Mounting device and mounting method

Abstract

A mounting device and a mounting method are provided that can prevent a mounting object from having insufficient adhesive strength to a support. [Solution] In a mounting device equipped with a moving means 20 that moves a mounting target CP having a convex portion BP formed thereon and a support body LF on which the mounting target CP is mounted relative to one another, bringing the convex portion BP into contact with the support body LF and placing the mounting target CP at a predetermined position on the support body LF, the mounting target CP has an adhesive layer AL added thereto on a convex portion forming surface CP1 on which the convex portion BP is formed, the adhesive layer AL containing expandable particles SG that expand when a predetermined energy HT is applied thereto, and is equipped with an energy application means 50 that applies energy HT to the adhesive layer AL to expand the expandable particles SG, thereby increasing the contact area of ​​the adhesive layer AL with the support body LF compared to before the expandable particles SG were expanded, and adheres the mounting target CP to the predetermined position on the support body LF.

Description

Technical Field

[0001] The present invention relates to a mounting device and a mounting method.

Background Art

[0002] Conventionally, for mounting a mounting object having a convex portion on a predetermined support, there is a disclosure such as Patent Document 1.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the conventional method for manufacturing a semiconductor device described in Patent Document 1, since the resin layer 13 (adhesive layer) is not positively adhered to the substrate 4 (support), the bump-mounted chip 2a (mounting object) is mainly joined to the support by convex portion joining via the bumps 22 (convex portions), so there is a possibility that the adhesive force to the support is insufficient.

[0005] An object of the present invention is to provide a mounting device and a mounting method capable of preventing insufficient adhesive force of a mounting object to a support.

Means for Solving the Problems

[0006] The present invention employs the configuration described in the claims.

Effects of the Invention

[0007] According to the present invention, by expanding the expandable particles, the contact area of the adhesive layer with the support is increased, and the mounting object is adhered to a predetermined position of the support, so that it is possible to prevent insufficient adhesive force of the mounting object to the support. [Brief explanation of the drawing]

[0008] [Figure 1] (A) to (D) are explanatory diagrams of the mounting device of the present invention. [Modes for carrying out the invention]

[0009] Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, the X, Y, and Z axes are orthogonal to each other. The X and Y axes are axes within a predetermined plane, and the Z axis is an axis perpendicular to the predetermined plane. Furthermore, in this embodiment, using the view from the front direction in Figure 1, which is parallel to the Y axis, as the reference, when directions are indicated without specifying a figure, "up" is the direction of the Z-axis arrow and "down" is the opposite direction, "left" is the direction of the X-axis arrow and "right" is the opposite direction, and "front" is the front direction in Figure 1(A), which is parallel to the Y axis and "back" is the opposite direction. In addition, in figures other than Figure 1(A), all figures without arrows indicating direction are viewed from the same direction as Figure 1.

[0010] The mounting apparatus EA of the present invention comprises a holding means 10 for holding a semiconductor chip (hereinafter also simply referred to as "chip") CP as a mounting target, on which bumps BP as protrusions are formed; a moving means 20 for relatively moving the holding means 10 holding the chip CP and a lead frame LF as a support for mounting the chip CP, thereby bringing the bumps BP into contact with the lead frame LF and positioning the chip CP at a predetermined position on the lead frame LF; a bonding means 30 for bonding the bumps BP to the lead frame LF while the chip CP is positioned at a predetermined position on the lead frame LF; a removal means 40 for removing foreign matter adhering to the contact portion BP1 where the bumps BP contact the lead frame LF; and an energy-applying means 50 for increasing the contact area of ​​the adhesive layer AL with respect to the lead frame LF by applying heat HT as a predetermined energy to the adhesive layer AL to expand the expandable particles SG, thereby increasing the contact area of ​​the adhesive layer AL with respect to the lead frame LF compared to before the expansion of the expandable particles SG. The apparatus is located near a chip support means 60 that supports the chip CP on which the adhesive layer AL is laminated, and a lead frame support means 70 that supports the lead frame LF. The chip CP has an adhesive layer AL laminated onto the protruding surface CP1 where the bump BP is formed, with expandable particles SG added that expand when heat HT is applied. The thickness of the adhesive layer AL is set to be less than or equal to the height of the bump BP.

[0011] The holding means 10 includes a holding member 11 having a support surface 11A that can be held by suction using a depressurization means (not shown), such as a depressurization pump or a vacuum ejector.

[0012] The moving means 20 is composed of multiple arms and includes a so-called articulated robot 21, which is a drive device that can displace what is supported by the end arm 21A, which is the working part, to any position and angle within its working range; a frame 22 supported by the end arm 21A; and position detection equipment 23 supported by the frame 22, such as imaging means like a camera or projector, and various sensors like optical sensors or ultrasonic sensors. The articulated robot 21 can be exemplified by the articulated robot 111 shown in Japanese Patent Application Publication No. 2016-81974.

[0013] The joining means 30 includes a frame 31 supported by the tip arm 21A of the articulated robot 21, an ultrasonic vibration application device 32 supported by the frame 31 and acting as a vibration application means for supporting the holding member 11 with its output shaft 32A and applying vibration to the holding member 11, and a pressing force detection device 33 such as a load cell or pressure sensor for detecting the pressing force that the articulated robot 21 applies to the chip CP via the holding member 11.

[0014] The removal means 40 includes a rotary motor 41 as a driving device and a rotating brush 42 supported on its output shaft 41A.

[0015] The energy supply means 50 includes a rotary motor 51 as a drive device, a heater frame 52 supported on its output shaft 51A, and a coil heater 53 as a heating means supported on the heater frame 52.

[0016] The chip support means 60 includes a support table 61 that supports the chip CP on a support surface 61A.

[0017] The lead frame support means 70 includes a support table 71 that supports the lead frame LF on a support surface 71A.

[0018] The operation of the above-mentioned implementation device EA will now be explained. First, the user of the mounting device EA (hereinafter simply referred to as "user") or a transport means (not shown) such as an articulated robot or a belt conveyor places the chip CP and lead frame LF on the support tables 61 and 71, respectively, on the mounting device EA, which has the components positioned in the initial positions shown by the solid lines in Figure 1. Then, the moving means 20 and joining means 30 drive the articulated robot 21, position detection device 23 and pressing force detection device 33 to bring the support surface 11A of the holding member 11 into contact with the upper surface of the chip CP. After that, the holding means 10 drives a depressurization means (not shown) to start suction holding of the chip CP on the support surface 11A. At this time, the moving means 20 drives the articulated robot 21 so that the chip CP is held by the holding member 11 in a predetermined position and direction, based on the detection result of the position detection device 23. Furthermore, the moving means 20 drives the articulated robot 21 so that the pressing force applied to the chip CP via the holding member 11 is a predetermined pressing force, based on the detection result of the pressing force detection device 33.

[0019] Next, the removal means 40 drives the rotary motor 41 to rotate the rotating brush 42 in the AD direction, as shown by the dashed line in Figure 1(A). Then, the moving means 20 drives the articulated robot 21 to move the chip CP to the left, so that the contact portion BP1 comes into contact with the rotating brush 42. After that, the removal means 40 drives the rotary motor 41 to rotate the rotating brush 42 in the BD direction, as shown by the dashed line in Figure 1(A). Then, the moving means 20 drives the articulated robot 21 to move the chip CP to the right, so that the contact portion BP1 comes into contact with the rotating brush 42. As a result, for example, the adhesive layer AL covering the contact portion BP1 in a thin film state, or dirt and dust attached to the contact portion BP1, are removed as foreign matter by the rotating brush 42. Once the removal of foreign matter attached to the contact portion BP1 is complete, the removal means 40 stops driving the rotary motor 41.

[0020] Next, the moving means 20 and the joining means 30 drive the articulated robot 21, the position detection device 23, and the pressing force detection device 33, and as shown by the two-dot chain line in Fig. 1(A), the contact portion BP1 of the chip CP is brought into contact with the lead frame LF. At this time, based on the detection result of the position detection device 23, the moving means 20 drives the articulated robot 21 so that the chip CP is attached to the lead frame LF at a predetermined position and in a predetermined direction. Then, the joining means 30 drives the ultrasonic vibration application device 32 and applies vibration to the chip CP via the holding member 11, thereby performing a joining process by ultrasonic bonding. At this time, based on the detection result of the pressing force detection device 33, the moving means 20 drives the articulated robot 21 so that the pressing force applied to the chip CP via the holding member 11 becomes a predetermined pressing force. As a result, the chip CP is attached to a predetermined position of the lead frame LF only by convex portion bonding via the bumps BP. When the attachment is completed, the holding means 10 stops driving a decompression means (not shown), releases the adsorption and holding of the chip CP on the support surface 11A, and then the moving means 20 drives the articulated robot 21 to return the holding member 11 and each arm to their initial positions.

[0021] Note that, before the energy applying means 50 applies heat HT to the adhesive layer AL, the adhesive layer AL is in a non-contact state where it does not contact the lead frame LF, as shown by the two-dot chain line in Fig. 1(A), or in a state of excessive non-contact portions where it is partially in contact, as shown in Figs. 1(B1) and (B2). Here, the state of excessive non-contact portions refers to a state where the ratio of the initial contact area where the adhesive layer AL contacts the lead frame LF is less than 50% with respect to the entire area of the adhesive layer AL laminated on the chip CP and exposed on the lead frame LF side.

[0022] Next, the energy applying means 50 drives the rotation motor 51, and as shown in FIG. 1(C1), rotates the heater frame 52 to oppose the coil heater 53 to the upper surface of the chip CP. Then, the coil heater 53 is driven to apply heat HT to the adhesive layer AL. As a result, the expandable particles SG added to the adhesive layer AL expand, and as shown in FIG. 1(C2), when the adhesive layer AL contacts the lead frame LF, the contact area thereof increases compared to before the expandable particles SG are expanded. As a result, the chip CP attached to the lead frame LF only in a convex portion bonding or in a state of excessive convex portion bonding and non-contact portions is also adhered to the lead frame LF by most of the adhesive layer AL. After that, after the energy applying means 50 stops driving the coil heater 53 and then drives the rotation motor 51 to return the heater frame 52 to the initial position, a user (hereinafter simply referred to as "user") or a conveying means (not shown) conveys the lead frame LF to which the chip CP is attached to another process, and the same operation as described above is repeated thereafter.

[0023] According to the embodiment as described above, by expanding the expandable particles SG, the contact area of the adhesive layer AL with respect to the lead frame LF is increased, and the chip CP is adhered to a predetermined position of the lead frame LF, so that it is possible to prevent the adhesive force of the chip CP with respect to the lead frame LF from being insufficient.

[0024] The means and steps in the present invention are not limited at all as long as they can perform the operations, functions or steps described for those means and steps. Moreover, they are not limited to the components and steps of merely one embodiment shown in the above embodiment. For example, the holding means is not limited at all as long as it can hold the mounting object having the convex portions, as long as it is within the technical scope in light of the common technical knowledge at the time of filing the application (the same applies to other means and steps).

[0025] For example, the mounting apparatus EA may include a fragmentation means 80 for forming chips CP by fragmenting a semiconductor wafer (hereinafter also simply referred to as "wafer") WF, which is a base material in which an adhesive layer AL is laminated on a protrusion-forming surface WF1 on which bumps BP are formed, as shown in Figure 1(D). Such a fragmentation means 80 includes a rotating blade 82 as a cutting means supported on the output shaft 81A of a rotating motor 81 as a drive device. For example, as shown in Figure 1(D1), when a wafer WF is placed on a support table 61, as shown in Figure 1(D2), the fragmentation means 80 rotates the rotating blade 82 and moves the rotating blade 82 along the planned cutting line of the wafer WF, thereby forming chips CP.

[0026] The moving means 20 may move the other while restricting the movement of either the holding means 10 or the lead frame LF, or move both, thereby bringing the bump BP into contact with the lead frame LF and positioning the chip CP at a predetermined location on the lead frame LF, or it may not be equipped with a position detection device 23.

[0027] The joining means 30 may employ an eccentric motor or vibrator as a vibration application means, and the bump BP may be joined to the lead frame LF by any method, including joining with adhesive, adhesive sheet, adhesive tape, melting, baking, soldering, etc., and the vibration application means may not be necessary, nor may the pressing force detection device 33 be necessary.

[0028] The removal means 40 may be a method of removing foreign matter from the contact area BP1 by sandpaper, a file, or gas spraying, or a method of removing foreign matter from the contact area BP1 by plasma treatment, or a method of removing foreign matter from the contact area BP1 by applying hot air or cleaning solution, or it may not be provided in the mounting device EA.

[0029] The energy supply means 50 may employ an infrared heater that emits heat HT and applies the heat HT to the adhesive layer AL to expand the expandable particles SG, or it may apply heat HT to the entire adhesive layer AL at once, or it may apply heat HT to the adhesive layer AL partially, or the time for applying heat HT to the adhesive layer AL can be arbitrarily determined considering the characteristics, properties, materials, composition and structure of the expandable particles SG, and as a heating means, a heating side of a heat pipe, a hot water heater, etc., or a combination thereof may be adopted. The heat HT may be applied gradually from one end of the chip CP to the other, gradually from the center of the chip CP to the outer edge, gradually from the outer edge of the chip CP to the center, heat HT may be applied to the adhesive layer AL from the chip CP side, heat HT may be applied to the adhesive layer AL from the lead frame LF side, heat HT may be applied to the adhesive layer AL from the side of the chip CP or lead frame LF, heat HT may be applied to the adhesive layer AL from any position, and the rotating motor 51 is not required. Prior to the energy imparting means 50 imparting heat HT to the adhesive layer AL, the adhesive layer AL does not need to be in a non-contact state or a state with an excessive amount of non-contact with the lead frame LF. For example, prior to the energy imparting means 50 imparting heat HT to the adhesive layer AL, the proportion of the initial contact area may be 50% or more, such as 51%, 75%, or 99%, and it is sufficient that the energy imparting means 50 expands the expandable particles SG, thereby increasing the contact area of ​​the adhesive layer AL with the lead frame LF compared to before the expansion of the expandable particles SG.

[0030] The chip support means 60 may include a holding means for holding the chip CP, or it may be provided in the mounting apparatus EA of the present invention, or it may not be provided in the mounting apparatus EA if the chip CP is supported by another device.

[0031] The lead frame support means 70 may include a holding means for holding the lead frame LF, or it may be provided in the mounting apparatus EA of the present invention, or it may not be provided in the mounting apparatus EA of the present invention if the lead frame LF is supported by another device.

[0032] The fragmentation means 80 may fragment the wafer WF and form chip CPs by restricting the movement of one of the wafer WF and the rotating blade 82 while moving the other, or by moving both of them. Alternatively, it may employ a method in which a laser irradiator, acting as a cutting means, emits a laser, and moves the laser irradiator along the planned cutting line of the wafer WF to form a modified portion in the wafer WF, and then applies an external force such as tension or vibration to the wafer WF on which the modified portion has been formed to form chip CPs. When the fragmentation means 80 forms chip CPs by forming a modified portion in the wafer WF, it may employ an external force application means that applies an external force to the wafer WF on which the modified portion has been formed, thereby forming cracks originating from the modified layer. As a means for forming a modified portion, in addition to laser light, electromagnetic waves, vibrations, heat, chemicals, chemical substances, etc. may be applied to change the characteristics, properties, materials, composition, structure, dimensions, etc. of the wafer WF, thereby weakening, crushing, liquefying, or hollowing out the wafer WF to form a modified portion. Such a modified portion can be anything that can break down the object to be mounted into individual pieces and form individual pieces. The fragmentation means 80 may divide the wafer WF into two parts, or into three or more parts, and the shape of the chip CP formed by fragmentation may be any shape, such as a circle, an ellipse, a triangle, or a polygon with four or more sides. The individualizing means 80 may not be provided in the mounting apparatus EA of the present invention.

[0033] The adhesive layer AL may be made of expandable particles SG that expand with any energy, such as electromagnetic waves like ultraviolet rays, visible light, sound waves, X-rays, or gamma rays, or heat such as hot water or hot air. The energy imparting means may be any energy, such as electromagnetic waves like ultraviolet rays, visible light, sound waves, X-rays, or gamma rays, or heat such as hot water or hot air, depending on the characteristics, properties, materials, composition, and structure of the expandable particles SG. Any means is acceptable as long as it increases the contact area of ​​the adhesive layer AL with the support compared to before the expansion of the expandable particles SG.

[0034] Examples of expandable particles SG include fine particles in which substances that readily gasify and expand upon heating, such as isobutane, propane, and pentane, are encapsulated within an elastic shell. Examples include the heat-expandable fine particles disclosed in Japanese Patent Application No. 2017-73236, Japanese Patent Publication No. 2013-159743, Japanese Patent Publication No. 2012-167151, Japanese Patent Publication No. 2001-123002, etc., as well as the heat-expandable fine particles disclosed in Japanese Patent Publication No. 2013-47321, Japanese Patent Publication No. 2007-254580, Japanese Patent Publication No. 2011-212528, Japanese Patent Publication No. 2003-261842, etc. The expandable particles are not limited in any way, and for example, a foaming agent that produces water, carbon dioxide, and nitrogen by thermal decomposition to produce an effect similar to that of expandable particles may be used, or a gas generating agent such as an azo compound that generates gas when exposed to ultraviolet light, as disclosed in Japanese Patent Application Publication No. 2016-53115 and Japanese Patent Application Publication No. Hei 7-278333, may be used to expand the shell, or rubber or resin that expands when heated may be used, or other materials such as baking soda, sodium bicarbonate, or baking powder may be used.

[0035] The adhesive layer AL may be of a pressure-sensitive adhesive type, a heat-sensitive adhesive type, or any other adhesive type. If a heat-sensitive adhesive layer AL is used, it can be bonded by an appropriate method, such as providing a suitable heating means, such as a coil heater or the heating side of a heat pipe, to heat the adhesive layer AL. Furthermore, the adhesive layer AL may be a single layer of adhesive only, a double-sided adhesive type with one or more intermediate layers, or a single or multi-layered layer without intermediate layers, and may be circular, elliptical, a polygon such as a triangle or square, or any other shape. If the adhesive layer AL has an intermediate layer, the expandable particles SG may be added only to the adhesive layer AL, only to the intermediate layer, or to both the adhesive layer AL and the intermediate layer. The mounting object, support, and base material may be individual objects such as food, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit boards, information recording substrates such as optical discs, glass plates, glassware, steel plates, metal products, ceramics, wooden boards, wooden products, or resin, or composite objects formed from two or more of these, and any form of component or article may also be included, and their material, type, shape, etc., are not particularly limited, and the protrusions formed on such mounting objects may be of any kind, such as fasteners such as bolts and nuts, or resin-molded protrusions, and the shapes of the mounting object, support, base material, and protrusions may be any other shapes, such as circles, ellipses, polygons such as triangles and squares, cubes, rectangular prisms, spheres, cylinders, prismatic shapes, cones, pyramidal shapes, etc.

[0036] The drive equipment in the above embodiment can be electric equipment such as rotary motors, linear motors, single-axis robots, articulated robots with two or three or more axes, actuators such as air cylinders, hydraulic cylinders, rodless cylinders, and rotary cylinders, or a combination of these directly or indirectly. In the above embodiment, if a means or member for pressing the object to be pressed, such as a pressing roller or pressing head, is used, a member such as a roller, round bar, blade material, rubber, resin, or sponge may be used instead of or in combination with those exemplified above, or a configuration in which pressing is performed by blowing a gas such as air or gas may be used, or the object to be pressed may be made of a deformable material such as rubber or resin, or a non-deformable material, or if a means or member for supporting or holding the supported object is used, a gripping hand such as a mechanical chuck or chuck cylinder may be used. A configuration may be adopted in which the member to be supported is supported (held) by steps, Coulomb force, adhesive (adhesive sheet, adhesive tape), adhesive agent (adhesive sheet, adhesive tape), magnetic force, Bernoulli adsorption, suction adsorption, drive equipment, etc. Alternatively, if a means or cutting member is used to cut the member to be cut or to form notches or cutting lines in the member to be cut, a cutter blade, laser cutter, ion beam, thermal power, heat, water pressure, electric heating wire, spraying of gas or liquid, etc. may be used instead of or in combination with the examples given above, or the member to be cut may be moved and cut using a combination of appropriate drive equipment. [Explanation of symbols]

[0037] EA… Assembly device 10...Holding means 20…Means of transportation 30...Joining means 40...Removal means 50... Means of providing energy 80...Singulation means AL…Adhesive layer BP... Bump (protruding part) BP1…Contact part CP... Chip (the object to be implemented) CP1…Convex surface HT... Heat (energy) LF...Support (lead frame) SG…Expandable particles WF… Semiconductor wafer (base material) WF1... Surface that forms convex part

Claims

1. A mounting device including a moving means for relatively moving a mounting object having a convex portion formed thereon and a support body on which the mounting object is mounted, and bringing the convex portion into contact with the support body to place the mounting object at a predetermined position on the support body, the mounting object has an adhesive layer, to which expandable particles that expand when a predetermined energy is applied, laminated on a convex portion forming surface on which the convex portions are formed, A mounting device characterized by having an energy-applying means that applies energy to the adhesive layer to expand the expandable particles, thereby increasing the contact area of ​​the adhesive layer with the support compared to before the expandable particles were expanded, and adhering the mounting object to a predetermined position on the support.

2. A mounting method includes a moving step of relatively moving a mounting object having a convex portion formed thereon and a support body on which the mounting object is mounted, and bringing the convex portion into contact with the support body to place the mounting object at a predetermined position on the support body, the mounting object has an adhesive layer, to which expandable particles that expand when a predetermined energy is applied, laminated on a convex portion forming surface on which the convex portions are formed, A mounting method characterized by carrying out an energy application step in which energy is applied to the adhesive layer to expand the expandable particles, thereby increasing the contact area of ​​the adhesive layer with the support compared to before the expandable particles were expanded, and adhering the mounting object to a predetermined position on the support.

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