Electronic component mounting device and electronic component mounting method

Abstract

An electronic component mounting device (1) comprises: an electronic component supply unit (20) that supplies an electronic component having a bump electrode (EB); a transfer stage (31) that accumulates a flux (FX); a mounting stage (41) on which a substrate (BD) is placed; a plurality of heads that can each pick up an electronic component (CP); and a control unit (10) that controls movement of the plurality of heads. The control unit (10) is configured so as to cause each of the plurality of heads to function as a dipping head that dips the bump electrode (EB) of the electronic component (CP) into the flux (FX) accumulated on the transfer stage (31), or as a bonding head that mounts the electronic component (CP) to the substrate (BD) on the mounting stage (41) with the bump electrode (EB) interposed therebetween.

Description

[Technical field]

[0001] The present invention relates to an electronic component mounting apparatus and an electronic component mounting method. [Background technology]

[0002] In a process for mounting electronic components using the flip chip bonding method, a flux containing an oxide film remover, a surfactant, etc. is generally transferred to bump electrodes of the electronic components, and then the electronic components are soldered to a substrate.

[0003] For example, Patent Document 1 discloses an electronic component mounting device that includes a tray feeder section in which a tray containing a plurality of semiconductor devices, which are electronic components, is set in advance, a transfer stage having a flux immersion area, a motherboard positioning section that positions and holds a motherboard, and a suction unit section having a suction collet that suctions and holds the electronic components. In this electronic component mounting device, the suction unit takes out the semiconductor device from the tray using the suction collet, immerses the bump electrodes of the electronic component in flux in the flux immersion area, and then mounts the electronic component on the motherboard in the motherboard positioning section. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 4960160 Summary of the Invention [Problem to be solved by the invention]

[0005] However, according to the electronic component mounting device described in Patent Document 1, the suction collet becomes hot in order to solder the bump electrodes when mounting electronic components on a motherboard. The hot suction collet is cooled before immersing the bump electrodes in the flux in order to suppress evaporation or deterioration of the flux in the flux-immersed area, but this cooling time can affect productivity.

[0006] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method with improved productivity. [Means for solving the problem]

[0007] An electronic component mounting apparatus according to one embodiment of the present invention includes an electronic component supply unit that supplies electronic components having bump electrodes, a transfer stage that stores flux, a mounting stage on which a substrate is placed, a plurality of heads capable of picking up electronic components, and a control unit that controls the operation of the plurality of heads, and the control unit is configured to cause the plurality of heads to function as a dipping head that immerses the bump electrodes of the electronic components in the flux stored in the transfer stage, and a bonding head that mounts the electronic components via the bump electrodes on the substrate on the mounting stage.

[0008] According to this aspect, it is not necessary to cool the head, which has become hot due to the mounting process, before the immersion process in order to suppress evaporation or deterioration of the flux. By eliminating the cooling time for the head, it is possible to shorten the time required to mount electronic components on a board, and it is possible to provide an electronic component mounting apparatus with improved productivity.

[0009] In the above aspect, the control unit may perform control so that the maximum temperature during operation of the dipping head is lower than the minimum temperature during operation of the bonding head.

[0010] According to this aspect, the temperature range to be controlled for the dipping head and the bonding head is narrow, so that the time required to change the temperature of the dipping head and the bonding head can be shortened.

[0011] In the above aspect, the control unit may control the maximum temperature of the dipping head during operation to be lower than the activation temperature of the flux, and control the minimum temperature of the bonding head during operation to be higher than the activation temperature of the flux.

[0012] According to this aspect, since the maximum temperature during operation of the dipping head is lower than the activation temperature of the flux, heating of the flux by the head can be suppressed, and evaporation or deterioration of the flux can be suppressed. Also, since the minimum temperature during operation of the bonding head is higher than the activation temperature of the flux, the time required for activating the flux can be shortened.

[0013] In the above aspect, the control unit may control the temperature of the dipping head during operation to be 20° C. or higher and 90° C. or lower, and control the temperature of the bonding head during operation to be 150° C. or higher and 350° C. or lower.

[0014] According to this aspect, by controlling the dipping head to 20°C or higher, it is possible to suppress the cooling of the flux by the head and suppress the increase in viscosity of the flux. By controlling the dipping head to 90°C or lower, it is possible to suppress the heating of the flux by the head and suppress the evaporation or deterioration of the flux. By controlling the bonding head to 150°C or higher, it is possible to shorten the time required for activating the flux and to shorten the time required for changing the temperature of the head during the mounting process. By controlling the bonding head to 350°C or lower, it is possible to suppress the deterioration of the bump electrodes caused by excessive heating.

[0015] In the above aspect, the dipping head may have a cooling mechanism, and the bonding head may have a heating mechanism and a cooling mechanism.

[0016] According to this aspect, since the dipping head has a cooling mechanism, it is possible to suppress the temperature rise of the dipping head heated by the bonding head. Therefore, it is possible to suppress the evaporation or deterioration of the flux during the immersion process. Furthermore, since the bonding head has a heating mechanism and a cooling mechanism, it is possible to quickly melt or solidify only the solder of the electronic component to be mounted without deteriorating the solder of the electronic component already mounted due to heat.

[0017] In the above aspect, the control unit may transport the electronic component from the transfer stage to the mounting stage by means of the bonding head.

[0018] According to this aspect, since the electronic component is consistently held by the bonding head from the time it is picked up from the transfer stage until it is mounted on the substrate, it is possible to reduce the occurrence of defective products due to misalignment of the electronic component.

[0019] In the above aspect, the control unit may transport the electronic component from the transfer stage to the mounting stage by using the dipping head.

[0020] According to this aspect, when picking up an electronic component from the transfer stage, heating of the flux by the head can be suppressed, and evaporation or deterioration of the flux can be suppressed.

[0021] In the above aspect, a connecting member that connects the dipping head and the bonding head may be further provided, and the dipping head and the bonding head may be configured to move in conjunction with each other in a direction along the mounting surface of the mounting stage on which the electronic components are placed.

[0022] According to this aspect, the configuration can be simplified compared to an electronic component mounting apparatus in which a plurality of heads are configured to be able to move independently, which improves maintainability and extends the operating time of the apparatus.

[0023] In the above aspect, a shielding member that inhibits heat exchange between the bonding head and the dipping head may be further provided.

[0024] According to this aspect, it is possible to suppress a rise in temperature of the dipping head, and therefore it is possible to suppress heating of the flux by the head, and to suppress evaporation or deterioration of the flux.

[0025] In the above aspect, the dipping head and the bonding head may be configured to be movable separately and independently in a direction along a mounting surface of the mounting stage on which the electronic components are placed.

[0026] According to this embodiment, the immersion process and the mounting process can be carried out in parallel, thereby further improving productivity.

[0027] Another aspect of the present invention is an electronic component mounting method using an electronic component mounting apparatus that includes an electronic component supply unit that supplies electronic components having bump electrodes, a transfer stage that stores flux, a mounting stage on which a substrate is placed, a plurality of heads capable of picking up electronic components, and a control unit that controls the operation of the plurality of heads, and includes picking up an electronic component from the electronic component supply unit with a dipping head of the plurality of heads, immersing the bump electrodes of the electronic component in flux stored on the transfer stage with the dipping head, and mounting the electronic component on the substrate with a bonding head of the plurality of heads.

[0028] According to this aspect, it is not necessary to cool the head, which has become hot due to the mounting process, before the immersion process in order to suppress evaporation or deterioration of the flux. By eliminating the cooling time for the head, it is possible to shorten the time required to mount electronic components on a board, and it is possible to provide an electronic component mounting method with improved productivity.

[0029] The above aspect may further include releasing the electronic component from the dipping head at the transfer stage, and picking up the electronic component from the transfer stage by the bonding head.

[0030] According to this aspect, since the electronic component is consistently held by the bonding head from the time it is picked up from the transfer stage until it is mounted on the substrate, it is possible to reduce the occurrence of defective products due to misalignment of the electronic component.

[0031] In the above aspect, the method may further include controlling, by the control unit, the maximum temperature during operation of the dipping head to be lower than the minimum temperature during operation of the bonding head.

[0032] According to this aspect, the temperature range to be controlled for the dipping head and the bonding head is narrow, so that the time required to change the temperature of the dipping head and the bonding head can be shortened. Effect of the Invention

[0033] According to the present invention, it is possible to provide an electronic component mounting apparatus and an electronic component mounting method with improved productivity. [Brief description of the drawings]

[0034] [Figure 1] 1 is a diagram illustrating a schematic configuration of an electronic component mounting apparatus according to a first embodiment. [Diagram 2] 4 is a flowchart illustrating an electronic component mounting method using the electronic component mounting apparatus according to the first embodiment. [Diagram 3] FIG. 13 is a diagram illustrating a schematic view of step S130. [Figure 4] FIG. 13 is a diagram illustrating a schematic view of step S140. [Diagram 5] FIG. 13 is a diagram illustrating a schematic view of step S160. [Figure 6] FIG. 11 is a diagram illustrating a schematic view of step S170. [Figure 7] FIG. 13 is a diagram illustrating a schematic view of step S130. [Figure 8] 10 is a flowchart illustrating a modified example of the electronic component mounting method. [Figure 9] FIG. 13 is a diagram illustrating a schematic configuration of an electronic component mounting apparatus according to a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0035] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The drawings of the present embodiment are merely examples, and the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be interpreted as being limited to the embodiment.

[0036] First Embodiment First, the configuration of an electronic component mounting apparatus 1 according to a first embodiment of the present invention will be described with reference to Fig. 1. Fig. 1 is a diagram illustrating a schematic configuration of an electronic component mounting apparatus according to the first embodiment.

[0037] The electronic component mounting apparatus 1 is a flip chip bonder that solders an electronic component CP to a substrate BD. The solder that joins the substrate BD and the electronic component CP is provided, for example, on the bump electrodes EB of the electronic component CP. However, the solder may be provided on the electrode pads of the substrate BD, or on both the bump electrodes EB and the electrode pads. The electronic component mounting apparatus 1 includes a multi-head unit 100, a control unit 10, an electronic component supply unit 20, a transfer unit 30, and a mounting unit 40.

[0038] The multi-head unit 100 includes a plurality of heads 110 and 120 , a base member 130 , a shielding member 140 , and a head moving mechanism 150 .

[0039] The heads 110 and 120 are configured to be able to pick up an electronic component CP having bump electrodes EB. The head 110 has a holding tool 111, a heating tool 113, a cooling tool 115, and a lifting mechanism 119. The holding tool 111 is a pair of tweezers for holding the electronic component CP, such as a suction collet. The heating tool 113 is a heating mechanism for heating the holding tool 111, such as a ceramic heater. The cooling tool 115 is a cooling mechanism for cooling the holding tool 111, such as a cooling flow path or a Peltier element. The lifting mechanism 119 is a lifting mechanism for lifting the holding tool 111 in a direction perpendicular to the transfer surface of the transfer unit 30 or the mounting surface of the mounting unit 40 (hereinafter referred to as the "vertical direction"), such as an electric cylinder or an actuator. The head 120 has a holding tool 121, a heating tool 123, a cooling tool 125, and a lifting mechanism 129. Head 120 has the same configuration as head 110, so a description of the components of head 120 will be omitted. Heads 110 and 120 may further include a temperature sensor for detecting the temperature of heads 110 and 120, and a purge gas blowing mechanism for purging oxygen to suppress oxidation of electrodes. The purge gas is an inert gas that has low reactivity with metals, such as nitrogen gas.

[0040] A plurality of heads 110, 120 are attached to a base member 130. That is, the lifting mechanisms 119, 129 raise and lower the holding tools 111, 121 relative to the base member 130. The base member 130 connects the heads 110 and 120, and corresponds to an example of a "connecting member" according to the present invention.

[0041] The shielding member 140 inhibits heat exchange between the head 110 and the head 120. The shielding member 140 is a plate-like member provided between the holding tool 111 and the holding tool 121, and is, for example, a heat insulating plate or a heat shielding plate. The shielding member 140 may be equipped with a cooling mechanism.

[0042] The head moving mechanism 150 is a moving mechanism that moves the head 110 and the head 120 along a direction parallel to the transfer surface of the transfer unit 30 or the mounting surface of the mounting unit 40 (hereinafter referred to as the "horizontal direction"), and is, for example, a Cartesian robot or a robot manipulator. The head moving mechanism 150 moves the base member 130. For this reason, the head 110 and the head 120 attached to the base member 130 are configured to move in conjunction with each other along the horizontal direction. Note that the head 110 and the head 120 may be configured to be movable separately and independently along the horizontal direction.

[0043] The control unit 10 controls the multi-head unit 100. Specifically, the control unit 10 makes the head 110 function as a dipping head that immerses the bump electrodes EB of the electronic component CP in the flux FX stored in the transfer unit 30. The control unit 10 also makes the head 120 function as a bonding head that mounts the electronic component CP on the substrate BD on the mounting unit 40 via the bump electrodes EB. In order to assign roles to the heads 110 and 120 in this way, the control unit 10 controls the positions and temperatures of the heads 110 and 120. The control unit 10 also controls the holding tools 111 and 121 to make the heads 110 and 120 pick up or release the electronic component CP at appropriate timing. In this specification, the dipping head is a head dedicated to the immersion process, but the term "dedicated to the immersion process" means that, of the immersion process and the mounting process, the head performs only the operation that belongs to the immersion process without performing the operation that belongs to the mounting process, and does not exclude the performance of other processes other than the immersion process. Similarly, the bonding head is a head dedicated to mounting processing, but "dedicated to mounting processing" in this case means that, among the immersion processing and mounting processing steps, it does not perform any operations that belong to the immersion processing, but rather performs only operations that belong to the mounting processing, and does not exclude the performance of other processes other than the mounting processing.

[0044] The control unit 10 controls the lifting mechanisms 119, 129 and the head moving mechanism 150 to control the vertical and horizontal positions of the holding tools 111, 121 of the heads 110, 120. The control unit 10 controls the position of the holding tool 111 of the head 110 to pick up the electronic component CP from the electronic component supply unit 20, transport the electronic component CP from the electronic component supply unit 20 to the transfer unit 30, and immerse the bump electrodes EB of the electronic component CP in the flux FX stored in the transfer unit 30. The control unit 10 may release the electronic component CP on the transfer unit 30, or may transport the electronic component CP from the transfer unit 30 to the mounting unit 40 and then release it. The control unit 10 controls the position of the holding tool 121 of the head 120 to mount the electronic component CP on the board BD. The control unit 10 may cause the head 120 to pick up the electronic component CP from the transfer stage 31 and transport the electronic component CP to the mounting stage 41, or may cause the head 110 to transport the electronic component CP from the transfer stage 31 to the mounting stage 41. Note that the electronic component mounting apparatus may further include an electronic component transfer unit, where the electronic component is transferred from the holding tool 111 of the head 110 to the holding tool 121 of the head 120.

[0045] The control unit 10 controls the heating tools 113, 123 and the cooling tools 115, 125 of the heads 110, 120 to control the temperatures during operation of the heads 110, 120 (hereinafter referred to as "operating temperatures"). The "operating temperatures of the heads 110, 120" here refer to the temperatures of the holding tools 111, 121 in a state in which the electronic component mounting apparatus 1 is operating to perform the immersion process and the mounting process, and in a state in which the immersion process and the mounting process can be performed. The control unit 10 controls the operating temperature of the head 110 to a temperature range suitable for the immersion process. When the head 120 picks up the electronic component CP from the transfer stage 31, the control unit 10 controls the head 120 to a temperature lower than the melting point of the solder. When the head 120 mounts the electronic component CP on the board BD, the control unit 10 controls the head 120 to a temperature higher than the melting point of the solder. Hereinafter, the temperature of the head 110 when picking up the electronic component CP from the transfer stage 31 is referred to as the "pre-processing temperature," and the temperature when the electronic component CP is mounted on the substrate BD is referred to as the "processing temperature." For example, the minimum operating temperature of the head 120 is the pre-processing temperature, and the maximum operating temperature of the head 120 is the processing temperature. In this way, by limiting the control range of the operating temperatures of the heads 110, 120, the time it takes for the temperature change of the heads 110, 120 to be completed is shortened.

[0046] The control unit 10 controls the head 110 so that the maximum operating temperature is lower than the minimum operating temperature of the head 120. The control unit 10 controls the head 110 so that the maximum operating temperature is lower than the activation temperature of the flux FX. As an example, the control unit 10 preferably controls the head 110 to be between 10°C and 120°C, more preferably between 20°C and 90°C, and even more preferably between 20°C and 60°C. The control unit 10 also controls the head 120 so that the minimum operating temperature is lower than the melting point of the solder and the maximum temperature is higher than the melting point of the solder. The minimum operating temperature of the head 120 may be controlled to be higher than the activation temperature of the flux FX, for example. As an example, the control unit 10 preferably controls the head 120 to be between 100°C and 400°C, more preferably between 150°C and 350°C, and even more preferably between 200°C and 300°C.

[0047] The control unit 10 does not control the head 110 functioning as a dipping head to a high temperature range where mounting processing is possible, so the heating tool 113 of the head 110 may be omitted. Also, the control unit 10 does not control the head 120 functioning as a bonding head to a low temperature range where immersion processing is possible, so the cooling tool 125 of the head 120 may be omitted.

[0048] The control unit 10 may obtain information on the operating status of at least one of the electronic component supplying unit 20, the transfer unit 30, and the mounting unit 40, and control the multi-head unit 100 based on the information. The control unit 10 may also control at least one of the electronic component supplying unit 20, the transfer unit 30, and the mounting unit 40 based on the operating status of the multi-head unit 100.

[0049] In the electronic component supplying unit 20, electronic components CP are supplied to the head 110. The electronic component supplying unit 20 corresponds to an example of an "electronic component supplying section" according to the present invention. The electronic component supplying unit 20 is, for example, a tray feeder that supplies electronic components CP from a tray 21 in which the electronic components CP are accommodated. The electronic component supplying unit 20 may further include a holding section that holds the tray 21, a conveyor that transports the tray 21, an orthogonal robot or a robot manipulator, or the like. The electronic component supplying unit 20 is not limited to the above and may be, for example, a tape feeder.

[0050] In the transfer unit 30, the flux FX is transferred to the bump electrodes EB of the electronic component CP. The transfer unit 30 includes a transfer stage 31 that stores the flux FX. The flux FX is stored at a uniform depth in an immersion area 33 of the transfer stage 31. The transfer unit 30 may further include a flux pod that supplies the flux FX to the immersion area 33, a squeegee that smoothes the surface of the flux FX in the immersion area 33, a temperature adjustment mechanism that adjusts the temperature of the flux FX, and an image analyzer that images the surface of the flux FX in the immersion area 33 before or after the transfer process and analyzes the transfer status of the flux FX to the bump electrodes EB.

[0051] In the mounting unit 40, electronic components CP are mounted on a substrate BD. The mounting unit 40 includes a mounting stage 41 on which the substrate BD is placed. The mounting unit 40 may further include a temperature adjustment mechanism that adjusts the temperature of the substrate BD, a cover that covers the substrate BD, and a purge gas supply unit that purges oxygen from within the cover to suppress oxidation of the electrodes.

[0052] The electronic component mounting apparatus 1 may further include a transfer holding section that temporarily holds the electronic component CP in order to transfer the electronic component CP from head 110 to head 120, and an image analysis device that images the bump electrode EB after the flux FX is transferred and analyzes the transfer status of the flux FX to the bump electrode EB.

[0053] Next, an outline of an electronic component mounting method using the electronic component mounting apparatus 1 will be described with reference to FIGS. 2 to 7. FIG. 2 is a flow chart that shows an electronic component mounting method using the electronic component mounting apparatus according to the first embodiment. FIG. 3 is a diagram that shows an outline of step S130. FIG. 4 is a diagram that shows an outline of step S140. FIG. 5 is a diagram that shows an outline of step S160. FIG. 6 is a diagram that shows an outline of step S170. FIG. 7 is a diagram that shows an outline of step S130. In the following description, each component of the multi-head unit 100 is controlled by the control unit 10. In addition, in the following description, a case will be described in which the head 110 functions as a dipping head and the head 120 functions as a bonding head, and the head 110 will also be referred to as the "dipping head 110" and the head 120 as the "bonding head 120".

[0054] First, the dipping head 110 is controlled to about 25° C. (S110). The operating temperature of the dipping head 110 is not limited to about 25° C. as long as it is lower than the activation temperature of the flux FX, and may be controlled to about room temperature, for example. During operation of the electronic component mounting apparatus 1, the temperature of the dipping head 110 fluctuates due to the influence of the bonding head 120, but is controlled by the cooling tool 115 to preferably be between 20° C. and 90° C., and more preferably be between 20° C. and 60° C.

[0055] Next, the bonding head 120 is controlled to about 200° C. (S120). At this time, the bonding head 120 is controlled to the pre-processing temperature. That is, the bonding head 120 is controlled to the lowest operating temperature. The pre-processing temperature is not limited to about 200° C., but it is desirable to set the temperature as high as possible within a temperature range that is lower than the melting point of the solder provided on the bump electrode EB and that suppresses vaporization or deterioration of the flux FX stored in the transfer stage 31. When the electronic component CP is picked up by the bonding head 120, which will be described later, the time during which the bonding head 120 approaches the flux FX is shorter than the time of the immersion process. Therefore, even if the bonding head 120 is at about 200° C., which is higher than the dipping head 110, the temperature rise of the flux FX by the bonding head 120 can be sufficiently suppressed.

[0056] Next, the electronic component CP is picked up by the dipping head 110 (S130). As shown in Fig. 3, the head moving mechanism 150 is controlled to move the base member 130 so that the dipping head 110 overlaps the electronic component CP in the vertical direction. Next, the lifting mechanism 119 is controlled to lower the holding tool 111 vertically downward, and the holding tool 111 is controlled to pick up the electronic component CP. Thereafter, the lifting mechanism 119 is controlled to raise the holding tool 111 holding the electronic component CP vertically upward.

[0057] Next, the bump electrodes EB of the electronic component CP are immersed in the flux FX (S140). First, the head moving mechanism 150 is controlled to move the base member 130 in the horizontal direction so that the dipping head 110 overlaps the immersion area 33 in the vertical direction. Next, as shown in Fig. 4, the lifting mechanism 119 is controlled to lower the holding tool 111 vertically downward, and the bump electrodes EB of the electronic component CP are immersed in the flux FX.

[0058] Next, the electronic component CP is released from the dipping head 110 (S150). The holding tool 111 is controlled to release the electronic component CP, and the lifting mechanism 119 is controlled to lift the holding tool 111 vertically upward.

[0059] Next, the electronic component CP is picked up by the bonding head 120 (S160). First, the head moving mechanism 150 is controlled to move the base member 130 in the horizontal direction so that the head 110 overlaps the electronic component CP on the transfer stage 31 in the vertical direction. Next, as shown in Fig. 5, the lifting mechanism 129 is controlled to lower the holding tool 121 vertically downward, and the holding tool 121 is controlled to pick up the electronic component CP. Thereafter, the lifting mechanism 129 is controlled to raise the holding tool 121 holding the electronic component CP vertically upward.

[0060] Next, the bump electrodes EB of the electronic component CP are pressed against the electrode pads of the substrate BD (S170). First, the head moving mechanism 150 is controlled to move the base member 130 in the horizontal direction so that the bump electrodes EB of the electronic component CP overlap the electrode pads of the substrate BD in the vertical direction. Next, as shown in Fig. 4, the lifting mechanism 129 is controlled to lower the holding tool 121 vertically downward, so that the bump electrodes EB of the electronic component CP come into contact with the electrode pads of the substrate BD. Between steps S160 and S170, the flux FX transferred to the bump electrodes EB is heated and activated by the head 120.

[0061] Next, the temperature of the bonding head 120 is controlled to about 300°C (S180). At this time, the temperature of the bonding head 120 is raised from the pre-processing temperature and controlled to the processing temperature. That is, the bonding head 120 is controlled to the maximum operating temperature. The processing temperature is not limited to about 300°C, but is appropriately set within a temperature range that is equal to or higher than the melting point of the solder provided on the bump electrodes EB and does not deteriorate the solder. In step S180, the solder provided on the bump electrodes EB melts, and the bump electrodes EB of the electronic component CP are soldered to the electrode pads of the substrate BD.

[0062] Next, the electronic component CP is released from the bonding head 120 (S190). The holding tool 121 is controlled to release the electronic component CP, and the lifting mechanism 129 is controlled to lift the holding tool 121 vertically upward.

[0063] After that, the process returns to step S120, and the temperature of the bonding head 120 is lowered to the pre-processing temperature. Then, step S130 is performed again, as shown in Fig. 7. During this time, flux FX is added to the immersion area 33 of the transfer stage 31, and the surface of the flux FX supplied to the immersion area 33 is smoothed by the squeegee.

[0064] In the embodiment described above, the control unit 10 is configured to cause the multiple heads 110, 120 to function in a shared manner as a dipping head that immerses the bump electrodes EB of the electronic component CP in the flux FX stored in the transfer stage 31, and as a bonding head that mounts the electronic component CP onto the substrate BD on the mounting stage 41 via the bump electrodes EB.

[0065] According to this, it is not necessary to cool the head 120, which has become hot due to the mounting process, before the immersion process in order to suppress evaporation or deterioration of the flux FX. By eliminating the cooling time for the head 120, it is possible to shorten the time required to mount the electronic components CP on the board BD, and it is possible to provide an electronic component mounting apparatus 1 with improved productivity.

[0066] In one embodiment, the control unit 10 controls the maximum temperature during operation of the dipping head so as to be lower than the minimum temperature during operation of the bonding head.

[0067] According to this, the temperature range to be controlled for the dipping head and the bonding head is narrow, so that the time required to change the temperature of the dipping head and the bonding head can be shortened.

[0068] In one embodiment, the control unit 10 controls the maximum temperature during operation of the dipping head to be lower than the activation temperature of the flux FX, and controls the minimum temperature during operation of the bonding head to be higher than the activation temperature of the flux FX.

[0069] According to this, since the maximum temperature during operation of the dipping head is lower than the activation temperature of the flux FX, heating of the flux FX by the head 110 can be suppressed, and evaporation or deterioration of the flux FX can be suppressed. Also, since the minimum temperature during operation of the bonding head is higher than the activation temperature of the flux FX, the time required to activate the flux FX can be shortened.

[0070] In one embodiment, the control unit 10 controls the temperature of the dipping head during operation to be 20° C. or more and 90° C. or less, and controls the temperature of the bonding head during operation to be 150° C. or more and 350° C. or less.

[0071] According to this, by controlling the dipping head to 20° C. or higher, it is possible to suppress the cooling of the flux FX by the head 110 and suppress an increase in the viscosity of the flux FX. By controlling the dipping head to 90° C. or lower, it is possible to suppress the heating of the flux FX by the head 110 and suppress the evaporation or deterioration of the flux FX. By controlling the bonding head to 150° C. or higher, it is possible to shorten the time required to activate the flux FX and to shorten the time required to change the temperature of the head 120 during the mounting process. By controlling the bonding head to 350° C. or lower, it is possible to suppress the deterioration of the bump electrodes EB caused by excessive heating.

[0072] In one embodiment, the dipping head has a cooling mechanism, and the bonding head has a heating mechanism and a cooling mechanism.

[0073] According to this, since the dipping head has a cooling mechanism, it is possible to suppress the temperature rise of the dipping head heated by the bonding head. Therefore, it is possible to suppress the evaporation or deterioration of the flux FX during the immersion process. Furthermore, since the bonding head has a heating mechanism and a cooling mechanism, it is possible to quickly melt or solidify only the solder of the electronic component to be mounted without deteriorating the solder of the electronic component already mounted due to heat.

[0074] As one aspect, the control unit 10 transports the electronic component CP from the transfer stage 31 to the mounting stage 41 by the bonding head.

[0075] According to this, since the electronic component CP is consistently held by the bonding head from the time it is picked up from the transfer stage 31 until it is mounted on the substrate BD, it is possible to reduce the occurrence of defective products due to misalignment of the electronic component CP.

[0076] In one embodiment, the electronic component mounting apparatus 1 further includes a connecting member that connects the dipping head and the bonding head, and the dipping head and the bonding head are configured to move in conjunction with each other in a direction along the mounting surface on the mounting stage 41 on which the electronic component CP is placed.

[0077] This allows for a simpler configuration than electronic component mounting apparatus 1 in which multiple heads are configured to be able to move separately and independently. This improves maintainability and allows for longer operation time of the apparatus.

[0078] As one embodiment, the electronic component mounting apparatus 1 further includes a shielding member 140 that inhibits heat exchange between the bonding head and the dipping head.

[0079] This makes it possible to suppress a rise in temperature of the dipping head, thereby suppressing heating of the flux FX by the head and suppressing evaporation or deterioration of the flux FX.

[0080] In addition, an electronic component mounting method using the electronic component mounting apparatus 1 includes picking up an electronic component CP from an electronic component supply unit by a dipping head of the multiple heads 110, 120, immersing a bump electrode EB of the electronic component CP in flux FX stored on the transfer stage 31 by the dipping head, and mounting the electronic component CP on a substrate BD by a bonding head of the multiple heads 110, 120.

[0081] According to this, it is not necessary to cool the head 120, which has become hot due to the mounting process, before the immersion process in order to suppress evaporation or deterioration of the flux FX. By eliminating the cooling time for the head 120, it is possible to shorten the time required to mount the electronic components CP on the board BD, and it is possible to provide an electronic component mounting method with improved productivity.

[0082] In one embodiment, the method further includes releasing the electronic component CP from the dipping head at the transfer stage 31, and picking up the electronic component CP from the transfer stage 31 by the bonding head.

[0083] According to this, since the electronic component CP is consistently held by the bonding head from the time it is picked up from the transfer stage 31 until it is mounted on the substrate BD, it is possible to reduce the occurrence of defective products due to misalignment of the electronic component CP.

[0084] As one embodiment, the method further includes controlling the maximum temperature of the dipping head during operation by the control unit 10 so that the maximum temperature of the dipping head during operation is lower than the minimum temperature of the bonding head during operation.

[0085] According to this, the temperature range to be controlled for the dipping head and the bonding head is narrow, so that the time required to change the temperature of the dipping head and the bonding head can be shortened.

[0086] A modified example of the first embodiment and a second embodiment will be described below. The same or similar components as those in the first embodiment are denoted by the same or similar reference numerals, and the description thereof will be omitted as appropriate. In addition, the same effects and advantages due to the same components will not be mentioned one by one.

[0087] <Modification> First, a modified electronic component mounting method will be described with reference to Fig. 8. Fig. 8 is a flow chart that outlines the modified electronic component mounting method.

[0088] In this modification, after step S110 in which the dipping head 110 is controlled to about 25°C, the bonding head 120 is controlled to 300°C (S220). That is, the bonding head 120 is controlled to about 300°C, which is higher than the melting point of the solder, before it comes into contact with the electronic component CP, and is controlled to a constant temperature during the subsequent soldering. Next, step S130 in which the electronic component CP is picked up by the dipping head 110 and step S140 in which the bump electrodes EB of the electronic component CP are immersed in the flux FX are performed.

[0089] Next, the electronic component CP is placed on the substrate BD (S250). First, the holding tool 111 is controlled to maintain the state in which the dipping head 110 holds the electronic component CP when the bump electrodes EB are immersed in the flux FX. Next, the lifting mechanism 119 is controlled to raise the holding tool 111 holding the electronic component CP vertically upward. Next, the head moving mechanism 150 is controlled to move the base member 130 horizontally so that the bump electrodes EB of the electronic component CP overlap the electrode pads of the substrate BD in the vertical direction. Next, the lifting mechanism 119 is controlled to lower the holding tool 111 vertically downward, and the bump electrodes EB of the electronic component CP are brought into contact with the electrode pads of the substrate BD.

[0090] Next, the electronic component CP is released from the dipping head 110 (S260). The holding tool 111 is controlled to release the electronic component CP, and the lifting mechanism 119 is controlled to lift the holding tool 111 vertically upward.

[0091] Next, the bump electrodes EB of the electronic component CP are pressed against the electrode pads of the substrate BD (S270). First, the head moving mechanism 150 is controlled to move the base member 130 in the horizontal direction so that the bonding head 120 overlaps the electronic component CP on the mounting stage 41 in the vertical direction. Next, the lifting mechanism 129 is controlled to lower the holding tool 121 vertically downward, and the electronic component CP is brought into contact with the holding tool 121. Next, the electronic component CP is heated via the holding tool 121 to melt the solder and solder the bump electrodes EB to the electrode pads.

[0092] Next, the electronic component CP is released from the bonding head 120 (S190), and then the process returns to step S220.

[0093] In this manner, in the electronic component mounting apparatus 1, the control unit 10 may cause the dipping head 110 to transport the electronic component CP from the transfer stage 31 to the mounting stage 41.

[0094] According to this, when picking up the electronic component CP from the transfer stage 31, heating of the flux FX by the head 120 can be suppressed, and evaporation or deterioration of the flux FX can be suppressed.

[0095] Note that, if it is the head 110 that picks up the electronic component CP from the transfer stage 31, the control unit 10 does not have to be configured to transport the electronic component CP to the mounting stage 41 by the head 110. For example, if the electronic component mounting apparatus 1 further includes a transfer holder that temporarily holds the electronic component CP, the control unit 10 may cause the head 110 to transport the electronic component CP from the transfer stage 31 to the transfer holder, and then release the electronic component CP from the head 110. The control unit 10 may also cause the head 120 to pick up the electronic component CP from the transfer holder and transport it to the mounting stage 41. This also provides the same effect as the present modified example.

[0096] <Second embodiment> Next, the configuration of an electronic component mounting apparatus 2 according to a second embodiment will be described with reference to Fig. 9. Fig. 9 is a diagram showing a schematic configuration of an electronic component mounting apparatus according to the second embodiment.

[0097] In the multi-head unit 200, the multiple heads 210, 220 are connected independently to the head movement mechanism 150. In other words, the multiple heads 210, 220 are configured to be capable of moving separately and independently in the horizontal direction.

[0098] This allows the immersion process and the mounting process to be carried out in parallel, thereby further improving productivity.

[0099] Instead of head movement mechanism 150, multi-head unit 200 may have a separate head movement mechanism for moving head 210 in the horizontal direction and a head movement mechanism for moving head 220 in the horizontal direction.

[0100] As described above, according to one aspect of the present invention, it is possible to provide an electronic component mounting apparatus and an electronic component mounting method with improved productivity.

[0101] The above-described embodiments are intended to facilitate understanding of the present invention, and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangements, materials, conditions, shapes, sizes, etc., are not limited to those illustrated, and can be changed as appropriate. In addition, configurations shown in different embodiments can be partially substituted or combined with each other. [Explanation of symbols]

[0102] 1...Electronic component mounting equipment 10...Control section 100...Multi-head unit 110,120…Head 111,121…Holding tool 113,123…Heating tools 115,125…Cooling tool 119,129…Lifting mechanism 130...Base member 140...Shielding member 150...Head movement mechanism 20...Electronic component supply unit 21…Tray 30...Transcription unit 31...Transcription stage 33…Soaking area 40…Mounting unit 41…Implementation stage FX…Flux CP…Electronic parts EB…Bump electrode BD…Substrate

Claims

1. an electronic component supply unit that supplies electronic components having bump electrodes; a transfer stage for storing the flux; a mounting stage on which a substrate is placed; a connecting member that connects the plurality of heads capable of picking up the electronic components at a predetermined interval and interlocks the heads in a direction along a mounting surface on the mounting stage on which the electronic components are mounted; A control unit for controlling the operation of the plurality of heads; Equipped with the control unit causes the plurality of heads to function as a dipping head that immerses the bump electrodes of the electronic component in the flux stored in the transfer stage, and a bonding head that mounts the electronic component on the substrate on the mounting stage via the bump electrodes; After the electronic component is released from the dipping head in a state immersed in the flux on the transfer stage, the connecting member is moved by the predetermined distance, and the electronic component in a state immersed in the flux is picked up from the transfer stage by the bonding head. Electronic component mounting equipment.

2. The control unit controls the maximum temperature during operation of the dipping head to be lower than the minimum temperature during operation of the bonding head. The electronic component mounting apparatus according to claim 1 .

3. the control unit controls the maximum temperature during operation of the dipping head to be lower than an activation temperature of the flux, and controls the minimum temperature at which the bonding head picks up the electronic component from the transfer stage to be higher than the activation temperature of the flux. The electronic component mounting apparatus according to claim 2 .

4. The control unit controls the temperature of the dipping head during operation to 20° C. or more and 90° C. or less, and controls the temperature at which the bonding head picks up the electronic component from the transfer stage to 150° C. or more and 350° C. or less.

4. The electronic component mounting apparatus according to claim 2 or 3.

5. The dipping head has a cooling mechanism, The bonding head has a heating mechanism and a cooling mechanism. The electronic component mounting device according to claim 1 .

6. the control unit controls the bonding head to transport the electronic component from the transfer stage to the mounting stage; The electronic component mounting device according to claim 1 .

7. The control unit causes the dipping head to transport the electronic component from the transfer stage to the mounting stage. The electronic component mounting device according to claim 1 .

8. (delete)

9. The bonding head further includes a shielding member for blocking heat exchange between the bonding head and the dipping head. The electronic component mounting apparatus according to claim 1 .

10. the dipping head and the bonding head are configured to be movable separately and independently in a direction along a mounting surface on the mounting stage on which the electronic components are placed. The electronic component mounting device according to claim 1 .

11. an electronic component supply unit that supplies electronic components having bump electrodes; a transfer stage for storing the flux; a mounting stage on which a substrate is placed; a connecting member that connects the plurality of heads capable of picking up the electronic components at a predetermined interval and interlocks the heads in a direction along a mounting surface on the mounting stage on which the electronic components are mounted; An electronic component mounting method using an electronic component mounting apparatus including a control unit that controls the operation of the plurality of heads, picking up the electronic components from the electronic component supply unit by a dipping head among the plurality of heads; dipping the bump electrodes of the electronic component into the flux stored in the transfer stage by the dipping head; mounting the electronic component on the substrate by a bonding head among the plurality of heads; releasing the electronic component from the dipping head on the transfer stage, and then moving the connecting member by the predetermined distance; picking up the electronic component from the transfer stage by the bonding head; Including, Electronic component mounting method.

12. (delete)

13. The control unit further controls the maximum temperature of the dipping head during operation to be lower than the minimum temperature of the bonding head during operation. The electronic component mounting method according to claim 11.

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