Processing device and manufacturing method of moving body

Abstract

The processing device (1) includes a light irradiation device (11) that irradiates a surface of an object (S, SF) with multiple processing lights (EL), and a first change device (1121, 12) that changes the relative positional relationship of the focusing positions (FP) of the multiple processing lights in a direction intersecting the surface of the object, and changes the thickness of a portion of the object by irradiating the surface of the object with the processing light.

Description

[Technical Field]

[0001] The present invention relates to a processing device capable of processing an object by irradiating it with processing light, and a manufacturing method for manufacturing a moving body. [Background technology]

[0002] As a processing device capable of processing an object, Patent Document 1 describes a processing device that irradiates a laser beam onto the surface of an object to form a structure and reduce the resistance associated with the surface. This type of processing device is required to appropriately form a structure on the object. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent No. 4,994,639 Summary of the Invention

[0004] According to a first aspect, a processing device is provided that includes a light irradiation device that irradiates a surface of an object with multiple processing lights, and a first change device that changes the relative positional relationship of the focusing positions of the multiple processing lights in a direction intersecting the surface of the object, and that changes the thickness of a portion of the object by irradiating the processing lights onto the surface of the object.

[0005] According to a second aspect, there is provided a processing device comprising a light irradiation device that irradiates a surface of an object with a plurality of processing lights, and a first change device that changes the relative positional relationship of the focusing positions of the plurality of processing lights in a direction intersecting the surface of the object, and that removes a portion of the object by irradiating the processing lights onto the surface of the object.

[0006] According to a third aspect, there is provided a processing device comprising a light irradiation device that irradiates a surface of an object with a plurality of processing lights, and a first modification device that modifies the intensity distribution of the plurality of processing lights within a first plane that includes an axis that intersects with the surface of the object, and that modifies the thickness of a portion of the object by irradiating the processing lights onto the surface of the object.

[0007] According to a fourth aspect, there is provided a processing device comprising a light irradiation device that irradiates a surface of an object with a plurality of processing lights, and a first modification device that modifies the intensity distribution of the plurality of processing lights within a first plane that includes an axis that intersects with the surface of the object, and that removes a portion of the object by irradiating the processing lights onto the surface of the object.

[0008] According to a fifth aspect, there is provided a processing device comprising a light irradiation device that irradiates a plurality of processing lights onto the surface of an object, and a first modification device that modifies the shape of the plurality of processing lights within a first plane that includes an axis that intersects with the surface of the object, and that modifies the thickness of a portion of the object by irradiating the processing lights onto the surface of the object.

[0009] According to a sixth aspect, there is provided a processing device comprising a light irradiation device that irradiates a plurality of processing lights onto the surface of an object, and a first modification device that modifies the shape of the plurality of processing lights within a first plane that includes an axis that intersects with the surface of the object, and that removes a portion of the object by irradiating the processing lights onto the surface of the object.

[0010] According to a seventh aspect, there is provided a processing device comprising a light irradiation device that irradiates multiple processing lights so that they intersect on the surface of an object, and a first modification device that changes at least one of the intersection position and intersection angle of the multiple processing lights from the light irradiation device, and that changes the thickness of a portion of the object by irradiating the processing lights onto the surface of the object.

[0011] According to an eighth aspect, there is provided a processing device comprising a light irradiation device that irradiates multiple processing lights so that they intersect on the surface of an object, and a first modification device that changes at least one of the intersection position and intersection angle of the multiple processing lights from the light irradiation device, and that removes a portion of the object by irradiating the processing lights onto the surface of the object.

[0012] According to a ninth aspect, there is provided a processing device comprising a light irradiation device that irradiates a plurality of processing lights onto the surface of an object via an optical system, and a first change device that changes the focusing position of the plurality of processing lights in a direction intersecting the surface of the object to position the surface of the object within the range of the focal depth of the optical system, and that changes the thickness of a portion of the object by irradiating the processing lights onto the surface of the object.

[0013] According to a tenth aspect, there is provided a processing device comprising a light irradiation device that irradiates a plurality of processing lights onto the surface of an object via an optical system, and a first change device that changes the focusing position of the plurality of processing lights in a direction intersecting the surface of the object to position the surface of the object within the range of the focal depth of the optical system, and that removes a portion of the object by irradiating the processing lights onto the surface of the object.

[0014] According to an eleventh aspect, there is provided a processing device comprising a light irradiation device that irradiates processing light onto the surface of an object, and a first change device that changes the focusing position of the processing light in a direction intersecting the surface of the object, and which changes the thickness of a portion of the object by irradiating the processing light onto the surface of the object.

[0015] According to a twelfth aspect, there is provided a processing device comprising a light irradiation device that irradiates processing light onto the surface of an object, and a first change device that changes the focusing position of the processing light in a direction intersecting the surface of the object, and that removes a portion of the object by irradiating the processing light onto the surface of the object.

[0016] According to a thirteenth aspect, there is provided a processing device comprising a light irradiation device that irradiates processing light onto the surface of an object via an optical system, and a state change device that changes the state of the image plane of the optical system, and that changes the thickness of a portion of the object by irradiating the processing light onto the surface of the object.

[0017] According to a fourteenth aspect, there is provided a processing device comprising a light irradiation device that irradiates processing light onto the surface of an object via an optical system, and a state change device that changes the state of the image plane of the optical system, and that removes a portion of the object by irradiating the processing light onto the surface of the object.

[0018] According to a 15th aspect, there is provided a method for manufacturing a moving body that moves through a fluid, the method including irradiating a surface of an object with a plurality of processing lights, changing the relative positional relationship of the focusing positions of the plurality of processing lights in a direction intersecting the surface of the object, and changing the thickness of a portion of the object by irradiating the surface of the object with the processing lights to form a structure on the surface of the object.

[0019] According to a 16th aspect, there is provided a method for manufacturing a moving body that moves through a fluid, the method including irradiating a surface of an object with a plurality of processing lights, changing the relative positional relationship of the focusing positions of the plurality of processing lights in a direction intersecting the surface of the object, and removing a portion of the object by irradiating the surface of the object with the processing lights to form a structure on the surface of the object.

[0020] According to a 17th aspect, there is provided a method for manufacturing a moving body that moves through a fluid, the method including irradiating a surface of an object with a plurality of processing lights, changing the intensity distribution of the plurality of processing lights within a first plane including an axis that intersects the surface of the object, and changing the thickness of a portion of the object by irradiating the surface of the object with the processing lights to form a structure on the surface of the object.

[0021] According to an 18th aspect, there is provided a method for manufacturing a moving body that moves through a fluid, the method including irradiating a surface of an object with a plurality of processing lights, changing the intensity distribution of the plurality of processing lights within a first plane including an axis that intersects the surface of the object, and removing a portion of the object by irradiating the surface of the object with the processing lights to form a structure on the surface of the object.

[0022] According to a 19th aspect, there is provided a method for manufacturing a moving body that moves through a fluid, the method including irradiating a surface of an object with a plurality of processing lights, changing the shape of the plurality of processing lights within a first plane including an axis that intersects with the surface of the object, and changing the thickness of a portion of the object by irradiating the surface of the object with the processing lights to form a structure on the surface of the object.

[0023] According to a 20th aspect, there is provided a method for manufacturing a moving body that moves through a fluid, the method including irradiating a surface of an object with a plurality of processing lights, changing the shape of the plurality of processing lights within a first plane including an axis that intersects the surface of the object, and removing a portion of the object by irradiating the surface of the object with the processing lights to form a structure on the surface of the object.

[0024] According to a 21st aspect, there is provided a method for manufacturing a moving body that moves through a fluid, which includes irradiating a plurality of processing lights so that they intersect on the surface of the object, changing at least one of the intersection position and intersection angle of the plurality of processing lights from the light irradiation device, and changing the thickness of a portion of the object by irradiating the processing lights on the surface of the object, thereby forming a structure on the surface of the object.

[0025] According to the 22nd aspect, there is provided a method for manufacturing a moving body that moves through a fluid, which includes irradiating a plurality of processing lights so that they intersect on the surface of the object, changing at least one of the intersection position and intersection angle of the plurality of processing lights from the light irradiation device, and removing a portion of the object by irradiating the processing lights on the surface of the object to form a structure on the surface of the object.

[0026] According to a 23rd aspect, there is provided a method for manufacturing a moving body that moves through a fluid, the method including: irradiating a surface of an object with a plurality of processing lights via an optical system; changing the focusing positions of the plurality of processing lights in a direction intersecting the surface of the object to position the surface of the object within a range of the focal depth of the optical system; and changing the thickness of a portion of the object by irradiating the surface of the object with the processing lights to form a structure on the surface of the object.

[0027] According to a 24th aspect, there is provided a method for manufacturing a moving body that moves through a fluid, the method including: irradiating a surface of an object with a plurality of processing lights via an optical system; changing the focusing positions of the plurality of processing lights in a direction intersecting the surface of the object to position the surface of the object within a range of the focal depth of the optical system; and removing a portion of the object by irradiating the surface of the object with the processing lights to form a structure on the surface of the object.

[0028] According to a 25th aspect, there is provided a method for manufacturing a moving body that moves through a fluid, the method including irradiating a processing light onto a surface of the object, changing the focusing position of the processing light in a direction intersecting the surface of the object, and changing the thickness of a part of the object by irradiating the processing light onto the surface of the object, thereby forming a structure on the surface of the object.

[0029] According to a 26th aspect, there is provided a method for manufacturing a moving body that moves through a fluid, the method including irradiating a processing light onto a surface of the object, changing a focusing position of the processing light in a direction intersecting the surface of the object, and removing a part of the object by irradiating the processing light onto the surface of the object to form a structure on the surface of the object.

[0030] According to a 27th aspect, there is provided a method for manufacturing a moving body that moves through a fluid, the method including irradiating a processing light onto a surface of an object via an optical system, changing the state of the image plane of the optical system, and changing the thickness of a part of the object by irradiating the processing light onto the surface of the object, thereby forming a structure on the surface of the object.

[0031] According to a 28th aspect, there is provided a method for manufacturing a moving body that moves through a fluid, the method including irradiating a processing light onto a surface of an object via an optical system, changing the state of the image plane of the optical system, and removing a part of the object by irradiating the processing light onto the surface of the object to form a structure on the surface of the object. [Brief explanation of the drawings]

[0032] [Figure 1] FIG. 1 is a cross-sectional view schematically showing the overall structure of the processing apparatus of this embodiment. [Figure 2] 2(a) and 2(b) are cross-sectional views each showing a schematic view of processing of a coating film formed on the surface of an object to be processed. [Figure 3] FIG. 3(a) is a cross-sectional view showing a schematic diagram of a light irradiation device provided in the processing apparatus of this embodiment, and FIGS. 3(b) and 3(c) are cross-sectional views showing the configuration of a light source system provided in the light irradiation device, and FIG. 3(d) is a perspective view showing a schematic diagram of another example of the optical system of the light irradiation device. [Figure 4] FIG. 4 is a side view showing the storage device. [Figure 5] FIG. 5(a) is a cross-sectional view showing a cross section of a riblet structure formed by the processing device of this embodiment, and FIG. 5(b) is a perspective view showing the riblet structure formed by the processing device of this embodiment. [Figure 6] Figures 6(a) and 6(b) are each a front view showing an aircraft, which is an example of an object to be processed on which a riblet structure is formed, and Figure 6(c) is a side view showing an aircraft, which is an example of an object to be processed on which a riblet structure is formed. [Figure 7] FIG. 7 is a plan view showing a plurality of unit processing areas set on the surface of the coating film SF. [Figure 8] FIG. 8 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 9]Figure 9(a) is a cross-sectional view showing a processing device performing one step of a processing operation to form a riblet structure, and Figure 9(b) is a plan view showing the surface of a paint film during one step of the processing operation shown in Figure 9(a). [Figure 10] FIG. 10 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 11] Figure 11(a) is a cross-sectional view showing a processing device performing one step of a processing operation to form a riblet structure, and Figure 11(b) is a plan view showing the surface of a paint film during one step of the processing operation shown in Figure 11(a). [Figure 12] FIG. 12 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 13] FIG. 13 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 14] FIG. 14 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 15] FIG. 15 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 16] FIG. 16 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 17] FIG. 17 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 18] FIG. 18 is a cross-sectional view schematically showing another example of the light irradiation device. [Figure 19] FIG. 19 is a cross-sectional view schematically showing another example of the light irradiation device. [Figure 20] FIG. 20 is a cross-sectional view schematically showing another example of the light irradiation device. [Figure 21] FIG. 21 is a cross-sectional view schematically showing another example of the light irradiation device. [Figure 22] FIG. 22 is a cross-sectional view schematically showing another example of the light irradiation device. [Figure 23] FIG. 23 is a cross-sectional view schematically showing another example of the light irradiation device. [Figure 24] FIG. 24 is a cross-sectional view schematically showing another example of the light irradiation device. [Figure 25] FIG. 25 is a cross-sectional view schematically showing the overall structure of a processing apparatus according to a second modified example. [Figure 26] Figure 26(a) is a cross-sectional view showing how the surface of a paint film is located within the range of the focal depth of the optical system when the surface of the paint film is flat, Figure 26(b) is a cross-sectional view showing how the surface of a paint film is located within the range of the focal depth of the optical system when the surface of the paint film is curved, Figure 26(c) is a cross-sectional view showing how the surface of a paint film is located within the range of the focal depth of the optical system when the surface of the paint film has unevenness, and Figure 26(d) is a cross-sectional view showing how the surface of a paint film is located within the range of the focal depth of the optical system when the surface of the paint film is inclined with respect to the optical axis of the optical system. [Figure 27] FIG. 27 is a cross-sectional view that schematically shows a light irradiation device that can individually adjust the focusing positions of a plurality of processing beams. [Figure 28] FIG. 28 is a cross-sectional view showing how a plurality of processing beams are irradiated when the optical system is non-telecentric on the coating film side. [Figure 29] Figure 29(a) is a cross-sectional view showing how the focusing positions of multiple processing light beams are located on the surface of a coating film when the surface of the coating film is flat, Figure 29(b) is a cross-sectional view showing how the focusing positions of multiple processing light beams are located on the surface of a coating film when the surface of the coating film is curved, Figure 29(c) is a cross-sectional view showing how the focusing positions of multiple processing light beams are located on the surface of a coating film when the surface of the coating film has unevenness, and Figure 29(d) is a cross-sectional view showing how the focusing positions of multiple processing light beams are located on the surface of a coating film when the surface of the coating film is inclined with respect to the optical axis of the optical system. [Figure 30]Figure 30(a) is a cross-sectional view showing the range of depth of focus of an optical system set to include the surface of a paint film when the surface of the paint film is flat, Figure 30(b) is a cross-sectional view showing the range of depth of focus of an optical system set to include the surface of a paint film when the surface of the paint film is curved, Figure 30(c) is a cross-sectional view showing the range of depth of focus of an optical system set to include the surface of a paint film when the surface of the paint film is uneven, and Figure 30(d) is a cross-sectional view showing the range of depth of focus of an optical system set to include the surface of a paint film when the surface of the paint film is inclined with respect to the optical axis of the optical system. [Figure 31] Figure 31(a) is a cross-sectional view showing an image plane set to coincide with the surface of the coating film SF when the surface of the coating film is flat, Figure 31(b) is a cross-sectional view showing an image plane set to coincide with the surface of the coating film SF when the surface of the coating film SF is curved, Figure 31(c) is a cross-sectional view showing an image plane set to coincide with the surface of the coating film SF when the surface of the coating film is uneven, and Figure 31(d) is a cross-sectional view showing an image plane set to coincide with the surface of the coating film SF when the surface of the coating film is inclined with respect to the optical axis of the optical system. [Figure 32] FIG. 32(a) is a cross-sectional view showing the non-processed region, and FIG. 32(b) is a plan view showing the non-processed region. [Figure 33] Each of Figures 33(a) to 33(c) is a graph showing the relationship between the reflectance of the coating film with respect to the processing light and the intensity of the processing light set by the control device. [Figure 34] Each of Fig. 34(a) to Fig. 33(c) is a graph showing the relationship between the reflectance of the coating film with respect to the processing light and the irradiation time of the processing light set by the control device. [Figure 35] FIG. 35 is a graph showing the reflectance of a coating film for a plurality of measurement lights with different wavelengths. [Figure 36] FIG. 36 is a cross-sectional view schematically showing a light irradiation device equipped with a plurality of light source systems. [Figure 37]FIG. 37 is a cross-sectional view showing the range in which the surface property measuring device measures the shape of the surface of the coating film when the light irradiation device moves relative to the coating film SF. [Figure 38] FIG. 38 is a cross-sectional view schematically showing the overall structure of a processing apparatus according to a third modified example. [Figure 39] FIG. 39 is a plan view showing the positional relationship between a light projecting device and a detecting device provided in the structure measuring instrument. [Figure 40] FIG. 40 is a plan view showing a sample area where the structure measurement device measures the characteristics of the riblet structure. [Figure 41] Figure 41(a) is a cross-sectional view showing the ideal riblet structure that the processing device should form, Figure 41(b) is a cross-sectional view showing a riblet structure of the same size as the ideal riblet structure, Figure 41(c) is a cross-sectional view showing a riblet structure of a size smaller than the ideal riblet structure, and Figure 41(d) is a cross-sectional view showing a riblet structure of a size larger than the ideal riblet structure. [Figure 42] Figure 42(a) is a cross-sectional view showing a riblet structure having the same shape as the ideal riblet structure, and Figure 42(b) is a cross-sectional view showing a riblet structure having a different shape from the ideal riblet structure. [Figure 43] Figure 43(a) is a cross-sectional view showing a riblet structure including a concave structure at the same position as the concave structure that constitutes an ideal riblet structure, and Figure 43(b) is a cross-sectional view showing a riblet structure including a concave structure at a different position from the concave structure that constitutes the ideal riblet structure. [Figure 44] Figure 44(a) is a cross-sectional view showing a sample area in which a riblet structure is formed, and Figure 44(b) is a cross-sectional view showing a sample area in which a riblet structure is not formed. [Figure 45] Figure 45(a) is a cross-sectional view showing how processing light is irradiated onto a riblet structure that is smaller than the ideal size in order to correct the riblet structure, and Figure 45(b) is a cross-sectional view showing the corrected riblet structure. [Figure 46]FIG. 46 is a cross-sectional view schematically showing the structure of a light irradiation device provided in a processing apparatus of the fourth modified example. [Figure 47] Figures 47(a) and 47(b) are plan views showing multiple irradiation areas with different arrangement pitches, and Figures 47(c) and 47(d) are cross-sectional views showing riblet structures formed by irradiating multiple processing light beams onto the multiple irradiation areas shown in Figures 47(a) and 47(b), respectively. [Figure 48] Figures 48(a) and 48(b) are plan views showing multiple processing lights with different relative angles, and Figures 48(c) and 48(d) are plan views showing multiple irradiation areas onto which the multiple processing lights shown in Figures 48(a) and 48(b) are irradiated, respectively. [Figure 49] Figures 49(a) and 49(b) are plan views showing multiple processing lights emitted from light irradiation devices at different distances from the coating film SF, and Figures 49(c) and 49(d) are plan views showing multiple irradiation areas onto which the multiple processing lights shown in Figures 49(a) and 49(b) are irradiated, respectively. [Figure 50] Figures 50(a) and 50(c) are plan views showing multiple processing lights emitted from light irradiation devices having different numbers of light sources that emit processing light, and Figures 50(b) and 50(d) are plan views showing multiple irradiation areas onto which the multiple processing lights shown in Figures 50(a) and 50(c) are irradiated, respectively. [Figure 51] Figures 51(a) and 51(c) are plan views showing first and second branched lights having different intersecting angles, and Figures 51(b) and 51(d) are plan views showing interference fringes formed on the surface of a coating film due to interference between the first and second branched lights shown in Figures 51(a) and 51(c), respectively. [Figure 52] FIG. 52 is a cross-sectional view schematically showing a light irradiation device capable of adjusting the angle at which the first and second split light beams intersect. [Figure 53] FIG. 53 is a cross-sectional view schematically showing the overall structure of a processing apparatus according to a fifth modified example. [Figure 54]Figures 54(a) and 54(c) are cross-sectional views showing the intensity distribution on the surface of a coating film, and Figures 54(b) and 54(d) are cross-sectional views showing the riblet structure formed by irradiating multiple processing light beams having the intensity distributions shown in Figures 54(a) and 54(c), respectively. [Figure 55] Figures 55(a) and 55(c) are cross-sectional views showing multiple irradiation areas with different shapes, and Figures 55(b) and 55(d) are cross-sectional views showing riblet structures formed by irradiating multiple processing light beams onto multiple irradiation areas having the shapes shown in Figures 55(a) and 55(c), respectively. [Figure 56] Figures 56(a) and 56(c) are cross-sectional views showing multiple irradiation areas of different sizes, and Figures 56(b) and 56(d) are cross-sectional views showing riblet structures formed by irradiating multiple processing light beams onto multiple irradiation areas having the sizes shown in Figures 56(a) and 56(c), respectively. [Figure 57] Figures 57(a) and 57(c) are cross-sectional views showing multiple processing lights with different intensities, and Figures 57(b) and 57(d) are cross-sectional views showing riblet structures formed by irradiating multiple processing lights with the intensities shown in Figures 57(a) and 57(c), respectively. [Figure 58] Figure 58(a) is an oblique view showing a riblet structure in which the cross-sectional shape of the concave structure changes along the extension direction, Figure 58(b) is a cross-sectional view taken along line II' in Figure 58(a), and Figure 58(c) is a cross-sectional view taken along line II-II' in Figure 58(a). [Figure 59] Figure 59(a) is an oblique view showing a riblet structure in which the width of the concave structure changes along the extension direction, Figure 59(b) is a cross-sectional view taken along line II' in Figure 54(a), and Figure 59(c) is a cross-sectional view taken along line II-II' in Figure 59(a). [Figure 60] FIG. 60 is a cross-sectional view schematically showing the overall structure of a processing apparatus according to a sixth modified example. [Figure 61] FIG. 61 is a cross-sectional view schematically showing the overall structure of a processing apparatus according to a seventh modified example. [Figure 62] FIG. 62 is a cross-sectional view schematically showing the overall structure of a processing apparatus according to an eighth modified example. [Figure 63] FIG. 63 is a cross-sectional view showing an example of the structure of an adsorption part that positions the light irradiation device on the coating film. [Figure 64] FIG. 64 is a cross-sectional view schematically showing the overall structure of a processing apparatus according to a ninth modified example. [Figure 65] FIG. 65 is a cross-sectional view schematically showing the overall structure of a processing apparatus according to a tenth modified example. [Figure 66] FIG. 66 is a plan view showing a unit processing area that partially overlaps with another adjacent unit processing area. [Figure 67] FIG. 67 is a cross-sectional view showing how processing light is irradiated onto two adjacent unit processing areas. [Figure 68] FIG. 68 is a cross-sectional view showing how processing light is irradiated onto two adjacent unit processing areas. [Figure 69] FIG. 69 is a cross-sectional view showing the intensity of processing light irradiated onto two adjacent unit processing regions. [Figure 70] FIG. 70 is a cross-sectional view showing the intensity of processing light irradiated onto two adjacent unit processing regions. [Figure 71] Each of Figures 71(a) to 71(c) is a plan view showing an area where a plurality of irradiation areas move in one scanning operation. [Figure 72] Each of Figures 72(a) and 72(b) is a cross-sectional view showing a structure in which multiple layers are stacked. DETAILED DESCRIPTION OF THE INVENTION

[0033] Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the embodiments described below.

[0034] (1) Structure of the processing device 1 The structure of the processing apparatus 1 of this embodiment will be described with reference to FIG. 1. FIG. 1 is a cross-sectional view schematically illustrating the structure of the processing apparatus 1 of this embodiment. Hereinafter, the structure of the processing apparatus 1 will be described in a three-dimensional coordinate space defined by mutually orthogonal X-, Y-, and Z-axes. The X- and Y-axes are directions along a horizontal plane, and the Z-axis is a direction perpendicular to the X- and Y-axes. Although FIG. 1 illustrates the processing apparatus 1 being disposed on a workpiece S having a surface along a horizontal plane, the processing apparatus 1 is not necessarily disposed on the workpiece S having a surface along a horizontal plane. For example, as will be described in detail later with reference to FIG. 6 and the like, the processing apparatus 1 may be disposed on a workpiece S having a surface intersecting a horizontal plane, or may be suspended from the workpiece S. In this case, the X- and Y-axes may be defined as directions along the surface of the workpiece S for convenience.

[0035] As shown in FIG. 1, the processing device 1 processes a coating film SF formed on the surface of a workpiece S. The workpiece S may be, for example, a metal, an alloy (e.g., duralumin, etc.), a resin (e.g., CFRP (Carbon Fiber Reinforced Plastic), etc.), glass, or an object made of any other material. The coating film SF is a film of paint that covers the surface of the workpiece S. The thickness of the coating film SF is, for example, several tens of micrometers to several hundred micrometers, but may be any other size. The paint that constitutes the coating film SF may include, for example, a resin-based paint (e.g., at least one of a polyurethane-based paint, a vinyl-based paint, a silicone-based paint, and an epoxy-based paint), or may include other types of paint.

[0036] The processing device 1 irradiates the coating film SF with processing light EL in order to process the coating film SF. The processing light EL may be any type of light as long as it can process the coating film SF when irradiated onto the coating film SF. As an example, the processing light EL may be laser light. Furthermore, the processing light EL may be light of any wavelength as long as it can process the coating film SF when irradiated onto the coating film SF. In this embodiment, the explanation will be given using an example in which the processing light EL is invisible light (for example, at least one of infrared light and ultraviolet light). However, the processing light EL may also be visible light.

[0037] The processing apparatus 1 irradiates the processing light EL onto an irradiation area EA set (in other words, formed) on the surface of the coating film SF. As shown in FIG. 2(a), when the processing light EL is irradiated onto the irradiation area EA, a portion of the coating film SF overlapping the irradiation area EA (i.e., the coating film located on the -Z side of the irradiation area EA) is evaporated by the processing light EL. At this time, not all of the coating film SF overlapping the irradiation area EA in the thickness direction of the coating film SF is evaporated. That is, in the thickness direction of the coating film SF, a portion of the coating film SF overlapping the irradiation area EA (specifically, a portion of the coating film SF relatively close to the irradiation area EA) evaporates, while the other portion of the coating film SF overlapping the irradiation area EA (specifically, a portion of the coating film SF relatively far from the irradiation area EA) does not evaporate. In other words, the coating film SF evaporates only to the extent that the workpiece S is not exposed through the coating film SF. As a result, the coating film SF is removed in the portion where it has evaporated. On the other hand, the coating film SF remains in the portion where it has not evaporated. That is, as shown in FIG. 2(b), the coating film SF is partially removed in the area irradiated with the processing light EL. As a result, as shown in FIG. 2(b), the thickness of the coating film SF is thinner in the area irradiated with the processing light EL compared to the area not irradiated with the processing light EL. In other words, as shown in FIG. 2(b), on the surface of the workpiece S, there exists a coating film SF that remains relatively thick because it is not irradiated with the processing light EL, and a coating film SF that is relatively thin because it is irradiated with the processing light EL. That is, the thickness of the coating film SF is at least partially adjusted by irradiation with the processing light EL. As a result, a recess (in other words, a groove) C corresponding to the relatively thin portion of the coating film SF is formed on the surface of the coating film SF. Therefore, the "operation of processing the coating film SF" in this embodiment includes an operation of adjusting the thickness of the coating film SF, an operation of removing a portion of the coating film SF, and an operation of forming a recess C in the coating film SF. Furthermore, the energy of the processing light EL irradiated onto the coating film SF is determined so that the irradiation of the processing light EL does not affect the workpiece S. In other words, the energy of the processing light EL is determined so that irradiation with the processing light EL affects only the coating film SF.

[0038] The coating film SF evaporates by absorbing the processing light EL. That is, the coating film SF is photochemically decomposed and removed, for example, when the energy of the processing light EL is transmitted to the coating film SF. When the processing light EL is laser light, the phenomenon in which the energy of the processing light EL is transmitted to the coating film SF and the coating film SF is photochemically decomposed and removed is sometimes referred to as laser ablation. For this reason, the coating film SF contains a material that can absorb the processing light EL. Specifically, for example, the coating film SF may contain a material whose absorptance for the processing light EL (i.e., absorptance for light of a wavelength different from the wavelength range of visible light) is equal to or greater than a predetermined first absorption threshold. Such a material may be a pigment.

[0039] If the coating film SF contains a pigment, the pigment may be a pigment that exhibits a desired color when irradiated with visible light. As a result, the coating film SF containing such a pigment exhibits the desired color. In this case, the pigment may have a characteristic such that the absorptance of a first light component of a wavelength in the visible light wavelength range that is reflected by the coating film SF and recognized by humans as light of the desired color differs from the absorptance of a second light component of visible light other than the first light component, so that the coating film SF exhibits the desired color. For example, the pigment may have a characteristic such that the absorptance of the first light component is smaller than the absorptance of the second light component. For example, the pigment may have a characteristic such that the absorptance of the first light component is equal to or less than a predetermined second absorption threshold (where the second absorption threshold is smaller than the first absorption threshold) and the absorptance of the second light component is equal to or greater than a predetermined third absorption threshold (where the third absorption threshold is larger than the second absorption threshold). An example of a dye that can adequately absorb invisible processed light EL while exhibiting a desired color is a near-infrared absorbing dye manufactured by Spectrum Info, located in Kyiv, Ukraine (one example is tetrafluoroboronated 4-((E)-2-{(3E)-2-chloro-3-[2-(2,6-diphenyl-4H-thiopyran-4-ylidene)ethylidene]cyclohex-1-en-1-yl}vinyl)-2,6-diphenylthiopyrylium).

[0040] Alternatively, if the coating film SF contains a dye, the dye may be a dye that is transparent to visible light. As a result, the coating film SF containing such a dye becomes a transparent film (so-called clear coat). In this case, the dye may have the property of not absorbing much visible light (i.e., reflecting a certain amount) so that the coating film SF is transparent. For example, the dye may have the property of having a visible light absorption rate less than a predetermined fourth absorption threshold. An example of a dye that can absorb a certain amount of invisible processed light EL while being transparent to visible light is a near-infrared absorbing dye manufactured by Spectrum Info (e.g., tetrafluoroboronated 6-chloro-2-[(E)-2-(3-{(E)-2-[6-chloro-1-ethylbenzo[cd]indol-2(1H)-ylidene]ethylidene}-2-phenyl-1-cyclopenten-1-yl)ethenyl]-1-ethylbenzo[cd]indolium).

[0041] Referring again to FIG. 1, in order to process the coating film SF, the processing apparatus 1 includes a light irradiation device 11, a drive system 12, a storage device 13, a support device 14, a drive system 15, an exhaust device 16, a gas supply device 17, and a control device 18.

[0042] The light irradiation device 11 can irradiate the coating film SF with processing light EL under the control of the control device 18. To irradiate the processing light EL, the light irradiation device 11 includes a light source system 111 that can emit the processing light EL, and an optical system 112 that guides the processing light EL emitted from the light source system 111 to the coating film SF, as shown in FIG.

[0043] The light source system 111 simultaneously emits, for example, multiple processing light beams EL. For this purpose, the light source system 111 includes multiple light sources 1111, as shown in FIG. 3(b). The multiple light sources 1111 are arranged in a row at equal intervals. Each light source 1111 emits pulsed light as the processing light EL. A shorter emission time width of the pulsed light (hereinafter referred to as the "pulse width") improves processing accuracy (e.g., the accuracy of forming the riblet structure described below). Therefore, each light source 1111 may emit pulsed light with a relatively short pulse width as the processing light EL. For example, each light source 1111 may emit pulsed light with a pulse width of 1000 nanoseconds or less as the processing light EL. Alternatively, as shown in FIG. 3(c), the light source system 111 may include a single light source 1111 and a branching device 1112 that branches the light from the single light source 1111 into multiple processing light beams EL. The multiple exit ports from which the multiple processing lights EL branched by the branching device 1112 are respectively emitted are arranged in a row at equal intervals. An example of the branching device 1112 is at least one of an optical fiber coupler and a waveguide splitter. As will be described later, the branching device 1112 may also be at least one of a lens array, a diffractive optical element, a spatial light modulator, etc.

[0044] The optical system 112 includes a focus lens 1121, a galvanometer mirror 1122, and an fθ lens 1123. The processing light EL is irradiated onto the coating film SF via the focus lens 1121, the galvanometer mirror 1122, and the fθ lens 1123.

[0045] The focus lens 1121 is composed of one or more lenses and is an optical element for adjusting the focusing positions of the multiple processing light beams EL (i.e., the focal position of the optical system 112) by adjusting the positions of at least some of the lenses along the optical axis direction. The galvanometer mirror 1122 deflects the multiple processing light beams EL so that they scan the surface of the coating film SF (i.e., multiple irradiation areas EA, onto which the multiple processing light beams EL are respectively irradiated, move across the surface of the coating film SF). The galvanometer mirror 112 includes an X-scanning mirror 1122X and a Y-scanning mirror 1122Y. The X-scanning mirror 1122X reflects the multiple processing light beams EL toward the Y-scanning mirror 1122Y. The X-scanning mirror 1122X can swing or rotate in the θY direction (i.e., the rotational direction around the Y axis). The swinging or rotation of the X-scanning mirror 1122X causes the multiple processing light beams EL to scan the surface of the coating film SF along the X-axis direction. The X-scanning mirror 1122X swings or rotates, causing the multiple irradiation areas EA to move along the X-axis on the coating film SF. The X-scanning mirror 1122X changes the relative positional relationship between the multiple irradiation areas EA and the coating film SF along the X-axis. The Y-scanning mirror 1122Y reflects the multiple processing light beams EL toward the fθ lens 1123. The Y-scanning mirror 1122Y can swing or rotate in the θX direction (i.e., the rotation direction around the X-axis). The Y-scanning mirror 1122Y swings or rotates, causing the multiple processing light beams EL to scan the surface of the coating film SF along the Y-axis. The Y-scanning mirror 1122Y swings or rotates, causing the multiple irradiation areas EA to move along the Y-axis on the coating film SF. The Y-scanning mirror 1122Y changes the relative positional relationship between the multiple irradiation areas EA and the coating film SF along the Y-axis. The fθ lens 1123 is an optical element for focusing the multiple processing light beams EL from the galvanometer mirror 1122 onto the coating film SF.

[0046] The fθ lens 1123 is the terminal optical element located closest to the light exit side of the optical system 112 among the optical elements included in the optical system 112 (in other words, closest to the coating film SF or located at the end of the optical paths of the multiple processing lights EL). The fθ lens 1123 is configured to be detachable from the optical system 112. As a result, it is possible to attach a new fθ lens 1123 to the optical system 112 after removing the old fθ lens 1123 from the optical system 112. However, if the optical system 112 includes an optical element (for example, a cover lens) that is provided on the exit side of the fθ lens 1123, that optical element becomes the terminal optical element, and the optical element is configured to be detachable from the optical system 112.

[0047] The directions of travel of the multiple processing light beams EL from the optical system 112 are, for example, parallel to each other. As a result, in this embodiment, the coating film SF is simultaneously irradiated with multiple processing light beams EL traveling in parallel to each other. In other words, multiple irradiation areas EA are simultaneously set on the coating film SF. Therefore, the throughput for processing the coating film SF is improved compared to when a single processing light beam EL is irradiated onto the coating film SF. Note that the optical system 112 may be configured such that all optical components (e.g., the focus lens 1121, the galvanometer mirror 1122, and the fθ lens 1123) are not located on the same plane, as shown in FIG. 3(d), for example.

[0048] Referring again to FIG. 1 , the drive system 12, under the control of the control device 18, moves the light irradiation device 11 relative to the coating film SF (i.e., relative to the workpiece S on whose surface the coating film SF is formed). That is, the drive system 12 moves the light irradiation device 11 relative to the coating film SF so as to change the relative positional relationship between the light irradiation device 11 and the coating film SF. When the relative positional relationship between the light irradiation device 11 and the coating film SF is changed, the relative positional relationship between the multiple irradiation areas EA, onto which the multiple processing lights EL are respectively irradiated, and the coating film SF also changes. Therefore, it can be said that the drive system 12 moves the light irradiation device 11 relative to the coating film SF so as to change the relative positional relationship between the multiple irradiation areas EA and the coating film SF. The drive system 12 may also move the light irradiation device 11 along the surface of the coating film SF. In the example shown in FIG. 1 , the surface of the coating film SF is a plane parallel to at least one of the X-axis and Y-axis, so the drive system 12 may move the light irradiation device 11 along at least one of the X-axis and Y-axis. As a result, the irradiation area EA moves along at least one of the X-axis and Y-axis on the coating film SF. The drive system 12 may move the light irradiation device 11 along the thickness direction of the coating film SF (i.e., the direction intersecting the surface of the coating film SF). In the example shown in FIG. 1, the thickness direction of the coating film SF is along the Z-axis, so the drive system 12 may move the light irradiation device 11 along the Z-axis. The drive system 12 may move the light irradiation device 11 along at least one of the θX direction, θY direction, and θZ direction (i.e., the rotation direction around the Z-axis) in addition to at least one of the X-axis, Y-axis, and Z-axis.

[0049] The drive system 12 supports the light irradiation device 11 and moves the supported light irradiation device 11. In this case, the drive system 12 includes, for example, a first support member that supports the light irradiation device 11 and a first movement mechanism that moves the first support member.

[0050] The accommodation device 13 includes a ceiling member 131 and a partition member 132. The ceiling member 131 is disposed on the +Z side of the light irradiation device 11. The ceiling member 131 is a plate-shaped member extending along the XY plane. The ceiling member 131 supports the drive system 12 via a support member 133. A partition member 132 is disposed on (or near) the outer edge of the -Z side surface of the ceiling member 131. The partition member 132 is a tubular (e.g., cylindrical or rectangular tubular) member extending from the ceiling member 131 toward the -Z side. The space surrounded by the ceiling member 131 and the partition member 132 forms an accommodation space SP for accommodating the light irradiation device 11 and the drive system 12. Therefore, the drive system 12 moves the light irradiation device 11 within the accommodation space SP. Furthermore, the accommodation space SP includes a space between the light irradiation device 11 and the coating film SF (particularly, a space including the optical path of the processing light EL). More specifically, the accommodation space SP includes the space between the final optical element (for example, the fθ lens 1123) included in the light irradiation device 11 and the coating film SF (particularly, the space including the optical path of the processing light EL).

[0051] The ceiling member 131 and the partition member 132 are each capable of blocking the processing light EL. That is, the ceiling member 131 and the partition member 132 are each opaque to the wavelength of the processing light EL. As a result, the processing light EL propagating within the storage space SP does not leak out to the outside of the storage space SP (i.e., outside the storage device 13). The ceiling member 131 and the partition member 132 may each be a member capable of attenuating the processing light EL. That is, the ceiling member 131 and the partition member 132 may each be semi-transparent to the wavelength of the processing light EL. Furthermore, the ceiling member 131 and the partition member 132 are each a member that does not transmit (i.e., can block) unnecessary substances generated by irradiation with the processing light EL. An example of unnecessary substances is vapor from the coating film SF. As a result, unnecessary substances generated within the storage space SP do not leak out to the outside of the storage space SP (i.e., outside the storage device 13).

[0052] An end 134 of the partition member 132 (specifically, the end on the coating film SF side, or the -Z side end in the example shown in FIG. 1 ) can come into contact with the surface of the coating film SF. When the end 134 comes into contact with the coating film SF, the storage device 13 (i.e., the ceiling member 131 and the partition member 132) cooperates with the coating film SF to maintain the airtightness of the storage space SP. When the end 134 comes into contact with the coating film SF, its shape (particularly the shape of the contact surface of the end 134 that comes into contact with the coating film SF (the surface on the -Z side in the example shown in FIG. 1 )) can change depending on the shape of the surface of the coating film SF; the same applies below). For example, when the end 134 comes into contact with a coating film SF with a flat surface, the shape of the end 134 becomes flat, just like the coating film SF. For example, when the end 134 comes into contact with a coating film SF with a curved surface, the shape of the end 134 becomes curved, just like the coating film SF. As a result, the sealing performance of the accommodation space SP is improved compared to when the end 134 cannot change its shape according to the shape of the surface of the coating film SF. An example of the shape-changeable end 134 is an end 134 made of an elastic material such as rubber (in other words, a flexible material). Note that the shape-changeable end 134 may be, for example, a bellows-shaped end 134a having an elastic structure as shown in FIG. 4.

[0053] Returning to FIG. 1 , the end 134 can be attached to the coating film SF while in contact with the coating film SF. For example, the end 134 may be provided with an adsorption mechanism that can adsorb to the coating film SF. When the end 134 is attached to the coating film SF, the airtightness of the storage space SP is further improved compared to when the end 134 is not attached to the coating film SF. However, the end 134 does not have to be able to be attached to the coating film SF. Even in this case, as long as the end 134 is in contact with the coating film SF, the airtightness of the storage space SP is still maintained to an appropriate extent.

[0054] The partition member 132 is a member that can expand and contract along the Z-axis by a drive system (e.g., an actuator) (not shown) that operates under the control of the control device 18. For example, the partition member 132 may be a bellows-shaped member. In this case, the partition member 132 can expand and contract by expanding and contracting the bellows portion. Alternatively, for example, the partition member 132 may include a telescopic pipe that combines multiple hollow cylindrical members with different diameters. In this case, the partition member 132 can expand and contract by relative movement of the multiple cylindrical members. The state of the partition member 132 can be set to at least a first extended state in which the partition member 132 extends along the Z-axis and thus has a relatively long length in the Z-axis direction, and a first contracted state in which the partition member 132 contracts along the Z-axis and thus has a relatively short length in the Z-axis direction. When the partition member 132 is in the first extended state, the end portion 134 can come into contact with the coating film SF. On the other hand, when the partition member 132 is in the first contracted state, the end 134 does not contact the coating film SF. In other words, when the partition member 132 is in the first contracted state, the end 134 is away from the coating film SF on the +Z side. Note that the configuration for switching the state of the partition member 132 between the first extended state, in which the end 134 of the partition member 132 can contact the coating film SF, and the first contracted state, in which the end 134 is away from the coating film SF, is not limited to a configuration for extending or contracting the partition member 132. For example, the state of the partition member 132 may be switched between the first extended state and the first contracted state by configuring the storage device 13 itself to be movable along the ±Z directions.

[0055] The accommodation device 13 further includes a detection device 135. The detection device 135 detects unwanted substances in the accommodation space SP (i.e., substances generated by irradiation with the processing light EL). As will be described in detail later, the detection result of the detection device 135 is referred to by the control device 18 when changing the state of the partition member 132 from the first extended state to the first contracted state.

[0056] The support device 14 supports the storage device 13. Because the storage device 13 supports the drive system 12 and the light irradiation device 11, the support device 14 essentially supports the drive system 12 and the light irradiation device 11 via the storage device 13. In order to support the storage device 13, the support device 14 is equipped with a beam member 141 and a plurality of leg members 142. The beam member 141 is arranged on the +Z side of the storage device 13. The beam member 141 is a beam-shaped member extending along the XY plane. The beam member 141 supports the storage device 13 via support members 143. A plurality of leg members 142 are arranged on the beam member 141. The leg members 142 are rod-shaped members extending from the beam member 141 toward the -Z side.

[0057] The end 144 of the leg member 142 (specifically, the end on the coating film SF side, or the -Z side end in the example shown in FIG. 1 ) can come into contact with the surface of the coating film SF. As a result, the support device 14 is supported by the coating film SF (i.e., by the workpiece S). That is, the support device 14 supports the storage device 13 with the end 144 in contact with the coating film SF (in other words, with the support device 14 supported by the coating film S). When the end 144 comes into contact with the coating film SF, like the end 134 of the storage device 13, its shape (particularly, the shape of the contact surface of the end 144 that comes into contact with the coating film SF (the surface on the -Z side in the example shown in FIG. 1 ); the same applies below) can change depending on the shape of the surface of the coating film SF. The end 144 can adhere to the coating film SF while in contact with the coating film SF. For example, the end 144 may be provided with an adsorption mechanism that can adsorb to the coating film SF. When the end 144 is attached to the coating film SF, the stability of the support device 14 is improved compared to when the end 144 is not attached to the coating film SF. However, the end 144 does not have to be able to be attached to the coating film SF.

[0058] The beam member 141 is a member that can be extended and retracted along at least one of the X-axis and Y-axis (or along any direction along the XY plane) by the drive system 15 that operates under the control of the control device 18. For example, the beam member 141 may include a telescopic pipe in which multiple tubular members with different diameters are combined. In this case, the beam member 141 can be extended and retracted by the relative movement of the multiple tubular members.

[0059] The leg member 142 is a member that can be extended and retracted along the Z axis by the drive system 15 that operates under the control of the control device 18. For example, the leg member 142 may include a telescopic pipe that combines multiple tubular members with different diameters. In this case, the leg member 142 can be extended and retracted by relative movement of the multiple tubular members. The state of the leg member 142 can be set to at least a second extended state in which the leg member 142 extends along the Z axis, thereby making the length in the Z axis direction relatively long, and a second contracted state in which the leg member 142 contracts along the Z axis, thereby making the length in the Z axis direction relatively short. When the leg member 142 is in the second extended state, the end portion 144 can come into contact with the coating film SF. On the other hand, when the leg member 142 is in the second contracted state, the end portion 144 does not come into contact with the coating film SF. In other words, when the leg member 142 is in the second contracted state, the end portion 144 is separated from the coating film SF on the +Z side.

[0060] The drive system 15, under the control of the control device 18, moves the support device 14 relative to the coating film SF (i.e., relative to the workpiece S on whose surface the coating film SF is formed). That is, the drive system 15 moves the support device 14 relative to the coating film SF so as to change the relative positional relationship between the support device 14 and the coating film SF. Because the support device 14 supports the storage device 13, the drive system 15 essentially moves the storage device 13 relative to the coating film SF by moving the support device 14. That is, the drive system 15 essentially moves the support device 14 relative to the coating film SF so as to change the relative positional relationship between the storage device 13 and the coating film SF. Furthermore, the storage device 13 supports the light irradiation device 11 via the drive system 12. Therefore, the drive system 15 essentially moves the support device 14 so as to move the light irradiation device 11 relative to the coating film SF. That is, the drive system 15 can move the support device 14 relative to the coating film SF so as to change the relative positional relationship between the light irradiation device 11 and the coating film SF. In other words, the drive system 15 can move the support device 14 relative to the coating film SF so as to change the relative positional relationship between the multiple irradiation areas EA and the coating film SF.

[0061] The drive system 15 extends and retracts the beam members 141 under the control of the control device 18 in order to move the support device 14. Furthermore, the drive system 15 extends and retracts the multiple leg members 142 under the control of the control device 18 in order to move the support device 14. The manner in which the drive system 15 moves the support device 14 will be described in detail later with reference to Figures 7 to 17.

[0062] The exhaust device 16 is connected to the accommodation space SP via an exhaust pipe 161. The exhaust device 16 can exhaust gas from the accommodation space SP. In particular, by exhausting gas from the accommodation space SP, the exhaust device 16 can suck unnecessary substances generated by irradiation of the processing light EL from the accommodation space SP to the outside of the accommodation space SP. In particular, if this unnecessary substance is present in the optical path of the processing light EL, it may affect the irradiation of the processing light EL onto the coating film SF. For this reason, the exhaust device 16 particularly sucks unnecessary substances together with gas from the space including the optical path of the processing light EL between the final optical element of the optical system 112 and the coating film SF. The unnecessary substances sucked from the accommodation space SP by the exhaust device 16 are discharged to the outside of the processing apparatus 1 via a filter 162. The filter 162 adsorbs the unnecessary substances. Note that the filter 162 may be detachable or replaceable.

[0063] The gas supply device 17 is connected to the accommodation space SP via an intake pipe 171. The gas supply device 17 can supply gas to the accommodation space SP. The gas to be supplied to the accommodation space SP can be at least one of atmospheric air, CDA (clean dry air), and an inert gas. An example of an inert gas is nitrogen gas. In this example, the gas supply device 17 supplies CDA. Therefore, the accommodation space SP becomes a space purged with CDA. At least a portion of the CDA supplied to the accommodation space SP is sucked in by the exhaust device 16. The CDA sucked in from the accommodation space SP by the exhaust device 16 passes through a filter 162 and is discharged to the outside of the processing apparatus 1.

[0064] The gas supply device 17 particularly supplies a gas such as CDA to the optical surface 1124 on the accommodation space SP side of the fθ lens 1123 shown in FIG. 3 (i.e., the optical surface on the accommodation space SP side of the final optical element of the optical system 112). Because the optical surface 1124 faces the accommodation space SP, it may be exposed to unwanted substances generated by irradiation with the processing light EL. As a result, the unwanted substances may adhere to the optical surface 1124. Furthermore, because the processing light EL passes through the optical surface 1124, the unwanted substances adhered to the optical surface 1124 may be burned (i.e., fixed) by the processing light EL passing through the optical surface 1124. The unwanted substances that have adhered (or even fixed) to the optical surface 1124 may contaminate the optical surface 1124 and affect the characteristics of the processing light EL. Therefore, supplying a gas such as CDA to the optical surface 1124 prevents the optical surface 1124 from coming into contact with the unwanted substances. This prevents dirt from adhering to the optical surface 1124. Therefore, the gas supply device 17 also functions as an adhesion prevention device that prevents dirt from adhering to the optical surface 1124. Furthermore, even if dirt has adhered (or even become stuck) to the optical surface 1124, the dirt may be removed (e.g., blown away) by the CDA supplied to the optical surface 1124. Therefore, the gas supply device 17 may also function as an adhesion prevention device that removes dirt adhering to the optical surface 1124.

[0065] The control device 18 controls the overall operation of the processing device 1. In particular, the control device 18 controls the light irradiation device 11, the drive system 12, the storage device 13, and the drive system 15 so that a recess C having a desired shape is formed at a desired position, as will be described in detail later.

[0066] (2) Specific examples of processing operations by the processing device 1 (2-1) Examples of structures formed by machining operations As described above with reference to FIG. 2, in this embodiment, the processing device 1 forms a recess C in the coating film SF. The recess C is formed in a portion of the coating film SF that is actually irradiated with the processing light EL (i.e., a portion where an irradiation area EA where the processing light EL is actually irradiated is set). Therefore, by appropriately setting the position on the coating film SF where the processing light EL is actually irradiated (i.e., a position where an irradiation area EA where the processing light EL is actually irradiated is set), the recess C can be formed at a desired position on the coating film SF. In other words, a structure made of the coating film SF can be formed on the workpiece S.

[0067] In this embodiment, the processing apparatus 1 forms a riblet structure, which is an example of a structure formed by such a coating film SF, on the workpiece S under the control of the control device 15. The riblet structure is a structure that can reduce the resistance of the surface of the coating film SF to a fluid (particularly, frictional resistance and turbulent frictional resistance). The resistance of the workpiece S on which the riblet structure is formed to a fluid is smaller than the resistance of the workpiece S on which the riblet structure is not formed to a fluid. For this reason, the riblet structure can also be said to be a structure that can reduce the resistance of the surface of the workpiece S to a fluid. Note that the fluid referred to here may be any medium (gas, liquid) that flows over the surface of the coating film SF; for example, if the medium itself is stationary but the surface of the coating film SF moves, this medium may also be called a fluid.

[0068] An example of a riblet structure is shown in Figures 5(a) and 5(b). As shown in Figures 5(a) and 5(b), the riblet structure is a structure in which a plurality of concave structures CP1 (i.e., concave structures CP1 formed linearly so as to extend along the first direction) formed by continuously forming recesses C along a first direction (in the example shown in Figures 5(a) and 5(b), the Y-axis direction) are arranged along a second direction (in the example shown in Figures 5(a) and 5(b), the X-axis direction) intersecting the first direction. Between two adjacent concave structures CP1, a convex structure CP2 protruding from the surroundings is substantially present. Therefore, the riblet structure can also be said to be a structure in which a plurality of convex structures CP2 extending linearly along the first direction (e.g., the Y-axis direction) are arranged along a second direction (e.g., the X-axis direction) intersecting the first direction. The riblet structure shown in Figures 5(a) and 5(b) is a periodic structure.

[0069] The distance between two adjacent concave structures CP1 (i.e., the arrangement pitch P1 of the concave structures CP1) is, for example, several microns to several hundred microns, but may be other sizes. Furthermore, the depth D of each concave structure CP1 (i.e., the depth in the Z-axis direction) is, for example, several microns to several hundred microns, but may be other sizes. The depth D of each concave structure CP1 may be equal to or less than the arrangement pitch P1 of the concave structures CP1. The depth D of each concave structure CP1 may be equal to or less than half the arrangement pitch P1 of the concave structures CP1. The shape of a cross section including the Z-axis of each concave structure CP1 (specifically, a cross section along the XZ plane) is a bowl-shaped curved shape, but may also be a triangle, a rectangle, or a polygon with pentagons or more sides. Similarly, the distance between two adjacent convex structures CP2 (i.e., the arrangement pitch P2 of the convex structures CP2) is, for example, several microns to several hundred microns, but may be other sizes. Furthermore, the height H of each convex structure CP2 (i.e., the height in the Z-axis direction) is, for example, several microns to several hundred microns, but may be other sizes. The height H of each convex structure CP2 may be equal to or less than the arrangement pitch P2 of the convex structures CP2. The height H of each convex structure CP2 may be equal to or less than half the arrangement pitch P2 of the convex structures CP2. The shape of a cross section including the Z-axis of each convex structure CP2 (specifically, a cross section along the XZ plane) is a mountain shape with curved slopes, but may also be a triangle, a rectangle, or a polygon with pentagons or more sides. Note that the riblet structure itself formed by the processing apparatus 1 may be an existing riblet structure such as that described in Chapter 5 of the "Mechanical Engineering Handbook: Basics, α4 Fluid Engineering" edited by the Japan Society of Mechanical Engineers, and therefore a detailed description of the riblet structure itself will be omitted.

[0070] As described above, such a riblet structure can reduce the resistance to a fluid on the surface of the workpiece S on which the riblet structure is formed. Therefore, the workpiece S may be an object (e.g., a structure) for which it is desired to reduce the resistance to a fluid. For example, the workpiece S may include an object (i.e., a moving object) that is movable so that at least a portion of it moves through a fluid (e.g., at least one of a gas and a liquid). Specifically, for example, the workpiece S may include the body of an aircraft PL (e.g., at least one of a fuselage PL1, a main wing PL2, a vertical tail PL3, and a horizontal tail PL4), as shown in FIGS. 6(a) to 6(c). In this case, as shown in FIGS. 6(a) and 6(c), the processing apparatus 1 may be freestanding on the body of the aircraft PL by a support device 14. Alternatively, because the end portions 144 of the leg members 142 of the support device 14 can be attached to the paint film SF, the processing device 1 may be attached to the fuselage of the aircraft PL so as to be suspended (i.e., hanging) from the fuselage of the aircraft PL by the support device 14, as shown in FIG. 6(b). Furthermore, because the end portions 144 of the leg members 142 of the support device 14 can be attached to the paint film SF and the end portions 134 of the partition members 132 of the storage device 13 can be attached to the paint film SF, the processing device 1 can stand on its own on the paint film SF even when the surface of the paint film SF is facing upward and inclined relative to the horizontal. Furthermore, even when the surface of the paint film SF is facing downward and inclined relative to the horizontal, the processing device 1 can be attached to the paint film SF so as to be suspended from the paint film SF. In either case, the light irradiation device 11 can be moved along the surface of the aircraft PL by the drive system 12 and / or by movement of the support device 14. Therefore, the processing device 1 can form a riblet structure using a coating film SF even on a processing object S such as an aircraft fuselage (i.e., a processing object S with a curved surface, a surface inclined relative to the horizontal plane, or a surface facing downward).

[0071] Alternatively, for example, the workpiece S may include the body of an automobile. For example, the workpiece S may include the hull of a ship. For example, the workpiece S may include the body of a rocket. For example, the workpiece S may include a turbine (for example, at least one of a water turbine and a wind turbine, etc., and in particular a turbine blade thereof). Alternatively, for example, the workpiece S may include a part constituting an object that is movable so that at least a portion of it moves through a fluid. Alternatively, for example, the workpiece S may include an object at least a portion of which is fixed within a flowing fluid. Specifically, for example, the workpiece S may include a bridge girder to be installed in a river or the sea.

[0072] Note that an example of the workpiece S given here is a relatively large object (for example, an object having a size on the order of several meters to several hundred meters). In this case, as shown in FIGS. 6(a) to 6(c), the size of the light irradiation device 11 is smaller than the size of the workpiece S. However, the workpiece S may be an object of any size. For example, the workpiece S may be an object having a size on the order of kilometers, centimeters, millimeters, or micrometers.

[0073] The size of the above-mentioned riblet structure (for example, at least one of the arrangement pitch P1 of the concave structures CP1, the depth D of each concave structure CP1, the arrangement pitch P2 of the convex structures CP2, the height H of each convex structure CP2, etc.) may be set to an appropriate size so that the friction reduction effect is appropriately obtained, depending on the type of object the workpiece S is. More specifically, the size of the riblet structure may be set to an appropriate size so that the friction reduction effect is appropriately obtained, depending on at least one of the type of fluid distributed around the workpiece S during use (i.e., during operation), the relative speed of the workpiece S with respect to the fluid, and the shape of the workpiece S. For example, if the workpiece S is the airframe of an aircraft flying at a cruising speed of 1000 km / h at an altitude of 10 km, the arrangement pitch P1 of the concave structures CP1 (i.e., the arrangement pitch P2 of the convex structures CP2) may be set to, for example, about 78 micrometers.

[0074] Furthermore, the size of the riblet structures described above may be set to an appropriate size that provides an appropriate friction reduction effect, depending on the type of object the workpiece S is and on which part of the object the riblet structures are formed. For example, if the workpiece S is the body of an aircraft PL, the size of the riblet structures formed on the fuselage PL1 may be different from the size of the riblet structures formed on the main wing PL2.

[0075] (2-2) Processing flow Next, the flow of processing operations for forming the riblet structure will be described with reference to FIGS.

[0076] First, as described above, the multiple processing beams EL are deflected by the galvanometer mirror 1122. To form the riblet structure, the galvanometer mirror 1122 deflects the multiple processing beams EL so that a scanning operation in which the multiple processing beams EL scan the surface of the coating film SF along the Y axis (i.e., moving multiple irradiation areas EA on the surface of the coating film SF along the Y axis) and a stepping operation in which the multiple irradiation areas EA are moved a predetermined distance along the X axis on the surface of the coating film SF are alternately repeated. In this case, there is a limit to the size of the area on the surface of the coating film SF that can be scanned with the multiple processing beams EL by controlling the galvanometer mirror 1122 while the light irradiation device 11 is stationary relative to the coating film SF. Therefore, in this embodiment, as shown in FIG. 7 , the control device 18 sets multiple unit processing areas SA on the surface of the coating film SF (especially the area of ​​the coating film SF where the riblet structure is to be formed). Each unit processing area SA corresponds to an area on the coating film SF that can be scanned with the multiple processing beams EL by controlling the galvanometer mirror 1122 while the light irradiation device 11 is stationary relative to the coating film SF. Each unit processing area SA has a rectangular shape, but the shape is arbitrary.

[0077] The control device 18 controls the light irradiation device 11 to irradiate one unit processing area SA (e.g., SA1) with multiple beams of processing light EL deflected by the galvanometer mirror 1122, thereby forming a riblet structure in the one unit processing area SA (SA1). The control device 18 then controls at least one of the drive systems 12 and 15 to move the light irradiation device 11 relative to the coating film SF, thereby positioning the light irradiation device 11 at a position where it can irradiate another unit processing area SA (e.g., SA2) with multiple beams of processing light EL. The control device 18 then controls the light irradiation device 11 to irradiate the other unit processing area SA (SA2) with multiple beams of processing light EL deflected by the galvanometer mirror 1122, thereby forming a riblet structure in the other unit processing area SA. The control device 18 repeats the following operations for all unit processing areas SA1 to SA16, thereby forming a riblet structure.

[0078] The following explanation will be given using as an example the operation of forming a riblet structure in the unit processing areas SA1 to SA4 shown in Figure 7. Note that the following explanation will be given using an example in which two unit processing areas SA adjacent along the X axis are located within the accommodation space SP. However, the same operation is performed even when any number of unit processing areas SA are located within the accommodation space SP.

[0079] As shown in FIG. 8 , first, the control device 18 controls the drive system 15 to move the support device 14 relative to the coating film SF so that the storage device 13 is located at the first storage position where the unit processing areas SA1 and SA2 are located within the storage space SP. That is, the control device 18 moves the storage device 13 supported by the support device 14 so that the unit processing areas SA1 and SA2 are covered by the storage device 13. Furthermore, the control device 18 controls the drive system 12 to move the light irradiation device 11 relative to the coating film SF so that the light irradiation device 11 is located at the first irradiation position where it can irradiate the unit processing area SA1 with multiple processing beams EL. After the storage device 13 is located at the first storage position and the light irradiation device 11 is located at the first irradiation position, the partition member 132 is in a first extended state. Therefore, the end 134 of the partition member 132 contacts and adheres to the coating film SF. Similarly, the multiple leg members 142 are in a second extended state. Therefore, the ends 144 of the multiple leg members 142 contact and adhere to the paint film SF.

[0080] 9(a) and 9(b), the control device 18 controls the light irradiation device 11 (particularly, the galvanometer mirror 1122) so that the multiple beams of processing light EL scan the unit processing area SA1. Specifically, to perform the above-described scanning operation, the control device 18 controls the Y-scanning mirror 1122Y of the galvanometer mirror 1122 so that the multiple beams of processing light EL scan a certain area within the unit processing area SA1 along the Y-axis direction. While the scanning operation is being performed, the light source system 111 irradiates the multiple beams of processing light EL. Then, to perform the above-described stepping operation, the control device 18 rotates the X-scanning mirror 1122X of the galvanometer mirror 1122 by a unit step amount. While the stepping operation is being performed, the light source system 111 does not irradiate the multiple beams of processing light EL. Then, to perform the above-described scanning operation, the control device 18 controls the Y-scanning mirror 1122Y of the galvanometer mirror 1122 so that the multiple beams of processing light EL scan a certain area within the unit processing area SA1 along the Y-axis direction. In this way, the control device 18 controls the galvanometer mirror 1122 so that multiple processing lights EL scan the entire unit processing area SA1 (or a portion of the unit processing area SA1 where a riblet structure is to be formed) by alternately repeating scanning and stepping operations. As a result, a riblet structure is formed in the unit processing area SA1. As shown in Figures 9(a) and 9(b), the width of the area scanned by the processing light EL (i.e., the width of the unit processing area SA, particularly the width in the X-axis direction) is larger than the width of the light irradiation device 11 (particularly the width in the X-axis direction).

[0081] The control device 18 controls the drive system 15 so that the multiple leg members 142 are maintained in the second extended state while the light irradiation device 11 is irradiating the processing light EL. As a result, the ends 144 of the multiple leg members 142 continue to adhere to the coating film SF. As a result, the stability of the support device 14 is improved, reducing the possibility that the irradiation area EA of the processing light EL will unintentionally shift on the coating film SF due to instability of the support device 14. However, as long as the support device 14 can stand on its own on the coating film SF (or can be attached to the coating film SF so as to hang from the coating film SF) for at least part of the period while the light irradiation device 11 is irradiating the light EL, some of the multiple leg members 142 may be in the second contracted state.

[0082] The control device 18 controls a drive system (not shown) that expands and contracts the partition member 132 so that the partition member 132 is maintained in the first extended state while the light irradiation device 11 is irradiating the processing light EL. As a result, the end 134 of the partition member 132 continues to adhere to the coating film SF. As a result, the storage space SP is maintained airtight, so the processing light EL propagating within the storage space SP does not leak out to the outside of the storage space SP (i.e., outside the storage device 13). Furthermore, unnecessary substances generated within the storage space SP do not leak out to the outside of the storage space SP (i.e., outside the storage device 13).

[0083] It is possible that at least a portion of the end 134, which should be attached to the coating film SF, may become detached from the coating film SF due to some factor. If the light irradiation device 11 continues to irradiate the processing light EL in this case, at least one of the processing light EL and the unnecessary material may leak out of the storage device 13. Therefore, the control device 18 may control the light irradiation device 11 to stop irradiating the processing light EL when it detects that at least a portion of the end 134 has become detached from the coating film SF while the light irradiation device 11 is irradiating the processing light EL.

[0084] 10, the control device 18 controls the drive system 12 to move the light irradiation device 11 from the first irradiation position to the second irradiation position where the light irradiation device 11 can irradiate the unit processing area SA2 with a plurality of beams of processing light EL. While the light irradiation device 11 is moving, the control device 18 controls the light irradiation device 11 so that the light irradiation device 11 does not irradiate the processing light EL.

[0085] 11(a) and 11(b), the control device 18 controls the light irradiation device 11 (particularly, the galvanometer mirror 1122) so that a plurality of processing lights EL scan the unit processing area SA2. Specifically, the control device 18 controls the light irradiation device 11 (particularly, the galvanometer mirror 1122) so that a plurality of processing lights EL scan the entire unit processing area SA2 (or a partial area of ​​the unit processing area SA2 where a riblet structure is to be formed) by alternately repeating the above-mentioned scanning operation and the above-mentioned stepping operation. As a result, a riblet structure is formed in the unit processing area SA2. Note that each of the recesses CP1 constituting the riblet structure in the unit processing area SA1 may or may not be continuously connected to each of the recesses CP1 constituting the riblet structure in the unit processing area SA2 (or other unit processing areas SA) adjacent to the unit processing area SA1. This is because the size of the unit processing area SA can be secured to be at least about 10 cm, and therefore the continuous length of a single recess CP1 formed as a result of scanning the processing light EL within the unit processing area SA will be at least about 10 cm, which is sufficiently longer than the continuous length (approximately a few mm) within which the riblet structure can function, calculated from the airspeed and frequency of turbulence phenomena when the aircraft is in use (i.e., during cruising).

[0086] When a riblet structure is formed in the unit processing area SA2, there are no unit processing areas SA in which a riblet structure has not yet been formed remaining in the storage space SP. Therefore, simply moving the light irradiation device 11 within the storage space SP using the drive system 12 does not allow the light irradiation device 11 to irradiate multiple processing lights EL onto the unit processing areas SA in which a riblet structure has not yet been formed and form a riblet structure. Therefore, when there are no unit processing areas SA in which a riblet structure has not yet been formed remaining in the storage space SP, the control device 18 controls the drive system 15 by moving the support device 14 (i.e., by moving the storage device 13) so that a unit processing area SA in which a riblet structure has not yet been formed is newly positioned within the storage space SP.

[0087] 12 , the control device 18 first controls a drive system (not shown) that expands and contracts the partition member 132 so that the state of the partition member 132 switches from a first extended state to a first contracted state. As a result, the end 134 of the partition member 132 moves away from the coating film SF. Note that while the support device 14 is moving, the control device 18 controls the light irradiation device 11 so that the light irradiation device 11 does not irradiate the processing light EL. Therefore, even if the end 134 moves away from the coating film SF, there is no possibility that at least one of the processing light EL and the unnecessary material will leak out of the storage device 13.

[0088] However, although the unnecessary substances present in the storage space SP are sucked out of the storage space SP by the exhaust device 16 described above, there is a possibility that, due to some factor, not all of the unnecessary substances present in the storage space SP are sucked out by the exhaust device 16 (i.e., the unnecessary substances remain in the storage space SP). In this case, when the end portion 134 separates from the coating film SF, the unnecessary substances may leak out of the storage device 13. For this reason, the control device 18 determines whether to switch the partition member 132 from the first extended state to the first contracted state based on the detection result of the detection device 135, which detects the unnecessary substances in the storage space SP. If unnecessary substances remain in the storage space SP, the control device 18 does not switch the partition member 132 from the first extended state to the first contracted state. In this case, the exhaust device 16 continues to suck out the unnecessary substances remaining in the storage space SP. On the other hand, if no unnecessary substances remain in the storage space SP, the control device 18 switches the partition member 132 from the first extended state to the first contracted state.

[0089] Furthermore, the control device 18 controls the drive system 15 so that the state of at least some of the leg members 142 that move relative to the paint film SF in accordance with the movement of the support device 14 (particularly, as described below, the extension of the contracted beam member 141) is switched from the second extended state to the second contracted state. The leg member 142 that moves relative to the paint film SF in accordance with the extension of the contracted beam member 141 is typically the leg member 142 of the multiple leg members 142 that is located on the front side in the movement direction of the support device 14 (i.e., the movement direction of the storage device 13). In the example shown in FIG. 12, the support device 14 moves toward the +X side, and the leg member 142 located on the front side in the movement direction of the support device 14 is the leg member 142 located on the +X side. Hereinafter, the leg member 142 located on the front side in the movement direction of the support device 14 will be referred to as the "front leg member 142." As a result, the end 144 of the front leg member 142 moves away from the paint film SF.

[0090] 13, the control device 18 controls the drive system 15 to move the storage device 13 from the first storage position to the second storage position where the unit processing areas SA3 and SA4 are located within the storage space SP. Specifically, the control device 18 controls the drive system 15 to extend the beam member 141 along the movement direction of the support device 14. As a result, the beam member 141 extends while supporting the storage device 13 (and further while supporting the light irradiation device 11 supported by the storage device 13). Furthermore, in parallel with the movement of the support device 14, the control device 18 controls the drive system 12 to move the light irradiation device 11 from the second irradiation position to the third irradiation position where the light irradiation device 11 can irradiate the unit processing area SA3 with multiple beams of processing light EL.

[0091] While the support device 14 is moving (i.e., while the contracted beam member 141 is expanding), the control device 18 controls a drive system (not shown) that expands and contracts the partition member 132 so that the partition member 132 is maintained in the first contracted state. As a result, contact between the end 134 of the partition member 132 and the coating film SF does not hinder the movement of the support device 14 (i.e., the movement of the storage device 13). Furthermore, contact between the end 134 and the coating film SF during the movement of the support device 14 does not damage the coating film SF. However, if contact between the end 134 and the coating film SF does not hinder the movement of the support device 14, at least a portion of the end 134 may be in contact with the coating film SF for at least a portion of the period during which the support device 14 is moving. If the coating film SF is not damaged by contact between the end portion 134 and the coating film SF while the support device 14 is moving, at least a portion of the end portion 134 may be in contact with the coating film SF during at least part of the period during which the support device 14 is moving.

[0092] Furthermore, while the support device 14 is moving, the control device 18 controls the drive system 15 so that the front leg member 142 remains in the second contracted state. As a result, contact between the end 144 of the front leg member 142 and the coating film SF does not impede the movement of the support device 14 (i.e., the movement of the storage device 13). Furthermore, contact between the end 144 and the coating film SF during the movement of the support device 14 does not damage the coating film SF. However, if contact between the end 144 and the coating film SF does not impede the movement of the support device 14, at least a portion of the end 144 may be in contact with the coating film SF for at least a portion of the movement of the support device 14. If contact between the end 144 and the coating film SF does not damage the coating film SF during the movement of the support device 14, at least a portion of the end 144 may be in contact with the coating film SF for at least a portion of the movement of the support device 14.

[0093] Furthermore, while the support device 14 is moving, the control device 18 controls the drive system 15 so that the leg members 142 other than the front leg member 142 are maintained in the first extended state. As a result, the movement of the support device 14 (i.e., the movement of the storage device 14) is not hindered by contact between the end 144 of the front leg member 142 and the coating film SF. Furthermore, the coating film SF is not damaged by contact between the end 144 and the coating film SF while the support device 14 is moving. Even if the end 144 of the front leg member 142 separates from the coating film SF, the end 144 of the leg members 142 other than the front leg member 142 remains in contact with the coating film SF. Therefore, the support device 14 remains free-standing on the coating film SF (or can be attached to the coating film SF so as to hang from it), just as in the case where all the end parts 144 of the multiple leg members 142 are in contact with the coating film SF.

[0094] Furthermore, while the support device 14 is moving, the control device 18 controls the light irradiation device 11 so that the light irradiation device 11 does not irradiate the processing light EL.

[0095] After the storage device 13 is placed in the second storage position, as shown in FIG. 14 , the control device 18 controls a drive system (not shown) that extends and contracts the partition member 132 so that the partition member 132 switches from the first contracted state to the first extended state. As a result, the end 134 of the partition member 132 comes into contact with and adheres to the paint film SF. Furthermore, the control device 18 controls the drive system 15 so that the front leg member 142 switches from the second contracted state to the second extended state. As a result, the end 144 of the front leg member 142 comes into contact with and adheres to the paint film SF. Here, the extension operation of the partition member 132 and the extension operation of the front leg member 142 may be performed simultaneously or with a time lag.

[0096] Thereafter, as shown in FIG. 15 , the control device 18 controls the drive system 15 so that the state of at least some of the leg members 142 that move relative to the paint film SF as the support device 14 moves (particularly, as will be described later, as the extended beam member 141 contracts) is switched from the second extended state to the second contracted state. The leg member 142 that moves relative to the paint film SF as the extended beam member 141 contracts is typically the leg member 142 located on the rear side of the movement direction of the support device 14 among the multiple leg members 142. In the example shown in FIG. 15 , the leg member 142 located on the rear side of the movement direction of the support device 14 is the leg member 142 located on the -X side. Hereinafter, the leg member 142 located on the rear side of the movement direction of the support device 14 will be referred to as the "rear leg member 142." As a result, the end 144 of the rear leg member 142 moves away from the paint film SF.

[0097] Thereafter, as shown in FIG. 16, the control device 18 controls the drive system 15 so that the beam members 141 that have been extended along the movement direction of the support device 14 contract.

[0098] After the beam member 141 has been retracted, the control device 18 controls the drive system 15 so that the rear leg member 142 switches from the second retracted state to the second extended state, as shown in Figure 17. As a result, the end 144 of the rear leg member 142 comes into contact with and adheres to the paint film SF.

[0099] Thereafter, the control device 18 controls the light irradiation device 11 so that the multiple processing light beams EL scan the unit processing areas SA3 and SA4, similar to when the multiple processing light beams EL scan the unit processing areas SA1 and SA2. Similar operations are repeated thereafter, so that the multiple processing light beams EL are irradiated onto the surface of the coating film SF (particularly, the area of ​​the coating film SF where the riblet structure is to be formed). As a result, a riblet structure is formed on the workpiece S by the coating film SF.

[0100] (3) Technical effect of processing device 1 As described above, the processing apparatus 1 of this embodiment can form a riblet structure by the coating film SF on the surface of the workpiece S by irradiating the processing light EL onto the workpiece S (especially the coating film SF formed on the surface of the workpiece S). Therefore, compared to processing apparatuses that form a riblet structure by scraping away the surface of the workpiece S with a cutting tool such as an end mill, the processing apparatus 1 can form the riblet structure relatively easily and in a relatively short time.

[0101] Furthermore, the processing apparatus 1 can simultaneously irradiate a plurality of processing light beams EL to form a plurality of recessed structures CP1, thereby improving the throughput for forming the riblet structure compared to a processing apparatus that can irradiate a single processing light beam EL to form only a single recessed structure CP1 at a time.

[0102] Furthermore, the processing apparatus 1 can scan the coating film SF at a relatively high speed by deflecting the multiple processing light beams EL with the galvanometer mirror 1122. This improves the throughput in forming the riblet structure.

[0103] Furthermore, instead of directly processing the workpiece S, the processing device 1 processes the coating film SF formed on the surface of the workpiece S, thereby forming a riblet structure on the surface of the workpiece S. Therefore, compared to a processing device that forms a riblet structure by newly adding (e.g., attaching) a special material for forming the riblet structure to the surface of the workpiece S (i.e., the surface of the coating film SF), it is possible to avoid an increase in the weight of the workpiece S due to the formation of the riblet structure.

[0104] Furthermore, because the processing device 1 does not directly process the workpiece S, it can relatively easily re-form the riblet structure. Specifically, when re-forming the riblet structure, the riblet structure formed by the coating film SF is first peeled off, and then a new coating film SF is applied. The processing device 1 can then process the newly applied coating film SF to form a new riblet structure. Therefore, deterioration of the riblet structure (for example, damage, etc.) can be dealt with relatively easily by re-forming the riblet structure.

[0105] Furthermore, because the processing device 1 does not directly process the workpiece S, it can form a riblet structure on the surface of the workpiece S that is difficult to process directly or that does not originally have a riblet structure. In other words, if the coating film SF is applied to the surface of the workpiece S and then the processing device 1 processes the coating film SF, it is possible to form a riblet structure relatively easily.

[0106] Furthermore, the processing apparatus 1 can form a riblet structure using a coating film SF. The coating film SF usually has relatively high durability against the external environment (for example, at least one of heat, light, and wind). Therefore, the processing apparatus 1 can relatively easily form a riblet structure with relatively high durability.

[0107] Furthermore, in this embodiment, the optical path of the processing light EL between the final optical element of the optical system 112 and the coating film SF is included within the accommodation space SP. Therefore, compared to a processing apparatus in which the optical path of the processing light EL is not included in the accommodation space SP (i.e., is open to an open space), it is possible to appropriately prevent the processing light EL irradiated to the coating film SF (or the scattered light or reflected light of the processing light EL from the coating film SF, etc.) from propagating to the surroundings of the processing apparatus 1 (in other words, scattering). Furthermore, it is possible to appropriately prevent unnecessary substances generated by irradiation with the processing light EL from propagating to the surroundings of the processing apparatus 1 (in other words, scattering).

[0108] Furthermore, in this embodiment, the light irradiation device 11 is supported by a support device 14 that is movable over the coating film SF. Therefore, the processing device 1 can relatively easily process a coating film SF that spreads over a relatively wide area. In other words, the processing device 1 can form a riblet structure using the coating film SF over a relatively wide area on the surface of the workpiece S. Furthermore, because the processing device 1 does not need to move the workpiece S, it can relatively easily form a riblet structure even on the surface of a relatively large or heavy workpiece S.

[0109] Furthermore, the processing apparatus 1 can use the exhaust device 16 to suck out unwanted substances generated by irradiation with the processing light EL to the outside of the accommodation space SP. Therefore, irradiation of the processing light EL onto the coating film SF is hardly hindered by unwanted substances. This improves the irradiation accuracy of the processing light EL compared to processing apparatuses that do not have the exhaust device 16 (i.e., where irradiation of the processing light EL onto the coating film SF may be hindered by unwanted substances). As a result, the formation accuracy of the riblet structure is improved.

[0110] Furthermore, the processing apparatus 1 can use the gas supply device 17 to prevent dirt from adhering to the optical surface 1124 (i.e., the optical surface on the storage space SP side of the terminal optical element of the optical system 112). Therefore, compared to a processing apparatus not equipped with the gas supply device 17, there is less chance that the irradiation of the processing light EL onto the coating film SF will be hindered by dirt that has adhered to the optical surface 1124. This improves the irradiation accuracy of the processing light EL. As a result, the formation accuracy of the riblet structure improves.

[0111] (4) Variations Next, a modified example of the processing device 1 will be described.

[0112] (4-1) First Modification The structure of the light irradiation device 11 shown in Fig. 3 described above is one example, and the processing apparatus 1 may be provided with another light irradiation device having a structure different from that of the light irradiation device 11 shown in Fig. 3. Hereinafter, as examples of other light irradiation devices having a structure different from that of the light irradiation device 11, light irradiation device 21a, light irradiation device 22a, light irradiation device 23a, light irradiation device 24a, light irradiation device 25a, light irradiation device 26a, and light irradiation device 27a will be described.

[0113] (4-1-1) Structure of the light irradiation device 21a In order to irradiate the coating film SF with processing light EL, the light irradiation device 21a includes a light source system 211a capable of emitting processing light EL, and an optical system 212a that guides the processing light EL emitted from the light source system 211a to the coating film SF, as shown in FIG. 18.

[0114] The light source system 211a includes a single light source 2111a, which may be the same as the light source 1111 described above, and therefore a detailed description thereof will be omitted.

[0115] The optical system 212a splits the processing light EL emitted from the light source 2111a into multiple beams (typically two beams), and then forms interference fringes on the surface of the coating film SF by causing the two branched processing light beams EL to interfere with each other. To form the interference fringes, the optical system 212a includes a beam splitter 2121a, a beam outlet 2123a, a beam outlet 2124a, a focusing optical system 2125a, and a focusing optical system 2126a. The beam splitter 2121a splits the processing light EL emitted from the light source 2111a into a first branched light beam EL1 and a second branched light beam EL2. The first branched light beam EL1 is output from the beam outlet 2123a via a light guide path (e.g., optical fiber, etc.) not shown. The second branched light beam EL2 is output from the beam outlet 2124a via a light guide path (e.g., optical fiber, etc.) not shown. The first branched light EL1 emitted from the light outlet 2123a is converted into parallel light by the focusing optical system 2125a and then irradiated onto the surface of the coating film SF. The second branched light EL2 emitted from the light outlet 2124a is converted into parallel light by the focusing optical system 2126a and then irradiated onto the surface of the coating film SF. The first branched light EL1 emitted from the focusing optical system 2125a and the second branched light EL2 emitted from the focusing optical system 2126a interfere with each other to form interference fringes on the surface of the coating film SF, which have an interference pattern that is a periodic stripe pattern along the X direction in the figure, corresponding to the above-mentioned riblet structure (or the concave structure CP1). In other words, the coating film SF is irradiated with interference light having an intensity distribution on the surface of the coating film SF as processing light for forming the riblet structure. As a result, part of the coating film SF evaporates in accordance with the interference fringes, and a riblet structure made of the coating film SF is formed on the surface of the workpiece S.

[0116] The irradiation area EA onto which the light irradiation device 21a irradiates the first branched light EL1 and the second branched light EL2 (i.e., the irradiation area EA where interference fringes are formed) is an area that spreads two-dimensionally along the surface of the coating film SF. Therefore, the processing device 1a equipped with the light irradiation device 21a forms a riblet structure using the coating film SF by alternately repeating an operation of forming interference fringes on the surface of the coating film SF and a step operation of moving the irradiation area EA where interference fringes are formed by a predetermined amount along at least one of the X-axis and Y-axis on the surface of the coating film SF. In other words, the processing device 1a equipped with the light irradiation device 21a forms interference fringes in a certain area on the surface of the coating film SF, and then moves the light irradiation device 21a relative to the coating film SF to repeat the operation of forming interference fringes in another area on the surface of the coating film SF. Note that the light irradiation device 21a cannot move the irradiation area EA by deflecting the first branched light EL1 and the second branched light EL2. Therefore, the processing apparatus 1a equipped with the light irradiation device 21a moves the irradiation area EA relative to the coating film SF by moving the light irradiation device 21a using the drive system 12. In the light irradiation device 21a, a galvanometer mirror may be disposed between the condensing optical systems 2125a and 2126a and the coating film SF to move the irradiation area EA. The pitch of the interference fringe pattern may be changed by changing the intersection angle between the first branched light EL1 from the condensing optical system 2125a and the second branched light EL2 from the condensing optical system 2126a. In this case, the light exit 2123a and the condensing optical system 2125a may be provided as a movable integral unit, and the light exit 2123b and the condensing optical system 2125b may be provided as a movable integral unit to change the intersection angle between the first branched light EL1 and the second branched light EL2 reaching the irradiation area EA.

[0117] (4-1-2) Structure of the light irradiation device 22a In order to irradiate the coating film SF with processing light EL, the light irradiation device 22a is equipped with a light source system 221a capable of emitting processing light EL, and an optical system 222a that guides the processing light EL emitted from the light source system 221a to the coating film SF, as shown in Figure 19.

[0118] The light source system 221a includes a single light source 2211a, which may be the same as the light source 1111 described above, and therefore a detailed description thereof will be omitted.

[0119] The optical system 222a converts the processing light EL emitted from the light source 2211a into multiple processing light beams EL0 and projects the multiple processing light beams EL0 onto the coating film SF. The optical system 222a includes a mirror array 2221a. The mirror array 2221a includes multiple mirrors M arranged in a matrix. Each mirror M is configured to have a variable tilt angle. As an example of operation, each mirror M can be switched between a state in which the processing light EL incident on the mirror M is reflected toward the coating film SF and a state in which the processing light EL incident on the mirror M is not reflected toward the coating film SF. The tilt angle of each mirror M may be controlled to change the position on the coating film SF of the processing light EL0 from each mirror M. The control device 18 controls the digital mirror device 2221a so that multiple processing light beams EL0 capable of forming the above-mentioned riblet structure (especially the multiple recessed structures CP1 that are part of it) are emitted from the mirror array 2221a. As a result, the light irradiation device 22a can simultaneously irradiate the surface of the coating film SF with multiple processing light beams EL, similar to the above-described light irradiation device 11. That is, multiple irradiation areas EA, onto which multiple processing light beams EL0 are respectively irradiated, are simultaneously set on the surface of the coating film SF. As a result, the light irradiation device 22a can form a riblet structure made of the coating film SF on the surface of the workpiece S, similar to the above-described light irradiation device 11.

[0120] The optical system 222a of the light irradiation device 22a may include a galvanometer mirror 1122 and an fθ lens 1123, similar to the light irradiation device 11. In this case, the light irradiation device 22a can control the galvanometer mirror 1122 to cause the multiple processing light beams EL to scan the surface of the coating film SF. Alternatively, even if the optical system 222a does not include the galvanometer mirror 1122 and the fθ lens 1123, the multiple processing light beams EL may be scanned over the surface of the coating film SF by moving the light irradiation device 22a using the drive system 12. Note that the multiple processing light beams EL may be scanned over the surface of the coating film SF by controlling the tilt angle of each mirror M of the mirror array 2221a to change the position of the reflecting surface of each mirror M.

[0121] (4-1-3) Structure of the light irradiation device 23a In order to irradiate the coating film SF with processing light EL, the light irradiation device 23a is equipped with a light source system 231a capable of emitting processing light EL, and an optical system 232a that guides the processing light EL emitted from the light source system 231a to the coating film SF, as shown in Figure 20.

[0122] The light source system 231a may be the same as the above-described light source system 111, and therefore a detailed description thereof will be omitted. Note that in Fig. 20, the description will proceed using the light source system 231a including a plurality of light sources 1111 (that is, the light source system 231a having the configuration shown in Fig. 3(b)).

[0123] The optical system 232a reduces the beams of processing light EL emitted from the light sources 1111 and projects them onto the coating film SF. The optical system 232a includes a plurality of collimator lenses 2321a and a projection optical system 2322a. The collimator lenses 2321a convert the beams of processing light EL emitted from the light sources 1111 into parallel beams. The projection optical system 2322a projects the parallel beams of processing light EL onto the coating film SF at a predetermined reduction magnification (e.g., 1 / 10 projection magnification). The projection optical system 2322a may be configured to form a light source image on the coating film SF, or may be configured to form a light source image at a position spaced apart from the coating film SF in the optical axis direction. As a result, the light irradiation device 23a can simultaneously irradiate the coating film SF with a plurality of processing light beams EL, similar to the light irradiation device 11 described above. That is, a plurality of irradiation areas EA, each irradiated with a plurality of processing light beams EL, are simultaneously defined on the surface of the coating film SF. As a result, the light irradiation device 23a can form a riblet structure made of a coating film SF on the surface of the workpiece S, similar to the light irradiation device 11 described above. Here, the projection magnification of the projection optical system 2322a is not limited to a reduction magnification and may be an equal magnification or an enlargement magnification. Furthermore, one or more optical members constituting the projection optical system 2322a may be configured to be movable (typically movable along the optical axis direction) to change the projection magnification. In this case, the intervals at which the multiple irradiation areas EA are formed can be changed, and thus the pitch of the riblet structure can be changed. Each of the multiple collimator lenses 2321a may be provided on the light source 1111. Furthermore, the traveling directions of the multiple processing light beams EL emitted from the projection optical system 2322a are not limited to being parallel to each other, and the multiple processing light beams EL may be configured to widen or narrow as they travel.

[0124] The optical system 232a of the light irradiation device 23a may include a galvanometer mirror 1122, similar to the light irradiation device 11. In this case, the light irradiation device 23a can control the galvanometer mirror 1122 to cause the multiple processing lights EL to scan the surface of the coating film SF. Alternatively, even if the optical system 232a does not include the galvanometer mirror 1122, the light irradiation device 23a may be moved by the drive system 12 so that the multiple processing lights EL scan the surface of the coating film SF. Alternatively, the light source 1111 may be moved so that the multiple processing lights EL scan the surface of the coating film SF.

[0125] (4-1-4) Structure of the light irradiation device 24a In order to irradiate the coating film SF with processing light EL, the light irradiation device 24a is equipped with a light source system 241a capable of emitting processing light EL, and an optical system 242a that guides the processing light EL emitted from the light source system 241a to the coating film SF, as shown in Figure 21.

[0126] The light source system 241a includes a single light source 2411a and an illumination optical system 2412a. The light source 2411a may be the same as the above-described light source 1111, and therefore detailed description thereof will be omitted. The illumination optical system 2412a makes the amount of light of the processing light EL from the light source 2411a uniform within the cross section of the beam of the processing light EL.

[0127] The optical system 242a includes a mask 2421a and a projection optical system 2422a. The mask 242a is a photomask (or, in other words, a reticle) on which a mask pattern (e.g., a pattern in which transmission patterns that allow the processing light EL to pass and light-shielding patterns that block the processing light EL are periodically arranged in the X direction) having a light transmittance distribution corresponding to the riblet structure (or the structure to be formed) is formed. The processing light EL that passes through the illumination optical system 2412a passes through the mask 2421a and becomes processing light EL having a periodically changing intensity distribution corresponding to the riblet structure. The projection optical system 2422a projects the processing light EL that passes through the mask 2421a onto the coating film SF at a predetermined reduction magnification (e.g., 1 / 10 projection magnification). In other words, the projection optical system forms a reduced image of the mask 2421a on the coating film SF. As a result, the light irradiation device 24a irradiates the surface of the coating film SF with processing light EL having an intensity distribution corresponding to the above-mentioned riblet structure (or the concave structure CP1). That is, the surface of the coating film SF is irradiated with processing light EL having an intensity distribution corresponding to the riblet structure on the surface of the coating film SF. As a result, a portion of the coating film SF evaporates in accordance with the intensity distribution of the processing light EL, and a riblet structure is formed by the coating film SF on the surface of the workpiece S. Here, the projection magnification of the projection optical system 2322a is not limited to a reduction magnification, and may be the same magnification or an enlargement magnification. Furthermore, one or more optical components constituting the projection optical system 2322a may be configured to be movable (typically movable along the optical axis direction) to change the projection magnification. In this case, the period of the periodically changing intensity distribution can be changed, and thus the pitch of the riblet structure can be changed.

[0128] The irradiation area EA onto which the light irradiation device 24a irradiates the processing light EL is a region that extends two-dimensionally along the surface of the coating film SF. Therefore, in the processing apparatus 1a equipped with the light irradiation device 24a, a riblet structure is formed in the coating film SF by alternately repeating the operation of irradiating the surface of the coating film SF with the processing light EL through the mask 2421a and the step operation of moving the irradiation area EA by a predetermined amount along at least one of the X-axis and Y-axis on the surface of the coating film SF. The light irradiation device 24a cannot move the irradiation area EA by deflecting the processing light EL. Therefore, the processing apparatus 1a equipped with the light irradiation device 24a moves the irradiation area EA relative to the coating film SF by moving the light irradiation device 24a using the drive system 12.

[0129] The optical system 242a of the light irradiation device 24a may include a galvanometer mirror 1122, similar to the light irradiation device 11. In this case, the light irradiation device 24a can control the galvanometer mirror 1122 to cause the multiple beams of processing light EL to scan the surface of the coating film SF. In addition, the mask 2421a and the light source system 241a may be moved relative to the projection optical system 2422a.

[0130] In addition, the light irradiation device 24a may be equipped with a spatial light modulator capable of spatially modulating the processing light EL with a modulation pattern corresponding to the riblet structure, instead of the mask 2421a. "Spatially modulating the processing light EL" means changing the distribution of at least one of the optical characteristics of the processing light EL in a cross section transverse to the direction of propagation of the processing light EL, which is the amplitude (intensity), phase of the light, polarization state of the light, wavelength of the light, and propagation direction of the light (in other words, polarization state). The spatial light modulator may be a transmissive spatial light modulator that transmits and spatially modulates the processing light EL, or a reflective spatial light modulator that reflects and spatially modulates the processing light EL.

[0131] (4-1-5) Structure of the light irradiation device 25a In order to irradiate the coating film SF with processing light EL, the light irradiation device 25a includes, as shown in FIG. 22, a light source system 251a capable of emitting processing light EL, a lens array 2513a that divides the processing light EL emitted from the light source system 251a into multiple beams, and an optical system 252a that guides the multiple beams from the lens array 2513a to the coating film SF.

[0132] The light source system 251a includes a single light source 2511a and a beam expander 2512a that shapes, typically expands, the incident beam from the light source 2511a and emits it. The beam expander 2512a may have an optical member for making the intensity distribution of the incident beam from the light source 2511a uniform in the beam cross section.

[0133] The lens array 2513a includes a plurality of lens elements arranged in a direction transverse to the incident beam, typically in the YZ plane in the drawing, each of which focuses the incident beam. A two-dimensionally arranged light source image is formed on the exit side of the lens array 2513a.

[0134] The optical system 252a includes an afocal zoom lens 2522a for adjusting the spacing between the multiple incident beams to a predetermined interval, a focusing optical system 2523a for focusing the multiple beams from the afocal zoom lens 2522a at a predetermined position, and an fθ lens 2524a for focusing the multiple beams from the focusing optical system 2523a onto the coating film SF as multiple processing beams EL0.

[0135] The multiple processing beams EL0 from the optical system 252a (the multiple processing beams EL0 from the fθ lens 2524a) form multiple irradiation areas EA on the coating film SF. In other words, the multiple processing beams EL0 are irradiated onto the coating film SF.

[0136] Here, the afocal zoom lens 2522a can also be considered a double-telecentric zoom lens. In this case, the positions where multiple light source images are formed by the lens array 2513a, the optical path between the afocal zoom lens 2522a and the focusing optical system 2523a, and the coating film SF may be optically conjugate with each other. Because the optical path between the afocal zoom lens 2522a and the focusing optical system 2523a, i.e., the optical path on the exit side of the afocal zoom lens 2522a, and the coating film SF are conjugate with each other, it is clear that changing the spacing between the multiple beams emitted from the afocal zoom lens 2522a will also change the spacing between the processing light EL0 reaching the coating film SF. Therefore, the magnification (angular magnification) of the afocal zoom lens 2522a may be changed by a drive unit (not shown) to change the spacing between the processing light EL0 reaching the coating film SF.

[0137] Furthermore, some of the lenses that make up the light-collecting optical system 2523a may be provided to be movable in the optical axis direction and used as a focus lens.

[0138] In the above description, the lens array 2513a can be called an optical branching element. A reflective mirror array may be used instead of the lens array 2513a.

[0139] (4-1-6) Structure of the light irradiation device 26a In order to irradiate the coating film SF with processing light EL, the light irradiation device 26a includes, as shown in FIG. 23, a light source system 261a capable of emitting processing light EL, a lens array 2613a that divides the processing light EL emitted from the light source system 261a into multiple beams, and an optical system 262a that guides the multiple beams from the lens array 2613a to the coating film SF.

[0140] 23 differs from the light irradiation device 25a shown in FIG. 22 in that the galvanometer mirror 2624a is positioned between the focusing optical system 2623a (focus lens) and the fθ lens 2625a. The other configurations of the light irradiation device 26a may be the same as the other configurations of the light irradiation device 25a. Even though the position of the galvanometer mirror 2624a is different in this way, the light irradiation device 26a shown in FIG. 23 can achieve the same effects as the light irradiation device 25a shown in FIG. 22.

[0141] 23, the fθ lens 2625a may be an optical system that is telecentric on the coating film SF side, or may be an optical system that is non-telecentric on the coating film SF side. When the fθ lens 2625a is an optical system that is non-telecentric on the coating film SF side, the processing light EL can be irradiated onto an area larger than the size of the fθ lens 2625a.

[0142] 22 and 23, when a part of the lenses in the focusing optical system 2523a or 2623a is moved in the optical axis direction to serve as a focus lens, the magnification of the optical system 252a or 262a may change as the focus lens moves. In this case, the change in magnification caused by the movement of the focus lens can be corrected by changing the magnification of the afocal zoom lens 2522a or 2622a.

[0143] In this example, the galvanometer mirror 2624a may be a two-axis galvanometer mirror that can move around two axes that are perpendicular to each other, but is not limited to this, and may be a combination of two one-axis galvanometer mirrors as shown in Figure 3.

[0144] (4-1-7) Structure of the light irradiation device 27a In order to irradiate the coating film SF with the processing light EL, the light irradiation device 27a includes a light source system 271a capable of emitting the processing light EL, a light branching unit including a light branching member 2713a that branches the processing light emitted from the light source 271a into multiple beams, and an optical system 272a that guides the multiple beams from the light branching unit to the coating film SF, as shown in Fig. 24. Here, the configurations of the light source system 271a and the optical system 272a are similar to those of the light source system 251a and the optical system 252a shown in Fig. 22, and therefore description thereof will be omitted here.

[0145] A reflective diffractive optical element can be used as the light branching member 2713a. An incident beam incident on the light branching member 2713a is split into multiple diffracted beams traveling in different directions, for example, by diffraction. A collimating optical system 2714a, whose front focal point is located at the position of the light branching member 2713a, is provided on the exit side of the light branching member 2713a. The multiple beams traveling in different directions are redirected by the collimating optical system 2714a to become parallel to each other, and then travel toward the optical system 272a as multiple parallel beams.

[0146] The light branching element 2713a is not limited to a reflective diffractive optical element, and a reflective spatial light modulator may also be used. Reflective spatial light modulators can be various types, such as a mirror array having multiple mirrors whose positions and / or orientations can be changed relative to each other, or an LCOS (Liquid Crystal on Silicon) spatial light modulator. If a spatial light modulator capable of actively changing the state of reflected light is used as the light branching element 2713a, the state of light from the spatial light modulator (intensity distribution, propagation direction, etc.) can be changed to adjust at least one of the position, shape, distribution, etc. of the irradiation area EA on the coating film SF. Furthermore, at least one of a transmissive diffractive optical element and a transmissive spatial light modulator may also be used as the light branching element 2713a.

[0147] The optical system 262a shown in FIG. 25 may be used as the optical system 272a shown in FIG.

[0148] (4-1-8) Modification of the light irradiation device 11 shown in FIG. 3 In the light source system 111 shown in FIG. 3(b), the multiple light sources 1111 are arranged in a row at equal intervals. However, the multiple light sources 1111 do not have to be arranged at equal intervals or in a row. In other words, the multiple light sources 1111 may be arranged in an array pattern other than the array pattern shown in FIG. 3(b). For example, the multiple light sources 1111 may be arranged in a matrix at equal intervals. For example, the multiple light sources 1111 may be arranged in a staggered array pattern. For example, the multiple light sources 1111 may be arranged in a row or multiple rows at random intervals.

[0149] In the light source system 111 shown in FIG. 3(c), the multiple exit ports through which the multiple processing light beams EL branched by the branching device 1112 are emitted are arranged in a line at equal intervals. However, the multiple exit ports do not have to be arranged at equal intervals or in a line. That is, the multiple exit ports may be arranged in an arrangement pattern other than the arrangement pattern shown in FIG. 3(c). For example, the multiple exit ports may be arranged in a matrix at equal intervals. For example, the multiple exit ports may be arranged in a staggered arrangement pattern. For example, the multiple exit ports may be arranged in a line or in multiple lines at random intervals. Alternatively, the light source system 111 may have a single exit port. That is, the light source system 111 may irradiate a single processing light beam EL. In this case, the light source system 111 does not have to have the branching device 1112.

[0150] According to the light irradiation device 11 shown in FIG. 3, multiple processing lights EL are simultaneously irradiated onto the coating film SF. However, multiple processing lights EL do not have to be simultaneously irradiated onto the coating film SF. For example, while some of the multiple processing lights EL are irradiated onto the coating film SF, other parts of the multiple processing lights EL do not have to be irradiated onto the coating film SF. For example, some of the multiple processing lights EL may be irradiated onto the coating film SF at a first timing, and then other parts of the multiple processing lights EL may be irradiated onto the coating film SF at a second timing different from the first timing. For example, multiple processing lights EL may be irradiated onto the coating film SF sequentially.

[0151] In the light irradiation device 11 shown in FIG. 3, the galvanometer mirror 1122 is a two-axis galvanometer mirror including both an X-scan mirror 1122X and a Y-scan mirror 1122Y. However, the galvanometer mirror 1122 may also be a single-axis galvanometer mirror including either the X-scan mirror 1122X or the Y-scan mirror 1122Y. A processing device including such a single-axis galvanometer mirror may control the galvanometer mirror to scan the surface of the coating film SF along either the X-axis direction or the Y-axis direction with multiple processing lights EL, and may use the drive system 12 to move the light irradiation device including the single-axis galvanometer mirror along the other of the X-axis direction or the Y-axis direction, thereby scanning the surface of the coating film SF along either the X-axis direction or the Y-axis direction with multiple processing lights EL. Note that the galvanometer mirror 1122 may also be a single mirror that can rotate about two orthogonal axes.

[0152] (4-2) Second Modification Next, a processing apparatus 1b of a second modified example will be described with reference to FIG. 25. As shown in FIG. 25, the processing apparatus 1b of the second modified example differs from the processing apparatus 1 described above in that it further includes a surface property measuring device 19b. The surface property measuring device 19b measures the properties of the surface of the coating film SF (particularly, a portion of the surface of the coating film SF onto which the light irradiation device 11 is about to irradiate the multiple processing light beams EL) before the light irradiation device 11 irradiates the surface of the coating film SF with multiple processing light beams EL. The surface property measuring device 19b is supported by the accommodation device 13 via a support member 136b. Therefore, the relative positional relationship between the light irradiation device 11 and the surface property measuring device 19b is fixed within the accommodation space SP. Furthermore, the processing apparatus 1b of the second modified example differs from the processing apparatus 1 described above in that the light irradiation device 11 is controlled based on the measurement results of the surface property measuring device 19b. Other features of the processing apparatus 1b may be the same as those of the processing apparatus 1.

[0153] A specific example of the preliminary measurement control operation for controlling the light irradiation device 11 based on the measurement results of the surface property measurement device 19b will be described below.

[0154] (4-2-1) First example of advance measurement control operation In the first specific example, the surface property measuring device 19b measures the surface shape of the coating film SF as a surface property of the coating film SF. The surface property measuring device 19b irradiates the coating film SF with measurement light MLb (hereinafter, the measurement light MLb used in the first specific example will be referred to as "measurement light MLb1"). For this purpose, the surface property measuring device 19b is equipped with a light projecting device 191b that irradiates the measurement light MLb1. Furthermore, the surface property measuring device 19b measures the reflected light of the measurement light MLb1 from the coating film SF. For this purpose, the surface property measuring device 19b is equipped with a detection device 192b that detects the reflected light of the measurement light MLb1. Because the reflected light is the measurement light MLb1 reflected from the surface of the coating film SF, the measurement result of the reflected light (i.e., the output of the surface property measuring device 19b) contains information about the surface shape of the coating film SF. For this reason, the control device 18 can identify the surface shape of the coating film SF based on the measurement result of the surface property measuring device 19b. An example of the surface characteristic measuring device 19b that measures the surface shape of the coating film SF is a measuring device (such as a measuring device using a light-section method) that can measure the surface shape by irradiating the surface of the coating film SF with measuring light MLb1 having a predetermined emission pattern (for example, a linear emission pattern or a grid-like emission pattern) and measuring the pattern image from a direction different from the irradiation direction of the measuring light MLb1. Also, an example of the surface characteristic measuring device 19b that can be used is an optical measuring device that uses various methods, such as a moire topography method using a grating illumination method or a grating projection method, a holographic interferometry method, an autocollimation method, a stereo method, an astigmatism method, a critical angle method, or a knife-edge method.

[0155] In the first specific example, the control device 18 sets the irradiation conditions (i.e., irradiation states) of the multiple processing light beams EL based on the surface shape of the coating film SF. In the first specific example, the irradiation conditions of the multiple processing light beams EL are the focusing positions FP of the multiple processing light beams EL. Specifically, the control device 18 sets, for example, the focusing positions FP of the multiple processing light beams EL to positions where the coating film SF can be processed by irradiating the multiple processing light beams EL. Here, as described above, the coating film SF is processed so that a portion of the coating film SF evaporates when irradiated with the processing light beam EL. The coating film SF evaporates due to the energy applied to the coating film SF from the processing light beam EL by irradiating the processing light beam EL (i.e., the energy of the processing light beam EL absorbed by the coating film SF). The energy applied to the coating film SF from the processing light beam EL increases as the intensity of the processing light beam EL on the surface of the coating film SF increases. Therefore, if the intensity of the processing light beam EL on the surface of the coating film SF is equal to or greater than the intensity capable of evaporating the coating film SF, the coating film SF will evaporate when irradiated with the processing light beam EL. Therefore, the control device 18 considers the relationship between the relative position of the focusing position FP of the processing light EL with respect to the surface of the coating film SF and the intensity of the processing light EL on the surface of the coating film SF, and sets the focusing positions FP of the multiple processing light beams EL to positions where the coating film SF can be processed by irradiating the multiple processing light beams EL. Furthermore, since processing is performed so that a portion of the coating film SF within the irradiation area EL irradiated with the processing light EL evaporates, if the focusing position of the processing light EL deviates significantly from the surface of the coating film SF (i.e., deviates along the Z-axis), the irradiation area EA irradiated with the processing light EL becomes large, and there is a risk that the desired riblets will not be obtained. Therefore, the control device 18 sets the focusing positions FP of the multiple processing light beams EL so that the size of the irradiation area EA of the processing light EL on the surface of the coating film SF is the desired size.

[0156] Based on this premise, if the surface of the coating film SF is located within the depth of focus (DOF) of the optical system 112 (i.e., the area extending from the focusing position FP of the multiple processing light beams EL toward the object plane and the image plane), the intensity of the processing light beam EL on the surface of the coating film SF will be correspondingly large (i.e., the intensity will be greater than or equal to the intensity required to evaporate the coating film SF). Furthermore, if the surface of the coating film SF is located within the depth of focus of the optical system 112, the size of the irradiation area EA of the processing light beam EL on the surface of the coating film SF will be a required size. The term "the surface of the coating film SF being located within the depth of focus of the optical system 112" may also mean that the size of the irradiation area EA of the processing light beam EL formed on the surface of the coating film SF is within a required range. Therefore, as shown in FIGS. 26(a) to 26(d), the control device 18 may set the focusing positions FP of the multiple processing light beams EL so that the surface of the coating film SF (particularly, the portion of the surface of the coating film SF irradiated with the multiple processing light beams EL) is located within the depth of focus of the optical system 112. Fig. 26(a) is a cross-sectional view showing how the surface of the coating film SF is located within the range of the depth of focus of the optical system 112 when the surface of the coating film SF is flat. Fig. 26(b) is a cross-sectional view showing how the surface of the coating film SF is located within the range of the depth of focus of the optical system 112 when the surface of the coating film SF is curved. Fig. 26(c) is a cross-sectional view showing how the surface of the coating film SF is located within the range of the depth of focus of the optical system 112 when the surface of the coating film SF has irregularities. Fig. 26(d) is a cross-sectional view showing how the surface of the coating film SF is located within the range of the depth of focus of the optical system 112 when the surface of the coating film SF is inclined with respect to the optical axis AX of the optical system 112 (i.e., the optical axis AX along the Z-axis).

[0157] When the focusing positions FP of the multiple processing beams EL move along the Z axis relative to the coating film SF, the relative positional relationship (particularly the positional relationship in the Z axis direction) changes between the coating film SF and the range of the depth of focus of the optical system 112. Therefore, it can be said that the control device 18, by setting the focusing positions FP of the multiple processing beams EL, essentially sets the relative positional relationship between the coating film SF and the range of the depth of focus of the optical system 112.

[0158] After setting the focusing position FP in this manner, the control device 18 controls the focus lens 1121 provided in the light irradiation device 11 so that the multiple processing light beams EL are focused at the set focusing position FP. That is, the control device 18 controls (i.e., adjusts) the focusing positions FP of the multiple processing light beams EL collectively by controlling the focus lens 1121 so that the multiple processing light beams EL are focused at the set focusing position FP. In other words, the control device 18 controls (simultaneously changes) the focusing positions FP of the multiple processing light beams EL by controlling the focus lens 1121 so that the multiple processing light beams EL are focused at the set focusing position FP. Incidentally, in the light irradiation devices 21a to 24a described in the first modified example, if the optical systems 212a to 242a are equipped with the focusing lens 1121, the control device 18 can control the light irradiation devices 21a to 24a so that the multiple processing light beams EL are focused at the set focusing position FP. As a result, the surface of the coating film SF is positioned within the range of the focal depth of the optical system 112. Therefore, the surface of the coating film SF is irradiated with processing light EL having an intensity equal to or greater than that at which the coating film SF can be evaporated, so that the coating film SF is appropriately processed by the multiple processing lights EL.

[0159] According to the first specific example of such a pre-measurement control operation, the processing device 1b can process the coating film SF without being restricted by the surface shape of the coating film SF, while enjoying the same effects as those that can be enjoyed by the processing device 1 described above.

[0160] As the multiple processing beams EL scan, the relative positions (particularly the positions in the direction along the surface of the coating film SF) of the multiple irradiation areas EA onto which the multiple processing beams EL are respectively irradiated change on the surface of the coating film SF. That is, the multiple processing beams EL move relative to the surface of the coating film SF along the surface of the coating film SF. If the relative positions of the multiple irradiation areas EA on the surface of the coating film SF change, the shape of the portion of the surface of the coating film SF where the multiple irradiation areas EA are formed may also change while the multiple processing beams EL are being irradiated. For this reason, the control device 18 may appropriately set a focusing position FP based on the shape of the portion of the surface of the coating film SF where the multiple irradiation areas EA are formed when the multiple processing beams EL are irradiated onto the coating film SF (that is, when the multiple processing beams EL are moving relative to the coating film SF), and control the focus lens 1121 so that the multiple processing beams EL are condensed at the set focusing position FP.

[0161] Furthermore, depending on the shape of the surface of the coating film SF, even if the focusing positions FP of the multiple processing beams EL are set, a portion of the surface of the coating film SF (especially, a portion of the surface of the coating film SF that is irradiated with the multiple processing beams EL) may not be positioned within the focal depth of the optical system 112. In other words, while a portion of the surface of the coating film SF is positioned within the focal depth of the optical system 112, another portion of the surface of the coating film SF may not be positioned within the focal depth of the optical system 112. In this case, the processing apparatus 1b may selectively irradiate only some of the multiple processing beams EL onto the coating film SF so that the processing beam EL is irradiated onto the portion of the coating film SF whose surface is positioned within the focal depth of the optical system 112, while the processing beam EL is not irradiated onto the other portion of the coating film SF whose surface is not positioned within the focal depth of the optical system 112.

[0162] Furthermore, control of the focusing positions FP of the multiple processing light beams EL by the focus lens 1121 is equivalent to control of the relative positional relationship in the Z-axis direction between the surface of the coating film SF and the focusing positions FP of the multiple processing light beams EL. Therefore, in addition to or instead of controlling the focusing positions FP of the multiple processing light beams EL by controlling the focus lens 1121, the control device 18 may control the drive system 12 to control the relative position of the light irradiation device 11 with respect to the coating film SF in the Z-axis direction. Even in this case, the processing device 1b can process the coating film SF without being restricted by the shape of the surface of the coating film SF.

[0163] Furthermore, when the focusing position FP changes, the intensity distribution of the multiple processing light beams EL changes in a plane including an axis intersecting the surface of the coating film SF (for example, the XZ plane in the example shown in FIGS. 26(a) to 26(d)). Therefore, controlling the focusing position FP of the multiple processing light beams EL by the focus lens 1121 is equivalent to controlling the intensity distribution of the multiple processing light beams EL in a plane including an axis intersecting the surface of the coating film SF. Conversely, the control device 18 may control the intensity distribution of the multiple processing light beams EL in a plane including an axis intersecting the surface of the coating film SF so that the coating film SF can be processed by irradiating the multiple processing light beams EL. In this case, the optical system 112 may include an intensity distribution adjusting element for adjusting the intensity distribution of the multiple processing light beams EL under the control of the control device 18. Examples of the intensity distribution adjusting element include a filter having a desired concentration distribution in a plane intersecting the optical path, an aspherical (refractive or reflective) optical element having a desired surface shape in a plane intersecting the optical path, a diffractive optical element, a spatial light modulator, and the like. Alternatively, if the shapes of the multiple processing beams EL change in a plane including an axis intersecting the surface of the coating film SF, the intensity distribution of the multiple processing beams EL may also change. Therefore, the control device 18 may control the shapes of the multiple processing beams EL in a plane including an axis intersecting the surface of the coating film SF so that the coating film SF can be processed by irradiating the multiple processing beams EL. In this case, the optical system 112 may include a beam shape adjustment element for adjusting the shapes of the multiple processing beams EL under the control of the control device 18. Examples of the beam shape adjustment element, such as an intensity distribution adjustment element, include a diaphragm having a predetermined aperture shape, a filter having a desired density distribution in a plane intersecting the optical path, an aspherical (refractive or reflective) optical element having a desired surface shape in a plane intersecting the optical path, a diffractive optical element, and a spatial light modulator. Note that when the control device 18 controls at least one of the intensity distribution and shape of the multiple processing beams EL, it may or may not control the focusing position FP of the multiple processing beams EL.

[0164] Furthermore, when the focusing position FP changes, the size of the irradiation area EA on the surface of the coating film SF changes. Specifically, the closer the focusing position FP is to the surface of the coating film SF in the direction along the surface of the coating film SF, the smaller the size of the irradiation area EA. The farther the focusing position FP is from the surface of the coating film SF in the direction along the surface of the coating film SF, the larger the size of the irradiation area EA. Therefore, controlling the focusing position FP of the multiple processing beams EL by the focus lens 1121 is equivalent to controlling the size of the multiple irradiation areas EA on the coating film SF. Therefore, it can be said that the control device 18 essentially controls the size of the multiple irradiation areas EA on the surface of the coating film SF based on the positional relationship between the coating film SF and the multiple irradiation areas EA. 26(c), the control device 18 can be said to control the sizes of the plurality of irradiation areas EA so as to (i) relatively reduce the size of the irradiation area EA formed in a first portion of the coating film SF (the portion located on the left side in FIG. 26(c)), and (i) relatively increase the sizes of the irradiation area EA formed in a second portion of the coating film SF (the portion located in the center in FIG. 26(c)) and a third portion of the coating film SF (the portions located on the right side in FIG. 26(c)). In other words, the control device 18 can be said to set the size of the irradiation area EA formed in the first portion of the coating film SF to a desired first size, set the size of the irradiation area EA formed in the second portion of the coating film SF to a desired second size, and set the size of the irradiation area EA formed in the third portion of the coating film SF to a desired third size.

[0165] In the above description, the control device 18 controls the focus lens 1121 to collectively (simultaneously) control the focus positions FP of the multiple processing lights EL. However, the control device 18 may control the focus positions FP of the multiple processing lights EL individually or independently. However, when controlling the focus positions FP of the multiple processing lights EL individually or independently, the processing device 1b includes a light irradiation device 11b-1 equipped with multiple focus lenses 1121 for adjusting the focus positions FP of the multiple processing lights EL, instead of the light irradiation device 11. An example of the light irradiation device 11b-1 equipped with multiple focus lenses 1121 is shown in FIG. 27. As shown in FIG. 27, the light irradiation device 11b-1 includes multiple irradiation units 110b-1. Each irradiation unit 110b-1 includes a light source system 111b-1 and the above-described optical system 112. The light source system 111b-1 includes a single light source 1111. In this light irradiation device 11b-1, the multiple irradiation units 110b-1 that respectively irradiate multiple processing light beams EL are each equipped with multiple focus lenses 1121, so that the focusing positions FP of the multiple processing light beams EL can be controlled individually or independently. Note that each irradiation unit 110b-1 is not limited to irradiating multiple processing light beams EL onto the coating film SF, but may each irradiate a single processing light beam EL onto the coating film SF.

[0166] 28, when each irradiation unit 110b-1 irradiates a single processing light EL, if the optical system 112 of each irradiation unit 110b-1 is a non-telecentric optical system on the coating film SF side, the distance from the optical system 112 to the focusing position FP changes depending on the position on the coating film SF even if the surface of the coating film SF is flat. In this case, the focus lens 1121 can be controlled according to the irradiation position of the processing light EL on the coating film SF.

[0167] Even when the focusing positions FP of the multiple processing beams EL are controlled individually or independently, the control device 18 may set the focusing positions FP of the multiple processing beams EL so that the surface of the coating film SF is located within the range of the focal depth of the optical system 112. Alternatively, the control device 18 may set the focusing positions FP of the multiple processing beams EL so that the focusing positions FP of each of the multiple processing beams EL are located on the surface of the coating film SF, as shown in Figures 29(a) to 29(d). Figure 29(a) is a cross-sectional view showing how the focusing positions FP of the multiple processing beams EL are located on the surface of the coating film SF when the surface of the coating film SF is flat. Figure 29(b) is a cross-sectional view showing how the focusing positions FP of the multiple processing beams EL are located on the surface of the coating film SF when the surface of the coating film SF is curved. Figure 29(c) is a cross-sectional view showing how the focusing positions FP of the multiple processing beams EL are located on the surface of the coating film SF when the surface of the coating film SF has irregularities. FIG. 29(d) is a cross-sectional view showing a state in which the focusing positions FP of the multiple processing beams EL are located on the surface of the coating film SF when the surface of the coating film SF is inclined with respect to the optical axis AX of the optical system 112.

[0168] Furthermore, even when the focusing positions FP of the multiple processing light beams EL are controlled individually or independently, the focusing positions FP of some of the multiple processing light beams EL may not be located on the surface of the coating film SF depending on the surface shape of the coating film SF. That is, while the focusing positions FP of some of the multiple processing light beams EL may be located on the surface of the coating film SF, the focusing positions FP of other parts of the multiple processing light beams EL may not be located on the surface of the coating film SF. In this case, the processing apparatus 1b may selectively irradiate only some of the multiple processing light beams EL onto the coating film SF so that the processing light beams EL whose focusing positions FP are located on the surface of the coating film SF are irradiated onto the coating film SF, while the processing light beams EL whose focusing positions FP are not located on the surface of the coating film SF are not irradiated. Alternatively, even when the focusing positions FP of the multiple processing light beams EL are controlled individually or independently, the surface of the coating film SF may not be located within the focal depth range of the optical system 112 for irradiating some of the multiple processing light beams EL. That is, there are cases where the surface of the coating film SF is located within the focal depth range of one optical system 112 for irradiating one of the plurality of processing lights EL, while the surface of the coating film SF cannot be located within the focal depth range of another optical system 112 for irradiating another of the plurality of processing lights EL. Even in this case, the processing apparatus 1b may selectively irradiate only some of the plurality of processing lights EL onto the coating film SF so that the processing light EL is irradiated via the optical system 112 whose focal depth range is included in the surface of the coating film SF, while the processing light EL is not irradiated via the optical system 112 whose focal depth range is not included in the surface of the coating film SF.

[0169] As shown in Figures 29(a) to 29(d), individually controlling the focusing positions FP of the multiple processing beams EL is essentially equivalent to changing the relative positional relationship of the focusing positions FP of the multiple processing beams EL with respect to the coating film SF in the Z-axis direction (or the direction intersecting the surface of the coating film SF). Therefore, in addition to or instead of controlling the multiple focus lenses 1121 to control the focusing positions FP of the multiple processing beams EL, the control device 18 may control the relative positions of each of the multiple irradiation units 110b-1 with respect to the coating film SF in the Z-axis direction by controlling a drive system (not shown) that can individually move the multiple irradiation units 110b-1. Controlling the relative positions of each of the multiple irradiation units 110b-1 in the Z-axis direction changes the relative positional relationship between the surface of the coating film SF and the focusing positions FP of the multiple processing beams EL in the Z-axis direction. Therefore, even if the processing device 1b controls the relative positions of each of the multiple irradiation units 110b-1 in the Z-axis direction, it can process the coating film SF without being restricted by the shape of the surface of the coating film SF.

[0170] Alternatively, even if the orientation of each of the multiple irradiation units 110b-1 with respect to the coating film SF (e.g., the tilt amount, i.e., the relative position in at least one of the θX and θY directions) changes, the relative positional relationship of the focusing positions FP of the multiple processing light beams EL emitted by the multiple irradiation units 110b-1 also changes. Therefore, the control device 18 may control the orientation of each of the multiple irradiation units 110b-1 with respect to the coating film SF by controlling a drive system (not shown) that can individually move the multiple irradiation units 110b-1. Even in this case, the processing apparatus 1b can process the coating film SF without being restricted by the surface shape of the coating film SF. Note that even if the processing apparatus 1b includes a light irradiation device 11 that does not include multiple irradiation units 110b-1, the control device 18 may control the orientation of the light irradiation device 11 with respect to the coating film SF. Even in this case, the relative position of the focusing positions FP of the multiple processing light beams EL with respect to the coating film SF can be controlled.

[0171] (4-2-2) Second specific example of advance measurement control operation The second specific example of the preliminary measurement control operation differs from the first specific example of the preliminary measurement control operation described above in that, instead of the focusing positions FP of the multiple processing lights EL, a condition related to the focal depth of the optical system 112 (in the following description, a range of the focal depth) is used as the irradiation condition of the multiple processing lights EL. Other features of the second specific example of the preliminary measurement control operation may be the same as those of the first specific example of the preliminary measurement control operation.

[0172] In the second specific example, as in the first specific example, the control device 18 sets the focusing positions FP of the multiple processing beams EL to positions where the coating film SF can be processed with the multiple processing beams EL. For example, as shown in FIGS. 30(a) to 30(d), the control device 18 may set the range of the depth of focus of the optical system 112 so that the surface of the coating film SF (particularly, a portion of the surface of the coating film SF that is irradiated with the multiple processing beams EL) is located within the range of the depth of focus of the optical system 112. In other words, the control device 18 may set the range of the depth of focus of the optical system 112 so that the size of the irradiation area EA of the processing beam EL formed on the surface of the coating film SF falls within a required range. FIG. 30(a) is a cross-sectional view showing the range of the depth of focus of the optical system 112 set to include the surface of the coating film SF when the surface of the coating film SF is flat. FIG. 30(b) is a cross-sectional view showing the range of the depth of focus of the optical system 112 set to include the surface of the coating film SF when the surface of the coating film SF is curved. Fig. 30(c) is a cross-sectional view showing the range of the depth of focus of the optical system 112 set to include the surface of the coating film SF when the surface of the coating film SF has irregularities. Fig. 30(d) is a cross-sectional view showing the range of the depth of focus of the optical system 112 set to include the surface of the coating film SF when the surface of the coating film SF is inclined with respect to the optical axis AX of the optical system 112.

[0173] In the second specific example, the optical system 112 includes an optical element (hereinafter, this optical element will be referred to as a "depth of focus adjustment element") for adjusting the depth of focus range of the optical system 112. The depth of focus adjustment element can be, for example, a focus lens 1121. The depth of focus range can be defined as the upper and lower limits of the depth of focus range in the light propagation direction. The control device 18 controls the depth of focus adjustment element so that the depth of focus range of the optical system 112 is within the set depth of focus range. As a result, the surface of the coating film SF is positioned within the depth of focus range of the optical system 112. Therefore, the surface of the coating film SF is irradiated with processing light EL having an intensity greater than or equal to that sufficient to evaporate the coating film SF, and the coating film SF is removed within the required range. Therefore, the coating film SF is appropriately processed using multiple processing lights EL. Note that, in the second specific example, the size of the depth of focus range is constant, but the size of the depth of focus range may be changed. When changing the size of the depth of focus range, the numerical aperture on the coating film SF side of the optical system 112 may be changed.

[0174] According to the second specific example of the preliminary measurement control operation, the processing apparatus 1b can obtain the same effects as those obtainable by the first specific example of the preliminary measurement control operation described above.

[0175] In the second specific example, as in the first specific example, depending on the shape of the surface of the coating film SF, even if the range of the focal depth of the optical system 112 is set, part of the surface of the coating film SF (particularly, part of the surface of the coating film SF onto which the multiple processing lights EL are irradiated) may not be located within the range of the focal depth of the optical system 112. In this case, the processing device 1b may selectively irradiate only part of the multiple processing lights EL onto the coating film SF so that the processing light EL is irradiated onto part of the coating film SF whose surface is located within the range of the focal depth of the optical system 112, while the processing light EL is not irradiated onto other parts of the coating film SF whose surface is not located within the range of the focal depth of the optical system 112.

[0176] (4-2-3) Third specific example of advance measurement control operation The third specific example of the preliminary measurement control operation differs from the first specific example of the preliminary measurement control operation described above in that the control device 18 sets the state of the image plane of the optical system 112 (i.e., the optical surface on which the processing light EL forms an image via the optical system 112) based on the shape of the surface of the coating film SF. Furthermore, the third specific example of the preliminary measurement control operation differs from the first specific example of the preliminary measurement control operation described above in that the control device 18 controls the optical system 112 so that the state of the image plane of the optical system 112 becomes the set state. Other features of the third specific example of the preliminary measurement control operation may be the same as those of the first specific example of the preliminary measurement control operation. Here, the image plane of the optical system 112 may be a virtual plane fitted to multiple focusing positions FP. Furthermore, in the modified example of FIG. 21 , the image plane may be a plane on which the image of the mask 2421a is formed.

[0177] The control device 18 may set the size of the image plane based on the shape of the surface of the coating film SF. For example, the control device 18 may set the size of the image plane to a predetermined size that corresponds to the shape of the surface of the coating film SF. The control device 18 may set the relative position (e.g., the relative position along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction) of the image plane with respect to the coating film SF (particularly, the surface of the coating film SF) based on the shape of the surface of the coating film SF. For example, the control device 18 may set the position of the image plane to a predetermined position that corresponds to the shape of the surface of the coating film SF. The control device 18 may set the shape of the image plane based on the shape of the surface of the coating film SF. For example, the control device 18 may set the shape of the image plane to a predetermined shape that corresponds to the shape of the surface of the coating film SF.

[0178] When setting the state of the image plane, the control device 18 may set the state of the image plane so that it coincides with the surface of the coating film SF, as shown in Figures 31(a) to 31(d). Figure 31(a) is a cross-sectional view showing an image plane set to coincide with the surface of the coating film SF when the surface of the coating film SF is flat. Figure 31(b) is a cross-sectional view showing an image plane set to coincide with the surface of the coating film SF when the surface of the coating film SF is curved. As shown in Figure 31(b), when the surface of the coating film SF is curved (i.e., curved), the state of the image plane is set so that the set image plane is also curved (i.e., curved). Figure 31(c) is a cross-sectional view showing an image plane set to coincide with the surface of the coating film SF when the surface of the coating film SF is uneven. As shown in Figure 31(c), depending on the shape of the surface of the coating film SF, it may be difficult to coincide a single image plane with the surface of the coating film SF. In this case, the surface of the coating film SF may be divided into multiple divided regions (three divided regions #1 to #3 in the example shown in FIG. 31(c)), and the state of the image plane (particularly, at least one of the size and position) may be set so that an image plane coincides with the surface of each divided region (three image planes #1 to #3 in the example shown in FIG. 31(c)). Furthermore, in this case, the processing light EL is irradiated sequentially onto the multiple divided regions. That is, the processing apparatus 1b processes divided region #1 by irradiating the processing light EL with the image plane of the optical system 112 set to image plane #1, then processes divided region #2 by irradiating the processing light EL with the image plane of the optical system 112 set to image plane #2, and then processes divided region #3 by irradiating the processing light EL with the image plane of the optical system 112 set to image plane #3. FIG. 31(d) is a cross-sectional view showing an image plane set to coincide with the surface of the coating film SF when the surface of the coating film SF is inclined with respect to the optical axis AX of the optical system 112. As shown in FIG. 31(d), when the surface of the coating film SF is inclined, the state of the image plane is set so that the set image plane is also inclined.

[0179] In the third specific example, the optical system 112, which guides the processing light EL to the coating film SF, includes an optical element for adjusting the state of the image plane (hereinafter, this optical element will be referred to as the “image plane adjustment element”). The control device 18 controls the image plane adjustment element so that the image plane on which the processing light EL actually forms an image becomes a set image plane. Alternatively, the control device 18 may control at least one of the relative position and orientation of the light irradiation device 11 with respect to the coating film SF so that the image plane on which the processing light EL actually forms an image becomes a set image plane. As a result, the image plane on which the processing light EL forms an image coincides with the surface of the coating film SF. Therefore, the coating film SF is appropriately processed using multiple processing lights EL. Note that, for example, a movable or deformable optical element among the optical elements constituting the optical system 112 may serve as the image plane adjustment element. For example, a pair of wedge prisms rotatable around the optical axis may be provided, and the apex angle of the entire pair of wedge prisms may be changed to tilt the image plane. Furthermore, as the image plane adjustment element, at least one of the optical members constituting the optical system 112 may be decentered with respect to the optical axis or tilted with respect to the optical axis to tilt the image plane. Alternatively, as the image plane adjustment element, a pair of cylindrical lenses rotatable around the optical axis may be provided, and the degree of field curvature may be adjusted by changing the relative angle between these lenses around the optical axis. Alternatively, as the image plane adjustment element, a deformable optical member may be provided, and the degree of field curvature of the optical system 112 may be adjusted by deformation of this optical member. Note that when the processing light EL is a single processing light, the focus lens 1121 may be used as the image plane adjustment element.

[0180] According to this third specific example of the preliminary measurement control operation, the processing apparatus 1b can obtain the same effects as those obtainable by the first specific example of the preliminary measurement control operation described above.

[0181] (4-2-4) Fourth specific example of advance measurement control operation The fourth specific example of the preliminary measurement control operation differs from the first specific example of the preliminary measurement control operation described above in that the control device 18 sets a non-processing area on the surface of the coating film SF where the coating film SF should not be processed by irradiating the processing light EL based on the surface shape of the coating film SF. Furthermore, the fourth specific example of the preliminary measurement control operation differs from the first specific example of the preliminary measurement control operation described above in that the control device 18 controls the light irradiation device 11 so as not to irradiate the processing light EL onto the non-processing area. Other features of the fourth specific example of the preliminary measurement control operation may be the same as those of the first specific example of the preliminary measurement control operation.

[0182] As shown in FIG. 32(a), the control device 18 sets as a non-machining area a region on the surface of the coating film SF where a structure of a size equal to or larger than the allowable size is present. Specifically, for example, the control device 18 sets as a non-machining area a region on the surface of the coating film SF where a convex structure that protrudes from its surroundings and where a protrusion amount T1 from its surroundings is greater than a predetermined protrusion threshold value (e.g., several millimeters, several centimeters, etc.) corresponding to the allowable size is present. For example, in addition to or instead of a region where a convex structure is present, the control device 18 sets as a non-machining area a region on the surface of the coating film SF where a concave structure that is recessed from its surroundings and where a recess amount T2 from its surroundings is greater than a predetermined recess threshold value (e.g., several millimeters, several centimeters, etc.) corresponding to the allowable size is present. Such convex or concave structures are typically present in a protruding or recessed portion of the workpiece S itself, as shown in FIG. 32(a).

[0183] As described above, an example of the workpiece S is the fuselage of an aircraft PL. In this case, structures larger than the allowable size include, for example, operational structures formed on the surface of the fuselage for the operation of the aircraft PL. An example of an operational structure is an antenna structure related to an antenna. The antenna structure includes, for example, the antenna itself and / or an accessory attached to the antenna. Examples of antennas include at least one of an Emergency Locator Transmitter (ELT) antenna, a Very High Frequency (VHF) antenna, an Automatic Direction Finder (ADF) antenna, an Air Traffic Control (ATC) transponder antenna, a Traffic Alert and Collision Avoidance System (TCAS) antenna, and a weather radar antenna. An example of an operational structure is a sensor structure related to a sensor. The sensor structure includes, for example, the sensor itself and / or an accessory attached to the sensor. Examples of sensors include at least one of an ice detection sensor, a Pitot tube, an Angle of Attack (AOA) sensor, and an altitude sensor. An example of an operational structure is a flow structure related to the inflow and outflow of a fluid (typically, gas). An example of a flow structure is at least one of an inlet through which a fluid flows in (for example, at least one of an air intake and a cooling port) and an outlet through which the fluid flows out (for example, at least one of a drain outlet and an exhaust port). Other examples of operational structures include at least one of a window, a wiper, a storage door, etc. for a surveillance camera.

[0184] After the non-processing area is set, the control device 18 controls the light control device 11 so that multiple processing light beams EL scan the surface of the coating film SF. During this time, as shown in FIGS. 32(a) and 32(b), the control device 18 controls the light irradiation device 11 so that the processing light beam EL is not irradiated onto the non-processing area. That is, if a certain irradiation area EA overlaps with the non-processing area, the control device 18 may turn off the processing light beam EL irradiated onto that irradiation area EA. Turning off the processing light beam EL can be achieved, for example, by turning off the light source 1111 or by inserting a light-shielding member into the optical path of the processing light beam EL. Meanwhile, the control device 18 controls the light irradiation device 11 so that the processing light beam EL is irradiated onto areas not set as non-processing areas. Note that, when a single processing light beam EL is used, the scanning range of the processing light beam EL may be controlled to limit the scanning range of the processing light beam EL to the processing area other than the non-processing area.

[0185] According to this fourth specific example of the advance measurement control operation, the processing device 1b can achieve the same effects as those achieved by the processing device 1 described above. Furthermore, in the fourth specific example, the processing device 1b does not irradiate the processing light EL onto portions of the coating film SF that should not be processed. Therefore, the processing device 1b can process the coating film SF while preventing the adverse effects of the irradiation of the processing light EL from reaching any structures, such as operational structures.

[0186] In the above description, a region on the surface of the coating film SF where structures larger than the allowable size exist is set as a non-processing region. However, in some cases, it may be desirable to form riblet structures in a region where structures larger than the allowable size exist. For example, even if the above-mentioned operational structures are not present, a region where structures larger than the allowable size exist on the surface of the coating film SF may be created due to at least one of distortion of the workpiece S and uneven thickness of the coating film SF. In this case, the region where structures larger than the allowable size exist may be a region where riblet structures should be formed because it is not a region where operational structures exist. Therefore, the control device 18 may irradiate the desired processing region with the processing light EL without setting the region where structures larger than the allowable size exist but where riblet structures are desired to be formed (hereinafter, for convenience, this region will be referred to as the “desired processing region”) as a non-processing region. Alternatively, the control device 18 may first set the desired processing region as a non-processing region and then irradiate the desired processing region with the processing light EL before or after irradiating regions other than the desired processing region on the surface of the coating film SF with the processing light EL. However, the region where structures larger than the allowable size exist corresponds to a protruding region compared to the region where structures larger than the allowable size exist (i.e., the region where the unevenness shown in FIG. 26(c) above exists). Therefore, in order to irradiate the region where structures larger than the allowable size exist with the processing light EL, the control device 18 may adjust the focusing positions FP of the multiple processing light beams EL (see the first specific example above), may control the drive system 12 to move the light irradiation device 11 along the Z axis (see the first specific example above), or may adjust the focal depth of the optical system 112 (see the second specific example above).

[0187] Furthermore, the control device 18 may set, as a non-processing area, an area where a riblet structure has already been formed (i.e., where a concave structure CP1 and / or a convex structure CP2 has been formed) in addition to or instead of an area where structures larger than the allowable size exist on the surface of the coating film SF. In this case, the already formed riblet structure will not be processed so that its characteristics are deteriorated (for example, its shape becomes undesirable) by being irradiated with processing light EL again.

[0188] Furthermore, the control device 18 may control the light irradiation device 11 so that the irradiation area EA does not overlap the non-processing area (i.e., the irradiation area EA moves on the surface of the coating film SF, avoiding the non-processing area). For example, the control device 18 may control the drive system 12 to move the light irradiation device 11 relative to the coating film SF while the light irradiation device 11 is irradiating the processing light EL so that the irradiation area EA does not overlap the non-processing area. Even in this case, the processing device 1b does not irradiate the processing light EL onto portions of the coating film SF that should not be processed, and therefore the coating film SF can be processed while preventing adverse effects of the irradiation of the processing light EL from extending to any structures, such as operational structures.

[0189] (4-2-5) Fifth specific example of advance measurement control operation In the fifth specific example, the surface property measuring device 19b measures the reflectance R of the coating film SF with respect to the processing light EL as a surface property of the coating film SF. To measure the reflectance R, the light projecting device 191b of the surface property measuring device 19b irradiates the coating film SF with measurement light MLb (hereinafter, the measurement light MLb used in the fifth specific example will be referred to as "measurement light MLb2"). The measurement light MLb2 is light with the same wavelength as the processing light EL. Alternatively, the measurement light MLb2 may be light containing an optical component with the same wavelength as the processing light EL. In this case, if the intensity of the measurement light MLb2 is greater than or equal to the intensity capable of evaporating the coating film SF, the irradiation of the measurement light MLb2 may evaporate the coating film SF. For this reason, the light projecting device 191b irradiates measurement light MLb2 with an intensity less than the intensity capable of evaporating the coating film SF. In other words, the light projecting device 191b irradiates measurement light MLb with an intensity weak enough to be unable to evaporate the coating film SF.

[0190] The detection device 192b of the surface property measuring device 19b measures the reflected light (particularly its intensity) of the measurement light MLb2 from the coating film SF. Because the measurement light MLb2 is light with the same wavelength as the processing light EL, the intensity of the reflected light of the measurement light MLb2 increases as the reflectance R of the coating film SF with respect to the processing light EL increases. Therefore, the measurement result of the reflected light (i.e., the output of the surface property measuring device 19b) contains information about the reflectance R. Therefore, the control device 18 can identify the reflectance R based on the measurement result of the surface property measuring device 19b.

[0191] In the fifth specific example, the control device 18 sets the intensities of the multiple processing light beams EL based on the reflectance R. Specifically, as shown in FIG. 33(a), the control device 18 sets the intensities of the multiple processing light beams EL so that the intensities of the multiple processing light beams EL increase as the reflectance R increases. After setting the intensities of the multiple processing light beams EL in this manner, the control device 18 controls the light irradiation device 11 to irradiate the multiple processing light beams EL having the set intensities. Note that the relationship between the reflectance R and the intensity of the processing light beam EL is not limited to being linear as shown in FIG. 33(a), and may be nonlinear, for example, as shown in FIG. 33(b) and FIG. 33(c).

[0192] According to this fifth specific example of the advance measurement control operation, the processing apparatus 1b can achieve the same effects as those achieved by the processing apparatus 1 described above. Furthermore, in the fifth specific example, the processing apparatus 1b irradiates the coating film SF with processing light EL of a higher intensity as the reflectance R of the coating film SF with respect to the processing light EL increases. Therefore, the processing apparatus 1b can appropriately process the coating film SF without being affected by differences in the reflectance R of the coating film SF. In other words, the processing apparatus 1b can process a coating film SF with a relatively high reflectance R and a coating film SF with a relatively low reflectance R in the same way, thereby forming the same riblet structure. The reason for this will be explained below.

[0193] First, as described above, the coating film SF evaporates due to the energy applied to the coating film SF from the processing light EL when it is irradiated with the processing light EL. Therefore, assuming that the intensity of the processing light EL irradiated onto a coating film SF with a relatively high reflectance R is the same as the intensity of the processing light EL irradiated onto a coating film SF with a relatively low reflectance R, the energy from the processing light EL applied to the coating film SF with a relatively high reflectance R is smaller than the energy from the processing light EL applied to the coating film SF with a relatively low reflectance R. This is because a coating film SF with a relatively high reflectance R reflects more of the processing light EL than a coating film SF with a relatively low reflectance R, and therefore the proportion of the processing light EL absorbed as energy by the coating film SF is smaller. In other words, the degree to which a coating film SF with a relatively high reflectance R absorbs the processing light EL (i.e., the absorptivity of the coating film SF for the processing light EL) is smaller than the degree to which a coating film SF with a relatively low reflectance R absorbs the processing light EL (i.e., the absorptivity of the coating film SF for the processing light EL). As a result, there is a possibility that a coating film SF with a relatively high reflectance R and a coating film SF with a relatively low reflectance R will not be processed in the same way. In other words, there is a possibility that the riblet structure formed by processing a coating film SF with a relatively high reflectance R will not be the same as the riblet structure formed by processing a coating film SF with a relatively low reflectance R.

[0194] However, in the fifth specific example, the intensity of the processing light EL irradiated onto a coating film SF with a relatively high reflectance R is greater than the intensity of the processing light EL irradiated onto a coating film SF with a relatively low reflectance R. Therefore, the energy applied from the processing light EL to the coating film SF with a relatively high reflectance R can be equal to the energy applied from the processing light EL to the coating film SF with a relatively low reflectance R. Conversely, the control device 18 sets the intensities of the multiple processing lights EL based on the reflectance R so that the energy applied from the processing light EL to the coating film SF with a relatively high reflectance R is equal to the energy applied from the processing light EL to the coating film SF with a relatively low reflectance R. As a result, the coating film SF with a relatively high reflectance R and the coating film SF with a relatively low reflectance R are processed in the same way. In other words, the riblet structure formed by processing the coating film SF with a relatively high reflectance R is the same as the riblet structure formed by processing the coating film SF with a relatively low reflectance R. Therefore, the processing device 1b can prevent variations in the formation accuracy of the riblet structure due to differences in the reflectance R of the coating film SF. If high-intensity processing light EL is irradiated onto a coating film SF with a relatively low reflectance R, the processing range of the riblets may exceed the coating film SF, affecting the workpiece S. In this example, the intensities of multiple processing light EL are set based on the reflectance R, so there is little risk of adversely affecting the workpiece S.

[0195] As described above, the relative positions (particularly, positions in the direction along the surface of the coating film SF) of the multiple irradiation areas EA onto which the multiple processing light beams EL are respectively irradiated change as the multiple processing light beams EL scan. If the relative positions of the multiple irradiation areas EA on the surface of the coating film SF change, the reflectance R of the portions of the surface of the coating film SF where the multiple irradiation areas EA are set may also change while the multiple processing light beams EL are being irradiated. Therefore, the control device 18 may set the intensities of the multiple processing light beams EL based on the reflectance R of the portions of the surface of the coating film SF where the multiple irradiation areas EA are set, and control the light irradiation device 11 to irradiate the multiple processing light beams EL at the set intensities, when the multiple processing light beams EL are irradiated onto the coating film SF (i.e., when the multiple processing light beams EL are moving relative to the coating film SF). Depending on the surface shape of the coating film SF, if the relative positions of the multiple irradiation areas EA on the surface of the coating film SF change, the angle of incidence of the processing light beam EL with respect to the coating film SF may change. Alternatively, even if the relative positions of the multiple irradiation areas EA on the surface of the coating film SF do not change, the angle of incidence of the processing light EL with respect to the coating film SF may change due to some factor. If the angle of incidence of the processing light EL with respect to the coating film SF changes, the reflectance R may change. In this case, the control device 18 can set the intensity of the processing light EL to an appropriate intensity using information about the measured or previously prepared surface shape of the coating film SF.

[0196] Furthermore, the energy applied from the processing light EL to the coating film SF can vary depending not only on the intensity of the processing light EL but also on the irradiation time of the processing light EL. Specifically, the energy applied from the processing light EL to the coating film SF increases as the irradiation time of the processing light EL increases. Here, the "irradiation time of the processing light EL" refers to the time during which the processing light EL is irradiated onto the same region on the surface of the coating film SF. Therefore, the control device 18 may set the irradiation times of the processing light EL based on the reflectance R in addition to or instead of the intensities of the processing light EL. Specifically, as shown in FIGS. 34(a) to 34(c), the control device 18 sets the irradiation times of the processing light EL so that the irradiation times of the processing light EL increase as the reflectance R increases. Note that FIG. 34(a) shows a case where the relationship between the irradiation time of the processing light EL and the reflectance R changes linearly, while FIGS. 34(b) and 34(c) show a case where the relationship between the irradiation time of the processing light EL and the reflectance R changes nonlinearly. After setting the irradiation times of the processing light EL in this way, the control device 18 controls the light irradiation device 11 to irradiate the processing light EL based on the set irradiation times. Specifically, the control device 18 controls the scanning speed of the processing light EL (i.e., the relative movement speed of the multiple irradiation areas EA with respect to the coating film SF) based on the set irradiation times. More specifically, the control device 18 controls the scanning speed of the processing light EL so that the scanning speed of the processing light EL slows as the irradiation time increases. To control the scanning speed, the control device 18 may control the rotational frequency or oscillation frequency of the galvanometer mirror 1122. Specifically, the control device 18 may control the rotational frequency or oscillation frequency of the galvanometer mirror 1122 so that the rotational frequency or oscillation frequency of the galvanometer mirror 1122 decreases as the irradiation time increases. As a result, the scanning speed of the processing light EL decreases as the irradiation time increases. Even when the irradiation times of the multiple processing light beams EL are set based on the reflectance R, the same effect as that achieved when the intensities of the multiple processing light beams EL are set based on the reflectance R can be achieved. Depending on the surface shape of the coating film SF, the angle of incidence of the processing light EL with respect to the coating film SF may change if the relative positions of the multiple irradiation areas EA on the surface of the coating film SF change. Alternatively, even if the relative positions of the multiple irradiation areas EA on the surface of the coating film SF do not change, the angle of incidence of the processing light EL with respect to the coating film SF may change due to some factor. If the incident angle of the processing light EL to the coating film SF changes, the reflectance R may change.In this case as well, the control device 18 may set the irradiation time of the processing light EL to an appropriate time using information on the shape of the surface of the coating film SF that has been measured or prepared in advance.

[0197] When the processing apparatus 1b performs at least one of the first to fourth specific examples of the preliminary measurement operation in addition to the fifth specific example of the preliminary measurement operation, the processing apparatus 1b is equipped with a surface property measuring device 19b-1 that measures the surface shape of the coating film SF and a surface and structure measuring device 19b-2 that measures the reflectance of the coating film SF. In this case, the surface property measuring devices 19b-1 and 19b-2 irradiate measurement light beams MLb1 and ML2, respectively, but may share a light source for the measurement light beams MLb1 and ML2. In other words, the surface property measuring devices 19b-1 and 19b-2 may share a single light source that emits measurement light beam MLb that can be used as measurement light beams MLb1 and ML2.

[0198] In the above description, the measurement light MLb2 for measuring the reflectance R is light having the same wavelength as the wavelength of the processing light EL (or light containing a light component having the same wavelength as the wavelength of the processing light EL). However, the measurement light MLb2 may be light having a wavelength different from the wavelength of the processing light EL (or light not containing a light component having the same wavelength as the wavelength of the processing light EL). Even in this case, as long as measurement light MLb2 is used that has some correlation between the reflectance of the coating film SF with respect to the measurement light MLb2 and the reflectance R of the coating film SF with respect to the processing light EL, the control device 18 can identify the reflectance R from the measurement results of the surface property measuring device 19b.

[0199] In the above description, the surface characteristic measuring device 19b measures the reflectance R of the coating film SF for the processing light EL. However, the higher the reflectance R of the coating film SF for the processing light EL, the lower the absorptance of the coating film SF for the processing light EL. Therefore, it can be said that the surface characteristic measuring device 19b essentially measures the absorptance of the coating film SF for the processing light EL. In this case, it can be said that the control device 18 essentially sets the intensities of the multiple processing light beams EL so that the intensities of the multiple processing light beams EL decrease as the absorptance of the coating film SF for the processing light EL increases. Furthermore, it can be said that the control device 18 essentially sets the irradiation times of the multiple processing light beams EL so that the irradiation times of the multiple processing light beams EL decrease as the absorptance of the coating film SF for the processing light EL increases.

[0200] (4-2-6) Sixth specific example of advance measurement control operation In the sixth specific example, the surface characteristic measuring device 19b measures the reflectance Ra of the coating film SF for multiple measurement light beams MLb with different wavelengths (hereinafter, the measurement light beams MLb used in the sixth specific example will be referred to as "measurement light beams MLb3") as a surface characteristic of the coating film SF. To measure the reflectance Ra, the light projecting device 191b of the surface characteristic measuring device 19b irradiates the coating film SF with multiple measurement light beams MLb3 with different wavelengths. The multiple measurement light beams MLb3 may or may not contain light with the same wavelength as the processing light beam EL. The multiple measurement light beams MLb3 may or may not contain light containing an optical component with the same wavelength as the processing light beam EL. As in the fifth specific example, the intensity of the multiple measurement light beams MLb3 is set to an intensity less than the intensity capable of evaporating the coating film SF. Furthermore, the detection device 192b of the surface characteristic measuring device 19b further measures the reflected light (particularly its intensity) of each of the multiple measurement light beams MLb3 from the coating film SF. Therefore, the control device 18 can specify the reflectance Ra of the coating film for each of the plurality of measurement beams MLb3 based on the measurement results of the surface property measuring device 19b. Note that Fig. 35 is a graph showing an example of the specified plurality of reflectances Ra.

[0201] Thereafter, the control device 18 sets the wavelength of one of the plurality of measurement light MLb3 to the wavelength of the processing light EL. Specifically, the control device 18 sets the wavelength of the measurement light MLb3 having the smallest reflectance Ra among the plurality of measurement light MLb3 to the wavelength of the processing light EL. In other words, the control device 18 sets the wavelength of the measurement light MLb3 having the largest absorptance of the coating film SF among the plurality of measurement light MLb3 to the wavelength of the processing light EL. In the example shown in FIG. 35, the reflectance Ra corresponding to the measurement light MLb3(#3) among the five measurement light MLb3 (i.e., measurement light MLb3(#1) to measurement light MLb3(#5)) is the smallest. Therefore, the control device 18 sets the wavelength of the measurement light MLb3(#3) to the wavelength of the processing light EL.

[0202] Thereafter, the control device 18 controls the light irradiation device 11 to irradiate the coating film SF with the processing light EL of the set wavelength. Specifically, the processing device 1b performing the sixth specific example of the preliminary measurement control operation includes, instead of the above-described light irradiation device 11, a light irradiation device 11b-6 having multiple light source systems 111 emitting processing light EL with different wavelengths, as shown in FIG. 36 . The wavelengths of the processing light EL emitted by each of the multiple light source systems 111 are the same as the wavelengths of the multiple measurement light beams MLb3. The control device 18 controls one of the multiple light source systems 111 capable of emitting processing light EL of the set wavelength so that it emits the multiple processing light beams EL of the set wavelength. Meanwhile, the control device 18 controls the other light source systems 111 so that the other light source systems 111 do not emit processing light EL. As a result, the light irradiation device 111 can irradiate the coating film SF with processing light EL of the set wavelength.

[0203] In the above example, the light irradiation device 11b-6 has a plurality of light source systems 111 that respectively emit a plurality of processing lights EL having different wavelengths, but instead of or in addition to this, the light irradiation device 11b-6 may be provided with a light source system 111 that includes a wavelength-variable light source that can continuously change the emission wavelength.

[0204] According to this sixth specific example of the preliminary measurement control operation, the processing apparatus 1b can achieve the same effects as those achieved by the processing apparatus 1 described above. Furthermore, in the sixth specific example, the processing apparatus 1b can irradiate the coating film SF with processing light EL having the same wavelength as one measurement light MLb3 among the multiple measurement lights MLb3 that has the smallest reflectance Ra of the coating film SF. Therefore, the processing apparatus 1b can irradiate the coating film SF with processing light EL whose reflectance R of the coating film is relatively small (i.e., whose absorption rate of the coating film SF is relatively high). Therefore, the processing apparatus 1b can appropriately process the coating film SF without being affected by differences in the characteristics of the coating film SF.

[0205] As explained in the fifth specific example, the reflectance Ra of the portion of the surface of the coating film SF where the multiple irradiation areas EA are set may also change while the multiple processing light beams EL are being irradiated. Therefore, when the multiple processing light beams EL are being irradiated onto the coating film SF (i.e., when the multiple processing light beams EL are moving relative to the coating film SF), the control device 18 may set the wavelength of the processing light beam EL based on the reflectance Ra of the portion of the surface of the coating film SF where the multiple irradiation areas EA are set, and control the light irradiation device 11 to irradiate the multiple processing light beams EL of the set wavelength. As explained in the fifth specific example, the reflectance R may change if the angle of incidence of the processing light beam EL with respect to the coating film SF changes. In this case, the control device 18 may set the wavelength of the processing light beam EL to an appropriate wavelength using measured or previously prepared information on the shape of the surface of the coating film SF.

[0206] Furthermore, the control device 18 may set the wavelength of one of the plurality of measurement beams MLb3 whose reflectance Ra is equal to or less than a predetermined reflection threshold (i.e., whose absorptance of the coating film SF is equal to or greater than a predetermined absorption threshold) as the wavelength of the processing light EL. The reflection threshold is set to satisfy the condition that even if a portion of the processing light EL irradiated onto the coating film SF is reflected by the coating film SF whose reflectance R is equal to or greater than the reflection threshold, the coating film SF can be evaporated by the processing light EL. The absorption threshold is also set from the same perspective. Even in this case, the processing device 1b can appropriately process the coating film SF without being affected by differences in the characteristics of the coating film SF.

[0207] (4-2-7) Seventh specific example of advance measurement control operation The seventh specific example of the preliminary measurement control operation differs from the first specific example of the preliminary measurement control operation described above in that the control device 18 controls the relative positional relationship between the coating film SF and the plurality of irradiation areas EA based on the shape of the surface of the coating film SF. Other features of the seventh specific example of the preliminary measurement control operation may be the same as those of the first specific example of the preliminary measurement control operation.

[0208] Specifically, in the seventh example, when the light irradiation device 11 moves relative to the coating film SF (and further, the surface property measuring device 19b, whose position relative to the light irradiation device 11 is fixed, also moves relative to the coating film SF), the surface property measuring device 19b measures the surface shape of the coating film SF before the light irradiation device 11 moves, and then measures the surface shape of the coating film SF after the light irradiation device 11 moves (or while the light irradiation device 11 is moving, the same applies below). At this time, as shown in FIG. 37, the surface property measuring device 19b measures the surface shape of the coating film SF so that a region 31b on the surface of the coating film SF that was the measurement target of the surface property measuring device 19b before the light irradiation device 11 moved and a region 32b on the surface of the coating film SF that was the measurement target of the surface property measuring device 19b after the light irradiation device 11 moved partially overlap. In other words, the surface property measuring device 19b performs measurements in accordance with the movement of the light irradiation device 11 so as to measure the surface shape of an overlapping region 33b included in both regions 31b and 32b. As a result, the measurement result of the overlapping area 33b, which is included in both the area 31b and the area 32b, is included in both the measurement result of the area 31b and the measurement result of the area 32b.

[0209] The control device 18 determines how the overlapping region 33b has moved based on the measurement results of the region 31b and the measurement results of the region 32b. Specifically, the control device 18 determines, from the measurement results of the region 31b, a specific region within the region 31b whose surface shape is a uniquely distinguishable shape. Furthermore, from the measurement results of the region 32b, the control device 18 determines whether a specific region exists within the region 32b by pattern matching using the surface shape of the specific region as a template. If a specific region does not exist within the region 32b, the control device 18 identifies a new specific region within the region 31b and determines whether the new specific region exists within the region 32b. If a specific region exists within the region 32b, the specific region corresponds to the overlapping region 33b. The control device 18 compares the position of the overlap region 33b within region 31b with the position of the overlap region 33b within region 32b to determine how the relative position of the surface property measuring device 19b with respect to the overlap region 33b has changed as the light irradiation device 11 has moved. Specifically, the control device 18 determines how much the surface property measuring device 19b has moved along each of the X-axis and Y-axis directions with respect to the overlap region 33b. The light irradiation device 11 may irradiate the surface of the coating film SF with processing light EL to form a specific region within region 31b whose surface shape is uniquely distinguishable. For example, the riblet structure may be processed to have a convex or concave structure extending linearly along a predetermined direction with a portion cut out. Alternatively, the riblet structure may have a cross-sectional shape that varies in the direction in which the riblets extend, as shown in Figures 58 and 59 (described later).

[0210] The amount of relative movement of the surface property measuring device 19b with respect to the overlapping region 33b is the same as the amount of relative movement of the light irradiation device 11 with respect to the coating film SF. The direction of relative movement of the surface property measuring device 19b with respect to the overlapping region 33b is the same as the direction of relative movement of the light irradiation device 11 with respect to the coating film SF. Therefore, the control device 18 can determine how much the light irradiation device 11 has moved along each of the X-axis and Y-axis directions with respect to the coating film SF. In other words, the control device 18 can determine the relative position of the light irradiation device 11 with respect to the coating film SF by determining the relative position of the surface property measuring device 19b with respect to the overlapping region 33b.

[0211] Because the light irradiation device 11 irradiates the coating film SF with processing light EL, determining the relative position of the light irradiation device 11 with respect to the coating film SF is essentially equivalent to determining the relative positions of the multiple irradiation areas EA with respect to the coating film SF. Therefore, the control device 18 can determine the relative positions of the multiple irradiation areas EA with respect to the coating film SF (particularly, their positions along the X-axis and Y-axis) based on the surface shape of the coating film SF. If the determined positions of the multiple irradiation areas EA are different from the positions of the multiple irradiation areas EA required to form a riblet structure (or a structure desired to be formed by processing the coating film SF), the control device 18 controls the light irradiation device 11 to move the multiple irradiation areas EA relative to the coating film SF. In other words, the control device 18 controls the relative positional relationship between the coating film SF and the multiple irradiation areas EA. For example, the control device 18 may control the drive system 12 to move the light irradiation device 11 with respect to the coating film SF, thereby moving the multiple irradiation areas EA relative to the coating film SF.

[0212] According to this seventh specific example of the preliminary measurement control operation, the processing device 1b can achieve the same effects as those achieved by the above-mentioned processing device 1. Furthermore, in the seventh specific example, the processing device 1b can appropriately adjust the relative positions of the multiple irradiation areas EA on the surface of the coating film SF, thereby enabling the riblet structure to be formed more appropriately (e.g., with even greater precision).

[0213] (4-2-8) Other examples of advance measurement control operations In the above description, the processing apparatus 1b is equipped with the surface property measuring device 19b. However, the processing apparatus 1b does not necessarily have to be equipped with the surface property measuring device 19b. In this case, as long as the control device 18 can acquire information about the surface of the coating film SF, the processing apparatus 1b can perform the above-described preliminary measurement control operation. For example, the surface shape of the coating film SF can be estimated from design data such as a three-dimensional model of the workpiece S. Therefore, the control device 18 may acquire design data of the workpiece S, estimate the surface shape of the coating film SF from the design data, and perform the first to fourth specific examples of the preliminary measurement control operation described above based on the estimated surface shape of the coating film SF. Alternatively, the control device 18 may acquire data in which information about the processing area and the non-processing area has been added to the design data. Alternatively, for example, the reflectance R of the coating film SF can be estimated from the specifications of the coating film SF. Therefore, the control device 18 may acquire information about the specifications of the coating film SF, estimate the reflectance R of the coating film SF from the information about the specifications, and perform the fifth to sixth specific examples of the preliminary measurement control operation described above based on the estimated reflectance R. Alternatively, the control device 18 may acquire data in which paint reflectance information (generally color information) has been added to the design data in advance. As a result, measurement by the surface characteristic measuring device 19b is not required, thereby shortening the time required to process the paint film SF. Note that the operation performed in this case does not need to be called a pre-measurement control operation, since it does not require measurement by the surface characteristic measuring device 19b. Note that the non-processing area may be masked with masking tape or the like.

[0214] In the above description, the control device 18 controls at least one of the focusing position FP of the processing light EL, the intensity distribution of the processing light EL, the shape of the processing light EL, and the focal depth of the optical system 112 based on the surface shape of the coating film SF. The control device 18 controls at least one of the intensities of the multiple processing light beams EL, the irradiation times of the multiple processing light beams EL, and the wavelengths of the multiple processing light beams EL based on the reflectance of the coating film SF. However, the control device 18 may control any characteristic of the processing light EL based on any characteristic of the coating film SF so that the coating film SF can be processed by irradiating the multiple processing light beams EL. Examples of any characteristic of the processing light EL include at least one of the shapes of the multiple irradiation areas EA, the sizes of the multiple irradiation areas EA, the positions of the multiple irradiation areas EA, the relative positions between the multiple processing light beams EL, the relative angles between the multiple processing light beams EL, the polarization states of the multiple processing light beams EL, the intensities of the multiple processing light beams EL, the irradiation times of the multiple processing light beams EL, and the wavelengths of the multiple processing light beams EL.

[0215] In the above description, the surface property measuring device 19b measures the surface properties of the coating film SF before the light irradiation device 11 irradiates the surface of the coating film SF with multiple beams of processing light EL. In other words, while the surface property measuring device 19b is measuring the surface properties of the coating film SF, the light irradiation device 11 does not irradiate the surface of the coating film SF with multiple beams of processing light EL, and while the light irradiation device 11 is irradiating the surface of the coating film SF with multiple beams of processing light EL, the surface property measuring device 19b does not measure the surface properties of the coating film SF. However, the surface property measuring device 19b may measure the surface properties of the coating film SF during at least a portion of the period while the light irradiation device 11 irradiates the surface of the coating film SF with multiple beams of processing light EL. The light irradiation device 11 may irradiate the surface of the coating film SF with multiple beams of processing light EL during at least a portion of the period while the surface property measuring device 19b measures the surface properties of the coating film SF. That is, the operation of measuring the surface characteristics of the coating film SF by the surface characteristic measuring device 19b and the operation of irradiating the coating film SF with multiple processing light beams EL by the light irradiation device 11 (i.e., the operation of processing the coating film SF) may be performed in parallel. For example, the surface characteristic measuring device 19b may measure the characteristics of another region of the coating film SF different from the one region of the coating film SF whose characteristics have already been measured by the surface characteristic measuring device 19b during at least a portion of the period during which the light irradiation device 11 irradiates the one region of the coating film SF whose characteristics have already been measured by the surface characteristic measuring device 19b with multiple processing light beams EL. For example, the light irradiation device 11 may irradiate the one region of the coating film SF whose characteristics have already been measured by the surface characteristic measuring device 19b with multiple processing light beams EL during at least a portion of the period during which the surface characteristic measuring device 19b measures the characteristics of another region of the coating film SF. In this case, an improvement in throughput regarding the formation of a riblet structure can be expected.

[0216] (4-3) Third Modification Next, a processing apparatus 1c of a third modified example will be described with reference to Fig. 38. As shown in Fig. 38(a), the processing apparatus 1c of the third modified example differs from the processing apparatus 1 described above in that it further includes a structure measuring device 19c. Other features of the processing apparatus 1c may be the same as other features of the processing apparatus 1.

[0217] The structure measurement device 19c measures the characteristics of the riblet structure (or any other structure; the same applies hereinafter in this modified example) formed by irradiation with processing light EL from the light irradiation device 11. Examples of the characteristics of the riblet structure include at least one of the presence or absence of a riblet structure, the shape of the riblet structure (for example, at least one of the cross-sectional shape of the concave structure CP1 and the cross-sectional shape of the concave structure CP1), the size of the riblet structure (for example, at least one of the depth D of the concave structure CP1, the width of the concave structure CP1, the arrangement pitch P1 of the concave structure CP1, the height H of the convex structure CP2, the width of the convex structure CP2, and the arrangement pitch P2 of the convex structure CP2), and the position of the riblet structure (for example, the position of at least one of the concave structure CP1 and the convex structure CP2).

[0218] To measure the characteristics of the riblet structure, the structure measuring device 19c is equipped with a light projecting device 191c and a detecting device 192c. The light projecting device 191c and the detecting device 192c are supported by the containing device 13 via a support member 136c. The light projecting device 191c irradiates the riblet structure (i.e., the coating film SF) with measurement light MLc1. When the measurement light MLc1 is irradiated onto the riblet structure, the measurement light MLc1 is reflected or scattered by the riblet structure. As a result, measurement light MLc2 containing at least one of the reflected light and scattered light of the measurement light MLc1 is emitted from the riblet structure. The detecting device 192c detects this measurement light MLc2.

[0219] When the measurement light MLc1 is irradiated onto a portion where a riblet structure is formed, the measurement light MLc2 includes at least one of reflected light and scattered light propagating in a direction intersecting the direction of travel of the measurement light MLc1. On the other hand, when the measurement light MLc1 is irradiated onto a portion where a riblet structure is not formed, the measurement light MLc2 does not include at least one of reflected light and scattered light propagating in a direction intersecting the direction of travel of the measurement light MLc1. In other words, the direction of travel of the measurement light MLc2 is approximately parallel to the direction of travel of the measurement light MLc1. Therefore, as shown in FIG. 39, when the light projecting device 191c and the detecting device 192c are arranged to detect the measurement light MLc2 propagating in a direction intersecting the direction of travel of the measurement light MLc1, the control device 18 can determine the presence or absence of a riblet structure in the portion irradiated with the measurement light MLc1 based on the detection result of the detecting device 192c. Furthermore, the characteristics (e.g., intensity, etc.) of the measurement light MLc2 vary depending on at least one of the shape and size of the riblet structure. Therefore, based on the detection results of the detection device 192c, the control device 18 can also identify at least one of the shape of the riblet structure, the size of the riblet structure, the position of the concave structure CP1 that constitutes the riblet structure, and the position of the convex structure CP2 that constitutes the riblet structure.

[0220] The structure measurement device 19c is further configured to be able to change the traveling direction of the measurement light MLc1. For example, if the light projector 191c is equipped with an optical element that optically changes the traveling direction of the measurement light MLc1, the traveling direction of the measurement light MLc1 may be changed by the optical element. For example, if the light projector 191c is movable relative to the coating film SF, the traveling direction of the measurement light MLc1 may be changed by the relative movement of the light projector 191c. Here, if the measurement light MLc1 can be irradiated onto the riblet structure from only one direction, depending on the extension direction of the riblet structure, even if the measurement light MLc1 is irradiated onto the riblet structure, measurement light MLc2 may not be generated. However, if the traveling direction of the measurement light MLc1 can be changed, the light projector 191c can irradiate the measurement light MLc1 onto a riblet structure extending in a certain direction from various directions. Therefore, the structure measurement device 19c can measure the characteristics of the riblet structure without being affected by differences in the extension direction of the riblet structure. In order to change the traveling direction of the measuring beam MLc1, the structure measuring device 19c itself may be rotated around the Z axis. Also, a plurality of structure measuring devices 19c may be provided in which the traveling directions of the measuring beam MLc1 differ from each other.

[0221] In addition to or instead of changing the traveling direction of the measurement light MLc1, the structure measurement device 19c may be configured to change the traveling direction of the measurement light MLc2 that the detection device 192c can detect. For example, if the detection device 192c is movable relative to the coating film SF, the traveling direction of the measurement light MLc2 that the detection device 192c can detect may be changed by the relative movement of the detection device 192c. Here, if the detection device 192c can only detect the measurement light MLc2 traveling in a certain direction, depending on the extension direction of the riblet structure, the measurement light MLc2 may not travel toward the detection device 192c, and the detection device 192c may not be able to detect the measurement light MLc2. However, if the traveling direction of the measurement light MLc2 that the detection device 192c can detect is changeable, the detection device 192c can detect the measurement light MLc2 traveling in various directions from a riblet structure extending in a certain direction. Therefore, the structure measurement device 19c can measure the characteristics of the riblet structure without being affected by differences in the extension direction of the riblet structure.

[0222] The structure measurement device 19c may measure the characteristics of all riblet structures formed by the processing device 1c. However, if the characteristics of all riblet structures formed by the processing device 1c were measured, the time required to measure the characteristics of the riblet structures would be enormous. For this reason, in the third modified example, as shown in FIG. 40, the structure measurement device 19c selectively measures the characteristics of riblet structures formed in sample areas DAc corresponding to a portion of the processed area in which the processing device 1c formed riblet structures. The structure measurement device 19c selectively measures the characteristics of riblet structures formed in multiple sample areas DAc that are evenly distributed within the processed area. However, the structure measurement device 19c may also selectively measure the characteristics of riblet structures formed in multiple (or one) sample areas DAc that are randomly distributed within the processed area.

[0223] After the processing device 1c forms a riblet structure in a certain area where the riblet structure is to be formed, the structure measurement device 19c may selectively measure the characteristics of the riblet structure formed in a sample area DAc within that certain area. For example, after the processing device 1c forms a riblet structure in a certain unit processing area SA, the structure measurement device 19c may set a sample area DAc within that unit processing area SA and selectively measure the characteristics of the riblet structure formed in the set sample area DAc. If the processing device 1c then forms a riblet structure in another unit processing area SA, the structure measurement device 19c may set a sample area DAc within that other unit processing area SA and selectively measure the characteristics of the riblet structure formed in the set sample area DAc. In other words, the formation of a riblet structure by the processing device 1c and the measurement of the characteristics of the riblet structure by the structure measurement device 19c may be alternately repeated.

[0224] Alternatively, during at least a portion of the period during which the processing device 1c is irradiating a region on the surface of the coating film SF with multiple processing lights EL (i.e., forming a riblet structure in the region), the structure measurement device 19c may measure the characteristics of a riblet structure that the processing device 1c has already formed in another region different from the first region. For example, during at least a portion of the period during which the processing device 1c is forming a riblet structure in a unit processing region SA, the structure measurement device 19c may selectively measure the characteristics of a riblet structure formed in a sample region DAc in another unit processing region SA that is different from the first unit processing region SA and in which the processing device 1c has already formed a riblet structure. In other words, the formation of a riblet structure by the processing device 1c and the measurement of the characteristics of the riblet structure by the structure measurement device 19c may be performed in parallel. In this case, an improvement in throughput can be expected.

[0225] When measurement by the structure measuring device 19c is completed, the measurement results by the structure measuring device 19c are output to the control device 18. As described above, the control device 18 identifies the characteristics of the riblet structure based on the measurement results by the structure measuring device 19c. The control device 18 determines whether the characteristics of the riblet structure are good or bad based on the identified characteristics of the riblet structure. Furthermore, the control device 18 notifies the operator of the processing device 1c of the result of the determination of the characteristics of the riblet structure via an output device including at least one of a display, a speaker, etc.

[0226] For example, the control device 18 may determine whether the size of the riblet structure in a direction intersecting the surface of the coating film SF (i.e., the depth D of the concave structures CP1 or the height H of the convex structures CP2) is acceptable. Figure 41(a) is a cross-sectional view showing an ideal riblet structure to be formed by the processing device 1c. If the size of the identified riblet structure is the same as the size of the ideal riblet structure as shown in Figure 41(b), the control device 18 determines that the size of the riblet structure is normal (i.e., the riblet structure is acceptable). In this case, the control device 18 notifies the user that the size of the riblet structure is normal. On the other hand, if the size of the identified riblet structure is smaller than the size of the ideal riblet structure as shown in Figure 41(c), the control device 18 determines that the size of the riblet structure is abnormal (i.e., the riblet structure is defective). In this case, the control device 18 notifies the user that the size of the riblet structure is abnormal (in particular, that the size is small). On the other hand, if the size of the identified riblet structure is larger than the size of the ideal riblet structure as shown in Figure 41(d), the control device 18 determines that the size of the riblet structure is abnormal (i.e., the riblet structure is defective). In this case, the control device 18 notifies the user that the size of the riblet structure is abnormal (especially that the size is large).

[0227] For example, the control device 18 may determine whether the shape of the riblet structure is good or bad. If the shape of the identified riblet structure is the same as the shape of an ideal riblet structure as shown in FIG. 42(a), the control device 18 determines that the shape of the riblet structure is normal (i.e., the riblet structure is a good product). In this case, the control device 18 notifies the user that the shape of the riblet structure is normal. On the other hand, if the shape of the identified riblet structure differs from the shape of the ideal riblet structure as shown in FIG. 42(b), the control device 18 determines that the shape of the riblet structure is abnormal (i.e., the riblet structure is a defective product). In this case, the control device 18 notifies the user that the shape of the riblet structure is abnormal.

[0228] For example, the control device 18 may determine whether the positions of the concave structures CP1 (and further, the convex structures CP2, the same applies below) that constitute the riblet structure are good or bad. If the identified positions of the concave structures CP1 are the same as the positions of the concave structures CP1 that constitute an ideal riblet structure, as shown in the upper part of Figure 43, the control device 18 determines that the positions of the concave structures CP1 that constitute the riblet structure are normal (i.e., the riblet structure is a good product). In this case, the control device 18 notifies the user that the positions of the concave structures CP1 that constitute the riblet structure are normal. On the other hand, if the identified positions of the concave structures CP1 differ from the positions of the concave structures CP1 that constitute an ideal riblet structure, as shown in the lower part of Figure 43, the control device 18 determines that the positions of the concave structures CP1 that constitute the riblet structure are abnormal (i.e., the riblet structure is defective). In this case, the control device 18 notifies the user that the positions of the concave structures CP1 that constitute the riblet structure are abnormal.

[0229] For example, the control device 18 may determine whether a riblet structure is present or not. As shown in FIG. 44(a), if a riblet structure is present in the sample area DA, the control device 18 determines that the riblet structure is formed (i.e., the riblet structure is of good quality). In this case, the control device 18 notifies the user that a riblet structure is formed. On the other hand, as shown in FIG. 44(b), if a riblet structure is not present in the sample area DA, the control device 18 determines that the riblet structure is not formed (i.e., the riblet structure is defective). In this case, the control device 18 notifies the user that a riblet structure is not formed.

[0230] If the control device 18 determines that the riblet structure is defective, it may control the light irradiation device 11 to correct the riblet structure that has already been formed. Specifically, if the riblet structure is determined to be defective, not only is the riblet structure in the sample area DA where the defective riblet structure exists defective, but there is also the possibility that the riblet structures in a wider area on the coating film SF that includes the sample area DA are defective. Therefore, the control device 18 controls the light irradiation device 11 to irradiate the processing light EL onto a wider area on the coating film SF that includes the sample area DA (hereinafter, this area will be referred to as the "area to be corrected"), thereby correcting the riblet structure in the correction area. For example, as shown in FIG. 45(a), if the size (here, depth D) of the recessed structures CP1 constituting the riblet structure becomes smaller than the size of the recessed structures CP1 constituting the ideal riblet structure, the control device 18 may control the light irradiation device 11 to irradiate the recessed structures CP1 with processing light EL to further remove the coating film SF (i.e., further thin the coating film SP1), thereby enlarging the recessed structures CP1. As a result, as shown in FIG. 45(b), the size of the riblet structure in the correction target area is corrected to match the size of the ideal riblet structure. The processing conditions of the processing device 1c may be changed using the measurement results of the riblet structure characteristics by the structure measurement device 19c. For example, if the shape, formation position, and size of the riblet structure are measured to be close to the upper and lower limits of a predetermined range (standard), the processing conditions of the processing device 1c may be changed to bring the shape, formation position, and size of the riblet structure closer to the central value of the standard.

[0231] The processing device 1c of the third modified example can achieve the same effects as those achieved by the above-described processing device 1. Furthermore, the processing device 1c can appropriately evaluate the quality of the riblet structure that is actually formed.

[0232] (4-4) Fourth Modification Next, a processing device 1d of a fourth modified example will be described. The processing device 1d of the fourth modified example can change the arrangement pitch P1 of the concave structures CP1. When the arrangement pitch P1 of the concave structures CP1 changes, the arrangement pitch P2 of the convex structures CP2 also changes. Therefore, it can be said that the processing device 1d can change the arrangement pitch P2 of the convex structures CP2.

[0233] In order to change the arrangement pitch P1, the processing apparatus 1d is equipped with a light irradiation device 11d instead of the above-described light irradiation device 11. As shown in FIG. 46, the light irradiation device 11d differs from the light irradiation device 11 in that it is equipped with an optical system 112d equipped with a zoom lens 1124d. Other features of the light irradiation device 11d may be the same as other features of the light irradiation device 11. The zoom lens 1124d can change the projection magnification of the optical system 112d under the control of the control device 18. The zoom lens 1124d can change the interval between the multiple beams of processing light EL that it emits under the control of the control device 18.

[0234] When the projection magnification of the optical system 112d changes, the relative positional relationship of the multiple irradiation areas EA in the direction along the surface of the coating film SF changes. Specifically, as shown in FIG. 47(a), when the projection magnification of the optical system 112d is a first magnification (i.e., the interval between the multiple emitted processing lights EL is a first interval), the arrangement pitch of the multiple irradiation areas EA is a first pitch Pe1. Note that the arrangement pitch of the multiple irradiation areas EA refers to the arrangement pitch along the direction in which the multiple irradiation areas EA move on the surface of the coating film EA during stepping (in the example shown in FIG. 47(a)), the X-axis direction. On the other hand, as shown in FIG. 47(b), when the projection magnification of the optical system 112d is a second magnification greater than the first magnification (i.e., the interval between the multiple emitted processing lights EL is a second interval greater than the first interval), the arrangement pitch of the multiple irradiation areas EA is a second pitch Pe2 greater than the first pitch Pe1. In other words, the control device 18 can change the relative positional relationship of the multiple irradiation areas EA in the direction along the surface of the coating film SF (particularly, the arrangement pitch of the multiple irradiation areas EA) by changing the projection magnification of the optical system 112d.

[0235] When the arrangement pitch of the irradiation areas EA changes, the arrangement pitch P1 of the recessed structures CP1 formed by the processing light EL irradiated onto the irradiation areas EA also changes. Specifically, as shown in FIG. 47(c), the arrangement pitch P1 of the recessed structures CP1 formed by the processing light EL irradiated onto the irradiation areas EA, whose arrangement pitch is the first pitch Pe1, is a first pitch Pp1 corresponding to the first pitch Pe1. On the other hand, as shown in FIG. 47(d), the arrangement pitch P1 of the recessed structures CP1 formed by the processing light EL irradiated onto the irradiation areas EA, whose arrangement pitch is the second pitch Pe2, is a second pitch Pp2 corresponding to the second pitch Pe2. Because the second pitch Pe2 is larger than the first pitch Pe1, the second pitch Pp2 is also larger than the first pitch Pp1.

[0236] Since the light irradiation device 11d irradiates multiple parallel processing light beams EL, changing the arrangement pitch of the multiple irradiation areas EA changes the relative positional relationship between the multiple processing light beams EL. That is, as shown in Figures 47(c) and 47(d), the relative positional relationship between the multiple processing light beams EL changes so that the larger the arrangement pitch of the multiple irradiation areas EA, the larger the spacing between the multiple processing light beams EL (particularly the spacing in the direction along the surface of the coating film SF). Therefore, controlling the arrangement pitch of the multiple irradiation areas EA is equivalent to controlling the relative positional relationship between the multiple processing light beams EL. Therefore, it can be said that the control device 18 essentially changes the arrangement pitch of the concave structures CP1 by changing the relative positional relationship between the multiple processing light beams EL.

[0237] The control device 18 may change the arrangement pitch P1 of the recessed structures CP1 depending on which part of the workpiece S the area in which the riblet structure is to be formed corresponds to. For example, as described above, when the workpiece S is an aircraft, the arrangement pitch P1 of the recessed structures CP1 that can efficiently exhibit the effect of reducing friction on the fuselage PL1 is not necessarily the same as the arrangement pitch P1 of the recessed structures CP1 that can efficiently exhibit the effect of reducing friction on the main wing PL2. For this reason, the control device 18 may change the arrangement pitch P1 of the recessed structures CP1 so that the arrangement pitch P1 of the recessed structures CP1 formed by processing the paint film SF on the fuselage PL1 is different from the arrangement pitch P1 of the recessed structures CP1 formed by processing the paint film SF on the main wing PL2.

[0238] The control device 18 may change the arrangement pitch P1 of the concave structures CP1 based on the surface shape of the coating film SF. Specifically, as described above, the surface shape of the coating film SF is likely to depend on the surface shape of the work-piece S underneath the coating film SF. That is, the surface of a coating film SF applied to a work-piece S having a flat surface is likely to be flat, and the surface of a coating film SF applied to a work-piece S having a curved surface is likely to be curved. In this case, the arrangement pitch P1 of the concave structures CP1 that can efficiently reduce the friction on the surface of the work-piece S having a first shape is not necessarily the same as the arrangement pitch P1 of the concave structures CP1 that can efficiently reduce the friction on the surface of the work-piece S having a second shape different from the first shape. For this reason, the control device 18 may change the arrangement pitch P1 of the recessed structures CP1 so that the arrangement pitch P1 of the recessed structures CP1 formed by processing the coating film SF having a first surface shape is different from the arrangement pitch P1 of the recessed structures CP1 formed by processing the coating film SF having a second surface shape. In this case, the processing device 1d may be equipped with a surface property measuring device 19b capable of measuring the surface shape of the coating film SF, as with the processing device 1b, to change the arrangement pitch P1 of the recessed structures CP1 based on the surface shape of the coating film SF, or may acquire information regarding the surface shape of the coating film SF (e.g., the design data described above). Furthermore, when the light irradiation device 11d irradiates the coating film SF with multiple parallel processing beams EL, if the shape of the workpiece S is not flat, the interval (pitch) between the multiple processing beams EL may not necessarily be the same as the arrangement pitch P1 of the recessed structures CP1 formed. In this case, the interval between the multiple processing beams EL may be changed so that the arrangement pitch P1 of the recessed structures CP1 is a predetermined pitch. Furthermore, even when the light irradiation device 11d irradiates the coating film SF with multiple processing lights EL that are not parallel to each other, if the shape of the workpiece S is not flat, the spacing (pitch) between the multiple processing lights EL and the arrangement pitch P1 of the formed concave structures CP1 may not necessarily be the same, so the spacing between the multiple processing lights EL may be changed.

[0239] As the multiple processing light beams EL scan, the relative positions (particularly, the positions in the direction along the surface of the paint film SF) of the multiple irradiation areas EA onto which the multiple processing light beams EL are respectively irradiated change. If the relative positions of the multiple irradiation areas EA on the surface of the paint film SF change, the area where the multiple irradiation areas EA are formed may change from an area corresponding to a certain portion of the workpiece S (e.g., an area corresponding to the fuselage PL1) to an area corresponding to another portion of the workpiece S (e.g., an area corresponding to the main wing PL2) while the multiple processing light beams EL are being irradiated. Alternatively, if the relative positions of the multiple irradiation areas EA on the surface of the paint film SF change, the shape of the portion of the surface of the paint film SF onto which the multiple irradiation areas EA are formed may also change while the multiple processing light beams EL are being irradiated. Therefore, the control device 18 may change the arrangement pitch P1 of the concave structures CP1 while the multiple processing light beams EL are irradiated onto the paint film SF (i.e., while the multiple processing light beams EL are moving relative to the paint film SF). As described above, even if the spacing between the multiple processing lights EL is constant, the arrangement pitch of the formed concave structures CP1 may differ depending on the shape of the workpiece S. In this case, the spacing (pitch) between the multiple processing lights EL may be changed depending on the shape of the coating film SF.

[0240] The processing apparatus 1d of the fourth modification can change the arrangement pitch of the concave structures CP1 and the convex structures CP2 that make up the riblet structure while enjoying the same effects as those enjoyed by the processing apparatus 1 described above. Therefore, a more appropriate riblet structure can be formed compared to when the arrangement pitch of the concave structures CP1 and the convex structures CP2 cannot be changed. Specifically, for example, it is possible to form a riblet structure that employs an appropriate arrangement pitch that appropriately achieves the effect of reducing friction.

[0241] At least one of the light irradiation devices 21a to 27a described with reference to Figures 18 to 24 may also be equipped with a zoom lens 1124d. In this case, too, the arrangement pitch of the concave structures CP1 and the convex structures CP2 that make up the riblet structure can be changed.

[0242] In the above description, the control device 18 changes the arrangement pitch P1 of the concave structures CP1 (i.e., the arrangement pitch of the multiple irradiation areas EA) and / or the spacing between the multiple processing lights EL by changing the projection magnification of the optical system 112d using the zoom lens 1124d. However, the control device 18 may change the arrangement pitch P1 of the concave structures CP1 (i.e., the arrangement pitch of the multiple irradiation areas EA) and / or the spacing between the multiple processing lights EL by other methods. Even when the processing device 1d includes any of the light irradiation devices 21a to 27a described above instead of the light irradiation device 11d, the control device 18 may change the arrangement pitch P1 of the concave structures CP1 (i.e., the arrangement pitch of the multiple irradiation areas EA) and / or the spacing between the multiple processing lights EL by other methods.

[0243] For example, a plane-parallel plate whose inclination angle with respect to the optical axis can be changed may be provided in each optical path of the plurality of processing light beams EL emitted from the light source system 111, and the angle of each of these plane-parallel plates may be set to a predetermined angle, thereby changing the arrangement pitch of the plurality of irradiation areas EA and / or the spacing between the plurality of processing light beams EL. At least one of the light irradiation devices 22a to 23a and 25a to 27a that irradiate the plurality of processing light beams EL may also be provided with a plane-parallel plate.

[0244] For example, if the processing apparatus 1d includes the multiple irradiation units 110b-1 shown in FIG. 27, the control device 18 may change the arrangement pitch of the multiple irradiation areas EA and / or the spacing between the multiple processing beams EL by moving the multiple irradiation units 110b-1 in a direction along the surface of the coating film SF. Specifically, the control device 18 may change the arrangement pitch of the multiple irradiation areas EA and / or the spacing between the multiple processing beams EL by moving the multiple irradiation units 110b-1 to change the arrangement spacing between the multiple irradiation units 110b-1. As a result, the arrangement pitch P1 of the recessed structures CP1 is changed. The same applies when the processing apparatus 1d includes any of the above-described light irradiation devices 22a to 23a and 25a to 27a capable of irradiating multiple processing beams EL, and any of the light irradiation devices 22a to 23a and 25a to 27a includes multiple irradiation units 110b-1 for irradiating the multiple processing beams EL.

[0245] For example, if the processing apparatus 1d includes the plurality of light sources 1111 shown in FIG. 3(b), the control device 18 may change the arrangement pitch of the plurality of irradiation areas EA and / or the spacing between the plurality of processing light beams EL by moving the plurality of light sources 1111 in a direction along the surface of the coating film SF. Specifically, the control device 18 may change the arrangement pitch of the plurality of irradiation areas EA and / or the spacing between the plurality of processing light beams EL by moving the plurality of light sources 1111 to change the arrangement spacing between the plurality of light sources 1111. As a result, the arrangement pitch P1 of the recessed structures CP1 is changed. The same applies when the processing apparatus 1d includes any of the light irradiation devices 22a to 23a and 25a to 27a described above that can irradiate a plurality of processing light beams EL, and any of the light irradiation devices 22a to 23a and 25a to 27a includes a plurality of light sources 1111 for irradiating a plurality of processing light beams EL.

[0246] For example, when the processing apparatus 1d splits the processing light EL from the single light source 1111 shown in FIG. 3(c) using a splitter 1112 and outputs the split light from multiple outlets, the control device 18 may change the arrangement pitch of the multiple irradiation areas EA and / or the spacing between the multiple processing light beams EL by changing the positions of the multiple outlets. Specifically, the control device 18 may change the arrangement pitch of the multiple irradiation areas EA and / or the spacing between the multiple processing light beams EL by changing the arrangement spacing between the multiple outlets. As a result, the arrangement pitch P1 of the recessed structures CP1 is changed. The same applies when the processing apparatus 1d includes any of the light irradiation devices 22a to 23a and 25a to 27a described above that can irradiate multiple processing light beams EL, and the processing light EL from the single light source 1111 is split by a splitter 1112 so that any of the light irradiation devices 22a to 23a and 25a to 27a irradiates multiple processing light beams EL.

[0247] For example, if the processing apparatus 1d is equipped with the light irradiation device 22a having the mirror array 222a, the control device 18 may change the arrangement pitch of the multiple irradiation areas EA and / or the spacing between the multiple processing lights EL by controlling the tilt angle of each mirror M of the mirror array 2221a to change the position (particularly the position around the Y axis) of the reflecting surface of each mirror M. For example, if the mirror array 2221a is equipped with multiple mirrors M arranged in a matrix on the XY plane, the control device 18 may change the arrangement pitch of the multiple irradiation areas EA arranged along the X axis direction and / or the spacing between the multiple processing lights EL by controlling the tilt angle of each mirror M in units of a group of mirrors M arranged along the Y axis direction.

[0248] For example, if the processing apparatus 1d includes a light irradiation device 11d-1 capable of changing the relative angles of the processing light beams EL, the control device 18 may change the arrangement pitch of the multiple irradiation areas EA and / or the spacing between the multiple processing light beams EL by changing the relative angles of the multiple processing light beams EL. Specifically, FIG. 48(a) shows the relative angles of the multiple processing light beams EL in a first angle state, and FIG. 48(b) shows the relative angles of the multiple processing light beams EL in a second angle state different from the first angle state. As shown in FIGS. 48(a) and 48(b), when the relative angles of the multiple processing light beams EL change, the angles at which the multiple processing light beams EL are incident on the coating film SF change. On the other hand, even if the relative angles of the multiple processing light beams EL change, the emission points of the multiple processing light beams EL remain unchanged within the light source system of the light irradiation device 11d-1. As a result, when the relative angles of the multiple processing light beams EL change, the arrangement pitch of the multiple irradiation areas EA changes, as shown in FIGS. 48(c) and 48(d). Specifically, as shown in FIG. 48(c), when the relative angles of the multiple processing light beams EL are in a first angle state, the arrangement pitch of the multiple irradiation areas EA is a third pitch Pe3. On the other hand, as shown in FIG. 48(d), when the relative angles of the multiple processing light beams EL are in a second angle state, the arrangement pitch of the multiple irradiation areas EA is a fourth pitch Pe4 that is larger than the third pitch Pe3. As a result, the arrangement pitch P1 of the recessed structures CP1 is changed. Note that the light irradiation device 11d-1 may be a light irradiation device provided with an optical member for changing the relative angles of the multiple processing light beams EL for any one of the above-described light irradiation device 11, light irradiation devices 22a to 23a, and 25a to 27a that can irradiate multiple processing light beams EL.

[0249] For example, if the processing apparatus 1d includes the light irradiation apparatus 11d-2 that can irradiate a plurality of processing light beams EL that are non-parallel to each other onto the coating film SF, the control apparatus 18 can change the relative positional relationship (the distance between the light irradiation apparatus 11d-2 and the coating film SF) in the direction intersecting the surface of the coating film SF (in the example shown in FIGS. 49(a) and 49(b), the Z-axis direction), so as to change the arrangement pitch of the plurality of irradiation regions EA and / or the interval between the plurality of processing light beams EL. Specifically, as shown in FIG. 49(a), when the distance between the light irradiation apparatus 11d-2 and the coating film SF in the Z-axis direction is D5, the arrangement pitch of the plurality of irradiation regions EA is the fifth pitch Pe5. Thereafter, as shown in FIG. 49(b), as a result of the light irradiation apparatus 11d-2 being moved along the Z-axis away from the coating film SF by the drive system 12, when the distance between the light irradiation apparatus 11d-2 and the coating film SF in the Z-axis direction becomes D6 (where D5 < D6), the arrangement pitch of the plurality of irradiation regions EA becomes the sixth pitch Pe6 that is larger than the fifth pitch Pe5. As a result, the arrangement pitch P1 of the concave structure CP1 is changed. Incidentally, the light irradiation apparatus 11d-2 may be a light irradiation apparatus provided with an optical member for irradiating a plurality of processing light beams EL that are non-parallel to each other, with respect to any one of the above-described light irradiation apparatuses 11 and light irradiation apparatuses 22a to 23a and 25a to 27a that can irradiate a plurality of processing light beams EL.

[0250] For example, if the processing apparatus 1d includes multiple light sources 1111 each capable of emitting processing light EL, the control device 18 may change the arrangement pitch of the multiple irradiation areas EA and / or the spacing between the multiple processing light EL by changing the number of light sources 1111 that actually emit the processing light EL. Specifically, in the example shown in FIG. 50(a), six of the multiple light sources 1111 are selected as the light sources 111 that emit the processing light EL. In this case, the six light sources 1111 emit the processing light EL, and the other light sources 1111 do not emit the processing light EL. Alternatively, the other light sources 1111 may also emit the processing light EL, but the emitted processing light EL is blocked and not irradiated onto the coating film SF. In this case, as shown in FIG. 50(b), the arrangement pitch of the multiple irradiation areas EA is a seventh pitch Pe7. On the other hand, in the example shown in FIG. 50(c), three light sources 1111 of the multiple light sources 1111 (particularly, the three light sources 1111 selected every other one of the six light sources 1111 selected in the example shown in FIG. 50(a)) are selected as the light sources 111 that emit the processing light EL. In this case, as shown in FIG. 50(d), the arrangement pitch of the multiple irradiation areas EA is an eighth pitch Pe8 that is larger than (for example, twice) the seventh pitch Pe7. As a result, the arrangement pitch P1 of the recessed structures CP1 is changed. The same applies when the processing device 1d is equipped with any of the above-mentioned light irradiation devices 22a to 23a and 25a to 27a that can irradiate multiple processing lights EL, and any of the light irradiation devices 22a to 23a and 25a to 27a is equipped with multiple light sources 1111 to irradiate multiple processing lights EL.

[0251] Alternatively, in addition to or instead of changing the arrangement pitch of the plurality of irradiation areas EA (i.e., changing the relative positional relationship of the plurality of irradiation areas EA), the control device 18 may change the arrangement pitch of the concave structures CP1 and / or the spacing between the plurality of processing light beams EL by other methods. For example, a shutter may be provided in the optical path of each of the plurality of processing light beams EL emitted from the light source system 111.

[0252] For example, if the processing apparatus 1d includes a light irradiation device 21a that forms interference fringes on the surface of the coating film SF by causing interference between the first branched light EL1 and the second branched light EL2 shown in FIG. 18 described above, the control device 18 may change the arrangement pitch P1 of the recessed structures CP1 by changing the angle at which the first branched light EL1 and the second branched light EL intersect (i.e., the relative angle between the first branched light EL1 and the second branched light EL). Specifically, in the example shown in FIG. 51(a), the angle at which the first branched light EL1 and the second branched light EL intersect is a first angle θ1. In this case, as shown in FIG. 51(b), the pitch of the interference fringes formed on the surface of the coating film SF is a ninth pitch Pe9. On the other hand, in the example shown in FIG. 51(c), the angle at which the first branched light EL1 and the second branched light EL intersect is a second angle θ2 that is different from the first angle θ1. 51(d), the pitch of the interference fringes formed on the surface of the coating film SF is a tenth pitch Pe10, which is different from the ninth pitch Pe9, and as a result, the arrangement pitch P1 of the concave structures CP1 is changed.

[0253] However, in order to change the angle at which the first branched light EL1 and the second branched light EL intersect, the processing apparatus 1d includes, instead of the light irradiation device 21a, a light irradiation device 11d-3 including an angle adjustment element 2127d for adjusting the angle at which the first branched light EL1 and the second branched light EL intersect, as shown in FIG. 52. The angle adjustment element 2127d can adjust the relative angle of the first branched light EL1 with respect to the second branched light EL2 by synchronously moving the light exit 2123a and the projection optical system 2125a. Furthermore, in addition to or instead of synchronously moving the light exit 2123a and the projection optical system 2125a, the angle adjustment element 2127d may be able to adjust the relative angle of the second branched light EL2 with respect to the first branched light EL1 by synchronously moving the light exit 2124a and the focusing optical system 2126a. Therefore, the angle adjusting element 2127d can change the angle at which the first split light EL1 and the second split light EL intersect.

[0254] For example, when the arrangement pitch of the plurality of irradiation areas EA and / or the spacing between the plurality of processing light beams EL are changed, the intensity distribution of the plurality of processing light beams EL on the surface of the coating film SF changes. Therefore, changing the arrangement pitch of the plurality of irradiation areas EA and / or the spacing between the plurality of processing light beams EL is equivalent to controlling the intensity distribution of the plurality of processing light beams EL on the surface of the coating film SF. Similarly, when the pitch of the interference fringes formed on the surface of the coating film SF by the interference between the first branched light EL1 and the second branched light EL2 is changed, the intensity distribution of the plurality of processing light beams EL on the surface of the coating film SF changes. Therefore, changing the angle at which the first branched light EL1 and the second branched light EL2 intersect is equivalent to controlling the intensity distribution of the plurality of processing light beams EL on the surface of the coating film SF. Therefore, the control device 18 may control the intensity distribution of the plurality of processing light beams EL on the surface of the coating film SF (or the intensity distribution of the plurality of processing light beams EL in a plane along the surface of the coating film SF) in addition to or instead of changing the arrangement pitch P1 of the concave structures CP1 and / or the spacing between the plurality of processing light beams EL. In this case, the optical system 112 may include an intensity distribution adjusting element for adjusting the intensity distribution of the plurality of processing light beams EL under the control of the control device 18. The intensity distribution adjusting element may be, for example, a spatial light modulator capable of spatially modulating the processing light beam EL. Therefore, if the processing device 1d includes a light irradiation device 24a (see FIG. 21) including a spatial light modulator, the control device 18 may control the spatial light modulator to change the intensity distribution of the plurality of processing light beams EL.

[0255] In the above description, the control device 18 changes at least one of the following: the arrangement pitch of the irradiation areas EA and / or the spacing between the multiple processing light beams EL, the angle at which the first branched light beam EL1 and the second branched light beam EL intersect, and the intensity distribution of the multiple processing light beams EL on the surface of the coating film SF, in order to change the arrangement pitch P1 of the recessed structures CP1. However, the control device 18 may also change at least one of the arrangement pitch of the irradiation areas EA and / or the spacing between the multiple processing light beams EL, the angle at which the first branched light beam EL1 and the second branched light beam EL intersect, and the intensity distribution of the multiple processing light beams EL on the surface of the coating film SF, in order to maintain the arrangement pitch P1 of the recessed structures CP1 (i.e., to prevent fluctuations in the arrangement pitch P1). Specifically, as described above, the processing device 1d scans the unit processing areas SA with the multiple processing light beams EL via the galvanometer mirror 1122. Here, strictly speaking, the optical path length of the processing light EL from the galvanometer mirror 1122 to the center of the unit processing area SA is different from the optical path length of the processing light EL from the galvanometer mirror 1122 to the edge of the unit processing area SA. Therefore, the arrangement pitch of the multiple irradiation areas EA in the center of the unit processing area SA may not match the arrangement pitch of the multiple irradiation areas EA at the edge of the unit processing area SA. Alternatively, as described above, because the workpiece S is an aircraft fuselage or the like, the surface of the coating film SF is likely to be curved, uneven, or inclined. In this case, too, strictly speaking, the optical path length of the processing light EL from the galvanometer mirror 1122 to a certain portion of the unit processing area SA is different from the optical path length of the processing light EL from the galvanometer mirror 1122 to another portion of the unit processing area SA. Therefore, the arrangement pitch of the multiple irradiation areas EA in a certain portion of the unit processing area SA may not match the arrangement pitch of the multiple irradiation areas EA in another portion of the unit processing area SA. As a result, in a situation where it is desired to form recessed structures CP1 with the same arrangement pitch P1 in the unit processing area SA, the arrangement pitch P1 of the recessed structures CP1 formed in one part of the unit processing area SA may unintentionally become mismatched with the arrangement pitch P1 of the recessed structures CP1 formed in another part of the unit processing area SA.Therefore, the control device 18 may change at least one of the arrangement pitch of the irradiation area EA, the angle at which the first branched light EL1 and the second branched light EL intersect, and the intensity distribution of the plurality of processing light beams EL on the surface of the coating film SF so as to offset such unintended variation in the arrangement pitch P1 of the concave structures CP1. As a result, the unintended variation in the arrangement pitch P1 of the concave structures CP1 is offset, and concave structures CP1 having the same arrangement pitch P1 can be appropriately formed.

[0256] (4-5) Fifth Modification The processing device 1d of the fourth modified example described above changes the characteristics of the processing light EL (for example, at least one of the relative positional relationship between the multiple irradiation areas EA, the angle at which the first branched light EL1 and the second branched light EL2 intersect, and the intensity distribution of the multiple processing light EL on the coating film SF) in order to change the arrangement pitch P1 of the recessed structures CP1 that make up the riblet structure. On the other hand, the processing device e of the fifth modified example changes any characteristic of the processing light EL in order to change any characteristic of the riblet structure. As described in the third modified example, examples of "any characteristic of the riblet structure" in the fifth modified example include the presence or absence of a riblet structure, the shape of the riblet structure (for example, at least one of the cross-sectional shape of the concave structure CP1 and the cross-sectional shape of the concave structure CP1), the size of the riblet structure (for example, at least one of the depth D of the concave structure CP1, the width of the concave structure CP1, the arrangement pitch P1 of the concave structure CP1, the height H of the convex structure CP2, the width of the convex structure CP2, and the arrangement pitch P2 of the convex structure CP2), and the position of the riblet structure (for example, the position of at least one of the concave structure CP1 and the convex structure CP2). Therefore, as shown in FIG. 53, the processing apparatus 1e differs from the above-described processing apparatus 1 in that it is equipped with a characteristic adjustment device 41e for adjusting the characteristics of the processing light EL. The processing apparatus 1e may include a characteristic adjustment device 41e separate from the light irradiation device 11, or may include a characteristic adjustment device 41e incorporated into the light irradiation device 11 (i.e., constituting a part of the light irradiation device 11). Other features of the processing apparatus 1e may be the same as other features of the processing apparatus 1.

[0257] The control device 18 may change any characteristic of the processing light EL so as to change any characteristic of the riblet structure to form a more appropriate riblet structure. For example, the control device 18 may change any characteristic of the processing light EL so as to change any characteristic of the riblet structure to form an appropriate riblet structure that appropriately obtains the effect of reducing friction.

[0258] The characteristics of the multiple processing lights EL may include the intensity distribution of the multiple processing lights EL on the surface of the coating film SF. That is, the control device 18 may control the characteristic adjustment device 41e to change the intensity distribution of the multiple processing lights EL on the surface of the coating film SF. When the intensity distribution of the multiple processing lights EL on the surface of the coating film SF changes, the characteristics of the recessed structures CP1 (particularly, at least one of the shape, position, etc.) change. As a result, the characteristics of the riblet structures formed from such recessed structures CP1 (particularly, at least one of the shape, position, etc.) change. For example, when multiple processing lights EL having a first intensity distribution shown in FIG. 54(a) are irradiated onto the surface of the coating film SF, the recessed structures CP1 shown in FIG. 54(b) are formed. On the other hand, when multiple processing lights EL having a second intensity distribution different from the first intensity distribution shown in FIG. 54(c) are irradiated onto the surface of the coating film SF, the recessed structures CP1 shown in FIG. 54(d) are formed, which have characteristics different from the recessed structures CP1 shown in FIG. 54(b).

[0259] The characteristics of the multiple processing beams EL may include the shapes of the multiple irradiation areas EA. That is, the control device 18 may control the characteristic adjustment device 41e to change the shapes of the multiple irradiation areas EA. When the shapes of the multiple irradiation areas EA change, the characteristics of the recessed structure CP1 (particularly, at least one of the shape, position, etc.) change. As a result, the characteristics of the riblet structure formed from such a recessed structure CP1 (particularly, at least one of the shape, position, etc.) change. For example, when multiple processing beams EL are irradiated onto multiple irradiation areas EA having a first shape shown in FIG. 55(a), the recessed structure CP1 shown in FIG. 55(b) is formed. On the other hand, when multiple processing beams EL are irradiated onto multiple irradiation areas EA having a second shape different from the first shape shown in FIG. 55(c), the recessed structure CP1 shown in FIG. 55(d) is formed, which has characteristics different from the recessed structure CP1 shown in FIG. 55(b).

[0260] The characteristics of the multiple processing beams EL may include the sizes of the multiple irradiation areas EA. That is, the control device 18 may control the characteristic adjustment device 41e to change the sizes of the multiple irradiation areas EA. When the sizes of the multiple irradiation areas EA change, the characteristics of the recessed structure CP1 (particularly, at least one of the shape, position, etc.) change. As a result, the characteristics of the riblet structure formed from such a recessed structure CP1 (particularly, at least one of the shape, position, etc.) change. For example, when multiple processing beams EL are irradiated onto multiple irradiation areas EA having a first size shown in FIG. 56(a), the recessed structure CP1 shown in FIG. 51(b) is formed. On the other hand, when multiple processing beams EL are irradiated onto multiple irradiation areas EA having a second size smaller than the first size shown in FIG. 56(c), the recessed structure CP1 shown in FIG. 56(d) is formed, which is narrower in width than the recessed structure CP1 shown in FIG. 56(b).

[0261] The characteristics of the multiple processing lights EL may include the intensities of the multiple processing lights EL. That is, the control device 18 may control the characteristic adjustment device 41e to change the intensities of the multiple processing lights EL. When the intensities of the multiple processing lights EL change, the characteristics (particularly, shape, etc.) of the concave structure CP1 change. Specifically, the greater the intensities of the multiple processing lights EL, the greater the energy applied to the coating film SF by irradiation with the multiple processing lights EL, and therefore more of the coating film SF is removed. Therefore, the greater the intensities of the multiple processing lights EL, the greater the depth of the formed concave structure CP1. As a result, the characteristics (particularly, shape, etc.) of the riblet structure formed from such a concave structure CP1 change. For example, when multiple processing lights EL having a first intensity shown in FIG. 57(a) are irradiated, the concave structure CP1 shown in FIG. 57(b) is formed. On the other hand, for example, when multiple processing light EL having a second intensity greater than the first intensity shown in Figure 57(c) is irradiated, a concave structure CP1 shown in Figure 57(d) is formed that is deeper than the concave structure CP1 shown in Figure 57(b).

[0262] The characteristics of the multiple processing light beams EL may include the irradiation times of the multiple processing light beams EL. That is, the control device 18 may control the characteristic adjustment device 41e to change the irradiation times of the multiple processing light beams EL. When the irradiation times of the multiple processing light beams EL change, the characteristics (particularly, shape, etc.) of the concave structure CP1 change. Specifically, the longer the irradiation times of the multiple processing light beams EL, the greater the energy applied to the coating film SF by irradiation with the multiple processing light beams EL, and therefore, more of the coating film SF is removed. Therefore, the longer the irradiation times of the multiple processing light beams EL, the greater the depth of the formed concave structure CP1. As a result, the characteristics (particularly, shape, etc.) of the riblet structure formed from such a concave structure CP1 change.

[0263] The characteristics of the multiple processing lights EL may include the polarization states of the multiple processing lights EL (for example, at least one of s-polarized or p-polarized light, and circularly polarized, linearly polarized, or elliptically polarized light). That is, the control device 18 may control the characteristic adjustment device 41e to change the polarization states of the multiple processing lights EL. When the polarization states of the multiple processing lights EL change, the degree of absorption of the multiple processing lights EL by the coating film SF may change. As a result, the energy applied to the coating film SF by irradiation with the multiple processing lights EL may change, and the characteristics (particularly, shape, etc.) of the multiple concave structures CP1 may change. As a result, the characteristics (particularly, shape, etc.) of the riblet structure formed from such concave structures CP1 may change.

[0264] The characteristics of the multiple processing lights EL may include the wavelengths of the multiple processing lights EL. That is, the control device 18 may control the characteristic adjustment device 41e to change the wavelengths of the multiple processing lights EL. When the wavelengths of the multiple processing lights EL change, the degree of absorption of the multiple processing lights EL by the coating film SF may change. As a result, the energy applied to the coating film SF by irradiation with the multiple processing lights EL may change, and the characteristics (particularly, shape, etc.) of the multiple recessed structures CP1 may change. As a result, the characteristics (particularly, shape, etc.) of the riblet structure formed from such recessed structures CP1 may change.

[0265] The control device 18 may change the characteristics of the multiple processing lights EL when the multiple processing lights EL are irradiated onto the coating film SF (i.e., when the multiple processing lights EL are moving relative to the coating film SF). As a result, a series of recessed structures CP1 extending in a certain direction will have a portion having a first characteristic and a portion having a second characteristic different from the first characteristic. For example, as shown in Figures 58(a) to 58(c), a series of recessed structures CP1 extending in a certain direction will have a portion having a first shape (see Figure 53(b), which is a cross-sectional view taken along line I-I' in Figure 58(a)) and a portion having a second shape different from the first shape (see Figure 58(c), which is a cross-sectional view taken along line II-II' in Figure 58(a)). In other words, the cross-sectional shape of the recessed structures CP1 changes along the extension direction of the recessed structures CP1. Alternatively, for example, as shown in Figures 59(a) to 59(c), a series of concave structures CP1 extending in a certain direction will have a portion having a first width (see Figure 54(b), which is a cross-sectional view taken along II-I' in Figure 59(a)) and a portion having a second width different from the first width (see Figure 59(c), which is a cross-sectional view taken along II-II' in Figure 59(a)). In other words, the width of the concave structures CP1 changes along the extension direction of the concave structures CP1.

[0266] The processing device 1e of the fifth modified example can change the characteristics of the riblet structure while enjoying the same effects as those enjoyed by the processing device 1 described above. Therefore, a more appropriate riblet structure can be formed compared to when the characteristics of the riblet structure cannot be changed. Specifically, for example, it is possible to form a riblet structure having appropriate characteristics that provide an appropriate friction reduction effect.

[0267] (4-6) Sixth Modification Next, a processing apparatus 1f of a sixth modified example will be described with reference to Figure 60. In the above description, the end 144 of the support device 14 is capable of contacting the surface of the coating film SF. In other words, the support device 14 supports the storage device 13 (and further the light irradiation device 11 supported by the storage device 13) while being in contact with the coating film SF. On the other hand, as shown in Figure 60, the processing apparatus 1f of the sixth modified example differs from the above-described processing apparatus 1 in that it is equipped with a support device 14f that does not contact the surface of the coating film SF instead of such a support device 14. Other features of the processing apparatus 1f may be the same as other features of the processing apparatus 1.

[0268] Because the support device 14f does not contact the surface of the coating film SF, the support device 14 supports the storage device 13 (and further the light irradiation device 11 supported by the storage device 13; the same applies hereinafter in the sixth modified example) without contacting the coating film SF. The support device 14f is supported by a support frame (or any support member, etc.) Ff that is separated from the coating film SF (and further the workpiece S). The support device 14f supports the storage device 13 while in contact with the support frame Ff.

[0269] The support device 14f includes a beam member 141, similar to the support device 14. Furthermore, the support device 14f includes a plurality of pillar members 142f arranged on the beam member 141, instead of the plurality of leg members 142 included in the support device 14. The pillar members 142f are rod-shaped members extending from the beam member 141 toward the +Z side. An end 144f (the end on the +Z side in the example shown in FIG. 60) of the leg member 142f is capable of coming into contact with the support frame Ff. Similar to the end 144 of the leg member 142, the end 144f is capable of being attached to the support frame Ff while in contact with the support frame Ff.

[0270] Like the leg member 142, the pillar member 142f is a member that can be extended and contracted along the Z axis by the drive system 15. That is, the state of the pillar member 142f can be switched between a third extended state in which the pillar member 142f extends along the Z axis, making the length in the Z axis direction relatively long, and a third contracted state in which the pillar member 142f contracts along the Z axis, making the length in the Z axis direction relatively short. Like the leg member 142, the state of the pillar member 142f can be switched between the third extended state and the third contracted state when the support device 14f moves. When the pillar member 142f is in the third extended state, the end 144f of the pillar member 142f can come into contact with the support frame Ff. On the other hand, when the pillar member 142f is in the third contracted state, the end 144f does not come into contact with the support frame Ff. That is, when the pillar member 142f is in the third contracted state, the end 144f is separated from the support frame Ff on the -Z side. Therefore, movement of the support device 14f is not hindered by contact between the end 144f of the pillar member 142f and the support frame Ff. The pillar member 142f may be attached to an overhead crane that is movable along at least one of the X-axis and the Y-axis. The support device 14f may also be at least one of a crane and a robot arm.

[0271] The processing device 1f of the sixth modified example can achieve the same effects as those that can be achieved by the processing device 1 described above.

[0272] However, in the processing apparatus 1f, the support device 14f and the coating film SF are not in contact with each other, so the support device 14f and the coating film SF are vibrationally separated. Because the support device 14f supports the light irradiation device 11, the light irradiation device 11 and the coating film SF are vibrationally separated. Therefore, if the coating film SF moves relative to the light irradiation device 11 due to vibration or other factors, the irradiation position of the processing light EL from the light irradiation device 11 on the surface of the coating film SF (i.e., the position of the irradiation area EA) may shift from the original irradiation position. In other words, the relative positional relationship between the coating film SF and the irradiation area EA may change. Therefore, in the sixth modified example, the control device 18 moves the irradiation area EA relative to the support device 14f based on at least one of the vibration state of the coating film SF relative to the support device 14f and the relative positional relationship of the coating film SF relative to the support device 14f so that the relative position of the irradiation area EA to the coating film SF does not change. When the coating film SF vibrates (or moves) relative to the support device 14f, the relative positional relationship between the coating film SF and the irradiation area EA changes, so the control device 18 changes the relative position of the irradiation area EA with respect to the coating film SF based on the relative positional relationship between the coating film SF and the irradiation area EA so that the relative positional relationship of the irradiation area EA with respect to the coating film SF is maintained constant.

[0273] For this reason, the processing device 14f is equipped with a vibration measuring device 51f that measures the vibration state of the coating film SF relative to the support device 14f. The vibration measuring device can be an optical measuring device using various measurement principles, such as moire topography using a grating projection method or a grating projection method, holographic interferometry, autocollimation, stereo, astigmatism, critical angle, or knife-edge method. The processing device 14f may also be equipped with a vibration measuring device equipped with a displacement meter, a speedometer, or an accelerometer that measures its own vibration state. Based on the measurement results of the vibration measuring device 51f, the control device 18 changes the position of the irradiation area EA relative to the support device 14f so that the position of the irradiation area EA relative to the coating film SF does not change even if the coating film SF vibrates relative to the support device 14f. Here, if the coating film SF moves a certain distance in a certain direction relative to the support device 14f due to vibration, while the irradiation area EA remains stationary relative to the support device 14f, the coating film SF will move a certain distance in a certain direction relative to the irradiation area EA. In other words, on the surface of the coating film SF, the irradiation area EA will move a certain distance in a different direction opposite to the certain direction relative to the coating film SF. Therefore, in order to maintain the relative position of the irradiation area EA relative to the coating film SF, it is necessary to move the irradiation area EA in the same manner as the coating film SF. In other words, if the irradiation area EA moves a certain distance in a certain direction in accordance with the movement of the coating film SF, the position of the irradiation area EA relative to the coating film SF will not change. More specifically, if the irradiation area EA moves a certain distance in a certain direction relative to the support device 14f, the position of the irradiation area EA relative to the coating film SF will not change. Therefore, the control device 18 moves the irradiation area EA relative to the support device 14f in the same direction as the movement direction of the coating film SF relative to the support device 14f by the same amount as the movement amount of the coating film SF relative to the support device 14f. The movement of the irradiation area EA may be realized by moving the light irradiation device 11 using the drive system 12, or may be realized by moving and / or controlling the attitude of at least one optical member included in the light irradiation device 11 (for example, controlling the rotational state of the galvanometer mirror 1122), or may be realized by other methods.

[0274] Incidentally, even in the above-described processing apparatus 1 etc. in which the support device 14 and the coating film SF are capable of contacting each other, there is a possibility that the vibration state of the support device 14 does not match the vibration state of the coating film SF. For this reason, also in the above-described processing apparatus 1 etc., the control device 18 may move the irradiation area EA relative to the support device 14f based on the vibration state of the coating film SF relative to the support device 14f (i.e., the relative position of the coating film SF relative to the support device 14f) so that the relative position of the irradiation area EA to the coating film SF does not change.

[0275] (4-7) Seventh Modification Next, a processing apparatus 1g of a seventh modified example will be described with reference to Fig. 61. The processing apparatus 1 described above is capable of moving the light irradiation device 11 relative to the coating film SF by the drive systems 12 and 15 without moving the workpiece SF. On the other hand, the processing apparatus 1g of the seventh modified example differs from the processing apparatus 1 described above in that it is capable of moving the coating film SF (i.e., the workpiece SF) relative to the light irradiation device 11 without moving the light irradiation device 11. Other features of the processing apparatus 1g may be the same as other features of the processing apparatus 1.

[0276] In order to move the workpiece SF, the processing apparatus 1g is equipped with a stage 61g. The stage 61g is supported from the -Z side by a surface plate 62g. The stage 61g is housed in the accommodation space SP. The stage 61g is arranged to face the light irradiation device 11. The stage 61g can hold the workpiece S so that the coating film SF faces the light irradiation device 11. The stage 61g can hold the workpiece S so that multiple processing lights EL from the light irradiation device 11 are irradiated onto the coating film SF. The stage 61g can release the held workpiece S.

[0277] The stage 61g is movable by a drive system 63g. The stage 61g is movable while holding the workpiece S. The stage 61g is movable relative to the light irradiation device 11. The stage 61g is movable relative to the irradiation area EA onto which multiple processing lights EL are irradiated from the light irradiation device 11. The drive system 63g moves the stage 61g under the control of the control device 18 so as to change the relative positional relationship between the light irradiation device 11 and the coating film SF (i.e., the relative positional relationship between the irradiation area EA and the coating film SF). The drive system 63g may move the stage 61g along at least one of the X-axis and the Y-axis. As a result, the irradiation area EA moves along at least one of the X-axis and the Y-axis on the coating film SF. The drive system 63g may move the stage 61g along the Z-axis. The driving system 63g may move the stage 61g along at least one of the X-axis, Y-axis, and Z-axis, as well as at least one of the θX direction, θY direction, and θZ direction.

[0278] Movement of the stage 61g moves the workpiece S relative to the light irradiation device 11, and therefore the coating film SF moves relative to the storage device 13 (particularly, the end 134 of the partition member 132) and the support device 14 (particularly, the end 144 of the leg member 142). Therefore, if the stage 61g moves with at least one of the ends 134 and 144 in contact with the coating film SF, the movement of the stage 61g (i.e., the movement of the workpiece S) may be hindered by the contact between at least one of the ends 134 and 144 and the coating film SF. Therefore, in the seventh modification, the ends 134 and 144 do not come into contact with the coating film SF. In this case, the end 134 comes into contact with, for example, the surface plate 62g. As a result, the storage device 13 cooperates with the surface plate 62g to maintain the sealing of the storage space SP. Furthermore, the end 144 also comes into contact with, for example, the surface plate 62g. As a result, the support device 14 can stand on its own on the surface plate 62g. That is, the support device 14 supports the accommodation device 13 with the end portion 144 in contact with the surface plate 62g.

[0279] In the seventh modified example, the light irradiation device 11 does not need to be moved, and therefore the processing apparatus 1g does not need to include the drive system 12 that moves the light irradiation device 11 and the drive system 15 that moves the support device 15. However, the processing apparatus 1g may move the light irradiation device 11 in the same manner as the processing apparatus 1 described above, and in that case, may include at least one of the drive systems 12 and 15.

[0280] The processing apparatus 1g of the seventh modification can change the relative position between the coating film SF and the irradiation area EA by moving the stage 61g (i.e., moving the workpiece S), whereas the above-described processing apparatus 1 requires the movement of the light irradiation device 11. Furthermore, the processing apparatus 1g can also change the relative position between the coating film SF and the irradiation area EA by moving the stage 61g (i.e., moving the workpiece S), whereas the above-described processing apparatus 1 requires the rotation of the galvanometer mirror 1122. Therefore, the processing apparatus 1g can also achieve the same effects as the processing apparatus 1. That is, by moving the stage 61g to move the workpiece S, the processing apparatus 1g can alternately repeat a scanning operation in which multiple processing beams EL scan the surface of the coating film SF along the Y axis (i.e., moving multiple irradiation areas EA along the Y axis) and a stepping operation in which mul...

Claims

1. a light irradiation device that irradiates a surface of an object with a plurality of processing lights from an irradiation optical system; a change device that changes each of the focusing positions of the plurality of processing beams in a direction intersecting a surface of the object; a moving device that relatively moves the plurality of processing beams from the light irradiation device and the object in a direction along a surface of the object; Control device and Equipped with The control device includes: Controlling the moving device to relatively move the plurality of processing beams and the object; setting a plurality of regions on the surface of the object based on a three-dimensional shape of the surface of the object; By controlling the light irradiation device, the change device, and the movement device, the processing light is irradiated onto one of the plurality of regions on the surface of the object, thereby changing thicknesses of a plurality of locations on the surface of the object in the one region; The plurality of regions are set such that, when a focusing position of each of the plurality of processing lights in the intersecting direction of the plurality of processing lights is changed, the focusing position of each of the plurality of processing lights can be positioned on one of the plurality of regions on the surface. Processing equipment.

2. The light collecting position when the plurality of processing beams are irradiated to the one region is different from the light collecting position when the plurality of processing beams are irradiated to a region among the plurality of regions that is different from the one region. The processing device according to claim 1 .

3. a light irradiation device that irradiates a surface of an object with a plurality of processing lights from an irradiation optical system; a change device that changes a state of an image plane of the irradiation optical system to change each of the focusing positions of the plurality of processing beams in a direction intersecting a surface of the object; a moving device that relatively moves the plurality of processing beams from the light irradiation device and the object in a direction along a surface of the object; Control device and Equipped with The control device Controlling the moving device to relatively move the plurality of processing beams and the object; setting a plurality of regions on the surface of the object based on a three-dimensional shape of the surface of the object; By controlling the light irradiation device, the change device, and the movement device, the processing light is irradiated onto one of the plurality of regions on the surface of the object, thereby changing thicknesses of a plurality of locations on the surface of the object in the one region; The plurality of regions are set so that one of the plurality of regions can be positioned within a range of a focal depth of the irradiation optical system when a state of the image plane of the irradiation optical system is changed. Processing equipment.

4. When the one region is within the range of the depth of focus, the other region is outside the range of the depth of focus. The processing apparatus according to claim 3.

5. The one region among the plurality of regions on the surface and a region other than the one region on the surface have different inclinations with respect to the optical axis of the irradiation optical system.

5. A processing device according to any one of claims 1 to 4.

6. The inclination of the image plane of the irradiation optical system when the processing light is irradiated onto the one region is different from the inclination of the image plane of the irradiation optical system when the processing light is irradiated onto the different region. A processing device according to any one of claims 1 to 5.

7. In a direction intersecting the surface of the object, a position of an image plane of the irradiation optical system when the processing light is irradiated onto the one region is different from a position of an image plane of the irradiation optical system when the processing light is irradiated onto the different region.

7. A processing device according to any one of claims 1 to 6.

8. The one region and the different region are adjacent to each other.

8. Processing device according to any one of claims 2 and 4 to 7.

9. The control device controls the light irradiation device, the change device, and the movement device to process the plurality of regions on the surface of the object with the processing light in sequence. A processing device according to any one of claims 1 to 8.

10. The control device controls the light irradiation device, the change device, and the movement device to scan the plurality of processing lights in a first direction in one of the plurality of regions to process the one region, and then scan the plurality of processing lights in the first direction in a region adjacent to the one region in a second direction intersecting the first direction to process the adjacent region.

10. Processing device according to any one of claims 1 to 9.

11. The surface is non-planar. A processing device according to any one of claims 1 to 10.

12. The control device controls the change device to change the relative positional relationship of the focused positions of the plurality of processing beams in a direction intersecting with the surface of the object, while controlling the movement device to relatively move the plurality of processing beams and the object. A processing device according to any one of claims 1 to 11.

13. The control device controls the change device to change the focusing positions of the plurality of processing beams in a direction intersecting the surface of the object independently. The processing device according to claim 12.

14. The adjustment device includes a plurality of focus optical systems that adjust the focusing positions of the plurality of processing beams, respectively. The processing device according to claim 13.

15. The control device controls the change device to change the relative positional relationship between the focusing positions of the plurality of processing beams based on the shape of the surface of the object. The processing device according to any one of claims 12 to 14.

16. The control device controls the change device to change the relative positional relationship between the focusing positions of the plurality of processing beams so that the focusing positions of the plurality of processing beams are set on the surface of the object. The processing device according to claim 15.

17. The light irradiation device irradiates the plurality of processing beams via the irradiation optical system, The control device controls the change device to change the relative positional relationship between the focusing positions of the plurality of processing beams and the object so that the surface of the object is located within a range of the focal depth of the irradiation optical system. The processing device according to claim 15.

18. The light irradiation device irradiates the plurality of processing beams via the irradiation optical system, The control device controls the change device to change at least one of a position and a posture of one or more optical members constituting the irradiation optical system so as to change a relative positional relationship between the focusing positions of the plurality of processing beams.

18. The processing device according to any one of claims 12 to 17.

19. The apparatus further includes a measurement device for measuring a three-dimensional shape of a surface of the object, The control device controls the change device using an output from the measurement device to change the relative positional relationship between the focusing positions of the plurality of processing beams.

19. The processing device according to any one of claims 15 to 18.

20. The control device controls the change device to change the relative positional relationship of the focusing position when the processing light is irradiated onto the surface of the object.

20. The processing device according to any one of claims 12 to 19.

21. The modification device modifies the intensity distribution of the plurality of processing beams in a plane including an axis intersecting with a surface of the object.

21. The processing device according to any one of claims 1 to 20.

22. The method further includes a measurement device that measures a three-dimensional shape of a surface of the object, The control device sets the plurality of regions based on a measurement result of the surface of the object by the measurement device.

22. Processing device according to any one of claims 1 to 21.

23. Irradiating a surface of an object with a plurality of processing beams from an irradiation optical system; Changing a focusing position of each of the plurality of processing beams in a direction intersecting a surface of the object; Relatively moving the plurality of processing beams from the irradiation optical system and the object in a direction along a surface of the object; setting a plurality of regions on the surface of the object based on a three-dimensional shape of the surface of the object; By irradiating one of the plurality of regions on the surface of the object with the processing light, thicknesses of a plurality of locations on the surface of the object in the one region are changed. Including, The plurality of regions are set such that, when a focusing position of each of the plurality of processing lights in the intersecting direction of the plurality of processing lights is changed, the focusing position of each of the plurality of processing lights can be positioned on one of the plurality of regions on the surface. Processing method.

24. The light collecting position when the plurality of processing beams are irradiated to the one region is different from the light collecting position when the plurality of processing beams are irradiated to a region among the plurality of regions that is different from the one region. The processing method according to claim 23.

25. Irradiating a surface of an object with a plurality of processing beams from an irradiation optical system; changing a state of an image plane of the irradiation optical system to change each of the focusing positions of the plurality of processing beams in a direction intersecting a surface of the object; Relatively moving the plurality of processing beams from the irradiation optical system and the object in a direction along a surface of the object; setting a plurality of regions on the surface of the object based on a three-dimensional shape of the surface of the object; By irradiating one of the plurality of regions on the surface of the object with the processing light, thicknesses of a plurality of locations on the surface of the object in the one region are changed. Including, The plurality of regions are set so that one of the plurality of regions can be positioned within a range of a focal depth of the irradiation optical system when a state of the image plane of the irradiation optical system is changed. Processing method.

26. When the one region is within the range of the depth of focus, the other region is outside the range of the depth of focus. The processing method according to claim 25.

27. The one region among the plurality of regions on the surface and a region other than the one region on the surface have different inclinations with respect to the optical axis of the irradiation optical system.

27. The method according to any one of claims 23 to 26.

28. The inclination of the image plane of the irradiation optical system when the processing light is irradiated onto the one region is different from the inclination of the image plane of the irradiation optical system when the processing light is irradiated onto the different region.

28. The method according to any one of claims 23 to 27.

29. The one region and the different region are adjacent to each other.

29. A method according to any one of claims 24 and 26 to 28.

30. and processing the plurality of regions on the surface of the object sequentially with the processing light.

30. The method according to any one of claims 23 to 29.

31. The irradiating includes scanning the plurality of processing lights in a first direction in one of the plurality of regions to process the one region, and then scanning the plurality of processing lights in the first direction in a region adjacent to the one region in a second direction intersecting the first direction to process the adjacent region.

31. The method according to any one of claims 23 to 30.

32. The surface is non-planar.

32. The method according to any one of claims 23 to 31.

33. Changing the focusing positions includes changing a relative positional relationship between the focusing positions of the plurality of processing beams in a direction intersecting a surface of the object while the plurality of processing beams and the object are moved relatively to each other.

33. The method according to any one of claims 23 to 32.

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