Processing equipment

Abstract

To provide a processing device capable of easily preparing for detecting a line to be divided.SOLUTION: Control means 14 of a processing device includes: an X-axis direction positioning portion 22 that detects a straight line area corresponding to a first scheduled dividing line from a crossing area of the first scheduled dividing line and a second scheduled dividing line, obtains an angle with the X-axis direction, and positions the straight line area corresponding to the first scheduled dividing line in the X-axis direction; a first scheduled dividing line interval provisional setting unit 24 that detects a straight line area corresponding to the next first scheduled dividing line, and obtains and temporarily sets the interval of the first scheduled dividing line; a second scheduled dividing line interval provisional setting unit 26 that detects two adjacent linear regions corresponding to the second scheduled dividing line, and obtains and provisionally sets the interval of the second scheduled dividing line; a device image creation unit 28 that one device area surrounded by a pair of first scheduled dividing lines and a pair of second scheduled dividing lines by imaging means, and creates and stores a device image; and a target pattern extraction unit 30 that extracts and stores a target pattern from the device image.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a processing apparatus that extracts a target pattern for detecting planned dividing lines of a wafer. [Background technology]

[0002] Wafers, on whose surface multiple devices such as ICs and LSIs are formed, are divided along planned dividing lines. These are then divided into individual device chips using a dicing machine and laser processing machine. Each of these device chips is then used in electrical equipment such as mobile phones and personal computers.

[0003] The dicing apparatus includes a rotatable chuck table for holding a wafer, cutting means equipped with a cutting blade for cutting the wafer held on the chuck table, X-axis feed means for relatively feeding the chuck table and the cutting means in the X-axis direction, Y-axis feed means for relatively indexing and feeding the chuck table and the cutting means in the Y-axis direction, operating means for operating the X-axis feed means and Y-axis feed means, imaging means for imaging the wafer held on the chuck table and detecting the area to be cut, display means for displaying the area imaged by the imaging means, and control means.

[0004] In a dicing device, the division lines to be cut are detected by an imaging means, and a cutting blade is positioned on the division lines to cut the wafer, thereby dividing the wafer into individual device chips with high precision (see, for example, Patent Document 1).

[0005] Similarly, a laser processing device can detect the planned dividing lines to be laser processed using an imaging means, position a concentrator that focuses the laser beam on the planned dividing line, and irradiate the laser beam onto the wafer, thereby dividing the wafer into individual device chips with high precision (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 5-315444 [Patent Document 2] JP 2004-322168 A Summary of the Invention [Problem to be solved by the invention]

[0007] However, in preparation for detecting the dividing lines by the imaging means, an operator needs to extract a characteristic pattern from the device formed on the surface of the wafer and register the extracted characteristic pattern as a target pattern in the control means of the processing device. In addition, the positional relationship between the target pattern and the dividing lines and the interval between adjacent dividing lines must be stored in the control means of the processing device. Such preparation must be performed by the operator, which is troublesome.

[0008] SUMMARY OF THE PRESENT EMBODIMENT In view of the above, an object of the present invention is to provide a processing device that can easily perform preparations for detecting the planned division lines. [Means for solving the problem]

[0009] According to the present invention, there is provided the following processing device that solves the above problems. A processing apparatus for extracting a target pattern for detecting a first dividing line in a wafer having a surface on which a plurality of devices are partitioned by a first dividing line extending in a first direction and a second dividing line extending in a second direction perpendicular to the first direction, the processing apparatus comprising: the wafer processing apparatus comprises a rotatable chuck table which holds a wafer, a processing means which processes the wafer held on the chuck table, an X-axis feed means which feeds the chuck table and the processing means relatively in the X-axis direction for processing, a Y-axis feed means which indexes and feeds the chuck table and the processing means relatively in the Y-axis direction, an operation means for operating the X-axis feed means and the Y-axis feed means, an imaging means which images the wafer held on the chuck table and detects an area to be processed, a display means which displays the area imaged by the imaging means, and a control means; The control means an X-axis direction positioning unit that detects a straight line region corresponding to the first planned dividing line from an intersection region between the first planned dividing line and the second planned dividing line imaged by the imaging means on the wafer held on the chuck table, determines an angle with the X-axis direction, and rotates the chuck table to position the straight line region corresponding to the first planned dividing line in the X-axis direction; a first division line interval temporary setting unit that operates the Y-axis feed means to detect a straight line area corresponding to the next first division line, and obtains and temporarily sets an interval between the first division lines; a second division line interval provisional setting unit that operates the X-axis feed means to detect two adjacent straight line regions corresponding to the second division line, and obtains and provisionally sets an interval between the second division lines; a device image creation unit that creates and stores a device image by capturing an image of one device area surrounded by a pair of adjacent first division lines and a pair of adjacent second division lines using the imaging means; and a target pattern extraction unit that extracts and stores a characteristic target pattern from the device image.

[0010] Preferably, the target pattern extraction unit has a first magnification target pattern extraction unit that extracts and stores a characteristic target pattern at a first magnification of the imaging means, and a second magnification target pattern extraction unit that extracts and stores a characteristic target pattern at a second magnification, which is a magnification of the imaging means higher than the first magnification.

[0011] The control means preferably includes a confirmation unit that images the wafer with the imaging means, detects a pattern identical to the target pattern in each region of any two devices spaced apart in the X-axis direction, and confirms the suitability of the pattern by positioning a line connecting the detected patterns so as to be parallel to the X-axis direction, or detects a pattern identical to the target pattern in each region of any two devices spaced apart in the Y-axis direction, and confirms the suitability of the pattern by positioning a line connecting the detected patterns so as to be parallel to the Y-axis direction.

[0012] The control means conveniently includes a first planned division line spacing setting unit that images the wafer with the imaging means, detects a pattern identical to the target pattern in each area of ​​any two devices adjacent in the Y-axis direction, calculates the spacing in the Y-axis direction between the detected patterns, and sets the spacing of the first planned division lines, and a second planned division line spacing setting unit that images the wafer with the imaging means, detects a pattern identical to the target pattern in each area of ​​any two devices adjacent in the X-axis direction, and calculates the spacing in the X-axis direction between the detected patterns to set the spacing of the second planned division lines. Effect of the Invention

[0013] The processing apparatus of the present invention performs a process ranging from detecting a straight line area corresponding to the first planned dividing line from the intersection area between the first and second planned dividing lines imaged by the imaging means on the wafer held on the chuck table, determining the angle with the X-axis direction, rotating the chuck table to position the straight line area corresponding to the first planned dividing line in the X-axis direction, to extracting and storing a characteristic target pattern from the device image, so that the operator can easily make preparations for detecting the planned dividing lines by operating the operating means to image the intersection area between the first and second planned dividing lines on the wafer held on the chuck table by the imaging means. [Brief description of the drawings]

[0014] [Figure 1] 1 is a perspective view of a processing device constructed in accordance with the present invention; [Diagram 2] 2 is a perspective view showing a state in which a wafer is imaged by the imaging means shown in FIG. 1; [Diagram 3] FIG. 2 is a block diagram showing a configuration of a control unit shown in FIG. [Figure 4] FIG. 1A is a schematic diagram showing an image of an intersection area between a first planned dividing line and a second planned dividing line of a wafer when the angle between the first planned dividing line and the X-axis direction is θ; FIG. 1B is a schematic diagram showing an image in which the chuck table is rotated by an angle θ from the state shown in FIG. [Diagram 5] FIG. 11 is a schematic diagram showing a state in which the interval of the first planned division lines is provisionally set. [Figure 6] FIG. 11 is a schematic diagram showing a state in which the interval of the second planned division lines is provisionally set. [Figure 7] FIG. [Figure 8] 1A is a schematic diagram of an image including a target pattern extracted by a first magnification target pattern extraction unit, and FIG. 1B is a schematic diagram of an image including a target pattern extracted by a second magnification target pattern extraction unit. [Figure 9] (a) Schematic diagram showing the state in which the lines connecting the detected patterns are positioned so that they are parallel to the X-axis direction to confirm the suitability of the patterns. (b) Schematic diagram showing the state in which the lines connecting the detected patterns are positioned so that they are parallel to the Y-axis direction to confirm the suitability of the patterns. [Figure 10] FIG. 1A is a schematic diagram showing a state in which the distance between the detected patterns in the X-axis direction is calculated to set the distance between the second planned division lines; FIG. 1B is a schematic diagram showing a state in which the distance between the detected patterns in the Y-axis direction is calculated to set the distance between the first planned division lines. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a processing apparatus constructed according to the present invention will be described with reference to the drawings.

[0016] The processing apparatus, generally designated by the reference symbol 2 in FIG. 1, includes a rotatable chuck table 4 which holds a wafer W, a processing means 6 which processes the wafer W held on the chuck table 4, an X-axis feed means (not shown) which feeds the chuck table 4 and the processing means 6 relatively in the X-axis direction for processing, a Y-axis feed means (not shown) which indexes and feeds the chuck table 4 and the processing means 6 relatively in the Y-axis direction, an operation means 8 for operating the X-axis feed means and the Y-axis feed means, an imaging means 10 which images the wafer W held on the chuck table 4 and detects the area to be processed, a display means 12 which displays the area imaged by the imaging means 10, and a control means 14 which controls the operation of the processing apparatus 2.

[0017] The X-axis direction is the direction indicated by the arrow X in Fig. 1, and the Y-axis direction is the direction indicated by the arrow Y in Fig. 1, which is a direction perpendicular to the X-axis direction. The XY plane defined by the X-axis and Y-axis directions is substantially horizontal.

[0018] The wafer W to be processed by the processing device 2 is disk-shaped and may be made of an appropriate semiconductor material such as silicon. As shown in Fig. 2, the wafer W is supported on an annular frame F via a dicing tape T. That is, the back surface Wb of the wafer W is attached to the dicing tape T, and the peripheral edge of the dicing tape T is fixed to the annular frame F.

[0019] A plurality of dividing lines, which are linear regions, are provided on the front surface Wa of the wafer W, and the plurality of dividing lines are combined in a lattice pattern as a whole. The lattice-like dividing lines include a plurality of first dividing lines L1 extending in a first direction and a second dividing line L2 extending in a second direction perpendicular to the first direction. The first and second dividing lines L1 and L2 divide the front surface Wa of the wafer W into a plurality of rectangular regions, and devices D such as ICs and LSIs are formed in each of the rectangular regions.

[0020] 1, a porous circular suction chuck 16 connected to a suction means (not shown) is disposed on the upper end of the chuck table 4. The suction means generates a suction force on the suction chuck 16, and the chuck table 4 suction-holds the wafer W placed on the upper surface. In addition, a plurality of clamps 18 for fixing an annular frame F are disposed at intervals in the circumferential direction on the periphery of the chuck table 4. The chuck table 4 is fed for processing in the X-axis direction by the X-axis feed means, and is rotated by a chuck table motor (not shown) with the vertical axis as its axis.

[0021] The processing device 2 of the illustrated embodiment is a dicing device as an example of the processing device of the present invention, and the processing means 6 is configured as cutting means that performs cutting processing on the wafer W. The processing means (cutting means) 6 includes an annular cutting blade 20 that cuts the wafer W held by suction on the chuck table 4. The cutting blade 20 is disposed along the X-axis direction and is configured to be rotatable about an axis in the Y-axis direction.

[0022] The X-axis feed means has a ball screw connected to the chuck table 4 and extending in the X-axis direction, and a motor that rotates the ball screw. In the X-axis feed means, the ball screw converts the rotational motion of the motor into linear motion and transmits it to the chuck table 4, and feeds the chuck table 4 in the X-axis direction relative to the processing means 6 for processing.

[0023] The Y-axis feed means includes a ball screw connected to the processing means 6 and extending in the Y-axis direction, and a motor that rotates the ball screw. The Y-axis feed means converts the rotational motion of the motor into linear motion by the ball screw and transmits it to the processing means 6, thereby indexing and feeding the processing means 6 in the Y-axis direction relative to the chuck table 4.

[0024] The operation means 8 has input devices such as a keyboard and a touch panel for inputting operating conditions of the X- and Y-axis feed means, etc. The operating conditions input from the operation means 8 are sent to the control means 14, and the operation of the X- and Y-axis feed means, etc. is controlled by the control means 14.

[0025] The imaging means 10 is disposed above the orbit of the chuck table 4. Moreover, the imaging means 10 is capable of changing the magnification when imaging the wafer W held on the chuck table 4.

[0026] 4, in addition to the image captured by the imaging means 10, an X-axis line Lx indicating the X-axis direction and a Y-axis line Ly indicating the Y-axis direction are displayed on the display means 12. The X-axis line Lx is displayed along the horizontal direction at the vertical center of the display means 12, and the Y-axis line Ly is displayed along the vertical direction at the horizontal center of the display means 12.

[0027] The control means 14, which is composed of a computer, includes a central processing unit (CPU) (not shown) that performs calculations according to a control program, a read-only memory (ROM) that stores the control program, etc., and a readable / writable random access memory (RAM) that stores the calculation results, etc.

[0028] 3, the control means 14 includes at least an X-axis direction positioning unit 22, a first planned division line interval provisional setting unit 24, a second planned division line interval provisional setting unit 26, a device image creation unit 28, and a target pattern extraction unit 30. The control means 14 in the illustrated embodiment further includes a confirmation unit 32, a first planned division line interval setting unit 34, and a second planned division line interval setting unit 36.

[0029] The X-axis direction positioning unit 22 detects a straight line area corresponding to the first planned dividing line L1 from an intersection area between the first planned dividing line L1 and the second planned dividing line L2 captured by the imaging means 10 of the wafer W held on the chuck table 4, calculates an angle between the detected straight line area and the X-axis direction, and rotates the chuck table 4 by the calculated angle. In this way, the X-axis direction positioning unit 22 positions the straight line area corresponding to the first planned dividing line L1 in the X-axis direction. The X-axis direction positioning unit 22 detects the straight line area by a known technique such as Hough transform.

[0030] The first planned dividing line spacing provisional setting unit 24 is adapted to operate the Y-axis feed means while imaging the wafer W with the imaging means 10, detect a straight line area corresponding to the next first planned dividing line L1, and obtain and provisionally set the spacing of the first planned dividing line L1.

[0031] The second planned division line interval provisional setting unit 26 operates the X-axis feed means while imaging the wafer W with the imaging means 10, detects two adjacent straight line regions corresponding to the second planned division line L2, and determines and provisionally sets the interval of the second planned division line L2. Note that, in the first and second planned division line interval provisional setting units 24, 26, similarly to the X-axis positioning unit 22, straight line regions are detected by a Hough transform or the like.

[0032] The device image creation unit 28 captures an image of an area of ​​one device D surrounded by a pair of adjacent first planned division lines L1 and a pair of adjacent second planned division lines L2 using the imaging means 10, and creates and stores a device image (see Figure 7).

[0033] The target pattern extraction unit 30 extracts and stores a characteristic target pattern from a device image. As shown in Fig. 3, the target pattern extraction unit 30 in the illustrated embodiment has a first magnification target pattern extraction unit 30a that extracts and stores a characteristic target pattern at a first magnification of the imaging means 10, and a second magnification target pattern extraction unit 30b that extracts and stores a characteristic target pattern at a second magnification of the imaging means 10 that is higher than the first magnification.

[0034] The confirmation unit 32 images the wafer W using the imaging means 10, detects a pattern identical to the target pattern in each area of ​​any two devices D spaced apart in the X-axis direction, and positions the line connecting the detected patterns so that it is parallel to the X-axis direction to confirm the suitability of the pattern.

[0035] Alternatively, the confirmation unit 32 may be configured to detect a pattern identical to the target pattern in each area of ​​any two devices D spaced apart in the Y-axis direction, and to position the line connecting the detected patterns so that it is parallel to the Y-axis direction, thereby confirming the suitability of the pattern.

[0036] The first planned division line spacing setting unit 34 images the wafer W using the imaging means 10, detects a pattern identical to the target pattern in each area of ​​any two devices D adjacent in the Y-axis direction, calculates the spacing between the detected patterns in the Y-axis direction, and sets the spacing of the first planned division line L1.

[0037] The second planned division line spacing setting unit 36 ​​images the wafer W using the imaging means 10, detects a pattern identical to the target pattern in each area of ​​any two devices D adjacent in the X-axis direction, calculates the spacing in the X-axis direction between the detected patterns, and sets the spacing of the second planned division line L2.

[0038] As shown in FIG. 1, the processing apparatus 2 further includes a cassette stage 40 that can be raised and lowered on which a cassette 38 containing a plurality of wafers W is placed, a loading / unloading means 44 that pulls out the unprocessed wafer W from the cassette 38 and transports it to the temporary placement table 42 and transports the processed wafer W positioned on the temporary placement table 42 into the cassette 38, a first transport means 46 that transports the unprocessed wafer W transported from the cassette 38 to the temporary placement table 42 to the chuck table 4, a cleaning means 48 that cleans the processed wafer W, and a second transport means 50 that transports the processed wafer W from the chuck table 4 to the cleaning means 48.

[0039] Next, an operation of extracting a target pattern for detecting the division lines (preparation for detecting the division lines during cutting) in the processing device 2 as described above will be described.

[0040] First, the operator holds the wafer W by suction on the chuck table 4 with the surface Wa, on which the first and second planned dividing lines L1, L2 are formed, facing upward, and fixes the annular frame F with the multiple clamps 18. Next, the operator operates the operating means 8 to actuate the X-axis feed means, and moves the wafer W held on the chuck table 4 below the imaging means 10. Then, the operator operates the operating means 8 to image the intersection area between the first planned dividing line L1 and the second planned dividing line L2 with the imaging means 10.

[0041] Then, the image captured by the imaging means 10 is sent from the imaging means 10 to the control means 14. Next, the X-axis direction positioning unit 22 of the control means 14 detects a straight line region corresponding to the first planned division line L1 in the image sent from the imaging means 10. Furthermore, the X-axis direction positioning unit 22 determines the angle θ between the detected first planned division line L1 and the X-axis direction (see FIG. 4(a)). Then, if the determined angle θ is not 0°, the X-axis direction positioning unit 22 rotates the chuck table 4 by the angle θ to position the straight line region corresponding to the first planned division line L1 in the X-axis direction, as shown in FIG. 4(b).

[0042] When the straight line region corresponding to the first planned division line L1 is positioned in the X-axis direction, the control by the first planned division line interval temporary setting unit 24 of the control means 14 is executed.

[0043] Specifically, the first planned dividing line interval tentative setting unit 24 activates the Y-axis feed means and the imaging means 10 to image the wafer W held on the chuck table 4 while moving it in the Y-axis direction. As a result, the first planned dividing line interval tentative setting unit 24 detects a straight line region corresponding to the next first planned dividing line L1 adjacent to the first planned dividing line L1 previously detected by the X-axis direction positioning unit 22, as shown in FIG.

[0044] 5, the first planned division line L1 detected first by the X-axis direction positioning unit 22 is shown by a two-dot chain line (imaginary line) since it is outside the display area of ​​the display means 12. On the other hand, the first planned division line L1 detected next by the first planned division line interval temporary setting unit 24 is shown by a solid line since it is within the display area of ​​the display means 12.

[0045] Next, the first planned division line spacing provisional setting unit 24 determines the spacing (e.g., 5 mm) of the first planned division line L1 from the previously detected first planned division line L1 and the next detected first planned division line L1, and provisionally sets the determined spacing as the spacing of the first planned division line L1.

[0046] When the interval of the first planned division line L1 is provisionally set, control is executed by the second planned division line interval provisional setting unit 26. The second planned division line interval provisional setting unit 26 activates the X-axis feed means and the imaging means 10 to capture an image while moving the wafer W in the X-axis direction. Then, as shown in Fig. 6, the second planned division line interval provisional setting unit 26 detects two adjacent straight line regions corresponding to the second planned division line L2, obtains the interval (for example, 5 mm) of the second planned division line L2, and provisionally sets the obtained interval as the interval of the second planned division line L2.

[0047] After the interval of the second planned dividing lines L2 is provisionally set, control is performed by the device image creation unit 28. The device image creation unit 28 operates the imaging means 10 together with the XY-axis feed means to adjust the positional relationship between the wafer W and the imaging means 10, and captures an image of an area including one device D surrounded by a pair of adjacent first planned dividing lines L1 and a pair of adjacent second planned dividing lines L2 by the imaging means 10 (see FIG. 7). Then, based on the image captured by the imaging means 10, the device image creation unit 28 creates and stores an image of the device D (device image).

[0048] When the device image is created, the target pattern extraction unit 30 extracts and stores a characteristic target pattern from the device image. That is, while moving the area surrounded by the dashed line in FIG. 7 by one pixel, an image of the size of the area surrounded by the dashed line in FIG. 7 is acquired over the entire device image, and all acquired images are compared, and the image with the lowest mutual similarity is stored as the target pattern. In the illustrated embodiment, the first magnification target pattern extraction unit 30a extracts and stores a characteristic first target pattern P1 from the device image at the first magnification (low magnification) of the imaging means 10. The first target pattern P1 may include a plurality of patterns in the device D, for example, as shown in FIG. 7 and FIG. 8(a).

[0049] In addition, the second magnification target pattern extraction unit 30b extracts and stores a characteristic second target pattern P2 from the device image at a second magnification (high magnification) that is higher than the first magnification of the imaging means 10. The second target pattern P2 may be composed of a single pattern on the device D, as shown in Fig. 7 and Fig. 8(b).

[0050] In this manner, the processing device 2 in the illustrated embodiment extracts the target pattern, and the operator can easily prepare for detecting the planned division lines during cutting processing by operating the operating means 8 and capturing an image of the intersection area between the first planned division line L1 and the second planned division line L2 with the imaging means 10.

[0051] In the processing apparatus 2 of the illustrated embodiment, as described above, the first planned dividing line L1 can be detected and positioned in the X-axis direction by the X-axis direction positioning unit 22, but a small deviation may remain between the first planned dividing line L1 and the X-axis direction only by adjustment by the X-axis direction positioning unit 22. Therefore, by aligning the wafer W using the target pattern, the first planned dividing line L1 can be precisely aligned in the X-axis direction.

[0052] When aligning the wafer W using a target pattern, first, a first target pattern P1 at a low magnification is extracted by pattern matching to roughly align the wafer W, and then a second target pattern P2 at a high magnification is extracted by pattern matching to precisely align the wafer W, thereby enabling highly accurate alignment to be achieved in a short period of time.

[0053] After the first and second target patterns P1 and P2 are extracted as described above, it is preferable to have the confirmation unit 32 confirm the suitability of the extracted patterns. Specifically, the confirmation unit 32 detects a pattern identical to the target pattern (the second target pattern P2 in the example shown in FIG. 9) by pattern matching in each area of ​​any two devices D spaced apart in the X-axis direction from the image of the wafer W captured by the imaging means 10. In this case, the areas of the two devices D may be two adjacent areas, but it is preferable that they are two areas as far apart as possible to improve accuracy. In FIG. 9, the image displayed on the display means 12 is broken by a break line, and the second target patterns P2 are shown in a state where they are close to each other.

[0054] Then, as shown in Figure 9(a), when the confirmation unit 32 positions the line Lpx connecting the extracted second target patterns P2 so that it is parallel to the X-axis direction (X-axis line Lx), if the first planned division line L1 is parallel to the X-axis direction, then the confirmation unit 32 determines that the extracted second target pattern P2 is appropriate.

[0055] Alternatively, the confirmation unit 32 may be configured to A pattern identical to the second target pattern P2 may be detected by pattern matching in each region of any two devices D spaced apart in the Y-axis direction from the image of the wafer W. In this case, as shown in Fig. 9(b), when the line Lpy connecting the detected second target patterns P2 is positioned so as to be parallel to the Y-axis direction (Y-axis line Ly), if the second planned division line L2 is parallel to the Y-axis direction, the confirmation unit 32 determines that the extracted second target pattern P2 is appropriate.

[0056] In this manner, in the processing device 2 of the illustrated embodiment, the suitability of the extracted target pattern can be confirmed, and therefore, it is possible to prevent erroneous extraction of an inappropriate pattern.

[0057] The checking unit 32 can check the suitability of the first target pattern P1 in the same manner as above.

[0058] Furthermore, in the processing device 2, it is preferable that control is executed by the first and second division line interval setting units 34 and 36 after the first and second target patterns P1 and P2 are extracted.

[0059] More specifically, the first planned division line interval setting unit 34 detects a pattern identical to the second target pattern P2 in each region of any two devices D adjacent in the Y-axis direction from the image of the wafer W captured by the imaging means 10. Next, as shown in Fig. 10(a), the first planned division line interval setting unit 34 calculates the interval (e.g., 5.11 mm) in the Y-axis direction between the detected patterns, and sets the calculated interval as the interval of the first planned division line L1.

[0060] Further, the second division line interval setting unit 36 ​​detects a pattern identical to the second target pattern P2 in each region of any two devices D adjacent in the X-axis direction from the image of the wafer W captured by the imaging means 10. Then, as shown in Fig. 10(b), the second division line interval setting unit 36 ​​calculates the interval in the X-axis direction between the detected patterns (for example, 5.15 mm) and sets it as the interval of the second division line L2. Note that the first and second division line interval setting units 34 and 36 may use the first target pattern P1 to determine the interval between the first and second division lines L1 and L2.

[0061] As described above, the processing device 2 performs processes from positioning the straight line area corresponding to the first planned dividing line L1 in the X-axis direction to extracting at least the target pattern based on an image of the intersection area between the first planned dividing line L1 and the second planned dividing line L2. Therefore, by operating the operating means 8, the operator can easily make preparations for detecting the planned dividing lines by imaging the intersection area between the first planned dividing line L1 and the second planned dividing line L2 of the wafer W held on the chuck table 4 with the imaging means 10.

[0062] In the illustrated embodiment, an example has been described in which the processing device 2 is configured as a dicing device that performs cutting processing on the wafer W. However, the processing device of the present invention need only extract a target pattern for detecting the planned division lines, and can also be configured, for example, as a laser processing device that performs laser processing on the wafer W. [Explanation of symbols]

[0063] 2: Processing equipment 4: Chuck table 6: Processing means 8:Operation means 10: Imaging means 12:Display means 14: Control means 22: X-axis positioning part 24: First division line interval provisional setting section 26: Second division line interval provisional setting section 28: Device image creation section 30: Target pattern extraction unit 30a: First magnification target pattern extraction unit 30b: second magnification target pattern extraction unit 32: Verification department 34: First division planned line interval setting unit 36: Second division line interval setting section W: Wafer L1: First division line L2: Second division line D: Device P1: First target pattern P2: Second target pattern

Claims

1. A processing apparatus for extracting a target pattern for detecting a first dividing line in a wafer having a surface on which a plurality of devices are partitioned by a first dividing line extending in a first direction and a second dividing line extending in a second direction perpendicular to the first direction, the processing apparatus comprising: the wafer processing apparatus comprises a rotatable chuck table which holds a wafer, a processing means which processes the wafer held on the chuck table, an X-axis feed means which feeds the chuck table and the processing means relatively in the X-axis direction for processing, a Y-axis feed means which indexes and feeds the chuck table and the processing means relatively in the Y-axis direction, an operation means for operating the X-axis feed means and the Y-axis feed means, an imaging means which images the wafer held on the chuck table and detects an area to be processed, a display means which displays the area imaged by the imaging means, and a control means, The control means an X-axis direction positioning unit that detects a straight line region corresponding to the first planned dividing line from an intersection region between the first planned dividing line and the second planned dividing line imaged by the imaging means on the wafer held on the chuck table, determines an angle with the X-axis direction, and rotates the chuck table to position the straight line region corresponding to the first planned dividing line in the X-axis direction; a first division line interval temporary setting unit that operates the Y-axis feed means to detect a straight line area corresponding to the next first division line, and obtains and temporarily sets an interval between the first division lines; a second division line interval provisional setting unit that operates the X-axis feed means to detect two adjacent straight line regions corresponding to the second division line, and obtains and provisionally sets an interval between the second division lines; a device image creation unit that creates and stores a device image by capturing an image of one device area surrounded by a pair of adjacent first division lines and a pair of adjacent second division lines with the imaging means; and a target pattern extraction unit that extracts and stores a characteristic target pattern from the device image.

2. 2. The processing apparatus according to claim 1, wherein the target pattern extraction unit has a first magnification target pattern extraction unit that extracts and stores a characteristic target pattern at a first magnification of the imaging means, and a second magnification target pattern extraction unit that extracts and stores a characteristic target pattern at a second magnification of the imaging means that is higher than the first magnification.

3. 3. The processing apparatus according to claim 1 or 2, wherein the control means includes a confirmation unit that images the wafer with the imaging means, detects a pattern identical to the target pattern in each region of any two devices spaced apart in the X-axis direction, and confirms suitability of the pattern by positioning a line connecting the detected patterns so as to be parallel to the X-axis direction, or detects a pattern identical to the target pattern in each region of any two devices spaced apart in the Y-axis direction, and confirms suitability of the pattern by positioning a line connecting the detected patterns so as to be parallel to the Y-axis direction.

4. 3. The processing apparatus according to claim 1 or 2, wherein the control means includes a first planned division line spacing setting unit that images the wafer with the imaging means, detects a pattern identical to the target pattern in each area of ​​any two devices adjacent in the Y-axis direction, calculates the spacing in the Y-axis direction between the detected patterns, and sets the spacing of the first planned division line, and a second planned division line spacing setting unit that images the wafer with the imaging means, detects a pattern identical to the target pattern in each area of ​​any two devices adjacent in the X-axis direction, and calculates the spacing in the X-axis direction between the detected patterns to set the spacing of the second planned division line.

Images