Drawing device

Abstract

To suitably adjust the temperature of a drawing head moving along a head moving path.SOLUTION: A drawing head moving mechanism 42 of a drawing apparatus 1 horizontally moves a head unit 43 between a first drawing position and a second drawing position along a head movement path. A gas delivery section 5 is arranged along the head movement path. A gas flow path 51 of the gas delivery section 5 extends along the head movement path from the first drawing position to the second drawing position. A gas delivery port is provided at a portion of the gas flow path 51 facing the head unit 43 and delivers gas toward the gas inlet of a head cover 44. A delivery position switching section switches the position of the gas delivery port between a first delivery position facing the head unit 43 positioned at the first drawing position and a second delivery position facing the head unit 43 positioned at the second drawing position. Thereby, the temperature of the drawing head that moves along the head movement path can be adjusted appropriately.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a drawing apparatus for performing drawing on a substrate. [Background technology]

[0002] Conventionally, patterns have been drawn by irradiating light onto a photosensitive material formed on a semiconductor substrate, a printed circuit board, or a glass substrate for an organic electroluminescence display device or a liquid crystal display device (hereinafter referred to as a "substrate").

[0003] In the imaging device that performs the imaging, if the temperature of the projection optical system or the like fluctuates in the imaging head that emits light toward the substrate, there is a possibility that the magnification, focus position, imaging position, etc. may fluctuate. Therefore, in the imaging device of Patent Document 1, a technology is disclosed in which a temperature-controlling air duct extending from a temperature regulator is disposed in a housing that covers the multiple imaging heads of the imaging section, and temperature-controlling air is supplied to the inside of the housing from the outlet of the air duct, thereby maintaining the temperature of the multiple imaging heads. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6117594 Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, in order to improve the throughput of drawing apparatuses, it has been proposed to provide two stages and one drawing unit within a single drawing apparatus, and to perform replacement or alignment of a substrate on one stage while drawing is being performed on a substrate on the other stage.

[0006] In such a drawing device, when attempting to control the temperature of the drawing head as in Patent Document 1, the air duct for temperature control changes shape to follow the drawing unit as the drawing unit moves from above one stage to above the other stage. However, when the air duct deforms, the flow of air discharged from the outlet into the housing of the drawing unit becomes turbulent, causing a loss of flow rate of the air and uneven distribution of the flow rate, which may result in inappropriate temperature control of the drawing head.

[0007] The present invention has been made in consideration of the above-mentioned problems, and has an object to suitably adjust the temperature of a drawing head moving along a head movement path. [Means for solving the problem]

[0008] The invention described in claim 1 is a drawing device for drawing on a substrate, comprising: a substrate holding part for holding the substrate in a horizontal position; a substrate moving mechanism for horizontally moving the substrate holding part along a substrate movement path; a head unit including a drawing head arranged above the substrate holding part for irradiating light onto the substrate to draw a pattern; and a head cover for accommodating the drawing head; a drawing head moving mechanism for horizontally moving the head unit between a first head position and a second head position along a head movement path that intersects with the substrate movement path in a plan view; the head cover is provided with a gas delivery section capable of supplying temperature-regulated gas to the inside of the head cover regardless of which head position the head cover is positioned at, the gas delivery section comprising: a gas flow path extending along the head movement path from the first head position to the second head position and through which the gas flows; a gas delivery outlet provided at a portion of the gas flow path facing the head unit and delivering the gas toward the gas inlet of the head cover; and a delivery position switching section which switches the position of the gas delivery outlet between a first delivery position facing the head unit positioned at the first head position and a second delivery position facing the head unit positioned at the second head position.

[0009] The invention described in claim 2 is the drawing device described in claim 1, wherein an opening is provided in the gas flow path extending from the first delivery position to the second delivery position, and the delivery position switching unit includes an opening / closing unit that opens and closes a first region of the opening that faces the head unit located at the first head position and a second region that faces the head unit located at the second head position, and the opening / closing unit opens the first region of the opening and closes the second region, thereby setting the position of the gas delivery outlet to the first delivery position, and the opening / closing unit closes the first region of the opening and opens the second region, thereby setting the position of the gas delivery outlet to the second delivery position.

[0010] The invention described in claim 3 is the drawing device described in claim 1, wherein the gas outlet is movably provided along the head movement path at a portion of the gas flow path facing the head unit, and is moved between the first outlet position and the second outlet position by the outlet position switching unit in synchronization with the movement of the head unit between the first head position and the second head position.

[0011] The invention recited in claim 4 is the drawing apparatus recited in any one of claims 1 to 3, wherein the gas outlet comprises a plurality of outlet holes distributed in a portion of the gas flow path facing the head unit.

[0012] The invention described in claim 5 is a drawing apparatus described in any one of claims 1 to 4, wherein the gas outlet faces the projection optical system of the drawing head and is arranged on both sides of the width direction of the position, avoiding a position facing the width direction center of the projection optical system.

[0013] The invention described in claim 6 is a drawing device described in any one of claims 1 to 5, further comprising a temperature sensor that measures the temperature of the drawing head, and a temperature adjustment unit that adjusts the temperature of the gas supplied to the gas delivery unit based on the output from the temperature sensor.

[0014] The invention described in claim 7 is a drawing device described in any one of claims 1 to 6, wherein the head unit further includes another drawing head that is adjacent to the drawing head within the head cover and arranged along the head movement path together with the drawing head, and that irradiates light onto the substrate to draw a pattern, and the gas outlet includes a delivery area facing the drawing head and another delivery area spaced apart from the delivery area and facing the other drawing head.

[0015] The invention described in claim 8 is a drawing device described in any one of claims 1 to 7, wherein the head unit further includes another drawing head that is adjacent to the drawing head in the head cover and arranged along the head movement path together with the drawing head, and that irradiates light onto the upper main surface of the substrate to draw a pattern, and a partition is provided in an area facing the gas inlet in the head cover to separate the drawing head from the other drawing head.

[0016] The invention described in claim 9 is a drawing apparatus described in any one of claims 1 to 8, further comprising: another substrate holding part arranged adjacent to the substrate holding part and holding the substrate in a horizontal position; and another substrate moving mechanism arranged alongside the substrate moving mechanism in a direction intersecting the substrate movement path and moving the other substrate holding part horizontally along another substrate movement path parallel to the substrate movement path, wherein the first head position is a first drawing position above the substrate holding part where light is irradiated onto the substrate on the substrate holding part, and the second head position is a second drawing position above the other substrate holding part where light is irradiated onto the substrate on the other substrate holding part. Effect of the Invention

[0017] In the present invention, the temperature of the drawing head moving along the head movement path can be suitably adjusted. [Brief description of the drawings]

[0018] [Figure 1] 1 is a perspective view showing a drawing device according to an embodiment; [Diagram 2] FIG. 1 illustrates a configuration of a computer. [Diagram 3] FIG. 4 is a block diagram showing the functions of a control unit. [Figure 4] FIG. 2 is a front view of the head unit. [Diagram 5] FIG. 2 is a side view of the head unit. [Figure 6] FIG. 2 is a diagram illustrating a gas delivery unit and a configuration related to the gas delivery unit. [Figure 7] FIG. 2 is a side view of the head unit and the gas delivery section. [Figure 8] FIG. [Figure 9] FIG. 4 is a cross-sectional view of a gas flow path and a head unit. [Figure 10] FIG. [Figure 11] FIG. 2 is a front view of the head unit. [Figure 12] FIG. 11 is a rear view showing another preferred example of a gas flow path. [Figure 13] FIG. 11 is a rear view showing another preferred example of a gas flow path. [Figure 14] FIG. 4 is a cross-sectional view of a gas flow path and a head unit. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] FIG. 1 is a perspective view showing a drawing apparatus 1 according to an embodiment of the present invention. The drawing apparatus 1 is a twin-stage type direct drawing apparatus that draws a pattern by irradiating a photosensitive material on a substrate 9 with spatially modulated light in a substantially beam shape and scanning the substrate 9 with an irradiated area of ​​the light. In FIG. 1, three mutually orthogonal directions are indicated by arrows as the X direction, the Y direction, and the Z direction. In the example shown in FIG. 1, the X direction and the Y direction are horizontal directions perpendicular to each other, and the Z direction is a vertical direction. The same applies to other figures.

[0020] The substrate 9 is, for example, a plate-like member having a substantially rectangular shape in a plan view. The substrate 9 is, for example, a printed circuit board. On the (+Z) side main surface (hereinafter also referred to as "upper surface 91") of the substrate 9, a resist film formed of a photosensitive material is provided on a copper layer. In the drawing device 1, a circuit pattern is drawn (i.e., formed) on the resist film of the substrate 9. The type, shape, etc. of the substrate 9 may be changed in various ways.

[0021] The imaging device 1 includes a first transport mechanism 2a, a second transport mechanism 2b, an imaging unit 3, a imaging unit 4, a gas delivery unit 5, a frame 7, and a controller 10. The controller 10 controls the first transport mechanism 2a, the second transport mechanism 2b, the imaging unit 3, the imaging unit 4, and the gas delivery unit 5.

[0022] FIG. 2 is a diagram showing the configuration of a computer 100 included in the control unit 10. The computer 100 is a normal computer including a processor 101, a memory 102, an input / output unit 103, and a bus 104. The bus 104 is a signal circuit that connects the processor 101, the memory 102, and the input / output unit 103. The memory 102 stores programs and various information. The processor 101 executes various processes (e.g., numerical calculations and image processing) using the memory 102 and the like according to the programs and the like stored in the memory 102. The input / output unit 103 includes a keyboard 105 and a mouse 106 that receive input from an operator, and a display 107 that displays output and the like from the processor 101. The control unit 10 may be a programmable logic controller (PLC), a circuit board, or the like, or may be a combination of one or more computers with these.

[0023] Fig. 3 is a block diagram showing the functions of control unit 10 realized by computer 100. Fig. 3 also shows configurations other than control unit 10. Control unit 10 includes a storage unit 111, an imaging control unit 112, a detection unit 113, a drawing control unit 114, an air supply control unit 115, and a temperature control unit 116. Storage unit 111 is mainly realized by memory 102, and stores various information such as data of a pattern to be drawn on substrate 9 (i.e., drawing data) in advance.

[0024] The imaging control unit 112, the detection unit 113, the drawing control unit 114, the airflow control unit 115, and the temperature control unit 116 are mainly realized by the processor 101. The imaging control unit 112 controls the imaging unit 3, the first transport mechanism 2a, and the second transport mechanism 2b to cause the imaging unit 3 to capture an image of the upper surface 91 of the substrate 9 on the first transport mechanism 2a and the second transport mechanism 2b and acquire an image. The image is sent to the storage unit 111 and stored therein. The detection unit 113 uses the image to detect the position of the substrate 9 on the first transport mechanism 2a and the position of the substrate 9 on the second transport mechanism 2b. The drawing control unit 114 controls the drawing unit 4, the first transport mechanism 2a, and the second transport mechanism 2b based on the position of the substrate 9 detected by the detection unit 113 and the drawing data previously stored in the storage unit 111, thereby causing the drawing unit 4 to draw on the substrate 9 on the first transport mechanism 2a and the second transport mechanism 2b. The air blowing control unit 115 controls the delivery of gas by the gas delivery unit 5. The temperature control unit 116 controls the temperature of the gas delivered from the gas delivery unit 5 by controlling the temperature adjustment unit 57 described later.

[0025] The frame 7 shown in FIG. 1 is a main body base on which each component of the drawing device 1 is attached. The frame 7 includes a substantially rectangular parallelepiped base 71, and a gate-shaped first gantry unit 72 and a second gantry unit 73 that straddle the base 71. The second gantry unit 73 is disposed adjacent to the (+Y) side of the first gantry unit 72. In the following description, the first gantry unit 72 and the second gantry unit 73 are also collectively referred to as "gantry unit 74." The gantry unit 74 is fixed relatively to the base 71. The first transport mechanism 2a and the second transport mechanism 2b are attached on the base 71. The first gantry unit 72 supports the imaging unit 3. The second gantry unit 73 supports the drawing unit 4. The frame 7 is placed on a pedestal (not shown).

[0026] The first transport mechanism 2a and the second transport mechanism 2b are mechanisms that hold and move the substrate 9 below (i.e., on the (-Z) side) the imaging unit 3 and the drawing unit 4. The second transport mechanism 2b is disposed adjacent to the (+X) side of the first transport mechanism 2a. The first transport mechanism 2a and the second transport mechanism 2b have approximately the same structure.

[0027] The first transport mechanism 2a includes a first stage 21a and a first moving mechanism 22a. The first stage 21a is a substantially flat substrate holder that holds the substrate 9 from below in a substantially horizontal state. The first stage 21a is, for example, a vacuum chuck that adsorbs and holds the lower surface of the substrate 9. The first stage 21a may have a structure other than a vacuum chuck. The upper surface 91 of the substrate 9 placed on the first stage 21a is substantially perpendicular to the Z direction (i.e., the up-down direction) and substantially parallel to the X direction and the Y direction.

[0028] The first moving mechanism 22a is a substrate moving mechanism that moves the substrate 9 together with the first stage 21a substantially horizontally along a substrate moving path parallel to the Y direction (i.e., moves in a direction substantially parallel to the upper surface 91 of the substrate 9). In the following description, the substrate moving path of the substrate 9 by the first moving mechanism 22a is also called the "first substrate moving path". The first moving mechanism 22a moves the first stage 21a supported on the guide rail 221a linearly in the Y direction along the guide rail 221a below the imaging unit 3 and the drawing unit 4. As a result, the substrate 9 held by the first stage 21a moves in the Y direction. In the following description, the Y direction is also called the "substrate moving direction". The driving source of the first moving mechanism 22a is, for example, a linear servo motor or a motor attached to a ball screw. The structure of the first moving mechanism 22a may be variously modified.

[0029] The second transport mechanism 2b includes a second stage 21b and a second moving mechanism 22b. The second stage 21b is disposed adjacent to the side (i.e., (+X) side) of the first stage 21a, which is a substrate holder, and is another substantially flat-plate-shaped substrate holder that holds the substrate 9 in a substantially horizontal state from below. The upper surface of the second stage 21b is located at substantially the same height in the vertical direction (i.e., Z direction) as the upper surface of the first stage 21a. The second stage 21b is, for example, a vacuum chuck that adsorbs and holds the lower surface of the substrate 9. The second stage 21b may have a structure other than a vacuum chuck. The upper surface 91 of the substrate 9 placed on the second stage 21b is substantially perpendicular to the Z direction and substantially parallel to the X direction and the Y direction. The upper surface 91 of the substrate 9 held by the second stage 21b is located at substantially the same height in the vertical direction (i.e., substantially the same position in the Z direction) as the upper surface 91 of the substrate 9 held by the first stage 21a.

[0030] The second moving mechanism 22b is another substrate moving mechanism arranged alongside the first moving mechanism 22a in a direction intersecting the substrate moving direction (i.e., the Y direction). In the example shown in FIG. 1, the first moving mechanism 22a and the second moving mechanism 22b are arranged alongside in the X direction, and the second moving mechanism 22b is adjacent to the (+X) side of the first moving mechanism 22a. The first moving mechanism 22a and the second moving mechanism 22b are located at approximately the same height in the up-down direction. The second moving mechanism 22b moves the substrate 9 together with the second stage 21b approximately horizontally along another substrate moving path (hereinafter also referred to as the "second substrate moving path") that is approximately parallel to the first substrate moving path.

[0031] The second moving mechanism 22b linearly moves the second stage 21b supported on the guide rail 221b in the Y direction (i.e., the substrate moving direction) along the guide rail 221b below the imaging unit 3 and the drawing unit 4. This causes the substrate 9 held by the second stage 21b to move in the Y direction. The direction of movement of the second stage 21b by the second moving mechanism 22b is approximately parallel to the direction of movement of the first stage 21a by the first moving mechanism 22a. The drive source of the second moving mechanism 22b is, for example, a linear servo motor or a motor attached to a ball screw. The structure of the second moving mechanism 22b may be modified in various ways.

[0032] The first substrate movement path and the second substrate movement path are paths fixed to the base 71 of the frame 7. The first substrate movement path is determined, for example, based on the guide rail 221a of the above-mentioned first movement mechanism 22a. The second substrate movement path is determined, for example, based on the guide rail 221b of the above-mentioned second movement mechanism 22b. Note that the first substrate movement path and the second substrate movement path may be determined based on other configurations.

[0033] The first moving mechanism 22a and the second moving mechanism 22b extend from the (+Y) side to the (-Y) direction beyond the second gantry unit 73, pass below the drawing unit 4 supported by the second gantry unit 73 and below the imaging unit 3 supported by the first gantry unit 72, and protrude to the (-Y) side from the first gantry unit 72. The first gantry unit 72 is located at approximately the same position in the Y direction as the centers in the Y direction of the first moving mechanism 22a and the second moving mechanism 22b.

[0034] In the drawing apparatus 1, the substrate 9 is carried in and out of the first stage 21a in a state in which the first stage 21a is positioned on the (-Y) side of the first gantry section 72. Moreover, the substrate 9 is carried in and out of the second stage 21b in a state in which the second stage 21b is positioned on the (-Y) side of the first gantry section 72.

[0035] As described above, the first gantry unit 72 and the second gantry unit 73 are provided across the first transport mechanism 2a and the second transport mechanism 2b. The first gantry unit 72 includes two support columns extending in the Z direction on both sides of the first transport mechanism 2a and the second transport mechanism 2b in the X direction, and a beam portion connecting the upper ends of the two support columns. The beam portion extends in the X direction above the first transport mechanism 2a and the second transport mechanism 2b. The two support columns of the first gantry unit 72 are connected to the base 71 at their ends on the (-Z) side. The second gantry unit 73 includes two support columns extending in the Z direction on both sides of the first transport mechanism 2a and the second transport mechanism 2b in the X direction, and a beam portion connecting the upper ends of the two support columns. The beam portion extends in the X direction above the first transport mechanism 2a and the second transport mechanism 2b. The two support columns of the second gantry section 73 are connected to the base 71 at their ends on the (-Z) side.

[0036] The imaging unit 3 includes a plurality of imaging heads 31 (two in the example shown in FIG. 1) and an imaging head moving mechanism 32. The plurality of imaging heads 31 are arranged in the X direction and movably attached to the beam portion of the first gantry unit 72. The imaging head moving mechanism 32 is attached to the beam portion and moves the plurality of imaging heads 31 in the X direction along the beam portion. The driving source of the imaging head moving mechanism 32 is, for example, a linear servo motor or a motor attached to a ball screw. In the example shown in FIG. 1, the interval between the two imaging heads 31 in the X direction is changeable. Note that the number of imaging heads 31 in the imaging unit 3 may be one or may be three or more.

[0037] Each imaging head 31 is a camera equipped with an imaging sensor and an optical system (not shown). Each imaging head 31 is, for example, an area camera that captures a two-dimensional image. The imaging sensor is equipped with, for example, a plurality of elements such as CCDs (Charge Coupled Devices) arranged in a matrix. In each imaging head 31, the reflected light of illumination light guided from a light source (not shown) to the upper surface 91 of the substrate 9 is guided to the imaging sensor via the optical system. The imaging sensor receives the reflected light from the upper surface 91 of the substrate 9 and captures an image of a substantially rectangular imaging area. As the light source, various light sources such as LEDs (Light Emitting Diodes) can be used. Note that each imaging head 31 may be another type of camera such as a line camera.

[0038] In the drawing device 1, the imaging head moving mechanism 32 moves the multiple imaging heads 31 between a first imaging position above the first transport mechanism 2a and a second imaging position above the second transport mechanism 2b. In FIG. 1, the multiple imaging heads 31 are located at the first imaging position. The multiple imaging heads 31 capture an image of the upper surface 91 of the substrate 9 on the first stage 21a at the first imaging position. The multiple imaging heads 31 also capture an image of the upper surface 91 of the substrate 9 on the second stage 21b at the second imaging position.

[0039] The drawing section 4 includes a head unit 43 and a drawing head moving mechanism 42. The head unit 43 is movably attached to a beam portion of the second gantry section 73. The drawing head moving mechanism 42 is attached to the beam portion and moves the head unit 43 in the X direction along the beam portion. The driving source of the drawing head moving mechanism 42 is, for example, a linear servo motor, or a motor attached to a ball screw.

[0040] Fig. 4 is a front view of head unit 43 as viewed from the (-Y) side. Fig. 5 is a side view of head unit 43 as viewed from the (-X) side. Fig. 5 shows a cross section of head cover 44, which will be described later, and the internal configuration of head cover 44 is drawn with solid lines.

[0041] The head unit 43 includes a drawing head 41 and a head cover 44. In the example shown in FIG. 4, the head unit 43 includes six drawing heads 41. The six drawing heads 41 are arranged at substantially the same positions in the Y direction and the Z direction, and are arranged adjacent to each other substantially parallel to the X direction. The head cover 44 accommodates the six drawing heads 41 therein. The head cover 44 is a housing made of a thin plate member that surrounds the six drawing heads 41. The drawing heads 41 and the head cover 44 are arranged above the first stage 21a and the second stage 21b (see FIG. 1). The number of drawing heads 41 accommodated inside the head cover 44 may be one, or may be variously changed to a range of two or more.

[0042] Each of the multiple drawing heads 41 irradiates light onto the substrate 9 to draw a pattern. The multiple drawing heads 41 have approximately the same structure. Each drawing head 41 includes an illumination optical system 411, a spatial light modulation element 412, a projection optical system 413, and a focus sensor 415. The illumination optical system 411 guides light from a light source (not shown) to the spatial light modulation element 412. Note that FIG. 4 illustrates only a part of the configuration of the illumination optical system 411. As the light source, various light sources such as an LD (Laser Diode) can be used. The spatial light modulation element 412 modulates the light from the illumination optical system 411 and guides it to the projection optical system 413. As the spatial light modulation element 412, various elements such as a DMD (Digital Micro Mirror Device) and a GLV (Grating Light Valve) (registered trademark of Silicon Light Machines, Sunnyvale, California) can be used. The projection optical system 413 guides the light modulated by the spatial light modulation element 412 to the upper surface 91 of the substrate 9. The focus sensor 415 is disposed at approximately the same position in the vertical direction as the objective lens 414 provided at the lower end of the projection optical system 413, and is used for adjusting the focus of the drawing head 41.

[0043] 4 and 5, most of the illumination optical system 411, the spatial light modulation element 412, and the projection optical system 413 of each imaging head 41 are housed inside the head cover 44, and the lower part of the objective lens 414 and the focus sensor 415 protrude downward from the lower end of the head cover 44. Note that in the head unit 43, the entire configuration of the imaging head 41 may be housed inside the head cover 44.

[0044] A substantially rectangular opening 441 extending in the X direction is provided on the (-Y) side surface of the head cover 44. As described later, the opening 441 is an inlet through which the gas delivered from the gas delivery unit 5 flows in, and in the following description, is also referred to as a "gas inlet 441."

[0045] In the example shown in FIG. 4 and FIG. 5, the gas inlet 441 is provided on a surface approximately perpendicular to the Y direction in a groove 442 extending in the X direction provided on the (-Y) side surface of the head cover 44. The groove 442 is a substantially rectangular parallelepiped space extending approximately parallel to the X direction, which is formed by recessing a part of the (-Y) side surface of the head cover 44 in the (+Y) direction. The gas inlet 441 faces the six drawing heads 41 arranged in the X direction in the Y direction. The length of the gas inlet 441 in the X direction is longer than the length of the area in which the six drawing heads 41 are provided in the X direction. In the example shown in FIG. 4 and FIG. 5, the gas inlet 441 faces the projection optical system 413 of the six drawing heads 41 in the Y direction.

[0046] In the drawing device 1 shown in FIG. 1, the head unit 43 (i.e., the multiple drawing heads 41 and the head cover 44) is moved along a predetermined movement path by the drawing head moving mechanism 42 between a first drawing position above the first transport mechanism 2a and a second drawing position above the second transport mechanism 2b. In FIG. 1, the head unit 43 is located at the second drawing position. The movement path of the head unit 43 (hereinafter also referred to as the "head movement path") extends approximately parallel to the X direction at a position spaced upward from the first substrate movement path and the second substrate movement path described above, and intersects the first substrate movement path and the second substrate movement path approximately perpendicularly in a plan view. In addition, the multiple drawing heads 41 (see FIG. 4) described above are arranged along the head movement path. The head movement path is a path fixed to the second gantry unit 73 of the frame 7, and is determined, for example, with a guide rail provided on the second gantry unit 73 as a reference. Note that the head movement path may be determined with another configuration as a reference.

[0047] When the head unit 43 is located at the first drawing position, the multiple drawing heads 41 (see FIG. 4) draw a pattern on the upper surface 91 of the substrate 9 on the first stage 21a. When the head unit 43 is located at the second drawing position, the multiple drawing heads 41 draw a pattern on the upper surface 91 of the substrate 9 on the second stage 21b. In the following description, the first drawing position and the second drawing position are also referred to as the "first head position" and the "second head position", respectively.

[0048] When a pattern is drawn at the first drawing position, modulated (i.e., spatially modulated) light is irradiated from the multiple drawing heads 41 of the drawing unit 4 toward the substrate 9 on the first stage 21a below. In parallel with the light irradiation, the substrate 9 is moved horizontally in the Y direction (i.e., the substrate moving direction) by the first moving mechanism 22a. As a result, the irradiation area of ​​the light from the multiple drawing heads 41 is scanned in the Y direction on the substrate 9, and a pattern (e.g., a circuit pattern) is drawn on the substrate 9. The first moving mechanism 22a is a scanning mechanism that moves the irradiation area of ​​the light from each drawing head 41 in the Y direction on the substrate 9.

[0049] In the example shown in FIG. 1, drawing on the substrate 9 is performed by a so-called single-pass method. Specifically, the first moving mechanism 22a moves the first stage 21a relative to the multiple drawing heads 41 in the Y direction, and the irradiation area of ​​the light from the multiple drawing heads 41 is scanned only once in the Y direction on the upper surface 91 of the substrate 9. This completes drawing on the substrate 9. Note that in the drawing device 1, drawing on the substrate 9 may be performed by a multi-pass method in which the movement of the first stage 21a in the Y direction and the step movement of the head unit 43 in the X direction are repeated. Drawing of a pattern at the second drawing position is similar to the drawing of a pattern at the first drawing position described above, except that the first stage 21a and the first moving mechanism 22a are changed to the second stage 21b and the second moving mechanism 22b.

[0050] The gas delivery unit 5 includes a gas flow path 51 and a flow path support unit 52. The gas flow path 51 is disposed close to the head unit 43 on the (-Y) side of the head unit 43. The gas flow path 51 is a substantially rectangular parallelepiped member extending substantially parallel to the X direction along the head movement path from the first drawing position to the second drawing position. In detail, the gas flow path 51 extends substantially parallel to the X direction along the head movement path from a position facing the first drawing position in the Y direction to a position facing the second drawing position in the Y direction. The length of the gas flow path 51 in the X direction is longer than the length of the head unit 43 in the X direction. A space is provided inside the gas flow path 51 over substantially the entire length of the gas flow path 51 in the longitudinal direction (i.e., the X direction), and the space serves as a flow path through which gas flows.

[0051] The flow path support parts 52 are tubular members extending upward from both ends of the gas flow path 51 in the X direction. Although not shown in FIG. 1, the flow path support parts 52 are fixed to the frame 7 and support the gas flow path 51 by suspending it from above. The gas flow path 51 is indirectly fixed to the frame 7 via the flow path support parts 52 and does not move. The flow path support parts 52 also connect the gas flow path 51 to a gas supply source 59 (see FIG. 6) described later and serve as a supply flow path that supplies gas from the gas supply source 59 to the gas flow path 51. Note that the method of supporting the gas flow path 51 by the flow path support parts 52 may be changed in various ways. For example, the flow path support parts 52 may support the gas flow path 51 from below.

[0052] FIG. 6 is a diagram showing a schematic diagram of the gas delivery unit 5 and a configuration related to the gas delivery unit 5. In the drawing apparatus 1, the flow path support unit 52 of the gas delivery unit 5 is connected to a gas supply source 59 via a pipe 58. The gas supply source 59 is usually provided outside the drawing apparatus 1. The gas supplied from the gas supply source 59 to the gas delivery unit 5 is, for example, compressed air. As the gas, various gases other than compressed air may be used. A temperature adjustment unit 57 is provided in the middle of the pipe 58, which adjusts the temperature of the gas supplied from the gas supply source 59 to the gas delivery unit 5 between the gas supply source 59 and the gas delivery unit 5. As the temperature adjustment unit 57, for example, a known temperature adjustment device of a Peltier type or a heat pump type can be used.

[0053] The temperature-adjusted gas (so-called temperature-adjusted gas) supplied from the gas supply source 59 to the gas delivery section 5 is delivered in the (+Y) direction from a gas delivery outlet 56 provided on the (+Y) side of the gas flow path 51 toward a gas inlet 441 provided in the head cover 44 of the head unit 43. The temperature-adjusted gas delivered from the gas delivery outlet 56 is supplied into the head cover 44 via the gas inlet 441.

[0054] A temperature sensor 55 for measuring the temperature of the drawing head 41 is provided inside the head cover 44. In the example shown in Fig. 6, the temperature sensor 55 is disposed on the (+Y) side of the projection optical system 413 of the drawing head 41. Configurations other than the projection optical system 413 of the drawing head 41 are not shown in Fig. 6. The temperature sensor 55 measures the temperature of the projection optical system 413 of the drawing head 41, where temperature changes have a relatively large effect on drawing quality.

[0055] The temperature of the drawing head 41 measured by the temperature sensor 55 (hereinafter also referred to as the "measured temperature") is sent to the control unit 10 (see FIG. 3). The temperature control unit 116 of the control unit 10 controls the temperature adjustment unit 57 based on the measured temperature of the drawing head 41 output from the temperature sensor 55, thereby causing the temperature adjustment unit 57 to adjust the temperature of the gas supplied to the gas delivery unit 5. As a result, the temperature of the gas supplied from the gas delivery unit 5 to the inside of the head cover 44 is adjusted, and the temperature of the drawing head 41 (the temperature of the projection optical system 413 in the example shown in FIG. 6) is maintained at approximately the same temperature as a predetermined target temperature.

[0056] The temperature sensor 55 may measure the temperature of one representative drawing head 41 among the six drawing heads 41, for example, or may measure the temperatures of two or more drawing heads 41. When the temperatures of two or more drawing heads 41 are measured, for example, the arithmetic average of the temperatures of the two or more drawing heads 41 measured by the temperature sensor 55 is sent to the control unit 10 as the measured temperature. For example, an infrared non-contact temperature sensor is used as the temperature sensor 55. Note that various contact or non-contact temperature sensors may be used as the temperature sensor 55. In addition, the temperature sensor 55 may be disposed outside the head cover 44 as long as it can accurately measure the temperature of the drawing head 41.

[0057] 7 is a side view of the head unit 43 and the gas delivery unit 5 as viewed from the (-X) side. In FIG. 7, similar to FIG. 5, the head cover 44 is shown in cross section, and the internal configuration of the head cover 44 is depicted by solid lines. In the example shown in FIG. 7, the gas flow path 51 is disposed in the groove portion 442 of the head cover 44, and is adjacent to the (+Y) side surface of the groove portion 442. The gas flow path 51 is spaced apart from the head cover 44 on the (-Y) side with a small gap between it and the head cover 44. The gas flow path 51 is disposed at a position facing the gas inlet 441 of the head cover 44 in the Y direction in the Z direction.

[0058] FIG. 8 is a rear view of the (+Y) side surface of gas flow path 51 (i.e., the portion facing head cover 44 of head unit 43) as viewed from the (+Y) side. In FIG. 8, head cover 44 and gas inlet 441 of head unit 43 located at the second drawing position are also drawn with dashed lines. FIG. 9 is a cross-sectional view of gas flow path 51 and head unit 43 cut at the position where gas inlet 441 in the Z direction is provided. In FIG. 9, only a portion of head unit 43 on the (-Y) side is drawn.

[0059] An opening 53 is provided on the (+Y) side surface of the gas flow passage 51 over substantially the entire length in the X direction. The opening 53 penetrates the (+Y) side surface of the gas flow passage 51 and communicates with the internal space of the gas flow passage 51. In the example shown in FIG. 8, the opening 53 is a collection of a plurality of small, substantially circular delivery holes 531 (i.e., through holes). In the example shown in FIG. 8, the delivery holes 531 are dispersed and arranged in a matrix in the X direction and the Z direction. The delivery holes 531 are, for example, substantially uniformly distributed in the X direction and the Z direction. In this embodiment, the side wall on the (+Y) side of the gas flow passage 51 is formed of a punching plate (for example, punching metal) in which the delivery holes 531 are provided.

[0060] In the example shown in Fig. 8, opening 53 is a generally rectangular region with each side generally parallel to the X direction or the Z direction, and is a region circumscribing delivery holes 531 located on the respective outer edges on the (+X) side, (-X) side, (+Z) side, and (-Z) side among a plurality of delivery holes 531 included in said region. In Fig. 8, opening 53 is surrounded by a two-dot chain line.

[0061] As shown in FIG. 8, when the head unit 43 is located at the second drawing position, approximately half of the (+X) side of the opening 53 faces the head unit 43. When the head unit 43 is located at the first drawing position, approximately half of the (-X) side of the opening 53 faces the head unit 43. In the following description, the area of ​​the opening 53 that faces the head cover 44 of the head unit 43 located at the first drawing position (i.e., approximately half of the area on the (-X) side of the opening 53) is also referred to as a "first area 532." In addition, the area of ​​the opening 53 that faces the head cover 44 of the head unit 43 located at the second drawing position (i.e., approximately half of the area on the (+X) side of the opening 53) is also referred to as a "second area 533." In FIG. 8, the first area 532 and the second area 533 are each surrounded by a two-dot chain line.

[0062] 8, the first region 532 is a generally rectangular region with each side generally parallel to the X direction or the Z direction, and is a region circumscribing the output holes 531 located on the outer edge portions of the (+X) side, the (-X) side, the (+Z) side, and the (-Z) side among the multiple output holes 531 included in the region. The same applies to the second region 533. The same applies to output regions 534 and 535 described later.

[0063] In the gas delivery section 5, the first region 532 and the second region 533 of the opening 53 are opened and closed independently by the opening / closing section 541 of the delivery position switching section 54. In the example shown in Figs. 8 and 9, the opening / closing section 541 includes two plate-like members 542 and 543 arranged side by side in the X direction in the internal space of the gas flow passage 51. The plate-like members 542 and 543 are substantially rectangular flat plate members substantially perpendicular to the Y direction, and are arranged close to the inner surface of the side wall on the (+Y) side of the gas flow passage 51. The plate-like member 542 overlaps with the entire first region 532 of the opening 53 in the Y direction. The plate-like member 543 overlaps with the entire second region 533 of the opening 53 in the Y direction.

[0064] The opening / closing section 541 further includes a member moving mechanism 544 that moves the plate-shaped member 542 in the Y direction, and a member moving mechanism 545 that moves the plate-shaped member 543 in the Y direction. The driving source of the member moving mechanisms 544, 545 is, for example, a linear servo motor, or a motor attached to a ball screw.

[0065] When the plate-shaped member 542 is moved in the (+Y) direction by the member moving mechanism 544 and comes into contact with the sidewall on the (+Y) side of the gas flow path 51, the first region 532 of the opening 53 is closed. On the other hand, when the plate-shaped member 542 is moved in the (-Y) direction by the member moving mechanism 544 and moves away from the sidewall on the (+Y) side of the gas flow path 51, the first region 532 of the opening 53 is opened. Also, when the plate-shaped member 543 is moved in the (+Y) direction by the member moving mechanism 545 and comes into contact with the sidewall on the (+Y) side of the gas flow path 51, the second region 533 of the opening 53 is closed. On the other hand, when the plate-shaped member 543 is moved in the (-Y) direction by the member moving mechanism 545 and moves away from the sidewall on the (+Y) side of the gas flow path 51, the second region 533 of the opening 53 is opened.

[0066] In the gas delivery section 5, when the head unit 43 is located at the second drawing position, as shown in FIG. 9, the delivery position switching section 54 is controlled by the airflow control section 115 (see FIG. 3) of the control section 10, so that the second region 533 of the opening 53 is opened and the first region 532 is closed. Specifically, the member moving mechanisms 544, 545 are controlled by the airflow control section 115, so that the plate-shaped member 542 abuts against the side wall on the (+Y) side of the gas flow path 51 to cover all of the delivery holes 531 arranged in the first region 532, and the plate-shaped member 543 moves away from the side wall on the (+Y) side of the gas flow path 51 in the (-Y) direction. As a result, gas is delivered from the second region 533 of the opening 53 toward the head unit 43, and gas is not delivered from the first region 532. That is, the second region 533 of the opening 53 becomes the gas delivery port 56 that delivers gas toward the head unit 43. In the following description, the position of the gas delivery port 56 at this time is also referred to as the "second delivery position."

[0067] On the other hand, when the head unit 43 is located at the first drawing position, the blowing position switching unit 54 is controlled by the blowing control unit 115 of the control unit 10, so that the first region 532 of the opening 53 is opened and the second region 533 is closed. Specifically, the member moving mechanisms 544, 545 are controlled by the blowing control unit 115, so that the plate-shaped member 542 moves away from the side wall on the (+Y) side of the gas flow path 51 in the (-Y) direction, and the plate-shaped member 543 abuts against the side wall on the (+Y) side of the gas flow path 51 to cover all of the multiple blowing holes 531 arranged in the second region 533. As a result, gas is blown from the first region 532 of the opening 53 toward the head unit 43, and gas is not blown from the second region 533. That is, the first region 532 of the opening 53 becomes the gas blowing port 56 that blows gas toward the head unit 43. In the following description, the position of the gas delivery port 56 at this time is also referred to as the “first delivery position.” The first delivery position is located at approximately the same position as the second delivery position in the Y and Z directions, and is located on the (−X) side of the second delivery position.

[0068] In the gas delivery section 5, the position of the gas delivery port 56 is switched by the delivery position switching section 54 between a first delivery position facing in the Y direction the head unit 43 located at the first drawing position, and a second delivery position facing in the Y direction the head unit 43 located at the second drawing position. This allows temperature-adjusted gas to be supplied from the gas delivery port 56 to the inside of the head cover 44, regardless of whether the head unit 43 is located at the first drawing position or the second drawing position. Note that, in the side wall on the (+Y) side of the gas flow path 51, the opening 53 is provided over substantially the entire length in the X direction of the region from the first delivery position to the second delivery position.

[0069] Fig. 10 is a rear view of the (+Y) side surface of gas flow path 51 as viewed from the (+Y) side, similar to Fig. 8. In Fig. 10, a part of the projection optical system 413 of the multiple drawing heads 41 located on the (+Y) side of gas flow path 51 is also drawn by a thin solid line. Fig. 10 shows a state in which the head unit 43 is located at the first drawing position, and the first region 532 of the opening 53 is the gas delivery port 56 (i.e., a state in which the gas delivery port 56 is located at the first delivery position).

[0070] In the example shown in FIG. 10, the plurality of sending holes 531 arranged in the first region 532 are divided into seven groups arranged in the X direction. The plurality of sending holes 531 included in each group are arranged in a matrix shape approximately evenly in the X direction and the Z direction. In FIG. 10, the region in which the plurality of sending holes 531 included in each group are arranged (hereinafter also referred to as a "sending region") is surrounded by a two-dot chain line. The first region 532 includes six sending regions 534 of approximately the same size and one sending region 535 whose width in the X direction is smaller than that of the sending regions 534. The sending region 535 is arranged on the (-X) side of the six sending regions 534. Each of the sending regions 534 and the sending region 535 is an approximately rectangular region. The number of sending holes 531 included in each of the sending regions 534 and 535 may be changed in various ways.

[0071] The six sending regions 534 are spaced apart from one another in the X direction. In other words, in two sending regions 534 adjacent to each other in the X direction, the shortest distance in the X direction between one sending hole 531 in one sending region 534 and one sending hole 531 in the other sending region 534 is greater than the distance in the X direction between two sending holes 531 adjacent to each other in the X direction in each sending region 534. In addition, the sending region 535 is also spaced apart in the X direction from the sending region 534 furthest on the (-X) side among the six sending regions 534.

[0072] The six delivery regions 534 face the projection optical systems 413 of the six drawing heads 41 in the Y direction via the gas inlets 441 (see FIG. 7) of the head cover 44. In detail, the center in the X direction of each delivery region 534 is located at approximately the same position in the X direction as the center in the X direction of the facing drawing head 41. This prevents the gas supplied from the gas delivery ports 56 of the gas flow path 51 to the inside of the head cover 44 from being unevenly supplied to any one of the drawing heads 41, and allows the temperature of the six drawing heads 41 to be regulated efficiently and approximately uniformly.

[0073] 10, the sending region 535 does not face any of the drawing heads 41. For example, when the above-mentioned multi-pass drawing method in which the head unit 43 moves stepwise in the X direction is performed, the sending region 535 covers the movement range in the (-X) direction of the drawing head 41 on the (-X) side among the six drawing heads 41. Specifically, when the drawing head 41 on the (-X) side is located on the (-X) side at the first drawing position, gas is supplied to the drawing head 41 from the sending region 534 and the sending region 535 on the (-X) side.

[0074] In the second region 533, the arrangement of the multiple delivery holes 531, the arrangement of the delivery regions 534, 535, and the positional relationship between the delivery regions 534, 535 and the multiple drawing heads 41 when the head unit 43 is located at the second drawing position are approximately the same as those in the above-mentioned first region 532. For example, when the head unit 43 is located at the second drawing position, the six delivery regions 534 of the second region 533 face the projection optical systems 413 of the six drawing heads 41 in the Y direction, respectively, via the gas inlet 441 of the head cover 44.

[0075] FIG. 11 is a front view of the head unit 43 as viewed from the (-Y) side. As described above, the gas inlet 441 faces the six drawing heads 41 in the Y direction. In a region facing the gas inlet 441 in the head cover 44, partition walls 443 are provided between each two drawing heads 41 adjacent to each other in the X direction. In the example shown in FIG. 11, seven partition walls 443 are disposed between each of the six projection optical systems 413 and on the (+X) side and (-X) side of the six projection optical systems 413. The seven partition walls 443 have approximately the same shape and size. The partition wall 443 is a flat plate-like member that is approximately perpendicular to the X direction. The partition wall 443 preferably extends from the (+Y) side of the projection optical system 413 to the (-Y) side of the projection optical system 413. The length of the partition 443 in the Z direction is longer than the length of the gas inlet 441 in the Z direction, and crosses the gas inlet 441 over the entire length in the Z direction in plan view. In this manner, the partition 443 is provided in the area facing the gas inlet 441 in the head cover 44 to separate two adjacent drawing heads 41, thereby preventing the gas from the gas delivery unit 5 from being unevenly supplied to any one of the drawing heads 41, and the temperature of the six drawing heads 41 can be adjusted efficiently and approximately uniformly.

[0076] Next, a flow of drawing a pattern on the substrate 9 in the drawing apparatus 1 shown in FIG. 1 will be described. When drawing a pattern in the drawing apparatus 1, the substrate 9 is first carried onto the first stage 21a, and alignment processing and the like of the substrate 9 are performed using the imaging head 31 and the like located at the first imaging position. Next, the pattern is drawn on the substrate 9 on the first stage 21a by the head unit 43 located at the first imaging position. At this time, in the gas delivery unit 5, the position of the gas delivery port 56 is set to the first delivery position by the delivery position switching unit 54 (see FIG. 9), and temperature-adjusted gas is supplied from the gas delivery unit 5 to the inside of the head cover 44 of the head unit 43 located at the first drawing position. This allows the temperature of the multiple drawing heads 41 (see FIG. 4) to be maintained at approximately the same temperature as a predetermined target temperature. In parallel with drawing on the substrate 9 on the first stage 21a, the substrate 9 is carried onto the second stage 21b, and alignment processing and the like of the substrate 9 are performed using the imaging head 31 and the like moved to the second imaging position.

[0077] When drawing of a pattern on the substrate 9 on the first stage 21a is completed, the head unit 43 is moved from the first drawing position to the second drawing position, and drawing of a pattern on the substrate 9 on the second stage 21b is started. At this time, in the gas delivery unit 5, the position of the gas delivery port 56 is switched from the first delivery position to the second delivery position by the delivery position switching unit 54, and temperature-adjusted gas is supplied from the gas delivery unit 5 to the inside of the head cover 44 of the head unit 43 located at the second drawing position. This maintains the temperature of the multiple drawing heads 41 at approximately the same temperature as a predetermined target temperature. As described above, since the gas delivery unit 5 is fixed to the frame 7, the gas delivery unit 5 is not moved even when the head unit 43 is moved.

[0078] In the imaging apparatus 1, in parallel with imaging on the substrate 9 on the second stage 21b, the substrate 9 on which imaging has been performed on the first stage 21a is carried out from the imaging apparatus 1, and a new substrate 9 is carried in onto the first stage 21a, where alignment processing and the like are performed. In this manner, in the imaging apparatus 1, imaging is alternately performed on the substrates 9 on the first stage 21a and the second stage 21b, thereby improving throughput. Furthermore, regardless of whether the head unit 43 is located at the first imaging position or the second imaging position, a temperature-adjusted gas is supplied from the gas delivery unit 5, and the temperature of the imaging head 41 is adjusted.

[0079] The gas delivery unit 5 may be applied to a drawing apparatus other than the twin-stage type drawing apparatus 1. For example, in a drawing apparatus having only one stage for holding the substrate 9, when drawing is performed by a multi-pass method, the gas delivery unit 5 may supply a temperature-adjusted gas to the head unit 43 that moves stepwise in the sub-scanning direction. In this case, when the head unit 43 is located at a first head position, which is one position in the sub-scanning direction, the position of the gas delivery port 56 in the gas delivery unit 5 is set to the first delivery position, and when the head unit 43 is located at a second head position, which is another position in the sub-scanning direction, the position of the gas delivery port 56 is set to the second delivery position. This makes it possible to supply a temperature-adjusted gas to the inside of the head cover 44 regardless of whether the head unit 43 is located at the first head position or the second head position.

[0080] As described above, the drawing device 1 that draws on the substrate 9 includes a substrate holding unit (for example, the first stage 21a), a substrate moving mechanism (for example, the first moving mechanism 22a), a head unit 43, a drawing head moving mechanism 42, and a gas delivery unit 5. The substrate holding unit holds the substrate 9 in a horizontal state. The substrate moving mechanism moves the substrate holding unit horizontally along a substrate moving path. The head unit 43 includes a drawing head 41 and a head cover 44. The drawing head 41 is disposed above the substrate holding unit and irradiates light onto the substrate 9 to draw a pattern. The head cover 44 accommodates the drawing head 41 therein. The drawing head moving mechanism 42 moves the head unit 43 horizontally between a first head position and a second head position (between the first drawing position and the second drawing position in the above example) along a head moving path that intersects with the substrate moving path in a plan view. The gas delivery unit 5 is disposed along the head moving path. The gas delivery section 5 is capable of supplying temperature-adjusted gas to the inside of the head cover 44 whether the head unit 43 is located at the first head position or the second head position.

[0081] The gas delivery unit 5 includes a gas flow path 51 through which gas flows, a gas delivery port 56, and a delivery position switching unit 54. The gas flow path 51 extends along the head movement path from the first head position to the second head position. The gas delivery port 56 is provided at a portion of the gas flow path 51 facing the head unit 43, and delivers gas toward the gas inlet 441 of the head cover 44. The delivery position switching unit 54 switches the position of the gas delivery port 56 between a first delivery position facing the head unit 43 located at the first head position and a second delivery position facing the head unit 43 located at the second head position.

[0082] In this way, in the drawing device 1, in the gas flow passage 51 provided from the first head position to the second head position, the position of the gas outlet 56 is switched between the first and second outlet positions, so that temperature-adjusted gas can be supplied to the head unit 43 located at either the first head position or the second head position without moving the gas flow passage 51 in association with the movement of the head unit 43. Therefore, compared to the case where the gas flow passage 51 also moves in association with the movement of the head unit 43, adverse effects (e.g., a decrease in the flow rate of gas delivered from the gas outlet 56 and non-uniformity in the flow rate distribution, etc.) caused by changes in the shape of the piping that supplies gas to the gas flow passage 51 can be prevented. As a result, the temperature of the drawing head 41 moving along the head movement path can be appropriately adjusted.

[0083] As described above, the gas flow passage 51 is preferably provided with an opening 53 extending from the first delivery position to the second delivery position. The delivery position switching unit 54 is preferably provided with an opening / closing unit 541 for opening and closing a first region 532 of the opening 53 facing the head unit 43 located at the first head position and a second region 533 facing the head unit 43 located at the second head position. In the drawing device 1, the opening / closing unit 541 opens the first region 532 of the opening 53 and closes the second region 533, thereby setting the position of the gas delivery port 56 to the first delivery position. The opening / closing unit 541 closes the first region 532 of the opening 53 and opens the second region 533, thereby setting the position of the gas delivery port 56 to the second delivery position. This structure allows the position of the gas delivery port 56 in the gas delivery unit 5 to be easily switched between the first delivery position and the second delivery position.

[0084] As described above, it is preferable that the gas delivery port 56 has a plurality of delivery holes 531 distributed in the portion of the gas flow path 51 facing the head unit 43. This can improve the uniformity of the flow rate of the gas delivered from the gas delivery port 56.

[0085] The drawing device 1 preferably further includes a temperature sensor 55 for measuring the temperature of the drawing head 41, and a temperature adjustment unit 57 for adjusting the temperature of the gas supplied to the gas delivery unit 5 based on the output from the temperature sensor 55. This makes it possible to precisely adjust the temperature of the gas supplied from the gas delivery unit 5 into the head cover 44. As a result, the temperature of the drawing head 41 can be suitably maintained at approximately the same temperature as the target temperature.

[0086] As described above, it is preferable that the head unit 43 further includes another drawing head 41 that irradiates light onto the substrate 9 to draw a pattern. The other drawing head 41 is adjacent to the drawing head 41 described above inside the head cover 44, and is arranged along the head movement path together with the drawing head 41 (along the X direction in the above example). In this way, by the head unit 43 including a plurality of drawing heads 41, the throughput of the drawing device 1 can be improved.

[0087] In the gas delivery unit 5, the gas delivery port 56 preferably includes a delivery area 534 facing the above-mentioned drawing head 41, and another delivery area 534 spaced apart from the delivery area 534 and facing the above-mentioned other drawing head 41. This makes it possible to prevent the gas supplied from the gas delivery unit 5 into the head cover 44 from being unevenly supplied to any one of the multiple drawing heads 41. As a result, the temperature of the multiple drawing heads 41 can be adjusted efficiently and approximately uniformly.

[0088] Furthermore, in the head unit 43, a partition wall 443 is preferably provided in a region facing the gas inlet 441 in the head cover 44 to separate the above-mentioned drawing head 41 from the other drawing head 41. This makes it possible to prevent the gas supplied from the gas delivery unit 5 into the head cover 44 from being unevenly supplied to any one of the multiple drawing heads 41. As a result, the temperature of the multiple drawing heads 41 can be adjusted efficiently and approximately uniformly.

[0089] As described above, it is preferable that the drawing apparatus 1 further includes another substrate holding unit (in the above example, the second stage 21b) and another substrate moving mechanism (in the above example, the second moving mechanism 22b). The other substrate holding unit is disposed adjacent to the above-mentioned substrate holding unit (in the above example, the first stage 21a) and holds the substrate 9 in a horizontal state. The other substrate moving mechanism is disposed alongside the above-mentioned substrate moving mechanism (in the above example, the first moving mechanism 22a) in a direction intersecting the substrate moving path (in the above example, the first substrate moving path). The other substrate moving mechanism moves the other substrate holding unit horizontally along another substrate moving path (in the above example, the second substrate moving path) parallel to the substrate moving path. The above-mentioned first head position is a first drawing position above the substrate holding unit (the first stage 21a) where light is irradiated onto the substrate 9 on the substrate holding unit. Moreover, the second head position is a second drawing position above the other substrate holding part (second stage 21b) where light is irradiated onto the substrate 9 on the other substrate holding part.

[0090] As described above, the imaging device 1 can suitably adjust the temperature of the imaging head 41 moving along the head movement path. Therefore, the structure of the imaging device 1 is particularly suitable for a twin-stage type imaging device 1 including a head unit 43 that moves a relatively large distance between a first imaging position on the first stage 21a and a second imaging position on the second stage 21b.

[0091] In the drawing apparatus 1, the shape of the gas delivery port 56 in the gas delivery unit 5 may be changed in various ways. FIG. 12 is a rear view showing another preferred gas flow path 51a, and corresponds to FIG. 10 described above. In the gas flow path 51a, the multiple delivery holes 531 are distributed and arranged at positions facing the projection optical systems 413 of the multiple drawing heads 41 in the Y direction, but are not arranged at positions facing the center in the X direction (i.e., the width direction center) of each projection optical system 413 in the Y direction. In other words, in the gas delivery unit 5a, the gas delivery ports 56a of the gas flow path 51a face the projection optical system 413 of the drawing head 41, and are arranged on both sides in the width direction of the position (i.e., the (+X) side and the (-X) side) of the projection optical system 413, avoiding the position facing the width direction center of the projection optical system 413. This prevents the flow of gas delivered from the gas delivery port 56a toward the inside of the head cover 44 from colliding with the center of the projection optical system 413 in the width direction and becoming turbulent, and allows the gas to pass through the (+X) side and (-X) side of the projection optical system 413 and make an appropriate turn around to the (+Y) side of the projection optical system 413. As a result, the temperature of the entire projection optical system 413 can be appropriately adjusted.

[0092] In the drawing apparatus 1, the structure of the delivery position switching unit 54 in the gas delivery unit 5 may be modified in various ways. FIG. 13 is a rear view showing another preferred gas flow path 51b, and corresponds to FIG. 8 described above. FIG. 14 is a cross-sectional view showing the gas flow path 51b, and corresponds to FIG. 9 described above. In the example shown in FIG. 13 and FIG. 14, a substantially rectangular opening 548 extending in the X direction is provided on the side wall on the (+Y) side of the gas flow path 51b. The opening 548 faces the gas inlet 441 of the head unit 43 in the Y direction. The opening 548 extends from a position facing the head unit 43 located at the first drawing position in the Y direction to a position facing the head unit 43 located at the second drawing position in the Y direction. FIG. 14 depicts the head unit 43 in a state where it is located at the first drawing position.

[0093] In the internal space of the gas flow passage 51b, a substantially flat movable member 546 having a plurality of delivery holes 531 corresponding to the above-mentioned first region 532 (see FIG. 8) is disposed substantially perpendicular to the Y direction. The movable member 546 abuts against the inner surface of the side wall on the (+Y) side of the gas flow passage 51b. The movable member 546 extends to the (+X) side and (-X) side beyond a region 549 in which the plurality of delivery holes 531 are provided, and covers the entire opening 548 from the (-Y) side. No delivery holes 531 are provided in the regions on the (+X) side and (-X) side beyond the region 549 of the movable member 546, and gas does not pass through these regions.

[0094] The movable member 546 is moved in the X direction by a member moving mechanism 547 of the delivery position switching unit 54b. The driving source of the member moving mechanism 547 is, for example, a linear servo motor or a motor attached to a ball screw. As shown in FIG. 13 and FIG. 14, the region 549 in the movable member 546 where the plurality of delivery holes 531 are provided is disposed at a position facing the head unit 43 located at the first drawing position in the Y direction, so that the gas delivery port 56b is located at the first delivery position. In addition, the movable member 546 is moved in the (+X) direction, and the region 549 in which the plurality of delivery holes 531 are provided is disposed at a position facing the head unit 43 located at the second drawing position in the Y direction, so that the gas delivery port 56b is located at the second delivery position.

[0095] In this manner, in the gas flow path 51b, the gas delivery port 56b is provided in a portion of the gas flow path 51b facing the head unit 43 (i.e., the side wall on the (+Y) side) so as to be movable along the head movement path. The gas delivery port 56b is moved between the first and second delivery positions by the delivery position switching unit 54b in synchronization with the movement of the head unit 43 between the first and second head positions. In this manner, by moving one gas delivery port 56b in the X direction without moving the gas flow path 51b, the position of the gas delivery port 56b in the gas delivery unit 54b can be easily switched between the first and second delivery positions in a manner substantially similar to that described above.

[0096] The above-described drawing device 1 can be modified in various ways.

[0097] For example, the arrangement of the plurality of delivery holes 531 in the gas delivery unit 5 is not limited to that shown in Fig. 8 and Fig. 12, and may be changed in various ways. For example, the plurality of delivery holes 531 do not need to be arranged in a plurality of delivery regions 534 corresponding to the plurality of drawing heads 41, but may be approximately uniformly distributed in the region facing the plurality of drawing heads 41. The same applies to the gas delivery units 5a and 5b.

[0098] Moreover, the shape of the delivery hole 531 provided in the gas delivery unit 5 as viewed from the Y direction is not necessarily limited to a circle, and may be another shape (for example, an ellipse or a rectangle). Moreover, in the gas delivery unit 5, the gas delivery port 56 does not necessarily need to be a collection of a plurality of delivery holes 531, and may be, for example, a plurality of slits each extending in the X direction or the Z direction, or may be one large rectangular opening. The same applies to the gas delivery units 5a and 5b.

[0099] The structure for switching the position of the gas delivery ports 56, 56b is not limited to the structure of the delivery position switching units 54, 54b described above, and may be modified in various ways.

[0100] In the head unit 43, the above-mentioned partition wall 443 may be omitted.

[0101] In the head unit 43, the temperature of the drawing head 41 measured by the temperature sensor 55 is not necessarily limited to the temperature of the projection optical system 413, and may be the temperature of a component other than the projection optical system 413. Also, the temperature sensor 55 may be omitted. In this case, the temperature of the gas supplied from the gas supply source 59 to the gas flow passage 51 is maintained at a predetermined temperature that is lower than the above-mentioned target temperature, for example.

[0102] The above-mentioned substrate 9 is not necessarily limited to a printed circuit board. The imaging device 1 may detect the positions of, for example, a semiconductor substrate, a glass substrate for a flat panel display device such as a liquid crystal display device or an organic EL display device, a glass substrate for a photomask, a substrate for a solar cell panel, and the like.

[0103] The configurations in the above-described embodiment and each of the modified examples may be combined as appropriate as long as they are not mutually inconsistent. [Explanation of symbols]

[0104] 1 Drawing device 5, 5a, 5b Gas delivery section 9 Substrate 21a 1st Stage 21b 2nd Stage 22a 1st movement mechanism 22b Second movement mechanism 41 Drawing head 42 Drawing head movement mechanism 43 Head Unit 44 Head Cover 51, 51a, 51b Gas flow path 53 Opening 54, 54b Sending position switching unit 55 Temperature Sensor 56, 56a, 56b Gas outlet 57 Temperature control section 91 (Platform) Top 413 Projection optical system 441 Gas inlet 443 Bulkhead 531 Outlet hole 534,535 Sending area 541 Opening and closing part

Claims

1. A drawing apparatus for drawing on a substrate, comprising: a substrate holder that holds the substrate in a horizontal position; a substrate moving mechanism that horizontally moves the substrate holder along a substrate moving path; a head unit including a drawing head disposed above the substrate holding part and configured to draw a pattern on the substrate by irradiating the substrate with light, and a head cover configured to house the drawing head therein; a drawing head moving mechanism that horizontally moves the head unit between a first head position and a second head position along a head movement path that intersects with the substrate movement path in a plan view; a gas delivery unit that is disposed along the head movement path and is capable of supplying a temperature-adjusted gas to an inside of the head cover regardless of whether the head unit is located at the first head position or the second head position; Equipped with The gas delivery unit includes: a gas flow path extending along the head movement path from the first head position to the second head position and through which the gas flows; a gas delivery port provided in a portion of the gas flow path facing the head unit and configured to deliver the gas toward a gas inlet of the head cover; a delivery position switching unit that switches a position of the gas delivery port between a first delivery position facing the head unit located at the first head position and a second delivery position facing the head unit located at the second head position; A drawing device comprising:

2. The drawing device according to claim 1 , an opening is provided in the gas flow path extending from the first delivery position to the second delivery position; the sending position switching unit includes an opening / closing unit that opens and closes a first region of the opening that faces the head unit located at the first head position and a second region of the opening that faces the head unit located at the second head position, the opening / closing portion opens the first region and closes the second region of the opening, thereby setting the position of the gas delivery port to the first delivery position; a gas supply port being positioned at the second supply position by closing the first region of the opening and opening the second region of the opening with the opening / closing portion.

3. The drawing device according to claim 1 , The gas delivery port is provided movably along the head movement path at a portion of the gas flow path facing the head unit, and is moved between the first delivery position and the second delivery position by the delivery position switching unit in synchronization with the movement of the head unit between the first head position and the second head position.

4. 4. The drawing device according to claim 1, The imaging apparatus, wherein the gas delivery port includes a plurality of delivery holes distributed in a portion of the gas flow path facing the head unit.

5. 5. The drawing device according to claim 1, The gas supply ports are disposed opposite a projection optical system of the drawing head, and on both sides in the width direction of the position avoiding a position opposite a center of the projection optical system in the width direction.

6. 6. The drawing device according to claim 1, a temperature sensor for measuring a temperature of the drawing head; a temperature adjusting unit that adjusts a temperature of the gas supplied to the gas delivery unit based on an output from the temperature sensor; The drawing device further comprises:

7. 7. The drawing device according to claim 1, the head unit further includes another drawing head that is adjacent to the drawing head in the head cover and arranged along the head movement path together with the drawing head, and that irradiates light onto the substrate to draw a pattern, The gas outlet is a sending area facing the drawing head; another emission region spaced apart from the emission region and facing the other drawing head; A drawing device comprising:

8. 8. The drawing device according to claim 1, the head unit further includes another drawing head that is adjacent to the drawing head in the head cover and arranged along the head movement path together with the drawing head, and that irradiates light onto an upper main surface of the substrate to draw a pattern; a partition wall for separating the drawing head from the other drawing head is provided in a region facing the gas inlet in the head cover.

9. 9. The drawing device according to claim 1, Another substrate holder arranged adjacent to the substrate holder and holding the substrate in a horizontal position; another substrate moving mechanism that is arranged alongside the substrate moving mechanism in a direction intersecting the substrate moving path and that horizontally moves the other substrate holder along another substrate moving path that is parallel to the substrate moving path; Further equipped with the first head position is a first drawing position above the substrate holding part where light is irradiated onto the substrate on the substrate holding part, The imaging device, wherein the second head position is a second imaging position above the other substrate holding part and where light is irradiated onto the substrate on the other substrate holding part.

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