Wafer, semiconductor device, wafer manufacturing method, and semiconductor device manufacturing method

Abstract

To provide a wafer, a semiconductor device, a wafer manufacturing method, and a semiconductor device manufacturing method that improve characteristics.SOLUTION: A wafer according to an embodiment includes a substrate and a crystal layer. The substrate includes a plurality of SiC regions containing SiC and an inter-SiC region containing Si and provided between the plurality of SiC regions. The crystal layer includes a first layer containing SiC, and a first intermediate layer containing SiC and provided between the substrate and the first layer in a first direction. The first layer contains nitrogen at first layer concentration. The first intermediate layer concentration of nitrogen in the first intermediate layer is higher than the first concentration.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] FIELD Embodiments of the present invention relate to a wafer, a semiconductor device, a method for manufacturing a wafer, and a method for manufacturing a semiconductor device. [Background technology]

[0002] 2. Description of the Related Art There is a demand for improved characteristics in wafers used in the manufacture of semiconductor devices. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2011-165958 A Summary of the Invention [Problem to be solved by the invention]

[0004] Advantageous Effects of Invention The embodiments of the present invention provide a wafer, a semiconductor device, a method for manufacturing a wafer, and a method for manufacturing a semiconductor device that can improve characteristics. [Means for solving the problem]

[0005] According to an embodiment of the present invention, a wafer includes a substrate and a crystal layer. The substrate includes a plurality of SiC regions including SiC, and an inter-SiC region including Si provided between the plurality of SiC regions. The crystal layer includes a first layer including SiC, and a first intermediate layer including SiC provided between the substrate and the first layer in a first direction. The first layer includes nitrogen at a first layer concentration. The first intermediate layer concentration of nitrogen in the first intermediate layer is a first intermediate layer concentration of nitrogen in the first intermediate layer. layer higher than the concentration. [Brief description of the drawings]

[0006] [Figure 1] 1(a) and 1(b) are schematic cross-sectional views illustrating a wafer according to the first embodiment. [Diagram 2]FIG. 2 is a graph illustrating the characteristics of the wafer. [Diagram 3] 3(a) and 3(b) are graphs illustrating the characteristics of the wafer. [Figure 4] 4(a) and 4(b) are graphs illustrating the characteristics of the wafer. [Diagram 5] 5(a) and 5(b) are graphs illustrating the characteristics of the wafer. [Figure 6] FIG. 6 is a graph illustrating the characteristics of the wafer. [Figure 7] 7(a) and 7(b) are schematic cross-sectional views illustrating the wafer according to the first embodiment. [Figure 8] 8(a) to 8(c) are schematic cross-sectional views illustrating the wafer manufacturing method according to the second embodiment. [Figure 9] 9(a) to 9(c) are schematic cross-sectional views illustrating the wafer manufacturing method according to the second embodiment. [Figure 10] 10(a) to 10(c) are schematic cross-sectional views illustrating the method for manufacturing a wafer according to the second embodiment. [Figure 11] 11(a) to 11(c) are schematic cross-sectional views illustrating the method for manufacturing a wafer according to the second embodiment. [Figure 12] 12(a) to 12(c) are schematic cross-sectional views illustrating the method for manufacturing a wafer according to the second embodiment. [Figure 13] FIG. 13 is a graph illustrating characteristics related to the manufacturing method of the semiconductor device according to the embodiment. [Figure 14] 14(a) to 14(d) are schematic cross-sectional views illustrating the method for manufacturing the semiconductor device according to the third embodiment. [Figure 15] 15(a) to 15(c) are schematic cross-sectional views illustrating the method for manufacturing the semiconductor device according to the third embodiment. [Figure 16] FIG. 16 is a schematic cross-sectional view illustrating the semiconductor device according to the fourth embodiment. [Figure 17]FIG. 17 is a schematic cross-sectional view illustrating the semiconductor device according to the fourth embodiment. As shown in FIG. [Figure 18] FIG. 18 is a schematic cross-sectional view illustrating the semiconductor device according to the fourth embodiment. [Figure 19] FIG. 19 is a schematic cross-sectional view illustrating a semiconductor device according to the fourth embodiment. [Figure 20] FIG. 20 is a schematic cross-sectional view illustrating the semiconductor device according to the fourth embodiment. [Figure 21] FIG. 21 is a schematic cross-sectional view illustrating the semiconductor device according to the fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the size ratio between parts, etc. are not necessarily the same as those in reality. Even when the same part is shown, the dimensions and ratios of each part may be different depending on the drawing. In this specification and each drawing, elements similar to those described above with reference to the previous drawings are given the same reference numerals and detailed descriptions thereof will be omitted as appropriate.

[0008] (First embodiment) 1(a) and 1(b) are schematic cross-sectional views illustrating a wafer according to the first embodiment. FIG. 1(b) is an enlarged view of a portion of FIG. 1(a). 1(a), a wafer 210 according to the embodiment includes a substrate 10s and a crystal layer 10L. The crystal layer 10L includes a first layer 11 and a first intermediate layer 61. For example, the crystal layer 10L is in contact with the substrate 10s.

[0009] The first intermediate layer 61 is provided between the substrate 10s and the first layer 11 in a first direction. As shown in Fig. 1(a), the first direction from the first intermediate layer 61 toward the first layer 11 is defined as the Z-axis direction. One direction perpendicular to the Z-axis direction is defined as the X-axis direction. A direction perpendicular to the Z-axis direction and the X-axis direction is defined as the Y-axis direction.

[0010] The substrate 10s extends along the XY plane. The first intermediate layer 61 and the first layer 11 are, for example, along the XY plane. For example, the first intermediate layer 61 contacts the substrate 10s.

[0011] As shown in FIG. 1(b), the substrate 10s includes a plurality of SiC regions 10p and an inter-SiC region 10q. The plurality of SiC regions 10p include SiC. The inter-SiC region 10q is provided between the plurality of SiC regions 10p. The inter-SiC region 10q includes Si. For example, the substrate 10s may be a sintered body substrate including Si and Si-C. For example, Si is filled between the plurality of SiC regions 10p. The inter-SiC region 10q may be, for example, in the form of a network. The substrate 10s is, for example, a Si-impregnated SiC sintered substrate. Such a substrate 10s has excellent heat resistance. Such a substrate 10s is easy to process, such as polishing.

[0012] In this example, the multiple SiC regions 10p include multiple first SiC regions 10a and multiple second SiC regions 10b. The size of one of the multiple first SiC regions 10a is larger than the size of one of the multiple second SiC regions 10b. The size of one of the multiple first SiC regions 10a may be, for example, a length along any direction, for example, a diameter. The size of one of the multiple second SiC regions 10b may be, for example, a length along any direction, for example, a diameter. In the distribution of the sizes of the multiple SiC regions 10p, two or more peaks may be substantially provided. As a result, a small-sized SiC region is located between large-sized SiC regions. As a result, the gap between SiC (the length of the inter-SiC region 10q) can be made small. The average size (average diameter) of the multiple first SiC regions 10a is, for example, 1 μm or more and 10 μm or less. The average size (average diameter) of the multiple second SiC regions 10b is, for example, not less than 0.1 μm and less than 1 μm.

[0013] By including the plurality of SiC regions 10p and the inter-SiC region 10q in the substrate 10s, the gap between the SiC regions can be reduced. By including the plurality of SiC regions 10p and the inter-SiC region 10q in the substrate 10s, the unevenness of the surface of the substrate 10s can be reduced. For example, a substantially flat surface can be easily obtained.

[0014] The first layer 11 includes SiC. The first layer 11 includes nitrogen at a first layer concentration. Since the first layer 11 includes nitrogen, the first layer 11 functions as an n-type semiconductor layer. The nitrogen functions as, for example, an n-type impurity.

[0015] The first intermediate layer 61 includes SiC. The first intermediate layer concentration of nitrogen in the first intermediate layer 61 is layer For example, the first layer 11 is a low nitrogen concentration SiC layer. For example, the first intermediate layer 61 is a high nitrogen concentration SiC layer.

[0016] For example, the first intermediate layer 61 includes a SiC single crystal. For example, the first intermediate layer 61 is a hexagonal SiC single crystal layer. The first layer 11 includes a SiC single crystal. The first layer 11 is a SiC single crystal layer. The first layer 11 functions as, for example, at least a part of a functional layer of a semiconductor device.

[0017] The thickness of the substrate 10s is sufficiently thicker than the thickness of the crystal layer 10L. The thick substrate 10s supports the crystal layer 10L.

[0018] For example, a heating process is performed when processing the first layer 11 provided on the substrate 10s to form a semiconductor device. There is a difference in thermal expansion coefficient between the substrate 10s and the first layer 11. Due to the difference in thermal expansion coefficient, stress occurs in the substrate 10s and the crystal layer 10L. As described above, the substrate 10s is sufficiently thicker than the crystal layer 10L. Therefore, if the first intermediate layer 61 is not provided between the substrate 10s and the first layer 11, the generated stress is applied to the crystal layer 10L, and the crystal layer 10L is easily damaged. For example, dislocations increase in the crystal layer 10L, and the crystal quality of the crystal layer 10L decreases. This makes it particularly difficult to obtain the desired characteristics.

[0019] In the embodiment, a first intermediate layer 61 is provided between the substrate 10s and the first layer 11. The concentration of nitrogen in the first intermediate layer 61 is higher than the concentration of nitrogen in the first layer 11. The lattice length of the first intermediate layer 61 having a high concentration of nitrogen is shorter than the lattice length of the first layer 11 having a low concentration of nitrogen. Stress occurs in the crystal layer 10L based on the difference in lattice length. The direction of the stress based on the difference in lattice length is opposite to the direction of the stress caused by the difference in thermal expansion coefficient between the substrate 10s and the crystal layer 10L. The stress based on the difference in lattice length can reduce the stress caused by the difference in thermal expansion coefficient. This suppresses dislocations, and a crystal layer 10L having high crystal quality is obtained. For example, a first layer 11 with good characteristics is obtained. According to the embodiment, a wafer capable of improving characteristics can be provided.

[0020] As shown in FIG. 1(a), an intermediate region 11B may be provided. The intermediate region 11B is provided between the first intermediate layer 61 and the first layer 11. The nitrogen concentration in the intermediate region 11B is between the nitrogen concentration in the first intermediate layer 61 (first intermediate layer concentration) and the nitrogen concentration in the first layer 11 (first layer concentration). The intermediate region 11B is, for example, a transition layer. The intermediate region 11B is thinner than the first intermediate layer 61 and the first layer 11. Therefore, the effect of the intermediate region 11B on stress can be substantially negligible.

[0021] For example, the first intermediate layer concentration is preferably 5 times or more the first layer concentration. This allows the stress based on the difference in lattice length to be effectively generated in the crystal layer 10L. This allows the stress caused by the above-mentioned thermal expansion coefficient to be effectively suppressed. The first intermediate layer concentration may be 50,000 times or less the first layer concentration. For example, if the first layer concentration is excessively low, it becomes difficult to obtain good electrical characteristics in a semiconductor device manufactured from the wafer.

[0022] The nitrogen concentration in the first layer 11 (first layer concentration) is, for example, 1×10 15 cm -3 More than 2×10 17 cm -3 The first layer concentration is 1×10 15 cm -3 When the first layer concentration is 2×10 or more, for example, in a semiconductor device manufactured from the wafer, good electrical characteristics are easily obtained. 17 cm -3 By being equal to or less than this, an appropriate stress is easily generated in the crystal layer 10L including the first layer 11 and the first intermediate layer 61.

[0023] The nitrogen concentration in the first intermediate layer 61 (first intermediate layer concentration) is, for example, 1×10 18 cm -3 5×10 or more 19 cm -3 The first intermediate layer concentration is 1×10 18 cm -3When the nitrogen concentration in the first intermediate layer 61 is excessively high, for example, the crystal quality of the first intermediate layer 61 is likely to deteriorate. 19 cm -3 By keeping the temperature below 0.15° C., high crystal quality can be maintained.

[0024] As shown in FIG. 1(a), the thickness (length) of the first layer 11 along the first direction (Z-axis direction) from the first intermediate layer 61 toward the first layer 11 is defined as a first thickness t1. The thickness (length) of the first intermediate layer 61 along the first direction is defined as a second thickness t2. In the embodiment, the first thickness t1 is preferably 0.2 to 2 times the second thickness t2. For example, the first thickness t1 is not significantly different from the second thickness t2. This makes it easy to appropriately generate a desired stress in the crystal layer 10L by using the difference in nitrogen concentration.

[0025] In the embodiment, the first thickness t1 is preferably 10 μm or more and 80 μm or less, which makes it easier to obtain good semiconductor characteristics.

[0026] In the embodiment, the second thickness t2 is preferably 10 μm or more and 80 μm or less. Warping is effectively suppressed. The second thickness t2 is more preferably 20 μm or more and 30 μm or less.

[0027] The substrate 10s has a third thickness t3 along the first direction (Z-axis direction). The crystal layer 10L has a thickness t0 along the first direction (Z-axis direction). The thickness t0 substantially corresponds to the sum of the first thickness t1 and the second thickness t2. The third thickness t3 is, for example, four times or more the thickness t0. This prevents the substrate 10s from substantially deforming and suppresses warping. The third thickness t3 may be, for example, five times or more the thickness t0. The third thickness t3 may be, for example, ten times or more the thickness t0. The third thickness t3 may be, for example, 50 times or less the thickness t0. For example, if the thickness of the crystal layer 10L becomes excessively thick, for example, internal stress such as thermal distortion occurs in the substrate 10s, making it more likely to warp.

[0028] The third thickness t3 is preferably, for example, not less than 300 μm and not more than 800 μm. law In this way, good handling can be obtained.

[0029] As shown in Fig. 1(a), the first layer 11 has a (11-21) plane 11F. In the description of "(11-21)", the notation "-" corresponds to the "bar" of the number written after the "-". The notation "(11-21)" follows the Miller index notation.

[0030] The angle between the (11-21) plane 11F in the first layer 11 and the XY plane is defined as angle θ1. The angle θ1 corresponds to an offset angle. The XY plane is a plane perpendicular to the direction from the first intermediate layer 61 toward the first layer 11 (the first direction, the Z-axis direction). In the embodiment, the angle θ1 may be 4.5 degrees or less. The offset makes it easier to obtain good crystallinity in the crystal layer 10L. For example, when the angle θ1 exceeds 4.5 degrees, basal plane dislocations (BPDs) are more likely to intrude into the crystal layer epitaxially grown on the crystal layer 10L.

[0031] In an embodiment, for example, the basal plane dislocation density in first intermediate layer 61 may be higher than the basal plane dislocation density in first layer 11. This allows stress to be more effectively relieved in first intermediate layer 61. The low basal plane dislocation density in first layer 11 makes it easier to obtain good electrical characteristics, for example, in a semiconductor device obtained from the wafer.

[0032] The basal plane dislocation density in the first intermediate layer 61 is, for example, 8×10 1 cm -2 More than 1×10 3 cm -2 The basal plane dislocation density in the first intermediate layer 61 is 8×10 1 cm -2 When the basal plane dislocation density in the first intermediate layer 61 is 1×10 or more, for example, the stress is easily relaxed. 3 cm -2If the basal plane dislocation density in the first layer 11 exceeds 1.5×10, for example, the basal plane dislocation density in the first intermediate layer 61 is likely to be high. 2 cm -2 More than that is fine.

[0033] The basal plane dislocation density in the first layer 11 is, for example, 1 cm -2 It is preferable that the thickness be less than or equal to 100 nm. This makes it easier to obtain good electrical characteristics in a semiconductor device obtained from the wafer, for example.

[0034] For example, in the first layer 11, etc., basal plane dislocations are converted into threading edge dislocations. For example, by setting the offset angle (the above angle θ1) to 4.5 degrees or less, a high conversion efficiency into threading edge dislocations can be obtained. In the semiconductor device, good electrical characteristics can be obtained.

[0035] Below, a simulation result of an example of stress generated in the crystal layer 10L will be described. In the simulation model, the crystal layer 10L is not fixed to the substrate 10s. In this model, the lattice length changes based on the difference in nitrogen concentration, and as a result, stress occurs between the first layer 11 and the first intermediate layer 61. In this model in which the crystal layer 10L is not fixed to the substrate 10s, the crystal layer 10L is deformed (warped) due to the stress caused by the difference in nitrogen concentration. The curvature of this deformation corresponds to the generated stress. In the following, a curvature parameter is used as a parameter indicating the stress generated in the crystal layer 10L.

[0036] FIG. 2 is a graph illustrating the characteristics of the wafer. The horizontal axis of FIG. 2 is the nitrogen concentration C1 in the first intermediate layer 61. The vertical axis is the curvature parameter Pm1. As described above, the curvature parameter Pm1 corresponds to the stress generated in the crystal layer 10L when the crystal layer 10L is not fixed to the substrate 10s. When the curvature parameter Pm1 is high, the stress is large. In the example of FIG. 2, the nitrogen concentration in the first layer 11 (first layer concentration) is 5×10 15 cm -3 The first thickness t1 of the first layer 11 is the same as the second thickness t2 of the first intermediate layer 61.

[0037] 2, when the nitrogen concentration C1 (first intermediate layer concentration) in the first intermediate layer 61 increases, the curvature parameter Pm1 increases. 17 cm -3 In the following region, the curvature parameter Pm1 increases slightly and does not change substantially. 17 cm -3 When the concentration C1 exceeds 1×10 18 cm -3 In the above cases, the curvature parameter Pm1 increases rapidly.

[0038] In the embodiment, the first intermediate layer concentration is 1×10 18 cm -3 It is preferable that the curvature parameter Pm1 is high. The stress based on the difference in nitrogen concentration is effectively obtained. This makes it possible to effectively suppress the deterioration of the crystal quality of the crystal layer 10L caused by the change in the thermal expansion coefficient.

[0039] 3(a) and 3(b) are graphs illustrating the characteristics of the wafer. These figures illustrate the simulation results of the curvature parameter Pm1 corresponding to the stress when the first thickness t1 of the first layer 11 and the second thickness t2 of the first intermediate layer 61 are changed. In this case, too, in the simulation model, the crystal layer 10L is not fixed to the substrate 10s. In this example, the nitrogen concentration in the first layer 11 (first layer concentration) is 5×10 15 cm -3 The nitrogen concentration C1 (first intermediate layer concentration) in the first intermediate layer 61 is 5×10 18 cm -3The horizontal axis of these figures is the second thickness t2 of the first intermediate layer 61. The vertical axis of these figures is the curvature parameter Pm1. FIG. 3(a) corresponds to the characteristic where the first thickness t1 of the first layer 11 is 6 μm to 30 μm. FIG. 3(b) corresponds to the characteristic where the first thickness t1 of the first layer 11 is 30 μm to 100 μm. The first thickness t1 of the first layer 11 is changed in the range of 10 μm to 100 μm. The second thickness t2 of the first intermediate layer 61 is changed in the range of 10 μm to 120 μm.

[0040] As shown in FIG. 3(a) and FIG. 3(b), in general, when the first thickness t1 of the first layer 11 is thin and the second thickness t2 of the first intermediate layer 61 is thin, a high curvature parameter Pm1 is obtained. As shown in FIG. 3(b), when the first thickness t1 is 30 μm to 120 μm, a peak is observed in the curvature parameter Pm1 when the second thickness t2 is changed. The second thickness t2 at which the curvature parameter Pm1 reaches a peak becomes thinner as the first thickness t1 becomes thinner. As shown in FIG. 3(a), in the characteristics when the first thickness t1 is 6 μm to 20 μm, no peak is observed in the curvature parameter Pm1. Inferred from the result of FIG. 3(b), when the first thickness t1 is 6 μm to 20 μm, the second thickness t2 at which the curvature parameter Pm1 reaches a peak is considered to be 10 μm or less.

[0041] 4(a) and 4(b) are graphs illustrating the characteristics of the wafer. These figures illustrate the simulation results described with reference to Figures 3(a) and 3(b) with the axes changed. The horizontal axis of Figures 4(a) and 4(b) is the first thickness t1 of the first layer 11. The vertical axis of these figures is the curvature parameter Pm1. Figure 4(a) corresponds to the characteristic where the second thickness t2 of the first intermediate layer 61 is 10 μm to 40 μm. Figure 4(b) corresponds to the characteristic where the second thickness t2 of the first intermediate layer 61 is 40 μm to 180 μm.

[0042] As shown in FIG. 4(a) and FIG. 4(b), in general, when the first thickness t1 of the first layer 11 is thin and the second thickness t2 of the first intermediate layer 61 is thin, a high curvature parameter Pm1 is obtained. As shown in FIG. 4(a) and FIG. 4(b), when the second thickness t2 is 20 μm to 180 μm, a peak is observed in the curvature parameter Pm1 when the first thickness t1 is changed. The second thickness t2 at which the curvature parameter Pm1 reaches a peak becomes thinner as the first thickness t1 becomes thinner. As shown in FIG. 4(a), in the characteristics when the second thickness t2 is 10 μm, no peak is observed in the curvature parameter Pm1. Inferred from the result of FIG. 4(b), when the second thickness t2 is 10 μm, the first thickness t1 at which the curvature parameter Pm1 reaches a peak is considered to be 10 μm or less.

[0043] In this way, there exists a condition where the curvature parameter Pm1 reaches a peak (maximum) in the combination of the first thickness t1 and the second thickness t2.

[0044] 5(a) and 5(b) are graphs illustrating the characteristics of the wafer. Fig. 5(a) illustrates the change in the maximum value of the curvature parameter Pm1 obtained when the first thickness t1 is fixed for various combinations of the first thickness t1 of the first layer 11 and the second thickness t2 of the first intermediate layer 61. The horizontal axis of Fig. 5(a) is the first thickness t1 of the first layer 11. The vertical axis is the maximum value Pm2 of the curvature parameter Pm1.

[0045] As shown in FIG. 5(a), when the first thickness t1 is greater than 80 μm, the maximum value Pm2 of the curvature parameter Pm1 is low. When the first thickness t1 is 80 μm or less, the maximum value Pm2 of the curvature parameter Pm1 is high. When the first thickness t1 is 80 μm or less, a high curvature parameter Pm1 is obtained. When the first thickness t1 is 80 μm or less, as the first thickness t1 decreases, the maximum value Pm2 increases rapidly. As shown in FIG. 5(a), when the first thickness t1 is 10 μm or less, the maximum value Pm2 of the curvature parameter Pm1 is high. m Below this, the maximum value decreases.

[0046] In the embodiment, the first thickness t1 is preferably 80 μm or less. A high curvature parameter Pm1 (maximum value Pm2) can be obtained. In the embodiment, the first thickness t1 is preferably 10 μm or more. A high maximum value Pm2 can be easily obtained.

[0047] Fig. 5(b) illustrates the change in the maximum value of the curvature parameter Pm1 obtained when the second thickness t2 is fixed for various combinations of the first thickness t1 of the first layer 11 and the second thickness t2 of the first intermediate layer 61. The horizontal axis of Fig. 5(b) is the second thickness t2 of the first intermediate layer 61. The vertical axis is the maximum value Pm2 of the curvature parameter Pm1.

[0048] As shown in FIG. 5(b), when the second thickness t2 is greater than 80 μm, the maximum value Pm2 of the curvature parameter Pm1 is low. When the second thickness t2 is 80 μm or less, the maximum value Pm2 of the curvature parameter Pm1 is high. When the second thickness t2 is 80 μm or less, a high curvature parameter Pm1 is obtained. When the second thickness t2 is 80 μm or less, as the first thickness t1 decreases, the maximum value Pm2 increases rapidly. As shown in FIG. 5(b), when the first thickness t1 is 10 μm or less, the maximum value Pm2 of the curvature parameter Pm1 is high. When the second thickness t2 is 80 μm or less, as the first thickness t1 decreases, the maximum value Pm2 increases rapidly. m Below this, the maximum value decreases.

[0049] In an embodiment, the second thickness t2 is preferably 80 μm or less. A high curvature parameter Pm1 (maximum value Pm2) can be obtained. In an embodiment, the second thickness t2 is preferably 10 μm or more. A high maximum value Pm2 can be easily obtained. The second thickness t2 may be 20 μm or more. A high maximum value Pm2 can be easily and stably obtained.

[0050] FIG. 6 is a graph illustrating the characteristics of the wafer. The horizontal axis of Fig. 6 is the thickness ratio RR1. The thickness ratio RR1 is the ratio of the first thickness t1 to the second thickness t2. The vertical axis of Fig. 6 is the curvature parameter Pm1.

[0051] As shown in FIG. 6, when the first thickness t1 is 30 μm or more and 80 μm or less, the thickness ratio RR 1 isWhen the thickness is changed, the curvature parameter Pm1 shows a peak. For various combinations of thickness, it is preferable that the curvature parameter Pm1 is high.

[0052] For example, when the first thickness t1 is in the range of 30 μm or more and 80 μm or less, the thickness ratio RR1 at which the curvature parameter Pm1 peaks is in the range of 0.4 or more and 0.75 or less. When the thickness ratio RR1 is in the range of 0.4 or more and 0.75 or less, a high curvature parameter Pm1 (peak) is obtained. Even when the thickness ratio RR1 is lower or higher than the thickness ratio RR1 at which the curvature parameter Pm1 peaks, a somewhat high curvature parameter Pm1 is obtained.

[0053] For example, the range up to half the peak value of the curvature parameter Pm1 is defined as the "range of high curvature parameter Pm1." The ratio RR1 at which this "range of high curvature parameter Pm1" is obtained is approximately 0.2 or more and 2 or less when the first thickness t1 is 30 μm or more and 80 μm or less. At such a thickness ratio RR1, a high curvature parameter Pm1 is obtained.

[0054] On the other hand, when the first thickness t1 is 20 μm, the curvature parameter Pm1 does not show a peak in the simulation results illustrated in FIG. 6. When the first thickness t1 is 20 μm, the curvature parameter Pm1 monotonically decreases as the ratio RR1 increases. When the first thickness t1 is 20 μm, the value of the curvature parameter Pm1 is sufficiently high for any thickness ratio RR1. Therefore, even when the first thickness t1 is 20 μm, a high curvature parameter Pm1 is obtained when the ratio RR1 is in the range of 0.2 or more and 2 or less.

[0055] In an embodiment, the thickness ratio RR1 is 0. 2 or more above 2 or more It is preferable that the first thickness t1 of the first layer 11 along the first direction (Z-axis direction) is 0.2 to 2 times the second thickness t2 of the first intermediate layer 61 along the first direction. This allows a high curvature parameter Pm1 to be obtained. A large stress corresponding to the high curvature parameter Pm1 can be generated in the crystal layer 10L.

[0056] As shown in Figure 6, the curvature parameter Pm1 is 10m -1 It may be more than that. It is considered that the curvature parameter Pm1 becomes excessively high, and the stress due to the difference in the nitrogen concentration becomes excessively large. It is considered that the stress due to the difference in the nitrogen concentration becomes excessively large, and the value becomes excessively larger than the stress due to the difference in the thermal expansion coefficient between the substrate 10s and the crystal layer 10L. In this case, it is considered that the stress due to the difference in the nitrogen concentration causes defects in the crystal layer 10L. However, in practical terms, the stress due to the difference in the nitrogen concentration does not greatly exceed the absolute value of the stress due to the difference in the thermal expansion coefficient. Therefore, it can be considered that, within a practical range, the stress due to the difference in the thermal expansion coefficient can be alleviated by a high curvature parameter Pm1.

[0057] As shown in FIG. 1(b), in the embodiment, the substrate 10s may include a plurality of inter-SiC regions 10q. The average length L1 of the plurality of inter-SiC regions 10q is preferably 0.3 μm or less. The length L1 corresponds to the length of the inter-SiC region 10q along a direction perpendicular to the first direction (Z-axis direction). The length L1 may be, for example, the length in any direction along the XY plane (for example, the X-axis direction). The length L1 corresponds, for example, to the distance between the plurality of SiC regions 10p.

[0058] A long length L1 corresponds to a large gap between the multiple SiC regions 10p. If the average of the length L1 exceeds 0.3 μm, the unevenness of the surface of the substrate 10s becomes excessively large. In this case, the adhesion between the substrate 10s and the crystal layer 10L decreases, and the crystal layer 10L becomes more likely to peel off from the substrate 10s, for example, due to high-temperature treatment. By setting the average of the length L1 to 0.3 μm or less, peeling can be suppressed. By setting the average of the length L1 to 0.3 μm or less, the unevenness of the surface of the substrate 10s can be reduced.

[0059] In the embodiment, the inter-SiC region 10q contains Si. For example, the gaps between the multiple SiC regions 10p are filled with Si. It is possible to suppress voids from forming between the multiple SiC regions 10p. If voids occur, liquid or gas may enter the voids during the manufacturing process of a semiconductor device using the wafer, which may interfere with the desired processing. The inter-SiC region 10q contains Si, which suppresses voids. This allows the manufacturing of a semiconductor device using the wafer to be stably performed.

[0060] 7(a) and 7(b) are schematic cross-sectional views illustrating the wafer according to the first embodiment. FIG. 7(b) is an enlarged view of a portion of FIG. 7(a). 7(a), a wafer 211 according to the embodiment includes a substrate 10s, a first layer 11, a first intermediate layer 61, and a second intermediate layer 62. The configuration of the wafer 211, except for the second intermediate layer 62, may be similar to the configuration of the wafer 210.

[0061] The second intermediate layer 62 is provided between the substrate 10s and the first intermediate layer 61. The second intermediate layer 62 contains SiC. The second intermediate layer concentration of nitrogen in the second intermediate layer 62 is higher than the first intermediate layer concentration of nitrogen in the first intermediate layer 61. This makes it possible to more stably increase the stress due to the difference in nitrogen concentration in the crystal layer 10L. This makes it possible to more stably reduce the stress due to the difference in thermal expansion coefficient. A higher quality crystal layer 10L is easily obtained.

[0062] The second intermediate layer 62 is, for example, an incomplete SiC layer having a high nitrogen concentration. The nitrogen concentration in the second intermediate layer 62 is, for example, 1×10 19 cm -3 More than 3×10 20 cm -3 The thickness (fourth thickness t4) of the second intermediate layer 62 is, for example, not less than 0.5 μm and not more than 3 μm.

[0063] In the substrate 10s according to the embodiment, at least some of the SiC regions 10p are preferably in the α phase, which makes it difficult for a phase change to occur even during heat treatment at high temperatures (eg, 1600° C. or higher).

[0064] An example of a method for manufacturing a wafer according to an embodiment will be described below.

[0065] Second embodiment No. 2 The embodiment relates to a method for manufacturing a wafer. 8(a) to 8(c) and 9(a) to 9(c) are schematic cross-sectional views illustrating the wafer manufacturing method according to the second embodiment. As shown in FIG. 8(a), a first intermediate layer substrate 61s is prepared. The first intermediate layer substrate 61s becomes the first intermediate layer 61 containing SiC. The first intermediate layer substrate 61s contains SiC. The nitrogen concentration in the first intermediate layer substrate 61s is 3×10 18 cm -3 The basal plane dislocation density in the first intermediate layer substrate 61s is, for example, 1.5×10 2 cm -2 The first intermediate layer substrate 61s is, for example, a SiC single crystal substrate.

[0066] As shown in FIG. 8(b), a first layer 11 is formed on a first intermediate layer substrate 61s. The first layer 11 includes SiC. The first layer 11 can be formed by, for example, epitaxial growth. The first layer 11 includes nitrogen at a first layer concentration. As already described, the concentration of nitrogen in the first intermediate layer substrate 61s (for example, the first intermediate layer concentration) is higher than the first layer concentration.

[0067] As shown in FIG. 8(b), in one example, between the first intermediate layer substrate 61s and the first layer 11, an intermediate region 11B may be provided.

[0068] As shown in Fig. 8(c), the first intermediate layer substrate 61s includes a first layered region 61a and a second layered region 61b. The first layered region 61a is between the second layered region 61b and the first layer 11. The first layered region 61a is a region close to the first layer 11. The second layered region 61b is a region far from the first layer 11. In the state illustrated in Fig. 8(c), the boundary between these layered regions may be unclear.

[0069] As shown in Fig. 8(c), after the formation of the first layer 11, a third layer region 61c is formed between the first layer region 61a and the second layer region 61b. For example, the first intermediate layer substrate 61s is irradiated with electromagnetic waves 68. The electromagnetic waves 68 are, for example, laser light. The wavelength (center wavelength) of the laser light is, for example, 390 nm or more and 1200 nm or less. The power of the laser light is, for example, 30 mW or more and 30 W or less.

[0070] As shown in FIG. 8(c), a modified region 61d is formed in the third layer region 61c by irradiation with electromagnetic waves 68 (laser light). In the modified region 61d, the mechanical strength is locally reduced. Thus, the formation of the third layer region 61c may include irradiating the first intermediate layer substrate 61s with electromagnetic waves 68. This forms the third layer region 61c. The third layer region 61c is, for example, a fractured layer. The mechanical strength of the third layer region 61c is lower than that of the other regions (the first layer region 61a and the second layer region 61b). For example, the crystallinity of the third layer region 61c is lower than that of the first layer region 61a. The crystallinity of the third layer region 61c is lower than that of the second layer region 61b. Information regarding the crystallinity of these layers can be obtained, for example, by X-ray diffraction analysis. For example, when the crystallinity is low, the intensity peak obtained by X-ray diffraction becomes broad.

[0071] When a third layer region 61c (e.g., altered region 61d) is formed by irradiation with electromagnetic wave 68 (laser light), peeling occurs between the first layer region 61a and the second layer region 61b from the portion where the altered region 61d has been formed. This causes the second layer region 61b to be removed (see FIG. 9(a)). In this manner, removal of the second layer region 61b includes forming the third layer region 61c between the first layer region 61a and the second layer region 61b after the formation of the first layer 11.

[0072] 9(b), the workpiece from which the second layer region 61b has been removed is placed opposite the substrate 10s. For example, the remaining first layer region 61a faces the substrate 10s.

[0073] As shown in FIG. 9(c), the remaining first layer region 61a is bonded to the substrate 10s. The substrate 10s has the configuration described in relation to the first embodiment. As shown in FIG. 1(b), the substrate 10s includes a plurality of SiC regions 10p including SiC and an inter-SiC region 10q including Si provided between the plurality of SiC regions 10p. The remaining first layer region 61a becomes the first intermediate layer 61.

[0074] In the bonding, for example, direct bonding is performed. The direct bonding is performed in a reduced pressure atmosphere (less than 1 atmosphere). Before the bonding, the surface of the first layer region 61a may be planarized. Before the bonding, the surface of the substrate 10s may be planarized. During the bonding, Ar or the like may be introduced into the space between the first layer region 61a and the substrate 10s. This allows sputter cleaning. During the bonding, Si may be deposited on at least one of the surface of the first layer region 61a and the surface of the substrate 10s.

[0075] Through the above process, a wafer 210 according to the embodiment is obtained.

[0076] As described below, the third layer region 61c may remain after the removal of the second layer region 61b. The third layer region 61c may be removed before bonding. Furthermore, as described above, a part (surface portion) of the remaining first layer region 61a may be removed and planarized. In this manner, the method for manufacturing a wafer according to the embodiment may further include removing a part of the remaining first layer region 61b and planarizing it after the removal of the second layer region 61b and before bonding.

[0077] As shown in FIG. 9(a), after the first layer 11 is formed, a support member 65 (e.g., a support substrate) may be fixed to the first layer 11. The support member 65 includes, for example, graphite. For example, a resin layer 66 is provided between the first layer 11 and the support member 65. The support member 65 is fixed to the first layer 11 by the resin layer 66. After the second layer region 61b is removed, the first layer 11 and the first layer region 61a are supported by the support member 65. Fixing the support member 65 to the first layer 11 may be performed by any technically possible process.

[0078] 10(a) to 10(c) are schematic cross-sectional views illustrating the method for manufacturing a wafer according to the second embodiment. As shown in Fig. 10(a), after the process described with reference to Fig. 8(c), the third layer region 61c remains after removal of the second layer region 61b. The third layer region 61c is removed. The removal can be performed, for example, by CMP (Chemical Mechanical Polishing).

[0079] 10(b), for example, ions 69 are implanted into a portion (surface portion) of the first layer region 61a exposed by removing the third layer region 61c. The ions 69 contain nitrogen. This forms a region (second intermediate layer 62) containing nitrogen at a high concentration. The remaining first layer region 61a becomes the first intermediate layer 61.

[0080] As shown in Fig. 10(c), the second intermediate layer 62 and the substrate 10s are made to face each other. The second intermediate layer 62 and the substrate 10s are bonded together. In the bonding, the above-mentioned direct bonding is performed. As a result, for example, the wafer 211 according to the embodiment is obtained.

[0081] 11(a) to 11(c) and 12(a) to 12(c) are schematic cross-sectional views illustrating the wafer manufacturing method according to the second embodiment. As shown in FIGS. 11(a) and 11(b), the third layer region 61c is removed and the second intermediate layer 62 is formed.

[0082] As shown in FIG. 11(c), a substrate 10s is prepared. The substrate 10s includes a first substrate portion 10sa and a second substrate portion 10sb. The first substrate portion 10sa includes a plurality of SiC regions 10p and an inter-SiC region 10q (see FIG. 1(b)). The first substrate portion 10sa is, for example, a sintered substrate including Si and Si-C. The second substrate portion 10sb is provided on the surface of the first substrate portion 10sa. 2 The substrate portion 10sb includes, for example, polycrystalline SiC. The second substrate portion 10sb can be formed by, for example, CVD (Chemical Vapor Deposition) etc. The thickness of the second substrate portion 10sb is, for example, not less than 0.1 μm and not more than 300 μm.

[0083] As shown in FIG. 11(c), the second substrate portion 10sb of the substrate 10s is opposed to the second intermediate layer 62.

[0084] As shown in FIG. 12(a), the second intermediate layer 62 and the substrate 10s (second substrate portion 10sb) are bonded. In the bonding, the above-mentioned direct bonding is performed. This results in, for example, a wafer according to the embodiment. During and after the bonding, at least a portion of the second substrate portion 10sb is between at least a portion of the first substrate portion 10sa and at least a portion of the first layer 11. In this example, during and after the bonding, a portion of the second substrate portion 10sb is between the first substrate portion 10sa and the second intermediate layer 62.

[0085] 12(b), the resin layer 66 and the support member 65 are removed. For example, the support member 65 is peeled off by removing the resin layer 66. The resin layer 66 and the support member 65 may also be removed by polishing or the like.

[0086] As shown in FIG. 12(c), at least a portion of the first substrate portion 10sa may be removed to thin the first substrate portion 10sa. At this time, a corresponding portion of the second substrate portion 10sb is also removed. The entire first substrate portion 10sa may be removed. The second substrate portion 10sb may also be removed. In this manner, the substrate 10s may be thinned. The entire substrate 10s may be removed.

[0087] The nitrogen concentration in the second substrate portion 10sb may be higher than the nitrogen concentration (first intermediate layer concentration) in the first intermediate layer 61. In this case, at least a part of the remaining second substrate portion 10sb may become at least a part of the second intermediate layer 62. In this case, the formation of the second intermediate layer 62 (for example, the introduction of ions 69) illustrated in FIG. 11(b) may be omitted.

[0088] Figure 13 shows ,fruit 4 is a graph illustrating characteristics related to a manufacturing method of a semiconductor device according to an embodiment. As already described, the surface of the substrate 10s may be planarized before bonding to the substrate 10s. The planarization may be performed, for example, by polishing using abrasive grains. The horizontal axis of Fig. 13 is the diameter d1 of the abrasive grains. The vertical axis is the surface roughness Ra of the substrate 10s after polishing using the abrasive grains.

[0089] As shown in FIG. 13, in the range where the diameter d1 is 5 μm or more, the surface roughness Ra decreases as the diameter d1 becomes smaller. When the diameter d1 is smaller than 5 μm, the surface roughness Ra increases. This is because when the diameter d1 is excessively small, Si in the inter-SiC region 10q included in the substrate 10s is easily removed. As a result, it is considered that a plurality of SiC regions 10p remain, and the surface roughness Ra of the substrate 10s increases. When the diameter d1 is 5 μm or more, the abrasive grains are prevented from removing Si in the inter-SiC region 10q. For this reason, in the range where the diameter d1 is 5 μm or more, it is preferable that the diameter d1 is small. This allows a flat substrate 10s to be obtained.

[0090] The diameter d1 of the abrasive grains is preferably larger than the average of the lengths L1 (see FIG. 1(b)) of the inter-SiC regions 10q. If the diameter d1 is excessively small, the Si in the inter-SiC regions 10q is selectively removed, and the surface roughness Ra is likely to increase. From a practical standpoint, it is preferable that the diameter d1 be at least twice the average of the lengths L1 (see FIG. 1(b)) of the inter-SiC regions 10q.

[0091] The method for manufacturing a wafer according to the embodiment may include polishing the substrate 10s with a plurality of abrasive grains before bonding the substrate 10s. The average diameter d1 of the plurality of abrasive grains is preferably 0.5 μm or more. A flat substrate 10s is obtained.

[0092] Third embodiment The third embodiment relates to a method for manufacturing a semiconductor device. 14(a) to 14(d) are schematic cross-sectional views illustrating the method for manufacturing the semiconductor device according to the third embodiment. As shown in Fig. 14(a), a wafer (wafer 210 or 211, etc.) according to the first embodiment is prepared. Substrate 10s may include a first substrate portion 10sa and a second substrate portion 10sb (see Fig. 12(c), etc.). The wafer may include a second intermediate layer 62 in addition to the first intermediate layer 61 and the first layer 11.

[0093] As shown in FIG. 14(b), a first element 69B is introduced into at least a portion of the first layer 11. The first element 69B includes at least one selected from the group consisting of B, Al, and Ga. The first element 69B functions as a p-type impurity. A second semiconductor region 12 including the first element 69B is formed.

[0094] As shown in Fig. 14(c), after the introduction of the first element 69B, a heat treatment is performed. The heat treatment is performed at a temperature of 1600°C or higher. This activates the first element 69B. The second semiconductor region 12 functions as the intended p-type semiconductor.

[0095] In the embodiment, the wafer includes a substrate 10s, a first intermediate layer 61, and a first layer 11. This reduces stress even during high-temperature heat treatment, and suppresses warpage. Semiconductor devices using the wafer can be stably manufactured.

[0096] As shown in FIG. 14(d), after the heat treatment, at least a portion of the substrate 10s is removed. This makes the substrate 10s thinner. Alternatively, the entire substrate 10s may be removed. A first electrode 51 is formed on the surface exposed by removing at least a portion of the substrate 10s. In this example, the first electrode 51 is in contact with the second intermediate layer 62. The first electrode 51 may be in contact with the first intermediate layer 61. In this way, the semiconductor device 110A is obtained.

[0097] 15(a) to 15(c) are schematic cross-sectional views illustrating the method for manufacturing the semiconductor device according to the third embodiment. As shown in FIG. 15(a), after heat treatment (see FIG. 12(c)), a portion 10sp of the substrate 10s is removed, leaving another portion 10sq of the substrate 10s. To remove the portion 10sp of the substrate 10s, for example, etching using a mask material is performed. The etching may include, for example, REI (Reactive Ion Etching). The etching may include wet etching. In this example, the substrate 10s may include a first substrate portion 10sa and a second substrate portion 10sb. In the etching, the first intermediate layer 61 (or the second intermediate layer 62) may function as an etching stopper.

[0098] As shown in FIG. 15(b), a first electrode 51 is formed on the surface exposed by removing a portion 10sp of the substrate 10s. The first electrode 51 contacts the exposed first intermediate layer 61 (or the second intermediate layer 62). The first electrode 51 contacts the other portion 10sq of the substrate 10s. The first electrode 51 is electrically connected to the first intermediate layer 61 (or the second intermediate layer 62). In this way, the semiconductor device 110B is obtained.

[0099] In this example, the first electrode 51 is electrically connected to the first intermediate layer 61 (or the second intermediate layer 62) without passing through the entire substrate 10s. This makes it possible to reduce the resistance (on-resistance) in the semiconductor device 110B.

[0100] The semiconductor device 110B includes another portion 10sq of the substrate 10s, which provides the semiconductor device 110B with high mechanical strength.

[0101] As shown in FIG. 15(c), a conductive material 51M may be formed in the space left by the recess formed by removing the portion 10sp of the substrate 10s. The conductive material 51M is embedded in the recess. The depth of the recess is reduced. Higher mechanical strength is obtained.

[0102] (Fourth embodiment) The fourth embodiment relates to a semiconductor device. FIG. 16 is a schematic cross-sectional view illustrating the semiconductor device according to the fourth embodiment. As shown in FIG. 16, the semiconductor device 110C according to the embodiment includes a first intermediate layer 61, a first layer 11, and a first electrode 51. The first intermediate layer 61 is a first intermediate layer obtained after at least a portion of the substrate 10s (see FIG. 1(a) and the like) is removed. The electrode 51 is electrically connected to the first intermediate layer 61 obtained by removing at least a portion of the substrate 10s of the wafer according to the first embodiment. In the semiconductor device 110C according to the embodiment, stress is relaxed. For example, a low dislocation density is obtained in the first layer 11 of the semiconductor device 110C. A semiconductor device having good characteristics is obtained.

[0103] FIG. 17 is a schematic cross-sectional view illustrating the semiconductor device according to the fourth embodiment. As shown in FIG. As shown in FIG. 17, the semiconductor device 110D according to the embodiment includes a second intermediate layer 62, a first intermediate layer 61, a first layer 11, and a first electrode 51. The first intermediate layer 61 is electrically connected to the second intermediate layer 62. In this example, the first electrode 51 is electrically connected to the first intermediate layer 61 after at least a portion of the substrate 10s is removed via the second intermediate layer 62. In the semiconductor device 110D, stress is relaxed. In the first layer 11, for example, a low dislocation density is obtained. A semiconductor device having good characteristics is obtained.

[0104] FIG. 18 is a schematic cross-sectional view illustrating the semiconductor device according to the fourth embodiment. 18, the semiconductor device 110 according to the embodiment includes a first intermediate layer 61, a first layer 11, a second semiconductor region 12, a third semiconductor region 13, a first electrode 51, a second electrode 52, a third electrode 53, and a first insulating member 81. The first layer 11 corresponds to an n-type first semiconductor region containing nitrogen. The second semiconductor region corresponds to a p-type semiconductor region containing a first element 69B. The third semiconductor region 13 corresponds to an n-type semiconductor region containing nitrogen.

[0105] The first layer 11 includes a first partial region 11a and a second partial region 11b. A second direction from the second partial region 11b to the first partial region 11a intersects with the first direction (Z-axis direction). The second direction is along the X-axis direction. The position of the second partial region 11b in the second direction is different from the position of the first partial region 11a in the second direction.

[0106] At least a portion of the third semiconductor region 13 is provided between the second partial region 11b and a portion of the third electrode 53 in the first direction (Z-axis direction). A portion 12p of the second semiconductor region 12 is provided between the second partial region 11b and the third semiconductor region 13 in the first direction (Z-axis direction). Another portion 12q of the second semiconductor region 12 is provided between the third semiconductor region 13 and a portion of the first partial region 11a in the second direction (X-axis direction). The other portion 12q of the second semiconductor region 12 is between the second partial region 11b and a portion of the third electrode 53 in the first direction (Z-axis direction).

[0107] In the first direction (Z-axis direction), the first insulating member 81 is located between the third semiconductor region 13 and the third electrode 53, between the other portion 12q of the second semiconductor region 12 and the third electrode 53, and between the first partial region 11a and the third electrode 53. The second electrode 52 is electrically connected to the third semiconductor region 13.

[0108] The current flowing between the first electrode 51 and the second electrode 52 can be controlled by the potential of the third electrode 53. The potential of the third electrode 53 may be, for example, a potential based on the potential of the second electrode 52. The first electrode 51 functions as, for example, a drain electrode. The second electrode 52 functions as, for example, a source electrode. The third electrode 53 functions as, for example, a gate electrode. The first insulating member 81 functions as a gate insulating film. The semiconductor device 110 is, for example, a transistor. The semiconductor device 110 is, for example, a MOS transistor.

[0109] In this example, a fourth semiconductor region 14 and a second insulating member 82 are provided. The fourth semiconductor region 14 includes the first element 69B. The fourth semiconductor region 14 corresponds to a p-type semiconductor region including the first element 69B. In the second direction (X-axis direction), the third semiconductor region 13 is between the fourth semiconductor region 14 and the other part 12q of the second semiconductor region 12. The second electrode 52 is electrically connected to the fourth semiconductor region 14.

[0110] The second insulating member 82 is provided between the third electrode 53 and the second electrode 52. The second insulating member 82 electrically insulates the third electrode 53 from the second electrode 52.

[0111] FIG. 19 is a schematic cross-sectional view illustrating a semiconductor device according to the fourth embodiment. 19 , the semiconductor device 111 according to the embodiment includes a first intermediate layer 61, a first layer 11, a second semiconductor region 12, a third semiconductor region 13, a fifth semiconductor region 15, a first electrode 51, a second electrode 52, a third electrode 53, and a first insulating member 81. In the semiconductor device 111, the first layer 11, the second semiconductor region 12, the third semiconductor region 13, the first electrode 51, the second electrode 52, the third electrode 53, and the first insulating member 81 may be similar to those in the semiconductor device 110.

[0112] The fifth semiconductor region 15 is formed by a first electrode 51 and a first intermediate layer 6 1 The fifth semiconductor region 15 corresponds to a p-type semiconductor region including the first element 69B. The semiconductor device 111 is, for example, an IGBT (Insulated Gate Bipolar Transistor).

[0113] FIG. 20 is a schematic cross-sectional view illustrating the semiconductor device according to the fourth embodiment. 20, the semiconductor device 112 according to the embodiment includes a first intermediate layer 61, a first layer 11, a first electrode 51, and a second electrode 52. The first intermediate layer 61 is between the first electrode 51 and the second electrode 52. The first layer 11 is between the first intermediate layer 61 and the second electrode 52. The first electrode 51 is electrically connected to the first intermediate layer 61. The second electrode 52 is electrically connected to the first layer 11. The semiconductor device 112 is, for example, a Schottky diode.

[0114] 20, the semiconductor device 112 may include a termination region 12A. The termination region 12A is provided between the first layer 11 and an end of the second electrode 52. The termination region 12A includes, for example, a first element 69B. The termination region 12A corresponds to, for example, a p-type semiconductor region.

[0115] FIG. 21 is a schematic cross-sectional view illustrating the semiconductor device according to the fourth embodiment. As shown in FIG. 21, the semiconductor device 113 according to the embodiment includes a first intermediate layer 61, a first layer 11, a second semiconductor region 12, a first electrode 51, and a second electrode 52. The first intermediate layer 61 is between the first electrode 51 and the second electrode 52. The first layer 11 is between the first intermediate layer 61 and the second electrode 52. The second semiconductor region 12 is between the first layer 11 and the second electrode 52. The first electrode 51 is electrically connected to the first intermediate layer 61. The second electrode 52 is electrically connected to the second semiconductor region 12. The semiconductor device 113 is, for example, a pn diode. The semiconductor device 113 may include a termination region 12A.

[0116] In the semiconductor devices 110 to 113, stress is relieved and stable characteristics can be obtained, for example, high electrical characteristics can be obtained.

[0117] In the semiconductor devices 110 to 113, the first electrode 51 includes, for example, Ni or Ni silicide. In the semiconductor devices 110, 111, and 113, the second electrode 52 includes, for example, at least one selected from the group consisting of Ni and Ti. In the semiconductor device 112, the second electrode 52 includes, for example, at least one selected from the group consisting of Ni and Ti / Al. In the semiconductor devices 110 to 113, the third electrode 53 includes, for example, at least one selected from the group consisting of Ni and amorphous Si.

[0118] According to the embodiments, it is possible to provide a wafer, a semiconductor device, a method for manufacturing a wafer, and a method for manufacturing a semiconductor device that can improve characteristics.

[0119] In this specification, "electrically connected" includes a state in which multiple conductors are in physical contact with each other and a current flows between the multiple conductors. "Electrically connected" includes a state in which a conductor is inserted between multiple conductors and a current flows between the multiple conductors.

[0120] In this specification, "vertical" and "parallel" do not only mean strictly vertical and strictly parallel, but also include, for example, variations in the manufacturing process, and may mean substantially vertical and substantially parallel.

[0121] The above describes the embodiments of the present invention with reference to specific examples. However, the present invention is not limited to these specific examples. For example, the specific configurations of each element, such as the substrate, intermediate layer, first layer, semiconductor region, electrode, and insulating member, contained in the wafer or semiconductor device are included in the scope of the present invention as long as a person skilled in the art can carry out the present invention in a similar manner and obtain the same effects by appropriately selecting them from the known range.

[0122] Furthermore, any combination of two or more elements of each of the specific examples, within the scope of technical feasibility, is also included within the scope of the present invention as long as it includes the gist of the present invention.

[0123] In addition, all wafers, semiconductor devices, wafer manufacturing methods, and semiconductor device manufacturing methods that can be implemented by a person skilled in the art by appropriate design modifications based on the wafers, semiconductor devices, wafer manufacturing methods, and semiconductor device manufacturing methods described above as embodiments of the present invention also fall within the scope of the present invention as long as they include the gist of the present invention.

[0124] In addition, within the scope of the concept of the present invention, a person skilled in the art may conceive of various modifications and alterations, and it will be understood that these modifications and alterations also fall within the scope of the present invention.

[0125] Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are included in the scope of the invention and its equivalents described in the claims. [Explanation of symbols]

[0126] 10L...crystal layer, 10a, 10b...first and second SiC regions, 10p...SiC region, 10q...inter-SiC region, 10s...substrate, 10sa, 10sb...first and second substrate parts, 10sp...part, 10sq...other parts, 11...first layer, 11B...intermediate region, 11F...(11-21) plane, 11a, 11b...first and second partial regions, 12-15...second to fifth semiconductor regions, 12A...termination region, 12p...part, 12q...other part, 51-53...first to third electrodes, 51M...conductive material, 61...first intermediate layer, 61a-61c...first to third layered region, 61d...altered region, 61s...first intermediate layer substrate, 62...second intermediate layer, 65...support member, 66...resin layer, 68...electromagnetic wave, 69...ion, 69B...first element, 81, 82...first and second insulating members, θ1...angle, 110, 110A to 110D, 111 to 113...semiconductor device, 210, 211...wafer, C1...concentration, L1...length, Pm1...curvature parameter, Pm2...maximum value, RR1...thickness ratio, Ra...surface roughness, t0...thickness, t1 to t4...first to fourth thicknesses

Claims

1. A substrate including a plurality of SiC regions including SiC and an inter-SiC region including Si provided between the plurality of SiC regions; A crystal layer, the crystal layer including a first layer including SiC, and a first intermediate layer including SiC provided between the substrate and the first layer in a first direction, the first layer including nitrogen at a first layer concentration, the first intermediate layer concentration of nitrogen being higher than the first layer concentration; Equipped with A wafer, wherein an angle between a (11-21) plane in the first layer and a plane perpendicular to a direction from the first intermediate layer toward the first layer is 4.5 degrees or less.

2. 2. The wafer according to claim 1, wherein the first intermediate layer concentration is at least five times the first layer concentration.

3. The first layer concentration is 1×10 １５ cm －３ Above 2 x 10 １７ cm －３ is as follows: The first intermediate layer concentration is 1×10 １８ cm －３ Above 5 x 10 １９ cm －３ 3. The wafer according to claim 1 or 2, wherein:

4. A wafer according to any one of claims 1 to 3, wherein a first thickness of the first layer along the first direction is 0.2 to 2 times the second thickness of the first intermediate layer along the first direction.

5. 5. The wafer according to claim 1, wherein a first thickness of the first layer along the first direction is not less than 10 μm and not more than 80 μm.

6. 6. The wafer according to claim 1, wherein the thickness of the first intermediate layer along the first direction is 20 μm or more and 80 μm or less.

7. 7. The wafer according to claim 1, wherein a third thickness of the substrate along the first direction is four times or more the thickness of the crystal layer along the first direction.

8. the substrate includes a plurality of the inter-SiC regions; 8. The wafer according to claim 1, wherein an average length of the plurality of inter-SiC regions along a direction perpendicular to the first direction is 0.3 μm or less.

9. 9. The wafer according to claim 1, wherein the basal plane dislocation density in the first intermediate layer is higher than the basal plane dislocation density in the first layer.

10. A second intermediate layer is provided between the substrate and the first intermediate layer and includes SiC; 10. The wafer according to claim 1, wherein a second intermediate layer concentration of nitrogen in the second intermediate layer is higher than a first intermediate layer concentration.

11. A first electrode electrically connected to the first intermediate layer obtained by removing at least a portion of the substrate of the wafer according to any one of claims 1 to 10; the first intermediate layer after at least a portion of the substrate has been removed; The first layer; A semiconductor device comprising:

12. forming a first layer containing SiC on a first intermediate layer substrate which is to become a first intermediate layer containing SiC, the first layer containing nitrogen at a first layer concentration, the first intermediate layer concentration of nitrogen in the first intermediate layer substrate being higher than the first layer concentration, the first intermediate layer substrate including a first layer region and a second layer region, the first layer region being between the second layer region and the first layer, removing the second layer region; A method for manufacturing a wafer, comprising bonding the remaining first layer region to a substrate, the substrate including a plurality of SiC regions containing SiC and an inter-SiC region containing Si provided between the plurality of SiC regions.

13. said removing said second layer region further comprises forming a third layer region between said first layer region and said second layer region after said forming of said first layer; The method for producing a wafer according to claim 12 , wherein the crystallinity in the third layer region is lower than the crystallinity in the first layer region and lower than the crystallinity in the second layer region.

14. 14. The method of claim 13, wherein the forming of the third layer region includes irradiating the first intermediate layer substrate with electromagnetic waves to form the third layer region.

15. 15. The method for producing a wafer according to claim 12, further comprising removing and planarizing a portion of the remaining first layer region after the removal of the second layer region and before the bonding.

16. and polishing the substrate with a plurality of abrasive grains prior to the bonding of the substrate.

16. The method for producing a wafer according to claim 12, wherein an average diameter of the plurality of abrasive grains is 0.5 μm or more.

17. the substrate includes a first substrate portion and a second substrate portion; the first substrate portion includes a plurality of SiC regions including SiC, and an inter-SiC region including Si provided between the plurality of SiC regions, the second substrate portion is provided on a surface of the first substrate portion, the second substrate portion comprises polycrystalline SiC; 17. The method for producing a wafer according to claim 12, wherein a nitrogen concentration in the second substrate portion is higher than a nitrogen concentration in the first intermediate layer.

18. A first element including at least one selected from the group consisting of B, Al, and Ga is introduced into at least a portion of the first layer of the wafer according to any one of claims 1 to 10; A method for manufacturing a semiconductor device, comprising the steps of: after the introduction, performing a heat treatment at a temperature of 1600° C. or higher.

19. removing at least a portion of the substrate after the heat treatment; The method for manufacturing a semiconductor device according to claim 18 , further comprising forming a first electrode on a surface exposed by the removal of the at least part of the substrate.

20. After the heat treatment, a portion of the substrate is removed and another portion of the substrate is left; The method for manufacturing a semiconductor device according to claim 18 , further comprising forming a first electrode on a surface exposed by the removal of the portion of the substrate.

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