Semiconductor devices including trench structures and methods of fabrication - Patents.com

Abstract

To provide a semiconductor device including a trench structure and a manufacturing method thereof.SOLUTION: In a semiconductor device 100, a first conductive type source region 104 includes a first source portion region 1041, a second source portion region 1042, and a third source portion region 1043 directly adjacent to a contact 112 in a source contact area 113 of the first surface. The second source portion region is arranged vertically between the first source portion region and the third source portion region. A vertical doping concentration profile of the source region has a minimum doping concentration within the second source portion region and a maximum doping concentration within the third source portion region. Each of the second source portion region and the third source portion region overlaps the source contact area.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to semiconductor devices, and in particular to silicon carbide (SiC) semiconductor devices and fabrication methods therefor. [Background technology]

[0002] The technological development of SiC semiconductor devices, including field effect transistor cells, has focused on the blocking voltage capability between the source and drain, V DS without adversely affecting the on-state resistance R DS(on) The aim is to reduce the on-state resistance per unit area R. Although changing a particular device parameter may improve one device characteristic, this may lead to degradation of another device characteristic. As an example, the on-state resistance per unit area R DS(on) can be improved, for example, by increasing the drift zone doping concentration. However, this comes at the expense of the blocking voltage capability V between the source and drain. DS Therefore, device parameters are designed during technology development based on a number of trade-offs that must be satisfied in view of the target device specifications.

[0003] There is a need for improved semiconductor devices based on silicon carbide. Summary of the Invention [Means for solving the problem]

[0004] An embodiment of the present disclosure relates to a semiconductor device including a silicon carbide semiconductor body including a source region of a first conductivity type and a body region of a second conductivity type. The semiconductor device further includes a trench structure extending from a first surface into the silicon carbide semiconductor body along a vertical direction, the trench structure including a gate electrode and a gate dielectric. The semiconductor device further includes a contact electrically connected to the source region at the first surface. The source region includes a first source portion region directly adjacent to the contact at a source contact area of ​​the first surface, a second source portion region, and a third source portion region. The second source portion region is disposed between the first source portion region and the third source portion region along the vertical direction. A doping concentration profile of the source region along the vertical direction includes a doping concentration minimum in the second source portion region and a doping concentration maximum in the third source portion region. Each of the second source portion region and the third source portion region overlaps the source contact area.

[0005] Another embodiment of the present disclosure relates to another semiconductor device including a silicon carbide semiconductor body including a source region of a first conductivity type and a body region of a second conductivity type. The semiconductor device further includes a trench structure extending from the first surface into the silicon carbide semiconductor body along a vertical direction, the trench structure including a gate electrode and a gate dielectric. The trench structure is striped and extends along a longitudinal direction perpendicular to the vertical direction. The source region includes first source partial regions and second source partial regions alternately arranged along the longitudinal direction. A doping concentration profile of the first source partial region along the vertical direction is different from a doping concentration profile of the second source partial region along the vertical direction.

[0006] An embodiment of the present disclosure relates to a method of fabricating a semiconductor device. The method includes forming a source region of a first conductivity type and a body region of a second conductivity type in a silicon carbide semiconductor body. The method further includes forming a trench structure extending from a first surface into the silicon carbide semiconductor body along a vertical direction, the trench structure including a gate electrode and a gate dielectric. The method further includes forming a contact electrically connected to the source region at the first surface. The source region includes a first source portion region, a second source portion region, and a third source portion region immediately adjacent to the contact at a source contact area of ​​the first surface. The second source portion region is disposed between the first source portion region and the third source portion region along the vertical direction. A doping concentration profile of the source region along the vertical direction includes a doping concentration minimum in the second source portion region and a doping concentration maximum in the third source portion region. Each of the second source portion region and the third source portion region overlaps the source contact area.

[0007] An embodiment of the present disclosure relates to another method of fabricating a semiconductor device. The method includes forming a source region of a first conductivity type and a body region of a second conductivity type in a silicon carbide semiconductor body. The method further includes forming a trench structure extending from a first surface into the silicon carbide semiconductor body along a vertical direction, the trench structure including a gate electrode and a gate dielectric. The trench structure is striped and extends along a longitudinal direction perpendicular to the vertical direction. The source region includes first source partial regions and second source partial regions alternately arranged along the longitudinal direction. A doping concentration profile of the first source partial region along the vertical direction is different from a doping concentration profile of the second source partial region along the vertical direction.

[0008] Those skilled in the art will recognize additional features and advantages upon reading the following detailed description, and upon viewing the accompanying drawings.

[0009] The accompanying drawings are included to provide a further understanding of the present embodiments, and are incorporated in and constitute a part of this specification. The drawings illustrate present embodiments of a semiconductor device and a method of fabricating a semiconductor device, and together with the description, serve to explain the principles of the embodiments. Further embodiments and intended advantages will be readily appreciated as they become better understood by reference to the following detailed description. Further embodiments are described in the following detailed description and claims. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 illustrates a cross-sectional view of one embodiment of a silicon carbide semiconductor device including a source portion region. [Figure 2A] FIG. 2A is an exemplary graph illustrating a vertical doping profile along line AA' of the semiconductor device shown in FIG. [Figure 2B] FIG. 2B is an exemplary graph illustrating the vertical doping profile along line AA' of the semiconductor device shown in FIG. [Diagram 3] FIG. 3 is an exemplary graph for illustrating a lateral doping concentration profile along line BB' of the semiconductor device shown in FIG. [Figure 4] FIG. 4 illustrates a cross-sectional view of an embodiment of a silicon carbide semiconductor device including a source portion region. [Diagram 5] FIG. 5 illustrates a cross-sectional view of an embodiment of a silicon carbide semiconductor device including a source portion region. [Figure 6] FIG. 6 illustrates a schematic plan view of one embodiment of a silicon carbide semiconductor device including a source portion region. [Figure 7] FIG. 7 is an exemplary graph illustrating different vertical doping concentration profiles of adjacent source portion regions of the semiconductor device shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] In the following detailed description, reference is made to the accompanying drawings, which form a part of the description and in which specific embodiments in which a semiconductor device may be implemented are shown by way of example. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure. For example, features illustrated or described for one embodiment may be used on or in conjunction with other embodiments to yield still further embodiments. The present disclosure is intended to include such modifications and variations. Although the examples are described using specific language, such language should not be construed as limiting the scope of the appended claims. The drawings are not to scale and are for illustrative purposes only. Corresponding elements are designated by the same reference numerals in different drawings unless otherwise noted.

[0012] The terms "having," "containing," "including," "comprising," and the like are open, meaning that the terms indicate the presence of stated structures, elements, or features but do not exclude additional elements or features. The articles "a," "an," and "the" are intended to include both the plural and the singular, unless the context clearly dictates otherwise. When two elements are "adjoined" with one another, they may be in direct contact with one another, at least in some places (i.e., directly adjacent to one another), or they may be separated from one another by only a short distance. A short distance may be at most 100 nm, usually at most 20 nm or at most 10 nm.

[0013] The term "electrically connected" describes a permanent, low-resistance connection between the electrically connected elements, e.g., direct contact between the elements, or a low-resistance connection via metal and / or highly doped semiconductor material. The term "electrically coupled" includes that there may be one or more intervening element(s) between the electrically coupled elements adapted for signal and / or power transmission, e.g., an element that is controllable to temporarily provide a low-resistance connection in a first state and a high-resistance electrical decoupling in a second state.

[0014] The diagrams indicate relative doping concentrations by indicating a "-" or "+" next to the doping type "n" or "p". For example, "n-" means a doping concentration lower than that of an "n" doped region, while an "n+" doped region has a doping concentration higher than that of an "n" doped region. Doped regions of the same relative doping concentration do not necessarily have the same absolute doping concentration. For example, two different "n" doped regions may have the same or different absolute doping concentrations. Two directly adjacent doped regions of the same conductivity type but with different dopant concentrations form a unipolar junction along the interface between the two doped regions, e.g., an n / n+ or p / p+ junction. In a unipolar junction, the dopant concentration profile perpendicular to the unipolar junction may show a step or turning point where the dopant concentration profile changes from being concave to convex or vice versa.

[0015] Ranges given for physical dimensions are inclusive, for example a range for a parameter y from a to b is understood as a≦y≦b, a parameter y having a value of at least c is understood as c≦y, and a parameter y having a value of at most d is understood as y≦d.

[0016] An IGFET (insulated gate field effect transistor) is a voltage controlled device, including MOSFETs (metal oxide semiconductor FETs), as well as other FETs that have a gate electrode based on a doped semiconductor material and / or have a gate dielectric that is not, or is not necessarily, based solely on an oxide.

[0017] According to an embodiment, a semiconductor device may include a silicon carbide semiconductor body including a source region of a first conductivity type and a body region of a second conductivity type. The semiconductor device may further include a trench structure extending from the first surface into the silicon carbide semiconductor body along a vertical direction, the trench structure may include a gate electrode and a gate dielectric. The semiconductor device may further include a contact electrically connected to the source region at the first surface. The source region may include a first source portion region directly adjacent to the contact in a source contact area of ​​the first surface, a second source portion region, and a third source portion region. The second source portion region may be disposed between the first source portion region and the third source portion region along the vertical direction. A doping concentration profile of the source region along the vertical direction may include a doping concentration minimum in the second source portion region and a doping concentration maximum in the third source portion region. Each of the second source portion region and the third source portion region may overlap the source contact area.

[0018] The doping concentration maximum in the third source part region may be a local maximum. The doping concentration minimum in the second source part region may be a local, in particular a global, minimum. For example, the doping concentration profile of the source region may include a global maximum in the first source part region. In some embodiments, the maximum in the third source part region may be the second highest maximum of the doping concentration profile of the source region.

[0019] It may happen that the maximum in the third source part region and / or the minimum in the second source part region are not very pronounced. This may be the case if the doping concentration in the third source part region is relatively low (for example at most 60%) compared to the doping concentration in the first source part region, or if the maximum in the third source part region is close to the minimum in the second source part region, for example due to the overlap of different ion implantation doping profiles. In this case, due to the overlap of the doping concentrations in the first and second source part regions and the overlap of the doping concentrations in the second and third source part regions, the doping concentration profile may show a shoulder-like and / or flattened curve in the area of ​​the maximum in the third source part region and the minimum in the second source part region.

[0020] The first conductivity type may be n-type and the second conductivity type may be p-type. Alternatively, the first conductivity type may be p-type and the second conductivity type may be n-type.

[0021] The silicon carbide (SiC) semiconductor body may be a hexagonal phase of silicon carbide, e.g., 4H-SiC. The silicon carbide semiconductor body may have an off-orientation, e.g., in the <11-20> or <1-100> direction. The off-axis angle of the silicon carbide semiconductor body may be in the range of 2° to 8°, typically 4°. The first surface of the silicon carbide semiconductor body may be a main extension plane of the silicon carbide semiconductor body, subtended by the lateral direction. The vertical direction may extend perpendicular to the first surface and / or the lateral direction.

[0022] The trench structure may be perpendicular to the first surface or may taper with increasing distance to the first surface. For example, the taper angle of the trench gate structure relative to the vertical may be equal to the off-axis angle or may deviate from the off-axis angle by ±2 degrees or less (e.g., ±1 degree or less) such that at least a first of two opposing longitudinal mesa sidewalls of the SiC mesa is formed in a crystallographic plane with high charge carrier mobility, e.g., a {11-20} crystallographic plane.

[0023] The gate dielectric may separate the gate electrode from the silicon carbide semiconductor body along at least one side of the trench structure. The gate dielectric may include or consist of a thermally grown or deposited silicon oxide, silicon nitride, silicon oxynitride, another deposited dielectric material, or any combination thereof. The thickness of the gate dielectric may be selected to obtain a transistor cell having a threshold voltage, for example, in the range of 1.0V to 8V, for example, in the range of 3.0V to 7.0V. The trench structure may include exclusively the gate electrode and gate dielectric, or may include further conductive and / or dielectric structures in addition to the gate electrode and gate dielectric. The gate electrode and any optional additional auxiliary electrodes may include or consist of, for example, an electrode material, or a combination of electrode materials, for example, a doped semiconductor material (e.g., a degenerately doped semiconductor material), such as doped polycrystalline silicon, a metal, or a metal compound.

[0024] The first source partial region may be directly adjacent to the second partial region, and the second source partial region may be directly adjacent to the third source partial region. In other words, the first source partial region may not be spaced apart by a vertical distance from the second source partial region, and the second source partial region may not be spaced apart by a vertical distance from the third source partial region. Besides the first to third partial regions, the source region may also include further source partial regions, for example a fourth source partial region directly adjacent to the bottom side of the third source partial region. In some embodiments, the doping concentration minimum in the second source partial region may be formed by merging a first doping concentration tail decreasing from the first source partial region towards the third source partial region and a second doping concentration tail decreasing from the third source partial region towards the first source partial region. Thus, the first to third source regions may be defined by segments of the vertical doping concentration profile of the source region along the vertical direction, the segments being immediately adjacent to each other along the vertical direction. In some embodiments, the second source region may include two or more doping concentration minima and one or more doping concentration maxima. Any doping concentration maxima in the second source region may be smaller than the doping concentration maxima in the first and / or third source region. The doping concentration profile along the vertical direction may allow tuning the bulk resistance of the source region. The bulk resistance may be tuned to provide a voltage drop during a short circuit current load that may allow current filaments to be countered and the effective gate overvoltage to be reduced. When tuning the bulk resistance of the source region, a trade-off may also be considered, for example, between i) countering the current filaments and / or reducing the effective gate overvoltage during a short circuit current load by increasing the bulk resistance of the source region and ii) reducing the on-state resistance of the device by decreasing the bulk resistance of the source region.

[0025] In some embodiments, the doping concentration maximum in the third source partial region may be smaller than the doping concentration maximum in the first source partial region. The doping concentration maximum in the first partial region may be located at or a small vertical distance to the first surface. The small vertical distance may be, for example, a vertical distance of less than 50 nm, for example less than 30 nm or less than 10 nm. This may reduce or minimize the electrical contact resistance between the first source partial region and the contact. The contact may, for example, comprise or consist of a conductive material or a combination of conductive materials, for example a doped semiconductor material (e.g. a degenerately doped semiconductor material), such as doped polycrystalline silicon, a metal, or a metal compound.

[0026] When the second (third) source partial region overlaps the source contact area, the vertical projection of the second (third) source partial region onto the first surface at least partially coincides with the source contact area. In other words, in a plan view of the semiconductor device, the area of ​​the second (third) source partial region and the source contact area at least partially coincide. In the vertical direction, the source contact area may be located, for example, directly above the second and / or third source partial region. This allows a compact transistor cell design. Outside the source contact area, a dielectric may, for example, be directly adjacent to the first source partial region. The dielectric may also, for example, cover the top of the trench structure.

[0027] According to an embodiment of the semiconductor device, the gate electrode may directly face each of the first source partial region, the second source partial region, and the third source partial region. In other words, the gate electrode faces each of the first source partial region, the second partial region, and the third source partial region along a lateral direction parallel to the first main surface. Thus, a portion of the gate electrode is disposed at the same vertical distance to the first main surface as each of the first to third source partial regions. This may, for example, make it possible to reduce or minimize the gate resistance to the gate pad.

[0028] According to an embodiment of the semiconductor device, the doping concentration profile of the source region along the vertical direction may comprise a doping concentration valley in the second source part region and a doping concentration peak in the third source part region. The doping concentration peak may be generated, for example, by an ion implantation process of dopants through the first surface. The doping valley in the second source part region may be generated, for example, by merging a first doping concentration tail decreasing from the first source part region towards the third source part region and a second doping concentration tail decreasing from the third source part region towards the first source part region. By adjusting the doping tail, for example, the bulk resistance of the source region may be optimized.

[0029] According to an embodiment of the semiconductor device, the lateral extent of the second source partial region may be defined between i) an interface to the sidewall of the trench structure and ii) a pn junction to the body region. The doping concentration profile of the second source partial region may be constant along at least 80% of the lateral extent. In other words, the second source partial region may not be divided into a plurality of partial regions with different doping concentrations. The second source region may therefore be formed by a single photolithography process, including, for example, one or more ion implantation processes requiring a mask on the first surface. This may allow, for example, a simple and cost-effective adjustment of the bulk resistance of the source.

[0030] According to an embodiment of the semiconductor device, the minimum doping concentration in the second source region may be in the range of at least 0.01% to at most 50% of the maximum doping concentration in the third source region, or in the range of 0.1% to at most 50% or 1% to at most 30% of the maximum doping concentration in the third source region, thereby optimizing, for example, the bulk resistance of the source region.

[0031] According to an embodiment of the semiconductor device, the vertical extent of the second source region may be in the range of at least 30 nm to at most 500 nm, or at least 50 nm to at most 200 nm, or at least 80 nm to at most 150 nm. The vertical extent may be adjusted, for example, depending on the doping concentration to set a desired bulk resistance of the source region.

[0032] According to an embodiment of the semiconductor device, at least a portion of the second source sub-region may include a dopant of a second conductivity type, which may partially offset the dopant of the first conductivity type within a range of at least 10% to at most 99.9%, or within a range of at least 10% to at most 90%, or within a range of 20% to 80%, or within a range of 30% to 70%. Partial offsetting of dopants means that donors outnumber acceptors or vice versa. Partial offsetting provides an additional degree of freedom to adjust the desired bulk resistance of the source region. Not only can partial offsetting be used to increase or decrease the number of donors or acceptors, but the electron and hole mobility can also be decreased by offsetting, since the mobility is affected by the sum of donor and acceptor ions. As an example, p-type dopants in SiC, such as aluminum (Al) and / or gallium (Ga) and / or boron (B), may be used to partially offset n-type doping caused by n-type dopants in SiC, such as phosphorus (P) and / or nitrogen (N), or vice versa.

[0033] According to one embodiment, the semiconductor device may include lattice defects in the second source region that can reduce the mobility of free charge carriers and further reduce the effective doping concentration in the second source region due to partial cancellation of donors in the second source region. Exemplary implant particles for such mobility reduction and partial counterdoping include, for example, Z ions with carbon vacancies. 1 / 2The impurity atoms that introduce the impurities are argon (Ar), protons, and helium (He). The provision of lattice impurities can provide an additional degree of freedom for adjusting the desired bulk resistance of the source region.

[0034] According to an embodiment, the semiconductor device may include a silicon carbide semiconductor body including a source region of a first conductivity type and a body region of a second conductivity type. The semiconductor device may further include a trench structure extending from the first surface along a vertical direction into the silicon carbide semiconductor body, the trench structure may include a gate electrode and a gate dielectric. The trench structure may be striped and extend along a longitudinal direction perpendicular to the vertical direction. The source region may include first and second source partial regions arranged alternately along the longitudinal direction. The doping concentration profile of the first source partial region along the vertical direction may differ from the doping concentration profile of the second source partial region along the vertical direction. This embodiment may allow for tuning the bulk resistance of the source region depending on one or more of the lateral extent of the first and second source partial regions along the longitudinal direction, the doping concentration profile of the first and second source partial regions along the vertical direction, and a contact scheme for electrically connecting the first and / or second source partial regions at the first surface. This embodiment can be combined with any of the above-mentioned embodiments. In other words, each of the first and second sub-regions can be divided into at least three sub-regions along the vertical direction as described in the above-mentioned embodiments.

[0035] According to an embodiment of the semiconductor device, a doping amount of the first conductivity type may be greater in the first source sub-region than in the second source sub-region. The doping amount of the source sub-region may correspond, for example, to a vertical integral of the dopant of the first conductivity type between the top and bottom of the source sub-region. In some examples, the amount may correspond to a total ion implantation dose used to fabricate the source sub-region. The doping amount may be expressed as the number of dopants per unit area, e.g., cm -2The dopant of the first conductivity type may include one or more dopant species of the first conductivity type, such as one or more dopant elements such as phosphorus (P) and nitrogen (N) and other suitable elements or complexes for n-type doping, or one or more dopant elements such as boron (B), gallium (Ga), and aluminum (Al) and other suitable elements or complexes for p-type doping. The term "dopant species" refers to a particular dopant element in silicon carbide, such as P for n-type doping, or B for p-type doping. For example, dopants may be introduced into the silicon carbide semiconductor body using ion implantation and / or during epitaxial growth.

[0036] According to an embodiment, the semiconductor device may further comprise a contact and a dielectric, and the contact may be electrically connected to the source region at the first surface. The dielectric may be at least partially replaced by a cavity (i.e., a hollow space). The contact may be directly adjacent to at least a portion of the first source sub-region at the first surface, and the dielectric may be adjacent to at least a portion of the second source sub-region at the first surface. In some embodiments, the contact may only be in direct contact with the first source sub-region, and the second source sub-region may not be in direct contact with the contact.

[0037] According to an embodiment, the semiconductor device may further comprise a doped region of a second conductivity type disposed between the second source portion region and the first surface.

[0038] According to an embodiment, the semiconductor device may further comprise a current spreading region of a first conductivity type. The semiconductor device may further comprise a drift region of the first conductivity type, which may be disposed between the current spreading region and a semiconductor substrate of the first conductivity type, and / or between the current spreading region and a contact region of the first conductivity type, and / or between the current spreading region and a buffer or drain region. The doping concentration of the current spreading region may be greater than the doping concentration of the drift region. Exemplary values ​​for the average net dopant concentration in the drift region are 10 15cm -3 ~5×10 16 cm -3 The average net dopant concentration in the current spreading region can be, for example, in the range of 5 to 1000 times, or in the range of 10 to 500 times, or in the range of 50 to 200 times, greater than the average net dopant concentration in the drift region. The arrangement of the current spreading region can, for example, enable further reduction in the on-state resistance per unit area RDS(on).

[0039] According to an embodiment, the semiconductor device may further comprise a shielding region of the second conductivity type directly adjacent at least a bottom portion of the trench structure. The shielding region may, for example, protect the gate dielectric from high electric field strengths occurring during a reverse voltage mode of the semiconductor device. The shielding region may also be adjacent to a sidewall of the trench structure. The shielding region and the body region may, for example, be adjacent to the trench structure from opposite sidewalls. The body region may also be adjacent to the trench structure from opposite sidewalls of the trench structure, and the shielding region may, for example, be adjacent to the trench structure at the bottom of the trench structure. The maximum dopant concentration in the shielding region may be higher than the maximum dopant concentration in the body region. However, in other embodiments, the maximum dopant concentration in the shielding region may be lower than the maximum dopant concentration in the body region. The vertical dopant concentration profile in the shielding region may have a local maximum at a position below the trench gate structure. In addition to the protective function of the shielding region, the shielding region may also provide integrated flyback diode (also called "body diode") functionality for the silicon carbide device.

[0040] According to one embodiment of the semiconductor device, the contact may include a positive temperature coefficient (PTC) material directly adjacent to the source region. A PTC material is typically a conductive material that has at least a gradual increase, particularly a sudden increase, in resistivity when a switching temperature is reached. If the resistivity jump is high enough, the resistivity may effectively block current flow and further localized heating of the semiconductor device may be prevented or counteracted. Exemplary PTC materials are conductive polymer composites and / or barium titanate.

[0041] According to an embodiment, a method of fabricating a semiconductor device may include forming a source region of a first conductivity type and a body region of a second conductivity type in a silicon carbide semiconductor body. The method may further include forming a trench structure extending from the first surface into the silicon carbide semiconductor body along a vertical direction, the trench structure may include a gate electrode and a gate dielectric. The method may further include forming a contact at the first surface electrically connected to the source region, the source region may include a first source portion region immediately adjacent to the contact in a source contact area of ​​the first surface, a second source portion region, and a third source portion region. The second source portion region may be disposed between the first source portion region and the third source portion region along the vertical direction. A doping concentration profile of the source region along the vertical direction may include a minimum doping concentration in the second source portion region and a maximum doping concentration in the third source portion region. Each of the second source portion region and the third source portion region may overlap the source contact area.

[0042] According to an embodiment of the method for fabricating a semiconductor device, the first source partial region, the second source partial region, and the third source partial region may be formed by an ion implantation process using the same single ion implantation mask. In some embodiments, the first to third source partial regions may be formed by two ion implantations having different ion implantation energies. For example, a doping peak of one of the two ion implantations may define a maximum doping concentration in the third source partial region, and a doping peak of the other of the two ion implantations may define a maximum doping concentration in the first source partial region. A minimum doping concentration in the second source partial region may be defined, for example, by an overlap of the tails of the doping concentrations of the two ion implantation profiles. Also, more than two ion implantations may be used to form the first to third source partial regions.

[0043] According to an embodiment, a method of fabricating a semiconductor device may include forming a source region of a first conductivity type and a body region of a second conductivity type in a silicon carbide semiconductor body. The method may further include forming a trench structure extending from the first surface into the silicon carbide semiconductor body along a vertical direction, the trench structure may include a gate electrode and a gate dielectric. The trench structure may be striped and extend along a longitudinal direction perpendicular to the vertical direction. The source region may include first source partial regions and second source partial regions alternately arranged along the longitudinal direction. A doping concentration profile of the first source partial region along the vertical direction may be different from a doping concentration profile of the second source partial region along the vertical direction.

[0044] The method may be applied to fabricate a semiconductor device as described with respect to any of the embodiments described above or with respect to the figures below. In at least some embodiments of the method, the following features are applied (where applicable) alone or in combination: (i) forming at least one of the source region, the body region, the current spreading region, and the shielding region may include at least one masked or unmasked ion implantation process; (ii) forming the source region may include two or more ion implantation processes having different ion implantation energies / doses, and the ion implantation processes may be performed based on different ion implantation masks or based on a common ion implantation mask; (iii) forming the source region may include introducing lattice defects into the second source sub-region by one or more ion implantation processes.

[0045] Although the methods are described above and below as a series of steps or events, it will be understood that the described ordering of such steps or events is not to be construed in a limiting sense. Rather, some steps may occur in different orders and / or concurrently with other steps or events in addition to those described above and below.

[0046] The functional and structural details described with respect to the above embodiments apply equally to the exemplary embodiments shown in the figures and further described below.

[0047] Referring to the schematic cross-sectional view of FIG. 1, one embodiment of a semiconductor device 100 is shown.

[0048] The semiconductor device 100 has n +The semiconductor device includes a silicon carbide semiconductor body 102 including a doped source region 104 and a p-doped body region 106. A trench structure 108 extends from a first surface 110 into the silicon carbide semiconductor body 102 along a vertical direction y. The trench structure 108 includes a gate electrode 1081 and a gate dielectric 1082. A contact 112 is electrically connected to the source region 104 at the first surface 110. The source region 104 includes a first source partial region 1041 directly adjacent to the contact 112 at a source contact area 113 of the first surface 110. The source region 104 further includes a second source partial region 1042 and a third source partial region 1043. The second source partial region 1042 is disposed between the first source partial region 1041 and the third source partial region 1043 along the vertical direction y. Each of the second source partial region 1042 and the third source partial region 1043 overlaps the source contact area 113. The trench structure 108 may, for example, be stripe-shaped and extend along the longitudinal direction x1.

[0049] An exemplary profile of doping concentrations c1, c2, c3 of the source region 104 along line AA' in FIG. 1 is shown in the schematic diagrams of FIGS. 2A-2B.

[0050] 2A , the doping concentrations c1, c2 along the vertical direction y of the source region 104 include a doping concentration minimum or valley 150 in the second source sub-region 1042 and a doping concentration maximum or peak 151 in the third source sub-region 1043. The doping concentration value at the minimum 150 can be adjusted, for example, for a desired bulk resistance of the source region 104.

[0051] Referring to the profile of doping concentration c3 shown in Figure 2B, the second source region 1042 has more than one doping concentration minimum 150. In the example shown in Figure 2B, two doping concentration minima and one doping concentration maximum are present in the second source region 1042. The number of doping minima and doping maxima may also be greater than that shown in Figure 2B.

[0052] In the embodiments described and illustrated herein, the trench structures 108 may be evenly spaced and may have equal widths, forming a regular stripe pattern, with a center-to-center distance between the trench structures 108 in the range of 1 μm to 10 μm, e.g., 2 μm to 5 μm. The length of the trench structures 108 along the longitudinal direction x1 may extend up to several millimeters (e.g., at least 300 μm and at most 2 mm). The vertical extension of the trench structures 108 may be in the range of 0.3 μm to 5 μm, e.g., in the range of 0.5 μm to 2 μm. At the bottom, the trench structures 108 may be rounded.

[0053] In other embodiments (not shown), the trench structure 108 may be of a circular, hexagonal, or square shape, with a lateral width that may roughly correspond to the length of the trench structure 108. The channel region and / or body region may be adjacent to more than one sidewall, or even more than two sidewalls, of the trench structure.

[0054] 3 shows a profile of the doping concentration c4 along a lateral direction x2 that defines the lateral extent (see exemplary line BB' in FIG. 1) of the second source region 1042. The lateral extent of the second source region 1042 is defined between i) the interface to the sidewall of the trench structure 108 and ii) the pn junction 154 to the body region 106. The doping concentration c4 of the second source region 104 is constant along at least 80% of its lateral extent.

[0055] Another embodiment of a semiconductor device 100 is shown in schematic cross-sectional view in FIG.

[0056] The semiconductor device 100 includes a dielectric 156. The contact 112 is immediately adjacent to a first portion of the first source portion region 1041 at the first surface 110, and the dielectric 156 is adjacent to a second portion of the first source portion region 1041 at the first surface 110.

[0057] The semiconductor device 100 further includes an n-doped current spreading region 158. - It further includes a doped drift region 160 disposed between the current spreading region 158 and the semiconductor substrate, and / or between the current spreading region 158 and the contact region 164, and / or between the current spreading region and a buffer or highly doped drain contact region. The doping concentration of the current spreading region 158 is greater than the doping concentration of the drift region 160.

[0058] The semiconductor device 100 has a p-type junction layer directly adjacent at least a bottom portion of the trench structure 108. + It further includes a doped shielding region 162. The shielding region 162 is also adjacent to the sidewall of the trench structure 108 opposite the sidewall on which the source region 104 is located.

[0059] Referring to the schematic cross-sectional view of FIG. 5, the contact 112 of one embodiment of the semiconductor device 100 further includes a positive temperature coefficient (PTC) material 1121 immediately adjacent to the source region 104 .

[0060] Referring to the schematic cross-sectional view of FIG. 6, a top view of one embodiment of a semiconductor device 200 is shown.

[0061] The semiconductor device 200 has n + The semiconductor device 200 includes a silicon carbide semiconductor body 202 including a doped source region 204 and a p-doped body region 206. The semiconductor device 200 includes a trench structure 208. The trench structure 208 includes a gate electrode 2081 and a gate dielectric 2082. The trench structure 208 is striped and extends along a longitudinal direction x1 perpendicular to a vertical direction y. The vertical direction y is, for example, perpendicular to the drawing plane of FIG. 6. The source region 204 includes first source partial regions 2041 and second source partial regions 2042 alternately arranged along the longitudinal direction x1. The doping concentration profile of the first source partial region 2041 along the vertical direction y is different from the doping concentration profile of the second source partial region 2042 along the vertical direction y.

[0062] With reference to the schematic graph of FIG. 7, an exemplary profile of the doping concentration profile along the vertical direction y is shown. The profile of the doping concentration c5 is taken along the vertical direction y through one of the first and second source partial regions 2041, 2042, and the profile of the doping concentration c6 is taken along the vertical direction through the other of the first and second source partial regions 2041, 2042. In the exemplary profiles of the doping concentrations c5, c6 shown in FIG. 7, in the region close to the first surface 210, the concentration c5 is greater than the concentration c6. One or both of the doping concentration profiles of the first and second partial regions 2041, 2042 along the vertical direction y may be formed, for example, according to the embodiments described above. According to other embodiments, one or both of the doping concentration profiles of the first and second partial regions 2041, 2042 may also differ from the profiles described in the above embodiments, as long as the doping concentration profiles of the first and second partial regions 2041, 2042 differ from each other.

[0063] Although specific embodiments have been illustrated and described herein, it will be understood by those skilled in the art that various alternative and / or equivalent implementations may be substituted for the specific embodiments illustrated and described without departing from the scope of the invention. This application is intended to cover any adaptations or variations of the specific embodiments described herein. It is therefore intended that the invention be limited only by the claims and their equivalents. [Explanation of symbols]

[0064] 100 Semiconductor Devices 102 Silicon carbide semiconductor body 104 Source Area 106 Main body area 108 Trench Structure 110 First Surface 112 Contacts 113 Source Contact Area 150 Doping Concentration Minimum 151 Maximum doping concentration 154 pn junction 156 Dielectric 158 Current spreading region 160 Drift Region 162 Shield area 164 Contact area 200 Semiconductor Devices 202 Silicon carbide semiconductor body 204 Source Region 206 Main body area 208 Trench Structure 210 First Surface 1041 First Source Partial Region 1042 Second Source Subregion 1043 Third Source Subregion 1081 Gate electrode 1082 Gate Dielectric 1121 Positive Temperature Coefficient Material 2041 First Source Subregion 2042 Second Source Subregion 2081 Gate electrode 2082 Gate Dielectric

Claims

1. A semiconductor device (100), a silicon carbide semiconductor body (102) including a source region (104) of a first conductivity type and a body region (106) of a second conductivity type; a trench structure (108) extending along a vertical direction (y) from a first lateral surface (110) of the silicon carbide semiconductor body (102) into the silicon carbide semiconductor body (102), the trench structure (108) comprising a gate electrode (1081) and a gate dielectric (1082); a contact (112) electrically connected to the source region (104) at the first surface (110); the source region (104) comprises a first source partial region (1041), a second source partial region (1042) and a third source partial region (1043) immediately adjacent to the contact (112) in a source contact area (113) of the first surface (110), the second source partial region (1042) being arranged between the first source partial region (1041) and the third source partial region (1043) along the vertical direction (y); a doping concentration profile (c) along the vertical direction (y) of the source region (104) comprising a doping concentration minimum in the second source region (1042) and a doping concentration maximum in the third source region (1043); each of the second source region (1042) and the third source region (1043) overlaps with the source contact area (113); A semiconductor device (100), wherein the gate electrode (1081) directly faces each of the first source partial region (1041), the second source partial region (1042), and the third source partial region (1043).

2. 2. The semiconductor device of claim 1, wherein the doping concentration profile (c) along the vertical direction (y) of the source region (104) includes a doping concentration valley in the second source region (1042) and a doping concentration peak in the third source region (1043).

3. a lateral extent (lx) of said second source region (1042) is defined between i) an interface to a sidewall of said trench structure and ii) a pn junction to said body region; The semiconductor device (100) of claim 1 or 2, wherein the doping concentration profile (c) of the second source partial region (1042) is constant along at least 80% of the lateral extent (lx).

4. The semiconductor device (100) of any one of claims 1 to 3, wherein the minimum of the doping concentration in the second source partial region (1042) is in a range of at least 0.01% to at most 50% of the maximum of the doping concentration in the third source partial region (1043).

5. The semiconductor device (100) according to any one of the preceding claims, wherein the vertical extent (d) of the second source partial region (1042) is in the range of at least 30 nm and at most 300 nm.

6. The semiconductor device (100) of any one of claims 1 to 5, wherein at least a portion of the second source region (1042) comprises a dopant of the second conductivity type, and the dopant of the second conductivity type partially offsets the dopant of the first conductivity type in a range of at least 10% to at most 99.9%.

7. The semiconductor device (100) of any one of claims 1 to 6, further comprising lattice defects in the second source region (1042), the lattice defects reducing the mobility of free charge carriers in the second source region.

8. The semiconductor device (100) of any one of claims 1 to 7, further comprising lattice defects in the second source region (1042), the lattice defects reducing an effective n-type doping level in the second source region.

9. The semiconductor device (100) of any one of the preceding claims, wherein the contact (112) comprises a positive temperature coefficient material (1121) immediately adjacent the source region (104).

10. A semiconductor device (200), a silicon carbide semiconductor body (202) including a source region (204) of a first conductivity type and a body region (206) of a second conductivity type; a trench structure (208) extending from a first surface (210) into the silicon carbide semiconductor body (202) along a vertical direction (y), the trench structure (208) comprising a gate electrode (2081) and a gate dielectric (2082), the trench structure (208) being striped and extending along a longitudinal direction (x1) perpendicular to the vertical direction (y); Equipped with The source region (204) includes first source partial regions (2041) and second source partial regions (2042) arranged alternately along the longitudinal direction (x1), A semiconductor device (200), wherein a doping concentration profile of the first source partial region (2041) along the vertical direction (y) is different from a doping concentration profile of the second source partial region (2042) along the vertical direction (y).

11. 11. The semiconductor device (200) of claim 10, wherein a doping amount of the first conductivity type is greater in the first source partial region (2041) than in the second source partial region (2042).

12. 12. The semiconductor device (200) of claim 10 or 11, further comprising a contact and a dielectric, the contact being electrically connected to the source region (204) at the first surface (210), the contact being directly adjacent to at least a portion of the first source partial region (2041) at the first surface (210), and the dielectric being adjacent to at least a portion of the second source partial region (2042) at the first surface (210).

13. 12. The semiconductor device (200) of claim 10 or 11, further comprising a doped region of the second conductivity type disposed between the second source portion region (2042) and the first surface (210).

14. a current spreading region (158) of said first conductivity type; a drift region (160) of the first conductivity type, the drift region (160) is disposed between the current spreading region (158) and the semiconductor substrate of the first conductivity type, and / or between the current spreading region (158) and the contact region (164) of the first conductivity type, and / or between the current spreading region and a buffer or drain region, The semiconductor device (100, 200) of any one of the preceding claims, wherein the doping concentration of the current spreading region (158) is greater than the doping concentration of the drift region (160).

15. The semiconductor device (100, 200) of any one of the preceding claims, further comprising a shielding region (162) of the second conductivity type immediately adjacent at least a bottom portion of the trench structure (108, 208).

16. 1. A method of fabricating a semiconductor device, the method comprising: forming a source region (104) of a first conductivity type and a body region (106) of a second conductivity type in a silicon carbide semiconductor body (102); forming a trench structure (108) extending along a vertical direction (y) from a first lateral surface (110) of the silicon carbide semiconductor body (102) into the silicon carbide semiconductor body (102), the trench structure (108) including a gate electrode (1081) and a gate dielectric (1082); forming a contact (112) at the first surface (110) electrically connected to the source region (104); the source region (104) comprises a first source partial region (1041), a second source partial region (1042) and a third source partial region (1043) immediately adjacent to the contact (112) in a source contact area (113) of the first surface (110), the second source partial region (1042) being arranged between the first source partial region (1041) and the third source partial region (1043) along the vertical direction (y); a doping concentration profile (c) along the vertical direction (y) of the source region (104) comprising a doping concentration minimum in the second source region (1042) and a doping concentration maximum in the third source region (1043); each of the second source region (1042) and the third source region (1043) overlaps with the source contact area (113); The method of claim 1, wherein the gate electrode (1081) directly faces each of the first source portion region (1041), the second source portion region (1042), and the third source portion region (1043).

17. 17. The method of claim 16, wherein the first source region (1041), the second source region (1042) and the third source region (1043) are formed by an ion implantation process using a same ion implantation mask.

18. A method of fabricating a semiconductor device (200), the method comprising: forming a source region (204) of a first conductivity type and a body region (206) of a second conductivity type in a silicon carbide semiconductor body (202); forming a trench structure (208) extending from a first surface (210) into the silicon carbide semiconductor body (202) along a vertical direction (y), the trench structure (208) including a gate electrode (2081) and a gate dielectric (2082); The trench structure (208) is striped and extends along a longitudinal direction (xlo) perpendicular to the vertical direction (y), The source region (204) includes first source partial regions (2041) and second source partial regions (2042) arranged alternately along the longitudinal direction (xlo), A method according to claim 1, wherein a doping concentration profile of said first source partial region (2041) along a vertical direction (y) is different from a doping concentration profile of said second source partial region (2042) along said vertical direction (y).

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