TRANSFER CARRIER, MICRO DEVICE TRANSFER ASSEMBLY, AND TRANSFER METHOD

Abstract

To provide a novel transfer carrier that facilitates transfer of microdevices and improves transfer accuracy.SOLUTION: A transfer carrier 100 for transferring a plurality of micro devices includes a substrate 10, a plurality of response units 22 arranged on one side of the substrate and spaced apart from one another, and a response layer 20 used to correspond one-to-one with the plurality of micro devices, and each of the plurality of response units includes at least two first response members 221 arranged at a distance from one another.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present application relates to the field of display technology, and in particular to a transfer carrier, a micro device transfer assembly, and a micro device transfer method. [Background technology]

[0002] Mass transfer of Micro LED (Micro Light Emitting Diode) chips is a key step in the manufacturing process of Micro LED display screens, among which laser-assisted transfer technology is one of the very promising mass transfer solutions. However, in recent years, the size of micro devices such as Micro LED chips is becoming smaller and smaller, and the distance between chips is also becoming smaller and smaller, so that when transferring chips of such small size or small distance, the conventional laser-assisted transfer technology begins to encounter problems such as the chips being difficult to remove from the transfer carrier, the transfer accuracy being poor due to the influence of adjacent chips, and even erroneous transfer occurring during selective transfer. Summary of the Invention [Problem to be solved by the invention]

[0003] Therefore, it is necessary to provide a new transfer carrier that makes it easier to transfer micro devices and improves the accuracy of transferring micro devices. [Means for solving the problem]

[0004] Therefore, in order to overcome at least some of the shortcomings of the prior art, the embodiments of the present application provide a transfer carrier, a micro device transfer assembly, and a micro device transfer method, which have the characteristics of higher transfer accuracy and lower transfer difficulty.

[0005] In one aspect, a transfer carrier for transferring a plurality of micro devices provided in one embodiment of the present application includes a substrate and a plurality of responsive sections arranged on one side of the substrate and spaced apart from each other, the plurality of responsive sections including a responsive layer used to correspond one-to-one with the plurality of micro devices, wherein each of the plurality of responsive sections includes at least two first responsive members spaced apart from each other.

[0006] In one embodiment, the responsive layer further includes a plurality of second responsive members disposed in gaps between the plurality of responsive portions and spaced apart from each other of the plurality of responsive portions.

[0007] In one embodiment, each of the responsive portions has a first total area, and in each of the responsive portions, each of the at least two first responsive members has a bonding area, and the sum of the bonding areas of the at least two first responsive members is greater than or equal to 10% of the first total area.

[0008] In one embodiment, the at least two first response members of each of the response parts are distributed symmetrically about a centre of the response part.

[0009] In one embodiment, the at least two first response members of each of the response sections include an intermediate first response member and a plurality of peripheral first response members surrounding the intermediate first response member, the intermediate first response member having a first adhesive area and the peripheral first response members having a second adhesive area, the first adhesive area being greater than the second adhesive area.

[0010] In one embodiment, the at least two first response members of each of the response sections are arranged in a plurality of rows, the number of first response members in each row is multiple, and the multiple first response members in any two adjacent rows are staggered.

[0011] In one embodiment, the material of the responsive layer is one or a combination of at least two selected from triazapolymer, polyimide, or organic silica gel.

[0012] In one embodiment, the material of any one of the plurality of responsive parts is a rubber-based polymer, a polyester, a carbamate-based polymer, a polyether, a silicone-based polymer, an ethylene-vinyl acetate-based polymer, a vinyl chloride-based polymer, a cyanoacrylate-based polymer, a cellulose-based polymer, a phenolic resin, a polyolefin, a styrene-based polymer, polyvinyl acetate, polyvinyl alcohol, polyvinyl acetal, polyvinyl pyrrolidone, polyvinyl butyral, polybenzimidazole, a melamine resin, a urea resin, a resorcinol-based polymer, a polyvinyl ether-based adhesive, a hydroxyphenyltriazine-based ultraviolet absorber, a benzophenone-based ultraviolet absorber, a benzotriazole-based ultraviolet absorber, a benzoate-based ultraviolet absorber, a benzoxazinone-based ultraviolet absorber, or a phenyl salicylate. The ultraviolet absorbing agent may be one or a combination of at least two of the following: a cyanoacrylate ultraviolet absorbing agent, a nickel complex salt ultraviolet absorbing agent, a hydroquinone ultraviolet absorbing agent, a salicylic acid ultraviolet absorbing agent, a malonic acid ester ultraviolet absorbing agent, an oxalic acid ultraviolet absorbing agent, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholino-phenyl)butan-1-one, ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(0-acetyloxime), 1,2-octanedione, 1-[4-(phenylthio)phenyl]-, 2-(O-benzoyloxime), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone, or 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one.

[0013] In one embodiment of the present application, a micro device transfer assembly is provided, comprising: a transfer carrier including a substrate and a responsive layer disposed on one side of the substrate, the responsive layer including a plurality of responsive members disposed at intervals from each other; and a plurality of microdevices attached in spaced relation to one another on a side of the responsive layer away from the substrate, each connected to at least two of the plurality of responsive members, wherein any one of the plurality of responsive members is connected to at most one of the microdevices.

[0014] In one embodiment, the plurality of responsive members includes a plurality of first responsive members connected between the plurality of micro devices and the substrate, and a plurality of second responsive members located in gaps between the plurality of micro devices.

[0015] In one embodiment, the at least two responsive members to which each of the microdevices is connected have a total area in contact with the microdevice that is at least 10% of the area of ​​the microdevice.

[0016] In one embodiment, each of the microdevices has a tip length along a first direction and a tip width along a second direction, the first direction and the second direction being perpendicular to each other, and each of the at least two responsive members to which each of the microdevices is connected has a responsive width that is less than half the tip length and less than the tip width.

[0017] In one embodiment, the at least two responsive members to which each of the microdevices is connected are distributed symmetrically about the center of the microdevice.

[0018] A micro device transfer method provided in one embodiment of the present application employs any one of the transfer carriers described above or any one of the micro device transfer assembly described above.

[0019] In one embodiment, the plurality of microdevices include target release microdevices, and the microdevice transfer method includes irradiating an area of ​​a response layer corresponding to the target release microdevice with a laser, and decomposing or deforming the material of the response layer in the irradiated area to release the target release microdevice. Effect of the Invention

[0020] The above-mentioned embodiment of the present application has at least one or more beneficial effects, such as bonding multiple micro devices by installing responsive members (or responsive sections) that are installed at intervals from each other, and ensuring that only one micro device is correspondingly connected to each of the responsive members (or responsive sections), and having at least two responsive members (or two first responsive members) at the connection positions corresponding to each of the micro devices in the responsive layer, making the materials of the responsive layer to which the multiple micro devices are correspondingly connected independent of each other in the transfer process, and when it is necessary to selectively transfer the micro devices to be transferred, even if they are small in size and the distance is small, the micro devices to be transferred can avoid affecting other micro devices adjacent thereto, and can improve the transfer accuracy. In addition, since the connection positions of each micro device are also at least two independent structures, the contact area with the micro device is small after the micro device is bonded, and the micro device can be released more easily during transfer. [Brief description of the drawings]

[0021] Hereinafter, the present application will be described in detail with reference to the drawings. [Figure 1] FIG. 1 is a schematic diagram of the principle of transfer error when selectively transferring using laser assisted transfer technology in the related art; [Diagram 2] 1 is a structural schematic diagram of a transfer carrier provided in one embodiment of the present application; [Diagram 3] 3 is a schematic diagram of a bottom structure of the transfer carrier shown in FIG. 2. [Figure 4]10 is a structural schematic diagram of a transfer carrier provided in another embodiment of the present application. FIG. [Diagram 5] 13 is a schematic diagram of a bottom structure of a transfer carrier provided in another embodiment of the present application; FIG. [Figure 6] 10 is a structural schematic diagram of a transfer carrier provided in another embodiment of the present application. FIG. [Figure 7] 10 is a structural schematic diagram of a transfer carrier provided in another embodiment of the present application. FIG. [Figure 8] 13 is a schematic diagram of a bottom structure of a transfer carrier provided in another embodiment of the present application; FIG. [Figure 9] 13 is a schematic diagram of a bottom structure of a transfer carrier provided in another embodiment of the present application; FIG. [Figure 10] 1 is a structural schematic diagram of a micro device transfer assembly provided in one embodiment of the present application. [Figure 11] 11 is a schematic diagram of the bottom structure of the micro device transfer assembly shown in FIG. 10. [Figure 12] FIG. 13 is a structural schematic diagram of a micro device transfer assembly provided in another embodiment of the present application. [Figure 13] 13 is a schematic diagram of the bottom structure of the micro device transfer assembly shown in FIG. 12. [Figure 14] 1 is a schematic flow chart of a micro device transfer method provided in one embodiment of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] In order to make the above objects, features and advantages of the present application clearer and more comprehensible, specific embodiments of the present application will be described in detail below in combination with the drawings.

[0023] In order to allow those skilled in the art to better understand the technical solutions of the present application, the technical solutions in the embodiments of the present application will be described below in a clear and complete manner in combination with the drawings in the embodiments of the present application, but obviously, the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without any creative efforts shall fall within the scope of protection of the present application.

[0024] In the specification, claims, and drawings of the present application, the terms "first", "second", etc. are used to distinguish between similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that the terms used in this manner may be interchanged with one another, where appropriate, such that the embodiments of the present application described herein may be performed in an order other than that shown or described herein. Furthermore, the terms "comprise" and "have" and any variations thereof are intended to cover a non-exclusive inclusion, e.g., a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units expressly recited, but may include other steps or units that are not expressly recited or that are inherent to such process, method, product, or apparatus.

[0025] Furthermore, the division of multiple embodiments in this application is merely for convenience of description and should not be construed as being particularly limiting, and features in various embodiments may be combined with each other and referenced to each other if not inconsistent.

[0026] In the related art, the laser-assisted transfer technology has the principle that one or more layers of responsive material for bonding micro devices such as Micro LED chips are attached to a transfer carrier, and when the chip needs to be released to a target substrate, the responsive material at the location where the chip to be transferred is located is irradiated with a laser, and after the responsive material is irradiated with a laser, the surface state changes, such as directly decomposing, forming bubbles, or expanding to generate cracks, thereby detaching the device attached thereon. Conventional micro devices are large in size and have a large gap between adjacent micro devices, and the transfer of micro devices can be effectively controlled by adopting a responsive layer material for the entire layer. However, in recent years, the size of micro devices such as Micro LEDs is becoming smaller and smaller, and the gap between adjacent devices is becoming smaller and smaller. When such a responsive material for the entire layer is adopted for transfer, problems such as the micro device being difficult to remove from the transfer carrier, or the adjacent responsive material and the micro device affect each other as shown in FIG. 1, which leads to poor transfer accuracy, and even the adjacent micro devices being erroneously transferred when selectively transferred, etc. begin to occur. Therefore, embodiments of the present application provide a novel transfer carrier to solve at least some of the above problems.

[0027] (First embodiment) As shown in Fig. 2, an embodiment of the present application provides a transfer carrier 100 for transferring a plurality of micro devices, the transfer carrier 100 including a substrate 10 and a responsive layer 20. As shown in Fig. 3, the responsive layer 20 includes a plurality of responsive units 22 disposed on one side of the substrate 10 and spaced apart from each other, the plurality of responsive units 22 corresponding one-to-one to the plurality of micro devices 200, each of the plurality of responsive units 22 including at least two first responsive members 211 spaced apart from each other.

[0028] Among them, the multiple micro devices are, for example, Micro LED chips or other devices with similar transfer requirements, but are not limited thereto in this embodiment. The substrate 10 may be, for example, a transparent plate material such as glass, sapphire, or quartz that can transmit a laser, and the responsive layer 20 may be formed by technical means such as photolithography or nanoimprint. The material of the responsive layer 20 may be a polymer material that is easily decomposed and generates gaseous volatile decomposition products after irradiation with a laser of ultraviolet or deep ultraviolet wavelength, such as photodegradable triazapolymer (TP), polyimide (PI), epoxy resin, polyurethane, fluororesin, acrylic polymer, imide polymer, amide polymer, etc. It may also be a material that deforms when irradiated with a laser, such as organic silica gel, and the material of the responsive layer 20 may be any one of the above multiple materials, or a combination of two or more materials.

[0029] Of course, the responsive layer 20 includes a plurality of responsive portions 22, and any one of the plurality of responsive portions 22 includes a material (called an adhesive material) that provides an adhesive force for adhering the Micro LED chip, and in some embodiments, the adhesive material may be selected from materials such as, for example, specifically, rubber-based polymers (e.g., natural rubber, neoprene rubber, styrene-butadiene rubber, nitrile rubber, etc.), polyesters, carbamate-based polymers (i.e., polyurethanes), polyethers, silicone-based polymers, ethylene-vinyl acetate-based polymers, vinyl chloride-based polymers, cyanoacrylate-based polymers, cellulose-based polymers, phenolic resins, polyolefins, styrene-based polymers, polyvinyl acetate, polyvinyl alcohol, polyvinyl acetal, polyvinyl pyrrolidone, polyvinyl butyral, polybenzimidazole, melamine resins, urea resins, resorcinol-based polymers, polyvinyl adhesives, etc., or may be one or a combination of at least two of these. The materials of the multiple responsive sections 22 may be the same or different, for example, the adhesive material of some of the responsive sections 22 may be a material that provides adhesive strength while being decomposed by laser irradiation, such as polyimide, or the adhesive material of some of the responsive sections 22 may be a combination of a material having strong adhesive properties and a material that can be decomposed by laser, such as a combination of natural rubber and triaza polymer.

[0030] In some embodiments, the responsive portion 22 may include, for example, a laser absorbing material therein in addition to the adhesive material so that the responsive portion 22 can better absorb the laser to release the microdevice by irradiation with the laser. Of the multiple responsive portions 22, some of the responsive portions 22 may include the laser absorbing material and some of the responsive portions 22 may not include the laser absorbing material. All of the responsive portions 22 may include the laser absorbing material. The laser absorbing materials included in the multiple responsive portions 22 may be the same or different.

[0031] The laser absorbing material may, for example, contain an ultraviolet absorber for better absorbing an ultraviolet laser. Specifically, the ultraviolet absorber may be, for example, a hydroxyphenyltriazine-based ultraviolet absorber, a benzophenone-based ultraviolet absorber, a benzotriazole-based ultraviolet absorber, a benzoate-based ultraviolet absorber, a benzoxazinone-based ultraviolet absorber, a phenyl salicylate-based ultraviolet absorber, a cyanoacrylate-based ultraviolet absorber, a nickel complex salt-based ultraviolet absorber, a hydroquinone-based ultraviolet absorber, a salicylic acid-based ultraviolet absorber, a malonic acid ester-based ultraviolet absorber, an oxalic acid-based ultraviolet absorber, or the like, or may be any one or a combination of at least two of these.

[0032] The laser absorbing material includes, for example, a photoinitiator, which may be, for example, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholino-phenyl)butan-1-one, ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(0-acetyloxime), 1,2-octanedione, 1-[4-(phenylthio)phenyl]-, 2-(O-benzoyloxime), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, or a combination of one or at least two of them.

[0033] For example, some of the responsive parts 22 include an acrylic polymer as an adhesive material and an oxalic acid-based ultraviolet absorber as a laser absorbing material. Or, some of the other responsive parts 22 include a silicone polymer as an adhesive material and ethanone as a laser absorbing material. Or, some of the responsive layers 22 include an epoxy resin as an adhesive material and a salicylic acid-based ultraviolet absorber and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone as laser absorbing materials. The above description lists and describes some combinations of materials for the responsive part 22, but in this embodiment, more combinations are not listed and described one by one.

[0034] One response part 22 of the transfer carrier 100 provided in this embodiment is composed of a combination of two or more first response members 211. The first response member 211 may be columnar, block-shaped, or other shapes, but this embodiment is not limited thereto. For example, as shown in FIG. 3, the multiple first response members 211 are columnar with a circular surface opposite to the substrate 10. When the transfer carrier 100 provided in this embodiment is applied to a transfer process, each of the response parts 22 may be connected to one micro device. In the transfer carrier 100 shown in FIG. 3, a total of 12 response parts 22 are shown in two rows and six columns, and each of the response parts 22 includes multiple first response members 211. Of course, the above specific numerical values ​​are merely listed and explained, and are not intended to be limitations on this embodiment.

[0035] In the embodiment shown in Figure 3, at least two first response members 211 of each of the response sections 22 are arranged in multiple rows, the number of first response members 211 in each row is multiple, and the multiple first response members 211 in any two adjacent rows are staggered to make the contact more uniform.

[0036] In this embodiment, the multiple response parts 22 are independent of each other, and when it is necessary to bond the microdevices using the transfer carrier shown in FIG. 3, one microdevice can be bonded to each of the response parts 22. In the transfer process, when a large number of microdevices are attached to the response layer 20, the response parts 22 at the bottom of adjacent microdevices are not connected to each other, and when they are selectively transferred, the corresponding response parts 22 of the corresponding microdevices are irradiated with a laser so as to decompose and vaporize or deform the material of the corresponding response parts 22 to release the microdevices onto the target substrate, and since each of the response parts 22 is independent of each other, the adjacent response parts 22 are not affected, reducing transfer errors and improving transfer accuracy. At least two first response members 211 connected to each of the microdevices are also installed at intervals from each other, and there is a gap between the first response members 211 and the first response members 211, so that the area actually bonded to the microdevice is smaller than the area of ​​the microdevice itself, and the release of the microdevice is also easier.

[0037] In some embodiments, the first response member 211 may be a single-layer material structure as shown in FIG. 2, which directly decomposes after being irradiated with a laser to generate gas and activate the microdevice, or deforms or splits after being irradiated with a laser, causing a phenomenon such as a decrease in adhesion and making the adhesiveness non-existent. Or, as shown in FIG. 4, the first response member 211 may further be a multi-layer material structure, with the side closer to the substrate 10 being made of a material that is easily decomposed by a laser to generate gas, which is called an inner layer material, and the side farther from the substrate 10 of the inner layer material being covered with a material having adhesiveness, which is called an outer layer material. As an example, the first response member 211 may have an inner layer material of triaza polymer and an outer layer material of natural rubber. The microdevice can be bonded to the transfer carrier 100 by the outer layer material, and can be decomposed by the inner layer material to generate gas and be separated from the substrate 10. The multiple response units 22 are installed at intervals, and do not affect other surrounding response units 22 during the transfer process.

[0038] In some embodiments, the materials of the at least two first response members 211 of each of the response sections 22 may be the same or different, and the materials of the multiple response sections 22 may be the same or different. For example, some of the first response members 211 may be multi-layer materials, some of the first response members 211 may be single-layer materials, or all of the first response members 211 may be multi-layer materials.

[0039] Furthermore, in some embodiments, referring to FIG. 5, the response layer 20 further includes a plurality of second response members 212 that are disposed in the gaps between the plurality of response parts 22 and spaced apart from the plurality of response parts 22. As shown in FIG. 5, the plurality of first response members 211 in each of the dashed frames are combined into one response part 22, and the plurality of second response members 212 are disposed in the gaps between the dashed frames. In addition, in the transfer carrier provided in this embodiment, the first response member 211 and the second response member 212 may not have a clear boundary, and the first response member 211 and the second response member 212 may not be distinguished before transfer using the transfer carrier 100 provided in this embodiment. In the transfer process, when a plurality of microdevices are attached to the transfer carrier 100 provided in this embodiment, the one that is in contact with and connected to the microdevice is called the first response member 211, and the one that is not connected to the microdevice is called the second response member 212. Referring to FIG. 5, in the embodiment of the present application, at least two first response members 211 of each of the response sections 22 may be arranged without staggering when arranged in multiple rows.

[0040] In some embodiments, a light-blocking material 23 may be provided on one side of the substrate 10, and the orthogonal projection of the light-blocking material 23 on the substrate 10 is located between the plurality of responsive sections 22. For example, as shown in FIG. 6, the light-blocking material 23 may be provided on one side of the substrate 10 close to the plurality of responsive sections 22, or as shown in FIG. 7, the light-blocking material 23 may be provided on one side of the substrate 10 opposite to the plurality of responsive sections 22. The light-blocking material 23 can block the transmission of a laser of a specific wavelength, and may be, for example, a light-reflecting material, specifically, a metal thin film that can be irradiated with radiation and can reflect a laser, such as Cr (chromium), Ti (titanium) or Mo (molybdenum), or a DBR (Distributed Bragg Reflection) light-reflecting layer. The plurality of responsive sections 22 are provided at intervals from each other, and the effect of the spot size caused by the irradiation of the laser on the adjacent responsive sections 22 is further prevented by the light-blocking material 23.

[0041] In some embodiments, referring to Fig. 8, the at least two first response members 211 of each of the response sections 22 include a middle first response member 211 and a peripheral first response member 2112 of the middle first response member 2111. The number of the middle first response members 2111 may be one or more, and the number of the peripheral first response members 2112 may also be one or more. For example, the peripheral first response member 2112 may be an annular structure in which a cavity is formed around the middle first response member 2111, as shown in Fig. 8. The material of the intermediate first response member 2111 and the material of the surrounding first response member 2112 may be the same or different, for example, the material of the intermediate first response member 2111 may be a material that is easily decomposed by a laser to generate gas, for example, the material of the intermediate first response member 2111 may be a combination of polyurethane, hydroxyphenyltriazine-based ultraviolet absorber and ethanone, and the surrounding first response member 2112 may be an adhesive material such as silica gel. When transferring a microdevice, the microdevice is bonded to the surrounding first response member 2112, and a sealed chamber is surrounded by the surrounding first response member 2112 and the substrate 10, and the intermediate first response member 2111 is irradiated with a laser to energize the microdevice so that the intermediate first response member 2111 decomposes to generate gas and is separated from the surrounding first response member 2112 and transferred. In this embodiment, when the material of the intermediate first response member 2111 is a material that is easily decomposed by a laser to generate gas, and the surrounding first response member 2112 is an adhesive material such as silica gel, the height of the intermediate first response member 2111 protruding from the substrate 10 may be smaller than the height of the surrounding first response member 2112 protruding from the substrate 10.

[0042] In some embodiments, referring to FIG. 9, at least two first response members 211 of each of the response sections 22 include a middle first response member 2111 and a plurality of peripheral first response members 2112 surrounding the middle first response member 2111. The middle first response member 2111 has a first adhesive area, and the peripheral first response member 2112 has a second adhesive area, and the first adhesive area is larger than the second adhesive area. In this embodiment, the first adhesive area is the area of ​​the middle first response member 2111 on the side opposite to the substrate 10, that is, the area where the middle first response member 2111 can contact the micro device. The second adhesive area is the area of ​​the peripheral first response member 2112 on the side opposite to the substrate 10, that is, the area where the peripheral first response member 2112 can contact the micro device. By reducing the size of the peripheral first response member 2112, the influence on the adjacent micro device during transfer can be further reduced. The intermediate first response member 2111 may be provided as a multi-layer material structure and the peripheral first response member 2112 may be provided as a single layer material structure.

[0043] In some embodiments, each of the responsive sections 22 has a first total area. In each of the responsive sections 22, each of the at least two first responsive members 211 has an adhesive area, and the total adhesive area of ​​the at least two first responsive members 211 is 10% or more of the first total area. The adhesive area of ​​each of the first responsive members 211 is the area of ​​the surface of the first responsive member 211 opposite the substrate 10 (i.e., the surface for adhering the micro device). With reference to FIG. 3, the adhesive area of ​​one first responsive member 211 is the area of ​​one small circle in FIG. 3. The surfaces of the at least two first responsive members 211 opposite the substrate 10 of each of the responsive sections 22 are combined to form a pattern, and the area of ​​the circumscribing rectangle of the pattern is the first total area of ​​the responsive section 22, which is understood to be the total area of ​​the adhesive area and the gap area of ​​the at least two first responsive members 211 of the responsive section 22. 3 to 9, the circumscribing rectangle corresponding to each of the response sections 22 has, for example, a length W1 along a first direction and a width W2 along a second direction, where the first direction is perpendicular to the second direction. The first total area is understood to be the product of the length W1 and the width W2. Referring to FIG. 3, each of the response sections 22 has 32 first response members 211, and the total area of ​​the 32 small circles is 10% or more of W1*W2.

[0044] In some embodiments, the multiple first response members 211 are arranged in multiple rows, and the multiple first response members 211 in any two adjacent rows are staggered to make the contact more uniform.

[0045] 3 to 9, in some embodiments, the at least two first response members 211 of each of the response units 22 are disposed symmetrically with respect to the center of the response unit 22. This can ensure alignment of the microdevice when releasing the microdevice in the transfer process, and can improve the transfer accuracy.

[0046] (Second Example) 10 and 11, a micro device transfer assembly 300 provided in one embodiment of the present application includes a transfer carrier 100 and a plurality of micro devices 200 attached to the transfer carrier 100. The transfer of the target release micro device may be achieved by releasing the target release micro device in the plurality of micro devices 200 from the transfer carrier 100 to a target substrate. Wherein, the transfer carrier 100 includes a substrate 10 and a responsive layer 20 disposed on one side of the substrate 10, and the responsive layer 20 includes a plurality of responsive members 21 disposed at intervals from each other. The plurality of micro devices 200 are attached to the side of the responsive layer 20 away from the substrate 10 at intervals from each other. Each of the plurality of micro devices 200 is connected to at least two of the plurality of responsive members 21. Wherein, any one of the plurality of responsive members 21 is connected to at most one micro device 200.

[0047] In this embodiment, the substrate 10 may be a transparent plate material such as glass that can transmit a laser, and the responsive layer 20 may be formed by technical means such as photolithography or nanoimprint. The material of the responsive layer 20 may be a polymer material that is easily decomposed and generates gaseous volatile decomposition products after irradiation with a laser of ultraviolet or deep ultraviolet wavelength, such as photodegradable triazapolymer (TP), polyimide (PI), etc. It may also be a material that deforms when irradiated with a laser, such as organic silica gel, and the material of the responsive layer 20 may be any one of the above three materials, or a combination of two or more materials.

[0048] The responsive layer 20 includes a plurality of responsive members 21, and the materials of the plurality of responsive members 21 may be the same or different. Some of the plurality of responsive members 21 may include an adhesive material that provides adhesive force for adhering the micro LED chip, or may include a laser absorbing material for better absorbing the laser in the responsive layer 20, depending on the functional classification of the material of each part of the responsive member 21. In some embodiments, the adhesive material may be selected from materials such as rubber-based polymers (e.g., natural rubber, neoprene rubber, styrene-butadiene rubber, nitrile rubber, etc.), polyesters, carbamate-based polymers, polyethers, silicone-based polymers, ethylene-vinyl acetate-based polymers, vinyl chloride-based polymers, cyanoacrylate-based polymers, cellulose-based polymers, phenolic resins, polyolefins, styrene-based polymers, polyvinyl acetate, polyvinyl alcohol, polyvinyl acetal, polyvinyl pyrrolidone, polyvinyl butyral, polybenzimidazole, melamine resins, urea resins, resorcinol-based polymers, polyvinyl adhesives, etc., or may be one or a combination of at least two of them. For example, the adhesive material of some of the responsive members 21 may be selected to provide adhesion while being decomposed by laser irradiation, while the adhesive material of other responsive members 22 may be selected to be a combination of a material having strong adhesion and a material that can be decomposed by laser.

[0049] The laser absorbing material may contain an ultraviolet absorber and / or a photopolymerization initiator, and the ultraviolet absorber may be, for example, a hydroxyphenyltriazine-based ultraviolet absorber, a benzophenone-based ultraviolet absorber, a benzotriazole-based ultraviolet absorber, a benzoate-based ultraviolet absorber, a benzoxazinone-based ultraviolet absorber, a phenyl salicylate-based ultraviolet absorber, a cyanoacrylate-based ultraviolet absorber, a nickel complex salt-based ultraviolet absorber, a hydroquinone-based ultraviolet absorber, a salicylic acid-based ultraviolet absorber, a malonic acid ester-based ultraviolet absorber, an oxalic acid-based ultraviolet absorber, or the like, or may be any one or a combination of at least two of these. The photopolymerization initiator may be, for example, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholino-phenyl)butan-1-one, ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(0-acetyloxime), 1,2-octanedione, 1-[4-(phenylthio)phenyl]-, 2-(O-benzoyloxime), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, or a combination of one or at least two of these.

[0050] Each of the plurality of response members 21 may be, but is not limited to, a columnar, block, or other shape in this embodiment. The plurality of micro devices 200 may be, but is not limited to, a Micro LED chip, or other devices having similar transfer requirements.

[0051] In this embodiment, the responsive member 21 is connected to at most one micro device 200, i.e., one responsive member 21 is connected to only one micro device 200, or no micro device 200 is connected. For example, in some embodiments, referring to Fig. 12 and Fig. 13, the multiple responsive members 21 include multiple first responsive members 211 connected between the multiple micro devices 200 and the substrate 10, and multiple second responsive members 212 located in the gaps between the multiple micro devices 200. The second responsive member 212 is a responsive member 21 to which no micro device 200 is connected.

[0052] In some embodiments, the multiple microdevices 200 may have, for example, electrodes, and the multiple microdevices 200 may be connected to the responsive layer 20 on the side away from the electrodes (as shown in FIG. 11 ) or on the side where the electrodes are located (as shown in FIG. 13 ), although this embodiment is not limited thereto.

[0053] In this embodiment, when one target release micro device needs to be released in the transfer carrier 100, the response member 21 connected to the target release micro device is irradiated with a laser, and since the multiple response members 21 are installed at intervals from each other, i.e., independent from each other, even if the response member 21 connected to the target release micro device is disassembled, it will not affect the response members 21 connected to other micro devices 200, thereby reducing transfer errors and improving transfer accuracy. At least two response members 21 connected to each micro device 200 are also installed at intervals from each other, i.e., have gaps, so that the area of ​​contact with each response layer 20 of the micro device 200 is smaller than the area of ​​the micro device 200, making the release easier.

[0054] In some embodiments, each of the micro devices 200 has a chip length W4 along a first direction and a chip width W5 along a second direction, and the first direction and the second direction are perpendicular to each other. Each of the at least two responsive members 21 connected to each of the micro devices 200 has a response width W3 that is less than half the chip length W4 and less than the chip width W5. For example, when the pattern of the surface of the responsive member 21 opposite the substrate 10 (i.e., the surface for connecting with the micro device 200) is circular, the response width W3 is the diameter of the circle. For example, when the pattern of the surface of the responsive member 21 opposite the substrate 10 (i.e., the surface for connecting with the micro device 200) is another shape, the response width W3 is the diameter of the circumscribing circle of the pattern. The responsive member 21 connected to the micro device 200 does not extend beyond the edge of the micro device 200.

[0055] In some embodiments, the total area of ​​at least two responsive members 21 connected to each of the microdevices 200 that contact the microdevice 200 is 10% or more of the area of ​​the microdevice 200. This makes it easier to release the microdevice 200 while ensuring sufficient adhesive strength.

[0056] At least two response members 21 connected to each of the micro devices 200 are distributed symmetrically about the center of the micro device 200, which can ensure alignment of the micro device when releasing the micro device during the transfer process and improve the transfer accuracy.

[0057] (Third Example) As shown in Fig. 14, the method for transferring the micro device 200 provided in the third embodiment of the present application employs any one of the transfer carriers 100 in the first embodiment described above or any one of the micro device transfer assemblies 300 in the second embodiment described above. Referring to Fig. 14, first, a plurality of micro devices 200 can be bonded from a source substrate to the transfer carrier 100 to form a micro device transfer assembly 300, and the plurality of micro devices 200 include a target release micro device 200 that is released from the transfer carrier 100 to a target transfer substrate to complete the transfer. Specifically, a laser-assisted transfer process can be adopted in which a region of the response layer 20 corresponding to the target release micro device 200 is irradiated with a laser, and the material of the response layer 20 in the irradiated region is decomposed or deformed to release the target release micro device 200.

[0058] The micro device transfer method provided in this embodiment applies the transfer carrier 100 provided in the first embodiment described above or the micro device transfer assembly 300 provided in the second embodiment described above, and therefore has beneficial effects similar to those of the first and second embodiments described above.

[0059] The above is merely a preferred embodiment of the present application, and does not impose any form of limitation on the present application. Although the present application is disclosed as a preferred embodiment as above, it does not limit the present application. Those skilled in the art may make equivalent embodiments by making slight changes or equivalent modifications using the technical content disclosed above, within the scope of the technical solution of the present application. However, as long as the content does not deviate from the technical solution of the present application, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical substance of the present application still fall within the scope of the technical solution of the present application. [Explanation of symbols]

[0060] 100: Transfer carrier, 10: Substrate, 20: Response layer, 21: Response member, 211: first response member; 2111: an intermediate first response member; 2112: a peripheral first response member; 212: second response member; 22: Response section, 23: Light blocking material, 200: Microdevices, 300: Micro device transfer assembly.

Claims

1. A transfer carrier used for transferring a plurality of micro devices, A substrate; a response layer disposed on one side of the substrate and including a plurality of response units spaced apart from one another; the plurality of response units correspond one-to-one to the plurality of microdevices; Each of the plurality of response units includes at least two first response members spaced apart from each other; The transfer carrier, wherein the responsive layer further includes a plurality of second responsive members disposed in gaps between the plurality of responsive portions and spaced apart from each other from the plurality of responsive portions.

2. 2. The transfer carrier of claim 1, wherein each of the response sections has a first total area, and in each of the response sections, each of the at least two first response members has a bonding area, and the sum of the bonding areas of the at least two first response members is greater than or equal to 10% of the first total area.

3. The transfer carrier of claim 1 , wherein the at least two first response members of each of the response portions are distributed symmetrically about a center of the response portion.

4. 2. The transfer carrier of claim 1, wherein the at least two first response members of each of the response sections include an intermediate first response member and a plurality of peripheral first response members surrounding the intermediate first response member, the intermediate first response member having a first bonding area and the peripheral first response members having a second bonding area, the first bonding area being greater than the second bonding area.

5. The transfer carrier of claim 1, wherein the at least two first response members of each of the response sections are arranged in a plurality of rows, the number of first response members in each row is multiple, and the multiple first response members in any two adjacent rows are staggered.

6. The transfer carrier according to claim 1 , wherein the material of the response layer is one or a combination of at least two selected from the group consisting of triaza polymer, polyimide, and organic silica gel.

7. The material of any one of the plurality of response parts may be a rubber-based polymer, a polyester, a carbamate-based polymer, a polyether, a silicone-based polymer, an ethylene-vinyl acetate-based polymer, a vinyl chloride-based polymer, a cyanoacrylate-based polymer, a cellulose-based polymer, a phenolic resin, a polyolefin, a styrene-based polymer, polyvinyl acetate, polyvinyl alcohol, polyvinyl acetal, polyvinyl pyrrolidone, polyvinyl butyral, polybenzimidazole, a melamine resin, a urea resin, a resorcinol-based polymer, a polyvinyl ether-based adhesive, a hydroxyphenyl triazine-based ultraviolet absorber, a benzophenone-based ultraviolet absorber, a benzotriazole-based ultraviolet absorber, a benzoate-based ultraviolet absorber, a benzoxazinone-based ultraviolet absorber, a phenyl salicylate-based ultraviolet absorber, a cyanoacrylate-based ultraviolet absorber, a cellulose-based polymer, a phenolic resin, a cellulose acetate-based ultraviolet absorber ... The transfer carrier according to claim 1, comprising one or a combination of at least two of lylate-based ultraviolet absorbers, nickel complex-based ultraviolet absorbers, hydroquinone-based ultraviolet absorbers, salicylic acid-based ultraviolet absorbers, malonic acid ester-based ultraviolet absorbers, oxalic acid-based ultraviolet absorbers, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholino-phenyl)butan-1-one, ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(0-acetyloxime), 1,2-octanedione, 1-[4-(phenylthio)phenyl]-, 2-(O-benzoyloxime), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone or 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one.

8. A transfer carrier including a substrate and a responsive layer including a plurality of responsive members disposed on one side of the substrate and spaced apart from one another; a plurality of microdevices attached to the responsive layer on a side thereof remote from the substrate in a spaced relationship therebetween; the plurality of responsive members includes a plurality of first responsive members connected between the plurality of micro devices and the substrate, and a plurality of second responsive members located in gaps between the plurality of micro devices; Each of the plurality of microdevices is connected to at least two first responsive members of the plurality of responsive members; Here, in this micro device transferring assembly, any one of the plurality of first response members is connected to a maximum of one of the micro devices.

9. The micro device transfer assembly of claim 8 , wherein the at least two first response members to which each of the micro devices is connected have a total area in contact with the micro device that is 10% or more of an area of ​​the micro device.

10. 9. The micro device transfer assembly of claim 8, wherein each of the micro devices has a tip length along a first direction and a tip width along a second direction, the first direction and the second direction being perpendicular to each other, and each of the at least two first response members to which each of the micro devices is connected has a response width that is less than half the tip length and less than the tip width.

11. The micro device transfer assembly of claim 8 , wherein the at least two first response members to which each of the micro devices is connected are distributed symmetrically about a center of the micro device.

12. A step of adhering a plurality of micro devices including a target release micro device, which is to be transferred by releasing the target release micro device in the transfer carrier of claim 1 to a target transfer substrate, from a source substrate to the transfer carrier to form a micro device transfer assembly of claim 8; A microdevice transfer method, comprising: a laser-assisted transfer step of irradiating a region of the response layer described in claim 8 corresponding to the target release microdevice with a laser, thereby decomposing or deforming the material of the response layer in the irradiated region to release the target release microdevice.

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