Substrate cleaning apparatus and substrate cleaning method

Abstract

To provide a substrate cleaning device and a substrate cleaning method capable of cleaning the lower surface of a substrate while reducing an increase in footprint.SOLUTION: The central area of the lower surface of a substrate W held by a first holding portion is cleaned by rotating a cleaning tool around the central axis 51c while the cleaning tool is in contact with the central area of the lower surface. The outer area of the lower surface of the substrate W rotated by a second holding portion is cleaned when the cleaning tool comes into contact with the outer area of the lower surface. A movable pedestal 32 provided with the second holding portion and the cleaning tool is moved in a horizontal plane such that the reference position 10R of the first holding portion and the central axis 21c of the second holding portion are aligned in plan view when the substrate W is transferred between the first holding portion and the second holding portion, and the cleaning tool overlaps the central area of the lower surface of the substrate W held by the first holding portion and the central axis 51c of the cleaning tool coincides with a first portion different from the center of the substrate W in plan view when the central area of the lower surface is cleaned.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning the underside of a substrate. [Background technology]

[0002] Substrate processing apparatuses are used to perform various processes on various substrates such as FPD (Flat Panel Display) substrates used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, semiconductor substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, solar cell substrates, etc. Substrate cleaning apparatuses are used to clean substrates.

[0003] The substrate cleaning apparatus described in Patent Document 1 includes two suction pads that hold the peripheral portion of the back surface of the wafer, a spin chuck that holds the central portion of the back surface of the wafer, and a brush that cleans the back surface of the wafer. The two suction pads hold the wafer and move laterally. In this state, the central portion of the back surface of the wafer is cleaned with the brushes. The spin chuck then receives the wafer from the suction pads, and rotates while holding the central portion of the back surface of the wafer. In this state, the peripheral portion of the back surface of the wafer is cleaned with the brushes. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5904169 Summary of the Invention [Problem to be solved by the invention]

[0005] In order to reduce the floor space (footprint) of the substrate cleaning apparatus in a clean room, it is necessary to reduce the size of the substrate cleaning apparatus, but it is difficult to reduce the size of the substrate cleaning apparatus in the horizontal direction.

[0006] An object of the present invention is to provide a substrate cleaning apparatus and a substrate cleaning method that are capable of cleaning the underside of a substrate while reducing an increase in the footprint. [Means for solving the problem]

[0007] (1) A substrate cleaning apparatus according to a first aspect of the present invention includes a first holder having a reference position and holding a substrate such that a center of the substrate is located at the reference position; a second holder having a first central axis extending in a vertical direction and rotating the substrate around the first central axis while holding a central region of an underside of the substrate; and a second holder having a second central axis extending in a vertical direction and rotating the substrate around the second central axis while contacting the central region of the underside of the substrate held by the first holder to clean the central region of the underside of the substrate, and the second holder rotating the central region of the underside of the substrate. a cleaning tool that cleans the surrounding underside outer region by contacting the surrounding underside outer region; and a movable base that is provided with a second holding part and a cleaning tool, and that moves within a horizontal plane so that, when the substrate is transferred between the first holding part and the second holding part, a reference position of the first holding part and a first central axis of the second holding part coincide in a plan view, and that, when the underside central region is cleaned, the cleaning tool overlaps with the underside central region of the substrate held by the first holding part and the second central axis of the cleaning tool coincides with a first portion different from the center of the substrate in a plan view. The second holding part moves together with the movable base in a horizontal plane. do.

[0008] In this substrate cleaning apparatus, a first holding unit holds a substrate such that the center of the substrate is located at a reference position. A second holding unit holds a central region of the underside of the substrate and rotates the substrate around a first central axis extending in the vertical direction. A cleaning tool is brought into contact with the central region of the underside of the substrate held by the first holding unit and rotated around a second central axis extending in the vertical direction, thereby cleaning the central region of the underside. A cleaning tool is brought into contact with an outer region of the underside surrounding the central region of the underside of the substrate rotated by the second holding unit, thereby cleaning the outer region of the underside.

[0009] The second holder and the cleaning tool are provided on a movable base. When the substrate is transferred between the first holder and the second holder, the movable base is moved in a horizontal plane so that a reference position of the first holder and a first central axis of the second holder coincide in a plan view. When the central region of the lower surface is cleaned, the movable base is moved in a horizontal plane so that the cleaning tool overlaps with the central region of the lower surface of the substrate held by the first holder and the second central axis of the cleaning tool coincides with a first portion different from the center of the substrate in a plan view.

[0010] According to this substrate cleaning apparatus, it is not necessary to move the substrate in a horizontal plane in order to clean the underside of the substrate. Here, when cleaning the central region of the underside, a small amount of contaminants may remain on the first portion of the substrate that contacts the second central axis of the cleaning tool. However, since the center of the substrate does not contact the second central axis of the cleaning tool, no contaminants remain on the center of the substrate. Therefore, almost no contaminants adhere to the second holder from the center of the substrate. Therefore, even when multiple substrates are cleaned in sequence, cross-contamination between multiple substrates via the second holder hardly occurs. This makes it possible to clean the underside of the substrate while reducing an increase in the footprint.

[0011] (2) When cleaning the central region of the lower surface, the movable base may be further moved in the horizontal plane so that the cleaning tool coincides with a second portion of the substrate held by the first holder, the second portion being different from the first portion of the substrate in a plan view. In this case, contaminants remaining in a small amount on the first portion of the substrate are removed. This allows the lower surface of the substrate to be thoroughly cleaned.

[0012] (3) The second portion of the substrate may be the center of the substrate. With this configuration, even if the cleaning tool is not relatively large, the central area of ​​the lower surface of the substrate can be sufficiently cleaned.

[0013] (4) The substrate cleaning apparatus may further include a gas ejection unit that is provided on the movable base and ejects gas onto the underside of the substrate to dry the central region or the outer region of the underside after cleaning. In this case, the underside of the substrate is dried entirely in a short time as the movable base moves. This can improve the cleaning efficiency of the underside of the substrate.

[0014] (5) The substrate cleaning apparatus may further include a linear guide extending in one direction in a horizontal plane, and the movable base may move linearly along the linear guide. In this case, the movable base can be moved in the horizontal plane with a simple configuration.

[0015] (6) Each of the second holder and the cleaning tool may have a circular outer shape, and the diameter of the cleaning tool may be larger than the diameter of the second holder. In this case, the lower surface of the substrate can be efficiently cleaned by the relatively large cleaning tool.

[0016] (7) Each of the substrate and the cleaning tool may have a circular outer shape, and the diameter of the cleaning tool may be larger than 1 / 3 of the diameter of the substrate. In this case, the lower surface of the substrate can be efficiently cleaned by the relatively large cleaning tool.

[0017] (8) A second aspect of the present invention provides a method for cleaning a substrate, comprising: holding a substrate with a first holding part such that a center of the substrate is located at a reference position; rotating the substrate around a first central axis extending in a vertical direction while holding a central region of an underside of the substrate with a second holding part; cleaning the central region of the underside of the substrate held by the first holding part by rotating the cleaning tool around a second central axis extending in a vertical direction while contacting the central region of the underside of the substrate held by the first holding part; and contacting a cleaning tool with an outer region of the underside of the substrate rotated by the second holding part, the outer region of the underside of the substrate being rotated by the second holding part. the movable base on which the second holding part and the cleaning tool are provided is moved in a horizontal plane so that, when transferring the substrate between the first holding part and the second holding part, a reference position of the first holding part and a first central axis of the second holding part coincide with each other in a plan view; and, when cleaning the central region of the lower surface, the movable base is moved in a horizontal plane so that, when transferring the substrate between the first holding part and the second holding part, a reference position of the first holding part coincides with a first central axis of the second holding part. The second holding part moves together with the movable base in a horizontal plane. .

[0018] According to this substrate cleaning method, it is not necessary to move the substrate in a horizontal plane to clean the underside of the substrate. In addition, when cleaning the central region of the underside, the center of the substrate does not contact the second central axis of the cleaning tool, and contaminants hardly adhere to the second holder from the center of the substrate. Therefore, even when multiple substrates are cleaned sequentially, cross-contamination between multiple substrates via the second holder hardly occurs. This makes it possible to clean the underside of the substrate while reducing the increase in footprint.

[0019] (9) The method for cleaning a substrate may further include moving the movable base in a horizontal plane during cleaning of the central region of the lower surface so that, in a plan view, the cleaning tool coincides with a second portion of the substrate held by the first holder, the second portion being different from the first portion. In this case, any contaminants remaining in the first portion of the substrate are removed. This allows the lower surface of the substrate to be thoroughly cleaned.

[0020] (10) The second portion of the substrate may be the center of the substrate. With this configuration, even if the cleaning tool is not relatively large, the central area of ​​the lower surface of the substrate can be sufficiently cleaned.

[0021] (11) The substrate cleaning method may further include drying the central region or the outer region of the underside after cleaning by blowing gas onto the underside of the substrate from a gas blowing unit provided on the movable base. In this case, the underside of the substrate is dried entirely in a short time as the movable base moves. This can improve the cleaning efficiency of the underside of the substrate.

[0022] (12) Moving the movable base within the horizontal plane may include moving the movable base linearly along a linear guide extending in one direction within the horizontal plane. In this case, the movable base can be moved within the horizontal plane with a simple configuration.

[0023] (13) Each of the second holder and the cleaning tool may have a circular outer shape, and the diameter of the cleaning tool may be larger than the diameter of the second holder. In this case, the lower surface of the substrate can be efficiently cleaned by the relatively large cleaning tool.

[0024] (14) Each of the substrate and the cleaning tool may have a circular outer shape, and the diameter of the cleaning tool may be larger than 1 / 3 of the diameter of the substrate. In this case, the lower surface of the substrate can be efficiently cleaned by the relatively large cleaning tool. Effect of the Invention

[0025] According to the present invention, the underside of a substrate can be cleaned while reducing an increase in the footprint. [Brief description of the drawings]

[0026] [Figure 1] 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention; [Diagram 2] 2 is an external perspective view showing an internal configuration of the substrate cleaning apparatus of FIG. 1. [Diagram 3]2 is a block diagram showing a configuration of a control system of the substrate cleaning apparatus. [Figure 4] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Diagram 5] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 6] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 7] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 8] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 9] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 10] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 11] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 12] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 13] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 14] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 15] 2 is a schematic diagram for explaining an outline of the operation of the substrate cleaning apparatus of FIG. 1. [Figure 16] 8 is a schematic diagram for explaining cleaning of the central region of the lower surface of the substrate in FIG. 7. FIG. [Figure 17] 13 is a schematic diagram for explaining cleaning of the outer region of the lower surface of the substrate in FIG. 12. FIG. [Figure 18] FIG. 2 is a plan view showing the substrate after the bottom surface has been cleaned. [Figure 19] 13A and 13B are schematic views for explaining cleaning of the central region of the lower surface of the substrate in the first modified example. [Figure 20] 13A and 13B are schematic views for explaining cleaning of the central region of the lower surface of the substrate in the second modified example. [Figure 21]13A and 13B are schematic views for explaining cleaning of the central region of the lower surface of the substrate in the third modified example. [Figure 22] 4 is a flowchart showing a substrate cleaning process performed by the control device of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] Hereinafter, a substrate cleaning apparatus and a substrate cleaning method according to an embodiment of the present invention will be described with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate, a substrate for FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. The substrate used in this embodiment has at least a partially circular outer periphery. For example, the outer periphery excluding a positioning notch has a circular shape.

[0028] (1) Configuration of the substrate processing device Fig. 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention. Fig. 2 is an external perspective view showing the internal configuration of the substrate cleaning apparatus 1 of Fig. 1. In the substrate cleaning apparatus 1 according to this embodiment, mutually orthogonal X-, Y-, and Z-directions are defined to clarify the positional relationship. In Fig. 1 and certain figures following Fig. 2, the X-, Y-, and Z-directions are appropriately indicated by arrows. The X- and Y-directions are mutually orthogonal in a horizontal plane, and the Z-direction corresponds to the vertical direction.

[0029] 1, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a pedestal device 30, a delivery device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an edge cleaning device 80, and an opening / closing device 90. These components are provided in a unit housing 2. In FIG. 2, the unit housing 2 is indicated by a dotted line.

[0030] The unit housing 2 has a rectangular bottom surface portion 2a and four side walls 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom surface portion 2a. The side walls 2b and 2c face each other, and the side walls 2d and 2e face each other. A rectangular opening is formed in the center of the side wall portion 2b. This opening is an entrance / exit 2x for the substrate W, and is used when the substrate W is carried into and carried out of the unit housing 2. In FIG. 2, the entrance / exit 2x is indicated by a thick dotted line. In the following description, the direction from inside the unit housing 2 through the entrance / exit 2x toward the outside of the unit housing 2 (the direction from the side wall portion 2c to the side wall portion 2b) in the Y direction is referred to as the front, and the opposite direction (the direction from the side wall portion 2b to the side wall portion 2c) is referred to as the rear.

[0031] An opening / closing device 90 is provided in a portion of the side wall 2b where the loading / unloading opening 2x is formed and in an area in the vicinity thereof. The opening / closing device 90 includes a shutter 91 configured to be able to open and close the loading / unloading opening 2x, and a shutter driver 92 that drives the shutter 91. In FIG. 2, the shutter 91 is indicated by a thick two-dot chain line. The shutter driver 92 drives the shutter 91 to open the loading / unloading opening 2x when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1. The shutter driver 92 also drives the shutter 91 to close the loading / unloading opening 2x when the substrate W is cleaned in the substrate cleaning apparatus 1.

[0032] A pedestal device 30 is provided in the center of the bottom surface portion 2a. The pedestal device 30 includes a linear guide 31, a movable pedestal 32, and a pedestal drive unit 33. The linear guide 31 includes two rails and is provided so as to extend in the Y direction from the vicinity of the side wall portion 2b to the vicinity of the side wall portion 2c in a plan view. The movable pedestal 32 is provided so as to be movable in the Y direction on the two rails of the linear guide 31. The pedestal drive unit 33 includes, for example, a pulse motor, and moves the movable pedestal 32 in the Y direction on the linear guide 31.

[0033] The lower holding device 20 and the lower surface cleaning device 50 are provided on the movable base 32 so as to be aligned in the Y direction. The lower holding device 20 includes an adsorption holding part 21 and an adsorption holding drive part 22. The adsorption holding part 21 is a so-called spin chuck, and has a circular adsorption surface capable of adsorbing and holding the lower surface of the substrate W, and is configured to be rotatable around a central axis 21c (axis in the Z direction) extending in the vertical direction. In the following description, when the substrate W is adsorbed and held by the adsorption holding part 21, the region of the lower surface of the substrate W to be adsorbed by the adsorption surface of the adsorption holding part 21 is referred to as a lower surface central region. Meanwhile, the region of the lower surface of the substrate W surrounding the lower surface central region is referred to as a lower surface outer region.

[0034] The suction hold driving unit 22 includes a motor. The motor of the suction hold driving unit 22 is provided on the movable base 32 so that the rotation shaft protrudes upward. The suction hold unit 21 is attached to the upper end of the rotation shaft of the suction hold driving unit 22. A suction path is formed in the rotation shaft of the suction hold driving unit 22 for suctioning and holding the substrate W in the suction hold unit 21. The suction path is connected to a suction device (not shown). The suction hold driving unit 22 rotates the suction hold unit 21 around the central axis 21c.

[0035] A delivery device 40 is further provided on the movable base 32 near the lower holding device 20. The delivery device 40 includes a plurality of support pins 41 (three in this example), a pin connecting member 42, and a pin lifting and lowering drive unit 43. The pin connecting member 42 is formed so as to surround the suction holding unit 21 in a plan view, and connects the plurality of support pins 41. The plurality of support pins 41 extend upward a certain length from the pin connecting member 42 while being connected to one another by the pin connecting member 42. The pin lifting and lowering drive unit 43 raises and lowers the pin connecting member 42 above the movable base 32. As a result, the plurality of support pins 41 rise and lower relative to the suction holding unit 21.

[0036] The lower surface cleaning device 50 includes a lower surface brush 51, two liquid nozzles 52, a gas ejection unit 53, a lifting support unit 54, a moving support unit 55, a lower surface brush rotation drive unit 55a, a lower surface brush lifting drive unit 55b, and a lower surface brush moving drive unit 55c. The moving support unit 55 is provided so as to be movable in the Y direction relative to the lower holding device 20 within a certain area on the movable base 32. As shown in Fig. 2, the lifting support unit 54 is provided on the moving support unit 55 so as to be liftable. The lifting support unit 54 has an upper surface 54u that is inclined obliquely downward in a direction away from the suction holding unit 21 (rearward in this example).

[0037] 1, the lower surface brush 51 has a circular outer shape in a plan view, and is formed to be relatively large in this embodiment. Therefore, the lower surface of the substrate W can be efficiently cleaned. Specifically, the diameter of the lower surface brush 51 is larger than the diameter of the suction surface of the suction holding unit 21, for example, 1.3 times the diameter of the suction surface of the suction holding unit 21. The diameter of the lower surface brush 51 is larger than 1 / 3 and smaller than 1 / 2 the diameter of the substrate W. The diameter of the substrate W is, for example, 300 mm.

[0038] The lower surface brush 51 has a cleaning surface capable of contacting the lower surface of the substrate W. In addition, the lower surface brush 51 is attached to the upper surface 54u of the lifting support part 54 so that the cleaning surface faces upward and is rotatable around a central axis 51c that passes through the center of the cleaning surface and extends in the vertical direction.

[0039] Each of the two liquid nozzles 52 is attached to the upper surface 54u of the lift support part 54 so as to be located near the lower surface brush 51 and so that its liquid discharge port faces upward. A lower surface cleaning liquid supply part 56 (FIG. 3) is connected to the liquid nozzle 52. The lower surface cleaning liquid supply part 56 supplies cleaning liquid to the liquid nozzle 52. When the substrate W is cleaned by the lower surface brush 51, the liquid nozzle 52 discharges the cleaning liquid supplied from the lower surface cleaning liquid supply part 56 onto the lower surface of the substrate W. In this embodiment, pure water is used as the cleaning liquid supplied to the liquid nozzle 52.

[0040] The gas ejection part 53 is a slit-shaped gas ejection nozzle having a gas ejection port extending in one direction. The gas ejection part 53 is attached to the upper surface 54u of the lift support part 54 so that it is located between the lower surface brush 51 and the suction holding part 21 in a plan view and the gas ejection port faces upward. A gas ejection supply part 57 (FIG. 3) is connected to the gas ejection part 53. The gas ejection supply part 57 supplies gas to the gas ejection part 53. In this embodiment, an inert gas such as nitrogen gas is used as the gas supplied to the gas ejection part 53. The gas ejection part 53 ejects the gas supplied from the gas ejection supply part 57 onto the lower surface of the substrate W when the substrate W is cleaned by the lower surface brush 51 and when the lower surface of the substrate W is dried, which will be described later. In this case, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction holding part 21.

[0041] The lower surface brush rotation drive unit 55a includes a motor and rotates the lower surface brush 51 when the lower surface brush 51 cleans the substrate W. The lower surface brush lift drive unit 55b includes a stepping motor or an air cylinder and lifts and lowers the lift support unit 54 relative to the moving support unit 55. The lower surface brush movement drive unit 55c includes a motor and moves the moving support unit 55 in the Y direction on the movable base 32. Here, the position of the lower holding device 20 on the movable base 32 is fixed. Therefore, when the moving support unit 55 is moved in the Y direction by the lower surface brush movement drive unit 55c, the moving support unit 55 moves relative to the lower holding device 20. In the following description, the position of the lower surface cleaning device 50 when it is closest to the lower holding device 20 on the movable base 32 is called the approach position, and the position of the lower surface cleaning device 50 when it is farthest from the lower holding device 20 on the movable base 32 is called the separation position.

[0042] A cup device 60 is further provided in the center of the bottom surface portion 2a. The cup device 60 includes a cup 61 and a cup drive unit 62. The cup 61 is provided so as to surround the lower holding device 20 and the base device 30 in a plan view and is movable up and down. In FIG. 2, the cup 61 is indicated by a dotted line. The cup drive unit 62 moves the cup 61 between a lower cup position and an upper cup position depending on which part of the lower surface of the substrate W is to be cleaned by the lower surface brush 51. The lower cup position is a height position where the upper end of the cup 61 is below the substrate W adsorbed and held by the adsorption holding unit 21. The upper cup position is a height position where the upper end of the cup 61 is above the adsorption holding unit 21.

[0043] A pair of upper holding devices 10A, 10B are provided at a height position above the cup 61 so as to face each other across the pedestal device 30 in a plan view. The upper holding devices 10A, 10B have a reference position 10R. The upper holding devices 10A, 10B hold the substrate W so that the center of the substrate W is located at the reference position 10R. Specifically, the upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck driving unit 13A, and an upper chuck driving unit 14A. The upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck driving unit 13B, and an upper chuck driving unit 14B.

[0044] The lower chucks 11A, 11B are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) through the center of the suction holding part 21 in a plan view, and are provided to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A, 11B has two support pieces capable of supporting the peripheral portion of the lower surface of the substrate W from below the substrate W. The lower chuck driving parts 13A, 13B move the lower chucks 11A, 11B so that the lower chucks 11A, 11B approach each other or so that the lower chucks 11A, 11B move away from each other.

[0045] The upper chucks 12A, 12B, like the lower chucks 11A, 11B, are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) passing through the center of the suction holding unit 21 in a plan view, and are provided to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A, 12B has two holding pieces configured to be able to hold the outer circumferential end of the substrate W by abutting against two portions of the outer circumferential end of the substrate W. The upper chuck driving units 14A, 14B move the upper chucks 12A, 12B so that the upper chucks 12A, 12B approach each other or move the upper chucks 12A, 12B away from each other.

[0046] 1, an upper surface cleaning device 70 is provided on one side of the cup 61 so as to be located near the upper holding device 10B in a plan view. The upper surface cleaning device 70 includes a rotating support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

[0047] The rotating support shaft 71 is supported on the bottom surface portion 2a so as to extend in the vertical direction and to be movable up and down and rotatable by an upper surface cleaning drive unit 74. As shown in Fig. 2, the arm 72 is provided at a position above the upper holding device 10B and extends horizontally from the upper end of the rotating support shaft 71. A spray nozzle 73 is attached to the tip of the arm 72.

[0048] An upper surface cleaning fluid supply unit 75 (FIG. 3) is connected to the spray nozzle 73. The upper surface cleaning fluid supply unit 75 supplies a cleaning liquid and a gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and an inert gas such as nitrogen gas is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid and the gas supplied from the upper surface cleaning fluid supply unit 75 to generate a mixed fluid, and sprays the generated mixed fluid downward.

[0049] The upper surface cleaning drive unit 74 includes one or more pulse motors, an air cylinder, etc., and raises and lowers the rotary support shaft 71 and rotates the rotary support shaft 71. According to the above configuration, by moving the spray nozzle 73 in an arc above the upper surface of the substrate W that is attracted and held by the suction holding unit 21 and rotated, it is possible to clean the entire upper surface of the substrate W.

[0050] 1, an edge cleaning device 80 is provided on the other side of the cup 61 so as to be located near the upper holding device 10A in a plan view. The edge cleaning device 80 includes a rotating support shaft 81, an arm 82, a bevel brush 83, and a bevel brush driving unit 84.

[0051] The rotating support shaft 81 is supported by a bevel brush driving unit 84 on the bottom surface portion 2a so as to extend in the vertical direction and to be movable up and down and rotatable. As shown in Fig. 2, the arm 82 is provided at a position above the upper holding device 10A and extends horizontally from the upper end of the rotating support shaft 81. A bevel brush 83 is provided at the tip of the arm 82 so as to protrude downward and to be rotatable around a vertical axis.

[0052] The upper half of the bevel brush 83 has an inverted truncated cone shape, and the lower half has a truncated cone shape. With this bevel brush 83, the outer periphery edge of the substrate W can be cleaned by the central portion in the up-down direction of the outer periphery surface.

[0053] The bevel brush driving unit 84 includes one or more pulse motors and air cylinders, and raises and lowers the rotary support shaft 81 and rotates the rotary support shaft 81. According to the above configuration, by bringing the central portion of the outer circumferential surface of the bevel brush 83 into contact with the outer circumferential edge of the substrate W that is attracted and held by the attracting and holding unit 21 and rotated, the entire outer circumferential edge of the substrate W can be cleaned.

[0054] Here, the bevel brush driving unit 84 further includes a motor built into the arm 82. The motor rotates the bevel brush 83 provided at the tip of the arm 82 about an axis in the vertical direction. Therefore, when cleaning the outer circumferential edge of the substrate W, the cleaning power of the bevel brush 83 at the outer circumferential edge of the substrate W is improved by the rotation of the bevel brush 83.

[0055] Fig. 3 is a block diagram showing the configuration of a control system of substrate cleaning apparatus 1. Control device 9 in Fig. 3 includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), and a storage device. The RAM is used as a working area for the CPU. The ROM stores a system program. The storage device stores a control program.

[0056] 3, the control device 9 includes, as its functional parts, a chuck control part 9A, a suction control part 9B, a base control part 9C, a delivery control part 9D, a lower surface cleaning control part 9E, a cup control part 9F, an upper surface cleaning control part 9G, a bevel cleaning control part 9H, and a carry-in / carry-out control part 9I. The functional parts of the control device 9 are realized by the CPU executing, on the RAM, a substrate cleaning program stored in the storage device. Some or all of the functional parts of the control device 9 may be realized by hardware such as electronic circuits.

[0057] The chuck control unit 9A receives the substrate W carried into the substrate cleaning apparatus 1 and controls the lower chuck driving units 13A, 13B and the upper chuck driving units 14A, 14B to hold the substrate W at a position above the suction holding unit 21. The suction control unit 9B controls the suction holding driving unit 22 to suction and hold the substrate W by the suction holding unit 21 and to rotate the substrate W that is suction-held.

[0058] The pedestal control unit 9C controls the pedestal drive unit 33 to move the movable pedestal 32 relative to the substrate W held by the upper holding devices 10A, 10B. The delivery control unit 9D controls the pin lift drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A, 10B and the height position of the substrate W held by the suction holder 21.

[0059] The lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush up / down drive unit 55b, the lower surface brush movement drive unit 55c, the lower surface cleaning liquid supply unit 56, and the jet gas supply unit 57 in order to clean the lower surface of the substrate W. The cup control unit 9F controls a cup drive unit 62 in order to use a cup 61 to receive the cleaning liquid splashed from the substrate W when the substrate W adsorbed and held by the suction holding unit 21 is cleaned.

[0060] The upper surface cleaning control unit 9G controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W adsorbed and held by the suction holding unit 21. The bevel cleaning control unit 9H controls the bevel brush drive unit 84 to clean the outer circumferential edge of the substrate W adsorbed and held by the suction holding unit 21. The load / unload control unit 9I controls the shutter drive unit 92 to open and close the load / unload opening 2x of the unit housing 2 when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1.

[0061] (2) Overview of the operation of the substrate cleaning device 4 to 15 are schematic diagrams for explaining the general operation of the substrate cleaning apparatus 1 of FIG. 1. In each of FIGS. 4 to 15, a plan view of the substrate cleaning apparatus 1 is shown in the upper part. A side view of the lower holding device 20 and its periphery as viewed along the Y direction is shown in the middle part, and a side view of the lower holding device 20 and its periphery as viewed along the X direction is shown in the lower part. The side view in the middle part corresponds to the side view along the AA line in FIG. 1, and the side view in the lower part corresponds to the side view along the BB line in FIG. 1. In addition, in order to facilitate understanding of the shape and operating state of each component in the substrate cleaning apparatus 1, the enlargement and reduction ratios of some components are different between the plan view in the upper part and the side views in the middle and lower parts. In addition, in FIGS. 4 to 15, the cup 61 is shown by a two-dot chain line, and the outer shape of the substrate W is shown by a thick dashed line.

[0062] In the initial state before the substrate W is loaded into the substrate cleaning apparatus 1, the shutter 91 of the opening / closing device 90 closes the loading / unloading opening 2x. As shown in FIG. 1, the lower chucks 11A, 11B are maintained in a state in which the distance between them is sufficiently larger than the diameter of the substrate W. The upper chucks 12A, 12B are also maintained in a state in which the distance between them is sufficiently larger than the diameter of the substrate W. The movable pedestal 32 of the pedestal device 30 is disposed so that the center of the suction holding portion 21 is located at the center of the cup 61 in a plan view. The lower surface cleaning device 50 is disposed in a close position on the movable pedestal 32. The lifting / lowering support portion 54 of the lower surface cleaning device 50 In In this case, the cleaning surface (upper end portion) of the lower surface brush 51 is located lower than the suction holding portion 21.

[0063] In addition, in the delivery device 40, the multiple support pins 41 are located below the suction holding unit 21. Furthermore, in the cup device 60, the cup 61 is in the lower cup position. In the following description, the center position of the cup 61 in a planar view is referred to as the planar reference position rp. Furthermore, the state of the movable base 32 when the center of the suction holding unit 21 is at the planar reference position rp in a planar view is referred to as the first state.

[0064] The substrate W is loaded into the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the loading / unloading opening 2x immediately before the substrate W is loaded. Thereafter, as indicated by the thick solid arrow a1 in Fig. 4, a hand (substrate holding part) RH of a substrate transport robot (not shown) loads the substrate W into a substantially central position in the unit housing 2 through the loading / unloading opening 2x. At this time, the substrate W held by the hand RH is positioned between the lower chuck 11A and the upper chuck 12A and the lower chuck 11B and the upper chuck 12B as shown in Fig. 4.

[0065] Next, as indicated by thick solid arrow a2 in Fig. 5, the lower chucks 11A, 11B approach each other so that the multiple support pieces of the lower chucks 11A, 11B are positioned below the peripheral portion of the lower surface of the substrate W. In this state, the hand RH descends and exits from the loading / unloading opening 2x. As a result, multiple portions of the peripheral portion of the lower surface of the substrate W held by the hand RH are supported by the multiple support pieces of the lower chucks 11A, 11B. After the hand RH exits, the shutter 91 closes the loading / unloading opening 2x.

[0066] Next, as shown by a thick solid arrow a3 in Fig. 6, the upper chucks 12A and 12B approach each other so that the multiple holding pieces of the upper chucks 12A and 12B come into contact with the outer peripheral end of the substrate W. As a result of the multiple holding pieces of the upper chucks 12A and 12B coming into contact with multiple portions of the outer peripheral end of the substrate W, the substrate W supported by the lower chucks 11A and 11B is further held by the upper chucks 12A and 12B. Also, as shown by a thick solid arrow a4 in Fig. 6, the suction holding portion 21 is shifted a predetermined distance from the planar reference position rp and the movable base 32 moves forward so that the center of the lower surface brush 51 is positioned near the planar reference position rp. The state of the movable base 32 at this time is called a second state.

[0067] Next, as indicated by a thick solid arrow a5 in Fig. 7, the lifting support part 54 rises so that the cleaning surface of the lower surface brush 51 comes into contact with the central region of the lower surface of the substrate W. Also, as indicated by a thick solid arrow a6 in Fig. 7, the lower surface brush 51 rotates (spins) around the central axis 51c. As a result, contaminants adhering to the central region of the lower surface of the substrate W are physically peeled off by the lower surface brush 51.

[0068] In the lower part of FIG. 7, an enlarged side view of the portion where the lower brush 51 contacts the lower surface of the substrate W is shown in a bubble. As shown in the bubble, with the lower brush 51 in contact with the substrate W, the liquid nozzle 52 and the gas ejection part 53 are held in a position close to the lower surface of the substrate W. At this time, the liquid nozzle 52 ejects the cleaning liquid toward the lower surface of the substrate W at a position close to the lower brush 51, as shown by the outlined arrow a51. As a result, the cleaning liquid supplied from the liquid nozzle 52 to the lower surface of the substrate W is guided to the contact part between the lower brush 51 and the substrate W, and the contaminants removed from the rear surface of the substrate W by the lower brush 51 are washed away by the cleaning liquid. In this way, in the lower surface cleaning device 50, the liquid nozzle 52 is attached to the lift support part 54 together with the lower brush 51. As a result, the cleaning liquid can be efficiently supplied to the portion of the lower surface of the substrate W cleaned by the lower brush 51. Therefore, the consumption of the cleaning liquid is reduced and excessive scattering of the cleaning liquid is suppressed.

[0069] Here, the upper surface 54u of the lifting support part 54 is inclined obliquely downward in a direction away from the suction holding part 21. In this case, when the cleaning liquid containing contaminants drops from the lower surface of the substrate W onto the lifting support part 54, the cleaning liquid received by the upper surface 54u is guided in a direction away from the suction holding part 21.

[0070] Moreover, when the lower surface of the substrate W is cleaned by the lower surface brush 51, the gas ejection unit 53 ejects gas toward the lower surface of the substrate W at a position between the lower surface brush 51 and the suction holding unit 21, as shown by the white arrow a52 in the blowout in FIG. 7. In this embodiment, the gas ejection unit 53 is attached on the lift support unit 54 so that the gas ejection port extends in the X direction. In this case, when gas is ejected from the gas ejection unit 53 toward the lower surface of the substrate W, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction holding unit 21. This prevents the cleaning liquid containing contaminants from scattering toward the suction holding unit 21 when the lower surface of the substrate W is cleaned by the lower surface brush 51. Therefore, when the lower surface of the substrate W is cleaned by the lower surface brush 51, the cleaning liquid containing contaminants is prevented from adhering to the suction holding unit 21, and the suction surface of the suction holding unit 21 is kept clean.

[0071] 7, the gas blowing part 53 blows gas obliquely upward from the gas blowing part 53 toward the lower surface brush 51 as shown by the outlined arrow a52, but the present invention is not limited to this. The gas blowing part 53 may blow gas from the gas blowing part 53 toward the lower surface of the substrate W along the Z direction. Cleaning of the central region of the lower surface of the substrate W in FIG. 7 will be described later in detail.

[0072] 7, when cleaning of the central region of the lower surface of the substrate W is completed, the rotation of the lower surface brush 51 is stopped, and the lifting support part 54 is lowered so that the cleaning surface of the lower surface brush 51 is spaced a predetermined distance from the substrate W. In addition, the discharge of the cleaning liquid from the liquid nozzle 52 to the substrate W is stopped. At this time, the spray of gas from the gas blowing part 53 to the substrate W continues.

[0073] 8, the movable base 32 moves backward so that the central axis 21c of the suction holder 21 is located at the planar reference position rp, thereby changing the movable base 32 from the second state to the first state. In this case, the reference position 10R of the upper holding devices 10A, 10B and the central axis 21c of the suction holder 21 coincide with each other in a planar view. At this time, the gas is continuously ejected from the gas ejection unit 53 onto the substrate W, so that the central region of the lower surface of the substrate W is sequentially dried by the gas curtain.

[0074] Next, as shown by a thick solid arrow a8 in Fig. 9, the lifting support part 54 descends so that the cleaning surface of the lower surface brush 51 is positioned below the suction surface (upper end) of the suction holding part 21. Also, as shown by a thick solid arrow a9 in Fig. 9, the upper chucks 12A, 12B move away from each other so that the multiple holding pieces of the upper chucks 12A, 12B are separated from the outer circumferential end of the substrate W. At this time, the substrate W is supported by the lower chucks 11A, 11B.

[0075] 9, the pin connecting member 42 is raised so that the upper ends of the plurality of support pins 41 are positioned slightly above the lower chucks 11A and 11B. As a result, the substrate W supported by the lower chucks 11A and 11B is received by the plurality of support pins 41.

[0076] Next, the lower chucks 11A and 11B move away from each other as indicated by a thick solid arrow a11 in Fig. 10. At this time, the lower chucks 11A and 11B move to positions where they do not overlap the substrate W supported by the multiple support pins 41 in a plan view. As a result, both of the upper holding devices 10A and 10B return to their initial states.

[0077] 11, the pin connecting member 42 is lowered so that the upper ends of the multiple support pins 41 are positioned below the suction holding portion 21. As a result, the substrate W supported on the multiple support pins 41 is received by the suction holding portion 21. In this state, the suction holding portion 21 suction-holds the central region of the lower surface of the substrate W. Simultaneously with the descent of the pin connecting member 42 or after the descent of the pin connecting member 42 is completed, the cup 61 is raised from the lower cup position to the upper cup position, as shown by the thick solid arrow a13 in FIG.

[0078] 12, the suction holding part 21 rotates around the central axis 21c (the axis of the rotation axis of the suction holding drive part 22). As a result, the substrate W sucked and held by the suction holding part 21 rotates in a horizontal position.

[0079] Next, the rotary support shaft 71 of the upper surface cleaning device 70 rotates and descends. As a result, as shown by a thick solid arrow a15 in Fig. 12, the spray nozzle 73 moves to a position above the substrate W, and descends so that the distance between the spray nozzle 73 and the substrate W becomes a predetermined distance. In this state, the spray nozzle 73 sprays a mixed fluid of a cleaning liquid and a gas onto the upper surface of the substrate W. In addition, the rotary support shaft 71 rotates. As a result, as shown by a thick solid arrow a16 in Fig. 12, the spray nozzle 73 moves to a position above the rotating substrate W. The mixed fluid is sprayed onto the entire upper surface of the substrate W, so that the entire upper surface of the substrate W is cleaned.

[0080] Moreover, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the rotary support shaft 81 of the edge cleaning device 80 also rotates and descends. As a result, the bevel brush 83 moves to a position above the outer circumferential edge of the substrate W, as shown by a thick solid arrow a17 in FIG. 12. Also, the central portion of the outer circumferential surface of the bevel brush 83 descends so as to contact the outer circumferential edge of the substrate W. In this state, the bevel brush 83 rotates (spins) around an axis in the up-down direction. As a result, contaminants adhering to the outer circumferential edge of the substrate W are physically peeled off by the bevel brush 83. The contaminants peeled off from the outer circumferential edge of the substrate W are washed away by the cleaning liquid of the mixed fluid sprayed from the spray nozzle 73 onto the substrate W.

[0081] Furthermore, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the lifting support part 54 rises so that the cleaning surface of the lower surface brush 51 comes into contact with the outer region of the lower surface of the substrate W. Also, as shown by a thick solid arrow a18 in Fig. 12, the lower surface brush 51 rotates (spins) around the central axis 51c. Furthermore, the liquid nozzle 52 ejects the cleaning liquid toward the lower surface of the substrate W, and the gas ejection part 53 ejects gas toward the lower surface of the substrate W. This allows the lower surface brush 51 to clean the entire outer region of the lower surface of the substrate W that is sucked and held by the suction holding part 21 and rotated.

[0082] When the lower surface brush 51 is not relatively large, the moving support part 55 may move forward and backward between the close position and the separated position on the movable base 32, as shown by a thick solid arrow a19 in Fig. 12. Even in this case, the lower surface brush 51 can clean the entire outer region of the lower surface of the substrate W that is attracted and held by the suction holding part 21 and rotated.

[0083] Next, when cleaning of the upper surface, the outer peripheral end, and the outer region of the lower surface of the substrate W is completed, the spray nozzle 73 stops spraying the mixed fluid onto the substrate W. Also, as shown by a thick solid arrow a20 in FIG. 13, the spray nozzle 73 moves to a position on one side of the cup 61 (initial state position). Also, as shown by a thick solid arrow a21 in FIG. 13, the bevel brush 83 moves to a position on the other side of the cup 61 (initial state position). Furthermore, the rotation of the lower brush 51 is stopped, and the lift support part 54 is lowered so that the cleaning surface of the lower brush 51 is separated from the substrate W by a predetermined distance. Also, the discharge of the cleaning liquid from the liquid nozzle 52 onto the substrate W and the spray of the gas from the gas blowing part 53 onto the substrate W are stopped. In this state, the suction holding part 21 rotates at high speed, so that the cleaning liquid adhering to the substrate W is shaken off, and the entire substrate W is dried.

[0084] Next, the cup 61 descends from the upper cup position to the lower cup position, as shown by a thick solid arrow a22 in Fig. 14. Also, in preparation for a new substrate W being carried into the unit housing 2, the lower chucks 11A and 11B approach each other to positions where they can support the new substrate W, as shown by a thick solid arrow a23 in Fig. 14.

[0085] Finally, the substrate W is unloaded from within the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the loading / unloading opening 2x immediately before the substrate W is unloaded. Thereafter, as indicated by a thick solid arrow a24 in Fig. 15, a hand (substrate holder) RH of a substrate transport robot (not shown) enters the unit housing 2 through the loading / unloading opening 2x. Next, the hand RH receives the substrate W on the suction holder 21, and exits through the loading / unloading opening 2x. After the hand RH exits, the shutter 91 closes the loading / unloading opening 2x.

[0086] (3) Cleaning the underside of the board Fig. 16 is a schematic diagram for explaining cleaning of the central region of the lower surface of the substrate W in Fig. 7. As indicated by solid arrow a4 in Fig. 6, when cleaning the central region R1 of the lower surface of the substrate W, the movable base 32 moves forward to enter the second state. At this time, as shown in the upper part of Fig. 16, the central axis 51c of the lower surface brush 51 of the movable base 32 coincides with the center Wc of the substrate W. That is, in a plan view, the central axis 51c of the lower surface brush 51 overlaps with the center Wc of the substrate W held by the upper holding devices 10A, 10B in Fig. 1.

[0087] Next, as shown in the middle of Fig. 16, the lower surface brush 51 rises so that the cleaning surface comes into contact with the lower surface central region R1 of the substrate W. In addition, the lower surface brush 51 rotates (spins) around the central axis 51c. In this case, the cleaning surface of the lower surface brush 51 rubs against the lower surface central region R1 of the substrate W, thereby peeling off contaminants adhering to the lower surface central region R1. This cleans the lower surface central region R1 of the substrate W. The cleaning operation in the middle of Fig. 16 is called a first cleaning operation.

[0088] In the first cleaning operation, the center of the lower surface brush 51 hardly rubs the substrate W. Therefore, contaminants at the center Wc of the substrate W that contacts the central axis 51c of the lower surface brush 51 may not be completely peeled off and may remain slightly. Therefore, after the first cleaning operation is performed, as shown in the lower part of Fig. 16, the movable base 32 moves to a position where the lower surface brush 51 overlaps with the substrate W and the central axis 51c does not coincide with the center Wc of the substrate W.

[0089] In this case, in a plan view, the lower surface brush 51 overlaps with the lower surface central region R1 of the substrate W. Furthermore, the central axis 51c of the lower surface brush 51 coincides with a portion Pa that is different from the center Wc of the substrate W. In this state, the lower surface brush 51 rotates and comes into contact with the lower surface of the substrate W, thereby peeling off contaminants remaining at the center Wc of the substrate W that was in contact with the central axis 51c of the lower surface brush 51 in the first cleaning operation. This allows the lower surface central region R1 of the substrate W to be thoroughly cleaned. In FIG. Lower row This cleaning operation is called the second cleaning operation.

[0090] After the second cleaning operation is performed, the substrate W is dried and transferred from the upper holding devices 10A, 10B to the lower holding device 20 in sequence, as shown in Figures 8 to 11. Furthermore, as shown in Figure 12, the upper surface, outer circumferential surface and lower outer region of the substrate W are cleaned. Figure 17 is a schematic diagram for explaining the cleaning of the lower outer region of the substrate W in Figure 12. When the upper surface, outer circumferential surface and lower outer region of the substrate W are cleaned, the movable base 32 moves backward to reach the first state, as shown by the solid arrow a7 in Figure 8.

[0091] 17, the lower brush 51 rises so that the cleaning surface comes into contact with the lower surface outer region R2 of the substrate W. In Fig. 17, when cleaning the lower surface outer region R2 of the substrate W, the lower brush 51 is arranged so that a part of it protrudes outward from the substrate W, but the embodiment is not limited to this. The lower brush 51 may be arranged so that its outer edge overlaps with the outer edge of the substrate W.

[0092] Thereafter, the suction holding unit 21 rotates around the central axis 21c. In this example, the lower surface brush 51 also rotates around the central axis 51c. This cleans the lower surface outer region R2. The rotation direction of the lower surface brush 51 may be opposite to the rotation direction of the suction holding unit 21. In this case, the lower surface outer region R2 of the substrate W can be cleaned efficiently. On the other hand, the lower surface outside When cleaning an area, the lower brush 51 does not have to rotate about the central axis 51c.

[0093] Fig. 18 is a plan view showing the substrate W after the bottom surface has been cleaned. In Fig. 18, the area of ​​the bottom surface of the substrate W cleaned when the movable pedestal 32 in Fig. 1 is in the second state is shown by a dot pattern, and the area of ​​the bottom surface of the substrate W cleaned when the movable pedestal 32 is in the first state is shown by a hatched pattern. The area of ​​the bottom surface of the substrate W cleaned when the movable pedestal 32 is in the second state is the sum of the area of ​​the bottom surface of the substrate W cleaned during the first cleaning operation and the area of ​​the bottom surface of the substrate W cleaned during the second cleaning operation.

[0094] In this example, the area of ​​the lower surface of the substrate W that is cleaned when the movable pedestal 32 is in the second state includes the entire lower surface central region R1. Therefore, as shown in FIG. 18, when the movable pedestal 32 is in the second state, the entire lower surface central region R1 is cleaned. Also, when the movable pedestal 32 is in the second state, the entire lower surface outer region R2 is cleaned. The area of ​​the lower surface of the substrate W that is cleaned when the movable pedestal 32 is in the first state may partially overlap with the area of ​​the lower surface of the substrate W that is cleaned when the movable pedestal 32 is in the second state. In this way, the entire lower surface of the substrate W is cleaned by the movement of the movable pedestal 32 along the linear guide 31 in FIG. 1.

[0095] As described above, in the present embodiment, during the first cleaning operation, the lower surface central region R1 of the substrate W is cleaned in a state in which the central axis 51c of the lower surface brush 51 coincides with the center Wc of the substrate W. Thereafter, during the second cleaning operation, the lower surface central region R1 of the substrate W is cleaned in a state in which the central axis 51c of the lower surface brush 51 coincides with a portion Pa different from the center Wc of the substrate W. However, the embodiment is not limited to this.

[0096] Fig. 19 is a schematic diagram for explaining cleaning of the lower surface central region R1 of the substrate W in the first modified example. In the first modified example, as shown in the upper part of Fig. 19, during the first cleaning operation, the lower surface central region R1 of the substrate W is cleaned in a state in which the central axis 51c of the lower surface brush 51 and the portion Pa of the substrate W coincide with each other. Thereafter, as shown in the lower part of Fig. 19, during the second cleaning operation, the lower surface central region R1 of the substrate W is cleaned in a state in which the central axis 51c of the lower surface brush 51 and the center Wc of the substrate W coincide with each other. In this way, when cleaning the lower surface central region R1, the order of the first cleaning operation and the second cleaning operation is not limited.

[0097] Fig. 20 is a schematic diagram for explaining cleaning of the lower surface central region R1 of the substrate W in the second modified example. In the second modified example, as shown in the upper part of Fig. 20, during the first cleaning operation, the lower surface central region R1 of the substrate W is cleaned in a state in which the central axis 51c of the lower surface brush 51 coincides with the portion Pa of the substrate W. Thereafter, as shown in the lower part of Fig. 20, the lower surface central region R1 of the substrate W is cleaned in a state in which the central axis 51c of the lower surface brush 51 coincides with another portion Pb of the substrate W different from the portion Pa.

[0098] In this manner, cleaning of the lower surface central region R1 may be performed in a state in which the central axis 51c of the lower surface brush 51 does not coincide with the center Wc of the substrate W. On the other hand, the center Wc of the substrate W may be regarded as portion Pb, and cleaning of the lower surface central region R1 may be performed in a state in which the central axis 51c of the lower surface brush 51 coincides with the center Wc of the substrate W, as in the examples of Figures 16 and 19. With this configuration, even if the lower surface brush 51 is not relatively large, it is possible to sufficiently clean the lower surface central region R1 of the substrate W.

[0099] FIG. 21 is a schematic diagram for explaining cleaning of the lower surface central region R1 of the substrate W in the third modified example. In the third modified example, as shown in FIG. 21, the diameter of the lower surface brush 51 is sufficiently large. Specifically, the diameter of the lower surface brush 51 is larger than 1 / 2 the diameter of the substrate W. Therefore, the lower surface brush 51 completely encompasses the lower surface central region R1 in a plan view during the first cleaning operation. Furthermore, the central axis 51c of the lower surface brush 51 contacts a portion Pa located outside the lower surface central region R1. In this state, the lower surface central region R1 of the substrate W is cleaned.

[0100] In this way, also in the third modified example, cleaning of the lower surface central region R1 is performed in a state in which the central axis 51c of the lower surface brush 51 does not coincide with the center Wc of the substrate W. Also, in this example, the second cleaning operation is not performed. In this case, during cleaning of the lower surface central region R1, contaminants on the portion Pa of the substrate W that contacts the central axis 51c of the lower surface brush 51 may not be completely removed and may remain slightly.

[0101] However, the portion Pa of the substrate W where the contaminants remain is located outside the lower surface central region R1. Therefore, by cleaning the lower surface outer region R2, the contaminants remaining on the portion Pa of the substrate W that was in contact with the central shaft 51c of the lower surface brush 51 during cleaning of the lower surface central region R1 are peeled off. This makes it possible to clean the entire lower surface of the substrate W.

[0102] (4) Substrate cleaning process Fig. 22 is a flow chart showing the substrate cleaning process by the control device 9 of Fig. 3. The substrate cleaning process of Fig. 22 is performed by the CPU of the control device 9 executing a substrate cleaning program stored in the storage device on the RAM. The substrate cleaning process will be described below with reference to the control device 9 of Fig. 3, the substrate cleaning apparatus 1 of Figs. 4 to 17, and the flow chart of Fig. 22.

[0103] First, the loading / unloading control unit 9I controls the shutter driving unit 92 to load the substrate W into the unit housing 2 (FIGS. 4, 5, and step S1). Next, the chuck control unit 9A controls the lower chuck driving units 13A, 13B and the upper chuck driving units 14A, 14B to hold the substrate W by the upper holding devices 10A, 10B (FIGS. 5, 6, and step S2).

[0104] Next, the pedestal control unit 9C controls the pedestal drive unit 33 to move the movable pedestal 32 so that the movable pedestal 32 is in the second state (FIG. 6 and step S3). Thereafter, the lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lift drive unit 55b, the lower surface brush movement drive unit 55c, the lower surface cleaning liquid supply unit 56 and the jet gas supply unit 57 to clean the entire central region of the lower surface of the substrate W (FIGS. 7, 16 and step S4).

[0105] Next, the lower surface cleaning control unit 9E controls the jet gas supply unit 57 to dry the substrate W (FIG. 8 and step S5). Furthermore, the pedestal control unit 9C controls the pedestal driving unit 33 to move the movable pedestal 32 so that the movable pedestal 32 is in the first state (FIG. 8 and step S6). In this example, steps S5 and S6 are performed substantially simultaneously. As a result, the central region of the lower surface of the substrate W is sequentially dried.

[0106] Next, the chuck control unit 9A controls the lower chuck driving units 13A, 13B and the upper chuck driving units 14A, 14B, and the delivery control unit 9D controls the pin lifting and lowering driving unit 43, thereby delivering the substrate W from the upper holding devices 10A, 10B to the lower holding device 20 (FIGS. 8 to 11 and step S7). In this state, the suction control unit 9B controls the suction hold driving unit 22 to suction the central region of the lower surface of the substrate W, thereby causing the lower holding device 20 to hold the substrate W (FIG. 11 and step S8).

[0107] Thereafter, the upper surface cleaning control unit 9G controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the entire upper surface of the substrate W (FIG. 12 and step S9). In addition, the bevel cleaning control unit 9H controls the bevel brush drive unit 84 to clean the outer peripheral edge of the substrate W (FIG. 12 and step S10). Furthermore, the lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lift drive unit 55b, the lower surface brush movement drive unit 55c, the lower surface cleaning liquid supply unit 56, and the jet gas supply unit 57 to clean the entire outer region of the lower surface of the substrate W (FIGS. 12, 17, and step S11).

[0108] Steps S9 to S11 are performed substantially simultaneously. When steps S9 to S11 are performed, the suction control unit 9B controls the suction hold driving unit 22 to rotate the substrate W around the axis of the rotation shaft of the suction hold driving unit 22. In addition, the cup control unit 9F controls the cup driving unit 62 to lift the cup 61 from the lower cup position to the upper cup position.

[0109] After the cleaning is completed, the suction control unit 9B controls the suction holding drive unit 22 to rotate the suction holding unit 21 at high speed, thereby drying the entire substrate W (FIG. 13 and step S12). After the cleaning is completed and drying is completed, the upper holding devices 10A, 10B and the cup 61 are returned to their initial states (FIG. 14). Finally, the loading / unloading control unit 9I controls the shutter drive unit 92 to unload the substrate W from the unit housing 2 (FIG. 15 and step S13), thereby completing the substrate cleaning process.

[0110] (5) Effects In the substrate cleaning apparatus 1 according to this embodiment, the substrate W is held by the upper holding devices 10A, 10B such that the center of the substrate W is located at the reference position 10R. The substrate W is rotated around the central axis 21c while the lower surface central region R1 of the substrate W is held by the suction holding unit 21. The lower surface brush 51 is brought into contact with the lower surface central region R1 of the substrate W held by the upper holding devices 10A, 10B and rotated around the central axis 51c to clean the lower surface central region R1. The lower surface brush 51 is brought into contact with the lower surface outer region R2 of the substrate W rotated by the suction holding unit 21 to clean the lower surface outer region R2.

[0111] The suction holding unit 21, the lower surface brush 51, and the gas ejection unit 53 are provided on the movable base 32. When the substrate W is transferred between the upper holding devices 10A, 10B and the suction holding unit 21, the movable base 32 is moved in a horizontal plane so that the reference position 10R of the upper holding devices 10A, 10B and the central axis 21c of the suction holding unit 21 coincide with each other in a plan view. When the lower surface central region R1 is cleaned, the movable base 32 is moved in a horizontal plane so that the lower surface brush 51 overlaps with the lower surface central region R1 of the substrate W held by the upper holding devices 10A, 10B and the central axis 51c of the lower surface brush 51 coincides with a portion Pa different from the center of the substrate W in a plan view.

[0112] According to this substrate cleaning apparatus 1, it is not necessary to move the substrate W in a horizontal plane to clean the lower surface of the substrate W. Here, when cleaning the lower surface central region R1, a small amount of contaminants may remain in the portion Pa of the substrate W that contacts the central axis 51c of the lower surface brush 51. Therefore, when cleaning the lower surface central region R1, the movable base 32 is further moved in the horizontal plane so that the lower surface brush 51 coincides with a portion Pb of the substrate W that is different from the portion Pa of the substrate W held by the upper holding devices 10A and 10B in a plan view. This removes the small amount of contaminants remaining in the portion Pa of the substrate W.

[0113] Therefore, contaminants do not adhere to the suction holding part 21 from the lower surface of the substrate W. Therefore, even when a plurality of substrates W are cleaned sequentially, cross-contamination between the plurality of substrates W does not occur via the suction holding part 21. This makes it possible to clean the lower surface of the substrate W while reducing an increase in the footprint.

[0114] The gas ejection unit 53 ejects gas onto the underside of the substrate W to dry the cleaned underside central region R1 or the underside outer region R2. In this case, the underside of the substrate W is dried entirely in a short time as the movable base 32 moves. This can improve the cleaning efficiency of the underside of the substrate W.

[0115] (6) Other embodiments (a) In the above embodiment, contaminants are removed from the portion Pa of the substrate W without remaining, but the embodiment is not limited to this. A small amount of contaminants may remain on the portion Pa of the substrate W. Even in this case, the center Wc of the substrate W does not come into contact with the central axis 51c of the lower surface brush 51 when the lower surface central region R1 is cleaned, so that no contaminants remain on the center Wc of the substrate W. Therefore, almost no contaminants adhere to the suction holding portion 21 from the center Wc of the substrate W. Therefore, even when multiple substrates W are cleaned sequentially, cross-contamination between the multiple substrates W via the suction holding portion 21 hardly occurs.

[0116] (b) In the above embodiment, after the lower central region R1 of the substrate W is cleaned in the upper holding device 10A, 10B, the lower outer region R2 of the substrate W is cleaned in the lower holding device 20, but the embodiment is not limited to this. After the lower outer region R2 of the substrate W is cleaned in the lower holding device 20, the lower central region R1 of the substrate W may be cleaned in the upper holding device 10A, 10B.

[0117] (c) In the above embodiment, substrate cleaning apparatus 1 includes gas blowing unit 53 provided on movable base 32, but the embodiment is not limited to this. Substrate cleaning apparatus 1 does not have to include gas blowing unit 53. In addition, gas blowing unit 53 does not have to be provided on movable base 32.

[0118] (d) In the above embodiment, the movable base 32 moves linearly within a horizontal plane, but the embodiment is not limited to this. The movable base 32 may move in a curved line within a horizontal plane.

[0119] (e) In the above embodiment, the substrate cleaning apparatus 1 includes the delivery device 40 for transferring the substrate W between the upper holding devices 10A, 10B and the lower holding device 20, but the embodiment is not limited to this. If the upper holding devices 10A, 10B and the lower holding device 20 are configured to be able to directly transfer the substrate W between them, the substrate cleaning apparatus 1 does not need to include the delivery device 40.

[0120] (f) In the above embodiment, the upper surface and the outer circumferential edge of the substrate W are cleaned, but the embodiment is not limited to this. The upper surface of the substrate W does not have to be cleaned. In this case, the substrate cleaning apparatus 1 does not include the upper surface cleaning apparatus 70. Similarly, the outer circumferential edge of the substrate W does not have to be cleaned. In this case, the substrate cleaning apparatus 1 does not include the edge cleaning apparatus 80.

[0121] (g) In the above embodiment, substrate cleaning apparatus 1 includes control device 9, but the embodiment is not limited to this. If substrate cleaning apparatus 1 is configured to be controllable by an external information processing device, substrate cleaning apparatus 1 does not need to include control device 9.

[0122] (7) Correspondence between each component of the claims and each part of the embodiment Below, examples of the correspondence between each component of the claims and each element of the embodiment will be described, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

[0123] In the above embodiment, the reference position 10R is an example of a reference position, the substrate W is an example of a substrate, the center Wc is an example of a center, the upper holding devices 10A, 10B and the suction holding unit 21 are examples of the first and second holding units, respectively. The central axes 21c, 51c are examples of the first and second central axes, respectively. The lower surface central region R1 is an example of a lower surface central region, the lower surface outer region R2 is an example of a lower surface outer region, and the lower surface brush 51 is an example of a cleaning tool. The parts Pa, Pb are examples of the first and second parts, respectively. The movable base 32 is an example of a movable base, the substrate cleaning device 1 is an example of a substrate cleaning device, the gas ejection unit 53 is an example of a gas ejection unit, and the linear guide 31 is an example of a linear guide. (8) Reference form (8-1) A substrate cleaning apparatus according to a first embodiment includes a first holding unit having a reference position and holding a substrate such that a center of the substrate is located at the reference position; a second holding unit having a first central axis extending in a vertical direction and rotating the substrate around the first central axis while holding a central region of an underside of the substrate; and a second holding unit having a second central axis extending in a vertical direction and rotating the substrate around the second central axis while contacting the central region of the underside of the substrate held by the first holding unit to clean the central region of the underside of the substrate, and and a movable base that is provided with a second holding part and a cleaning tool, and that moves within a horizontal plane so that, when the substrate is transferred between the first holding part and the second holding part, a reference position of the first holding part and a first central axis of the second holding part coincide in a plan view, and when the central region of the underside is cleaned, the cleaning tool overlaps with the central region of the underside of the substrate held by the first holding part and the second central axis of the cleaning tool coincides with a first portion different from the center of the substrate in a plan view. In this substrate cleaning apparatus, a first holding unit holds a substrate such that the center of the substrate is located at a reference position. A second holding unit holds a central region of the underside of the substrate and rotates the substrate around a first central axis extending in the vertical direction. A cleaning tool is brought into contact with the central region of the underside of the substrate held by the first holding unit and rotated around a second central axis extending in the vertical direction, thereby cleaning the central region of the underside. A cleaning tool is brought into contact with an outer region of the underside surrounding the central region of the underside of the substrate rotated by the second holding unit, thereby cleaning the outer region of the underside. The second holder and the cleaning tool are provided on a movable base. When the substrate is transferred between the first holder and the second holder, the movable base is moved in a horizontal plane so that a reference position of the first holder and a first central axis of the second holder coincide in a plan view. When the central region of the lower surface is cleaned, the movable base is moved in a horizontal plane so that the cleaning tool overlaps with the central region of the lower surface of the substrate held by the first holder and the second central axis of the cleaning tool coincides with a first portion different from the center of the substrate in a plan view. According to this substrate cleaning apparatus, it is not necessary to move the substrate in a horizontal plane in order to clean the underside of the substrate. Here, when cleaning the central region of the underside, a small amount of contaminants may remain on the first portion of the substrate that contacts the second central axis of the cleaning tool. However, since the center of the substrate does not contact the second central axis of the cleaning tool, no contaminants remain on the center of the substrate. Therefore, almost no contaminants adhere to the second holder from the center of the substrate. Therefore, even when multiple substrates are cleaned in sequence, cross-contamination between multiple substrates via the second holder hardly occurs. This makes it possible to clean the underside of the substrate while reducing an increase in the footprint. (8-2) When cleaning the central region of the lower surface, the movable base may be further moved in the horizontal plane so that, in a plan view, the cleaning tool coincides with a second portion of the substrate held by the first holder, the second portion being different from the first portion. In this case, contaminants remaining in a small amount on the first portion of the substrate are removed. This allows the lower surface of the substrate to be thoroughly cleaned. (8-3) The second portion of the substrate may be the center of the substrate. With this configuration, even if the cleaning tool is not relatively large, the central area of ​​the lower surface of the substrate can be sufficiently cleaned. (8-4) The substrate cleaning apparatus may further include a gas ejection unit that is provided on the movable base and ejects gas onto the underside of the substrate to dry the central region or the outer region of the underside after cleaning. In this case, the underside of the substrate is dried entirely in a short time as the movable base moves. This can improve the cleaning efficiency of the underside of the substrate. (8-5) The substrate cleaning apparatus may further include a linear guide extending in one direction in a horizontal plane, and the movable base may move linearly along the linear guide. In this case, the movable base can be moved in the horizontal plane with a simple configuration. (8-6) Each of the second holder and the cleaning tool may have a circular outer shape, and the diameter of the cleaning tool may be larger than the diameter of the second holder. In this case, the lower surface of the substrate can be efficiently cleaned by the relatively large cleaning tool. (8-7) Each of the substrate and the cleaning tool may have a circular outer shape, and the diameter of the cleaning tool may be larger than 1 / 3 of the diameter of the substrate. In this case, the lower surface of the substrate can be efficiently cleaned by the relatively large cleaning tool. (8-8) A substrate cleaning method according to a second reference embodiment includes holding a substrate with a first holding part such that the center of the substrate is located at a reference position; rotating the substrate around a first central axis extending in a vertical direction while holding a central region of an underside of the substrate with a second holding part; cleaning the central region of the underside of the substrate held by the first holding part by rotating the cleaning tool around a second central axis extending in a vertical direction while contacting the central region of the underside of the substrate held by the first holding part; and contacting a cleaning tool with an outer region of the underside of the substrate rotated by the second holding part to surround the central region of the underside of the substrate. the movable base on which the second holding part and the cleaning tool are mounted is moved in a horizontal plane so that, when transferring the substrate between the first holding part and the second holding part, the reference position of the first holding part and the first central axis of the second holding part coincide in a plan view; and, when cleaning the central region of the underside, the movable base is moved in a horizontal plane so that, when viewed in a plan view, the cleaning tool overlaps with the central region of the underside of the substrate held by the first holding part and the second central axis of the cleaning tool coincides with a first portion different from the center of the substrate. According to this substrate cleaning method, it is not necessary to move the substrate in a horizontal plane to clean the underside of the substrate. In addition, when cleaning the central region of the underside, the center of the substrate does not contact the second central axis of the cleaning tool, and contaminants hardly adhere to the second holder from the center of the substrate. Therefore, even when multiple substrates are cleaned sequentially, cross-contamination between multiple substrates via the second holder hardly occurs. This makes it possible to clean the underside of the substrate while reducing the increase in footprint. (8-9) The substrate cleaning method may further include, during cleaning of the central region of the lower surface, moving the movable base in a horizontal plane so that, in a plan view, the cleaning tool coincides with a second portion of the substrate held by the first holder, the second portion being different from the first portion. In this case, contaminants remaining in a small amount on the first portion of the substrate are removed. This allows the lower surface of the substrate to be thoroughly cleaned. (8-10) The second portion of the substrate may be the center of the substrate. With this configuration, even if the cleaning tool is not relatively large, the central region of the lower surface of the substrate can be sufficiently cleaned. (8-11) The substrate cleaning method may further include drying the central region or the outer region of the underside after cleaning by blowing gas onto the underside of the substrate from a gas blowing unit provided on the movable base. In this case, the underside of the substrate is dried entirely in a short time as the movable base moves. This can improve the cleaning efficiency of the underside of the substrate. (8-12) Moving the movable base in a horizontal plane may include moving the movable base linearly along a linear guide extending in one direction in the horizontal plane. In this case, the movable base can be moved in the horizontal plane with a simple configuration. (8-13) Each of the second holder and the cleaning tool may have a circular outer shape, and the diameter of the cleaning tool may be larger than the diameter of the second holder. In this case, the lower surface of the substrate can be efficiently cleaned by the relatively large cleaning tool. (8-14) Each of the substrate and the cleaning tool may have a circular outer shape, and the diameter of the cleaning tool may be larger than 1 / 3 of the diameter of the substrate. In this case, the lower surface of the substrate can be efficiently cleaned by the relatively large cleaning tool. [Explanation of symbols]

[0124] 1...substrate cleaning device, 2...unit housing, 2a...bottom surface portion, 2b-2e...side wall portion, 2x...loading / unloading port, 9...control device, 9A...chuck control portion, 9B...suction control portion, 9C...pedestal control portion, 9D...delivery control portion, 9E...lower surface cleaning control portion, 9F...cup control portion, 9G...upper surface cleaning control portion, 9H...bevel cleaning control portion, 9I...loading / unloading control portion, 10A, 10B...upper holding device, 10R...reference position , 11A...lower chuck, 12A...upper chuck, 13A...lower chuck drive unit, 14A...upper chuck drive unit, 20...lower holding device, 21...suction holding unit, 21c, 51c...central axis, 22...suction holding drive unit, 30...pedestal device, 31...linear guide, 32...movable base, 33...pedestal drive unit, 40...delivery device, 41...support pin, 42...pin connecting member, 43...pin lift drive unit, 50...lower surface washing Cleaning device, 51... lower surface brush, Wc... center, 52... liquid nozzle, 53... gas ejection section, 54... lifting support section, 54u... upper surface, 55... movement support section, 55a... lower surface brush rotation drive section, 55b... lower surface brush lifting drive section, 55c... lower surface brush movement drive section, 56... lower surface cleaning liquid supply section, 57... ejected gas supply section, 60... cup device, 61... cup, 62... cup drive section, 70... upper surface cleaning device, 71 , 81...rotating support shaft, 72, 82...arm, 73...spray nozzle, 74...upper surface cleaning drive unit, 75...upper surface cleaning fluid supply unit, 80...edge cleaning device, 83...bevel brush, 84...bevel brush drive unit, 90...opening / closing device, 91...shutter, 92...shutter drive unit, Pa, PbPb...part, R1...lower surface central region, R2...lower surface outer region, RH...hand, rp...plane reference position, W...substrate

Claims

1. a first holder having a reference position and configured to hold the substrate such that a center of the substrate is positioned at the reference position; a second holding unit having a first central axis extending in a vertical direction and rotating the substrate around the first central axis while holding a central region of a lower surface of the substrate; a cleaning tool having a second central axis extending in the up-down direction, which rotates around the second central axis while contacting the underside central region of the substrate held by the first holding part to clean the underside central region, and which cleans the underside outer region by contacting a underside outer region surrounding the underside central region of the substrate rotated by the second holding part; a movable base that is provided with the second holding part and the cleaning tool, and that moves within a horizontal plane so that, when the substrate is transferred between the first holding part and the second holding part, the reference position of the first holding part and the first central axis of the second holding part coincide with each other in a plan view, and when the central region of the lower surface is cleaned, the cleaning tool overlaps with the central region of the lower surface of the substrate held by the first holding part and the second central axis of the cleaning tool coincides with a first portion different from the center of the substrate in the plan view, The second holder moves together with the movable base within a horizontal plane.

2. The substrate cleaning apparatus of claim 1 , wherein the movable base further moves within the horizontal plane so that, when cleaning the central region of the lower surface, the cleaning tool coincides with a second portion of the substrate held by the first holding part, the second portion being different from the first portion, in the planar view.

3. The apparatus for cleaning a substrate of claim 2 , wherein the second portion of the substrate is a center of the substrate.

4. The substrate cleaning apparatus according to any one of claims 1 to 3, further comprising a gas ejection unit provided on the movable base for ejecting gas onto an underside of the substrate to dry the central region or the outer region of the underside after cleaning.

5. Further comprising a linear guide extending in one direction within the horizontal plane, 5. The substrate cleaning apparatus according to claim 1, wherein the movable base moves linearly along the linear guide.

6. Each of the second holder and the cleaning tool has a circular outer shape; The substrate cleaning apparatus according to claim 1 , wherein a diameter of the cleaning tool is larger than a diameter of the second holder.

7. each of the substrate and the cleaning tool has a circular outer shape; The substrate cleaning apparatus according to any one of claims 1 to 5, wherein a diameter of the cleaning tool is larger than ⅓ of a diameter of the substrate.

8. holding the substrate by a first holding unit such that a center of the substrate is located at a reference position; rotating the substrate around a first central axis extending in a vertical direction while holding a central region of a lower surface of the substrate with a second holding portion; cleaning the central region of the lower surface of the substrate held by the first holding part by rotating the cleaning tool around a second central axis extending in the up-down direction while contacting the central region of the lower surface of the substrate held by the first holding part; cleaning a lower surface outer region surrounding the lower surface central region of the substrate rotated by the second holding part by contacting the cleaning tool with the lower surface outer region; when transferring the substrate between the first holding part and the second holding part, moving a movable base on which the second holding part and the cleaning tool are provided within a horizontal plane so that the reference position of the first holding part and the first central axis of the second holding part coincide with each other in a plan view; and moving the movable base within the horizontal plane so that, when cleaning the central region of the lower surface, the cleaning tool overlaps with the central region of the lower surface of the substrate held by the first holding part in the plan view and the second central axis of the cleaning tool coincides with a first portion different from the center of the substrate, The substrate cleaning method, wherein the second holding part moves together with the movable base within a horizontal plane.

9. The substrate cleaning method according to claim 8, further comprising: moving the movable base within the horizontal plane so that, in the planar view, the cleaning tool coincides with a second portion of the substrate held by the first holding part, the second portion being different from the first portion of the substrate when cleaning the central region of the lower surface.

10. The method of claim 9 , wherein the second portion of the substrate is a center of the substrate.

11. The substrate cleaning method according to any one of claims 8 to 10, further comprising drying the central region or the outer region of the lower surface after cleaning by ejecting gas onto the lower surface of the substrate from a gas ejection part provided on the movable base.

12. The substrate cleaning method according to any one of claims 8 to 11, wherein moving the movable base within a horizontal plane includes moving the movable base linearly along a linear guide extending in one direction within the horizontal plane.

13. Each of the second holder and the cleaning tool has a circular outer shape; The substrate cleaning method according to any one of claims 8 to 12, wherein a diameter of the cleaning tool is larger than a diameter of the second holder.

14. each of the substrate and the cleaning tool has a circular outer shape; The method for cleaning a substrate according to any one of claims 8 to 12, wherein a diameter of the cleaning tool is greater than ⅓ of a diameter of the substrate.

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