Connection Structure

Abstract

To ensure conductivity between electrodes and to prevent adjacent electrodes from short-circuiting. [Solution] A method for producing a connection structure includes arranging conductive particles and a first composition on a first electrode arranged on a first surface of a first member, arranging a second composition on the first electrode and an area of ​​the first surface other than the first electrode, arranging the first surface and a second surface of a second member on which the second electrode is arranged so that the first electrode and the second electrode face each other, pressing the first member and the second member together, and hardening the first composition and the second composition.

Description

[Technical field]

[0001] One embodiment of the present invention relates to a connection structure having an electrode connection structure made of a conductive composition, and a method for producing the connection structure. [Background technology]

[0002] When mounting electronic components such as integrated circuits on a substrate, such as in a COG (Chip on Glass) connection that directly connects an integrated circuit to a glass substrate such as a liquid crystal display, or a FOG (Film on Glass) connection that connects a flexible printed circuit board to a glass substrate of a flat panel display, an anisotropic conductive film (ACF) containing conductive particles is generally widely used. An anisotropic conductive film is a thermosetting resin film in which fine conductive particles are dispersed. By sandwiching an anisotropic conductive film between aligned electrodes and thermocompressing the film, the conductive particles located between the electrodes can form a conductive path. On the other hand, the insulating property of the thermosetting resin can suppress short-circuiting of adjacent electrodes in the surface direction of the substrate. That is, an anisotropic conductive film has anisotropy in which it forms conductivity in the pressure direction (towards both electrodes) and maintains insulation in the non-pressure direction (surface direction of the substrate). With such characteristics, an anisotropic conductive film can collectively connect multiple electrodes provided on an integrated circuit, a printed circuit board, a glass substrate, etc., and can maintain insulation of adjacent electrodes in the surface direction of the substrate.

[0003] However, with the recent trend toward higher definition and higher density of connection circuits in electronic devices, the reliability of connections using anisotropic conductive films has become an issue. That is, when the size of the electrodes to be connected becomes smaller, the number of conductive particles contributing to conduction between a pair of electrodes decreases, and the connection reliability between the electrodes may not be sufficiently obtained. In addition, when the distance between adjacent electrodes in the surface direction of the substrate becomes narrow, the conductive particles may come into contact with both of the adjacent electrodes, and the insulation reliability may not be sufficiently obtained. For this reason, Patent Document 1 discloses an anisotropic conductive film in which the conductive particles are dispersed by means of applying a magnetic field or the like and are separated from other conductive particles. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2015-167106 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in anisotropic conductive films, the arrangement of conductive particles becomes irregular when the substrates are thermocompression bonded together, so it is not possible to fully resolve the problem of poor continuity due to the absence of conductive particles between the electrodes, or short circuits due to contact between conductive particles between adjacent electrodes. Furthermore, because of the heat-curing connection method, dimensional changes occur in principle due to the difference in thermal expansion coefficient between the upper and lower substrates, and the problem of misalignment between the electrodes formed on the upper and lower substrates cannot be resolved.

[0006] One embodiment of the present invention has been made in consideration of the above-mentioned conventional problems, and has as one object to ensure conductivity between opposing electrodes and prevent short circuits between adjacent electrodes through a simple process, even when electrodes arranged on an integrated circuit, a printed circuit board, a glass substrate, or the like are made highly precise and dense. [Means for solving the problem]

[0007] A method for producing a connection structure according to one embodiment of the present invention includes: arranging conductive particles and a first composition on a first electrode arranged on a first surface of a first member; arranging a second composition on the first surface other than the first electrode and the area of ​​the first surface; arranging the first surface and a second surface of a second member on which the second electrode is arranged so that the first electrode and the second electrode face each other; pressing the first member and the second member; and hardening the first composition and the second composition.

[0008] A method for producing a connection structure according to another embodiment of the present invention includes disposing conductive particles and a first composition on a first electrode disposed on a first surface of a first member, disposing a second composition on a second electrode disposed on a second surface of a second member and on an area other than the second electrode, disposing the first surface and the second surface such that the first electrode and the second electrode face each other, pressing the first member and the second member together, and hardening the first composition and the second composition.

[0009] A connection structure according to one embodiment of the present invention includes a first surface of a first member, a first electrode arranged on the first surface, a second surface of a second member opposite the first surface, a second electrode opposite the first electrode and arranged on the second surface, a first resin and conductive particles arranged between the first electrode and the second electrode, and a second resin arranged between the first electrode and the second electrode and between an area of ​​the first surface other than the first electrode and an area of ​​the second surface other than the second electrode, wherein the first resin is in contact with the first electrode and the second resin is in contact with the second electrode, and the first resin and the second resin are different. Effect of the Invention

[0010] According to one embodiment of the present invention, even if the electrodes arranged on the electronic component are highly fine and highly dense, it is possible to ensure the conductivity between the opposing electrodes and prevent adjacent electrodes from shorting out by a simple process. Furthermore, since the heat curing connection method is not used, it is possible to connect the electrodes of the upper and lower substrates with different thermal expansion coefficients with high accuracy. [Brief description of the drawings]

[0011] [Figure 1] 1A to 1C are diagrams showing a structure of a connection structure according to an embodiment of the present invention; [Diagram 2] 1A to 1C are diagrams illustrating a method for producing a connection structure according to one embodiment of the present invention. [Diagram 3] 1A to 1C are diagrams illustrating a method for producing a connection structure according to one embodiment of the present invention. [Figure 4] 1A to 1C are diagrams illustrating a method for producing a connection structure according to one embodiment of the present invention. [Diagram 5] 1A to 1C are diagrams illustrating a method for producing a connection structure according to one embodiment of the present invention. [Figure 6] 1A to 1C are diagrams illustrating a method for producing a connection structure according to one embodiment of the present invention. [Figure 7] 1A to 1C are diagrams showing a structure of a connection structure according to an embodiment of the present invention; [Figure 8] 1A to 1C are diagrams illustrating a method for producing a connection structure according to one embodiment of the present invention. [Figure 9] 1A to 1C are diagrams illustrating a method for producing a connection structure according to one embodiment of the present invention. [Figure 10] 1A to 1C are diagrams showing a structure of a connection structure according to an embodiment of the present invention; [Figure 11] 1A to 1C are diagrams illustrating a method for producing a connection structure according to one embodiment of the present invention. [Figure 12] 1A to 1C are diagrams illustrating a method for producing a connection structure according to one embodiment of the present invention. [Figure 13] 1A to 1C are diagrams illustrating a method for producing a connection structure according to one embodiment of the present invention. [Figure 14]1A to 1C are diagrams illustrating a method for producing a connection structure according to one embodiment of the present invention. [Figure 15] 1A to 1C are diagrams illustrating a method for producing a connection structure according to one embodiment of the present invention. [Figure 16] 1A to 1C are diagrams showing a structure of a connection structure according to an embodiment of the present invention; [Figure 17] 1A to 1C are diagrams illustrating a method for producing a connection structure according to one embodiment of the present invention. [Figure 18] 1A to 1C are diagrams illustrating a method for producing a connection structure according to one embodiment of the present invention. [Figure 19] 1A and 1B are diagrams illustrating an example of a connection structure according to an embodiment of the present invention. [Figure 20] 1A and 1B are diagrams illustrating an example of a connection structure according to an embodiment of the present invention. [Figure 21] 1A and 1B are diagrams illustrating an example of a connection structure according to an embodiment of the present invention. [Figure 22] 1A and 1B are diagrams illustrating an example of a connection structure according to an embodiment of the present invention. [Figure 23] 1A and 1B are diagrams illustrating an example of a connection structure according to an embodiment of the present invention. [Figure 24] 1A and 1B are diagrams illustrating an example of a connection structure according to an embodiment of the present invention. [Diagram 25] 1A and 1B are diagrams illustrating an example of a connection structure according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. However, the present invention includes many different aspects, and is not to be interpreted as being limited to the following exemplary embodiments. The drawings attached to this specification may be schematic in terms of the width, thickness, shape, etc. of each part compared to the actual aspect in order to make the description clearer, but this is merely an example and does not necessarily limit the contents of the present invention. In addition, in the present invention, when a specific element depicted in a drawing and a specific element depicted in another drawing are identical or in a corresponding relationship, the same symbol (or a symbol with a, b, etc. added after the number depicted as the symbol) may be added, and repeated explanations may be omitted as appropriate. Furthermore, the letters "first" and "second" attached to each element are convenient marks used to distinguish each element, and have no further meaning unless otherwise explained.

[0013] In this specification, when a certain member or region is described as being "on (or under)" another member or region, unless otherwise specified, this includes not only the case where it is directly above (or directly below) the other member or region, but also the case where it is above (or below) the other member or region. In other words, it also includes the case where another component is included between the certain member or region and above (or below) the other member or region.

[0014] In this specification, a connection structure for COG connection that connects an integrated circuit (second electronic component) to a glass substrate of a liquid crystal display (first electronic component) is shown as an example. However, the present invention is not limited to this, and may be a connection structure for FOG connection that connects a flexible printed circuit board to a glass substrate of a flat panel display. In this case, the second electronic component may be a flexible printed circuit board such as TAB (Tape Automated Bonding) or COF (Chip on film).

[0015] First Embodiment [Connection structure] Fig. 1 shows the structure of a connection structure according to one embodiment of the present invention. Fig. 1(A) is a plan view of a connection structure according to one embodiment of the present invention. Fig. 1(B) is a cross-sectional view taken along line A-A' in Fig. 1(A). Fig. 1(C) is an enlarged cross-sectional view of a conductive particle in region B in Fig. 1(B).

[0016] As shown in FIGS. 1A and 1B, the first electronic component 101 includes a terminal 104, a first insulating film 106, a second insulating film 108, and a first electrode 110 on a connection surface (first surface) of a first member 102. A second electronic component 111 is mounted on the connection surface (first surface) of the first electronic component 101. The second electronic component 111 includes a second electrode 114 on a connection surface (second surface) of a second member 112. The first surface of the first electronic component 101 and the second surface of the second electronic component 111 are disposed opposite to each other. The connection structure 100 is responsible for the physical connection between the first electronic component 101 and the second electronic component 111, and the electrical connection between the first electrode 110 and the second electrode 114. The connection structure 100 includes a first surface of a first member 102 , a first electrode 110 , a second surface of a second member 112 , a second electrode 114 , conductive particles 10 , a first resin 20 , and a second resin 30 .

[0017] A plurality of first electrodes 110 are arranged on a first surface of the first member 102. A second insulating film 108 is arranged on an area of ​​the first surface of the first member 102 other than the area where the first electrodes 110 are arranged. A plurality of second electrodes 114 corresponding to the plurality of first electrodes 110 are arranged on a second surface of the second member 112. An insulating film may be arranged on an area of ​​the second surface of the second member 112 other than the area where the second electrodes 114 are arranged.

[0018] A plurality of first electrodes 110 and a plurality of second electrodes 114 are disposed opposite to each other. A plurality of conductive particles 10, a first resin 20, and a second resin 30 are disposed between the opposing first electrode 110 and the second electrode 114. A plurality of conductive particles 10 are disposed in a planar direction (D2-D3 planar direction) between the opposing first electrode 110 and the second electrode 114. A single conductive particle 10 is disposed between the opposing first electrode 110 and the second electrode 114 in the opposing direction (D1 direction) of the first electrode 110 and the second electrode 114. Each conductive particle 10 is in contact with the opposing first electrode 110 and the second electrode 114. As shown in FIG. 1(C), the conductive particle 10 is deformed by pressure in the opposing direction (D1 direction) of the electrodes between the first electrode 110 and the second electrode 114 by a method for producing a connection structure described later. That is, the distance between the first electrode 110 and the second electrode 114 in the facing direction of the electrodes (D1 direction) is approximately the same as the height of the conductive particle 10 in the facing direction of the electrodes (D1 direction). The height of the conductive particle 10 in the facing direction of the electrodes (D1 direction) is deformed by about 10% to 40% due to pressure. By applying stress between the first electrode 110, the conductive particle 10, and the second electrode 114, the first resin 20 and the second resin 30 are eliminated at the contact portion between the first electrode 110 and the conductive particle 10 and the contact portion between the second electrode 114 and the conductive particle 10. Furthermore, even if a natural oxide film is formed on the first electrode 110, the conductive particle 10, or the second electrode 114 and the surface is insulated, the natural oxide film is broken through by pressing the first electrode 110 and the second electrode 114 with the conductive particle 10 sandwiched therebetween, and a conductive path is formed. Furthermore, the deformation of the conductive particles 10 can increase the contact area between the first electrode 110 and the conductive particles 10, and the contact area between the second electrode 114 and the conductive particles 10. By being arranged in this manner, the conductive particles 10 can electrically connect the first electrode 110 and the second electrode 114.

[0019] A plurality of conductive particles 10 are dispersed in a first resin 20 and a second resin 30 between a first electrode 110 and a second electrode 114. Each conductive particle 10 is surrounded by the first resin 20 in a planar direction (D2-D3 planar direction) on the first electrode 110. Each conductive particle 10 is surrounded by the second resin 30 in a planar direction (D2-D3 planar direction) on the second electrode 114. The first resin 20 and the second resin 30 are insulating resins. Therefore, the connection structure 100 has insulation in a planar direction (D2-D3 planar direction). However, a plurality of conductive particles 10 arranged between the opposing first electrode 110 and second electrode 114 and adjacent to each other in a planar direction (D2-D3 planar direction) may be in contact with each other. When the conductive particles 10 adjacent to each other in a planar direction (D2-D3 planar direction) are in contact with each other, the adjacent conductive particles 10 are also electrically connected to each other. By being arranged in this manner, the conductive particles 10 can more reliably electrically connect the opposing first electrode 110 and second electrode 114. The distance between adjacent conductive particles 10 can be appropriately controlled by the concentration of the conductive particles 10 mixed in the first composition 20′ described below.

[0020] As shown in FIG. 1(A) and (B), a plurality of conductive particles 10 and a first resin 20 are disposed on the upper surface of a first electrode 110. A plurality of conductive particles 10 and a first resin 20 are disposed in a certain area when viewed in the facing direction (D1 direction) of the electrodes. In this embodiment, the diameter of the conductive particle 10 viewed in the facing direction (D1 direction) of the electrodes is in the range of 2 μm to 10 μm. The number of areas in which the conductive particles 10 and the first resin 20 are disposed on the upper surface of one first electrode 110 is one or more, and each area is preferably spaced apart by 5 μm or more. The number of conductive particles 10 in one area in which the conductive particles 10 and the first resin 20 are disposed is preferably one or more and seven or less. The number of conductive particles 10 disposed in one area is preferably seven, more preferably three. When viewed in the opposing direction of the electrodes (direction D1), the number of conductive particles 10 disposed between the opposing first electrode 110 and second electrode 114 is 7 / 400 μm 2 More than 20 pieces / 400μm 2The number of conductive particles 10 is preferably in the following range: 7 pieces / 400 μm 2 When the number of conductive particles 10 is less than 20 / 400 μm, the connection resistance value may be easily varied. 2 If the number of conductive particles 10 is more than 20 / 400 μm, the load is dispersed, so that the amount of deformation of the conductive particles 10 due to pressure is reduced, and the conductive particles 10 cannot break through the native oxide film in the connection area, which may increase the connection resistance. 2 If the number of particles is larger, the amount of deformation due to pressure is likely to change over time, and the connection resistance is likely to change over time. By arranging the conductive particles 10 in this manner, the conductive particles 10 can reliably connect the opposing first electrodes 110 and second electrodes 114, and can prevent short circuits between the first electrodes 110 adjacent in the planar direction (D2-D3 planar direction), between the second electrodes 114 adjacent in the planar direction (D2-D3 planar direction), and between the first electrodes 110 and second electrodes 114 that do not face each other.

[0021] In this embodiment, the shape of the region in which the conductive particles 10 and the first resin 20 are arranged as viewed in the opposing direction of the electrodes (D1 direction) is circular. However, this is not limited to this, and the region in which the conductive particles 10 and the first resin 20 are arranged can have any shape as long as the above conditions are met. In this embodiment, the region in which the conductive particles 10 and the first resin 20 are arranged is arranged in two places on the upper surface of one first electrode 110. In addition, seven conductive particles 10 are arranged in each region. However, this is not limited to this, and the number of regions in which the conductive particles 10 and the first resin 20 arranged on the upper surface of one first electrode 110 are arranged can be appropriately adjusted depending on the area of ​​the upper surface of the first electrode 110, the area of ​​the region in which the conductive particles 10 and the first resin 20 are arranged, and the size of the conductive particles 10, as long as the above conditions are met. In addition, the number of conductive particles 10 arranged in one region can be appropriately adjusted depending on the size and concentration of the conductive particles 10, as long as the above conditions are met.

[0022] A second resin 30 is further disposed between the first surface of the first member 102 and the second surface of the second member 112. The second resin 30 is disposed in a region other than between the opposing first electrode 110 and second electrode 114. The second resin 30 is disposed between a region other than the first electrode on the first surface and a region other than the second electrode on the second surface. That is, the second resin 30 is disposed between and around a plurality of first electrodes 110 adjacent in the surface direction (D2-D3 surface direction) (between and around a plurality of second electrodes 114 adjacent in the surface direction (D2-D3 surface direction)). Furthermore, the second resin 30 is disposed between the first electrode 110 and the second electrode 114, in a region other than the region where the conductive particles 10 and the first resin 20 are disposed. The second resin 30 is disposed between and around the area where the conductive particles 10 and the first resin 20 adjacent in the planar direction (D2-D3 planar direction) are disposed. In other words, the conductive particles 10 and the first resin 20 are surrounded by the second resin 30 in the planar direction (D2-D3 planar direction). That is, when viewed in the facing direction (D1 direction) of the electrodes, the conductive particles 10 are surrounded by the first resin 20 on the first surface of the first electronic component 101, and the first resin 20 is surrounded by the second resin 30. As shown in FIGS. 1B and 1C, the second resin 30 is further disposed between the first electrode 110 and the second electrode 114, in the area where the conductive particles 10 and the first resin 20 are disposed. The second resin 30 is disposed between the first resin 20 and the second electrode 114. That is, when viewed in the facing direction (D1 direction) of the electrodes, the plurality of conductive particles 10 are surrounded by the second resin 30 on the second surface of the second electronic component 111. The second resin 30 is an insulating resin. Therefore, the connection structure 100 has insulating properties in the planar direction (D2-D3 planar direction). By arranging in this manner, the second resin 30 can reliably insulate between the plurality of first electrodes 110 adjacent in the planar direction (D2-D3 planar direction), between the plurality of second electrodes 114 adjacent in the planar direction (D2-D3 planar direction), and between the first electrodes 110 and second electrodes 114 that do not face each other.

[0023] A first resin 20 and a second resin 30 are disposed between the first electrode 110 and the second electrode 114. The first resin 20 is disposed so as to be in contact with the first electrode 110, and the second resin 30 is disposed so as to be in contact with the second electrode 114. That is, the first resin 20 and the second resin 30 are in contact with each other in the planar direction (D2-D3 planar direction) between the first electrode 110 and the second electrode 114, and are laminated in the opposing direction of the electrodes (D1 direction).

[0024] The boundary between the first resin 20 and the second resin 30 can be confirmed by observing a cross section of the connection structure 100. Due to the difference in composition between the first resin 20 and the second resin 30, it is also possible to determine the boundary between the first resin 20 and the second resin 30 in a processing and observation device such as a focused ion beam processing and observation device (FIB), a scanning electron microscope (SEM), or a transmission electron microscope (TEM).

[0025] When the first composition 20' and the second composition 30' described below are poorly compatible with each other, the boundary between the first resin 20 and the second resin 30 can be confirmed as an interface. When the first composition 20' and the second composition 30' have similar compositions and the interface disappears in the process described below, it may be observed as a boundary layer in which the first resin 20 and the second resin 30 are mixed.

[0026] The first electronic component 101 may be, for example, a flat display such as a liquid crystal display, an organic electroluminescence display, or a plasma display, and the first member 102 is preferably, for example, an insulating substrate such as a glass substrate or a transparent film substrate. The first electrode 110 corresponds to, for example, an external connection terminal provided on a display. The first electrode 110 and the terminal 104 may be formed of a transparent conductive material such as ITO (indium tin oxide) or IZO (indium zinc oxide), a metal such as copper (Cu), aluminum (Al), molybdenum (Mo), or titanium (Ti), or an alloy containing at least one of these metals (Mo-Ti alloy, etc.), and a laminated structure of these materials (Mo / Cu laminated structure, Mo-Ti alloy / Cu laminated structure, Mo / Al laminated structure, Mo / Al / Mo laminated structure, Al / Ti laminated structure, etc.).

[0027] The second electronic component 111 may be a Si chip on which an integrated circuit is formed. In this case, the second electrode 114 corresponds to an external connection terminal (bonding pad) provided on the integrated circuit. The second member 112 is preferably a silicon substrate, a SiC substrate, a sapphire substrate, a plastic substrate, or the like. The second electrode 114 is preferably formed by gold plating on the surface of gold (Au) or copper (Cu), or the like. When the second electronic component 111 is, for example, a flexible printed circuit board, the second member 112 is preferably, for example, an insulating polymer film such as polyimide or para-polyamide. The second electrode 114 corresponds to an external connection terminal provided on, for example, a flexible printed circuit board, and is generally formed of copper (Cu) with a gold-plated surface.

[0028] The size of the first electrode 110 and the second electrode 114 in the direction in which the electrodes face each other (D1 direction) is not particularly limited. The distance between the first electrodes 110 adjacent to each other in the planar direction (D2-D3 planar direction) (the distance between the second electrodes 114 adjacent to each other in the planar direction) is not particularly limited, and may be, for example, 5 μm or more. By adopting such a configuration, the first electrode 110 and the second electrode 114 can be electrically connected without impairing the insulation. In this embodiment, the first electrode 110 and the second electrode 114 are arranged in a row at one end of the first electronic component 101 and the second electronic component 111 so that the short sides are aligned. However, this is not limited thereto, and the first electrodes 110 and the second electrodes 114 may be arranged in multiple rows or in a staggered pattern.

[0029] The conductive particles 10 contained in the connection structure 100 may be oblate spheroids. The diameter (long axis) of the conductive particles 10 as viewed in the facing direction (D1 direction) of the electrodes is within a range of 2 μm to 10 μm. The conductive particles 10 are originally spherical with the above-mentioned long axis as a diameter, and may be deformed to be flattened in the facing direction (D1 direction) of the electrodes within a range of 10% to 40% of the long axis 100% by a manufacturing method of the connection structure described later. The diameter (long axis) and the amount of deformation by pressure of the conductive particles 10 can be appropriately selected from the above range depending on the types of the first electronic component 101 and the second electronic component 111, the manufacturing method of each connection structure, and the like. In this embodiment, the conductive particles 10 are true spherical as shown in FIG. 1(D). However, the conductive particles 10 are not limited thereto, and may be, for example, spherical with a plurality of protrusions on the surface (compeito shape) as shown in FIG. 1(E). Having a fine protruding structure on the spherical surface in this way is more preferable because it can break through the natural oxide film in the connection region, for example.

[0030] The material of the conductive particle 10 is not particularly limited, and may be appropriately selected from known conductive particles. The conductive particle 10 may be a metal-coated particle in which a particle core 10a in which a high-hardness resin material is coated with a rubber-like elastic resin, or a particle core 10a in which a high-hardness inorganic material is coated with a rubber-like inorganic elastomer, is coated with metals 10b and 10c such as nickel (Ni), copper (Cu), and gold (Au), as shown in Figures 1(D) and (E). The metal coating may be formed into a Ni / Cu laminated structure, a Ni / Au laminated structure, or a Cu / Au laminated structure by, for example, a barrel sputtering method, a metal nanoparticle plating method, an electroless plating method, or an ultrasonic plating method.

[0031] The first resin 20 and the second resin 30 are formed by curing a first composition 20' and a second composition 30' containing different materials. The materials of the first composition 20' and the second composition 30' are not particularly limited, and can be appropriately selected from known curable resin materials. In this embodiment, the curable resin materials of the first composition 20' and the second composition 30' both contain radical polymerization type resins. The radical polymerization type resin material is preferably a (meth)acrylic monomer or a (meth)acrylate oligomer, and more preferably one bonded in an ester type. The (meth)acrylic oligomer has at least one or more (meth)acryloyl groups, and examples of the (meth)acrylic oligomer include epoxy acrylate, urethane acrylate, polyester acrylate, polybutadiene acrylate, polyol acrylate, polyether acrylate, silicone resin acrylate, melamine acrylate, and the like. Either monofunctional or polyfunctional may be used, but it is more preferable to include a polyfunctional monomer or oligomer. The curable resin material may be composed of two or more selected from (meth)acrylate monomers and (meth)acrylate oligomers.

[0032] In particular, the curable resin material of the second composition 30' is preferably one that has a low volumetric shrinkage rate when cured. For this reason, the (meth)acrylic monomer compound may contain, for example, an amidomethylol structure portion, or may contain a dendrimer or hyperbranched polymer structure portion. When photocuring, the (meth)acrylic monomer compound having an amidomethylol structure portion is cut between the methylene and oxygen of the amidomethylol structure portion in conjunction with polymerization between carbon-carbon double bonds derived from (meth)acrylic acid. For this reason, when the second composition 30' contains a (meth)acrylic monomer compound having at least one amidomethylol structure portion consisting of -CO-NH-CH2-O- in the molecule as a curing component, the volumetric shrinkage rate of the second resin 30 caused by curing the second composition 30' can be further suppressed, and warping due to the difference in bending rigidity between the first electronic component 101 and the second electronic component 111 can be suppressed. By including a dendrimer or hyperbranched polymer structure portion with acrylic groups arranged at the branches, the Van del Waals distance between the branches becomes shorter than the Van del Waals distance of a normal molecule. Therefore, by including a dendrimer or hyperbranched polymer structure portion with acrylic groups arranged as a curing component in second composition 30', the volumetric shrinkage rate of second resin 30 caused by curing second composition 30' can be further suppressed, and warpage caused by the difference in bending rigidity between first electronic component 101 and second electronic component 111 can be suppressed.

[0033] As the curable resin material of the second composition 30', it is preferable to use a fluorene-based acrylate. The second composition 30' may contain an ene / thiol-based curable resin containing a compound having an ethylenically unsaturated double bond and a thiol compound as a curing component, and at least one of these components may contain a compound having a 9,9-bisarylfluorene skeleton. The 9,9-bisarylfluorene compound may contain a 9,9-bisarylfluorene compound having an ethylenically unsaturated bond and / or a 9,9-bisarylfluorene compound having a mercapto group. As the ethylenically unsaturated compound, for example, 9,9-bis(4-acryloyloxyethoxyphenyl)fluorene (Oxol EA-0200, manufactured by Osaka Gas Chemical Co., Ltd.) and phenoxyethyl acrylate (Light Acrylate POA, manufactured by Kyoeisha Chemical Co., Ltd.) may be used. As the thiol compound, for example, pentaerythritol tetra(3-mercaptobutyrate) (Karenz MT PE1, manufactured by Showa Denko K.K.) may be used. When second composition 30' contains such a curable resin material, the volumetric shrinkage rate of second resin 30 caused by curing second composition 30' can be further suppressed, and warping due to the difference in bending rigidity between first electronic component 101 and second electronic component 111 can be suppressed.

[0034] As the curable resin material of the second composition 30', an ene compound having two or more functional groups selected from the group consisting of allyl ether group, vinyl ether group, acrylate group, and methacrylate group in the molecule, or an ene compound which is a mixture of two or more of the above ene compounds, and an ene / thiol-based curable resin containing a thiol compound having two or more thiol groups in one molecule may be used, which is obtained by treating with an oxidizing compound. The compound having two or more mercapto groups in one molecule may include esters of mercaptocarboxylic acid and polyhydric alcohol, aliphatic polythiols, aromatic polythiols, and other polythiols, and one or more of these may be used. The oxidizing compound treatment is preferably performed with a gas having an oxidizing ability. The oxidizing gas is a compound that has gaseous properties and has an oxidizing ability under the temperature and pressure conditions for the oxidizing compound treatment. As the oxidizing gas, air, oxygen, ozone, etc. may be used, and a mixed gas containing a part of these may be used. The second composition 30' can have improved stability over time by treating the photocurable resin material with an oxidizing compound.

[0035] The materials of the first composition 20' and the second composition 30' further include a photocuring initiator. The photocuring initiator is a photoradical initiator, and may be a compound that generates radicals by irradiation with ultraviolet or visible light. Examples of the ultraviolet radical initiator include acetophenone initiators, benzoin ether initiators, benzophenone initiators, α-diketone initiators, and thioxanthone initiators. Examples of the visible light radical initiator include camphorquinone compounds and acylphosphine oxide compounds. In addition, even if the initiator is classified as an ultraviolet radical initiator, it may be one that enables visible light radical initiation when used in combination with a sensitizer. The sensitizer can be used appropriately as needed. As the sensitizer, a known compound can be used, for example, an amine compound and an alkanolamine (meth)acrylic acid ester. A plurality of types of photocuring initiators and sensitizers may be used in combination. For example, the ultraviolet radical initiator and the visible light radical initiator can be used in combination to expand the wavelength range in which curing is possible. The photocuring initiation component is preferably a photoradical initiator that generates radicals when the wavelength of the irradiated light is in the range of 300 nm to 500 nm. The photocuring initiation component is mixed so that the curable resin material can be cured at room temperature with light irradiation time of preferably about 3 seconds or less, more preferably 1 second or less. The curable resin material is also appropriately selected so that it can be cured at room temperature within such a time.

[0036] In this embodiment, the first composition 20' and the second composition 30' preferably further contain a shielding portion curing active compound, such as a chain transfer agent. The chain transfer agent transfers radicals generated by light irradiation to the shielding portion where light does not directly reach. The chain transfer agent can be, for example, a compound containing at least one of at least one selected from a urethane bond, a urea bond, or an isocyanate group, and one or more alkoxysilyl groups. In the photocuring reaction using the chain transfer agent, a polyalcohol having a hydroxyl group, which is a type of anion, is generated as a by-product. This polyalcohol and the alkoxysilyl group contained in the chain transfer agent undergo an ester exchange reaction, which further progresses curing. In other words, by containing a chain transfer agent, radical curing and anion curing occur simultaneously, making it possible to cure the shielding portion where light does not directly reach.

[0037] By including the shielding portion curable active compound, the first composition 20' and the second composition 30' can reliably cure even under conditions such as the materials of the first electronic component 101, the second electronic component 111, the first electrode 110, and the second electrode 114, or the connection method, which do not allow the first composition 20' and the second composition 30' to be cured solely by the action of the photocuring initiation component upon light irradiation.

[0038] In this embodiment, the material of the first composition 20' may further include an anaerobic curing initiator. The anaerobic curing initiator may be a known system including an organic peroxide and a curing accelerator. The organic peroxide may be, for example, hydroperoxides, ketone peroxides, diallyl peroxides, peroxy esters, etc. The curing accelerator may be, for example, o-benzoic sulfimide (saccharin), hydrazine compounds, amine compounds, mercaptan compounds, etc. A plurality of types of anaerobic curing initiators and curing accelerators may be used in combination.

[0039] In this embodiment, the first composition 20' is surrounded by a first surface (including the first electrode 110), a second surface (including the second electrode 114), and the second composition 30'. Furthermore, the first composition 20' is in contact with the first electrode 110, the second electrode 114, and the conductive particles 10. When the first composition 20' contains an anaerobic curing initiator component, the first electrode 110, the second electrode 114, and the conductive particles 10 contain a transition metal component, so that the peroxide is decomposed by a redox reaction mediated by the curing accelerator and the transition metal ion, and the anaerobic curing of the first composition 20' can be initiated.

[0040] Since the first composition 20' further contains an anaerobic curing initiator component, the curing of the first composition 20' can be ensured even under conditions such as the materials of the first electronic component 101, the second electronic component 111, the first electrode 110, and the second electrode 114, or the connection method, which do not allow the first composition 20' to be cured solely by the action of the photocuring initiator component upon light irradiation.

[0041] Additives can be used as necessary to improve or change properties such as fluidity, coating properties, storage properties, curing properties, and physical properties after curing. Known compounds can be used as additives, and examples of such additives include, but are not limited to, silane coupling agents, diluents, modifiers, surfactants, storage stabilizers, defoamers, and leveling agents. Silane coupling agents are not particularly limited, and examples of such silane coupling agents include epoxy, amino, mercapto-sulfide, and ureido. The addition of a silane coupling agent improves the adhesion at the interface between an organic material and an inorganic material.

[0042] The viscosity of the first composition 20' is higher than the viscosity of the second composition 30'. The viscosity of the first composition 20' is 5×10 3 cP or more 5×10 5 The viscosity of the second composition 30' is in the range of 2×10 3 cP or more 2×10 5The viscosity of the first composition 20' is in the range of 5×10 cP or less. The difference between the viscosity of the first composition 20' and the viscosity of the second composition 30' may be at least two times. The viscosity of the first composition 20' and the second composition 30' can also be controlled by the degree of polymerization of the resin material contained in the first composition 20' and the second composition 30'. The viscosity of each composition can be appropriately selected from within the above range depending on the type of the first electronic component 101 and the second electronic component 111, the method for producing the connection structure, the method for arranging the composition, and the like. When the viscosity of the first composition 20' is 5×10 3 If the viscosity is less than cP, the conductive particles 10 will not be uniformly dispersed, and will be prone to settling or aggregation. When the viscosity of the first composition 20' is higher than that of the second composition 30', the flow of the conductive particles 10 mixed into the first composition 20' is suppressed, and the conductive particles 10 can be efficiently arranged between the first electrode 110 and the second electrode 114. Therefore, the connection reliability between the first electrode 110 and the second electrode 114 can be ensured.

[0043] The first resin 20 and the second resin 30 are formed by curing the first composition 20' and the second composition 30'. The volumetric shrinkage rate of the first resin 20 caused by curing the first composition 20' and the volumetric shrinkage rate of the second resin 30 caused by curing the second composition 30' are preferably 4% or less, more preferably 2% or less. If the volumetric shrinkage rates of the first resin 20 and the second resin 30 are greater than 4%, internal shrinkage stress occurs, and warping is likely to occur due to the difference in bending rigidity between the first electronic component 101 and the second electronic component 111, and the physical connection reliability between the first electronic component 101 and the second electronic component 111 decreases.

[0044] The first resin 20 preferably has a high adhesive strength with conductive materials such as metal materials and metal oxide materials. The first resin 20 preferably has a high adhesive strength with metal materials forming the first electrode 110 and the second electrode 114, and preferably has a high adhesive strength with Au and ITO, for example. The second resin 30 preferably has a high adhesive strength with resin materials. The second resin 30 preferably has a high adhesive strength with insulating film materials forming the first surface of the first member 102 and the second surface of the second member 112, and preferably has a high adhesive strength with insulating materials such as polyimide, para-polyamide film, P-SiNx, and glass, for example. The adhesive strength of the first resin 20 is preferably in the range of 500 N / m or more. The adhesive strength of the second resin 30 is preferably in the range of 700 N / m or more. The adhesive strength, glass transition temperature, and hardness of each resin can be appropriately selected depending on the types of first electronic component 101 and second electronic component 111, the manufacturing method of the connection structure, and the like. By selecting first resin 20 and second resin 30 depending on the material of the adherend, respectively, it is possible to further improve the adhesive strength of the first surface of first member 102 and the second surface of second member 112. Therefore, it is possible to improve the reliability of the physical connection between first electronic component 101 and second electronic component 111.

[0045] [Method of manufacturing the connection structure] Next, a method for producing a connection structure according to one embodiment of the present invention will be described with reference to Figures 2 to 5. In this embodiment, since it is possible to use existing first electronic component 101 and second electronic component 111, a description thereof will be omitted, and a method for forming connection structure 100 will be described in detail with reference to Figures 2 to 5.

[0046] First, a plurality of conductive particles 10 and a first composition 20' are placed in a predetermined area on the first electrode 110. The plurality of conductive particles 10 and the first composition 20' are mixed and placed using an offset printing method. Since the mixture of the conductive particles 10 and the first composition 20' contains the conductive particles 10, a pad printing method in which a printed matter is transferred using a pad is particularly preferable. A method for placing a plurality of conductive particles 10 and the first composition 20' will be described with reference to Figs. 2 to 5.

[0047] FIG. 2 shows a process of disposing a mixture of a plurality of conductive particles 10 and a first composition 20' on a plate 220. FIG. 3 is a cross-sectional view taken along the line C-C' of FIG. 2. In this embodiment, the plate 220 is, for example, a waterless flat plate. The plate 220 has a recess 226 corresponding to the region where the plurality of conductive particles 10 and the first composition 20' are disposed on the first surface of the first member 102. The plate 220 includes a lyophilic layer 222 and a lyophobic layer 224. The lyophobic layer 224 is disposed on the liquid-contacting surface and has an opening. The lyophobic layer 224 exposes the lyophobic layer 222 at the opening. That is, the lyophobic layer 224 is disposed on the upper surface of the plate 220, and the lyophobic layer 222 is disposed on the bottom surface of the recess 226.

[0048] The material of the lyophilic layer 222 may be, for example, aluminum oxide (Al2O3). The material of the liquid-repellent layer 224 is preferably, for example, a silicone resin having elasticity. The depth of the recesses 226 is approximately the same as the thickness of the liquid-repellent layer 224. The depth of the recesses 226 may be greater than the diameter of the conductive particles 10. The plate 220 may be a waterless plate, a glass concave plate, a stainless steel concave plate, a sapphire concave plate, or a zirconia concave plate. It is preferable that the recesses 226 are spaced apart by 5 μm or more when viewed from the top surface of the plate 220. If the recesses 226 are spaced apart by less than 5 μm, the liquid-repellent layer 224 separating the adjacent recesses 226 is easily damaged, and the durability of the plate 220 may be reduced.

[0049] In this embodiment, the shape of the recess 226 when viewed in the opposing direction of the electrodes (direction D1) is circular. The recess 226 also has the same shape in the depth direction. That is, the recess 226 has a shape obtained by cutting a cylinder out of the plate 220. However, the shape of the recess 226 is not limited to this, and the shape of the recess 226 can be any shape as long as the depth is within the above range.

[0050] In this embodiment, the mixture of conductive particles 10 and first composition 20' is placed on plate 220 using roller 210. As shown in Figures 2(A) to (C) and 3(A) to (C), roller 210 moves while rotating from one end of plate 220 to the other end so that the outer circumferential surface of roller 210 contacts the upper surface of plate 220 (upper surface of liquid repellent layer 224), thereby placing conductive particles 10 and first composition 20' in recesses 226.

[0051] The concentration of the conductive particles 10 mixed in the first composition 20' is preferably in the range of 20% by volume or more and 60% by volume or less of the conductive particles 10 with respect to the total volume of the conductive particles 10 and the first composition 20'. If the amount of the conductive particles 10 mixed is less than 20% by volume, it becomes difficult to fill a sufficient number of the conductive particles 10 in the recesses 226. If the amount of the conductive particles 10 mixed is more than 60% by volume, the operability becomes poor, and it becomes difficult to fill the mixture of the conductive particles 10 and the first composition 20' in the recesses 226. By disposing the mixture of the conductive particles 10 and the first composition 20' with the roller 210, the conductive particles 10 and the first composition 20' are filled in the recesses 226 of the plate 220. Since the recesses 226 have a depth in the above-mentioned range, one conductive particle 10 can be held in the depth direction (D1 direction) of the recesses 226. The number of the conductive particles 10 arranged in one recess 226 is preferably 1 to 7. The number of conductive particles 10 arranged in one recess 226 is preferably 7, and more preferably 3. By arranging them in this manner, the conductive particles 10 and the first composition 20' can be efficiently transferred to the pad in the step of transferring a mixture of the conductive particles 10 and the first composition 20' to the pad, which will be described later.

[0052] Since the recesses 226 have openings in the elastic liquid-repellent layer 224, even if the conductive particles 10 come into contact with the liquid-repellent layer 224 as the roller 210 advances, the conductive particles 10 can be held in the recesses 226 without being damaged. Since the recesses 226 have the lyophilic layer 222 at the bottom, they can hold the first composition 20'. Meanwhile, since the liquid-repellent layer 224 is disposed on the upper surface of the plate 220, the first composition 20' is repelled.

[0053] 4 shows a process of transferring a mixture of a plurality of conductive particles 10 and a first composition 20' from the plate 220 to the pad 230. As shown in FIGS. 4(A) to 4(C), the pad 230 is pressed against the plate 220 in a direction substantially perpendicular to the plate 220, and then pulled away from the plate 220 in a direction substantially perpendicular to the plate 220, thereby transferring the conductive particles 10 and the first composition 20' filled in the recesses 226 to the pad 230. The viscosity of the first composition 20' is 5×10 3 cP or more 5×10 5 Since the viscosity is in the range of cP or less, the conductive particles 10 mixed in the first composition 20 ′ can be held on the surface of the pad 230 .

[0054] The material of pad 230 is preferably, for example, a silicone resin having elasticity. The shape of pad 230 preferably has at least a convex structure. The shape of pad 230 can be appropriately selected depending on the shapes of first electronic component 101 and plate 220.

[0055] 5(A)-(B) show the process of transferring a mixture of a plurality of conductive particles 10 and a first composition 20' from a pad 230 to a first electrode 110. As shown in FIG. 5(A)-(B), the pad 230 is pressed in a direction substantially perpendicular to the first electrode 110, and the pad 230 is pulled away in a direction substantially perpendicular to the first electrode 110, thereby transferring the mixture of the conductive particles 10 and the first composition 20' transferred to the pad 230 onto the first electrode 110. On the first surface of the first member 102, the conductive particles 10 and the first composition 20' form a convex structure in the opposing direction of the electrodes (direction D1). The viscosity of the curable resin material of the first composition 20' is 5×10 3 cP or more 5×10 5Since the viscosity is in the range of 100 cP or less, the conductive particles 10 mixed into the first composition 20' can be held on the first electrode 110. By using such a method, the conductive particles 10 and the first composition 20' can be reliably arranged in a predetermined region on the first electrode 110.

[0056] Next, the second composition 30' is placed on the first surface of the first member 102. As shown in FIG. 5(C), the second composition 30' is also placed on the first electrode 110 on the first surface of the first member 102 and in a region other than the first electrode 110. That is, the second composition 30' is also placed on the first electrode 110 and in a region other than the region where the plurality of conductive particles 10 and the first composition 20' are placed. Furthermore, the second composition 30' is also placed on the first electrode 110 and in a region where the plurality of conductive particles 10 and the first composition 20' are placed. That is, the second composition 30' is placed on the first surface of the first member 102 and in a region other than the first electrode 110 and the first electrode 110. In this embodiment, the second composition 30' is in a paste form and is placed using an inkjet method or a jet dispensing method. However, the method for disposing the second composition 30' is not limited thereto, and any existing method can be used, such as application by inkjet or dispenser, or screen printing.

[0057] The viscosity of the second composition 30' is 2×10 3 cP or more 2×10 5 The viscosity of the first composition 20' is in the range of 0.1 to 1.0 cP or less. The viscosity of the first composition 20' is higher than the viscosity of the second composition 30', and the difference in viscosity may be at least two times. This makes it possible to suppress the flow of the conductive particles 10 mixed into the first composition 20', and to hold the conductive particles 10 on the first electrode 110.

[0058] Next, the second member 112 is mounted on the first surface of the first member 102. As shown in FIG. 5(D), the first surface of the first member 102 and the second surface of the second member 112 are arranged to face each other so that the corresponding first electrodes 110 and the corresponding second electrodes 114 face each other. The first member 102 and the second member 112 are pressed, and the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. The first surface of the first member 102 and the second surface of the second member 112 are pressed against the conductive particles 10, the first composition 20', and the second composition 30'. At this time, the first composition 20' arranged on the first electrode 110 has a higher viscosity than the second composition 30', and is therefore held on the first electrode 110 together with the conductive particles 10. The second composition 30' arranged on the conductive particles 10 and the first composition 20' on the first electrode 110 is lower in viscosity than the first composition 20', and therefore moves mostly to areas other than the areas where the conductive particles 10 and the first composition 20' are arranged. That is, when stress is applied between the first surface of the first member 102 and the second surface of the second member 112, most (most) of the second composition 30' located between the second electrode 114 and the first composition 20' moves, and the second composition 30' located between the second electrode 114 and the conductive particles 10 is eliminated. Furthermore, the first composition 20' and the conductive particles 10 forming the convex structure on the first surface of the first member 102 are buried by the second composition 30'. In other words, the second composition 30' is mostly disposed in the area other than the area (convex structure) where the plurality of conductive particles 10 and the first composition 20' are disposed on the first surface of the first member 102. The conductive particles 10 disposed on the first electrode 110 contact the second electrode 114, and the second composition 30' is disposed so as to contact the area other than the first electrode 110 on the first surface and the area other than the second electrode 114 on the second surface and the second electrode 114.

[0059] As shown in Fig. 5(E), the first member 102 and the second member 112 are further pressed, and the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. At this time, sufficient pressure is applied so that the opposing first electrode 110 and second electrode 114 contact each other above and below one conductive particle 10. The pressure for pressing the first surface of the first member 102 and the second surface of the second member 112 can be appropriately adjusted depending on the repulsive force of the conductive particle 10 and the elastic force of the first composition 20' and the second composition 30'.

[0060] Here, the conductive particle 10 is pressurized until it is deformed into an oblate spheroid by receiving pressure from the first electrode 110 and the second electrode 114. The amount of deformation of the conductive particle 10 due to pressure is controlled to be in the range of 10% to 40% of the major axis of the conductive particle 10 (100%). At this time, stress is applied between the first electrode 110, the conductive particle 10, and the second electrode 114, so that the first composition 20' and the second composition 30' between the first electrode 110 and the conductive particle 10, and between the second electrode 114 and the conductive particle 10 are eliminated. Furthermore, even if a natural oxide film is formed on the first electrode 110, the conductive particle 10, or the second electrode 114, and the surface is insulated, the natural oxide film is broken through by pressing the first electrode 110 and the second electrode 114 together with the conductive particle 10 sandwiched therebetween, and a conductive path is formed. The deformation of the conductive particles 10 can increase the contact area between the first electrode 110 and the conductive particles 10, and the contact area between the second electrode 114 and the conductive particles 10. By being arranged in this manner, the conductive particles 10 can electrically connect the first electrode 110 and the second electrode 114.

[0061] With the first member 102 and the second member 112 pressed against each other, the connection structure 100 is irradiated with light. The wavelength region of the light is preferably ultraviolet and / or visible light, and more preferably ultraviolet. The wavelength region of the light can be appropriately selected depending on the photocuring initiator component contained in the first composition 20' and the second composition 30'. The direction of light irradiation can be appropriately selected from the first electronic component 101 side or the second electronic component 111 side depending on the wavelength region of the light and the materials of the first member 102 and the second member 112. It is also preferable to irradiate from both sides, and it is also effective to irradiate from a side that is not blocked by anything. The light irradiation time can be appropriately selected depending on the photocuring initiator component and the curable resin material contained in the first composition 20' and the second composition 30'. In general, it is preferable that the irradiation time is about 3 seconds or less, and more preferably about 1 second or less. In other words, the light irradiation intensity, the photocuring initiator component, and the curable resin material are appropriately selected so that the curing can be performed at room temperature within such a time.

[0062] By the light irradiation, most of the first composition 20' and the second composition 30' contained in the connection structure 100 are cured at room temperature. However, the curing may be insufficient between the first electrode 110 and the second electrode 114 where sufficient light does not reach. For this reason, it is more preferable that the material of the first composition 20' contains a shielding part curing active compound or an anaerobic curing initiation component. By containing a shielding part curing active compound or an anaerobic curing initiation component, room temperature curing can be promoted even in a portion where sufficient light does not reach. The first resin 20 and the second resin 30 are formed by curing the first composition 20' and the second composition 30'. By adopting such a configuration, the first surface of the first electronic component 101 and the second surface of the second electronic component 111 can be physically connected.

[0063] According to the present embodiment, it is possible to provide a method for manufacturing a connection structure and a connection structure that can ensure conductivity between opposing electrodes and suppress short circuits between adjacent connection electrodes through a simple process, even if the electrodes arranged on the electronic component are highly fine and highly dense. Furthermore, since the heat curing connection method is not used, it is possible to connect electrodes of upper and lower substrates with different thermal expansion coefficients with high precision.

[0064] <Second embodiment> The structure of the connection structure according to this embodiment is the same as that of the connection structure according to the first embodiment. The method for producing the connection structure according to this embodiment is the same as the method for producing the connection structure according to the first embodiment, except that the second composition 30' is disposed in the second electrode 114 on the second surface and in an area other than the second electrode 114. Explanations of the same things as in the first embodiment will be omitted, and only differences from the method for producing the connection structure according to the first embodiment will be described here.

[0065] [Method of manufacturing the connection structure] A method for producing a connection structure according to one embodiment of the present invention will be described with reference to Fig. 6. In this embodiment, since it is possible to use an existing first electronic component 101 and second electronic component 111, a description thereof will be omitted, and a method for forming the connection structure 100 will be described in detail with reference to Fig. 6.

[0066] First, a plurality of conductive particles 10 and a first composition 20' are placed in a predetermined area on the first electrode 110. The plurality of conductive particles 10 and the first composition 20' are mixed and placed using an offset printing method. Since the mixture of the conductive particles 10 and the first composition 20' contains the conductive particles 10, a pad printing method in which a printed matter is transferred using a pad is particularly preferable. The area and method for placing the mixture of the plurality of conductive particles 10 and the first composition 20' are the same as those in the method for producing the connection structure according to the first embodiment, and therefore will not be described here.

[0067] 6(A)-(B) show a process of transferring a mixture of a plurality of conductive particles 10 and a first composition 20' from a pad 230 to a first electrode 110 by pad printing. As shown in FIG. 6(A)-(B), the pad 230 is pressed in a direction substantially perpendicular to the first electrode 110, and the pad 230 is pulled away in a direction substantially perpendicular to the first electrode 110, thereby transferring the mixture of the conductive particles 10 and the first composition 20' transferred to the pad 230 onto the first electrode 110. On the first surface of the first member 102, the conductive particles 10 and the first composition 20' form a convex structure in the opposing direction of the electrodes (direction D1). The viscosity of the curable resin material of the first composition 20' is 5×10 3 cP or more 5×10 5 Since the viscosity is in the range of 100 cP or less, the conductive particles 10 mixed into the first composition 20' can be held on the first electrode 110. By using such a method, the conductive particles 10 and the first composition 20' can be reliably arranged in a predetermined region on the first electrode 110.

[0068] Next, the second composition 30' is placed on the second surface of the second member 112. As shown in FIG. 6(C)-(D), the second composition 30' is placed on the second surface of the second member 112 in an area other than the second electrode 114. Furthermore, the second composition 30' is placed on the second electrode 114 in an area other than the area where the plurality of conductive particles 10 and the first composition 20' described later are placed. The second composition 30' is also placed on the second electrode 114 in an area where the plurality of conductive particles 10 and the first composition 20' described later are placed. That is, the second composition 30' is placed on the second surface of the second member 112 in an area other than the second electrode 114 and the second electrode 114. In this embodiment, the second composition 30' is in a paste form and is placed using an inkjet method or a jet dispensing method. However, the method is not limited to this, and the method of placing the second composition 30' can be an existing method. For example, coating by inkjet or dispenser, screen printing, or the like can be used.

[0069] The viscosity of the second composition 30' is 2×10 3cP or more 2×10 5 This makes it possible to suppress the flow of the second composition 30'.

[0070] Next, the second electronic component 111 is mounted on the first surface of the first electronic component 101. As shown in FIG. 6(E), the first surface of the first member 102 and the second surface of the second member 112 are arranged to face each other so that the corresponding first electrodes 110 and the corresponding second electrodes 114 face each other. The first member 102 and the second member 112 are pressed, and the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. The first surface of the first member 102 and the second surface of the second member 112 are pressed against the conductive particles 10, the first composition 20', and the second composition 30'. At this time, the first composition 20' arranged on the first electrode 110 has a higher viscosity than the second composition 30', and is therefore held on the first electrode 110 together with the conductive particles 10. The second composition 30' disposed on the second electrode 114 has a lower viscosity than the first composition 20', and therefore most of the second composition 30' moves to areas other than the areas where the conductive particles 10 and the first composition 20' are disposed. That is, when stress is applied between the first surface of the first member 102 and the second surface of the second member 112, most (most) of the second composition 30' located between the second electrode 114 and the first composition 20' moves, and the second composition 30' located between the second electrode 114 and the conductive particles 10 is removed. Furthermore, the first composition 20' and the conductive particles 10 that form a convex structure on the first surface of the first member 102 are buried by the second composition 30'. In other words, the second composition 30' is mostly disposed in areas other than the area (convex structure) where the conductive particles 10 and the first composition 20' are disposed on the second surface of the second member 112. The conductive particles 10 disposed on the first electrode 110 are in contact with the second electrode 114, and the second composition 30' is disposed so as to be in contact with the areas of the first surface other than the first electrode 110 and the areas of the second surface other than the second electrode 114 and the second electrode 114.

[0071] As shown in FIG. 6(F), the first member 102 and the second member 112 are further pressed, and the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. At this time, a sufficient pressure is applied so that the opposing first electrode 110 and second electrode 114 contact each other above and below one conductive particle 10. The pressure for pressing the first surface of the first member 102 and the second surface of the second member 112 can be appropriately adjusted by the repulsive force of the conductive particle 10 and the elastic force of the first composition 20' and the second composition 30'. By adopting such a configuration, the first electrode 110 and the second electrode 114 can be electrically connected.

[0072] With the first member 102 and the second member 112 pressed against each other, the connection structure 100 is irradiated with light to cure the first composition 20' and the second composition 30'. The method for curing the first composition 20' and the second composition 30' is the same as the method for producing the connection structure according to the first embodiment, and therefore will not be described here. The first resin 20 and the second resin 30 are formed by curing the first composition 20' and the second composition 30'. With this configuration, the first surface of the first electronic component 101 and the second surface of the second electronic component 111 can be physically connected to each other.

[0073] According to the present embodiment, it is possible to provide a method for manufacturing a connection structure and a connection structure that can ensure conductivity between opposing electrodes and suppress short circuits between adjacent connection electrodes through a simple process, even if the electrodes arranged on the electronic component are highly fine and highly dense. Furthermore, since the heat curing connection method is not used, it is possible to connect electrodes of upper and lower substrates with different thermal expansion coefficients with high precision.

[0074] <Third embodiment> The structure of the connection structure according to this embodiment is the same as that of the connection structure according to the first embodiment, except that the second resin 30 is disposed on the second electrode 114. The method for producing the connection structure according to this embodiment is the same as the method for producing the connection structure according to the first embodiment, except that a mixture of a plurality of conductive particles 10 and a first composition 20' is disposed on the second electrode 114 of the second surface, and the second composition 30' is disposed on the first electrode 110 of the first surface and in an area other than the first electrode 110. Explanations of the same things as in the first embodiment will be omitted, and only the parts that are different from the connection structure and the method for producing the connection structure according to the first embodiment will be described here.

[0075] [Connection structure] Fig. 7 shows the structure of a connection structure according to one embodiment of the present invention. Fig. 7(A) is a plan view of a connection structure according to one embodiment of the present invention. Fig. 7(B) is a cross-sectional view taken along line D-D' of Fig. 7(A). Fig. 7(C) is an enlarged cross-sectional view of a conductive particle in region E of Fig. 7(B).

[0076] As shown in FIG. 7(A) to (C), a plurality of conductive particles 10 are dispersed in a first resin 20 and a second resin 30 between a first electrode 110 and a second electrode 114. Each conductive particle 10 is surrounded by the first resin 20 in a planar direction (D2-D3 planar direction) on the second electrode 114. Each conductive particle 10 is surrounded by the second resin 30 in a planar direction (D2-D3 planar direction) on the first electrode 110. The first resin 20 and the second resin 30 are insulating resins. Therefore, the connection structure 100a has insulation in a planar direction (D2-D3 planar direction). However, a plurality of conductive particles 10 arranged between the opposing first electrode 110 and second electrode 114 and adjacent to each other in a planar direction (D2-D3 planar direction) may be in contact with each other. When adjacent conductive particles 10 in the planar direction (D2-D3 planar direction) come into contact with each other, the adjacent conductive particles 10 are also electrically connected to each other. By arranging the conductive particles 10 in this manner, the conductive particles 10 can more reliably electrically connect the opposing first electrode 110 and second electrode 114. The distance between adjacent conductive particles 10 can be appropriately controlled by the concentration of the conductive particles 10 mixed into the first composition 20' described below.

[0077] A second resin 30 is further disposed between the first surface of the first member 102 and the second surface of the second member 112. The second resin 30 is disposed in a region other than between the opposing first electrode 110 and second electrode 114. The second resin 30 is disposed between a region other than the first electrode on the first surface and a region other than the second electrode on the second surface. That is, the second resin 30 is disposed between and around a plurality of first electrodes 110 adjacent in the surface direction (D2-D3 surface direction) (between and around a plurality of second electrodes 114 adjacent in the surface direction (D2-D3 surface direction)). Furthermore, the second resin 30 is disposed between the first electrode 110 and the second electrode 114, in a region other than the region where the conductive particles 10 and the first resin 20 are disposed. The second resin 30 is disposed between and around the area where the conductive particles 10 and the first resin 20 adjacent in the planar direction (D2-D3 planar direction) are disposed. In other words, the conductive particles 10 and the first resin 20 are surrounded by the second resin 30 in the planar direction (D2-D3 planar direction). That is, when viewed in the facing direction (D1 direction) of the electrodes, the conductive particles 10 are surrounded by the first resin 20 on the second surface of the second electronic component 111, and the first resin 20 is surrounded by the second resin 30. As shown in FIGS. 7(B) and (C), the second resin 30 is further disposed between the first electrode 110 and the second electrode 114, in the area where the conductive particles 10 and the first resin 20 are disposed. The second resin 30 is disposed between the first resin 20 and the first electrode 110. That is, when viewed in the opposing direction of the electrodes (D1 direction), the multiple conductive particles 10 are surrounded by the second resin 30 on the first surface of the first electronic component 101. The first resin 20 and the second resin 30 are insulating resins. Therefore, the connection structure 100a has insulation properties in the planar direction (D2-D3 planar direction). By arranging in this manner, the second resin 30 can reliably insulate between the multiple first electrodes 110 adjacent to each other in the planar direction (D2-D3 planar direction), between the multiple second electrodes 114 adjacent to each other in the planar direction (D2-D3 planar direction), and between the first electrodes 110 and the second electrodes 114 that do not face each other.

[0078] A first resin 20 and a second resin 30 are disposed between the first electrode 110 and the second electrode 114. The first resin 20 is disposed so as to be in contact with the second electrode 114, and the second resin 30 is disposed so as to be in contact with the first electrode 110. That is, the first resin 20 and the second resin 30 are disposed so as to be in contact with the first electrode 110 and the second electrode 114 in a planar direction (D2-D3 planar direction), and are laminated in the opposing direction of the electrodes (D1 direction).

[0079] [Method of manufacturing the connection structure] A method for producing a connection structure according to one embodiment of the present invention will be described with reference to Fig. 8. In this embodiment, since it is possible to use an existing first electronic component 101 and second electronic component 111, a description thereof will be omitted, and a method for forming a connection structure 100a will be described in detail with reference to Fig. 8.

[0080] First, a plurality of conductive particles 10 and a first composition 20' are placed in a predetermined area on the second electrode 114. The plurality of conductive particles 10 and the first composition 20' are mixed and placed using an offset printing method. Since the mixture of the conductive particles 10 and the first composition 20' contains the conductive particles 10, a pad printing method in which a printed matter is transferred using a pad is particularly preferable. The area and method for placing the mixture of the plurality of conductive particles 10 and the first composition 20' are the same as those in the method for producing the connection structure according to the first embodiment, and therefore will not be described here.

[0081] 8(A)-(B) show a process of transferring a mixture of a plurality of conductive particles 10 and a first composition 20' from a pad 230 to a second electrode 114 by a pad printing method. As shown in FIG. 8(A)-(B), the pad 230 is pressed in a direction substantially perpendicular to the second electrode 114, and the pad 230 is pulled away in a direction substantially perpendicular to the second electrode 114, thereby transferring the mixture of the conductive particles 10 and the first composition 20' transferred to the pad 230 onto the second electrode 114. On the second surface of the second member 112, the conductive particles 10 and the first composition 20' form a convex structure in the opposing direction of the electrodes (direction D1). The viscosity of the curable resin material of the first composition 20' is 5×10 3 cP or more 5×105 Since the viscosity is in the range of 100 cP or less, the conductive particles 10 mixed into the first composition 20' can be held on the second electrode 114. By using such a method, the conductive particles 10 and the first composition 20' can be reliably arranged in a predetermined region on the second electrode 114.

[0082] Next, the second composition 30' is placed on the first surface of the first member 102. As shown in FIG. 8(C)-(D), the second composition 30' is placed on the first surface of the first member 102 in an area other than the first electrode 110. Furthermore, the second composition 30' is placed on the first electrode 110 in an area other than the area where the plurality of conductive particles 10 and the first composition 20' described later are placed. The second composition 30' is also placed on the first electrode 110 in an area where the plurality of conductive particles 10 and the first composition 20' described later are placed. That is, the second composition 30' is placed on the first surface of the first member 102 in an area other than the first electrode 110 and the first electrode 110. In this embodiment, the second composition 30' is in a paste form and is placed using an inkjet method or a jet dispensing method. However, the method of placing the second composition 30' is not limited to this, and an existing method can be used. For example, coating by inkjet or dispenser, screen printing, or the like can be used.

[0083] The viscosity of the second composition 30' is 2×10 3 cP or more 2×10 5 This makes it possible to suppress the flow of the second composition 30'.

[0084] Next, the second electronic component 111 is mounted on the first surface of the first electronic component 101. As shown in FIG. 8(E), the first surface of the first member 102 and the second surface of the second member 112 are arranged to face each other so that the corresponding first electrodes 110 and the corresponding second electrodes 114 face each other. The first member 102 and the second member 112 are pressed, and the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. The first surface of the first member 102 and the second surface of the second member 112 are pressed against the conductive particles 10, the first composition 20', and the second composition 30'. At this time, the first composition 20' arranged on the second electrode 114 has a higher viscosity than the second composition 30', and is therefore held on the second electrode 114 together with the conductive particles 10. The second composition 30' disposed on the first electrode 110 has a lower viscosity than the first composition 20', and therefore most of the second composition 30' moves to areas other than the areas where the conductive particles 10 and the first composition 20' are disposed. That is, when stress is applied between the first surface of the first member 102 and the second surface of the second member 112, most (most) of the second composition 30' located between the first electrode 110 and the first composition 20' moves, and the second composition 30' located between the first electrode 110 and the conductive particles 10 is removed. Furthermore, the first composition 20' and the conductive particles 10 that form a convex structure on the second surface of the second member 112 are buried by the second composition 30'. In other words, the second composition 30' is disposed mostly in areas other than the area (convex structure) where the conductive particles 10 and the first composition 20' are disposed on the first surface of the first member 102. The conductive particles 10 disposed on the second electrode 114 are in contact with the first electrode 110, and the second composition 30' is disposed so as to be in contact with the first electrode 110 and with the areas of the first surface other than the first electrode 110 and the areas of the second surface other than the second electrode 114.

[0085] As shown in FIG. 8(F), the first member 102 and the second member 112 are further pressed, and the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. At this time, a sufficient pressure is applied so that the opposing first electrode 110 and second electrode 114 contact each other above and below one conductive particle 10. The pressure for pressing the first surface of the first member 102 and the second surface of the second member 112 can be appropriately adjusted by the repulsive force of the conductive particle 10 and the elastic force of the first composition 20' and the second composition 30'. By adopting such a configuration, the first electrode 110 and the second electrode 114 can be electrically connected.

[0086] With the first member 102 and the second member 112 pressed against each other, the connection structure 100a is irradiated with light to cure the first composition 20' and the second composition 30'. The method for curing the first composition 20' and the second composition 30' is the same as the method for producing the connection structure according to the first embodiment, and therefore will not be described here. The first resin 20 and the second resin 30 are formed by curing the first composition 20' and the second composition 30'. With this configuration, the first surface of the first electronic component 101 and the second surface of the second electronic component 111 can be physically connected to each other.

[0087] According to the present embodiment, it is possible to provide a method for manufacturing a connection structure and a connection structure that can ensure conductivity between opposing electrodes and suppress short circuits between adjacent connection electrodes through a simple process, even if the electrodes arranged on the electronic component are highly fine and highly dense. Furthermore, since the heat curing connection method is not used, it is possible to connect electrodes of upper and lower substrates with different thermal expansion coefficients with high precision.

[0088] <Fourth embodiment> The structure of the connection structure according to this embodiment is the same as that of the connection structure according to the third embodiment. The method for producing the connection structure according to this embodiment is the same as the method for producing the connection structure according to the third embodiment, except that the second composition 30' is disposed in the second electrode 114 on the second surface and in an area other than the second electrode 114. Explanations of the same things as in the first and third embodiments will be omitted, and only differences from the methods for producing the connection structures according to the first and third embodiments will be described here.

[0089] [Method of manufacturing the connection structure] A method for producing a connection structure according to one embodiment of the present invention will be described with reference to Fig. 9. In this embodiment, since it is possible to use an existing first electronic component 101 and second electronic component 111, a description thereof will be omitted, and a method for forming a connection structure 100a will be described in detail with reference to Fig. 9.

[0090] First, a plurality of conductive particles 10 and a first composition 20' are placed in a predetermined area on the second electrode 114. The plurality of conductive particles 10 and the first composition 20' are mixed and placed using an offset printing method. Since the mixture of the conductive particles 10 and the first composition 20' contains the conductive particles 10, a pad printing method in which a printed matter is transferred using a pad is particularly preferable. The area and method for placing the mixture of the plurality of conductive particles 10 and the first composition 20' are the same as those in the method for producing the connection structure according to the first embodiment, and therefore will not be described here.

[0091] 9(A)-(B) show a process of transferring a mixture of a plurality of conductive particles 10 and a first composition 20' from a pad 230 to a second electrode 114 by a pad printing method. As shown in FIG. 9(A)-(B), the pad 230 is pressed in a direction substantially perpendicular to the second electrode 114, and the pad 230 is pulled away in a direction substantially perpendicular to the second electrode 114, thereby transferring the mixture of the conductive particles 10 and the first composition 20' transferred to the pad 230 onto the second electrode 114. On the second surface of the second member 112, the conductive particles 10 and the first composition 20' form a convex structure in the opposing direction of the electrodes (direction D1). The viscosity of the curable resin material of the first composition 20' is 5×10 3 cP or more 5×10 5 Since the viscosity is in the range of 100 cP or less, the conductive particles 10 mixed into the first composition 20' can be held on the second electrode 114. By using such a method, the conductive particles 10 and the first composition 20' can be reliably arranged in a predetermined region on the second electrode 114.

[0092] Next, the second composition 30' is placed on the second surface of the second member 112. As shown in FIG. 9(C)-(D), the second composition 30' is placed on the second surface of the second member 112 in an area other than the second electrode 114. Furthermore, the second composition 30' is placed on the second electrode 114 in an area other than the area where the plurality of conductive particles 10 and the first composition 20' described later are placed. Furthermore, the second composition 30' is placed on the second electrode 114 in an area where the plurality of conductive particles 10 and the first composition 20' are placed. That is, the second composition 30' is placed on the second surface of the second member 112 in an area other than the second electrode 114 and the second electrode 114. In this embodiment, the second composition 30' is in a paste form and is placed using an inkjet method or a jet dispensing method. However, the method of placing the second composition 30' is not limited to this, and an existing method can be used. For example, coating by inkjet or dispenser, screen printing, or the like can be used.

[0093] The viscosity of the second composition 30' is 2×10 3cP or more 2×10 5 This makes it possible to suppress the flow of the second composition 30'.

[0094] Next, the second electronic component 111 is mounted on the first surface of the first electronic component 101. As shown in FIG. 9(E), the first surface of the first member 102 and the second surface of the second member 112 are arranged to face each other so that the corresponding first electrodes 110 and the corresponding second electrodes 114 face each other. The first member 102 and the second member 112 are pressed, and the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. The first surface of the first member 102 and the second surface of the second member 112 are pressed against the conductive particles 10, the first composition 20', and the second composition 30'. At this time, the first composition 20' arranged on the second electrode 114 has a higher viscosity than the second composition 30', and is therefore held on the second electrode 114 together with the conductive particles 10. The second composition 30' disposed on the second electrode 114 has a lower viscosity than the first composition 20', and therefore most of the second composition 30' moves to areas other than the areas where the conductive particles 10 and the first composition 20' are disposed. That is, when stress is applied between the first surface of the first member 102 and the second surface of the second member 112, most (most) of the second composition 30' located between the first electrode 110 and the first composition 20' moves, and the second composition 30' located between the first electrode 110 and the conductive particles 10 is removed. Furthermore, the first composition 20' and the conductive particles 10 that form a convex structure on the second surface of the second member 112 are buried by the second composition 30'. In other words, the second composition 30' is mostly disposed in areas other than the area (convex structure) where the conductive particles 10 and the first composition 20' are disposed on the second surface of the second member 112. The conductive particles 10 disposed on the second electrode 114 are in contact with the first electrode 110, and the second composition 30' is disposed so as to be in contact with the first electrode 110 and with the areas of the first surface other than the first electrode 110 and the areas of the second surface other than the second electrode 114.

[0095] As shown in FIG. 9(F), the first member 102 and the second member 112 are further pressed, and the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. At this time, a sufficient pressure is applied so that the opposing first electrode 110 and second electrode 114 contact each other above and below one conductive particle 10. The pressure for pressing the first surface of the first member 102 and the second surface of the second member 112 can be appropriately adjusted by the repulsive force of the conductive particle 10 and the elastic force of the first composition 20' and the second composition 30'. By adopting such a configuration, the first electrode 110 and the second electrode 114 can be electrically connected.

[0096] With the first member 102 and the second member 112 pressed against each other, the connection structure 100a is irradiated with light to cure the first composition 20' and the second composition 30'. The method for curing the first composition 20' and the second composition 30' is the same as the method for producing the connection structure according to the first embodiment, and therefore will not be described here. The first resin 20 and the second resin 30 are formed by curing the first composition 20' and the second composition 30'. With this configuration, the first surface of the first electronic component 101 and the second surface of the second electronic component 111 can be physically connected to each other.

[0097] According to the present embodiment, it is possible to provide a method for manufacturing a connection structure and a connection structure that can ensure conductivity between opposing electrodes and suppress short circuits between adjacent connection electrodes through a simple process, even if the electrodes arranged on the electronic component are highly fine and highly dense. Furthermore, since the heat curing connection method is not used, it is possible to connect electrodes of upper and lower substrates with different thermal expansion coefficients with high precision.

[0098] <Fifth embodiment> The structure of the connection structure according to this embodiment is the same as that of the connection structure according to the first embodiment, except that the first resin 20 is disposed in areas other than the first electrode of the first member 102. The method for producing the connection structure according to this embodiment is the same as the method for producing the connection structure according to the first embodiment, except that the first composition 20' is disposed in areas other than the first electrode 110 on the first surface. Explanations of the same things as in the first embodiment will be omitted, and only differences from the connection structure and the method for producing the connection structure according to the first embodiment will be described here.

[0099] [Connection structure] Fig. 10 shows the structure of a connection structure according to one embodiment of the present invention. Fig. 10(A) is a plan view of a connection structure according to one embodiment of the present invention. Fig. 10(B) is a cross-sectional view taken along line F-F' of Fig. 10(A). Fig. 10(C) is an enlarged cross-sectional view of a conductive particle in region G of Fig. 10(B).

[0100] As shown in FIGS. 10(A) and 10(B), the connection structure 100b includes a first surface of the first member 102, a first electrode 110, a second surface of the second member 112, a second electrode 114, conductive particles 10, a first resin 20, and a second resin 30. A plurality of first electrodes 110 and a plurality of second electrodes 114 are disposed opposite each other. A plurality of conductive particles 10, a first resin 20, and a second resin 30 are disposed between the opposed first electrode 110 and second electrode 114. A plurality of conductive particles 10 are disposed in a planar direction (D2-D3 planar direction) between the opposed first electrode 110 and second electrode 114. A single conductive particle 10 is disposed between the opposed first electrode 110 and second electrode 114 in the opposing direction (D1 direction) of the first electrode 110 and second electrode 114. Each conductive particle 10 is in contact with the first electrode 110 and the second electrode 114 facing each other. As shown in FIG. 10C, the conductive particle 10 is deformed by pressure in the electrode facing direction (D1 direction) between the first electrode 110 and the second electrode 114 by a method for producing a connection structure described later. That is, the distance between the first electrode 110 and the second electrode 114 in the electrode facing direction (D1 direction) is approximately the same as the height of the conductive particle 10 in the electrode facing direction (D1 direction). The height of the conductive particle 10 in the electrode facing direction (D1 direction) is deformed by pressure by about 10% to 40%. By applying stress between the first electrode 110, the conductive particle 10, and the second electrode 114, the first resin 20 and the second resin 30 are eliminated at the contact portion between the first electrode 110 and the conductive particle 10 and the contact portion between the second electrode 114 and the conductive particle 10. Furthermore, even if a natural oxide film is formed on the first electrode 110, the conductive particles 10, or the second electrode 114 and the surface is insulated, the natural oxide film is broken through and a conductive path is formed by pressing the first electrode 110 and the second electrode 114 together with the conductive particles 10 sandwiched between them. Furthermore, the conductive particles 10 are deformed, so that the contact area between the first electrode 110 and the conductive particles 10 and the contact area between the second electrode 114 and the conductive particles 10 can be increased. By being arranged in this manner, the conductive particles 10 can electrically connect the first electrode 110 and the second electrode 114.

[0101] As shown in Figures 10(A) and (B), a plurality of conductive particles 10, a first resin 20, and a second resin 30 are disposed between a first electrode 110 and a second electrode 114. In this embodiment, the plurality of conductive particles 10, the first resin 20, and the second resin 30 are disposed over substantially the entire upper surface of the first electrode 110 when viewed in the electrode facing direction (D1 direction). The diameter of the conductive particles 10 when viewed in the electrode facing direction (D1 direction) is within a range of 2 µm to 10 µm. Furthermore, when viewed in the electrode facing direction (D1 direction), the number of conductive particles 10 disposed between the opposing first electrode 110 and second electrode 114 is 7 / 400 µm. 2 More than 20 pieces / 400μm 2 The following range is preferable. By arranging in this manner, the conductive particles 10 can reliably connect the opposing first electrodes 110 and second electrodes 114, and can prevent short circuits between the multiple first electrodes 110 adjacent in the planar direction (D2-D3 planar direction), between the multiple second electrodes 114 adjacent in the planar direction (D2-D3 planar direction), and between the first electrodes 110 and second electrodes 114 that do not face each other.

[0102] In this embodiment, the shape of the region in which the conductive particles 10 and the first resin 20 are arranged when viewed in the opposing direction of the electrodes (direction D1) is rectangular to match the first electrode 110. However, the shape is not limited to this, and the shape of the region in which the conductive particles 10 and the first resin 20 are arranged can be any shape as long as the area is within the above range.

[0103] The area of ​​the region where the conductive particles 10 and the first resin 20 are arranged on the upper surface of one first electrode 110 can be appropriately adjusted depending on the area of ​​the first electrode 110 and the size of the conductive particles 10, as long as the above conditions are satisfied. In addition, the number of conductive particles 10 arranged in the region where the conductive particles 10 and the first resin 20 are arranged can be appropriately adjusted depending on the size of the conductive particles 10 and the concentration of the conductive particles 10 mixed into the first composition 20' described below, as long as the above conditions are satisfied.

[0104] In this embodiment, the first resin 20 is arranged in regions other than the first electrode 110 on the first surface when viewed in the electrode facing direction (D1 direction). The first resin 20 is also arranged between and around the multiple first electrodes 110 on the first surface when viewed in the electrode facing direction (D1 direction). On the other hand, the first resin 20 is not arranged at the end of the first surface when viewed in the electrode facing direction (D1 direction). At this time, the conductive particles 10 are not arranged in regions other than the first electrode 110 on the first surface (the second electrode 114 on the second surface) when viewed in the electrode facing direction (D1 direction). That is, the conductive particles 10 are arranged on the first electrode 110 (or the second electrode 114).

[0105] A second resin 30 is further disposed between the first surface of the first member 102 and the second surface of the second member 112. The second resin 30 is disposed in a region other than between the opposing first electrode 110 and second electrode 114. In this embodiment, the second resin 30 is disposed in a region other than the second electrode 114 on the second surface when viewed in the electrode facing direction (D1 direction). That is, on the second surface of the second member 112, the second resin 30 is disposed between and around a plurality of second electrodes 114 adjacent in the surface direction (D2-D3 surface direction). The second resin 30 is also disposed at the ends of the first surface and the second surface when viewed in the electrode facing direction (D1 direction). As shown in FIGS. 10B and 10C, the second resin 30 is further disposed between the first electrode 110 and the second electrode 114, in the region where the conductive particles 10 and the first resin 20 are disposed. The second resin 30 is disposed between the first resin 20 and the second electrode 114. That is, when viewed in the electrode facing direction (D1 direction), on the second surface of the second member 112, the conductive particles 10 disposed on the second electrode 114 are surrounded by the second resin 30 in the planar direction (D2-D3 planar direction). The first resin 20 and the second resin 30 are insulating resins. Therefore, the connection structure 100b has insulation in the planar direction (D2-D3 planar direction). By being arranged in this manner, the second resin 30 can reliably insulate between multiple first electrodes 110 adjacent to each other in the planar direction (D2-D3 planar direction), between multiple second electrodes 114 adjacent to each other in the planar direction (D2-D3 planar direction), and between first electrodes 110 and second electrodes 114 that do not face each other.

[0106] A first resin 20 and a second resin 30 are disposed between an area of ​​the first surface other than the first electrode 110 and an area of ​​the second surface other than the second electrode 114. The first resin 20 and the second resin 30 are disposed between and around a plurality of first electrodes 110 adjacent to each other in the surface direction (D2-D3 surface direction) and between and around a plurality of second electrodes 114 adjacent to each other in the surface direction (D2-D3 surface direction). Furthermore, the first resin 20 and the second resin 30 are disposed between the first electrode 110 and the second electrode 114. The first resin 20 is disposed so as to contact the first surface, and the second resin 30 is disposed so as to contact the second surface. That is, the first resin 20 and the second resin 30 are in contact with each other in a planar direction (D2-D3 planar direction) between the first surface of the first electronic component 101 and the second surface of the second electronic component 111, and are laminated in the opposing direction of the electrodes (D1 direction). On the other hand, the second resin 30 is disposed at the ends of the first surface and the second surface when viewed in the opposing direction of the electrodes (D1 direction).

[0107] [Method of manufacturing the connection structure] Next, a method for producing a connection structure according to one embodiment of the present invention will be described with reference to Figures 11 to 14. In this embodiment, since it is possible to use existing first electronic component 101 and second electronic component 111, a description thereof will be omitted, and a method for forming connection structure 100b will be described in detail with reference to Figures 11 to 14.

[0108] First, a first composition 20' is placed on the first surface of the first member 102, and a plurality of conductive particles 10 are placed on the upper surface of the first electrode 110. The plurality of conductive particles 10 and the first composition 20' are mixed and placed using an offset printing method. Since the mixture of the conductive particles 10 and the first composition 20' contains the conductive particles 10, a pad printing method in which a printed matter is transferred using a pad is particularly preferable. A method for placing a plurality of conductive particles 10 and the first composition 20' will be described with reference to Figs. 11 to 14.

[0109] FIG. 11 shows a step of arranging a mixture of a plurality of conductive particles 10 and a first composition 20' on a plate 240. FIG. 12 is a cross-sectional view taken along the line H-H' of FIG. 11. In this embodiment, the plate 240 is, for example, a flat intaglio plate. In this embodiment, the plate 240 has a recess 246 corresponding to the first electrode 110. However, the present invention is not limited thereto, and the recess 246 may be any recess that corresponds to a region on the first surface of the first member 102 where the plurality of conductive particles 10 and the first composition 20' are arranged.

[0110] In this embodiment, the mixture of the conductive particles 10 and the first composition 20' is placed on the plate 240 using the blade 250. However, the present invention is not limited to this, and the mixture of the conductive particles 10 and the first composition 20' may be placed on the plate 240 using a roller or the like. As shown in Figs. 11(A)-(C) and 12(A)-(C), the blade 250 is moved from one end of the plate 240 to the other end in a state where the tip is separated from the upper surface 244 of the plate 240. The gap between the tip of the blade 250 and the upper surface 244 of the plate 240 can be appropriately set in a range greater than 0 μm and less than Y μm, where the diameter of the conductive particles 10 is Y μm. Since the distance of the gap is smaller than the diameter Y μm of the conductive particles 10, the conductive particles 10 are not placed on the upper surface 244 of the plate 240, and the first composition 20' is placed thereon.

[0111] The depth from the tip of the blade 250 to the bottom surface 242 of the recess 246 can be appropriately selected within a range greater than Y μm, where Y is the diameter of the conductive particle 10. Since the depth from the tip of the blade 250 to the bottom surface 242 of the recess 246 is greater than the diameter Y μm of the conductive particle 10, the conductive particle 10 is disposed in the recess 246 together with the first composition 20′.

[0112] If the distance from the tip of the blade 250 to the bottom surface 242 of the recess 246 is less than Y μm, the tip of the blade 250 and the conductive particles 10 are likely to come into contact with each other, and there is a risk that the conductive particles 10 will not be loaded or that the loaded conductive particles 10 will be damaged. If the gap distance between the tip of the blade 250 and the upper surface 244 of the plate 240 is greater than Y μm, there is a risk that the conductive particles 10 will be disposed on the upper surface 244 of the plate 240.

[0113] 11(A) to (C) and 12(A) to (C), the blade 250 is moved from one end of the plate 240 to the other end, thereby disposing the conductive particles 10 and the first composition 20' on the plate 240. In this embodiment, it is preferable to move the blade 250 from one end to the other end of the plate 240 in the short side direction (direction D3) of the recess 246. This makes it possible to prevent the conductive particles 10 disposed in one recess 246 from being biased to one side.

[0114] The concentration of the conductive particles 10 mixed into the first composition 20' is preferably in the range of 20% by volume or more and 60% by volume or less of the conductive particles 10 with respect to the total volume of the conductive particles 10 and the first composition 20'. If the amount of the conductive particles 10 mixed is less than 20% by volume, it becomes difficult to fill a sufficient number of the conductive particles 10 into the recesses 246. If the amount of the conductive particles 10 mixed is more than 60% by volume, the operability becomes poor and it becomes difficult to fill the mixture of the conductive particles 10 and the first composition 20' into the recesses 246. By disposing the mixture of the conductive particles 10 and the first composition 20' with the blade 250, the conductive particles 10 and the first composition 20' are filled into the recesses 246 of the plate 240, and the first composition 20' is disposed on the upper surface 244 of the plate 240.

[0115] Since the recess 246 has a depth in the above-mentioned range, one conductive particle 10 can be held in the depth direction (D1 direction) of the recess 246. When viewed from the top surface of the plate 240, the number of conductive particles 10 arranged in one recess 246 is 7 / 400 μm 2 More than 20 pieces / 400μm 2The following range is preferable. By arranging in this manner, the conductive particles 10 and the first composition 20' can be efficiently transferred to the pad in the step of transferring the mixture of the conductive particles 10 and the first composition 20' to the pad, which will be described later.

[0116] The recesses 246 are preferably spaced apart by 5 μm or more. If the recesses 246 are spaced apart less than 5 μm, the walls separating the adjacent recesses 246 may be easily damaged, and the durability of the plate 240 may decrease.

[0117] In this embodiment, the shape of the recess 246 as viewed in the electrode facing direction (direction D1) is rectangular, the same as that of the first electrode 110 (or the second electrode 114). The recess 246 also has the same shape in the depth direction. That is, the recess 246 has a shape obtained by cutting a rectangular parallelepiped out of the plate 240. However, the shape of the recess 246 is not limited to this, and it can be any shape as long as the depth and area are within the above ranges. For example, it is also possible to accommodate complex shapes.

[0118] The plate 240 may be, for example, a glass intaglio plate, a nickel plate intaglio plate, or a stainless steel plate intaglio plate. If necessary, the durability of the plate 240 may be improved by performing plasma surface treatment using a fluorine-based gas, nickel plating treatment, DLC (diamond-like carbon) treatment, or the like.

[0119] 13 shows a process of transferring a mixture of a plurality of conductive particles 10 and a first composition 20' from a plate 240 to a pad 230. As shown in Figs. 13(A) to (C), the pad 230 is pressed against the plate 240 in a direction substantially perpendicular to the plate 240 and then pulled away in a direction substantially perpendicular to the plate 240, whereby the first composition 20' arranged on the upper surface 244 of the plate 240 and the conductive particles 10 and first composition 20' filled in the recesses 246 of the plate 240 are transferred to the pad 230. The viscosity of the first composition 20' is 5 x 10 3 cP or more 5×10 5 Since the viscosity is in the range of cP or less, the conductive particles 10 mixed in the first composition 20 ′ can be held on the surface of the pad 230 .

[0120] 14(A)-(B) show a process of transferring a mixture of a plurality of conductive particles 10 and a first composition 20' from a pad 230 to a first surface of a first member 102. As shown in FIG. 14(A)-(B), the pad 230 is pressed against the first surface in a direction substantially perpendicular to the first surface, and the pad 230 is pulled away from the first surface in a direction substantially perpendicular to the first surface, thereby transferring the mixture of the conductive particles 10 and the first composition 20' transferred to the pad 230 onto the first surface. Here, the first composition 20' and the conductive particles 10 transferred from the recess 246 of the plate 240 are arranged so as to contact the first electrode 110. That is, the first composition 20' is arranged on the first surface of the first member 102, and the conductive particles 10 are arranged on the upper surface of the first electrode 110. The viscosity of the curable resin material of the first composition 20' is 5×10 3 cP or more 5×10 5 Since the viscosity is in the range of 100 cP or less, the conductive particles 10 mixed into the first composition 20' can be held on the first electrode 110. By using such a method, the conductive particles 10 and the first composition 20' can be reliably arranged in a predetermined region on the first electrode 110.

[0121] The first composition 20' and the conductive particles 10 transferred from the recesses 246 of the plate 240 are arranged thickly on the first electrode 110 on the first member 102 in the electrode facing direction (D1 direction) because the recesses 246 are deep. On the other hand, the first composition 20' transferred from the upper surface 244 of the plate 240 is arranged thinly in the electrode facing direction (D1 direction) in an area other than the first electrode 110 on the first member 102 because the recesses 246 are not deep. However, this is not limited thereto, and the first composition 20' does not have to be transferred from the upper surface 244 of the plate 240 to the pad 230. On the first surface of the first member 102, the first composition 20' forms a convex-concave structure in the electrode facing direction (D1 direction). On the first surface of the first member 102, the conductive particles 10 form a convex structure together with the first composition 20'. In this embodiment, the plate 240 is smaller than the first surface (connecting surface) of the first member 102. Therefore, the first composition 20' is not disposed on the end of the first surface.

[0122] Next, the second composition 30' is placed on the first surface of the first member 102. As shown in FIG. 14(C), the second composition 30' is placed on the area other than the first electrode 110 on the first surface. Furthermore, the second composition 30' is also placed on the first electrode 110 on the first surface. Here, the first composition 20' transferred from the upper surface 244 of the plate 240 is placed on the area other than the first electrode 110 on the first surface. Also, the conductive particles 10 and the first composition 20' transferred from the recessed portion 246 of the plate 240 are placed on the first electrode 110 on the first surface. For this reason, the second composition 30' is placed so as to overlap the conductive particles 10 and the first composition 20' so as to contact them. The second composition 30' is also placed on the end of the first surface. In this embodiment, the second composition 30' is in a paste form and is placed using an inkjet method or a jet dispensing method. However, the method for disposing the second composition 30' is not limited thereto, and any existing method can be used, such as application by inkjet or dispenser, or screen printing.

[0123] The viscosity of the second composition 30' is 2×10 3 cP or more 2×10 5 The viscosity of the first composition 20' is in the range of 0.1 to 1.0 cP or less. The viscosity of the first composition 20' is higher than the viscosity of the second composition 30', and the difference in viscosity may be at least two times. This makes it possible to suppress the flow of the conductive particles 10 mixed into the first composition 20', and to hold the conductive particles 10 on the first electrode 110.

[0124] Next, the second member 112 is mounted on the first surface of the first member 102. As shown in FIG. 14(D), the first surface of the first member 102 and the second surface of the second member 112 are arranged to face each other so that the corresponding first electrodes 110 and the corresponding second electrodes 114 face each other. The first member 102 and the second member 112 are pressed, and the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. The first surface of the first member 102 and the second surface of the second member 112 are pressed against the conductive particles 10, the first composition 20', and the second composition 30'. At this time, the first composition 20' arranged on the first electrode 110 has a higher viscosity than the second composition 30', and is therefore held on the first electrode 110 together with the conductive particles 10. The second composition 30' disposed on the first electrode 110 has a lower viscosity than the first composition 20', and therefore most of it moves to areas other than the first electrode 110 where the conductive particles 10 and the first composition 20' are disposed. That is, when stress is applied between the first surface of the first member 102 and the second surface of the second member 112, most (most) of the second composition 30' located between the second electrode 114 and the first composition 20' moves, and the second composition 30' located between the second electrode 114 and the conductive particles 10 is eliminated. Furthermore, the first composition 20' and the conductive particles 10 that form the uneven structure on the first surface of the first member 102 are buried by the second composition 30'. In other words, the second composition 30' is mostly disposed on the second surface of the second member 112 in the area other than the area (convex structure) where the multiple conductive particles 10 and the first composition 20' are disposed. The second composition 30' is disposed on the first surface of the first member 102 in the area (concave structure) where the first composition 20' is disposed. The conductive particles 10 disposed on the first electrode 110 contact the second electrode 114, and the second composition 30' is disposed so as to contact the first composition 20' disposed in the area other than the first electrode 110 on the first surface, the area other than the second electrode 114 on the second surface, and the second electrode 114.

[0125] As shown in Fig. 14(E), the first member 102 and the second member 112 are further pressed, and the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. At this time, sufficient pressure is applied so that the opposing first electrode 110 and second electrode 114 contact each other above and below one conductive particle 10. The pressure for pressing the first surface of the first member 102 and the second surface of the second member 112 can be appropriately adjusted depending on the repulsive force of the conductive particle 10 and the elastic force of the first composition 20' and the second composition 30'.

[0126] With the first member 102 and the second member 112 pressed against each other, the connection structure 100b is irradiated with light to cure the first composition 20' and the second composition 30'. The method for curing the first composition 20' and the second composition 30' is the same as the method for producing the connection structure according to the first embodiment, and therefore will not be described here. The first resin 20 and the second resin 30 are formed by curing the first composition 20' and the second composition 30'. With this configuration, the first surface of the first electronic component 101 and the second surface of the second electronic component 111 can be physically connected to each other.

[0127] According to the present embodiment, it is possible to provide a method for manufacturing a connection structure and a connection structure that can ensure conductivity between opposing electrodes and suppress short circuits between adjacent connection electrodes through a simple process, even if the electrodes arranged on the electronic component are highly fine and highly dense. Furthermore, since the heat curing connection method is not used, it is possible to connect electrodes of upper and lower substrates with different thermal expansion coefficients with high precision.

[0128] Sixth embodiment The structure of the connection structure according to this embodiment is the same as that of the connection structure according to the fifth embodiment. The method for producing the connection structure according to this embodiment is the same as the method for producing the connection structure according to the fifth embodiment, except that the second composition 30' is disposed in the second electrode 114 on the second surface and in an area other than the second electrode 114. Explanations of the same things as in the first and fifth embodiments will be omitted, and only the parts that differ from the methods for producing the connection structures according to the first and fifth embodiments will be described here.

[0129] [Method of manufacturing the connection structure] A method for producing a connection structure according to one embodiment of the present invention will be described with reference to Fig. 15. In this embodiment, since it is possible to use existing first electronic component 101 and second electronic component 111, a description thereof will be omitted, and a method for forming connection structure 100b will be described in detail with reference to Fig. 15.

[0130] First, a first composition 20' is placed on the first surface of the first member 102, and a plurality of conductive particles 10 are placed on the upper surface of the first electrode 110. The plurality of conductive particles 10 and the first composition 20' are mixed and placed using an offset printing method. Since the mixture of the conductive particles 10 and the first composition 20' contains the conductive particles 10, a pad printing method in which a printed matter is transferred using a pad is particularly preferable. The region and method for placing the mixture of the plurality of conductive particles 10 and the first composition 20' are the same as the method for producing the connection structure according to the fifth embodiment, and therefore will not be described here.

[0131] 15(A)-(B) show a process of transferring a mixture of a plurality of conductive particles 10 and a first composition 20' from a pad 230 to a first surface of a first member 102. As shown in FIG. 15(A)-(B), the pad 230 is pressed against the first surface in a direction substantially perpendicular to the first surface, and the pad 230 is pulled away from the first surface in a direction substantially perpendicular to the first surface, thereby transferring the mixture of the conductive particles 10 and the first composition 20' transferred to the pad 230 onto the first surface. Here, the first composition 20' and the conductive particles 10 transferred from the recess 246 of the plate 240 are arranged so as to contact the first electrode 110. That is, the first composition 20' is arranged on the first surface of the first member 102, and the conductive particles 10 are arranged on the upper surface of the first electrode 110. The viscosity of the curable resin material of the first composition 20' is 5×10 3 cP or more 5×10 5 Since the viscosity is in the range of 100 cP or less, the conductive particles 10 mixed into the first composition 20' can be held on the first electrode 110. By using such a method, the conductive particles 10 and the first composition 20' can be reliably arranged in a predetermined region on the first electrode 110.

[0132] The first composition 20' and the conductive particles 10 transferred from the recesses 246 of the plate 240 are arranged thickly on the first electrode 110 on the first member 102 in the electrode facing direction (D1 direction) because the recesses 246 are deep. On the other hand, the first composition 20' transferred from the upper surface 244 of the plate 240 is arranged thinly in the electrode facing direction (D1 direction) in an area other than the first electrode 110 on the first member 102 because the recesses 246 are not deep. However, this is not limited thereto, and the first composition 20' does not have to be transferred from the upper surface 244 of the plate 240 to the pad 230. On the first surface of the first member 102, the first composition 20' forms a convex-concave structure in the electrode facing direction (D1 direction). On the first surface of the first member 102, the conductive particles 10 form a convex structure together with the first composition 20'. In this embodiment, the plate 240 is smaller than the first surface (connecting surface) of the first member 102. Therefore, the first composition 20' is not disposed on the end of the first surface.

[0133] Next, the second composition 30' is placed on the second surface of the second member 112. As shown in FIG. 15(C)-(D), the second composition 30' is placed on the region of the second surface of the second member 112 other than the second electrode 114. Furthermore, the second composition 30' is also placed on the second electrode 114 on the second surface. The second composition 30' is also placed on the end of the second surface. In this embodiment, the second composition 30' is in a paste form and is placed using an inkjet method or a jet dispense method. However, the method is not limited to this, and the method of placing the second composition 30' can be an existing method. For example, application by inkjet or a dispenser, screen printing, etc. can be used.

[0134] The viscosity of the second composition 30' is 2×10 3 cP or more 2×10 5 This makes it possible to suppress the flow of the second composition 30'.

[0135] Next, the second member 112 is mounted on the first surface of the first member 102. As shown in FIG. 15(E), the first surface of the first member 102 and the second surface of the second member 112 are arranged to face each other so that the corresponding first electrodes 110 and the corresponding second electrodes 114 face each other. The first member 102 and the second member 112 are pressed, and the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. The first surface of the first member 102 and the second surface of the second member 112 are pressed against the conductive particles 10, the first composition 20', and the second composition 30'. At this time, the first composition 20' arranged on the first electrode 110 has a higher viscosity than the second composition 30', and is therefore held on the first electrode 110 together with the conductive particles 10. The second composition 30' disposed on the second electrode 114 has a lower viscosity than the first composition 20', and therefore most of it moves to areas other than the first electrode 110 where the conductive particles 10 and the first composition 20' are disposed. That is, when stress is applied between the first surface of the first member 102 and the second surface of the second member 112, most (most) of the second composition 30' located between the second electrode 114 and the first composition 20' moves, and the second composition 30' located between the second electrode 114 and the conductive particles 10 is eliminated. Furthermore, the first composition 20' and the conductive particles 10 that form the uneven structure on the first surface of the first member 102 are buried by the second composition 30'. In other words, the second composition 30' is mostly disposed on the second surface of the second member 112 in the area other than the area (convex structure) where the multiple conductive particles 10 and the first composition 20' are disposed. The second composition 30' is disposed on the first surface of the first member 102 in the area (concave structure) where the first composition 20' is disposed. The conductive particles 10 disposed on the first electrode 110 contact the second electrode 114, and the second composition 30' is disposed so as to contact the first composition 20' disposed in the area other than the first electrode 110 on the first surface, the area other than the second electrode 114 on the second surface, and the second electrode 114.

[0136] As shown in FIG. 15(F), the first member 102 and the second member 112 are further pressed, and the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. At this time, a sufficient pressure is applied so that the opposing first electrode 110 and second electrode 114 contact each other above and below one conductive particle 10. The pressure for pressing the first surface of the first member 102 and the second surface of the second member 112 can be appropriately adjusted by the repulsive force of the conductive particle 10 and the elastic force of the first composition 20' and the second composition 30'. By adopting such a configuration, the first electrode 110 and the second electrode 114 can be electrically connected.

[0137] With the first member 102 and the second member 112 pressed against each other, the connection structure 100b is irradiated with light to cure the first composition 20' and the second composition 30'. The method for curing the first composition 20' and the second composition 30' is the same as the method for producing the connection structure according to the first embodiment, and therefore will not be described here. The first resin 20 and the second resin 30 are formed by curing the first composition 20' and the second composition 30'. With this configuration, the first surface of the first electronic component 101 and the second surface of the second electronic component 111 can be physically connected to each other.

[0138] According to the present embodiment, it is possible to provide a method for manufacturing a connection structure and a connection structure that can ensure conductivity between opposing electrodes and suppress short circuits between adjacent connection electrodes through a simple process, even if the electrodes arranged on the electronic component are highly fine and highly dense. Furthermore, since the heat curing connection method is not used, it is possible to connect electrodes of upper and lower substrates with different thermal expansion coefficients with high precision.

[0139] Seventh embodiment The structure of the connection structure according to this embodiment is the same as the structure of the connection structure according to the third embodiment, except that the first resin 20 is also disposed in an area other than the second electrode of the second member 112. The structure of the connection structure according to this embodiment is the same as the structure of the connection structure according to the fifth embodiment, except that the lamination order of the first resin 20 and the second resin 30 disposed between the first surface and the second surface is different. The method for producing the connection structure according to this embodiment is the same as the method for producing the connection structure according to the first and fifth embodiments, except that the first composition 20' is disposed in an area other than the second electrode 114 and the second electrode 114 on the second surface, and the second composition 30' is disposed in an area other than the second electrode 114 and the second electrode 114 on the second surface. Explanations of the same as the first and fifth embodiments will be omitted, and here, the parts different from the connection structure and the method for producing the connection structure according to the first and fifth embodiments will be described.

[0140] [Connection structure] Fig. 16 shows the structure of a connection structure according to one embodiment of the present invention. Fig. 16(A) is a plan view of a connection structure according to one embodiment of the present invention. Fig. 16(B) is a cross-sectional view taken along line I-I' in Fig. 16(A). Fig. 16(C) is an enlarged cross-sectional view of a conductive particle in region J in Fig. 16(B).

[0141] As shown in FIGS. 16(A) and 16(B), the connection structure 100c includes a first surface of the first member 102, a first electrode 110, a second surface of the second member 112, a second electrode 114, conductive particles 10, a first resin 20, and a second resin 30. A plurality of first electrodes 110 and a plurality of second electrodes 114 are disposed opposite each other. A plurality of conductive particles 10, a first resin 20, and a second resin 30 are disposed between the opposed first electrode 110 and second electrode 114. A plurality of conductive particles 10 are disposed in a planar direction (D2-D3 planar direction) between the opposed first electrode 110 and second electrode 114. A single conductive particle 10 is disposed opposite the first electrode 110 and second electrode 114 (D1 direction) between the opposed first electrode 110 and second electrode 114. Each conductive particle 10 is in contact with the first electrode 110 and the second electrode 114 facing each other. As shown in FIG. 16C, the conductive particle 10 is deformed by pressure in the electrode facing direction (D1 direction) between the first electrode 110 and the second electrode 114 by a method for producing a connection structure described later. That is, the distance between the first electrode 110 and the second electrode 114 in the electrode facing direction (D1 direction) is approximately the same as the height of the conductive particle 10 in the facing direction (D1 direction). The height of the conductive particle 10 in the electrode facing direction (D1 direction) is deformed by about 10% to 40%. By applying stress between the first electrode 110, the conductive particle 10, and the second electrode 114, the first resin 20 and the second resin 30 are eliminated at the contact portion between the first electrode 110 and the conductive particle 10 and the contact portion between the second electrode 114 and the conductive particle 10. Furthermore, even if a natural oxide film is formed on the first electrode 110, the conductive particles 10, or the second electrode 114 and the surface is insulated, the natural oxide film is broken through and a conductive path is formed by pressing the first electrode 110 and the second electrode 114 together with the conductive particles 10 sandwiched between them. Furthermore, the conductive particles 10 are deformed, so that the contact area between the first electrode 110 and the conductive particles 10 and the contact area between the second electrode 114 and the conductive particles 10 can be increased. By being arranged in this manner, the conductive particles 10 can electrically connect the first electrode 110 and the second electrode 114.

[0142] In this embodiment, the first resin 20 is disposed in an area other than the second electrode 114 on the second surface when viewed in the electrode facing direction (D1 direction). The first resin 20 is disposed between and around the second electrodes 114 on the second surface when viewed in the electrode facing direction (D1 direction). On the other hand, the first resin 20 is not disposed at the end of the second surface when viewed in the electrode facing direction (D1 direction). At this time, the conductive particles 10 are not disposed in an area other than the first electrode 110 on the first surface (the second electrode 114 on the second surface) when viewed in the electrode facing direction (D1 direction). That is, the conductive particles 10 are disposed on the first electrode 110 (or the second electrode 114).

[0143] A second resin 30 is further disposed between the first surface of the first member 102 and the second surface of the second member 112. The second resin 30 is disposed in a region other than between the opposing first electrode 110 and second electrode 114. In this embodiment, the second resin 30 is disposed in a region other than the first electrode 110 on the first surface when viewed in the electrode facing direction (D1 direction). That is, on the first surface of the first member 102, the second resin 30 is disposed between and around a plurality of first electrodes 110 adjacent in the surface direction (D2-D3 surface direction). The second resin 30 is also disposed at the ends of the first surface and the second surface when viewed in the electrode facing direction (D1 direction). As shown in Fig. 16(B) and (C), the second resin 30 is further disposed between the first electrode 110 and the second electrode 114, in the region where the conductive particles 10 and the first resin 20 are disposed. The second resin 30 is disposed between the first resin 20 and the first electrode 110. That is, when viewed in the electrode facing direction (D1 direction), on the first surface of the first member 102, the conductive particles 10 disposed on the first electrode 110 are surrounded by the second resin 30 in the planar direction (D2-D3 planar direction). The first resin 20 and the second resin 30 are insulating resins. Therefore, the connection structure 100c has insulation in the planar direction (D2-D3 planar direction). By being arranged in this manner, the second resin 30 can reliably insulate between multiple first electrodes 110 adjacent to each other in the planar direction (D2-D3 planar direction), between multiple second electrodes 114 adjacent to each other in the planar direction (D2-D3 planar direction), and between first electrodes 110 and second electrodes 114 that do not face each other.

[0144] A first resin 20 and a second resin 30 are disposed between an area of ​​the first surface other than the first electrode 110 and an area of ​​the second surface other than the second electrode 114. The first resin 20 and the second resin 30 are disposed between and around a plurality of first electrodes 110 adjacent to each other in the surface direction (D2-D3 surface direction) and between and around a plurality of second electrodes 114 adjacent to each other in the surface direction (D2-D3 surface direction). Furthermore, the first resin 20 and the second resin 30 are disposed between the first electrode 110 and the second electrode 114. The first resin 20 is disposed so as to contact the second surface, and the second resin 30 is disposed so as to contact the first surface. That is, the first resin 20 and the second resin 30 are in contact with each other in a planar direction (D2-D3 planar direction) between the first surface of the first electronic component 101 and the second surface of the second electronic component 111, and are laminated in the opposing direction of the electrodes (D1 direction). On the other hand, the second resin 30 is disposed at the ends of the first surface and the second surface when viewed in the opposing direction of the electrodes (D1 direction).

[0145] [Method of manufacturing the connection structure] A method for producing a connection structure according to one embodiment of the present invention will be described with reference to Fig. 17. In this embodiment, since it is possible to use an existing first electronic component 101 and second electronic component 111, a description thereof will be omitted, and a method for forming a connection structure 100c will be described in detail with reference to Fig. 17.

[0146] First, the first composition 20' is placed on the second surface of the second member 112, and a plurality of conductive particles 10 are placed on the upper surface of the second electrode 114. The plurality of conductive particles 10 and the first composition 20' are mixed and placed using an offset printing method. Since the mixture of the conductive particles 10 and the first composition 20' contains the conductive particles 10, a pad printing method in which a printed matter is transferred using a pad is particularly preferable. The region and method for placing the mixture of the plurality of conductive particles 10 and the first composition 20' are the same as the method for producing the connection structure according to the fifth embodiment, and therefore will not be described here.

[0147] 17(A)-(B) show a process of transferring a mixture of a plurality of conductive particles 10 and a first composition 20' from a pad 230 to a second surface of a second member 112 by pad printing. As shown in FIG. 17(A)-(B), the pad 230 is pressed against the second surface in a direction substantially perpendicular to the second surface, and the pad 230 is pulled away from the second surface in a direction substantially perpendicular to the second surface, thereby transferring the mixture of the conductive particles 10 and the first composition 20' transferred to the pad 230 onto the second surface. Here, the first composition 20' and the conductive particles 10 transferred from the recess 246 of the plate 240 are arranged so as to contact the second electrode 114. That is, the first composition 20' is arranged on the second surface of the second member 112, and the conductive particles 10 are arranged on the upper surface of the second electrode 114. The viscosity of the curable resin material of the first composition 20' is 5×10 3 cP or more 5×10 5 Since the viscosity is in the range of 100 cP or less, the conductive particles 10 mixed into the first composition 20' can be held on the second electrode 114. By using such a method, the conductive particles 10 and the first composition 20' can be reliably arranged in a predetermined region on the second electrode 114.

[0148] The first composition 20' and the conductive particles 10 transferred from the recesses 246 of the plate 240 are arranged thickly on the second electrode 114 on the second member 112 in the electrode facing direction (D1 direction) because of the depth of the recesses 246. On the other hand, the first composition 20' transferred from the upper surface 244 of the plate 240 is arranged thinly in the electrode facing direction (D1 direction) in an area other than the second electrode 114 on the second member 112 because the recesses 246 are not deep. However, this is not limited thereto, and the first composition 20' does not have to be transferred from the upper surface 244 of the plate 240 to the pad 230. On the second surface of the second member 112, the first composition 20' forms a convex-concave structure in the electrode facing direction (D1 direction). On the second surface of the second member 112, the conductive particles 10 form a convex structure together with the first composition 20'. In this embodiment, the plate 240 is smaller than the second surface (connecting surface) of the second member 112. Therefore, the first composition 20' is not disposed on the end of the second surface.

[0149] Next, the second composition 30' is placed on the second surface of the second member 112. As shown in FIG. 17(C), the second composition 30' is placed on the area other than the second electrode 114 on the second surface of the second member 112. Furthermore, the second composition 30' is also placed on the second electrode 114 on the second surface. Here, the first composition 20' transferred from the upper surface 244 of the plate 240 is placed on the area other than the second electrode 114 on the second surface. Also, the conductive particles 10 and the first composition 20' transferred from the recessed portion 246 of the plate 240 are placed on the second electrode 114 on the second surface. For this reason, the second composition 30' is placed so as to overlap the conductive particles 10 and the first composition 20' so as to be in contact with them. The second composition 30' is also placed on the end of the second surface. In this embodiment, the second composition 30' is in a paste form and is disposed by using an inkjet method or a jet dispensing method. However, the method of disposing the second composition 30' is not limited to this, and any existing method can be used. For example, application by an inkjet or dispenser, screen printing, etc. can be used.

[0150] The viscosity of the second composition 30' is 2×10 3 cP or more 2×10 5 The viscosity of the first composition 20' is in the range of 0.1 to 1.0 cP or less. The viscosity of the first composition 20' is higher than the viscosity of the second composition 30', and the difference in viscosity may be at least two times. This makes it possible to suppress the flow of the conductive particles 10 mixed into the first composition 20', and to hold the conductive particles 10 on the first electrode 110.

[0151] Next, the second electronic component 111 is mounted on the first surface of the first electronic component 101. As shown in FIG. 17(D), the first surface of the first member 102 and the second surface of the second member 112 are arranged to face each other so that the corresponding first electrodes 110 and the corresponding second electrodes 114 face each other. The first member 102 and the second member 112 are pressed, and the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. The first surface of the first member 102 and the second surface of the second member 112 are pressed against the conductive particles 10, the first composition 20', and the second composition 30'. At this time, the first composition 20' arranged on the second electrode 114 has a higher viscosity than the second composition 30', and is therefore held on the second electrode 114 together with the conductive particles 10. The second composition 30' disposed on the second electrode 114 has a lower viscosity than the first composition 20', and therefore most of it moves to an area other than the area on the second electrode 114 where the conductive particles 10 and the first composition 20' are disposed. That is, when stress is applied between the first surface of the first member 102 and the second surface of the second member 112, most (most) of the second composition 30' located between the first electrode 110 and the first composition 20' moves, and the second composition 30' located between the first electrode 110 and the conductive particles 10 is eliminated. Furthermore, the first composition 20' and the conductive particles 10 that form the uneven structure on the second surface of the second member 112 are buried by the second composition 30'. In other words, the second composition 30' is mostly disposed on the first surface of the first member 102 in the area other than the area (convex structure) where the multiple conductive particles 10 and the first composition 20' are disposed. The second composition 30' is disposed on the first surface of the first member 102 in the area (concave structure) where the first composition 20' is disposed. The conductive particles 10 disposed on the second electrode 114 are in contact with the first electrode 110, and the second composition 30' is disposed so as to be in contact with the first composition 20' disposed in the area other than the second electrode 114 on the second surface, the area other than the first electrode 110 on the first surface, and the first electrode 110.

[0152] As shown in FIG. 17(E), the first member 102 and the second member 112 are further pressed, and the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. At this time, a sufficient pressure is applied so that the opposing first electrode 110 and second electrode 114 contact each other above and below one conductive particle 10. The pressure for pressing the first surface of the first member 102 and the second surface of the second member 112 can be appropriately adjusted by the repulsive force of the conductive particle 10 and the elastic force of the first composition 20' and the second composition 30'. By adopting such a configuration, the first electrode 110 and the second electrode 114 can be electrically connected.

[0153] With the first member 102 and the second member 112 pressed against each other, the connection structure 100c is irradiated with light to cure the first composition 20' and the second composition 30'. The method for curing the first composition 20' and the second composition 30' is the same as the method for producing the connection structure according to the first embodiment, and therefore will not be described here. The first resin 20 and the second resin 30 are formed by curing the first composition 20' and the second composition 30'. With this configuration, the first surface of the first electronic component 101 and the second surface of the second electronic component 111 can be physically connected to each other.

[0154] According to the present embodiment, it is possible to provide a method for manufacturing a connection structure and a connection structure that can ensure conductivity between opposing electrodes and suppress short circuits between adjacent connection electrodes through a simple process, even if the electrodes arranged on the electronic component are highly fine and highly dense. Furthermore, since the heat curing connection method is not used, it is possible to connect electrodes of upper and lower substrates with different thermal expansion coefficients with high precision.

[0155] Eighth embodiment The structure of the connection structure according to this embodiment is the same as that of the connection structure according to the seventh embodiment. The method for producing the connection structure according to this embodiment is the same as the method for producing the connection structure according to the seventh embodiment, except that the second composition 30' is disposed in the first electrode 110 on the first surface and in an area other than the first electrode 110. Explanations of the same things as in the first, fifth, and seventh embodiments will be omitted, and only differences from the methods for producing the connection structures according to the first, fifth, and seventh embodiments will be described here.

[0156] [Method of manufacturing the connection structure] A method for producing a connection structure according to one embodiment of the present invention will be described with reference to Fig. 18. In this embodiment, since it is possible to use an existing first electronic component 101 and second electronic component 111, a description thereof will be omitted, and a method for forming a connection structure 100c will be described in detail with reference to Fig. 18.

[0157] First, the first composition 20' is placed on the second surface of the second member 112, and a plurality of conductive particles 10 are placed on the upper surface of the second electrode 114. The plurality of conductive particles 10 and the first composition 20' are mixed and placed using an offset printing method. Since the mixture of the conductive particles 10 and the first composition 20' contains the conductive particles 10, a pad printing method in which a printed matter is transferred using a pad is particularly preferable. The region and method for placing the mixture of the plurality of conductive particles 10 and the first composition 20' are the same as the method for producing the connection structure according to the fifth embodiment, and therefore will not be described here.

[0158] 18(A)-(B) show a process of transferring a mixture of a plurality of conductive particles 10 and a first composition 20' from a pad 230 to a second surface of a second member 112 by pad printing. As shown in FIG. 18(A)-(B), the pad 230 is pressed against the second surface in a direction substantially perpendicular to the second surface, and the pad 230 is pulled away from the second surface in a direction substantially perpendicular to the second surface, thereby transferring the mixture of the conductive particles 10 and the first composition 20' transferred to the pad 230 onto the second surface. Here, the first composition 20' and the conductive particles 10 transferred from the recess 246 of the plate 240 are arranged so as to contact the second electrode 114. That is, the first composition 20' is arranged on the second surface of the second member 112, and the conductive particles 10 are arranged on the upper surface of the second electrode 114. The viscosity of the curable resin material of the first composition 20' is 5×10 3 cP or more 5×10 5 Since the viscosity is in the range of 100 cP or less, the conductive particles 10 mixed into the first composition 20' can be held on the second electrode 114. By using such a method, the conductive particles 10 and the first composition 20' can be reliably arranged in a predetermined region on the second electrode 114.

[0159] The first composition 20' and the conductive particles 10 transferred from the recesses 246 of the plate 240 are arranged thickly on the second electrode 114 on the second member 112 in the electrode facing direction (D1 direction) because of the depth of the recesses 246. On the other hand, the first composition 20' transferred from the upper surface 244 of the plate 240 is arranged thinly in the electrode facing direction (D1 direction) in an area other than the second electrode 114 on the second member 112 because the recesses 246 are not deep. However, this is not limited thereto, and the first composition 20' does not have to be transferred from the upper surface 244 of the plate 240 to the pad 230. On the second surface of the second member 112, the first composition 20' forms a convex-concave structure in the electrode facing direction (D1 direction). On the second surface of the second member 112, the conductive particles 10 form a convex structure together with the first composition 20'. In this embodiment, the plate 240 is smaller than the second surface (connecting surface) of the second member 112. Therefore, the first composition 20' is not disposed on the end of the second surface.

[0160] Next, the second composition 30' is placed on the first surface of the first member 102. As shown in FIG. 18(C)-(D), the second composition 30' is placed on the area other than the first electrode 110 on the first surface of the first member 102. Furthermore, the second composition 30' is also placed on the first electrode 110 on the first surface. The second composition 30' is also placed on the end of the first surface. In this embodiment, the second composition 30' is in a paste form and is placed using an inkjet method or a jet dispense method. However, the method is not limited to this, and the method of placing the second composition 30' can be an existing method. For example, application by inkjet or a dispenser, screen printing, etc. can be used.

[0161] The viscosity of the second composition 30' is 2×10 3 cP or more 2×10 5 This makes it possible to suppress the flow of the second composition 30'.

[0162] Next, the second electronic component 111 is mounted on the first surface of the first electronic component 101. As shown in FIG. 18(E), the first surface of the first member 102 and the second surface of the second member 112 are arranged to face each other so that the corresponding first electrodes 110 and the corresponding second electrodes 114 face each other. The first member 102 and the second member 112 are pressed, and the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. The first surface of the first member 102 and the second surface of the second member 112 are pressed against the conductive particles 10, the first composition 20', and the second composition 30'. At this time, the first composition 20' arranged on the second electrode 114 has a higher viscosity than the second composition 30', and is therefore held on the second electrode 114 together with the conductive particles 10. The second composition 30' disposed on the first electrode 110 has a lower viscosity than the first composition 20', and therefore most of it moves to an area other than the area on the second electrode 114 where the conductive particles 10 and the first composition 20' are disposed. That is, when stress is applied between the first surface of the first member 102 and the second surface of the second member 112, most (most) of the second composition 30' located between the first electrode 110 and the first composition 20' moves, and the second composition 30' located between the first electrode 110 and the conductive particles 10 is eliminated. Furthermore, the first composition 20' and the conductive particles 10 that form the uneven structure on the second surface of the second member 112 are buried by the second composition 30'. In other words, the second composition 30' is mostly disposed on the first surface of the first member 102 in the area other than the area (convex structure) where the multiple conductive particles 10 and the first composition 20' are disposed. The second composition 30' is disposed on the first surface of the first member 102 in the area (concave structure) where the first composition 20' is disposed. The conductive particles 10 disposed on the second electrode 114 are in contact with the first electrode 110, and the second composition 30' is disposed so as to be in contact with the first composition 20' disposed in the area other than the second electrode 114 on the second surface, the area other than the first electrode 110 on the first surface, and the first electrode 110.

[0163] As shown in FIG. 18(F), the first member 102 and the second member 112 are further pressed, and the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. At this time, a sufficient pressure is applied so that the opposing first electrode 110 and second electrode 114 contact each other above and below one conductive particle 10. The pressure for pressing the first surface of the first member 102 and the second surface of the second member 112 can be appropriately adjusted by the repulsive force of the conductive particle 10 and the elastic force of the first composition 20' and the second composition 30'. By adopting such a configuration, the first electrode 110 and the second electrode 114 can be electrically connected.

[0164] With the first member 102 and the second member 112 pressed against each other, the connection structure 100c is irradiated with light to cure the first composition 20' and the second composition 30'. The method for curing the first composition 20' and the second composition 30' is the same as the method for producing the connection structure according to the first embodiment, and therefore will not be described here. The first resin 20 and the second resin 30 are formed by curing the first composition 20' and the second composition 30'. With this configuration, the first surface of the first electronic component 101 and the second surface of the second electronic component 111 can be physically connected to each other.

[0165] According to the present embodiment, it is possible to provide a method for manufacturing a connection structure and a connection structure that can ensure conductivity between opposing electrodes and suppress short circuits between adjacent connection electrodes through a simple process, even if the electrodes arranged on the electronic component are highly fine and highly dense. Furthermore, since the heat curing connection method is not used, it is possible to connect electrodes of upper and lower substrates with different thermal expansion coefficients with high precision.

[0166] The present invention is not limited to the above-described embodiment, and can be modified as appropriate without departing from the spirit and scope of the present invention. In addition, the embodiments can be combined as appropriate. EXAMPLES

[0167] Fig. 19 is a diagram showing an example of a connection structure according to an embodiment of the present invention. Fig. 19(A) is a diagram showing an arrangement pattern of conductive particles 10 and first resin 20 of a connection structure according to Example 1 of the present invention. Fig. 19(B) is a diagram showing an arrangement pattern of first resin 20 and second resin 30 of a connection structure according to Example 1 of the present invention. The parameters of the connection structure according to Example 1 are as follows. Width (short side) (A1) of the first electrode 110=9 μm Distance between first electrodes 110 (B1) = 6 μm Pitch of the first electrodes 110 (A1+B1=C1)=15 μm Length (long side) of the first electrode 110 (D1) = 105 μm Area of ​​the first electrode 110 (A1×D1)=945 μm 2 Number of conductive particles 10 arranged per first electrode 110 = 19 EXAMPLES

[0168] Figure 20 is a diagram showing an example of a connection structure according to an embodiment of the present invention. Figure 20(A) is a diagram showing an arrangement pattern of conductive particles 10 and first resin 20 of a connection structure according to embodiment 2 of the present invention. Figure 20(B) is a diagram showing an arrangement pattern of first resin 20 and second resin 30 of a connection structure according to embodiment 2 of the present invention. The parameters of the connection structure according to embodiment 2 are as follows. Width (short side) (A2) of the first electrode 110=9 μm Distance between first electrodes 110 (B2) = 6 μm Pitch of the first electrodes 110 (A2+B2=C2)=15 μm Length (long side) of the first electrode 110 (D2) = 105 μm Area of ​​the first electrode 110 (A2×D2)=945 μm 2 Number of conductive particles 10 arranged per first electrode 110 = 26 EXAMPLES

[0169] Fig. 21 is a diagram showing an example of a connection structure according to an embodiment of the present invention. Fig. 21(A) is a diagram showing an arrangement pattern of conductive particles 10 and first resin 20 of a connection structure according to Example 3 of the present invention. Fig. 21(B) is a diagram showing an arrangement pattern of first resin 20 and second resin 30 of a connection structure according to Example 3 of the present invention. The parameters of the connection structure according to Example 3 are as follows. Width (short side) of the first electrode 110 (A3) = 9 μm Distance between first electrodes 110 (B3) = 6 μm Pitch of the first electrodes 110 (A3+B3=C3)=15 μm Length (long side) of the first electrode 110 (D3) = 78 μm Area of ​​the first electrode 110 (A3×D3)=702 μm 2 The area of ​​one region where the conductive particles 10 and the first resin 20 are arranged is 40 μm 2 Total area of ​​the region in which the conductive particles 10 and the first resin 20 are arranged per electrode = 280 μm 2 Number of regions in which the conductive particles 10 and the first resin 20 are arranged per electrode=7 The number of conductive particles 10 arranged in one region where the conductive particles 10 and the first resin 20 are arranged is 2. Number of conductive particles per electrode = 14 EXAMPLES

[0170] Figure 22 is a diagram showing an example of a connection structure according to an embodiment of the present invention. Figure 22(A) is a diagram showing an arrangement pattern of conductive particles 10 and first resin 20 of a connection structure according to embodiment 4 of the present invention. Figure 22(B) is a diagram showing an arrangement pattern of first resin 20 and second resin 30 of a connection structure according to embodiment 4 of the present invention. The parameters of the connection structure according to embodiment 4 are as follows. Width (short side) of the first electrode 110 (A4) = 12 μm Distance between first electrodes 110 (B4)=9 μm Pitch of the first electrodes 110 (A4+B4=C4)=21 μm Length (long side) of the first electrode 110 (D4) = 105 μm Area of ​​the first electrode 110 (A4×D4)=1260 μm 2 The area of ​​one region where the conductive particles 10 and the first resin 20 are arranged is 113 μm 2 Total area of ​​the region in which the conductive particles 10 and the first resin 20 are arranged per electrode = 791 μm 2 Number of regions in which the conductive particles 10 and the first resin 20 are arranged per electrode=7 The number of conductive particles 10 arranged in one region where the conductive particles 10 and the first resin 20 are arranged=7 The number of conductive particles 10 arranged per first electrode 110 = 49 EXAMPLES

[0171] Fig. 23 is a diagram showing an example of a connection structure according to an embodiment of the present invention. Fig. 23(A) is a diagram showing an arrangement pattern of conductive particles 10 and first resin 20 of a connection structure according to embodiment 5 of the present invention. Fig. 23(B) is a diagram showing an arrangement pattern of first resin 20 and second resin 30 of a connection structure according to embodiment 5 of the present invention. The parameters of the connection structure according to embodiment 5 are as follows. Width (short side) of the first electrode 110 (A5) = 9 μm Distance between first electrodes 110 (B5) = 6 μm Pitch of the first electrodes 110 (A5+B5=C5)=15 μm Length (long side) of the first electrode 110 (D5) = 84 μm Area of ​​the first electrode 110 (A5×D5)=756 μm 2 The area of ​​one region where the conductive particles 10 and the first resin 20 are arranged is 64 μm 2 Total area of ​​the region in which the conductive particles 10 and the first resin 20 are arranged per electrode = 448 μm 2 Number of regions in which the conductive particles 10 and the first resin 20 are arranged per electrode=7 The number of conductive particles 10 arranged in one region where the conductive particles 10 and the first resin 20 are arranged is 3. Number of conductive particles per electrode = 21 EXAMPLES

[0172] Figure 24 is a diagram showing an example of a connection structure according to an embodiment of the present invention. Figure 24(A) is a diagram showing an arrangement pattern of conductive particles 10 and first resin 20 of a connection structure according to embodiment 6 of the present invention. Figure 24(B) is a diagram showing an arrangement pattern of first resin 20 and second resin 30 of a connection structure according to embodiment 6 of the present invention. The parameters of the connection structure according to embodiment 6 are as follows. Width (short side) of the first electrode 110 (A6) = 21 μm Distance between first electrodes 110 (B6) = 10 μm Pitch of the first electrodes 110 (A6+B6=C6)=31 μm Length (long side) of the first electrode 110 (D6) = 21 μm Area of ​​the first electrode 110 (A6×D6)=441 μm 2 The area of ​​the region α in which the conductive particles 10 and the first resin 20 are arranged is 64 μm 2 Total area of ​​the region α in which the conductive particles 10 and the first resin 20 are arranged per electrode = 128 μm 2 The number of regions α in which the conductive particles 10 and the first resin 20 are arranged is 2. Number of conductive particles 10 arranged per area α = 3 The area of ​​the region β in which the conductive particles 10 and the first resin 20 are arranged is 40 μm 2 Total area of ​​the region β in which the conductive particles 10 and the first resin 20 are arranged per electrode = 80 μm The number of regions β in which the conductive particles 10 and the first resin 20 are arranged is 2. Number of conductive particles 10 arranged per region β = 2 Number of conductive particles placed per electrode = 10 EXAMPLES

[0173] Fig. 25 is a diagram showing an example of a connection structure according to an embodiment of the present invention. Fig. 25(A) is a diagram showing an arrangement pattern of conductive particles 10 and first resin 20 of a connection structure according to Example 7 of the present invention. Fig. 25(B) is a diagram showing an arrangement pattern of first resin 20 and second resin 30 of a connection structure according to Example 7 of the present invention. The parameters of the connection structure according to Example 7 are as follows. Width (short side) of the first electrode 110 (A7) = 15 μm Distance between first electrodes 110 (B7) = 10 μm Pitch of the first electrodes 110 (A7+B7=C7)=25 μm Length (long side) of the first electrode 110 (D7) = 30 μm Area of ​​the first electrode 110 (A7×D7)=450 μm 2 The area of ​​one region where the conductive particles 10 and the first resin 20 are arranged is 113 μm 2 Total area of ​​the region in which the conductive particles 10 and the first resin 20 are arranged per electrode = 226 μm 2 The number of regions in which the conductive particles 10 and the first resin 20 are arranged per electrode is 2. The number of conductive particles 10 arranged in one region where the conductive particles 10 and the first resin 20 are arranged=7 Number of conductive particles per electrode = 14

[0174] As shown in the first to seventh embodiments, according to one embodiment of the present invention, even if the electrodes arranged on the electronic component are highly fine and highly dense, a simple process can ensure conductivity between opposing electrodes and prevent adjacent electrodes from shorting each other. [Explanation of symbols]

[0175] REFERENCE SIGNS LIST 10 conductive particles, 20 first resin, 20' first composition, 30 second resin, 30' second composition, 100, 100a, 100b, 100c connection structure, 101 first electronic component, 102 first member, 104 terminal, 106 first insulating film, 108 second insulating film, 110 first electrode, 111 second electronic component, 112 second member, 114 second electrode, 210 roller, 220, 240 plate, 222 lyophilic layer, 224 lyophobic layer, 226, 246 recess, 230 pad, 250 blade

Claims

1. a first member having a first surface; a first electrode disposed on the first surface; a second member having a second surface opposite to the first surface; a second electrode disposed on the second surface and opposed to and paired with the first electrode; A first resin containing conductive particles; A second resin having a different composition from the first resin, a plurality of first regions spaced apart from each other between the pair of the first electrode and the second electrode, and a second region other than the plurality of first regions; a first resin containing the conductive particles is disposed in each of the plurality of first regions; the second resin is disposed between the first resin and the second electrode in each of the plurality of first regions and between the first electrode and the second electrode in the second region; The conductive particles are arranged in a monolayer. Connection structure.

2. The connection structure according to claim 1 , wherein the areas of the plurality of first regions are different, and the numbers of the conductive particles disposed in the plurality of first regions are different.

3. The connection structure according to claim 1 , wherein the second resin has a thickness in the second region greater than a thickness in the plurality of first regions.

4. In the plurality of first regions, the first resin is in contact with the first electrode, and the second resin is in contact with the second electrode; The connection structure according to claim 1 , wherein in the second region, the second resin has a portion in contact with the first electrode and the second electrode.

5. The first resin is further disposed in the second region, The connection structure according to claim 1 , wherein the first resin has a thickness in the plurality of first regions greater than a thickness in the second region.

6. a first insulating film disposed on the first surface and exposing a surface of the first electrode; the first insulating film is disposed between the first member and the first resin; The connection structure according to claim 5 , wherein the second resin is disposed between the second member and the first resin.

7. a second insulating film disposed on the second surface and exposing a surface of the second electrode; the second insulating film is disposed between the second member and the second resin; The connection structure according to claim 5 , wherein the first resin is disposed between the first member and the second resin.

8. The connection structure according to claim 1 , wherein one of the conductive particles is in contact with a pair of the first electrode and the second electrode.

9. 9. The connection structure according to claim 8, wherein the height of the conductive particles is deformed by 10% to 40% under pressure.

10. The connection structure according to claim 1 , wherein the second resin is disposed from the first surface to the second surface at ends of the first member and the second member.

11. The connection structure according to claim 1 , wherein each of the first resins arranged in the plurality of first regions contains 1 to 7 conductive particles.

12. The conductive particles are arranged between the first electrode and the second electrode at 7 particles / 400 μm ２ More than 20 pieces / 400μm ２ The connection structure according to any one of claims 1 to 11, which is arranged in the following range:

13. The connection structure according to claim 1 , wherein the first resin includes a radical polymerization type resin.

14. The connection structure according to claim 1 , wherein the second resin includes a dendrimer or hyperbranched polymer structure portion having an acrylic group arranged thereon.

15. The second resin includes an ene / thiol-based curable resin including an ethylenically unsaturated compound and a thiol compound, and at least one of the curing components of the ethylenically unsaturated compound and the thiol compound is a 9,9-bisarylfluorene compound. A connection structure according to any one of claims 1 to 14.

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