ROBOT SYSTEM AND IMAGING METHOD

Abstract

To acquire useful information on a robot by an imaging apparatus, with a compact configuration.SOLUTION: A robot system includes a mirror, the robot, and the imaging apparatus. The robot includes a hand for holding a substrate. The imaging apparatus is provided in the robot, so that a photographing angle is horizontal. In the robot, the position of the hand can be changed with respect to the mirror. The mirror is arranged at an angle to a horizontal surface. The imaging apparatus photographs the upper surface side of the hand through the mirror.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to the acquisition of information by an imaging device provided on a robot. [Background technology]

[0002] 2. Description of the Related Art Conventionally, a configuration in which an imaging device is provided on a robot for transporting a substrate is known. Patent Document 1 discloses this type of configuration.

[0003] The semiconductor wafer grinding device of Patent Document 1 includes a wafer transport robot and a reflecting mirror. A camera serving as an imaging means is mounted on the wafer transport robot. The reflecting mirror is disposed at an inclination of 45 degrees. When a wafer is stored protruding from an opening of a wafer cassette, the reflecting mirror reflects the wafer in a state in which the wafer can be imaged by the camera. The image reflected on the reflecting mirror is captured by the camera and analyzed by a discrimination means, so that the presence or absence of a wafer stored protruding from the opening can be detected before the wafer is carried out. Patent Document 1 claims that this makes it possible to prevent damage to the semiconductor wafer. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5295720 Summary of the Invention [Problem to be solved by the invention]

[0005] In the configuration of Patent Document 1, the reflecting mirror merely reflects the wafers contained in the wafer cassette. Therefore, a configuration that enables the robot to handle substrates more efficiently has been desired.

[0006] The present invention has been made in consideration of the above circumstances, and an object of the present invention is to obtain useful information about a robot by an imaging device with a compact configuration. [Means for solving the problem]

[0007] The problem to be solved by the present invention has been described above. Next, the means for solving this problem and the effects thereof will be described.

[0008] According to a first aspect of the present invention, there is provided a robot system having the following configuration. That is, the robot system includes a mirror, a robot, and an imaging device. The robot has a hand that holds a substrate. The imaging device is provided on the robot so that the imaging angle is horizontal. The robot is capable of changing the position of the hand relative to the mirror. The mirror is disposed at an angle relative to the horizontal plane. With the robot inserting at least a part of the hand into the space below the mirror, the imaging device images the upper surface side of the hand through the mirror. The robot system includes: The substrate is held on the upper surface side of the hand, and the image capturing device captures an image of the substrate through the mirror. The operation of the aligner device for adjusting the orientation of the substrate is changed based on the image captured by the image capturing device.

[0009] According to a second aspect of the present invention, there is provided a robot, an imaging device, An aligner device; The present invention provides a method for photographing a substrate in a robot system comprising: the robot having a hand for holding a substrate, the imaging device being provided on the robot such that a photographing angle is horizontal. The aligner device adjusts the orientation of the set substrate. The photographing method includes an insertion step and a photographing step. In the insertion step, the robot inserts at least a part of the hand into a space below a mirror that is inclined with respect to a horizontal plane. In the photographing step, the imaging device photographs the upper surface side of the hand through the mirror. In the photographing step, the imaging device photographs the substrate held on the upper surface side of the hand through the mirror, and the operation of the aligner device for adjusting the orientation of the substrate is changed based on the image photographed by the imaging device.

[0010] This allows the imaging device, which is horizontally oriented, to capture a wide area above the hand, making it possible to easily obtain information about the hand and other parts of the robot while keeping the vertical size of the robot small. Furthermore, by changing the operation of the aligner device depending on the situation, the orientation of the substrate can be adjusted efficiently. Effect of the Invention

[0011] According to the present invention, useful information about a robot can be obtained by an imaging device with a compact configuration. [Brief description of the drawings]

[0012] [Figure 1] 1 is a perspective view showing a configuration of a robot system according to an embodiment of the present invention. [Diagram 2] FIG. [Diagram 3] FIG. 13 is a diagram showing a state in which the robot holds a substrate. [Figure 4] FIG. [Diagram 5] FIG. 2 is a block diagram showing the electrical configuration of the robot system. [Figure 6] 5A and 5B are schematic diagrams illustrating an operation of detecting a notch of a wafer by an aligner device. [Figure 7] 11 is a flowchart showing control of photographing by a camera and adjustment of the orientation of a wafer. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Next, an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration of a robot system 100 according to an embodiment of the present invention. Fig. 2 is a perspective view showing a configuration of a robot 1. Fig. 3 is a block diagram showing a configuration of a part of the robot system 100.

[0014] A robot system 100 shown in FIG. 1 is a system that causes a robot 1 to perform a task in a work space such as a clean room.

[0015] The robot system 100 includes a robot 1, an aligner device 4, and a controller (control device) 5.

[0016] The robot 1 functions as, for example, a wafer transfer robot that transports a wafer (substrate) 2 stored in a storage container 8. In this embodiment, the robot 1 is realized by a SCARA type horizontal articulated robot. SCARA is an abbreviation for Selective Compliance Assembly Robot Arm.

[0017] The wafer 2 carried by the robot 1 is formed in the shape of a circular thin plate. A notch (concave) 2a is formed on the outer periphery of the wafer 2. The notch 2a indicates the crystal orientation of the semiconductor wafer. An orientation flat (flat portion) may be formed on the wafer 2 instead of the notch 2a.

[0018] As shown in FIG. 2, the robot 1 includes a hand (holding unit) 10, a manipulator 11, and a posture detection unit 12.

[0019] The hand 10 is a type of end effector, and is generally formed in a V-shape or U-shape in plan view. The hand 10 is supported at the tip of a manipulator 11 (specifically, a second link 16 described below). The hand 10 rotates about a third axis c3 extending in the vertical direction relative to the second link 16. In plan view, the hand 10 is formed to be linearly symmetrical with respect to an axis passing through the third axis c3. A symmetric axis A1 of the hand is shown in FIG. 3.

[0020] The hand 10 is configured as an edge grip type hand. As shown in Fig. 3 etc., a plurality of edge guide parts 6 for holding the wafer 2 are provided on each of the tip side and the base side of the hand 10. The edge guide parts 6 can come into contact with the outer peripheral surface of the disk-shaped wafer 2.

[0021] A pressing member 7 is provided at the base of the hand 10. The pressing member 7 can move along a symmetrical axis A1 of the hand 10. An actuator (not shown) built into the hand 10 is connected to the pressing member 7. The actuator may have any configuration, but in this embodiment, it is configured as a pneumatic cylinder. The pneumatic cylinder is connected to a compressed air supply source through a pipe (not shown) that passes through the inside of the manipulator 11.

[0022] By supplying compressed air to the pneumatic cylinder, the pressing member 7 can be displaced toward the tip of the hand 10. The pressing member 7 comes into contact with the outer peripheral surface of the wafer 2 placed on the hand 10, and presses the wafer 2 toward the tip of the hand 10. As a result, the pressing member 7 can hold the wafer 2 between itself and the edge guide part 6 on the tip side of the hand 10.

[0023] A camera 3 serving as an imaging device is provided at the base of the hand 10. The camera 3 is fixed integrally with the hand 10 so as to capture images of the surroundings at a horizontal angle along the symmetry axis A1 of the hand 10. The lens of the camera 3 is located above the upper surface of the hand 10. The camera 3 is electrically connected to the controller 5 of the robot 1.

[0024] As shown in FIG. 2, the manipulator 11 mainly includes a base 13, a lift shaft 14, a first link 15, and a second link 16.

[0025] The base 13 is fixed to the ground (for example, the floor surface of a clean room) and functions as a base member that supports the lift shaft 14.

[0026] The lift shaft 14 moves up and down relative to the base 13. By this lifting and lowering, the heights of the first link 15, the second link 16, and the hand 10 can be changed.

[0027] The first link 15 is supported on the upper part of the lift shaft 14. The first link 15 rotates about a first axis c1 that extends in the vertical direction relative to the lift shaft 14. This allows the orientation of the first link 15 to be changed within a horizontal plane.

[0028] The second link 16 is supported at the tip of the first link 15. The second link 16 rotates about a second axis c2 extending in the vertical direction relative to the first link 15. This allows the posture of the second link 16 to be changed within the horizontal plane.

[0029] The manipulator 11 is provided with a plurality of drive motors (not shown). The drive motors can rotate the first link 15, the second link 16, and the hand 10 in a horizontal plane. The drive motors can also raise and lower the lift shaft 14. The drive motors can be configured as electric motors, for example.

[0030] The aligner device 4 is, for example, a pre-aligner (wafer aligner). As shown in FIG.

[0031] The turntable 41 can rotate the wafer 2 by an electric motor (not shown) or the like. The turntable 41 rotates with the wafer 2 placed thereon. The rotation direction of the turntable 41 can be changed as necessary by switching the rotation direction of the electric motor or the like. The turntable 41 is formed, for example, in a cylindrical shape as shown in FIG. 1. However, the shape of the turntable 41 is not limited.

[0032] The line sensor 42 is composed of, for example, a transmission type sensor having a light-projecting section and a light-receiving section. The light-projecting section and the light-receiving section face each other and are arranged at a predetermined interval in the vertical direction. The line sensor 42 projects detection light via the light-projecting sections arranged in the radial direction of the rotating table 41, and receives the detection light via the light-receiving section provided below the light-projecting sections. The detection light can be, for example, laser light. When the wafer 2 is placed on the rotating table 41, its outer edge is positioned between the light-projecting section and the light-receiving section.

[0033] The line sensor 42 is electrically connected to the controller 5 of the robot 1. The line sensor 42 transmits the detection result of the light receiving portion to the controller 5. Although details will be described later, a change in the detection result of the light receiving portion when the turntable 41 is rotated corresponds to the shape of the outer edge of the wafer 2. From the shape of the outer edge, the orientation of the notch 2a of the wafer 2 can be detected. The line sensor 42 is not limited to a transmission type sensor, and may be composed of, for example, a reflective type sensor.

[0034] 1, the mirror 9 is provided at a position beside the aligner device 4. The hand 10 can be inserted into the space directly below the mirror 9. The mirror 9 is arranged in an inclined manner so that it becomes lower toward the tip side of the hand 10 when the hand 10 is inserted downward.

[0035] With the hand 10 inserted in a predetermined position below the mirror 9 as shown in Fig. 4, the wafer 2 reflected on the mirror 9 can be photographed by the camera 3. The position of the hand 10 is preferably such that the entire wafer 2 reflected on the mirror 9 (in other words, the entire circumference) can be accommodated within the field of view of the camera 3. In this way, no matter where the notch 2a is located on the wafer 2, the notch 2a can be reliably photographed by the camera 3.

[0036] 4, the wafer 2 is inserted so that the entire wafer 2 overlaps the mirror 9 in a plan view. This makes it easy to include the entire circumference of the wafer 2 in the field of view of the camera 3. The degree of inclination of the mirror 9 is arbitrary, but it is preferable to set the inclination angle α with respect to the horizontal plane to less than 45°, since this allows a wide area around the hand 10 to be reflected with a small mirror 9.

[0037] As shown in Fig. 3, the controller 5 includes a transport control unit 51, an image analysis unit 52, an aligner control unit 53, and a direction acquisition unit 54. The controller 5 is configured as a known computer including a CPU, a ROM, a RAM, an auxiliary storage device, and the like. The auxiliary storage device is configured as, for example, an HDD, an SSD, and the like. The auxiliary storage device stores a robot control program and the like for implementing the imaging method of the present invention. Through cooperation of these hardware and software, the controller 5 can operate as the transport control unit 51, the image analysis unit 52, the aligner control unit 53, the direction acquisition unit 54, and the like.

[0038] The transport control unit 51 outputs command values ​​to each drive motor that drives each part of the above-mentioned robot 1 in accordance with a predetermined operating program or movement commands input by a user, and controls the motors to move the hand 10 to a predetermined command position.

[0039] The image analysis unit 52 analyzes the image captured by the camera 3. The image analysis unit 52 can obtain the direction in which the notch 2a faces by detecting the position of the notch 2a of the wafer 2 that appears in the image data. The orientation of the notch 2a is precisely measured later by the aligner device 4. Therefore, it is sufficient for the image analysis unit 52 to roughly obtain the orientation of the notch 2a. The image analysis can be performed using, for example, known pattern recognition.

[0040] The aligner control unit 53 controls the rotation / stop of the turntable 41 provided in the aligner device 4, the detection / stop of detection of the line sensor 42, and the like.

[0041] The orientation acquisition unit 54 acquires the direction in which the notch 2a formed in the wafer 2 faces based on the detection result from the line sensor 42, as described above.

[0042] In this embodiment, the transfer control unit 51 controls the robot 1 so that the orientation of the wafer 2 when photographed by the camera 3 via the mirror 9 coincides with the orientation of the wafer 2 when set in the aligner device 4.

[0043] 6 shows the mirror 9 and the aligner device 4 in a plan view. In the aligner device 4, the line sensor 42 is located at the 0 o'clock position in FIG.

[0044] Therefore, as shown in FIG. 6(a), if the notch 2a is located near the 2 o'clock direction in a planar view when photographed by the camera 3, the notch 2a can be detected by the line sensor 42 in a shorter time by rotating the turntable 41 counterclockwise in the aligner device 4 than by rotating it clockwise.

[0045] On the other hand, as shown in FIG. 6(b), if the notch 2a is located near the 9 o'clock position in a planar view when photographed by the camera 3, the notch 2a can be detected by the line sensor 42 in a shorter time by rotating the turntable 41 in the aligner device 4 clockwise than by rotating it counterclockwise.

[0046] In this way, the controller 5 controls the rotation direction of the turntable 41 in the aligner device 4 to vary based on the image captured by the camera 3. This effectively reduces the processing time required for precisely adjusting the orientation of the wafer 2 in the aligner device 4.

[0047] In this embodiment, the orientation of the notch 2a can be roughly grasped based on the result of photographing the notch 2a by the camera 3. Therefore, in an angle region where it is known in advance that the notch 2a will not be detected by the line sensor 42, the aligner device 4 can control the rotation table 41 to rotate at a higher speed than usual. In this case, the processing time can be further shortened.

[0048] The controller 5 may cause the aligner device 4 to adjust the orientation of the wafer 2 based only on the orientation of the notch 2a acquired based on the result of photographing the notch 2a by the camera 3. That is, precise detection of the notch 2a by the line sensor 42 may be omitted. In this case, the line sensor 42 can be omitted from the aligner device 4. In general, the detection accuracy of the orientation of the notch 2a by the camera 3 is not higher than that of the line sensor 42. However, depending on the application, such rough sensing may be sufficient.

[0049] While the camera 3 is attached to the hand 10, the mirror 9 is not attached to the hand 10. The mirror 9 is fixedly disposed at a position slightly away from the robot 1, and the hand 10 can be moved close to the mirror 9 to photograph the wafer 2 only when necessary. Therefore, a lightweight and compact hand 10 can be obtained.

[0050] Since the camera 3 is provided on the hand 10 so as to take pictures at a horizontal angle, it is easy to make the hand 10 compact in the thickness direction (vertical direction) of the hand 10. In other words, even if the camera 3 is provided, the overall height of the hand 10 can be reduced.

[0051] The camera 3 can not only photograph the wafer 2 via the mirror 9, but also photograph various locations. For example, the inside of the storage container 8 can be photographed by the camera 3. Therefore, the camera 3 can be efficiently used for monitoring the surroundings, etc. Since the camera 3 is attached in the same orientation as the tip of the hand 10, the position and attitude of the camera 3 can be controlled in the same way as the position and attitude of the hand 10 are controlled. Therefore, control for photographing is easy.

[0052] Furthermore, the camera 3 can perform monitoring at all times. Therefore, for example, an abnormality in the wafer 2 and / or the hand 10 can be found early. As described above, the camera 3 is provided on the hand 10, and therefore vibrations occurring in members such as the wafer 2 held by the hand 10 are the same as vibrations occurring in the camera 3. Therefore, in the image captured by the camera 3, the members such as the wafer 2 held by the hand 10 appear clearly.

[0053] Next, control regarding photographing by the camera 3 and adjustment of the orientation of the wafer 2 will be described with reference to FIG.

[0054] First, the transfer control unit 51 of the controller 5 appropriately controls the drive motor of the robot 1 to take out, for example, the wafer 2 from the storage container 8 with the hand 10. The transfer control unit 51 controls the robot 1 to insert the wafer 2 held by the hand 10 together with the hand 10 below the mirror 9 (step S101). This state is shown in FIG.

[0055] Next, the camera 3 captures an image of the wafer 2 reflected on the mirror 9 (step S102). The image data acquired by the camera 3 is output to the image analysis unit 52 of the controller 5.

[0056] The image analysis unit 52 analyzes the input image data to obtain the phase of the notch 2a, and stores it in a storage device included in the controller 5 (step S103).

[0057] Next, the transfer control unit 51 controls the robot 1 to move the hand 10, transfers the wafer 2 to the aligner device 4, and places it on the rotating table 41 (step S104).

[0058] The controller 5 determines whether the phase of the notch 2a obtained by the image analysis in step S103 is equal to or greater than 0 o'clock and less than 6 o'clock in FIG. 6 (step S105).

[0059] As shown in Fig. 6(a), if the phase of notch 2a is between 0 o'clock and 6 o'clock, the aligner control unit 53 rotates the turntable 41 counterclockwise (step S106). As shown in Fig. 6(b), if the phase of notch 2a is not between 0 o'clock and 6 o'clock, the aligner control unit 53 rotates the turntable 41 clockwise (step S107). In either case, the rotation of the turntable 41 continues until the line sensor 42 detects the notch 2a.

[0060] When the notch 2a of the wafer 2 is detected, the orientation of the turntable 41 is appropriately adjusted based on the rotation phase of the turntable 41 at the time of detection (step S108). As a result, the orientation of the wafer 2 can be adjusted to a desired orientation.

[0061] Thereafter, the transfer control unit 51 controls the robot 1 so that the hand 10 takes out the wafer 2 from the aligner device 4 and transfers it to a predetermined destination (step S109).

[0062] As described above, the robot system 100 of this embodiment includes the mirror 9, the robot 1, and the camera 3. The robot 1 has the hand 10 that holds the wafer 2. The camera 3 is provided on the robot 1 so that the shooting angle is horizontal. The robot 1 can change the position of the hand 10 relative to the mirror 9. The mirror 9 is disposed at an angle relative to the horizontal plane. With the robot 1 inserting at least a part of the hand 10 into the space below the mirror 9, the camera 3 shoots an image of the upper surface side of the hand 10 through the mirror 9.

[0063] This allows the camera 3, which is arranged horizontally, to capture a wide range of images of the horizontal surface above the hand 10. Therefore, information about the hand and the like can be easily obtained with a configuration that limits the size of the robot in the vertical direction.

[0064] In the robot system 100 of this embodiment, the robot 1 is configured as a horizontal articulated robot.

[0065] A configuration in which the camera 3 is arranged so that the shooting angle is horizontal and shoots the wafer 2 through the inclined mirror 9 is particularly suitable for a horizontal articulated robot that transports the wafer 2 in a horizontal position.

[0066] The robot system 100 of this embodiment includes an aligner device 4 that adjusts the orientation of a set wafer 2. A camera 3 captures an image of the wafer 2 held on the upper surface side of a hand 10 via a mirror 9. The operation of the aligner device 4 for adjusting the orientation of the wafer 2 changes based on the image captured by the camera 3.

[0067] This allows the operation of the aligner device 4 to be changed depending on the situation, thereby making it possible to efficiently adjust the orientation of the wafer 2.

[0068] In the robot system 100 of this embodiment, the wafer 2 is disk-shaped with a notch 2a formed on its outer periphery. The aligner device 4 includes a rotating table 41 and a line sensor 42. The rotating table 41 rotates the substrate. The line sensor 42 detects the notch 2a at a constant phase with respect to the center of rotation of the rotating table 41. The aligner device 4 changes the direction in which the rotating table 41 rotates the wafer 2 for the detection of the notch 2a by the line sensor 42, based on the position of the notch 2a photographed by the camera 3.

[0069] This makes it possible to reduce the angle at which the turntable 41 is rotated in order to search for the notch 2a of the wafer 2 in the aligner device 4. Therefore, the orientation of the wafer 2 can be adjusted efficiently.

[0070] In the robot system 100 of this embodiment, the mirror 9 is disposed at a position higher than the position at which the wafer 2 is set in the aligner device 4.

[0071] This allows a series of operations, such as setting the wafer 2 in the aligner device 4 after photographing it, to be carried out smoothly.

[0072] In this embodiment, the camera 3 captures an image by a method including an insertion step and an image capturing step. In the insertion step, the robot 1 inserts at least a part of the hand 10 into a space below a mirror 9 that is disposed at an angle with respect to a horizontal plane. In the image capturing step, the camera 3 captures an image of the upper surface side of the hand 10 through the mirror 9.

[0073] This allows the camera 3, which is arranged horizontally, to capture a wide range of images of the area above the hand 10. Therefore, useful information about the robot 1 can be easily obtained with a compact configuration.

[0074] Although the preferred embodiment of the present invention has been described above, the above configuration can be modified, for example, as follows.

[0075] The image captured by the camera 3 through the mirror 9 can be used for purposes other than detecting the rough orientation of the notch 2a. For example, the camera 3 can capture an image of the hand 10 without holding the wafer 2, and the image of the camera 3 can be used for the controller 5 to automatically determine the degree of wear of the edge guide portion 6. This result can be used, for example, to determine the timing of maintenance of the hand 10. The image captured by the camera 3 can also be used to determine whether the pressing member 7 is worn or not, or to determine whether there is an abnormality in the clamping operation by the pressing member 7.

[0076] The hand 10 can also be configured as a suction hand. In this case, the image captured by the camera 3 can be used to detect the amount of eccentricity of the wafer 2 with respect to the hand 10 when the wafer 2 is held by the hand 10, or to detect an abnormal state of the wafer 2 held by the hand 10 (for example, a crack or chip in the wafer 2).

[0077] The mirror 9 can be configured as a plane mirror or as a curved mirror having a convex or concave surface.

[0078] The mirror 9 can also be placed on top of the aligner device 4 instead of to the side of the aligner device 4 .

[0079] As long as there is a certain relationship between the orientation (first orientation) of the hand 10 when the wafer 2 is photographed by the mirror 9 and the orientation (second orientation) of the hand 10 when the wafer 2 is set in the aligner device 4, the first orientation and the second orientation do not have to be the same.

[0080] In the above embodiment, the controller 5 for controlling the robot 1 controls the aligner device 4. The controller 5 also analyzes the images input from the camera 3. However, at least one of the control of the aligner device 4 and the analysis of the images may be configured to be performed by a computer other than the controller 5.

[0081] The shooting angle of the camera 3 does not have to be strictly horizontal, but may be substantially horizontal. The camera 3 may be disposed on a part other than the hand 10, for example, on the first link 15 or the second link 16.

[0082] The number of joints of the robot 1 is not limited to three, and may be one, two, or four or more. The robot 1 may be configured as a vertical multi-joint type or a linear motion type instead of a horizontal multi-joint type.

[0083] It is preferable that the camera 3 captures the image while the hand 10 is stationary, but it may capture the image while the hand 10 is moving and passing under the mirror 9.

[0084] The aligner device 4 can be used not only to detect and adjust the orientation of the wafer 2, but also to detect positional deviation of the wafer 2. Positional deviation of the wafer 2 means deviation of the center position of the wafer 2 from the center of rotation of the turntable 41.

[0085] Obviously many modifications and variations of the present invention are possible in light of the above teachings, and it is therefore to be understood that, within the scope of the appended claims, the invention may be practiced otherwise than as specifically described herein. [Explanation of symbols]

[0086] 1. Robot 2. Wafer (substrate) 2a Notch (recess) 3. Camera (imaging device) 4 Aligner device 5 Controller 9. Mirror 10 Hands 41 Rotating table (rotating part) 42 Line sensor (sensor) 100 Robot System

Claims

1. Miller and a robot having a hand for holding a substrate; an imaging device provided on the robot so that a photographing angle is horizontal; Equipped with the robot is capable of changing a position of the hand relative to the mirror; The mirror is disposed at an angle with respect to a horizontal plane, When the robot has inserted at least a part of the hand into a space below the mirror, the imaging device captures an image of an upper surface side of the hand through the mirror; an aligner device for adjusting the orientation of the set substrate; the imaging device captures an image of the substrate held on the upper surface side of the hand through the mirror; A robot system, characterized in that the operation of the aligner device for adjusting the orientation of the substrate is changed based on an image captured by the imaging device.

2. The robot system according to claim 1 , The robot system is characterized in that the robot is configured as a horizontal articulated robot.

3. The robot system according to claim 1 or 2, The substrate is a disk having a recess or a flat portion formed on an outer periphery thereof, The aligner device comprises: A rotating unit that rotates the substrate; a sensor that detects the recess or the flat portion at a constant phase with respect to a rotation center of the rotating portion; Equipped with The aligner device is a robot system characterized in that the rotation unit changes the direction in which the substrate is rotated in order to detect the recessed portion or flat portion with the sensor, based on the position of the recessed portion or flat portion photographed by the imaging device.

4. The robot system according to any one of claims 1 to 3, A robot system, wherein the mirror is disposed at a position higher than a position at which the substrate is set in the aligner device.

5. The robot system according to claim 1 , a guide portion for guiding the held substrate is disposed on an upper surface of the hand; The robot system is characterized in that the imaging device detects an abnormality in the guide portion based on an image captured through the mirror.

6. a robot having a hand for holding a substrate; an imaging device provided on the robot so that a photographing angle is horizontal; an aligner device for adjusting the orientation of the set substrate; A method for photographing in a robot system comprising: an insertion step in which the robot inserts at least a part of the hand into a space below a mirror that is inclined with respect to a horizontal plane; an imaging step of the imaging device imaging an upper surface side of the hand through the mirror; Including, In the photographing step, the imaging device photographs the substrate held on the upper surface side of the hand through the mirror, An imaging method, comprising changing an operation of the aligner device for adjusting an orientation of the substrate based on an image captured by the imaging device.

7. The photographing method according to claim 6, The photographing method according to the present invention, wherein the robot is configured as a horizontal articulated robot.

8. The photographing method according to claim 6 or 7, The imaging method according to claim 1, wherein the mirror is disposed at a position higher than a position at which the substrate is set in the aligner apparatus.

Images