TRANSPORTATION MECHANISM AND PROCESSING APPARATUS EQUIPPED WITH SAME

Abstract

To provide a new technique for a technique to convey a placement table on which a plurality of workpieces is placed together with the plurality of workpieces.SOLUTION: A conveying mechanism conveys a placement table having a workpiece area on which a plurality of workpieces is placed and an outer peripheral area surrounding the workpiece area with the plurality of workpieces placed in the workpiece area, and comprises: a holding unit that is adsorbed to the outer peripheral area of the placement table to hold the placement table and is formed with an accommodation part that corresponds to the workpiece area and accommodates the plurality of workpieces placed in the workpiece area; and a moving unit that moves the holding unit. The holding unit has a movement prevention part that prevents the movement of the workpieces during the movement of the holding unit.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a transport device that transports a mounting table on which a plurality of workpieces are placed together with the plurality of workpieces, and to a processing device equipped with the transport device. [Background technology]

[0002] Conventionally, for example, when cutting a small workpiece into chips of a specified size, it is inefficient to hold and process a single workpiece on a holding table, so multiple workpieces are lined up and processed at the same time.

[0003] When machining multiple workpieces at once in this manner, it is common practice to attach and fix the multiple workpieces to tape, and jigs for attaching workpieces to tape are also known (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2012-74657 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, tape is costly, and in order to reduce this cost, there is a demand for the ability to handle multiple workpieces simultaneously without using tape.

[0006] Therefore, instead of using tape, a method of handling using a mounting table on which multiple workpieces can be placed is considered. In this case, if the placement of the workpieces is significantly shifted when the mounting table is transported and placed on the holding table (holding table) of the processing device, there is a concern that processing defects such as inability to cut out the workpieces to a specified size may occur.

[0007] In view of the above problems, the present invention provides a new technique for transporting a mounting table on which a plurality of workpieces are placed together with the plurality of workpieces. [Means for solving the problem]

[0008] The problem to be solved by the present invention has been described above, and the means for solving this problem will now be described.

[0009] According to one aspect of the present invention, A transport mechanism transports a mounting table having a work area on which a plurality of workpieces are placed and an outer peripheral area surrounding the work area, with the plurality of workpieces placed in the work area, a holding unit that holds the mounting table by adsorbing the outer circumferential area of ​​the mounting table and has a storage section formed therein that corresponds to the work area and stores a plurality of workpieces placed on the work area; A moving unit that moves the holding unit, The holding unit is a transport mechanism having a movement suppressing portion that suppresses movement of the workpiece while the holding unit is moving.

[0010] According to another aspect of the present invention, The movement suppressing portion is provided in the storage portion and is configured by a portion that abuts against a part of the workpiece.

[0011] According to another aspect of the present invention, a plurality of workpieces are placed on the work area of ​​the placement table with a gap between them, The movement suppressing portion is composed of walls that correspond to the gaps and are inserted between adjacent workpieces.

[0012] According to another aspect of the present invention, there is provided a processing apparatus including a conveying mechanism, A processing unit for processing the workpiece; a support table that supports the support table on which a plurality of workpieces to be machined by the machining unit are placed; a relative movement mechanism for moving the processing unit relative to the support table; a load table on which a plurality of workpieces before machining are temporarily placed; an unload table on which the workpieces are temporarily placed after machining; Equipped with The transport mechanism is a processing device that transports the mounting table from the load table to the support table and transports the mounting table from the support table to the unload table. Effect of the Invention

[0013] In the present invention, by using a mounting table and a holding unit on which multiple workpieces can be placed instead of using tape, it becomes possible to handle multiple workpieces simultaneously. In addition, since the positional deviation of the workpieces is suppressed during transportation, it is possible to prevent the occurrence of processing defects such as the inability to cut out the workpieces to a specified size. [Brief description of the drawings]

[0014] [Figure 1] FIG. 2 is a diagram showing an example of the configuration of a workpiece and a mounting table. [Diagram 2] FIG. [Diagram 3] 1A is a diagram showing the mounting table and the holding unit, and FIG. 1B is a diagram showing the internal configuration of the holding unit. [Figure 4] 1A is a diagram showing one embodiment of a movement suppressing portion of a holding unit, and FIG. 1B is a diagram showing another embodiment of a movement suppressing portion of a holding unit. [Diagram 5] 13A and 13B are views showing another embodiment of a movement suppressing portion of a holding unit; [Figure 6] FIG. 2 is a perspective view showing a configuration example of a processing device. [Figure 7] 5A and 5B are diagrams for explaining transport of a holding unit. [Figure 8] 1A is a diagram illustrating a state in which the mounting table is placed on the holding table by the holding unit, and FIG. 1B is a diagram illustrating a state in which the mounting table is placed on the holding table. [Figure 9]FIG. 4 is a diagram illustrating a state in which the mounting table is placed on the support table. [Figure 10] 1 is a diagram illustrating machining of a workpiece. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a diagram showing an example of the configuration of a workpiece 1 and a mounting table 11. As shown in FIG. The workpiece 1 is formed by placing a workpiece 1b on a substrate 1a (board). The substrate 1a is formed of a plate material such as glass, silicon, carbon, etc. The workpiece 1b is formed of a plate material such as glass, resin, ceramics, etc. The workpiece 1b is fixed to the upper surface of the substrate 1a with wax or adhesive. Note that the workpiece 1 may be formed of only the workpiece 1b without the substrate 1a.

[0016] On an upper surface 11a of the mounting table 11, a work area 12 on which a plurality of workpieces 1 are placed and an outer circumferential area 13 surrounding the work area 12 are formed.

[0017] In the work area 12, positioning marks 12a are provided at a plurality of locations for arranging the workpieces 1 with a predetermined gap between them. In this embodiment, the positioning marks 12a are configured by displaying a rectangular frame (rectangular line) of a size that is approximately the same as the outline of the bottom surface of the substrate 1a of the workpiece 1. The specific configuration of the positioning marks 12a is not particularly limited, and in addition to being configured as a linear mark, they may also be configured as a recessed portion into which the substrate 1a of the workpiece 1 is fitted for positioning.

[0018] A suction portion 12b for suction-holding each workpiece 1 is formed inside the positioning mark 12a. In this embodiment, the suction portion 12b is configured by a groove having a square frame and a cross shape inside the square frame. The specific configuration of the suction portion 12b is not particularly limited, and may be configured to have a plurality of holes, for example.

[0019] 2, a suction passage 12c leading to the suction unit 12b is formed inside the mounting table 11. For example, when the mounting table 11 is placed on the mounting surface 40a of the load table 40, the suction passage 12c of the mounting table 11 is connected to a suction port 40b formed on the mounting surface 40a and is connected to a suction source 41b via a valve 41a communicating with the suction port 40b. With this configuration, the suction unit 12b of the mounting table 11 is connected to the suction source 41b, and the workpiece 1 is sucked and held by the suction unit 12b.

[0020] Fig. 3(A) is a diagram showing the configuration of the mounting table 11 and the holding unit 44. Fig. 3(B) is a diagram showing the inner configuration of the holding unit 44.

[0021] 3(A) and (B), the holding unit 44 is attached to the outer peripheral region 13 of the mounting table 11 and holds the mounting table 11 so as to suspend it from above. The holding unit 44 is formed with a storage section 44b that corresponds to the work area 12 and stores multiple workpieces 1 placed in the work area 12.

[0022] As shown in Figures 3(A) and (B), the holding unit 44 has a holding side 44a facing the upper surface 11a of the mounting table 11, and a recess is formed in the holding side 44a in an area corresponding to the work area 12, thereby forming a concave accommodating portion 44b.

[0023] 3(A) and (B), a suction groove 44c is formed so as to surround the storage portion 44b on the holding side surface 44a of the holding unit 44. The suction groove 44c is connected to an upper surface 44d opposite to the holding side surface 44a via a suction path 44e.

[0024] As shown in Fig. 3(A), a substantially U-shaped suspended part 46 is provided on an upper surface 44d of the holding unit 44. A suction path 46p is formed in the suspended part 46, and the suction path 46p is connected to each suction path 44e via a tube. The suction path 46p of the suspended part 46 is configured to communicate with a suction source 49b (Fig. 6), as will be described in detail later.

[0025] As shown in Fig. 4(A), the holding unit 44 has a movement suppressing portion 44f that suppresses movement of the workpiece 1 while the holding unit 44 is moving. In the embodiment of Fig. 4(A), the movement suppressing portion 44f is made of a plate-like member provided in the storage portion 44b, and abuts against the upper surface 1m (workpiece 1b), which is a part of the workpiece 1, and suppresses movement of the workpiece 1, such as lateral shift, by pressing down the workpiece 1 from above.

[0026] The movement suppressing portion 44f can be made of, for example, an elastic member made of rubber or a plate-shaped sponge, and can prevent damage when placed on the upper surface 1m of the workpiece 1 (workpiece 1b).

[0027] Fig. 4(B) shows another embodiment of the holding unit 44A. In the embodiment of Fig. 4(B), the movement suppressing portion 44g is arranged at a position corresponding to the gap formed between the workpieces 1, and is composed of a wall inserted between adjacent workpieces. When the workpiece 1 shifts laterally, the substrate 1a comes into contact with the wall, suppressing the movement of the workpiece 1, such as a large lateral shift.

[0028] The walls constituting the movement suppressing portion 44g may be formed by integrally molding a protrusion on the main body of the holding unit 44A, or by attaching a separate member. The walls constituting the movement suppressing portion 44g divide the storage portion 44b into small spaces, and the workpiece 1 is stored in each space. By ensuring a gap between each space and the top surface 1m (workpiece 1b) of the workpiece 1, damage to the workpiece 1b due to contact with the holding unit 44A can be prevented. The walls constituting the movement suppressing portion 44g may be configured to abut against the substrate 1a of the workpiece 1.

[0029] 5(A) and (B) show another embodiment of the holding unit 44B. In the embodiment of Fig. 5(A) and (B), a vacuum pad 44v is provided in the holding unit 44B, and the mounting table 11 is held by suction with the vacuum pad 44v.

[0030] The movement suppressing portion 44h is disposed at a position corresponding to the gap formed between the workpieces 1, and is composed of a wall inserted between adjacent workpieces 1. When the workpiece 1 shifts laterally, the substrate 1a comes into contact with the wall, suppressing the movement of the workpiece 1, such as a large lateral shift.

[0031] The walls constituting the movement suppressing portion 44h may be formed by integrally molding a protrusion on the main body of the holding unit 44B, or by attaching a separate member. The walls constituting the movement suppressing portion 44h divide the storage portion 44b into small spaces, and the workpiece 1 is stored in each space. In the holding unit 44B, the upper part of the upper surface 1m (workpiece 1b) of the workpiece 1 in each space is opened by the opening portion 44m, so that damage to the workpiece 1b due to contact with the holding unit 44B can be prevented. The walls constituting the movement suppressing portion 44h may be configured to abut against the substrate 1a of the workpiece 1.

[0032] Next, a configuration example of a processing device using the mounting table and the holding unit configured as above will be described. Fig. 6 is a diagram showing a cutting device which is an example of the processing device 2.

[0033] 6, the processing device 2 includes an equipment base 4 that supports each component, a holder 6 that suction-holds a mounting table 11 on which a workpiece 1 is placed on the equipment base 4, and a processing unit 8 that cuts the workpiece 1. The processing device 2 suction-holds a plurality of workpieces 1 placed on the mounting table 11 with the holder 6, and performs cutting processing with the processing unit 8.

[0034] The holding table 6 has an internal suction path (not shown) one end of which is connected to a suction source, and the other end of the suction path is connected to a suction groove portion formed in the holding surface 6a on the upper surface of the holding table 6. The holding table 6 is configured to be rotatable around an axis along a direction perpendicular to the holding surface 6a.

[0035] When the mounting table 11 carrying multiple workpieces 1 is placed on the holding surface 6a and the suction source is activated, the mounting table 11 is held by suction to the holding table 6a, and negative pressure is generated at the suction portion 12b (Figure 1) on the upper surface of the mounting table 11 through the suction path 12c (Figure 1) formed inside the mounting table 11, and this negative pressure causes each workpiece 1 to be held by suction to the mounting table 11.

[0036] An opening 16 having a long side along the X-axis direction is provided in the center of the upper surface of the device base 4, and an X-axis moving table 18 located below the holder 6 and a dust-proof and drip-proof cover 20 one end of which is attached to the X-axis moving table 18 are disposed inside the opening 16. The holder 6 and the X-axis moving table 18 are moved in the X-axis direction by a processing feed unit (not shown) disposed in the area below the dust-proof and drip-proof cover 20.

[0037] When cutting the workpiece 1, the holding table 6 is processed and fed in the X-axis direction (processing feed direction) by the processing feed unit. In addition, the holding table 6 moves between a processing area 62 where the workpiece 1 is cut by the processing feed unit and a carry-in / out area 60 where the placement table 11 is carried in and out of the holding table 6.

[0038] A support structure 22 having a protrusion extending above the opening 16 is erected on the rear part of the upper surface of the device base 4. A pair of Y-axis guide rails 24 parallel to the Y-axis direction are provided on the front side surface of the support structure 22, and a Y-axis moving plate 26 is slidably attached to the Y-axis guide rails 24.

[0039] A nut portion (not shown) is provided on the rear side of the Y-axis moving plate 26, and a Y-axis ball screw 28 parallel to the Y-axis guide rail 24 is screwed into this nut portion. A Y-axis pulse motor 30 is connected to one end of the Y-axis ball screw 28. When the Y-axis pulse motor 30 rotates the Y-axis ball screw 28, the Y-axis moving plate 26 moves in the Y-axis direction along the Y-axis guide rail 24.

[0040] The pair of Y-axis guide rails 24, the Y-axis moving plate 26, the Y-axis ball screw 28, and the Y-axis pulse motor 30 function as an indexing feed unit Uy that indexes and feeds the processing unit 8 and the camera unit 10 in the Y-axis direction.

[0041] A pair of Z-axis guide rails 32 extending in the Z-axis direction and a Z-axis moving plate 34 slidably attached to each of the Z-axis guide rails 32 are disposed on the front surface of the Y-axis moving plate 26. A nut portion (not shown) is provided on the back surface side (rear surface side) of the Z-axis moving plate 34, and a Z-axis ball screw 36 parallel to the Z-axis guide rails 32 is screwed into this nut portion.

[0042] A Z-axis pulse motor 38 is connected to one end of the Z-axis ball screw 36. When the Z-axis pulse motor 38 rotates the Z-axis ball screw 36, the Z-axis moving plate 34 moves in the Z-axis direction along the Z-axis guide rail 32. A processing unit 8 and a camera unit 10 are fixed to the lower front surface of the Z-axis moving plate 34.

[0043] The pair of Z-axis guide rails 32, the Z-axis moving plate 34, the Z-axis ball screw 36, and the Z-axis pulse motor 38 function as a lifting unit Uz that moves the processing unit 8 and the camera unit 10 in the Z-axis direction perpendicular to the holding surface 6a of the holding table 6. The indexing feed unit Uy and the lifting unit Uz function as a relative movement mechanism that moves the processing unit 8 relative to the holding table 6.

[0044] The processing unit 8 includes a spindle (not shown) along the Y-axis direction and an annular cutting blade 8a attached to the tip of the spindle. A spindle motor (not shown) that rotates the spindle around the Y-axis direction is connected to the base end side of the spindle. When the spindle is rotated by the spindle motor, the cutting blade 8a rotates.

[0045] The cutting blade 8a has a cutting edge on the outer periphery. The cutting edge includes, for example, abrasive grains and a binder in which the abrasive grains are dispersed. When the rotating cutting blade 8a is positioned at a predetermined height and the mounting table 11 (holding table 6) is moved in the processing feed direction, the workpiece 1 is cut by the cutting blade 8a.

[0046] The machining unit 8 is provided with a nozzle 8b on the side of the cutting blade 8a, and cutting fluid is supplied from the nozzle 8b to the upper surface of the workpiece 1 and the cutting blade 8a.

[0047] The cutting fluid supplied from the nozzle 8b is, for example, pure water. The cutting fluid has a function of cooling the workpiece 1 and the cutting blade 8a. In addition, cutting chips and the like generated by the cutting process are carried to the outside of the workpiece 1 by the cutting fluid and removed.

[0048] A load table 40 for temporarily placing a mounting table 11 on which a plurality of unmachined workpieces 1 are placed is set at a position adjacent to the carry-in / out area 60 on the upper surface of the device base 4. An operator temporarily places the mounting table 11 on the load table 40 at any timing.

[0049] An unload table 50 for temporarily placing the mounting table 11 on which the plurality of processed workpieces 1 are placed is provided at another position adjacent to the carry-in / out area 60 on the upper surface of the apparatus base 4. After processing, the operator temporarily places the mounting table 11 from the support table 6 on the unload table 50, and unloads the mounting table 11 from the unload table 50 at any timing.

[0050] The processing device 2 includes a transport mechanism for transporting the mounting table 11 placed on the load table 40 to the holding table 6 located in the carry-in / out area 60. The transport mechanism includes a holding unit 44 and a moving unit that moves the holding unit 44.

[0051] A roughly U-shaped suspended part 46 is provided on the upper surface of holding unit 44, and the lower surface of the upper horizontal part of suspended part 46 is lifted up by hanging part 48 provided at the tip of arm 42. In this way, holding unit 44 is suspended from arm 42, detachably supported by arm 42, and can be transported.

[0052] When the holding unit 44 is not in use, it is temporarily placed on the waiting table 58. When the holding unit 44 is to be used, the arm 42 is moved to attach the holding unit 44 that is temporarily placed on the waiting table 58. The holding unit 44 is integrated with the arm 42, and moves in conjunction with the movement of the Z-axis moving plate 34 in the Y-axis direction and the Z-axis direction.

[0053] In the above configuration, the arm 42 (Z-axis moving plate 34), the indexing feed unit Uy that moves the arm 42 in the Y-axis direction, and the lifting unit Uz that moves the arm 42 in the Z-axis direction constitute a moving unit U44 that moves the holding unit 44. Note that in addition to constituting the moving unit U44 that moves the holding unit 44 by the arm 42, the indexing feed unit Uy, and the lifting unit Uz, a dedicated moving unit for moving the holding unit 44 may be provided separately.

[0054] Suction paths 42p, 46p that communicate with each other are formed in the hanging portion 48 of the arm 42 and the suspended portion 46 of the holding unit 44, respectively. When the holding unit 44 is suspended and supported by the arm 42, the suction paths 42p, 46p communicate with each other. The suction path 42p on the arm 42 side communicates with a suction source 49b through a valve 49a, and the communication between the suction paths 42p, 46p generates negative pressure in the suction groove 44c of the holding unit 44 (FIGS. 3(A)(B)).

[0055] Negative pressure is generated in the suction groove 44c (FIGS. 3A and 3B) of the holding unit 44, so that the mounting table 11 is suction-held in a suspended state by the holding unit 44 (FIG. 8B).

[0056] To reduce weight, arm 42 and suspended part 46 are formed from a metal material mainly composed of aluminum, for example. However, stainless steel may be used for the contact portion between arm 42 and suspended part 46, and the contact surface may be polished. Furthermore, a seal member such as an O-ring may be provided around the periphery of the connection portion of suction paths 42p, 46p to increase the airtightness of the connection portion.

[0057] 6, the processing device 2 is provided with a pipe-shaped cleaning nozzle 54 that straddles the opening 16 in the indexing feed direction (Y-axis direction) above the movement path of the holding table 6 between the processing area 62 and the carry-in / out area 60. The cleaning nozzle 54 is provided with a plurality of jetting ports (not shown) facing downward, and can jet a cleaning liquid such as pure water from the jetting ports. If the cleaning liquid is jetted from the cleaning nozzle 54 when the holding table 6 moves from the processing area 62 to the carry-in / out area 60, the workpiece 1 machined by the processing unit 8 can be cleaned.

[0058] In order to enhance the cleaning effect, a high-pressure cleaning liquid may be sprayed from the cleaning nozzle 54 toward the workpiece 1. Also, a mixture of two fluids, air and water, may be sprayed from the cleaning nozzle 54.

[0059] 6, the processing device 2 is provided with a pipe-shaped drying nozzle 56 that straddles the opening 16 in the indexing feed direction (Y-axis direction) between the carry-in / out area 60 and the unload table 50. The drying nozzle 56 is provided with a plurality of nozzles (not shown) facing downward, and can spray gas such as dry air from the nozzles. By spraying gas from the drying nozzle 56 onto the workpiece 1 placed on the mounting table 11 that has been moved to the carry-in / out area 60 after processing, the workpiece 1 to which cutting fluid or the like has adhered can be dried.

[0060] Next, the loading and unloading of the mounting table 11 into and from the processing device 2 and the cutting of the workpiece 1 will be described. 6, the operator places the mounting table 11 on the load table 40 and places the workpiece 1 on the mounting table 11 so as to align it with each of the positioning marks 12a of the mounting table 11. Note that the mounting table 11 on which the workpiece 1 has been placed in advance may be placed on the load table 40.

[0061] At this time, by generating negative pressure in the suction portion 12b of the mounting table 11 placed on the load table 40, each workpiece 1 is sucked and held within the positioning mark 12a, preventing the workpiece 1 positioned in accordance with the positioning mark 12a from shifting out of position.

[0062] 6 and 7, the arm 42 is moved, and the holding unit 44 temporarily placed on the waiting table 58 is lifted by the arm 42. The holding unit 44 is then moved in the Y-axis direction to above the mounting table 11, and thereafter the holding unit 44 is lowered and set on the mounting table 11 to reach the state shown in FIG.

[0063] 4A, suction on the load table 40 side is stopped, and the mounting table 11 is held by suction in the holding unit 44. Then, the mounting table 11 integrated with the holding unit 44 is raised, and then, as shown in FIG. 7, the mounting table 11 is moved to above the holding table 6 that has moved to the carry-in / out area 60.

[0064] 8(A), the holding unit 44 is lowered to place the mounting table 11 on the holding table 6, and then the suction holding of the mounting table 11 by the holding unit 44 is stopped. Then, as shown in FIG. 8(B), the holding unit 44 is raised to leave the mounting table 11 placed on the holding table 6.

[0065] In this manner, the mounting table 11 placed on the load table 40 is transported to the holding table 6. During this transport process, the movement suppressing portion 44f (FIG. 4(A)) of the holding unit 44 abuts against a part of the workpiece 1, thereby suppressing the movement of the workpiece 1, such as lateral shift.

[0066] 9, the holding unit 44 is moved to the position of the waiting table 58, and the holding unit 44 is temporarily placed on the waiting table 58. As a result, the holding unit 44 is detached from the arm 42.

[0067] Also, as shown in Figure 9, suction begins on the holding surface 6a of the holding table 6, the mounting table 11 is held by suction on the holding surface 6a, and each work 1 is held by suction on the upper surface of the mounting table 11 due to the negative pressure generated in the suction groove 44c of the mounting table 11.

[0068] With the mounting table 11 held by the holding table 6 in the above manner, the processing feed unit moves the holding table 6 to the processing area 62 as shown in Fig. 10. Then, the cutting blade 8a of the processing unit 8 is positioned at a predetermined height suitable for cutting the workpiece 1, and the holding table 6 is moved in the processing feed direction, whereby processing of the workpiece 1 (workpiece 1b) is performed at a certain position in the indexing feed direction.

[0069] After cutting at a certain position in the indexing feed direction, the machining unit 8 is indexed in the indexing feed direction, and the machining feed unit is operated again to cut the workpiece 1. Then, after cutting of the workpiece 1 in one direction is completed, the holding table 6 is rotated around an axis perpendicular to the holding surface 6a, and the workpiece 1 is cut in the other direction. By the above cutting process, the workpiece 1b (FIG. 1) of the workpiece 1 is cut out to, for example, a predetermined size.

[0070] As shown in Fig. 10, when cutting the workpiece 1, cutting fluid is ejected from the nozzle 8b and supplied to the cutting blade 8a and the workpiece 1. Cutting chips generated from the workpiece 1 during cutting are washed away by the cutting fluid. In addition, heat generated by friction between the workpiece 1 and the cutting blade 8a is removed by the cutting fluid.

[0071] As shown in FIG. 6, while cutting is being performed, the operator may place a new mounting table 11 on the load table 40 and place the workpiece 1 on the mounting table 11 to prepare for the loading of the next mounting table 11.

[0072] 6, after cutting of all the workpieces 1 placed on the placement table 11 is completed, the support table 6 is moved to the carry-in / out area 60. At this time, high-pressure gas is sprayed from the drying nozzle 56 to dry the workpieces 1.

[0073] After drying, suction of the holding surface 6a of the holding table 6 moved to the carry-in / out area 60 is stopped, and the suction holding of the mounting table 11 is released. The operator carries the mounting table 11 out to the unload table 50. The operator carries the mounting table 11 out of the unload table 50 at any timing.

[0074] In the embodiment described above, by using a mounting table and a holding unit on which multiple workpieces can be placed instead of using tape, it becomes possible to handle multiple workpieces simultaneously. In addition, since the positional deviation of the workpieces is suppressed during transportation, problems such as being unable to cut out to a specified size can be prevented. [Explanation of symbols]

[0075] 1 Work 1a Substrate 1b Workpiece 1m top surface 2 Processing equipment 2 6 Holding stand 6a Holding surface 8 Processing Unit 11 Placement table 11a Top surface 12 Work Area 12a Positioning mark 12b Suction part 13 Outer area 40 Road Table 42 Arm 44 Holding Unit 44a Retaining side 44b Storage section 44c suction groove 44d top surface 44e Suction channel 44f Movement prevention part 44m open area 44v Vacuum Pad 50 Unloading Table 58 Waiting Table 60 Loading / unloading area 62 Processing area U44 Mobile Unit Uy Indexing feed unit Uz Lifting unit

Claims

1. A transport mechanism transports a mounting table having a work area on which a plurality of workpieces are placed and an outer peripheral area surrounding the work area, with the plurality of workpieces placed in the work area, a holding unit that holds the mounting table by adsorbing the outer circumferential area of ​​the mounting table and has a storage section formed therein that corresponds to the work area and stores a plurality of workpieces placed on the work area; A moving unit that moves the holding unit, The holding unit is a conveying mechanism having a movement suppressing portion that suppresses movement of the workpiece while the holding unit is moving.

2. 2. The transport mechanism according to claim 1, wherein the movement suppressing portion is provided in the storage portion and configured as a portion that abuts against a part of the workpiece.

3. A plurality of workpieces are placed on the work area of ​​the placement table with gaps between them, 3. The transport mechanism according to claim 1, wherein the movement suppressing portion is made of a wall that corresponds to the gap and is inserted between adjacent works.

4. A processing apparatus including the conveying mechanism according to any one of claims 1 to 3, A processing unit for processing the workpiece; a support table that supports the support table on which a plurality of workpieces to be machined by the machining unit are placed; a relative movement mechanism for moving the processing unit relative to the support table; a load table on which a plurality of workpieces to be processed are temporarily placed; an unload table on which the workpieces are temporarily placed; Equipped with The transport mechanism transports the mounting table from the load table to the support table, and transports the mounting table from the support table to the unload table.

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