Substrate-related work machine

Abstract

To provide a substrate working machine that can accurately stop a substrate at a target stop position.SOLUTION: An substrate working machine transports a substrate along a transport path to a target stop position and performs predetermined work. The substrate working machine comprises: a camera that images a detection object attached to the substrate; a focus adjustment unit that matches the focus of the camera to a first height position at which the substrate is transported along the transport path during the transportation of the substrate; and a transport control unit that controls the transport of the substrate to the target stop position on the basis of the captured image captured by the camera while the camera is focused on the first height position.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present specification relates to a substrate-related operating machine. [Background technology]

[0002] Conventionally, there is known a substrate-related operation machine that transports a substrate along a transport path to a target stop position (see, for example, Patent Document 1). After the substrate is stopped at the target stop position, this substrate-related operation machine uses a camera to read a detection object such as a reference mark attached to the substrate, and determines the positional deviation of the substrate stop position from the target stop position. Then, corrective movement or position correction is performed on the substrate according to the positional deviation. Thereafter, the pedestal on which the substrate is placed is raised, and the substrate is fixed to the clamp position. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-27202 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the substrate-related operation machine described in Patent Document 1, the camera reads the detection object on the substrate at the target stop position after the substrate transport stops. In this configuration, the substrate transport is performed using an encoder or the like, but the substrate stop position may actually deviate from the target stop position. If the positional deviation is large, the detection object may not be within the field of view of the camera at the substrate stop position, causing an error in reading the detection object and forcing the device to stop.

[0005] An object of the present specification is to provide a substrate-related operating machine that is capable of stopping a substrate at a target stopping position with high accuracy. [Means for solving the problem]

[0006] This specification discloses a substrate-related work machine that transports a substrate along a transport path to a target stop position to perform a specified operation, the machine comprising: a camera that captures an image of a detection object attached to the substrate; a focus adjustment unit that, during transport of the substrate, adjusts the focus of the camera to a first height position at which the substrate is transported along the transport path; and a transport control unit that controls the transport of the substrate to the target stop position based on an image captured by the camera with the focus adjusted to the first height position.

[0007] According to the present disclosure, the focus of the camera can be adjusted to a first height position, which is the transport height position of the substrate, while the substrate is being transported, thereby preventing abnormalities caused by out-of-focus recognition of the detection target using the camera while the substrate is being transported, thereby enabling the substrate to be stopped accurately at the target stopping position. [Brief description of the drawings]

[0008] [Figure 1] FIG. 2 is a configuration diagram of a substrate-related operating machine according to an embodiment, as viewed from above; [Diagram 2] 2 is a perspective view showing a relationship between a substrate transport and a camera in the substrate-related performing apparatus according to the embodiment; FIG. [Diagram 3] 1 is a diagram illustrating a positional relationship between a substrate and a clamping device during substrate transport by a substrate-related operating apparatus according to an embodiment. FIG. [Figure 4] 1 is a diagram illustrating a positional relationship between a substrate and a clamp device at a clamping position of a substrate-related operating apparatus according to an embodiment. FIG. [Diagram 5] FIG. 2 is a block diagram of a substrate-related operating apparatus according to the embodiment; [Figure 6] 13 is a diagram showing the camera field of view when the reference mark starts to enter the camera field of view. FIG. [Figure 7] 13 is a diagram showing the camera field of view when the reference mark reaches the center of the camera field of view. FIG. [Figure 8] 5 is a flowchart illustrating an example of a control routine executed in the substrate-related performing apparatus according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of a substrate-related operation machine according to the present disclosure will be described.

[0010] 1. Configuration of the board-related processing machine The substrate-related operation machine 1 is a device that performs a predetermined operation on a substrate 2 such as an electronic board. The substrate-related operation machine 1 is, for example, a component mounting machine that mounts components on the substrate 2, or a printer that performs solder printing on the substrate 2. Hereinafter, the substrate-related operation machine 1 is assumed to be a component mounting machine that mounts components on the substrate 2 as shown in FIG.

[0011] The substrate 2 is a plate-like member on which a wiring pattern is formed, and is a member on which components are mounted. As shown in FIG. 2, a reference mark 2a is provided on the substrate 2. The reference mark 2a is an object to be detected for defining position coordinates required for mounting components on the substrate 2. The reference mark 2a is a mark having a predetermined shape, such as a circle or a square, that is attached to or processed on the surface of the substrate 2. The reference mark 2a has a size of, for example, 0.5 to 2 millimeters.

[0012] A plurality of reference marks 2a (two in this embodiment) are provided on the substrate 2. Each of the reference marks 2a is disposed at a predetermined position on the surface of the substrate 2. The reference marks 2a are formed at different positions on the surface of the substrate 2, and are disposed at a predetermined distance from each other to have a predetermined positional relationship.

[0013] 1, the substrate-related performing operation machine 1 includes a substrate transport device 20, a component supply device 30, and a component transfer device 40. The substrate transport device 20, the component supply device 30, and the component transfer device 40 are each attached to and mounted on a main body 10, which is a base of the substrate-related performing operation machine 1.

[0014] The substrate transport device 20 is a device that transports the substrate 2 in a transport direction X. As shown in Figures 1, 2, 3, and 4, the substrate transport device 20 has a pair of guide rails 21, 22, a conveyor belt (not shown), and a clamp device 24. The guide rails 21, 22, the conveyor belt, and the clamp device 24 can be appropriately replaced depending on the type, size, shape, etc. of the substrate 2 to be transported.

[0015] The guide rails 21, 22 are rail members constituting a transport path that guides the substrate 2 transported in the transport direction X. The pair of guide rails 21, 22 extend parallel to each other and are arranged at an interval in a direction perpendicular to the transport direction X (perpendicular direction Y). The conveyor belt is a belt member on which the substrate 2 is placed. The conveyor belt is provided so as to be rotatable by an electric motor or the like. The substrate 2, while being guided by the pair of guide rails 21, 22 and placed on the conveyor belt, is transported in the transport direction X along the transport path defined by the guide rails 21, 22 by the rotation of the conveyor belt. The transport speed of the substrate 2 is, for example, 100 millicentimeters per second.

[0016] The clamp device 24 is a device that pushes up and positions the substrate 2 that has been transported to a target stop position. The clamp device 24 is disposed corresponding to the target stop position of the substrate 2. The clamp device 24 has a pedestal 24a and a support pin 24b. The pedestal 24a is provided so as to be movable up and down by a cylinder or the like. The support pin 24b is erected on the upper surface of the pedestal 24a. A plurality of support pins 24b are provided and are appropriately arranged according to the substrate 2.

[0017] When the board 2 is transported to a target stop position by the conveyor belt, the clamp device 24 clamps and positions the board 2 between the engaging protrusions 21a, 22a of the guide rails 21, 22 as the pedestal 24a rises and the tips of the support pins 24b push up the board 2. Components are transferred and mounted on the positioned board 2 by the component transfer device 40. After the components are mounted on the board 2, the clamp device 24 releases the positioning of the board 2 by lowering the pedestal 24a and places the board 2 on the conveyor belt. After being placed on the conveyor belt, the board 2 is carried out along the transport direction X.

[0018] The component supplying device 30 is a device that supplies components to be mounted on the board 2 to the pick-up position L. The component supplying device 30 has a part feeder 31. The part feeder 31 is detachably and replaceably held in a slot provided in the main body 10 of the substrate-related operating machine 1. The part feeder 31 supplies components housed in, for example, a carrier tape to the pick-up position L one by one by rotating the carrier tape.

[0019] The component transfer device 40 is a device that transfers a component, which has been supplied to the pickup position L by the component supply device 30, toward the board 2 that has been positioned at a target stop position by the board transport device 20. The component transfer device 40 has a Y-axis slide device 41, an X-axis slide device 42, a head lifting device 43, and a mounting head 44.

[0020] The Y-axis sliding device 41 is a device that moves the mounting head 44 in the orthogonal direction Y relative to the main body 10 of the substrate-related operating machine 1. The Y-axis sliding device 41 moves the mounting head 44 in the orthogonal direction Y by driving an electric motor. The X-axis sliding device 42 is a device that moves the mounting head 44 in the transport direction X relative to the main body 10 of the substrate-related operating machine 1. The X-axis sliding device 42 moves the mounting head 44 in the transport direction X by driving an electric motor. The X-axis sliding device 42 is attached to the Y-axis sliding device 41 so as to be movable in the transport direction X, and is moved in position integrally with the Y-axis sliding device 41 in the orthogonal direction Y as the Y-axis sliding device 41 moves in the orthogonal direction Y.

[0021] The head lifting device 43 is a device that moves the mounting head 44 in a direction perpendicular to both the transport direction X and the orthogonal direction Y (hereinafter referred to as the up-down direction Z) relative to the main body 10 of the substrate-related operating machine 1. The head lifting device 43 has a Z-axis table 43a to which the mounting head 44 is attached. The Z-axis table 43a is attached to the X-axis sliding device 42 so as to be movable in the up-down direction Z. The head lifting device 43 moves the Z-axis table 43a and therefore the mounting head 44 in the up-down direction Z relative to the X-axis sliding device 42 by driving an electric motor.

[0022] The head lifting device 43 can move the mounting head 44 between the upward end and the downward end. The head lifting device 43 is provided to widen the stroke range in the up-down direction Z of the suction nozzle 44b (described later) mounted on the mounting head 44. Component transfer between the component pick-up position L and the mounting position on the board 2 can be realized in response to a wide range of component heights without causing interference with components on the board 2. For example, a component with a high component height is transferred with the mounting head 44 positioned at the upward end, and a component with a low component height is transferred with the mounting head 44 positioned at the downward end.

[0023] The mounting head 44 is integral with the Z-axis table 43a, and moves relative to the main body 10 in the transport direction X by the X-axis slide device 42, in the perpendicular direction Y by the Y-axis slide device 41, and in the vertical direction Z by the head lifting device 43. The mounting head 44 has a head main body 44a, a suction nozzle 44b, and a nozzle lifting and rotating mechanism (not shown).

[0024] The head body 44a is fixed to the Z-axis table 43a, and moves up and down as the Z-axis table 43a moves in the up and down direction Z. The suction nozzle 44b is a nozzle that sucks and holds a component at the lower end, which is the tip of the nozzle, by introducing negative pressure or the like. The suction nozzle 44b sucks up a component supplied to the pick-up position L of the component supply device 30 by using negative pressure or the like, and places the sucked component at a mounting position on the board 2 by releasing the suction. Note that multiple types of suction nozzles 44b may be provided according to the size and type of the component to be sucked.

[0025] The head body 44a may be capable of holding a plurality of suction nozzles 44b at the same time. The mounting head 44 may have a gripping chuck for gripping and holding a component, instead of or in addition to the suction nozzles 44b for suctioning a component.

[0026] The nozzle lifting and rotating mechanism is a mechanism that moves the suction nozzle 44b in the vertical direction Z relative to the head main body 44a and rotates it about the axis in the vertical direction Z. The suction nozzle 44b is attached to the tip side (i.e., the lower end side) of the lifting shaft of the nozzle lifting and rotating mechanism, and moves up and down relative to the head main body 44a and rotates about the axis as the lifting shaft moves. The suction nozzle 44b can move in any of the transport direction X, the perpendicular direction Y, and the vertical direction Z relative to the main body 10 as the head main body 44a moves. The suction nozzle 44b is attached to the lifting shaft of the nozzle lifting and rotating mechanism in a detachable and replaceable manner.

[0027] A camera 50 is attached to the Z-axis table 43a. The camera 50 moves integrally with the head body 44a of the mounting head 44. The camera 50 is a camera for capturing images of the reference marks 2a and the like attached to the board 2 from above. The camera 50 is disposed on the Z-axis table 43a with its optical axis facing downward. The image captured by the camera 50 is used to acquire position information of the board 2. This acquired position information is used for transport control of the board 2 by the board transport device 20, and for position control and attitude control of the suction nozzle 44b when mounting components by the component transfer device 40. Hereinafter, the camera 50 is referred to as a mark camera 50.

[0028] A camera 60 is attached to the main body 10 of the substrate-related performing operation machine 1. The camera 60 is a camera for capturing an image of the component picked up by the suction nozzle 44b from below. The camera 60 is disposed on the main body 10 with its optical axis facing upward. The image captured by the camera 60 is used to obtain position information of the component with respect to the suction nozzle 44b. This obtained position information is used for position control and attitude control when the suction nozzle 44b picks up or places a component. Hereinafter, the camera 60 is referred to as a component camera 60.

[0029] In the component transfer device 40, the head body 44a of the mounting head 44 is moved in the transport direction X, the perpendicular direction Y, and the up-down direction Z by driving each motor, and the suction nozzle 44b of the mounting head 44 is raised and lowered in the up-down direction Z and rotated around the axis of the lifting and lowering shaft of the nozzle lifting and rotation mechanism.

[0030] The substrate-related operating machine 1 also includes a control device 70 as shown in Fig. 5. The control device 70 is a device that controls the substrate transport device 20, the component supply device 30, and the component transfer device 40. The control device 70 is composed of a CPU, an input / output unit, a storage unit, etc. The control device 70 controls substrate transport by the substrate transport device 20, component supply by the component supply device 30, component transfer by the component transfer device 40, etc., based on various sensor inputs and images captured by the cameras 50 and 60.

[0031] The control device 70 has a focus adjustment unit 70a, a transport control unit 70b, an operation execution unit 70c, and an identification unit 70d. The focus adjustment unit 70a is a unit that adjusts the focus of the mark camera 50 to the height position of the board 2. The transport control unit 70b is a unit that controls the transport of the board 2 along the transport path. The operation execution unit 70c is a unit that performs component mounting as an operation for the board 2 that has reached the clamp position. The identification unit 70d is a unit that identifies whether the reference mark 2a recognized in the image captured by the mark camera 50 is correct or incorrect.

[0032] 2. Operation of the board-related processing machine In the substrate-related operating machine 1, when the substrate 2 is carried into the main body 10 and placed on the conveyor belt of the substrate transport device 20, the transport control section 70b of the control device 70 causes the conveyor belt to rotate and transport the substrate 2 in the transport direction X along the transport path defined by the guide rails 21, 22 to a target stop position. When the substrate 2 is carried into the main body 10, it is transported while being placed on the conveyor belt and is positioned and stopped at the target stop position so that a predetermined portion of the substrate 2 is located at a predetermined position on the transport path.

[0033] The "predetermined portion" in the board 2 may be the center of a main mounting location where components are mounted, or the center of the board 2 in the transport direction. The "predetermined position" on the transport path is a position suitable for the mounting head 44 to mount various components on the board 2 on the transport path. For example, this "predetermined position" may be a position aligned with a sensor that detects the front edge of the board 2 on the transport path, a position aligned with the component camera 60 on the transport path, a position aligned with the center of the board transport device 20 in the transport direction on the transport path, or a position aligned with a main use portion of the component supply device 30 on the transport path. The "target stop position" may be any position in the transport direction depending on the type of board 2 to be transported.

[0034] Before the board 2 is transported to the target stop position as described above, the control device 70 moves the mounting head 44 to which the mark camera 50 is attached, thereby moving the mark camera 50 to match the target stop position of the board 2 (step S100). This movement of the mounting head 44 is performed, for example, so that the center of the image captured by the mark camera 50 (i.e., the center Vc of the camera field of view V) overlaps with the position of the reference mark 2a in a state in which the board 2 is stopped at the target stop position, as shown in FIG.

[0035] Furthermore, when the mark camera 50 is moved as described above, the focus adjustment unit 70a of the control device 70 adjusts the height position of the mark camera 50 so that the mark camera 50 can clearly capture the reference mark 2a of the board 2 being transported (step S110). At this time, the height position of the mark camera 50 is adjusted to a height position Pd such that the focus of the mark camera 50 coincides with the transport height position of the board 2 when the board 2 is transported along the transport path (hereinafter referred to as a first height position H1), as shown in Fig. 3. This adjustment of the height position of the mark camera 50 is achieved by moving the mounting head 44 in the up-down direction Z by the head lifting device 43.

[0036] When the mark camera 50 is adjusted to the height position Pd and starts to be transported along the transport path (step S120), the mark camera 50 starts to capture an image with its camera focus on the substrate 2 at the first height position H1, and a process of recognizing the reference mark 2a in the captured image starts (step S130). These image capturing and recognition processes are repeatedly performed until the substrate 2 reaches the target stop position, and are performed at a predetermined cycle (e.g., 25 milliseconds). For example, the image capturing by the mark camera 50 is performed at a predetermined exposure time (e.g., 5 milliseconds) and a predetermined capture time (e.g., 10 milliseconds). The process of recognizing the reference mark 2a is performed at a predetermined recognition time (e.g., 10 milliseconds).

[0037] 6, immediately before the substrate 2 reaches the target stop position, the reference mark 2a of the substrate 2 enters the camera field of view V of the mark camera 50. When the reference mark 2a enters the camera field of view V, the control device 70 recognizes the reference mark 2a shown in the image captured by the mark camera 50, and detects the position of the reference mark 2a on the captured image.

[0038] When the control device 70 detects the position of the reference mark 2a on the captured image, it calculates the amount of positional deviation (distance) between the position of the reference mark 2a and the center of the captured image (i.e., the center Vc of the camera field of view V) (step S140). This calculation of the amount of positional deviation is performed every time the position of the reference mark 2a is detected. The transport control unit 70b of the control device 70 controls the transport of the substrate 2 by the substrate transport device 20 based on the amount of positional deviation calculated as described above, so that the position of the reference mark 2a on the captured image of the mark camera 50 coincides with the center Vc of the camera field of view V. That is, the transport of the substrate 2 by the substrate transport device 20 is controlled so that the substrate 2 is stopped at the timing when the position of the reference mark 2a on the captured image of the mark camera 50 coincides with the center Vc of the camera field of view V. Note that the above "coincidence" is not limited to perfect coincidence, and may be a concept including a case where the position is within a certain range.

[0039] The center Vc of the camera field of view V of the mark camera 50 is set so as to overlap the position of the reference mark 2a when the substrate 2 is stopped at the target stop position during the transportation of the substrate 2. Therefore, if the position of the reference mark 2a on the image captured by the mark camera 50 coincides with the center Vc of the camera field of view V, the substrate 2 has reached the target stop position. When the substrate 2 has reached the target stop position (positive determination in step S150), the control device 70 stops transportation of the substrate (step S160). After that, the clamp device 24 pushes up the substrate 2 to position it at the clamp position (step S170).

[0040] Furthermore, when the board 2 is positioned as described above, the focus adjustment unit 70a of the control device 70 adjusts the height position of the mark camera 50 so that the mark camera 50 can clearly capture the reference mark 2a of the board 2 (step S180). At this time, the height position of the mark camera 50 is adjusted to a height position Pu such that the focus of the mark camera 50 coincides with the clamp height position (hereinafter referred to as the second height position H2) of the board 2 when the board 2 is positioned at the clamp position and components are mounted thereon, as shown in Fig. 4. This adjustment of the height position of the mark camera 50 is achieved by moving the mounting head 44 in the up-down direction Z by the head lifting device 43.

[0041] When the height position of the mark camera 50 is adjusted to the height position Pu, the mark camera 50 captures the board 2 at the second height position H2 with its camera focus set on the board 2, and performs a recognition process for the reference mark 2a in the captured image. The control device 70 recognizes the reference mark 2a shown in the image captured by the mark camera 50, and detects the position and attitude of the board 2 at the clamp position using the reference mark 2a as the starting point. Then, the component transfer control by the component transfer device 40 is performed using the position and attitude of the board 2 (specifically, position control and attitude control when the suction nozzle 44b mounts a component on the board 2) (step S190).

[0042] In this manner, in the substrate-related performing machine 1 of this embodiment, when the substrate 2 is transported along the transport path in the transport direction X to the target stop position, the reference mark 2a of the substrate 2 is recognized using the mark camera 50 attached to the mounting head 44 before the substrate 2 reaches the target stop position, thereby controlling the transport of the substrate 2 to the target stop position. Specifically, the amount of positional deviation between the position of the reference mark 2a recognized on the image captured by the mark camera 50 and the center of the captured image is calculated, and the transport of the substrate 2 by the substrate transport device 20 is controlled based on the amount of positional deviation so that the substrate 2 is stopped at a timing when the position of the reference mark 2a on the image captured by the mark camera 50 coincides with the center Vc of the camera field of view V.

[0043] During transport of the substrate 2, the height position of the mark camera 50 is adjusted to a height position Pd such that its focus is aligned with the first height position H1, which is the transport height position of the substrate 2. With this configuration, the focus of the mark camera 50 can be aligned with the substrate 2 at the first height position H1 during transport of the substrate 2. Therefore, it is possible to prevent abnormalities caused by out-of-focus recognition of the reference mark 2a using the mark camera 50 during transport of the substrate 2, and this makes it possible to appropriately control the transport of the substrate 2 and accurately stop the substrate 2 at the target stop position.

[0044] In order to stop the substrate 2 at the target stopping position, it is possible to use a sensor to capture the edge of the substrate 2. However, with this configuration, the stopping position of the substrate 2 may deviate from the target stopping position due to the presence of notches or cutouts on the edge of the substrate 2, and the substrate may not be stopped correctly.

[0045] In contrast, according to the configuration of this embodiment, the reference mark 2a attached to the substrate 2 is recognized by the mark camera 50, and transport control of the substrate 2 to the target stopping position is performed, so that the substrate 2 can be stopped correctly at the target stopping position without being affected by the presence of notches or the like provided on the edge of the substrate 2.

[0046] Furthermore, according to the above-described configuration, the reference mark 2a is recognized in real time during transport of the substrate 2, and transport control of the substrate 2 to the target stopping position is performed based on the position of the reference mark 2a, so that the substrate 2 can be stopped at the target stopping position with high accuracy while minimizing loss in transport speed.

[0047] In particular, when the board 2 is transported in the transport direction X along the transport path with components already mounted on the back surface of the board, it is required to stop the board 2 at the target stop position with high accuracy so that the support pins 24b of the clamp device 24 do not interfere with the components on the back surface of the board. Therefore, the transport control of the board 2 to the target stop position may be performed based on the recognition result of the reference mark 2a during the board transport as described above, and further, a camera or an AOI device may be used to inspect the state of the components mounted on the board 2 to detect the mounting positions of the components on the board 2 or to detect the positions of the support pins 24b, and the board 2 may be stopped accurately based on the detection result so that the support pins 24b do not interfere with the components.

[0048] Note that the stop position of the substrate 2 may be corrected by recognizing the position of the reference mark 2a using an image captured by the mark camera 50 again in an unclamped state before the substrate 2 is positioned at the clamped position after the transport is stopped. With this configuration, the substrate 2 can be stopped at the target stop position with even greater accuracy.

[0049] In addition, in the substrate-related performing operation machine 1 of this embodiment, after the substrate 2 reaches the target stop position, the substrate 2 is pushed up and positioned at the clamp position, and the height position of the mark camera 50 is changed from the first height position H1 and adjusted to a height position Pu such that its focus is on the second height position H2, which is the clamp height position of the substrate 2. Then, the reference mark 2a of the substrate 2 is recognized using the image captured by the mark camera 50 in this state, and component transfer control is performed based on the position and attitude of the substrate 2 at the clamp position based on the reference mark 2a.

[0050] According to this configuration, the focus of the mark camera 50 can be adjusted to the substrate 2 at the second height position H2 at the clamp position of the substrate 2. Therefore, it is possible to prevent abnormalities caused by out-of-focus recognition of the reference mark 2a using the mark camera 50 at the clamp position of the substrate 2, and thus it is possible to appropriately control component transfer and transfer components to the substrate 2 with high accuracy.

[0051] The recognition of the reference mark 2a while the substrate 2 is being transported and at the clamping position of the substrate 2 is performed using a common mark camera 50 by changing the height position of the mark camera 50 to height position Pd and height position Pu so that the camera focus is on the substrate 2. For this reason, it is not necessary to use separate cameras to recognize the reference mark 2a while the substrate 2 is being transported and when it is clamped, and the recognition of the reference mark 2a at both timings can be achieved with a simple configuration without increasing the number of cameras, thereby making it possible to use the mark camera 50 more efficiently.

[0052] In the above embodiment, the reference mark 2a corresponds to the "detection object" recited in the claims, and the mark camera 50 corresponds to the "camera" recited in the claims.

[0053] 3. Variations In the above embodiment, the reference mark 2a is recognized in the image captured by the mark camera 50 while the focus of the mark camera 50 is set on the substrate 2 at the first height position H1 during the transportation of the substrate 2, and then the substrate 2 is transported to the target stop position. The transportation speed of the substrate 2 to the target stop position after the recognition of the reference mark 2a is not slowed down compared to the transportation before the recognition of the reference mark 2a. However, the present disclosure is not limited to this, and after the reference mark 2a is recognized during the transportation of the substrate 2, the transportation speed of the substrate 2 may be slowed down compared to the transportation before the recognition.

[0054] According to this modified configuration, compared to a configuration in which the transport speed of the substrate 2 does not change before and after the recognition of the reference mark 2a during transport of the substrate 2, the accuracy in detecting the position of the reference mark 2a on the image captured by the mark camera 50 can be improved, and the substrate 2 can be easily stopped at the target stopping position.

[0055] In the above embodiment, the mark camera 50 is used to detect the reference mark 2a attached to the substrate 2 while the substrate 2 is being transported. Meanwhile, the substrate 2 may be provided with a through-hole or the like having a shape similar to that of the reference mark 2a in addition to the reference mark 2a to be detected on the captured image of the mark camera 50. In this case, if the through-hole or the like is detected as the reference mark 2a, the transport control of the substrate 2 based on the reference mark 2a will not be performed appropriately due to the erroneous detection.

[0056] Therefore, the identification unit 70d of the control device 70 may identify whether the reference mark 2a recognized in the image captured by the mark camera 50 is correct or not. The reference mark 2a attached to the board 2 is a mark that is formed in advance to a predetermined shape and size and is generally made of copper foil or plating. On the other hand, the through hole of the board 2 is a round hole. In this regard, the reference mark 2a and the through hole may have different shapes, and further, different colors or brightness. The reference mark 2a is relatively bright, and the through hole is relatively dark. Therefore, the identification unit 70d may identify whether the reference mark 2a is correct or not by performing a color judgment together with a shape judgment on the image captured by the mark camera 50 that can capture a color image, or by performing a brightness judgment together with a shape judgment.

[0057] Further, a plurality of reference marks 2a are provided on the substrate 2. These reference marks 2a are arranged to be spaced apart from each other by a predetermined distance and to be in a predetermined positional relationship. Specifically, when a detected object that can be recognized as a reference mark 2a is present in the captured image of the mark camera 50, the identification unit 70d may identify whether the detected object is a reference mark 2a or not by determining whether the distance and positional relationship between the detected object and other reference marks 2a are correct when the detected object is considered to be a reference mark 2a.

[0058] According to the configuration of this modified form, it is possible to prevent through-holes or the like that are similar in shape to the reference mark 2a contained in the image captured by the mark camera 50 from being mistakenly detected as the reference mark 2a, and it is possible to appropriately control the transport of the substrate 2 based on the reference mark 2a, thereby enabling the substrate 2 to be correctly stopped at the target stopping position.

[0059] Furthermore, when the control device 70 identifies that a detected object that can be recognized as a reference mark 2a is not a reference mark 2a, it continues transporting the substrate 2 and repeatedly captures images using the mark camera 50 while the substrate 2 is being transported and recognizes the reference mark 2a in the captured images.

[0060] In the above embodiment, the detection object attached to the substrate 2 is a reference mark 2a having a round or square shape, etc. However, the present disclosure is not limited to this, and may be an edge of the substrate 2, a wiring pattern formed on the substrate 2, a one-dimensional or two-dimensional code attached to the surface of the substrate 2, etc.

[0061] In the above embodiment, in order to focus the mark camera 50 on the board 2, the focus adjustment unit 70a adjusts the height position of the mark camera 50, and specifically, the head lifting device 43 moves (raises and lowers) the mounting head 44 to which the mark camera 50 is attached in the up-down direction Z. However, the present disclosure is not limited to this, and in order to focus the mark camera 50, the focus adjustment unit 70a may move the lens of the mark camera 50 relative to the camera body or change the depth of field of the mark camera 50.

[0062] Even in this modified configuration, the focus of the mark camera 50 can be adjusted to the substrate 2 being transported or the substrate 2 at the clamping position by moving the lens of the mark camera 50 or changing the depth of field, so that it is possible to obtain the same effect as that of the above embodiment.

[0063] The present disclosure is not limited to the above-described embodiment and modified examples, and various modifications can be made without departing from the spirit and scope of the present disclosure. [Explanation of symbols]

[0064] 1: substrate-related work machine, 2: substrate, 2a: reference mark, 10: main body, 20: substrate transport device, 24: clamping device, 30: component supply device, 40: component transfer device, 43: head lifting device, 44: mounting head, 50: mark camera, 60: component camera, 70: control device, 70a: focus adjustment unit, 70b: transport control unit, 70c: work execution unit, 70d: identification unit.

Claims

1. A substrate-related operation machine which is at least one of a component mounting machine and a printer that transports a substrate along a transport path to a target stop position and performs a predetermined operation of mounting components on the substrate or performing solder printing on the substrate, A camera that captures an image of a detection target attached to the substrate; a focus adjustment unit that adjusts a focus of the camera to a first height position at which the substrate is transported along the transport path during transport of the substrate; a transport control unit that controls transport of the substrate to the target stop position based on an image captured by the camera during transport of the substrate with the focus adjusted to the first height position; an identification unit that identifies the authenticity of the detection object recognized in a captured image captured by the camera during transportation of the substrate with the focus adjusted to the first height position; and Equipped with The image capturing by the camera and the process of recognizing the detection object in the captured image are repeatedly performed until the substrate reaches the target stop position, When the identification unit identifies the detection object as being incorrect, the transport control unit continues transporting the substrate and repeatedly performs image capture by the camera and recognition processing of the detection object within the captured image during transport of the substrate.

2. the focus adjustment unit adjusts the focus to the first height position during transport of the substrate, and adjusts the focus to a second height position different from the first height position after the substrate reaches the target stop position; the second height position is a height position at which the predetermined operation is performed on the substrate that has been raised or lowered to a clamp position after the substrate has reached the target stop position, 2. The substrate-related operating machine according to claim 1, further comprising an operation execution unit that executes the specified operation on the substrate based on an image captured by the camera with the focus set at the second height position.

3. A substrate-related work machine as described in claim 1 or 2, wherein the transport control unit transports the substrate to the target stopping position so that the position of the detected object on the captured image obtained by the recognition process coincides with a corresponding position of the target stopping position of the substrate.

4. The substrate-related operating machine according to claim 3 , wherein the transport control unit transports the substrate to the target stop position based on a distance from an actual position of the detection object to the corresponding position on the captured image.

5. 5. The substrate-related operating machine according to claim 1, wherein the transport control unit, after recognizing the detection object in the captured image during transport of the substrate by the camera with the focus set at the first height position, reduces the transport speed of the substrate compared to before the recognition.

6. 6. The substrate-related operating machine according to claim 1, wherein the identification unit is configured to identify whether the substrate is correct or not based on a brightness or a shape of an object recognized as the detection target in an image captured by the camera while the substrate is being transported.

7. 7. The substrate-related operating machine according to claim 1, wherein the focus adjustment unit adjusts the focus of the camera by raising and lowering a head to which the camera is attached, by moving a lens of the camera, or by changing the depth of field of the camera.

Images