Chuck Table Mechanism

Abstract

To provide a chuck table mechanism that allows easy attachment of a chuck table to a table base even if the chuck table has a heavy weight.SOLUTION: A chuck table mechanism includes a chuck table 20 including a holding surface that holds a workpiece and an undersurface on the opposite side of the holding surface, and a table base 120 that supports the undersurface 20b of the chuck table in a freely removable way. The table base includes a support surface 122 that supports the undersurface of the chuck table, a central suction hole 123 that is formed in the center part of the support surface, and a plurality of undersurface holding suction holes 127 that are formed in the support surface 122 and suck and hold the undersurface of the chuck table. The chuck table mechanism includes compressed air supply means 140 that, when the chuck table is attached to the support surface of the table base, supplies compressed air H to the plurality of undersurface holding suction holes to form an air layer between the undersurface of the chuck table and the support surface of the table base.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a chuck table mechanism including a chuck table that holds a workpiece and a table base that detachably supports the lower surface of the chuck table. [Background technology]

[0002] A wafer having a number of devices such as ICs and LSIs formed on its front surface and partitioned along planned dividing lines has its back surface ground by a grinding device to form the wafer into the desired thickness. The wafer is then divided into individual device chips by a processing device such as a laser processing device or a cutting device. These chips are then used in electrical devices such as mobile phones and personal computers.

[0003] The processing device includes a holding table that holds a wafer by suction, and processes the wafer held on the holding table into a desired shape using various processing means, such as a grinding means, a laser irradiation means, and a cutting means.

[0004] In addition, there are multiple types of wafer diameters, such as 5 inches, 6 inches, and 8 inches, and chuck tables corresponding to the wafer sizes are prepared and replaced appropriately depending on the wafer size (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 3424052 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the chuck table is heavy (10 to 30 kg), and it takes time for an operator to pick up the chuck table, place it on the table base, and accurately align the table base and the chuck table to the desired positional relationship, making it difficult to attach the chuck table to the table base.

[0007] The present invention has been made in consideration of the above-mentioned circumstances, and its main technical object is to provide a chuck table mechanism that can easily attach the chuck table to a table base even if the chuck table is heavy. [Means for solving the problem]

[0008] In order to solve the above-mentioned main technical problem, according to the present invention, there is provided a chuck table having a holding surface for holding a workpiece and a lower surface opposite to the holding surface, and a table base for detachably supporting the lower surface of the chuck table, the table base having a support surface for supporting the lower surface of the chuck table, a central suction hole formed in the center of the support surface, and a lower surface holding suction hole formed in the support surface for suction-holding the lower surface of the chuck table, the support surface of the table base having a first magnet embedded in a first region, and a first magnet embedded in the first region. a second magnet embedded in a second region spaced from the first region, and a lower surface of the chuck table is provided with a third magnet embedded in a third region corresponding to the first region and attracted to the first magnet, and a fourth magnet embedded in a fourth region corresponding to the second region and attracted to the second magnet, and a compressed air supplying means is provided for supplying compressed air to the lower surface holding suction hole when the chuck table is attached to the support surface of the table base, thereby forming an air layer between the lower surface of the chuck table and the support surface of the table base. The first region is a region in which the first magnet is embedded, the first magnet being formed in a ring shape surrounding the central suction hole. A chuck table mechanism is provided. Effect of the Invention

[0009] The chuck table mechanism of the present invention includes a chuck table having a holding surface for holding a workpiece and a lower surface opposite to the holding surface, and a table base for detachably supporting the lower surface of the chuck table, the table base having a support surface for supporting the lower surface of the chuck table, a central suction hole formed in the center of the support surface, and an underside holding suction hole formed in the support surface for suction-holding the underside of the chuck table, and the support surface of the table base has a first magnet embedded in a first region and a second magnet extending from the first region. a second magnet embedded in a second region spaced apart from the first region, and a lower surface of the chuck table is provided with a third magnet embedded in a third region corresponding to the first region and attracted to the first magnet, and a fourth magnet embedded in a fourth region corresponding to the second region and attracted to the second magnet, and a compressed air supplying means is provided for supplying compressed air to the lower surface holding suction hole when the chuck table is attached to the support surface of the table base, thereby forming an air layer between the lower surface of the chuck table and the support surface of the table base. The first region is a region in which the first magnet is embedded, the first magnet being formed in a ring shape surrounding the central suction hole. As a result, even if the chuck table is a relatively heavy object, the air layer formed between the underside of the chuck table and the support surface of the table base makes it easy to move the chuck table, and the magnets properly position the chuck table on the table base, eliminating the problem of it being difficult to attach the chuck table to the table base. [Brief description of the drawings]

[0010] [Figure 1] FIG. 2 is a perspective view of a cutting device equipped with a chuck table mechanism. [Diagram 2] 2 is an enlarged exploded perspective view of a portion of a chuck table mechanism attached to the cutting device of FIG. 1. [Diagram 3] 3A is a plan view of the table base shown in FIG. 2, and FIG. 3B is a cross-sectional view taken along line AA of FIG. [Figure 4] 1A is an upper perspective view, a lower perspective view, a BB cross-sectional view, and a plan view of a 5-inch chuck table; FIG. 1B is an upper perspective view, a lower perspective view, a CC cross-sectional view, and a plan view of a 6-inch chuck table. [Diagram 5] FIG. 13 is a perspective view showing an embodiment in which an operator attaches a chuck table to a table base. [Figure 6] 6(a) to 6(c) are partially enlarged cross-sectional views of the chuck table and the table base, showing the embodiment shown in FIG. 5 at different times. [Figure 7] 13A and 13B are bottom perspective views showing another embodiment of the chuck table. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a chuck table mechanism configured based on the present invention will be described in detail with reference to the accompanying drawings.

[0012] 1 shows a cutting device 1 to which a chuck table mechanism 3 of this embodiment is applied. The cutting device 1 in the illustrated embodiment includes a substantially rectangular parallelepiped device housing 2, a chuck table mechanism 3 arranged as a holding means for holding a wafer 10, which is a workpiece, and a cutting means 4 equipped with a cutting blade 41 for cutting the wafer 10 held by the chuck table mechanism 3. As shown in the figure, the wafer 10 to be processed in this embodiment is, for example, a substantially disk-shaped semiconductor wafer having a diameter of 5 inches, with a plurality of devices formed on a surface partitioned by planned division lines, and is supported by an annular frame F via an adhesive tape T.

[0013] The cutting device 1 further includes a cassette 5 (indicated by a two-dot chain line) for accommodating a plurality of wafers 10, a temporary placement table 6 for carrying out and temporarily placing the wafers 10 accommodated in the cassette 5, a carry-in / out means 7 for carrying out the wafers 10 to the temporary placement table 6, a transport means 8 for rotating and transporting the wafers 10 carried out to the temporary placement table 6 onto the chuck table mechanism 3, a cleaning means 9 (details not shown) for cleaning the wafers 10 cut by the cutting means 4, a cleaning transport means 11 for transporting the cut wafers 10 from the chuck table mechanism 3 to the cleaning means 9, an imaging means 12 for imaging the wafers 10 on the chuck table mechanism 3, and a control means (not shown). The cassette 5 is placed on a cassette table 5a arranged so as to be movable up and down by a lifting means (not shown), and when the wafers 10 are carried out of the cassette 5 by the carry-in / out means 7, the height of the cassette 5 is appropriately adjusted.

[0014] Located within the device housing 2 is an X-axis feed means (not shown) which serves to feed the chuck table mechanism 3 and the cutting means 4 relative to one another for processing, and moves the chuck table mechanism 3 in the X-axis direction indicated by the arrow X, which is the cutting feed direction.

[0015] 2 shows a perspective view of the chuck table mechanism 3 mounted on the cutting device 1, in which the chuck table 20 for suction-holding the wafer 10 described above is removed upward from the chuck table mechanism 3. As shown in the figure, the chuck table mechanism 3 includes a chuck table 20 having a holding surface 24a formed to a size for suction-holding the wafer 10 having a diameter of 5 inches as shown in FIG. 1, a bottom surface 20b opposite to the holding surface 24a, and a table base 120 for detachably supporting the bottom surface 20b of the chuck table 20. The chuck table 20 is configured to be rotatable together with the table base 120 by a rotation drive mechanism (not shown). As described later, the chuck table mechanism 3 is capable of replacing the chuck table according to the size of the wafer, which is the workpiece.

[0016] 2, the table base 120 includes a support surface 122 that supports the lower surface 20b of the chuck table 20, a central suction hole 123 formed in the center of the support surface 122, and lower surface holding suction holes 127, 127 formed in the support surface 122 that suction-hold the lower surface 20b of the chuck table 20. In addition, the support surface 122 of the table base 120 includes a first magnet 125 embedded in a first region C1 on the support surface 122, and a second magnet 126 embedded in a second region C2 spaced apart from the first region C1.

[0017] FIG. 3(a) shows a plan view of the table base 120, and FIG. 3(b) shows a cross-sectional view of FIG. 3(a) taken along line AA. As can be seen from these figures, the first magnet 125 is formed in a ring shape and is embedded in the support surface 122 so as to surround the central suction hole 123 of the support surface 122. In this embodiment, the first magnet 125 is disposed so that the center of the first magnet 125 coincides with the center of the central suction hole 123. The first magnet 125 is disposed so that the upper surface 125a exposed to the support surface 122 is the N pole and the embedded lower surface 125b is the S pole, and the second magnet 126 is disposed so that the upper surface 126a exposed to the support surface 122 is the S pole and the embedded lower surface 126b is the N pole. As shown in FIG. 3(b), the distance between the center position of the first magnet 125 and the center position of the second magnet 126 is set to W0.

[0018] Returning to Fig. 2, the explanation will be continued with respect to the lower surface holding suction holes 127, 127 of the table base 120 constituting the chuck table mechanism 3 of this embodiment, to which a compressed air supply means 140 and a suction means 150 are connected. The compressed air supply means 140 supplies compressed air H to the lower surface holding suction holes 127, 127 of the table base 120 via a compressed air supply path 142, an on-off valve 144 disposed on the compressed air supply path 142, and a communication path 146. The suction means 150 is connected to the communication path 146, which is also used for supplying the compressed air H, via a suction path 152 and an on-off valve 154 disposed on the suction path 152, and operates the suction means 150 to generate a suction negative pressure V in the lower surface holding suction holes 127, 127 of the table base 120. In addition, a compressed air supply path and a suction path (not shown) are connected to the central suction hole 123 of the table base 120 via a communicating passage 147, and it is configured so that compressed air H can be supplied or suction negative pressure V can be generated at any time separately from the lower surface holding suction holes 127, 127.

[0019] The chuck table mechanism 3 of the present embodiment is configured to be able to interchangeably use a plurality of chuck tables having different outer diameter dimensions, and can be equipped with not only the chuck table 20 for holding a 5-inch diameter wafer shown in FIG. 2, but also the chuck table 30 for holding a 6-inch diameter wafer shown in FIG. 4(b), and a chuck table for holding an 8-inch diameter wafer (not shown).

[0020] 4(a) shows, from the top, an upper perspective view of the chuck table 20 as seen from above, a BB cross-sectional view of the chuck table 20, and a plan view of the chuck table 20, and on the right side of the upper perspective view of the chuck table 20 in the upper part, a lower perspective view of the chuck table 20 as seen from below is shown. As can be seen from FIG. 4(a), the chuck table 20 is at least composed of a disk-shaped suction chuck 24 having a holding surface 24a for suction-holding a wafer with a diameter of 5 inches, and a frame 22 for surrounding the suction chuck 24 and supporting the outer periphery, and an internal space 221 is formed by the suction chuck 24 and the frame 22. A communication hole 222 is formed in the lower surface 20b of the chuck table 20, which is connected to the internal space 221 and is formed at a position corresponding to the central suction hole 123 formed in the table base 120 described above. The frame 22 is made of a metal such as SUS, and the suction chuck 24 is made of a porous ceramic such as alumina (Al2O3).

[0021] 4(a), on the lower surface 20b of the chuck table 20, when the chuck table 20 is positioned at a predetermined position on the table base 120, a third magnet 42 that attracts the first magnet 125 is disposed in a third region C3 corresponding to the first region C1, and a fourth magnet 44 that attracts the second magnet 126 is disposed in a fourth region C4 corresponding to the second region C2, such that the upper surface 42a of the third magnet 42 is an N pole and the lower surface 42b is an S pole, and the upper surface 44a of the fourth magnet 44 is an S pole and the lower surface 44b is an N pole. The distance W1 between the center of the third magnet 42 and the center of the fourth magnet 44 of the chuck table 20 is the same as the distance W0 between the center position of the first magnet 125 and the center position of the second magnet 126 described above. As a result, when the chuck table 20 is positioned at a predefined position on the table base 120, the north pole of the upper surface 125a of the first magnet 125 and the south pole of the lower surface 42b of the third magnet 42 are attracted to each other, and the south pole of the upper surface 126a of the second magnet 126 and the north pole of the lower surface 44b of the fourth magnet 44 are attracted to each other.

[0022] 4(b) shows, from the top, an upper perspective view of the chuck table 30 as seen from above, a CC sectional view of the chuck table 30, and a plan view of the chuck table 30, and on the right side of the upper perspective view of the chuck table 30 in the upper part, a lower perspective view of the chuck table 30 as seen from below is shown. The chuck table 30 shown in FIG. 4(b) has a configuration substantially similar to that of the above-mentioned chuck table 20, except that the diameter of the wafer it holds is 6 inches. That is, the chuck table 30 is at least composed of a disk-shaped suction chuck 34 having a holding surface 34a that suction-holds a wafer with a diameter of 6 inches, and a frame 32 that surrounds the suction chuck 34 and supports the outer periphery, and an internal space 321 is formed by the suction chuck 34 and the frame 32. A communication hole 322 is formed in the lower surface 30b of the chuck table 30, which is connected to the internal space 321 and is located at a position corresponding to the central suction hole 123 formed in the table base 120. The frame 32 is made of a metal such as SUS, and the suction chuck 34 is made of a porous ceramic such as alumina (Al2O3).

[0023] 4(b), on the lower surface 30b of the chuck table 30, when the chuck table 30 is positioned at a predetermined position on the table base 120, a third magnet 42 that attracts the first magnet 125 is disposed in a third region C3 corresponding to the first region C1, and a fourth magnet 44 that attracts the second magnet 126 is disposed in a fourth region C4 corresponding to the second region C2. More specifically, the third magnet 42 is disposed so that its upper surface 42a is an N pole and its lower surface 42b is an S pole, and the fourth magnet 44 is disposed so that its upper surface 44a is an S pole and its lower surface 44b is an N pole. The distance W2 between the center of the third magnet 42 and the center of the fourth magnet 44 of the chuck table 30 is the same as the above-mentioned distances W0 and W1. As a result, when the chuck table 30 is positioned at a predetermined position on the table base 120, the north pole of the upper surface 125a of the first magnet 125 and the south pole of the lower surface 42b of the third magnet 42 are attracted to each other, and the south pole of the upper surface 126a of the second magnet 126 and the north pole of the lower surface 44b of the fourth magnet 44 are attracted to each other.

[0024] 2, the chuck table mechanism 3 of this embodiment includes a table base 110 on which the table base 120 is disposed, and four clamp mechanisms 130 disposed between the table base 110 and the table base 120. The table base 110 is formed in a cylindrical shape, and configured to be rotatable to a desired angle by a servo motor (not shown).

[0025] Four clamp mechanisms 130 are disposed evenly at angles of 90° in the circumferential direction between the table base 110 and the table base 120. Each clamp mechanism 130 is composed of a pair of guide rails 131 protruding outward, a clamp unit 132 mounted so as to be movable in the radial direction along the guide rails 131, and a lock unit 133 for fixing the clamp unit 132 to the guide rails 131.

[0026] The clamp portion 132 is equipped with clamp claws 134 that are rotated in the direction indicated by the arrow R1 by air supplied to the clamp portion 132, and these clamp claws 134 press down on the frame F that holds the wafer 10 placed on the chuck table 20, thereby fixing it to the clamp portion 132.

[0027] The guide rail 131 is formed with a plurality of positioning grooves for fixing the clamp portion 132 which is moved in the direction indicated by the arrow R2 in accordance with the size of an annular frame which holds a wafer placed on the chuck table mechanism 3. The positioning groove 131a shown in the figure is for fixing the clamp portion 132 when holding a frame which holds an 8-inch wafer, and the positioning groove 131b is for fixing the clamp portion 132 when holding a frame which holds a 6-inch wafer. The clamp portion 132 shown in FIG. 2 is fixed by engaging a tip portion (not shown) of the lock portion 133 with a positioning groove for a 5-inch wafer (not shown).

[0028] The cutting device 1 to which the chuck table mechanism 3 of this embodiment is attached has roughly the above-mentioned configuration, and the function and action of the chuck table mechanism 3 of this embodiment will be described with reference to Figures 2, 5, and 6. Note that in the following embodiment, an embodiment in which the chuck table 20 that holds a wafer 10 with a diameter of 5 inches is placed on the table base 120 and attached will be described.

[0029] 2 is operated and the on-off valve 144 is opened, and compressed air H is ejected from the lower surface holding suction holes 127, 127 of the table base 120 via the compressed air supply path 142, the on-off valve 144, and the communication path 146. Next, as shown in FIG. 5, the operator holds the chuck table 20 with both hands and places it from above on the support surface 122 of the table base 120 of the chuck table mechanism 3 attached to the cutting device 1. Here, when an operator places the chuck table 20 on the table base 120, in the initial state, as shown in Fig. 6(a), the positions of the first magnet 125 embedded in the first region C1 of the support surface 122 of the table base 120, the third magnet 42 embedded in the third region C3 of the lower surface 20b of the chuck table 20, and the second magnet 126 embedded in the second region C2 of the support surface 122 and the fourth magnet 44 (shown by a broken line) embedded in the fourth region C4 of the lower surface 20b of the chuck table 20 do not match, so that they are not in a specified positional relationship. At this time, compressed air H is supplied from the lower surface holding suction holes 127, 127 of the table base 120 described above between the lower surface 20b of the chuck table 20 and the support surface 122 of the table base 120 to form an air layer P, and the chuck table 20 floats above the table base 120. This allows the operator to easily move the chuck table 20, which is a heavy object, in the horizontal direction (the plane defined by the X and Y directions in FIG. 5), and as shown in FIG. 6(b), the operator can easily position the third magnet 42 disposed in the third region C3 of the chuck table 20 relative to the first magnet 125 embedded in the support surface 122 of the table base 120. When the third magnet 42 of the chuck table 20 is positioned relative to the first magnet 125 of the table base 120, the two magnets are attracted to each other by the action of the two magnets, and the central position of the table base 120 and the central position of the chuck table 20 coincide with each other, and the positions are fixed.

[0030] The first magnet 125 of the table base 120 and the third magnet 42 of the chuck table 20 are attracted to each other, so that the central positions of the table base 120 and the chuck table 20 are substantially fixed, and the chuck table 20 is movable in the rotation direction indicated by the arrow R3 in Fig. 5. Here, the operator rotates the chuck table 20 in the direction indicated by the arrow R3, so as to position the fourth magnet 44 embedded in the fourth region C4 of the chuck table 20 relative to the second magnet 126 embedded in the second region C2 of the support surface 122 of the table base 120, as shown in Fig. 6(c). As a result, the second magnet 126 of the table base 120 and the fourth magnet 44 of the chuck table 20 are attracted to each other, and the position of the chuck table 20 relative to the table base 120 is set to a specified position in a plan view.

[0031] As described above, once the position of the chuck table 20 has been accurately determined with respect to the table base 120, the on-off valve 144 that supplies the compressed air H is closed, and the operation of the compressed air supply means 140 is stopped to stop the supply of compressed air H. This causes the chuck table 20 to descend, causing the first magnet 125 to come into close contact with the third magnet 42 and the second magnet 126 to come into close contact with the fourth magnet 44, and the chuck table 20 to be fixed in a specified positional relationship with respect to the table base 120, completing the mounting process.

[0032] Once the mounting of the chuck table 20 on the table base 120 is completed, the cutting machine 1 performs cutting on the wafer 10. When performing cutting, the suction means 150 is operated and the on-off valve 154 is opened to generate a negative suction pressure V in the lower surface holding suction holes 127, 127, and the chuck table 20 is sucked against the table base 120. Next, the wafer 10, which is the workpiece, is placed on the holding surface 24a of the chuck table 20, and the clamp mechanism 130 is operated to grip the frame F supporting the wafer 10, and a negative suction pressure V is generated in the central suction hole 123 via the communication passage 147 shown in FIG. 2 to hold the wafer 10 on the chuck table 20. Once the wafer 10 is held on the chuck table 20, the X-axis feed means (not shown) is operated to position the chuck table mechanism 3 directly under the imaging means 12 to take an image, and an alignment process is performed. Next, based on the position information of the processing position of the wafer 10 detected by the alignment process, the chuck table mechanism 3 is positioned directly below the cutting means 4, and the cutting blade 41 of the cutting means 4 cuts the planned dividing lines of the wafer 10, dividing the wafer 10 into individual device chips (details are omitted).

[0033] As described above, once the wafer 10 has been divided into individual device chips, the clamp mechanism 130 releases the frame F from its grip, and compressed air H is supplied to the central suction hole 123 of the table base 120 to carry the wafer 10 out of the chuck table 20. Note that, in the above embodiment, an example has been shown in which the chuck table 20 holding a wafer 10 with a diameter of 5 inches is mounted on the table base 120 for the chuck table mechanism 3, but the chuck table 30 holding a wafer with a diameter of 6 inches can also be mounted in the same manner by the above procedure, and details thereof will be omitted.

[0034] According to the above-described embodiment, even if the chuck table 20 to be attached to the table base 120 is a relatively heavy weight, compressed air H is supplied between the underside 20b of the chuck table 20 and the support surface 122 of the table base 120 to form an air layer P, making it easier to move the chuck table 20 horizontally and allowing the chuck table 20 to be moved horizontally on the table base 120 and positioned at an appropriate position, thereby eliminating the problem of difficulty in attaching the chuck table 20 to the table base 120.

[0035] Furthermore, in the above-described embodiment, the first magnet 125 and the second magnet 126 embedded in the support surface 122 of the table base 120 are set so that the magnetic poles exposed on the support surface 122 side are different, thereby preventing the fourth magnet 44 of the chuck table 20 from being mistakenly attracted to the first magnet 125 of the table base 120, or the third magnet 42 from being mistakenly attracted to the second magnet 126.

[0036] The present invention is not limited to the above-described embodiment. For example, in the above-described embodiment, the fourth magnet 44 embedded in the fourth region C4 of the lower surface 20b of the chuck table 20 is shaped to have a circular cross section, but the chuck table 20A may be configured such that a magnet 46 having a rectangular cross section extending in the radial direction as shown in FIG. 7(a) is adopted as the fourth magnet, and the lower surface 46b of the magnet 46 is set as the N pole. When the fourth magnet is the above-described magnet 46, the second magnet 126 on the table base 120 side is also a magnet having a rectangular cross section extending in the radial direction corresponding to the magnet 46, so that when the chuck table 20A is rotated in the direction indicated by the arrow R3 in FIG. 5, the position of the chuck table 20A relative to the table base 120 can be more accurately positioned at a specified position.

[0037] Furthermore, in the above embodiment, the third magnet 42 is disposed in the center of the lower surface 20b of the chuck table 20 in correspondence with the position of the ring-shaped first magnet 125 surrounding the central suction hole 123 disposed in the center of the support surface 122 of the table base 120, but the present invention is not limited to this, and for example, a configuration like that of the chuck table 20B shown in Fig. 7(b) may be used. That is, in the chuck table 20B, a magnet 47 as a third magnet is disposed in a predetermined third region of the lower surface 20Bb, and a magnet 48 as a fourth magnet is disposed in a predetermined fourth region spaced from the magnet 47. In this embodiment, too, the lower surface 47b of magnet 47 is set to a south pole, and the lower surface 48b of magnet 48 is set to a north pole, and although not shown, a first magnet having a shape corresponding to magnet 47 is embedded in a first region of support surface 122 of table base 120 corresponding to the above-mentioned magnet 47, and a second magnet having a shape corresponding to magnet 48 is embedded in a second region spaced from the first region corresponding to the above-mentioned magnet 48.

[0038] Furthermore, in the above embodiment, the magnet embedded in the table base 120 is described as being a permanent magnet, but the present invention is not limited to this, and it is also possible for the magnet to be an electromagnet.

[0039] In the above embodiment, an example is shown in which the chuck table mechanism 3 of this embodiment is applied to the cutting device 1, but the present invention is not limited to this, and can also be applied to, for example, a laser processing device or a grinding device. Also, although the types of chuck tables supported by the table base 120 have been described as being 5 inches, 6 inches, and 8 inches, they may support other sizes, and are not limited to the above embodiment. [Explanation of symbols]

[0040] 1:Cutting device 2: Device housing 3: Chuck table mechanism 20, 20A, 20B: Chuck table 30: Chuck table 20b, 30b: Bottom surface 22, 32: Frame 222, 322: 223, 323: 24, 34: Vacuum chuck 24a, 34a: Holding surface 4:Cutting means 41: Cutting blade 5: Cassette 6: Temporary table 7: Carrying in / out means 8: Means of transportation 9: Cleaning method 11: Cleaning and transport means 12: Imaging means 42: The third magnet 42a:Top surface 42b: Bottom surface 44: The fourth magnet 44a:Top surface 44b: Bottom surface 110: Table base 120: Table base 122: Support surface 123: Central suction hole 125: First magnet 125a:Top surface 125b: Bottom surface 126: Second magnet 126a:Top surface 126b: Bottom surface 127: Bottom holding suction hole 130: Clamp mechanism 131: Guide rail 131a, 131b: Positioning grooves 132: Clamp section 133: Rock Club 134: Clamp claw 140: Compressed air supply means 142: Compressed air supply line 144: Opening and closing valve 146: Communication path 147: Communication path 150: Suction means 152: Suction route 154: On-off valve C1: First area C2: The second area C3: The third area C4: The fourth area

Claims

1. The present invention includes a chuck table having a holding surface for holding a workpiece and a lower surface opposite to the holding surface, and a table base for detachably supporting the lower surface of the chuck table, the table base includes a support surface that supports a lower surface of the chuck table, a central suction hole formed in a center portion of the support surface, and a lower surface holding suction hole formed in the support surface that holds the lower surface of the chuck table by suction, the support surface of the table base includes a first magnet embedded in a first region and a second magnet embedded in a second region spaced from the first region; the lower surface of the chuck table is provided with a third magnet embedded in a third region corresponding to the first region and attracting the first magnet, and a fourth magnet embedded in a fourth region corresponding to the second region and attracting the second magnet, a compressed air supplying means for supplying compressed air to the lower surface holding suction hole when the chuck table is attached to the support surface of the table base, to form an air layer between the lower surface of the chuck table and the support surface of the table base, The first region is a chuck table mechanism in which the first magnet is embedded and is formed in a ring shape surrounding the central suction hole.

2. A chuck table mechanism as described in claim 1, wherein the magnetic pole exposed on the support surface of the first magnet embedded in the support surface of the table base is different from the magnetic pole exposed on the support surface of the second magnet.

Images