Exposure method and exposure apparatus

Abstract

To cause an exposure head to emit light to an appropriate position on a substrate by suppressing the yawing of a driving object when driving a stage in a main scanning direction with a drive mechanism, while suppressing cost increase.SOLUTION: A stage 2 is driven in a Y direction by a stage driving mechanism 3, so that the stage 2 moves in an exposure movement range Ye in the Y direction, and a substrate We passes an irradiation range Re in the Y direction. In parallel with a first main scanning driving, an exposure head 41 is caused to emit light to the irradiation range Re, so that a stripe region Rs extending in the Y direction in the substrate We is exposed. On the basis of a yawing correction table Ty indicating a θ-direction correction amount for correcting the rotation amount of the stage 2 in a rotation direction θ according to the position of the stage 2 in the Y direction in the exposure movement range Ye, the rotation amount of the stage 2 in the rotation direction θ during the execution of the first main scanning driving is corrected by the stage driving mechanism 3.SELECTED DRAWING: Figure 5B

Description

[Technical field]

[0001] The present invention relates to a technique for exposing a substrate, such as a semiconductor wafer or a glass substrate, to light in order to form a pattern on the substrate. [Background technology]

[0002] Patent documents 1 and 2 describe an exposure device that draws a pattern extending in the main scanning direction on a substrate (photosensitive material, substrate to be exposed) by irradiating light from an exposure head onto the photosensitive material while moving a stage on which the substrate is placed in the main scanning direction. In such an exposure device, there are cases where misalignment occurs between the stage and the exposure head, making it impossible to irradiate light onto the appropriate position on the photosensitive material. Therefore, Patent documents 1 and 2 address this issue by adjusting the pattern of light irradiated from the exposure head.

[0003] Furthermore, Patent Document 2 focuses on stage yawing. In particular, it has been pointed out that a method of eliminating the effects of yawing by controlling the stage position based on the results of measuring the stage yawing with a laser displacement meter has a problem in that it is necessary to equip the device with an expensive laser displacement meter. Therefore, Patent Document 2 adopts a software method of correcting the data given to the exposure head to adjust the light pattern, rather than a hardware method of controlling the stage position. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2007-114468 A [Patent Document 2] JP 2010-113001 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, there is a limit to how much the above-mentioned software method can reliably eliminate the effect of stage yawing on the exposure position, and it is necessary to suppress the stage yawing itself using hardware. This situation is also true for devices that expose a substrate on a fixed stage while driving an exposure head in the main scanning direction.

[0006] The present invention has been made in consideration of the above-mentioned problems, and aims to provide a technology that suppresses yawing of a driven object, such as a stage or exposure head, when the driven object is driven in the main scanning direction by a driving mechanism, while minimizing increases in costs, thereby enabling light to be irradiated from the exposure head to an appropriate position on a substrate placed on the stage. [Means for solving the problem]

[0007] The exposure method of the present invention includes the steps of: performing a first main scanning drive in which one of the driving objects, either the stage on which the substrate is placed or the exposure head that irradiates light onto the irradiation range, is driven in the main scanning direction by a driving mechanism, so that the driving object moves through a first moving range in the main scanning direction and the substrate passes through the irradiation range relatively in the main scanning direction; performing a first yawing correction operation in which the driving mechanism corrects the rotation amount of the driving object in the yaw direction during the execution of the first main scanning drive based on first yawing correction information indicating a first correction amount for correcting the rotation amount of the driving object in the yaw direction according to the position of the driving object in the main scanning direction in the first moving range; and performing an exposure operation in which the exposure head irradiates light onto the irradiation range during the execution of the first main scanning drive, thereby exposing an area extending in the main scanning direction on the substrate.

[0008] The exposure apparatus of the present invention includes a stage on which a substrate is placed, an exposure head that irradiates light onto an irradiation range, a drive mechanism that drives one of the stage and the exposure head as a drive object in the main scanning direction, a memory unit that stores first yawing correction information indicating a first correction amount for correcting the rotation amount of the drive object in the yaw direction depending on the position of the drive object in the main scanning direction in a first movement range in the main scanning direction, and a control unit that performs an exposure operation to expose an area extending in the main scanning direction on the substrate by irradiating light onto the irradiation range from the exposure head while performing a first main scanning drive in which the drive object moves through the first movement range by driving the drive object in the main scanning direction using the drive mechanism and the substrate passes through the irradiation range relatively in the main scanning direction, and the control unit performs a first yawing correction operation in which the drive mechanism corrects the rotation amount of the drive object in the yaw direction during the execution of the first main scanning drive based on the first yawing correction information.

[0009] In the present invention (exposure method and exposure apparatus) configured as described above, one of the driving targets, the stage and the exposure head, is driven in the main scanning direction by the driving mechanism, so that the driving target moves in a first movement range in the main scanning direction, and the substrate passes through the irradiation range relatively in the main scanning direction (first main scanning drive). Then, in parallel with the first main scanning drive, the exposure head irradiates the irradiation range with light, thereby exposing an area extending in the main scanning direction on the substrate (exposure operation). In particular, based on first yawing correction information indicating a first correction amount for correcting the rotation amount in the yaw direction of the driving target according to the position in the main scanning direction of the driving target in the first movement range, the rotation amount in the yaw direction of the driving target during the execution of the first main scanning drive is corrected by the driving mechanism (first yawing correction operation). As a result, it is possible to suppress the yawing of the driving target when the driving target, such as the stage or the exposure head, is driven in the main scanning direction by the driving mechanism while suppressing an increase in cost, and to irradiate light from the exposure head to an appropriate position on the substrate placed on the stage.

[0010] The exposure method may further include a step of performing a first correction information creating operation to create first yawing correction information based on a result of determining a rotation amount in the yawing direction of the driven object moved in the main scanning direction in the first movement range by the drive mechanism, and the first yawing correction operation may correct the rotation amount in the yawing direction of the driven object based on the first yawing correction information created in the first correction information creating operation. In this configuration, the first yawing correction information is created based on a result of determining a position in the yawing direction of the driven object moved in the main scanning direction in the first movement range by the drive mechanism, i.e., a result of determining yawing in advance (first correction information creating operation). Then, when performing an exposure operation while performing the first main scanning drive, yawing of the driven object can be suppressed based on the first yawing correction information thus created.

[0011] The exposure method may be configured so that the first correction information creation operation includes a step of attaching a yaw measuring device that measures the rotation amount of the stage in the yaw direction by a laser interferometer to an exposure device having a stage, an exposure head, and a driving mechanism, a step of measuring the rotation amount in the yaw direction of a driven object that moves in a first moving range by driving the driven object in the main scanning direction by the driving mechanism using the yaw measuring device, and acquiring a correspondence between the position in the main scanning direction of the driven object and the rotation amount in the yaw direction, and a step of creating first yaw correction information based on the result of the first yaw measurement. In this configuration, the yaw of the driven object can be easily obtained by the measurement of the laser interferometer of the yaw measuring device. Moreover, the yaw measuring device is attached to the exposure device and used when measuring the yaw. Therefore, once the measurement of the yaw is completed, the yaw measuring device can be removed from the exposure device. Therefore, there is no need to provide a yaw measuring device in the exposure device itself, and it is possible to suppress an increase in the cost of the exposure device.

[0012] The exposure method may also be configured to include, before the exposure operation is performed, a step of performing a second main scanning drive in which the drive object is driven in the main scanning direction by a drive mechanism, so that the drive object moves through a second movement range in the main scanning direction and the substrate passes through the camera's imaging range in the main scanning direction relatively; a step of performing a second yawing correction operation in which the drive mechanism corrects the amount of rotation of the drive object in the yaw direction during the execution of the second main scanning drive based on second yawing correction information indicating a second correction amount for correcting the amount of rotation of the drive object in the yaw direction in accordance with the position of the drive object in the main scanning direction in the second movement range; and a step of performing an alignment mark acquisition operation in which the camera captures an alignment mark image of the alignment mark of the substrate passing through the imaging range during the execution of the second main scanning drive, and the position of the alignment mark indicated by the alignment mark image is acquired.In this case, the exposure method is configured to adjust the pattern of light irradiated from the exposure head to the substrate in accordance with the position of the alignment mark acquired in the alignment mark acquisition operation.

[0013] In this configuration, the driving mechanism drives the driving target in the main scanning direction, so that the driving target moves in a second moving range in the main scanning direction, and the substrate passes through the imaging range of the camera in the main scanning direction relatively (second main scanning drive). In parallel with the second main scanning drive, the camera captures an image of the alignment mark passing through the imaging range, so that an alignment mark image is captured, and the position of the alignment mark indicated by this alignment mark image is acquired (alignment mark acquisition operation). In particular, based on second yawing correction information indicating a second correction amount for correcting the rotation amount of the driving target in the yaw direction according to the position of the driving target in the main scanning direction in the second moving range, the rotation amount of the driving target in the yaw direction during the execution of the second main scanning drive is corrected by the driving mechanism (second yawing correction operation). As a result, it is possible to accurately acquire the position of the alignment mark on the substrate by suppressing the yawing of the driving target when the driving mechanism drives the driving target such as a stage or an exposure head in the main scanning direction, while suppressing an increase in cost.

[0014] The exposure method may further include a step of performing a second correction information creating operation to create second yawing correction information based on a result of determining a rotation amount in the yawing direction of the driven object moved in the main scanning direction in the second movement range by the drive mechanism, and the second yawing correction operation may correct the rotation amount in the yawing direction of the driven object based on the second yawing correction information created in the second correction information creating operation. In this configuration, the second yawing correction information is created based on a result of determining a position in the yawing direction of the driven object moved in the main scanning direction in the second movement range by the drive mechanism, i.e., a result of determining yawing in advance (second correction information creating operation). Then, when performing an alignment mark acquisition operation while performing the second main scanning drive, yawing of the driven object can be suppressed based on the second yawing correction information thus created.

[0015] The exposure method may be configured so that the following steps are performed in the second correction information creation operation: attaching a yaw measuring device to an exposure device having a stage, an exposure head, and a drive mechanism, the yaw measuring device measures the amount of rotation of the stage in the yaw direction by a laser interferometer; measuring the amount of rotation of the drive object in the yaw direction by driving the drive mechanism in the main scanning direction, the amount of rotation of the drive object in the second moving range, and performing a second yaw measurement to obtain a correspondence between the position of the drive object in the main scanning direction and the amount of rotation in the yaw direction; and creating second yaw correction information based on the result of the second yaw measurement. In this configuration, the yaw of the drive object can be easily obtained by the measurement of the laser interferometer of the yaw measuring device. Moreover, the yaw measuring device is attached to the exposure device and used when measuring the yaw. Therefore, once the measurement of the yaw is completed, the yaw measuring device can be removed from the exposure device. Therefore, there is no need to provide a yaw measuring device in the exposure device itself, and it is possible to suppress an increase in the cost of the exposure device.

[0016] Also, in the alignment mark acquisition operation, the position of the driven object in the main scanning direction is detected by the position detection unit and transmitted to the imaging timing control unit that controls the timing of imaging by the camera, and the imaging timing control unit images the alignment mark by causing the camera to perform imaging at a timing according to the position of the driven object in the main scanning direction received from the position detection unit, and the exposure method may be configured so that the position detection unit and the imaging timing control unit are provided in the same integrated circuit. In such a configuration, since the position detection unit and the imaging timing control unit are provided in the same integrated circuit, the position of the driven object in the main scanning direction can be transmitted to the imaging timing control unit while suppressing communication delays from the position detection unit to the imaging timing control unit. Therefore, imaging by the camera can be performed at an appropriate timing according to the position of the driven object.

[0017] The exposure method may further include a step of detecting the position of the driven object in the main scanning direction by a position detection unit and transmitting the detected position to a correction timing control unit that controls the execution timing of the first yawing correction operation by the driving mechanism, and the correction timing control unit causes the driving mechanism to execute the first yawing correction operation at a timing according to the position of the driven object in the main scanning direction received from the position detection unit, and the position detection unit and the correction timing control unit are provided in the same integrated circuit. In this configuration, since the position detection unit and the correction timing control unit are provided in the same integrated circuit, the position of the driven object in the main scanning direction can be transmitted to the correction timing control unit while suppressing communication delays from the position detection unit to the correction timing control unit. Therefore, the amount of rotation of the driven object in the yaw direction can be corrected at an appropriate timing according to the position of the driven object.

[0018] Meanwhile, a plurality of different exposure positions in the sub-scanning direction are set for the substrate, and a wide range can be exposed by repeating the first main scanning drive, the first yawing correction operation, and the exposure operation while changing the position of the driven object by the drive mechanism between the plurality of different sub-scanning positions in the sub-scanning direction corresponding to the plurality of exposure positions. However, when the position of the driven object (sub-scanning position) changes in the sub-scanning direction, the balance of the weight applied from the stage to the drive mechanism changes. Therefore, it may be difficult to suppress the yawing of the driven object at each of the plurality of sub-scanning positions by a single first yawing correction information.

[0019] Therefore, the exposure method may be configured such that the first yawing correction information is provided for each of the multiple sub-scanning positions, and in the first yawing correction operation, the position of the object to be driven in the sub-scanning direction is corrected based on the first yawing correction information provided for the sub-scanning position where the object to be driven is located. With this configuration, it is possible to suppress yawing of the object to be driven at each of the multiple sub-scanning positions.

[0020] Alternatively, the exposure method may be configured such that the first yawing correction information is provided for each of a plurality of different set positions in the sub-scanning direction, the plurality of set positions is less than the plurality of sub-scanning positions, and in the first yawing correction operation, the position of the driven object in the sub-scanning direction is corrected based on the first yawing correction information provided for the set position closest to the sub-scanning position where the driven object is located among the plurality of set positions, or by linear interpolation using the first yawing correction information provided for the set position closest to the sub-scanning position where the driven object is located and the first yawing correction information provided for the set position second closest to the sub-scanning position where the driven object is located. With such a configuration, it is possible to suppress the yawing of the driven object at each of the plurality of sub-scanning positions while suppressing memory resources required for storing the first yawing correction information. Effect of the Invention

[0021] As described above, according to the present invention, it is possible to suppress yawing of the driven object, such as a stage or exposure head, when the driven object is driven in the main scanning direction by a drive mechanism while suppressing increases in costs, and to irradiate light from the exposure head to an appropriate position on a substrate placed on the stage. [Brief description of the drawings]

[0022] [Figure 1] FIG. 1 is a front view showing a schematic configuration of an exposure apparatus according to the present invention. [Diagram 2] FIG. 2 is a block diagram showing an example of the electrical configuration of the exposure apparatus in FIG. [Diagram 3] FIG. 2 is a perspective view illustrating an example of a position measuring device that measures the position of a stage by a laser interferometer. [Figure 4] FIG. 4 is a block diagram showing an example of a detailed configuration of a control unit that executes an alignment mark obtaining operation and an exposure operation. [Figure 5A] FIG. 4 is a diagram showing an example of a straightness correction table. [Figure 5B] FIG. 4 is a diagram showing an example of a yawing correction table. [Figure 6] 11 is a flowchart showing an example of an alignment mark obtaining operation and an exposure operation. [Figure 7] 7 is a side view showing typically the operation of the exposure apparatus which is executed according to the flowchart in FIG. 6. [Figure 8] FIG. 7 is a diagram showing an example of a substrate on which the flowchart of FIG. 6 is executed; [Figure 9] 6 is a flowchart showing an example of a method for creating a yawing correction table. [Figure 10] 11 is a flowchart showing an example of a method for creating a straightness correction table. [Figure 11A] 11A to 11C are diagrams illustrating operations executed in creating the straightness correction table in FIG. 10 . [Figure 11B] 11A to 11C are diagrams illustrating operations executed in creating the straightness correction table in FIG. 10 . [Figure 12] 11A to 11C are diagrams illustrating operations executed in creating the straightness correction table in FIG. 10 . [Figure 13] FIG. 11 is a block diagram showing a configuration for executing another example of a method for creating a straightness correction table. [Figure 14] FIG. 13 is a perspective view showing a configuration for executing another example of a method for creating a straightness correction table. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] Fig. 1 is a front view showing a schematic configuration of an exposure apparatus according to the present invention, and Fig. 2 is a block diagram showing an example of an electrical configuration of the exposure apparatus of Fig. 1. In Fig. 1 and the following figures, the X direction which is the horizontal direction, the Y direction which is the horizontal direction perpendicular to the X direction, the Z direction which is the vertical direction, and the rotation direction θ (yaw direction) around a rotation axis parallel to the Z direction are shown as appropriate.

[0024] The exposure device 1 draws a pattern on a substrate We (substrate to be exposed) on which a layer of a photosensitive material such as resist is formed, by irradiating the substrate We with a laser beam of a predetermined pattern. As the substrate We, various substrates such as a semiconductor substrate, a printed circuit board, a substrate for a color filter, a glass substrate for a flat panel display provided in a liquid crystal display device or a plasma display device, and a substrate for an optical disk can be used.

[0025] The exposure apparatus 1 includes a main body 11, which is composed of a main body frame 111 and a cover panel (not shown) attached to the main body frame 111. Various components of the exposure apparatus 1 are disposed both inside and outside the main body 11.

[0026] The inside of the main body 11 of the exposure apparatus 1 is divided into a processing region 112 and a transfer region 113. In the processing region 112, mainly, a stage 2, a stage driving mechanism 3, an exposure unit 4, and an alignment unit 5 are arranged. In addition, an illumination unit 6 that supplies illumination light to the alignment unit 5 is arranged outside the main body 11. In the transfer region 113, a transport device 7 such as a transport robot that transports the substrate We into and out of the processing region 112 is arranged. Furthermore, a control unit 8 is arranged inside the main body 11, and the control unit 8 is electrically connected to each part of the exposure apparatus 1 and controls the operation of each of these parts.

[0027] Outside the main body 11 of the exposure apparatus 1, a cassette placement part 114 for placing a cassette C is disposed at a position adjacent to the transfer area 113. The transport device 7 disposed in the transfer area 113 inside the main body 11 corresponding to this cassette placement part 114 takes out the unprocessed substrate We contained in the cassette C placed on the cassette placement part 114 and carries it (loads it) into the processing area 112, and also carries out (unloads) the processed substrate We from the processing area 112 and stores it in the cassette C. The transfer of the cassette C to and from the cassette placement part 114 is performed by an external transport device (not shown). The loading of the unprocessed substrate We and the unloading of the processed substrate We are performed by the transport device 7 in response to instructions from the control unit 8.

[0028] The stage 2 has a flat plate-like outer shape and horizontally holds the substrate We placed on its upper surface. A plurality of suction holes (not shown) are formed in the upper surface of the stage 2, and the substrate We placed on the stage 2 is fixed to the upper surface of the stage 2 by applying a negative pressure (suction pressure) to the suction holes. The stage 2 is driven by a stage driving mechanism 3.

[0029] The stage driving mechanism 3 is an XYZ-θ driving mechanism that moves the stage 2 in the Y direction (main scanning direction), X direction (sub-scanning direction), Z direction, and rotational direction θ (yaw direction). The stage driving mechanism 3 has a Y-axis robot 31 which is a single-axis robot extending in the Y direction, a table 32 which is driven in the Y direction by the Y-axis robot 31, an X-axis robot 33 which is a single-axis robot extending in the X direction on the upper surface of the table 32, a table 34 which is driven in the X direction by the X-axis robot 33, and a θ-axis robot 35 which drives the stage 2 supported on the upper surface of the table 34 in the rotational direction θ relative to the table 34.

[0030] Therefore, the stage driving mechanism 3 can drive the stage 2 in the Y direction by the Y-axis servo motor 311 of the Y-axis robot 31, drive the stage 2 in the X direction by the X-axis servo motor 331 of the X-axis robot 33, and drive the stage 2 in the rotation direction θ by the θ-axis servo motor 351 of the θ-axis robot 35. The stage driving mechanism 3 can also drive the stage 2 in the Z direction by the Z-axis robot, which is omitted in Fig. 1. The stage driving mechanism 3 moves the substrate We placed on the stage 2 by operating the Y-axis robot 31, the X-axis robot 33, the θ-axis robot 35, and the Z-axis robot in response to a command from the control unit 8.

[0031] The exposure unit 4 has an exposure head 41 arranged above the substrate We on the stage 2, and a light irradiation section 43 that irradiates the exposure head 41 with laser light. The light irradiation section 43 has a laser driving section 431, a laser oscillator 432, and an illumination optical system 433. The laser driving section 431 is operated to emit laser light from the laser oscillator 432, which is then irradiated onto the exposure head 41 via the illumination optical system 433. The exposure head 41 modulates the laser light irradiated from the light irradiation section 43 by a spatial light modulator, and illuminates the modulated laser light onto the substrate We moving directly below it. By exposing the substrate We to the laser light in this manner, a pattern is drawn on the substrate We (exposure operation).

[0032] The alignment unit 5 has an alignment camera 51 disposed above the substrate We on the stage 2. This alignment camera 51 has a lens barrel, an objective lens, and a CCD image sensor, and captures an image of an alignment mark provided on the top surface of the substrate We moving directly below it. The CCD image sensor provided in the alignment camera 51 is composed of, for example, an area image sensor (two-dimensional image sensor).

[0033] The illumination unit 6 is connected to the lens barrel of the alignment camera 51 via a fiber 61, and supplies illumination light to the alignment camera 51. The illumination light guided by the fiber 61 extending from the illumination unit 6 is guided to the upper surface of the substrate We via the lens barrel of the alignment camera 51, and the reflected light from the substrate We is incident on the CCD image sensor via the objective lens. In this way, the upper surface of the substrate We is imaged, and a captured image is obtained. The alignment camera 51 is electrically connected to the control unit 8, and obtains a captured image in response to an instruction from the control unit 8, and transmits the captured image to the control unit 8.

[0034] The control unit 8 acquires the position of the alignment mark indicated by the captured image captured by the alignment camera 51 (alignment mark acquisition operation). The control unit 8 also controls the exposure unit 4 based on the position of the alignment mark to adjust the pattern of the laser light irradiated from the exposure head 41 to the substrate We in the exposure operation. The control unit 8 then draws the pattern on the substrate We by irradiating the substrate We with the laser light modulated according to the pattern to be drawn from the exposure head 41.

[0035] Further, the exposure apparatus 1 is provided with a main PC (Personal Computer) 91, and image processing of the alignment marks is executed by the main PC 91. That is, the control unit 8 acquires the positions of the alignment marks calculated by the main PC 91 from the captured images of the alignment marks from the main PC 91. Furthermore, a position measuring device 92 that measures the position of the stage 2 by a laser interferometer can be detachably attached to the main body 11 of the exposure apparatus 1.

[0036] 3 is a perspective view showing a schematic example of a position measuring device that measures the position of a stage by a laser interferometer. The stage 2 moves in a movable range Yt in the Y direction, and the movable range Yt includes an alignment movement range Ya and an exposure movement range Ye. Here, the alignment movement range Ya is a range in which the stage 2 moves in the Y direction for an alignment mark acquisition operation, and the exposure movement range Ye is a range in which the stage 2 moves in the Y direction for an exposure operation. In this example, the alignment movement range Ya and the exposure movement range Ye partially overlap. However, they do not necessarily need to overlap.

[0037] The position measuring device 92 can measure the position of the stage 2 moving in the Y direction within the movable range Yt. The position measuring device 92 has two laser interferometers 921, 922 and two mirrors 923, 924 attached to the side surface of the stage 2 in the Y direction. The laser interferometers 921, 922 emit laser light parallel to the Y direction, and the mirrors 923, 924 are mirror surfaces perpendicular to the Y direction, and the two laser interferometers 921, 922 and the two mirrors 923, 924 face each other in the Y direction. The laser interferometer 921 emits laser light toward the mirror 923 and measures the position of the stage 2 in the Y direction based on the result of detecting the laser light reflected by the mirror 923, and the laser interferometer 922 emits laser light toward the mirror 924 and measures the position of the stage 2 in the Y direction based on the result of detecting the laser light reflected by the mirror 924.

[0038] In the position measuring instrument 92, the Y-axis laser length measuring instrument 92y is composed of a laser interferometer 921, and the Y-axis laser length measuring instrument 92y outputs the measurement result of the laser interferometer 921 to the control unit 8 as the position of the stage 2 in the Y direction. Also, the ΔY-axis laser length measuring instrument 92d is composed of a laser interferometer 921 and a laser interferometer 922, and the ΔY-axis laser length measuring instrument 92d outputs the tilt (in other words, the difference) between the position of the stage 2 in the Y direction measured by the laser interferometer 921 and the position of the stage 2 in the Y direction measured by the laser interferometer 922 to the control unit 8 as the amount of rotation in the rotation direction θ of the stage 2. Then, as will be described later in detail, the control unit 8 creates a yawing correction table Ty based on the result of measuring the position of the stage 2 by the position measuring instrument 92 (table creation operation).

[0039] 4 is a block diagram showing an example of a detailed configuration of a control unit that executes an alignment mark acquisition operation and an exposure operation. The control unit 8 has an integrated circuit 81, for example an FPGA (Field Programmable Gate Array), and a control board 85, for example, configured with a CPU (Central Processing Unit) and a memory.

[0040] The integrated circuit 81 has a Y-axis counter 811 that counts the output of the Y-axis encoder 312 provided on the Y-axis servo motor 311. Furthermore, the integrated circuit 81 has an imaging timing output unit 812, an exposure timing output unit 813, and an interrupt generation unit 814. The imaging timing output unit 812 provides the alignment camera 51 with imaging timing generated according to the Y-direction position of the stage 2 received from the Y-axis counter 811, and the alignment camera 51 captures an image at this imaging timing. The exposure timing output unit 813 provides the exposure head 41 with exposure timing generated according to the Y-direction position of the stage 2 indicated by the Y-axis counter 811, and the exposure head 41 performs exposure at this exposure timing. The interrupt generation unit 814 provides correction timing based on the straightness correction table Ts and the yawing correction table Ty, and the position correction of the stage 2 described later is performed at this correction timing.

[0041] Furthermore, the integrated circuit 81 has a Y-axis position information output unit 817. The Y-direction position of the stage 2 measured by the Y-axis laser length measuring device 92y, the amount of rotation in the rotation direction θ of the stage 2 measured by the ΔY-axis laser length measuring device 92d, and the count value of the Y-axis counter 811 are input to this Y-axis position information output unit 817. Then, the Y-axis position information output unit 817 outputs these inputs to the control board 85.

[0042] The control board 85 has an imaging timing control unit 851. This imaging timing control unit 851 stores the correspondence between the count value of a Y-axis counter 811 indicating the position of the stage 2 in the Y direction and the imaging timing, and the imaging timing output unit 812 of the integrated circuit 81 causes the alignment camera 51 to capture an image at the imaging timing based on this correspondence acquired from the imaging timing control unit 851.

[0043] The control board 85 also has a Y-axis scale correction table section 852 that corrects an error in the Y-direction position of the stage 2 output by the Y-axis encoder 312. Specifically, a calibration operation for correcting the position of the stage 2 is executed in advance. In this calibration operation, while the stage 2 is moved in the Y direction by the Y-axis servo motor 311, the Y-direction position of the stage 2 measured by the Y-axis laser length measuring device 92y and the count value of the Y-axis counter 811 output of the Y-axis encoder 312 are transmitted to the Y-axis scale correction table section 852 via the Y-axis position information output section 817, and the Y-axis scale correction table section 852 stores the error in the count value of the Y-axis encoder 312 relative to the measurement position of the Y-axis laser length measuring device 92y as a table (Y-axis scale correction table). Then, during the exposure operation, the exposure timing output section 813 of the integrated circuit 81 corrects the count value of the output of the Y-axis encoder 312 received from the Y-axis counter 811 based on the table, and generates the exposure timing by the exposure head 41.

[0044] The control board 85 also has an X-axis scale correction table section 853 and a θ-axis scale correction table section 854 similarly provided for the X direction and the rotation direction θ. That is, the X-axis scale correction table section 853 stores a table (X-axis scale correction table) for correcting an error between the output value of the X-axis encoder provided in the X-axis servo motor 331 and the position of the stage 2 in the X direction, and outputs a correction value for correcting this error. The θ-axis scale correction table section 854 stores a table (θ-axis scale correction table) for correcting an error between the output value of the θ-axis encoder provided in the θ-axis servo motor 351 and the amount of rotation in the rotation direction θ of the stage 2, and outputs a correction value for correcting this error.

[0045] Furthermore, the control board 85 has a Y-axis straightness correction table section 855 that stores a straightness correction table Ts (FIG. 5A). FIG. 5A is a diagram showing an example of the straightness correction table. In the example of FIG. 5A, the left column of the straightness correction table Ts indicates the Y-direction position of the stage 2 indicated by the Y-axis counter 811 (in other words, the count value of the Y-axis encoder 312 by the Y-axis counter 811) by one count across the movable range Yt, and the right column of the straightness correction table Ts indicates the correction amount (X-direction correction amount) for correcting the position of the stage 2 in the X direction. In other words, the straightness correction table Ts indicates the correspondence relationship between the Y-direction position of the stage 2 indicated by the Y-axis counter 811 and the correction amount of the position of the stage 2 in the X direction. Therefore, the Y-axis straightness correction table section 855 drives the stage 2 in the X direction by the stage driving mechanism 3 by the correction amount indicated by the straightness correction table Ts in correspondence with the Y-direction position of the stage 2. This ensures the straightness of the stage 2 moving in the Y direction. As will be described later, the straightness correction table Ts is created by cooperation between a straightness correction table creating unit 856 provided in the control board 85 and a CPU 911 provided in the main PC 91.

[0046] In this way, the control board 85 is provided with an X-axis scale correction table unit 853 and a Y-axis straightness correction table unit 855 as a function of correcting the position of the stage 2 in the X direction. Therefore, the control board 85 is provided with an X-axis movement amount calculation unit 857 that combines the correction amounts of both the correction tables 853, 855. In other words, the X-axis movement amount calculation unit 857 outputs a total correction amount obtained by adding together the correction amount output by the X-axis scale correction table unit 853 and the correction amount output by the Y-axis straightness correction table unit 855 to the X-axis servo motor 331, and the X-axis servo motor 331 drives the stage 2 in the X direction by the total correction amount.

[0047] The control board 85 also has an XY yaw correction table section 858 that stores a yaw correction table Ty (FIG. 5B). FIG. 5B is a diagram showing an example of the yaw correction table. In the example of FIG. 5B, the left column of the yaw correction table Ty indicates the Y-direction position of the stage 2 indicated by the Y-axis counter 811 (in other words, the count value of the Y-axis encoder 312 by the Y-axis counter 811) by one count across the movable range Yt, and the right column of the yaw correction table Ty indicates the correction amount (θ-direction correction amount) for correcting the position of the stage 2 in the rotation direction θ. In other words, the yaw correction table Ty indicates the correspondence between the Y-direction position of the stage 2 indicated by the Y-axis counter 811 and the correction amount of the position of the stage 2 in the rotation direction θ. Therefore, the XY yaw correction table section 858 drives the stage 2 in the rotation direction θ by the stage driving mechanism 3 by the correction amount indicated by the yaw correction table Ty in association with the Y-direction position of the stage 2. This makes it possible to suppress yawing of the stage 2 moving in the Y direction. Note that, as will be described later, the yawing correction table Ty is created by the XY yawing correction table unit 858.

[0048] In this way, the control board 85 is provided with a θ-axis scale correction table unit 854 and an XY yawing correction table unit 858 as a function of correcting the position of the stage 2 in the rotation direction θ. Therefore, the control board 85 is provided with a θ-axis movement amount calculation unit 859 that combines the respective correction amounts of both the correction tables 854, 858. In other words, the θ-axis movement amount calculation unit 859 outputs a total correction amount obtained by adding together the correction amount output by the θ-axis scale correction table unit 854 and the correction amount output by the XY yawing correction table unit 858 to the θ-axis servo motor 351, and the θ-axis servo motor 351 drives the stage 2 in the rotation direction θ by the total correction amount.

[0049] FIG. 6 is a flowchart showing an example of an alignment mark acquisition operation and an exposure operation, FIG. 7 is a side view showing typically the operation of an exposure apparatus executed according to the flowchart of FIG. 6, and FIG. 8 is a diagram showing typically an example of a substrate on which the flowchart of FIG. 6 is executed.

[0050] During execution of the flowchart shown in FIG. 6, the Y-axis straightness correction table unit 855 performs position correction (straightness correction) of the stage 2, and the XY yawing correction table unit 858 performs position correction (yawing correction) of the stage 2. As described above, the execution timing of these position corrections is controlled by the interrupt generation unit 814. Specifically, every time the Y-axis counter 811 counts a predetermined number of counts (for example, 10), the interrupt generation unit 814 transmits an execution command to the X-axis movement amount calculation unit 857 and the θ-axis movement amount calculation unit 859, and the X-axis movement amount calculation unit 857 and the θ-axis movement amount calculation unit 859 perform the position corrections in charge every time they receive an execution command. In this way, the position correction of the stage 2 is not performed for each count. However, the position correction of the stage 2 may be performed for each count.

[0051] In step S101, the stage driving mechanism 3 starts driving the stage 2 in the Y direction. This causes the stage 2 to move in the alignment movement range Ya, and the substrate We placed on the stage 2 passes through the imaging range Rc (FIG. 7) of the alignment camera 51 (step S102). Meanwhile, as shown in FIG. 8, the substrate We is provided with an alignment mark Ma. Therefore, the alignment camera 51 captures an image of the alignment mark Ma moving in the imaging range Rc to obtain an alignment mark image Ia (step S103, alignment mark acquisition operation). In this way, the alignment mark image Ia is captured between the time when the leading edge of the stage 2 reaches one end of the alignment movement range Ya ("at the start of alignment mark acquisition" in FIG. 7) and the time when the leading edge of the stage 2 reaches the other end of the alignment movement range Ya ("at the end of alignment mark acquisition" in FIG. 7).

[0052] Furthermore, in the alignment mark acquisition operation (step S103), the alignment mark image Ia is transmitted from the alignment camera 51 to the main PC 91 (FIG. 4). The CPU 911 of the main PC 91 extracts the position of the alignment mark Ma by performing image processing on the alignment mark image Ia, and transmits it to the control unit 8. In this way, the control unit 8 acquires the position of the alignment mark Ma from the CPU 911 (alignment mark acquisition operation). Then, the control unit 8 adjusts the pattern of light to be irradiated to the substrate We based on the position of the alignment mark Ma acquired by the alignment mark acquisition operation.

[0053] Also, the stage 2 reaches one end of the exposure movement range Ye shortly before the stage 2 reaches the other end of the alignment movement range Ya. As a result, the stage 2 moves through the exposure movement range Ye, and the substrate We placed on the stage 2 passes through the irradiation range Re (FIG. 7) of the exposure head 41 (step S104). Also, in parallel with the passage of the substrate We through the irradiation range Re, the exposure head 41 irradiates the irradiation range Re with laser light to expose the stripe region Rs extending in the Y direction on the substrate We (exposure operation). At this time, the laser light irradiated to the irradiation range Re is adjusted based on the position of the alignment mark Ma as described above. Thus, the exposure operation is performed from when the tip of the stage 2 reaches one end of the exposure movement range Ye ("at the start of the exposure operation" in FIG. 7) until the tip of the stage 2 reaches the other end of the exposure movement range Ye ("at the end of the exposure operation" in FIG. 7).

[0054] When the exposure operation is completed, the stage driving mechanism 3 stops the movement of the stage 2 in the Y direction (step S106). As shown in FIG. 8, a plurality of stripe regions Rs arranged in the Y direction are set on the substrate We, and laser light is irradiated on one stripe region Rs in one exposure operation. Therefore, in step S107, it is confirmed whether the exposure operation has been performed on all stripe regions Rs. If there is a stripe region Rs for which the exposure operation has not been performed (i.e., unexposed), the stage driving mechanism 3 drives the stage 2 in the X direction to position the irradiation range Re of the exposure head 41 on the unexposed stripe region Rs (step S108), and repeats steps S104 to S106. However, the direction in which the stage 2 passes through the exposure movement range Ye in this exposure operation is opposite to that of the previous exposure operation. In this way, by performing a plurality of exposure operations while reciprocating the stage 2 in the Y direction, all stripe regions Rs can be exposed.

[0055] FIG. 9 is a flow chart showing an example of a method for creating a yawing correction table. In step S201, an operator or a working robot attaches the position measuring device 92 to the main body 11 of the exposure apparatus 1. In step S202, the stage driving mechanism 3 starts driving the stage 2 in the Y direction. This causes the stage 2 to move through a movable range Yt including the alignment movement range Ya and the exposure movement range Ye. At this stage, the straightness correction table Ts and the yawing correction table Ty have not been created, so straightness correction and yawing correction cannot be performed. Therefore, while the Y-axis servo motor 311 of the stage driving mechanism 3 is operating, the X-axis servo motor 331 and the θ-axis servo motor 351 are stopped, and straightness correction and yawing correction are not functioning.

[0056] In this manner, while the Y-axis servo motor 311 is driving the stage 2 in the Y direction, the XY yawing correction table unit 858 associates the output value (amount of rotation in the rotation direction θ) from the ΔY-axis laser length measurement device 92d with the output value (position in the Y direction) from the Y-axis counter 811, and acquires them for each count of the Y-axis counter 811 (step S204). These are acquired via the Y-axis position information output unit 817. This provides a yawing measurement result indicating the correspondence between the count value of the Y-axis counter 811 and the amount of rotation in the rotation direction θ of the stage 2 located at the position indicated by the count value.

[0057] When the yawing measurement results are acquired for the entire movable range Yt, the movement of the stage 2 in the Y direction stops (step S205). Then, the XY yawing correction table unit 858 obtains an error between a reference rotation amount θ0 in the rotation direction θ and the measured rotation amount of the stage 2 in the rotation direction θ, and obtains a correction amount for the rotation direction θ required to eliminate the error, thereby creating and storing a yawing correction table Ty (step S206).

[0058] Incidentally, a step may be provided in which, after the movement of the stage 2 in the Y direction has stopped, an operator or a working robot removes the position measuring device 92 from the main body 11 of the exposure apparatus 1. On the other hand, when the straightness correction table creating operation, which will be described using FIG. 10 etc., is performed subsequently, this step does not need to be executed.

[0059] Figure 10 is a flowchart showing an example of a method for creating a straightness correction table, and Figures 11A, 11B and 12 are diagrams showing typically the operations executed in creating the straightness correction table of Figure 10. If the position measuring device 92 has not been attached to the main body 11 of the exposure apparatus 1 before the start of the flowchart of Figure 10, the position measuring device 92 is attached to the main body 11 by an operator or a working robot.

[0060] In step S301, the test substrate Wt is placed on the stage 2. The test substrate Wt is, for example, a glass substrate, and on the upper surface of the test substrate Wt, as shown in FIG. 12, a plurality of test marks Mt are arranged in the Y direction. The positional relationship of each test mark Mt in the X direction is measured in advance and stored in the straightness correction table creation unit 856. Here, each test mark Mt is provided at the same position in the X direction, and the plurality of test marks Mt are arranged in parallel in the Y direction. Furthermore, a photosensitive material such as a resist is applied to the upper surface of the glass substrate of the test substrate Wt, and the alignment camera 51 can capture an image of the test marks Mt through this photosensitive material.

[0061] In step S302, the stage driving mechanism 3 starts driving the stage 2 in the Y direction. This causes the stage 2 to move through the alignment movement range Ya, and the test substrate Wt passes through the imaging range Rc of the alignment camera 51. At this stage, the straightness correction table Ts has not been created, so straightness correction cannot be performed. On the other hand, the yawing correction table Ty has been created, so yawing correction can be performed. Therefore, while the Y-axis servo motor 311 of the stage driving mechanism 3 drives the stage 2 in the Y direction, the θ-axis servo motor 351 drives the stage 2 in the rotation direction θ based on the yawing correction table Ty to perform yawing correction. On the other hand, the X-axis servo motor 331 is stopped, so straightness correction is not performed.

[0062] In step S304, the alignment camera 51 captures the test mark Mt moving in the imaging range Rc to obtain a test mark image It (FIG. 12). In this manner, the test mark image It is captured during the period from when the leading edge of the stage 2 reaches one end of the alignment movement range Ya ("test mark acquisition start time" in FIG. 11A) until the leading edge of the stage 2 reaches the other end of the alignment movement range Ya ("test mark acquisition end time" in FIG. 11A).

[0063] Furthermore, the test mark image It is transmitted from the alignment camera 51 to the main PC 91 in association with the count value of the Y-axis counter 811 when the test mark image It was captured (FIG. 4). The CPU 911 of the main PC 91 extracts the X-direction position of the test mark Mt by executing image processing on the test mark image It. Then, the X-direction position of the test mark Mt is transmitted from the main PC 91 to the straightness correction table creation unit 856 of the control board 85 in association with the count value of the Y-axis counter 811 when the test mark Mt was captured.

[0064] This makes it possible to measure the position of the test mark Mt in the X direction, i.e., the position of the stage 2 in the X direction, for the count values ​​over the entire alignment movement range Ya (step S305).The straightness correction table creation unit 856 then obtains the error between the reference position X0 in the X direction and the measured position of the stage 2 in the X direction for each count value, and obtains the amount of correction in the X direction required to eliminate such error, thereby creating a straightness correction table Ts for the alignment movement range Ya and storing it in the Y-axis straightness correction table unit 855 (step S306).

[0065] Furthermore, as the stage 2 is driven in the Y direction, the stage 2 moves through the exposure movement range Ye, and the test substrate Wt passes through the irradiation range Re of the exposure head 41 (step S307). In step S308, the exposure head 41 irradiates the test substrate Wt moving through the irradiation range Re with a light beam, thereby drawing an exposure mark Me on each test mark Mt on the test substrate Wt (FIG. 12). In this way, the exposure operation is performed between when the leading edge of the stage 2 reaches one end of the exposure movement range Ye ("exposure operation start time" in FIG. 11A) and when the leading edge of the stage 2 reaches the other end of the exposure movement range Ye ("exposure operation end time" in FIG. 11A).

[0066] The stage driving mechanism 3 stops the movement of the stage 2 in the Y direction in step S309 (step S309), and moves the stage 2 to the start point (one end) of the alignment movement range Ya in step S310 ("exposure mark acquisition start time" in FIG. 11B). Next, the Y-axis straightness correction table unit 855 turns on straightness correction using the straightness correction table Ts for the alignment movement range Ya created in step S306 (step S311).

[0067] In step S312, the stage driving mechanism 3 starts driving the stage 2 in the Y direction. As a result, the stage 2 moves through the alignment movement range Ya, and the test substrate Wt passes through the imaging range Rc of the alignment camera 51. At this time, the stage 2 has been subjected to straightness correction based on the straightness correction table Ts created in step S306.

[0068] In step S314, the alignment camera 51 captures an image of the exposure mark Me moving in the imaging range Rc to obtain an exposure mark image Ie (FIG. 12). In this manner, the exposure mark image Ie is captured during the period from when the leading edge of the stage 2 reaches one end of the alignment movement range Ya ("exposure mark acquisition start time" in FIG. 11B) until the leading edge of the stage 2 reaches the other end of the alignment movement range Ya ("exposure mark acquisition end time" in FIG. 11B).

[0069] Furthermore, the exposure mark image Ie is associated with the count value of the Y-axis counter 811 when the exposure mark image Ie was captured, and transmitted from the alignment camera 51 to the main PC 91 (FIG. 4). The CPU 911 of the main PC 91 extracts the X-direction position of the exposure mark Me by executing image processing on the exposure mark image Ie. Then, the X-direction position of the exposure mark Me is associated with the count value of the Y-axis counter 811 when the exposure mark Me was captured, and transmitted from the main PC 91 to the straightness correction table creation unit 856 of the control board 85.

[0070] As described above, the exposure head 41 irradiates a light beam onto the test substrate Wt placed on the stage 2 passing through the exposure movement range Ye, thereby drawing the exposure mark Me. In addition, while the stage 2 passes through the alignment movement range Ya while performing straightness correction on the stage 2, the position of the exposure mark Me in the X direction is acquired based on the image of the exposure mark Me captured by the alignment camera 51. The position of each exposure mark Me in the X direction thus acquired represents the straightness of the stage 2 in the exposure movement range Ye.

[0071] This allows the X-direction position of the exposure mark Me to be measured for the count values ​​over the entire exposure movement range Ye (step S315). The straightness correction table creation unit 856 then calculates the error between the reference position X0 in the X direction and the measured X-direction position of the stage 2 for each count value, and calculates the amount of correction in the X direction required to eliminate the error, thereby creating a straightness correction table Ts for the exposure movement range Ye and storing it in the Y-axis straightness correction table unit 855 (step S316). As described above, the alignment movement range Ya and the exposure movement range Ye partially overlap. For this overlapping portion, it is sufficient to select and use either the data calculated in step S306 or the data calculated in step S316.

[0072] As described above, the stage 2 (drive target) is driven in the Y direction (main scanning direction) by the stage drive mechanism 3 (drive mechanism), whereby the stage 2 moves in the exposure movement range Ye (first movement range) in the Y direction, and the substrate We passes through the irradiation range Re in the Y direction (step S104 (first main scanning drive)). Then, in parallel with the first main scanning drive (step S104), the exposure head 41 irradiates the irradiation range Re with light, thereby exposing the stripe region Rs extending in the Y direction on the substrate We (step S105 (exposure operation)). In particular, based on the yawing correction table Ty (first yawing correction information) indicating the θ direction correction amount (first correction amount) for correcting the rotation amount in the rotation direction θ (yaw direction) of the stage 2 according to the position of the stage 2 in the Y direction in the exposure movement range Ye, the rotation amount in the rotation direction θ of the stage 2 during the first main scanning drive is corrected by the stage drive mechanism 3 (first yawing correction operation). As a result, it is possible to suppress yawing of the stage 2 when the stage 2 is driven in the Y direction by the stage driving mechanism 3 while preventing an increase in costs, and to irradiate light from the exposure head 41 to an appropriate position on the substrate We placed on the stage 2.

[0073] Also, a first correction information creating operation (steps S201 to S206) is executed to create a yawing correction table Ty based on the result of determining the amount of rotation in the rotation direction θ of the stage 2 moving in the Y direction in the exposure movement range Ye by the stage driving mechanism 3. Then, in the yawing correction (first yawing correction operation) executed in parallel with the movement (first main scanning drive) of the stage 2 in the exposure movement range Ye in step S104, the amount of rotation in the rotation direction θ of the stage 2 is corrected based on the yawing correction table Ty created in the first correction information creating operation (steps S201 to S206). That is, the yawing correction table Ty is created based on the result of determining the position in the rotation direction θ of the stage 2 moving in the Y direction in the exposure movement range Ye by the stage driving mechanism 3, that is, the result of determining the yawing in advance (steps S201 to S206). Then, when performing the exposure operation (step S105) while performing the movement of the exposure movement range Ye of the stage 2 in step S104 (first main scanning drive), the yawing of the stage 2 can be suppressed based on the yawing correction table Ty thus created.

[0074] Also, a step (step S201) of attaching a position measuring device 92 (yawing measuring device) that measures the amount of rotation of the stage 2 in the rotation direction θ by a laser interferometer to the exposure apparatus 1 is provided. Then, the stage 2 is driven in the Y direction by the stage driving mechanism 3, and the amount of rotation of the stage 2 in the rotation direction θ is measured by the position measuring device 92, which moves in the exposure movement range Ye, and a first yawing measurement is performed (step S204) in which the position of the stage 2 in the Y direction and the amount of rotation in the rotation direction θ are associated with each other and acquired, and a yawing correction table Ty (first yawing correction information) is created based on the result of the first yawing measurement (step S206). In this configuration, the yawing of the stage 2 can be easily obtained by the measurement of the laser interferometer of the position measuring device 92. Moreover, the position measuring device 92 is attached to the exposure apparatus 1 and used when measuring the yawing. Therefore, once the measurement of the yawing is completed, the position measuring device 92 can be removed from the exposure apparatus 1. Therefore, there is no need to provide the exposure apparatus 1 itself with a position measuring device 92, making it possible to prevent an increase in the cost of the exposure apparatus 1.

[0075] Moreover, by driving the stage 2 in the Y direction by the stage driving mechanism 3, the stage 2 moves in the alignment movement range Ya (second movement range) in the Y direction, and the substrate We passes through the imaging range Rc of the alignment camera 51 in the Y direction (step S102 (second main scanning drive)). Then, in parallel with the second main scanning drive (step S102), the alignment camera 51 captures an image of the alignment mark Ma passing through the imaging range Rc, thereby capturing an alignment mark image Ia, and the position of the alignment mark Ma indicated by this alignment mark image Ia is acquired (step S103, alignment mark acquisition operation). In particular, based on the yawing correction table Ty (second yawing correction information) indicating a θ-direction correction amount (second correction amount) for correcting the rotation amount in the rotation direction θ of the stage 2 according to the position of the stage 2 in the Y direction in the alignment movement range Ya, the rotation amount in the rotation direction θ of the stage 2 during the execution of the second main scanning drive is corrected by the stage driving mechanism 3 (second yawing correction operation). As a result, it is possible to suppress yawing of the stage 2 when the stage 2 is driven in the Y direction by the stage driving mechanism 3 while suppressing an increase in costs, and to accurately obtain the position of the alignment mark Ma of the substrate We.

[0076] Also, a second correction information creating operation (steps S201 to S206) is executed to create a yawing correction table Ty based on the result of determining the amount of rotation in the rotation direction θ of the stage 2 moving in the Y direction within the alignment movement range Ya by the stage driving mechanism 3. Then, in the yawing correction (second yawing correction operation) executed in parallel with the movement (second main scanning drive) of the stage 2 in the alignment movement range Ya in step 102, the amount of rotation in the rotation direction θ of the stage 2 is corrected based on the yawing correction table Ty created in the second correction information creating operation (steps S201 to S206). That is, the yawing correction table Ty is created based on the result of determining the position in the rotation direction θ of the stage 2 moving in the Y direction within the alignment movement range Ya by the stage driving mechanism 3, that is, the result of determining the yawing in advance (steps S201 to S206). Then, when performing the alignment mark acquisition operation (step S103) while performing the movement of the alignment movement range Ya of the stage 2 in step S102 (second main scan drive), the yawing of the driven object can be suppressed based on the yawing correction table Ty thus created.

[0077] Also, a step (step S201) of attaching a position measuring device 92 (yawing measuring device) that measures the amount of rotation of the stage 2 in the rotation direction θ by a laser interferometer to the exposure apparatus 1 is provided. Then, the stage 2 is driven in the Y direction by the stage driving mechanism 3, and the amount of rotation of the stage 2 in the rotation direction θ is measured by the position measuring device 92, which moves in the alignment movement range Ya, and a second yawing measurement is performed (step S204) in which the position of the stage 2 in the Y direction and the amount of rotation in the rotation direction θ are associated with each other and acquired, and a yawing correction table Ty (second yawing correction information) is created based on the result of the second yawing measurement (step S206). In this configuration, the yawing of the stage 2 can be easily obtained by the measurement of the laser interferometer of the position measuring device 92. Moreover, the position measuring device 92 is attached to the exposure apparatus 1 and used when measuring the yawing. Therefore, once the measurement of the yawing is completed, the position measuring device 92 can be removed from the exposure apparatus 1. Therefore, there is no need to provide the exposure apparatus 1 itself with a position measuring device 92, making it possible to prevent an increase in the cost of the exposure apparatus 1.

[0078] In the alignment mark acquisition operation (step S103), the position of the stage 2 in the Y direction is detected by a Y-axis counter 811 (position detection unit) and transmitted to an imaging timing output unit 812 (imaging timing control unit) that controls the timing of imaging by the alignment camera 51 (camera). Then, the imaging timing output unit 812 causes the alignment camera 51 to perform imaging at a timing according to the position of the stage 2 in the Y direction received from the Y-axis counter 811, thereby imaging the alignment mark Ma. Here, the Y-axis counter 811 and the imaging timing output unit 812 are provided in the same integrated circuit 81 (FPGA). Therefore, the position of the stage 2 in the Y direction can be transmitted to the imaging timing output unit 812 while suppressing communication delay from the Y-axis counter 811 to the imaging timing output unit 812. Therefore, imaging by the alignment camera 51 can be performed at an appropriate timing according to the position of the stage 2.

[0079] Furthermore, the position of the stage 2 in the Y direction is detected by the Y-axis counter 811 and transmitted to an interrupt generation unit 814 (correction timing control unit) that controls the execution timing of yawing correction (first yawing correction operation) by the stage driving mechanism 3. Then, the interrupt generation unit 814 causes the stage driving mechanism 3 to execute yawing correction at a timing according to the position of the stage 2 in the Y direction received from the Y-axis counter 811. Here, the Y-axis counter 811 and the interrupt generation unit 814 are provided in the same integrated circuit 81 (FPGA). Therefore, the position of the stage 2 in the Y direction can be transmitted to the interrupt generation unit 814 while suppressing communication delay from the Y-axis counter 811 to the interrupt generation unit 814. Therefore, the amount of rotation of the stage 2 in the rotation direction θ can be corrected at an appropriate timing according to the position of the stage 2.

[0080] In the embodiment described above, the exposure apparatus 1 corresponds to an example of the "exposure apparatus" of the present invention, the stage 2 corresponds to an example of the "stage" and "driven object" of the present invention, the stage driving mechanism 3 corresponds to an example of the "driving mechanism" of the present invention, the exposure head 41 corresponds to an example of the "exposure head" of the present invention, the control unit 8 corresponds to an example of the "control unit" and "storage unit" of the present invention, the integrated circuit 81 corresponds to an example of the "integrated circuit" of the present invention, the Y-axis counter 811 corresponds to an example of the "position detection unit" of the present invention, and the imaging timing output unit 812 corresponds to an example of the "imaging timing control unit" of the present invention. the interrupt generating unit 814 corresponds to an example of a "correction timing control unit" of the present invention, the position measuring device 92 corresponds to an example of a "yawing measuring device" of the present invention, the alignment mark Ma corresponds to an example of an "alignment mark" of the present invention, the irradiation range Re corresponds to an example of an "irradiation range" of the present invention, the yawing correction table Ty for the exposure movement range Ye corresponds to an example of "first yawing correction information" of the present invention, the straightness correction table Ts for the alignment movement range Ya corresponds to an example of "second yawing correction information" of the present invention, and the substrate We corresponds to an example of a "yawing correction information" of the present invention. the Y direction corresponds to an example of the "substrate" of the present invention, the Y direction corresponds to an example of the "main scanning direction" of the present invention, the alignment movement range Ya corresponds to an example of the "second movement range" of the present invention, the exposure movement range Ye corresponds to an example of the "first movement range" of the present invention, the rotation direction θ corresponds to an example of the "yaw direction" of the present invention, the θ direction correction amount corresponds to an example of the "first correction amount" and "second correction amount" of the present invention, step S102 corresponds to an example of the "second main scanning drive" of the present invention, step S103 corresponds to an example of the "alignment mark acquisition operation" of the present invention, and step S104 corresponds to an example of the "first main step S102 corresponds to an example of a "second yaw correction operation" of the present invention, and the yaw correction performed in parallel with step S104 corresponds to an example of a "first yaw correction operation" of the present invention.

[0081] The present invention is not limited to the above-mentioned embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, the method of creating the straightness correction table Ts is not limited to the above-mentioned example. Fig. 13 is a block diagram showing a configuration for executing another example of the method for creating the straightness correction table, and Fig. 14 is a perspective view showing a configuration for executing another example of the method for creating the straightness correction table.

[0082] In this other example, the position of the stage 2 in the X direction is measured by a laser interferometer. That is, in addition to the configuration shown in Fig. 3, the position measuring device 92 has a laser interferometer 925 attached to the side surface of the stage 2 in the X direction and a mirror 926 extending across the moving range of the stage 2 in the Y direction. The laser interferometer 925 emits laser light parallel to the X direction, and the mirror 926 has a mirror surface perpendicular to the X direction, and the laser interferometer 925 and the mirror 926 face each other in the X direction. The laser interferometer 925 emits laser light toward the mirror 926 and measures the position of the stage 2 in the X direction based on the result of detecting the laser light reflected by the mirror 926.

[0083] The X-axis laser length measuring device 92x is configured with a laser interferometer 925, and outputs the X-direction position of the stage 2 measured by the laser interferometer 925 to the control unit 8. The control unit 8 creates a straightness correction table Ts based on the result of measuring the position of the stage 2 by the position measuring device 92.

[0084] That is, while the stage 2 moves in the Y direction, the straightness correction table creation unit 856 of the control unit 8 associates the count value output by the Y-axis counter 811 with the X-direction position of the stage 2 output by the X-axis laser length measurement device 92x, and acquires it for each count of the Y-axis counter 811. This provides a straightness measurement result indicating the correspondence between the count value of the Y-axis counter 811 and the X-direction position of the stage 2 located at the position indicated by the count value.

[0085] When the straightness measurement results are acquired for the entire movable range Yt, the movement of the stage 2 in the Y direction stops. Then, the straightness correction table creation unit 856 obtains an error between the reference position X0 in the X direction and the measured position of the stage 2 in the X direction, and obtains an amount of correction in the X direction required to eliminate the error, thereby creating a straightness correction table Ts and storing it in the Y-axis straightness correction table unit 855.

[0086] That is, in this other example, in the correction information creation operation, the straightness correction table Ts is created based on the result of measuring the position in the X direction of the stage 2 that moves in the Y direction within the exposure movement range Ye by a laser interferometer. In this configuration, the straightness of the stage 2 can be easily obtained by measurement by the laser interferometer.

[0087] 8, a plurality of different stripe regions Rs (exposure positions) are set on the substrate We in the X direction (sub-scanning direction). The first main scanning drive, the first yawing correction operation, and the exposure operation are repeated while changing the position of the stage 2 by the stage driving mechanism 3 between a plurality of different sub-scanning positions in the X direction corresponding to the plurality of stripe regions Rs, so that the entire substrate We is exposed. However, when the position (sub-scanning position) of the stage 2 changes in the X direction, the balance of the weight applied from the stage 2 to the stage driving mechanism 3 changes. Therefore, it may be difficult to suppress the yawing of the stage 2 at each of the plurality of sub-scanning positions by a single yawing correction table Ts.

[0088] Therefore, a yawing correction table Ty may be provided for each of the multiple sub-scanning positions (in other words, multiple stripe regions Rs). Specifically, the operation of creating the above-mentioned yawing correction table Ty may be performed for each sub-scanning position while changing the position of the stage 2 at the multiple sub-scanning positions. In this configuration, when the stage 2 is located at one sub-scanning position corresponding to one of the multiple stripe regions Rs, the amount of rotation of the rotation direction θ of the stage 2 driven in the Y direction is corrected based on the yawing correction table Ty provided for that one sub-scanning position (in other words, one stripe region Rs). This makes it possible to suppress yawing of the stage 2 in the Y direction at each of the multiple sub-scanning positions.

[0089] Alternatively, instead of providing a yaw correction table Ty for each of the plurality of stripe regions Rs, the number of yaw correction tables Ty may be set smaller than the number of stripe regions Rs. Specifically, a yaw correction table Ty is provided for each of a plurality of different set positions in the X direction, and the number of set positions is smaller than the number of sub-scanning positions (in other words, the number of stripe regions Rs). In such a configuration, when the stage 2 is located at one sub-scanning position corresponding to one of the plurality of stripe regions Rs, the amount of rotation of the rotation direction θ of the stage 2 driven in the Y direction is corrected based on the yaw correction table Ty provided for the set position closest to the one sub-scanning position among the plurality of set positions. Alternatively, when the stage 2 is located at a sub-scanning position corresponding to one of the multiple stripe regions Rs, the amount of rotation in the rotation direction θ of the stage 2 driven in the Y direction may be corrected by linear interpolation using correction amounts obtained from a yawing correction table Ty provided for a set position among the multiple set positions that is closest to the one sub-scanning position, and a yawing correction table Ty provided for a set position that is second closest to the one sub-scanning position. This makes it possible to suppress yawing of the stage 2 at each of the multiple sub-scanning positions while reducing memory resources required for storing the yawing correction table Ty.

[0090] The straightness correction table Ts can also be configured to be provided for each of a plurality of sub-scanning positions or set positions.

[0091] In addition, it is assumed that the straightness of the stage 2 by the X-axis robot 33 of the stage driving mechanism 3, i.e., the straightness of the stage 2 in the X direction, is not sufficiently ensured. In such a case, in a configuration in which the exposure operation is performed while changing the position of the stage 2 at multiple sub-scanning positions as described above to expose each of the multiple stripe regions Rs, the position of the stage 2 in the Y direction when the exposure operation starts (exposure start position) may vary among the multiple sub-scanning positions (in other words, the multiple stripe regions Rs). Therefore, based on a result of measuring in advance the variation in the exposure start position of the stage 2 among the multiple sub-scanning positions, a correction table indicating the amount of correction for eliminating the variation may be created. In such a configuration, the position of the stage 2 in the Y direction is corrected based on this correction table, so that the exposure operation can be performed on the substrate We while suppressing the variation in the exposure start position.

[0092] Also, information for performing straightness correction may be held by a formula, not in a table format such as the straightness correction table Ts. Similarly, information for performing yawing correction may be held by a formula, not in a table format such as the yawing correction table Ty. The same applies to various information represented by other tables.

[0093] Furthermore, the alignment camera 51 or the exposure head 41 may be driven instead of the stage 2 to move the stage 2 relative to the alignment camera 51 and the exposure head 41 .

[0094] In addition, the positions of the functional units 811-817 and 851-859 may be interchanged between the integrated circuit 81 and the control board 85. Furthermore, the control unit 8 does not need to be configured as separate units, the integrated circuit 81 and the control board 85, but may be configured as an integrated unit. In addition, the main PC 91 may be attached to the exposure apparatus 1 as an integral unit.

[0095] Furthermore, the form of the test marks Mt provided on the test substrate Wt is not limited to the example in Fig. 12. For example, a single straight line extending parallel to the Y direction may be provided on the test substrate Wt as the test marks Mt. [Industrial Applicability]

[0096] The present invention is suitable for use in the technical field of exposing a substrate, such as a semiconductor wafer or a glass substrate, to light in order to form a pattern on the substrate. [Explanation of symbols]

[0097] 1...Exposure device 2...Stage (drive object) 3...Stage drive mechanism (drive mechanism) 41...Exposure head 8...Control unit (control unit, memory unit) 81...Integrated circuits 811...Y-axis counter (position detector) 812...imaging timing output unit (imaging timing control unit) 814...Interrupt generation unit (correction timing control unit) 92...Position measuring instrument (yawing measuring instrument) Ma...Alignment mark Re…Irradiation range Ty... Yaw correction table (1st and 2nd yaw correction information) We…Substrate Y...Y direction (main scanning direction) Ya…Alignment movement range (second movement range) Ye…Exposure movement range (first movement range) θ…Rotation direction (yaw direction) S102...Step (second main scanning drive) S103...STEP (alignment mark acquisition operation) S104...Step (first main scanning drive) S105...Step (exposure operation) Steps S201 to S206 (first and second correction information creation operations) S204...Step (1st and 2nd yaw measurement)

Claims

1. a step of performing a first main scanning drive in which one of the driving objects, that is, a stage on which a substrate is placed and an exposure head which irradiates an irradiation area with light, is driven in a main scanning direction by a driving mechanism, so that the driving object moves through a first movement range in the main scanning direction and the substrate passes through the irradiation range relatively in the main scanning direction; a step of executing a first yawing correction operation for correcting a rotation amount of the driven object in the yaw direction by the drive mechanism during execution of the first main scanning drive, based on first yawing correction information stored in a storage unit that stores first yawing correction information indicating a first correction amount for correcting a rotation amount of the driven object in the yaw direction according to a position of the driven object in the main scanning direction in the first movement range; performing an exposure operation of exposing an area extending in the main scanning direction on the substrate by irradiating light from the exposure head onto the irradiation range during execution of the first main scanning drive; Equipped with an output of an encoder provided in a servo motor of the driving mechanism that drives the driven object in the main scanning direction is counted by a counter; An exposure method in which the first yawing correction information indicates a correspondence relationship between a position of the object to be driven in a main scanning direction indicated by the counter and a correction amount of the position of the object to be driven in the yaw direction.

2. a step of executing a first correction information creating operation of creating the first yawing correction information based on a result of determining a rotation amount in the yaw direction of the driven object that is moved in the first movement range in the main scanning direction by the driving mechanism, The exposure method according to claim 1 , wherein in the first yawing correction operation, a rotation amount in the yaw direction of the driven object is corrected based on the first yawing correction information created in the first correction information creation operation.

3. a step of attaching a yawing measuring device to an exposure apparatus including the stage, the exposure head, and the driving mechanism, the yawing measuring device measuring an amount of rotation of the stage in the yaw direction by a laser interferometer; a step of performing a first yawing measurement in which a rotation amount in the yaw direction of the driven object that moves in the first movement range is measured by the yawing measuring device by driving the driven object in the main scanning direction by the driving mechanism, and a position of the driven object in the main scanning direction and a rotation amount in the yaw direction are obtained in correspondence with each other; generating the first yawing correction information based on a result of the first yawing measurement; 3. The exposure method according to claim 2, wherein the first correction information generating operation is performed.

4. a step of performing a second main scanning drive in which the driven object is driven in the main scanning direction by the drive mechanism, so that the driven object moves through a second movement range in the main scanning direction and the substrate passes relatively through an imaging range of a camera in the main scanning direction; executing a second yawing correction operation for correcting a rotation amount of the driven object in the yaw direction by the drive mechanism during execution of the second main scanning drive, based on second yawing correction information indicating a second correction amount for correcting a rotation amount of the driven object in the yaw direction in accordance with a position of the driven object in the second movement range in the main scanning direction; performing an alignment mark acquisition operation of capturing an alignment mark image by capturing an image of the alignment mark of the substrate passing through the imaging range while the second main scanning drive is being performed, and acquiring a position of the alignment mark indicated by the alignment mark image; before the exposure operation is performed, 4. The exposure method according to claim 1, wherein in the exposure operation, a pattern of light irradiated from the exposure head to the substrate is adjusted according to the position of the alignment mark acquired in the alignment mark acquisition operation.

5. a step of executing a second correction information generating operation for generating the second yawing correction information based on a result of calculating a rotation amount in the yaw direction of the driven object that is moved in the second movement range in the main scanning direction by the driving mechanism, The exposure method according to claim 4 , wherein in the second yawing correction operation, a rotation amount in the yaw direction of the driven object is corrected based on the second yawing correction information created in the second correction information creation operation.

6. a step of attaching a yawing measuring device to an exposure apparatus including the stage, the exposure head, and the driving mechanism, the yawing measuring device measuring an amount of rotation of the stage in the yaw direction by a laser interferometer; a step of performing a second yawing measurement in which a rotation amount in the yaw direction of the driven object that moves in the second movement range is measured by the yawing measuring device by driving the driven object in the main scanning direction by the driving mechanism, and a position of the driven object in the main scanning direction and a rotation amount in the yaw direction are obtained in correspondence with each other; generating the second yawing correction information based on a result of the second yawing measurement; 6. The exposure method according to claim 5, wherein the above is executed in the second correction information creating operation.

7. In the alignment mark acquisition operation, a position of the driven object in the main scanning direction is detected by a position detection unit, and transmitted to an imaging timing control unit that controls timing of imaging by the camera, and the imaging timing control unit causes the camera to capture an image at a timing according to the position of the driven object in the main scanning direction received from the position detection unit, thereby capturing an image of the alignment mark; 7. The exposure method according to claim 4, wherein the position detection section and the imaging timing control section are provided in a single integrated circuit.

8. a step of detecting a position of the driven object in the main scanning direction by a position detection unit, and transmitting the position to a correction timing control unit that controls a timing of execution of the first yawing correction operation by the driving mechanism, the correction timing control unit causes the drive mechanism to execute the first yawing correction operation at a timing according to the position of the driven object in the main scanning direction received from the position detection unit; 8. The exposure method according to claim 1, wherein the position detection section and the correction timing control section are provided in a single integrated circuit.

9. 9. The exposure method according to claim 1, wherein a plurality of different exposure positions in a sub-scanning direction are set on the substrate, and the first main scanning drive, the first yawing correction operation, and the exposure operation are repeated while changing a position of the driven object by the drive mechanism between a plurality of different sub-scanning positions in the sub-scanning direction that respectively correspond to the plurality of exposure positions, the first yawing correction information is provided for each of the plurality of sub-scanning positions, In the first yawing correction operation, a position of the object to be driven in the sub-scanning direction is corrected based on the first yawing correction information provided for the sub-scanning position where the object to be driven is located.

10. 9. The exposure method according to claim 1, wherein a plurality of different exposure positions in a sub-scanning direction are set on the substrate, and the first main scanning drive, the first yawing correction operation, and the exposure operation are repeated while changing a position of the driven object by the drive mechanism between a plurality of different sub-scanning positions in the sub-scanning direction that respectively correspond to the plurality of exposure positions, the first yawing correction information is provided for each of a plurality of different setting positions in the sub-scanning direction, the plurality of set positions is less than the plurality of sub-scanning positions, In the first yawing correction operation, an exposure method is provided in which the position of the driven object in the sub-scanning direction is corrected based on the first yawing correction information provided for the setting position among the multiple setting positions that is closest to the sub-scanning position where the driven object is located, or by linear interpolation using the first yawing correction information provided for the setting position closest to the sub-scanning position and the first yawing correction information provided for the setting position second closest to the sub-scanning position.

11. a stage on which a substrate is placed; an exposure head that irradiates light onto an irradiation area; a driving mechanism that drives one of the stage and the exposure head in a main scanning direction; a storage unit configured to store first yawing correction information indicating a first correction amount for correcting a rotation amount in a yaw direction of the driven object in accordance with a position of the driven object in the main scanning direction within a first movement range in the main scanning direction; a control unit that performs an exposure operation to expose an area of ​​the substrate extending in the main scanning direction by irradiating light from the exposure head onto the irradiation range while performing a first main scanning drive in which the drive mechanism drives the drive target in the main scanning direction, causing the drive target to move through the first movement range and the substrate to relatively pass through the irradiation range in the main scanning direction; and a counter that counts the output of an encoder provided in a servo motor of the driving mechanism that drives the driven object in the main scanning direction; Equipped with the first yawing correction information indicates a correspondence relationship between a position of the driven object in a main scanning direction indicated by the counter and a correction amount of the position of the driven object in a yaw direction, The control unit performs a first yawing correction operation to correct the amount of rotation of the driven object in the yaw direction during execution of the first main scanning drive using the drive mechanism based on the first yawing correction information.

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