Substrate carrier and substrate, and substrate assembly including same

Abstract

The present invention provides a substrate carrier and a substrate assembly including the same. The substrate carrier includes a receiving space, a guide portion disposed adjacent to the receiving space, and a support portion disposed below the receiving space and the guide portion. The guide portion has an edge that is either circular or arc-shaped when viewed from above.

Description

[Technical field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims priority to U.S. Provisional Patent Application No. 63 / 240,023, filed September 2, 2021, the entire disclosure of which is incorporated herein by reference for all purposes.

[0002] The present disclosure relates to a substrate carrier and a substrate assembly including the same. [Background technology]

[0003] As the high-end packaging substrate, ceramic materials such as glass can be applied, and organic materials can be excluded. By forming through vias on the substrate and applying conductive materials in the through vias, the wiring length between the device and the motherboard can be shortened, and excellent electrical properties can be obtained.

[0004] Such a substrate is packaged to manufacture an array substrate including a plurality of package substrate units, and the array substrate may be manufactured to have a rectangular panel shape. In order to realize fine and complex packaging, it may be desirable to use a high-precision semiconductor process. However, commercially available equipment for processing the array substrate into a rectangular shape may be insufficient, and development / maintenance may require a considerable amount of time and cost.

[0005] In order to apply this rectangular array substrate to a typical device using a silicon-based semiconductor wafer, it is preferable for the substrate to have a circular edge similar to that of the wafer. However, in the case of an array substrate that is mounted in a rectangular shape, a considerable amount of area loss may occur when processing the substrate into a 12-inch wafer or other wafer. This may result in a decrease in productivity and make it impossible to achieve mass production.

[0006] Therefore, it is desirable to consider various factors and configurations that can minimize the occurrence of material and cost waste and increase the productivity of the packaging process for a typical rectangular substrate. Summary of the Invention

[0007] This Summary is provided to introduce some concepts in a simplified form that are described later in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

[0008] The present invention provides a substrate holder comprising: an accommodation space configured to accommodate a substrate; a guide portion disposed adjacent to the accommodation space; The present invention provides a substrate carrier comprising one selected from a support portion, a fixing portion, or both, wherein the support portion is arranged at a lower portion of the accommodating space and the guide portion and configured to support a substrate arranged in the guide portion and the accommodating space, and the fixing portion is arranged on an inner surface of the guide portion and configured to fix the substrate and the guide portion.

[0009] The guide portion has an edge that is either circular or arc-shaped when viewed from above.

[0010] The guide portion has a diameter of 4 inches or greater.

[0011] The guide portion has a thickness of 100 μm to 2000 μm.

[0012] The accommodation space has a height lower than that of the guide portion.

[0013] The support portion has a thickness of 50 μm to 200 μm.

[0014] The support portion includes an ultraviolet (UV) curable adhesive layer, and the fixing portion includes a UV curable adhesive material.

[0015] The present invention provides a method for manufacturing a substrate carrier comprising: The target substrate and the substrate carrier are configured to be integrally secured to one another.

[0016] The target substrate is at least one substrate selected from a silicon-based ceramic substrate, a glass-based ceramic substrate, a glass substrate, and combinations thereof.

[0017] The target substrate includes an array in which a plurality of package substrate units are formed.

[0018] The target substrate and the guide portion have a gap of 0.5 mm to 20 mm.

[0019] The target substrate and the guide portion have a gap of 0.5 mm to 20 mm.

[0020] Other features and aspects will become apparent from the following detailed description, the drawings, and the claims. [Brief description of the drawings]

[0021] [Figure 1] 1 is a diagram showing an example of a substrate carrier according to an embodiment, viewed from above. [Diagram 2] 1 is an example diagram of a cross-section of a substrate carrier in accordance with one or more embodiments. [Diagram 3] 1 illustrates an example of a top view of a substrate assembly in accordance with one or more embodiments. [Figure 4] 1 is an example diagram of a cross-section of a substrate assembly in accordance with one or more embodiments. [Diagram 5] 1 is an example diagram of a cross-section of a substrate assembly in accordance with one or more embodiments. [Figure 6] 1 is an example diagram of a cross-section of a substrate assembly in accordance with one or more embodiments. [Figure 7]1 is a drawing showing an example of a cross-section of a substrate assembly according to one or more embodiments. In the drawings and the detailed description, like reference numerals refer to like elements. The drawings may not be to scale, and the relative scale, proportions, and descriptions of elements in the drawings may be exaggerated for clarity, illustration, and convenience. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] The following detailed description is provided to assist the reader in a comprehensive understanding of the method, device, and / or system described herein. However, various changes, modifications, and equivalents of the method, device, and / or system described herein will become apparent upon understanding the present disclosure. For example, the order of operations described herein is merely illustrative and is not limited to those described herein, and may be changed as becomes apparent upon understanding the present disclosure, except that the operations are necessarily performed in a certain order. It should also be noted that the description of features that are well known to those skilled in the art may be omitted for clarity and conciseness, but the omission of features and their description are not intended to acknowledge their general knowledge.

[0023] The features described herein may be embodied in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways of implementing the methods, apparatus, and / or systems described herein that will become apparent after understanding the present disclosure.

[0024] In this specification, terms such as "first," "second," and "third" are used to describe various members, components, regions, layers, or sections, but are not intended to limit these members, components, regions, layers, or sections. Rather, these terms are used only to distinguish one member, component, region, layer, or section from another member, component, region, layer, or section. Thus, a first member, component, region, layer, or section referred to in an embodiment described herein may also be referred to as a second member, component, region, layer, or section without departing from the teachings of the embodiment.

[0025] In the specification, when an element, such as a layer, region, or substrate, is described as being "on" or "connected" or "coupled" to another element, it is directly "on," "connected" or "coupled" to the other element, or there are one or more other elements between them. In contrast, when an element is described as being "directly on," "directly connected to," or "directly coupled" to another element, there are no other intervening elements between them. Similarly, expressions such as "between," "just between," "adjacent to," and "directly adjacent to" can be interpreted as above.

[0026] The terms used herein are intended to describe particular examples only and are not used to limit the disclosure. As used herein, the singular form is intended to include the plural form unless the context clearly dictates otherwise. As used herein, the term "and / or" includes any one and any two or more of the associated listed items in any combination. As used herein, the terms "including," "comprising," and "having" specify the presence of stated features, numbers, operations, elements, components, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, operations, elements, components, and / or combinations thereof. As used herein, the term "may" in an example or embodiment (e.g., with respect to what an example or embodiment may include or may perform) means that there is at least one example or embodiment in which such feature is included or performed. However, not all examples are limited to this.

[0027] Unless otherwise defined, all terms, including technical and scientific terms, used herein have the same meaning as commonly understood by a person of ordinary skill in the art to which this disclosure belongs, consistent with the understanding of this disclosure. Terms as defined in commonly used dictionaries are interpreted to have a meaning consistent with the meaning in the context of the relevant technology and this disclosure, and should not be interpreted in an idealized or overly formal sense unless expressly defined in this specification.

[0028] In this specification, the meaning of "B is located on A" means that B is located on A in direct contact therewith, or that B is located on A with another layer located therebetween, and should not be interpreted as being limited to B being located in direct contact with A, unless otherwise clearly stated in the specification.

[0029] In this specification, the term "combinations thereof" contained in a Markush form expression means a mixture or combination of one or more selected from the group consisting of each component described in the Markush form expression, and means including one or more selected from the group consisting of each of the components.

[0030] In one or more examples, the term "A and / or B" means "A, B, or A and B."

[0031] In one or more instances, terms such as "first," "second," or "A," "B" are used to distinguish identical terms from one another, unless otherwise specified.

[0032] In one or more instances, the singular term "a" or "an" is to be construed as including the singular or plural as the context requires, unless specifically stated otherwise.

[0033] One or more embodiments provide a substrate carrier and substrate assembly that can minimize the occurrence of material and cost waste. Embodiments can aid in adapting typical wafer processing equipment to square shaped substrates, improving productivity of the packaging process.

[0034] One or more embodiments provide a method for adapting target substrates, including ceramic substrates (eg, glass) having a square shape, to a process common to circular shaped wafers by a substrate carrier.

[0035] In one or more embodiments, the substrate carrier is implemented to minimize material waste and costs, and can improve productivity when applied to packaging processes involving target substrates including rectangular shaped ceramic substrates (e.g., glass).

[0036] PCB Carrier 10 Referring to FIG. 1, a substrate carrier 10 according to one or more embodiments may include a storage space 12 for accommodating a substrate, a guide portion 11 arranged outside the storage space 12, a support portion 13, and a fixing portion 14 (FIG. 5).

[0037] The support portion 13 supports the guide portion 11 and the substrate accommodated in the accommodation space 12 , and may be disposed below the accommodation space 12 and the guide portion 11 .

[0038] The fixing portion 14 may be disposed on the inner circumferential surface of the guide portion 11 to fix the substrate and the guide portion 11 in place.

[0039] As a non-limiting example, the guide portion 11 may be configured to include an edge portion that is circular or arc-shaped in a plan view seen from above.

[0040] The guide portion 11 preferably has an edge with a circular shape similar to that of a wafer. In one example, the diameter of the outermost edge of the guide portion 11 may be 3 inches or more, about 6 inches or more, about 20 inches or less, or about 18 inches or less. By having such a diameter, the guide portion 11 can easily apply the target substrate 20 to a semiconductor wafer level package (WLP) device when the target substrate 20 is placed in the accommodation space 12.

[0041] In a non-limiting example, the guide portion 11 may have a thickness of about 100 μm to about 2000 μm, or about 100 μm to 1000 μm. Minimizing the difference in thickness with the target substrate placed in the receiving space 12 is advantageous for the subsequent packaging process, thereby minimizing the occurrence of defects.

[0042] The guide portion 11 may have a flat area (not shown) having a linear shape formed by cutting off a part of a circular arc in a part of the circumference.

[0043] The guide portion 11 may have a notch (not shown) recessed toward the center in a part of the circumference.

[0044] The guide portion 11 may include, for example, metal, ceramic, plastic, glass, etc., and the guide portion 11 may be made of a material that does not generate impurities or particles during a packaging process.

[0045] For example, the guide portion 11 may be a substrate selected from the group consisting of a prepreg, a silicon-based ceramic substrate, a glass-based ceramic substrate, a glass substrate, or a combination thereof. Specifically, the substrate may have an accommodation space 12 therein and may have a disk shape as a whole. The guide portion 11 may be integrally formed, or may be entirely formed of two or more fragments.

[0046] The guide portion 11 may be made of a UV light-transmitting material. For example, a UV light-transmitting plastic plate, a UV light-transmitting glass plate, or the like may be used. When the guide portion 11 is made of a UV light-transmitting material, the workability can be further improved. For example, the support portion 13, whose adhesive strength is weakened by irradiation with UV light, is removed to manufacture the substrate assembly, thereby improving the workability of irradiating UV light and removing the support portion 13.

[0047] The guide portion 11 may be collected after the target substrate 20 is placed in the accommodation space 12 and processed, and the collected guide portion 11 may be reused multiple times in the manufacture of substrate carriers.

[0048] With reference to the top plan view of the substrate carrier 10 (FIG. 1), the shape of the receiving space 12 may be a rectangle having at least four sides, and may receive a substrate in a rectangular shape that is a target substrate. Furthermore, the receiving space may have four vertices that are treated as a circular curve of a rectangle.

[0049] The accommodating space 12 may have an average height that is lower than the height of the guide portion, as shown in FIG. 2, and the accommodating space 12 may, for example, be an empty space, or may completely penetrate the support portion 13 or expose the support portion 13.

[0050] When the storage space 12 has a rectangular shape as described above, its area is about 2.5×10 3 mm 2 ~2.8×10 5 mm 2 Furthermore, the length of one side of the accommodation space 12 may be about 50 mm to about 520 mm, or about 75 mm to about 450 mm.

[0051] As shown in Figures 3, 4 and 6, the accommodation space 12 may include an arrangement area in which the target substrate 20 is arranged, and a buffer zone B provided separately outside the arrangement area. The buffer zone B is a space or interval between the arrangement area of ​​the accommodation space 12 and the guide portion 11, and may have a width of about 0.1 mm to about 2 mm, or may have a constant width overall. By providing the buffer zone B in the accommodation space 12, it is possible to improve workability and reduce the defect rate in the packaging process.

[0052] The placement area may have a shape similar to the outer shape of the target substrate 20 .

[0053] The buffer zone B may be filled with a fixing portion 14 at least in part or in whole, as shown in FIG. 5 or FIG. 7. The fixing portion 14 may include, for example, an epoxy resin, a polyimide resin, a polyacrylate resin, a silicone resin, or the like, and may fill at least a part of the buffer zone B to fix the target substrate 20 and the support portion 13. Furthermore, the fixing portion 14 may be formed by curing a composition including a UV-curable acrylate compound, an acrylic copolymer, a photoinitiator, a heat curing agent, or the like. In one or more embodiments, the fixing portion 14 may be subjected to an additional treatment, such as a UV irradiation treatment, after processing of the target substrate 20, described later, to reduce the adhesive strength, so that the fixing portion 14 can be easily separated from the guide portion 11.

[0054] The provision of the fixing portion 14 can prevent the occurrence of short circuits or defects during processing of the target substrate 20, and can facilitate the fixing or separation of the substrate carrier 10 and the target substrate 20 as desired.

[0055] As illustrated in FIG. 7, the fixing portion 14 can be connected to the target substrate 20 and fix the target substrate 20 to the guide portion 11 without providing a separate support portion 13 .

[0056] The fixing portion 14 may further include a filler. The filler may include, for example, any one selected from the group including silica, alumina, titania, zirconia, silicon, magnesium oxide, and combinations thereof.

[0057] The support portion 13 may be implemented to support the target substrate 20 placed in the storage space 12, may be in contact with the target substrate 20 when the target substrate 20 is placed in the storage space 12, and may further include an adhesive layer disposed between the target substrate 20 and the support portion 13.

[0058] The supporting portion 13 may have a thickness of about 20 μm to about 200 μm, or about 80 μm to about 180 μm. By having such a thickness, the supporting portion 13 can be effectively removed after a cutting step in the processing step of the target substrate 20.

[0059] The support portion 13 may include a UV-curable adhesive layer. The support portion 13 may be a support film and a UV-curable adhesive layer on the support film. The support portion 13 may be a UV-curable adhesive layer in the form of an adhesive tape, or may be composed of a UV-curable adhesive layer without a separate member.

[0060] In one example, the UV-curable adhesive layer may be formed by curing a composition including a UV-curable acrylate-based compound, an olefin-based compound, an ester-based compound, a polyvinyl chloride-based compound, an acrylic copolymer, a photoinitiator, a thermal curing agent, etc., but is not limited thereto.

[0061] The support 13 may include another adhesive layer. The other adhesive layer may include an acrylic oligomer, an isocyanate curing agent, an amine curing agent, or the like.

[0062] Furthermore, the support portion 13 may be made of a support film such as a polyester film, a polyolefin film, a polyvinyl chloride film, or a polyethylene film.

[0063] The thickness of the UV-curable adhesive layer and other adhesive layers may be about 10 μm to 180 μm, but is not limited thereto as long as it can facilitate adhesion and support of the target substrate.

[0064] The UV-curable adhesive layer and other adhesive layers may have an adhesive strength with the target substrate 20 of about 300 gf / 25 mm to about 3500 gf / 25 mm, or about 1000 gf / 25 mm to about 3500 gf / 25 mm. By having such an adhesive strength, the target substrate 20 and the supporting portion 13 can be easily fixed to each other in a processing step of the target substrate 20 described later.

[0065] When the support portion 13 includes a UV-curable adhesive layer and another adhesive layer, the guide portion 11 may include a material that is sufficiently UV-transmitting, such as glass.

[0066] The support 13 may be resistant to a developer (tetramethylammonium hydroxide, TMAH) or the like, and may be retained in the processing step of the target substrate 20 prior to a cutting step.

[0067] The adhesive strength of the supporting portion 13 may be reduced by UV irradiation.

[0068] The support portion 13 may be a so-called heat-peelable adhesive layer, the adhesive strength of which decreases when exposed to heat.

[0069] The substrate carrier 10 may be heat resistant at temperatures of about 150° C. to about 200° C., and may have an appearance and characteristics that do not change significantly even when held at a temperature of about 200° C. for one hour.

[0070] Through such a substrate carrier 10, the target substrate, particularly an array substrate including rectangular shaped glass and including multiple units for packaging substrates, can be applied to the wafer level packaging process, thereby minimizing material waste and costs and improving productivity.

[0071] Substrate assembly 100 In a general aspect, a substrate assembly according to one or more embodiments comprises the substrate carrier 10 described above and a target substrate 20 received in the receiving space 12 .

[0072] The target substrate 20 may be a substrate selected from the group consisting of a silicon-based ceramic substrate, a glass-based ceramic substrate, a glass substrate, and combinations thereof.

[0073] The ceramic substrate may be, for example, a silicon-based ceramic substrate or a glass-based ceramic substrate. The silicon-based ceramic substrate may be a substrate made entirely or partially of a silicon substrate, a silicon carbide substrate, etc. The glass-based ceramic substrate may be a substrate made entirely or partially of a quartz substrate, a sapphire substrate, etc.

[0074] The target substrate may be a glass substrate, which may be, for example, an alkali borosilicate plate glass, an alkali-free borosilicate plate glass, an alkali-free alkaline earth borosilicate plate glass, or the like, and any plate glass that can be used as an electronic component may be used.

[0075] The target substrate may be an array substrate including a plurality of package substrate units, and may include glass, such as borosilicate glass or non-alkali glass.

[0076] The target substrate 20 may have a rectangular shape and an area of ​​about 1.5×10 5 mm 2 ~Approx. 4×10 5 mm 2 Furthermore, the length of one side of the target substrate may be about 450 mm to about 550 mm.

[0077] The target substrate 20 may have a significant area loss when processed into a commercially available wafer form, and therefore may be adapted for a wafer level packaging process while placed on the carrier substrate 10 .

[0078] The accommodating space 12 and the target substrate 20 may have a buffer zone B therebetween. The buffer zone B may have a width of about 0.1 mm to about 2 mm as a space or interval between the target substrate 20 and the guide portion 11, and may have a regular width overall. By providing the buffer zone B, the accommodating space 12 can prevent the target substrate 20 in the accommodating space 12 from being contaminated with impurities, thereby reducing the defect rate in the packaging process.

[0079] The buffer zone B may be filled at least partially or entirely with a fixing part 14. Components included in the fixing part 14 are similar to those of the substrate carrier 10, and therefore a description thereof will be omitted. Providing the fixing part 14 can prevent short circuits and defects from occurring during the processing of the target substrate 20, and can facilitate fixing or separating the substrate carrier 10 and the target substrate 20.

[0080] The adhesive strength between the target substrate 20 and the supporting portion 13 may be about 300 gf / 25 mm to about 3500 gf / 25 mm, or about 1000 gf / 25 mm to about 3500 gf / 25 mm. By having such an adhesive strength, the target substrate 20 and the supporting portion 13 can be easily fixed to each other in a processing step of the target substrate 20 described later.

[0081] About 400 mJ / cm 2 After being uniformly irradiated with the UV, the adhesive strength with the target substrate 20 may be about 5 gf / 25 mm to about 150 gf / 25 mm.

[0082] The substrate assembly 100 can be applied to a target substrate processing method described below, and can also be applied to a wafer level packaging (WLP) process.

[0083] The configuration and the like of the substrate carrier 10 of the substrate assembly 100 are similar to the substrate carrier described above, and therefore description thereof will be omitted.

[0084] Methods for manufacturing, fixing and separating substrate carriers; In a general aspect, a method for manufacturing a substrate carrier according to an embodiment includes the steps of providing any material having a circular or arc shape when viewed from above, and forming a support 13 at a bottom portion.

[0085] In the step of forming the accommodation space 12 and the guide portion 11, the interior of the arbitrary material may be partially penetrated to form the preliminary accommodation space 12, and the remaining region may be the guide portion 11. The processing may be performed by, for example, mechanical etching, laser processing, or the like.

[0086] The step of forming the accommodation space 12 and the guide portion 11 may include a step of processing the penetrating portion of the preliminary accommodation space 12 so as to have the shape of the accommodation space.

[0087] In the step of forming the support portion 13, a process may be performed in which a support portion having a shape for finishing the lower portion of the accommodation space 12 and the guide portion 11 is bonded to the lower portion of the guide portion 11. Alternatively, a process may be performed in which a raw material is applied to a separate mold, and the lower portion of the guide portion 11 is brought into contact with the applied layer and cured.

[0088] The fixing portion 14 is disposed between the target substrate 20 and the guide portion 11 to fix the target substrate 20 and the guide portion 11, and the specific filling material is as described above.

[0089] The fixing portion 14 may be formed, for example, by placing the target substrate 20 in a state where an uncured or semi-cured filling material is placed, or may be formed by an additional curing or fixing process. Furthermore, the fixing portion 14 may be manufactured by provisionally placing the target substrate 20 and the guide portion 11 on a support film, forming the fixing portion after that process, and removing the support film.

[0090] The material of the support 13 is the same as that of the substrate carrier described above, and therefore the description thereof will be omitted.

[0091] In a general aspect, a method for fixing a target substrate 20 according to one embodiment includes the steps of preparing a substrate carrier 10 and a target substrate 20, and an assembly step of fixing the target substrate 20 by the support portion 13 or the fixing portion 14 of the substrate carrier 10 to obtain an integrally formed substrate assembly.

[0092] The substrate carrier 10 includes an accommodating space 12 for accommodating a target substrate 20 therein, and a guide portion 11 surrounding the accommodating space 12 and allowing the target substrate 20 to have a substantially disk-shaped outer shape.

[0093] The substrate assembly includes a target substrate 20 disposed in an accommodating space 12 and a substrate carrier 10 fixed via at least one of a support portion 13 or a fixing portion 14 .

[0094] The support 13 may comprise a UV light curable adhesive layer.

[0095] The fixing portion 14 may contact at least a portion of the target substrate 20 and the guide portion 11 to fix the target substrate 20 and the guide portion 11, and the distance between the target substrate 20 and the guide portion 11 may be 0.5 mm to 20 mm.

[0096] The guide portion 11 may be a substrate selected from the group consisting of a prepreg, a silicon-based ceramic substrate, a glass-based ceramic substrate, a glass substrate, and combinations thereof.

[0097] The target substrate may be a substrate selected from the group consisting of a glass-based ceramic substrate, a glass substrate, and combinations thereof.

[0098] In a general aspect, a method for separating a target substrate according to one embodiment includes a preparation step of preparing a substrate assembly, and a treatment step of applying UV light or heat to the substrate assembly to prepare a substrate assembly in which the adhesive strength of the support portion 13 or fixing portion 14 included in the substrate assembly is reduced.

[0099] The separation method may further include applying forces in opposite directions up and down to the guide portion 11 and the target substrate of the substrate assembly whose adhesive strength has decreased.

[0100] In one example, the guide portion 11 may be a UV-transmitting guide portion. In the processing step, UV may be transmitted to the fixing portion 14 or the supporting portion 13 through the UV-transmitting guide portion.

[0101] The detailed description of the guide portion 11, the target substrate 20, the fixing portion 14, the support portion 13, etc. has been given above, and therefore will not be repeated.

[0102] How to process the target board In a general aspect, a method for processing a target substrate 20 may include the steps of forming a first plating layer on one side of the target substrate 20 of the aforementioned substrate assembly, forming a resist pattern on the first plating layer and forming a second plating layer on the remaining portion excluding the resist pattern, and forming solder on the second plating layer and removing the resist pattern and the first plating layer below the resist pattern.

[0103] The target substrate 20 may include an array forming multiple units for packaging substrates.

[0104] The target substrate 20 may have a conductive pad and a passivation layer on one side thereof, and the first plating layer may be formed on the conductive pad and the passivation layer.

[0105] In the step of forming a first plating layer, the first plating layer may include, for example, titanium, chromium, aluminum, copper, tungsten, or an alloy thereof.

[0106] The first plating layer may include, for example, a first layer including titanium and a second layer including copper formed on the first layer.

[0107] The first plating layer may be formed on one side of the target substrate, or on a conductive pad and a passivation layer of the target substrate, by a sputtering process or the like.

[0108] The resist pattern may be formed by a general method of applying a photoresist onto the first plating layer, exposing the photoresist using a mask on which a pattern has been formed, developing the photoresist, and etching the photoresist.

[0109] In the step of forming the second plating layer, the second plating layer may include, for example, copper, nickel, or an alloy thereof.

[0110] The second plating layer may be formed by electroplating or electroless plating.

[0111] When solder is formed on the second plating layer, the solder may be a solder containing lead, tin, or the like, or may be a lead-free solder containing silver, tin, zinc, aluminum, magnesium, gallium, or the like.

[0112] The step of removing the first plating layer under the resist pattern may be performed by a general method using an etching solution, which may include hydrofluoric acid or the like.

[0113] After the step of removing the first plating layer underneath the resist pattern, a predetermined heat treatment step may be performed to condition the remaining plating layer and the components connected thereto.

[0114] The method may further include, after the step of removing the first plating layer, processing the solder into a solder ball shape.

[0115] After the step of removing the first plating layer, if the target substrate 20 has an array including a plurality of units for package substrates, a cutting step may be performed to cut the array into separate units for the package substrates. In addition, a step of removing the support 13 remaining on the lower part of the package substrate unit after the cutting step may be further performed. If the support 13 has a UV-curable adhesive layer, the removal of the support 13 may be performed by uniformly irradiating UV light.

[0116] After the step of removing the support portion 13, a step of recovering the guide portion 11 disposed on the support portion 13 before the removal may be further performed. The recovered guide portion may be applied to a method of manufacturing a substrate carrier and may be reused multiple times.

[0117] The method for treating the target substrate may further include depositing a multi-layer metal thin film wiring on the target substrate, and forming a redistribution layer.

[0118] Although the present disclosure includes specific embodiments, it will be apparent to those skilled in the art after reading the disclosure of this application that various changes in form and details can be made in these embodiments without departing from the spirit and scope of the claims and their equivalents. The embodiments described herein should be considered in an explanatory sense only and not for the purpose of limitation. The description of a feature or aspect in each embodiment shall be deemed applicable to the same feature or aspect in other embodiments. Appropriate results may be achieved when the described techniques are performed in different orders, and / or when the components in the described systems, architectures, devices, or circuits are combined in different ways, and / or when other components or their equivalents are substituted or supplemented. Thus, the scope of the present disclosure is defined by the claims and their equivalents, rather than the detailed description, and all changes within the scope of the claims and their equivalents should be construed as being included in the present disclosure.

Claims

1. a receiving space configured to receive a rectangular shaped substrate; A guide portion disposed adjacent to the accommodation space; A support portion. the support portion is disposed under the accommodation space and the guide portion, and the support portion is configured to support a substrate disposed in the guide portion and the accommodation space; The substrate carrier, wherein the support includes an ultraviolet (UV) curable adhesive layer.

2. Further comprising a fixing portion, The substrate carrier of claim 1 , wherein the fixing portion is disposed on an inner circumferential surface of the guide portion and configured to fix the substrate and the guide portion.

3. The substrate carrier of claim 1 , wherein the guide portion has an edge that is either circular or arc-shaped when viewed from above.

4. The substrate carrier of claim 1 , wherein the guide portion has a diameter of 4 inches or greater.

5. The substrate carrier of claim 1 , wherein the guide portion has a thickness of 100 μm to 2000 μm.

6. The substrate carrier according to claim 1 , wherein the accommodation space has a height lower than that of the guide portion.

7. The substrate carrier of claim 1 , wherein the support portion has a thickness of between 50 μm and 200 μm.

8. The substrate carrier of claim 2, characterized in that the fixing portion includes a UV-curable adhesive material.

9. A substrate carrier according to claim 1 and a target substrate disposed in the accommodation space, 20. A substrate assembly, comprising: a substrate carrier and a target substrate;

10. 10. The substrate assembly of claim 9, wherein the target substrate is at least one substrate selected from a silicon-based ceramic substrate, a glass-based ceramic substrate, a glass substrate, and combinations thereof.

11. 10. The substrate assembly of claim 9, wherein the target substrate includes an array in which a plurality of package substrate units are formed.

12. 10. The substrate assembly of claim 9, wherein the target substrate and the guide portion have a gap of 0.5 mm to 20 mm.

13. The substrate assembly of claim 12 , wherein at least a portion of the gap is filled with a filler material.

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