Multilayer Electronic Components

Abstract

The multilayer electronic component has an effective portion and a cover. The effective portion has dielectric layers and internal electrodes alternately stacked in a stacking direction. The cover overlaps the effective portion in the stacking direction. The cover has a plurality of insulating layers stacked in the stacking direction and a dummy electrode located between the plurality of insulating layers. The dummy electrode has at least one oxidized region.

Description

[Technical field]

[0001] The present disclosure relates to multilayer electronic components such as multilayer ceramic capacitors. [Background technology]

[0002] As an example of a multilayer electronic component, a multilayer ceramic capacitor is known (for example, see Patent Document 1 below). A multilayer ceramic capacitor has, for example, an effective portion, a cover, and an external electrode. The effective portion has alternately stacked dielectric layers and flat internal electrodes, and directly functions as a capacitor. The cover covers the effective portion in the stacking direction of the dielectric layers and internal electrodes, and contributes to protecting the effective portion. The external electrode is composed of a metal layer that covers the side surfaces of the main body portion consisting of the effective portion and the cover, and contributes to mounting the capacitor on a circuit board or the like. In Patent Document 1, a dummy electrode (auxiliary electrode) is provided on the cover. The dummy electrode contributes to depositing a metal that becomes the external electrode by, for example, a plating method. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2014-212298 A Summary of the Invention

[0004] A multilayer electronic component according to one embodiment of the present disclosure has an effective portion and a cover. The effective portion has dielectric layers and internal electrodes alternately stacked in a stacking direction. The cover overlaps the effective portion in the stacking direction. The cover has a plurality of insulating layers stacked in the stacking direction and a dummy electrode located between the plurality of insulating layers. The dummy electrode has at least one oxidized region. [Brief description of the drawings]

[0005] [Figure 1]FIG. 1 is a perspective view showing a capacitor according to a first embodiment. [Diagram 2] FIG. 2 is a schematic exploded perspective view of the capacitor of FIG. 1. [Diagram 3] FIG. 2 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 4 is an enlarged view of region IV in FIG. [Diagram 5] FIG. 11 is a perspective view showing a capacitor according to a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0006] Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. The drawings used in the following description are schematic. Therefore, for example, the dimensional ratios in the drawings do not necessarily match the actual ones. In addition, the dimensional ratios may not match between drawings. Certain shapes and / or dimensions may be exaggerated, and details may be omitted. However, the above does not deny that the actual shapes and / or dimensions may be as shown in the drawings, or that features of the shapes and / or dimensions may be extracted from the drawings.

[0007] Regarding the aspect described relatively later, basically, only the difference from the aspect described relatively earlier will be described. Matters not specifically mentioned may be the same as the aspect described earlier or may be inferred from the aspect described earlier. For the sake of convenience, the same reference numerals may be used for components corresponding to each other in different aspects, even if there are differences.

[0008] In the following description, when referring to a "rectangle" (or rectangular shape), a "square" (or square shape), and a "rectangle" (or rectangular shape), the corners may be chamfered by a curved surface or the like, as long as the above-mentioned concept of shape is valid. For example, a corner formed by two sides may be chamfered to a length of 1 / 5, 1 / 10, or 1 / 20 of the length of the shorter of the two sides. It goes without saying that when viewed microscopically, the corners may be rounded due to manufacturing precision (error). The same applies to other polygons, etc.

[0009] (Overview of the embodiment) Fig. 1 is a perspective view showing a capacitor 1 (an example of a multilayer electronic component) according to a first embodiment. For convenience, a Cartesian coordinate system D1D2D3 is attached to Fig. 1 and other figures described later. The capacitor 1 may be used with either side being the upper or lower. However, in the description of the embodiment, for convenience, the +D3 side may be regarded as the upper side, and terms such as the upper surface and the lower surface may be used.

[0010] The capacitor 1 is, for example, a multilayer ceramic capacitor. The capacitor 1 has a roughly rectangular parallelepiped body 3 and four external electrodes 5 located at the four corners of the body 3 in a plan view (as viewed in the D3 direction). The external electrodes 5 contribute to electrical connection between the capacitor 1 and other electronic components (for example, a circuit board not shown).

[0011] Fig. 3 is a cross-sectional view taken along line III-III in Fig. 1. Fig. 3 shows a D1D3 cross section taken through the external electrode 5 on the +D2 side. However, the D1D3 cross section taken through the external electrode 5 on the -D2 side, the D2D3 cross section taken through the external electrode 5 on the -D1 side, and the D2D3 cross section taken through the external electrode 5 on the +D1 side are basically similar. In the description of the embodiments, for convenience, the positional relationship between components may be described using the terms D1, D2, and D3 without any particular mention, on the basis of the cross section shown in Fig. 3.

[0012] The main body 3 has, for example, an effective portion 11, two covers 13 respectively overlapping the upper and lower surfaces of the effective portion 11, and an undercoat layer 15 overlapping the surface of each cover 13 opposite the effective portion 11. The effective portion 11 has a plurality of dielectric layers 7 and a plurality of internal electrodes 9 which are alternately overlapped. The multiple internal electrodes 9 include a plurality of first internal electrodes 9A and a plurality of second internal electrodes 9B. Each undercoat layer 15 has, for example, four undercoat electrodes 16 at positions corresponding to the positions of the four external electrodes 5.

[0013] The effective portion 11 directly functions as a capacitor. The cover 13 contributes, for example, to protecting the main body portion 3 and improving the strength thereof. The base electrode 16 contributes, for example, to depositing a metal to be the external electrode 5 by a plating method and / or to improving the adhesive strength of the external electrode 5 to the main body portion 3.

[0014] Each cover 13 has, for example, a plurality of (two in the example of FIG. 3) insulating layers 17 and at least one (one in the example of FIG. 3) dummy layer 19 located between the plurality of insulating layers 17. Each dummy layer 19 has, for example, four dummy electrodes 20 at positions corresponding to the positions of the four external electrodes 5. The dummy electrodes 20 contribute, for example, to reinforcing the cover 13 and / or improving the connection strength between the main body 3 and the external electrodes 5, and also function as a base for the external electrodes 5 in an embodiment in which the external electrodes 5 are formed by plating.

[0015] Fig. 4 is an enlarged view of region IV in Fig. 3. The dummy electrode 20 has at least one (three in Fig. 4) oxidized region 20x.

[0016] The formation of the oxidized region 20x increases, for example, the volume of the dummy electrode 20. As a result, for example, the adhesion between the dummy electrode 20 and the insulating layer 17 is improved. In other words, the probability of a gap being formed between them is reduced. The above-mentioned improvement in adhesion improves, for example, the strength of the cover 13. In addition, for example, the probability that gas and / or liquid that has entered the gap for some reason will affect the mechanical properties and / or electrical properties is reduced. In an embodiment in which the external electrode 5 is formed by a plating method, the probability that a plating solution will enter the gap and affect the mechanical properties and / or electrical properties is reduced.

[0017] The above is an outline of the embodiment. Specifically, the embodiment will be described in the following order. 1. Configuration of the capacitor according to the first embodiment (FIGS. 1 to 3) 1.1. Overall structure 1.2. Effective part 1.3.Cover 1.4. Base electrode 1.5.External electrode 2. Oxidation region 2.1. Oxidized area of ​​dummy electrode 2.2. Comparison with the oxidized areas of other electrodes 3. Capacitor manufacturing method 4. Configuration of a capacitor according to another embodiment (FIG. 6) 5. Summary of the embodiment

[0018] (1. Configuration of the Capacitor According to the First Embodiment) (1.1. Overall structure) The capacitor 1 shown in Fig. 1 is configured as, for example, a surface-mounted chip-type component. Specifically, for example, the capacitor 1 is arranged with the -D3 side or +D3 side surface facing a circuit board (not shown). Then, the four pads of the circuit board and the four external electrodes 5 are respectively joined with a conductive joining material (e.g., solder) (not shown) to mount the capacitor on the circuit board.

[0019] The configuration (internal structure and external shape) of the capacitor 1 is, for example, approximately plane-symmetric with respect to a symmetry plane (not shown) that is parallel to the D1D2 plane and passes through the center of the thickness direction (D3 direction) of the capacitor 1. Also, the configuration of the capacitor 1 is, for example, rotationally symmetric by 180° when viewed in the D3 direction. Of course, the capacitor 1 does not have to have such symmetry.

[0020] The shape of the main body 3 is, for example, generally a thin rectangular parallelepiped. This rectangular parallelepiped may be a square (as shown in the example) or a rectangle (excluding a square; the same applies below) in plan view. For convenience, in the description of the embodiments, a square shape may be used unless otherwise specified.

[0021] The specific dimensions of the main body 3 (or the capacitor 1) are arbitrary. As an example of dimensions when the capacitor 1 is relatively small, the lengths of the main body 3 (or the capacitor 1) in the D1 and D2 directions may each be 0.030 mm or more and 0.200 mm or less. When the length in the D1 direction is L and the length in the D2 direction is W, L / W may be 0.5 or more and 2.0 or less. The thickness in the D3 direction may be 0.030 mm or more and 0.200 mm or less. When the surface of the main body 3 is not flat, for example, the maximum values ​​of the various dimensions may satisfy the above ranges (hereinafter, the same applies to the various dimensions of the other components, unless a contradiction occurs).

[0022] In addition, unless otherwise specified, the example dimensions of each component described below are for a relatively small capacitor 1. Therefore, dimensions larger (or smaller) than the illustrated dimensions may be used.

[0023] A plurality of components of the same type (e.g., 5, 7, 9, 13, 15, 16, 17, 19, or 20, etc.) may basically (except for relatively small differences, for example; the same applies below) be provided with the same (or corresponding) shape, size, material, position, etc., unless otherwise specified or unless a contradiction occurs. Therefore, unless otherwise specified or unless a contradiction occurs, the description of one component may be considered to be common to a plurality of components of the same type.

[0024] A layered (membrane-like) component (e.g., 5, 7, 9, 15, 17, or 19) may be entirely made of one material, but may also be made of layers of different materials stacked together.

[0025] (1.2. Effective part) The shape of the effective part 11 shown in FIG. 3 is, for example, approximately a thin rectangular parallelepiped. Its planar shape is basically the same as that of the main body part 3. The specific thickness of the effective part 11 is arbitrary. For example, the thickness of the effective part 11 may be 30% or more, 40% or more, or 50% or more, or 90% or less, 80% or less, or 70% or less, of the thickness of the main body part 3. The above lower limit and upper limit may be combined with any one of them. The thickness of the main body part 3 is, for example, the thickness from the upper surface of the base electrode 16 on the upper side to the lower surface of the base electrode 16 on the lower side. The thickness of the effective part 11 is, for example, the thickness from the upper surface of the internal electrode 9 of the uppermost layer to the lower surface of the internal electrode 9 of the lowermost layer.

[0026] The dielectric layer 7 is basically a layer having a constant thickness (at least between the internal electrodes 9). The thickness of the dielectric layer 7 may be appropriately set according to the characteristics required of the capacitor 1. As an example of a relatively thin thickness, the thickness between the mutually adjacent internal electrodes 9 (between the first internal electrode 9A and the second internal electrode 9B) may be 0.1 μm or more or 0.5 μm or more, and may be 3.0 μm or less, 2.0 μm or less, or 1.0 μm or less. The above lower limit and upper limit may be combined with any one of them. The shape and size of the dielectric layer 7 in a plan view are basically the same as the shape and size of the effective portion 11 in a plan view. The material of the dielectric layer is, for example, ceramics, and the specific type is also arbitrary. The number of laminated dielectric layers 7 (internal electrodes 9) is arbitrary. For example, it is 10 layers or more and 30 layers or less.

[0027] The internal electrode 9 is a layer having a certain thickness. The thickness of the internal electrode 9 is arbitrary, and may be thinner, the same as, or thicker than the thickness of the region between the internal electrodes 9 of the dielectric layer 7. As an example of a relatively thin thickness, the thickness of the internal electrode 9 may be 0.3 μm or more or 0.5 μm or more, and may be 3.0 μm or less, 2.0 μm or less, or 1.0 μm or less. The above lower limit and upper limit may be combined with any one of them. The material of the internal electrode 9 is, for example, a metal. The specific type of metal is arbitrary, and for example, the whole or main component (for example, 60 mass% or more of a component. The same applies below) is a base metal (for example, Ni and / or Cu).

[0028] Fig. 2 is an exploded perspective view of the capacitor 1. Fig. 2 is a schematic view for understanding the shapes and relative positions of the internal electrodes 9, etc. Therefore, Fig. 2 shows a smaller number of various layers than Fig. 3.

[0029] The internal electrode 9 has, for example, a rectangular (square in the illustrated example) electrode body 9a in a plan view and a pair of extraction electrodes 9b extending from a pair of opposing corners of the electrode body 9a. The internal electrode 9 is located inside the outer edge of the dielectric layer 7 and is not exposed from the side surface of the effective portion 11. The pair of extraction electrodes 9b reach the outer edge of the dielectric layer 7 and are connected to a pair of external electrodes 5 located at a pair of opposing corners of the main body portion 3.

[0030] The first internal electrode 9A and the second internal electrode 9B face each other with the dielectric layer 7 interposed therebetween. A pair of lead electrodes 9b of the first internal electrode 9A and a pair of lead electrodes 9b of the second internal electrode 9B are located on different diagonal lines in a planar perspective view. Both are connected to a pair of external electrodes 5 different from each other.

[0031] The electrode body 9a and the extraction electrode 9b may have any dimensions. For example, the length of the extraction electrode 9b on one side of the dielectric layer 7 is approximately the same as the length of the external electrode 5 along the said one side.

[0032] (1.3. Cover) The cover 13 shown in FIG. 3 is, for example, a layer having a shape and dimensions that overlap the effective portion 11 without excess or deficiency. The thickness of the cover 13 is approximately constant in each of the arrangement region and non-arrangement region of the base electrode 16. The ratio of the thickness of the cover 13 to the thickness of the main body portion 3 may be approximately the reverse of the ratio of the thickness of the effective portion 11 to the thickness of the main body portion 3 (as described above). For example, in an embodiment in which the covers 13 are provided on both sides in the D3 direction, the thickness of one cover 13 may be, for example, 5% or more, 10% or more, or 15% or more of the thickness of the main body portion 3, and may be 35% or less, 30% or less, or 25% or less. The above lower limit and upper limit may be combined arbitrarily. The thickness of the cover 13 is, for example, the thickness in a region that overlaps the internal electrode 9 and does not overlap the base electrode 16 (not crushed by the base electrode 16).

[0033] The insulating layers 17 and the dummy layers 19 are alternately stacked one by one. In other words, the dummy layers 19 are provided at the boundaries of all the insulating layers 17. Unlike the illustrated example, the dummy layers 19 may be provided only at some of the boundaries. For example, the dummy layers 19 may not be provided at one or more boundaries relatively close to the effective portion 11, and the dummy layers 19 may be provided only at one or more boundaries relatively far from the effective portion 11. However, in such a case, two or more insulating layers 17 that are in close contact with each other without a dummy layer 19 interposed therebetween may be regarded as one insulating layer 17.

[0034] The insulating layer 17 is a layer having a generally constant thickness, except for variations in thickness resulting from the presence or absence of overlap with the conductor layers (9, 15, and 19). The planar shape of the insulating layer 17 is, for example, basically the same as the planar shape of the dielectric layer 7. The material of the insulating layer 17 is arbitrary. For example, the material of the insulating layer 17 may be the same as the material of the dielectric layer 7, or may be different. Furthermore, the material of the insulating layer 17 may be, for example, ceramics, or a material other than ceramics.

[0035] The thickness of the insulating layer 17 is arbitrary. For example, the thickness of the insulating layer 17 may be thicker (as shown in the example), equal to, or thinner than the thickness of the dielectric layer 7 (both are thicknesses between conductor layers, or thicknesses of regions not overlapping with conductor layers. The same applies below in this paragraph). For example, the thickness of the insulating layer 17 may be two or more, three or more, or five or more times the thickness of the dielectric layer 7, and may be 20 or less, 10 or less, or 5 or less times the thickness of the dielectric layer 7. The above lower limit and upper limit may be combined with any of them. Also, for example, the thickness of the insulating layer 17 may be 1.0 μm or more, or 2.0 μm or more, and may be 10.0 μm or less, or 5.0 μm or less. The above lower limit and upper limit may be combined with any of them. Note that the insulating layer overlapping the uppermost internal electrode 9 may be regarded as the insulating layer 17, not the dielectric layer 7, regardless of its material and thickness. The same applies to the insulating layer overlapping the lowermost internal electrode 9.

[0036] The dummy electrode 20 is, for example, a layer having a basically constant thickness. The material of the dummy electrode 20 is, for example, a metal. The specific type of metal is arbitrary, and for example, the entire or main component is a base metal (for example, Ni and / or Cu). The material of the dummy electrode 20 may be the same as or different from the material of the internal electrode 9. In a plan view, the position, shape, and size of the dummy electrode 20 are arbitrary. In the example of FIG. 2 and FIG. 3, the position, shape, and size of the dummy electrode 20 are set to a position, shape, and size that approximately overlaps with the external electrode 5 in a plan view (however, the external electrode 5 is slightly wider). The dummy electrode 20 is exposed, for example, on the side surface of the main body 3. This exposed portion is fixed to the external electrode 5.

[0037] The thickness of the dummy electrode 20 is arbitrary. For example, the thickness of the dummy electrode 20 may be thicker than the thickness of the internal electrode 9 (example shown in the figure), may be approximately the same as the thickness of the internal electrode 9, or may be thinner. For example, the thickness of the dummy electrode 20 may be 1 time or more, 1.5 times or more, or 2 times or more, or may be 10 times or less, 5 times or less, or 2 times or less, of the thickness of the internal electrode 9. The above lower limit and upper limit may be combined with any of them. Also, for example, the thickness of the dummy electrode 20 may be 0.3 μm or more, 0.5 μm or more, 1.0 μm or more, or 2.0 μm or more, or may be 10.0 μm or less, 5.0 μm or less, 3.0 μm or less, or 2.0 μm or less. The above lower limit and upper limit may be combined with any of them. Also, the thickness of the dummy electrode 20 may be thin (example shown in the figure), may be equivalent to the thickness of the insulating layer 17, or may be thicker than the thickness of the insulating layer 17.

[0038] (1.4. Base electrode) The base electrode 16 is, for example, a layer having a basically constant thickness. The material of the base electrode 16 is, for example, a metal. The specific type of metal is arbitrary, and for example, the whole or main component is a base metal (for example, Ni and / or Cu). The material of the base electrode 16 may be the same as or different from the material of the internal electrode 9 and / or the material of the dummy electrode 20. In a plan view, the position, shape, and size of the base electrode 16 are arbitrary. In the example of FIG. 2 and FIG. 3, the position, shape, and size of the base electrode 16 are set to a position, shape, and size that approximately overlaps with the external electrode 5 in a plan view (however, the external electrode 5 is slightly wider).

[0039] The thickness of the base electrode 16 is arbitrary. For example, the thickness of the base electrode 16 may be thicker than the thickness of the internal electrode 9 and / or the dummy electrode 20 (in the illustrated example), may be approximately the same as, or may be thinner than the thickness of the internal electrode 9 and / or the dummy electrode 20. For example, the thickness of the base electrode 16 may be two or more times, three or more times, or five or more times, or 20 or less times, 10 or less times, or 5 or less times, of the thickness of the internal electrode 9 and / or the dummy electrode 20. The above lower limit and upper limit may be combined with any of the above. For example, the thickness of the base electrode 16 may be 2.0 μm or more, 3.0 μm or more, or 5.0 μm or more, or 20.0 μm or less, 10.0 μm or less, or 5.0 μm or less. The above lower limit and upper limit may be combined with any of the above. The thickness of the base electrode 16 may be thinner than, equal to, or thicker than the thickness of the insulating layer 17 (in the illustrated example).

[0040] (1.5.External electrode) The external electrode 5 is, for example, a layer having a basically constant thickness. The material of the external electrode 5 is, for example, a metal. The specific type of metal is arbitrary, and for example, the entire or main component is a base metal (for example, Ni and / or Cu). The external electrode 5 may be formed by laminating different materials as necessary. For example, the external electrode 5 may be formed by laminating Cu, Ni, and Sn from the side of the base electrode 16. The material of the external electrode 5 may be the same as or different from the material of the internal electrode 9, the material of the dummy electrode 20, and / or the material of the base electrode 16.

[0041] As shown in FIG. 1, the external electrodes 5 cover the four faces (upper face, lower face, and two side faces) of the main body 3, for example, approximately at the corners of the main body 3 in a plan view. As a result, one external electrode 5 is connected to one extraction electrode 9b on the two side faces of the main body 3, and the capacitor 1 can be surface-mounted on either the upper or lower face. The shape and dimensions of the portions of the external electrodes 5 on each face are arbitrary. The planar shape of the portion of the external electrode 5 located on the upper or lower face of the main body 3 is, for example, rectangular (square in the illustrated example). The planar shape and dimensions of the portion of the external electrode 5 located on the side face of the main body 3 are, for example, rectangular with the same lateral length as the portion located on the upper or lower face.

[0042] The thickness of the external electrode 5 is arbitrary. For example, the thickness of the external electrode 5 may be thicker than the thickness of the internal electrode 9, the dummy electrode 20, and the base electrode 16. For example, the thickness of the external electrode 5 may be 1.2 times or more, 2 times or more, or 3 times or more, or 10 times or less, 5 times or less, or 3 times or less, of the thickness of the base electrode 16. The above lower limit and upper limit may be combined with any of them. Also, for example, the thickness of the external electrode 5 may be 3 μm or more, 5 μm or more, or 10 μm or more, or 30 μm or less, 20 μm or less, or 10 μm or less. The above lower limit and upper limit may be combined with any of them.

[0043] (2. Oxidation Region) (2.1. Oxidized area of ​​dummy electrode) In the oxidized region 20x (FIG. 4), the metal contained in the dummy electrode 20 is oxidized. That is, the oxidized region 20x is configured to contain a metal oxide. The specific type of the metal oxide is arbitrary. For example, when the entire or main component of the dummy electrode 20 (before oxidation) is Ni, the oxidized region 20x contains NiO.

[0044] The oxidized region 20x can be observed, for example, by a scanning electron microscope (SEM) and energy dispersive X-ray spectroscopy (EDS). Specifically, when the oxidized region 20x is observed by an SEM at an appropriate magnification, it is observed as a region (hereinafter referred to as a different hue region) that exhibits a different hue from the region of the dummy electrode 20 other than the oxidized region 20x. Furthermore, if the presence of the element that is the main component of the dummy electrode 20 and the oxygen element is confirmed by EDS for the spot where the different hue region identified by SEM is located, the different hue region can be said to be the oxidized region 20x in which the dummy electrode 20 is oxidized. Note that by identifying the range of the different hue region by SEM, it is possible to identify the range of the oxidized region 20x and measure the dimensions of the range.

[0045] Methods for confirming the presence of oxygen element by EDS include, for example, point analysis or mapping analysis. For example, the presence of oxygen element in the different hue region may be confirmed by confirming the spectrum of oxygen element from the spot where the different hue region is located by point analysis. Also, the presence of oxygen element in the different hue region may be confirmed by confirming, for example, by mapping analysis, that the oxygen element concentration in the spot where the different hue region is located is higher than the oxygen element concentration in the region other than the different hue region in the dummy electrode 20. This is because it is unreasonable to consider the oxidized region 20x as publicly known based on the unavoidable and extremely small presence of oxygen in the publicly known technology.

[0046] The above-mentioned point analysis or mapping analysis can be used as a method for confirming the presence of the element that is the main component of the dummy electrode 20. In this paragraph, Ni will be described as an example of the element that is the main component of the dummy electrode 20. For example, the point analysis may be used to confirm the spectrum of Ni element from the spot where the different hue region is located, thereby confirming the presence of Ni element in the different hue region. Also, for example, the mapping analysis may be used to confirm that the Ni element concentration in the spot where the different hue region is located is higher than the Ni element concentration in the insulating layer 17, thereby confirming the presence of Ni element in the different hue region.

[0047] In the above mapping analysis, the area for calculating the concentration of oxygen elements may be set appropriately. For example, the oxygen concentration may be calculated for each predetermined unit area in a cross section parallel to the D3 direction (e.g., D1D3 cross section) as shown in FIG. 4. The unit area may be set to an appropriate size. For example, the unit area may be 0.01 μm 2 (or an even smaller area). Note that the unit area may be larger (i.e., the accuracy may be lower) depending on the situation. The shape of each unit area may be, for example, a square (e.g., 0.1 μm×0.1 μm square).

[0048] As an SEM-EDS analysis device for observing the oxidized region 20x, for example, a JSM-6010LV manufactured by JEOL Ltd. can be used.

[0049] In a cross section parallel to the D3 direction as shown in FIG. 4 (eg, a D1D3 cross section), the number, distribution pattern, area ratio (volume ratio), size, shape, and the like of the oxidized regions 20x that one dummy electrode 20 has are arbitrary.

[0050] For example, the dummy electrode 20 may have a plurality of oxidized regions 20x (as shown in the example), the entire dummy electrode 20 may be an oxidized region 20x, or the dummy electrode 20 may have one oxidized region 20x as a partial region. The plurality of oxidized regions 20x may be distributed in the D1 direction as shown in the example. And / or the plurality of oxidized regions 20x may have, for example, a layered oxidized region 20x constituting the upper surface of the dummy electrode 20 and a layered oxidized region 20x constituting the lower surface of the dummy electrode 20. The one oxidized region 20x as a partial region of the dummy electrode 20 may be, for example, a partial region in the D1 direction as shown in the example, or may be a partial region constituting the upper surface or lower surface of the dummy electrode 20.

[0051] Furthermore, for example, in an embodiment in which one or more oxidized regions 20x are formed as a partial region of the dummy electrode 20, the ratio of the total area of ​​the oxidized regions 20x to the area of ​​the dummy electrode 20 is arbitrary. For example, the ratio may be 3% or more, 5% or more, 7% or more, 10% or more, 50% or more, or 80% or more, and may be 80% or less, 50% or less, 20% or less, 15% or less, or 10% or less. The above lower limit and upper limit may be arbitrarily combined as long as no contradiction occurs.

[0052] For example, when the ratio of the total area of ​​the oxidized regions 20x to the area of ​​the dummy electrode 20 is 3% or more, the adhesion between the dummy electrode 20 and the insulating layer 17 improves with an increase in the volume of the oxidized regions 20x, and the intrusion of the plating liquid is significantly reduced. On the other hand, when the total area of ​​the oxidized regions 20x to the area of ​​the dummy electrode 20 becomes excessively large, the increase in volume increases the possibility of cracks occurring due to stress being applied inside the capacitor. For example, when the ratio of the total area of ​​the oxidized regions 20x to the area of ​​the dummy electrode 20 is 20% or less, the excessive increase in the volume of the dummy electrode 20 can be reduced, and the possibility of cracks occurring can be reduced.

[0053] Also, for example, in a mode in which one or more oxidized regions 20x are formed as a part of the region of the dummy electrode 20, the oxidized regions 20x may be distributed evenly or unevenly in the dummy electrode 20. An example of the latter will be given. The dummy electrode 20 is divided into a region on the -D1 side and a region on the +D1 side with the center in the D1 direction (see the center line CL) as a boundary. In FIG. 4, the -D1 side is the end side of the cover 13, and the +D1 side is the center side of the cover 13. In this case, for example, the total area of ​​the oxidized regions 20x in the region on the -D1 side may be made larger than the total area of ​​the oxidized regions 20x in the region on the +D1 side. In other words, the area ratio of the oxidized regions 20x on the end side of the cover 13 may be made higher than that on the center side of the cover 13. In this case, the difference between the areas (or ratios) of the two is arbitrary. For example, the area of ​​the former may be 1.2 times or more or 2 times or more than the area of ​​the latter.

[0054] Also, for example, in a mode in which one or more oxidized regions 20x are formed as a partial region of the dummy electrode 20, as can be understood from the above description, each oxidized region 20x may extend over the entire thickness of the dummy electrode 20 (in the illustrated example), or may occupy only a part of the thickness. In the latter mode, the oxidized region 20x is not limited to the layer shape already mentioned, but may be in a block shape. Also, the specific size of the diameter of the oxidized region 20x in the D3 direction is also arbitrary. For example, the diameter of the oxidized region 20x in the D3 direction (or the maximum length in the D3 direction) may be 1 / 2 or more or 1 / 2 or less of the thickness of the dummy electrode 20.

[0055] Also, for example, in a mode in which one or more oxidized regions 20x are formed as a partial region of the dummy electrode 20, as can be understood from the above explanation, the diameter in the D1 direction of each oxidized region 20x is also arbitrary. For example, the diameter in the D1 direction of the oxidized region 20x (or the maximum length in the D1 direction) may be ½ or more or ½ or less of the length in the D1 direction of the dummy electrode 20. Also, the diameter in the D1 direction of the oxidized region 20x (or the maximum length in the D1 direction) may be ½ or more or ½ or less of the thickness of the dummy electrode 20.

[0056] Furthermore, for example, in a mode in which one or more oxidized regions 20x are formed as a partial region of the dummy electrode 20, as can be understood from the above description, the aspect ratio of each oxidized region 20x is arbitrary. For example, the diameter in the D1 direction (or the maximum length in the D1 direction) may be 1 / 2 or more or 1 / 2 or less of the diameter in the D3 direction (or the maximum length in the D3 direction). The shape of the oxidized region 20x is also arbitrary, and may be, for example, a circle, an ellipse, an oval (illustrated example), or a rectangle.

[0057] Also, for example, as can be understood from the above description, the diameter (minimum diameter, maximum diameter, circle equivalent diameter, etc.) of the oxidized region 20x is arbitrary. The diameter is a diameter passing through the geometric center (centroid) of the oxidized region 20x. For example, the minimum diameter of the oxidized region 20x may be 0.5 μm or more, 1.0 μm or more, or 2.0 μm or more. Furthermore, the minimum diameter may be the same as the thickness of the dummy electrode 20 and may or may not be the diameter in the D3 direction.

[0058] Focus on one dummy electrode 20. The dummy electrode 20 has a length in the D2 direction. Therefore, there are an infinite number of D1D3 cross sections in the D2 direction as shown in FIG. 4. When the configuration (oxygen concentration, distribution pattern, area ratio, size and / or shape, etc.) of the oxidized region 20x in the above-mentioned D1D3 cross section is established, it is not necessary that the above configuration of the oxidized region 20x is established in all cross sections. For example, the above configuration may be established over ⅓ or more, ½ or more, or ⅔ or more of the length of the dummy electrode 20 in the D2 direction. Of course, the above configuration may be established over the entire length of the dummy electrode 20 in the D2 direction.

[0059] Whether or not the configuration related to the oxidized region 20x is established within the above-mentioned length range may be determined based on, for example, a predetermined number (e.g., 3, 5, or 10) of D1D3 cross-sectional images set at equal distances along the length of the dummy electrode 20 in the D2 direction. If it is difficult to extract multiple cross-sectional images from one capacitor 1, multiple cross-sectional images may be extracted from multiple capacitors 1 of the same type.

[0060] In the example of Figs. 1 to 3, a plurality of dummy electrodes 20 are provided. The above-mentioned configuration related to the oxidized region 20x does not need to be established in all of the plurality of dummy electrodes 20. For example, in an embodiment in which one cover 13 has a plurality of dummy layers 19, only the dummy layer 19 close to the effective portion 11 or far from the effective portion 11 may have the above-mentioned configuration related to the oxidized region 20x. In addition, in each dummy electrode 20, the above-mentioned configuration related to the oxidized region 20x may be established in both the D1 direction and the D2 direction, but it is not necessary that the above-mentioned configuration is established in both directions. Of course, the above-mentioned configuration related to the oxidized region 20x may be established in all dummy electrodes 20 and in all directions.

[0061] (2.2. Comparison with Oxidized Areas of Other Electrodes) The presence or absence of an oxidized region in the other electrodes (the internal electrode 9, the base electrode 16, and the external electrode 5), and the specific form in the case where an oxidized region exists, are arbitrary. The above description of the oxidized region 20x (concentration threshold, distribution form, area ratio, size, shape, etc.) may be applied to other electrodes as long as no contradiction occurs.

[0062] Also, for example, in the same cross section, the area ratio of the oxidized region 20x in the dummy electrode 20 may be larger, equal to, or smaller than the area ratio of the oxidized region in the other electrodes.

[0063] Note that the example described below does not have to be true for all dummy electrodes 20 (or other electrodes) as well as for the configuration related to the oxidized region 20x, and does not have to be true for all D1D3 cross sections that exist in an infinite number of directions in the D2 direction. In this regard, the above description of the oxidized region 20x may be used.

[0064] The region in the internal electrode 9 where the metal is oxidized is defined as an oxidized region 9x. The ratio of the total area of ​​all the oxidized regions 20x to the area of ​​the dummy electrode 20 (hereinafter referred to as the "first ratio") may be greater than the ratio of the total area of ​​all the oxidized regions 9x to the area of ​​the internal electrode 9 (hereinafter referred to as the "second ratio"). In this regard, the internal electrode 9 may or may not have an oxidized region 9x. When the oxidized region 9x exists, the difference between the first ratio and the second ratio may be any degree. For example, the first ratio may be 1.2 times or more, or 2 times or more, as large as the second ratio.

[0065] The above description of the comparison between the dummy electrode 20 and the internal electrode 9 may be applied to the base electrode 16 by replacing the term internal electrode 9 with the term base electrode 16. Fig. 4 illustrates an embodiment in which no oxidized region exists in the base electrode 16.

[0066] The above description of the comparison between the dummy electrode 20 and the internal electrode 9 may be applied to the external electrode 5 by replacing the term internal electrode 9 with the term external electrode 5. Fig. 4 illustrates an embodiment in which no oxidized region exists in the external electrode 5. In addition, in the case where the external electrode 5 includes a plurality of metal layers, the above description of the comparison between the dummy electrode 20 and the internal electrode 9 may be applied to some of the plurality of metal layers.

[0067] (3. Capacitor manufacturing method The capacitor 1 may be manufactured by various methods. For example, the outline of the manufacturing process may be the same as a known process. An example is shown below.

[0068] First, ceramic green sheets that will become the dielectric layer 7 and the insulating layer 17 are prepared. Next, a conductive paste that will become the internal electrode 9, the dummy electrode 20, or the base electrode 16 is applied (e.g., printed) to the ceramic green sheets. Next, the ceramic green sheets are stacked to prepare a laminate that will become the main body portion 3. Note that the stacking of the laminate that will become the effective portion 11 and the stacking of the portion that will become the cover 13 on the laminate may be performed together or separately.

[0069] The above-mentioned steps up to the production of the laminate are carried out, for example, on a mother board of a size from which a large number of main body parts 3 are obtained. After the production of the laminate, the mother board including the laminate is diced (e.g., cut) into pieces of a size roughly corresponding to the size of the main body parts 3. Next, the laminate having the size of the main body parts 3 is fired. After that, a metal film is formed on the main body parts 3, and the external electrodes 5 are formed.

[0070] Before firing, degreasing may be performed. The firing may be performed, for example, in a reducing atmosphere. After firing, a reoxidation heat treatment may be performed. Before and / or after firing, polishing (e.g., barrel polishing) of the main body portion 3 may be performed. In the polishing, for example, the ridges of the main body portion 3 may be chamfered or the side surfaces of the main body portion 3 may be polished.

[0071] The external electrode 5 may be formed by various methods. For example, a metal may be deposited on the surface of the base electrode 16 and on the edges of the internal electrode 9 and the dummy electrode 20 exposed to the outside by electroless plating and / or electrolytic plating. Also, a thin film formation method such as a dipping method, a printing method, CVD (Chemical Vapor Deposition) or PVD (Physical Vapor Deposition) may be adopted. As will be understood from the above, the base electrode 16 and the dummy electrode 20 may or may not contribute to the deposition of the metal.

[0072] The method of forming the oxidized region 20x (and other oxidized regions) and the method of adjusting the area ratio, etc. are arbitrary. For example, the degree of oxidation in the internal electrode 9 and the dummy electrode 20 may be adjusted by adjusting the amount of oxygen contained in the conductive paste before application and / or adjusting the time for which the ceramic green sheet before lamination on which the conductive paste is applied is exposed to an oxidizing atmosphere. Also, for example, an oxidizing agent or a reducing agent may be used at an appropriate time. By making the whole or a part of the dummy electrode 20 have a thickness of a certain degree or more, the dummy electrode 20 is easily exposed to oxygen during or after firing, and thus the degree of oxidation may be increased absolutely or relatively to the internal electrode 9. The same may be applied to the base electrode 16. Moreover, since the base electrode 16 is exposed to the outside before the formation of the external electrode 5, the degree of oxidation may be adjusted by an oxygen atmosphere, an oxidizing agent, or a reducing agent after firing.

[0073] (4. Configuration of Capacitor According to Other Embodiments) Fig. 5 is a perspective view of a capacitor 201 according to the second embodiment. Figs. 3 and 4 according to the first embodiment may be referred to as cross-sectional views of the capacitor 201.

[0074] Generally speaking, the capacitor 201 is different from the four-terminal type capacitor 1 in that it is a two-terminal type. In the capacitor 201, too, an oxidized region 20x may be formed in the dummy electrode 20, as described with reference to FIGS.

[0075] The specific shapes and dimensions of each part of capacitor 201 may be different from those of capacitor 1, since capacitor 201 is a two-terminal type. More specifically, they are as follows.

[0076] The shape of the main body 203 (or the capacitor 201) is, for example, a roughly rectangular parallelepiped. For example, the height (length in the D3 direction) of this rectangular parallelepiped may be equal to (as in the illustrated example) or smaller than the width (length in the D2 direction). The length (D1 direction) of the rectangular parallelepiped is, for example, greater than the width. The dimensions of the main body 203 are arbitrary. As long as the length in the D1 direction is greater than the length in the D2 direction, the specific examples of the dimensions of the main body 3 in the first embodiment may be applied to the dimensions of the main body 203. The external electrode 5 is roughly layered covering the longitudinal ends of the main body 203 over the five faces of the rectangular parallelepiped.

[0077] The planar shape of the internal electrode 9 is, for example, approximately a rectangle having four sides parallel to the four sides of the rectangular main body 203 (dielectric layer 7). Of the four sides of the internal electrode 9, two long sides and one short side are, for example, located inside the side surface of the main body 203 (not exposed). The remaining short side is exposed from the side surface of the +D1 side or -D1 side of the main body 203. A region of the internal electrode 9 that overlaps with another internal electrode 9 in a planar perspective view is an electrode body 9a. A portion extending from the electrode body 9a to the external electrode 5 is an extraction electrode 9b.

[0078] Each dummy layer 19 has, for example, two dummy electrodes 20 at both ends in the longitudinal direction of the main body 203. The planar shape of the dummy electrode 20 is, for example, a rectangular shape that spans the entire width (length in the D2 direction) of the main body 203, and is exposed, for example, from a side surface on the +D1 side or -D1 side of the main body 203 and from a side surface on the +D2 side and a side surface on the -D2 side. The above description of the configuration of the dummy layer 19 (dummy electrode 20) in a planar view may be applied to the configuration of the base layer 15 (base electrode 16) in a planar view.

[0079] Although not specifically shown, still another example of the capacitor configuration will be given.

[0080] The capacitor may have an exterior resin that covers the entire structure illustrated in Fig. 1 or 5, and a lead wire that is connected to the external electrode 5 and extends from the exterior resin. From another perspective, the capacitor may be a through-hole mount type rather than a surface mount type. In such an embodiment, one external electrode 5 may only cover one side surface.

[0081] Two types of internal electrodes 9 connected to different external electrodes 5 may be alternately stacked two by two, rather than one by one. In this case, for example, the thickness of the dielectric layer 7 between the internal electrodes 9 connected to the same external electrode 5 and facing each other may be thinner than the thickness of the dielectric layer 7 between the internal electrodes 9 connected to different external electrodes 5 and facing each other. As can be understood from this, the multiple dielectric layers 7 do not need to have the same shape and size.

[0082] Furthermore, the two types of internal electrodes 9 connected to different external electrodes 5 do not have to face each other. For example, two types of internal electrodes 9 connected to different external electrodes 5 may be provided in the same layer, and an internal electrode 9 facing the two types of internal electrodes 9 may be provided, thereby forming a circuit in which two parallel plate capacitors are connected in series. Also, a circuit in which three or more parallel plate capacitors are connected in series may be formed.

[0083] In the example of FIG. 5, among the edges of the internal electrode 9, for example, a portion other than the -D1 side or the +D1 side (referred to as the "non-exposed edge portion" in this paragraph) is not exposed from the side surface of the main body portion 203. This non-exposed edge portion is covered by the portions of the dielectric layer 7 and the insulating layer 17 that extend outward beyond the non-exposed edge portion. However, the non-exposed edge portion may be covered by overlapping another dielectric layer on the side surface of the laminate formed by the dielectric layer 7 and the insulating layer 17, thereby preventing it from being exposed. From another point of view, the main body portion 203 does not need to have a laminated structure in its entirety.

[0084] (5. Summary of the embodiment) In the following description, for convenience, the reference numerals in the first embodiment are used, but the matters described below also apply to the other embodiments unless a contradiction arises.

[0085] The multilayer electronic component (capacitor 1) has an effective portion 11 and a cover 13. The effective portion 11 has dielectric layers 7 and internal electrodes 9 that are alternately stacked in a stacking direction (direction D3). The cover 13 overlaps the effective portion 11 in the direction D3. The cover 13 has a plurality of insulating layers 17 that are stacked in the direction D3, and a dummy electrode 20 located between the plurality of insulating layers 17. The dummy electrode 20 has at least one oxidized region 20x.

[0086] Therefore, for example, as described in the outline of the embodiment, the volume of the dummy electrode 20 is increased and the gap between the dummy electrode 20 and the insulating layer 17 is reduced, thereby achieving various effects.

[0087] The thickness of the dummy electrode 20 may be greater than the thickness of the internal electrode 9 .

[0088] In this case, for example, the dummy electrode 20 has a relatively large shrinkage amount due to firing, and is relatively likely to have a gap. The effect of the oxidized region 20x is useful because the gap is reduced by forming the oxidized region 20x in the dummy electrode 20. Although the shrinkage due to firing has been described, the same can be said about the shrinkage due to temperature changes after fabrication and / or during use.

[0089] In a cross section parallel to the stacking direction (D3 direction), the ratio (first ratio) of the total area of ​​the oxidized regions 20x in the dummy electrode 20 to the area of ​​the dummy electrode 20 may be greater than the ratio (second ratio, which may be 0) of the total area of ​​the oxidized regions 9x in the internal electrode 9 to the area of ​​the internal electrode 9.

[0090] Here, if the degree of oxidation of the internal electrode 9 increases, for example, the electrical resistivity increases, and the electrical characteristics of the capacitor 1 deteriorate. On the other hand, since the dummy electrode 20 is not a part that directly contributes to the electrical characteristics of the capacitor 1, it does not matter if the electrical resistivity increases due to oxidation. Therefore, by making the degree of oxidation of the dummy electrode 20 greater than the degree of oxidation of the internal electrode 9, it is easier to obtain the effect of reducing the gap related to the dummy electrode 20 described above while maintaining the electrical characteristics of the capacitor 1.

[0091] In a cross section parallel to the stacking direction (D3 direction), the dummy electrode 20 may have an oxidized region 20x with a minimum diameter of 0.5 μm or more.

[0092] In this case, for example, the oxidized region 20x is relatively large, so the effect of reducing the gap described above is improved. In particular, in a small capacitor 1, the thickness of the internal electrode 9 may be 1 μm or less than 1 μm, and the dummy electrode 20 may also be relatively thin. In such a configuration, the oxidized region 20x having a diameter of 0.5 μm or more functions effectively.

[0093] In a cross section parallel to the stacking direction (D3 direction), the dummy electrode 20 may have an oxidized region 20x that is large enough to cover the entire thickness of the dummy electrode 20.

[0094] In this case, the volume of the dummy electrode 20 is maximized in the thickness direction in at least a part of the D1 direction (or the D2 direction) (excluding the effect of the oxygen concentration in the oxidized region 20x). This improves the effect of reducing the gap described above.

[0095] In a cross section parallel to the stacking direction (D3 direction) and a first direction (e.g., D1 direction) perpendicular to the D3 direction, the dummy electrode 20 may be located closer to the end than to the center in the D1 direction with respect to the cover 13 (the dummy electrode 20 shown in FIG. 4 is on the -D1 side). In the dummy electrode 20, the total area of ​​the oxidized region 20x in the half on the end side of the cover 13 may be larger than the total area of ​​the oxidized region 20x in the half on the center side of the cover 13.

[0096] In this case, for example, the gap is reduced toward the end of the cover 13. As a result, for example, the intrusion of unintended gas and / or liquid into the gap is more likely to be prevented at the end of the cover 13. Therefore, the intrusion of gas and / or liquid into the deep portion can be effectively reduced relative to the degree of oxidation in the entire dummy electrode 20. As a result, for example, the electrical characteristics of the capacitor 1 are more likely to be maintained.

[0097] The capacitor 1 may further have a base electrode 16 overlapping the cover 13 from the side opposite to the effective portion 11. In a cross section parallel to the stacking direction (direction D3), the ratio of the total area of ​​the oxidized regions 20x in the dummy electrode 20 to the area of ​​the dummy electrode 20 may be larger than the ratio of the total area of ​​the oxidized regions (not shown) in the base electrode 16 to the area of ​​the base electrode 16.

[0098] Here, as the degree of oxidation of the base electrode 16 increases, for example, the adhesive strength of the external electrode 5 to the base electrode 16 decreases. On the other hand, the dummy electrode 20 contributes to improving the adhesive strength of the external electrode 5, but has a smaller effect on peeling of the external electrode 5 than the base electrode 16. Therefore, by making the degree of oxidation of the dummy electrode 20 greater than the degree of oxidation of the base electrode 16, it is easier to obtain the effect of reducing the gap associated with the dummy electrode 20 described above while maintaining the peel strength of the external electrode 5.

[0099] The base electrode 16 does not necessarily have to have an oxidized region.

[0100] In this case, for example, the effect of reducing the gaps associated with the dummy electrodes 20 is improved while maintaining the peel strength of the external electrodes 5 described above.

[0101] As described above, in an embodiment in which the area ratio of the oxidized region 20x in the dummy electrode 20 is greater than the area ratio of the oxidized region in the underlying electrode 16, the dummy electrode 20 may be thinner than the underlying electrode 16.

[0102] In this case, for example, by making the base electrode 16, which has a relatively high adhesive strength with the external electrode 5, relatively thick, the adhesive strength of the external electrode 5 to the capacitor 1 can be efficiently improved.

[0103] The technology according to the present disclosure is not limited to the above-described embodiments and may be implemented in various forms.

[0104] For example, the multilayer electronic component is not limited to a capacitor. For example, in the multilayer electronic component, some of the multiple internal electrodes may form a capacitor, and the other of the multiple internal electrodes may form an inductor or resistor. The multilayer electronic component may form an appropriate circuit (for example, a resonant circuit) as a whole. The cover, the base electrode, and the external electrode may be provided on only one of the upper and lower surfaces of the active part. [Explanation of symbols]

[0105] 1...capacitor, 5...external electrode, 7...dielectric layer, 9...internal electrode, 11...active portion, 13...cover, 17...insulating layer, 20...dummy electrode, 20x...oxidized region (of dummy electrode).

Claims

1. an effective portion having dielectric layers and internal electrodes alternately stacked in a stacking direction; a cover overlapping the effective portion in the stacking direction; It has The cover is A plurality of insulating layers stacked in the stacking direction; a dummy electrode located between the insulating layers, The dummy electrode has at least one oxidized region, In a cross section parallel to the lamination direction, a ratio of a total area of ​​the oxidized regions of the dummy electrodes to an area of ​​the dummy electrodes is larger than a ratio of a total area of ​​the oxidized regions of the internal electrodes to an area of ​​the internal electrodes. Multilayer electronic components.

2. The thickness of the dummy electrodes is greater than the thickness of the internal electrodes. The multilayer electronic component according to claim 1 .

3. In a cross section parallel to the lamination direction, the dummy electrode has an oxidized region having a minimum diameter of 0.5 μm or more. The multilayer electronic component according to claim 1 .

4. In a cross section parallel to the lamination direction, the dummy electrode has an oxidized region having a size that spans the entire thickness of the dummy electrode. The multilayer electronic component according to claim 1 or 3.

5. In a cross section parallel to the stacking direction and a first direction perpendicular to the stacking direction, the dummy electrode is located closer to an end than to a center of the cover in the first direction, In the dummy electrode, the total area of ​​the oxidized region in the half on the edge side is larger than the total area of ​​the oxidized region in the half on the center side. The multilayer electronic component according to claim 1 .

6. The cover further includes a base electrode overlapping the cover from the opposite side to the effective portion, In a cross section parallel to the lamination direction, a ratio of a total area of ​​the oxidized regions of the dummy electrode to an area of ​​the dummy electrode is larger than a ratio of a total area of ​​the oxidized regions of the base electrode to an area of ​​the base electrode. The multilayer electronic component according to claim 1 .

7. The underlying electrode does not have an oxidized region. The multilayer electronic component according to claim 6 .

8. The dummy electrode is thinner than the base electrode. The multilayer electronic component according to claim 6 or 7.

9. In a cross section parallel to the lamination direction, the ratio of a total area of ​​an oxidized region in the dummy electrode to an area of ​​the dummy electrode is 5% or more. The multilayer electronic component according to claim 1 .

10. In a cross section parallel to the lamination direction, the ratio of a total area of ​​an oxidized region in the dummy electrode to an area of ​​the dummy electrode is 20% or less. The multilayer electronic component according to claim 1 or 9.

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