Gas delivery system for high pressure processing chambers

Abstract

To provide a gas delivery system for a high-pressure processing chamber.SOLUTION: A high-pressure processing system 200 includes: a first chamber 202; a second chamber 204 adjacent to the first chamber; a foreline to remove gas from the second chamber; a vacuum processing system 208 configured to lower a pressure within the second chamber to near vacuum; a valve assembly 212 to isolate the pressure in the first chamber from the pressure in the second chamber; a gas delivery system 206 configured to introduce a gas into the first chamber and to increase the pressure in the first chamber to at least 10 atmospheres; an exhaust line to remove gas from the first chamber; and a containment enclosure surrounding a portion of the gas delivery system and the exhaust line, the containment enclosure configured to divert gas leaking from the portion of the gas delivery system and the exhaust line to the foreline.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to high pressure processing chambers for, for example, annealing, deposition or etching processes during the manufacture of integrated circuits. [Background technology]

[0002]

[0002] Microelectronic circuits and other microscale devices are typically fabricated from a substrate or wafer, such as a silicon or other semiconductor material wafer. Multiple metal layers are formed on the substrate to form microelectronic or other microscale components or to provide electrical connections. These metal layers, such as copper, are plated onto the substrate to form components and interconnects in a series of photolithography, plating, etching, polishing, or other steps.

[0003]

[0003] To reach the desired material properties, the substrate is typically subjected to an annealing process in which the substrate is rapidly heated, usually to about 200-500°C. The substrate may be held at these temperatures for a relatively short period of time, for example 60-300 seconds. The substrate is then rapidly cooled, the entire process typically taking only a few seconds. Annealing can be used to change the material properties of layers on the substrate. Annealing can also be used to activate inter-film dopants, drive dopants on the substrate, to change film-film or film-substrate interfaces, to densify deposited films, or to repair damage caused by ion implantation.

[0004]

[0004] As the feature sizes of microelectronic devices and interconnects decrease, the tolerable defect rate drops dramatically. Some defects result from contaminant particles. Other defects can result from incomplete processing of particular areas of the wafer, for example, incomplete growth of a film at the bottom of a trench.

[0005]

[0005] Various annealing chambers have been used in the past. In single wafer processing facilities, these annealing chambers typically position the substrate between or over heating and cooling elements to control the temperature profile of the substrate. However, engineering challenges can arise in achieving an accurate and repeatable temperature profile as well as an acceptable defect level. Summary of the Invention

[0006]

[0006] In one aspect, a high pressure processing system for processing a layer on a substrate includes a first chamber, a second chamber adjacent the first chamber, a foreline for removing gas from the second chamber, a vacuum processing system configured to reduce a pressure in the second chamber to near vacuum, a valve assembly between the first and second chambers for isolating the pressure in the first chamber from the pressure in the second chamber, a gas supply system configured to introduce gas into the first chamber to increase the pressure in the first chamber to at least 10 atmospheres while the gas is in the first chamber and while the first chamber is isolated from the second chamber, a controller configured to operate the gas supply system and the valve assembly, an exhaust system having an exhaust line for removing gas from the first chamber, and a containment enclosure configured to enclose a portion of the gas supply system and the exhaust line and divert gas leaking from the portion of the gas supply system and the exhaust line to the foreline.

[0007]

[0007] Implementations may include one or more of the following features.

[0008]

[0008] The containment enclosure may be configured to prevent leaking gas from escaping to the atmosphere. The foreline may be connected to a dryline pump and a diffuser configured to reduce the pressure of the gas before it reaches the dryline pump.

[0009]

[0009] The first pump may be configured to increase the pressure of the gas to at least 10 atmospheres, such as at least 40 atmospheres, prior to supplying the gas to the first chamber. The containment enclosure may enclose the first pump and a supply line connecting the first pump and the first chamber.

[0010] The second gas supply system may be configured to introduce a second gas into the first chamber to increase the pressure in the first chamber to at least 10 atmospheres while the second gas is in the first chamber and while the first chamber is isolated from the second chamber. The second gas supply system may include a second pump configured to increase the pressure of the second gas to at least 40 atmospheres prior to supplying the second gas to the first chamber.

[0011] The gas supply system may include a steam supply system that introduces steam into the first chamber.

[0012]

[0012] One or more chemical sensors, e.g., hydrogen sensors, can be located within the containment enclosure, and the controller can be configured to shut off the first pump if the controller receives a signal from the one or more chemical sensors indicating a chemical leak.

[0013] A pedestal may be positioned within the first chamber to support the substrate, and a heating element on the pedestal may be configured to apply heat to the substrate to anneal the substrate while the substrate is supported on the pedestal.

[0014] The vacuum processing system may be configured to create a pressure of less than 1 atmosphere in the second chamber.

[0015] The robot arm may be configured to transfer a substrate from a first chamber to a second chamber through a valve assembly. The valve assembly may include a slit valve between the first and second chambers. The slit valve may include a slit through a wall between the first and second chambers and an arm movable between a first position in which the arm blocks the slit to form a seal between the first and second chambers and a second position in which the slit is unblocked and the substrate may be transferred from the first chamber to the second chamber through the slit valve. The arm may be configured to intimately contact an inner surface of a wall defining the first chamber in the first position to compress an O-ring to form a seal between the first and second chambers. An actuator coupled to an end of the arm outside the second chamber may move the arm relative to the slit. The gas channel may be internal to the arm. The gas channel may be connected to a cooling gas source at the first end.

[0016]

[0016] The lift pin assembly can lift the substrate from the support. The cooling channel can provide a cooling gas proximate the lift pin assembly to cool the lift pin assembly.

[0017] In another aspect, a semiconductor manufacturing apparatus includes a central vacuum chamber having a robot positioned therein, a factory interface module coupled to the central vacuum chamber, a low pressure processing chamber coupled to the central vacuum chamber by a first vacuum valve, and a high pressure processing system as described above. A second chamber is coupled to the central vacuum chamber by a second vacuum valve.

[0018] Implementations may include one or more of the following advantages.

[0019]

[0019] High pressures can be established in the chamber more safely. Leaks are detectable.

[0020]

[0020] Layers may be processed or formed more uniformly across the substrate. Additionally, high pressure processing may provide access to chemical reactions that are not available at lower pressures.

[0021]

[0021] The details of one or more embodiments are set forth in the accompanying drawings and the description below. Other features, objects, and advantages will be apparent from the description and drawings, and from the claims. [Brief description of the drawings]

[0022] [Figure 1] FIG. 1 is a diagram of a processing platform. [Diagram 2] FIG. 1 is a diagram of a high pressure system. [Diagram 3] FIG. 1 is a diagram of a high pressure system having improved safety features. [Figure 4] FIG. 1 is a schematic side view of one embodiment of a high pressure deposition system. [Diagram 5] FIG. 2 is a schematic side view of a pedestal. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023]

[0027] Like reference numbers in the various drawings indicate like elements.

[0024]

[0028] As mentioned above, some defects may result from incomplete processing of certain areas of the substrate. However, high pressure processing (e.g., annealing or deposition) may improve the consistency of processing across the substrate. Specifically, annealing may be performed in a high pressure environment. Through the annealing process, where a layer is formed, for example, by thermal oxidation or other processes in which chemicals diffuse into and react with the substrate, the high pressure may help improve the completeness of the surface coverage of the material layer on the substrate. For example, problems with processing the layer in trenches may be reduced. This may result in the layer being processed or formed more uniformly across the substrate. Additionally, high pressure processing (e.g., annealing or deposition) may provide access to chemical reactions that are not available at lower pressures.

[0025]

[0029] Another challenge is that certain materials, such as copper, oxidize quickly when exposed to oxygen at temperatures above about 70° C. Once copper or other materials oxidize, the substrate may no longer be usable, or the oxide layer may have to be removed first before further processing. Both of these are unacceptable options for efficient manufacturing. Therefore, a design factor is to isolate the substrate from oxygen when the substrate temperature exceeds about 70° C. Of course, oxygen is present in the ambient air, and avoiding oxidation of copper during annealing may also present an engineering challenge. As described herein, it is possible to transfer the substrate between a high pressure processing chamber and a different processing chamber with a low pressure, e.g., near vacuum, environment to avoid contamination and oxidation of the substrate.

[0026]

[0030] Wafer temperature uniformity is another significant design factor because it affects the crystal structure of copper or other materials on the wafer. The processing system, for example, the pedestal configuration, can provide uniform heating of the wafer.

[0027]

[0031] Another consideration is pressure. Very high pressures can improve the consistency and quality of the wafers produced. However, systems with high pressures (e.g., greater than 10 atm, greater than 15 atm, or even up to 20 atm) have a high risk of containment breach and damage. Systems with improved safety features would be beneficial for use in such ultra-high pressure processes.

[0028]

[0032] 1 illustrates an integrated multi-chamber substrate processing system suitable for performing at least one embodiment of a physical vapor deposition, chemical vapor deposition, and / or annealing process. In general, a multi-chamber substrate processing system includes at least one high-pressure processing chamber, which may operate at a pressure greater than 40 atmospheres, for performing a high-pressure process, such as deposition or annealing, and at least one low-pressure processing chamber, which may operate at a low pressure, for performing a low-pressure process, such as etching, deposition, or thermal processing. In one implementation, the multi-chamber processing system is a cluster tool having a low-pressure central transfer chamber from which multiple processing chambers can be accessed.

[0029]

[0033] Some embodiments of the processes and systems described herein involve depositing layers of materials, such as metal and metal silicide barriers, to define features. For example, a first metal layer is deposited on a silicon substrate and annealed to form a metal silicide layer. A second metal layer is then deposited on the metal silicide layer to fill the feature. The annealing process to form the metal silicide layer may be performed in multiple annealing steps.

[0030]

[0034] 1 is a schematic top view of one embodiment of a processing platform 100 including two transfer chambers 102, 104, transfer robots 106, 108 positioned in the transfer chambers 102, 104, respectively, and processing chambers 110, 112, 114, 116, 118, 130 disposed in the two transfer chambers 102, 104. The first and second transfer chambers 102, 104 are central vacuum chambers that interface with adjacent processing chambers 110, 112, 114, 116, 118, 130.

[0031]

[0035] The first transfer chamber 102 and the second transfer chamber 104 are separated by a pass-through chamber 120, which may comprise a cooling or pre-heating chamber. The pass-through chamber 120 may also be pumped down or ventilated during substrate handling when the first transfer chamber 102 and the second transfer chamber 104 operate at different pressures. For example, the first transfer chamber 102 may operate at about 100 mTorr to about 5 Torr, such as about 40 mTorr, and the second transfer chamber 104 may operate at about 1×10-5 Torr to about 1×10-8 Torr, such as about 1×10-7 Torr.

[0032]

[0036] The processing platform 100 is operated by a programmed controller 122. The controller 122 can control the transfer robots 106, 108 to transport workpieces between the chambers and can cause each chamber of the processing platform 100 to perform a separate process for processing a substrate.

[0033]

[0037] The first transfer chamber 102 is coupled to two degassing chambers 124, two load lock chambers 128, a reactive pre-clean chamber 118, at least one physical vapor deposition chamber 110, and a pass-through chamber 120. The pre-clean chamber may be a PreClean II chamber available from Applied Materials, Inc., Santa Clara, Calif. Substrates (not shown) are loaded into the processing platform 100 through the load lock chamber 128. For example, if a factory interface module 132 is present, it serves to receive one or more substrates, e.g., wafers, a cassette of wafers, or a sealed pod of wafers, from a human operator or an automated substrate handling system. The factory interface module 132 can open the cassette or pod of substrates, if applicable, and move the substrates in and out of the load lock chamber 128. The processing chambers 110, 112, 114, 116, 118, 130 allow for receiving substrates from the transfer chambers 102, 104, processing the substrate, and transferring the substrate back to the transfer chambers 102, 104. After being loaded onto the processing platform 100, the substrate is sequentially degassed and cleaned in the degassing chamber 124 and pre-clean chamber 118, respectively.

[0034]

[0038] Each processing chamber is isolated from the transfer chamber 102, 104 by an isolation valve, which allows the processing chambers to operate at a different vacuum level than the transfer chamber 102, 104 and prevents any gases used in the processing chambers from being introduced into the transfer chamber. The load lock chamber 128 is also isolated from the transfer chamber 102, 104 with an isolation valve. Each load lock chamber 128 has a door that opens to the outside environment, for example to the factory interface module 132. In a typical process, a cassette loaded with substrates is placed into the load lock chamber 128 through the door from the factory interface module 132 and the door is closed. The load lock chamber 128 is then pumped down to the same pressure as the transfer chamber 102 and the isolation valve between the load lock chamber 128 and the transfer chamber 102 is opened. The transfer chamber 102 robot moves into position and one substrate is removed from the load lock chamber 128. The load lock chamber 128 is preferably equipped with an elevator mechanism so that one substrate can be removed from a cassette and the elevator moves the stack of wafers in the cassette to position another wafer on the transfer surface so that it can be positioned on the robot blade.

[0035]

[0039] The transfer robot 106 in the transfer chamber 102 then rotates with the substrate, thereby aligning it with the processing chamber. The processing chamber is flushed of all harmful gases and brought to the same pressure level as the transfer chamber, and the isolation valve is opened. The transfer robot 106 then moves the wafer to the processing chamber, where it lifts the wafer. The transfer robot 106 then retreats from the processing chamber, and the isolation valve is closed. A series of steps are then performed in the processing chamber to perform a particular process on the wafer. Once complete, the processing chamber is returned to the same environment as the transfer chamber 102, and the isolation valve is opened. The transfer robot 106 removes the wafer from the processing chamber and then either moves it to another processing chamber for another step, or places it back in the load lock chamber 128 for removal from the processing platform 100 when the entire cassette of wafers has been processed.

[0036]

[0040] The transfer robots 106, 108 include robot arms 107, 109, respectively, that support and move the substrate between the different processing chambers. The transfer robot 106 moves the substrate between the degassing chamber 124 and the pre-clean chamber 118. The substrate may then be transferred to a long throw PVD chamber 110 for deposition of material thereon.

[0037]

[0041] The second transfer chamber 104 is coupled to a cluster of processing chambers 116, 112, 114, 130. The processing chambers 116, 112 may be chemical vapor deposition (CVD) chambers for depositing materials such as tungsten as desired by the operator. The PVD processed substrate is transferred from the first transfer chamber 102 to the second transfer chamber 104 via a pass-through chamber 120. A transfer robot 108 then moves the substrate between one or more of the processing chambers 116, 112, 114, 130 for deposition and annealing of materials required in the process.

[0038]

[0042] Of course, all of the above are merely example implementations, and each transfer chamber may have only a different number of processing chambers, for example 1-5 chambers, the processing chambers may have different functional distribution arrangements, the system may have a different number of transfer chambers, for example only a single transfer chamber, the transfer chamber may be omitted entirely, and the system may have only a single isolated processing chamber.

[0039]

[0043] 2 shows a controlled high pressure system 200 that creates a high pressure environment for processing a substrate and a low pressure environment for the substrate as it is being transferred between processing chambers. The controlled high pressure system 200 includes a first high pressure chamber 202 and a second vacuum chamber 204. The first chamber 202 may correspond to one of the processing chambers 110, 112, 114, 116, 118, 130 of the processing platform 100, and the second chamber 204 may correspond to one of the transfer chambers 102, 104 of the processing platform 100. Alternatively, in an implementation, one of the processing chambers 110, 112, 114, 116, 118, 130 includes both the first chamber 202 and the second chamber 204. The first chamber 202 may correspond to an inner chamber, and the second chamber 204 may correspond to an outer chamber surrounding the inner chamber.

[0040]

[0044] The pressure in the first chamber 202 can be controlled independently of the pressure in the second chamber 204. If the first and second chambers 202, 204 are separate from the transfer chamber, the first and second chambers 202, 204 can have pressures controlled independently of the pressure in the transfer chamber. The controlled high pressure system 200 further includes a gas supply system 206, a vacuum processing system 208, and a controller 210. In an embodiment, the controller 122 of the processing platform 100 can include the controller 210.

[0041]

[0045] The second chamber 204 is a relatively low pressure chamber adjacent to the first chamber 202. In some implementations, the second chamber 204 also surrounds the first chamber 202. The second chamber 204 may correspond to a transfer chamber, such as the transfer chamber 102 that receives substrates between different processing chambers, or the transfer chamber 104. The low pressure environment of the second chamber 204 may prevent contamination and / or oxidation of the substrate or materials deposited on the substrate.

[0042]

[0046] The gas supply system 206 operates to pressurize and depressurize the first chamber 202. The first chamber 202 is a high pressure processing chamber that receives precursor gas from the gas supply system 206 and establishes a high pressure, such as a pressure of at least 10 atmospheres (e.g., greater than 15 atm, greater than 20 atm). The precursor gas may react with the workpiece, such as a layer on the workpiece, or may serve as a source of material to be deposited on the workpiece. To pressurize the first chamber 202, the gas supply system 206 introduces the precursor gas to the first chamber 202. The gas supply system 206 may also introduce steam to the first chamber 202 to increase the pressure in the first chamber 202.

[0043]

[0047] The gas supply system 206 includes an exhaust system 211 that reduces the pressure in the first chamber 202 by evacuating precursor gases and steam from the first chamber 202. The vacuum processing system 208 operates to control the pressure in the second chamber 204 to be vacuum or near vacuum, e.g., less than 1 mTorr. The vacuum processing system 208 reduces the pressure in the second chamber 204 to near vacuum, thereby creating a low pressure environment suitable for substrate transfer. In operation, the ultra-high pressure reached in the first chamber 202 (e.g., greater than 10 atm, greater than 15 atm) requires a corresponding high pressure in the second chamber 204 (less than about 1 atm, e.g., approximately 0.85 atm or 640 Torr).

[0044]

[0048] A valve assembly 212 between the first chamber 202 and the second chamber 204 isolates the pressure in the first chamber 202 from the pressure in the second chamber 204. The high pressure environment in the first chamber 202 can thus be isolated and sealed from the low pressure environment in the second chamber 204. The valve assembly 212 can be opened to allow a substrate to be transferred directly from the first chamber 202 to the second chamber 204 or to allow a substrate to be transferred directly from the second chamber 204 to the first chamber 202.

[0045]

[0049] The high pressure system 200 includes a foreline 214 connected to one of the transfer chambers, e.g., the transfer chambers 102, 104, and connected to the external environment. An isolation valve 216 is disposed along the foreline 214 to isolate the pressure in the second chamber 204 from the pressure of the external environment. The isolation valve 216 may operate to regulate the pressure in the second chamber 204 and release gas in the second chamber 204. The isolation valve 216 may operate in conjunction with a vacuum processing system 208 to regulate the pressure in the second chamber 204. The isolation valve 216 may operate in conjunction with a gas supply system 206 and an exhaust system 211 to enhance the overall safety of the high pressure system 200 at the multi-polar point.

[0046]

[0050] Figure 3 is a schematic diagram of a high pressure processing system including pressure isolation for increased safety. Referring to Figure 3, one embodiment of a high pressure system 300 includes a first chamber 302 and a second chamber 304 as described with respect to Figures 1 and 2. The first chamber 302 and the second chamber 304 may be similar to the first chamber 202 and the second chamber 204, except as described below.

[0047]

[0051] The inner chamber includes a pedestal 318 that supports a substrate 326 to be processed, e.g., annealed or having a layer of material deposited thereon. The pedestal 318 is positioned or positionable within the first chamber 302. In some implementations, the substrate 326 rests directly on a flat upper surface of the pedestal 318. In some implementations, the substrate 326 rests on lift pins that protrude from the pedestal 318.

[0048]

[0052] The gas supply system 306 operates to receive gas from the gas supply system 306 to pressurize and depressurize the first chamber 302 establishing a high pressure, for example, a pressure of up to 75 psi or 80 psi. To pressurize the first chamber 302, the gas supply system 306 introduces gas into the first chamber 302. Gas is supplied from a first process gas supply module 342 to deliver a first high pressure gas and / or from a second process gas supply module 346 to deliver a second pressure gas of a different composition than the first high pressure gas. The first gas may be H2, and the first process gas supply module 342 is a high pressure H2 gas supply module. The second gas may be NH3, and the first process gas supply module 345 is a high pressure NH3 gas supply module 346. The gas supply system 306 may also introduce steam supplied from a high pressure steam supply module 344 into the first chamber 302 to increase the pressure within the first chamber 302. The supply modules 342, 344, 346 are connected to supply facilities or gas tanks that supply the respective gases. The supply modules 342, 344, 346 are connected to the first chamber 302 by a first supply line 352, a second supply line 354, and a third supply line 356.

[0049]

[0053] The first high pressure gas supply module 342 includes a first pump 372, and the second high pressure gas supply module 346 has a second pump 376. The first pump 372 incorporated in the first supply module 342 increases the pressure of the incoming first gas, e.g., hydrogen gas. The first gas can be supplied to the first gas supply module 342 at a relatively low pressure, e.g., 25-40 psi (approximately 1.7-2.7 atm). The first pump 372 can increase the pressure, in some cases, to a magnitude of up to 750 psi.

[0050]

[0054] Similarly, a second pump 376 associated with the second supply module 346 increases the pressure of the incoming second gas, e.g., ammonia gas. The gas can be supplied to the second supply module 346 at a relatively low pressure and can be increased by the second pump 376 to a pressure, e.g., greater than 10 atm, greater than 15 atm, or up to 50 atm. The first gas supply module 342 and the second gas supply module 346 each have an independent pump 372, 376. In some cases, only one pump is needed and is included in the system 300.

[0051]

[0055] The first and second gas supply modules 342, 346 with their respective pumps 372, 376, and the steam supply module 344 are housed in separate housings 362, 366, and 364, respectively. In some implementations, none of the respective housings may be physically and fluidly connected to promote safety of the system 300.

[0052]

[0056] To further enhance the safety of the system 300, each supply module 342, 344, 346 is enclosed within a containment assembly. The containment assembly includes at least one containment enclosure 360 ​​that surrounds the connections of the supply lines 352, 354, 356 to the chambers 302, 304.

[0053]

[0057] In some implementations, the containment assembly includes multiple components, each of which is a pressure containment enclosure that surrounds and encapsulates a respective gas supply module. For example, the first gas supply module 342 may be sealed in a first containment enclosure, the steam supply module 344 in a second enclosure, and the second gas supply module in a third enclosure. In some cases, these physically separate subcomponents of the containment assembly may correspond to housings 362, 364, 366.

[0054]

[0058] Alternatively, as shown, for example, in FIG. 3, the supply modules 342, 344, 346 may be enclosed by a common containment enclosure 360. In this case, the housings 362, 364, 366 may be part of the common containment enclosure 360. The housings 362, 364, 366 may be coupled to a portion 360a of the containment enclosure 360 ​​that seals the connections of the supply lines 352, 354, 356 with the chambers 302, 304. Specifically, the supply lines 352, 354, 356 may be sealed to respective conduits 352a, 354a, 356a that extend between the housings 362, 364, 366, respectively, and the portion 360a.

[0055]

[0059] The containment enclosure 360 ​​may also include an outer chamber 304 and may be fluidly connected to an exhaust system 311 that exhausts gas and steam from the second chamber 304. The exhaust system 311 includes an isolation valve 316 and a foreline 314.

[0056]

[0060] The containment enclosure 360 ​​may also include a containment exhaust line 368. The containment exhaust line 368 surrounds an exhaust line 370 for the first chamber 302, which connects the first chamber 302 to the exhaust system 311. The containment exhaust line 368 surrounds the exhaust line 370 and connects the containment enclosure 360 ​​to the exhaust system 311.

[0057]

[0061] Breach of any of the pressurized components within containment enclosure 360 ​​may be suppressed by containment enclosure 360. In some cases, exhaust line 368 routes the breaching gases to foreline 314 where they may be safely vented from system 300.

[0058]

[0062] Each supply line 352, 354, 356 is itself housed within a containment enclosure 360, and each supply line 352, 354, 356 has a pressure relief line within the containment enclosure 360. Any pressure that builds up in the supply lines 352, 354, 356 that is relieved by the pressure relief lines is bled to the containment enclosure 360 ​​and removed from the system 300, for example, by a containment exhaust line 368, or in some cases through a separate exhaust channel 369 connected to the exhaust system 311.

[0059]

[0063] System 300 also includes a pressure relief line 382 connected to inner chamber 302. If the pressure in inner chamber 302 exceeds an acceptable level, gas released by pressure relief line 382 can be diverted to outer chamber 304 and removed from system 300 by exhaust channel 369, or diverted to containment enclosure 360 ​​and removed from system 300 by containment exhaust line 368, or in some cases through a separate exhaust channel connected to exhaust system 311.

[0060]

[0064] Thus, all pressurized components are housed within containment enclosure 360, which allows system 300 to eliminate accidental leaks, ruptures, or breaches without even exposing the pressurized gas to the atmosphere.

[0061]

[0065] The system 300 includes multiple chemical sensors 380, e.g., gas sensors. Specifically, the gas sensors may be hydrogen sensors due to their volatility. The gas sensors 380 are installed at locations of potential leaks, e.g., in the containment enclosure 360 ​​and in the exhaust line 368. If any of the hydrogen sensors 380 detect a hydrogen leak, the controller detects a signal from the sensor 380 and shuts off the pumps 372, 376.

[0062]

[0066] In some cases, containment enclosure 360 ​​is connected to a foreline 314, which is connected to a dryline pump 378. In the event of a leak in a pressurized unit, such as one of supply lines 352, 354, 356, the leaking gas is sent to the foreline 314, which then flows through the dryline pump 378. To accommodate the pressure (e.g., to prevent the dryline pump 378 from breaching due to high pressure), the gas is allowed to expand before reaching the dryline pump 378. In some cases, the gas is flowed through a large diameter diffuser, such as a 20 inch by 5 foot tall diffuser.

[0063]

[0067] The second chamber 304 is maintained at a lower pressure, for example approximately 12 psi, than the first chamber 302. Any leakage of the second chamber 304 is also routed through the dry line pump 378.

[0064]

[0068] To process or deposit a layer of material on the substrate 326, the controller can operate the vacuum processing system to evacuate the second chamber 304 to a low pressure state, e.g., the second chamber 304 has a pressure less than 1 atmosphere, in preparation for transferring the substrate 326 through the second chamber 304. The low pressure state can be a near vacuum state, e.g., a pressure below 1 milliTorr. Moving the substrate 326 through the second chamber 304 by a transfer robot, e.g., one of the transfer robots 106, 108 of FIG. 1, while the second chamber 304 is at low pressure can prevent contamination and oxidation of the substrate 326.

[0065]

[0069] The substrate 326 is transferred to the first chamber 302 for processing. To transfer the substrate 326 into the first chamber 302, the controller can operate the valve assembly 212, e.g., to open the valve assembly 212, e.g., to provide an opening through which the substrate 326 can be transferred to the first chamber 302. The controller can operate the transfer robot to carry the substrate 326 into the first chamber 302 and place the substrate 326 on the pedestal 318.

[0066]

[0070] After the substrate 326 is transferred to the first chamber 302, the controller can operate the valve assembly 212 to close the openings, e.g., close the valve assembly 212, thereby isolating the first and second chambers 302, 304 from each other. When the valve assembly 212 is closed, the pressures of the first chamber 302 and the second chamber 304 can be set to different values. The controller can operate the gas supply system 306 to introduce gas into the first chamber 302 and pressurize the first chamber 302 to deposit a layer of material on the substrate 326. The introduction of gas can increase the pressure in the first chamber 302, e.g., to 10 atmospheres or more.

[0067]

[0071] The gas may be an annealing gas that reacts with a layer on the substrate 326. Alternatively, the gas may include a material to be deposited on the substrate 326. Appropriate temperature and pressure conditions in the first chamber 302 may anneal or deposit the material. During processing, e.g., during annealing or deposition, a controller may operate one or more heating elements 320 on the pedestal 318 to apply heat to the substrate 326 to facilitate processing of the layer of material on the substrate 326.

[0068]

[0072] Once processing of the material layer on the substrate 326 is complete, the substrate 326 can be removed from the first chamber 302 using the transfer robot and, if necessary, transferred to a subsequent processing chamber. To prepare for transferring the substrate 326 out of the first chamber 302, the controller can operate the exhaust system of the gas supply system 306 to reduce the pressure in the first chamber 302 before the valve assembly 212 is opened. In particular, gas is evacuated from the first chamber 302 to reduce the pressure in the first chamber 302 before transferring the substrate 326 out of the first chamber 302. The pressure can be reduced to near vacuum pressure such that the pressure difference between the first chamber 302 and the second chamber 304 can be minimized.

[0069]

[0073] A valve assembly 212 between the first chamber 202 and the second chamber 204 isolates the pressure in the first chamber 202 from the pressure in the second chamber 204. The high pressure environment in the first chamber 202 can thus be isolated and sealed from the low pressure environment in the second chamber 204. The valve assembly 212 can be opened to allow a substrate to be transferred directly from the first chamber 202 to the second chamber 204 or to allow a substrate to be transferred directly from the second chamber 204 to the first chamber 202.

[0070]

[0074] 4, the high pressure deposition system 400 further includes a valve assembly 416 between the first chamber 402 and the second chamber 404, similar to the valve assembly 212 of FIG. 2, that separates the first chamber 402 from the second chamber 404. The second chamber 404 may be defined by a volume between an inner wall 420 and an outer wall 424. In addition, the substrate 326 may also be supported on a pedestal 418 having a heater element 484. The substrate may be placed directly on the pedestal 418 or on a lift pin assembly 430 that extends through the pedestal.

[0071]

[0075] The valve assembly 416 is formed by an arm 425 that is movable relative to the inner wall 420 and base 422 of the first chamber 402. The arm 425 may be movable relative to the outer wall 420 and base 422 of the first chamber 402. Specifically, the valve assembly 416 includes a slit valve 423 between the first chamber 402 and the second chamber 404. The slit valve 423 includes a slit 423a and an arm 425. The slit 423a extends through one of the inner walls 420 of the first chamber 402. A vertical end 425a of the arm 425 is positioned outside the first chamber 402, while a horizontal end 425b of the arm 425 is positioned within the first chamber 402. The vertical end 425a of the arm 425 may be positioned within the second chamber 404 and moved by an actuator positioned within the second chamber 404. Alternatively, the vertical end 425a of the arm 425 may be positioned outside the second chamber 404 and thereby moved by an actuator 428 also positioned outside the second chamber 404.

[0072]

[0076] The arm 425 extends through the slit 423a and is movable relative to the wall 420 such that the arm 425 can be moved to a position to form a seal with the wall 420. An actuator 428 is coupled to the vertical end 425a of the arm 425 and moves the horizontal end 425b of the arm 425 relative to the wall 420. The arm 425 can be moved vertically to block or unblock the slit 423a. In particular, the vertical end 425a of the arm 425 can be or include a flange that extends substantially parallel to the inner surface of the adjacent inner wall 420. The arm 425 can also be moved laterally such that the horizontal end 425b of the arm 425 can be brought into or out of contact with the wall 420. The arm 425 can also extend through an aperture 426 in the outer wall 424.

[0073]

[0077] The valve assembly 416 is movable between an open position and a closed position. When the valve assembly 416 is in the open position, the horizontal end 425b of the arm 425 is laterally spaced from the wall 420, e.g., the inner surface of the wall 420. In addition, the horizontal end 425b of the arm 425 is vertically positioned so as not to block the slit 423a. The slit 423a thus provides an opening that allows fluid communication between the first chamber 402 and the second chamber 404 and also allows the substrate 326 to be moved in and out of the first chamber 402, e.g., by a robot, as described above. When the valve assembly 416 is in the closed position, the horizontal end 425b of the arm 425 blocks the slit 423a and contacts one of the walls 420 to form a seal separating the first chamber 402 from the second chamber 404. When pressurized, the flange or horizontal edge 425b contacts the inner surface of the wall 420 that defines the first chamber 402. An O-ring is placed along the periphery of the horizontal edge 425b on the surface that contacts the wall 420 to help enhance the seal of containment when the first chamber 402 is pressurized.

[0074]

[0078] A heater element 484 on the pedestal 418 heats the gas in the first chamber 402 to up to 250° C. To prevent damage to the O-rings, the arm 425 includes an internal gas channel 480. The internal gas channel 480 is a conduit that is fed from a cooling gas supply 482 and flows cooling gas through the arm 425. The internal gas channel 480 may extend through the horizontal end 425 b, or may extend through both the horizontal end 425 b and the vertical end 425 a. The internal gas channel and cooling gas supply 482 may be configured such that when the valve assembly 416 is in the open position, gas from the cooling gas supply 482 is unavailable, preventing the flow of cooling gas when substrate transfer is occurring.

[0075]

[0079] 5, the lift pin assembly 430 may be incorporated into a pedestal 500 along with a heating element. The pedestal 500 may correspond, for example, to one of the pedestals 418 described. The pedestal 500 includes a lift pin assembly 502 (e.g., lift pin assembly 430) having lift pins 504 at least partially disposed in openings 506 defined in a plate 508. The lift pins 504 are used to lift a substrate from the pedestal 500 so that a transfer robot, such as one of the transfer robots 106, 108, can access the substrate and move it out of the chamber. The lift pins 504 are moved by an actuator 505 from a first position in which the lift pins 504 are retracted into the pedestal 500 to a second position in which the lift pins 504 are protruding from the pedestal 500.

[0076]

[0080] Due to radiation and conduction from the pedestal, the area around the lift pin assembly 502 heats up, e.g., to 150° C. or 200° C. Various cooling mechanisms are possible for the lift pin assembly 502. In one example, a wall 524 may have gas channels 520 that deliver a cooling gas (e.g., H2 at less than 100° C.) to the area of ​​the lift pin assembly 502.

[0077]

[0081] Several embodiments of the present invention have been described. Nevertheless, it should be understood that various modifications can be made without departing from the spirit and scope of the present invention. For example, although the above describes the formation of the metal silicide layer from a cobalt or nickel film, in some implementations, other materials can be used. For example, other materials for forming the metal silicide material described herein can include titanium, tantalum, tungsten, molybdenum, platinum, iron, niobium, palladium, and combinations thereof, as well as nickel-cobalt alloys, cobalt-tungsten alloys, cobalt-nickel-tungsten alloys, doped cobalt and nickel alloys, or other alloys including nickel-iron alloys.

[0078]

[0082] Although described above with respect to a deposition system, a high pressure chamber may also be used for an etching system, depending on the gases provided. Alternatively, the high pressure chamber may be filled with an inert gas and used only for thermal processing at high pressure. The processing platforms described herein may include other types of processing chambers. For example, the processing platform may include an etching chamber for etching a pattern onto the surface of a substrate.

[0079]

[0083] The different chambers of the processing platform may each have different pressure environments ranging from near vacuum to over 50 atmospheres. Isolation valves between the chambers, e.g., vacuum valves, allow for pressure isolation from each other so that these different pressure environments can be maintained within each chamber.

[0080]

[0084] Accordingly, other embodiments are within the scope of the following claims.

Claims

1. A first chamber comprising one or more gas channels and a pedestal configured to hold a substrate within an interior region of the first chamber during processing, the pedestal comprising: One or more plates, and a lift pin assembly having lift pins disposed at least partially within openings in the one or more plates, the lift pins configured to move the substrate relative to a surface of the one or more plates, and the one or more gas channels configured to receive a cooling gas to cool the lift pins. a first chamber comprising: a second chamber surrounding the first chamber; a valve assembly between the first chamber and the second chamber, the valve assembly configured to isolate the first chamber from the second chamber; a supply line connecting the first chamber through an interior of the second chamber and configured to provide one or more gases to the first chamber while a substrate to be processed is disposed on the pedestal and the valve assembly is closed to pressurize the interior of the first chamber to a pressure higher than the interior of the second chamber during the processing; an exhaust line configured to exhaust the one or more gases from the first chamber, the exhaust line passing through an interior of the second chamber and connecting to the first chamber; a containment enclosure enclosing a connection between the supply line and the second chamber and a connection between the exhaust line and the second chamber; and A high pressure processing system comprising:

2. The high pressure processing system of claim 1 , wherein the one or more gas channels are disposed within a first wall of the first chamber.

3. 10. The high pressure processing system of claim 1, wherein said pedestal further comprises a plurality of heater elements configured to heat a gas in said first chamber.

4. 10. The high pressure processing system of claim 1, further comprising a foreline configured to remove gas from said second chamber, said containment enclosure being connected to said foreline and configured to deliver one or more of said breaching gases of said supply line and said exhaust line to said foreline.

5. 2. The high pressure processing system of claim 1, wherein the first chamber further comprises a first wall, and the valve assembly comprises an arm disposed in a slit in the first wall, the arm including an end configured to contact an interior portion of the first wall to isolate the first chamber from the second chamber.

6. The high pressure processing system of claim 5 , wherein said arm of said valve assembly extends through an aperture in a second wall of said second chamber.

7. Central chamber, 1. A high pressure processing system comprising: A first chamber comprising one or more gas channels and a pedestal configured to support a substrate within an interior region of the first chamber during processing, the pedestal comprising: One or more plates, and a lift pin assembly having lift pins disposed at least partially within openings in the one or more plates, the lift pins configured to move the substrate relative to a surface of the one or more plates, and the one or more gas channels configured to receive a cooling gas to cool the lift pins. a first chamber comprising: a second chamber surrounding the first chamber; a valve assembly between the first chamber and the second chamber, the valve assembly configured to isolate the first chamber from the second chamber; a supply line connecting the first chamber through an interior of the second chamber and configured to provide one or more gases to the first chamber while a substrate to be processed is disposed on the pedestal and the valve assembly is closed to pressurize the interior of the first chamber to a pressure higher than the interior of the second chamber during the processing; an exhaust line configured to exhaust the one or more gases from the first chamber, the exhaust line passing through an interior of the second chamber and connecting to the first chamber; a containment enclosure enclosing a connection between the supply line and the second chamber and a connection between the exhaust line and the second chamber; and A high pressure processing system comprising: a transfer robot positioned within the central chamber and configured to load the substrate by transferring the substrate from the central chamber through the second chamber and the valve assembly onto the pedestal; A semiconductor manufacturing apparatus comprising:

8. The semiconductor manufacturing apparatus of claim 7 , wherein the one or more gas channels are disposed within a first wall of the first chamber.

9. 8. The semiconductor manufacturing apparatus of claim 7, wherein the pedestal further comprises a plurality of heater elements configured to heat a gas in the first chamber.

10. 8. The semiconductor manufacturing apparatus of claim 7, wherein the high pressure processing system further comprises a foreline configured to remove gas from the second chamber, the containment enclosure being connected to the foreline and configured to deliver one or more of the breaching gases of the supply line and the exhaust line to the foreline.

11. 8. The semiconductor manufacturing apparatus of claim 7, wherein the first chamber further comprises a first wall, and the valve assembly comprises an arm disposed in a slit in the first wall, the arm including an end configured to contact an inner portion of the first wall to isolate the first chamber from the second chamber.

12. 12. The semiconductor manufacturing apparatus of claim 11, wherein the arm of the valve assembly extends through an aperture in a second wall of the second chamber.

13. 1. A method of operating a processing system, comprising: positioning lift pins of a lift pin assembly of a pedestal in an extended position relative to a surface of the pedestal disposed within an interior region of the first chamber; loading the substrate onto the lift pins by transferring the substrate by a robot through a second chamber surrounding the first chamber and a valve assembly disposed between the first chamber and the second chamber; positioning the lift pins in a retracted position relative to the surface of the pedestal; closing the valve assembly to isolate the substrate in the first chamber from an interior of the second chamber; providing a cooling gas to one or more gas channels in the pedestal to cool the lift pins; providing a first gas to the first chamber via a supply line that passes through an interior of the second chamber and connects to the first chamber; processing the substrate in the first chamber while the interior of the first chamber is pressurized to a pressure higher than the interior of the second chamber; exhausting the first gas from the first chamber through an exhaust line that passes through the interior of the second chamber and connects to the first chamber; Including, The method of claim 1, wherein the connection between the supply line and the second chamber and the connection between the exhaust line and the second chamber are contained within a containment enclosure.

14. The method of claim 13 , wherein the one or more gas channels are disposed within a first wall of the first chamber.

15. The method of claim 13 , further comprising heating a gas in the first chamber with a heater element of the pedestal.

16. The method of claim 13 , further comprising directing one or more of the breaching gases of the supply line and the exhaust line from the containment enclosure to a foreline.

17. 14. The method of claim 13, wherein closing the valve assembly includes contacting an end of an arm of the valve assembly with an inner portion of a first wall of the first chamber, the arm being disposed within a slit in the first wall.

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