SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD

Abstract

To raise the efficiency of substrate treatment.SOLUTION: A substrate treatment device according to one side of the present disclosure includes a cooling plate that cools the substrate, and a support portion that supports the back of the substrate such that a gap is formed between the upper surface of the cooling plate and the back of the substrate. The support portion includes a central support pin placed in a central region of the cooling plate and provided on the cooling plate so as to protrude from the upper surface of the cooling plate, and an outer peripheral support pin placed on the outer peripheral area of the cooling plate and protruding from the upper surface of the cooling plate. The outer peripheral support pin includes a pin body that supports the back of the substrate, and an extension member that changes the amount protruding from the upper surface of the cooling plate according to the temperature. When the temperature rises, the extension member is configured to change from a first state where the pin body protrudes from the upper surface of the cooling plate with the first protruding amount to a second state where the pin body protrudes from the upper surface of the cooling plate with the second protruding amount larger than the first protruding amount. The first protruding amount is smaller than the amount that the central support pin protrudes from the upper surface of the cooling plate.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to a substrate processing apparatus, a substrate processing system, and a substrate processing method. [Background technology]

[0002] Patent Document 1 discloses a substrate cooling device that is disposed in a processing chamber whose interior can be switched between a vacuum atmosphere and an atmospheric pressure atmosphere. This substrate cooling device has support pins that support the substrate while protruding from the top surface of a stage that cools the substrate, and an expandable member that adjusts the protruding height of the support pins from the top surface of the stage. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2015-50418 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a substrate processing apparatus, a substrate processing system, and a substrate processing method that are useful for improving the efficiency of substrate processing. [Means for solving the problem]

[0005] A substrate processing apparatus according to one aspect of the present disclosure includes a cooling plate for cooling a substrate, and a support section for supporting the rear surface of the substrate such that a gap is formed between an upper surface of the cooling plate and the rear surface of the substrate. The support section includes a central support pin disposed in a central region of the cooling plate and provided on the cooling plate so as to protrude from the upper surface of the cooling plate, and a peripheral support pin disposed in a peripheral region of the cooling plate and provided on the cooling plate so as to protrude from the upper surface of the cooling plate. The peripheral support pin includes a pin body for supporting the rear surface of the substrate, and an expandable member for changing an amount by which the pin body protrudes from the upper surface of the cooling plate in accordance with temperature. The expandable member is configured to change, when the temperature rises, a first state in which the pin body protrudes from the upper surface of the cooling plate by a first protrusion amount to a second state in which the pin body protrudes from the upper surface of the cooling plate by a second protrusion amount that is larger than the first protrusion amount. The first protrusion amount is smaller than an amount by which the central support pin protrudes from the upper surface of the cooling plate. Effect of the Invention

[0006] According to the present disclosure, a substrate processing apparatus, a substrate processing system, and a substrate processing method that are useful for improving the efficiency of substrate processing are provided. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a perspective view illustrating an example of a substrate processing system according to a first embodiment. [Diagram 2] FIG. 2 is a side view diagrammatically illustrating an example of a coating and developing apparatus. [Diagram 3] FIG. 3 is a side view illustrating a schematic example of a heat treatment unit. [Figure 4] FIG. 4 is a plan view illustrating an example of a cooling plate. [Diagram 5] 5(a) and 5(b) are schematic diagrams for explaining an example of the relationship between the central support pin and the outer periphery support pins. [Figure 6] FIG. 6 is a schematic diagram showing an example of the internal structure of the outer periphery support pin. [Figure 7]Figure 7(a) is a schematic diagram showing an example of the state of the outer periphery support pins at low temperature, and Figure 7(b) is a schematic diagram showing an example of the state of the outer periphery support pins at high temperature. [Figure 8] Fig. 8(a) is a side view showing a schematic view of a part of a top plate of a periphery support pin, and Fig. 8(b) is a schematic view showing an example of the relationship between the top plate of the periphery support pin and a spring. [Figure 9] FIG. 9 is a block diagram illustrating an example of a hardware configuration of the control device. [Figure 10] FIG. 10 is a flowchart showing an example of a heat treatment method performed by the control device. [Figure 11] 11(a) to 11(d) are schematic diagrams illustrating the state of the outer periphery support pins during heat treatment. [Figure 12] 12(a) and 12(b) are schematic diagrams showing an example of a support portion according to the second embodiment. [Figure 13] 13(a) and 13(b) are schematic diagrams showing an example of an outer periphery support pin according to the third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, some embodiments will be described with reference to the drawings. In the description, the same elements or elements having the same functions are given the same reference numerals, and duplicated descriptions will be omitted. Some drawings show an orthogonal coordinate system defined by an X-axis, a Y-axis, and a Z-axis. In the following embodiments, the Z-axis corresponds to the vertical direction, and the X-axis and the Y-axis correspond to the horizontal direction.

[0009] [First embodiment] First, a substrate processing system according to a first embodiment will be described with reference to Figs. 1 to 11. The substrate processing system 1 (substrate processing apparatus) shown in Fig. 1 is a system that performs the processes of forming a photosensitive film on a workpiece W, exposing the photosensitive film, and developing the photosensitive film. The workpiece W to be processed is, for example, a substrate, or a substrate on which a film, a circuit, or the like has been formed by performing a predetermined process. One example of the substrate is a silicon wafer. The workpiece W (substrate) may be circular. The workpiece W may be a glass substrate, a mask substrate, or an FPD (Flat Panel Display), etc. The photosensitive film is, for example, a resist film.

[0010] 1 and 2, the substrate processing system 1 includes a coating and developing apparatus 2 (substrate processing apparatus), an exposure apparatus 3, and a control device 100. The exposure apparatus 3 is an apparatus that exposes a resist film (photosensitive coating) formed on a workpiece W (substrate). Specifically, the exposure apparatus 3 irradiates an exposure target portion of the resist film with an energy beam by a method such as immersion exposure.

[0011] (Coating and developing equipment) The coating and developing apparatus 2 applies resist (chemical solution) to the surface of the workpiece W to form a resist film before the exposure process by the exposure device 3, and develops the resist film after the exposure process. The coating and developing apparatus 2 includes a carrier block 4, a processing block 5, and an interface block 6.

[0012] The carrier block 4 introduces the workpiece W into the coating and developing apparatus 2 and removes the workpiece W from the coating and developing apparatus 2. For example, the carrier block 4 can support multiple carriers C for the workpiece W and has a built-in transport device A1 including a delivery arm. The carrier C accommodates, for example, multiple circular workpieces W. The transport device A1 removes the workpiece W from the carrier C and delivers it to the processing block 5, and receives the workpiece W from the processing block 5 and returns it to the carrier C. The processing block 5 has processing modules 11, 12, 13, and 14.

[0013] The processing module 11 incorporates a liquid processing unit U1, a heat processing unit U2, and a transport device A3 that transports the workpiece W to these units. The processing module 11 forms an underlayer film on the surface of the workpiece W using the liquid processing unit U1 and the heat processing unit U2. The liquid processing unit U1 applies a processing liquid for forming the underlayer film onto the workpiece W. The heat processing unit U2 performs various heat treatments associated with the formation of the underlayer film.

[0014] The processing module 12 incorporates a liquid processing unit U1, a heat processing unit U2, and a transport device A3 that transports the workpiece W to these units. The processing module 12 forms a resist film on the underlayer film using the liquid processing unit U1 and the heat processing unit U2. The liquid processing unit U1 applies a processing liquid for forming the resist film onto the underlayer film. The heat processing unit U2 performs various heat treatments associated with the formation of the resist film.

[0015] The processing module 13 incorporates a liquid processing unit U1, a heat processing unit U2, and a transport device A3 that transports the workpiece W to these units. The processing module 13 forms an upper layer film on the resist film using the liquid processing unit U1 and the heat processing unit U2. The liquid processing unit U1 applies a processing liquid for forming the upper layer film onto the resist film. The heat processing unit U2 performs various heat treatments associated with the formation of the upper layer film.

[0016] The processing module 14 incorporates a liquid processing unit U1, a heat processing unit U2, and a transport device A3 that transports the workpiece W to these units. The processing module 14 uses the liquid processing unit U1 and the heat processing unit U2 to perform development processing of the resist film that has been subjected to exposure processing and heat processing associated with the development processing. The liquid processing unit U1 supplies a developer onto the surface of the exposed workpiece W, and then washes it away with a rinsing liquid to form a resist pattern (development processing of the resist film). The heat processing unit U2 performs various heat processing associated with the development processing. Specific examples of heat processing include a heat processing before the development processing (PEB: Post Exposure Bake) and a heat processing after the development processing (PB: Post Bake).

[0017] A shelf unit U10 is provided on the carrier block 4 side in the processing block 5. The shelf unit U10 is divided into multiple cells arranged in the vertical direction. A transport device A7 including a lifting arm is provided near the shelf unit U10. The transport device A7 lifts and lowers the workpiece W between the cells of the shelf unit U10.

[0018] A shelf unit U11 is provided on the interface block 6 side in the processing block 5. The shelf unit U11 is partitioned into a plurality of cells arranged in the vertical direction.

[0019] The interface block 6 transfers the workpiece W to and from the exposure apparatus 3. For example, the interface block 6 has a built-in transport device A8 including a transfer arm, and is connected to the exposure apparatus 3. The transport device A8 transfers the workpiece W placed on the shelf unit U11 to the exposure apparatus 3. The transport device A8 receives the workpiece W from the exposure apparatus 3 and returns it to the shelf unit U11.

[0020] The control device 100 is configured to partially and entirely control the coating and developing apparatus 2. The control device 100 controls the coating and developing apparatus 2 to execute a coating and developing process, for example, in the following procedure. First, the control device 100 controls the transport device A1 to transport the workpiece W in the carrier C to the shelf unit U10, and controls the transport device A7 to place the workpiece W in a cell for the processing module 11.

[0021] Next, the control device 100 controls the transport device A3 to transport the workpiece W on the shelf unit U10 to the liquid treatment unit U1 and the heat treatment unit U2 in the processing module 11. The control device 100 also controls the liquid treatment unit U1 and the heat treatment unit U2 to form an underlayer film on the surface of the workpiece W. Thereafter, the control device 100 controls the transport device A3 to return the workpiece W on which the underlayer film has been formed to the shelf unit U10, and controls the transport device A7 to place the workpiece W in a cell for the processing module 12.

[0022] Next, the control device 100 controls the transport device A3 to transport the workpiece W on the shelf unit U10 to the liquid processing unit U1 and heat processing unit U2 in the processing module 12. The control device 100 also controls the liquid processing unit U1 and heat processing unit U2 to form a resist film on the underlying film of the workpiece W. Thereafter, the control device 100 controls the transport device A3 to return the workpiece W to the shelf unit U10, and controls the transport device A7 to place the workpiece W in a cell for the processing module 13.

[0023] Next, the control device 100 controls the transport device A3 to transport the workpiece W on the shelf unit U10 to each unit in the processing module 13. The control device 100 also controls the liquid processing unit U1 and the heat processing unit U2 to form an upper layer film on the resist film of the workpiece W. Thereafter, the control device 100 controls the transport device A3 to transport the workpiece W to the shelf unit U11.

[0024] Next, the control device 100 controls the transport device A8 to send the workpiece W on the shelf unit U11 to the exposure device 3. Thereafter, the control device 100 controls the transport device A8 to receive the workpiece W that has been subjected to the exposure process from the exposure device 3 and place it in a cell for the processing module 14 in the shelf unit U11.

[0025] Next, the control device 100 controls the transport device A3 to transport the workpiece W on the shelf unit U11 to each unit in the processing module 14, and controls the liquid processing unit U1 and the heat processing unit U2 to perform development processing of the resist film on the workpiece W. Thereafter, the control device 100 controls the transport device A3 to return the workpiece W to the shelf unit U10, and controls the transport devices A7 and A1 to return the workpiece W into the carrier C.

[0026] This completes the coating and developing process for one workpiece W. The control device 100 causes the coating and developing apparatus 2 to perform the coating and developing process for each of the subsequent workpieces W in the same manner as described above. Note that the specific configuration of the coating and developing apparatus 2 is not limited to the configuration exemplified above. The coating and developing apparatus 2 may be of any type as long as it is equipped with a unit that performs heat treatment.

[0027] <Heat treatment unit> Next, an example of the heat-treating unit U2 will be described in detail with reference to Fig. 3 to Fig. 8. The heat-treating unit U2 is configured to perform heat treatment including heating treatment and cooling treatment on the workpiece W. As shown in Fig. 3, the heat-treating unit U2 includes a housing 20, a cooling section 30, and a heating section 40.

[0028] The housing 20 forms a space for performing heat treatment (hereinafter referred to as "processing space S"). The housing 20 houses a cooling section 30 and a heating section 40. One side wall of the housing 20 is provided with an entrance 22 for carrying the workpiece W into the processing space S. The housing 20 has a floor plate 24 that divides the processing space S into an upper region and a lower region. The upper region is a movement region in which the workpiece W is moved, and the lower region is the other region (for example, a region in which a drive unit, etc. is installed).

[0029] The cooling section 30 performs a cooling process on the workpiece W to be processed, which reduces the temperature of the workpiece W to a target temperature in the processing space S. The cooling section 30 has a function of transferring the workpiece W to and from the transport device A3 outside the heat processing unit U2. The cooling section 30 has, for example, a cooling plate 32, a connecting bracket 34, and a drive section 36.

[0030] The cooling plate 32 is a plate (cool plate) that cools the workpiece W. The cooling plate 32 cools the workpiece W to a target temperature with the workpiece W located above it after being heated by the heating unit 40. The cooling unit 30 may be formed in a disk shape (see FIG. 4). The size (diameter) of the cooling unit 30 may be approximately the same as the size (diameter) of the workpiece W. The cooling plate 32 may be made of a metal such as aluminum, silver, or copper. A refrigerant flow path (not shown) is formed inside the cooling plate 32 to circulate a refrigerant such as cooling water or cooling gas. The refrigerant flowing inside the cooling plate 32 removes heat from the workpiece W, thereby lowering the temperature of the workpiece W.

[0031] The connecting bracket 34 is connected to the cooling plate 32. The connecting bracket 34 is configured to be movable in one horizontal direction (for example, the X-axis direction in the figure) inside the housing 20. The connecting bracket 34 is movable, for example, along a guide rail extending between the vicinity of the entrance 22 of the housing 20 and the heating unit 40. The connecting bracket 34 moves along the guide rail, so that the cooling plate 32 moves in one horizontal direction (for example, the X-axis direction in the figure) between the cooling position and the transfer position. The cooling position is a position where the cooling plate 32 does not overlap with the heating unit 40 and cools the workpiece W. The transfer position is a position where at least a part of the cooling plate 32 overlaps with the heating unit 40 (more specifically, the hot plate 44 described later) and transfers the workpiece W between the heating unit 40 and the cooling plate 32.

[0032] The drive unit 36 ​​operates based on an operation instruction from the control device 100, and moves the connecting bracket 34 back and forth along one horizontal direction. The drive unit 36 ​​includes a drive source such as an electric motor, and moves the connecting bracket 34 so that the cooling plate 32 moves between the cooling position and the transfer position. The carry-in entrance 22, the cooling position, and the transfer position (the position of the heating unit 40) are aligned in this order along one horizontal direction.

[0033] The thermal processing unit U2 has a coolant supplying part 28 that supplies a coolant to the cooling plate 32 of the cooling part 30. The coolant supplying part 28 supplies a coolant to the coolant flow path in the cooling plate 32. The coolant supplied from the coolant supplying part 28 is, for example, water for cooling. The coolant supplying part 28 may continue to supply the coolant to the cooling plate 32 while the coating and developing apparatus 2 is in operation. The coolant supplying part 28 may be provided in the housing 20, or, unlike the example shown in FIG. 3, a part of the coolant supplying part 28 may be disposed outside the housing 20.

[0034] The heating unit 40 performs a heat treatment on the workpiece W to be treated, by heating the workpiece W in the treatment space S. The heating unit 40 includes, for example, a support table 42, a hot plate 44, a cover 46, a drive unit 48, a plurality of lift pins 52, and a drive unit 54.

[0035] The support table 42 is a table that supports the hot plate 44. The support table 42 is formed, for example, in a disk shape with a recess in its center. The hot plate 44 is a plate that heats the workpiece W placed on it. The hot plate 44 is formed, for example, in a disk shape and is accommodated in a recess in the support table 42. The hot plate 44 has a mounting surface 44a facing upward. A heater 45 is provided on the lower surface of the hot plate 44 opposite to the mounting surface 44a. The heater 45 is composed of, for example, a resistance heating element. When a current flows through the heater 45, the heater 45 generates heat, and the temperature of the hot plate 44 increases due to the heat. As a result, the workpiece W placed on the mounting surface 44a of the hot plate 44 is heated.

[0036] The cover 46 is configured to surround the mounting surface 44a of the hot plate 44. The cover 46 includes a top plate portion 46a and a side wall portion 46b. The top plate portion 46a is configured to be a disk shape having a diameter approximately the same as that of the support base 42. The top plate portion 46a is disposed to face the mounting surface 44a in the up-down direction. The side wall portion 46b is configured to extend downward from the outer edge of the top plate portion 46a.

[0037] The lid body 46 is movable between an elevated position where a space for performing a heat treatment on the workpiece W is opened and a lowered position where the lid body 46 is lowered to form a space for performing a heat treatment on the workpiece W. The drive unit 48 raises and lowers the lid body 46 based on an operation instruction from the control device 100. The drive unit 48 includes a drive source such as an electric motor, and raises and lowers the lid body 46 so as to move between the elevated position and the lowered position.

[0038] The lift pins 52 are pins that raise and lower the workpiece W. The lift pins 52 extend in the vertical direction so as to penetrate the support base 42 and the hot plate 44. A plurality of (e.g., three) lift pins 52 may be disposed at equal intervals in the circumferential direction around the center of the hot plate 44. The lift pins 52 can rise and fall between a placement position where the workpiece W is placed on the hot plate 44 and a protruding position where the lift pins 52 protrude beyond the hot plate 44 to transfer the workpiece W between the cooling plate 32 and the lift pins 52.

[0039] The drive unit 54 raises and lowers the lift pins 52 based on an operation instruction from the control device 100. The drive unit 54 includes a drive source such as an electric motor, and raises and lowers the multiple lift pins 52 so as to move between a placement position and a protruding position. The lift pins 52 supporting the workpiece W are raised and lowered, whereby the workpiece W is raised and lowered.

[0040] As described above, the cooling plate 32 is movable between the delivery position and the cooling position. When the cooling plate 32 is located at the delivery position, at least a part of the cooling plate 32 overlaps with the hot plate 44 with the cooling plate 32 and the hot plate 44 separated from each other in the vertical direction. "At least a part of the cooling plate 32 overlaps with the hot plate 44" means that at least a part of the cooling plate 32 covers the hot plate 44 when viewed from above. When the cooling plate 32 is located at the cooling position, the cooling plate 32 and the hot plate 44 are separated from each other in one horizontal direction (when viewed from above, the cooling plate 32 does not cover the hot plate 44).

[0041] Next, the cooling plate 32 will be described in detail. As shown in Fig. 4, the cooling plate 32 is formed with a plurality of (for example, two) slits 58 extending along the moving direction of the cooling plate 32. Each slit 58 penetrates the cooling plate 32 in the thickness direction of the cooling plate 32. The slits 58 are formed so that the cooling plate 32 and the plurality of lift pins 52 do not interfere with each other when the cooling plate 32 moves to a position above the hot plate 44 (the transfer position).

[0042] The cooling section 30 has a support section 60 that supports the workpiece W. The support section 60 supports the workpiece W so that the center of the workpiece W and the center of the cooling plate 32 are approximately aligned with each other. The support section 60 supports the back surface Wb of the workpiece W so that a gap is formed between the upper surface 32a of the cooling plate 32 and the back surface Wb of the workpiece W (see also Figs. 5(a) and 5(b)). When the workpiece W is supported by the support section 60, a gap is formed between the upper surface 32a of the cooling plate 32 and the back surface Wb of the workpiece W. The gap is set, for example, to a degree that allows the cooling of the workpiece W by the cooling plate 32. In one example, the gap between the upper surface 32a and the back surface Wb is about several hundred µm to several mm. The support section 60 includes, for example, a plurality of central support pins 64, a plurality of first outer peripheral support pins 68, and a plurality of second outer peripheral support pins 70 (outer peripheral support pins).

[0043] The multiple central support pins 64 are arranged in a centrally located region on the upper surface 32a of the cooling plate 32 (hereinafter referred to as the "central region CA"), and support a central portion of the back surface Wb of the workpiece W. The multiple central support pins 64 may be arranged in any manner in the central region CA. Some of the multiple central support pins 64 may be arranged in a row at equal intervals along the circumferential direction around the center of the upper surface 32a of the cooling plate 32. Some of the multiple central support pins 64 may be arranged in a row along the radial direction of the upper surface 32a.

[0044] Each central support pin 64 is provided on the cooling plate 32 such that its upper end protrudes from the upper surface 32a of the cooling plate 32. The amount by which the central support pin 64 protrudes from the upper surface 32a may be several hundred μm to several mm. The amount by which the central support pin 64 protrudes from the upper surface 32a is defined as the distance between the upper end of the central support pin 64 and the upper surface 32a in the vertical direction (direction perpendicular to the upper surface 32a). In FIG. 5(a), the amount by which the central support pin 64 protrudes from the upper surface 32a is indicated by "dc". The amounts by which each of the multiple central support pins 64 protrudes from the upper surface 32a may be approximately the same as each other. The upper end of the central support pin 64 may be formed with a convex spherical surface that comes into contact with the back surface Wb of the workpiece W.

[0045] The first outer peripheral support pins 68 and the second outer peripheral support pins 70 (outer peripheral support pins) are arranged in an area (hereinafter referred to as "outer peripheral area PA") located on the outer periphery of the upper surface 32a of the cooling plate 32, and support the outer peripheral portion of the back surface Wb of the workpiece W. The outer peripheral area PA is the periphery of the upper surface 32a and a portion in its vicinity, and is an area defined in an annular shape. The central area CA is an area on the upper surface 32a other than the outer peripheral area PA, and is located inside the outer peripheral area PA. The distance between the periphery of the upper surface 32a and the inner edge of the outer peripheral area PA (the distance along the radial direction of the upper surface 32a) may be about 1 / 10 to 1 / 5 of the radius of the upper surface 32a.

[0046] Both the first outer periphery support pin 68 and the second outer periphery support pin 70 are provided on the cooling plate 32 in the outer periphery region PA such that their upper ends protrude from the upper surface 32a. The second outer periphery support pin 70 is configured so that the amount of protrusion from the upper surface 32a changes depending on its own temperature, whereas the first outer periphery support pin 68 is configured so that the amount of protrusion from the upper surface 32a does not change. The number of the first outer periphery support pins 68 and the number of the second outer periphery support pins 70 may be the same as or different from each other.

[0047] The first outer periphery support pins 68 and the second outer periphery support pins 70 may be arranged in any manner in the outer periphery region PA. The first outer periphery support pins 68 may be arranged at equal intervals along the circumferential direction around the center of the upper surface 32a of the cooling plate 32. The second outer periphery support pins 70 may be arranged at equal intervals along the circumferential direction around the center of the upper surface 32a. The first outer periphery support pins 68 and the second outer periphery support pins 70 may be arranged such that the first outer periphery support pins 68 are located between the adjacent second outer periphery support pins 70 in the circumferential direction around the center of the upper surface 32a. The distance between the first outer periphery support pins 68 and the center of the upper surface 32a may be approximately equal to the distance between the second outer periphery support pins 70 and the center of the upper surface 32a.

[0048] The amount by which the first outer periphery support pin 68 protrudes from the upper surface 32a may be smaller than the amount by which the central support pin 64 protrudes from the upper surface 32a. The amount by which the first outer periphery support pin 68 protrudes from the upper surface 32a may be about 1 / 2 to 9 / 10 of the amount by which the central support pin 64 protrudes. The amount by which the first outer periphery support pin 68 protrudes from the upper surface 32a is defined as the distance between the upper end of the first outer periphery support pin 68 and the upper surface 32a in the vertical direction (direction perpendicular to the upper surface 32a). The amount by which each of the multiple first outer periphery support pins 68 protrudes from the upper surface 32a may be approximately the same as each other. The upper end of the first outer periphery support pin 68 may be formed with a convex spherical surface that comes into contact with the back surface Wb of the workpiece W.

[0049] The second outer periphery support pins 70 are configured to switch between two states with different amounts of protrusion from the upper surface 32a depending on their own temperature. When the second outer periphery support pins 70 are in a low temperature state (hereinafter referred to as the "first state") and the temperature rises to a certain value, the second outer periphery support pins 70 change to a state (hereinafter referred to as the "second state") in which the amount of protrusion is greater than in the first state. After changing to the second state, when the second outer periphery support pins 70's temperature drops below a certain value, the second outer periphery support pins 70 change from the second state to the first state. The temperature at which the first state changes to the second state and the temperature at which the second state changes to the first state may be approximately the same or may differ by about several degrees Celsius.

[0050] The amount by which the second outer periphery support pins 70 protrude from the upper surface 32a is defined as the distance in the up-down direction (direction perpendicular to the upper surface 32a) between the upper ends of the second outer periphery support pins 70 and the upper surface 32a. Hereinafter, the amount by which the second outer periphery support pins 70 protrude from the upper surface 32a in the first state is referred to as the "first protrusion amount," and the amount by which the second outer periphery support pins 70 protrude from the upper surface 32a in the second state is referred to as the "second protrusion amount." The second protrusion amount is greater than the first protrusion amount.

[0051] In the first state, the first protrusion amounts of the second outer periphery support pins 70 may be approximately the same as each other. In the second state, the second protrusion amounts of the second outer periphery support pins 70 may be approximately the same as each other. The first protrusion amount may be approximately the same as the amount by which the first outer periphery support pin 68 protrudes from the upper surface 32a. The first protrusion amount is smaller than the amount by which the central support pin 64 located in the central area CA protrudes from the upper surface 32a. The second protrusion amount may be approximately the same as the amount by which the central support pin 64 protrudes from the upper surface 32a, or may be larger than the amount by which the central support pin 64 protrudes.

[0052] 5(a) and 5(b) are schematic diagrams showing an example of the state in which the workpiece W is supported by the second outer peripheral support pins 70 and the central support pins 64 in the first state. Since various films and circuits are formed on the front surface Wa of the workpiece W, warping may occur before the cooling by the cooling plate 32 is started. The state of warping (warping shape) may vary depending on the type of workpiece W. In the workpiece W shown in FIG. 5(a), warping is almost not generated and the shape is flat. In the following, the workpiece W having a flat shape with almost no warping will be described as having a flat warping shape. In the workpiece W shown in FIG. 5(b), warping occurs such that the central part of the workpiece W protrudes from the back surface Wb toward the front surface Wa. In the present disclosure, warping in which the central part protrudes from the back surface Wb toward the front surface Wa is referred to as convex warping, and warping in which the central part protrudes from the front surface Wa toward the back surface Wb (warping in which the central part of the front surface Wa is recessed) is referred to as concave warping.

[0053] 5(a), when the warpage shape of the workpiece W is flat (when almost no warpage occurs), the back surface Wb of the workpiece W is supported by the multiple central support pins 64 without contacting the second outer periphery support pins 70. When the warpage shape of the workpiece W is concave, it is also supported by the multiple central support pins 64 without contacting the second outer periphery support pins 70, just like when the workpiece W is flat.

[0054] On the other hand, as shown in Fig. 5(b), when the warpage shape of the workpiece W is a convex warp, the back surface Wb of the workpiece W can be supported by the multiple second outer periphery support pins 70 and the multiple central support pins 64. Depending on the degree of warping, the multiple second outer periphery support pins 70 may support the back surface Wb without contacting the central support pin 64, and the multiple central support pins 64 may support the back surface Wb without contacting the second outer periphery support pins 70. Below, a case will be described in which a workpiece W that is warped in a convex shape to such an extent that the back surface Wb comes into contact with at least the second outer periphery support pins 70 is cooled by the cooling plate 32.

[0055] FIG. 6 shows a schematic configuration of the inside and the upper part of the second outer periphery support pin 70. FIG. 6 shows the second outer periphery support pin 70 in a first state. FIG. 7(a) shows a schematic configuration of the inside of the second outer periphery support pin 70 in a first state, and FIG. 7(b) shows a schematic configuration of the inside of the second outer periphery support pin 70 in a second state. The second outer periphery support pin 70 includes a pin body 71, a guide member 80, a cover member 86, a fixing member 88, and an expandable member 90. Note that the expandable member 90 is not shown in FIG. 6.

[0056] The pin body 71 is a member that supports the back surface Wb of the workpiece W. A pin accommodating portion 38 that accommodates the pin body 71 is formed on the upper surface 32a of the cooling plate 32. The pin accommodating portion 38 is a recess formed so as not to penetrate the cooling plate 32, and the spatial shape of the pin accommodating portion 38 is cylindrical. The pin accommodating portion 38 includes, for example, a side surface extending along a direction perpendicular to the cooling plate 32 and a bottom surface extending along the upper surface 32a of the cooling plate 32. The pin body 71 may be made of SiC (silicon carbide). The pin body 71 includes a top plate 72, a side wall 74, and a flange 76.

[0057] The top plate 72 is a portion on which the back surface Wb of the workpiece W is placed. The top plate 72 is formed in a circular plate shape. The top plate 72 includes a planar mounting surface 72a on which the back surface Wb of the workpiece W is placed. The mounting surface 72a (the uppermost portion of the mounting surface 72a) corresponds to the upper end of the pin main body 71. When viewed from above, the size of the top plate 72 is smaller than the size of the bottom surface of the pin accommodating portion 38. The pin main body 71 may be disposed in the pin accommodating portion 38 such that the center of the top plate 72 approximately coincides with the center of the bottom surface of the pin accommodating portion 38 when viewed from above.

[0058] The side wall 74 extends downward from the peripheral portion (lower end of the peripheral portion) of the top plate 72 and is formed in a cylindrical shape. The top plate 72 and the side wall 74 form a space inside the pin body 71. The vertical length of the side wall 74 may be approximately the same as the depth of the pin accommodating portion 38, or may be greater than half the depth of the pin accommodating portion 38 and smaller than the depth. The flange 76 extends outward from the lower end (side surface of the lower end) of the cylindrical side wall 74. The flange 76 is formed in an annular shape. When viewed from above, the area surrounded by the outer edge of the flange 76 may be approximately the same as the bottom surface of the pin accommodating portion 38, or may be smaller than the bottom surface.

[0059] The guide member 80 is disposed below the pin body 71. The guide member 80 has a function of guiding (restricting the movement of) a shape memory alloy spring 94 described later. In addition to the guide function, the guide member 80 has a function of insulating between a part of the cooling plate 32 constituting the bottom surface of the pin accommodating portion 38 and the space inside the pin accommodating portion 38, and a function of supporting the top plate 72 in the first state. The guide member 80 has a base portion 82 and a shaft portion 84. The base portion 82 and the shaft portion 84 are made of the same material and are integrally formed. The guide member 80 may be made of a thermoplastic resin. In one example, the guide member 80 may be made of a PEEK (polyether ether ketone) resin containing carbon. The carbon-containing PEEK resin has high thermal insulation performance.

[0060] The base portion 82 is formed in a plate shape so as to cover substantially the entire bottom surface of the pin housing portion 38. The outer peripheral portion of the base portion 82 faces the flange 76 of the pin body 71 in the vertical direction. The shaft portion 84 has a lower end connected to substantially the center of the upper surface of the base portion 82 and is formed in a cylindrical shape so as to extend along the vertical direction. The shaft portion 84 is disposed in a space (space within the pin body 71) formed by the top plate 72 and the side wall 74. When viewed from above, the size of the shaft portion 84 is smaller than the bottom surface of the pin housing portion 38. The shaft portion 84 is disposed below the top plate 72 and is configured to support the back surface of the top plate 72 in the first state.

[0061] The length of the shaft portion 84 may be approximately the same as the length of the side wall 74 of the pin body 71, or may be slightly longer than the length of the side wall 74. The shaft portion 84 includes a convex spherical surface 84a with which the back surface of the top plate 72 comes into contact in the first state. The spherical surface 84a forms the upper surface of the shaft portion 84. If the guide member 80 (base portion 82) were not provided, most of the cooling plate 32 would be exposed at the bottom surface of the pin accommodating portion 38. In contrast, in the above configuration, the base portion 82 of the guide member 80 made of carbon-containing PEEK resin is provided so as to cover substantially the entire bottom surface of the pin accommodating portion 38, so that heat insulation between the cooling plate 32 and the space within the pin accommodating portion 38 can be effectively obtained.

[0062] The cover member 86 is a member that covers the area outside the pin body 71 (side wall 74) of the space in the pin accommodating portion 38. The cover member 86 includes an umbrella portion 86a and a plate-shaped portion 86b. The umbrella portion 86a is a cylindrical portion of the cover member 86 that is formed so as to surround the upper end portion of the pin body 71. When viewed from above, the outer edge of the umbrella portion 86a approximately coincides with the outer edge of the bottom surface of the pin accommodating portion 38. The umbrella portion 86a includes a first portion 87a and a second portion 87b.

[0063] The first portion 87a is a portion of the umbrella portion 86a formed to extend along the side surface of the pin housing portion 38, and has a cylindrical shape. The outer peripheral surface of the first portion 87a is close to the side surface of the pin housing portion 38. The inner peripheral surface of the first portion 87a faces the side wall 74 of the pin body 71, and a cylindrical space is formed between the first portion 87a and the side wall 74. The second portion 87b is a portion of the umbrella portion 86a formed to extend inward from the side surface of the upper end of the first portion 87a, and has an annular shape. When viewed from above, the inner peripheral surface of the second portion 87b is located outside the outer peripheral surface of the top plate 72 or the side wall 74. A gap is formed between the inner peripheral surface of the second portion 87b and the pin body 71 (top plate 72 or side wall 74) to the extent that it does not hinder the operation of the pin body 71.

[0064] The plate-shaped portion 86b is connected to a portion of the outer edge of the umbrella portion 86a and is a portion that bulges outward beyond the pin accommodating portion 38. The plate-shaped portion 86b is formed in a plate shape so as to extend along the cooling plate 32 on the outer side of the first outer periphery support pin 68. An accommodating portion that is connected to the pin accommodating portion 38 and that accommodates the plate-shaped portion 86b is formed on the upper surface 32a of the cooling plate 32. The cover member 86 (plate-shaped portion 86b) is fixed to the cooling plate 32 by a fixing member 88. The fixing member 88 is, for example, a screw member.

[0065] The umbrella portion 86a and the plate-shaped portion 86b are integrally formed. The thermal conductivity of the cover member 86 (umbrella portion 86a) is higher than that of the guide member 80 (base portion 82). The cover member 86 is made of, for example, stainless steel (in one example, SUS304). The upper surface of the umbrella portion 86a and the upper surface of the plate-shaped portion 86b are flush with each other and form the upper surface of the cover member 86. The height position of the upper surface of the fixing member 88 is approximately the same as or lower than the height position of the upper surface of the cover member 86. The height position of the upper surface of the cover member 86 may be approximately the same as the height position of the upper surface 32a of the cooling plate 32.

[0066] 7(a) and 7(b) is a member that changes the amount by which the pin body 71 protrudes from the upper surface 32a of the cooling plate 32 depending on its own temperature. The upper end of the pin body 71 is located (protrudes) above the upper surface 32a of the cooling plate 32. The amount by which the upper end of the pin body 71 protrudes from the upper surface 32a corresponds to the amount by which the second outer periphery support pin 70 (the upper end of the second outer periphery support pin 70) protrudes from the upper surface 32a.

[0067] The elastic member 90 is configured to change the state of the second outer periphery support pin 70 from a first state in which the pin body 71 protrudes from the upper surface 32a by the first protrusion amount to a second state in which the pin body 71 protrudes from the upper surface 32a by the second protrusion amount that is greater than the first protrusion amount when the temperature rises. The elastic member 90 is configured to change the state of the second outer periphery support pin 70 from the second state to the first state when the temperature drops after changing (transitioning) to the second state. To achieve the above operation, the elastic member 90 has a metal spring 92 (first spring) and a shape memory alloy spring 94 (second spring).

[0068] The metal spring 92 is a coil spring (compression coil spring) made of a general metal. The metal spring 92 is made of, for example, stainless steel. The spring constant of the metal spring 92 does not change significantly depending on the temperature.

[0069] The metal spring 92 is provided on the outer periphery of the side wall 74 of the pin body 71. The side wall 74 has a function of guiding (restricting the movement of) the metal spring 92. The metal spring 92 is configured to apply a downward force to the flange 76 with its upper end portion fixed. The upper end portion of the metal spring 92 is fixed to, for example, the umbrella portion 86a (the lower surface of the second portion 87b). The metal spring 92 is disposed so that its lower end portion contacts the upper surface of the flange 76.

[0070] The shape memory alloy spring 94 is a coil spring (compression coil spring) made of a shape memory alloy. The shape memory alloy spring 94 is made of, for example, a Ni-Ti alloy or a Ni-Ti-Cu alloy. When the temperature of the shape memory alloy spring 94 is equal to or higher than the shape recovery temperature (transformation point), the shape memory alloy spring 94 is in a shape-memorized state (a state in which the entire length is extended). When the temperature of the shape memory alloy spring 94 is lower than the shape recovery temperature, the shape memory alloy spring 94 is in a state in which it is contracted by an external force. Hereinafter, the terms "low temperature" and "high temperature" are used based on the temperature (transformation point) at which the shape memory alloy spring 94 recovers its shape. When the shape memory alloy spring 94 is at a low temperature, the second outer periphery support pin 70 is in a first state, and when the shape memory alloy spring 94 is at a high temperature, the second outer periphery support pin 70 is in a second state.

[0071] The shape memory alloy spring 94 is disposed below the top plate 72 and is provided on the outer periphery of the shaft portion 84. The shaft portion 84 has the function of guiding (regulating the movement of) the shape memory alloy spring 94. The shape memory alloy spring 94 is configured to apply an upward force to the top plate 72 with its lower end portion fixed. The lower end portion of the shape memory alloy spring 94 is fixed, for example, to the upper surface of the base portion 82 of the guide member 80. As a result, the base portion 82 is provided between the shape memory alloy spring 94 and the cooling plate 32 in the vertical direction. The shape memory alloy spring 94 is disposed so that its upper end portion contacts the rear surface 72b of the top plate 72.

[0072] As shown in FIG. 8(a), a recess 72c is formed on the back surface 72b of the top plate 72 to accommodate the upper end of the shape memory alloy spring 94. As shown in FIG. 8(b), the upper end of the shape memory alloy spring 94 is accommodated in the recess 72c. The surface forming the recess 72c is a part of the back surface 72b, and contact with the recess 72c corresponds to contact with the back surface 72b. The recess 72c is recessed upward with respect to a part of the back surface 72b where the recess 72c is not formed. The recess 72c has a shape corresponding to the cross-sectional shape of the linear member constituting the shape memory alloy spring 94. The recess 72c may be formed in an annular shape as viewed from below so as to correspond to the annular shape memory alloy spring 94. The recess 72c may be formed in an arc shape as viewed from below.

[0073] Returning to Figures 7(a) and 7(b), the state of the expandable member 90 at low temperatures lower than the transformation point and the state of the expandable member 90 at high temperatures higher than the transformation point will be described. The shape memory alloy spring 94 has the property of being soft at low temperatures and hard at high temperatures. As shown in Figure 7(a), when the shape memory alloy spring 94 becomes cold, it contracts due to the downward force applied to the pin body 71 by the metal spring 92. This causes the second outer periphery support pin 70 to enter the first state. In Figure 7(a), the first protrusion amount is indicated by "d1".

[0074] The shape memory alloy spring 94 is configured so that its total length at high temperatures (the length when the shape is memorized and no external force is applied) is longer than the length in the contracted state shown in FIG. 7(a). When the temperature becomes high, the shape memory alloy spring 94 recovers to the shape memorized state, and its spring constant becomes larger. As shown in FIG. 7(b), the shape memory alloy spring 94 stretches more than in a low temperature environment, and the upward force against the top plate 72 causes the metal spring 92 to contract. This causes the second outer periphery support pin 70 to enter the second state. In FIG. 7(b), the second protrusion amount is indicated by "d2".

[0075] With the above configuration, by changing the temperature of the shape memory alloy spring 94 from a low temperature to a high temperature, the amount of protrusion of the pin body 71 can be increased, and by changing the temperature of the shape memory alloy spring 94 from a high temperature to a low temperature, the amount of protrusion of the pin body 71 can be decreased. As a result, by changing the amount of protrusion of the pin body 71, the support position of the workpiece W (the size of the gap between the back surface Wb of the workpiece W and the upper surface 32a of the cooling plate 32) can be changed.

[0076] The control device 100 is configured with one or more control computers. The control device 100 has, for example, a circuit 120 shown in FIG. 9. The circuit 120 has one or more processors 122, a memory 124, a storage 126, an input / output port 128, and a timer 132. The storage 126 has a computer-readable storage medium, such as a hard disk. The storage medium stores a program for causing the control device 100 to execute a substrate processing method, which will be described later. The storage medium may be a removable medium, such as a non-volatile semiconductor memory, a magnetic disk, or an optical disk.

[0077] The memory 124 temporarily stores the programs loaded from the storage medium of the storage 126 and the results of calculations by the processor 122. The processor 122 executes the above programs in cooperation with the memory 124. The input / output port 128 inputs and outputs electrical signals between the liquid processing unit U1, the heat processing unit U2, etc. in accordance with instructions from the processor 122. The timer 132 measures the elapsed time, for example, by counting reference pulses at a constant period.

[0078] (Substrate processing method) Next, an example of heat treatment performed in the heat treatment unit U2 will be described as an example of a substrate processing method with reference to Figs. 10 and 11. Fig. 10 is a flow chart showing an example of a series of processes performed by the control device 100 in heat treatment of one workpiece W. In this series of processes, the control device 100 performs step S11 in a state in which the cooling plate 32 is placed in a cooling position for cooling the workpiece W. In the initial state when step S11 is performed, the second outer periphery support pins 70 are in a first state in which the protrusion amount is small. Fig. 11(a) illustrates the second outer periphery support pins 70 in the initial state. In addition, while this series of processes is being performed, a state in which a coolant at a substantially constant temperature is supplied from the coolant supply unit 28 at a substantially constant amount continues.

[0079] In step S11, for example, the control device 100 controls the transport device A3 and the cooling section 30 so that the workpiece W to be treated is carried into the heat treatment unit U2. The control device 100 controls the transport device A3 and the cooling section 30 so that the workpiece W to be treated is transferred from the transport device A3 to the cooling plate 32 of the cooling section 30. By executing step S11, the workpiece W to be treated is supported by the support section 60.

[0080] Next, the control device 100 executes step S12. In step S12, for example, the control device 100 controls the cooling unit 30 and the heating unit 40 so that the workpiece W to be treated is transported and delivered to the heating unit 40. In one example, the control device 100 controls the drive unit 36 ​​of the cooling unit 30 so that the cooling plate 32 on which the workpiece W to be treated is placed while being supported by the support unit 60 moves from the cooling position to a delivery position above the hot plate 44. Then, the control device 100 raises the lift pins 52 of the heating unit 40 by the drive unit 54 so that the lift pins 52 support (receive) the workpiece W to be treated. After that, the control device 100 moves the cooling plate 32 to the cooling position by the drive unit 36, and then lowers the lift pins 52 by the drive unit 54 so that the workpiece W to be treated is placed on the placement surface 44a of the hot plate 44.

[0081] Next, the control device 100 executes step S13. In step S13, for example, the control device 100 controls the heat treatment unit U2 so that the workpiece W to be treated is subjected to heat treatment in the heating section 40. In one example, the control device 100 causes the drive section 48 to lower the lid body 46 so that a space for heating is formed above the hot plate 44. Thereafter, the control device 100 waits until a predetermined heating time has elapsed. The heat treatment causes the temperature of the workpiece W to rise to a temperature (e.g., several hundred degrees Celsius) higher than the transformation point of the shape memory alloy spring 94.

[0082] Next, the control device 100 executes step S14. In step S14, for example, the control device 100 controls the cooling unit 30 and the heating unit 40 so that the workpiece W to be processed is received from the heating unit 40. In one example, the control device 100 controls the driving unit 36 ​​to raise the lid body 46 by the driving unit 48 and raise the lift pins 52 by the driving unit 54, and then to move the cooling plate 32 from the cooling position to the transfer position. Then, the control device 100 controls the driving unit 54 to lower the lift pins 52 so that the support units 60 provided on the cooling plate 32 support (receive) the workpiece W to be processed.

[0083] Next, the control device 100 executes step S15. In step S15, for example, the control device 100 controls the heat treatment unit U2 so that the cooling treatment is performed on the workpiece W to be treated at the cooling position. In one example, the control device 100 controls the drive unit 36 ​​so as to move the cooling plate 32 on which the workpiece W to be treated is placed by being supported by the support unit 60 from the transfer position to the cooling position. Thereafter, the control device 100 waits until a predetermined cooling time has elapsed.

[0084] FIG. 11(b) illustrates the state of the second outer periphery support pin 70 immediately after the start of the cooling process. Although the temperature of the workpiece W is high immediately after the start of the cooling process, it takes time for the temperature of the shape memory alloy spring 94 to reach the transformation point, so the second outer periphery support pin 70 is maintained in the first state. When the workpiece W is placed on the second outer periphery support pin 70 in the first state, if the workpiece W is warped in a convex shape, a part (a certain point) of the top plate 72 may come into contact with the back surface of the workpiece W in a biased contact state. However, since the top plate 72 is supported by the spherical surface 84a formed on the upper end of the shaft portion 84 and the shape memory alloy spring 94, the top plate 72 tilts to follow the warp of the workpiece W. As a result, the placement surface 72a of the top plate 72 and the back surface Wb of the workpiece W come into surface contact.

[0085] After a few seconds have passed since the start of the cooling process, the heat of the workpiece W is transferred to the shape memory alloy spring 94, and the temperature of the shape memory alloy spring 94 exceeds the transformation point. As a result, the shape memory alloy spring 94 stretches, and the second outer periphery support pin 70 changes to the second state in which the protrusion amount of the pin body 71 increases, as shown in Fig. 11(c) . When the second outer periphery support pin 70 changes to the second state, the gap between the workpiece W and the cooling plate 32 around the second outer periphery support pin 70 increases, and the degree of temperature drop in the outer periphery of the workpiece W decreases.

[0086] When a dozen to several tens of seconds have passed since the second outer periphery support pins 70 changed (transitioned) to the second state, the temperature of the shape memory alloy springs 94 is lowered by cooling by the cooling plate 32, and the temperature of the shape memory alloy springs 94 falls below the transformation point. As a result, the shape memory alloy springs 94 become softer than when they are at high temperatures, and the second outer periphery support pins 70 change from the second state to the first state, as shown in Fig. 11(d). Thereafter, in the latter stage of the cooling process, the workpiece W is cooled while the workpiece W and the cooling plate 32 are in close proximity to each other.

[0087] Returning to FIG. 10, after the cooling process is completed, the control device 100 executes steps S16 and S17. In step S16, for example, the control device 100 waits until the unloading timing. The unloading timing may be preset to a timing after a predetermined time has elapsed since the cooling process is completed, or may be a timing set during a series of processes depending on the operating status of the transport device A3. In step S17, for example, the control device 100 controls the cooling section 30 and the transport device A3 so that the workpiece W to be processed that is placed on the cooling plate 32 is unloaded from the heat treatment unit U2.

[0088] This completes the series of processes performed in the heat treatment unit U2 on one workpiece W. Thereafter, the control device 100 may repeatedly perform steps S11 to S17 on the subsequent workpiece W.

[0089] (Modification) The above-mentioned series of processes is an example and can be changed as appropriate. In the above-mentioned series of processes, the control device 100 may execute one step and the next step in parallel, or may execute each step in an order different from the above-mentioned example. The control device 100 may execute a process different from the above-mentioned example.

[0090] In order to shorten the time until the shape memory alloy spring 94 reaches the transformation point after the start of the cooling process, the degree of cooling of the cooling plate 32 by the coolant supply unit 28 may be adjusted when the cooling process is not being performed. In one example, the control device 100 may perform a non-cooling process in which the support unit 60 waits without supporting the workpiece W to be processed, and then performs the cooling process of step S15 described above after the non-cooling process. A process other than the cooling process may be performed on the workpiece W during the non-cooling process. The non-cooling process may be a process in which the cooling plate 32 waits at the cooling position during the period in which the above-mentioned step S13 is being performed.

[0091] The control device 100 may control the coolant supply unit 28 so that the degree of cooling of the cooling plate 32 by the coolant in the non-cooling process is smaller than that in the cooling process. The control device 100 controls the coolant supply unit 28, for example, so that the amount of coolant supplied in the non-cooling process is smaller than the amount of coolant supplied per unit time in the cooling process. Reducing the amount of coolant supplied in the non-cooling process includes not supplying coolant to the cooling plate 32 in the non-cooling process (i.e., setting the amount of coolant supplied to zero). The control device 100 may control the coolant supply unit 28 so that in the non-cooling process, the coolant is supplied to the cooling plate 32 at a lower temperature than the temperature of the coolant supplied during the cooling process.

[0092] In order to shorten the time until the shape memory alloy spring 94 reaches the transformation point after the start of the cooling process, the time the cooling plate 32 stays above the hot plate 44 (stay time) may be adjusted when moving the cooling plate 32 to the cooling position after receiving the workpiece W from the heating unit 40. The control device 100 controls the driving unit 36 ​​of the cooling unit 30 so that the stay time when the warpage shape of the workpiece W to be treated is convex warped is longer than the stay time when the warpage shape is not convex warped.

[0093] In one example, the control device 100 acquires shape information that is information indicating the warpage shape of the workpiece W to be processed. The control device 100 may acquire the shape information from an inspection unit provided in the coating and developing apparatus 2, or acquires the shape information based on a user input. In response to the shape information, the control device 100 controls the drive unit 36 ​​to adjust the time that the cooling plate 32 stays above the hot plate 44 when moving the cooling plate 32 from the transfer position to the cooling position after receiving the workpiece W to be processed. The time that the cooling plate 32 stays above the hot plate 44 is defined as the time that at least a part of the cooling plate 32 overlaps with the hot plate 44 when viewed from above.

[0094] In one example, when the warpage shape of the workpiece W to be processed is a convex warp, the control device 100 controls the drive unit 36 ​​so that the moving speed when moving the workpiece W from the delivery position to the cooling position is slower than when the warpage shape is not a convex warp. Alternatively, when the warpage shape of the workpiece W to be processed is a convex warp, the control device 100 controls the drive unit 36 ​​so that the time during which the cooling plate 32 is stopped above the hot plate 44 is longer than when the warpage shape is not a convex warp.

[0095] In the above example, the support part 60 has a plurality of first outer periphery support pins 68 and a plurality of second outer periphery support pins 70, but the support part 60 may have a plurality of second outer periphery support pins 70 without having a plurality of first outer periphery support pins 68. In the above example, the heat-treating unit U2 has a cooling part 30 and a heating part 40, but the heat-treating unit U2 may have the cooling part 30 without having the heating part 40. The position of the cooling plate 32 of the cooling part 30 may be fixed.

[0096] (Effects of the embodiment) The coating and developing apparatus 2 according to the first embodiment described above includes the cooling plate 32 for cooling the workpiece W, and the support portion 60 for supporting the back surface Wb of the workpiece W such that a gap is formed between the upper surface 32a of the cooling plate 32 and the back surface Wb of the workpiece W. The support portion 60 includes a central support pin 64 disposed in the central region CA of the cooling plate 32 and provided on the cooling plate 32 so as to protrude from the upper surface 32a of the cooling plate 32, and a second outer peripheral support pin 70 disposed in the outer peripheral region PA of the cooling plate 32 and provided on the cooling plate 32 so as to protrude from the upper surface 32a of the cooling plate 32. The second outer peripheral support pin 70 includes a pin body 71 for supporting the back surface Wb of the workpiece W, and an expandable member 90 for changing the amount by which the pin body 71 protrudes from the upper surface 32a of the cooling plate 32 depending on the temperature. The expandable member 90 is configured to change, when the temperature rises, from a first state in which the pin body 71 protrudes from the upper surface 32a of the cooling plate 32 by a first protrusion amount to a second state in which the pin body 71 protrudes from the upper surface 32a of the cooling plate 32 by a second protrusion amount that is larger than the first protrusion amount. The first protrusion amount is smaller than the amount by which the central support pin 64 protrudes from the upper surface 32a of the cooling plate 32.

[0097] The amount of warping of the workpiece W tends to increase with increasing stacking density of the workpiece W (substrate). When the workpiece W is warped such that the central portion of the workpiece W protrudes toward the surface side, if the workpiece W after heat treatment is placed on a cooling plate, the amount of warping of the workpiece W may increase during cooling. This increase in the amount of warping is considered to be caused by the fact that the outer peripheral portion of the workpiece W is rapidly cooled in the initial stage of cooling after the workpiece W is placed on the cooling plate, increasing the temperature difference between the outer peripheral portion and the central portion of the workpiece W. In order to eliminate the effect of the increased amount of warping, it is conceivable to sufficiently extend the time for cooling the workpiece W until the increase due to the temperature difference becomes zero, but there is a concern that the cooling time will be long and the processing efficiency of the workpiece W will decrease.

[0098] In contrast, the coating and developing apparatus 2 is provided with an expandable member 90 that changes the state from the first state to the second state so that the amount of protrusion of the pin body 71 increases when the temperature rises. Therefore, when the heated workpiece W in a convexly warped state is placed on the cooling plate 32, the heat from the workpiece W causes the pin body 71 to transition to the second state in which it protrudes by the second amount of protrusion. This makes it difficult for the outer periphery of the workpiece W to be rapidly cooled in the initial stage of cooling, and suppresses an increase in the amount of warping caused by an increase in the temperature difference between the outer periphery and the center of the workpiece W. In addition, in the latter stage of cooling, the temperature of the second spring decreases due to a decrease in the temperature of the workpiece W, and the workpiece W transitions from the second state to the first state in which the amount of protrusion is smaller, so that cooling by the cooling plate 32 is promoted compared to the second state. As a result, it is not necessary to cool for a longer period of time to eliminate the effect of an increase in the amount of warping, and a decrease in the processing efficiency of the workpiece W can be suppressed.

[0099] Depending on the type of workpiece W, the workpiece W may be warped in a convex shape, may have almost no warping, or may be warped in a concave shape so that the central portion protrudes toward the back side. In the case of a flat workpiece W without warping or a concave warping, when the workpiece W is placed on the cooling plate 32, the outer periphery of the workpiece W and the cooling plate 32 do not come close to each other, and the temperature difference between the outer periphery and the central portion is unlikely to occur due to cooling of only the outer periphery. Therefore, in some cases, the cooling time can be shortened by not protruding the pin body 71. In the coating and developing apparatus 2, before the workpiece W is placed on the cooling plate 32, the pin body 71 protrudes by a first protruding amount, which is smaller than the amount by which the central support pin protrudes. Therefore, when performing a cooling process on a flat workpiece W without warping or a workpiece W having a concave warping, the workpiece W does not come into contact with or come close to the second outer periphery support pin 70 (pin body 71), and the second outer periphery support pin 70 does not transition to the second state. As a result, when it is not necessary depending on the warpage shape, the pin body 71 can be kept in the initial state, and an increase in cooling time can be prevented. From the above, the coating and developing apparatus 2 is useful for improving the efficiency of processing the workpiece W.

[0100] The pin body 71 may include a top plate 72 on which the back surface Wb of the workpiece W is placed, a side wall 74 extending downward from the periphery of the top plate 72, and a flange 76 extending outward from the lower end of the side wall 74. The expandable member 90 may include a first spring (metal spring 92) provided on the outer periphery of the side wall 74 and configured to apply a downward force to the flange 76 with the upper end fixed, and a second spring (shape memory alloy spring 94) arranged below the top plate 72 and configured to apply an upward force to the top plate 72 with the lower end fixed. The second spring may be configured to contract due to the downward force of the first spring in the first state, and to expand more than in the first state in the second state, causing the first spring to contract due to the upward force applied to the top plate 72.

[0101] In this case, the first spring and the second spring are arranged side by side in a direction along the upper surface 32a of the cooling plate 32. Therefore, it is possible to avoid an increase in the length of the second outer periphery support pin 70 (the length in a direction perpendicular to the upper surface 32a) caused by providing the elastic member 90. Therefore, even if the thickness of the cooling plate 32 is small, it is easy to provide the second outer periphery support pin 70.

[0102] The second outer periphery support pin 70 may further include an umbrella portion 86a to which an upper end portion of a first spring (metal spring 92) is fixed and which is provided so as to surround the side wall 74, and a base portion 82 to which a lower end portion of a second spring (shape memory alloy spring 94) is fixed and which is provided between the second spring and the cooling plate 32. The thermal conductivity of the umbrella portion 86a may be higher than the thermal conductivity of the base portion 82.

[0103] In order to suppress an increase in the amount of warping caused by rapid cooling of the outer peripheral portion of the workpiece W, it is desirable to transition to the second state at a relatively early time in the initial stage when the workpiece W is placed. Part of the heat is transferred from the workpiece W to the second spring via the umbrella portion 86a, and part of the cooling of the second spring by the cooling plate 32 is performed via the base portion 82. In the above configuration, since the thermal conductivity of the umbrella portion 86a is higher than that of the base portion 82, it is difficult for the cooling plate 32 to take away heat from the second spring, and heat from the workpiece W is easily transferred to the second spring at the initial stage when the workpiece W is placed. As a result, since the workpiece W can be transitioned to the second state at a relatively early time in the initial stage, it is useful for suppressing an increase in the amount of warping.

[0104] The second outer periphery support pin 70 may further include a shaft portion 84 that is disposed below the top plate 72 and configured to support the back surface 72b of the top plate 72 in the first state. The top plate 72 may include a planar mounting surface 72a on which the back surface Wb of the workpiece W is placed. The shaft portion 84 may include a convex spherical surface 84a with which the back surface 72b of the top plate 72 comes into contact in the first state.

[0105] When the convexly warped workpiece W is placed so as to contact the planar mounting surface 72a of the top plate 72, there is a possibility that the back surface Wb of the workpiece W may come into contact with a part of the mounting surface 72a. In the above configuration, the back surface 72b of the top plate 72 is supported by the spherical surface 84a, so that the inclination of the mounting surface 72a is adjusted (follows) in accordance with the warped shape of the workpiece W. Therefore, the contact area between the mounting surface 72a and the back surface Wb becomes large, and heat is easily transferred from the workpiece W to the second spring via the top plate 72. As a result, in the above initial stage, the workpiece W can be transitioned to the second state at a relatively early time, which is useful for suppressing an increase in the amount of warpage.

[0106] A recess 72c for accommodating the upper end of the second spring (shape memory alloy spring 94) may be formed on the back surface 72b of the top plate 72. In this case, the distance between the workpiece W supported by the pin body 71 and the second spring is shorter than when the recess 72c is not formed. Therefore, heat is easily transferred from the workpiece W to the second spring via the top plate 72. As a result, in the above-mentioned initial stage, the transition to the second state can be made relatively quickly, which is useful for suppressing an increase in the amount of warping.

[0107] The substrate processing system 1 described above includes the coating and developing apparatus 2 and the control device 100 that controls the coating and developing apparatus 2. The coating and developing apparatus 2 may further include a coolant supply unit 28 that supplies a coolant to the cooling plate 32. The control device 100 may execute a non-cooling process in which the support unit 60 waits without supporting the workpiece W, and a cooling process in which the support unit 60 supports the workpiece W and the cooling plate 32 cools the workpiece W after the non-cooling process. The control device 100 may control the coolant supply unit 28 so that the degree of cooling of the cooling plate 32 by the coolant in the non-cooling process is smaller than that in the cooling process.

[0108] By reducing the degree of cooling by the refrigerant in the non-cooling process before the cooling process, the degree to which the second spring is cooled by the cooling plate 32 during the non-cooling process can be reduced. Therefore, compared to the case where the degree of cooling by the refrigerant is not changed during the non-cooling process, the temperature of the second spring immediately after the workpiece W is placed can be increased. As a result, in the above-mentioned initial stage, it is possible to transition to the second state at a relatively early time, which is useful for suppressing an increase in the amount of warping.

[0109] The substrate processing system 1 described above includes the coating and developing apparatus 2 and the control device 100 that controls the coating and developing apparatus 2. The coating and developing apparatus 2 may further include a housing 20 that houses the cooling plate 32 and a hot plate 44 that is disposed in the housing 20 and heats the workpiece W. The cooling plate 32 may be movable between a transfer position where the workpiece W is transferred to the hot plate 44 with the hot plate 44 and the cooling plate 32 overlapping each other, and a cooling position where the workpiece W is cooled with the hot plate 44 and the cooling plate 32 separated from each other after heating by the hot plate 44. The control device 100 may acquire shape information indicating the warped shape of the workpiece W, and adjust the time that the cooling plate 32 stays above the hot plate 44 when moving the cooling plate 32 from the transfer position to the cooling position after receiving the workpiece W according to the shape information.

[0110] The hot plate 44 is in a high temperature state after the workpiece W is heated. Therefore, when the cooling plate 32 moves after receiving the workpiece W, the temperature of the second spring after the workpiece W is placed on the cooling plate 32 can be increased by the heat of the hot plate 44 by lengthening the time that the cooling plate 32 stays above the hot plate 44. For example, when the warp shape is a convex warp, the temperature of the second spring can be increased by the heat of the hot plate 44 by lengthening the time that the second spring stays above the hot plate 44 compared to when the warp shape is another shape. As a result, in the above-mentioned initial stage, the second state can be transitioned to the second state at a relatively early time, which is useful for suppressing an increase in the amount of warp.

[0111] The substrate processing method according to the first embodiment described above includes transferring the workpiece W to the cooling plate 32 having the support parts 60, including the central support pins 64 arranged in the central region CA and the second peripheral support pins 70 arranged in the peripheral region PA, on the upper surface 32a of the cooling plate 32, cooling the workpiece W by continuing the state in which the workpiece W is supported by the support parts 60 so that a gap is formed between the upper surface 32a of the cooling plate 32 and the back surface Wb of the workpiece W, and removing the workpiece W from the cooling plate 32 after cooling the workpiece W. Transferring the workpiece W to the cooling plate 32 includes transferring the workpiece W to the cooling plate 32 in a first state in which the pin bodies 71 included in the second peripheral support pins 70 are protruded by a first protrusion amount smaller than the amount by which the central support pins 64 protrude from the upper surface 32a of the cooling plate 32. Continuing the state in which the workpiece W is supported includes supporting the workpiece W in the second state after transitioning from the first state to a second state in which the pin body 71 is protruded by a second protrusion amount greater than the first protrusion amount as a result of an increase in temperature of the expandable member 90 configured to change the amount by which the pin body 71 protrudes. Transporting the workpiece W includes transporting the workpiece W from the cooling plate 32 in the first state after transitioning from the second state to the first state as a result of a decrease in temperature of the expandable member 90.

[0112] In this substrate processing method, similar to the above-mentioned coating and developing apparatus 2, rapid cooling of the outer periphery of the workpiece W in the initial stage of cooling is unlikely to occur, and an increase in the amount of warping caused by an increase in the temperature difference between the outer periphery and the center of the workpiece W is suppressed. Furthermore, when it is not necessary depending on the warping shape, the pin body 71 can be kept in the initial state, and an increase in cooling time can be prevented. Therefore, the above-mentioned substrate processing method is useful for improving the efficiency of processing the workpiece W.

[0113] [Second embodiment] Next, a coating and developing apparatus 2 (substrate processing apparatus) according to a second embodiment will be described with reference to Figs. 12(a) and 12(b). The coating and developing apparatus 2 according to the second embodiment differs from the coating and developing apparatus 2 according to the first embodiment in that the cooling section 30 has a supporting section 60A instead of the supporting section 60. The supporting section 60A differs from the supporting section 60 in the following two points. As shown in Fig. 12(a), the protruding amount of the second outer periphery supporting pin 70 of the supporting section 60A in the first state is approximately equal to the protruding amount of the central supporting pin 64. The protruding amount of the first outer periphery supporting pin 68 of the supporting section 60A is approximately equal to the protruding amount of the central supporting pin 64.

[0114] When a workpiece W having a flat warped shape is placed on the cooling plate 32 provided with the support portion 60A, the back surface Wb of the workpiece W may come into contact with the tips of the central support pin 64, the first outer peripheral support pin 68, and the second outer peripheral support pin 70. When the temperature of the shape memory alloy spring 94 rises after the heated workpiece W is placed on the cooling plate 32, the second outer peripheral support pin 70 of the support portion 60A changes from a first state in which it protrudes by a first protrusion amount to a second state in which it protrudes by a second protrusion amount, as shown in FIG. 12(b). Then, after changing to the second state, when the temperature of the shape memory alloy spring 94 drops, the second outer peripheral support pin 70 of the support portion 60A changes from the second state to the first state. When a convexly warped workpiece W is placed on the cooling plate 32, the support portion 60A operates in the same manner.

[0115] The coating and developing apparatus 2 according to the second embodiment is also provided with an expandable member 90. Therefore, when the heated workpiece W is placed on the cooling plate 32, the pin body 71 transitions to the second state in which it protrudes further due to heat from the workpiece W. This makes it difficult for the outer periphery of the workpiece W to be rapidly cooled in the initial stage of cooling, and suppresses an increase in the amount of warping caused by an increase in the temperature difference between the outer periphery and the center of the workpiece W. As a result, it is not necessary to cool the workpiece W for a longer period of time in order to eliminate the effect of an increase in the amount of warping, and a decrease in the processing efficiency of the workpiece W can be suppressed. Therefore, it is useful for improving the processing efficiency of the workpiece W.

[0116] [Third embodiment] Next, a coating and developing apparatus 2 (substrate processing apparatus) according to a third embodiment will be described with reference to Figures 13(a) and 13(b). The coating and developing apparatus 2 according to the third embodiment differs from the coating and developing apparatus 2 according to the first embodiment in that the cooling section 30 has a supporting section 60B instead of the supporting section 60. The supporting section 60B differs from the supporting section 60 in that the second outer periphery support pin 70 has an expanding member 90B instead of the expanding member 90.

[0117] The elastic member 90B has a metal spring 92 and a shape memory alloy spring 94, similar to the elastic member 90. While the metal spring 92 of the elastic member 90 is provided on the outer periphery of the side wall 74 of the pin body 71, the metal spring 92 of the elastic member 90B is provided on the outer periphery of the shaft portion 84 of the guide member 80 below the top plate 72. The metal spring 92 of the elastic member 90B is configured to apply an upward force to the top plate 72 with its lower end fixed to the base portion 82.

[0118] While the shape memory alloy spring 94 of the expandable member 90 is provided on the outer periphery of the shaft portion 84 below the top plate 72, the shape memory alloy spring 94 of the expandable member 90B is provided on the outer periphery of the side wall 74. The shape memory alloy spring 94 of the expandable member 90B is configured to apply a downward force to the flange 76 with its upper end fixed to the cover member 86 (umbrella portion 86a).

[0119] The expandable member 90B is configured to change the second outer periphery support pin 70 from a third state in which the second outer periphery support pin 70 protrudes from the upper surface 32a of the cooling plate 32 by a third protrusion amount to a fourth state in which the second outer periphery support pin 70 protrudes from the upper surface 32a of the cooling plate 32 by a fourth protrusion amount smaller than the third protrusion amount when the temperature rises. In the third state shown in Fig. 13(a), the shape memory alloy spring 94 is contracted by the upward force of the metal spring 92. In the fourth state shown in Fig. 13(b), the shape memory alloy spring 94 is expanded more than in the third state, and the downward force against the flange 76 causes the metal spring 92 to contract.

[0120] As in the cooling process according to the first embodiment, the heated workpiece W may be placed on the second outer periphery support pin 70 having the expandable member 90B, and the cooling process may be started. At the start of the cooling process, the second outer periphery support pin 70 is in the third state in which the protrusion amount is large. Immediately after the heated workpiece W is placed, the temperature of the shape memory alloy spring 94 of the expandable member 90B does not reach the transformation point, and the second outer periphery support pin 70 is maintained in the third state.

[0121] After a certain amount of time has elapsed since the start of the cooling process, the temperature of the shape memory alloy spring 94 exceeds the transformation point, and the second outer periphery support pin 70 changes from the third state to the fourth state in which the protrusion amount is smaller. After changing to the fourth state, when the temperature of the shape memory alloy spring 94 falls below the transformation point, the second outer periphery support pin 70 changes from the fourth state to the third state. As described above, in the previous stage (initial stage) of the cooling process, the distance between the back surface Wb and the upper surface 32a of the workpiece W can be increased. Then, in the later stage of the cooling process, the distance between the back surface Wb and the upper surface 32a of the workpiece W can be reduced.

[0122] In the coating and developing apparatus 2 according to the third embodiment, the heated workpiece W is placed on the cooling plate 32 in the third state in which the amount of protrusion is greater. This makes it difficult for the outer periphery of the workpiece W to be rapidly cooled in the initial stage of cooling, and suppresses an increase in the amount of warping caused by an increase in the temperature difference between the outer periphery and the center of the workpiece W. As a result, it is not necessary to cool for a longer period of time to eliminate the effect of an increase in the amount of warping, and it is possible to suppress a decrease in the processing efficiency of the workpiece W. In addition, in the latter stage of cooling, the temperature of the expandable member 90 rises and the workpiece transitions from the third state to a fourth state in which the amount of protrusion is smaller, so that the cooling by the cooling plate 32 is promoted compared to the third state. From the above, it is useful for improving the efficiency of processing the workpiece W. [Explanation of symbols]

[0123] 1...substrate processing system, 2...coating and developing apparatus, U2...thermal processing unit, 28...coolant supply section, 44...hot plate, 32...cooling plate, 32a...upper surface, CA...central region, PA...peripheral region, 60...support section, 64...central support pin, 70...second peripheral support pin, 71...pin body, 72...top plate, 72a...mounting surface, 72b...rear surface, 72c...recess, 74...side wall, 76...flange, 82...base portion, 84...shaft portion, 84a...spherical surface, 86a...umbrella portion, 90...expandable member, 92...metal spring, 94...shape memory alloy spring, W...workpiece, Wb...rear surface.

Claims

1. A cooling plate for cooling the substrate; a support portion that supports the rear surface of the substrate such that a gap is formed between an upper surface of the cooling plate and the rear surface of the substrate; The support portion is a central support pin disposed in a central region of the cooling plate and provided on the cooling plate so as to protrude from an upper surface of the cooling plate; a peripheral support pin disposed in a peripheral region of the cooling plate and provided on the cooling plate so as to protrude from an upper surface of the cooling plate; the outer periphery support pin includes a pin body that supports a rear surface of the substrate, and an expandable member that changes an amount by which the pin body protrudes from an upper surface of the cooling plate in response to a temperature; the expandable member is configured to change, when a temperature rises, a state in which the pin body protrudes from the upper surface of the cooling plate by a first protrusion amount to a second state in which the pin body protrudes from the upper surface of the cooling plate by a second protrusion amount larger than the first protrusion amount, the first protrusion amount is smaller than an amount by which the central support pin protrudes from an upper surface of the cooling plate.

2. the pin body includes a top plate on which the back surface of the substrate is placed, a side wall extending downward from a peripheral portion of the top plate, and a flange extending outward from a lower end of the side wall; The elastic member includes a first spring provided on the outer periphery of the side wall and configured to apply a downward force to the flange with an upper end portion fixed, and a second spring disposed below the top plate and configured to apply an upward force to the top plate with a lower end portion fixed, 2. The substrate processing apparatus of claim 1, wherein the second spring is configured to contract due to a downward force of the first spring in the first state, and is configured to extend more than in the first state in the second state so as to contract the first spring due to an upward force against the top plate.

3. the outer periphery support pin further includes an umbrella portion to which an upper end portion of the first spring is fixed and which is provided so as to surround the side wall, and a base portion to which a lower end portion of the second spring is fixed and which is provided between the second spring and the cooling plate, The substrate processing apparatus according to claim 2 , wherein the heat conductivity of the umbrella portion is higher than the heat conductivity of the base portion.

4. The outer periphery support pin further includes a shaft portion disposed below the top plate and configured to support a rear surface of the top plate in the first state, the top plate includes a planar mounting surface on which the back surface of the substrate is placed, The substrate processing apparatus according to claim 2 , wherein the shaft portion includes a convex spherical surface that comes into contact with a rear surface of the top plate in the first state.

5. 5. The substrate processing apparatus according to claim 2, wherein a recess for accommodating an upper end of the second spring is formed on a rear surface of the top plate.

6. A substrate processing apparatus according to any one of claims 1 to 5, A control device for controlling the substrate processing apparatus, the substrate processing apparatus further includes a coolant supply unit that supplies a coolant to the cooling plate, The control device includes: a non-cooling process in which the substrate is in a standby state without being supported by the supporting portion, and a cooling process in which the substrate is supported by the supporting portion and the substrate is cooled by the cooling plate after the non-cooling process, a substrate processing system that controls the coolant supply unit so that a degree of cooling of the cooling plate by the coolant in the non-cooling process is smaller than a degree of cooling in the cooling process.

7. A substrate processing apparatus according to any one of claims 1 to 5, A control device for controlling the substrate processing apparatus, the substrate processing apparatus further includes a housing that houses the cooling plate, and a hot plate that is disposed within the housing and heats the substrate; the cooling plate is movable between a transfer position where the substrate is transferred to the hot plate in a state where the hot plate and the cooling plate are overlapped, and a cooling position where the substrate is cooled after heating by the hot plate in a state where the hot plate and the cooling plate are separated from each other; The control device includes: acquiring shape information indicating a warpage shape of the substrate; and adjusting, in accordance with the shape information, a time during which the cooling plate stays above the hot plate when the cooling plate after receiving the substrate is moved from the delivery position to the cooling position.

8. transferring the substrate to a cooling plate having a support portion on an upper surface thereof, the support portion including a central support pin arranged in a central region and a peripheral support pin arranged in a peripheral region; cooling the substrate by continuing to support the substrate by the support portion such that a gap is formed between an upper surface of the cooling plate and a rear surface of the substrate; removing the substrate from the cooling plate after cooling the substrate; transferring the substrate to the cooling plate includes transferring the substrate to the cooling plate in a first state in which pin bodies included in the outer periphery support pins are protruded by a first protrusion amount that is smaller than an amount by which the central support pins protrude from an upper surface of the cooling plate, continuing to support the substrate includes transitioning from the first state to a second state in which the pin body is protruded by a second protrusion amount greater than the first protrusion amount due to an increase in temperature of an expandable member configured to change an amount by which the pin body protrudes, and then supporting the substrate in the second state. The substrate processing method includes removing the substrate from the cooling plate in the first state after a temperature of the expandable member decreases, causing a transition from the second state to the first state.

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