Cleaning tool and method for cleaning cover member

Abstract

To provide a cleaning jig and a method for cleaning a cover member capable of cleaning a cover member to which a film-like adhesive adheres.SOLUTION: A cleaning jig 1 includes an annular frame 2 and an adhesive annular capture sheet 3 mounted in an opening 5 of the annular frame 2. In a tape expansion device 100, the cleaning jig 1 removes a waste 300 such as a broken piece of a film-like adhesive adhering to a cover member 130 for suppressing scattering of the film-like adhesive when a portion of the film-like adhesive protruding from a wafer is broken.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present invention relates to a cleaning tool for removing foreign matter adhering to a cover member of a tape expansion device and a method for cleaning the cover member. [Background technology]

[0002] A wafer having a number of devices formed on its surface is cut or laser processed along planned dividing lines (streets) to be divided into a number of device chips corresponding to each device. In order to fix this device chip on top of another device chip, an adhesive layer for fixing may be provided on the back side of the device chip. The adhesive layer provided on the back side is brought into close contact with an object to be fixed, and an external stimulus such as heat or light is applied to harden the adhesive layer, thereby fixing the device chip. For example, a film-like adhesive for die bonding, called a die attach film (DAF), is used as the adhesive layer.

[0003] This film adhesive is formed to a size sufficient to cover the entire back surface of the wafer and is attached to the back surface of the wafer before it is divided. After the film adhesive is attached to the back surface of the wafer, the film adhesive is cut together with the wafer to form device chips each having an adhesive layer on the back surface.

[0004] However, when a processing method such as DBG (Dicing Before Grinding) in which the wafer is not fully cut, or SDBG (Stealth Dicing Before Grinding) in which a laser beam is focused inside the wafer to form a modified layer by multiphoton absorption is adopted, there is no process of dividing the film-like adhesive together with the wafer. Therefore, a method of breaking a film-like adhesive has been proposed in which the film-like adhesive is attached to an expanding tape, and the expanding tape is expanded after being sufficiently cooled (see, for example, Patent Document 1). In this breaking method, the elasticity of the film-like adhesive is reduced by cooling, so that the film-like adhesive can be easily broken by simply expanding the expanding tape. In order to prevent the broken pieces of the film-like adhesive outside the wafer from adhering to the wafer device (particularly the electrode portion) when the film-like adhesive is expanded, it has been proposed to provide a cover member that covers the film-like adhesive from above in the tape expanding device (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2007-027250 A [Patent Document 2] JP 2016-012585 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, there is a problem in that scraps of the film-like adhesive adhering to the cover member may fall off and adhere to the wafer.

[0007] The present invention has been made in view of the above problems, and an object of the present invention is to provide a cleaning tool and a method for cleaning a cover member that are capable of cleaning a cover member to which a film-like adhesive has adhered. [Means for solving the problem]

[0008] In order to solve the above-mentioned problems and achieve the object, the cleaning jig of the present invention is a tape expansion device that breaks a film-like adhesive attached to the back surface of a wafer in which a break origin is formed along the planned division line or a wafer divided into individual chips along the planned division line, while the film-like adhesive is attached to an expanding tape attached to an opening of an annular frame, along the planned division line, and the tape expansion device includes a frame holding unit that holds the annular frame, a push-up unit that pushes up the expanding tape attached to the annular frame held by the frame holding unit to break the film-like adhesive, and a cover member that prevents the film-like adhesive from scattering when the portion of the film-like adhesive protruding from the wafer breaks, and the cleaning jig removes fragments of the film-like adhesive adhering to the cover member, and is characterized in that the cleaning jig includes the annular frame and an annular, adhesive capture sheet attached to the opening of the annular frame.

[0009] In addition, in order to solve the above-mentioned problems and achieve the object, the method for cleaning a cover member of the present invention is a method for cleaning a cover member using the above-mentioned cleaning tool, characterized in that it includes a holding step of holding the annular frame of the cleaning tool with the frame holding unit, and a moving step of using the push-up unit to relatively move the capture sheet and the cover member between a waiting position where they are spaced apart from each other and a contact position where they are in contact with each other and the capture sheet captures scraps of the film-like adhesive adhering to the cover member.

[0010] In the moving step, the push-up unit may relatively move the capture sheet and the cover member a number of times between the standby position and the contact position while changing the speed. Effect of the Invention

[0011] The present invention can clean a cover member to which a film-like adhesive has adhered. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a cleaning tool according to an embodiment. [Diagram 2] FIG. 2 is a perspective view illustrating the fabrication of the cleaning jig of FIG. [Diagram 3] FIG. 3 is an exploded perspective view showing a configuration example of a tape expanding device in which the cleaning jig of FIG. 1 is used. [Figure 4] FIG. 4 is a perspective view showing an example of the configuration of a wafer to which an expandable tape, which is an object to be expanded by the tape expanding device of FIG. 3, is attached. [Diagram 5] FIG. 5 is a cross-sectional view showing a state before the expanding tape of the main part of the tape expanding device of FIG. 3 is expanded. [Figure 6] FIG. 6 is a cross-sectional view showing a state in which the expanding tape of the main part of the tape expanding device of FIG. 3 is being expanded. [Figure 7] FIG. 7 is a flowchart illustrating an example of a process procedure of the method for cleaning the cover member according to the embodiment. [Figure 8] FIG. 8 is a cross-sectional view illustrating a method for cleaning the cover member according to the embodiment. [Figure 9] FIG. 9 is a cross-sectional view illustrating a method for cleaning the cover member according to the embodiment. [Figure 10] FIG. 10 is a cross-sectional view illustrating a method for cleaning the cover member according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. Furthermore, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the configurations can be made without departing from the gist of the present invention.

[0014] [Embodiment] A cleaning jig 1 according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of the cleaning jig 1 according to the embodiment. FIG. 2 is a perspective view explaining the fabrication of the cleaning jig 1 of FIG. 1. As shown in FIG. 1, the cleaning jig 1 according to the embodiment includes an annular frame 2 and an annular capturing sheet 3. The cleaning jig 1 is used to remove pieces of a film-like adhesive 205 (see FIG. 4) attached to a cover member 130 (see FIG. 3, etc.) of a tape expansion device 100 (see FIG. 3, etc.) described later.

[0015] The annular frame 2 has the same shape as an annular frame 207 (see FIG. 4) used to support a wafer 200 (see FIG. 4) that is attached via a film-like adhesive 205 to an expanding tape 206 (see FIG. 4) expanded by the tape expanding device 100 in which the cleaning jig 1 is used, and is formed in a plate shape as shown in FIG. 1, with a circular opening 5 in the center having an inner diameter larger than the outer diameter of the wafer 200. In this embodiment, the annular frame 2 is made of metal, for example, SUS (Steel Use Stainless).

[0016] As shown in FIG. 1, the annular capture sheet 3 has adhesiveness on one side and is attached to the opening 5 of the annular frame 2. The annular capture sheet 3 covers the outer peripheral area inside the opening 5 of the annular frame 2. The annular capture sheet 3 has a circular opening 6 in the center, the inner diameter of which is smaller than or equal to the outer diameter of the wafer 200. The upper surface 7 of the capture sheet 3, which is on the outer peripheral side of the opening 5 and the inner peripheral side of the opening 6 to which the annular frame 2 is attached, is an adhesive surface. In this embodiment, the annular capture sheet 3 is an adhesive tape having a glue layer formed on one side of the base layer, but the present invention is not limited to this, and may be a tape similar to the expand tape 206, or may be a sheet that does not have an adhesive layer and is formed only of a base layer of a thermoplastic resin such as polyolefin, polyethylene, polypropylene, polystyrene, a copolymer of propylene and ethylene, or an olefin-based elastomer, and exhibits adhesion in response to heating or pressure bonding.

[0017] The cleaning tool 1 is prepared by preparing an annular frame 2, attaching a capture sheet 3 to one surface of the annular frame 2 so as to cover the entire opening 5 of the annular frame 2, and cutting the attached capture sheet 3 into a circle with a cutter 19 or the like to form an opening 6. A cutting tool 10 is used to cut the capture sheet 3. As shown in FIG. 2, the cutting tool 10 includes a main body 11 in which a cross-shaped portion 15 inscribed in the opening 5 of the annular frame 2 and a circular portion 16 inscribed in the opening 6 of the annular capture sheet 3 are integrally formed in a flat plate shape, and a handle portion 12 formed on one surface side of the main body 11. In this embodiment, the main body 11 is made of metal, for example, SUS. A special coating is applied to the surface of the main body 11 opposite to the side on which the handle portion 12 is formed, and this special coating makes it difficult for the main body 11 to be attached to the capture sheet 3. The opening 6 of the cleaning jig 1 is formed by attaching the capture sheet 3 to the annular frame 2, and then, as shown in Figure 2, placing the cutting jig 10 with the specially coated side facing the capture sheet 3 side, in a position where the cross-shaped portion 15 is inscribed in the opening 5 of the annular frame 2, and moving a cutter 19 along the outer periphery of the circular portion 16 to cut the capture sheet 3.

[0018] Since the cutting jig 10 contacts the adhesive surface of the capture sheet 3, a small contact area with the capture sheet 3 is preferable because it is easier to peel off and does not reduce the adhesive strength of the capture sheet 3. Also, since it is necessary to position the cutout position based on the inner diameter of the annular frame 2, the cross-shaped portion 15 plays the role of positioning, and the circular portion indicates the cutout line. However, the form of the cutting jig is not limited to this. For example, the cutting jig may be an annular plate-like object, the outer diameter of the annular plate-like object contacts the inner diameter of the annular frame 2, the inner diameter of the annular plate-like object is the same shape as the inner diameter of the annular capture sheet 3, and the capture sheet 3 may be cut out in a circle along the inner diameter of the annular plate-like object. In this case, the cutting jig is easy to create, but the adhesive area with the capture sheet 3 is larger than in a form having a cross-shaped portion 15 and a circular portion 16, so it is particularly preferable when using a capture sheet 3 that does not have a glue layer.

[0019] Next, the tape expansion device 100 in which the cleaning jig 1 is used will be described with reference to the drawings. FIG. 3 is an exploded perspective view showing a configuration example of the tape expansion device 100 in which the cleaning jig 1 in FIG. 1 is used. FIG. 4 is a perspective view showing a configuration example of a wafer 200 to which an expanding tape 206, which is an expansion target of the tape expansion device 100 in FIG. 3, is attached. FIG. 5 is a cross-sectional view showing a state before the expanding tape 206 of the main part of the tape expansion device 100 in FIG. 3 is expanded. FIG. 6 is a cross-sectional view showing a state during the expanding tape 206 of the main part of the tape expansion device 100 in FIG. 3. As shown in FIG. 3, FIG. 5, and FIG. 6, the tape expansion device 100 includes a housing 101, a frame holding unit 110, a push-up unit 120, a cover member 130, and a control unit 140.

[0020] In this embodiment, the wafer 200 attached to the expanding tape 206 expanded by the tape expanding device 100 via a film-like adhesive 205 is, for example, a disk-like semiconductor wafer or an optical device wafer made of silicon, sapphire, silicon carbide (SiC), gallium arsenide, glass, etc. As shown in Fig. 4, the wafer 200 has devices 203 formed in areas partitioned by a plurality of planned division lines 202 formed in a lattice pattern on the surface 201.

[0021] In this embodiment, as shown in FIG. 4, the wafer 200 is further cut along the dividing lines 202 by a rotating cutting blade, or ablated by irradiating the wafer 200 with a laser beam having an absorbent wavelength, and then a machined groove 210 having a depth equal to or greater than the finished thickness of the device 203 is formed along the dividing lines 202. The back surface 204 on the back side of the front surface 201 is then ground by a rotating grinding wheel, and the wafer 200 is divided into chips of the individual devices 203. In the present invention, the wafer 200 is not limited to the form in which the machined groove 210 is formed and the wafer 200 is divided into chips of the individual devices 203. A laser beam having a wavelength that is transparent to the wafer 200 may be irradiated along the dividing lines 202 to form a modified layer, which is a fracture origin, inside the wafer 200 along the dividing lines 202. Here, the modified layer refers to a region in which the density, refractive index, mechanical strength, and other physical properties are different from those of the surroundings, and examples of the modified layer include a melting process region, a crack region, an insulation breakdown region, a refractive index change region, and a region in which these regions are mixed. The modified layer has a lower mechanical strength than other portions of the wafer 200 .

[0022] 4, the wafer 200 has an expandable tape (dicing tape) 206, which has an even larger area in the planar direction than the film-like adhesive 205, attached to the back surface 204 via a film-like adhesive 205, which has a larger area in the planar direction than the wafer 200 for die bonding, and an annular frame 207 is attached to the outer edge of the expandable tape 206 to which the film-like adhesive 205 is not attached. Thus, the wafer 200 is supported by the expandable tape 206 at an opening 208 of the annular frame 207 via the film-like adhesive 205.

[0023] As shown in Figs. 5 and 6, the housing 101 covers the frame holding unit 110, the push-up unit 120, the cover member 130, and the control unit 140. The housing 101 is omitted in Fig. 3. The housing 101 forms a processing space 102 therein in which the tape expanding device 100 performs processing such as expanding the expanding tape 206. The housing 101 is formed with an opening (not shown) for carrying the wafer 200 into and out of the processing space 102, and a shutter (not shown) for opening and closing the opening (not shown). As shown in Figs. 5 and 6, the housing 101 is formed with a cold air supplying section 103 for supplying cold air into the processing space 102 to cool the processing space 102 to, for example, 0°C or lower. The tape expansion device 100 reduces the elasticity of the film-like adhesive 205 within the processing space 102 cooled by the cold air supply section 103, so that the film-like adhesive 205 attached to the expanding tape 206 can be easily broken simply by expanding the expanding tape 206.

[0024] As shown in Figures 3, 5 and 6, the frame holding unit 110 has a frame support part 111 that supports the annular frame 2 of the placed cleaning jig 1 and the annular frame 207 affixed to the wafer 200 from below on the upper side, and a frame pressing part 112 that presses the annular frames 2, 207 from above on the lower side.

[0025] The frame support part 111 has a square shape on the upper surface side, and a circular opening 113 is formed in the center with a diameter approximately equal to the inner diameter of the opening 5, 208 of the annular frame 2, 207. The frame pressing part 112 is a square plate shape, and a circular opening 114 is formed in the center with a diameter equivalent to the inner diameter of the opening 5, 208 of the annular frame 2, 207. Both the frame support part 111 and the frame pressing part 112 are made of metal such as SUS. The frame pressing part 112 can be freely raised and lowered in the Z-axis direction in Figures 3, 5, and 6, which is parallel to the vertical direction, by a lifting part (not shown). The frame pressing part 112 is disposed above the frame support part 111. The frame support part 111 and the frame pressing part 112 are disposed in a positional relationship such that the opening 113 and the opening 114 overlap in the vertical direction. Frame pressing portion 112 has a plurality of pins 115 (three in the example shown in FIG. 3) standing upright, arranged at equal intervals in the circumferential direction, in a portion outer than opening 114 on the top surface.

[0026] The frame holding unit 110 places the annular frame 2, 207 on the frame support part 111 so that the opening 113 of the frame support part 111 and the opening 5, 208 of the annular frame 2, 207 overlap vertically, and then lowers the frame holding part 112 using a lifting part (not shown), thereby holding the annular frame 2, 207 by sandwiching it between the frame support part 111 and the frame holding part 112, as shown in Figure 5, etc.

[0027] 5 and 6, the push-up unit 120 has a push-up member 121, a roller member 122, and a lifting section 123. The push-up member 121 has a cylindrical shape, and is provided coaxially with the inner periphery of the opening 113 of the frame support section 111. The roller member 122 is provided at the upper end of the push-up member 121 so as to be able to rotate freely. The lifting section 123 is provided connected to the lower side of the push-up member 121, and lifts and lowers the push-up member 121.

[0028] With the annular frame 207 fixed to the frame holding unit 110, the push-up unit 120, as shown in FIG. 6, uses the lifting section 123 to raise the push-up member 121 in the vertical direction (Z-axis direction in FIG. 6) relative to the frame holding unit 110, thereby pushing up the annular region 209 of the expanding tape 206 between the outer periphery of the wafer 200 and the inner periphery of the opening 208 of the annular frame 207 in the thickness direction (Z-axis direction in FIG. 6) perpendicular to the front surface 201 and back surface 204 of the wafer 200, thereby expanding the expanding tape 206 in the planar direction.

[0029] By pushing up the annular region 209 of the expanding tape 206 and expanding it in the surface direction in this manner, when the wafer 200 is divided into chips of individual devices 203 along the division lines 202, the push-up unit 120 breaks the film-like adhesive 205 along the division lines 202 in order to expand the region of the expanding tape 206 that corresponds to the division lines 202 in particular. Furthermore, when a modified layer that is a breakage starting point is formed inside the wafer 200 along the division lines 202, the push-up unit 120 divides the wafer 200 into each device 203 along the modified layer and breaks the film-like adhesive 205 along the division lines 202 in order to expand the region of the expanding tape 206 that corresponds to the division lines 202 in particular.

[0030] The cover member 130 has an annular shape, and a circular opening 131 is formed in the center, the inner diameter of which is smaller than the opening 114 of the frame pressing part 112 and slightly larger than or equal to the outer diameter of the wafer 200. The cover member 130 has a concentric shape with the opening 131 in a plan view, and a stepped shape that gradually rises upward toward the outer periphery in a cross-sectional view along the central axis direction is formed. A corner portion 132 that is bent from the horizontal direction to the vertical direction toward the outer periphery at the innermost side of the stepped shape formed in the cover member 130 is formed so that the outer diameter is slightly on the inner side of the opening 114 of the frame pressing part 112. The cover member 130 is formed of a metal such as SUS, and is grounded as shown in Figs. 5 and 6.

[0031] The cover member 130 has a plurality of (three in the example shown in FIG. 3) through holes 133 arranged at equal intervals in the circumferential direction in a portion on the outer periphery of the stepped corner portion 132. The pins 115 of the frame pressing portion 112 are inserted into the through holes 133 of the cover member 130, and the cover member 130 is arranged so as to be movable up and down in the vertical direction relative to the frame pressing portion 112 while the opening 131 is regulated to be coaxial with the opening 114 of the frame pressing portion 112. The cover member 130 is biased downward in the vertical direction by gravity. The cover member 130 has a plurality of (three in the example shown in FIG. 3) screw holes 134 arranged at equal intervals in the circumferential direction in a portion on the outer periphery of the through holes 133.

[0032] 5 and 6, when the annular frame 207 is fixed to the frame holding unit 110, the underside 135 of the cover member 130, which is on the outer periphery side of the opening 131 and on the inner periphery side of the corner portion 132, is positioned above the portion 211 of the film-like adhesive 205 that protrudes from the wafer 200, and covers the upper side of this protruding portion 211. Therefore, when the push-up unit 120 pushes up the annular region 209 of the expanding tape 206 to break the film-like adhesive 205, the underside 135 of the cover member 130 comes into contact with the upper surface of the protruding portion 211 of the film-like adhesive 205 and the cover member 130 is pushed up, preventing the protruding portion 211 of the film-like adhesive 205 from scattering. As a result, debris 300 (see FIGS. 8, 9, and 10) such as broken pieces of protruding portion 211 of film-like adhesive 205 that was prevented from scattering adheres to underside 135 of cover member 130.

[0033] A movement suppressing member 136 is attached above the cover member 130. The movement suppressing member 136 is annular, and has a circular opening 137 in the center, the inner diameter of which is sufficiently smaller than the outer diameter of the wafer 200. The movement suppressing member 136 is made of a lightweight resin with appropriate strength, such as polyethylene terephthalate (PET) or polycarbonate.

[0034] The movement suppressing member 136 has a plurality of through holes 138 (three in the example shown in FIG. 3) that are arranged at equal intervals in the circumferential direction. The movement suppressing member 136 has a plurality of through holes 139 (three in the example shown in FIG. 3) that are arranged at equal intervals in the circumferential direction in a portion on the outer periphery of the through holes 138. The movement suppressing member 136 is attached to the cover member 130 by inserting screws into the through holes 139 and screwing them into the screw holes 134, and is integrated with the cover member 130. The pins 115 of the frame holding part 112 are inserted into the through holes 138, and the movement suppressing member 136 is supported so as to be vertically movable relative to the frame holding part 112 while being restricted together with the cover member 130 in a state in which the opening 137 is coaxial with the opening 114 of the frame holding part 112.

[0035] Since the opening 137 formed in the center of the movement suppression member 136 is sufficiently small to create a large air resistance when moving up and down, the movement suppression member 136 suppresses the upward movement of the cover member 130 caused by the impact when the annular region 209 of the expanding tape 206 is pushed up by the push-up unit 120.

[0036] The control unit 140 controls the operation of various components of the tape expansion device 100 to cause the tape expansion device 100 to perform a series of processes for dividing the film-like adhesive 205 by expanding the expanding tape 206 and a method for cleaning the cover member according to the embodiment. In this embodiment, the control unit 140 includes a computer system. The computer system included in the control unit 140 includes an arithmetic processing device having a microprocessor such as a CPU (Central Processing Unit), a storage device having a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input / output interface device. In this embodiment, the function of the control unit 140 is realized by the arithmetic processing device of the computer system included in the control unit 140 executing a computer program stored in the storage device of the computer system included in the control unit 140. The arithmetic processing device of the control unit 140 performs arithmetic processing according to the computer program stored in the storage device of the control unit 140, and outputs a control signal for controlling the tape expansion device 100 to each component of the tape expansion device 100 via the input / output interface device of the control unit 140.

[0037] Next, this specification will explain a method for cleaning a cover member according to an embodiment based on the drawings. The method for cleaning a cover member according to an embodiment is implemented by using a cleaning jig 1 according to an embodiment in a tape expansion device 100. FIG. 7 is a flowchart showing an example of a processing procedure of the method for cleaning a cover member according to an embodiment. FIGS. 8, 9, and 10 are cross-sectional views each explaining the method for cleaning a cover member according to an embodiment. As shown in FIG. 7, the method for cleaning a cover member according to an embodiment includes a holding step 1001 and a moving step 1002.

[0038] The holding step 1001 is a step of holding the annular frame 2 of the cleaning jig 1 by the frame holding unit 110. Specifically, in the holding step 1001, the control unit 140 transports the cleaning jig 1 into the processing space 102 by a transport unit (not shown), places the annular frame 2 of the cleaning jig 1 on the frame support part 111 so that the opening 113 of the frame support part 111 of the frame holding unit 110 and the opening 5 of the annular frame 2 of the cleaning jig 1 overlap in the vertical direction, and then lowers the frame pressing part 112 of the frame holding unit 110 by a lifting part (not shown), thereby holding the annular frame 2 of the cleaning jig 1 by sandwiching it between the frame support part 111 and the frame pressing part 112, as shown in FIG.

[0039] The moving step 1002 is a step performed after the holding step 1001, in which the push-up unit 120 relatively moves the capture sheet 3 of the cleaning jig 1 and the cover member 130 of the tape expansion device 100 between a standby position 21 (see Figures 8 and 10) in which they are spaced apart from each other, and a contact position 22 (see Figure 9) where the capture sheet 3 captures scraps 300 of the film-like adhesive 205 that are in contact with each other and adhered to the cover member 130.

[0040] In the moving step 1002, specifically, with the annular frame 2 of the cleaning jig 1 fixed to the frame holding unit 110, the control unit 140 causes the lifting part 123 to raise the push-up member 121 vertically relative to the frame holding unit 110 as shown in Fig. 9, thereby pushing up the capture sheet 3 of the cleaning jig 1 in the thickness direction of the cleaning jig 1 (the Z-axis direction in Fig. 9) and positioning the capture sheet 3 at the contact position 22 where the upper surface 7 of the capture sheet 3 contacts the lower surface 135 of the cover member 130. As a result, the debris 300 of the film-like adhesive 205 adhering to the lower surface 135 of the cover member 130 is captured by the upper surface 7 of the capture sheet 3, which is more adhesive than the lower surface 135 of the cover member 130.

[0041] In the moving step 1002, the capture sheet 3 is positioned at the contact position 22 to capture the scraps 300 of the film-like adhesive 205 adhering to the lower surface 135 of the cover member 130 by the capture sheet 3, and then the control unit 140, as shown in FIG. 10, causes the lifting unit 123 to lower the push-up member 121 along the vertical direction relative to the frame holding unit 110, thereby positioning the capture sheet 3 at the standby position 21 where the upper surface 7 of the capture sheet 3 is separated from the lower surface 135 of the cover member 130. As a result, the scraps 300 of the film-like adhesive 205 captured by the capture sheet 3 are separated from the lower surface 135 of the cover member 130 and removed. In this way, the cleaning jig 1 cleans the lower surface 135 of the cover member 130 by capturing and removing the scraps 300 of the film-like adhesive 205 adhering to the lower surface 135 of the cover member 130 with the capture sheet 3.

[0042] The opening 6 of the capture sheet 3 has an inner diameter smaller than or equal to that of the opening 131 of the cover member 130. Therefore, the upper surface 7 of the capture sheet 3 has a radial width larger than or equal to that of the lower surface 135 of the cover member 130, so that in the moving step 1002, the debris 300 of the film-like adhesive 205 can be captured and removed from the entire surface of the lower surface 135 of the cover member 130.

[0043] In the moving step 1002, the control unit 140 preferably causes the push-up unit 120 to relatively move the capture sheet 3 and the cover member 130 multiple times between the standby position 21 and the contact position 22 by changing the push-up speed and the descent speed of the capture sheet 3. In the moving step 1002, the horizontal position where the upper surface 7 of the capture sheet 3 contacts the lower surface 135 of the cover member 130 when the capture sheet 3 is at the contact position 22 changes depending on the push-up speed and the descent speed of the capture sheet 3 by the push-up unit 120, so that the lower surface 135 of the cover member 130 can be evenly cleaned through the multiple movements of the capture sheet 3.

[0044] The cleaning jig 1 and the cleaning method for a cover member according to the embodiment having the above-mentioned configuration have the effect of cleaning the underside 135 of the cover member 130 to which the film-like adhesive 205 is adhered, by the upper surface 7 of the capture sheet 3 of the cleaning jig 1 being in close contact with the underside 135 of the cover member 130 to remove debris 300 of the film-like adhesive 205 adhered to the underside 135 of the cover member 130.

[0045] Furthermore, the cleaning jig 1 and the cover member cleaning method of the embodiment do not require the operator of the tape expansion device 100 to stop cooling by the cold air supply unit 103 and open the processing space 102 for a long period of time in order to clean the cover member 130, so that the underside 135 of the cover member 130 to which the film-like adhesive 205 is attached can be efficiently cleaned.

[0046] Furthermore, the cleaning jig 1 and the method for cleaning the cover member according to the embodiment use an annular frame 2 having the same shape as the annular frame 207 that is attached to the expanding tape 206 together with the wafer 200. Therefore, in the case of a tape expansion device 100 equipped with a transport unit, the cleaning jig 1 can be automatically transported in the same manner as the transport of the wafer 200 to which the annular frame 207 is attached, and the capture sheet 3 can be automatically pushed up in the same manner as the pushing up of the expanding tape 206 attached to the wafer 200, thereby automatically carrying out the method for cleaning the cover member.

[0047] Furthermore, in the cleaning jig 1 and the cleaning method for the cover member of the embodiment, the capture sheet 3 is annular in shape with an opening 6 formed in the center, so that the capture sheet 3 is easily lifted upward by being pushed up by the push-up unit 120, and is more closely adhered to the underside 135 of the cover member 130, thereby efficiently removing debris 300 of the film-like adhesive 205 adhering to the underside 135 of the cover member 130.

[0048] It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. [Explanation of symbols]

[0049] 1 Cleaning tool 2,207 Circular Frame 3 Capture Sheet 5,6,131,208 aperture 21 Standby position 22 Contact position 100 Tape Expansion Unit 110 Frame Holding Unit 120 Push-up unit 130 Cover member 200 wafers 202 Division line 205 Film adhesive 206 Expandable Tape

Claims

1. A tape expanding device which breaks a wafer having breakage start points formed along a planned dividing line or a wafer divided into individual chips along the planned dividing line, while a film-like adhesive attached to a back surface of the wafer is attached to an expandable tape attached to an opening of an annular frame, the tape expanding device comprising: A frame holding unit for holding the annular frame; a push-up unit that pushes up the expandable tape attached to the annular frame held by the frame holding unit to break the film-like adhesive; a cover member that prevents the film-like adhesive from scattering when a portion of the film-like adhesive protruding from the wafer is broken; and a cleaning tool for removing fragments of the film-like adhesive attached to the cover member in a tape expanding device comprising: The cleaning tool is The annular frame; an annular adhesive capture sheet mounted in the opening of the annular frame; A cleaning tool comprising:

2. A method for cleaning a cover member using the cleaning tool according to claim 1, comprising the steps of: a holding step of holding the annular frame of the cleaning jig with the frame holding unit; a moving step of relatively moving the capture sheet and the cover member by the push-up unit between a standby position where the capture sheet and the cover member are spaced apart from each other and a contact position where the capture sheet contacts the cover member and captures the waste of the film-like adhesive adhering to the cover member; A method for cleaning a cover member, comprising the steps of:

3. The method for cleaning a cover member as described in claim 2, characterized in that in the moving step, the push-up unit moves the capture sheet and the cover member relatively multiple times between the standby position and the contact position while changing the speed.

Images