Printing machine setup support device and method

Abstract

To make it possible to reduce time required for setup work performed in accordance with a change in a type of a board on which solder printing is performed by a printing machine.SOLUTION: An order in which solder printing is executed on a plurality of types of substrates B (1) to B (4) is determined on the basis of squeegee 61 (first printing condition) of a plurality of printing conditions (squeegee 61 and solder D) including the squeegee 61 and the solder D used to execute solder printing. Therefore, on the basis of the squeegee 61 prepared in accordance with the change of a substrate B on which solder printing is executed, the order of executing solder printing on the plurality of types of substrates B (1) to B (4) is made appropriate so that time required for a squeegee 61 preparation can be reduced.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a technology for assisting in the preparation of squeegees and solder for a printing machine that performs solder printing, in which a squeegee is slid over the top surface of a mask to which solder has been supplied, to print solder on a substrate placed below the mask. [Background technology]

[0002] For example, the printer described in Patent Document 1 can be used to print solder onto lands on a printed circuit board. This printer prints solder onto the board placed below the mask by sliding a squeegee over the top surface of a mask to which solder has been supplied (solder printing). In addition, when the type of board on which solder printing is to be performed by the printer is changed, a setup operation must be carried out to change the mask, squeegee, or solder to be set in the printer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2002-366613 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the time required for such setup work reduces the efficiency of solder printing on the board.

[0005] The present invention has been made in consideration of the above-mentioned problems, and aims to reduce the time required for setup work carried out in response to changes in the type of board on which solder printing is performed by a printer. [Means for solving the problem]

[0006] The printing press setup support device of the present invention includes a memory unit that stores printing condition information indicating a first printing condition for each type among a plurality of printing conditions including the squeegee and solder used to perform solder printing, when solder printing is scheduled to be performed on a plurality of types of substrates by a printing press that performs solder printing by sliding a squeegee over the top surface of a mask to which solder has been supplied, and a calculation unit that determines the order in which solder printing is performed on the plurality of types of substrates based on the first printing condition.

[0007] The printing machine setup support method of the present invention includes, when solder printing is to be performed on multiple types of boards using a printing machine that performs solder printing by sliding a squeegee over the top surface of a mask to which solder has been supplied, a step of determining an order in which solder printing is to be performed on multiple types of boards based on a first printing condition among multiple printing conditions including the squeegee and solder used to perform the solder printing.

[0008] The present invention (printing machine setup support device and method) configured in this manner determines the order in which solder printing is performed on multiple types of boards based on a first printing condition among multiple printing conditions including the squeegee and solder used to perform solder printing. Therefore, the order in which solder printing is performed on multiple types of boards can be optimized based on the first printing condition prepared in response to a change in the board on which solder printing is performed, thereby reducing the time required to prepare the first printing condition. As a result, it is possible to reduce the time required for setup work performed in response to a change in the type of board on which solder printing is performed by the printing machine.

[0009] The setup support device may be configured such that the calculation unit determines the order in which solder printing is performed on a plurality of types of boards such that solder printing is performed consecutively on boards of the same type having the same first printing conditions. In this configuration, solder printing can be performed consecutively on boards of the same type having the same first printing conditions without changing the first printing conditions. Therefore, it is possible to reduce the time required for setup work performed in response to a change in the type of board on which solder printing is performed by the printer.

[0010] The setup support device may be configured such that the printing condition information indicates a second printing condition, which is different from the first printing condition, for each type of printing condition, and the calculation unit determines an order in which solder printing is performed on multiple types of boards such that solder printing is performed consecutively on types of boards having the same combination of the first printing condition and the second printing condition. In this configuration, solder printing can be performed consecutively on types of boards having the same first printing condition and second printing condition without changing the first printing condition and the second printing condition. Therefore, it is possible to reduce the time required for setup work performed in response to a change in the type of board on which solder printing is performed by the printer.

[0011] The setup support device may be configured such that the calculation unit determines the order of solder printing on a plurality of types of boards such that, for a group consisting of types with the same combination of the first and second printing conditions, solder printing on a type of board with a different first printing condition but the same second printing condition is performed consecutively to solder printing on a type of board belonging to the group. In this configuration, solder printing can be performed consecutively on types of boards with the same first and second printing conditions without changing the first and second printing conditions, and solder printing can be performed consecutively on types of boards with the same second printing conditions without changing the second printing conditions. Therefore, it is possible to reduce the time required for setup work performed in response to changes in the type of board on which solder printing is performed by the printer.

[0012] The printer setup support device may be configured so that the first printing condition is the squeegee. In this configuration, for boards of a type on which solder printing is performed using the same squeegee (first printing condition), solder printing can be performed continuously without changing the squeegee. This makes it possible to reduce the time required for setup work performed in response to changes in the type of board on which solder printing is performed by the printer.

[0013] The printer setup support device may be configured so that the first printing condition is solder. In this configuration, for boards of a type on which solder printing is performed using the same solder (first printing condition), solder printing can be performed continuously without changing the solder. Therefore, it is possible to reduce the time required for setup work performed in response to a change in the type of board on which solder printing is performed by the printer.

[0014] The printer setup support device may be configured to further include an operation unit that accepts operations by an operator, and the calculation unit sets one printing condition selected from among the multiple printing conditions by the operator operating the operation unit as the first printing condition. In this configuration, for a type of board on which solder printing is performed using the first printing condition selected by the operator, solder printing can be performed continuously without changing the first printing condition. Therefore, it is possible to reduce the time required for setup work performed in response to a change in the type of board on which solder printing is performed by the printer. Effect of the Invention

[0015] As described above, according to the present invention, it is possible to reduce the time required for setup work that is performed in response to a change in the type of board on which solder printing is performed by the printer. [Brief description of the drawings]

[0016] [Figure 1] FIG. [Diagram 2] FIG. 2 is a block diagram showing the configuration of a server computer that optimizes printing setup work. [Diagram 3] FIG. 13 is a diagram showing an example of a printing plan according to a first example of optimizing the solder printing order. [Figure 4] 4 is a timing chart showing a case where solder printing is performed in the order shown in the printing plan of FIG. 3; [Diagram 5] FIG. 11 is a diagram showing a printing plan obtained by executing optimization of the solder printing order in the first example. [Figure 6] 6 is a timing chart showing a case where solder printing is performed in the order shown in the printing plan of FIG. 5 . [Figure 7] FIG. 11 is a diagram showing a printing plan obtained by executing optimization of the solder printing order in the second example. [Figure 8A] FIG. 13 is a diagram showing a printing plan obtained by executing a first stage of optimizing the solder printing order in the second example. [Figure 8B] A figure showing a printing result obtained by performing the second stage of optimizing the solder printing order in the second example. [Figure 9] 8C is a timing chart showing a case where solder printing is performed in the order shown in the printing plans of FIGS. 8A and 8B. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] FIG. 1 is a front view showing a printing machine. In FIG. 1, XYZ orthogonal coordinate axes are appropriately shown, with the Z direction being the vertical direction and the X and Y directions being the horizontal directions. The printing machine 1 includes a mask holding unit 2 that holds a mask M, a substrate holding unit 4 arranged below the mask M, and a squeegee unit 6 arranged above the mask M. The printing machine 1 has the substrate B facing the mask M from below by the substrate holding unit 4, and slides the tip of the squeegee 61 of the squeegee unit 6 over the upper surface of the mask M in the X direction. As a result, the solder D supplied to the upper surface of the mask M is printed on the upper surface of the substrate B through a pattern penetrating the mask M.

[0018] The mask holding unit 2 has a clamp member 21, and the mask M is detachably attached to the clamp member 21 via a frame 22 provided on the periphery of the mask M. This allows the mask M, which has a flat plate shape, to be held horizontally by the mask holding unit 2. This mask M has a rectangular shape in a plan view, and has through holes (mask pattern) shaped according to the printing pattern on the substrate B.

[0019] The substrate holding unit 4 is disposed below the mask M held by the mask holding unit 2, and has the function of aligning the position of the substrate B with respect to the mask M. The substrate holding unit 4 has a pair of conveyors 41 that transport the substrate B, a substrate holding part 42 that holds the substrate B received from the conveyors 41, and a flat movable table 43 that supports the conveyors 41 and the substrate holding part 42.

[0020] The pair of conveyors 41 are arranged parallel to each other in the Y direction with a gap therebetween in the X direction, and support both ends in the X direction of the substrate B from below with their upper surfaces. Each conveyor 41 transports the substrate B in the Y direction, thereby carrying the substrate B into or out of the printing machine 1.

[0021] Substrate holding unit 42 has a flat lift table 421 and a slide support 422 that can slide in the Z direction relative to movable table 43, and lift table 421 is supported on the upper end of slide support 422. A plurality of backup pins P standing in the Z direction are arranged at intervals in the X and Y directions on the upper surface of lift table 421, and lift table 421 functions as a mounting table on which backup pins P are placed. Then, as slide support 422 moves up and down, backup pins P move up and down together with lift table 421.

[0022] For example, when the conveyor 41 carries in the board B, the upper end of each backup pin P is positioned below the upper surface of the conveyor 41. Then, when the conveyor 41 carries in the board B directly above the backup pin P, the backup pin P rises and the upper end of the backup pin P protrudes upward from the upper surface of the conveyor 41. As a result, the upper end of the backup pin P contacts the lower surface of the board B while pushing up the board B, and the board B is delivered from the upper surface of the conveyor 41 to the upper end of each backup pin P.

[0023] Furthermore, the substrate holding unit 42 has a pair of clamp plates 424 arranged at an interval in the X direction above the pair of conveyors 41, and at least one of these clamp plates 424 is movable in the X direction. The upper surface of each clamp plate 424 is a plane parallel to the X and Y directions and is located at the same height. Then, when the substrate B on the backup pins P rises to between the pair of clamp plates 424, one of the clamp plates 424 moves toward the other, and the substrate B is clamped by the clamp plates 424 from the X direction (horizontal direction).

[0024] Furthermore, the substrate holding unit 4 has a table driving mechanism 44 that drives the movable table 43. This table driving mechanism 44 drives the conveyor 41 and the substrate holding part 42 arranged on the movable table 43 in the X, Y, Z, and R directions by an X-axis table 441, a Y-axis table 442 attached to the upper surface of the X-axis table 441, an R-axis table 443 attached to the upper surface of the Y-axis table 442, and a ball screw 444 that raises and lowers the movable table 43 relative to the R-axis table 443. For example, when positioning the substrate B with respect to the mask M, the position of the substrate B clamped to the clamp plate 424 is adjusted in the X, Y, Z, and R directions to bring the upper surfaces of the clamp plate 424 and the substrate B into contact with the lower surface of the mask M.

[0025] In this way, the printer 1 shown in FIG. 1 performs solder printing, which prints solder D on the board B arranged below the mask M by sliding the squeegee 61 over the upper surface of the mask M to which the solder D has been supplied. In particular, the printer 1 can perform solder printing on a plurality of types of boards B having different configurations. However, when the type of board B is changed, a setup operation is required to change the conditions for performing the solder printing (printing conditions). The time required for this setup operation is one factor that reduces the operating rate of the printer 1. Therefore, in the embodiment described below, the setup operation is optimized by the server computer 9 (FIG. 2), thereby reducing the time required for the setup operation.

[0026] 2 is a block diagram showing the configuration of the server computer. The server computer 9 includes a calculation unit 91, a UI (User Interface) 92, and a storage unit 93. The calculation unit 91 includes a CPU (Central Processing Unit). The UI 92 is a processor including a PLC (Computing Unit) and other components, and executes calculations for optimizing the setup work. The UI 92 has an input device such as a mouse or a keyboard and an output device such as a display. The calculation unit 91 executes calculations according to inputs made by an operator to the input device of the UI 92, and controls the output device of the UI 92 to display a screen on the display. The input device and output device of the UI 92 do not need to be configured separately, and may be configured integrally using a patch panel display or the like. The storage unit 93 is a storage device including a hard disk drive (HDD) or a solid state drive (SSD), and stores various data. In particular, the storage unit 93 stores a printing plan Pp that indicates the order in which the printer 1 executes solder printing on multiple types of boards B.

[0027] FIG. 3 is a diagram showing an example of a printing plan according to a first example of optimizing the solder printing order. The printing plan Pp in FIG. 3 is initially set by an input operation by an operator to the UI 92. In the figure, a suffix (n) is added to the board B to distinguish the type of the board B (n=1, 2, 3, 4). In the printing plan Pp in FIG. 3, solder printing on 50 boards B(1), solder printing on 100 boards B(2), solder printing on 50 boards B(3), and solder printing on 150 boards B(4) are scheduled. In addition, the printing plan Pp includes information on the dimensions (length L) in the Y direction and the dimensions (width W) in the X direction of each type of board B(n). The dimensions shown in FIG. 3 are in millimeters. In addition, the printing plan Pp shows the printing conditions (type of squeegee 61 and type of solder) when solder printing is performed on these boards B(1) to B(4). The type of squeegee 61 is specified by the combination of the length (millimeters) and material of the squeegee 61, and in FIG. 3, two types of squeegees 61 having different lengths in the Y direction are planned to be used. Also, lead-free solder D is planned to be used as the solder D. And, in the printing plan Pp of FIG. 3, it is planned to execute solder printing in the order of board B(1), board B(2), board B(3), and board B(4). Note that in FIG. 3 and in each printing plan Pp shown below, solder printing on multiple boards B of the same type is executed continuously.

[0028] FIG. 4 is a timing chart showing a case where solder printing is performed in the order shown in the printing plan of FIG. 3. In FIG. 4, the squares marked with the symbols B(1), B(2), B(3), and B(4) indicate the time required for solder printing on the corresponding boards B(1), B(2), B(3), and B(4), respectively. For example, the time required for solder printing on the board B(1) is the time from the start to the end of solder printing on the 50 boards B(1), which is the number of boards to be produced. Also, in FIG. 4, the hatched squares indicate the time required for setup work. Since the boards B(1) to B(4) have different configurations, setup work such as changing the mask M and arranging the backup pins P occurs every time the type of board B on which solder printing is performed is changed.

[0029] In addition, because the length of the squeegee 61 used is different between solder printing on board B(1) and solder printing on board B(2), it is necessary to replace the squeegee 61 in the setup work from the end of solder printing on board B(1) to the start of solder printing on board B(2). Similarly, it is necessary to replace the squeegee 61 in the setup work from the end of solder printing on board B(2) to the start of solder printing on board B(3) and in the setup work from the end of solder printing on board B(3) to the start of solder printing on board B(4). Therefore, these setup works require time Ts.

[0030] In response to this, the calculation unit 91 optimizes the order of solder printing on the boards B(1) to B(4) shown in the printing plan Pp in FIG. 3 and FIG. 4. Specifically, the calculation unit 91 groups the four types of boards B(1), B(2), B(3), and B(4) included in the printing plan Pp based on the squeegee 61. That is, grouping is performed so that boards B of a type on which solder printing is performed using the same squeegee 61 belong to the same group, while boards B of a type on which solder printing is performed using a different squeegee 61 belong to a different group. As a result, the four types of boards B(1) to B(4) are grouped into a group of two types of boards B(1) and B(3) on which solder printing is performed using a squeegee 61 with a length of 250 mm, and a group of two types of boards B(2) and B(4) on which solder printing is performed using a squeegee 61 with a length of 440 mm. Then, the calculation unit 91 optimizes the order of solder printing on the four types of boards B(1) to B(4) so ​​that solder printing is performed consecutively on the types of boards B belonging to the same group.

[0031] FIG. 5 is a diagram showing a printing plan obtained by executing the optimization of the solder printing order according to the first example, and FIG. 6 is a timing chart showing a case where solder printing is executed in the order shown in the printing plan of FIG. 5. The notation in FIG. 5 is the same as that in FIG. 3, and the notation in FIG. 6 is the same as that in FIG. 4. In the example of FIG. 5, solder printing is executed in the order of board B(1), board B(3), board B(2), and board B(4). Therefore, in the setup work from the end of solder printing on the first board B(1) to the start of solder printing on the second board B(3), it is not necessary to replace the squeegee 61, and in the setup work from the end of solder printing on the third board B(2) to the start of solder printing on the fourth board B(4), it is not necessary to replace the squeegee 61. Therefore, as shown in the "After optimization" column of FIG. 6, the time Tmp required for these setup works is shorter than the time Ts.

[0032] In the first example described above, the order in which solder printing is performed on the multiple types of boards B(1) to B(4) is determined based on the squeegee 61 (first printing condition) among the multiple printing conditions (squeegee 61·solder D) including the squeegee 61 and solder D used to perform solder printing. In other words, the order in which solder printing is performed on the multiple types of boards B(1) to B(4) is optimized based on the squeegee 61 prepared in response to a change in the type of board B on which solder printing is performed, thereby making it possible to reduce the time required to prepare the squeegee 61. As a result, it becomes possible to reduce the time required for the setup work performed by the printer 1 in response to a change in the type of board B on which solder printing is performed.

[0033] In particular, the calculation unit 91 determines the order in which solder printing is performed on the multiple types of boards B(1) to B(4) so ​​that solder printing is performed continuously on each type of board B using the same squeegee 61 (first printing condition). In this configuration, solder printing can be performed continuously on each type of board B(1), B(3) (or boards B(2), B(4)) using the same squeegee 61 without changing the squeegee 61. Therefore, it is possible to reduce the time required for setup work performed in response to a change in the type of board B to be solder printed by the printer 1.

[0034] Furthermore, the calculation unit 91 optimizes the order of solder printing based on the squeegee 61. In this configuration, for each type of board B on which solder printing is performed using the same squeegee 61, solder printing can be performed continuously without changing the squeegee 61. Therefore, it is possible to reduce the time required for setup work performed in response to a change in the type of board B on which solder printing is performed by the printer 1.

[0035] FIG. 7 is a diagram showing a printing plan obtained by executing optimization of the solder printing order according to the second example. The printing plan Pp in FIG. 7 is initially set by an input operation by an operator to the UI 92. The printing plan Pp in FIG. 7 and that in FIG. 3 are different in that eutectic solder D is used for solder printing on the board B(3) among the four types of boards B(1) to B(4), but are common in other respects. Here, the differences from the example in FIG. 3 will be mainly described, and the common points will be appropriately omitted by assigning corresponding symbols. The calculation unit 91 performs optimization in two stages based on two printing conditions, the squeegee 61 and the solder D, for the execution order of the solder printing shown in the printing plan Pp shown in FIG. 7.

[0036] Fig. 8A is a diagram showing a printing plan obtained by executing a first stage of optimizing the solder printing order according to the second example, Fig. 8B is a diagram showing a printing plan obtained by executing a second stage of optimizing the solder printing order according to the second example, and Fig. 9 is a timing chart showing a case where solder printing is performed in the order shown in the printing plans of Fig. 8A and Fig. 8B. The notations in Fig. 8A and Fig. 8B are the same as those in Fig. 3, and the notations in Fig. 9 are the same as those in Fig. 4.

[0037] First, the calculation unit 91 groups the four types of boards B(1), B(2), B(3), and B(4) included in the printing plan Pp in Fig. 7 based on the squeegee 61. As a result, the four types of boards B(1) to B(4) are grouped into a group of two types of boards B(1) and B(3) on which solder printing is performed using a squeegee 61 with a length of 250 mm, and a group of two types of boards B(2) and B(4) on which solder printing is performed using a squeegee 61 with a length of 440 mm. Then, the calculation unit 91 optimizes the order in which solder printing is performed on the four types of boards B(1) to B(4) so ​​that solder printing is performed consecutively on each type of board B belonging to the same group.

[0038] 8A and 9, the execution order of solder printing is changed to the order of board B(1), board B(3), board B(2), and board B(4). Therefore, in the setup work from the end of solder printing on the first board B(1) to the start of solder printing on the second board B(3), there is no need to replace the squeegee 61, and in the setup work from the end of solder printing on the third board B(2) to the start of solder printing on the fourth board B(4), there is no need to replace the squeegee 61.

[0039] However, while the squeegee 61 used in the solder printing on the board B(1) and the board B(3) is the same, the solder D (lead-free) used in the solder printing on the board B(1) is different from the solder D (eutectic) used in the solder printing on the board B(3). Therefore, in the preparation work from the end of the solder printing on the first board B(1) to the start of the solder printing on the second board B(3), a cleaning work is required to remove the lead-free solder D attached to the squeegee 61. Such cleaning is performed by, for example, ultrasonic cleaning. Therefore, the preparation work from the end of the solder printing on the first board B(1) to the start of the solder printing on the second board B(3) requires the time Ts plus the time Tc (the time required for cleaning). On the other hand, the preparation work from the end of the solder printing on the third board B(2) to the start of the solder printing on the fourth board B(4) can be completed in the time Tmp because there is no need to clean the squeegee 61.

[0040] Therefore, the calculation unit 91 maintains the order of consecutively performing solder printing on the two types of boards B(2) and B(4) that use the same combination of squeegee 61 and solder D, while discarding the order of performing solder printing on the two types of boards B(1) and B(4) that use different solder D. Furthermore, the calculation unit 91 performs optimization for these two types of boards B(2) and B(4) (group) so that solder printing on board B(2), which uses a different squeegee 61 and the same solder D, is consecutive to solder printing on these boards B(2) and B(4).

[0041] As a result, as shown in the "After optimization 2" column of FIG. 8B and FIG. 9, the order of solder printing is determined to be the order of board B(1), board B(2), board B(4), and board B(3). In this example, optimization is performed so that solder printing on board B(3), which is different from the two types of boards B(2) and B(4) and has solder D to be printed, is performed after the solder printing on these boards B(2) and B(4), while solder printing on board B(3), which is the same as the two types of boards B(2) and B(4), is performed immediately before the solder printing on these boards B(2) and B(4). In other words, the solder printing on two types of boards B(1) and B(3), on which different types of solder D (lead-free, eutectic) are printed by the same squeegee 61, is distributed before and after the solder printing on boards B(2) and B(4). As a result, cleaning of the squeegee 61 can be performed in parallel with the solder printing on substrates B(2) and B(4), which is performed between the end of solder printing on substrate B(1) using the squeegee 61 to print lead-free solder D and the start of solder printing on substrate B(3) using the squeegee 61 to print eutectic solder D.

[0042] In the second example described above, the order in which solder printing is performed on the multiple types of boards B(1) to B(4) is determined based on the squeegee 61 (first printing condition) among the multiple printing conditions (squeegee 61·solder D) including the squeegee 61 and solder D used to perform solder printing. In other words, the order in which solder printing is performed on the multiple types of boards B(1) to B(4) is optimized based on the squeegee 61 prepared in response to a change in the type of board B on which solder printing is performed, thereby making it possible to reduce the time required to prepare the squeegee 61. As a result, it becomes possible to reduce the time required for the setup work performed by the printer 1 in response to a change in the type of board B on which solder printing is performed.

[0043] Moreover, the printing plan Pp (printing condition information) indicates the squeegee 61 (first printing condition) and the different solder D (second printing condition) among the multiple printing conditions for each of the four types of boards B(1) to B(4). Then, the calculation unit 91 determines the order of performing solder printing on the four types of boards B(1) to B(4) so ​​that the solder printing is performed consecutively on the boards B(2) and B(4) having the same combination of the squeegee 61 and the solder D. In this configuration, the solder printing can be performed consecutively on the boards B(2) and B(4) having the same squeegee 61 and the same solder D without changing the squeegee 61 and the solder D. Therefore, it is possible to reduce the time required for the setup work performed in response to the change in the type of board B to be solder printed by the printer 1.

[0044] The calculation unit 91 also determines the order of solder printing on the multiple boards B(1) to B(4) so ​​that solder printing on the board B(1) of a type having a different squeegee 61 but the same solder D is continuous with solder printing on the boards B(2) and B(4) belonging to the group, which is made up of boards B(2) and B(4) of each type having the same combination of squeegee 61 and solder D. In this configuration, solder printing can be performed continuously on two types of boards B(2) and B(4) having the same squeegee 61 and solder D without changing the squeegee 61 and solder D, and solder printing on the board B(1) having the same solder D as these boards can be performed continuously without changing the solder D. Therefore, it is possible to reduce the time required for the setup work performed in response to a change in the type of board B to be solder printed by the printer 1.

[0045] As described above, in this embodiment, the printing press 1 corresponds to an example of a "printing press" of the present invention, the squeegee 61 corresponds to an example of a "squeegee" of the present invention, the squeegee 61 and solder D used for solder printing each correspond to an example of a "printing condition" of the present invention, the squeegee 61 used for solder printing corresponds to an example of a "first printing condition" of the present invention, the solder D used for solder printing corresponds to an example of a "second printing condition" of the present invention, the server computer 9 corresponds to an example of a "printing press setup support device" of the present invention, the calculation unit 91 corresponds to an example of a "calculation unit" of the present invention, the memory unit 93 corresponds to an example of a "memory unit" of the present invention, the solder D corresponds to an example of "solder" of the present invention, the mask M corresponds to an example of a "mask" of the present invention, and the printing plan Pp corresponds to an example of "printing condition information" of the present invention.

[0046] The present invention is not limited to the above embodiment, and various modifications can be made to the above without departing from the spirit of the present invention. For example, in the first example shown in Figs. 3 to 6, when the same squeegee 61 is commonly used in solder printing on each of the four types of boards B(1) to B(4) and two or more types of solder D are used, grouping may be performed based on the solder D to optimize the order of solder printing on the multiple boards B(1) to B(4). In this configuration, for boards B on which solder printing is performed using the same solder D (first printing condition), solder printing can be performed continuously without changing the solder D. Therefore, it is possible to reduce the time required for setup work performed in response to a change in the type of board B on which solder printing is performed by the printer 1.

[0047] 3 to 6, the calculation unit 91 may perform grouping based on one printing condition selected from among a plurality of printing conditions (squeegee 61 / solder D) by an operator operating the UI 92 (operation unit). In this configuration, for the board B on which solder printing is performed using the printing condition selected by the operator, solder printing can be performed continuously without changing the printing condition. Therefore, it is possible to reduce the time required for setup work performed in response to a change in the type of board B on which solder printing is performed by the printer 1.

[0048] It should be noted that the same changes to the printing conditions described above can also be made to the groupings in the second example shown in FIGS.

[0049] Alternatively, the results of actually performing solder printing in an optimized order after grouping based on the squeegee 61 and the results of actually performing solder printing in an optimized order after grouping based on the solder D may be stored in the storage unit 93, and based on the results, the criterion (printing condition) to be used for grouping may be determined from the squeegee 61 and the solder D. In this case, for example, an artificial intelligence having a neural network may be made to learn the correlation between the grouping criterion and the time required for setup, and depending on the result, it may be determined which of the squeegee 61 and the solder D to use as the criterion for grouping.

[0050] Moreover, the above grouping does not exclude the case where, as a result, the number of types of substrates B belonging to a group is one.

[0051] Furthermore, the printing conditions that are the basis for grouping are not limited to the squeegee 61 and the solder D described above, but can be arbitrarily set by the operator.

[0052] Furthermore, the types of substrates B are not limited to four, but may be two or more. [Explanation of symbols]

[0053] 1...Printing machine 61...Squeegee (printing conditions, first printing conditions) 9...Server computer (printing machine setup support device) 91...Arithmetic section 93...Storage section D...Solder (printing conditions, second printing conditions) M...Mask Pp...Printing plan (printing condition information)

Claims

1. a storage unit that stores printing condition information indicating the squeegee and solder to be used for the solder printing for each type when solder printing is to be performed on a plurality of types of substrates by a printing machine that performs solder printing by sliding a squeegee over the top surface of a mask to which solder has been supplied, and a calculation unit that determines an order in which solder printing is performed on the plurality of types of boards based on the squeegee and the solder used in the solder printing; Equipped with The calculation unit is a printer setup support device that continues solder printing on a type of board that has the same combination of the squeegee and the solder, and distributes solder printing on a type of board that has the same squeegee but different solder in the combination of the squeegee and the solder before or after solder printing on a type of board that has the same combination of the squeegee and the solder.

2. 2. The setup support device according to claim 1, wherein the calculation unit determines an order in which solder printing is performed on the multiple types of boards in a group consisting of types that have the same combination of the squeegee and the solder, so that solder printing on a type of board in which the squeegee is different but the solder is the same is continuous with solder printing on a type of board belonging to the group.

3. When solder printing is to be performed on a plurality of types of boards by a printer that performs solder printing by sliding a squeegee over an upper surface of a mask to which solder has been supplied, the printer includes a step of: a setup support device determining an order in which solder printing is to be performed on the plurality of types of boards based on the squeegee and the solder used to perform the solder printing; The setup support device continues solder printing on a type of board having the same combination of the squeegee and the solder, and distributes solder printing on a type of board having the same squeegee but different solder in the combination of the squeegee and the solder before or after solder printing on a type of board having the same combination of the squeegee and the solder.

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