Overlay measurement device and method, and system and program therefor

Abstract

To provide an overlay measurement device and method and a system and program therefor, the overlay measurement device and method enabling a manager to remotely and conveniently control the measurement device and to create a recipe without using the measurement device.SOLUTION: An overlay measurement system 100 including a user terminal (e.g.: computer, notebook computer) and at least one measurement device includes a transmission / reception unit, and a processor electrically connected to the transmission / reception unit. The processor is set to acquire data transmitted from the user terminal through the transmission / reception unit, to analyze a recipe contained in the data, and to perform an optimization process for a wafer measurement option based on the recipe when the analysis of the recipe is completed.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to an overlay metrology apparatus and method, and a system therefor. [Background technology]

[0002] Typically, as technology advances, the size of the semiconductor devices whose characteristics are to be measured on the wafer decreases, and the density of integrated circuits in the measurement equipment increases. To form integrated circuits on a wafer, multiple manufacturing steps must be performed to sequentially form the desired circuit structures and elements at specific locations. These manufacturing steps sequentially produce patterned layers on the wafer.

[0003] These repeated stacking steps create electrically active patterns in the integrated circuit. If the structures are not aligned within the tolerances allowed by the production process, interference between the electrically active patterns can occur, which can cause problems in the performance and reliability of the manufactured circuit. To measure and verify the alignment errors between these layers, the administrator inputs or sets up a recipe that measures the characteristics of the wafer in the equipment.

[0004] However, conventionally, managers have had to input recipes directly into measuring devices, which places time and space constraints on them.

[0005] Furthermore, conventionally, a manager would directly select options such as filters, apertures, focus, and pinholes, and repeatedly perform measurements and check the values ​​to determine the optimal options. This means that the manager's skill, ability, and experience act as major variables, making it impossible to efficiently measure the characteristics of wafers based on the optimized options.

[0006] Thus, a need arises to optimize recipe options while measuring the recipe.

[0007] In addition, the need for the measurement device to perform the optimization process for the options by transmitting the minimum information required for optimization to the measurement device is raised. Summary of the Invention [Problem to be solved by the invention]

[0008] SUMMARY OF THE PRESENT EMBODIMENTS Accordingly, the present invention provides an overlay metrology apparatus and method, and a system therefor.

[0009] Also, the present invention provides a manager program that is driven by an administrator PC and transmits information about recipes so that the measurement tool can perform an optimization process for measurement options.

[0010] The present invention also provides a metrology apparatus and method for performing an optimization process for wafer measurement options based on data received by an administrator PC.

[0011] The object of the present invention is not limited to the object mentioned above, and other objects and advantages of the present invention not mentioned can be understood from the following description and can be more clearly understood from the embodiments of the present invention. In addition, it is easy to understand that the object and advantages of the present invention can be realized by the means and combinations thereof as set forth in the claims. [Means for solving the problem]

[0012] To achieve this object, an overlay metrology apparatus according to an embodiment of the present invention includes a transceiver unit and a processor electrically connected to the transceiver unit, wherein the processor is configured to acquire data transmitted from a user terminal via the transceiver unit, analyze a recipe included in the data, and upon completing the analysis of the recipe, perform an optimization process for measurement options of a wafer based on the recipe.

[0013] In addition, in a computer-readable recording medium storing a program including commands for controlling the operation of the overlay measurement system according to an embodiment of the present invention, the program may include commands for generating data including information about a recipe input by a manager program and unique information about an overlay measurement device, and commands for transmitting the generated data to an overlay measurement device corresponding to the unique information, and performing an optimization process for measurement options of the wafer based on the recipe when the overlay measurement device completes analysis of the recipe.

[0014] In addition, an overlay measurement system according to an embodiment of the present invention may include a user terminal that generates data including information regarding a recipe input by a manager program and unique information regarding an overlay measurement device and transmits the generated data to an overlay measurement device corresponding to the unique information, and the overlay measurement device that analyzes the recipe included in the data received from the user terminal and, upon completing the analysis of the recipe, performs an optimization process for measurement options of the wafer based on the recipe.

[0015] In addition, the method of the overlay metrology apparatus according to an embodiment of the present invention may include the steps of: receiving data from a user terminal; analyzing a recipe included in the data; and, upon completing the analysis of the recipe, performing an optimization process for measurement options of the wafer based on the recipe.

[0016] In addition, an overlay measurement system method according to an embodiment of the present invention may include a step of a user terminal generating data including information regarding a recipe inputted through a manager program and specific information regarding an overlay measurement device, and transmitting the generated data to an overlay measurement device corresponding to the specific information; and a step of the overlay measurement device analyzing the recipe included in the data received from the user terminal, and performing an optimization process for measurement options of a wafer based on the recipe upon completing the analysis of the recipe. Effect of the Invention

[0017] In the present invention, a user terminal generates data including information about a recipe inputted through a manager program and unique information about a measuring device, and transmits the generated data to a measuring device corresponding to the unique information, thereby enabling an administrator to conveniently control the measuring device remotely and to generate a recipe without using a measuring device.

[0018] In addition, the present invention allows a measurement device to analyze a recipe included in data received from a user terminal, and upon completing the analysis of the recipe, performs an optimization process for measurement options of the wafer based on the recipe, thereby efficiently measuring characteristics of the wafer based on the optimized options.

[0019] In addition, the present invention allows the user terminal to generate data including information indicating whether to perform an optimization process for the measurement options of the wafer, thereby allowing the measurement device to automatically perform an optimization process for the measurement options of the wafer.

[0020] Furthermore, in the present invention, the user terminal generates data including specific information of the measuring device, and the user terminal can transmit the data to each of the multiple measuring devices.

[0021] In addition, the present invention can perform a filter optimization process by measuring one or more filters in a measurement device once, calculating statistics for a plurality of parameters for each filter, assigning weights to the calculated statistics, and selecting a filter that minimizes the sum of the statistics to which the weights are assigned.

[0022] In addition, the present invention may perform an aperture optimization process by measuring one or more apertures in a measurement device once, calculating statistics for the plurality of parameters for each aperture, assigning weights to the calculated statistics, and selecting an aperture for which the sum of the statistics to which the weights are assigned is the smallest.

[0023] In addition, the present invention can perform a focus optimization process by performing a focus scan at one site in a measurement device to determine a focus measurement area, moving the focus by one step within the determined measurement area for each site, calculating statistics for the multiple parameters, assigning weights to the calculated statistics, and selecting a focus that minimizes the sum of the statistics to which the weights are assigned.

[0024] In addition, the present invention can perform a pinhole optimization process by performing one measurement at a first pinhole position determined by an aperture in a measurement device, performing one measurement at a second pinhole position moved a certain distance from the first pinhole position, calculating the Tis 3 sigma at the first pinhole position and the second pinhole position, modeling the Tis 3 sigma for each pinhole position determined by the aperture, and selecting a pinhole position where the Tis 3 sigma is minimum.

[0025] In addition, the present invention stores information regarding the options selected from each of the filter optimization process, aperture optimization process, focus optimization process, and pinhole optimization process, thereby providing consistent automatic optimization based on data regardless of the user's experience.

[0026] The above-mentioned effects and specific effects of the present invention will be described in conjunction with the following description of the preferred embodiment of the invention. [Brief description of the drawings]

[0027] [Figure 1] 1 is an exemplary diagram illustrating an overlay measurement system according to an embodiment of the present invention; [Diagram 2] 1 is a conceptual diagram of an overlay measurement apparatus according to an embodiment of the present invention; [Diagram 3] FIG. 1 is a block diagram of an overlay metrology system in accordance with one embodiment of the present invention. [Figure 4]4 is a flow chart illustrating a process in which a user terminal transmits data to a measurement device according to an embodiment of the present invention; [Diagram 5] FIG. 13 is an exemplary diagram showing information regarding a plurality of parameters inputted into a manager program according to an embodiment of the present invention. [Figure 6] FIG. 11 is a flow chart showing a process in which the measurement device according to the embodiment of the present invention performs optimization based on a recipe file. [Figure 7] 1 is an exemplary diagram showing a state in which a measurement device according to an embodiment of the present invention performs optimization based on a recipe file; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] The above-mentioned objects, features and advantages will be described in detail below with reference to the accompanying drawings, so that a person having ordinary skill in the art to which the present invention pertains can easily implement the technical idea of ​​the present invention. In describing the present invention, if a detailed description of a known technology according to the present invention is deemed to make the gist of the present invention unclear, the detailed description will be omitted. Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings are used to indicate the same or similar components.

[0029] Although the terms "first", "second", etc. are used to describe various components, it is understood that these components are not limited by these terms. These terms are used merely to distinguish one component from another, and it is understood that a first component may also be a second component unless otherwise specified.

[0030] Hereinafter, when an arbitrary structure is arranged on the "top (or bottom)" of a component or "above (or below)" a component, it means that the arbitrary structure is not only arranged in contact with the upper surface (or lower surface) of the component, but also that other structures may be interposed between the component and the arbitrary structure arranged on (or below) the component.

[0031] In addition, when a component is described as being "coupled," "coupled," or "connected" to another component, it should be understood that the components may be directly coupled or connected to each other, but that there may be other components "intervening" between each component, or each component may be "coupled," "coupled," or "connected" via other components.

[0032] Throughout the specification, unless otherwise specified to the contrary, each element may be singular or plural.

[0033] As used herein, singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "include" should not be interpreted as including all of the multiple components or multiple steps described in the specification, and should be interpreted as including some of the components or steps that may not be included or may include additional components or steps.

[0034] Throughout the specification, "A and / or B" means A, B, or A and B, unless otherwise specified, and "C to D" means C or more and D or less, unless otherwise specified.

[0035] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Overlay metrology apparatus and methods, and systems therefor, according to several embodiments of the present invention will now be described.

[0036] FIG. 1 is an exemplary diagram showing an overlay measurement system according to an embodiment of the present invention.

[0037] With reference to FIG. 1, an overlay metrology system 100 according to one embodiment of the invention can include a user terminal 110 (eg, a computer, laptop, etc.) and at least one metrology device 120 .

[0038] According to one embodiment, the user terminal 110 can send and receive data or signals via a communication protocol (e.g., File Transfer Protocol (FTP)) to at least one measurement device 120. For example, the user terminal 110 can send data or signals to one measurement device or can send data or signals to multiple measurement devices simultaneously.

[0039] According to one embodiment, the user terminal 110 may execute a manager program (e.g., an Auto Recipe Optimization (ARO) manager program) in which information regarding at least one metrology tool 120 is input by a user. The manager program may receive recipe information input by a user regarding operation of the metrology tool to measure a characteristic of a wafer. For example, the manager program may receive values ​​for a plurality of parameters that measure a characteristic of a wafer from a user.

[0040] In this manner, the manager program is installed in the user terminal 110. The user terminal 110 can then synchronize with the measuring device 120 by the manager program and exchange signals or data in real time.

[0041] The UI (User Interface) of the manager program (e.g., ARO manager program) installed in the user terminal 110 may be similar to the UI installed in the measurement device. The manager program can generate a recipe file when options to be set in the recipe are checked and saved. The recipe options are basically set to default values ​​when the recipe is generated, and can be changed if desired by the user. The file generated by the user terminal 110 can be transmitted via FTP to the measurement device that is to measure the recipe.

[0042] In order to send a recipe file to a measurement tool, the PC IP, Identifier, Password, and Server IP information of the measurement tool must be entered into the manager program. Once this information is properly entered, the user terminal 110 can register the FTP path of the files stored in the measurement tool to be used when creating a recipe. This information is necessary to use the manager program, which is not entered into the measurement tool.

[0043] The files stored in the equipment may be files that store a filter list, an aperture list, a template list used for focus and pinholes, and version information of each measurement device used in the equipment.

[0044] Since the manager program can transmit recipes to multiple measurement tools simultaneously, the above process can be repeated to register multiple measurement tools. Each measurement tool needs to be registered once initially. It is also possible to delete or modify measurement tools that have been added as needed.

[0045] Although the recipe can be created when the user already knows the wafer information, the tool can reconstruct the wafer information using a data file, so even if the wafer information is not known, a recipe can be created by loading the data file that measured the wafer.

[0046] According to an embodiment, the user terminal 110 can generate data including information on the input recipe and unique information on the measurement device 120 (e.g., an Internet Protocol (IP) address of the measurement device, an identifier of the measurement device, a password, and a server IP address). For example, the user terminal 110 can generate data including information on the recipe and unique information on the measurement device for each measurement device.

[0047] According to an embodiment, the user terminal 110 may generate data including information indicating whether or not to perform an optimization process for a measurement option of a wafer for each measurement tool.

[0048] According to one embodiment, the user terminal 110 may transmit the generated data to a measuring device corresponding to the unique information. For example, the user terminal 110 may transmit data or signals to one measuring device, or may transmit data or signals to each of a plurality of measuring devices simultaneously.

[0049] As described above, the user terminal 110 can generate a plurality of pieces of data including individual unique information of a plurality of measuring devices, and transmit the generated plurality of pieces of data to the measuring devices simultaneously.

[0050] According to one embodiment, the metrology tool 120 may analyze a recipe included in the data received from the user terminal 110, and upon completing the recipe analysis, may perform an optimization process for the measurement options of the wafer based on the recipe.

[0051] For example, a manager program installed in the user terminal 110 and measurement software (eg, an overlay application) installed in the measurement device 120 can transmit and receive data via FTP.

[0052] According to one embodiment, the measurement software (e.g., an overlay application) installed in the measurement device 120 operates in conjunction with a manager program installed in the user terminal 110 and may include commands to operate the measurement device based on data (e.g., recipe information) received from the user terminal 110.

[0053] According to an embodiment, the measurement device 120 may continuously check a path for receiving a recipe file from the user terminal 110 using a thread while the measurement software is being executed.

[0054] According to one embodiment, when a recipe file is received, the metrology tool 120 can determine whether the file is a recipe file using at least one of the format of the recipe file name and the file extension.

[0055] For example, the first name may be of the form 0000@@0000 and the extension may be xml.

[0056] According to one embodiment, the metrology tool 120 may construct recipe information by reading the recipe file line by line, and may store the recipe when the recipe information construction is completed after reading the last line.

[0057] According to one embodiment, if the measurement tool 120 fails to configure the recipe information, it transmits an error message indicating the failure of the recipe configuration via the path through which the recipe file is transmitted, and records and stores the reason for the failure in a log file.

[0058] According to one embodiment, when the metrology tool 120 completes the configuration of recipe information and the received data includes information indicating execution of an optimization process for the measurement options of the wafer, the metrology tool 120 can perform a filter optimization process, an aperture optimization process, a focus optimization process, a pinhole optimization process, and a process of storing the selected options regardless of the procedure.

[0059] Also, the measurement device 120 may sequentially perform the above-mentioned filter optimization process, aperture optimization process, focus optimization process, pinhole optimization process, and a process of storing the selected option.

[0060] According to one embodiment, the metrology tool 120 can automatically optimize the measurement options of a recipe, and these functions can be referred to as ARO (Auto Recipe Optimization) functions. At this time, representative optimization options include filter, aperture numerical aperture (NA), focus, and pinhole, and various options can be added later.

[0061] Therefore, as long as the wafer information and measurement target position information are available, the recipe can automatically store the optimal option via ARO.

[0062] By using the ARO function, the program can automatically measure, select, and optimize various options, reducing the number of workers required and shortening the optimization speed, which is heavily influenced by the individual capabilities of each worker.

[0063] FIG. 2 is a conceptual diagram of an overlay measurement apparatus according to an embodiment of the present invention.

[0064] Referring to FIG. 2, an overlay metrology apparatus 120 according to one embodiment of the present invention is an apparatus that measures the error between a first overlay mark (OM1) and a second overlay mark (OM2) formed on different layers formed on a wafer 240.

[0065] For example, the first overlay mark (OM1) may be an overlay mark formed on a previous layer, and the second overlay mark (OM2) may be an overlay mark formed on a current layer. The overlay marks are formed in the scribe lane while forming layers for forming a semiconductor device in a die area. For example, the first overlay mark (OM1) may be formed with an insulating film pattern, and the second overlay mark (OM2) may be formed with a photoresist pattern formed on the insulating film pattern.

[0066] In this case, the second overlay mark (OM2) is exposed to the outside, but the first overlay mark (OM1) is blocked by a photoresist layer, and is made of an oxide having different optical properties from the second overlay mark (OM2) made of a photoresist material, and the focal planes of the first overlay mark (OM1) and the second overlay mark (OM2) may be the same or different.

[0067] The overlay measurement apparatus 120 according to one embodiment of the present invention may include a light source 210, a first beam splitter 212, a first mirror 213, a first color filter 214, a second color filter 215, a beam combiner 216, a second mirror 217, a relay lens 218, a polarizing filter 221, an aperture 251, a second detector 233, a focus actuator 234, a zoom lens 232, a first detector 231, a second beam splitter 230, an optical element 227, a third beam splitter 224, a lambda wave plate 222, an objective lens 220, a lens focus actuator 225, an aperture 251, an AF (Auto Focus) 261, and a processor 270.

[0068] The configuration of the overlay measurement apparatus 120 shown in Fig. 2 is according to one embodiment, and the components of the overlay measurement apparatus 120 are not limited to the embodiment shown in Fig. 2, and some components may be added, changed, or deleted as necessary. For example, the overlay measurement apparatus 120 may include a memory (not shown) that stores commands, programs, logic, etc. that control the operation of each component of the overlay measurement apparatus 120 by the processor 270.

[0069] According to one embodiment, the light source 210 can be a halogen lamp, a xenon lamp, a supercontinuum laser, a light emitting diode, a laser induced lamp, or the like.

[0070] According to one embodiment, the first beam splitter 212 is responsible for splitting the beam emitted from the light source 210 into two beams. The first beam splitter 212 transmits a portion of the beam emitted from the light source 210 and reflects a portion of the beam, thereby splitting the beam emitted from the light source 210 into two beams.

[0071] According to one embodiment, the first mirror 213 is installed between the first beam splitter 212 and the second spectral filter 215 and redirects the beam reflected by the first beam splitter 212 towards the second spectral filter 215.

[0072] According to one embodiment, the first spectral filter 214 serves to adjust the central wavelength and bandwidth of the beam transmitted through the first beam splitter 212 to be suitable for image acquisition of the second overlay mark (OM2) formed on the current layer, among the beams split by the first beam splitter 212. The spectral filter can be one of a filter wheel, a linear translation device, and a flipper device.

[0073] According to an embodiment, the second spectral filter 215 serves to adjust the central wavelength and bandwidth of the beam reflected by the first beam splitter 212 to be suitable for image acquisition of the first overlay mark (OM1) formed on the previous layer. The present invention allows the first and second spectral filters to be replaced with various filters, and the spectral filter may include at least one of a filter wheel, a linear translation device, and a flipper device.

[0074] According to one embodiment, the beam combiner 216 serves to combine the light that has passed through the first spectrum filter 214 and the second spectrum filter 215. The light that has passed through the first spectrum filter 214 passes through the beam combiner 216, and the beam that has passed through the second spectrum filter 215 is redirected toward the beam combiner 216 by the second mirror 217, reflected by the beam combiner 216, and further combined with the beam that has passed through the beam combiner 216, and passes through the aperture 251.

[0075] According to one embodiment, the aperture 251 serves to modify the beam transmitted by the beam combiner into a form suitable for imaging the first overlay mark 1 .

[0076] According to one embodiment, the second detector 233 detects the beam reflected by the second beam splitter 230. The second detector 233 is mounted on a focus actuator 234 to adjust the distance between the second beam splitter 230 and the second detector 233. The second detector 233 captures an image of the first overlay mark (OM1).

[0077] According to one embodiment, the first detector 231 detects the beam that has passed through the second beam splitter 230. The first detector 231 can capture an image of the second overlay mark (OM2).

[0078] Alternatively, depending on the user's settings, the second detector may not operate and only the first detector may capture images of the first overlay mark (OM1) and the second overlay mark (OM2).

[0079] According to an embodiment, the zoom lens 232 is disposed between the second beam splitter 230 and the focus actuator 234. The zoom lens 232 receives a position change value of the second detector 233 from the focus actuator 234, and based on the position change value, matches the magnification of the image of the second overlay mark (OM2) and the image of the first overlay mark (OM1). Due to the height difference between the first overlay mark (OM1) and the second overlay mark (OM2), the optical path distance between the second detector 233 and the second beam splitter 230 is different from the optical path distance between the first detector 231 and the second beam splitter 230, so that the magnification of the image acquired by the first detector 231 and the image acquired by the second detector 233 may differ. In order to measure the overlay error accurately, the magnification must be matched.

[0080] According to an embodiment, the second beam splitter 230 is responsible for splitting the beam collected by the objective lens 220 into two beams. The second beam splitter 230 may include a tube beam splitter and a dichroic filter. A dichroic filter is a filter that transmits a specific wavelength beam. The beam collected by the objective lens 220 passes through the lambda wave plate 222, the third beam splitter 224, and the optical element 227, and is split into two beams by the second beam splitter 230. That is, the beam is split into a beam suitable for detecting the first overlay mark (OM1) and a beam suitable for detecting the second overlay mark (OM2).

[0081] According to one embodiment, the optical element 227 may include a hot mirror and a cold mirror.

[0082] According to one embodiment, the third beam splitter 224 serves to further split the beam combined via the combiner 216 into two beams. The beam combined via the beam combiner 216 is polarized via the relay lens 218 and the polarizing filter 221 and then split into two beams by the third beam splitter 224.

[0083] According to one embodiment, the objective lens 220 serves to focus the circularly polarized beam, which is combined by the combiner 216, reflected by the third beam splitter 224, and passed through the lambda wave plate 222, at a measurement position on the wafer 240, and to collect the beam reflected at the measurement position. The objective lens 220 is mounted on a lens focus actuator 225.

[0084] According to one embodiment, the lens focus actuator 225 can adjust the distance between the objective lens 220 and the wafer 240 so that the focal plane is located at the first overlay mark (OM1) or the second overlay mark (OM2). Under the control of the processor 270, the lens focus actuator 225 can move the objective lens 240 vertically towards the wafer to adjust the focal length.

[0085] According to one embodiment, an optical element is placed at 45° to the path of the beam transmitted through the beam splitter, for directing the beam to an autofocus module, characterized in that it reflects the long wavelength beam and transmits the short wavelength beam, or reflects the short wavelength beam and transmits the long wavelength beam. The optical element can consist of one of a hot mirror or a cold mirror.

[0086] According to an embodiment, the autofocus module is for adjusting the focus and plays a role of generating a signal according to the distance between the objective lens and the wafer. That is, it plays a role of generating a signal according to the change in the focus position of the detector. The autofocus module can use an autofocus sensor module of a phase difference type. For example, if the focus acquired by the autofocus sensor module coincides with the "standard focus", the phase difference value, which is the signal value output by the sensor, may be 0, and if it does not coincide, it may be + or - value depending on the focus position. The "standard focus" is the focus of the first or second detector, the autofocus sensor, determined based on the signal of the sensor. The "standard focus" may coincide with the "measurement focus" suitable for acquiring an actual alignment image, but it is almost different when the height difference between the first overlay mark (OM1) and the second overlay mark (OM2) is large.

[0087] The autofocus sensor obtains a signal according to the focal position from the light reflected from the measurement area of ​​the wafer, and adjusts the actuator that adjusts the distance between the measurement area of ​​the wafer and the objective lens so as to adjust the focal position.

[0088] FIG. 3 is a block diagram of an overlay metrology system in accordance with one embodiment of the present invention.

[0089] Referring to FIG. 3, an overlay metrology system 100 according to an embodiment of the present invention may include a user terminal 110 and a metrology device 120 .

[0090] According to one embodiment, the user terminal 110 may include a transceiver 311 , a display 312 , a memory 313 , and a processor 314 .

[0091] For example, the transceiver 311 can transmit data or signals to the measurement device 120 via a communication protocol (eg, FTP).

[0092] For example, the display unit 312, under the control of the processor 314, can display a manager program in which recipe settings for a metrology tool are input by a user.

[0093] For example, the memory 313 may store commands or data related to at least one other component of the user terminal 110. The memory 313 may store at least some of information related to a recipe input by a user, and commands, algorithms, software, and programs (e.g., an ARO manager program) required to transmit specific information related to the measurement device 120 to the measurement device 120.

[0094] For example, the memory 313 can store commands that enable the measuring device 120 to perform a function of performing an optimization process according to a manager program installed in the user terminal 110 .

[0095] For example, the processor 314 may communicate with at least one metrology tool 120 via the transceiver 311 to transmit data including recipe information for the metrology tool to the at least one metrology tool 120 .

[0096] For example, the processor 314 can execute a manager program (e.g., an ARO manager program) in which settings for a recipe of at least one metrology tool 120 are input, and display the manager program on the display unit 312. The manager program can receive recipe information related to the operation of the metrology tool to measure the characteristics of the wafer input by a user or via the transceiver unit 311.

[0097] For example, the processor 314 may generate data including information about the input recipe and unique information about the metrology tool 120 (e.g., the IP address of the metrology tool, the identifier of the metrology tool, the password, and the server IP). For example, the processor 314 may generate data including information about the recipe and unique information about the metrology tool for each metrology tool.

[0098] For example, the processor 314 may generate data including information indicating whether to perform an optimization process for the measurement options of the wafer for each metrology tool.

[0099] For example, the processor 314 can transmit the generated data to a measuring device corresponding to the unique information. For example, the user terminal 110 can transmit data or signals to one measuring device, or can transmit data or signals to each of multiple measuring devices simultaneously.

[0100] Additionally, the processor 314 may generate data including information indicating whether to perform an optimization process for the measurement options of the wafer 240 .

[0101] As described above, the processor 314 can generate a plurality of pieces of data including individual unique information of a plurality of measurement devices, and transmit the generated plurality of pieces of data to the measurement devices simultaneously.

[0102] According to one embodiment, the measurement device 120 may include a transceiver 321 , a display 322 , a memory 323 , a measurement unit 324 , and a processor 270 .

[0103] For example, the transceiver 321 can receive data or signals from the user terminal 110 via a communication protocol (eg, FTP).

[0104] For example, the display unit 322, under the control of the processor 270, can display information about a recipe received from the user terminal 110 via manager software (eg, metrology software).

[0105] For example, the memory 323 may store instructions or data related to at least one other component of the measurement tool 120. The memory 323 may store at least a portion of instructions, algorithms, and software required to receive information related to a recipe and specific information related to the measurement tool 120 from the user terminal 110.

[0106] For example, the memory 323 may store setting values ​​for a recipe received from the user terminal 110, setting values ​​pre-set in the measuring device 120, and data generated based on the operation of the processor 270 (e.g., data optimized for an option).

[0107] For example, the memory 323 may store commands that enable the measurement device 120 to execute a function of performing an optimization process via software installed in the measurement device 120 .

[0108] For example, under the control of the processor 270 , the measurement unit 324 can measure the characteristics of the wafer 240 according to recipe information set in the measurement tool 120 .

[0109] For example, the processor 270 can receive data including recipe information related to a measuring tool from the user terminal 110 via the transceiver 321 with the user terminal 110 .

[0110] For example, the processor 270 can display software into which setting values ​​for a recipe of the measurement tool 120 are input on the display unit 322. The processor 270 can also display recipe information related to the measurement tool received from the user terminal 110 via the measurement software.

[0111] According to one embodiment, the processor 270 may analyze a recipe contained in the data received from the user terminal 110. For example, the recipe may include values ​​for a number of parameters that measure characteristics of the wafer 240.

[0112] The recipe may also include at least one of Final Residual 3 Sigma, TIS 3 Sigma, Registration 3 Sigma, Total Measurement Uncertainty (TMU) indicating measurement precision, and Move and Measure (MAM) time indicating the measurement time after moving between measurements, or a total weight that is a combination of these.

[0113] The data may also include information indicating whether to perform an optimization process for the measurement options of wafer 240 .

[0114] According to an embodiment, the processor 270 may determine the authenticity of a recipe file using at least one of the format of the recipe file name and the file extension included in the data received from the user terminal 110. For example, the format of the file name may be 0000@@0000, and the extension may be xml.

[0115] According to an embodiment, after the processor 270 completes the recipe analysis, it may perform an optimization process for the measurement options of the wafer based on the recipe. For example, the processor 270 may read the recipe file line by line to construct recipe information. Then, after the processor 270 reads the last line and completes the construction of the recipe information, it may store the recipe in the memory 323.

[0116] According to one embodiment, the processor 270 may measure one or more filters (e.g., spectrum filters) in the measurement device 120 once and calculate statistics for a number of parameters for each filter. Alternatively, the processor 270 may measure one or more filters (e.g., spectrum filters) in the measurement device 120 at least once. The reason for measuring once is that this is the minimum number of measurements. The processor 270 may then perform a filter optimization process in which the calculated statistics are weighted and a filter is selected that has a minimum sum of the statistics to which the weights are respectively assigned.

[0117] For example, the processor 270 may measure overlay measurements, i.e., TIS 3 Sigma and Registration 3 Sigma, for each filter and model the measured TIS 3 Sigma and Registration 3 Sigma to obtain a Final Residual 3 Sigma.

[0118] In addition, processor 270 can acquire at least one of Final Residual 3 Sigma, TIS 3 Sigma, Registration 3 Sigma, Total Measurement Uncertainty (TMU) indicating measurement precision, and Move and Measure (MAM) time indicating the measurement time after a move between measurements, or can acquire a total weight that is a combination of these.

[0119] The processor 270 may then weight the statistics of at least one parameter of each filter and select the filter that results in the smallest sum of the weighted results.

[0120] According to one embodiment, when the processor 270 performs the filter optimization process, the processor 270 may measure one or more apertures in the metrology device 120 once and calculate statistics for a number of parameters for each aperture.

[0121] In addition, when the processor 270 performs the filter optimization process, it may measure one or more apertures in the measurement device 120 once and calculate statistics for a plurality of parameters for each aperture. Then, the processor 270 may perform an aperture optimization process in which weights are assigned to the calculated statistics and an aperture (Numerical Aperture, NA) is selected that minimizes the sum of the weighted statistics. Since the aperture uses only one same lens, the numerical aperture may be changed, thereby changing the amount and pattern of light.

[0122] For example, the processor 270 can measure overlay measurements, i.e., Tis 3 sigma and Registration 3 sigma, for each aperture and model the measured Tis 3 sigma and Registration 3 sigma to obtain a final residual 3 sigma.

[0123] Processor 270 may also obtain at least one of Final Residual 3 Sigma, TIS 3 Sigma, Registration 3 Sigma, TMU, and MAM time, or a total weight of any combination thereof.

[0124] Processor 270 can then assign weights to the statistics of each parameter for each aperture and select the aperture that minimizes the sum of the weighted results.

[0125] According to one embodiment, when the processor 270 performs the aperture optimization process, the processor 270 may perform a focus scan at one site in the measurement device 120 to determine a focus measurement region, and may calculate statistics for a plurality of parameters by moving the focus one step at a time within the determined measurement region for each site. The processor 270 may then perform a focus optimization process in which the processor 270 assigns weights to the calculated statistics and selects a focus that minimizes the sum of the statistics to which the weights are assigned.

[0126] For example, the processor 270 may measure overlay measurements, i.e., TIS 3 Sigma and REG 3 Sigma, for each focus, and model the measured TIS 3 Sigma and REG 3 Sigma to obtain a final residual 3 Sigma.

[0127] Then, the processor 270 can assign a weighting value to the statistical value of each parameter of each focus, and select the focus that minimizes the sum of the weighted result values.

[0128] According to one embodiment, when processor 270 performs the focus optimization process, it may measure the aperture in measurement device 120 once at a first pinhole position and once at a second pinhole position moved a certain distance (e.g., 3 μm) from the first pinhole position. Then, processor 270 may calculate Tis 3 sigma at the first pinhole position and the second pinhole position, and model the Tis 3 sigma for each pinhole position according to the aperture. Then, processor 270 may perform a pinhole optimization process to select a pinhole position where Tis 3 sigma is minimum.

[0129] According to one embodiment, when the processor 270 performs the pinhole optimization process, it can store information (e.g., optimization result values) regarding the options selected from each of the filter optimization process, the aperture optimization process, the focus optimization process, and the pinhole optimization process in the memory 323.

[0130] 4 is a flowchart showing a process in which a user terminal transmits data to a measuring device according to an embodiment of the present invention, and FIG 5 is an example of inputting information on a plurality of parameters on a manager program according to an embodiment of the present invention.

[0131] Hereinafter, a process in which a user terminal according to an embodiment of the present invention transmits data to a measuring device will be described in detail with reference to FIGS.

[0132] According to one embodiment, the processor 314 can execute a manager program (S410). The processor 314 can execute a manager program (e.g., ARO manager program) that remotely manages and controls the metrology tool, and then display the manager program on the display unit 312. The manager program can receive recipe information related to the operation of the metrology tool that measures the characteristics of the wafer, input by a user, or can acquire the recipe information via the transceiver unit 311.

[0133] According to one embodiment, the processor 314 may identify whether a recipe for measuring the wafer is input (S412). The manager program may receive input from a user values ​​for a plurality of parameters measuring characteristics of the wafer. For example, the plurality of parameters may include Final Residual 3 Sigma, TIS 3 Sigma, and Registration 3 Sigma. The plurality of parameters may also include a Total Weight consisting of a combination of at least one or more parameters.

[0134] In addition, the manager program can input at least one of Final Residual 3 Sigma, TIS 3 Sigma, Registration 3 Sigma, TMU (Total Measurement Uncertainty) indicating measurement precision, and MAM (Move and Measure) time indicating the measurement time after moving between measurements, or can input a total weight that is a combination of these.

[0135] According to one embodiment, the processor 314 can display the input recipe on the executed manager program (S414). The processor 314 can display the values ​​(e.g., percentages) input by the user for each of a plurality of parameters on the manager program in real time.

[0136] 5, a manager program (e.g., ARO manager program) 510 may display a popup 520 in which a user may input values ​​for a number of parameters. For example, the popup 520 may input a Final Residual 3 Sigma 521 percentage, a TIS 3 Sigma 521 percentage, and a Registration 3 Sigma 521 percentage. The popup 520 may also input percentages for at least one or more parameters.

[0137] For example, when the Final Residual 3 Sigma 521 ratio, the Tiss 3 Sigma 521 ratio, and the Registration 3 Sigma 521 ratio are all input, a total weight value can be displayed. Then, when the user clicks the weight value application button 530, the processor 314 can generate data including information on the input parameters and specific information of the measurement device.

[0138] According to one embodiment, the processor 314 can identify whether the recipe entry is complete (S416). The processor 314 can identify whether the percentages for the Final Residual 3 Sigma, the Tiss 3 Sigma, and the Registration 3 Sigma are all entered.

[0139] The processor 314 can also identify whether unique information is entered for at least one metrology tool to which the recipe for the entered parameters will be applied. For example, the unique information can include an IP address of the metrology tool, a metrology tool identifier, a password, and a server IP address.

[0140] In addition, the processor 314 may determine whether information indicating whether to execute an optimization process for a measurement option of a wafer for each measurement tool is input.

[0141] According to an embodiment, the processor 314 may generate data including information on an input recipe and information on at least one previously specified measurement tool. The processor 314 may generate data including information on the recipe and specific information on the measurement tool for each measurement tool.

[0142] In addition, the processor 314 may generate data including information indicating whether to perform an optimization process for the measurement options of the wafer for each metrology tool.

[0143] According to one embodiment, the processor 314 can transmit the generated data to at least one measurement device (S420). The processor 314 can transmit the generated data to a measurement device corresponding to the unique information via the transceiver 311. For example, the processor 314 can transmit data or a signal to one measurement device, or can transmit data or a signal to each of multiple measurement devices simultaneously.

[0144] As described above, the processor 314 can generate multiple pieces of data including individual unique information of multiple measuring devices, and simultaneously transmit the multiple pieces of data generated to the measuring devices via the transceiver unit 311.

[0145] 6 is a flow chart showing a process in which the measurement apparatus according to an embodiment of the present invention performs optimization based on a recipe file, and FIG 7 is an exemplary diagram showing a state in which the measurement apparatus according to an embodiment of the present invention performs optimization based on a recipe file.

[0146] Hereinafter, a process in which the measurement apparatus according to an embodiment of the present invention performs optimization based on a recipe file will be described in detail with reference to FIGS.

[0147] According to an embodiment, the measurement device 120 (e.g., the processor 270) may identify whether data is received from the user terminal 110 (S610). The measurement device 120 (e.g., the processor 270) may identify whether data is received from the user terminal 110 by continuously checking a path for receiving a recipe file from the user terminal 110 using a thread while the measurement software is being executed.

[0148] For example, the data may include information about a recipe input by a user through a manager program and specific information about a measurement device, and may also include information indicating whether to perform an optimization process for a measurement option of a wafer.

[0149] According to one embodiment, the measurement device 120 (e.g., processor 270) can identify whether the received data corresponds to a recipe file of the measurement device (S612). When the recipe file is received via the transceiver 321, the measurement device 120 (e.g., processor 270) can use at least one of the recipe file name format and the file extension to confirm that the recipe file is a recipe file related to the measurement device. For example, the name format may be 0000@@0000 and the extension may be xml. The present invention is not limited to a specific name format or a specific extension.

[0150] According to one embodiment, the metrology tool 120 (e.g., processor 270) may analyze the recipe file if the recipe file is appropriate for the metrology tool (S614, S616). The metrology tool 120 (e.g., processor 270) may read the received recipe file line by line to construct recipe information.

[0151] For example, the metrology tool 120 (e.g., processor 270) may analyze a recipe included in the data received from the user terminal 110. For example, the metrology tool 120 (e.g., processor 270) may analyze values ​​for a number of parameters that measure characteristics of the wafer 240. For example, the number of parameters may include final residual 3 sigma percentage, tear 3 sigma percentage, registration 3 sigma percentage, TMU percentage, MAM Time percentage, and total weight percentage.

[0152] According to one embodiment, the metrology tool 120 (e.g., processor 270) may identify whether the analysis of the recipe file is complete (S618). When the metrology tool 120 (e.g., processor 270) has read the last line and completed constructing the recipe information, the metrology tool 120 may store the recipe in memory 323.

[0153] According to one embodiment, the measurement device 120 (e.g., the processor 270) may identify whether an optimization option has been selected (S620). The measurement device 120 (e.g., the processor 270) may identify whether the data received in the above step (S610) includes information indicating the optimization option. Information regarding the optimization option may be input by a user via a manager application of the user terminal 110.

[0154] According to one embodiment, the metrology tool 120 (e.g., processor 270) may perform an optimization process for the recipe (S622). The metrology tool 120 (e.g., processor 270) may measure one or more filters (e.g., spectrum filters) in the metrology tool 120 once and calculate statistics for a number of parameters for each filter. The processor 270 may then perform a filter optimization process in which weights are assigned to the calculated statistics and a filter is selected that minimizes the sum of the statistics to which the weights are assigned.

[0155] The measurement tool 120 (e.g., processor 270) can then measure overlay measurements, i.e., Tesse 3 sigma and Registration 3 sigma, for each filter and model the measured Tesse 3 sigma and Registration 3 sigma to obtain a final residual 3 sigma.

[0156] Then, the measurement device 120 (eg, the processor 270) can assign weights to the statistical values ​​of each parameter of each filter, and select the filter that minimizes the sum of the weighted result values.

[0157] Referring to FIG. 7, the measurement device 120 (e.g., processor 270) may perform a filter optimization process 710 in which, for each of the spectrum filters (1 to n), a statistical value for a plurality of parameters is calculated, weighting values ​​are assigned to the calculated statistical values, and a filter is selected in which the sum of the statistical values ​​to which the weighting values ​​are assigned is minimized.

[0158] According to one embodiment, the metrology tool 120 (e.g., processor 270) may perform a filter optimization process by measuring one or more apertures in the metrology tool 120 once and calculating statistics for a number of parameters for each aperture. The metrology tool 120 (e.g., processor 270) may then perform an aperture optimization process in which the calculated statistics are weighted and the aperture that minimizes the sum of the weighted statistics is selected. Because the apertures use only one of the same lenses, the numerical aperture may be changed, thereby changing the amount and pattern of light.

[0159] Then, the metrology tool 120 (e.g., the processor 270) can measure the overlay measurements, i.e., Tis 3 sigma and Registration 3 sigma, for each aperture and model the measured Tis 3 sigma and Registration 3 sigma to obtain a final residual 3 sigma.

[0160] Then, the measurement tool 120 (eg, the processor 270) can assign weights to the statistics of each parameter for each aperture, and select the aperture for which the sum of the weighted results is the smallest.

[0161] Referring to FIG. 7, the measurement device 120 (e.g., processor 270) can perform an aperture optimization process 720 in which, for each aperture (1 to n), a statistical value for multiple parameters is calculated, a weighting value is assigned to each of the calculated statistical values, and an aperture in which the sum of the statistical values ​​to which the weighting values ​​are assigned is minimized is selected.

[0162] According to one embodiment, when the metrology tool 120 (e.g., processor 270) performs an aperture optimization process, it may perform a focus scan at one site in the metrology tool 120 to determine a focus measurement region, and for each site, it may move the focus one step at a time within the determined measurement region to calculate statistics for a plurality of parameters. Then, the metrology tool 120 (e.g., processor 270) may perform a focus optimization process in which the calculated statistics are each weighted, and a focus is selected that minimizes the sum of the statistics to which the weights are respectively assigned.

[0163] For example, the metrology tool 120 (e.g., the processor 270) can measure overlay measurements, i.e., Tessell 3 Sigma and Registration 3 Sigma, for each focus and model the measured Tessell 3 Sigma and Registration 3 Sigma to obtain a final residual 3 Sigma.

[0164] Then, the measurement device 120 (eg, the processor 270) can assign weights to the statistical values ​​of each parameter of each focus, and select the focus that minimizes the sum of the weighted result values.

[0165] Referring to FIG. 7, the measurement device 120 (e.g., processor 270) can perform a focus optimization process 730 to measure the Tessellation 3 Sigma and Registration 3 Sigma for each focus and model the measured Tessellation 3 Sigma and Registration 3 Sigma to obtain a final residual 3 Sigma.

[0166] According to one embodiment, when the measurement device 120 (e.g., processor 270) performs a focus optimization process, it may perform one measurement at a first pinhole position determined by an aperture in the measurement device 120, and one measurement at a second pinhole position moved a certain distance (e.g., 3 μm) from the first pinhole position. Then, the measurement device 120 (e.g., processor 270) may calculate Tis3 sigma at the first pinhole position and the second pinhole position, and model the Tis3 sigma for each pinhole position determined by the aperture. Then, the measurement device 120 (e.g., processor 270) may perform a pinhole optimization process to select a pinhole position where the Tis3 sigma is minimum.

[0167] Referring to FIG. 7, the measurement device 120 (e.g., processor 270) can perform a pinhole optimization process 740 to calculate Tis3 sigma at a first pinhole position and a second pinhole position, model the Tis3 sigma for each pinhole position according to the aperture, and select the pinhole position where the Tis3 sigma is minimum.

[0168] According to one embodiment, the measurement device 120 (e.g., the processor 270) may store information regarding the selected option (S624). When the measurement device 120 (e.g., the processor 270) performs a pinhole optimization process, it may store information regarding the option selected from each of the filter optimization process, the aperture optimization process, the focus optimization process, and the pinhole optimization process (e.g., optimization result values) in the memory 323.

[0169] 7, the metrology tool 120 (e.g., processor 270) may store information (e.g., optimization result values) related to a selected option from each of the above-mentioned filter optimization process, aperture optimization process, focus optimization process, and pinhole optimization process in the memory 323. Then, the metrology tool 120 (e.g., processor 270) may control the measurement unit 324 to measure characteristics of the wafer 240 based on the selected option.

[0170] The steps in each of the above-described procedure diagrams may be performed out of the order shown or simultaneously. Furthermore, at least one component of the present invention and at least one operation performed by the at least one component may be embodied in hardware and / or software.

[0171] Although the present invention has been described above with reference to the illustrative drawings, the present invention is not limited to the embodiments and drawings disclosed in this specification, and it is obvious that various modifications can be made by those skilled in the art within the scope of the technical concept of the present invention. Furthermore, even if the effects of the configuration of the present invention are not explicitly described and explained while the embodiments of the present invention are described above, it is natural that the effects that can be predicted by the configuration should also be recognized. [Explanation of symbols]

[0172] 100 Overlay Measurement System 110 User terminal 120 Overlay Measuring Device 270 processor 321 Transmitter / Receiver 322 Display section 323 Memory 324 Measuring section

Claims

1. In the overlay measurement device, A transmitter / receiver unit; a processor electrically connected to the transceiver; The processor, Acquire data transmitted from a user terminal via the transceiver unit; Analyzing recipes contained in said data; Upon completing the analysis of the recipe, an optimization process is configured to be performed on measurement options for the wafer based on the recipe; measuring one or more filters once in the overlay measurement device and calculating statistics for a plurality of parameters for each filter; a filter optimization process for selecting a filter that minimizes the sum of the calculated statistical values ​​and the weighted statistical values; Overlay measurement equipment.

2. the data includes information indicating whether to perform an optimization process for a measurement option of the wafer; The overlay metrology apparatus according to claim 1 .

3. the data includes information about a recipe inputted by a manager program installed in the user terminal to measure characteristics of a wafer, and specific information about the overlay metrology tool; The overlay metrology apparatus according to claim 1 .

4. The unique information is Including an IP (Internet Protocol) address, an identifier, a password, and a server IP for the overlay measurement device; The overlay measurement apparatus according to claim 3 .

5. The processor, determining whether the recipe file is genuine or not by using at least one of a format of a recipe file name and a file extension included in the data; The overlay metrology apparatus according to claim 1 .

6. The plurality of parameters include at least one of Final Residual 3 Sigma, TIS 3 Sigma, Registration 3 Sigma, TMU (Total Measurement Uncertainty), and MAM (Move and Measure) time, or a total weight obtained by adding up the ratio of each parameter in a combination of these, The overlay metrology apparatus according to claim 1 .

7. The processor, measuring one or more apertures once in the overlay metrology device and calculating statistics for a plurality of parameters for each aperture; assigning weights to the calculated statistics respectively; The method is configured to perform an aperture optimization process, which selects an aperture that minimizes the sum of the statistics to which the weights are respectively assigned. The overlay metrology apparatus according to claim 1 .

8. The processor, performing a focus scan at a site within the overlay metrology tool to determine a focus measurement area; For each site, move the focus one step at a time within the determined measurement area and calculate statistics for a plurality of parameters; assigning weights to the calculated statistics respectively; A focus optimization process is configured to select a focus that minimizes the sum of the statistics to which the weights are respectively assigned. The overlay metrology apparatus according to claim 1 .

9. The processor, A single measurement is performed at a first pinhole position defined by an aperture in the overlay measurement device; A measurement is made once at a second pinhole position that is moved a certain distance from the first pinhole position; Calculate the 3 sigma at the first pinhole position and the second pinhole position; The method is configured to perform a pinhole optimization process in which the Tis 3 sigma is modeled for each pinhole position according to the aperture and the pinhole position at which the Tis 3 sigma is minimized is selected. The overlay metrology apparatus according to claim 1 .

10. The processor, configured to store in a memory information regarding a selected option from each of the filter optimization process, the aperture optimization process, the focus optimization process, and the pinhole optimization process; The overlay metrology apparatus according to claim 1 .

11. A computer-readable recording medium storing a program including instructions for controlling the operation of an overlay measurement system, The program is A command to generate data including information about a recipe inputted by a user and specific information about the overlay metrology tool; a command for transmitting the generated data to an overlay metrology tool corresponding to the unique information, and performing an optimization process for measurement options of the wafer based on the recipe when the overlay metrology tool completes analysis of the recipe; a command for causing the overlay measurement device to measure one or more filters once within the overlay measurement device and to calculate statistics for a plurality of parameters for each filter; commands that cause the overlay metrology tool to assign weights to the calculated statistics; and and instructions for causing the overlay measurement apparatus to perform a filter optimization process, the filter being selected to minimize a sum of the statistics to which the weights are respectively assigned. A computer-readable recording medium.

12. The program is installed in a user terminal, a command for transmitting the generated plurality of data to at least one overlay metrology tool; The computer readable storage medium of claim 11.

13. The program is a command for causing the overlay measurement apparatus to determine authenticity of the recipe file using at least one of a format of a recipe file name and a file extension included in the data; The computer readable storage medium of claim 11.

14. The plurality of parameters include at least one of final residual 3 sigma, TIS 3 sigma, registration 3 sigma, TMU, and MAM time, or a total weight obtained by adding up the proportions of each parameter in a combination thereof, The computer readable storage medium of claim 11.

15. The program is a command for causing the overlay measurement device to measure one or more apertures once within the overlay measurement device and calculate statistics for a plurality of parameters for each aperture; commands that cause the overlay metrology tool to assign weights to the calculated statistics; and a command for performing a throttle optimization process, which selects a throttle that minimizes a sum of the statistics to which the weights are respectively assigned; The computer readable storage medium of claim 11.

16. The program is a command for causing the overlay measurement apparatus to perform a focus scan at a site within the overlay measurement apparatus to determine a focus measurement area; A command for causing the overlay measurement device to move the focus by one step within the determined measurement area for each site and calculate statistics for a plurality of parameters; and and a command for causing the overlay measurement apparatus to perform a focus optimization process, the focus optimization process including: assigning weights to the calculated statistics; and selecting a focus that minimizes a sum of the statistics to which the weights are assigned. The computer readable storage medium of claim 11.

17. The program is a command to cause the overlay measurement device to perform a measurement at a first pinhole position defined by an aperture in the overlay measurement device; a command to cause the overlay measurement device to perform a measurement at a second pinhole position that is moved a certain distance from the first pinhole position; instructions for causing the overlay metrology tool to calculate T3 sigma at the first pinhole position and the second pinhole position; and The overlay measurement apparatus includes a command for performing a pinhole optimization process, the pinhole optimization process including modeling the Tis 3 sigma for each pinhole position according to an aperture and selecting a pinhole position where the Tis 3 sigma is minimum. The computer readable storage medium of claim 11.

18. The program is The overlay measurement apparatus includes a command for storing information regarding a selected option from a filter optimization process, an aperture optimization process, a focus optimization process, and a pinhole optimization process. The computer readable storage medium of claim 11.

19. In overlay measurement systems, a user terminal that generates data including information about a recipe input by a manager program and specific information about an overlay measurement device, and transmits the generated data to an overlay measurement device corresponding to the specific information; the overlay metrology tool analyzes a recipe included in the data received from the user terminal, and when the analysis of the recipe is completed, performs an optimization process for a measurement option of the wafer based on the recipe; measuring one or more filters once in the overlay measurement device and calculating statistics for a plurality of parameters for each filter; A filter optimization process is performed to assign weights to the calculated statistics and select a filter that minimizes the sum of the statistics to which the weights are assigned. Overlay measurement system.

20. 1. A method of an overlay metrology apparatus comprising: receiving data from a user terminal; analyzing the recipes contained in the data; and Upon completing the analysis of the recipe, performing an optimization process for measurement options for the wafer based on the recipe; The optimization process includes: measuring one or more filters once in the overlay measurement device and calculating statistics for a plurality of parameters for each filter; and a filter optimization step of: assigning weights to the calculated statistics and selecting a filter that minimizes the sum of the statistics to which the weights are assigned. method.

21. The step of receiving the data includes: determining whether the recipe file is authentic or not by using at least one of a recipe file name format and a file extension included in the data; 21. The method of claim 20.

22. The plurality of parameters include at least one of Final Residual 3 Sigma, TIS 3 Sigma, Registration 3 Sigma, TMU (Total Measurement Uncertainty), and MAM (Move and Measure) time, or a total weight obtained by adding up the proportions of each parameter in a combination of these, 21. The method of claim 20.

23. The optimization process includes: measuring one or more apertures once in the overlay metrology tool and calculating statistics for a plurality of parameters for each aperture; assigning weights to the calculated statistics respectively; and The method further includes a step of optimizing the aperture, which selects an aperture that minimizes the sum of the statistics to which the weights are respectively assigned.

21. The method of claim 20.

24. The optimization process includes: performing a focus scan at a site within the overlay metrology tool to determine a focus measurement area; moving the focus step by step within the determined measurement area for each site and calculating statistics for a plurality of parameters; assigning weights to the calculated statistics respectively; and A focus optimization process is further included, which selects a focus that minimizes the sum of the statistics to which the weights are respectively assigned.

21. The method of claim 20.

25. The optimization process includes: performing a single measurement at a first pinhole position defined by an aperture in the overlay measurement device; performing a measurement once at a second pinhole position that is moved a certain distance from the first pinhole position; calculating the 3 sigma at the first pinhole position and the second pinhole position; and The method further includes a pinhole optimization process of modeling the Tis 3 sigma for each pinhole position according to the aperture and selecting a pinhole position where the Tis 3 sigma is minimized.

21. The method of claim 20.

26. 1. A method for an overlay metrology system comprising: a step of generating data including information on the recipe inputted by the user terminal through a manager program and specific information on the overlay measurement device, and transmitting the generated data to the overlay measurement device corresponding to the specific information; the overlay metrology tool analyzes a recipe included in the data received from the user terminal, and when the analysis of the recipe is completed, performs an optimization process for measurement options of the wafer based on the recipe; The optimization process includes: measuring one or more filters once in the overlay measurement device and calculating statistics for a plurality of parameters for each filter; and a filter optimization step of: assigning weights to the calculated statistics and selecting a filter that minimizes the sum of the statistics to which the weights are assigned. method.

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