Power Conversion Equipment

Abstract

This power conversion device comprises: a case (30) having a side wall (31) and a bottom wall (32); a plurality of first heat dissipating plates (41), a plurality of second heat dissipating plates (42), a plurality of circuit components (10), and a sealing material (50) disposed in the case; and a printed wiring board (60) electrically connected to the plurality of circuit components and attached to the case. A line normal to the inner wall surface of the bottom wall is oriented along a first direction (DR1). The plurality of first heat dissipating plates each extend along a second direction (DR2) orthogonal to the first direction and are arranged with gaps therebetween in a third direction (DR3) orthogonal to the first direction and the second direction. The plurality of second heat dissipating plates each extend in the third direction and are arranged with gaps therebetween in the second direction. Each of the plurality of circuit components are disposed in a space defined by two adjacent first heat dissipating plates among the plurality of first heat dissipating plates, two adjacent second heat dissipating plates among the plurality of second heat dissipating plates, and the bottom wall.

Description

[Technical field]

[0001] The present disclosure relates to a power conversion device. [Background technology]

[0002] JP 2016-66666 A (Patent Document 1) describes a capacitor. The capacitor described in Patent Document 1 has a case, a capacitor element, an electrode plate, a molded resin, and a lid. The capacitor element and the electrode plate are housed in the case. The lead terminals of the capacitor element are electrically connected to the electrode plate. The molded resin is filled in the case. This seals the capacitor element and the electrode plate in the case. The lid is attached to the opening of the case. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-66666 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the capacitor described in Patent Document 1, heat generated in the capacitor element is transferred to the lid through the lead terminals and the electrode plate, and is dissipated from the protrusions of the lid. Therefore, the capacitor described in Patent Document 1 has a large thermal resistance, and the temperature rise of the capacitor element is large.

[0005] The present disclosure has been made in consideration of the problems of the conventional techniques as described above. More specifically, the present disclosure provides a power conversion device capable of suppressing a temperature rise of circuit components. [Means for solving the problem]

[0006] The power conversion device of the present disclosure includes a case having a side wall and a bottom wall, a plurality of first heat sinks, a plurality of second heat sinks, a plurality of circuit components, and a sealant disposed in the case, and a printed wiring board electrically connected to the plurality of circuit components and attached to the case. A normal line of an inner wall surface of the bottom wall is along a first direction. Each of the plurality of first heat sinks extends along a second direction perpendicular to the first direction, and is arranged at intervals in a third direction perpendicular to the first direction and the second direction. Each of the plurality of second heat sinks extends along the third direction, and is arranged at intervals in the second direction. Each of the plurality of circuit components is disposed in a space defined by two adjacent ones of the plurality of first heat sinks, two adjacent ones of the plurality of second heat sinks, and the bottom wall. The sealant is filled in the space. Effect of the Invention

[0007] According to the power conversion device of the present disclosure, it is possible to suppress a rise in temperature of circuit components. [Brief description of the drawings]

[0008] [Figure 1] 1 is a circuit diagram of a power conversion device 100. FIG. [Diagram 2] FIG. 1 is a perspective view of a power conversion device 100. [Diagram 3] FIG. 2 is an exploded perspective view of the power conversion device 100. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Diagram 5] 2 is a plan view of a case 30 of the power conversion device 100. FIG. [Figure 6] 2 is a bottom view of a printed wiring board 60 included in the power conversion device 100. FIG. [Figure 7] 2 is a side view of a first heat sink 41 included in the power conversion device 100. FIG. [Figure 8] 4 is a side view of a second heat sink 42 included in the power conversion device 100. FIG. [Figure 9] FIG. 2 is a schematic side view showing a state in which a plurality of power conversion devices 100 are connected together. [Figure 10]1 is a plan view of a case 30 of a first modified example of a power conversion device 100. FIG. [Figure 11] 10 is a cross-sectional view of a second modified example of the power conversion device 100. FIG. [Figure 12] 2 is a plan view of a case 30 of the power conversion device 100A. FIG. [Figure 13] 4 is an enlarged cross-sectional view of the power converter 100A in the vicinity of a third groove 32a. FIG. [Figure 14] 11 is an enlarged cross-sectional view of the power converter 100A in the vicinity of a fourth groove 32b. FIG. [Figure 15] 11 is an enlarged cross-sectional view of the power converter 100B in the vicinity of a third groove 32a. FIG. [Figure 16] 13 is an enlarged cross-sectional view of the power converter 100B in the vicinity of a fourth groove 32b. FIG. [Figure 17] 11 is a plan view of a case 30 of a first modified example of a power conversion device 100B. FIG. [Figure 18] 13 is an enlarged cross-sectional view of a second modified example of the power converter 100B in the vicinity of a first groove 31aa. FIG. [Figure 19] 13 is an enlarged cross-sectional view of a second modification of the power converter 100B in the vicinity of a second groove 31ba. FIG. [Figure 20] 11 is an enlarged cross-sectional view of the power converter 100C in the vicinity of a third groove 32a. FIG. [Figure 21] 13 is an enlarged cross-sectional view of the power converter 100C in the vicinity of a fourth groove 32b. FIG. [Figure 22] 2 is an enlarged cross-sectional view of the power converter 100C in the vicinity of a bottom wall 32. FIG. [Diagram 23] 13 is an enlarged cross-sectional view of a second modified example of the power converter 100C in the vicinity of a first groove 31aa. FIG. [Figure 24] 13 is an enlarged cross-sectional view of a second modification of the power converter 100C in the vicinity of a second groove 31ba. FIG. [Diagram 25] FIG. 11 is a cross-sectional view of a power conversion device 100D. [Figure 26] FIG. 11 is a cross-sectional view of a first modified example of a power conversion device 100D. [Figure 27]FIG. 11 is a cross-sectional view of a second modified example of the power conversion device 100D. [Figure 28] FIG. 11 is a cross-sectional view of a third modified example of the power conversion device 100D. [Figure 29] FIG. 11 is a cross-sectional view of a fourth modified example of the power conversion device 100D. [Diagram 30] 11 is a side view of a first heat sink 41 included in the power conversion device 100E. FIG. [Diagram 31] 11 is a side view of a second heat sink 42 included in the power conversion device 100E. FIG. [Diagram 32] 2 is an exploded perspective view of a printed wiring board 60 included in the power conversion device 100F. FIG. [Diagram 33] 11 is a bottom view of a printed wiring board 60 included in the power conversion device 100G. [Diagram 34] FIG. 34 is a schematic cross-sectional view taken along line XXXIV-XXXIV in FIG. 33. [Diagram 35] 35 is a schematic cross-sectional view taken along line XXXV-XXXV of FIG. 33. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the embodiments of the present disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are designated by the same reference numerals, and redundant description will not be repeated.

[0010] Embodiment 1 A description will be given of a power conversion device according to embodiment 1. The power conversion device according to embodiment 1 is assumed to be a power conversion device 100.

[0011] (Configuration of power conversion device 100) The configuration of the power conversion device 100 will be described below.

[0012] 1 is a circuit diagram of a power conversion device 100. As shown in FIG. 1, the power conversion device 100 includes a peripheral circuit 110 and a switching circuit 120.

[0013] The peripheral circuit 110 has a plurality of circuit components 10. In the example shown in FIG. 1, the plurality of circuit components 10 are a capacitor 10a, an inductor 10b, a contactor 10c, a discharge resistor 10d, and a charge resistor 10e. The capacitor 10a, the inductor 10b, and the contactor 10c are connected in series. The inductor 10b is disposed between the capacitor 10a and the contactor 10c. The discharge resistor 10d and the charge resistor 10e are connected in parallel to the capacitor 10a and the contactor 10c, respectively. The peripheral circuit 110 is connected to a DC supply circuit 130.

[0014] The switching circuit 120 is, for example, a three-phase inverter circuit. The switching circuit 120 has a plurality of circuit components 20. In the example shown in Fig. 1, the plurality of circuit components 20 are transistors 20a to 20f and diodes 20g to 20l.

[0015] The drain of the transistor 20a is electrically connected to one electrode of the capacitor 10a. The source of the transistor 20a is electrically connected to the drain of the transistor 20b. The source of the transistor 20b is electrically connected to the other electrode of the capacitor 10a.

[0016] The anode of the diode 20g is electrically connected to the source of the transistor 20a. The cathode of the diode 20g is electrically connected to the drain of the transistor 20a. The anode of the diode 20h is electrically connected to the source of the transistor 20b. The cathode of the diode 20h is electrically connected to the drain of the transistor 20b.

[0017] The transistor 20c, the transistor 20d, the diode 20i, and the diode 20j are connected in the same manner as the transistor 20a, the transistor 20b, the diode 20g, and the diode 20h, respectively. The transistor 20e, the transistor 20f, the diode 20k, and the diode 20l are connected in the same manner as the transistor 20a, the transistor 20b, the diode 20g, and the diode 20h, respectively. Although not shown, the gates of the transistors 20a to 20f are connected to a control circuit.

[0018] The switching circuit 120 is connected to a motor 140. The motor 140 is, for example, a three-phase motor. The motor 140 has an input line 141, an input line 142, and an input line 143. The input line 141 is electrically connected to the source of the transistor 20a and the drain of the transistor 20b. The input line 142 is electrically connected to the source of the transistor 20c and the drain of the transistor 20d. The input line 143 is electrically connected to the source of the transistor 20e and the drain of the transistor 20f.

[0019] FIG. 2 is a perspective view of the power conversion device 100. FIG. 3 is an exploded perspective view of the power conversion device 100. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 2. FIG. 5 is a plan view of a case 30 included in the power conversion device 100. FIG. 6 is a bottom view of a printed wiring board 60 included in the power conversion device 100. FIG. 7 is a side view of a first heat sink 41 included in the power conversion device 100. FIG. 8 is a side view of a second heat sink 42 included in the power conversion device 100. As shown in FIGS. 2 to 8, the power conversion device 100 includes a plurality of circuit components 10, a case 30, a plurality of first heat sinks 41 and a plurality of second heat sinks 42, a sealant 50, and a printed wiring board 60.

[0020] The case 30 has a side wall 31 and a bottom wall 32. A direction along a normal line of the inner wall surface of the bottom wall 32 is defined as a first direction DR1. A direction perpendicular to the first direction DR1 is defined as a second direction DR2. A direction perpendicular to the first direction DR1 and the second direction DR2 is defined as a third direction DR3.

[0021] The side wall 31 is, for example, rectangular in plan view. The side wall 31 has a first side wall portion 31a and a second side wall portion 31b, and a third side wall portion 31c and a fourth side wall portion 31d. The first side wall portion 31a and the second side wall portion 31b face each other with a gap in the second direction DR2. The third side wall portion 31c and the fourth side wall portion 31d face each other with a gap in the third direction DR3. The arithmetic mean roughness of the inner wall surface of the side wall 31 is preferably 6.3 μm or more. The bottom wall 32 is continuous with the lower end of the side wall 31.

[0022] The case 30 is made of a rigid material. For example, the case 30 is made of a metal material. The case 30 is made of copper (Cu), a copper alloy, aluminum (Al), an aluminum alloy, iron (Fe), an iron alloy, or the like. The case 30 may be made of a resin material.

[0023] A plurality of first grooves 31aa are formed on the inner wall surface of the first side wall portion 31a. The plurality of first grooves 31aa are arranged at intervals in the third direction DR3. The first grooves 31aa extend along the first direction DR1. Both ends of the first grooves 31aa in the third direction DR3 reach the upper end and the lower end of the first side wall portion 31a, respectively.

[0024] A plurality of second grooves 31ba are formed on the inner wall surface of the second side wall portion 31b. The plurality of second grooves 31ba are arranged at intervals in the third direction DR3. The second grooves 31ba extend along the first direction DR1. Both ends of the second grooves 31ba in the third direction DR3 reach the upper end and the lower end of the second side wall portion 31b, respectively. The second grooves 31ba face the first grooves 31aa in the second direction DR2.

[0025] The first heat sink 41 and the second heat sink 42 are disposed in the case 30. More specifically, the first heat sink 41 and the second heat sink 42 are disposed in a space defined by the side wall 31 and the bottom wall 32. The first heat sink 41 and the second heat sink 42 are formed of a material having a high thermal conductivity. The first heat sink 41 and the second heat sink 42 are formed of, for example, copper, copper alloy, aluminum, aluminum alloy, iron, iron alloy, etc. The first heat sink 41 and the second heat sink 42 may be formed of the same material or different materials. The arithmetic mean roughness of the side surface of the first heat sink 41 and the second heat sink 42 is preferably 6.3 μm or more.

[0026] The first heat sink 41 extends along the second direction DR2 in a plan view. The first heat sinks 41 are arranged at intervals in the third direction DR3. The first heat sink 41 has a first end 41a and a second end 41b in the second direction DR2. The second end 41b is an end opposite to the first end 41a. The first heat sink 41 is attached to the case 30 by inserting the first end 41a and the second end 41b into the first groove 31aa and the second groove 31ba, respectively. The first heat sink 41 faces the electrode surface 11a.

[0027] The first heat sink 41 has a third end 41c and a fourth end 41d in the first direction DR1. The third end 41c is on the bottom wall 32 side. The third end 41c is thermally connected to the bottom wall 32 via a heat dissipation auxiliary material 51 described later. The fourth end 41d is the end opposite to the third end 41c. A plurality of first plug-in openings 41e are formed in the first heat sink 41. The first plug-in openings 41e penetrate the first heat sink 41 along the thickness direction. The first plug-in openings 41e extend from the fourth end 41d toward the third end 41c. The number of the first plug-in openings 41e is equal to or greater than the number of the second heat sinks 42.

[0028] The second heat dissipation plate 42 extends along the third direction DR3 in a plan view. The second heat dissipation plates 42 are arranged at intervals in the second direction DR2. The second heat dissipation plate 42 has a fifth end 42a and a sixth end 42b in the first direction DR1. The fifth end 42a is on the bottom wall 32 side. The sixth end 42b is the end opposite to the fifth end 42a.

[0029] The second heat sink 42 has a plurality of second plug-in openings 42c formed therein. The second plug-in openings 42c penetrate the second heat sink 42 in the thickness direction. The second plug-in openings 42c extend from the fifth end 42a toward the sixth end 42b. The number of the second plug-in openings 42c is equal to or greater than the number of the first heat sinks 41. The second heat sink 42 is attached to the first heat sink 41 by inserting the second plug-in openings 42c into the first plug-in openings 41e. The first heat sink 41 and the second heat sink 42 are assembled in a grid shape in a plan view.

[0030] Although not shown, a plurality of grooves extending along the first direction DR1 and spaced apart in the second direction DR2 may be formed on the inner wall surface of the third side wall portion 31c. A plurality of grooves extending along the first direction DR1 and spaced apart in the second direction DR2 may be formed on the inner wall surface of the fourth side wall portion 31d. The second heat sink 42 may be attached to the case 30 by inserting both ends of the second heat sink 42 in the third direction DR3 into the grooves formed on the inner wall surface of the third side wall portion 31c and the grooves formed on the inner wall surface of the fourth side wall portion 31d.

[0031] The second heat sink 42 has a seventh end 42e and an eighth end 42f in the third direction DR3. The eighth end 42f is the end opposite to the seventh end 42e. It is preferable that the seventh end 42e and the eighth end 42f are separated from the inner wall surface of the third side wall portion 31c and the inner wall surface of the fourth side wall portion 31d, respectively. From another perspective, it is preferable that a molding material 52 is disposed between the seventh end 42e and the inner wall surface of the third side wall portion 31c and between the eighth end 42f and the inner wall surface of the fourth side wall portion 31d.

[0032] In addition, when the electrode surface 11a faces the second heat sink 42 rather than the first heat sink 41, instead of the first groove 31aa and the second groove 31ba, a groove into which the seventh end 42e is inserted may be formed on the inner wall surface of the third side wall portion 31c, and a groove into which the eighth end 42f is inserted may be formed on the inner wall surface of the fourth side wall portion 31d.

[0033] 2 to 8, the circuit component 10 is a capacitor 10a. The capacitor 10a is disposed in a space defined by two adjacent first heat sinks 41, two adjacent second heat sinks 42, and the bottom wall 32.

[0034] The capacitor 10a is, for example, a film capacitor. The circuit component 10 has an element body and lead wires. When the circuit component 10 is a capacitor 10a, the element body is a capacitor element body 11, and the lead wires are lead wires 12. The capacitor 10a further has an exterior case 13 and a sealing resin 14.

[0035] The capacitor element body 11 is formed, for example, by winding a metal film and a dielectric film disposed on the metal film. Both end faces of the capacitor element body 11 form electrode surfaces 11a. Lead wires 12 are electrically connected to the electrode surfaces 11a. The lead wires 12 serve to pass a current from the outside to the capacitor element body 11. The lead wires 12 are made of a conductive material such as a metal material.

[0036] Capacitor element body 11 has two electrode surfaces 11a. Two electrode surfaces 11a face two different first heat sinks 41, respectively, with molding material 52 interposed therebetween.

[0037] The exterior case 13 is made of an insulating material. The exterior case 13 is made of, for example, a resin material. The capacitor element body 11 and the lead wires 12 are housed in the exterior case 13. However, a portion of the lead wires 12 protrudes from the upper surface of the exterior case 13. The interior of the exterior case 13 is filled with a sealing resin 14.

[0038] The capacitors 10a are arranged in a first row and a second row. The first row and the second row are aligned along the second direction DR2. It is preferable that the electrode surface 11a of the capacitors 10a belonging to the first row faces the electrode surface 11a of the capacitors 10a belonging to the second row. A first heat sink 41 is disposed between the first row and the second row. That is, the electrode surface 11a of the capacitors 10a belonging to the first row faces the electrode surface 11a of the capacitors 10a belonging to the second row via the first heat sink 41.

[0039] The sealing material 50 is filled inside the case 30. More specifically, the sealing material 50 is filled inside a space defined by two adjacent first heat dissipation plates 41, two adjacent second heat dissipation plates 42, and the bottom wall 32. The sealing material 50 has a heat dissipation auxiliary material 51 and a molding material 52.

[0040] The heat dissipation auxiliary material 51 is, for example, a resin material such as silicone resin, epoxy resin, or urethane resin, grease, gel, or an insulating sheet. The heat dissipation auxiliary material 51 may contain a thermally conductive filler. The thermally conductive filler is, for example, made of a ceramic or metal material. The thermal conductivity of the heat dissipation auxiliary material 51 is, for example, 1 W / m·K or more and several tens of W / m·K or less. The heat dissipation auxiliary material 51 is applied onto the bottom wall 32. More specifically, the heat dissipation auxiliary material 51 is applied onto the inner wall surface of the bottom wall 32. Although not shown, the heat dissipation auxiliary material 51 may also be applied onto the first groove 31aa and the second groove 31ba.

[0041] The molding material 52 is, for example, a resin material with high thermal conductivity. The molding material 52 is, for example, an epoxy resin, a silicone resin, a urethane resin, or the like containing a thermally conductive filler. The thermal conductivity of the molding material 52 is, for example, 0.1 W / m·K or more and 20 W / m·K or less. The Young's modulus of the molding material 52 is, for example, 1 MPa or more and 50 GPa or less. The molding material 52 may be the same material as the heat dissipation auxiliary material 51. For example, the heat dissipation auxiliary material 51 and the molding material 52 may be an adhesive.

[0042] The molding material 52 is disposed on the heat dissipation auxiliary material 51. The molding material 52 is in contact with the bottom, side and top surfaces of the exterior case 13. That is, the molding material 52 surrounds the capacitor 10a. The lead wires 12 protrude from the molding material 52. The molding material 52 is also in contact with the inner wall surface of the side wall 31, the side surface of the first heat dissipation plate 41 and the side surface of the second heat dissipation plate 42.

[0043] The printed wiring board 60 has a first surface 60a and a second surface 60b. The first surface 60a faces the case 30. The second surface 60b is the opposite surface to the first surface 60a. The capacitor 10a is electrically connected to the printed wiring board 60. More specifically, the lead wire 12 is inserted into a through hole (not shown) formed in the printed wiring board 60 and soldered, thereby connecting the capacitor 10a to the printed wiring board 60. This realizes wiring of the peripheral circuit 110 shown in FIG. 1. The capacitor 10a and the printed wiring board 60 may be connected to each other using a conductive adhesive.

[0044] The printed wiring board 60 also has an external connection terminal 60c. The external connection terminal 60c is formed of a land, and is connected to the switching circuit 120 shown in Fig. 1 by contacting a bus bar (not shown) and being energized. The printed wiring board 60 is attached to the upper end of the side wall 31.

[0045] FIG. 9 is a schematic side view when a plurality of power conversion devices 100 are connected. One of the plurality of power conversion devices 100 is the power conversion device 101, and the other of the plurality of power conversion devices 100 is the power conversion device 102. As shown in FIG. 9, the power conversion device 101 and the power conversion device 102 are connected by a connection member 61. One end of the connection member 61 is connected to an external connection terminal 60c of the printed wiring board 60 of the power conversion device 101, and the other end is connected to an external connection terminal 60c of the printed wiring board 60 of the power conversion device 102. The connection member 61 is, for example, a rolled material formed of a metal material.

[0046] 9, the number of the three power electronics devices 100 is three, but the number of the connected power electronics devices 100 can be increased or decreased. Also, while FIG. 9 shows an example in which the multiple power electronics devices 100 are connected along the first direction DR1, the multiple power electronics devices 100 may be connected along the second direction DR2 or the third direction DR3.

[0047] <First Modification of Power Converter 100> Fig. 10 is a plan view of the case 30 of the first modification of the power conversion device 100. As shown in Fig. 10, a plurality of grooves 31e may be formed on the outer wall surface of the side wall 31. The grooves 31e extend, for example, along the first direction DR1. In this case, the surface area of ​​the outer wall surface of the side wall 31 is increased and the thermal resistance between the case 30 and the outside air is reduced, so that the temperature rise of the capacitor 10a can be further suppressed.

[0048] <Modification 2 of power conversion device 100> Fig. 11 is a cross-sectional view of the power conversion device 100 in Modification 2. Fig. 11 shows a cross section taken along a line IV-IV in Fig. 2. As shown in Fig. 11, the sealing material 50 may have a silicone gel 53 instead of the molding material 52. The silicone gel 53 preferably has low viscosity and high insulating properties.

[0049] Since the silicone gel 53 has high adhesion to the capacitor 10a, the first heat sink 41, and the second heat sink 42, there is no need to consider the creepage at the boundary between the capacitor 10a, the first heat sink 41, and the second heat sink 42 in the evaluation of the insulation. Therefore, in this case, an insulating area for ensuring the creepage distance is not required, and the area around the capacitor 10a can be made smaller. In addition, in this case, the heat generated by the capacitor 10a can be efficiently transmitted to the case 30. Furthermore, the silicone gel 53 is a material with a high penetration, that is, a soft material. Therefore, in this case, the reliability of the power conversion device 100 when a heat cycle or a power cycle is applied can be improved. Note that the position of the capacitor 10a is fixed by attaching the printed wiring board 60 to the case 30, so even if the penetration of the silicone gel 53 is high, there is no problem in fixing the position of the capacitor 10a.

[0050] (Method of Assembling Power Converter 100) A method for assembling the power converter 100 will be described below.

[0051] In assembling the power conversion device 100, first, the case 30, the multiple first heat sinks 41, the multiple second heat sinks 42, and the printed wiring board 60 to which the multiple capacitors 10a are connected are prepared. Second, the heat sink auxiliary material 51 is applied to the inner wall surface of the bottom wall 32. At this time, the heat sink auxiliary material 51 may also be applied to the first groove 31aa and the second groove 31ba. Third, the first heat sink 41 is attached to the case 30. The first heat sink 41 is attached by inserting the first end 41a and the second end 41b into the first groove 31aa and the second groove 31ba, respectively.

[0052] Fourth, the second heat sink 42 is attached to the first heat sink 41. The second heat sink 42 is attached by inserting the second socket 42c into the first socket 41e. Fifth, the molding material 52 is injected into the case 30. Sixth, the printed wiring board 60 is attached to the upper end of the side wall 31. As a result, the capacitor 10a is disposed in a space defined by the two adjacent first heat sinks 41, the two adjacent second heat sinks 42, and the bottom wall 32, and is surrounded by the molding material 52. Seventh, the molding material 52 is hardened. With the above, the assembly of the power conversion device 100 is completed.

[0053] <Modification 1 of the method for assembling the power conversion device 100> When the heat dissipation auxiliary material 51 and the molding material 52 are made of the same material, the sealing material 50 may be injected into the case 30 before the first heat sink 41 is attached to the case 30 during assembly of the power conversion device 100. In this case, the number of assembly steps is reduced, and therefore the time required for assembly can be reduced.

[0054] <Modification 2 of the method for assembling the power conversion device 100> In assembling the power conversion device 100, the application of the auxiliary heat dissipation material 51 may be performed after the attachment of the first heat dissipation plate 41 to the case 30 and the attachment of the second heat dissipation plate 42 to the first heat dissipation plate 41, and before the injection of the molding material 52. In this case, the first heat dissipation plate 41 comes into contact with the bottom wall 32 without the auxiliary heat dissipation material 51 therebetween.

[0055] <Modification 3 of the method for assembling the power conversion device 100> When the heat dissipation auxiliary material 51 and the molding material 52 are made of the same material, in assembling the power conversion device 100, the sealing material 50 may be injected after the printed wiring board 60 is attached to the case 30. The sealing material 50 is injected from an injection port that is formed in advance in the printed wiring board 60. In this case, the number of assembly steps is reduced, and therefore the time required for assembly can be reduced.

[0056] (Effects of the power conversion device 100) The effects of the power conversion device 100 will be described below.

[0057] When an AC current flows through the capacitor 10a during operation of the power conversion device 100, power consumption occurs due to the resistance component of the capacitor 10a, and the capacitor 10a generates heat. The heat generated by the capacitor 10a is generated mainly in the capacitor element body 11, the electrode surface 11a, and the lead wires 12.

[0058] In the power conversion device 100, a plurality of capacitors 10a are arranged close together. Therefore, if the heat generated by the capacitors 10a interferes with each other and the temperature of the capacitors 10a rises excessively, there is a risk that the characteristics of the capacitors 10a will deteriorate, the capacitors 10a will be destroyed, or the life of the capacitors 10a will be shortened.

[0059] However, in the power conversion device 100, the capacitor 10a is thermally connected to the case 30 by the sealing material 50, the first heat sink 41, and the second heat sink 42. Therefore, in the power conversion device 100, the heat generated by the capacitor 10a is dissipated to the outside air from the case 30, and the temperature rise of the capacitor 10a is suppressed. When the temperature rise of the capacitor 10a is suppressed, the life of the capacitor 10a is extended. For example, when the temperature of the capacitor 10a decreases by 10° C., the life of the capacitor 10a is approximately doubled.

[0060] When the circuit component 10 is the inductor 10b, a drop in the temperature of the inductor 10b by 10° C. approximately doubles the life of the enamel coating of the inductor 10b. When the circuit component 10 is a discharge resistor 10d or a charge resistor 10e, the power category rank of the discharge resistor 10d or the charge resistor 10e can be lowered due to temperature derating, and the number of series or parallel connections of the discharge resistors 10d or the charge resistors 10e can be reduced.

[0061] In the power conversion device 100, heat generated by the capacitor 10a is transferred to the first heat sink 41 via the molding material 52. The heat transferred to the first heat sink 41 is transferred from the first end 41a and the second end 41b to the side wall 31, and is transferred from the third end 41c to the bottom wall 32 via the auxiliary heat dissipation material 51. Therefore, in the power conversion device 100, the area of ​​the heat transfer path from the capacitor 10a to the case 30 is large and the thermal resistance from the capacitor 10a to the case 30 is reduced, thereby suppressing a temperature rise in the capacitor 10a.

[0062] Since current concentrates on electrode surface 11a, it is important to cool electrode surface 11a in order to suppress a temperature rise of capacitor 10a. In power conversion device 100, two electrode surfaces 11a of capacitor 10a face two different first heat sinks 41 via molding material 52, respectively, so that a temperature rise of capacitor 10a can be further suppressed.

[0063] In the power conversion device 100, the first plug 41e is formed at the fourth end 41d. That is, the first plug 41e is not formed at the third end 41c. Therefore, the heat transfer area between the first heat sink 41 and the bottom wall 32 is increased, and the thermal resistance between the first heat sink 41 and the bottom wall 32 is reduced, so that the temperature rise of the capacitor 10a can be further suppressed.

[0064] In addition to the first heat sink 41, the power conversion device 100 has a second heat sink 42 thermally connected to the first heat sink 41. Therefore, in the power conversion device 100, the heat transferred from the capacitor 10a to the first heat sink 41 via the molding material 52 is also transferred to the case 30 via the second heat sink 42, thereby further suppressing the temperature rise of the capacitor 10a.

[0065] In the power conversion device 100, the first heat sink 41 extends along the second direction DR2 and the multiple capacitors 10a are lined up along the second direction DR2, so that the temperature difference between the multiple capacitors 10a lined up along the second direction DR2 is small. Similarly, in the power conversion device 100, the second heat sink 42 extends along the third direction DR3 and the multiple capacitors 10a are lined up along the third direction DR3, so that the temperature difference between the multiple capacitors 10a lined up along the second direction DR2 is small.

[0066] The temperature rise of the capacitors 10a varies depending on the position where the capacitors 10a are arranged. More specifically, the capacitors 10a arranged near the center of the power converter 100 are more likely to rise in temperature than the capacitors 10a arranged near the periphery of the power converter 100 due to the effect of heat generated by the capacitors 10a arranged around it. The temperature derating is determined by the capacitor 10a with the highest temperature. As described above, in the power converter 100, the first heat sink 41 and the second heat sink 42 make the temperature uniform among the multiple capacitors 10a, so that the power converter 100 can be used more effectively. In addition, in the power converter 100, the temperature is made uniform among the multiple capacitors 10a, so that the number of capacitors 10a connected in series or in parallel can be reduced.

[0067] In the power conversion device 100, either the first heat sink 41 or the second heat sink 42 is disposed between two adjacent capacitors 10a. Therefore, the first heat sink 41 and the second heat sink 42 function as a fire wall. That is, even if a spark and an impact due to discharge occurs due to a failure of a certain capacitor 10a, the first heat sink 41 and the second heat sink 42 prevent the spark and the impact from reaching the other capacitor 10a. When the circuit component 10 is an inductor 10b, leakage magnetic flux from the inductor 10b to the surroundings is blocked by the first heat sink 41 and the second heat sink 42, so that the accuracy of sensor components (e.g., a current sensor using the Hall effect) disposed in the surroundings can be improved.

[0068] In the power conversion device 100, the vibration resistance of the capacitor 10a is improved because the sealant 50 is filled inside the case 30. When the arithmetic mean roughness of the inner wall surface of the side wall 31, the side surface of the first heat sink 41, and the side surface of the second heat sink 42 is 6.3 μm or more, the adhesion with the sealant 50 is improved, and the mechanical strength of the power conversion device 100 is improved.

[0069] In the power converter 100, the number or size of the sections formed in a grid shape by two adjacent first heat sinks 41 and two adjacent second heat sinks 42 can be increased or decreased according to the number or size of the capacitors 10a by increasing or decreasing the number of the first heat sinks 41 and the number of the second heat sinks 42. In addition, in the power converter 100, the thickness, type, material, etc. of the first heat sink 41 and the second heat sink 42 can be selected arbitrarily. Furthermore, in the power converter 100, the strength of the first heat sink 41 and the second heat sink 42 can be ensured and the shape of the grid-shaped sections can be changed by performing bending processing or uneven pressing processing on the first heat sink 41 and the second heat sink 42. In this way, the power converter 100 can realize various specifications flexibly and at low cost.

[0070] The temperature of the capacitor 10a tends to rise on the electrode surface 11a where the current is concentrated. In the power conversion device 100, the electrode surface 11a faces the first heat sink 41 (or the second heat sink 42), so that the heat generated on the electrode surface 11a is easily transferred to the case 30 via the first heat sink 41 (or the second heat sink 42), and the temperature rise of the capacitor 10a can be further suppressed.

[0071] When the seventh end 42e is away from the inner wall surface of the third side wall portion 31c and the eighth end 42f is away from the inner wall surface of the fourth side wall portion 31d, the molding material 52 is more likely to be filled between the seventh end 42e and the third side wall portion 31c and between the eighth end 42f and the fourth side wall portion 31d, improving the manufacturing efficiency of the power conversion device 100 and making it easier for heat generated in the capacitor 10a to be transferred to the case 30 via the molding material 52.

[0072] Since the second heat sink 42 is positioned by intersecting with the first heat sink 41, if the seventh end 42e and the eighth end 42f come into contact with the inner wall surface of the third side wall portion 31c and the inner wall surface of the fourth side wall portion 31d, respectively, the second heat sink 42 may bend and break unless the dimensional tolerances of the first plug opening 41e and the second plug opening 42c are strictly controlled. On the other hand, if the seventh end 42e is separated from the inner wall surface of the third side wall portion 31c and the eighth end 42f is separated from the inner wall surface of the fourth side wall portion 31d, damage to the second heat sink 42 as described above can be suppressed even if the dimensional tolerances of the first plug opening 41e and the second plug opening 42c are relaxed.

[0073] Embodiment 2 A power conversion device according to the second embodiment will be described. The power conversion device according to the second embodiment is assumed to be a power conversion device 100A. Here, differences from the power conversion device 100 will be mainly described, and overlapping descriptions will not be repeated.

[0074] (Configuration of power conversion device 100A) The configuration of the power conversion device 100A will be described below.

[0075] The power conversion device 100A has a plurality of circuit components 10, a case 30, a plurality of first heat sinks 41 and a plurality of second heat sinks 42, a sealing material 50, and a printed wiring board 60. In this respect, the configuration of the power conversion device 100A is common to the configuration of the power conversion device 100.

[0076] FIG. 12 is a plan view of the case 30 of the power converter 100A. FIG. 13 is an enlarged cross-sectional view of the power converter 100A in the vicinity of the third groove 32a. FIG. 13 shows an enlarged cross-section perpendicular to the second direction DR2. FIG. 14 is an enlarged cross-sectional view of the power converter 100A in the vicinity of the fourth groove 32b. FIG. 14 shows an enlarged cross-section perpendicular to the third direction DR3. As shown in FIG. 12 to FIG. 14, in the power converter 100A, a plurality of third grooves 32a and a plurality of fourth grooves 32b are formed on the inner wall surface of the bottom wall 32.

[0077] The third groove 32a extends along the second direction DR2. The multiple third grooves 32a are arranged at intervals in the third direction DR3. The third end 41c side of the first heat sink 41 is inserted into the third groove 32a. The fourth groove 32b extends along the third direction DR3. The multiple fourth grooves 32b are arranged at intervals in the second direction DR2. The fifth end 42a side of the second heat sink 42 is inserted into the fourth groove 32b. Although not shown, the third groove 32a and the fourth groove 32b may be filled with a sealant 50 or may not be filled with the sealant 50. In these respects, the configuration of the power conversion device 100A is different from the configuration of the power conversion device 100.

[0078] (Effects of the power conversion device 100A) The effects of the power conversion device 100A will be described below.

[0079] In the power conversion device 100A, the first heat sink 41 is inserted into the third groove 32a and the second heat sink 42 is inserted into the fourth groove 32b, so that the heat transfer area between the first heat sink 41 and the second heat sink 42 and the bottom wall 32 is increased, and the thermal resistance between the first heat sink 41 and the second heat sink 42 and the bottom wall 32 is reduced. As a result, the power conversion device 100A can further suppress the temperature rise of the capacitor 10a.

[0080] Furthermore, in the power conversion device 100A, the first heat sink 41 is inserted into the third groove 32a and the second heat sink 42 is inserted into the fourth groove 32b, improving the ease of assembly and positioning accuracy of the first heat sink 41 and the second heat sink 42. As a result of improving the positioning accuracy of the first heat sink 41 and the second heat sink 42, the distances between the first heat sink 41 and the second heat sink 42 and the capacitor 10a can be set with high accuracy, and the thickness of the sealing material 50 can be reduced to reduce the thermal resistance between the capacitor 10a and the first heat sink 41 and the second heat sink 42.

[0081] Furthermore, in the power conversion device 100A, the first heat sink 41 and the second heat sink 42 are fixed to the bottom wall 32, so that the sealing material 50 can be more reliably filled into the space defined by the two adjacent first heat sinks 41, the two adjacent second heat sinks 42, and the bottom wall 32.

[0082] Embodiment 3 A power conversion device according to the third embodiment will be described. The power conversion device according to the third embodiment is assumed to be a power conversion device 100B. Here, differences from the power conversion device 100A will be mainly described, and overlapping descriptions will not be repeated.

[0083] The power conversion device 100B has a plurality of circuit components 10, a case 30, a plurality of first heat sinks 41 and a plurality of second heat sinks 42, a sealing material 50, and a printed wiring board 60. In this respect, the configuration of the power conversion device 100B is common to the configuration of the power conversion device 100A.

[0084] FIG. 15 is an enlarged cross-sectional view of the power converter 100B in the vicinity of the third groove 32a. FIG. 15 shows an enlarged cross-section perpendicular to the second direction DR2. FIG. 16 is an enlarged cross-sectional view of the power converter 100B in the vicinity of the fourth groove 32b. FIG. 16 shows an enlarged cross-section perpendicular to the third direction DR3. As shown in FIG. 15 and FIG. 16, in the power converter 100B, the first heat sink 41 is metal-joined to the third groove 32a on the third end 41c side. In the power converter 100B, the second heat sink 42 is metal-joined to the fourth groove 32b on the fifth end 42a side.

[0085] The first heat sink 41 may not be metal-bonded to the third groove 32a at all of the portions inserted into the third groove 32a, and the second heat sink 42 may not be metal-bonded to the fourth groove 32b at all of the portions inserted into the fourth groove 32b. The metal bonding between the first heat sink 41 and the third groove 32a and the metal bonding between the second heat sink 42 and the fourth groove 32b are performed by, for example, brazing material 33. The metal bonding between the first heat sink 41 and the third groove 32a and the metal bonding between the second heat sink 42 and the fourth groove 32b may be performed by welding. In these respects, the configuration of the power conversion device 100B is different from the configuration of the power conversion device 100A.

[0086] (Effects of power conversion device 100B) The effects of the power conversion device 100B will be described below.

[0087] In the power conversion device 100B, the first heat sink 41 is metal-joined to the third groove 32a and the second heat sink 42 is metal-joined to the fourth groove 32b, so that the thermal resistance between the first heat sink 41 and the second heat sink 42 and the bottom wall 32 is reduced. As a result, the power conversion device 100B can further suppress the temperature rise of the capacitor 10a.

[0088] Furthermore, in the power conversion device 100B, the first heat sink 41 is metal-bonded to the third groove 32a and the second heat sink 42 is metal-bonded to the fourth groove 32b, improving the ease of assembly and positioning accuracy of the first heat sink 41 and the second heat sink 42. As a result of improving the positioning accuracy of the first heat sink 41 and the second heat sink 42, the distance between the first heat sink 41 and the second heat sink 42 and the capacitor 10a can be set with high accuracy, and the thickness of the sealing material 50 can be reduced to reduce the thermal resistance between the capacitor 10a and the first heat sink 41 and the second heat sink 42.

[0089] Furthermore, in the power conversion device 100B, the first heat sink 41 and the second heat sink 42 are fixed to the bottom wall 32, so that the sealing material 50 can be more reliably filled into the space defined by the two adjacent first heat sinks 41, the two adjacent second heat sinks 42, and the bottom wall 32.

[0090] (Variation 1 of power conversion device 100B) FIG. 17 is a plan view of the case 30 of the first modification of the power converter 100B. As shown in FIG. 17, in the power converter 100B, the third groove 32a may be widened at a portion where it intersects with the fourth groove 32b, and the fourth groove 32b may be widened at a portion where it intersects with the third groove 32a. Although not shown, in the power converter 100B, the third groove 32a may be widened at an end in the second direction DR2, and the fourth groove 32b may be widened at an end in the third direction DR3. In this case, the widened portions of the third groove 32a and the fourth groove 32b become brazing material pools, and it is possible to prevent the brazing material 33 from overflowing from the third groove 32a and the fourth groove 32b and causing a joint failure.

[0091] (Modification 2 of power conversion device 100B) Fig. 18 is an enlarged cross-sectional view of the power converter 100B of the second modification in the vicinity of the first groove 31aa. Fig. 19 is an enlarged cross-sectional view of the power converter 100B of the second modification in the vicinity of the second groove 31ba. Figs. 18 and 19 show enlarged cross sections perpendicular to the first direction DR1. As shown in Figs. 18 and 19, in the power converter 100B, the first heat sink 41 may be metal-joined to the first groove 31aa on the first end 41a side, and may be metal-joined to the second groove 31ba on the second end 41b side.

[0092] The metal bonding between the first heat sink 41 and the first groove 31aa and the second groove 31ba is performed, for example, by a brazing material 33. The metal bonding between the first heat sink 41 and the first groove 31aa and the second groove 31ba may be performed by welding. In this case, the thermal resistance between the first heat sink 41 and the side wall 31 is reduced, so that the temperature rise of the capacitor 10a can be further suppressed.

[0093] Embodiment 4 A power conversion device according to embodiment 4 will be described. The power conversion device according to embodiment 4 is assumed to be a power conversion device 100C. Here, differences from the power conversion device 100A will be mainly described, and overlapping descriptions will not be repeated.

[0094] The power conversion device 100C includes a plurality of circuit components 10, a case 30, a plurality of first heat sinks 41 and a plurality of second heat sinks 42, a sealing material 50, and a printed wiring board 60. In this respect, the configuration of the power conversion device 100C is common to the configuration of the power conversion device 100A.

[0095] FIG. 20 is an enlarged cross-sectional view of the power converter 100C in the vicinity of the third groove 32a. FIG. 20 shows an enlarged cross-section perpendicular to the second direction DR2. FIG. 21 is an enlarged cross-sectional view of the power converter 100C in the vicinity of the fourth groove 32b. FIG. 21 shows an enlarged cross-section perpendicular to the third direction DR3. As shown in FIG. 20 and FIG. 21, in the power converter 100C, the first heat sink 41 is metal-joined to the third groove 32a by crimping at the third end 41c side. In the power converter 100C, the second heat sink 42 is metal-joined to the fourth groove 32b by crimping at the fifth end 42a side.

[0096] More specifically, in the power converter 100C, the crimping groove 32ca and the crimping groove 32cb are formed on the inner wall surface of the bottom wall 32. The crimping groove 32ca and the crimping groove 32cb extend along the second direction DR2. The third groove 32a is disposed between the crimping groove 32ca and the crimping groove 32cb in the third direction DR3. In addition, in the power converter 100C, the crimping groove 32da and the crimping groove 32db are formed on the inner wall surface of the bottom wall 32. The crimping groove 32da and the crimping groove 32db extend along the third direction DR3. The fourth groove 32b is disposed between the crimping groove 32da and the crimping groove 32db in the second direction DR2.

[0097] When the first heat sink 41 is crimped into the third groove 32a, a press tool is inserted into the crimping groove 32ca and the crimping groove 32cb. As a result, the part of the bottom wall 32 between the crimping groove 32ca and the third groove 32a and the part of the bottom wall 32 between the crimping groove 32cb and the third groove 32a are plastically deformed toward the first heat sink 41 side, and the first heat sink 41 is crimped into the third groove 32a. Similarly, the second heat sink 42 is crimped into the fourth groove 32b by inserting a press tool into the crimping groove 32da and the crimping groove 32db. Note that the first heat sink 41 does not have to be crimped into the third groove 32a at all the parts inserted into the third groove 32a, and the second heat sink 42 does not have to be crimped into the fourth groove 32b at all the parts inserted into the fourth groove 32b. In these respects, the configuration of the power conversion device 100C is different from the configuration of the power conversion device 100A.

[0098] (Effects of the power conversion device 100C) The effects of the power conversion device 100C will be described below.

[0099] In the power conversion device 100C, the first heat sink 41 is metal-joined to the third groove 32a and the second heat sink 42 is metal-joined to the fourth groove 32b by crimping, so that the thermal resistance between the first heat sink 41 and the bottom wall 32 and between the second heat sink 42 and the bottom wall 32 is reduced. As a result, the power conversion device 100C can further suppress the temperature rise of the capacitor 10a.

[0100] In addition, in the power conversion device 100C, the first heat sink 41 is metal-joined to the third groove 32a and the second heat sink 42 is metal-joined to the fourth groove 32b by crimping, improving the ease of assembly and positioning accuracy of the first heat sink 41 and the second heat sink 42. As a result of improving the positioning accuracy of the first heat sink 41 and the second heat sink 42, the distance between the first heat sink 41 and the second heat sink 42 and the capacitor 10a can be set with high accuracy, and the thickness of the sealing material 50 can be reduced to reduce the thermal resistance between the capacitor 10a and the first heat sink 41 and the second heat sink 42.

[0101] Furthermore, in the power conversion device 100C, the first heat sink 41 and the second heat sink 42 are fixed to the bottom wall 32, so that the sealing material 50 can be more reliably filled into the space defined by the two adjacent first heat sinks 41, the two adjacent second heat sinks 42, and the bottom wall 32.

[0102] (Variation 1 of power conversion device 100C) FIG. 22 is an enlarged cross-sectional view of the power converter 100C in the vicinity of the bottom wall 32. FIG. 22 shows an enlarged cross-section perpendicular to the second direction DR2. As shown in FIG. 22, in the power converter 100C, a plurality of fifth grooves 32e may be formed on the outer wall surface of the bottom wall 32. The fifth grooves 32e extend along the second direction DR2. The plurality of fifth grooves 32e are arranged at intervals in the third direction DR3. The fifth grooves 32e may extend along the third direction DR3. In this case, the plurality of fifth grooves 32e are arranged at intervals in the second direction DR2.

[0103] In the power conversion device 100C, a crimping groove 32ea and a crimping groove 32eb may be further formed on the outer wall surface of the bottom wall 32. The crimping groove 32ea and the crimping groove 32eb extend along the second direction DR2. The fifth groove 32e is disposed between the crimping groove 32ea and the crimping groove 32eb. When the fifth groove 32e extends along the third direction DR3, the crimping groove 32ea and the crimping groove 32eb extend along the third direction DR3.

[0104] The power conversion device 100C may have a plurality of plate members 34. The plate members 34 are inserted into the fifth groove 32e and crimped into the fifth groove 32e. The plate members 34 are crimped into the fifth groove 32e by inserting a press tool into the crimping grooves 32ea and 32eb. The plate members 34 crimped into the fifth groove 32e function as cooling fins, improving the heat dissipation from the case 30 to the outside air and further suppressing the temperature rise of the capacitor 10a.

[0105] (Modification 2 of power conversion device 100C) Fig. 23 is an enlarged cross-sectional view of the power converter 100C of the second modification in the vicinity of the first groove 31aa. Fig. 24 is an enlarged cross-sectional view of the power converter 100C of the second modification in the vicinity of the second groove 31ba. Figs. 23 and 24 show enlarged cross sections perpendicular to the first direction DR1. As shown in Figs. 23 and 24, in the power converter 100C, the first heat sink 41 may be metal-joined to the first groove 31aa at the first end 41a side by crimping, and may be metal-joined to the second groove 31ba at the second end 41b side by crimping.

[0106] In the power conversion device 100C, the crimping groove 31ab and the crimping groove 31ac may be formed on the inner wall surface of the first side wall portion 31a. In the power conversion device 100C, the crimping groove 31bb and the crimping groove 31bc may be formed on the inner wall surface of the second side wall portion 31b. The crimping groove 31ab, the crimping groove 31ac, the crimping groove 31bb, and the crimping groove 31bc extend along the first direction DR1. The first groove 31aa is disposed between the crimping groove 31ab and the crimping groove 31ac, and the second groove 31ba is disposed between the crimping groove 31bb and the crimping groove 31bc.

[0107] The first heat sink 41 is crimped into the first groove 31aa by inserting a press tool into the crimp grooves 31ab and 31ac, and is crimped into the second groove 31ba by inserting a press tool into the crimp grooves 31bb and 31bc. In this case, the thermal resistance between the first heat sink 41 and the side wall 31 is reduced, so that the temperature rise of the capacitor 10a can be further suppressed.

[0108] Embodiment 5. A power conversion device according to the fifth embodiment will be described. The power conversion device according to the fifth embodiment is assumed to be a power conversion device 100D. Here, differences from the power conversion device 100 will be mainly described, and overlapping descriptions will not be repeated.

[0109] (Configuration of power conversion device 100D) The configuration of the power conversion device 100D will be described below.

[0110] The power conversion device 100D has a plurality of circuit components 10, a case 30, a plurality of first heat dissipation plates 41 and a plurality of second heat dissipation plates 42, a sealing material 50, and a printed wiring board 60. In this respect, the configuration of the power conversion device 100D is common to the configuration of the power conversion device 100.

[0111] FIG. 25 is a cross-sectional view of the power conversion device 100D. FIG. 25 shows a cross section at a position corresponding to IV-IV in FIG. 2. As shown in FIG. 25, in the power conversion device 100D, the capacitor 10a does not have an outer case 13 and a sealing resin 14. The power conversion device 100D further has an insulating net 70. The insulating net 70 is a net-shaped member formed of an insulating resin material. The insulating net 70 is formed of, for example, an epoxy resin, a silicone resin, a urethane resin, or the like. The insulating net 70 may be formed of a rubber material having flexibility and stretchability.

[0112] The insulating net 70 is disposed in a space defined by two adjacent first heat sinks 41, two adjacent second heat sinks 42, and the bottom wall 32 so as to surround the capacitor 10a. That is, the insulating net 70 is positioned between the capacitor 10a and the first heat sink 41, the second heat sink 42, and the bottom wall 32. In the example shown in FIG. 25, the insulating net 70 and the capacitor 10a are not in contact with each other, but the insulating net 70 may be in contact with the capacitor 10a. It is only necessary that the insulating net 70 prevents the capacitor 10a from contacting the first heat sink 41, the second heat sink 42, and the bottom wall 32.

[0113] In the power conversion device 100D, the sealing material 50 may not have the heat dissipation auxiliary material 51 and the molding material 52. In the power conversion device 100D, the sealing material 50 may be formed by potting any resin material. In these respects, the configuration of the power conversion device 100D is different from the configuration of the power conversion device 100.

[0114] (Effects of the power conversion device 100D) The effects of the power conversion device 100D will be described below.

[0115] In the power conversion device 100D, since the capacitor 10a does not have the exterior case 13 and the sealing resin 14, the number of turns of the metal film and the dielectric film in the capacitor 10a can be increased, and the capacitance of each capacitor 10a can be increased. Also, in the power conversion device 100D, since the capacitor 10a does not have the exterior case 13 and the sealing resin 14, the cost of the capacitor 10a can be reduced.

[0116] In the power conversion device 100D, since the insulating net 70 is disposed between the capacitor 10a and the first heat sink 41, the second heat sink 42, and the bottom wall 32, it is possible to ensure insulation between the capacitor 10a and the first heat sink 41, the second heat sink 42, and the bottom wall 32 even without the exterior case 13 and the sealing resin 14. In the power conversion device 100D, since a resin material having a higher thermal conductivity than the sealing resin 14 can be used as the sealing material 50, the heat generated by the capacitor 10a can be efficiently transferred to the case 30.

[0117] (Modifications 1, 2, and 3 of Power Converter 100D) Fig. 26 is a cross-sectional view of Modification 1 of the power conversion device 100D. Fig. 26 shows a cross section at a position corresponding to IV-IV in Fig. 2. As shown in Fig. 26, in the power conversion device 100D, insulating paper 71 may be used instead of the insulating net 70. The insulating paper 71 is arranged in a space defined by two adjacent first heat dissipation plates 41, two adjacent second heat dissipation plates 42, and the bottom wall 32 so as to surround the capacitor 10a.

[0118] Fig. 27 is a cross-sectional view of Modification 2 of the power conversion device 100D. Fig. 27 shows a cross section at a position corresponding to IV-IV in Fig. 2. As shown in Fig. 27, in the power conversion device 100D, a thermally conductive insulating sheet 72 may be used instead of the insulating net 70. The thermally conductive insulating sheet 72 is disposed in a space defined by two adjacent first heat dissipation plates 41, two adjacent second heat dissipation plates 42, and the bottom wall 32.

[0119] Fig. 28 is a cross-sectional view of Modification 3 of the power conversion device 100D. Fig. 28 shows a cross section at a position corresponding to IV-IV in Fig. 2. As shown in Fig. 28, in the power conversion device 100D, spacers 73 may be used instead of the insulating net 70. The spacers 73 are disposed between the capacitor 10a and the first heat sink 41, between the capacitor 10a and the second heat sink 42, and between the capacitor 10a and the bottom wall 32. The spacers 73 are formed of, for example, a resin material.

[0120] Even in these cases, contact between the capacitor 10a and the first heat sink 41, the second heat sink 42, and the bottom wall 32 is prevented by the insulating paper 71, the thermally conductive insulating sheet 72, or the spacer 73, so that insulation between the first heat sink 41, the second heat sink 42, and the bottom wall 32 can be ensured.

[0121] (Fourth Modification of Power Converter 100D) Fig. 29 is a cross-sectional view of Modification 4 of the power conversion device 100D. Fig. 29 shows a cross section at a position corresponding to IV-IV in Fig. 2. As shown in Fig. 29, in the power conversion device 100D, the sealing material 50 may be silicone gel 53. It is preferable that the silicone gel 53 has low viscosity and high insulating properties.

[0122] Since the silicone gel 53 has high adhesion to the capacitor 10a, the first heat sink 41, and the second heat sink 42, there is no need to consider creepage at the boundaries between the capacitor 10a, the first heat sink 41, and the second heat sink 42 in the evaluation of insulation. Therefore, in this case, an insulating area for ensuring the creepage distance is not required, and the area around the capacitor 10a can be made smaller. In particular, in the power conversion device 100D using the insulating net 70, the use of the silicone gel 53 can ensure high insulation, i.e., high creepage dielectric strength and through dielectric strength.

[0123] In this case, heat generated by capacitor 10a can be efficiently transferred to case 30. Furthermore, silicone gel 53 has a high penetration degree, i.e., it is a soft material. Therefore, in this case, reliability can be improved when power conversion device 100 is subjected to a heat cycle or power cycle. Note that since capacitor 10a is also fixed in position by mounting printed wiring board 60 to case 30, even if silicone gel 53 has a high penetration degree, there is no problem in fixing capacitor 10a in position.

[0124] Embodiment 6 A power conversion device according to the sixth embodiment will be described. The power conversion device according to the sixth embodiment is referred to as a power conversion device 100E. Here, differences from the power conversion device 100 will be mainly described, and overlapping descriptions will not be repeated.

[0125] (Configuration of power conversion device 100E) The configuration of the power conversion device 100E will be described below.

[0126] The power conversion device 100E has a plurality of circuit components 10, a case 30, a plurality of first heat dissipation plates 41 and a plurality of second heat dissipation plates 42, a sealing material 50, and a printed wiring board 60. In this respect, the configuration of the power conversion device 100E is common to the configuration of the power conversion device 100.

[0127] FIG. 30 is a side view of the first heat sink 41 of the power converter 100E. As shown in FIG. 30, in the power converter 100E, a plurality of through holes 41f are formed in the first heat sink 41. The through holes 41f penetrate the first heat sink 41 along the thickness direction. The plurality of through holes 41f are arranged at intervals in the second direction DR2. The through holes 41f are arranged between two adjacent first plugs 41e. In the power converter 100E, the width of the first plug 41e in the second direction DR2 is larger than the thickness of the second heat sink 42. More specifically, in the power converter 100E, the width of the first plug 41e in the second direction DR2 may be 0.1 mm or more larger than the thickness of the second heat sink 42, and is preferably 0.5 mm or more larger than the thickness of the second heat sink 42.

[0128] FIG. 31 is a side view of the second heat sink 42 of the power converter 100E. As shown in FIG. 31, in the power converter 100E, a plurality of through holes 42d are formed in the second heat sink 42. The through holes 42d penetrate the second heat sink 42 along the thickness direction. The plurality of through holes 42d are arranged at intervals in the third direction DR3. The through holes 42d are arranged between two adjacent second plugs 42c. In the power converter 100E, the width of the second plug 42c in the third direction DR3 is larger than the thickness of the first heat sink 41. More specifically, in the power converter 100E, the width of the second plug 42c in the third direction DR3 may be 0.1 mm or more larger than the thickness of the first heat sink 41, and is preferably 0.5 mm or more larger than the thickness of the first heat sink 41.

[0129] In the power conversion device 100E, it is sufficient that at least one of the following is satisfied: a through hole 41f is formed in the first heat sink 41, a through hole 42d is formed in the second heat sink 42, the width of the first plug-in 41e in the second direction DR2 is sufficiently larger than the thickness of the second heat sink 42, and the width of the second plug-in 42c in the third direction DR3 is sufficiently larger than the thickness of the first heat sink 41. In these respects, the configuration of the power conversion device 100E differs from the configuration of the power conversion device 100.

[0130] The effects of the power conversion device 100E will be described below. In the power converter 100E, the first heat sink 41 has a through hole 41f, and the second heat sink 42 has a through hole 42d. Therefore, the sealing material 50 is easily injected through the through hole 41f and the through hole 42d into the space defined by the two adjacent first heat sinks 41, the two adjacent second heat sinks 42, and the bottom wall 32. As a result, voids are less likely to occur in the sealing material 50 in the space defined by the two adjacent first heat sinks 41, the two adjacent second heat sinks 42, and the bottom wall 32. If there are no voids in the sealing material 50, the thermal resistance of the sealing material 50 is reduced. Therefore, in the power converter 100E, the temperature rise of the capacitor 10a can be further suppressed.

[0131] In the power conversion device 100E, the sealant 50 is also present in the through holes 41f and 42d. Therefore, in the power conversion device 100E, the adhesion between the first heat sink 41 and the second heat sink 42 and the sealant 50 can be further improved. In addition, in the power conversion device 100E, the through holes 41f and 42d are formed, and as a result, the amount of material used to form the first heat sink 41 and the second heat sink 42 is reduced, so that the manufacturing cost and weight of the first heat sink 41 and the second heat sink 42 can be reduced.

[0132] In the power converter 100E, the width of the first plug-in 41e in the second direction DR2 is sufficiently larger than the thickness of the second heat sink 42, and the width of the second plug-in 42c in the third direction DR3 is sufficiently larger than the thickness of the first heat sink 41, so that the second heat sink 42 can be easily attached to the first heat sink 41. Therefore, the power converter 100E can improve the ease of assembly.

[0133] Embodiment 7 A power conversion device according to the seventh embodiment will be described. The power conversion device according to the seventh embodiment is referred to as a power conversion device 100F. Here, differences from the power conversion device 100 will be mainly described, and overlapping descriptions will not be repeated.

[0134] (Configuration of power conversion device 100F) The configuration of the power conversion device 100F will be described below.

[0135] The power conversion device 100F has a plurality of circuit components 10, a case 30, a plurality of first heat dissipation plates 41 and a plurality of second heat dissipation plates 42, a sealing material 50, and a printed wiring board 60. In this respect, the configuration of the power conversion device 100F is common to the configuration of the power conversion device 100.

[0136] FIG. 32 is an exploded perspective view of the printed wiring board 60 of the power converter 100F. As shown in FIG. 32, in the power converter 100F, the printed wiring board 60 has a plurality of layers that are stacked. In the example shown in FIG. 32, the printed wiring board 60 has a four-layer structure and has a first layer 60d, a second layer 60e, a third layer 60f, and a fourth layer 60g. However, the power converter 100F is not limited to the case where the printed wiring board 60 has a four-layer structure. The first layer 60d, the second layer 60e, the third layer 60f, and the fourth layer 60g are stacked in this order from the first surface 60a toward the second surface 60b.

[0137] In the power conversion device 100F, each of the layers constituting the printed wiring board 60 has a wiring pattern. In the example shown in FIG. 32, the wiring patterns of the first layer 60d, the second layer 60e, the third layer 60f, and the fourth layer 60g are the wiring pattern 60h, the wiring pattern 60i, the wiring pattern 60j, and the wiring pattern 60k, respectively. A potential different from that of the wiring pattern 60i and the wiring pattern 60j is applied to the wiring pattern 60h and the wiring pattern 60j. For example, when a positive potential is applied to the wiring pattern 60h and the wiring pattern 60j, a negative potential is applied to the wiring pattern 60i and the wiring pattern 60j. Note that the wiring patterns adjacent to each other in the thickness direction of the printed wiring board 60 are insulated from each other. It is preferable that the wiring pattern 60h is disposed near a portion where the side wall 31 and the printed wiring board 60 are in contact with each other. In these respects, the configuration of the power conversion device 100F is different from the configuration of the power conversion device 100.

[0138] (Effects of the power conversion device 100F) The effects of the power conversion device 100F will be described below.

[0139] In the power conversion device 100F, wiring patterns of different potentials are alternately laminated, so that stray capacitance occurs between the layers. As a result, the required capacitance of the capacitor 10a can be compensated for by the stray capacitance of the printed wiring board 60, so that the number of capacitors 10a connected in series or in parallel can be reduced. In addition, in the power conversion device 100F, wiring patterns of different potentials are arranged in parallel, so that the inductance between the wiring patterns can be reduced. As a result, the surge voltage caused by the switching of the switching circuit 120 can be reduced.

[0140] When an AC current flows through the printed wiring board 60 during operation of the power conversion device 100F, power consumption occurs due to the resistance component of the printed wiring board 60, and the printed wiring board 60 generates heat. In the example shown in Fig. 32, the wiring patterns 60h, 60i, 60j, and 60k generate heat. When the wiring pattern 60h is disposed near the portion where the side wall 31 and the printed wiring board 60 contact each other, it is possible to suppress a rise in temperature of the wiring pattern 60h.

[0141] Embodiment 8 A power conversion device according to the eighth embodiment will be described. The power conversion device according to the eighth embodiment is referred to as a power conversion device 100G. Here, differences from the power conversion device 100 will be mainly described, and overlapping descriptions will not be repeated.

[0142] (Configuration of power conversion device 100G) The configuration of the power conversion device 100G will be described below.

[0143] The power conversion device 100G has a plurality of circuit components 10, a case 30, a plurality of first heat sinks 41 and a plurality of second heat sinks 42, a sealing material 50, and a printed wiring board 60. In this respect, the configuration of the power conversion device 100G is common to the configuration of the power conversion device 100.

[0144] FIG. 33 is a bottom view of the printed wiring board 60 of the power conversion device 100G. FIG. 34 is a schematic cross-sectional view taken along line XXXIV-XXXIV in FIG. 33. FIG. 35 is a schematic cross-sectional view taken along line XXXV-XXXV in FIG. 33. As shown in FIGS. 33 to 35, in the power conversion device 100G, the first heat sink 41 and the second heat sink 42 are connected to the printed wiring board 60. The first heat sink 41 and the second heat sink 42 are connected to the printed wiring board 60 by, for example, soldering. In these respects, the configuration of the power conversion device 100G is different from that of the power conversion device 100.

[0145] (Method of assembling the power conversion device 100G) A method for assembling the power conversion device 100G will be described below.

[0146] In assembling the power conversion device 100G, first, the case 30 and the printed wiring board 60 to which the multiple first heat sinks 41, the multiple second heat sinks 42, and the multiple capacitors 10a are connected are prepared. Second, the sealing material 50 is injected into the case 30. Third, the printed wiring board 60 to which the multiple first heat sinks 41, the multiple second heat sinks 42, and the multiple capacitors 10a are connected is attached to the case 30. Fourth, the sealing material 50 is hardened. With the above, the assembly of the power conversion device 100G is completed.

[0147] (Effects of the 100G power conversion device) The effects of the power conversion device 100G will be described below.

[0148] In the power conversion device 100G, the first heat sink 41 and the second heat sink 42 are connected to the printed wiring board 60 in advance, which improves the ease of assembling the first heat sink 41 and the second heat sink 42 to the case 30. Furthermore, in the power conversion device 100G, the positioning accuracy of the capacitor 10a, the first heat sink 41, and the second heat sink 42 is improved, so that the thickness of the sealing material 50 can be reduced to reduce the thermal resistance between the capacitor 10a and the first heat sink 41 and the second heat sink 42.

[0149] Furthermore, in the power conversion device 100G, since the first heat sink 41 and the second heat sink 42 are connected to the printed wiring board 60, the heat generated by the printed wiring board 60 is dissipated from the case 30 via the first heat sink 41 and the second heat sink 42, thereby suppressing the temperature rise of the printed wiring board 60 and enabling the heating of the entire power conversion device 100G to be uniform.

[0150] The embodiments disclosed herein are illustrative in all respects and should not be considered as limiting. The basic scope of the present disclosure is defined by the claims, not the above-described embodiments, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0151] 100, 100A, 100B, 100C, 100D, 100E, 100F, 100G, 101, 102 power conversion device, 10 circuit components, 10a capacitor, 10b inductor, 10c contactor, 10d discharge resistor, 10e charge resistor, 11 capacitor element body, 11a electrode surface, 12 lead wire, 13 exterior case, 14 sealing resin, 20 circuit components, 20a, 20b, 20c, 20d, 20e, 20f transistor, 20g, 20h, 20i, 20j, 20k, 20l diode, 30 case, 31 side wall, 31a first side wall portion, 31aa first groove, 31ab, 31ac crimping groove, 31b second side wall portion, 31ba second groove, 31bb, 31bc crimping groove, 31c third side wall portion, 31d fourth side wall portion, 31e groove, 32 bottom wall, 32a third groove, 32b fourth groove, 32ca, 32cb crimping groove, 32da, 32db crimping groove, 32e fifth groove, 32ea, 32eb crimping groove, 33 brazing material, 34 plate member, 41 first heat sink, 41a first end, 41b second end, 41c third end, 41d fourth end, 41e first insertion port, 41f through hole, 42 second heat sink, 42a fifth end, 42b sixth end, 42c second insertion port, 42d through hole, 42e seventh end, 42f eighth end, 50 sealing material, 51 heat dissipation auxiliary material, 52 molding material, 53 silicone gel, 60 Printed wiring board, 60a first surface, 60b second surface, 60c external connection terminal, 60d first layer, 60e second layer, 60f third layer, 60g fourth layer, 60h, 60i, 60j, 60k wiring patterns, 61 connection member, 70 insulating net, 71 insulating paper, 72 thermally conductive insulating sheet, 73 spacer, 110 peripheral circuit, 120 switching circuit, 130 DC supply circuit, 140 motor, 141, 142, 143 input line, DR1 first direction, DR2 second direction, DR3 third direction.

Claims

1. a case having a side wall and a bottom wall; a plurality of first heat sinks, a plurality of second heat sinks, a plurality of circuit components, and a sealing material disposed within the case; a printed wiring board electrically connected to the plurality of circuit components and attached to the case; A normal line of the inner wall surface of the bottom wall is along a first direction, Each of the plurality of first heat dissipation plates extends along a second direction perpendicular to the first direction, and is arranged at intervals in a third direction perpendicular to the first direction and the second direction, Each of the plurality of second heat dissipation plates extends along the third direction and is arranged at intervals in the second direction, each of the plurality of circuit components is disposed within a space defined by adjacent two of the plurality of first heat sinks, adjacent two of the plurality of second heat sinks, and the bottom wall; The sealing material is filled in the space, The side wall has a first side wall portion and a second side wall portion facing the first side wall portion in the second direction, A plurality of first grooves are formed on an inner wall surface of the first sidewall portion, the first grooves extending along the first direction and being spaced apart in the third direction, A plurality of second grooves are formed on an inner wall surface of the second side wall portion, the second grooves extending along the first direction and spaced apart in the third direction, Each of the plurality of first heat dissipation plates has a first end and a second end opposite to the first end in the second direction, a power conversion device, wherein the first end and the second end of each of the plurality of first heat sinks are inserted into each of the plurality of first grooves and each of the plurality of second grooves, respectively.

2. Each of the plurality of first heat dissipation plates has a third end that is an end on the bottom wall side in the first direction and a fourth end that is an end opposite to the third end, Each of the first heat dissipation plates has a plurality of first insertion openings extending from the fourth end toward the third end and arranged at intervals in the second direction, Each of the plurality of second heat dissipation plates has a fifth end that is an end on the bottom wall side in the first direction and a sixth end that is an end opposite to the fifth end, Each of the second heat dissipation plates has a plurality of second insertion openings extending from the fifth end toward the sixth end and spaced apart in the third direction, The power conversion device according to claim 1 , wherein the second heat sinks are attached to the first heat sinks by inserting the second sockets into the first sockets.

3. The power conversion device according to claim 1 , wherein the sealing material comprises a heat dissipation auxiliary material applied onto the bottom wall, and a molding material disposed on the heat dissipation auxiliary material so as to surround each of the plurality of circuit components.

4. Each of the plurality of second heat dissipation plates has a seventh end and an eighth end that is an end opposite to the seventh end in the third direction, The power conversion device according to claim 1 , wherein the sealing material is disposed between the seventh end and the case and between the eighth end and the case.

5. A plurality of third grooves are formed on an inner wall surface of the bottom wall, the third grooves extending along the second direction and spaced apart in the third direction, The power conversion device according to claim 1 , wherein each of the first heat sinks is inserted into each of the third grooves.

6. The power conversion device according to claim 5 , wherein each of the plurality of first heat sinks is joined to each of the plurality of third grooves.

7. The power conversion device according to claim 1 , wherein at least one of the plurality of first heat dissipation plates and the plurality of second heat dissipation plates has a through hole formed therein.

8. Each of the plurality of circuit components includes an element body having an electrode surface, a lead wire connected to the electrode surface, and an exterior case housing the element body, The power conversion device according to claim 1 , wherein each of the plurality of circuit components is arranged such that the electrode surface faces one of the plurality of first heat sinks.

9. the printed wiring board has a first surface facing the case and a second surface opposite the first surface; 2. The power conversion device according to claim 1, wherein the printed wiring board has a first wiring pattern on the first surface, and a second wiring pattern laminated with the first wiring pattern and applied with a potential different from that of the first wiring pattern.

10. A case having a side wall and a bottom wall; a plurality of first heat sinks, a plurality of second heat sinks, a plurality of circuit components, and a sealing material disposed within the case; a printed wiring board electrically connected to the plurality of circuit components and attached to the case; A normal line of the inner wall surface of the bottom wall is along a first direction, Each of the plurality of first heat dissipation plates extends along a second direction perpendicular to the first direction, and is arranged at intervals in a third direction perpendicular to the first direction and the second direction, Each of the plurality of second heat dissipation plates extends along the third direction and is arranged at intervals in the second direction, each of the plurality of circuit components is disposed within a space defined by adjacent two of the plurality of first heat sinks, adjacent two of the plurality of second heat sinks, and the bottom wall; The sealing material is filled in the space, Each of the plurality of circuit components includes an element body having an electrode surface, a lead wire connected to the electrode surface, and an exterior case housing the element body, each of the plurality of circuit components is disposed such that the electrode surface faces one of the plurality of first heat sinks; The side wall has a first side wall portion and a second side wall portion facing the first side wall portion in the second direction, A plurality of first grooves are formed on an inner wall surface of the first sidewall portion, the first grooves extending along the first direction and being spaced apart in the third direction, A plurality of second grooves are formed on an inner wall surface of the second side wall portion, the second grooves extending along the first direction and spaced apart in the third direction, Each of the plurality of first heat dissipation plates has a first end and a second end opposite to the first end in the second direction, a power conversion device, wherein the first end and the second end of each of the plurality of first heat sinks are inserted into each of the plurality of first grooves and each of the plurality of second grooves, respectively.

11. the printed wiring board has a first surface facing the case and a second surface opposite the first surface; 11. The power conversion device according to claim 10, wherein the printed wiring board has a first wiring pattern on the first surface, and a second wiring pattern laminated with the first wiring pattern and to which a potential different from that of the first wiring pattern is applied.

12. Further comprising a plurality of insulating nets; Each of the plurality of circuit components includes an element body having an electrode surface and a lead wire connected to the electrode surface, The power conversion device according to claim 1 , wherein each of the plurality of insulating nets is arranged so as to cover the element body of each of the plurality of circuit components.

13. A case having a side wall and a bottom wall; a plurality of first heat sinks, a plurality of second heat sinks, a plurality of circuit components, and a sealing material disposed within the case; a printed wiring board electrically connected to the plurality of circuit components and attached to the case; A normal line of the inner wall surface of the bottom wall is along a first direction, Each of the plurality of first heat dissipation plates extends along a second direction perpendicular to the first direction, and is arranged at intervals in a third direction perpendicular to the first direction and the second direction, Each of the plurality of second heat dissipation plates extends along the third direction and is arranged at intervals in the second direction, each of the plurality of circuit components is disposed within a space defined by adjacent two of the plurality of first heat sinks, adjacent two of the plurality of second heat sinks, and the bottom wall; The sealing material is filled in the space, the printed wiring board has a first surface facing the case and a second surface opposite the first surface; the printed wiring board has a first wiring pattern on the first surface, and a second wiring pattern laminated with the first wiring pattern and having a potential different from that of the first wiring pattern applied thereto; The side wall has a first side wall portion and a second side wall portion facing the first side wall portion in the second direction, A plurality of first grooves are formed on an inner wall surface of the first sidewall portion, the first grooves extending along the first direction and being spaced apart in the third direction, A plurality of second grooves are formed on an inner wall surface of the second side wall portion, the second grooves extending along the first direction and being spaced apart in the third direction, Each of the plurality of first heat dissipation plates has a first end and a second end opposite to the first end in the second direction, a power conversion device, wherein the first end and the second end of each of the plurality of first heat sinks are inserted into each of the plurality of first grooves and each of the plurality of second grooves, respectively.

14. Each of the plurality of circuit components includes an element body having an electrode surface, a lead wire connected to the electrode surface, and an exterior case housing the element body, The power conversion device according to claim 13 , wherein each of the plurality of circuit components is arranged such that the electrode surface faces one of the plurality of first heat sinks.

15. The power conversion device according to claim 1 , wherein at least one of the plurality of first heat sinks and the plurality of second heat sinks is connected to the printed wiring board.

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