Wire bonding system, inspection device, wire bonding method, and program

Abstract

A wire bonding system according to the present invention comprises: an acquisition unit that acquires information pertaining to the diameter of a pressure-bonded ball where a wire is pressure-bonded to an electronic component by wire bonding; a first storage unit that stores the information pertaining to the pressure-bonded ball diameter which has been acquired by the acquisition unit; and an inspection unit that inspects the quality of wire bonding on the basis of the information pertaining to the pressure-bonded ball diameter which has been read from the first storage unit. With the wire bonding system, it is possible to enhance convenience in a method for checking the quality of wire bonding.

Description

[Technical field]

[0001] The present invention relates to a wire bonding system, an inspection device, a wire bonding method, and a program. [Background technology]

[0002] Conventionally, there has been known a wire bonding apparatus that connects a wire between an electronic component and a lead frame by bonding one end of the wire to an electronic component mounted on a substrate and bonding the other end of the wire to an electrode of the lead frame (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-119988 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the conventional technology, there is still room for improvement in the method for checking the quality of wire bonding.

[0005] The present invention has been made to solve such problems, and provides a wire bonding system, inspection device, wire bonding method, and program that can improve the convenience of checking the quality of wire bonding. [Means for solving the problem]

[0006] A wire bonding system in one embodiment of the present invention includes an acquisition unit that acquires information regarding the diameter of a compressed ball formed by wire bonding to an electronic component by wire bonding, a first memory unit that stores the information regarding the compressed ball diameter acquired by the acquisition unit, and an inspection unit that inspects the quality of the wire bonding based on the information regarding the compressed ball diameter read from the first memory unit.

[0007] An inspection device in one embodiment of the present invention includes an inspection unit that reads information regarding the diameter of a compressed ball formed by wire bonding to an electronic component from a first memory unit, and inspects the quality of the wire bonding based on the read information regarding the compressed ball diameter.

[0008] Moreover, a wire bonding method in one embodiment of the present invention includes a step of acquiring information regarding a diameter of a compressed ball formed by wire bonding to an electronic component by wire bonding, a step of storing the acquired information regarding the compressed ball diameter in a first memory unit, and a step of inspecting the quality of the wire bonding based on the information regarding the compressed ball diameter read from the first memory unit.

[0009] In addition, a program in one aspect of the present invention causes one or more computers to execute a process of acquiring information regarding the diameter of a compressed ball formed by wire bonding to an electronic component by wire bonding, a process of storing the acquired information regarding the compressed ball diameter in a first memory unit, and a process of inspecting the quality of the wire bonding based on the information regarding the compressed ball diameter read from the first memory unit. Effect of the Invention

[0010] According to the present invention, the convenience of the method for checking the quality of wire bonding can be improved. [Brief description of the drawings]

[0011] [Figure 1] 1 is a diagram showing a configuration of a wire bonding apparatus according to a first embodiment. [Diagram 2]FIG. 2 is a diagram showing a control configuration of the wire bonding apparatus according to the first embodiment. [Diagram 3] 5 is a flowchart showing an example of a notification process of an inspection result of the quality of wire bonding in the wire bonding apparatus according to the first embodiment. [Figure 4] FIG. 11 is a diagram showing a control configuration of the wire bonding apparatus according to the second embodiment. [Diagram 5] FIG. 13 is a diagram showing an example of correlation data showing the correlation between the pressing amount of the ball portion and the diameter of the compressed ball. [Figure 6] 10 is a flowchart showing an example of a process for setting an inspection standard in the wire bonding apparatus according to the second embodiment. [Figure 7] 10 is a flowchart showing an example of a notification process of an inspection result of the quality of wire bonding in the wire bonding apparatus according to the second embodiment. [Figure 8] 11 is a diagram for explaining an example of a target area for wire bonding for each conveyance; FIG. [Figure 9] FIG. 13 is a diagram showing an example of a display of inspection results of the quality of wire bonding. [Figure 10] FIG. 13 is a diagram showing the configuration of an inspection device according to a fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] First Embodiment Hereinafter, the wire bonding apparatus according to the first embodiment will be described with reference to the drawings.

[0013] As shown in FIG. 1, the wire bonding apparatus 10 includes, for example, a stage 11, an XY table 12, a bonding head 13, a bonding arm 14, a capillary 15 (an example of a bonding tool), a discharge electrode 16, and a clamper 17.

[0014] A substrate 51 on which a semiconductor chip 50 is mounted is placed on the stage 11. A heater (not shown) for heating a lead frame (not shown) formed on the substrate 51 is built into the stage 11. The heater heats the lead frame when wire bonding is performed.

[0015] The XY table 12 is connected to a bonding head 13. The bonding head 13 is connected to a bonding arm 14 via a lifting mechanism (not shown). The bonding arm 14 is an arm that protrudes horizontally from the bonding head 13. A capillary 15 is connected to the tip of the bonding arm 14. The capillary 15 is configured to be movable horizontally and vertically relative to the semiconductor chip 50 placed on the stage 11 as the bonding head 13 moves horizontally by the XY table 12 and as the bonding head 13 moves vertically by the lifting mechanism.

[0016] An ultrasonic vibrator is built into the bonding arm 14. When a voltage is applied to the ultrasonic vibrator during wire bonding, the ultrasonic vibrator applies ultrasonic vibration to the capillary 15 connected to the tip of the bonding arm 14.

[0017] The capillary 15 faces the stage 11 in the vertical direction and has a through hole that penetrates in the vertical direction. A wire 60 such as a gold wire is inserted into the through hole of the capillary 15. A discharge electrode 16 is disposed in the vicinity of the capillary 15.

[0018] When a voltage is applied to the discharge electrode 16 , a discharge occurs between the discharge electrode 16 and the tip of the wire 60 , melting the tip of the wire 60 to form a ball portion 61 .

[0019] The clamper 17 is provided above the capillary 15 and is configured to be able to clamp the wire 60 inserted into the through hole of the capillary 15 .

[0020] Then, the wire bonding apparatus 10 presses the ball portion 61 formed at the first end of the wire 60 against the semiconductor chip 50 as a voltage is applied to the discharge electrode 16. Then, after bonding the first end of the wire 60 to the semiconductor chip 50, the wire bonding apparatus 10 moves the capillary 15 to bend the wire 60, and makes a part of the wire 60 face the terminal of the substrate 51 in the vertical direction. Next, the wire bonding apparatus 10 presses the part of the wire 60 against the terminal of the substrate 51 as a voltage is applied to the discharge electrode 16. Then, after bonding the part of the wire 60 to the terminal of the substrate 51, the wire bonding apparatus 10 moves the capillary 15 upward in a state where the wire 60 is clamped by the clamper 17, thereby cutting the wire 60.

[0021] Next, the control configuration of the wire bonding apparatus 10 will be described.

[0022] As shown in FIG. 2, the wire bonding apparatus 10 includes, for example, a control unit 110 and a storage unit 120.

[0023] The control unit 110 is realized by, for example, a hardware processor such as a CPU (Central Processing Unit) executing a program (software). In addition, some or all of these components may be realized by hardware (including circuitry) such as an LSI (Large Scale Integration), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), or a GPU (Graphics Processing Unit), or may be realized by a combination of software and hardware. The program may be stored in advance in a storage device such as an HDD or flash memory of the wire bonding apparatus 10, or may be stored in a removable storage medium such as a DVD or CD-ROM, and installed in the HDD or flash memory of the wire bonding apparatus 10 by mounting the storage medium in a drive device.

[0024] The storage unit 120 is a non-volatile storage medium, and is configured, for example, by an HDD (Hard Disk Drive). The storage unit 120 stores various parameter values, functions, lookup tables, etc. used for control and calculation, in addition to programs for executing control and processing of the wire bonding apparatus 10. The process information 121 and the inspection standard 122 are examples of parameter values ​​used for control and calculation.

[0025] The process information 121 is information measured when wire bonding is performed. The process information 121 includes, for example, information about the diameter of a crimped ball formed by crimping a wire 60 to a terminal of a semiconductor chip 50 or a terminal of a substrate 51 by wire bonding. The information about the crimped ball diameter is information indicating the quality of wire bonding. The information about the crimped ball diameter includes, for example, a load, a US current, a spark voltage, a spark current, a pressing amount of the ball part 61, and observation information. The load is information about a load acting from the capillary 15 to a terminal of a semiconductor chip 50 or a terminal of a substrate 51 when wire bonding is performed. The US current is information about a current flowing through an ultrasonic transducer when wire bonding is performed. The spark voltage is information about a voltage applied to a discharge electrode 16 when wire bonding is performed. The spark current is information about a current flowing through a discharge electrode 16 when wire bonding is performed. The pressing amount of ball portion 61 is information regarding the pressing amount of ball portion 61 at the tip of wire 60 against the terminal of semiconductor chip 50 or the terminal of substrate 51 during wire bonding. The observation information includes image information regarding the bonding portion of wire 60 against the terminal of semiconductor chip 50 or the terminal of substrate 51.

[0026] The inspection standard 122 is information used when inspecting the quality of wire bonding, and is, for example, a threshold value for information related to the diameter of a compressed ball.

[0027] The control unit 110 includes, for example, an acquisition unit 111, an inspection unit 112, and a notification unit 113.

[0028] The acquiring unit 111 acquires information about the diameter of a compressed ball formed by bonding a wire 60 by wire bonding to a terminal of a semiconductor chip 50 or a terminal of a substrate 51. For example, when acquiring information about the compressed ball diameter during execution of wire bonding, the acquiring unit 111 stores the acquired information in the storage unit 120 as process information 121.

[0029] The inspection unit 112 inspects the quality of the wire bonding based on the information on the bonded ball diameter read from the storage unit 120. For example, the inspection unit 112 inspects the quality of the wire bonding based on the information on the bonded ball diameter acquired by the acquisition unit 111, with reference to the inspection standard 122 stored in the storage unit 120. For example, the inspection unit 112 compares the information on the bonded ball diameter acquired by the acquisition unit 111 with a threshold value stored in the storage unit 120 as the inspection standard 122, to inspect the quality of the wire bonding.

[0030] Notification unit 113 notifies the inspection result of the wire bonding quality by inspection unit 112 when the inspection result of the wire bonding quality by inspection unit 112 does not satisfy a predetermined condition. Notification unit 113 notifies the inspection result of the wire bonding quality by inspection unit 112 when, for example, inspection unit 112 outputs an inspection result indicating that the wire bonding quality is poor.

[0031] Next, a notification process of the inspection result of the wire bonding quality in the wire bonding apparatus 10 according to the first embodiment will be described with reference to the flowchart shown in Fig. 3. The flowchart shown in Fig. 3 is started, for example, when a user requests confirmation of the wire bonding quality.

[0032] As shown in FIG. 3, the wire bonding apparatus 10 acquires information on the diameter of the compressed ball stored as the process information 121 in the storage unit 120 (step S10).

[0033] Next, the wire bonding apparatus 10 judges whether or not the information on the bonded ball diameter acquired in step S10 satisfies a predetermined condition (step S11). When the wire bonding apparatus 10 judges that the information on the bonded ball diameter satisfies the predetermined condition (step S11=YES), the wire bonding apparatus 10 ends the process of the flowchart shown in Fig. 3 without notifying the inspection result of the wire bonding quality. On the other hand, when the wire bonding apparatus 10 judges that the information on the bonded ball diameter does not satisfy the predetermined condition (step S11=NO), the wire bonding apparatus 10 notifies the inspection result of the wire bonding quality (step S12) and ends the process of the flowchart shown in Fig. 3.

[0034] <Second embodiment> In the second and subsequent embodiments, the description of the matters common to the first and second embodiments will be omitted, and only the differences will be described. In particular, similar effects due to similar configurations will not be mentioned in each embodiment.

[0035] As shown in FIG. 4, a control unit 110A of a wire bonding apparatus 10A according to the second embodiment further includes a reference setting unit 114 in addition to an acquisition unit 111, an inspection unit 112, and a notification unit 113, for example.

[0036] When the amount of information on the compressed ball diameter stored as process information 121 in storage unit 120A becomes equal to or greater than a predetermined amount, standard setting unit 114 sets inspection standard 122 for the information on the compressed ball diameter. For example, standard setting unit 114 reads correlation data 123 indicating the correlation between the pressing amount of ball portion 61 and the compressed ball diameter from storage unit 120A, and sets a threshold value for the pressing amount of ball portion 61 as inspection standard 122 with reference to the read correlation data 123.

[0037] The inspection unit 112 compares, for example, the amount of pressing of the ball portion 61 acquired by the acquisition unit 111 with a threshold value set as an inspection standard 122 by the standard setting unit 114, to inspect the quality of the wire bonding.

[0038] 5 shows an example of correlation data 123 indicating the correlation between the pressing amount of the ball portion 61 and the diameter of the compressed ball. As shown in the figure, there is a positive correlation between the pressing amount of the ball portion 61 and the diameter of the compressed ball, and the larger the pressing amount of the ball portion 61, the larger the diameter of the compressed ball.

[0039] The standard setting unit 114, for example, refers to correlation data 123 read from the memory unit 120A based on predetermined standard data of the compressed ball diameter, identifies the amount of pressure applied to the ball portion 61 that corresponds to the standard data, and sets a numerical range including the identified amount of pressure applied to the ball portion 61 as the inspection standard 122.

[0040] The inspection unit 112 inspects the quality of the wire bonding based on, for example, whether or not the pressing amount of the ball portion 61 acquired by the acquisition unit 111 is within a numerical range set as an inspection standard 122 .

[0041] Next, a process for setting the inspection standard 122 in the wire bonding apparatus 10A according to the second embodiment will be described with reference to the flowchart shown in Fig. 6. The flowchart shown in Fig. 6 is started, for example, every time the process information 121 is acquired.

[0042] As shown in FIG. 6, the wire bonding apparatus 10A judges whether the amount of information on the compressed ball diameter is equal to or greater than a predetermined amount (step S20). When the amount of information on the compressed ball diameter is equal to or greater than a predetermined amount (step S20=YES), the wire bonding apparatus 10A reads out correlation data 123 indicating the correlation between the pressing amount of the ball part 61 and the compressed ball diameter from the storage unit 120A (step S21). Next, the wire bonding apparatus 10A refers to the correlation data 123 based on the standard data of the compressed ball diameter to specify the pressing amount of the ball part 61 corresponding to the standard data (step S22). Next, the wire bonding apparatus 10A sets a numerical range including the pressing amount of the ball part 61 specified in the previous step S22 as the inspection standard 122 (step S23), and ends the flowchart shown in FIG. 6.

[0043] As shown in FIG. 7, the wire bonding apparatus 10A acquires information on the diameter of the compressed ball stored in the storage unit 120A as the process information 121 (step S30). Next, the wire bonding apparatus 10A acquires the pressing amount of the ball portion 61 stored in the storage unit 120A as the process information 121 (step S31). Next, the wire bonding apparatus 10A judges whether or not the pressing amount of the ball portion 61 acquired in the previous step S31 is within a numerical range set as the inspection standard 122 (step S32). When the wire bonding apparatus 10A judges that the pressing amount of the ball portion 61 is not within the numerical range set as the inspection standard 122 (step S32=NO), it notifies the inspection result of the quality of the wire bonding (step S33) and ends the flowchart shown in FIG. 7. On the other hand, if the wire bonding apparatus 10A determines that the pressing amount of the ball portion 61 is within the numerical range set as the inspection standard 122 (step S32 = YES), it terminates the flowchart shown in Figure 7 without reporting the inspection results of the wire bonding quality.

[0044] <Third embodiment> The notification unit 113 of the wire bonding apparatus 10 according to the third embodiment notifies the inspection result of the wire bonding quality by the inspection unit 112 in association with information relating to the position of the wire bonding on the terminal of the semiconductor chip 50 or the terminal of the substrate 51.

[0045] The wire bonding apparatus 10 according to the third embodiment performs wire bonding on the substrate 51 while intermittently transporting the substrate 51. In the example shown in Fig. 8, when the transport direction of the substrate 51 is defined as a first direction and a direction intersecting the transport direction of the substrate 51 is defined as a second direction, a group of substrates 51 arranged in the first direction and the second direction becomes a target area for wire bonding for each transport.

[0046] 9 is a diagram showing an example of the display of the inspection result of the wire bonding quality in the wire bonding apparatus 10 according to the third embodiment. In the example shown in the figure, the notification unit 113 of the wire bonding apparatus 10 displays the inspection result of the quality of the wire bonding performed on each semiconductor chip 50 on the display unit 200 in association with the position of the board 51 on which each semiconductor chip 50 is mounted. In this example, the notification unit 113 of the wire bonding apparatus 10 displays the inspection result of the quality of the wire bonding performed on each semiconductor chip 50 on the display unit 200 in order of the wire bonding quality as "standard", "warning", and "abnormal".

[0047] <Fourth embodiment> As shown in FIG. 10, an inspection apparatus 300 according to the fourth embodiment includes, for example, a control unit 310 and a storage unit 320.

[0048] The control unit 310 is realized by, for example, a hardware processor such as a CPU (Central Processing Unit) executing a program (software). In addition, some or all of these components may be realized by hardware (including circuitry) such as an LSI (Large Scale Integration), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), or a GPU (Graphics Processing Unit), or may be realized by a combination of software and hardware. The program may be stored in advance in a storage device such as an HDD or flash memory of the inspection device 300, or may be stored in a removable storage medium such as a DVD or CD-ROM, and installed in the HDD or flash memory of the inspection device 300 by mounting the storage medium in a drive device.

[0049] The storage unit 320 is a non-volatile storage medium, and is configured, for example, by an HDD (Hard Disk Drive). The storage unit 320 stores various parameter values, functions, lookup tables, etc. used for control and calculation, in addition to programs for executing control and processing of the inspection device 300. The process information 321 and the inspection standard 322 are examples of parameter values ​​used for control and calculation.

[0050] The control unit 310 includes, for example, an acquisition unit 311, an inspection unit 312, and a notification unit 313.

[0051] The acquiring unit 311 acquires information about the diameter of a compressed ball formed by bonding a wire 60 to a terminal of a semiconductor chip 50 or a terminal of a substrate 51 by wire bonding from the wire bonding apparatus 10. For example, when acquiring information about the compressed ball diameter from the wire bonding apparatus 10 during execution of wire bonding, the acquiring unit 311 stores the acquired information in the storage unit 320 as process information 321.

[0052] The inspection unit 312 inspects the quality of the wire bonding based on the information on the bonded ball diameter read from the storage unit 320. For example, the inspection unit 312 inspects the quality of the wire bonding based on the information on the bonded ball diameter acquired by the acquisition unit 311, with reference to the inspection standard 322 stored in the storage unit 320. For example, the inspection unit 312 compares the information on the bonded ball diameter acquired by the acquisition unit 311 with a threshold value stored in the storage unit 320 as the inspection standard 322 to inspect the quality of the wire bonding.

[0053] The notification unit 313 notifies the inspection result of the wire bonding quality by the inspection unit 312 when the inspection result of the wire bonding quality by the inspection unit 312 does not satisfy a predetermined condition. For example, when the inspection unit 312 outputs an inspection result indicating that the wire bonding quality is poor, the notification unit 313 notifies the inspection result of the wire bonding quality by the inspection unit 312.

[0054] Each of the above-described embodiments may be implemented in the following manner.

[0055] In the second embodiment, the inspection criterion 122 does not necessarily have to be a numerical range including the pressing amount of the ball portion 61 specified based on the standard data of the compressed ball diameter set in advance, and may be, for example, a numerical range including the pressing amount of the ball portion 61 specified based on the statistical data of the compressed ball diameter acquired by the acquisition unit 111. Also, the inspection criterion 122 may be a numerical range higher than the pressing amount of the ball portion 61 specified as described above, or a numerical range lower than the pressing amount of the ball portion 61 specified as described above. Also, the inspection criterion 122 does not necessarily have to be a numerical range, and may be, for example, an upper limit value, a lower limit value, or a combination of an upper limit value and a lower limit value set based on the pressing amount of the ball portion 61 specified as described above.

[0056] In the above second embodiment, the correlation data 123 does not necessarily have to be data indicating the correlation between the pressing amount of the ball portion 61 and the diameter of the compressed ball. For example, if the inspection unit 112 inspects the quality of wire bonding based on the spark voltage, the correlation data 123 may be data indicating the correlation between the spark voltage and the diameter of the compressed ball.

[0057] In the above first to third embodiments, the functional block configurations included in the wire bonding apparatus 10, 10A may be configured as a wire bonding system distributed between the wire bonding apparatus 10, 10A and an external device.

[0058] The wire bonding apparatus according to each of the above embodiments has been described above by taking as an example a case where a terminal of a semiconductor chip 50 and a terminal of a substrate 51 are electrically connected by a wire 60. Alternatively, the wire bonding apparatus according to each of the above embodiments can be applied to a case where a semiconductor module is constructed by electrically connecting a terminal of a semiconductor chip 50 and a terminal of a lead frame by a wire 60. The wire bonding apparatus according to each of the above embodiments can also be applied to a case where a bump is formed on any electrode, such as a terminal of a semiconductor chip 50, by a wire 60. [Explanation of symbols]

[0059] 10, 10A...wire bonding apparatus, 11...stage, 12...XY table, 13...bonding head, 14...bonding arm, 15...capillary, 16...discharge electrode, 17...clamper, 50...semiconductor chip, 51...substrate, 60...wire, 61...ball portion, 110, 110A, 310...control portion, 111, 311...acquisition portion, 112, 312...inspection portion, 113, 313...alarm portion, 114...standard setting portion, 120, 120A, 320...memory portion, 121, 321...process information, 122...inspection standard, 123...correlation data, 200...display portion, 300...inspection apparatus, 322...inspection standard.

Claims

1. An acquisition unit that acquires information regarding a diameter of a crimped ball formed by wire bonding to an electronic component, the information regarding the crimped ball diameter including a pressing amount of a ball portion of the tip of the wire against the electronic component during wire bonding; A first storage unit that stores information regarding the compressed ball diameter acquired by the acquisition unit; An inspection unit that inspects the quality of wire bonding based on the information on the pressure-bonded ball diameter read from the first storage unit; A standard setting unit that sets an inspection standard for information regarding the compressed ball diameter; A second storage unit that stores correlation data indicating a correlation between the pressing amount of the ball portion and the diameter of the compressed ball; Equipped with The standard setting unit sets a threshold value for the pressing amount of the ball portion as the inspection standard based on the preset standard data of the compressed ball diameter, with reference to the correlation data read from the second storage unit, the inspection unit compares the amount of pressure of the ball portion acquired by the acquisition unit with a threshold value set by the standard setting unit to inspect quality of the wire bonding. Wire bonding system.

2. a notification unit that notifies a result of the wire bonding quality inspection by the inspection unit when the result of the wire bonding quality inspection by the inspection unit does not satisfy a predetermined condition; 2. The wire bonding system of claim 1.

3. The notification unit notifies the result of the inspection of the quality of the wire bonding by the inspection unit in association with information related to the position of the wire bonding in the electronic component.

3. The wire bonding system of claim 2.

4. When the amount of information on the compressed ball diameter stored in the first storage unit becomes equal to or greater than a predetermined amount, the standard setting unit sets an inspection standard for the information on the compressed ball diameter.

2. The wire bonding system of claim 1.

5. The standard setting unit refers to the correlation data read from the second storage unit based on the preset standard data of the compressed ball diameter, and specifies the pressing amount of the ball part corresponding to the standard data, and sets a numerical range including the specified pressing amount of the ball part as the inspection standard. the inspection unit inspects quality of the wire bonding based on whether or not the pressing amount of the ball portion acquired by the acquisition unit is within a numerical range set as the inspection standard.

2. The wire bonding system of claim 1.

6. An acquisition unit that acquires information regarding a diameter of a crimped ball formed by wire bonding to an electronic component, the information regarding the diameter of the crimped ball including an amount of pressure applied to a ball portion of a tip of a wire against the electronic component during wire bonding; A first storage unit that stores information regarding the compressed ball diameter acquired by the acquisition unit; An inspection unit that inspects the quality of wire bonding based on the information on the pressure-bonded ball diameter read from the first storage unit; A standard setting unit that sets an inspection standard for information regarding the compressed ball diameter; A second storage unit that stores correlation data indicating a correlation between the pressing amount of the ball portion and the diameter of the compressed ball; Equipped with The standard setting unit sets a threshold value for the pressing amount of the ball portion as the inspection standard based on the preset standard data of the compressed ball diameter, with reference to the correlation data read from the second storage unit, The inspection unit inspects the quality of the wire bonding by referring to the inspection standard set by the standard setting unit based on the information on the pressure-bonded ball diameter acquired by the acquisition unit. Inspection equipment.

7. A process for acquiring information regarding a diameter of a crimped ball formed by wire bonding to an electronic component, the information regarding the diameter of the crimped ball including an amount of pressure applied to a ball portion of a tip of a wire against the electronic component during wire bonding; Storing the acquired information regarding the compressed ball diameter in a first storage unit; An inspection process for inspecting the quality of wire bonding based on the information on the diameter of the compressed ball read from the first storage unit; A standard setting process for setting an inspection standard for information regarding the compressed ball diameter; Storing correlation data indicating a correlation between the pressing amount of the ball portion and the diameter of the compressed ball in a second storage unit; Equipped with In the standard setting step, a threshold value for the pressing amount of the ball portion is set as the inspection standard based on the preset standard data of the compressed ball diameter, with reference to the correlation data read from the second storage unit. In the inspection step, the quality of the wire bonding is inspected based on the information on the pressure-bonded ball diameter acquired in the acquisition step, with reference to the inspection standard set in the standard setting step. Wire bonding method.

8. On one or more computers, A process for acquiring information regarding a diameter of a crimped ball formed by wire bonding to an electronic component, the information regarding the diameter of the crimped ball including a pressing amount of a ball portion of the tip of the wire against the electronic component during wire bonding; A process of storing the acquired information regarding the compressed ball diameter in a first storage unit; An inspection process for inspecting the quality of wire bonding based on the information on the pressure-bonded ball diameter read from the first storage unit; A standard setting process for setting an inspection standard for information regarding the compressed ball diameter; A process of storing correlation data indicating a correlation between the pressing amount of the ball portion and the compressed ball diameter in a second storage unit; Run the command, In the standard setting process, a threshold value for the pressing amount of the ball portion is set as the inspection standard by referring to the correlation data read from the second storage unit based on the standard data of the compressed ball diameter set in advance. In the inspection process, a process of inspecting the quality of the wire bonding by referring to the inspection standard set in the standard setting process based on the information on the pressure-bonded ball diameter acquired in the acquisition process; Execute the program.

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