions as a pin height control unit 111, a movement control unit 112, a vacuum process control unit 113, and a table temperature control unit 114 by executing a control program Pr1 pre-stored in the memory unit 160.

[0067] The pin height control unit 111 is a functional unit that controls the operation of the pin up-down movement mechanisms 70, 80 (see FIG. 1). The pin height control unit 111 drives the pin up-down movement mechanisms 70, 80 to control the height adjustment operation of the suction pin pad 7b and the height adjustment operation of the adhesive pin plate 8b.

[0068] The movement control unit 112 is a functional means that controls the operations of the Z-axis drive mechanism 20 (see FIG. 1) and the XYθ movement unit 40 (see FIG. 1). The movement control unit 112 drives the Z-axis drive mechanism 20 (see FIG. 1) to move the upper frame 2 up and down, thereby moving the upper table 3 up and down. The movement control unit 112 also drives the XYθ movement unit 40 (see FIG. 1) to displace the lower table 4, thereby determining the bonding position of the upper substrate K1 and the lower substrate K2.

[0069] The vacuum process control unit 113 is a functional means for controlling the operations of the upper chamber 5a, the vacuum pump mechanism P0, and the vacuum pumps P1, P2, and P3.

[0070] The table temperature control unit 114 is a functional means for controlling the temperature of the table temperature adjustment mechanism 60 for each area. The table temperature control unit 114 manages the temperature of each area of ​​the lower table 4 based on the value of a signal output from a temperature sensor (see FIG. 8) embedded in each area of ​​the lower table 4.

[0071] The storage unit 160 stores, for example, a control program Pr1, setting data D1, and the like. The control program Pr1 is a program that prescribes the operations of the vacuum bonding apparatus 1 and the transport apparatus 200. The setting data D1 is data that represents the setting values ​​for the operation of the vacuum bonding apparatus 1 and the conveying apparatus 200.

[0072] In the first embodiment, it is assumed that, as the setting data D1, for example, data for determining a set temperature, data for correcting dimensions, etc. are stored in the storage unit 160 in advance. The "data for determining set temperature" is data that is referenced to determine a set temperature, which will be described later, in the table temperature adjustment step of S130 (see FIG. 7), which will be described later. The "data for determining set temperature" specifies what the set temperature, which will be described later, of the heater 62 of the table temperature adjustment mechanism 60 should be set to when the temperature of the table to be adjusted (the lower table 4 in this embodiment 1) is what. The "dimensional correction data" is data that is referenced to determine the set temperature (described later) in the table temperature adjustment step S130 (see FIG. 7) when performing dimensional correction of the substrate. The "dimensional correction data" specifies what temperature (described later) the heater 62 of the table temperature adjustment mechanism 60 should be set to depending on the required amount of dimensional correction of the substrate.

[0073] <Vacuum lamination system operation> Hereinafter, the operation of the vacuum lamination system 1000 will be described with reference to Fig. 7. Fig. 7 is a flowchart showing the operation of the vacuum lamination system 1000. Here, the explanation will be given on the assumption that the table temperature adjustment mechanism 60 has the configuration shown in Fig. 4.

[0074] The vacuum lamination system 1000 operates based on the time measured by a timer (not shown). A series of operations of the vacuum lamination system 1000 is regulated by a control program Pr1 pre-stored in the storage unit 160 of the control device 100 so as to be freely readable. Each piece of information is temporarily stored in the storage unit 160 so as to be freely readable, and then output to a predetermined component that performs subsequent processing. These points are common in information processing, so detailed explanations thereof will be omitted below.

[0075] 7, an operator who operates the vacuum bonding system 1000 operates the control device 100 to input an instruction to assemble substrates in the vacuum bonding system 1000. In response to this, the vacuum bonding system 1000 starts operating.

[0076] When the operator inputs an instruction, the vacuum bonding system 1000 executes the upper substrate loading step as follows (S110).

[0077] Specifically, the control device 100 drives the transport device 200 to transport the upper substrate K1 into the vacuum chamber 5 of the vacuum bonding device 1. At this time, the transport device 200 holds the upper substrate K1 with a holding part outside the vacuum chamber 5, and in this state, inserts the holding part into the vacuum chamber 5 and positions the upper substrate K1 below the upper table 3.

[0078] When the conveying device 200 places the upper substrate K1 below the upper table 3, the control device 100 drives the vacuum laminating device 1 to move the suction pins 7a downward and drives the vacuum pump P1. As a result, the suction pins 7a vacuum-suck the upper substrate K1 and hold the upper substrate K1.

[0079] When the suction pins 7a hold the upper substrate K1, the holding portion of the transfer device 200 releases the upper substrate K1. Then, the transfer device 200 moves the holding portion upward to separate the holding portion from the upper substrate K1. Thereafter, the transfer device 200 takes the holding portion out of the vacuum chamber 5.

[0080] When the holding part of the transport device 200 moves out of the vacuum chamber 5, the control device 100 drives the vacuum bonding device 1 to move the suction pins 7a upward. This causes the upper substrate K1 to abut against the upper substrate surface 3a of the upper table 3.

[0081] When the upper substrate K1 comes into contact with the upper substrate surface 3a of the upper table 3, the control device 100 drives the vacuum laminating device 1 to move the adhesive pins 8a downward and drives the vacuum pump P2, whereby the adhesive pins 8a vacuum-adsorb the upper substrate K1 and hold the upper substrate K1. This completes the upper substrate loading step S110.

[0082] When the upper substrate loading step of S110 is completed, the vacuum bonding system 1000 executes the lower substrate loading step (S120) as follows.

[0083] Specifically, the control device 100 drives the transport device 200 to transport the lower substrate K2 into the vacuum chamber 5 of the vacuum bonding device 1. At this time, the transport device 200 holds the lower substrate K2 with a holding part outside the vacuum chamber 5, and in this state, the holding part enters the vacuum chamber 5 and positions the lower substrate K2 above the lower table 4. Then, the transport device 200 moves the holding part downward to place the lower substrate K2 on the lower substrate surface 4a of the lower table 4. Thereafter, the control device 100 drives the vacuum pump P3. As a result, the lower table 4 vacuum-adsorbs the lower substrate K2 and holds the lower substrate K2.

[0084] When the lower table 4 holds the lower substrate K2, the holding portion of the transfer device 200 releases the lower substrate K2. Then, the transfer device 200 moves the holding portion upward to separate the holding portion from the lower substrate K2. Thereafter, the transfer device 200 moves the holding portion out of the vacuum chamber 5. This completes the lower substrate loading step S120.

[0085] When the lower substrate loading step of S120 is completed, the vacuum bonding system 1000 executes a table temperature adjustment step (S130) as follows.

[0086] Specifically, the control device 100 (mainly the table temperature control section 114) detects the temperature of each area of ​​the lower table 4 based on a detection signal output from a temperature sensor embedded in the lower table 4.

[0087] Fig. 8 is a diagram showing an example of temperature detection locations. In the example shown in Fig. 8, the lower table 4 is partitioned into four areas Ar1 to Ar4 of two rows and two columns, and nine temperature sensors SN1 to SN9 are arranged around each area. Specifically, three rows in the vertical direction and three columns in the horizontal direction are formed on the lower table 4 so as to avoid the four areas Ar1 to Ar4, and the nine temperature sensors SN1 to SN9 are arranged at the intersections of each row and each column.

[0088] Here, the following description will be given assuming that the temperature sensor SN1 is the sensor PAr1 that represents the temperature of the upper left area Ar1, the temperature sensor SN3 is the sensor PAr2 that represents the temperature of the upper right area Ar2, the temperature sensor SN7 is the sensor PAr3 that represents the temperature of the lower left area Ar3, and the temperature sensor SN9 is the sensor PAr4 that represents the temperature of the lower right area Ar4. However, the sensors PAr1 to PAr4 may be arranged near the center of each of the corresponding areas Ar1 to Ar4. The temperatures of the areas of the lower table 4 detected by the sensors PAr1 to PAr4 are, for example, as shown in FIG. 9. Details of FIG. 9 will be described later.

[0089] When the control device 100 detects the temperature of each area of ​​the lower table 4, it determines the set temperature of each of the heaters 62a-62d (see FIG. 4) for each area based on, for example, the set temperature determination data described above. At this time, the control device 100 determines the set temperature of each of the heaters 62a-62d so that the temperatures of all areas of the lower table 4 become approximately the same temperature in a vacuum environment. Here, "in a vacuum environment" refers to the environment in the vacuum chamber 5 from the start of a vacuum drawing step in S140 in FIG. 7 described later to the start of an atmosphere release (bonding) step in S170 in FIG. 7 described later.

[0090] After that, the control device 100 drives each of the heaters 62a-62d. At this time, each of the heaters 62a-62d heats the liquid so that the temperature of the liquid becomes the same as the respective set temperatures, and sends the heated liquid to the lower table 4. In this way, the vacuum lamination device 1 can make the temperature of the entire area of ​​the lower table 4 approximately the same temperature. At this time, heat is transferred from the lower table 4 to the lower substrate K2 placed on the lower table 4, so that the temperature of the entire area of ​​the lower substrate K2 can also be made approximately the same temperature. This completes the table temperature adjustment process in S130.

[0091] When the table temperature adjustment step of S130 is completed, the vacuum lamination system 1000 executes a vacuum drawing step (S140) as follows.

[0092] Specifically, first, the control device 100 drives the Z-axis drive mechanism 20 (vertical movement mechanism) to move the upper chamber 5a downward and close the vacuum chamber 5. Next, the control device 100 drives the vacuum pump mechanism P0 to expel the gas within the vacuum chamber 5 to the outside. This completes the evacuation step S140.

[0093] When the evacuation step of S140 is completed, the vacuum lamination system 1000 executes a positioning step (S150) as follows. Specifically, the control device 100 drives the vacuum bonding apparatus 1 to displace the lower table 4 with the XYθ movement unit 40. In this way, the vacuum bonding apparatus 1 determines the bonding position of the upper substrate K1 and the lower substrate K2. When the bonding positions of the upper substrate K1 and the lower substrate K2 are determined, the positioning step of S150 is completed.

[0094] When the positioning step of S150 is completed, the vacuum lamination system 1000 executes a pressing (pressurizing) step (S160) as follows.

[0095] Specifically, the control device 100 drives the vacuum bonding device 1 to move the upper substrate K1 downward together with the upper table 3 by the Z-axis drive mechanism 20 (vertical movement mechanism). At this time, the adhesive portion 8c of the adhesive pin 8a is crushed, and the upper substrate surface 3a of the upper substrate K1 comes into contact with the upper substrate K1. The vacuum bonding device 1 further moves the upper substrate K1 downward from that state, thereby pressing the upper substrate K1 against the lower substrate K2, and the upper table 3 presses the upper substrate K1 and the lower substrate K2. At this time, the upper substrate K1 and the lower substrate K2 are bonded together by the adhesive applied to either the upper substrate K1 or the lower substrate K2. This ends the pressing (pressurizing) step of S160.

[0096] When the pressing (pressurizing) step of S160 is completed, the vacuum bonding system 1000 executes the atmosphere release (bonding) step (S170) as follows.

[0097] Specifically, the control device 100 drives the vacuum laminating device 1, first moving the adhesive pin 8a upward with the pin vertical movement mechanism 80, and then moving the upper table 3 upward with the Z-axis drive mechanism 20 (vertical movement mechanism). After this, the vacuum laminating device 1 moves the upper chamber 5a upward together with the upper table 3 with the Z-axis drive mechanism 20 (vertical movement mechanism). At this time, the inside of the vacuum chamber 5 is opened to the atmosphere, so that atmospheric pressure is applied to the upper substrate K1 and the lower substrate K2. As a result, the vacuum laminating device 1 pressurizes the upper substrate K1 and the lower substrate K2 with atmospheric pressure. As a result, the vacuum laminating device 1 pressurizes the upper substrate K1 and the lower substrate K2 while squeezing the adhesive, and finally bonds the upper substrate K1 and the lower substrate K2 until a predetermined cell gap is reached. In this way, the vacuum laminating system 1000 assembles substrates such as liquid crystal panels. This completes the atmosphere release (bonding) step S170.

[0098] When the atmosphere release (bonding) step of S170 is completed, the vacuum bonding system 1000 executes a substrate unloading step (S180) as follows.

[0099] Specifically, the control device 100 drives the transport device 200 to cause the holding part to enter the vacuum chamber 5. The transport device 200 moves the holding part downward to hold the substrate formed by bonding the upper substrate K1 and the lower substrate K2 with the holding part, and moves the holding part upward to cause the holding part to move out of the vacuum chamber 5. As a result, the substrate formed by bonding the upper substrate K1 and the lower substrate K2 is carried out of the vacuum bonding apparatus 1. This completes the substrate unloading step S180. When the substrate unloading step in S180 is completed, the series of routine processes ends.

[0100] The operation of the table temperature adjustment mechanism 60 will be described below with reference to Fig. 9. Fig. 9 is a diagram showing an example of temperature change in each area of ​​the lower table 4. Fig. 9 shows the temperature change in a comparative example by lines To(PAr1) to To(PAr4), and the temperature change in the first embodiment by lines Tn(PAr1) to Tn(PAr4). The comparative example is an example in which the temperature of the lower table 4 was not adjusted, and corresponds to an example in which substrates are assembled using a conventional vacuum bonding apparatus.

[0101] In FIG. 9, lines To(PAr1) to To(PAr4) of the comparative example and lines Tn(PAr1) to Tn(PAr4) of the first embodiment respectively indicate the change in temperature in each area of ​​the lower table 4 detected by the sensors PAr1 to PAr4.

[0102] (1) Comparative example: Example when the temperature of the lower table was not adjusted (The period from closing the vacuum chamber to the start of the S140 evacuation process) For example, as shown by the line To(PAr1) to To(PAr4), in a comparative example in which the temperature of the lower table 4 was not adjusted, the temperature of each area of ​​the lower table 4 remains approximately constant during the period from when the vacuum chamber 5 is closed until the evacuation step of S140 is performed. Therefore, the temperature difference between each area of ​​the lower table 4 falls within the relatively small range of the temperature difference ΔTo1.

[0103] The reason why the temperature of each area of ​​the lower table 4 becomes almost constant during the above-mentioned period is that the heat stored in each area of ​​the lower substrate K2 placed on the lower table 4 is transferred to the surrounding area and diffused by air convection, as described below.

[0104] That is, during the above-mentioned period, the inside of the vacuum chamber 5 is in an atmospheric environment. In an atmospheric environment, air convection exists around the substrates (upper substrate K1 and lower substrate K2). Therefore, even if the amount of heat stored in the substrate and the efficiency of heat transfer are different for each area, the heat stored in each area of ​​the substrate is transferred to the surroundings and diffused by the air convection. As a result, under an atmospheric environment, the surface temperature of the substrate becomes almost uniform in the entire area. The upper substrate K1 and the lower substrate K2 are in contact with the corresponding upper table 3 or lower table 4. Therefore, the heat stored in the upper substrate K1 is transferred from the upper substrate K1 to the upper table 3, and the heat stored in the lower substrate K2 is transferred from the lower substrate K2 to the lower table 4. As a result, during the above-mentioned period, the temperature of each area of ​​the lower substrate 4 becomes almost constant, similar to the lower substrate K2.

[0105] In other words, during the above-mentioned period, each of the sensors PAr1 to PAr4 detects the temperature after it has been diffused around each area of ​​the lower substrate K2 placed on the lower table 4. Therefore, the temperature of each area of ​​the lower table 4 is detected as a substantially constant temperature.

[0106] (The period from the vacuum drawing process in S140 to the atmospheric release (bonding) process in S170) When the evacuation step S140 is performed, the temperature of each area of ​​the lower table 4 drops by several degrees. This is because, in an atmospheric environment, gas molecules in the air inside the vacuum chamber 5 collide with other molecules to become heat sources, raising the temperature inside the vacuum chamber 5, whereas in a vacuum environment, these molecules are expelled from the inside of the vacuum chamber 5 to the outside.

[0107] During the period from the evacuation step S140 to the atmosphere release (bonding) step S170, the temperatures of the areas on the lower table 4 are significantly different from one another. Therefore, the temperature difference between the areas on the lower table 4 has expanded to a temperature difference ΔTo2 that is significantly larger than the temperature difference ΔTo1.

[0108] During the above-mentioned period, the reason why the temperatures of each area of ​​the lower table 4 vary greatly from area to area is that the heat stored in each area of ​​the lower substrate K2 placed on the lower table 4 is not transferred to the surrounding area due to air convection, as will be explained below.

[0109] That is, during the above-mentioned period, the inside of the vacuum chamber 5 is in a vacuum environment. In a vacuum environment, there is no air convection around the substrates (upper substrate K1 and lower substrate K2). Therefore, the heat stored in each area of ​​the substrate is not transferred to the surroundings by air convection. Therefore, in a vacuum environment, the surface temperature of the substrate becomes a temperature that differs greatly from area to area. The upper substrate K1 and the lower substrate K2 are in contact with the corresponding upper table 3 or lower table 4. Therefore, the heat stored in the upper substrate K1 is transferred from the upper substrate K1 to the upper table 3, and the heat stored in the lower substrate K2 is transferred from the lower substrate K2 to the lower table 4. As a result, during the above-mentioned period, the temperature of each area of ​​the lower table 4 becomes a temperature that differs greatly from area to area, similar to the lower substrate K2.

[0110] In other words, during the above-mentioned period, each of the sensors PAr1 to PAr4 directly detects the heat accumulation temperature of each area of ​​the lower substrate K2 placed on the lower table 4. Therefore, the temperatures of each area of ​​the lower table 4 are detected as temperatures that differ greatly from area to area.

[0111] (The period after the S170 air release (bonding) process is performed) When the atmosphere release (bonding) step of S170 is performed, the temperature of each area of ​​the lower table 4 rises by a few degrees and returns to the original temperature (the temperature before the evacuation step of S140 is performed). This is because the environment inside the vacuum chamber 5 has returned to the original state (the state before the evacuation step of S140 is performed). In other words, the environment inside the vacuum chamber 5 has returned to a state in which gas molecules in the air inside the vacuum chamber 5 collide with other molecules in the atmospheric environment to become heating elements, thereby raising the temperature inside the vacuum chamber 5.

[0112] During the period after the atmospheric exposure (bonding) step S170 is performed, the temperature of each area of ​​the lower table 4 remains substantially constant.

[0113] The reason why the temperature of each area of ​​the lower table 4 becomes almost constant during the above-mentioned period is that the heat stored in each area of ​​the lower substrate K2 placed on the lower table 4 is transferred to the surrounding area and diffused by air convection, similar to the period from when the vacuum chamber 5 is closed until the evacuation process of S140 is performed.

[0114] (Amount of crushing of adhesive in comparative example) Incidentally, when bonding the upper substrate K1 and the lower substrate K2, in response to recent demands for assembling a wide variety of substrates, it is sometimes necessary to use an adhesive whose properties, such as viscosity, vary greatly with temperature.

[0115] When the surface temperature of the substrate varies greatly from area to area in a vacuum environment, as in the comparative example, the adhesive's properties such as viscosity vary significantly. Therefore, in the comparative example, the amount of crushing of the adhesive varies from area to area, for example.

[0116] That is, in the comparative example, the temperatures of the areas of the lower table 4 are significantly different from one another during the period from the evacuation step S140 to the atmosphere release (bonding) step S170. Therefore, in the comparative example, the amount of crushing of the adhesive may be non-uniform in each area.

[0117] (2) Example: Example of when the temperature of the lower table is adjusted In contrast to the comparative example described above, in the present embodiment 1, as described below, the temperature of the entire area of ​​the lower table 4 can be made substantially the same during the period from the evacuation step S140 to the atmosphere release (bonding) step S170, so that the amount of crushing of the adhesive can be made uniform over the entire area. Details of this will be described below.

[0118] (The period from closing the vacuum chamber to the start of the table temperature adjustment process in S130) For example, as shown by lines Tn(PAr1) to Tn(PAr4), in this embodiment 1, when temperature adjustment of the lower table 4 is performed, the temperature of each area of ​​the lower table 4 remains approximately constant during the period from when the vacuum chamber 5 is closed to when the table temperature adjustment process of S130 is performed.

[0119] (The period from the table temperature adjustment step S130 to the vacuum drawing step S140) Thereafter, the table temperature adjustment step S130 is performed at any timing. As a result, when the temperature rise stabilization time ΔR has elapsed since the start of the table temperature adjustment step S130, the temperature of each area of ​​the lower table 4 rises to the above-mentioned set temperature. Here, the "temperature rise stabilization time ΔR" refers to the time required for the temperature of the liquid flowing through the flow path 61 to reach the set temperature.

[0120] During the period from when the temperature rise stabilization time ΔR has elapsed until the evacuation step of S140 is performed, the temperature of each area of ​​the lower table 4 is approximately constant around the set temperature. Therefore, the temperature difference between each area of ​​the lower table 4 falls within a relatively small range of temperature difference ΔTn1. The value of temperature difference ΔTn1 is equal to or smaller than the temperature difference ΔTo1 in the comparative example.

[0121] The reason why the temperature of each area of ​​the lower table 4 becomes almost constant during the above-mentioned period is that, as in the comparative example, the heat stored in each area of ​​the lower substrate K2 placed on the lower table 4 is transferred to the surrounding area and diffused by air convection.

[0122] (The period from the vacuum drawing process in S140 to the atmospheric release (bonding) process in S170) When the evacuation step S140 is performed, the temperature of each area of ​​the lower table 4 drops by several degrees. This is because, as in the comparative example, gas molecules in the air inside the vacuum chamber 5 that were heating elements are expelled from the inside of the vacuum chamber 5 to the outside.

[0123] During the period from the evacuation step S140 to the atmosphere release (bonding) step S170, the temperature of each area of ​​the lower table 4 falls within a relatively small temperature difference ΔTn2. The value of the temperature difference ΔTn2 is smaller than the temperature difference ΔTo2 in the comparative example.

[0124] The reason why the temperature of each area of ​​the lower table 4 during the above-mentioned period falls within the range of the temperature difference ΔTn2 is because the temperature of each area of ​​the lower table 4 is adjusted by the table temperature adjustment mechanism 60.

[0125] (The period after the S170 air release (bonding) process is performed) When the atmosphere release (bonding) step of S170 is performed, the temperature of each area of ​​the lower table 4 rises by several degrees and returns to the original temperature (the temperature before the evacuation step of S140 is performed). This is because, as in the comparative example, the environment inside the vacuum chamber 5 returns to the original state (the state before the evacuation step of S140 is performed).

[0126] During the period after the atmospheric exposure (bonding) step S170 is performed, the temperature of each area of ​​the lower table 4 remains approximately constant around the set temperature.

[0127] The reason why the temperature of each area of ​​the lower table 4 becomes almost constant during the above-mentioned period is that, as in the comparative example, the heat stored in each area of ​​the lower substrate K2 placed on the lower table 4 is transferred to the surrounding area and diffused by air convection.

[0128] (Amount of crushing of adhesive in the embodiment) In the present embodiment 1, since the table temperature adjustment mechanism 60 adjusts the temperature of each area of ​​the lower table 4, it is possible to reduce the surface temperature difference between each area of ​​the substrate in a vacuum environment, and to suppress fluctuations in properties such as the viscosity of the adhesive. Therefore, in the present embodiment 1, for example, the amount of crushing of the adhesive can be made uniform over the entire area.

[0129] (Compensation for board dimensions) The vacuum bonding apparatus 1 according to the first embodiment can also perform dimensional correction of the substrate by adjusting the temperature of the table in the table temperature adjustment step S130, for example, by referring to the above-mentioned data for dimensional correction.

[0130] Hereinafter, the dimensional correction of the substrate will be described with reference to Fig. 10 and Fig. 11. Fig. 10 and Fig. 11 are diagrams each showing a schematic diagram of an example of correction of the dimension of the substrate in the present embodiment 1. Here, the upper substrate K1 is assumed to have a rectangular shape in a top view and to have four alignment marks MUa to MUd (see Fig. 10) near the four corners, and the lower substrate K2 is assumed to have a rectangular shape in a top view and to have four alignment marks MLa to MLd (see Fig. 10) near the four corners. The alignment marks MUa to MUd and the alignment marks MLa to MLd are marks used to align the positions of the upper substrate K1 and the lower substrate K2. Here, the upper substrate K1 is assumed to have a circuit pattern PtU (see Fig. 11), and the lower substrate K2 is assumed to have a circuit pattern PtL (see Fig. 11).

[0131] Fig. 10(a) shows a state in which the centers of the alignment marks MUa-MUd on the upper substrate K1 and the centers of the alignment marks MLa-MLd on the lower substrate K2 do not exactly match. In the example shown in Fig. 10(a), the alignment marks MLa-MLd on the lower substrate K2 are shifted toward the center O of the substrate with respect to the centers of the alignment marks MUa-MUd on the upper substrate K1. At this time, the circuit pattern PtU on the upper substrate K1 and the circuit pattern PtL on the lower substrate K2 are slightly shifted, for example, as shown in Fig. 11(a).

[0132] In the state shown in Fig. 10(a), the alignment marks MLa-MLd of the lower substrate K2 are contained within the alignment marks MUa-MUd of the upper substrate K1, so they can be considered to be aligned. Therefore, the vacuum bonding apparatus 1 can bond the upper substrate K1 and the lower substrate K2 together even in the state shown in Fig. 10(a). However, it is preferable to bond the substrates together in a state in which the centers of the alignment marks MUa-MUd of the upper substrate K1 and the centers of the alignment marks MLa-MLd of the lower substrate K2 are accurately aligned, as this improves the quality of the substrates.

[0133] Therefore, the vacuum laminating apparatus 1 adjusts the temperature of the lower table 4 to correct the size of the lower substrate K2 (see FIG. 10(b)). As shown in FIG. 10(b), the size of the lower substrate K2 is enlarged, and the alignment marks MLa-MLd of the lower substrate K2 move in the directions of the arrows A1a-A1d from the positions shown in FIG. 10(a), respectively. As a result, the centers of the alignment marks MUa-MUd of the upper substrate K1 and the centers of the alignment marks MLa-MLd of the lower substrate K2 are accurately aligned. At this time, the circuit pattern PtU of the upper substrate K1 and the circuit pattern PtL of the lower substrate K2 are accurately overlapped, for example, as shown in FIG. 11(b). The vacuum laminating apparatus 1 can assemble a high-quality substrate by laminating the upper substrate K1 and the lower substrate K2 together in this state.

[0134] As described above, according to the vacuum laminating apparatus 1 according to the present embodiment 1, the adhesive properties such as viscosity can be made uniform over the entire area. As a result, for example, the amount of crushing of the adhesive can be made uniform over the entire area. Furthermore, the vacuum bonding apparatus 1 can also correct the dimensions of the lower substrate K2.

[0135] [Embodiment 2] Hereinafter, the configuration of the vacuum laminating apparatus 1A according to the second embodiment will be described with reference to Fig. 12. Fig. 12 is a diagram showing a schematic configuration of the vacuum laminating apparatus 1A.

[0136] As shown in FIG. 12, the vacuum bonding apparatus 1A of this embodiment 2 differs from the vacuum bonding apparatus 1 of embodiment 1 in that it has table temperature adjustment mechanisms 60 not only on the lower table 4 but also on both the upper table 3 and the lower table 4.

[0137] Such a vacuum bonding apparatus 1A can correct the dimensions not only of the lower substrate K2 but also of the upper substrate K1. Therefore, the vacuum bonding apparatus 1A can adjust the positions of alignment marks and circuit patterns as shown in Fig. 13 and Fig. 14. Fig. 13 and Fig. 14 are schematic diagrams showing examples of correction of substrate dimensions in the present embodiment 2.

[0138] Fig. 13(a) shows a state in which the centers of the alignment marks MUa-MUd of the upper substrate K1 and the centers of the alignment marks MLa-MLd of the lower substrate K2 do not exactly coincide. In the example shown in Fig. 13(a), the alignment marks MLa-MLd of the lower substrate K2 are shifted in a direction away from the center O of the substrate with respect to the centers of the alignment marks MUa-MUd of the upper substrate K1. At this time, the circuit pattern PtU of the upper substrate K1 and the circuit pattern PtL of the lower substrate K2 are slightly shifted, for example, as shown in Fig. 14(a).

[0139] Therefore, the vacuum bonding apparatus 1A adjusts the temperature of the upper table 3 to correct the size of the upper substrate K1 (see FIG. 13(b)). As shown in FIG. 13(b), the size of the upper substrate K1 is enlarged, and the alignment marks MUa to MUd of the upper substrate K1 move in the directions of the arrows A2a to A2d from the positions shown in FIG. 13(a), respectively. As a result, the centers of the alignment marks MUa to MUd of the upper substrate K1 and the centers of the alignment marks MLa to MLd of the lower substrate K2 are accurately aligned. At this time, the circuit pattern PtU of the upper substrate K1 and the circuit pattern PtL of the lower substrate K2 are accurately overlapped, for example, as shown in FIG. 14(b). The vacuum bonding apparatus 1A can assemble a high-quality substrate by bonding the upper substrate K1 and the lower substrate K2 together in this state.

[0140] As described above, according to the vacuum laminating apparatus 1A of the present embodiment 2, the adhesive properties such as viscosity can be made uniform over the entire area, similar to the vacuum laminating apparatus 1 of the embodiment 1. As a result, for example, the amount of crushing of the adhesive can be made uniform over the entire area. Moreover, in comparison with the vacuum bonding apparatus 1 according to the first embodiment, the vacuum bonding apparatus 1A according to the second embodiment can perform dimensional correction not only on the lower substrate K2 but also on the upper substrate K1.

[0141] The present invention is not limited to the above-described embodiment, and includes various modified examples. For example, the above-described embodiment has been described in detail to easily explain the present invention, and is not necessarily limited to an embodiment having all of the configurations described. In addition, it is possible to replace a part of the configuration of an embodiment with another configuration, and it is also possible to add another configuration to the configuration of an embodiment. In addition, it is possible to add, delete, or replace a part of each configuration with another configuration.

[0142] Also, for example, in the above embodiment, the two members bonded by the vacuum bonding apparatus 1 are an upper substrate K1 (glass substrate) and a lower substrate K2 (glass substrate), and the vacuum bonding apparatus 1 is described as a substrate assembly apparatus that bonds the upper substrate K1 (glass substrate) and the lower substrate K2 (glass substrate) to assemble a substrate such as a liquid crystal panel. However, the two members are not necessarily limited to substrates.

[0143] Also, for example, in the above-described embodiment 1, the table temperature adjustment mechanism 60 is provided on the lower table 4, and further, in the above-described embodiment 2, the table temperature adjustment mechanism 60 is provided on both the upper table 3 and the lower table 4. However, the table temperature adjustment mechanism 60 may also be provided only on the upper table 3.

[0144] Also, for example, in the above-mentioned first and second embodiments, the table temperature adjustment mechanism 60 has been described as having a heating mechanism such as a heater. However, the table temperature adjustment mechanism 60 may have a heating / cooling mechanism incorporating a Peltier element instead of the heater 62 or 63, and may be configured to control the temperature of the table to be adjusted. That is, the table temperature adjustment mechanism 60 may be configured to heat or cool by a Peltier element disposed in each area of ​​the table to be adjusted. In this case, the temperature of the table temperature adjustment mechanism 60 (the temperature of the liquid flowing inside the flow path 61) is preferably equal to or higher than (room temperature -10)°C and equal to or lower than room temperature. The reason for this is that if the liquid is cooled at a temperature lower than (room temperature -10)°C, problems such as condensation may occur. Also, for example, the table temperature adjustment mechanism 60 may be configured to have both a heating mechanism and a cooling mechanism. [Explanation of symbols]

[0145] 1 Vacuum laminating equipment 1a Mount 1b Lower shaft 2 Upper Frame 2a Upper shaft 3 Upper table 3a Top board surface 4 Lower table 4a Lower board surface 5. Vacuum Chamber 5a Upper chamber 5b Lower chamber 6 Suspension mechanism 6a Support shaft 6b Locking part 6c Hook 7 Suction mechanism 7a Suction pin 7b Suction pin pad 8 Adhesive retention mechanism 8a Adhesive pin 8b Adhesive pin plate (base part) 8c Adhesive part 20 Z-axis drive mechanism (vertical movement mechanism) 20a Ball screw shaft 20b Ball screw mechanism 20c electric motor 20d Load Cell 30 Backplate 31 Cushion Seat 40 XYθ moving unit 60 Table temperature control mechanism 70,80 Pin up / down mechanism 71,81 Ball screw shaft 72,82 Ball screw mechanism 73,83 Electric motor 100 Control device 110 Control section 111 Pin height control section 112 Movement control section 113 Vacuum process control unit 114 Table temperature control unit 160 Storage section 180 Display section 190 Input section 200 Transport device 1000 Vacuum Lamination System Ar1,Ar2,Ar3,Ar4 Area D1 Setting data K1 upper board K2 lower board MLa,MLb,MLc,MLd,MUa,MUb,MUc,MUd Alignment marks P0 Vacuum pump mechanism P1, P2, P3 Vacuum Pumps Pr1 Control program PtL, PtU circuit pattern SN1(PAr1),SN2,SN3(PAr2),SN4,SN5,SN6,SN7(PAr3),SN8,SN9(PAr4) Temperature sensor

Claims

1. a vacuum chamber capable of housing the lower member and the upper member under a vacuum environment; a lower table on which the lower member is placed within the vacuum chamber; an upper table for holding the upper member within the vacuum chamber; a temperature sensor for detecting the temperature of either or both of the lower table and the upper table for each arbitrarily set area; A control unit is provided to control each part. The control unit is a storage unit that stores set temperature determination data that specifies a set temperature at which the temperature of each of the areas becomes uniform, the set temperature being determined based on the temperature of each of the areas detected by the temperature sensor in a vacuum environment; a table temperature adjustment mechanism that adjusts the temperature of each of the areas to a set temperature determined by the set temperature determination data stored in the storage unit based on the temperature of each of the areas detected by the temperature sensor under a vacuum environment, When cooling a table whose temperature is to be adjusted, the temperature of the table temperature adjustment mechanism is equal to or higher than (room temperature -10)°C and equal to or lower than room temperature. Vacuum laminating equipment.

2. 2. The vacuum lamination apparatus according to claim 1, The table temperature adjustment mechanism includes a liquid flow path disposed in each area of ​​the table to be adjusted in temperature, and a heater for heating the liquid. A vacuum lamination apparatus comprising:

3. 2. The vacuum lamination apparatus according to claim 1, The table temperature adjustment mechanism includes a heating wire disposed in each area of ​​the table to be adjusted in temperature, and a heater for heating the heating wire. A vacuum lamination apparatus comprising:

4. 2. The vacuum lamination apparatus according to claim 1, The table temperature adjustment mechanism heats or cools the table by using Peltier elements arranged in each area of ​​the table to be adjusted in temperature. A vacuum lamination apparatus comprising:

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