Expanding Device

Abstract

To provide an expand device that is configured to fracture an adhesive film adhering to a work-piece while cooling the film, which can suppress condensation from occurring when fracturing the adhesive film.SOLUTION: A gas adjusted so that a dew-point becomes lower than a temperature of a cooling table 22 at the time of fracturing an adhesive film and so that the temperature becomes higher than a dew-point in the atmosphere is supplied to a contact surface 22a, a back surface 22b and an outer peripheral surface 22c of the cooling table 22 for cooling the adhesive film adhering to a work-piece. This can suppress condensation from occurring on the contact surface 22a, the back surface 22b and the outer peripheral surface 22c of the cooling table as well as on a surface of a constitutive element of an expand device that approaches the cooling table, when making an expand sheet adhering to the adhesive film expand to fracture the adhesive film, so that probabilities that operation defect of a device formed on the surface of the work-piece and a failure of the expand device which are caused by water droplets generated by condensation occur, can be reduced.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to an expanding device. [Background technology]

[0002] Chips having devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations) are manufactured by dividing a workpiece such as a wafer made of silicon (Si) on which devices are formed in each area defined by dividing lines (streets) on the surface. Such a workpiece is divided, for example, in the following order:

[0003] First, a laser beam is irradiated along the planned dividing line of the workpiece to form a modified layer inside the workpiece, and an expandable sheet (dicing tape) is attached to the workpiece on which the modified layer has been formed. Next, an expandable sheet is expanded using an expander to apply an external force to the workpiece attached to the expandable sheet. As a result, the modified layer becomes the breakage starting point, and the workpiece is divided along the planned dividing line.

[0004] Furthermore, the chips produced by dividing the workpiece may be fixed to other chips or a substrate, etc. In such a case, it may be necessary to divide the workpiece with an adhesive film attached thereto for fixing the chips to the substrate, etc.

[0005] However, such adhesive films are generally made of materials with low elasticity such as resins, etc. Therefore, even if an expandable sheet attached to a workpiece via an adhesive film is expanded using an expansion device, the adhesive film may not be stretched to break.

[0006] In such a case, a method for dividing the adhesive film while suppressing deformation thereof is known in which an expandable sheet (protective tape) attached to the workpiece via the adhesive film is expanded while the adhesive film is cooled (see, for example, Patent Document 1). Specifically, in this method, the area of ​​the expandable sheet where the adhesive film is attached is brought into contact with a cooling table, and the cooling table is cooled to cool the adhesive film. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2006-49591 A Summary of the Invention [Problem to be solved by the invention]

[0008] In order to expand the expand sheet and break the adhesive film, for example, it is necessary to cool the adhesive film to 0° C. Therefore, in the above-mentioned method, the cooling table in contact with the adhesive film is cooled to below 0° C.

[0009] In this case, condensation may occur on the surface of the cooling table and / or on the surfaces of components of the expanding device adjacent to the cooling table, and the water droplets caused by this condensation may wet the device formed on the surface of the workpiece, causing the device to malfunction and may also cause the expanding device to break down.

[0010] In view of this, the object of the present invention is to provide an expanding device that breaks an adhesive film attached to a workpiece while cooling it, and that can suppress the occurrence of condensation when breaking the adhesive film. [Means for solving the problem]

[0011] According to one aspect of the present invention, there is provided an expanding device that expands an expandable sheet, which covers an opening of a ring-shaped frame, of a workpiece unit having a device formed in an area partitioned by a planned division line on the surface, via an adhesive film attached to the back surface of the workpiece, and breaks the adhesive film along the planned division line. The expanding device includes an expansion unit that holds the frame of the workpiece unit and expands the expandable sheet, a disk-shaped cooling table having a contact surface that contacts the area attached to the workpiece via the adhesive film of the expandable sheet while the frame is held by the expansion unit, a back surface that is the back surface of the contact surface, and an outer peripheral surface located between the contact surface and the back surface, and a dry gas supply unit that supplies gas adjusted to have a dew point lower than the temperature of the cooling table when the adhesive film is broken and a temperature higher than the dew point of the atmosphere to the contact surface, the back surface, and the outer peripheral surface of the cooling table.

[0012] Preferably, the expansion device is provided with a cover member fixed to the cooling table and facing the back surface and the outer peripheral surface through a gap, and the cooling table has a through hole formed therein that penetrates from the back surface to the corresponding contact surface, and the gas is supplied to the gap and the through hole.

[0013] The expanding device preferably includes a dew point measuring unit for measuring the dew point of the gas, a cooling unit for cooling the cooling table, and a control unit for controlling the cooling unit to stop cooling the cooling table when the dew point of the gas measured by the dew point measuring unit exceeds a threshold value.

[0014] Alternatively, the expansion device preferably comprises a dew point measuring unit that measures the dew point of the gas, an alarm unit that notifies information relating to the dew point of the gas, and a control unit that controls the alarm unit to notify that the dew point of the gas has exceeded a threshold value when the dew point of the gas measured by the dew point measuring unit exceeds a threshold value.

[0015] Preferably, the expanding device includes a hot air injection unit for injecting hot air toward a region of the expanding sheet between the outer peripheral edge of the workpiece and the inner peripheral edge of the frame. Effect of the Invention

[0016] In the expanding device of the present invention, a gas adjusted to have a dew point lower than the temperature of the cooling table when the adhesive film is broken and higher than the dew point of the atmosphere can be supplied to the contact surface, back surface and outer peripheral surface of the cooling table for cooling the adhesive film attached to the workpiece.

[0017] This makes it difficult for condensation to occur on the contact surface, back surface, and outer peripheral surface of the cooling table and on the surfaces of the components of the expanding device adjacent to the cooling table when, and before and after, the expanding sheet attached to the adhesive film is expanded to break the adhesive film. As a result, the probability of malfunction of the device formed on the surface of the workpiece and failure of the expanding device due to water droplets caused by condensation is reduced. [Brief description of the drawings]

[0018] [Figure 1] FIG. 1 is a perspective view showing a schematic diagram of a workpiece unit including a workpiece. [Diagram 2] FIG. 2 is a functional block diagram illustrating an example of components of the expanding device. [Diagram 3] FIG. 3 is a cross-sectional view that illustrates the expansion unit, the cooling table, and the like. [Figure 4] FIG. 4 is a bottom view diagrammatically illustrating the contact surface of the cooling table. [Diagram 5] FIG. 5 is a block diagram showing a schematic diagram of the connection relationship between the cooling table, the dry gas supply unit, the lifting unit, and the cooling unit. [Figure 6] FIG. 6 is a functional block diagram illustrating another example of components of the expanding device. [Figure 7]FIG. 7 is a functional block diagram illustrating another example of components of the expanding device. [Figure 8] FIG. 8 is a block diagram showing a schematic connection relationship between the cooling table and the suction unit and the like. [Figure 9] FIG. 9 is a cross-sectional view that typically shows the hot air ejection unit and the like. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the accompanying drawings, in which: Fig. 1 is a perspective view showing a schematic diagram of a workpiece unit including a workpiece to be divided by an expanding device of the present embodiment.

[0020] The workpiece unit 1 shown in Fig. 1 includes a disk-shaped workpiece 11. The workpiece 11 is, for example, a wafer made of a semiconductor material such as silicon (Si). A front surface 11a of the workpiece 11 is partitioned into a plurality of regions by a plurality of mutually intersecting division lines (streets) 13, and a device 15 such as an IC is formed in each region.

[0021] In this embodiment, a disk-shaped wafer made of a semiconductor material such as silicon is used as the workpiece 11, but there are no limitations on the material, shape, structure, size, etc. of the workpiece 11. For example, a substrate made of other materials such as semiconductors, ceramics, resins, and metals can also be used as the workpiece 11. Similarly, there are no limitations on the type, number, shape, structure, size, arrangement, etc. of the devices 15. In addition, the devices 15 do not have to be formed on the workpiece 11.

[0022] In addition, inside the workpiece 11, a modified layer 17 is formed along the intended division line 13. The modified layer 17 is formed, for example, by irradiating the workpiece 11 along the intended division line 13 with a laser beam that has a wavelength that transmits through the workpiece 11 and has a focal point positioned inside the workpiece 11.

[0023] An expandable sheet 23 is attached to the back surface 11b of the workpiece 11 via an adhesive film 21. The adhesive film 21 is a film-like adhesive typically called a die attach film (DAF) or the like, and generally has a disk-like shape with a diameter larger than that of the workpiece 11. The adhesive film 21 is formed using, for example, a resin that hardens by heat or light, and has a function of fixing chips obtained by dividing the workpiece 11 to any target (for example, another chip or a substrate).

[0024] The expandable sheet 23 attached to the back surface 11b of the workpiece 11 via the adhesive film 21 is a resin film that expands when force is applied, and has, for example, a disk-like shape with a diameter larger than that of the adhesive film 21. Furthermore, the outer peripheral portion of the expandable sheet 23 is attached to an annular frame 25 with an inner diameter larger than that of the workpiece 11 and the adhesive film 21.

[0025] In the workpiece unit 1 shown in Fig. 1, the adhesive film 21 and the expandable sheet 23 are overlapped and attached to the workpiece 11 so that the adhesive film 21 contacts the back surface 11b of the workpiece 11. Furthermore, the outer peripheral portion of the expandable sheet 23 is attached to the frame 25 to close the opening of the frame 25. As a result, the workpiece 11 is supported by the frame 25 via the adhesive film 21 and the expandable sheet 23.

[0026] Fig. 2 is a functional block diagram showing an example of components of an expanding device. The expanding device 2 shown in Fig. 2 has an expanding unit 10 for expanding the expanding sheet 23 of the workpiece unit 1 shown in Fig. 1 to divide the workpiece 11 and the adhesive film 21 along the planned dividing line 13, and a cooling table 22 for cooling the adhesive film 21 of the workpiece unit 1.

[0027] 3 is a cross-sectional view showing the expansion unit 10 and the cooling table 22 included in the expanding device 2. The expansion unit 10 has a plurality of (for example, four) cylinder cases 12 each fixed to a housing (not shown) of the expanding device 2.

[0028] The lower end of the piston rod 14 is inserted into the upper surface of the cylinder case 12. Note that Fig. 3 shows the piston rod 14 in a state where it is positioned at a carry-in position, which is a position where the workpiece unit 1 can be carried into the expanding device 2. Also, the piston rod 14 can move upward from the carry-in position.

[0029] An annular support table 16 capable of supporting a frame 25 of the workpiece unit 1 shown in Fig. 1 is fixed to the upper end of the piston rod 14. Furthermore, an annular fixed plate 18 is disposed above the support table 16.

[0030] The fixed plate 18 is supported by a housing (not shown) of the expanding device 2 so as to be movable upward. Specifically, the fixed plate 18 is supported so as to be separated from the support table 16 when the piston rod 14 is in the carry-in position.

[0031] Then, when the piston rod 14 moves upward with the frame 25 of the workpiece unit 1 supported by the support table 16, the fixing plate 18 comes into contact with the frame 25 to fix the frame 25 on the support table 16. When the piston rod 14 moves further upward, the fixing plate 18 moves upward together with the support table 16 and the frame 25.

[0032] A cylindrical drum 20 fixed to a housing (not shown) of the expanding device 2 is provided inside the fixed plate 18. The lower end of the drum 20 is located at approximately the same height as the lower surface of the fixed plate 18 when the piston rod 14 is in the loading position, for example.

[0033] 3, the piston rod 14 can be moved upward with the frame 25 of the workpiece unit 1 fixed between the support table 16 and the fixed plate 18. The expansion unit 10 can also maintain the position of the piston rod 14 when the cooling table 22 is lowered.

[0034] That is, the expansion unit 10 can relatively move the frame 25 of the workpiece unit 1 and the cooling table 22. Then, by moving the cooling table 22 and the frame 25 in contact with the fixed plate 18 so that they move away from each other, the expand sheet 23 of the workpiece unit 1 is expanded.

[0035] A cylindrical support rod 30 made of metal or the like is disposed inside the drum 20. The support rod 30 is supported by a housing (not shown) of the expanding device 2 in a manner that allows it to rise and fall, as described later. The lower end of the support rod 30 is fixed to the cooling table 22. The support rod 30 also functions as a medium for absorbing heat from the cooling table 22 and cooling the cooling table 22, as described later.

[0036] The cooling table 22 is made of a metal (e.g., aluminum (Al)) or the like and has a disk shape. The lower surface of the cooling table 22 serves as a contact surface (lower surface) 22a that contacts the area of ​​the expand sheet 23 attached to the workpiece 11 via the adhesive film 21.

[0037] Fig. 4 is a bottom view that typically illustrates the contact surface 22a of the cooling table 22. As illustrated in Fig. 4, the contact surface 22a of the cooling table 22 is provided with a plurality of concentric circular grooves 24 and a plurality of radial grooves 26 that connect pairs of adjacent circular grooves 24. The circular grooves 24 and the radial grooves 26 are provided to have the same depth (e.g., 2.3 mm). The circular grooves 24 are also provided such that the interval between a pair of adjacent circular grooves 24 is one of two predetermined distances (e.g., 3 mm and 5 mm).

[0038] Furthermore, a plurality of through holes 28 are opened in the bottom surface of the radial grooves 26. Each of the plurality of through holes 28 penetrates from the back surface 22b, which is the back surface of the contact surface 22a of the cooling table 22, to the contact surface 22a. As described later, the plurality of through holes 28 function as a supply path for supplying the dry gas to the contact surface 22a.

[0039] In addition, a cover member 34 made of resin or the like is fixed to the cooling table 22. The cover member 34 has a disk-shaped rear cover portion 34a with a circular lower surface. The lower surface of the rear cover portion 34a faces the rear surface 22b of the cooling table 22 via a gap 32. An opening 34b penetrating the rear cover portion 34a in the thickness direction is provided in the central region of the rear cover portion 34a, and the support rod 30 is inserted into the opening 34b.

[0040] A joint hole penetrating the rear cover part 34a in the thickness direction is provided in each of a plurality of regions of the rear cover part 34a located directly above a plurality of through holes 28 of the cooling table 22. A cylindrical joint 36 is inserted into the joint hole, and the inside of the joint 36 communicates with the through hole 28.

[0041] Furthermore, the cover member 34 has a cylindrical outer peripheral surface cover portion 34c extending downward from the outer peripheral edge of the back surface cover portion 34a. The inner peripheral surface of the outer peripheral surface cover portion 34c faces the outer peripheral surface 22c between the contact surface 22a and the back surface 22b of the cooling table 22 via the gap 32.

[0042] The cover member 34 also has a cylindrical joint insertion portion 34d extending upward from the inner peripheral edge of the rear cover portion 34a. An upper portion of the joint insertion portion 34d is fixed to the support rod 30 so as to close the gap 32. The joint insertion portion 34d also has a joint hole that penetrates the joint insertion portion 34d in the radial direction. A cylindrical joint 38 is inserted into this joint hole, and the inside of the joint 38 communicates with the gap 32.

[0043] The cooling table 22 is connected to a dry gas supply unit 40, a lifting unit 42, and a cooling unit 44. Fig. 5 is a block diagram showing a schematic diagram of the connection relationship between the cooling table 22, the dry gas supply unit 40, the lifting unit 42, and the cooling unit 44.

[0044] The dry gas supply unit 40 is connected to the valve 46 and the joint 36 via a pipe (not shown) or the like. Therefore, by opening the valve 46, the dry gas supply unit 40 can supply dry gas to the contact surface 22a of the cooling table 22 via the valve 46, the joint 36, and the through-hole 28.

[0045] Moreover, the dry gas supply unit 40 is connected to the valve 48 and the joint 38 via a pipe (not shown) or the like. Therefore, by opening the valve 48, the dry gas supply unit 40 can supply dry gas to the back surface 22b and the outer circumferential surface 22c of the cooling table 22 via the valve 48, the joint 38, and the gap 32.

[0046] The dry gas is adjusted so that its dew point is lower than the temperature of the cooling table 22 when the expansion unit 10 expands the expand sheet 23 of the workpiece unit 1 held on the contact surface of the cooling table 22 to break the adhesive film 21, and its temperature is higher than the dew point of the atmosphere. The dry gas supply unit 40 is composed of, for example, a cylinder containing dry gas and a compressor for adjusting the pressure of the dry gas.

[0047] The lifting unit 42 is connected to the cooling table 22 via the support rods 30 and the like. The lifting unit 42 can bring the contact surface 22a of the cooling table 22 into contact with the expand sheet 23 of the workpiece unit 1, for example, by lowering the cooling table 22 via the support rods 30 and the like. The lifting unit 42 is composed of, for example, a motor and a ball screw driven by the motor.

[0048] The cooling unit 44 is connected to the cooling table 22 via the support rods 30 and the like. The cooling unit 44 can cool the adhesive film 21 via the expand sheet 23 by, for example, absorbing heat from the support rods 30 and cooling the cooling table 22 while the workpiece unit 1 is held on the contact surface 22a of the cooling table 22. The cooling unit 44 is, for example, configured by a piston cooler or the like.

[0049] The operations of the expansion unit 10, the dry gas supply unit 40, the lifting unit 42, and the cooling unit 44 are controlled by a control unit 50. The control unit 50 includes, for example, a processing unit 52 that generates signals for controlling the components of the expansion device 2, and a storage unit 54 that stores various information (data, programs, etc.) used in the processing unit 52.

[0050] The function of the processing unit 52 is realized by a CPU (Central Processing Unit) or the like that reads and executes programs stored in the storage unit 54. The function of the storage unit 54 is realized by at least one of a semiconductor memory such as a DRAM (Dynamic Random Access Memory), an SRAM (Static Random Access Memory), or a NAND-type flash memory, and a magnetic storage device such as a HDD (Hard Disk Drive).

[0051] The control unit 50 controls the operation of the components included in the expanding device 2 in response to a signal input from the input unit 56. The input unit 56 is configured with at least one of a touch panel, a keyboard, a mouse, a button, a microphone, and the like.

[0052] The input unit 56 can, for example, input a signal to the control unit 50 instructing the suppression of the occurrence of condensation in response to an operator's operation before the workpiece unit 1 is abutted against the abutment surface 22a of the cooling table 22.

[0053] When this signal is input, the control unit 50 opens the valves 46 and 48. Then, the control unit 50 controls the dry gas supply unit 40 so that the dry gas is supplied to the cooling table 22.

[0054] In this case, the dry gas supplied from the dry gas supply unit 40 is supplied to the contact surface 22a of the cooling table 22 via the valve 46, the joint 36, and the through hole 28, and is also supplied to the back surface 22b and the outer peripheral surface 22c of the cooling table 22 via the valve 48, the joint 38, and the gap 32.

[0055] Furthermore, the input unit 56 can input a signal to the control unit 50 instructing the control unit 50 to hold the workpiece unit 1 against the contact surface 22a of the cooling table 22 and expand the expand sheet 23 in response to an operator's operation.

[0056] When this signal is input, the control unit 50 controls the lifting unit 42 so that the contact surface 22a of the cooling table 22 contacts the expanded sheet 23 of the workpiece unit 1. Next, the control unit 50 controls the cooling unit 44 so that the cooling table 22 is cooled.

[0057] Then, the control unit 50 controls the expansion unit 10 and / or the lifting unit 42 to expand the expand sheet 23 of the workpiece unit 1. Specifically, the control unit 50 controls the expansion unit 10 and / or the lifting unit 42 to move the piston rod 14 of the expansion unit 10 upward and / or to lower the cooling table 22. As a result, the workpiece 11 and the adhesive film 21 of the workpiece unit 1 are divided along the intended division line 13.

[0058] In the expanding device 2, dry gas can be supplied to the contact surface 22a, back surface 22b and outer peripheral surface 22c of the cooling table 22 for cooling the adhesive film 21 attached to the workpiece 11, the dry gas being adjusted so that its dew point is lower than the temperature of the cooling table 22 when the adhesive film 21 is broken and its temperature is higher than the dew point of the atmosphere.

[0059] This makes it difficult for condensation to occur on the contact surface 22a, back surface 22b, and outer peripheral surface 22c of the cooling table 22 and the surfaces of the components of the expanding device 2 adjacent to the cooling table 22 when and before and after the expanding sheet 23 attached to the adhesive film 21 is expanded to break the adhesive film 21. As a result, the probability of malfunction of the device 15 formed on the surface of the workpiece 11 and failure of the expanding device 2 caused by water droplets caused by condensation is reduced.

[0060] Furthermore, the expanding device according to the present invention may include components other than those of the expanding device 2 shown in Fig. 2. Fig. 6 and Fig. 7 are functional block diagrams that show examples of the components of such an expanding device. Among the components of the expanding devices 60 and 66 shown in Fig. 6 and Fig. 7, the same components as those of the expanding device 2 are given the same reference numerals, and the description of these components will be omitted.

[0061] 6 includes a dew point measuring unit 62 for measuring the dew point of the dry gas supplied from the dry gas supply unit 40, and a notification unit 64 for notifying an operator of various information. The dew point measuring unit 62 is, for example, a dew point meter. The notification unit 64 is, for example, at least one of a display, a pilot lamp, a printer, and a speaker.

[0062] The dew point measuring unit 62 measures, for example, the dew point of the dry gas present in the gap 32 between the cooling table 22 and the cover member 34 shown in Fig. 3, and inputs the measured dew point to the control unit 50. In addition, the notification unit 64 notifies an operator of information related to the dew point of the dry gas.

[0063] 6 stores in advance the temperature of the cooling table 22 when it is cooled to break the adhesive film 21. If this temperature varies depending on the type of adhesive film 21, the storage unit 54 may store the type of adhesive film 21 and this temperature in association with each other.

[0064] Then, the processing unit 52 of the control unit 50 sets a threshold value of the dew point of the dry gas necessary to suppress the occurrence of condensation in advance. For example, if the temperature of the cooling table 22 when cooled to break the adhesive film 21 is T, the processing unit 52 sets any temperature included in the range of T-5°C to T-2°C as the dew point threshold value.

[0065] Here, when the dew point of the dry gas measured by the dew point measuring unit 62 is input to the control unit 50, the processing unit 52 compares this dew point with a threshold value. Then, when this dew point exceeds the threshold value, the processing unit 52 controls the cooling unit 44 to stop cooling the cooling table 22 and / or controls the notification unit 64 to notify an operator that this dew point has exceeded the threshold value.

[0066] Therefore, in the expanding device 60 shown in FIG. 6, when the dew point of the dry gas measured by the dew point measuring unit 62 exceeds a threshold value, cooling of the cooling table 22 is stopped and / or the operator is notified that the dew point has exceeded the threshold value.

[0067] This prevents condensation from occurring on the contact surface 22a, the back surface 22b, and the outer peripheral surface 22c of the cooling table 22, as well as on the surfaces of the components of the expanding device 60 adjacent to the cooling table 22. As a result, malfunction of the device 15 formed on the surface of the workpiece 11 and failure of the expanding device 60 due to water droplets caused by condensation are prevented.

[0068] The expanding device 66 shown in Figure 7 has a suction unit 68 that generates negative pressure on the contact surface 22a of the cooling table 22, and a hot air injection unit that injects hot air toward the area of ​​the expanding sheet 23 between the outer peripheral edge of the workpiece 11 of the workpiece unit 1 and the inner peripheral edge of the frame 25.

[0069] Fig. 8 is a block diagram showing a schematic diagram of the connection relationship between the cooling table 22 and the suction unit 68, etc. Although Fig. 8 shows the dry gas supply unit 40, the lifting unit 42, the cooling unit 44, etc., the description of these components will be omitted.

[0070] The suction unit 68 is connected to the valve 69 and the joint 36 via a pipe (not shown) or the like. In the expanding device 66 shown in Fig. 7, the through hole 28 functions not only as a supply path for supplying the dry gas to the contact surface 22a, but also as a suction path for sucking the gas and generating a negative pressure on the contact surface 22a.

[0071] Therefore, by closing the valve 46 and opening the valve 69, the suction unit 68 can generate a negative pressure on the contact surface 22a of the cooling table 22 through the valve 69, the joint 36, and the through-hole 28. The suction unit 68 is formed of, for example, an ejector.

[0072] Fig. 9 is a cross-sectional view that shows a schematic diagram of the hot air injection unit, etc. Although Fig. 9 shows the expansion unit 10 and the cooling table 22, etc., the description of these components will be omitted.

[0073] The hot air spray unit 70 shown in Fig. 9 has a heater plate 72. The heater plate 72 has a disk shape and is disposed inside the support table 16. The upper surface of the heater plate 72 is disposed lower than the lower surface of the support table. The heater plate 72 is rotated by a heater plate rotation motor 74 fixed to the housing (not shown) of the expanding device.

[0074] A plurality of hot air ejection units 76 are provided on the upper surface of the heater plate 72 to eject hot air against the expand sheet 23 between the outer peripheral edge of the workpiece 11 of the workpiece unit 1 and the inner peripheral edge of the frame 25. Specifically, the plurality of hot air ejection units 76 are provided at approximately equal intervals in the circumferential direction on the outer peripheral portion of the upper surface of the heater plate 72.

[0075] The hot air ejection unit 76 includes an ejection unit body 78 that is cylindrical and has an open top and a closed bottom, and a coil heater 80 that is housed in the ejection unit body 78. The hot air ejection unit 76 is connected to an air supply source (not shown) that supplies air into the ejection unit body 78. The two terminals of the coil heater 80 are connected to a switch (not shown) and a DC power source (not shown), and when this switch is in a conductive state, power is supplied from the DC power source to the coil heater 80, causing the coil heater 80 to generate heat.

[0076] A shutter plate 82 is provided above the hot air ejection unit 76. The shutter plate 82 has a disk shape with a diameter slightly smaller than the inner diameter of the support table 16, and is disposed inside the support table 16. The shutter plate 82 is rotated by a shutter plate rotation motor 84 attached to the heater plate 72. In addition, an opening 86 through which the hot air ejection unit 76 can be exposed is provided on the outer periphery of the shutter plate 82.

[0077] 7 to 9 operate after the expanding sheet 23 of the workpiece unit 1 is expanded by the expansion unit 10. That is, in the expanding device 66 shown in Fig. 7, after sucking the circular area of ​​the expanding sheet 23 held on the contact surface 22a of the cooling table 22, the slack generated in the annular area surrounding this circular area is relaxed.

[0078] Specifically, first, the valve 46 is closed and the valve 69 is opened, and the suction unit 68 generates a negative pressure on the contact surface 22a of the cooling table 22. As a result, the circular region of the expanded sheet 23 that is held by the contact surface 22a is sucked to the contact surface 22a.

[0079] Next, the shutter plate rotating motor 84 rotates the shutter plate 82 so that the opening 86 of the shutter plate 82 is positioned directly above the hot air jetting part 76. Next, an air supply source (not shown) connected to the hot air jetting part 76 supplies air into the jetting part main body 78.

[0080] At this time, the air supplied into the injection unit main body 78 is heated by the energized coil heater 80 to become hot air, which is then injected upward through the opening 86 of the shutter plate 82. As a result, the hot air is injected into the area of ​​the expand sheet 23 between the outer peripheral edge of the workpiece 11 of the workpiece unit 1 located above the opening 86 and the inner peripheral edge of the frame 25.

[0081] Next, the heater plate rotating motor 74 rotates the heater plate 72 together with the shutter plate 82 so that hot air is sprayed in the circumferential direction of the expand sheet 23.

[0082] As a result, the annular region of the expand sheet 23 onto which the hot air is sprayed is heated and contracts. That is, the slack generated in that region of the expand sheet 23 expanded by the expansion unit 10 is relaxed.

[0083] The expanding device according to the present invention may include all of the components shown in FIG. 2, the dew point measuring unit 62 and the notification unit 64 shown in FIG. 6, and the suction unit 68 and the hot air injection unit 70 shown in FIG.

[0084] In addition, the structures and methods according to the above-described embodiments and modifications can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0085] 1: Workpiece unit 11: Workpiece 13: Planned division line (street) 15: Device 17: Modified layer 21: Adhesive film 23: Expanded sheet 25: Frame 2: Expanding device 10: Expansion unit 12: Cylinder case 14: Piston rod 16: Support table 18:Fixed plate 20: Drums 22: Cooling table 22a: Contact surface 22b: Back 22c: Outer surface 24:Circular groove 26: Radial grooves 28:Through hole 30: Support rod 32: Gap 34: Cover member 34a: Rear cover part 34b: Opening 34c: Outer cover part 34d: Joint insertion part 36: Joint 38: Joint 40: Dry gas supply unit 42: Lifting unit 44: Cooling unit 46: Valve 48: Valve 50: Control unit 52: Processing section 54: Storage section 56: Input unit 60: Expanding device 62:Dew point measurement unit 64: Announcement unit 66: Expanding device 68: Suction unit 69: Valve 70: Hot air injection unit 72: Heater plate 74: Heater plate rotation motor 76: Hot air injection section 78: Injection part body 80: Coil heater 82: Shutter plate 84: Shutter plate rotation motor 86: Opening

Claims

1. An expanding device which, in a state in which a workpiece having a device formed in an area partitioned by a planned division line on the surface is attached to an expandable sheet that closes an opening of an annular frame via an adhesive film attached to the back surface of the workpiece as a workpiece unit, expands the expandable sheet, and breaks the adhesive film along the planned division line, an expansion unit that holds the frame of the workpiece unit and expands the expand sheet; a disk-shaped cooling table having a contact surface that contacts the area of ​​the expand sheet attached to the workpiece via the adhesive film when the frame is held by the expansion unit, a back surface that is the back side of the contact surface, and an outer peripheral surface located between the contact surface and the back surface; and a dry gas supply unit that supplies a gas adjusted to have a dew point lower than the temperature of the cooling table and a temperature higher than the dew point of the atmosphere when the adhesive film is broken to the corresponding contact surface, back surface, and outer peripheral surface of the cooling table. An expanding device characterized by the above.

2. a cover member fixed to the cooling table and facing the back surface and the outer circumferential surface through a gap; The cooling table has a through hole formed therein, the through hole passing through from the back surface to the corresponding contact surface, The expanding apparatus according to claim 1 , wherein the gas is supplied to the gap and the through hole.

3. a dew point measuring unit for measuring the dew point of the gas; a cooling unit for cooling the cooling table; The expanding device according to claim 1 or 2, further comprising: a control unit that controls the cooling unit to stop cooling the cooling table when the dew point of the gas measured by the dew point measuring unit exceeds a threshold value.

4. a dew point measuring unit for measuring the dew point of the gas; an alarm unit for alarming information regarding the dew point of the gas; 3. The expanding device according to claim 1 or 2, further comprising: a control unit that controls the alarm unit to notify the user that the dew point of the gas measured by the dew point measuring unit exceeds a threshold value when the dew point of the gas measured by the dew point measuring unit exceeds a threshold value.

5. 5. The expanding apparatus according to claim 1, further comprising a hot air blowing unit for blowing hot air against the area of ​​the expanding sheet between the outer peripheral edge of the workpiece and the inner peripheral edge of the frame.

Images