Work Machine

Abstract

To suitably remove a cover from a carrier on which removable components are placed.SOLUTION: A work machine executes cover removal work to remove a cover mounted on a carrier on which a removable component is not mounted, component mounting work to detachably mount a component on the carrier from which the cover is removed during the cover removal work, and cover mounting work to mount the cover on the carrier on which the component is detachably mounted in the component mounting work, and the cover mounted on the carrier is magnetically prevented from shifting the position where the cover is mounted on the carrier, and the cover mounting position where the cover is mounted on the carrier on which the removable component is not mounted and is different from the cover mounting position where the cover is mounted on the carrier on which the component is removably mounted.SELECTED DRAWING: Figure 15

Description

[Technical field]

[0001] The present invention relates to a work machine for removing a cover from a carrier for carrying a removable part. [Background technology]

[0002] The following Patent Document describes an example of a work machine that removes a cover from a carrier for carrying removable parts. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-272650 A Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present specification is to suitably remove a cover from a carrier for mounting a removable component. [Means for solving the problem]

[0005] In order to solve the above problem, this specification provides a work machine that performs a cover removal operation of removing a cover placed on a carrier on which no removable part is placed, a component placement operation of detachably placing the component on the carrier from which the cover was removed in the cover removal operation, and a cover placement operation of placing the cover on the carrier on which the part is detachably placed in the component placement operation, wherein the cover placed on the carrier is prevented from shifting in its placement position on the carrier by a magnetic force, and a cover placement position at which the cover is placed on a carrier on which no removable part is placed is different from a cover placement position at which the cover is placed on a carrier on which the part is detachably placed. The magnetic force for preventing the displacement of the position of the cover placed on the carrier on which the detachable component is not placed is smaller than the magnetic force for preventing the displacement of the position of the cover placed on the carrier on which the component is detachably placed. A work implement is disclosed. Effect of the Invention

[0006] In the work machine of the present disclosure, a cover placement position where a cover is placed on a carrier on which no detachable parts are placed is different from a cover placement position where a cover is placed on a carrier on which parts are detachably placed. This makes it possible to appropriately remove the cover from the carrier by changing the magnetic force that prevents the cover from shifting from the placement position depending on the cover placement position. [Brief description of the drawings]

[0007] [Figure 1] FIG. 2 is a perspective view showing an electronic component mounting machine. [Diagram 2] FIG. [Diagram 3] FIG. [Figure 4] FIG. 4 is a cross-sectional view taken along line AA in FIG. [Diagram 5] FIG. 4 is a cross-sectional view taken along line BB in FIG. [Figure 6] FIG. [Figure 7] FIG. [Figure 8] FIG. 2 is a block diagram showing a control device. [Figure 9] FIG. [Figure 10] 13 is an operational diagram when the component cover is pushed up by the push-up pin. [Figure 11] 13 is an operational diagram when the component cover is pushed up by the push-up pin. [Figure 12] 13 is an operational diagram when the component cover is pushed up by the push-up pin. [Figure 13] 13 is an operational diagram when the component cover is pushed up by the push-up pin. [Figure 14] FIG. 4 is an enlarged perspective view showing the component cover when placed in a first position on the carrier. [Figure 15] FIG. 4 is a plan view showing the component cover when placed in a first position on the carrier. [Figure 16]FIG. 2 is a cross-sectional view of the carrier with the component cover removed. [Figure 17] FIG. 2 is a perspective view showing a carrier on which an electric component is placed; [Figure 18] FIG. 4 is an enlarged perspective view showing the component cover when placed in a second position on the carrier. [Figure 19] FIG. 4 is a cross-sectional view showing the component cover when placed in a second position on the carrier. [Figure 20] FIG. 13 is a plan view showing the component cover when placed in a second position on the carrier. [Figure 21] FIG. 4 is a cross-sectional view showing the component cover when placed in a second position on the carrier. [Figure 22] FIG. 2 is a plan view showing the carrier with an electrical component and a component cover placed thereon; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

[0009] 1 shows an electronic component mounting machine 10. The electronic component mounting machine 10 is a device for performing the operation of mounting electric components on a carrier. The electronic component mounting machine 10 includes a conveying and holding device 20, a moving device (see FIG. 8) 22, a mounting head 24, a supplying device 26, a parts camera 28, a mark camera (see FIG. 8) 30, a cover mounting stand 34, and a control device (see FIG. 8) 36.

[0010] The transporting and holding device 20 is a device for transporting and holding the carrier 40, which will be described in detail later, and is disposed so as to extend in the X-axis direction at approximately the center of the base 46 in the Y-axis direction. As shown in Figs. 2 to 5, the transporting and holding device 20 has a conveyor device 50 and a holding device 52. Fig. 2 is a view showing the transporting and holding device 20 from an obliquely upward perspective, and Fig. 3 is a view showing the transporting and holding device 20 from an upward perspective. Fig. 4 is a view showing the transporting and holding device 20 from the perspective of line AA in Fig. 3, and Fig. 5 is a view showing the transporting and holding device 20 from the perspective of line BB in Fig. 3.

[0011] The conveyor device 50 has a pair of guide rails 60, 62 and a conveyor belt 66 provided on each of the guide rails 60, 62. The pair of guide rails 60, 62 are disposed parallel to each other, and each of the guide rails 60, 62 is supported on the upper surface of a support plate 72 via a pair of support legs 70. The guide rails 60, 62 are disposed so as to extend in the X-axis direction.

[0012] Two pulleys 74, 76 are disposed on the side of each guide rail 60, 62 with their axes in the Y-axis direction. The two pulleys 74, 76 are disposed at both ends of each guide rail 60, 62. The guide rails 60 and 62 are disposed such that the surfaces on which the pulleys 74, 76 are disposed face each other. A conveyor belt 66 is wound around the pulleys 74, 76 of each guide rail 60, 62, and rotates by the drive of an electromagnetic motor (see FIG. 8) 78.

[0013] The rotation direction of the conveyor belt 66 is a clockwise direction in Fig. 4. Thus, by placing the carrier 40 on the conveyor belt 66, the carrier 40 is transported by the conveyor belt 66 from the side where the pulley 74 is disposed to the side where the pulley 76 is disposed.

[0014] The holding device 52 has a lifting table 80, a plurality of push-up pins 82, a table lifting mechanism 86, and a clamp device 88. The lifting table 80 is generally rectangular and is disposed below the guide rails 60, 62 so as to extend between a pair of support legs 70 of each guide rail 60, 62. A plurality of push-up pins 82 are erected on the upper surface of the lifting table 80. As shown in FIG. 5, each push-up pin 82 is composed of a generally cylindrical main body 90 and a pin 92 extending upward from the upper end surface of the main body 90. The pin 92 is stepped and composed of a large diameter pin 94 extending from the upper end surface of the main body 90 and a small diameter pin 96 extending from the upper end surface of the large diameter pin 94. The lift table 80 is disposed on the upper surface of the support plate 72 via a table lift mechanism 86, and the table lift mechanism 86 raises and lowers the lift table 80 to a predetermined position by driving an electromagnetic motor (see FIG. 8) 98.

[0015] The clamp device 88 also has a pair of clamp bars 100 and a pair of clamp plates 102. The clamp bars 100 are generally plate-shaped, and the length of the clamp bars 100 is longer than the length of the lift table 80 in the X-axis direction. Each of the pair of clamp bars 100 is fixed to the upper surface of the guide rails 60, 62 so that the lift table 80 is located between both ends of each clamp bar 100. In other words, the clamp bars 100 are fixed to the upper surface of the guide rails 60, 62 so that the lift table 80 extends below the clamp bars 100. The clamp bars 100 are fixed to the upper surface of the guide rails 60, 62 so that the clamp bars 100 extend above the conveyor belt 66 disposed on the guide rails 60, 62.

[0016] The clamp plate 102 is generally rectangular, and the length of the clamp plate 102 in the longitudinal direction is approximately the same as the length of the clamp bar 100. The clamp plate 102 extends in the same direction as the clamp bar 100 below the clamp bar 100, which extends above the conveyor belt 66, and is held by the guide rails 60, 62 in an upright position so as to be slidable in the vertical direction. That is, a holder 108 is disposed on the side surface of the guide rails 60, 62 on the side where the conveyor belt 66 is disposed. Then, with the side surfaces of the guide rails 60, 62 and the clamp plate 102 facing each other, the clamp plate 102 is held by the holder 108 below the clamp bar 100 so as to be slidable in the vertical direction.

[0017] When the clamp plate 102, which is held by the guide rails 60, 62 so that it can slide vertically, slides all the way down, as shown in FIG. 5, the upper end of the clamp plate 102 is positioned below the upper surface of the conveyor belt 66, and the lower end of the clamp plate 102 is positioned above the upper surface of the lift table 80 when not raised.

[0018] With this structure, in the conveying and holding device 20, the carrier 40 conveyed by the conveyor device 50 is held by the holding device 52. The conveying and holding device 20 also has a suction device 110. The suction device 110 is fixed to the side surface of the clamp plate 102, and the upper and lower ends of the suction device 110 are at the same height as the upper and lower ends of the clamp plate 102. The suction device 110 sucks the electric components placed on the carrier 40 from the lower surface side of the carrier 40 held by the holding device 52.

[0019] More specifically, as shown in FIG. 6, the carrier 40 has a generally rectangular flat plate shape, and is formed with a plurality of component placement sections 116 for placing electric components (see FIG. 17) 112 thereon. Each of the component placement sections 116 is formed with a plurality of through holes 118 that penetrate in the vertical direction. As will be described in detail later, when the lift table 80 rises, the suction device 110 also rises, and the upper surface of the suction device 110 comes into contact with the carrier 40. At this time, when the carrier 40 is in the position held by the holding device 52, the suction device 110 communicates with each of the multiple through holes 118 of the carrier 40 from the underside of the carrier 40. As a result, the electric components 112 placed on the carrier 40 are sucked by the suction device 110 from the underside of the carrier 40.

[0020] Furthermore, a plurality of magnets 120 are embedded in the upper surface of the carrier 40 around the plurality of component placement sections 116. A component cover (see FIG. 9) 122, which will be described in detail later, is detachably fixed to the carrier 40 by the magnets 120. Furthermore, a plurality of insertion holes 126 are formed in the carrier 40. The plurality of insertion holes 126 are formed corresponding to the push-up pins 82 placed on the lift table 80 of the holding device 52, and the inner diameter of the insertion holes 126 is made larger than the outer diameter of the large diameter pins 94 of the push-up pins 82. This makes it possible to insert the large diameter pins 94 of the push-up pins 82 into the insertion holes 126 of the carrier 40.

[0021] The moving device 22 also has a slider (not shown) to which the mounting head 24 is attached, an X-axis direction slide mechanism (not shown), and a Y-axis direction slide mechanism (not shown). The X-axis direction slide mechanism moves the slider in the X-axis direction by operation of an electromagnetic motor (see FIG. 8) 130, and the Y-axis direction slide mechanism moves the slider in the Y-axis direction by operation of an electromagnetic motor (see FIG. 8) 132. As a result, the mounting head 24 is moved to an arbitrary position on the base 46 by the moving device 22.

[0022] The mounting head 24 mounts the electric component 112 and has a suction nozzle 140 provided on the lower end surface. The suction nozzle 140 is described in Japanese Patent Application No. 2016-552779 filed by the applicant prior to the present application, so to briefly explain, as shown in FIG. 7, a suction pad 144 is held at the lower end of a generally cylindrical housing 142 so as to be movable in the vertical direction. The suction pad 144 is made of an elastically deformable material, and the lower end of the suction pad 144 is trumpet-shaped. The inside of the suction pad 144 is hollow, and the hollow inside of the suction pad 144 is connected to a positive and negative pressure supply device (see FIG. 8) 148 via an air passage 146. The positive and negative pressure supply device 148 supplies negative pressure to the air passage 146, so that the electric component 112 is sucked and held by the suction pad 144. The supply of negative pressure to the air passage 146 causes the suction pad 144 to move upward. At this time, the outer edge of the suction pad 144 is supported at the lower end by the housing 142. This suppresses elastic deformation of the suction pad 144 when the EC 112 is suctioned and held, and ensures that the EC 112 is suctioned and held by the suction pad 144. Then, a slight positive pressure is supplied to the air passage 146 by the positive / negative pressure supply device 148, so that the EC 112 is released from the suction pad 144 and the EC 112 is released. The mounting head 24 also has a nozzle lifting device (see FIG. 8) 150 that lifts and lowers the suction nozzle 140, and the nozzle lifting device 150 allows the mounting head 24 to change the vertical position of the EC 112 it holds. The suction nozzle 140 is detachable from the mounting head 24 in a one-touch position, and can be replaced with a different type of suction nozzle. The term "attachable and detachable with one touch" means that the operator can attach and detach the suction nozzle without using any tools.

[0023] 1, supply device 26 is disposed at the end of electronic component mounting machine 10 in the Y-axis direction, and supplies electrical components 112 placed on trays 156 to mounting head 24. Supply device 26 has a tray storage (not shown) and a tray moving device 158. A plurality of trays 156 are stored in the tray storage. Trays 156 stored in the tray storage are pulled out to a component supply position (the position in FIG. 1 where trays 156 are shown) by operation of tray moving device 158, and components are supplied from tray 156 to mounting head 24 at the component supply position.

[0024] Part camera 28 is disposed next to supply device 26 on base 46 facing upward on a vertical line. This allows part camera 28 to capture an image of electrical component 112 held by suction nozzle 140 by moving mounting head 24 above part camera 28. Mark camera 30 is fixed to a slider on which mounting head 24 of moving device 22 is attached facing downward on a vertical line, and can be moved to any position by operation of moving device 22. This allows mark camera 30 to capture an image of any position on base 46.

[0025] The cover placement table 34 is disposed so as to face the supply device 26 across the conveying and holding device 20. The cover placement table 34 has a flat plate shape, and its upper surface is provided with space on which three component covers 122 can be placed without overlapping.

[0026] 8, the control device 36 includes a controller 160 and a plurality of drive circuits 162. The plurality of drive circuits 162 are connected to the electromagnetic motors 78, 98, 130, 132, the suction device 110, the positive and negative pressure supply device 148, the nozzle lifting device 150, and the tray moving device 158. The controller 160 includes a CPU, a ROM, a RAM, and the like, and is mainly a computer, and is connected to the plurality of drive circuits 162. As a result, the controller 160 controls the operation of the conveying and holding device 20, the moving device 22, and the like. The controller 160 is also connected to an image processing device 166. The image processing device 166 is a device for processing the image data captured by the parts camera 28 and the mark camera 30. As a result, the controller 160 acquires various information from the image data.

[0027] In the electronic component mounting machine 10, with the above-mentioned configuration, the carrier 40 on which the electric component 112 is not placed on the component placement section 116 is carried in by the conveyor device 50 with the component cover 122 placed thereon. Then, the component cover 122 is removed from the carrier 40 by the suction nozzle 140 of the mounting head 24, and the electric component 112 is mounted on the component placement section 116 of the carrier 40 from which the component cover 122 has been removed by the suction nozzle 140 of the mounting head 24. Thereafter, when the mounting operation of the electric component 112 is completed, the component cover 122 is again placed on the carrier 40 on which the electric component 112 has been mounted by the suction nozzle 140 of the mounting head 24, and the carrier 40 is carried out by the conveyor device 50. Note that the component placement section 116 of the carrier 40 is for placing the electric component 112, and the electric component 112 is simply placed on the component placement section 116. In other words, the electric components 112 mounted on the component mounting portion 116 are detachable without being fixed to the component mounting portion 116. For this reason, the mounting operation of the electric components 112 on the component mounting portion 116 by the mounting head 24 is an operation of detachably mounting the electric components 112 on the component mounting portion 116, and can also be said to be an operation of placing the electric components 112 on the component mounting portion 116.

[0028] Specifically, as shown in Fig. 9, component cover 122 has a generally rectangular flat plate shape, and the outer dimensions of component cover 122 are slightly smaller than the outer dimensions of carrier 40. For this reason, component cover 122 is placed on the upper surface of carrier 40. Note that although the shape of component cover 122 shown in Fig. 9 differs from the shape of component cover 122 shown in Fig. 1, the following description will be given using component cover 122 shown in Fig. 9.

[0029] A plurality of component exposing holes 170 are formed in the component cover 122 at positions corresponding to the plurality of component mounting portions 116 of the carrier 40. The component exposing holes 170 are smaller than the electrical components 112 to be mounted on the carrier 40. The component cover 122 is then placed on the carrier 40 on which no electrical components 112 are mounted, so that the component mounting portions 116 are exposed through the component exposing holes 170.

[0030] In addition, the component cover 122 is also formed with a plurality of positioning holes 172 at positions corresponding to the plurality of insertion holes 126 of the carrier 40 when the component cover 122 is placed on the carrier 40. Therefore, as shown in Fig. 5, the component cover 122 is positioned and placed on the carrier 40 so that the insertion holes 126 of the carrier 40 and the positioning holes 172 of the component cover 122 communicate with each other in the vertical direction. The inner diameter of the positioning holes 172 is larger than the outer diameter of the small diameter pin 96 of the push-up pin 82, but smaller than the large diameter pin 94 of the push-up pin 82. In addition, the component cover 122 is formed of a magnetic material such as steel, and is fixed by the magnetic force of the magnets 120 embedded in the upper surface of the carrier 40, preventing the component cover 122 from shifting out of position.

[0031] The magnetic force of magnet 120 is a force generated between magnet 120 and a magnetic body, which attracts magnet 120 and the magnetic body to each other. In other words, magnetic force includes a force that attracts two or more objects to each other (attractive force) and a force that repels two or more objects to each other (repulsive force), and an attractive force is generated between the magnet and the magnetic body, which attracts the magnetic body and the magnet to each other. As a result, component cover 122 is fixed to the upper surface of carrier 40 by the magnetic force of magnet 120, and displacement of component cover 122 is prevented.

[0032] In this manner, carrier 40 with component cover 122 placed thereon and no electric components 112 mounted thereon is carried into electronic component mounting machine 10. Then, in response to a command from controller 160, carrier 40 is transported by conveyor device 50 to the working position, where it is fixedly held by holding device 52.

[0033] Specifically, the carrier 40 is carried into the electronic component mounting machine 10 and is transported to a predetermined work position by the conveyor device 50. When the carrier 40 is transported to the work position, both edges of the carrier 40 placed on the conveyor belt 66 of the conveyor device 50 are positioned between the clamp bar 100 and the clamp plate 102 in the vertical direction as shown in FIG. 5. When the carrier 40 is transported by the conveyor device 50, the lift table 80 is lowered, and therefore the push-up pins 82 placed on the lift-up table 80 are also lowered. Therefore, the upper ends of the push-up pins 82 are positioned below the bottom surface of the carrier 40 transported by the conveyor device 50, thereby ensuring the transport of the carrier 40.

[0034] Next, when the carrier 40 is transported to the work position, the lift table 80 is lifted by the operation of the table lift mechanism 86. The push-up pin 82 is disposed on the upper surface of the lift table 80 so as to overlap the insertion hole 126 formed in the carrier 40 in the vertical direction. As described above, the component cover 122 is placed on the carrier 40 so that the positioning hole 172 communicates with the insertion hole 126 in the vertical direction. Therefore, as the lift table 80 is lifted, as shown in FIG. 10, the large diameter pin 94 of the push-up pin 82 is inserted into the insertion hole 126 of the carrier 40, and the small diameter pin 96 of the push-up pin 82 is inserted into the positioning hole 172 of the component cover 122. At this time, since the inner diameter of the positioning hole 172 is smaller than the outer diameter of the large diameter pin 94 of the push-up pin 82, the component cover 122 is pushed upward by the large diameter pin 94 of the push-up pin 82.

[0035] As a result, the component cover 122 that was fixed to the top of the carrier 40 by the magnetic force of the magnet 120 moves upward away from the top surface of the carrier 40, as shown in Fig. 11. Note that a plurality of push-up pins 82 are arranged on the top surface of the lift-up table 80, and as the lift-up table 80 rises, the large diameter pins 94 of the plurality of push-up pins 82 simultaneously insert into the plurality of insertion holes 126 of the carrier 40, and the large diameter pins 94 of the push-up pins 82 simultaneously push up the component cover 122. As a result, the component cover 122 moves upward away from the top surface of the carrier 40 while being parallel to the carrier 40, while being positioned by the small diameter pins of the plurality of push-up pins 82.

[0036] As the lift table 80 rises, the lower end of the clamp plate 102 and the lower end of the suction device 110 come into contact with the upper surface of the lift table 80, and the clamp plate 102 and the suction device 110 also rise. As the clamp plate 102 and the suction device 110 rise, the upper end of the clamp plate 102 and the upper end of the suction device 110 come into contact with the lower surface of the carrier 40 supported by the conveyor belt 66. As the lift table 80 further rises, the carrier 40 supported by the conveyor belt 66 is lifted from the conveyor belt 66 by the clamp plate 102 and the suction device 110 and rises. At this time, as shown in FIG. 12, the lift table 80 rises to a position where the upper surface of the carrier 40 comes into contact with the lower surface of the clamp bar 100, and the carrier 40 is lifted by the clamp plate 102 and the suction device 110. As a result, the carrier 40 is sandwiched at both edges by the clamp bar 100 and the clamp plate 102. At this time, the suction device 110 is in close contact with the lower surface of the carrier 40 and communicates with the multiple through holes 118 of the carrier 40 as described above. That is, in the holding device 52, as the lift table 80 rises, the component cover 122 fixed to the upper surface of the carrier 40 by the magnetic force of the magnets 120 is pushed up by the push-up pins 82 and separated from the carrier 40, and the carrier 40, which has been released from the magnetic fixation of the component cover 122, is clamped by the clamp bar 100 and the clamp plate 102.

[0037] In the above description, as shown in FIG. 11, the large-diameter pin 94 of the push-up pin 82 pushes up the component cover 122, so that the component cover 122 is separated from the upper surface of the carrier 40. However, as shown in FIG. 6, the carrier 40 has a plurality of magnets 120 disposed around a plurality of component placement sections 116. Specifically, for example, seven magnets 120a-g are embedded around the component placement section 116a, and 40 to 50 magnets 120 are embedded throughout the carrier 40. For this reason, the force of attraction between the carrier 40 and the component cover 122 by the magnets 120 is strong, so that even if the large-diameter pin 94 of the push-up pin 82 pushes up the component cover 122, the component cover 122 may not be separated from the carrier 40, and may be lifted upward by the push-up pin 82 in a state in which the component cover 122 and the carrier 40 are fixed to each other by the magnets 120, as shown in FIG. 13. In such a case, the component cover 122 and the carrier 40 fixed by the magnet 120 are lifted, and the upper surface of the carrier 40 comes into contact with the clamp bar 100. Then, with the upper surface of the carrier 40 in contact with the clamp bar 100, the lift table 80 is lifted, and the component cover 122 is pushed up by the large diameter pin 94 of the push-up pin 82. At this time, the lift of the carrier 40 is restricted by the clamp bar 100, so that only the component cover 122 is lifted by the push-up pin 82, and the component cover 122 is separated from the upper surface of the carrier 40 as shown in FIG. 12. However, when the component cover 122 and the carrier 40 are separated, the carrier 40 is separated from the component cover 122 and falls to the upper end of the clamp plate 102 or the like. At this time, a falling sound is generated, which is undesirable. In addition, there is a concern that the carrier 40 may be damaged or worn out as the carrier 40 falls.

[0038] In view of this, when the carrier 40 is carried into the electronic component mounting machine 10, the component cover 122 is placed on the carrier 40 such that only some of the magnets 120 embedded in the carrier 40 come into contact with the component cover 122. More specifically, as shown in FIG. 6, a plurality of convex portions 180 are formed in the center of the carrier 40 in a line in the longitudinal direction. Meanwhile, as shown in FIG. 9, a plurality of first positioning holes 182 are formed in the center of the component cover 122 in a line in the longitudinal direction at positions corresponding to the plurality of convex portions 180 of the carrier 40. The inner diameter of the first positioning holes 182 is slightly larger than the outer diameter of the convex portions 180. The component cover 122 is placed on the carrier 40 such that each of the plurality of convex portions 180 fits into each of the plurality of first positioning holes 182. The position where the component cover 122 is placed on the carrier 40 such that each of the plurality of convex portions 180 fits into each of the plurality of first positioning holes 182 is referred to as the first position of the carrier 40.

[0039] When the component cover 122 is placed at the first position of the carrier 40 in this manner, as shown in Fig. 14, the insertion hole 126 of the carrier 40 and the positioning hole 172 of the component cover 122 communicate with each other. Also, as shown in Fig. 9, the component cover 122 has magnet exposure holes 190a, b, d formed at positions corresponding to the magnets 120a, b, d embedded around the component mounting portion 116a of the carrier 40 when the component cover 122 is placed at the first position of the carrier 40. Also, the component exposure hole 170 of the component cover 122 has notched holes 192e, f, g formed at positions corresponding to the magnets 120e, f, g embedded around the component mounting portion 116a of the carrier 40 when the component cover 122 is placed at the first position of the carrier 40. When component cover 122 having magnet exposure hole 190 and cutout hole 192 formed therein is placed in the first position of carrier 40, magnets 120a, b, d are exposed from magnet exposure holes 190a, b, d, and magnets 120e, f, g are exposed from cutout holes 192e, f, g, as shown in Fig. 15. Magnets 120a, b, d are entirely exposed from magnet exposure holes 190a, b, d, and magnets 120a, b, d are partially exposed from cutout holes 192e, f, g.

[0040] For this reason, when the component cover 122 is placed at the first position of the carrier 40, of the magnets 120a-g embedded around the component mounting portion 116a of the carrier 40, only 120c is in overall contact with the component cover 122, and the magnets 120a, b, d are in partial contact with the component cover 122. Furthermore, the component cover 122 has magnet exposure holes 190 and cutout holes 192 formed at positions corresponding to the magnets 120 embedded around the component mounting portions 116 other than the component mounting portion 116a of the carrier 40, and most of the magnets 120 embedded around the component mounting portions 116 other than the component mounting portion 116a are exposed from the magnet exposure holes 190 and the cutout holes 192.

[0041] In this way, when most of the magnets 120 embedded in the carrier 40 are exposed from the magnet exposure holes 190 and the notched holes 192, the force with which the magnets 120 attract the component cover 122 to the carrier 40, i.e., the magnetic force of the magnets 120, is very small. Therefore, when the component cover 122 is placed in the first position of the carrier 40, the large diameter pins 94 of the push-up pins 82 are inserted into the insertion holes 126 of the carrier 40 as the lift table 80 rises, and the large diameter pins 94 of the push-up pins 82 push up the component cover 122, thereby allowing the component cover 122 to be appropriately lifted from the upper surface of the carrier 40. This makes it possible to prevent the component cover 122 from falling or to reduce the amount of fall when the component cover 122 is lifted by the push-up pins 82, thereby preventing the generation of falling noise and damage to the component cover 122 due to falling. In addition, some of the magnets 120 that are in contact with the component cover 122 among the multiple magnet exposure holes 190 embedded in the carrier 40 prevent the component cover 122 from shifting out of position on the upper surface of the carrier 40 when the carrier 40 is loaded into the electronic component mounting machine 10.

[0042] That is, the component cover 122 is placed at the first position of the carrier 40 without any components outside the electronic component mounting machine 10, and the carrier 40 is carried into the electronic component mounting machine 10, thereby preventing the component cover 122 from being displaced from the upper surface of the carrier 40 when carried in. The carrier 40 carried into the electronic component mounting machine 10 is then transported to the working position, and the lift table 80 is raised at the working position, so that the component cover 122 placed at the first position of the carrier 40 can be appropriately lifted from the upper surface of the carrier 40 by the push-up pin 82. Note that, outside the electronic component mounting machine 10, a worker may place the component cover 122 at the first position of the carrier 40 without any components, and the carrier 40 may be carried into the electronic component mounting machine 10. Alternatively, a working machine disposed upstream of the electronic component mounting machine 10 may place the component cover 122 at the first position of the carrier 40 without any components, and the carrier 40 may be carried into the electronic component mounting machine 10.

[0043] In this manner, when the component cover 122 is lifted from the upper surface of the carrier 40 carried into the electronic component mounting machine 10 by the lifting of the lifting table 80, as described above, the lifting table 80 further rises, causing the clamp plate 102 to also rise, and the carrier 40 with the component cover 122 lifted from the upper surface is clamped by the clamp bar 100 and the clamp plate 102. Then, when the carrier 40 is clamped by the clamp bar 100 and the clamp plate 102, the through hole 118 formed in the carrier 40 and the suction device 110 communicate with each other, and the suction device 110 is activated to suck air through the through hole 118.

[0044] Further, the mounting head 24 moves above the carrier 40 in response to a command from the controller 160, and the component cover 122 lifted from the upper surface of the carrier 40 is sucked and held by the suction nozzle 140. Then, the component cover 122 held by the suction nozzle 140 is transferred from above the carrier 40 onto the cover placement table 34 by the operation of the moving device 22. That is, the component cover 122 is lifted by the mounting head 24 and transported from above the carrier 40 onto the cover placement table 34. In this way, the component cover 122 is lifted from the upper surface of the carrier 40 by the lifting of the lift table 80, and the component cover 122 lifted from the upper surface of the carrier 40 is transferred onto the cover placement table 34 by the operation of the moving device 22 and the mounting head 24. That is, the operation of the lift table 80, the moving device 22, and the mounting head 24 performs the operation of removing the component cover 122 placed on the upper surface of the carrier 40.

[0045] Note that even after the component cover 122 has been removed, the clamping of the carrier 40 by the clamp device 88 continues, so the lift table 80 is maintained in the raised state. Therefore, after the component cover 122 has been removed, the upper ends of the pins 92 of the push-up pins 82 of the carrier 40 clamped by the clamp device 88 extend upward from the insertion holes 126, as shown in FIG.

[0046] Subsequently, when the operation of removing the component cover 122 is performed, the mark camera 30, in response to a command from the controller 160, moves to above the carrier 40 from which the component cover 122 has been removed, and captures an image of the carrier 40. This allows the controller 160 to analyze the captured image data, and obtain information regarding the clamp position of the carrier 40, etc. In the supply device 26, in response to a command from the controller 160, the tray 156 on which the electrical components 112 are placed is pulled out to the component supply position by the operation of the tray moving device 158.

[0047] Then, in response to a command from the controller 160, the mounting head 24 moves to above the tray 156, which is the component supply position, and sucks and holds the electrical component 112 with the suction nozzle 140. After the component cover 122 is held by the suction nozzle 140 and transferred from the carrier 40 onto the cover mounting table 34, the suction nozzle 140 attached to the mounting head 24 holds the electrical component 112 without being replaced. In other words, the electrical component 112 and the component cover 122 are each held by the same suction nozzle 140 attached to the mounting head 24.

[0048] Next, the mounting head 24 moves above the part camera 28 in response to a command from the controller 160, and the part camera 28 captures an image of the electrical component 112 held by the suction nozzle 140. This allows the controller 160 to analyze the captured image data, and obtain information on the component's holding posture, holding position, etc. Then, in response to a command from the controller 160, the mounting head 24 moves above the carrier 40, corrects the holding position of the carrier 40, the holding posture of the electrical component 112, etc., and mounts the electrical component 112 on the component placement section 116 of the carrier 40, as shown in FIG. 17. At this time, in the component placement section 116, the through-hole 1 As air is sucked in from 18, the EC 112 mounted on the EC placement section 116 is fixed in place by the air sucking, preventing it from shifting out of position. In other words, after the removal operation has been performed, the moving device 22 and the mounting head 24 are operated to perform the EC mounting operation of mounting the EC 112 on the carrier 40 from which the EC cover 122 has been removed.

[0049] Then, when the component mounting operation on the carrier 40 is completed, the component cover 122 transferred onto the cover mounting stand 34 is returned onto the carrier 40. That is, the component cover 122 transferred onto the cover mounting stand 34 in the removal operation is placed on the upper surface of the carrier 40 on which the electric components 112 have been mounted in the component mounting operation and are in a state where the electric components are present. At this time, when the component cover 122 is placed on the first position of the carrier 40, as described above, most of the multiple magnets 120 embedded in the carrier 40 are exposed from the magnet exposure holes 190 and the cutout holes 192 of the component cover 122, so that the component cover 122 is placed on the upper surface of the carrier 40 with the magnetic force of the magnets 120 being weak. In this way, when the component cover 122 is placed on the upper surface of the carrier 40 with the magnetic force of the magnets 120 being weak, the electric components 112 mounted on the upper surface of the carrier 40 cannot be appropriately held by the component cover 122.

[0050] That is, in a state where the carrier 40 is clamped by the clamp device 88, as described above, the suction of air by the suction device 110 prevents the electric components 112 from being displaced. However, when the carrier 40 is carried out of the electronic component mounting machine 10, the clamping of the carrier 40 by the clamp device 88 is released as a matter of course. Then, accompanying the release of the clamping of the carrier 40 by the clamp device 88, the suction of air by the suction device 110 is also released, as described below. Therefore, in a state where the suction of air by the suction device 110 is released, in order to prevent the electric components 112 mounted on the carrier 40 from being displaced, a component cover 122 is placed on the upper surface of the carrier 40 on which the electric components 112 are mounted. However, if the component cover 122 is placed on the upper surface of the carrier 40 in a state where the magnetic force of the magnet 120 is weak, the electric components 112 mounted on the carrier 40 cannot be appropriately held by the component cover 122, and there is a risk that the electric components 112 may be displaced.

[0051] Therefore, when the component cover 122 is placed on the upper surface of the carrier 40 in a state where the electric components 112 are present, the component cover 122 is placed at a position (hereinafter, referred to as the "second position") different from the first position of the carrier 40. More specifically, as shown in FIG. 9, the component cover 122 has a plurality of second positioning holes 200 formed therein so as to be aligned next to the plurality of first positioning holes 182. The formation pitch of the plurality of second positioning holes 200 is the same as the formation pitch of the plurality of first positioning holes 182. The inner diameter of the second positioning holes 200 is the same as the inner diameter of the first positioning holes 182. Therefore, the component cover 122 can be placed on the upper surface of the carrier 40 so that the plurality of second positioning holes 200 of the component cover 122 fit the plurality of convex portions 180 of the carrier 40. The position where the component cover 122 is placed on the carrier 40 so that the plurality of convex portions 180 fit the plurality of second positioning holes 200 is the second position of the carrier 40.

[0052] Further, the component cover 122 has an insertion hole 202 formed at a position corresponding to the insertion hole 126 of the carrier 40 when the component cover 122 is placed at the second position of the carrier 40. The inner diameter of the insertion hole 202 of the component cover 122 is the same as the inner diameter of the insertion hole 126 of the carrier 40. Due to the space required for forming the insertion hole 202 in the component cover 122, the edge of the insertion hole 202 and the edge of the positioning hole 172 are in contact with each other, and the insertion hole 202 and the positioning hole 172 are connected to each other at their edges. When the component cover 122 is placed at the second position of the carrier 40, that is, when the component cover 122 is placed on the upper surface of the carrier 40 so that the convex portion 180 of the carrier 40 fits into the second positioning hole 200, the insertion hole 126 of the carrier 40 and the insertion hole 202 of the component cover 122 communicate with each other as shown in FIG. 18. The inner diameter of the insertion hole 202 of the component cover 122 is the same as the inner diameter of the insertion hole 126 of the carrier 40. Therefore, the insertion holes 126 and the insertion holes 202 communicate with each other while generally coinciding in the up-down direction. Therefore, as described above, in the carrier 40 clamped by the clamp device 88, the upper end portion of the pin 92 of the push-up pin 82 protrudes from the insertion hole 126 as shown in Fig. 16, but when the component cover 122 is placed in the second position of the carrier 40, the upper end portion of the pin 92 protruding from the insertion hole 126 of the carrier 40 is inserted into the insertion hole 202 of the component cover 122 as shown in Fig. 19. This allows the component cover 122 to be placed in the second position of the carrier 40 clamped by the clamp device 88 without interfering with the pin 92 of the push-up pin 82.

[0053] Therefore, when the component mounting work is completed, the mark camera 30, in response to a command from the controller 160, moves above the carrier 40 on which the electric components 112 are mounted, and captures an image of the carrier 40. As a result, the controller 160 analyzes the captured image data, and obtains information regarding the position of the protrusion 180 of the carrier 40. In addition, the mounting head 24, in response to a command from the controller 160, moves above the cover mounting table 34, and the component cover 122 placed on the cover mounting table 34 is sucked and held by the suction nozzle 140. Next, the mounting head 24, in response to a command from the controller 160, moves above the part camera 28, and the part camera 28 captures an image of the component cover 122 held by the suction nozzle 140. As a result, the controller 160 analyzes the captured image data, and obtains information regarding the position of the second positioning hole 200 of the component cover 122 held by the suction nozzle 140. Then, the mounting head 24 moves above the carrier 40 in response to a command from the controller 160, and places the held component cover 122 at a second position on the carrier 40. That is, based on information regarding the positions of the convex portion 180 and the second positioning hole 200 obtained from the imaging data, the moving device 22 and the mounting head 24 are controlled so that the convex portion 180 enters the second positioning hole 200, thereby placing the component cover 122 at the second position on the carrier 40. That is, the cover placing operation of placing the component cover 122 at the second position on the carrier 40 in the state where the electric component 112 is present is performed by the operation of the moving device 22 and the mounting head 24.

[0054] In this way, when the component cover 122 is placed at the second position of the carrier 40, that is, when the component cover 122 is placed at a position shifted from the first position, the positions of the magnet exposure holes 190 and the cutout holes 192 of the component cover 122 are shifted relatively to the positions of the magnets 120 of the carrier 40. Therefore, as shown in FIG. 20, the magnets 120 of the carrier 40 are not exposed in all of the magnet exposure holes 190 and the cutout holes 192 of the component cover 122. In other words, when the component cover 122 is placed at the second position of the carrier 40, the component cover 122 is present above all of the magnets 120 of the carrier 40. In this way, when all of the magnets 120 of the carrier 40 are in contact with the component cover 122, the force with which the magnet 120 attracts the component cover 122 to the carrier 40, that is, the magnetic force of the magnet 120, is relatively strong. Furthermore, in a state where the component cover 122 is placed at the second position of the carrier 40, the center of the electric component 112 attached to the carrier 40 is exposed through the component exposing hole 170, but the outer edge of the electric component 112 is covered by the component cover 122. That is, the outer edge of the electric component 112 attached to the carrier 40 is pressed by the edge that defines the component exposing hole 170 of the component cover 122. Therefore, compared to the case where the component cover is placed at the first position of the carrier, the electric component 112 attached to the carrier 40 can be pressed with a stronger force by the component cover 122. In this way, by performing the cover placing operation of placing the component cover 122 at the second position of the carrier 40 with the electric component 112 present, the strong magnetic force of the magnet 120 can appropriately prevent the electric component 112 from being displaced.

[0055] When the cover placement operation is completed, the lift table 80 is lowered by the operation of the table lift mechanism 86. At this time, the clamp plate 102 is lowered, and the clamp of the carrier 40 by the clamp bar 100 and the clamp plate 102 is released. In addition, the push-up pin 82 is also lowered, so that the upper end of the pin 92 of the push-up pin 82 is inserted into the insertion hole 20 of the component cover 122. 2 and is pulled out downward from the insertion hole 126 of the carrier 40. As the lift-up table 80 descends, the suction of the electric components 112 by the suction device 110 is released. Then, as the lift-up table 80 descends further, the carrier 40 with the component cover 122 placed thereon is placed on the conveyor belt 66, as shown in Fig. 21. As a result, the conveyor belt 66 is operated to carry out the carrier 40 with the electric components 112 mounted thereon, i.e., the carrier 40 with the component cover 122 placed thereon and with the electric components 112 present, from the electronic component mounting machine 10.

[0056] Note that carrier 40 carried out from electronic component mounting machine 10 is carried into, for example, a different electronic component mounting machine located downstream of electronic component mounting machine 10, and another type of electric component 210 is mounted on electric component 112 through component exposure hole 170 of component cover 122 placed on carrier 40, as shown in Fig. 22. In this way, a product constituted by electric components 112 and 210 is manufactured.

[0057] In this way, in the electronic component mounting machine 10, the placement position (first position) of the component cover 122 when the carrier 40 is carried in is different from the placement position (second position) of the component cover 122 when the carrier 40 is carried out. In other words, the placement position (first position) of the component cover 122 on the carrier 40 when there is no electric component 112 is different from the placement position (second position) of the component cover 122 on the carrier 40 when there is an electric component 112. In other words, the placement position (first position) of the component cover 122 on the carrier 40 before the removal operation is performed in the electronic component mounting machine 10 is different from the placement position (second position) of the component cover 122 on the carrier 40 when the cover placement operation is performed. In this way, by differentiating the position (first position) of the component cover 122 on the carrier 40 before the removal operation is performed and the position (second position) of the component cover 122 on the carrier 40 when the cover placement operation is performed, it is possible to achieve both proper execution of the removal operation and prevention of component displacement due to the component cover 122 placed on the carrier 40 by the cover placement operation.

[0058] More specifically, for example, if the only objective is to perform a proper removal operation, that is, to separate the component cover 122 from the carrier 40 with the component cover 122 placed thereon by the push-up pin 82, a magnet with a small magnetic force may be embedded in the carrier 40. However, a magnet with a small magnetic force cannot properly prevent the component from being displaced due to the component cover 122 placed on the carrier 40 by the cover placement operation. On the other hand, if the only objective is to prevent the component from being displaced due to the component cover 122 placed on the carrier 40 by the cover placement operation, a magnet with a strong magnetic force may be embedded in the carrier 40. However, with a magnet with a strong magnetic force, as shown in FIG. 13, the carrier 40 and the component cover 122 placed on the carrier 40 are lifted together by the push-up pin 82 during the removal operation, which may cause the carrier 40 to fall, and may prevent the removal operation from being performed properly.

[0059] In view of this, the component cover 122 is placed at the first position of the carrier 40 before the removal operation is performed, thereby reducing the force with which the magnet attracts the component cover 122 to the carrier 40. On the other hand, the component cover 122 is placed at the second position of the carrier 40 when the cover placement operation is performed, thereby increasing the force with which the magnet attracts the component cover 122 to the carrier 40. In other words, before the removal operation is performed, the component cover 122 is placed at the first position of the carrier 40 where the magnetic force of the magnet is weak, and when the cover placement operation is performed, the component cover 122 is placed at the second position of the carrier 40 where the magnetic force of the magnet is strong. This makes it possible to achieve both appropriate removal operation and prevention of displacement of the component caused by the component cover 122 placed on the carrier 40 by the cover placement operation.

[0060] In the above embodiment, the electronic component mounting machine 10 is an example of a work machine. The carrier 40 is an example of a carrier. The electric component 112 is an example of a component. The magnet 120 is an example of a magnet. The component cover 122 is an example of a cover.

[0061] The present invention is not limited to the above embodiment, and can be embodied in various forms with various modifications and improvements based on the knowledge of a person skilled in the art. Specifically, for example, in the above embodiment, when the component cover 122 is placed at the first position of the carrier 40, the magnet is exposed from the magnet exposure hole 190 and the cutout hole 192, thereby reducing the magnetic force of the magnet. However, the magnetic force of the magnet may be reduced by a different method. For example, the magnetic force of the magnet may be reduced by using a non-magnetic material. That is, a non-magnetic material may be disposed in a part of the area of ​​the component cover 122, and a component cover may be used in which the non-magnetic material part of the component cover 122 is located above the magnet of the carrier 40 when the component cover 122 is placed at the first position of the carrier 40, and the magnetic material part of the component cover 122 is located above the magnet of the carrier 40 when the component cover 122 is placed at the second position of the carrier 40. Also, for example, an electromagnet may be used, and when the component cover 122 is placed in a first position on the carrier 40, the electromagnet may be controlled to have a weaker magnetic force, and when the component cover 122 is placed in a second position on the carrier 40, the electromagnet may be controlled to have a stronger magnetic force.

[0062] In addition, in the above embodiment, the component cover 122 is placed at the first position on the carrier 40 when there are no components, and the component cover 122 is placed at the second position on the carrier 40 when there are components, but the component cover 122 may be placed at the second position on the carrier 40 when there are no components, and the component cover 122 may be placed at the first position on the carrier 40 when there are components. In other words, the magnetic force of the magnet when the component cover 122 is placed on the carrier 40 when there are no components may be stronger than the magnetic force of the magnet when the component cover 122 is placed on the carrier 40 when there are components.

[0063] In the above embodiment, the component cover 122 placed on the carrier 40 is pushed up by the push-up pins 82, thereby lifting the component cover 122 from the upper surface of the carrier 40, but the component cover 122 may be lifted from the upper surface of the carrier 40 by the suction nozzle 140. In other words, without providing the push-up pins 82 on the lift-up table 80, the lift-up table 80 is raised, and the carrier 40 with the component cover 122 placed thereon is clamped by the clamp device 88. The component cover 122 placed on the carrier 40 may then be held by the suction nozzle 140, and the suction nozzle 140 may be raised, thereby lifting the component cover 122 from the upper surface of the carrier 40. [Explanation of symbols]

[0064] 10: Electronic component placement machine (working machine) 40: Carrier 112: Electrical component (component) 120: Magnet 122: Parts cover (cover)

Claims

1. A work machine that performs a cover removal operation of removing a cover placed on a carrier on which no detachable part is placed, a component placement operation of detachably placing the part on the carrier from which the cover has been removed in the cover removal operation, and a cover placement operation of placing the cover on the carrier on which the part has been detachably placed in the component placement operation, the cover placed on the carrier is prevented from shifting from its position on the carrier by a magnetic force, a cover placement position where the cover is placed on a carrier on which the detachable component is not placed is different from a cover placement position where the cover is placed on a carrier on which the component is detachably placed, A work machine in which a magnetic force for preventing misalignment of the position of the cover placed on the carrier when the removable part is not placed on the carrier is smaller than a magnetic force for preventing misalignment of the position of the cover placed on the carrier when the part is detachably placed on the carrier.

2. 2. The work machine according to claim 1, wherein the carrier on which the detachable parts are not placed and on which the cover is placed is carried in, and the cover removal operation is performed.

3. 3. The work machine according to claim 1, wherein the carrier is removed after the cover placement operation is performed.

Images