Method for manufacturing a semiconductor device, a semiconductor device and a template substrate

Abstract

To provide a method for manufacturing a conductive element and a semiconductor element substrate that achieve a semiconductor element layer having an excellent quality with a simple support structure.SOLUTION: A method for manufacturing a semiconductor element includes the steps of: forming a first semiconductor layer (SL1) and a second semiconductor layer (SL2) having a larger thickness than the first semiconductor layer (SL1) on a grounding substrate (UK) arranged on its surface with a mask layer (ML) including a first opening (K1) and a second opening (K2); forming a first device layer (DL1) and a second device layer (DL2); and joining the first device layer and the second device layer to a support substrate (SK).SELECTED DRAWING: Figure 13

Description

[Technical field]

[0001] The present disclosure relates to a method for manufacturing a semiconductor device, a semiconductor device assembly, and a semiconductor device substrate. [Background technology]

[0002] A technique is known in which a growth mask having a plurality of openings is formed on a GaN substrate, a plurality of island-shaped GaN-based semiconductor layers are grown from the GaN substrate and extend onto the growth mask, and then the GaN-based semiconductor layers are peeled off from the GaN substrate (see, for example, Patent Document 1 listed below).

[0003] Patent Document 1 discloses a technique for providing a spacer on the outer periphery of a bonding surface when bonding a GaN semiconductor layer formed by epitaxial lateral overgrowth (ELO) of a base substrate to a support substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2013-251304 A Summary of the Invention

[0005] The method for manufacturing a semiconductor device according to the present disclosure includes a mask layer forming step of forming, on a base substrate, a mask layer having a first mask portion in which two adjacent openings are positioned with a predetermined first interval therebetween, and a second mask portion in which two adjacent openings are positioned with a predetermined second interval therebetween that is larger than the first interval; an element forming step of growing a semiconductor layer on the mask layer to form a semiconductor element; a preparation step of preparing a support substrate having a bonding surface to be opposed to the base substrate; a bonding step of bonding an upper surface of the semiconductor element to the bonding surface of the support substrate; and a peeling step of peeling the semiconductor element formed on the mask layer from the base substrate.

[0006] The semiconductor device body of the present disclosure includes a first semiconductor device layer formed on the growth surface of the base substrate and having a predetermined first height dimension in a direction perpendicular to the growth surface; a second semiconductor element layer formed on a growth surface of the base substrate and having a predetermined second height dimension greater than the first height dimension; A support substrate having a bonding surface bonded to an upper surface of the second semiconductor element layer. [Brief description of the drawings]

[0007] [Figure 1] 1 is a cross-sectional view showing a configuration of a semiconductor element according to a first embodiment of the present disclosure. [Diagram 2] 2 is a cross-sectional view showing a part of a semiconductor element assembly as viewed from the cross-sectional line II-II in FIG. [Diagram 3] 1A to 1C are process diagrams for explaining basic manufacturing procedures of a method for manufacturing a semiconductor element. [Figure 4] 1(a) to 1(c) are cross-sectional views illustrating steps of forming an element according to the first embodiment. [Diagram 5] 1 is a photograph of a semiconductor element layer formed on a base substrate. [Figure 6] 13 is a graph showing the inclination of the upper surface of a semiconductor element layer. [Figure 7] 4A to 4C are cross-sectional views showing a preparation step according to the first embodiment. [Figure 8] 5(a) and 5(b) are cross-sectional views showing a bonding step according to the first embodiment. [Figure 9] 5A to 5C are cross-sectional views showing a peeling step according to the first embodiment. [Figure 10] 10(a) to 10(c) are cross-sectional views illustrating element formation steps of a semiconductor element assembly according to a second embodiment of the present disclosure. [Figure 11] FIG. 11 is a cross-sectional view showing a configuration of a semiconductor element according to a third embodiment of the present disclosure. [Figure 12]12 is a cross-sectional view of the semiconductor element body taken along the cutting line XII-XII in FIG. 11. [Figure 13] 10A to 10C are cross-sectional views showing a method for manufacturing a semiconductor device according to a fourth embodiment. [Figure 14] FIG. 13 is a plan view showing an example of the configuration of a mask layer according to a fourth embodiment. [Figure 15] FIG. 13 is a plan view showing another configuration of the mask layer according to the fourth embodiment. [Figure 16] FIG. 11 is a cross-sectional view showing an example of the configuration of a base substrate according to a fourth embodiment. [Figure 17] FIG. 13 is a plan view showing a configuration example of a semiconductor element substrate according to a fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the schematic drawings.

[0009] 3, the semiconductor element of this embodiment can be manufactured through steps including, for example, a mask layer forming step S1, an element forming step S2, a preparation step S3, a bonding step S4, and a peeling step S5. However, the element forming step S2 and the preparation step S3 do not have to be performed in this order. For example, the element forming step S2 and the preparation step S3 may be performed in parallel.

[0010] The following description will be given with reference to FIG. 1 to FIG.

[0011] In the mask layer formation step S1, a mask 12 is formed. The mask 12 has a first mask portion 121 and a second mask portion 122. In the first mask portion 121, two adjacent openings 12b are positioned on the base substrate 11 with a predetermined first distance ΔL1 between them. In the second mask portion 122, two adjacent openings are positioned with a predetermined second distance ΔL2 between them that is larger than the first distance ΔL1.

[0012] In the element formation step S2, a semiconductor element layer 13, which is a crystal growth layer of a semiconductor crystal, is vapor-phase grown on the growth surface 11a exposed from the openings 12b. The semiconductor element layer 13 of the present disclosure is a nitride semiconductor layer. The semiconductor element layer 13 has connection parts 13b connected to the growth surfaces 11a exposed from the openings 12b of the mask layer 12. A semiconductor layer is grown on the mask layer 12 to form a semiconductor element 15.

[0013] In the preparation step S3, a support substrate 16 is prepared, which has a bonding surface 16c disposed on the base substrate 11 side. In the bonding step S4, an upper surface 15a of the semiconductor element 15 is bonded to the bonding surface 16c of the support substrate 16. In the peeling step S5, the semiconductor element 15 formed on the mask layer 12 is peeled off from the base substrate 11.

[0014] (First embodiment) FIG. 4 is a cross-sectional view showing an element formation process according to the first embodiment. As shown in FIG. 4(a), a base substrate 11 is prepared. For example, a GaN template substrate can be used as the base substrate 11. The base substrate 11 is an off-substrate, and the normal of the growth surface 11a of the base substrate 11 is inclined by 0.3° from the a-axis <11-20> direction. In this embodiment, the off-angle with respect to the a-axis is 0.3°, but a substrate with an off-angle of 0.1° to 1° can be used. However, the upper limit of the off-angle is a value appropriately selected within the range in which flat growth is achieved depending on the device, and is not necessarily 1°, and may be set to more than 1°. In addition, if the off-angle is less than 0.1°, there is a risk that the ELO semiconductor layer cannot be peeled off, so it is preferable that the off-angle is 0.1° or more. In addition, the upper limit of the off-angle, 1°, is a standard LED substrate off-angle,

[0015] For example, a GaN substrate cut from a GaN single crystal ingot may be used as the base substrate 11 so that the growth surface 11a of the base substrate 11 is in a predetermined plane direction. The base substrate 11 may be a nitride semiconductor substrate. It may also be an n-type substrate or a p-type substrate in which impurities are doped into the nitride semiconductor.

[0016] Here, the "nitride semiconductor" is, for example, Al X Ga Y In Z N (0≦X≦1; 0≦Y≦1; 0≦Z≦1; X+Y+Z=1). As the GaN template substrate, for example, sapphire, Si or SiC can be used as the base.

[0017] Next, a mask layer 12 is formed on the base substrate 11. The material of the mask layer 12 is, for example, silicon oxide (e.g., SiO2, etc.), silicon nitride (SiN X ) or a high melting point metal (Ti, W, etc.). The mask layer 12 may be formed by, for example, a PCVD (Plasma Chemical Vapor Deposition) method or the like. In the present disclosure, for example, a SiO2 layer is laminated on the growth surface 11a to a thickness of about 100 nm. Then, for example, the SiO2 layer is patterned by photolithography and wet etching using buffered hydrofluoric acid (Buffered Hydrogen Fluoride; BHF), or the like. As a result, the mask layer 12 shown in FIG. 4(a) is formed.

[0018] The mask layer 12 is, for example, striped with multiple long stripes 12a arranged in parallel at predetermined intervals in a direction perpendicular to the paper surface. In the present disclosure, the width of the opening 12b between adjacent stripes 12a is, for example, about 5 μm. The width of the stripes 12a is, for example, about 50 μm to 200 μm. The width of the opening 12b is, for example, about 2 μm to 20 μm.

[0019] The mask layer 12 can be formed from a material other than SiO2, such as a material grown by vapor phase deposition. The mask material may be any material that does not allow a semiconductor layer to grow easily. For example, the mask material may be ZrO X , TiO X or AlO X or oxides such as W or C It is also possible to use a transition metal such as r. Furthermore, the mask 12 can be laminated by a method suitable for the mask material, such as vapor deposition, sputtering, or coating and curing.

[0020] 4(b), a semiconductor element layer 13, which is a crystal growth layer of a semiconductor crystal, is grown by vapor phase growth from the growth surface 11a exposed from the opening 12b. The semiconductor element layer 13 of the present disclosure is a nitride semiconductor layer.

[0021] The crystal growth method can be vapor phase epitaxy (VPE) by chloride transport method using chloride as group III raw material, or metal organic chemical vapor deposition (MOCVD) using organic metal as group III raw material. By changing the ratio of the group III element raw material gas and the ratio of the impurity raw material gas during the growth process, the semiconductor element layer 13 can be formed as a multilayer film that functions as an LED (Light Emitting Diode) or LD (Laser Diode).

[0022] When the grown crystal exceeds the opening 12b of the mask layer 12, the crystal is also grown laterally along the upper surface 12c of the mask layer. The crystal growth is terminated before the semiconductor element layer 13 grown from the growth surface 11a overlaps with the adjacent semiconductor element layers 13. In this manner, the semiconductor element layer 13 is obtained by growing the nitride semiconductor by the ELO (Epitaxial Lateral Overgrowth) method. The width of the semiconductor element layer 13 is, for example, about 50 μm to 200 μm, and the height is about 10 μm to 50 μm.

[0023] Fig. 5 is a photograph showing a specific example of semiconductor element layer 13 formed on base substrate 11, and is a top view of semiconductor element layer 13 formed on mask layer 12 by the above-mentioned method. Fig. 6 is a graph showing the inclination of the top surface of semiconductor element layer 13, and shows the measurement results of measuring the distance between the top surface of semiconductor element layer 13 shown in Fig. 1 and a reference plane.

[0024] The width W of the strip-shaped semiconductor element layer 13 is 35 μm, the right end side is higher than the left end side in the width direction, and the height difference between the two ends is 150 nm. The inclination angle of the first surface 13a (upper surface) of the semiconductor element layer 13 is 0.25°. The off-angle of the base substrate 11 used for growing this semiconductor element layer 13 is 0.22°, and the inclination angle of the first surface 13a corresponds to the off-angle of the base substrate 11.

[0025] In this way, growing the semiconductor element layer 13 with an off-angle on the base substrate 11 is preferable for realizing a high-quality crystalline semiconductor element layer 13. The semiconductor element layer 13 has a first surface 13a and a second surface 13c located on the opposite side to the first surface 13a.

[0026] After the semiconductor element layer 13 is grown, as shown in FIG. 4(b), a metal layer 14 is formed on the first surface 13a of the semiconductor element layer 13. First, the base substrate 11, the mask layer 12, and the entire upper surface of the semiconductor element layer 13 are covered with a photoresist film. Then, an opening 12b is provided by photolithography so that the first surface 13a of the semiconductor element layer 13 is exposed. Then, a Cr layer and an AuSn layer, which is an alloy of gold and tin, are vapor-deposited in this order in the opening 12b. Then, unnecessary metal layers are removed together with the photoresist film by a lift-off method to form the metal layer 14. The thickness of this metal layer 14 is about 1 μm to 5 μm.

[0027] After forming the metal layer 14, the base substrate 11, the mask layer 12 formed on the base substrate 11, the semiconductor element layer 13, and the metal layer 14 are immersed in BHF for about 10 minutes to remove the mask layer 12. As a result, a semiconductor element 15 is formed on the base substrate 11, as shown in FIG. 4(c). The semiconductor element 15 and the base substrate 11 are connected to the base substrate 11 via a connection portion 13b, which is a part of the semiconductor element layer 13 grown in the opening portion 12b of the mask layer 12. The connection portion 13b is, for example, columnar. The metal layer 14 can be used as an electrode of the semiconductor element 15.

[0028] However, depending on the configuration of the semiconductor element 15, the metal layer 14 does not necessarily have to be used as an electrode. The upper surface 15a of the semiconductor element 15 is inclined similarly to the first surface 13a of the semiconductor element layer 13. The semiconductor element layer 13 has the first surface 13a and a second surface 13c located on the opposite side to the first surface 13a.

[0029] 7 is a cross-sectional view showing a preparation step according to the first embodiment. Next, a support substrate 16 for connection to a semiconductor element 15 is prepared. The support substrate 16 uses a silicon substrate as a base 16a. A metal layer 16b made of Au or the like that is resistant to oxidation is located on one surface of the base 16a, and the surface of the metal layer 16b that faces the base substrate 11 is a bonding surface 16c. The metal layer 16b makes it easy to bond the semiconductor element 15 to the support substrate 16. The metal layer 16b can be made of a precious metal material that is resistant to oxidation, such as Pt or Pd, other than Au, or a material that contains it as a main component, but is not limited to these.

[0030] Next, a substrate bonding device (not shown) is used to connect the semiconductor element 15 to the support substrate 16. First, the base substrate 11 and the support substrate 16 are attached to the substrate bonding device so that the growth surface 11a of the base substrate 11 and the bonding surface 16c of the support substrate 16 are parallel to each other.

[0031] 8 is a cross-sectional view showing the bonding step according to the first embodiment. Next, as shown in FIG. 8(a), the support substrate 16 is placed on the metal layer 14 formed in the step of forming the metal layer 14 with the bonding surface 16c facing each other, and the bonding surface 16c of the support substrate 16 is brought into contact with the upper surface 15a of the semiconductor element 15. As described above, since the first surface 13a of the semiconductor element layer 13 is inclined, the upper surface 15a of the semiconductor element 15, which is the upper surface of the metal layer 14 formed thereon, is also inclined.

[0032] 8(b), the support substrate 16 is pressed to bring the metal layer 14 into intimate contact with the support substrate 16, and then the metal layer 14 is heated to 300°C to perform AuSn bonding. However, the bonding using the metal layer 14 is not limited to AuSn bonding, and various bonding methods using other materials with low melting points similar to AuSn (e.g., AuIn, AuGe, InPd, or InSn) are possible. Bonding may also be performed using the metal layer 14 containing one or more of AuSn and AuCu, which have excellent thermal conductivity and function as a heat sink. At this time, the semiconductor element 15 is displaced so that the entire upper surface 15a of the semiconductor element 15 abuts against the bonding surface 16c. This may cause a large stress to be generated in the connection portion 13b of the semiconductor element layer 13, causing the connection portion 13b to break.

[0033] 9 is a cross-sectional view showing the peeling step according to the first embodiment. After cooling the base substrate 11 and the support substrate 16 by a substrate bonding device or the like, the base substrate 11 and the support substrate 16 are removed from the substrate bonding device. At this time, the semiconductor element 15 is bonded onto the support substrate 16, and the connection portion 13b is broken, so that the base substrate 11 can be easily peeled off. In the drawing, the columnar connection portion 13b is attached to the semiconductor element layer 13. Depending on the state of the breakage, the connection portion 13b may remain on the base substrate 11 side, the semiconductor element 15 side, or both. Therefore, the connection portion 13b remaining on the semiconductor element 15 after peeling may be removed by polishing or the like.

[0034] In the semiconductor element body 17 bonded and peeled by the above method, the first surface 13a of the semiconductor element layer 13 is parallel to the bonding surface 16c, which is the surface of the support substrate 16. On the other hand, the second surface 13c of the semiconductor element layer 13 is inclined with respect to the surface of the support substrate 16 in accordance with the inclination of the first surface 13a of the semiconductor element layer 13. Here, the first surface 13a of the semiconductor element layer 13 is considered to be parallel with respect to the surface of the support substrate 16 if the inclination is, for example, less than 0.5°.

[0035] Thus, the semiconductor element body 17 of the first embodiment has the support substrate 16, the first surface 13a and the second surface 13c located on the opposite side to the first surface 13a, and is fixed to the support substrate 16 on the side of the first surface 13a. The semiconductor element body 17 is provided with a semiconductor element layer 13 whose second surface 13c is inclined with respect to the surface of the support substrate 16. This makes it possible to realize a high-quality semiconductor element layer 13 with a simple support structure.

[0036] In this way, since semiconductor element 15 has upper surface 15a inclined with respect to growth surface 11a of base substrate 11, when pressure is applied in bonding step S3, shear stress is concentrated at the ends of columnar connection portions 13b, which are sheared. Therefore, semiconductor element 15 can be separated from base substrate 11 simply by applying pressure, without applying a separate large force perpendicular to the surface of base substrate 11 using ultrasound or the like. In this way, semiconductor element 15 can be reliably transferred to support substrate 16 without applying excessive force to semiconductor element 15, and the yield of semiconductor elements 15 can be improved.

[0037] Second embodiment 10 is a cross-sectional view showing an element formation process of a semiconductor element according to the second embodiment of the present disclosure. As shown in FIG. 10(a), first, a base substrate 21 is prepared. As in the first embodiment, a GaN template substrate is used as the base substrate 21. However, the crystal plane of the growth surface 21a of the base substrate 21 has no off-angle. A mask layer 22 is formed in the same process as in the first embodiment. The growth surface 21a is exposed through the opening 22b of the strip 22a of the mask layer 22.

[0038] 10(b), similarly to the first embodiment, a semiconductor element layer 23, which is a crystal growth layer of a nitride semiconductor, is vapor-grown from the growth surface 20a exposed from the opening 22b of the strip 22a. Thereafter, a metal layer 24, such as an AuSn alloy, is formed on the first surface 23a of the semiconductor element layer 23.

[0039] 10(c), the mask layer 22 on the base substrate 21 is etched to form a semiconductor element 25 on the base substrate 21. A first surface 23a of the semiconductor element layer 23 and an upper surface 25a of the semiconductor element 25 are substantially parallel to the growth surface 21a of the base substrate 21. In the second embodiment, similarly to the first embodiment, the semiconductor element layer 23 has a first surface 23a and a second surface 23c located on the opposite side thereof.

[0040] Third embodiment FIG. 11 is a cross-sectional view showing a schematic configuration of a semiconductor element body according to a third embodiment of the present disclosure. FIG. 12 is a cross-sectional view of the semiconductor element body taken along the line XII-XII in FIG. 11. The same reference numerals are used for parts corresponding to the above-described embodiments, and duplicated explanations are omitted. In the above-described embodiment, the openings 12b extend parallel to each other in a stripe shape. However, in other embodiments of the present disclosure, the openings 12b1 may be formed at regular intervals in the <1-100> direction (for example, the vertical direction in FIG. 12) in the part where the semiconductor element layer 13 used as a spacer for the base substrate 11 of the support substrate 16 is to be formed. According to such openings 12b1, it is not necessary to form the semiconductor element layer 13 that serves as the sacrificial layer described above, and unnecessary crystal growth of semiconductor is not performed, thereby improving productivity.

[0041] As described above, the method for manufacturing a semiconductor device disclosed herein includes a mask layer forming step of forming, on a base substrate, a mask layer having a first mask portion in which two adjacent openings are positioned with a predetermined first interval therebetween, and a second mask portion in which two adjacent openings are positioned with a predetermined second interval that is larger than the first interval; an element forming step of growing a semiconductor layer on the mask layer to form a semiconductor element; a preparation step of preparing a support substrate having a bonding surface to be opposed to the base substrate; a bonding step of bonding an upper surface of the semiconductor element to the bonding surface of the support substrate; and a peeling step of peeling the semiconductor element formed on the mask layer from the base substrate.

[0042] When spacers are used to form a GaN semiconductor layer by epitaxial vapor phase growth, the variation in height of the GaN semiconductor layer has an in-plane distribution. Therefore, if spacers of the same height are used over the entire surface, the amount of protrusion of the bonding layer from the GaN semiconductor layer varies depending on the location. If the amount of protrusion of the bonding layer is large, for example, if the semiconductor element constructed with the GaN semiconductor layer is a semiconductor laser, the protruding part of the bonding layer may cover the emission end face of the semiconductor element, which may reduce the manufacturing yield. Therefore, a manufacturing method of a semiconductor element and a semiconductor element body that can improve the manufacturing yield are desired.

[0043] According to the method for manufacturing a semiconductor device disclosed herein, the growth rate of the semiconductor device layer is faster in the second mask portion on the base substrate, which is spaced apart from the first mask portion, and the thickness of the semiconductor device layer can be increased. This makes it possible to keep the amount of protrusion of the metal layer between the upper surface of the semiconductor device layer and the bonding surface of the support substrate constant, thereby improving the manufacturing yield.

[0044] (Fourth embodiment) FIG. 13 is a cross-sectional view showing a method for manufacturing a semiconductor device according to the fourth embodiment. FIG. 14 is a plan view showing a configuration example of a mask layer according to the fourth embodiment. As shown in FIG. 13 and FIG. 14, the method for manufacturing a semiconductor device according to the fourth embodiment includes the steps of preparing a base substrate UK having a mask layer ML including a first opening K1 and a second opening K2 adjacent to each other in a first direction (X direction) on a surface thereof, forming a first semiconductor layer SL1 on the base substrate UK by, for example, an ELO method, the first semiconductor layer SL1 overlapping the first opening K1 in a planar view, and forming a second semiconductor layer SL2 on the base substrate UK by, for example, an ELO method, the second semiconductor layer SL2 overlapping the second opening K2 in a planar view, and having a thickness greater than that of the first semiconductor layer SL1. The first and second semiconductor layers SL1 and SL2 may be formed by the same film formation process (for example, an ELO process).

[0045] The mask layer ML includes a first mask portion M1, a second mask portion M2 that is adjacent to the first mask portion M1 via a first opening K1 and is wider than the first mask portion M1 (W1 < W2), and a third mask portion M3 that is adjacent to the second mask portion M2 via a second opening K2. The first and second openings K1 and K2 are slit-shaped with the Y direction (second direction) orthogonal to the X direction as the longitudinal direction. The substrate having the underlying substrate UK and the mask layer ML may be referred to as a template substrate TS. The underlying substrate UK and the first and second semiconductor layers SL1 and SL2 include, for example, nitride semiconductors. The first and second openings K1 and K2 expose the upper surface (seed portion) of the underlying substrate UK and have the function of growth start holes for starting the growth of the first and second semiconductor layers SL1 and SL2, and the mask portions M1 to M3 have the function of selective growth masks for laterally growing the first and second semiconductor layers SL1 and SL2. The mask portion and the opening mean a portion with a mask body and a portion without a mask body, and it does not matter whether the mask portion is layered. Also, the entire opening does not have to be surrounded by the mask portion.

[0046] In FIGS. 13 and 14, the width direction is the X direction. For example, the width W3 of the third mask portion M3 is equal to the width W2 of the second mask portion M2, and the widths of the first and second openings K1 and K2 are equal. In this process, the thickness of the second semiconductor layer SL2 where the raw material supply is increased is larger than the thickness of the first semiconductor layer SL1. Also, by periodically arranging the combined configuration of the first and second semiconductor layers SL1 and SL2 in the plane, the thickness of the second semiconductor layer SL2 is large in the region where the thickness of the first semiconductor layer SL1 is large, and the thickness of the second semiconductor layer SL2 is small in the region where the thickness of the first semiconductor layer SL1 is small. In the plane, the difference (height difference) in the thicknesses of the first and second semiconductor layers SL1 and SL2 is made uniform. Note that the width (length in the X direction) of the second semiconductor layer SL2 may be larger than the width of the first semiconductor layer SL1.

[0047] After forming the first and second semiconductor layers SL1 and SL2, a step of forming a first device layer DL1 on the first semiconductor layer SL1 and a step of forming a second device layer DL2 on the second semiconductor layer SL2 are performed. This forms a semiconductor element substrate HK1. The first and second device layers DL1 and DL2 may be formed by the same film formation process. Each of the first and second device layers DL1 and DL2 may include an n-type semiconductor layer, an active layer, and a p-type semiconductor layer.

[0048] After forming the first and second device layers DL1 and DL2, a step of forming a first metal layer CL1 on the first device DL1 and a step of forming a second metal layer CL2 on the second device layer DL2 are performed. The first and second metal layers CL1 and CL2 may be formed by the same film formation process. For example, since the first and second device layers DL1 and DL2 have approximately the same thickness, the top surface of the second metal layer CL2 is positioned higher than the top surface of the first metal layer CL1.

[0049] After the first and second metal layers CL1 and CL2 are formed, a process is performed in which the first and second metal layers CL1 and CL2 are brought into contact with a support substrate SK in a molten state and then hardened, thereby bonding the first and second device layers DL1 and DL2 to the support substrate SK via the first and second metal layers CL1 and CL2. During bonding, the second semiconductor layer SL2 and the second device layer DL2 function as spacers, and the second metal layer CL2 becomes thinner than the first metal layer CL1.

[0050] The second metal layer CL2 may contact an end face of the second device layer DL2 (a surface having a normal parallel to the X-direction or Y-direction). The second metal layer CL2 enhances the bonding strength with the support substrate SK. The end face of the first device layer DL1 (for example, a surface having a normal parallel to the Y-direction) may include a laser light emission surface. As described above, the difference in thickness (height difference) between the first and second semiconductor layers SL1 and SL2 is uniformed within the plane, thereby reducing the risk that the first metal layer CL1 will contact the end face of the first device layer DL1. The second semiconductor layer SL2 and the second device layer DL2 may be, but are not limited to, sacrificial layers (not used as semiconductor layer elements). Depending on the configuration of the second device layer DL2, it may be used as a semiconductor element.

[0051] Furthermore, when the first and second device layers DL1 and DL2 are bonded to the support substrate SK, stress is applied to the first and second semiconductor layers SL1 and SL2, weakening the bonding strength between the fixed base substrate UK and the first and second semiconductor layers SL1 and SL2 (e.g., the bond breaks).

[0052] The first and second metal layers CL1 and CL2 may be bonded to a third metal layer KL located on a supporting substrate SK. The first metal layer CL1 may be an electrode (anode or cathode) on the first device layer DL1.

[0053] For example, when the first and second device layers DL1 and DL2 are bonded to the support substrate SK, the top surfaces of the first and second metal layers CL1 and CL2 may be inclined at about 0.05° to 5° with respect to the support substrate SK. This inclination is due to, for example, the off-angle of the base substrate UK, and effectively generates an upward stress in the first and second semiconductor layers SL1 and SL2 when the first and second device layers DL1 and DL2 are bonded to the support substrate SK.

[0054] After bonding the support substrate SK, a process is performed to separate the first and second semiconductor layers SL1 and SL2 from the base substrate UK. This forms the semiconductor element substrate HK2. Before separating the first and second semiconductor layers SL1 and SL2, the mask layer ML (first to third mask portions M1 to M3) may be removed by etching or the like. Since the mask layer ML and the first and second semiconductor layers SL1 and SL2 may adhere to each other due to van der Waals forces or mutual diffusion of constituent elements, the first and second semiconductor layers SL1 and SL2 can be easily separated by removing the mask layer ML. Note that in the present disclosure, the mask layer ML is removed after bonding the support substrate SK.

[0055] The mask layer ML (first to third mask portions M1 to M3) may be removed by etching or the like before bonding the support substrate SK. Since the mask layer ML is exposed on the surface before bonding, the mask layer ML can be easily removed from the entire surface of the semiconductor element substrate by wet etching. Furthermore, before separating the first and second semiconductor layers SL1 and SL2, the first semiconductor layer SL1 and the first device layer DL1 may be divided into a plurality of semiconductor element portions aligned in the Y direction.

[0056] Fig. 15 is a plan view showing another configuration of the mask layer according to the fourth embodiment. The mask layer ML is not limited to that shown in Fig. 14. For example, as shown in Fig. 15, the length of the second opening K2 in the Y direction perpendicular to the first direction (X direction) may be smaller than the length of the first opening K1. The second opening K2 is formed, for example, in a mask portion M4 adjacent to the slit-shaped first opening K1, and the widths of the first and second openings K1·K2 are equal, for example.

[0057] In this case, the thickness of the second semiconductor layer SL2 that grows over the second opening K2 (grows faster in the Z direction than in the X direction) is greater than the thickness of the first semiconductor layer SL1. In the region where the thickness of the first semiconductor layer SL1 is greater, the thickness of the second semiconductor layer SL2 is also greater, and in the region where the thickness of the first semiconductor layer SL1 is smaller, the thickness of the second semiconductor layer SL2 is also smaller, so that the difference in thickness (height difference) between the first and second semiconductor layers SL1 and SL2 is uniformed within the surface. In FIG. 15, the width (length in the X direction) of the second semiconductor layer SL2 is smaller than the width of the first semiconductor layer SL1.

[0058] In the fourth embodiment, the base substrate UK may include a nitride semiconductor (GaN-based semiconductor, AlN, InN, AlInN, BN, etc.), and the first and second semiconductor layers SL1 and SL2 may include a nitride semiconductor, for example a GaN-based semiconductor (GaN, AlGaN, InGaN, AlInGaN, etc.). In this case, the thickness direction (Z direction) of the first and second semiconductor layers SL1 and SL2 may be a nitride semiconductor. <0001> The first direction (X direction) in which the first and second openings K1 and K2 are aligned can be the <11-20> direction (a-axis direction) of the nitride semiconductor, and the Y direction can be the <1-100> direction (m-axis direction) of the nitride semiconductor.

[0059] 16 is a cross-sectional view showing an example of the configuration of a base substrate according to the fourth embodiment. The base substrate UK may be a GaN wafer cut from a bulk crystal of GaN, or a SiC wafer (hexagonal 6H-SiC or 4H-SiC) cut from a bulk crystal of SiC. An off-angle may be provided when the base substrate UK is cut from the bulk crystal.

[0060] The base substrate UK may have a heterogeneous substrate 1 having a lattice constant different from that of a GaN-based semiconductor, and an underlayer 4 (seed layer) formed on the heterogeneous substrate 1. In this case, the heterogeneous substrate 1 may be a silicon substrate and the underlayer 4 may be AlN or silicon carbide (6H—SiC or 4H—SiC), or the heterogeneous substrate 1 may be a silicon carbide substrate and the underlayer 4 may be a GaN-based semiconductor or AlN.

[0061] The base substrate UK may have a heterogeneous substrate 1 and an underlayer 4 formed on the heterogeneous substrate 1, and the underlayer 4 may have a lower buffer layer 2 and a seed layer 3 formed on the buffer layer 2. In this case, the heterogeneous substrate 1 may be a silicon substrate, the buffer layer 2 may include at least one of AlN and silicon carbide, and the seed layer 3 may be a GaN-based semiconductor. The buffer layer 2 may be made of BN (boron nitride), and the seed layer 3 may be made of AlN. The upper surface of the heterogeneous substrate 1 in FIG. 16 may have an off-angle.

[0062] 13 includes a first semiconductor layer SL1 including a nitride semiconductor, a first device layer DL1 overlapping the first semiconductor layer SL1 in a planar view, a first metal layer CL1 disposed on the first device layer DL1, a second semiconductor layer SL2 including a nitride semiconductor, a second device layer DL2 overlapping the second semiconductor layer SL2 in a planar view, and a second metal layer CL2 disposed on the second device layer DL2. The thickness of the second semiconductor layer SL2 is greater than the thickness of the first semiconductor layer SL1.

[0063] The semiconductor element substrate HK1 has an undersubstrate UK connected to the first and second semiconductor layers SL1 and SL2, and the first and second device layers DL1 and DL2 include a nitride semiconductor (e.g., a GaN-based semiconductor). The first and second semiconductor layers SL1 and SL2 may include the same nitride semiconductor (e.g., GaN). Since the first and second device layers DL1 and DL2 have approximately the same thickness, the top surface of the second metal layer CL2 is higher than the top surface of the first metal layer CL1. The semiconductor element substrate HK1 is provided with a mask layer ML in contact with the undersubstrate UK and the first and second semiconductor layers SL1 and SL2.

[0064] 13 includes a first semiconductor layer SL1 including a nitride semiconductor, a first device layer DL1 overlapping with the first semiconductor layer SL1 in a planar view, a first metal layer CL1 disposed on the first device layer DL1, a second semiconductor layer SL2 including a nitride semiconductor, a second device layer DL2 overlapping with the second semiconductor layer SL2 in a planar view, and a second metal layer CL2 disposed on the second device layer DL2. The thickness of the second semiconductor layer SL2 is greater than the thickness of the first semiconductor layer SL1.

[0065] The semiconductor element substrate HK2 has a support substrate SK that is joined to the first and second device layers DL1 and DL2 via the first and second metal layers CL1 and CL2, and the first and second device layers DL1 and DL2 include a nitride semiconductor (e.g., a GaN-based semiconductor). The first and second semiconductor layers SL1 and SL2 may include the same nitride semiconductor (e.g., GaN).

[0066] In the semiconductor element substrate HK2, the second metal layer CL2 may be configured to have a thickness smaller than that of the first metal layer CL1. The second metal layer CL2 may be in contact with an end face T2 of the second device layer DL2. The first device layer DL1 may have a light-emitting function, and the second device layer DL2 may be a sacrificial layer (without a light-emitting function). A third metal layer KL may be located on the support substrate SK, and the first and second metal layers CL1 and CL2 may be bonded to the third metal layer KL. The support substrate SK may be a mounting substrate (a drive substrate such as a TFT substrate).

[0067] In the semiconductor element substrates HK1 and HK2, the first and second semiconductor layers SL1 and SL2 may be aligned in the <11-20> direction (X direction) of the nitride semiconductor. The first semiconductor layer SL1 and the first device layer DL1 may form a semiconductor element section (e.g., a light emitting element section). The end face T1 of the first device layer DL1 may include an emission surface for laser light. The first metal layer CL1 may function as an electrode, for example, an anode.

[0068] Fig. 17 is a plan view showing a configuration example of a semiconductor element substrate according to the fourth embodiment. As shown in Fig. 17, the semiconductor element substrates HK1 and HK2 may have a plurality of regions AR, and a first semiconductor layer SL1 and a first device layer DL1, as well as a second semiconductor layer SL2 and a second device layer DL2, may be provided in each region AR. The semiconductor element substrates HK1 and HK2 may also have a plurality of semiconductor element portions HB (each including a first semiconductor layer SL1 and a first device layer DL1), and the plurality of semiconductor element portions HB may be aligned in at least one of the X direction and the Y direction.

[0069] Although the present disclosure has been described in detail above, the present disclosure is not limited to the above-described embodiments, and various modifications, improvements, etc. are possible without departing from the gist of the present disclosure. [Explanation of symbols]

[0070] 11 Underlying substrate 13 Semiconductor element layer 13a 1st page 13b Connection 13c 2nd side 14 Metal layer 15 Semiconductor elements 15a Top side 16 Support substrate 16c Joint surface 17 Semiconductor element body S1 Mask layer formation process S2 element formation process S3 preparation process S4 Joining process S5 Peeling process

Claims

1. A step of preparing a first substrate including a base substrate having a first seed portion and a second seed portion adjacent to each other in a first direction arranged on a surface thereof, a first semiconductor layer overlapping the first seed portion in a planar view, and a second semiconductor layer overlapping the second seed portion in a planar view and having a thickness greater than that of the first semiconductor layer; forming a first device layer overlying the first semiconductor layer and a second device layer overlying the second semiconductor layer; forming a first metal layer overlying the first device layer and a second metal layer overlying the second device layer; and bonding the first and second device layers to a second substrate via the first and second metal layers; A method for manufacturing a semiconductor device, wherein the second metal layer between the second device layer and the second substrate has a thickness less than the first metal layer between the first device layer and the second substrate.

2. The method for manufacturing a semiconductor device according to claim 1 , wherein the base substrate includes first and second mask portions overlapping the first semiconductor layer, the first and second mask portions being adjacent to each other in the first direction and having different lengths in the first direction.

3. 2. The method for manufacturing a semiconductor device according to claim 1, further comprising the step of isolating the first and second semiconductor layers from the base substrate after bonding the first and second device layers to the second substrate via the first and second metal layers.

4. a first semiconductor layer and a second semiconductor layer spaced apart from each other, a first device layer and a first metal layer overlapping the first semiconductor layer in a plan view, a second device layer overlapping the second semiconductor layer in a plan view, a second metal layer, and a support substrate bonded to the first metal layer and the second metal layer; the first semiconductor layer and the second semiconductor layer include a nitride semiconductor; A semiconductor device, wherein the second semiconductor layer has a thickness greater than a thickness of the first semiconductor layer.

5. an interface between the first metal layer and the first device layer, and an interface between the second metal layer and the second device layer; The semiconductor device of claim 4 , wherein an interface between the second metal layer and the second device layer is closer to the support substrate than an interface between the first metal layer and the first device layer.

6. The semiconductor device according to claim 4 or 5, wherein the second metal layer has a thickness smaller than that of the first metal layer.

7. The semiconductor device of claim 4, wherein the second metal layer contacts an end face of the second device layer.

8. The semiconductor device according to any one of claims 4 to 7, wherein the first device layer has a light emitting function, and the second device layer has no light emitting function.

9. The semiconductor device according to claim 4, wherein the first and second semiconductor layers are adjacent to each other in a first direction and have different lengths in the first direction.

10. 10. The semiconductor device according to claim 4, wherein an end face of the first device layer includes an emission face of laser light.

11. The semiconductor device according to any one of claims 4 to 10, wherein the first metal layer functions as an electrode.

12. The semiconductor device according to any one of claims 4 to 11, comprising a plurality of regions, each region being provided with the first and second semiconductor layers.

13. The semiconductor device according to claim 4, comprising a plurality of semiconductor element portions each including the first semiconductor layer and the first device layer.

14. The semiconductor device according to claim 4, wherein the thickness of the first metal layer is equal to or greater than the difference in thickness between the first semiconductor layer and the second semiconductor layer.

15. A substrate is provided. A template substrate comprising, on a surface of the base substrate, a first seed portion that serves as a growth starting point for a nitride semiconductor, a second seed portion spaced apart from the first seed portion in a first direction, and a non-seed portion located between the first seed portion and the second seed portion, wherein the second seed portion has a length in a second direction perpendicular to the first direction that is smaller than that of the first seed portion.

16. The template substrate according to claim 15 , wherein the first seed portion and the second seed portion have an equal length in the first direction.

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