Processing equipment

Abstract

To stably and easily evaluate a determination condition for a machined trace.SOLUTION: A machining device is equipped with: a chuck table on which a workpiece having a plurality of division scheduled lines is held; a machining unit that machines the workpiece held on the chuck table along the division schedule lines; a camera unit that photographs the workpiece held on the chuck table; and a control unit that controls the machining unit and the camera unit. The control unit makes the camera unit photograph the workpiece machined by the machining unit and having a machined trace formed thereon, and comprises a memorizing part that memorizes a photographed image of the workpiece and a machined trace-determining part that can read out the image memorized in the memorizing part and determine whether the machine trace appearing in the image is proper or not.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a processing device that processes a plate-shaped workpiece along a planned dividing line to form processing marks. [Background technology]

[0002] In the manufacturing process of device chips used in electronic devices such as mobile phones and computers, grid-like dividing lines called streets are set on the surface of a wafer made of a semiconductor such as silicon. Devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations) are formed in each area defined by the dividing lines on the surface of the wafer. The wafer is then divided along the streets to form individual device chips.

[0003] Dividing a workpiece such as a wafer is performed, for example, by a cutting device having a cutting blade. The cutting device cuts the workpiece by rotating the cutting blade and cutting the workpiece along the streets. The workpiece may also be divided by using a laser processing device having a laser processing unit. The laser processing device irradiates the workpiece with a laser beam along the streets to laser process the workpiece.

[0004] These processing devices are equipped with a camera unit that photographs the workpiece. While the workpiece is being processed by the processing unit, the processing device photographs the processing marks formed on the workpiece with the camera unit. Then, the quality of the processing marks is judged by checking whether the processing marks are formed at the expected positions and whether there are any large chips on the edges of the processing marks (for example, see Patent Documents 1 to 4). This function is called a kerf check.

[0005] In the control unit of the processing device, evaluation items, evaluation methods, tolerances for each evaluation item, etc. are registered as judgment conditions used in the kerf check. When judging the quality of the processing marks formed on the workpiece, appropriate judgment conditions corresponding to the type of processing to be performed, the type of workpiece, etc. are read out and used. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2013-74198 A [Patent Document 2] JP 2010-10445 A [Patent Document 3] JP 2016-197702 A [Patent Document 4] JP 2009-246015 A Summary of the Invention [Problem to be solved by the invention]

[0007] When processing a new type of workpiece in a processing device or when processing is performed under new processing conditions, it is necessary to register new judgment conditions for judging the quality of the processing marks. In addition, there is room for improvement in the existing judgment conditions, and the judgment conditions are appropriately improved so as to reduce the number of times that problems occurring in the processed workpiece are not overlooked, and to prevent erroneous detection of the occurrence of a problem when there is no problem in the processed workpiece.

[0008] When new judgment conditions are set, it is necessary to evaluate whether the quality of the processing marks can be appropriately judged using these judgment conditions. Conventionally, when carrying out this evaluation, the workpiece is actually processed using a processing device to form processing marks, which are then photographed, and the quality of the processing marks is judged using the new judgment conditions, and the suitability and accuracy of these judgment conditions are evaluated.

[0009] However, preparing a workpiece for evaluation of the judgment conditions and actually performing machining requires financial, time, and human costs. If the judgment conditions are adjusted based on the results of this evaluation, these costs are incurred again to evaluate the adjusted judgment conditions. Therefore, this accumulated cost has been an obstacle to deriving appropriate judgment conditions.

[0010] Furthermore, when a new workpiece is machined each time to evaluate a criterion, the machining results may vary. Therefore, when evaluating multiple criterion, it is not possible to use the same evaluation criteria, and it may not be possible to properly evaluate the merits and demerits of each criterion.

[0011] The present invention has been made in view of the above problems, and an object of the present invention is to provide a processing device that can stably and easily evaluate the judgment conditions for processing marks. [Means for solving the problem]

[0012] According to one aspect of the present invention, there is provided a processing apparatus comprising a chuck table capable of holding a workpiece having a plurality of planned division lines, a processing unit that processes the workpiece held by the chuck table along the planned division lines, a camera unit that photographs the workpiece held by the chuck table, and a control unit that controls the processing unit and the camera unit, wherein the control unit comprises a memory unit that stores an image obtained by photographing the workpiece processed by the processing unit and having processing marks formed thereon with the camera unit, and a processing mark judgment unit that can read out the image stored in the memory unit and judge whether the processing marks shown in the image are good or bad.

[0013] Preferably, the processing mark judgment unit reads out the image stored in the memory unit and judges the quality of the processing marks based on judgment conditions, and judges the quality of the processing marks shown in the image stored in the memory unit based on the changed judgment conditions.

[0014] Alternatively, preferably, the memory section further stores the quality of the processing marks shown in the image in association with the image, and the control unit further includes a judgment condition evaluation section capable of evaluating the judgment conditions by comparing the result of the processing mark judgment section judging the quality of the processing marks shown in the image stored in the memory section based on judgment conditions with the quality of the processing marks shown in the image stored in the memory section.

[0015] According to another aspect of the present invention, there is provided a processing apparatus comprising: a chuck table capable of holding a workpiece having a plurality of planned division lines; a processing unit that processes the workpiece held by the chuck table along the planned division lines; a camera unit that photographs the workpiece held by the chuck table; and a control unit that controls the processing unit and the camera unit, wherein the control unit comprises: a memory unit that stores a plurality of images obtained by photographing the workpiece processed by the processing unit and having processing marks formed thereon with the camera unit; and a processing mark judgment unit that can read out the plurality of images stored in the memory unit and judge the quality of the processing marks appearing in each of the images, and the processing mark judgment unit is capable of calculating the proportion of images among the plurality of images for which the judgment result for the processing marks appearing in the images is a good judgment or a bad judgment.

[0016] Preferably, the processing mark judgment unit reads out the multiple images stored in the memory unit and judges the quality of each of the processing marks based on the judgment conditions, and judges the quality of the processing marks appearing in each of the multiple images stored in the memory unit based on the changed judgment conditions.

[0017] Alternatively, preferably, the memory section further stores the quality of each of the processing marks appearing in the multiple images in association with each of the images, and the control unit further includes a judgment condition evaluation section that compares the result of the processing mark judgment section judging the quality of the processing marks appearing in the multiple images stored in the memory section based on judgment conditions with the quality of the processing marks appearing in each of the images stored in the memory section to calculate a match rate, and can evaluate the judgment conditions based on the match rate.

[0018] In addition, preferably, the judgment conditions are one or both of image processing conditions for processing the image, and judgment items and permissible values ​​of the judgment items.

[0019] Also, preferably, the processing unit is a cutting unit which cuts the workpiece along the intended division line with a cutting blade, and the processing marks are cutting grooves formed in the workpiece by the cutting blade. Effect of the Invention

[0020] The processing mark judgment section of the control unit of the processing device according to one aspect of the present invention can read out an image stored in a memory section and judge the quality of the processing marks shown in the image. Therefore, the quality of the processing marks shown in the image stored in the memory section can be simulated by the processing mark judgment section under a judgment condition, and the judgment result can be verified to evaluate the judgment condition. In this case, it is not necessary to newly process the workpiece and photograph the workpiece to obtain the image.

[0021] In addition, even when it is desired to evaluate various judgment conditions, the processing marks shown in the images stored in the storage unit can be evaluated in the same manner for each judgment condition. Therefore, compared to the case where the workpiece is processed and the workpiece is photographed each time each judgment condition is evaluated, the processing variations do not affect the evaluation of each judgment condition, and each judgment condition can be stably and easily evaluated.

[0022] Therefore, the present invention provides a processing device that can stably and easily evaluate the judgment conditions for processing marks. [Brief description of the drawings]

[0023] [Figure 1] FIG. 2 is a perspective view showing a processing device. [Diagram 2] FIG. 2 is a perspective view showing a schematic view of a workpiece being machined by a machining unit. [Diagram 3] FIG. 2 is a plan view showing a schematic diagram of a machining mark formed on a workpiece; [Figure 4] FIG. 2 is a plan view showing a schematic diagram of a workpiece on which a processing mark is formed. [Diagram 5] FIG. 4 is a plan view illustrating a display unit that displays a judgment condition setting screen. [Figure 6] FIG. 4 is a plan view illustrating a display unit that displays a judgment condition setting screen. [Figure 7] FIG. 4 is a plan view illustrating a display unit that displays a judgment condition setting screen. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. The processing device according to this embodiment is, for example, a cutting device for processing a workpiece such as a semiconductor wafer, or a laser processing device. Fig. 2 is a perspective view showing a workpiece 1 being processed by the processing device. First, the workpiece 1 will be described.

[0025] The workpiece 1 is, for example, a circular wafer made of a semiconductor material such as silicon, and a plurality of mutually intersecting division lines 3 are set on the front surface 1a side of the workpiece 1. Devices 5 such as ICs and LSIs are formed in each area partitioned by the division lines 3. By dividing the workpiece 1 along the division lines 3, individual device chips can be manufactured.

[0026] The workpiece 1 may be other than a circular wafer made of a semiconductor material such as silicon, and there is no limitation on the material, shape, structure, etc. of the workpiece 1. For example, a rectangular substrate made of a material such as ceramics, resin, metal, etc. may be used as the workpiece 1. There is no limitation on the type, number, arrangement, etc. of the devices 5.

[0027] When the workpiece 1 is carried into the processing device, the workpiece 1 is integrated with the adhesive tape 7 and the annular frame 9 to form a frame unit 11. The workpiece 1 is carried into the processing device in the state of the frame unit 11 and processed.

[0028] The frame unit 11 includes an annular frame 9 and an adhesive tape 7 attached so as to cover an opening of the annular frame 9. The adhesive tape 7 exposed at the opening of the annular frame 9 is attached to the back surface 1b side of the workpiece 1. That is, the workpiece 1 is supported by the annular frame 9 via the adhesive tape 7.

[0029] 1 is a perspective view showing a schematic diagram of a cutting device 2, which is an example of a processing device according to the present embodiment. In the following, an example will be described in which the processing device is the cutting device 2, but the processing device according to the present embodiment is not limited to the cutting device 2.

[0030] The cutting device 2 includes a base 4 that supports each of the components. An opening 4a is formed in the front corner of the base 4, and a cassette support table 8 that is raised and lowered by a lifting mechanism (not shown) is provided within this opening 4a. A cassette 10 that stores a plurality of workpieces 1 is mounted on the upper surface of the cassette support table 8. For ease of explanation, only the outline of the cassette 10 is shown in FIG. 1.

[0031] A rectangular opening 4b is formed on the side of the cassette support base 8 so that its longitudinal direction is along the X-axis direction (front-rear direction, processing feed direction). A ball screw type X-axis moving mechanism (not shown), a table cover 14 that covers the upper part of the X-axis moving mechanism, and a dust-proof / water-proof cover 16 are arranged inside the opening 4b. The X-axis moving mechanism includes an X-axis moving table (not shown) covered by the table cover 14, and moves this X-axis moving table in the X-axis direction.

[0032] A chuck table 18 is disposed on the upper surface of the X-axis moving table so as to be exposed from the table cover 14. The chuck table 18 has a function of suction-holding the workpiece 1 placed on a holding surface 18a exposed upward. The chuck table 18 is connected to a rotation drive source (not shown) such as a motor, and rotates about a rotation axis roughly parallel to the Z-axis direction (vertical direction).

[0033] The chuck table 18 includes a porous member 18c having the same diameter as the workpiece 1, and a frame that covers the porous member 18c. A suction path (not shown) is formed inside the chuck table 18, one end of which is connected to a suction source (not shown) such as an ejector provided outside the chuck table 18. The other end of the suction path reaches the porous member 18c.

[0034] The upper surface of the porous member 18c is exposed on the holding surface 18a of the chuck table 18. The upper surface of the porous member 18c has the same diameter as the workpiece 1 and is formed approximately parallel to the X-axis and Y-axis directions. Furthermore, a plurality of clamps 18b are provided around the periphery of the chuck table 18 to fix the annular frame 9 supporting the workpiece 1 from all four sides.

[0035] When the workpiece 1 is held by the chuck table 18, first, the frame unit 11 is placed on the holding surface 18a of the chuck table 18. Then, the suction source and the porous member 18c are connected via the suction path, and negative pressure is applied to the workpiece 1 via the adhesive tape 7.

[0036] The cutting device 2 is provided with a transport unit (not shown) in an area adjacent to the opening 4b, which transports the workpiece 1 to the chuck table 18 and the like. A temporary placement mechanism for temporarily placing the workpiece 1 is provided in a position close to the side of the cassette support base 8. The temporary placement mechanism includes, for example, a pair of guide rails 12 that move toward and away from each other while maintaining a state parallel to the Y-axis direction (indexing feed direction). The pair of guide rails 12 sandwich the workpiece 1 pulled out of the cassette 10 by the transport unit along the X-axis direction, and align it to a predetermined position.

[0037] The workpiece 1 aligned in a predetermined position is lifted up by the transport unit and transported to the chuck table 18. At this time, the pair of guide rails 12 are separated from each other, and the workpiece 1 is passed between the pair of guide rails 12.

[0038] A first processing unit 24a and a second processing unit 24b that cut the workpiece 1 with an annular cutting blade are provided above the chuck table 18. A gate-shaped support structure 20 for supporting the first processing unit 24a and the second processing unit 24b is disposed on the upper surface of the base 4 so as to straddle the opening 4b.

[0039] A first moving unit 22a that moves the first processing unit 24a in the Y-axis direction and the Z-axis direction, and a second moving unit 22b that moves the second processing unit 24b in the Y-axis direction and the Z-axis direction are provided on the upper front surface of the support structure 20. The first moving unit 22a includes a Y-axis moving plate 28a, and the second moving unit 22b includes a Y-axis moving plate 28b. The two Y-axis moving plates 28a, 28b are slidably mounted on a pair of Y-axis guide rails 26 arranged on the front surface of the support structure 20 along the Y-axis direction.

[0040] A nut portion (not shown) is provided on the back surface side (rear surface side) of the Y-axis moving plate 28a, and a Y-axis ball screw 30a that is generally parallel to the Y-axis guide rail 26 is screwed into this nut portion. In addition, a nut portion (not shown) is provided on the back surface side (rear surface side) of the Y-axis moving plate 28b, and a Y-axis ball screw 30b that is generally parallel to the Y-axis guide rail 26 is screwed into this nut portion.

[0041] A Y-axis pulse motor 32a is connected to one end of the Y-axis ball screw 30a. When the Y-axis ball screw 30a is rotated by the Y-axis pulse motor 32a, the Y-axis moving plate 28a moves in the Y-axis direction along the Y-axis guide rail 26. In addition, a Y-axis pulse motor (not shown) is connected to one end of the Y-axis ball screw 30b. When the Y-axis ball screw 30b is rotated by the Y-axis pulse motor, the Y-axis moving plate 28b moves in the Y-axis direction along the Y-axis guide rail 26.

[0042] A pair of Z-axis guide rails 34a are provided along the Z-axis direction on the surface (front surface) side of the Y-axis moving plate 28a, and a pair of Z-axis guide rails 34b are provided along the Z-axis direction on the surface (front surface) side of the Y-axis moving plate 28b. A Z-axis moving plate 36a is slidably attached to the pair of Z-axis guide rails 34a, and a Z-axis moving plate 36b is slidably attached to the pair of Z-axis guide rails 34b.

[0043] A nut portion (not shown) is provided on the back surface side (rear surface side) of the Z-axis moving plate 36a, and a Z-axis ball screw 38a provided along a direction generally parallel to the Z-axis guide rail 34a is screwed into the nut portion. A Z-axis pulse motor 40a is connected to one end of the Z-axis ball screw 38a, and the Z-axis moving plate 36a moves in the Z-axis direction along the Z-axis guide rail 34a by rotating the Z-axis ball screw 38a with the Z-axis pulse motor 40a.

[0044] A nut portion (not shown) is provided on the back surface side (rear surface side) of the Z-axis moving plate 36b, and a Z-axis ball screw 38b provided along a direction generally parallel to the Z-axis guide rail 34b is screwed into the nut portion. A Z-axis pulse motor 40b is connected to one end of the Z-axis ball screw 38b, and the Z-axis moving plate 36b moves in the Z-axis direction along the Z-axis guide rail 34b by rotating the Z-axis ball screw 38b with the Z-axis pulse motor 40b.

[0045] A first machining unit 24a is provided below the Z-axis moving plate 36a. A camera unit 46a for photographing the workpiece 1 suction-held by the chuck table 18 is provided adjacent to the first machining unit 24a. A second machining unit 24b is provided below the Z-axis moving plate 36b. A camera unit 46b for photographing the workpiece 1 suction-held by the chuck table 18 is provided adjacent to the second machining unit 24b.

[0046] The first moving unit 22a controls the positions of the first machining unit 24a and the camera unit 46a in the Y-axis direction and the Z-axis direction, and the second moving unit 22b controls the positions of the second machining unit 24b and the camera unit 46b in the Y-axis direction and the Z-axis direction. The positions of the first machining unit 24a and the second machining unit 24b are controlled independently of each other.

[0047] Fig. 2 is a perspective view showing a workpiece 1 to be cut by a processing unit 24 (first processing unit 24a or second processing unit 24b) equipped with a cutting blade 44. Note that the clamp 18b of the chuck table 18 and the camera units 46a, 46b are omitted in Fig. 2. The processing unit (cutting unit) 24 includes an annular cutting blade 44 and a spindle (not shown) that is inserted into a central through-hole of the cutting blade 44. The cutting blade 44 can be rotated by rotating the spindle.

[0048] The cutting blade 44 has a grinding wheel part including countless abrasive grains such as diamond and a bond for dispersing and fixing the abrasive grains on its outer periphery. When the grinding wheel part is brought into contact with the workpiece 1 along the intended division line 3 while rotating the cutting blade 44, the workpiece 1 is cut and a processing mark 3a is formed.

[0049] When processing the workpiece 1, first, the surface 1a of the workpiece 1 held by the chuck table 18 is photographed by the camera units 46a, 46b to detect the division line 3. Then, the chuck table 18 is rotated about an axis perpendicular to the holding surface 18a so that the extension direction of the division line 3 coincides with the processing feed direction (X-axis direction). After that, the cutting blade 44 is positioned above the end of the division line 3, and the cutting blade 44 is rotated.

[0050] Thereafter, the processing unit 24 is lowered so that the lower end of the cutting blade 44 reaches the adhesive tape 7 below the back surface 1b of the workpiece 1. Then, when the workpiece 1 is processed and fed along the X-axis direction, the workpiece 1 is cut and processing marks (cut grooves) 3a are formed along the intended division lines 3. After processing the workpiece 1 along one of the intended division lines 3, the processing unit 24 is indexed and fed in the Y-axis direction perpendicular to the X-axis direction, and the workpiece 1 is similarly processed along the other intended division lines 3.

[0051] In this manner, the workpieces 1 are machined one after another, and after the workpiece 1 has been machined along all of the planned dividing lines 3 in one direction, the chuck table 18 is rotated about an axis perpendicular to the holding surface 18a, and the planned dividing lines 3 in the other direction are aligned with the processing feed direction. Thereafter, the workpieces 1 are machined one after another along the planned dividing lines 3 in the other direction. When the workpiece 1 has been machined along all of the planned dividing lines 3 and machining marks 3a have been formed, the processing of the workpiece 1 by the cutting device 2 is completed.

[0052] The cutting device (processing device) 2 will be further described with reference to Fig. 1. An opening 4c is formed at a position opposite to the opening 4a with respect to the opening 4b. A cleaning unit 48 for cleaning the workpiece 1 is disposed within the opening 4c, and the workpiece 1 processed on the chuck table 18 is cleaned by the cleaning unit 48. The workpiece 1 cleaned by the cleaning unit 48 is stored in the cassette 10 again.

[0053] Furthermore, the cutting device 2 is equipped with a display unit 50 capable of displaying various types of information. The display unit 50 displays information showing the state of the cutting device 2 and the workpiece 1, information showing the progress of the processing, information showing the presence or absence of an abnormality, and notifies such information to a user or manager of the cutting device 2. The display unit 50 also has a function of displaying images captured by the camera units 46a and 46b. The display unit 50 is, for example, a monitor such as a liquid crystal display.

[0054] An input device (input interface) such as a touch panel may be incorporated in the display unit 50. If the display unit 50 is a display with a touch panel, a user of the cutting device 2 can use the display unit 50 to input various commands to the cutting device 2 and operate the cutting device 2. In this case, an operation screen is displayed on the display unit 50.

[0055] The cutting device 2 also includes a control unit 52 that controls each component of the cutting device 2. The control unit 52 controls the X-axis direction moving mechanism, the moving units 22a and 22b, the processing units 24a and 24b, the camera units 46a and 46b, the chuck table 18, the cleaning unit 48, the display unit 50, various conveying devices, and the like. The control unit 52 then causes the cutting device 2 to proceed with the processing of the workpiece 1.

[0056] The control unit 52 is configured by a computer including, for example, a processing device such as a CPU or a microprocessor, and a storage device such as a flash memory or a hard disk drive. The control unit 52 functions as a concrete means in which the software and the processing device (hardware resource) work together by operating the processing device according to software such as a program stored in the storage device.

[0057] The control unit 52 includes a memory section 52a that stores various information and the like, as well as the processing conditions for processing various types of workpieces 1 by the processing units 24a and 24b. The processing conditions stored in the memory section 52a include information such as the type and size of the workpiece 1 to be processed, the rotation speed and cutting depth of the cutting blade 44, the processing feed rate, the cutting water injection conditions, and the type of cutting blade 44 used for processing. A plurality of processing conditions are registered in advance in the memory section 52a, and the conditions suitable for processing the workpiece 1 to be processed are appropriately selected and referenced.

[0058] In the cutting device 2, when the workpiece 1 processed by the processing units 24a, 24b is photographed by the camera units 46a, 46b, the formed processing marks 3a can be analyzed. The analysis of the processing marks 3a is called a kerf check. By carrying out a kerf check, the quality of the processing marks 3a formed on the workpiece 1 can be monitored. And, for example, when a processing mark 3a of an unacceptable shape is formed on the workpiece 1, the cutting device 2 can interrupt processing or issue a warning to the manager of the cutting device 2 to encourage an inspection.

[0059] The kerf check is performed while the machining units 24a, 24b are machining the workpiece 1. Fig. 3 is a plan view showing a machining mark 3a formed on the workpiece 1 and an image capturing position 3b where the camera units 46a, 46b capture images. When the camera units 46a, 46b capture an image of the surface 1a of the workpiece 1 at the image capturing position 3b, an image showing the machining mark 3a is obtained. The control unit 52 also performs a kerf check while the machining units 24a, 24b are machining the workpiece 1.

[0060] The control unit 52 includes a processing mark judgment section 52b that performs a kerf check of the processing mark 3a from an image obtained by photographing the workpiece 1 on which the processing unit 24a, 24b has processed and formed the processing mark 3a, and judges whether the processing mark 3a is good or bad. The memory section 52a stores in advance judgment conditions for the processing mark judgment section 52b to judge whether the processing mark 3a is good or bad.

[0061] Here, the kerf check of the processing mark 3a of the processed workpiece 1 will be described. Fig. 4 is a schematic enlarged plan view of the surface 1a of the workpiece 1 on which the processing mark 3a is formed. In Fig. 4, the center line 13 of the planned division line 3, the end 15 of the detected processing mark 3a, and the center line 17 of the processing mark 3a are shown by dashed straight lines.

[0062] Furthermore, in Fig. 4, the off-center 19 indicating the deviation between the center line 13 of the planned division line 3 and the center line 17 of the processing mark 3a, the minimum kerf width 21, and the maximum kerf width 23 are indicated by arrows. Also, as shown typically in Fig. 4, a chip called chipping occurs at the end 15 of the processing mark 3a. In Fig. 4, the maximum chipping size 27, which is the distance from the end 15 of the processing mark 3a to the farthest point of the maximum chipping 25, and the distance 29 from the center line 17 of the processing mark 3a to the end of the chipping 25 are indicated by arrows.

[0063] The judgment items for judging the acceptability of the machining mark 3a performed by the machining mark judgment unit 52b are, for example, the off-center 19, the minimum kerf width 21, the maximum kerf width 23, the maximum chipping size 27, the distance 29 from the center line 17 of the machining mark 3a to the end of the chipping 25, etc. A tolerance is set for each judgment item. The machining mark judgment unit 52b judges the acceptability of the machining mark 3a by judging whether the detection values ​​for these judgment items are within the tolerances from the images captured by the camera units 46a and 46b by photographing the workpiece 1.

[0064] Here, the judgment conditions such as the judgment items and their allowable values ​​when judging the quality of the machining marks 3a can be appropriately selected. The judgment conditions for appropriately judging the quality of the machining marks 3a vary depending on the type of the workpiece 1 and the machining conditions of the machining performed on the workpiece 1, and so the judgment conditions are associated with the machining conditions and stored in advance in the storage unit 52a.

[0065] Furthermore, the machining mark determination unit 52b performs image processing on the image obtained by photographing the workpiece 1 with the camera units 46a, 46b in order to extract the machining marks 3a from the image. There are appropriate conditions for this image processing depending on the type and machining conditions of the workpiece 1. The storage unit 52a may store the image processing conditions for processing the image as one item of the determination conditions, and the image processing conditions may be stored in the storage unit 52a in association with the machining conditions of the workpiece 1.

[0066] For example, the processing mark determination unit 52b performs a binarization process on the image, and detects the boundary between the area of ​​white pixels and the area of ​​black pixels present on the planned division line 3 as the outer edge (edge) of the processing mark 3a. Note that the image processing performed by the processing mark determination unit 52b on the image is not limited to this, and other known edge detection methods may be used. Also, a filter process for reducing noise appearing in the image, such as a Gaussian filter or a median filter, may be performed on the image in advance.

[0067] Here, the cutting device (processing device) 2 may start processing a new type of workpiece 1. Also, the cutting device 2 may start processing under new processing conditions. In these cases, new judgment conditions are required to judge the quality of the processing marks 3a formed on the workpiece 1. Furthermore, in order to improve the accuracy of judging the quality of the processing marks 3a, attempts may be made to improve the judgment conditions that have been used in the past. In these cases, it is necessary to evaluate whether the new judgment conditions are capable of performing an appropriate judgment.

[0068] In order to evaluate the judgment conditions for judging the quality of the processing marks 3a, it is advisable to actually judge the quality of the processing marks 3a based on the judgment conditions to be evaluated and confirm the accuracy of this judgment. That is, the workpiece 1 is actually processed by the processing units 24a and 24b to form the processing marks 3a on the workpiece 1, while the workpiece 1 is photographed by the camera units 46a and 46b, and the quality of the processing marks 3a is judged from the obtained images based on the judgment conditions to be evaluated. Then, the judgment result is verified.

[0069] However, preparing the workpiece 1, actually processing the workpiece 1 with the cutting device 2 to form the processing marks 3a, and photographing the workpiece 1 with the camera units 46a and 46b to form an image requires time and money costs. In addition, if the judgment conditions are evaluated as inappropriate, it is necessary to improve the judgment conditions and re-evaluate, which requires further costs.

[0070] In addition, the quality of the machining marks 3a formed on the workpiece 1 varies, and therefore it is necessary to judge the quality of the machining marks 3a when the workpiece 1 is actually machined by the cutting device 2. If there is variation in the quality of the machining marks 3a that are the subject of judgment when evaluating each judgment condition, the result of the evaluation of the judgment condition will be influenced by this variation. Therefore, the judgment conditions cannot be stably evaluated.

[0071] Therefore, in the processing device (cutting device 2, etc.) according to this embodiment, in order to stably and easily evaluate the judgment conditions of the processing marks 3a, the images obtained by photographing the workpiece 1 on which the processing marks 3a are formed by the processing units 24a, 24b with the camera units 46a, 46b are stored in advance in the storage unit 52a. Then, this image is read out from the storage unit 52a, and the quality of the processing marks 3a in the image is judged based on the judgment conditions to be evaluated, and the judgment results are verified to evaluate the judgment conditions.

[0072] 5 is a plan view showing a typical judgment condition setting screen 54 displayed on the display unit 50 of the cutting device 2 when the operator sets the judgment items of the judgment conditions and the allowable values ​​of the judgment items. The judgment condition setting screen 54 includes an image 56 obtained by photographing the surface 1a of the workpiece 1, on which the machining marks 3a have been formed after being machined by the machining units 24a and 24b, using the camera units 46a and 46b, and judgment conditions 58. The judgment condition setting screen 54 also includes a screen description 60 for explaining the screen displayed on the display unit 50.

[0073] For example, the judgment condition setting screen 54 includes an operation button 64 for inputting a specific operation to the control unit 52. For example, the operator touches the operation button 64 to instruct the machining mark judgment section 52b to perform a kerf check of the currently displayed image 56, and causes the machining mark judgment section 52b to judge whether the machining mark 3a is good or bad based on the judgment conditions 58.

[0074] Alternatively, the control unit 52 photographs the workpiece 1 with the camera units 46a, 46b at a predetermined timing while the workpiece 1 is being processed by the processing units 24a, 24b, to obtain an image 56, and causes the processing mark judgment unit 52b to perform a kerf check. At this time, the memory unit 52a stores the image 56, and the processing mark judgment unit 52b reads the image 56 from the memory unit 52a and judges whether the processing mark 3a is good or bad based on judgment conditions 58 previously stored in the memory unit 52a.

[0075] The obtained kerf check result 62 is then superimposed on the image 56 displayed on the judgment condition setting screen 54 shown in Fig. 5. As shown in Fig. 5, the kerf check result 62 includes a detection value of the off-center 19 (see Fig. 4), a detection value of the kerf width, and an evaluation value of the distance from the kerf center (center line 17 of the machining mark 3a) to the outermost point of the chipping 25. Furthermore, the kerf check result 62 includes an evaluation value of the maximum chipping size 27 (see Fig. 4) and an evaluation value of the total area of ​​the display pixels of the chipping in the image 56.

[0076] The display unit 50 also displays the current judgment items of the judgment conditions 58 for the machining mark judgment section 52b to judge the acceptability of the machining marks 3a, and the allowable values ​​of the current judgment items. The judgment conditions 58 may be stored in advance in the storage section 52a, and the control unit 52 reads out the judgment conditions 58 from the storage section 52a and displays them on the judgment condition setting screen 54. The judgment condition setting screen 54 displays the result of the machining mark judgment section 52b judging the acceptability of the machining marks 3a shown in the image 56 based on the judgment conditions 58.

[0077] In the example shown in Fig. 5, the tolerance for off-center 19 is 0.005 mm, but the detected value is 0.003 mm, so the machining mark 3a is judged as good in this judgment item. Also, the tolerance (allowable range) for kerf width is 0.022 mm or more and 0.025 mm or less, but the detected value is 0.023 mm, so the machining mark 3a is also judged as good in this judgment item. Also, the tolerance for chipping area is 5000 pix, but the detected value is 4500 pix, so the machining mark 3a is also judged as good in this judgment item.

[0078] On the other hand, the detected value of the distance from the kerf center (center line 17 of the machining mark 3a) to the outermost point of the chipping 25, which is displayed under the name "kerf center-chipping" on the judgment condition setting screen 54 shown in Fig. 5, is outside the allowable value. That is, the allowable value for this evaluation item is set to 0.032 mm, but the detected value is 0.040 mm. At this point, the machining mark 3a is judged to be defective.

[0079] In addition, the allowable value of the maximum chipping size 27, indicated by the name "Max chipping", is set to 0.015 mm, but the detected value is 0.017 mm. Therefore, the machining mark 3a is judged to be defective at this point.

[0080] In the judgment condition setting screen 54, among the detection values ​​displayed superimposed on the image 56, the detection values ​​related to the judgment items for which the processing marks 3a are judged to be defective may be highlighted by enclosing, underlining, writing in bold, changing the color, etc. Also, in the display of the judgment conditions 58, the setting value column related to the judgment items for which the processing marks 3a are judged to be defective may be highlighted by underlining, writing in bold, changing the color, etc.

[0081] Here, if the machining mark 3a formed on the workpiece 1 should be determined as defective, it is preferable that the machining mark 3a be determined as defective by a judgment in accordance with the judgment condition 58. On the other hand, if the machining mark 3a should not be determined as defective when taking into account the type of the workpiece 1, the machining conditions, etc., it is necessary to change the judgment items and their allowable values ​​of the judgment condition 58.

[0082] The operator can change the judgment conditions 58 by using the judgment condition setting screen 54 displayed on the display unit 50. For example, the operator touches and selects the judgment item for which he or she wishes to change the tolerance among the judgment conditions 58 displayed on the judgment condition setting screen 54. Then, the operator uses a numeric keypad image or the like displayed at this time to input a number that will be the new tolerance.

[0083] Fig. 6 is a plan view showing a schematic diagram of the display unit 50 on which the judgment condition setting screen 54 is displayed after the operator has changed the judgment condition 58. In the example shown in Fig. 6, the allowable value for the item of the distance from the kerf center (the center line 17 of the machining mark 3a) to the outermost point of the chipping 25 has been changed to 0.050 mm. Also, the allowable value for the maximum chipping size 27 has been changed to 0.020 mm. The changed judgment condition may be newly stored in the memory unit 52a.

[0084] Thereafter, the operator touches the operation button 64 to instruct to carry out a kerf check, and the machining mark determination unit 52b determines whether the machining mark 3a formed on the workpiece 1 is good or bad based on the changed determination condition 58. Here, after the image 56 is taken at the predetermined photographing position 3b (see FIG. 3), the positions of the camera units 46a, 46b are changed while the machining of the workpiece 1 progresses.

[0085] Therefore, in the processing device (cutting device 2) of this embodiment, the processing mark judgment unit 52b performs a kerf check based on the image 56 stored in the memory unit 52a, and judges the quality of the processing mark 3a shown in the image 56 under the changed new judgment conditions 58.

[0086] 6, as a result of the processing mark judgment unit 52b judging the acceptability of the processing mark 3a shown in the image 56, it is confirmed that the allowable values ​​are met for all judgment items of the judgment conditions 58. That is, the processing mark 3a is judged as good. Then, if the processing mark 3a shown in the image 56 should be judged as good, it is confirmed that the acceptability of the processing mark 3a was appropriately judged based on the changed new judgment conditions 58. That is, the operator can evaluate that the changed judgment conditions 58 are not inappropriate.

[0087] In this way, in the processing device (cutting device 2) according to this embodiment, a kerf check can be performed based on the image 56 stored in the storage unit 52a, and the quality of the processing marks 3a shown in the image 56 can be determined. Therefore, there is no need to process the workpiece 1 again to obtain a new image of the surface 1a of the workpiece 1, and no cost is required to prepare a new image.

[0088] Furthermore, in the cutting device 2, a plurality of images each showing the machining marks 3a may be stored in the memory section 52a of the control unit 52. Then, the machining mark judgment section 52b may perform a kerf check based on the plurality of images stored in the memory section 52a and judge the quality of the machining marks 3a shown in each image according to the judgment condition 58. The memory section 52a accumulates images obtained each time the camera units 46a, 46b photograph the workpiece 1 at a predetermined timing while the workpiece 1 is being machined by the machining units 24a, 24b.

[0089] FIG. 7 is a plan view that shows a schematic diagram of the display unit 50 that displays a judgment condition setting screen 54 including one image 58a out of the multiple images stored in the storage unit 52a and the kerf check result thereof.

[0090] 7, the judgment condition setting screen 54 includes an operation button 64 for instructing the processing mark judgment unit 52b to perform a kerf check on the multiple images (which may be all images) stored in the memory unit 52a and to judge the quality of the processing marks 3a based on the judgment conditions 58. When the operator touches this operation button 64, the processing mark judgment unit 52b performs a kerf check on each of the multiple images stored in the memory unit 52a and judges the quality of the processing marks 3a shown in each of the multiple images based on the judgment conditions 58.

[0091] Then, the processing mark judgment unit 52b calculates the ratio of images in which the judgment result of the processing mark 3a shown in the plurality of images is judged to be good or bad. For example, an error rate 66 is displayed on the display unit 50 as a result of the processing mark judgment unit 52b judging the quality of the processing mark 3a based on the judgment condition 58. The judgment condition setting screen 54 shown in Fig. 6 indicates that the error rate 66 is 2%, and that the processing mark 3a was judged to be bad in 2% of the plurality of images stored in the storage unit 52a.

[0092] An important property that the judgment condition 58 should have is that the processing mark judgment unit 52b can judge the processing mark 3a that should be judged as good as good, and the processing mark judgment unit 52b can judge the processing mark 3a that should be judged as bad as bad. Such a judgment condition 58 should be highly evaluated, and a judgment condition 58 that cannot achieve this should be highly evaluated.

[0093] For example, the ratio of images that show processing marks 3a that should be judged as defective among the multiple images stored in the storage unit 52a is calculated in advance as an expected error rate. Then, the quality of the processing marks 3a shown in each of the multiple images stored in the storage unit 52a is judged based on the changed new judgment conditions 58, and the closer the error rate 66 is to the expected error rate, the better the judgment conditions 58 can be evaluated. For example, if the expected error rate is 2%, the judgment conditions 58 shown in FIG. 6 can be evaluated as excellent.

[0094] 7, an operation button 64 for switching the displayed image 56a is displayed. By touching this operation button 64, the operator can display another image on the display unit 50 and can confirm the result of the kerf check performed on the displayed image and the result of the pass / fail judgment of the processing mark 3a shown in the image. In this case, the operator can confirm the validity of the pass / fail judgment of the processing mark 3a by the processing mark judgment unit 52b based on the judgment condition 58.

[0095] 7, an image in which the captured processing mark 3a has been judged as defective may be displayed on the display unit 50. In this case, the operator can look at the image to confirm whether the processing mark judgment section 52b has correctly judged the captured processing mark 3a as defective in an image in which the captured processing mark 3a should be judged as defective.

[0096] In this way, in the processing device (cutting device 2) according to this embodiment, when evaluating the changed judgment conditions 58, it is not necessary to process the workpiece 1 to form the processing marks 3a and photograph the workpiece 1 with the camera units 46a, 46b at multiple photographing positions. In other words, since the processing marks 3a captured in each of the multiple images stored in the storage unit 52a can be judged one after another by the judgment conditions 58, it is possible to quickly and efficiently evaluate whether the judgment conditions 58 implement appropriate judgment.

[0097] The processing device (cutting device 2) according to this embodiment may be capable of automatically evaluating the judgment conditions and may be capable of notifying the operator of the evaluation results. For example, the control unit 52 may be provided with a judgment condition evaluation unit 52c (see FIG. 1) that automatically evaluates the judgment conditions. In this case, the operator does not need to evaluate the judgment conditions himself, and can check the evaluation results of each of the multiple judgment conditions and select a more appropriate judgment condition.

[0098] For example, the operator stores in advance in the storage unit 52a the quality of the processing marks 3a shown in the images stored in the storage unit 52a in association with the images. Then, the judgment condition evaluation unit 52c causes the processing mark judgment unit 52b to judge the quality of the processing marks 3a shown in the images stored in the storage unit 52a based on the judgment conditions to be evaluated. Then, the judgment condition evaluation unit 52c compares this judgment result with the quality of the processing marks 3a shown in the images stored in the storage unit 52a to evaluate the judgment conditions.

[0099] More specifically, when the processing marks 3a shown in the image stored in the storage unit 52a are good, information indicating that the processing marks 3a are good is associated with the image and stored in the storage unit 52a. Then, the judgment condition evaluation unit 52c causes the processing mark judgment unit 52b to judge the quality of the processing marks 3a shown in the image stored in the storage unit 52a under the judgment conditions to be evaluated.

[0100] As a result, when the processing mark determination unit 52b determines the processing mark 3a as good, the determination condition evaluation unit 52c refers to the information stored in the storage unit 52a and evaluates that the determination condition succeeded in appropriately determining the processing mark 3a shown in the image. On the other hand, when the processing mark determination unit 52b determines the processing mark 3a as bad, the determination condition evaluation unit 52c refers to the information stored in the storage unit 52a and evaluates that the determination condition failed to appropriately determine the processing mark 3a shown in the image.

[0101] Also, for example, if the processing mark 3a shown in the image stored in the storage unit 52a is defective, information that the processing mark 3a is defective is associated with the image and stored in the storage unit 52a. Then, the judgment condition evaluation unit 52c causes the processing mark judgment unit 52b to judge whether the processing mark 3a shown in the image is good or bad based on the judgment condition, and as a result, if the processing mark 3a is judged to be defective, it evaluates that the judgment condition has succeeded in appropriately judging the processing mark 3a.

[0102] In this way, if the quality of the processing marks 3a shown in the images is stored in the storage unit 52a in association with the images, it becomes possible to evaluate whether the processing marks 3a can be appropriately judged based on the judgment conditions to be evaluated. Furthermore, the judgment condition evaluation unit 52c may have the processing mark judgment unit 52b make a similar judgment on each of the processing marks 3a shown in the multiple images under the judgment conditions to be evaluated, and evaluate the accuracy of the judgment conditions.

[0103] That is, the memory unit 52a stores in advance a plurality of images and the quality of each of the processing marks 3a in each image in association with each other. The judgment condition evaluation unit 52c then causes the processing mark judgment unit 52b to judge the quality of the processing marks 3a in each of the plurality of images based on the judgment conditions to be evaluated. After that, the result is compared with the quality of each of the processing marks 3a stored in the memory unit 52a, the number of matches (number of correct answers) is counted, and the judgment conditions are evaluated based on the match rate.

[0104] For example, the memory unit 52a may store in advance a plurality of images and the quality of the processing marks 3a in each image in association with each other, and may also store in advance a plurality of judgment conditions to be evaluated. The judgment condition evaluation unit 52c may then be caused to judge the quality of the processing marks 3a in each image in the same manner based on each judgment condition, thereby calculating the coincidence rate of each judgment condition. The judgment condition evaluation unit 52c may determine the merits or demerits of each judgment condition based on the degree of coincidence, and notify the operator of the result.

[0105] As described above, the memory unit 52a of the control unit 52 of the processing device (cutting device 2) according to this embodiment stores an image showing the processing mark 3a. The processing mark determination unit 52b can determine whether the processing mark 3a shown in the image stored in the memory unit 52a is good or bad.

[0106] Even when multiple judgment conditions are to be evaluated, the processing marks 3a appearing in the images stored in the storage unit 52a can be judged in the same manner for each judgment condition. Therefore, compared to the case where the workpiece 1 is processed and the workpiece 1 is photographed to obtain an image each time each judgment condition is evaluated, the processing variation does not affect the evaluation of each judgment condition, and each judgment condition can be stably and easily evaluated.

[0107] The present invention is not limited to the above embodiment, and can be modified in various ways. For example, in the above embodiment, the processing device is a cutting device 2, but the present invention is not limited to this. For example, the processing device according to the present invention may be a laser processing device that irradiates a workpiece 1 with a laser beam to perform laser processing. The laser processing device includes a laser processing unit that can irradiate the workpiece 1 with a laser beam as a processing unit.

[0108] For example, a laser processing device according to one embodiment of the present invention focuses a laser beam having a wavelength absorbed by the workpiece 1 (a wavelength that can be absorbed by the workpiece 1) on the surface of the workpiece 1 to ablate the workpiece 1. As a result, a processed groove is formed in the workpiece 1 as a processed mark 3a. Then, when the processed groove is formed in the workpiece 1 along the planned division line 3, the workpiece 1 is divided. When the workpiece 1 with the processed groove formed is photographed, the quality of the processed groove can be judged from the obtained image.

[0109] Alternatively, a laser processing device according to an embodiment of the present invention focuses a laser beam having a wavelength that can pass through the workpiece 1 (a wavelength that has transparency to the workpiece 1) inside the workpiece 1, and forms a modified layer as a processing mark 3a inside the workpiece 1. This modified layer becomes the starting point for dividing the workpiece 1. In other words, the workpiece 1 can be divided by extending a crack that extends vertically from the modified layer. When the workpiece 1 on which the modified layer has been formed is photographed, the quality of the modified layer can be determined from the obtained image.

[0110] In these laser processing devices, if the memory section 52a of the control unit 52 can store an image showing the processing mark 3a, the processing mark judgment section 52b can judge the quality of the processing mark 3a based on this image. Therefore, when evaluating new judgment conditions, it is not necessary to laser process the workpiece 1 to form the processing mark 3a and then photograph the workpiece 1 to form an image.

[0111] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of symbols]

[0112] 1 Workpiece 1a surface 1b back side 3. Planned division line 3a Machining marks 3b Shooting position 5 Devices 7. Adhesive Tape 9 Annular Frame 11 Frame unit 13,17 center line 15 End 19 Off-Center 21 Minimum kerf width 23 Maximum kerf width 25 Chipping 27 Maximum chipping size 29 distance 2 Cutting equipment 4 Foundation 4a,4b,4c opening 8 Cassette Support Stand 10 Cassettes 12 Guide rail 14 Table Cover 16 Dust-proof / water-proof cover 18 Chuck table 18a Holding surface 18b Clamp 18c Porous material 20 Support structure 22a, 22b Mobile unit 24, 24a, 24b Processing unit 26, 34a, 34b Guide rails 28a, 28b, 36a, 36b Moving plate 30a, 30b, 38a, 38b Ball screw 32a, 40a, 40b Pulse motor 44 Cutting blade 46a, 46b Camera unit 48 Cleaning Unit 50 display units 52 Control Unit 52a Storage section 52b Machining mark determination section 52c Judgment condition evaluation section 54 Judgment condition setting screen 56 images 58 Judgment Conditions 60 Screen Description 62 Kerf Check Results 64 Operation Buttons 66 Error rate

Claims

1. A processing apparatus including a chuck table capable of holding a workpiece having a plurality of planned division lines, a processing unit that processes the workpiece held by the chuck table along the planned division lines, a camera unit that photographs the workpiece held by the chuck table, and a control unit that controls the processing unit and the camera unit, The control unit A storage unit that photographs the workpiece on which a processing mark is formed by the processing unit using the camera unit and stores the image obtained; a processing mark judgment unit that can read out the image stored in the memory unit and judge the quality of the processing mark shown in the image.

2. The processing mark determination unit includes: The image stored in the storage unit is read out, and the quality of the processing mark is judged based on a judgment condition.

2. The processing device according to claim 1, wherein the quality of the processing marks shown in the image stored in the storage unit is judged based on the changed judgment condition.

3. The storage unit further stores the quality of the processing marks shown in the image in association with the image, The processing device described in claim 1, characterized in that the control unit further includes a judgment condition evaluation unit that can evaluate the judgment conditions by comparing the result of the judgment by the processing mark judgment unit regarding the quality of the processing marks shown in the image stored in the memory unit based on judgment conditions with the quality of the processing marks shown in the image stored in the memory unit.

4. A processing apparatus including a chuck table capable of holding a workpiece having a plurality of planned division lines, a processing unit that processes the workpiece held by the chuck table along the planned division lines, a camera unit that photographs the workpiece held by the chuck table, and a control unit that controls the processing unit and the camera unit, The control unit A storage unit that photographs the workpiece on which processing marks are formed by the processing unit using the camera unit and stores a plurality of images obtained; a processing mark determination unit capable of reading out a plurality of the images stored in the storage unit and determining whether the processing mark shown in each of the images is good or bad; The processing device is characterized in that the processing mark judgment unit is capable of calculating the proportion of images among the multiple images in which the judgment result for the processing marks depicted therein is a good judgment or the proportion of images in which the judgment result for the processing marks depicted therein is a bad judgment.

5. The processing mark determination unit includes: Reading out the plurality of images stored in the storage unit, and judging the quality of each of the processing marks based on a judgment condition; 5. The processing device according to claim 4, wherein the quality of the processing marks appearing in each of the plurality of images stored in the storage unit is judged based on the changed judgment condition.

6. The storage unit further stores the quality of each of the processing marks shown in the plurality of images in association with each of the images; The processing device described in claim 4, characterized in that the control unit further includes a judgment condition evaluation unit that compares the result of the judgment by the processing mark judgment unit regarding the quality of the processing marks shown in the multiple images stored in the memory unit based on judgment conditions with the quality of the processing marks shown in each of the images stored in the memory unit to calculate a match rate, and evaluates the judgment conditions based on the match rate.

7. 7. The processing device according to claim 2, 3, 5 or 6, wherein the judgment conditions are one or both of image processing conditions for processing the image, and judgment items and allowable values ​​for the judgment items.

8. the processing unit is a cutting unit that cuts the workpiece along the planned dividing line with a cutting blade, 8. The processing device according to claim 1, wherein the machining marks are cutting grooves formed in the workpiece by the cutting blade.

Images