Method for adjusting thermal uniformity in wafer placement table and method for manufacturing wafer placement table

Abstract

The present invention provides a method that makes it possible to adjust thermal uniformity in a placement surface after production of a wafer mounting base. Performed are: a) a step for preparing a wafer mounting base comprising a ceramic substrate that is provided with a placement surface for a wafer and that can be energized and heated and a cooling plate that is joined to the ceramic substrate and that enables cooling via a coolant supplied to a flow path, wherein the cooling plate is constituted by a base part that is provided with a flow path and a cover part that is attachable to and removable from the base part, and that enables opening of the flow path by being removed from the base part; b) a step for attaching the cover part to the base part and measuring a temperature distribution while performing energizing / heating and cooling; c) a step for removing the cover part and locally adjusting flow path shape when the temperature distribution does not satisfy a prescribed criterion; and d) a step for re-measuring the temperature distribution of the wafer mounting base which has an adjusted flow path shape, while performing energization / heating and cooling after attaching the cover part to the base part. Steps c) and d) are repeated until the re-measured temperature distribution satisfies the prescribed criterion.

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