Detergent composition and concentrate for detergent composition

Abstract

To provide a detergent composition that has excellent detergency in narrow gap and has suppressed reactivity to metal and resin, and to provide an undiluted solution for detergent composition.SOLUTION: Provided is a detergent composition that contains a hydrophilic glycol ether compound, a hydrophobic tertiary amine compound, a phosphonic acid compound, and water, and in which the hydrophobic tertiary amine compound is a compound represented by the formula (1), and the detergent composition is visually uniform in a temperature range of 10 to 70°C.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a detergent composition and a concentrate for a detergent composition. [Background technology]

[0002] It has been known for some time that when electronic components such as camera module components, integrated circuits (ICs), and capacitors are soldered to printed circuit boards, etc., flux scatters from the solder paste and adheres to the electrodes as residue (hereinafter, the above-mentioned flux residue may be referred to as "flux residue").

[0003] Flux residue can cause corrosion at solder joints, poor bonding during wire bonding, and poor adhesion with molding resin during resin sealing, etc. Therefore, flux residue needs to be removed with a cleaner, and various cleaners have been proposed. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-052277 A [Patent Document 2] International Publication No. 2020 / 116524 Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, detergent compositions have been proposed which contain a relatively large amount of water and thus are excellent in environmental safety while still exhibiting excellent cleaning properties. For example, JP 2019-052277 A (Patent Document 1) discloses a cleaning agent composition concentrate comprising four components: a hydrophobic glycol ether compound (A) having a boiling point of 200 ° C. or higher and a solubility in water at 20 ° C. of 10% by weight or less; an amino alcohol compound (B) having a boiling point of 200 ° C. or higher; a compound (C) having a boiling point of 200 ° C. or higher and an octanol / water partition coefficient (logP) of less than 0, which is represented by a predetermined structural formula; and water (D). The weight ratios are 50 to 90 parts by weight of component (A), 3 to 30 parts by weight of component (B), 5 to 40 parts by weight of component (C), and 1 to 10 parts by weight of component (D). The cleaning agent composition concentrate is characterized in that the cleaning agent composition obtained by mixing 100 to 1500 parts by weight of water with 100 parts by weight of the cleaning agent composition concentrate is in a cloudy state at 1 to 90 ° C.

[0006] International Publication No. 2020 / 116524 (Patent Document 2) discloses a cleaning agent composition for removing flux residue, which contains a solvent (component A), an amine (component B) having a polar term (δp) of the Hansen solubility parameter of 7.8 or less, and a diphosphonic acid (component C) represented by a specific chemical formula.

[0007] However, the cleaning composition prepared from the cleaning composition concentrate described in Patent Document 1 is corrosive to metals such as copper, and when the object to be cleaned is made of metal, the object to be cleaned is corroded. In addition, it is known that cleaning is performed by showering to remove flux residues present in narrow gaps into which the cleaning composition is unlikely to penetrate (for example, a gap formed between a substrate and a component connected to the substrate, the distance between the two being 30 to 100 μm), which places a large burden on the object to be cleaned. The cleaning composition described in Patent Document 2 is not corrosive to metals, but there is still room for improvement in cleaning properties. Under these circumstances, it is necessary to select an appropriate cleaning composition and an appropriate cleaning method depending on the material of the object to be cleaned, and therefore further improvement of cleaning compositions is required.

[0008] The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a cleaning composition and a concentrate solution for a cleaning composition that have excellent cleaning ability in narrow gaps and suppressed reactivity with metals and resins. [Means for solving the problem]

[0009] The present inventors have conducted intensive research to solve the above problems, and as a result have found that a cleaning composition containing a hydrophilic glycol ether compound, a hydrophobic tertiary amine compound having a specific chemical structure, a phosphonic acid compound, and water has excellent cleaning properties in narrow gaps and suppressed reactivity with metals and resins, and have completed the present invention. That is, the present invention is as follows.

[0010] [1] A cleaning composition comprising a hydrophilic glycol ether compound, a hydrophobic tertiary amine compound, a phosphonic acid compound, and water, The hydrophobic tertiary amine compound is a compound represented by formula (1): The above cleaning composition is homogeneous in appearance within a temperature range of 10 to 70°C. [ka] (In formula (1), R 1 represents a chain hydrocarbon group having 8 to 22 carbon atoms, and R 2 and R 3 each independently represents a methyl group, an ethyl group, or a propyl group.

[0011] [2] The content of the hydrophilic glycol ether compound is 4 to 74 mass% based on the total mass of the cleaning composition, the content of the hydrophobic tertiary amine compound is 0.8 to 16 mass% based on the total mass of the cleaning composition, the content of the phosphonic acid compound is 0.2 to 4 mass% based on the total amount of the cleaning composition, The cleaning composition according to [1], wherein the content of the water is 25 to 95 mass % based on the total mass of the cleaning composition.

[0012] [3] The cleaning composition according to [1] or [2], wherein the hydrophobic tertiary amine compound comprises at least one compound selected from the group consisting of N,N'-dimethylstearylamine, N,N'-dimethylpalmitylamine, N,N'-dimethylmyristylamine, N,N'-dimethyllaurylamine, N,N'-dimethyldecylamine, N,N'-dimethyloctylamine, and N,N'-dimethyldocosylamine.

[0013] [4] The cleaning composition according to any one of [1] to [3], wherein the phosphonic acid compound comprises at least one compound selected from the group consisting of alendronic acid, 3-phosphonopropionic acid, LO-phosphoserine, 2-phosphonobutane-1,2,4-tricarboxylic acid, 1-hydroxyethane-1,1-diphosphonic acid, glycine-N,N-bis(methylenephosphonic acid), nitrilotris(methylenephosphonic acid), N,N,N',N'-ethylenediaminetetrakis(methylenephosphonic acid), and pyrophosphoric acid.

[0014] [5] The cleaning composition according to any one of [1] to [4], wherein the hydrophilic glycol ether compound is a compound represented by formula (2) or a compound represented by formula (3). [ka] (In formula (2), R 5 , R 6 and R 7 each independently represents a hydrogen atom, a methyl group, or an ethyl group; R 8 represents a linear or cyclic hydrocarbon group having 1 to 11 carbon atoms, and -CH 2 - may be replaced by -O-, and in formula (3), R 9 and R 10 each independently represents a hydrogen atom or a methoxy group; R 11represents a hydrogen atom or a methyl group.

[0015] [6] The cleaning composition according to [5], wherein the hydrophilic glycol ether compound comprises at least one compound selected from the group consisting of ethylene glycol monomethyl ether, ethylene glycol monobutyl ether, ethylene glycol monoallyl ether, propylene glycol monopropyl ether, ethylene glycol monoisobutyl ether, ethylene glycol monopropyl ether, ethylene glycol mono-tert-butyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, tripropylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, diethylene glycol monoisobutyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monobenzyl ether, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, diethylene glycol isopropyl methyl ether, triethylene glycol monomethyl ether, triethylene glycol monobutyl ether, triethylene glycol dimethyl ether, diethylene glycol monohexyl ether, ethylene glycol monoisopropyl ether, 2-methoxybutanol, 3-methoxybutanol, and 3-methoxy-3-methylbutanol.

[0016] [7] The cleaning composition according to any one of [1] to [6], wherein the content of the hydrophilic amine compound is more than 0 mass% and less than 0.1 mass% based on the total amount of the cleaning composition.

[0017] [8] The cleaning composition according to any one of [1] to [7], which is for removing flux.

[0018] [9] A concentrate for a cleaning composition comprising a hydrophilic glycol ether compound, a hydrophobic tertiary amine compound, and a phosphonic acid compound, The hydrophobic tertiary amine compound is a compound represented by formula (1): the hydrophilic glycol ether compound is contained in an amount of 68 to 90% by mass based on the total mass of the concentrate for the cleaning composition, the hydrophobic tertiary amine compound is contained in an amount of 8 to 24% by mass based on the total mass of the concentrate solution for the cleaning composition, the content of the phosphonic acid compound is 2 to 8 mass% based on the total mass of the concentrate for the cleaning composition, A concentrate for a cleaning composition that is diluted 1.25 to 20 times with water when used to clean objects to be cleaned. [ka] (In formula (1), R 1 represents a chain hydrocarbon group having 8 to 22 carbon atoms, and R 2 and R 3 each independently represents a methyl group, an ethyl group, or a propyl group. Effect of the Invention

[0019] According to the present invention, it is possible to provide a cleaning composition and a concentrate solution for a cleaning composition that have excellent cleaning properties in narrow gaps and suppressed reactivity with metals and resins. [Brief description of the drawings]

[0020] [Figure 1] FIG. 1 is a schematic diagram illustrating the cleaning mechanism in a narrow gap when a conventional cleaning composition is used. [Diagram 2] FIG. 2 is a schematic diagram illustrating the cleaning mechanism in a narrow gap when the cleaning composition according to this embodiment is used. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Hereinafter, one embodiment of the present invention (hereinafter, referred to as "this embodiment") will be described. However, this embodiment is not limited to this. In this specification, an expression in the form of "X to Y" means the upper and lower limits of a range (i.e., X or more and Y or less). When no unit is specified for X and only a unit is specified for Y, the unit of X and the unit of Y are the same.

[0022] <Cleaning agent composition> The cleaning composition according to the present embodiment is a cleaning composition comprising a hydrophilic glycol ether compound, a hydrophobic tertiary amine compound, a phosphonic acid compound, and water, The hydrophobic tertiary amine compound is a compound represented by formula (1): The above cleaning composition is uniform in appearance within a temperature range of 10 to 70°C.

[0023] [ka] (In formula (1), R 1 represents a chain hydrocarbon group having 8 to 22 carbon atoms, and R 2 and R 3 each independently represents a methyl group, an ethyl group, or a propyl group.

[0024] The cleaning composition has the above-mentioned constitution, and thus has excellent cleaning properties in narrow gaps and suppressed reactivity with metals and resins. Here, "reactivity with metals and resins" means corrosivity to metals (metal corrosivity) and solubility in resins (resin solubility).

[0025] In this embodiment, the term "narrow gap" refers to a space in which the distance between the substances forming the gap is 100 μm or less. For example, a narrow gap is a gap formed between a substrate and a component connected to the substrate, the distance between the two being 10 to 100 μm. The term "cleaning ability in a narrow gap" refers to the cleaning ability of the cleaning composition in a narrow gap.

[0026] The cleaning composition is used to remove dirt (e.g., flux residue (rosin-based flux, water-soluble flux, etc.)) attached to the surface or gap of an object to be cleaned. The material of the object to be cleaned may be any commonly used material. Examples of the material include metals such as iron, SUS, copper, and aluminum, inorganic substances such as silica and alumina, and resins such as polyamide (nylon), polypropylene (PP), polyethylene (PE), polyimide, acrylonitrile-butadiene-styrene copolymer resin (ABS resin), polyvinyl chloride (PVC), acetal resin, acrylic resin, polystyrene (PS), polycarbonate (PC), polyether ether ketone (PEEK), polytetrafluoroethylene (Teflon (registered trademark)), polybutylene terephthalate (PBT), and epoxy resin.

[0027] <Hydrophilic glycol ether compound> The cleaning composition includes a hydrophilic glycol ether compound. In this embodiment, the term "glycol ether compound" refers to an ether compound of a dihydric alcohol. In this embodiment, "hydrophilic" refers to a property in which the solubility of water in the target compound is more than 50% by mass. Incidentally, "hydrophobic" refers to a property in which the solubility of water in the target compound is 50% by mass or less. The hydrophilic glycol ether compound may be synthesized from a known starting material by a known method. The hydrophilic glycol ether compound may be a commercially available product as it is.

[0028] In this embodiment, the hydrophilic glycol ether compound is preferably a compound represented by formula (2) or a compound represented by formula (3). [ka]

[0029] In the above formula (2), R 5 , R 6 and R 7 R each independently represents a hydrogen atom, a methyl group, or an ethyl group.8 represents a linear or cyclic hydrocarbon group having 1 to 11 carbon atoms. 2 - may be replaced by -O-. -CH contained in the above hydrocarbon group 2 When - is replaced with -O-, the number of carbon atoms before the replacement is regarded as the number of carbon atoms of the hydrocarbon group.

[0030] In one aspect of this embodiment, R 5 is preferably a hydrogen atom. That is, the hydrophilic glycol ether compound is preferably a compound represented by formula (4). [ka]

[0031] R 8 The chain-like hydrocarbon group in R may be a saturated hydrocarbon group or an unsaturated hydrocarbon group. The hydrocarbon group may be a straight-chain hydrocarbon group or a branched-chain hydrocarbon group. 8 The chain hydrocarbon group in R preferably has 4 to 6 carbon atoms. 8 Examples of the chain hydrocarbon group in include a methyl group, an ethyl group, an isopropyl group, a butyl group, a tert-butyl group, a hexyl group, a 2-ethylhexyl group, and a methoxyethyl group.

[0032] R 8 The cyclic hydrocarbon group in may be a saturated alicyclic hydrocarbon group, an unsaturated alicyclic hydrocarbon group, or an aromatic hydrocarbon group. 8 The cyclic hydrocarbon group in R preferably has 6 to 9 carbon atoms. 8 Examples of the cyclic hydrocarbon group in the formula include a phenyl group, a benzyl group, and a phenoxyethyl group.

[0033] In formula (3), R 9 and R 10 R each independently represents a hydrogen atom or a methoxy group. 11represents a hydrogen atom or a methyl group. In one aspect of this embodiment, R 9 and R 10 In one aspect of this embodiment, it is preferable that either one of R 9 is a hydrogen atom, and R 10 is a methyl group, and R 11 is preferably a methoxy group. In another aspect of this embodiment, R 9 is a methoxy group, and R 10 and R 11 is preferably a hydrogen atom. 9 is a hydrogen atom, and R 10 is a methoxy group, and R 11 is preferably a hydrogen atom.

[0034] The hydrophilic glycol ether compounds include ethylene glycol monomethyl ether (MG), ethylene glycol monobutyl ether (BC), ethylene glycol monoallyl ether (AG), propylene glycol monopropyl ether (PFG), ethylene glycol monoisobutyl ether (iBG), ethylene glycol monopropyl ether (PC), ethylene glycol mono-tert-butyl ether (ETB), propylene glycol monomethyl ether (MFG), dipropylene glycol monomethyl ether (MFDG), tripropylene glycol monomethyl ether (MFTG), diethylene glycol monomethyl ether (MDG), diethylene glycol monobutyl ether (BDG), diethylene glycol monoisobutyl ether (iBDG), diethylene glycol monoisopropyl ether (iPDG), ), diethylene glycol monobenzyl ether (BzDG), ethylene glycol dimethyl ether (DMG), diethylene glycol dimethyl ether (DMDG), diethylene glycol ethyl methyl ether (MEDG), diethylene glycol diethyl ether (DEDG), diethylene glycol isopropyl methyl ether (IPDM), triethylene glycol monomethyl ether (MTG), triethylene glycol monobutyl ether (BTG), triethylene glycol dimethyl ether (DMTG), diethylene glycol monohexyl ether (HeDG), ethylene glycol monoisopropyl ether (iPG), 2-methoxybutanol (2MB), 3-methoxybutanol (3MB), and 3-methoxy-3-methylbutanol (MMB).More preferably, the hydrophilic glycol ether compound comprises ethylene glycol monomethyl ether, ethylene glycol monobutyl ether, ethylene glycol monoallyl ether, propylene glycol monopropyl ether, ethylene glycol monoisobutyl ether, ethylene glycol monopropyl ether, ethylene glycol mono-tert-butyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, tripropylene glycol monomethyl ether, diethylene glycol monobutyl ether, diethylene glycol monoisobutyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monobenzyl ether, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, diethylene glycol isopropyl methyl ether, triethylene glycol monomethyl ether, triethylene glycol monobutyl ether, triethylene glycol dimethyl ether, diethylene glycol monohexyl ether, ethylene glycol monoisopropyl ether, 2-methoxybutanol, 3-methoxybutanol or 3-methoxy-3-methylbutanol.The structural formula of the hydrophilic glycol ether compound described above is shown below.

[0035] [ka]

[0036] [ka]

[0037] [ka]

[0038] The content of the hydrophilic glycol ether compound is preferably 4 to 74 mass%, more preferably 5 to 70 mass%, and further preferably 10 to 65 mass%, based on the total amount of the cleaning composition. This provides a cleaning composition with even better cleaning properties for flux residues. The hydrophilic glycol ether compound can be determined by gas chromatography analysis. The conditions for gas chromatography analysis are as follows: Equipment: Gas Catalog GC-14B (Shimadzu Corporation) Detector: Thermal conductivity detector (TCD) Column: Thermon-3000 (Shinwa Chemical Industry Co., Ltd.) Vaporization chamber temperature: 160℃ Detector temperature: 160℃

[0039] <Hydrophobic tertiary amine compounds> The cleaning composition includes a hydrophobic tertiary amine compound. Here, the term "tertiary amine compound" refers to a compound in which three hydrogen atoms of ammonia are replaced with a hydrocarbon group. In this embodiment, the term "hydrophobic tertiary amine compound" also includes a salt form with a phosphonic acid compound described later. That is, a part or all of the hydrophobic tertiary amine compound and a part or all of the phosphonic acid compound described later may form a salt. The present inventors believe that the hydrophobic tertiary amine compound forms a salt with a phosphonic acid compound described later, plays a role as a kind of water-soluble cationic surfactant, and forms fine micelles. In this embodiment, "hydrophobic" refers to a property in which the solubility of water in the target compound is 50% by mass or less. The hydrophobic tertiary amine compound may be synthesized from a known starting material by a known method. The hydrophobic tertiary amine compound may be a commercially available product as it is.

[0040] In this embodiment, the hydrophobic tertiary amine compound is a compound represented by formula (1). [ka]

[0041] In the above formula (1), R 1 represents a chain hydrocarbon group having 8 to 22 carbon atoms, and R 2 and R 3 each independently represents a methyl group, an ethyl group, or a propyl group.

[0042] R 1 The chain-like hydrocarbon group in R may be a saturated hydrocarbon group or an unsaturated hydrocarbon group. The hydrocarbon group may be a straight-chain hydrocarbon group or a branched-chain hydrocarbon group. 1 The chain hydrocarbon group in is preferably a straight-chain hydrocarbon group having 8 to 20 carbon atoms, and more preferably a straight-chain hydrocarbon group having 10 to 18 carbon atoms.

[0043] R 2 and R 3 is preferably a methyl group or an ethyl group, and more preferably both are a methyl group. 1 , R 2 and R 3 The sum of the carbon numbers is preferably 10 to 30, more preferably 12 to 28, and further preferably 12 to 24.

[0044] The hydrophobic tertiary amine compound preferably includes at least one compound selected from the group consisting of N,N'-dimethylstearylamine (DMSA), N,N'-dimethylpalmitylamine (DMPA), N,N'-dimethylmyristylamine (DMMA), N,N'-dimethyllaurylamine (DMLA), N,N'-dimethyldecylamine (DMDA), N,N'-dimethyloctylamine (DMOA), and N,N'-dimethyldocosylamine (DMDoA). The hydrophobic tertiary amine compound preferably includes N,N'-dimethylstearylamine or N,N'-dimethylpalmitylamine. The structural formula of the hydrophobic tertiary amine compound described above is shown below.

[0045] [ka]

[0046] The content of the hydrophobic tertiary amine compound is preferably 0.8 to 16 mass %, more preferably 1 to 15 mass %, and further preferably 2 to 13 mass %, based on the total amount of the cleaning composition. This provides a cleaning composition with excellent cleaning properties for flux residues. The hydrophobic tertiary amine compound can be determined by gas chromatography analysis. The above-mentioned conditions are used for the gas chromatography analysis. In one aspect of the present embodiment, when the hydrophobic tertiary amine compound is not detected by the above-mentioned gas chromatography analysis, it can be determined by potentiometric titration analysis. The conditions for the potentiometric titration analysis are as follows. Equipment: Automatic potentiometric titrator Model AT-710M (Kyoto Electronics Manufacturing Co., Ltd.) Measurement temperature: 20℃

[0047] <Phosphonic acid compounds> The cleaning composition includes a phosphonic acid compound. The phosphonic acid compound may be a hydrophilic phosphonic acid compound or a hydrophobic phosphonic acid compound. In this embodiment, "hydrophilic" means that the solubility of water in the target compound is more than 50% by mass. "Hydrophobic" means that the solubility of water in the target compound is 50% by mass or less. In addition, "phosphonic acid compound" refers to a compound having a phosphonic acid group such as -P(=O)(OH) 2It means an organic compound or an inorganic compound having a functional group represented by the formula: Among the above phosphonic acid compounds, those that are organic compounds may be referred to as "organic phosphonic acid". Among the above phosphonic acid compounds, those that are inorganic compounds may be referred to as "inorganic phosphonic acid". In this embodiment, the "phosphonic acid compound" also includes the form of a salt with the above hydrophobic tertiary amine compound. That is, a part or all of the above hydrophobic tertiary amine compound and a part or all of the above phosphonic acid compound may form a salt. The above phosphonic acid compound may be synthesized from a known starting material by a known method. The above phosphonic acid compound may be a commercially available product as it is.

[0048] In this embodiment, the phosphonic acid compound is -P(=O)(OH). 2 It is preferable that the phosphonic acid compound has 1 to 4 functional groups represented by the following formula, and more preferably has 2 to 4 functional groups represented by the following formula: In addition, the phosphonic acid compound may have other functional groups as long as the effects of the present invention are achieved. Examples of the "other functional groups" include amino groups and carboxyl groups.

[0049] The phosphonic acid compound preferably comprises at least one compound selected from the group consisting of alendronic acid (AA), 3-phosphonopropionic acid (PPA), LO-phosphoserine (LOP), 2-phosphonobutane-1,2,4-tricarboxylic acid (PBTC), 1-hydroxyethane-1,1-diphosphonic acid (HEDP), glycine-N,N-bis(methylenephosphonic acid) (GBMP), nitrilotris(methylenephosphonic acid) (NTMP), N,N,N',N'-ethylenediaminetetrakis(methylenephosphonic acid) (EDTMP) and pyrophosphoric acid (PA). In one aspect of this embodiment, the phosphonic acid compound is an organic phosphonic acid, and the organic phosphonic acid preferably comprises at least one compound selected from the group consisting of 2-phosphonobutane-1,2,4-tricarboxylic acid, 1-hydroxyethane-1,1-diphosphonic acid and nitrilotris(methylenephosphonic acid). These organic phosphonic acids are in a liquid state at room temperature and pressure. Therefore, even if the organic phosphonic acid remains on the object to be cleaned after cleaning, on the cleaning tank and its lid to which the cleaning composition is added, and around the area cleaned with the cleaning composition, it does not precipitate as a solid, and can be easily removed by wiping. The structural formula of the above-mentioned phosphonic acid compound is shown below.

[0050] [ka]

[0051] [ka]

[0052] In one aspect of this embodiment, the organic phosphonic acid may be 1-hydroxyethylidene 1,1-diphosphonic acid, methylene diphosphonic acid, 1,2-ethylene diphosphonic acid, 1,3-propylene diphosphonic acid, 1,4-butylene diphosphonic acid, 1,5-pentylene diphosphonic acid, or 1,6-hexylene diphosphonic acid.

[0053] The content of the phosphonic acid compound is preferably 0.2 to 4 mass%, more preferably 0.3 to 3.5 mass%, and even more preferably 0.5 to 2 mass%, based on the total amount of the cleaning composition. This provides a cleaning composition with excellent cleaning properties for flux residues. The phosphonic acid compound can be determined by potentiometric titration analysis. The conditions for potentiometric titration analysis are as follows: Equipment: Automatic potentiometric titrator Model AT-710M (Kyoto Electronics Manufacturing Co., Ltd.) Measurement temperature: 20℃

[0054] In this embodiment, the molar ratio of the phosphonic acid compound to the hydrophobic tertiary amine compound is preferably 1:0.1 to 1:1.2, and more preferably 1:0.1 to 1:1.

[0055] <Water> The cleaning agent composition contains water. The water is not particularly limited as long as it is water used as a raw material for various industrial products, tap water, or the like. The water may be distilled water or ion-exchanged water. In one aspect of the present embodiment, the water may have an electric conductivity of 1 to 300 μS / cm, or 1 to 100 μS / cm.

[0056] The content of the water is preferably 25 to 95% by mass, more preferably 30 to 90% by mass, and further preferably 40 to 85% by mass, based on the total amount of the cleaning composition. This provides a cleaning composition with excellent operational safety and environmental safety. The content of the water can be determined by analysis using a Karl Fischer moisture meter. The conditions for analysis using the Karl Fischer moisture meter are as follows. Karl Fischer moisture meter analysis conditions Equipment: Karl Fischer moisture meter MKS-500 (Kyoto Electronics Manufacturing Co., Ltd.) Measurement method: volumetric titration method Measurement temperature: 20℃

[0057] <Hydrophobic solvent> The cleaning agent composition according to the present embodiment may further contain a hydrophobic solvent as long as the effects of the present invention are achieved. In one aspect of the present embodiment, the hydrophobic solvent may contain a hydrophobic glycol ether compound. The hydrophobic solvent may be synthesized from a known starting material by a known method. A commercially available product may be used as the hydrophobic solvent.

[0058] Examples of the hydrophobic solvent include propylene glycol monobutyl ether (BFG), benzyl alcohol (BzAl), dimethylpropylene diglycol (DMFDG), ethylene glycol monobenzyl ether (BzG), dipropylene glycol monobutyl ether (BFDG), diethylene glycol dibutyl ether (DBDG), phenyl glycol (PhG), phenyl diglycol (PhDG), phenylpropylene glycol (PhFG), hexyl glycol (HeG), 2-ethylhexyl glycol (EHG), 2-ethylhexyl diglycol (EHDG), dipropylene glycol monopropyl ether (PFDG), diethylene glycol methyl isopropyl ether (iPDGMe), diethylene glycol ethyl isopropyl ether (iPDGEt), diethylene glycol ethyl butyl ether (BDGEt), and triethylene glycol ethyl butyl ether (BTGEt).

[0059] <Hydrophilic amine compounds> In one aspect of this embodiment, the cleaning composition preferably contains a hydrophilic amine compound in an amount greater than 0 mass% and less than 0.1 mass% relative to the total amount of the cleaning composition. By setting the content of the hydrophilic amine compound in the above-mentioned range, it is possible to reduce the effects of discoloration and corrosion of metal in the object to be cleaned. In one aspect of this embodiment, it is more preferable that the cleaning composition does not contain the hydrophilic amine compound.

[0060] In this embodiment, examples of the hydrophilic amine compound include 2-(ethylamino)ethanol (MEM), N,N-bis(2-hydroxyethyl)-N-cyclohexylamine (CHE-20), N,N,N',N'-tetramethyl-1,6-diaminohexane (TMHDA), monoethanolamine (MEA), diethanolamine (DEA), triethanolamine (TEA), etc. That is, it is preferable that the cleaning agent composition does not contain MEM, CHE-20, TMHDA, MEA, DEA, or TEA. In one aspect of the present embodiment, the cleaning composition preferably does not contain at least one hydrophilic amine compound selected from the group consisting of MEM, CHE-20, TMHDA, MEA, DEA, and TEA.

[0061] <Hydrophilic Carboxylic Acid> The cleaning composition may further contain a hydrophilic carboxylic acid as long as the effect of the present invention is achieved. In this embodiment, "hydrophilic" means a property in which the solubility of water in the target compound exceeds 50% by mass. In addition, "carboxylic acid" means an organic compound having a carboxyl group. In this embodiment, the "hydrophilic carboxylic acid" also includes a salt form with the hydrophobic tertiary amine compound. That is, a part or all of the hydrophobic tertiary amine compound and a part or all of the hydrophilic carboxylic acid may form a salt. The hydrophilic carboxylic acid may be synthesized from a known starting material by a known method. The hydrophilic carboxylic acid may be a commercially available product as it is.

[0062] In this embodiment, the hydrophilic carboxylic acid is preferably a compound represented by formula (5). 4 is a hydrogen atom or -CH 2 COOH, R 12 is a hydrogen atom, -OH or -CH 2 Indicates COOH. [ka]

[0063] The hydrophilic carboxylic acid is preferably a hydroxycarboxylic acid, and more preferably includes at least one compound selected from the group consisting of citric acid, malic acid, isocitric acid, and tartaric acid. The hydrophilic carboxylic acid further preferably includes citric acid or malic acid. The structural formula of the hydrophilic carboxylic acid is shown below.

[0064] [ka]

[0065] The content of the hydrophilic carboxylic acid is preferably 0.2 to 4 mass%, more preferably 0.3 to 3.5 mass%, and even more preferably 0.5 to 3 mass%, based on the total amount of the cleaning composition. This provides a cleaning composition with excellent cleaning properties for flux residues. The hydrophilic carboxylic acid can be determined by potentiometric titration analysis. The conditions for potentiometric titration analysis are as follows: Equipment: Automatic potentiometric titrator Model AT-710M (Kyoto Electronics Manufacturing Co., Ltd.) Measurement temperature: 20℃

[0066] In this embodiment, the molar ratio of the hydrophilic carboxylic acid to the hydrophobic tertiary amine compound is preferably 1:0.1 to 1:1.2, and more preferably 1:0.1 to 1:1.

[0067] <Other ingredients> The cleaning composition according to the present embodiment may further contain other components as long as the effects of the present invention are achieved. Examples of the other components include surfactants, rust inhibitors, pH adjusters, chelating agents, thickeners, wetting agents, evaporation retarders, antioxidants, UV absorbers, pigments, fragrances, and preservatives.

[0068] <Characteristics of the cleaning composition> In one aspect of this embodiment, the cleaning composition is homogeneous in appearance in a temperature range of 10 to 70°C. Here, "homogeneous in appearance" means that the cleaning composition does not separate into two or more layers in appearance when left to stand. "When left to stand" means when the cleaning composition is maintained for 4 hours in a state where it is not subjected to external forces other than gravity. More specifically, the "when left to stand" can be understood as when the cleaning composition is maintained for 4 hours in a state where it is not vibrated, rotated, or stirred. In one aspect of this embodiment, the cleaning composition may be homogeneous in appearance or may be separated into two or more layers in appearance at a temperature below 10°C. The cleaning composition may be homogeneous in appearance or may be separated into two or more layers in appearance at a temperature above 70°C.

[0069] Conventional cleaning compositions containing hydrophobic components (e.g. hydrophobic tertiary amine compounds) and hydrophilic components (e.g. hydrophilic carboxylic acids) may separate into an oil phase containing the hydrophobic components and an aqueous phase containing the hydrophilic components, and may separate into two layers when left at the temperature for cleaning the object to be cleaned. When attempting to remove flux residues in narrow gaps with such conventional cleaning compositions, the cleaning composition is first stirred, causing the oil phase (oil droplets) and the aqueous phase to penetrate into the narrow gaps. However, in the depths of the gaps, the force of stirring is reduced, and the oil phases gather together to form relatively large oil droplets (1 μm or larger) (Figure 1). Such relatively large oil droplets have a smaller surface area than bulk oil droplets, so the contact area with the flux residues is smaller, which tends to result in poor cleaning performance.

[0070] On the other hand, the present inventors believe that the cleaning composition according to this embodiment contains the hydrophobic tertiary amine compound and the phosphonic acid compound, thereby forming a micellar structure. The present inventors also believe that the oil phase gathers in the center of the micellar structure to form oil droplets (nanoemulsion) with a size of 10 nm or less. This nanoemulsion does not gather with each other even when it penetrates into the narrow gap described above, and can exhibit the same level of cleaning performance as when it exists in bulk (FIG. 2). Thus, in the cleaning composition according to this embodiment, the oil phase exists as a nanoemulsion, and the present inventors believe that it appears uniform in appearance. In one aspect of this embodiment, the cleaning composition is considered not to form a "uniform phase in which the oil phase and the water phase are mixed together".

[0071] <Concentrate for cleaning composition> The concentrate for a cleaning composition according to the present embodiment is a concentrate for a cleaning composition comprising a hydrophilic glycol ether compound, a hydrophobic tertiary amine compound, and a phosphonic acid compound, The hydrophobic tertiary amine compound is a compound represented by the above formula (1), the hydrophilic glycol ether compound is contained in an amount of 68 to 90% by mass based on the total mass of the concentrate for the cleaning composition, the hydrophobic tertiary amine compound is contained in an amount of 8 to 24% by mass based on the total mass of the concentrate solution for the cleaning composition, the content of the phosphonic acid compound is 2 to 8 mass% based on the total mass of the concentrate for the cleaning composition, When used to clean an object to be cleaned, the solution is diluted with water at a ratio of 1.25 to 20. The above-mentioned cleaning composition stock solution can be diluted at the above-mentioned ratio (volume ratio) to obtain the above-mentioned cleaning composition.

[0072] <Method for producing cleaning composition> The method for producing the cleaning composition according to the present embodiment includes a step of preparing the hydrophilic glycol ether compound, the hydrophobic tertiary amine compound, the phosphonic acid compound, and the water, and a step of adding the hydrophilic glycol ether compound, the hydrophobic tertiary amine compound, and the phosphonic acid compound to the water. Any method may be used for the adding step. Examples of the adding step include adding the hydrophilic glycol ether compound, the hydrophobic tertiary amine compound, the phosphonic acid compound, and the water to a flask, and adding the hydrophilic glycol ether compound, the hydrophobic tertiary amine compound, the phosphonic acid compound, and the water on an industrial scale in a chemical plant or the like.

[0073] <How to clean objects> The cleaning method for an object to be cleaned according to the present embodiment includes the steps of: A method for cleaning an object to be cleaned, comprising contacting the above-mentioned cleaning agent composition with a surface or gap of the object to be cleaned.

[0074] The method of contacting the cleaning composition with the surface or gap of the object to be cleaned is not particularly limited. Examples of the method include contacting the cleaning composition with the surface or gap of the object to be cleaned in the atmosphere, under reduced pressure or pressure, at room temperature or under heating, by methods such as immersion, coating, and spraying or showering. When the cleaning composition is contacted with the surface or gap of the object to be cleaned by immersion, operations such as stirring, ultrasonic treatment, bubbling, and shaking may be performed as necessary. In this method, the object to be cleaned is preferably immersed in a cleaning agent tank containing the heated cleaning composition to clean the object. The immersion time is preferably 1 minute to 60 minutes.

[0075] In one aspect of the present embodiment, when cleaning gaps in the object to be cleaned, it is preferable to immerse the object to be cleaned in the cleaning composition while stirring. In this case, compared with shower cleaning and ultrasonic cleaning, the load on the object to be cleaned tends to be reduced.

[0076] In the method for cleaning an object to be cleaned of the present embodiment, the temperature of the above-mentioned cleaner composition is preferably 20 to 70°C, more preferably 30 to 60°C, and further preferably 40 to 50°C.

[0077] Thereafter, the object to be cleaned may be rinsed with water, a water-containing alcohol, or a water-containing glycol ether, and then dried to remove the cleaning composition from the object to be cleaned.

[0078] The cleaning composition according to the present embodiment can be suitably used for removing flux residues. That is, the cleaning composition is preferably used for removing flux. EXAMPLES

[0079] The present invention will be described in detail below with reference to examples, but the present invention is not limited to these.

[0080] ≪Raw materials≫ The names of the raw materials used in the examples are shown below. (hydrophilic solvent: hydrophilic glycol ether compounds, etc.) Tetrahydrofurfuryl alcohol (THFA): Fujifilm Wako Pure Chemical Industries, Ltd. Diethylene glycol monobutyl ether (BDG): Nippon Nyukazai Co., Ltd. Ethylene glycol monopropyl ether (PC): manufactured by Dow Chemical Japan Co., Ltd. (Hydrophobic Solvent) Propylene glycol monobutyl ether (BFG): Nippon Nyukazai Co., Ltd. (Hydrophobic amine compounds) N,N'-Dimethylstearylamine (DMSA): Fujifilm Wako Pure Chemical Industries, Ltd. N,N'-Dimethylpalmitylamine (DMPA): Fujifilm Wako Pure Chemical Industries, Ltd. (hydrophilic amine compound) Diisopropanolamine (DIPA): Fujifilm Wako Pure Chemical Industries, Ltd. (Hydrophobic organic phosphonic acid) Alendronic acid (AA): manufactured by Tokyo Chemical Industry Co., Ltd. (Inorganic Phosphonic Acid) Pyrophosphate (PA): Fujifilm Wako Pure Chemical Industries, Ltd. (hydrophilic organic phosphonic acid) 2-Phosphonobutane-1,2,4-tricarboxylic acid (PBTC): Manufactured by Chelest Corporation, Product name: PH-430 1-Hydroxyethane-1,1-diphosphonic acid (HEDP): Manufactured by Chelest Co., Ltd. Product name: PH-210 Glycine-N,N-bis(methylenephosphonic acid) (GBMP): manufactured by Tokyo Chemical Industry Co., Ltd. Nitrilotris(methylenephosphonic acid) (NTMP): Manufactured by Chelesto Corporation Product name: PH-320 N,N,N',N'-Ethylenediaminetetrakis(methylenephosphonic acid) (EDTMP): Manufactured by Chelesto Corporation, Product name: PH-540 (hydrophilic sulfonic acid) 1,2-Ethanedisulfonic acid dihydrate (EDS): Tokyo Chemical Industry Co., Ltd.

[0081] <Experiment 1: Study of hydrophobic tertiary amine compounds and phosphonic acid compounds> <Preparation of cleaning composition> First, cleaning compositions of Sample No. 1 to Sample No. 14 and Sample No. 101 to Sample No. 104 were prepared based on the formulations shown in Tables 1-1, 1-2, and 2. In the "Formulations" in Tables 1-1, 1-2, and 2, the components marked with "-" indicate that they were not added to the sample.

[0082] <Performance evaluation of cleaning agent composition> (Metal reactivity evaluation) (Preparing the test piece) An aluminum plate (A1050p, 20×50×t3 mm) and a copper plate (20×50×t0.5 mm) were prepared as test pieces for use in evaluating reactivity to metals (metal corrosivity).

[0083] (Metal Corrosion Evaluation Test) The metal corrosivity of the cleaning composition of Sample No. 1 to Sample No. 14 and Sample No. 101 to Sample No. 104 was evaluated by the following procedure. First, 400 ml of the cleaning composition was added to a beaker (500 ml) and heated to 60° C. Next, the heated cleaning composition was stirred at 750 rpm. While maintaining the stirring state, a test piece was immersed in the cleaning composition. After the test piece was immersed in the cleaning composition, the test piece was taken out every 10 minutes, washed with water, dried by blowing air, and visually observed for changes in color tone on the surface of the test piece. If the color tone of the surface changed (for example, blackening, whitening, etc.), the test piece was judged to have corroded. Evaluation was performed according to the following criteria depending on the immersion time until corrosion of the test piece was observed. The evaluation results are shown in Tables 1-1, 1-2, and 2. Evaluation Ranking Criteria S rank: No color change was observed on the surface of the test piece after immersion for 60 minutes. Rank A: No color change was observed on the surface of the test piece after 40 minutes of immersion, but the color change was observed after 60 minutes of immersion. Rank B: No color change was observed on the surface of the test piece after 20 minutes of immersion, but the color change was observed after 40 minutes of immersion. Rank C: No color change was observed on the surface of the test piece after immersion for 10 minutes, but the color change was observed after immersion for 20 minutes. Rank D: A change in color tone was observed on the surface of the test piece after 10 minutes.

[0084] (Resin reactivity evaluation) (Preparing the test piece) As test pieces for evaluating reactivity with resin (resin solubility), polypropylene (PP) resin plates (20 x 50 x t2 mm) and polyethylene (PE) resin plates (20 x 50 x t2 mm) were prepared.

[0085] (Resin solubility evaluation test) The resin solubility of the cleaning compositions of Sample No. 1 to Sample No. 14 and Sample No. 101 to Sample No. 104 was evaluated by the following procedure. First, 400 ml of the cleaning composition was added to a beaker (500 ml) and heated to 60° C. Next, the heated cleaning composition was stirred at 750 rpm. While maintaining the stirring state, a test piece was immersed in the cleaning composition. 60 minutes after the test piece was immersed in the cleaning composition, the test piece was taken out, washed with water, and dried by blowing air, and the mass change rate and volume change rate of the test piece were calculated by the following formula. The volume of the test piece was calculated by measuring the length, width, and thickness of the test piece with a caliper. In addition, the appearance of the test piece was visually observed. Evaluation was performed according to the calculated mass change rate, volume change rate, and appearance of the test piece according to the following criteria. The results are shown in Tables 1-1, 1-2, and 2. Mass change rate (%) of test piece=100×{(mass of test piece 60 minutes after immersion in cleaning composition)−(mass of test piece before immersion in cleaning composition)} / (mass of test piece before immersion in cleaning composition) Volume change rate (%) of test piece=100×{(volume of test piece 60 minutes after immersion in cleaning composition)−(volume of test piece before immersion in cleaning composition)} / (volume of test piece before immersion in cleaning composition) Evaluation Ranking Criteria S rank: Mass and volume changes are within ±1% A rank: Mass and volume changes are greater than ±1% and are within ±3% Rank B: Mass and volume changes are greater than ±3% and are within ±5% C rank: Mass and volume changes are greater than ±5% and are within ±10% Rank D: The mass change rate and volume change rate exceeded ±10%, or changes in appearance such as cracks or dissolution occurred.

[0086] (Evaluation of cleaning ability of rosin-based flux residue) (Preparing the test piece) Test pieces for evaluating the cleaning properties were prepared by the following procedure. First, a JIS type 2 comb-shaped electrode substrate (manufactured by Satosen Corporation) was prepared. A metal mask was placed on the comb-shaped substrate, and solder paste (manufactured by Senju Metal Industry Co., Ltd., product name M705-GRN360-K2-V, manufactured by Senju Metal Industry Co., Ltd., product name M705-GLV, manufactured by Senju Metal Industry Co., Ltd., or product name M705-ULT369, manufactured by Senju Metal Industry Co., Ltd.) was printed on the mask. The comb-shaped electrode substrate was then left to stand on a hot plate at 250°C for 3 minutes to perform reflow. Three types of test pieces, each with a different solder paste, were prepared by the above procedure.

[0087] (Evaluation test of cleaning ability) The cleaning properties of the cleaning compositions of Sample Nos. 1 to 14 and 101 to 104 were evaluated by the following procedure. First, 400 ml of the cleaning composition was added to a beaker (500 ml) and heated to 50° C. Next, the heated cleaning composition was stirred at 750 rpm. A test piece was immersed in the cleaning composition while maintaining the stirring state. After a predetermined time had elapsed since the test piece was immersed in the cleaning composition, the test piece was taken out, washed with water and dried, and the surface was observed using a stereomicroscope (magnification 40 times). The time required for the flux residue to be completely removed was measured, and the cleaning properties were evaluated according to the following criteria. The evaluation results are shown in Tables 1-1, 1-2 and 2. Evaluation Ranking Criteria S rank: Cleaning time is less than 10 minutes. Rank A: Cleaning time is between 10 and 20 minutes. Rank B: Cleaning time is between 20 and 30 minutes. C rank: The cleaning time is between 30 and 60 minutes. Rank D: The cleaning time is 60 minutes or more.

[0088] (Appearance Evaluation of Cleaning Composition) The cleaning compositions of Sample Nos. 1 to 14 and 101 to 104 were allowed to stand at 25° C. or 50° C. Then, the appearance of each cleaning composition was observed. The evaluation results are shown in Tables 1-1, 1-2, and 2. In the tables, "uniform" means that the interface between the aqueous phase and the organic phase could not be confirmed with the naked eye, that is, the composition was uniform in appearance.

[0089] (pH Measurement) 200 g of the above cleaning composition was placed in a 300 ml beaker, and the pH of the above cleaning composition was measured using a pH meter (Docu-PH, manufactured by Sartorius K.K.) at a measurement temperature of 25° C. The results are shown in Tables 1-1, 1-2 and 2.

[0090] [Table 1-1]

[0091] [Table 1-2]

[0092] [Table 2]

[0093] From the results in Table 1, it was found that the cleaning compositions (sample numbers 1 to 14) using hydrophobic tertiary amine compounds and phosphonic acid compounds were excellent in resin solubility, metal corrosiveness, and cleaning properties. On the other hand, the cleaning composition (sample number 101) using hydrophilic sulfonic acid instead of phosphonic acid compounds was insufficient in both metal corrosiveness and cleaning properties. Moreover, the cleaning compositions (sample numbers 102 to 104) using hydrophilic amine compounds instead of hydrophobic tertiary amine compounds were insufficient in cleaning properties.

[0094] <Experiment 2: Evaluation of cleaning ability under parts with narrow gaps> The cleaning ability of the product against flux residues present in narrow gaps, such as under components on a circuit board, was evaluated using the following procedure.

[0095] <Performance evaluation of cleaning agent composition> The cleaning performance (on the surface and under the parts) and the appearance of the cleaning composition were evaluated in the same manner as in "Experiment 1". The results are shown in Tables 1-1, 1-2 and 2. The following test pieces were prepared and used to evaluate the cleaning performance and rinsability under the parts.

[0096] (Preparation of test pieces to evaluate cleaning ability under parts, etc.) First, a glass epoxy board (100 x 100 x t2 mm) was prepared. A metal mask was placed on the glass epoxy board, and solder paste (M705-NXC400ZH, manufactured by Senju Metal Industry Co., Ltd.) was printed on top of it. An LGA (8 mm square) was mounted on the glass epoxy board as a component via solder. After that, the glass epoxy board was left on a hot plate at 250°C for 3 minutes to perform reflow. A test piece was produced using the above procedure. The gap between the glass epoxy board and the LGA in the test piece was approximately 30 μm.

[0097] (Evaluation test of cleaning ability) Except for using the above test pieces, the cleaning performance was evaluated in the same manner as in "Experiment 1". In Experiment 2, in addition to the surface of the test pieces, the underside of the parts of the test pieces was also observed with a stereo microscope. The results are shown in Tables 1-1, 1-2 and 2.

[0098] (Rinsing Efficiency Evaluation Test) The rinsing properties of the cleaning compositions of Sample Nos. 1 to 14 and Sample Nos. 101 to 104 were evaluated by the following procedure. First, the test pieces were washed with each cleaning composition for 10 minutes at 50°C. Then, the test pieces were rinsed twice at room temperature for 10 minutes with ion-exchanged water under stirring, and then dried for 10 minutes at 100°C. The presence or absence of residual components derived from the cleaning composition under the parts of the dried test pieces was visually confirmed. When there was no residual component under the parts of the test pieces, it was rated as S rank. When there was residual component under the parts of the test pieces, it was rated as D rank. The results are shown in Tables 1-1, 1-2 and 2.

[0099] From the results of Tables 1-1 and 1-2, it was confirmed that the detergent compositions of Sample Nos. 1 to 14 had excellent cleaning and rinsing properties under the parts (Tables 1-1 and 1-2). On the other hand, the detergent compositions of Sample Nos. 101 to 104 had insufficient cleaning properties under the parts (Table 2). From the above, it was confirmed that the detergent composition containing a hydrophilic glycol ether compound, a hydrophobic tertiary amine compound having a specific chemical structure, a phosphonic acid compound, and water has excellent cleaning properties in narrow gaps. It is considered that the detergent composition contains the hydrophobic tertiary amine compound and the phosphonic acid compound, and thus forms oil droplets (nanoemulsion) with a size of 10 nm or less. It is considered that the oil droplets do not aggregate with each other even if they enter the narrow gap under the parts, and can exhibit cleaning properties equivalent to those when they exist in bulk (Figure 2).

[0100] Although the embodiments and examples of the present invention have been described above, it is also intended from the beginning that the configurations of the above-described embodiments and examples may be appropriately combined.

[0101] The embodiments and examples disclosed herein are illustrative in all respects and should not be considered as limiting. The scope of the present invention is indicated by the claims, not by the embodiments and examples described above, and is intended to include the meaning equivalent to the claims and all modifications within the scope.

Claims

1. A cleaning composition comprising a hydrophilic glycol ether compound, a hydrophobic tertiary amine compound, a phosphonic acid compound, and water, the content of the hydrophilic glycol ether compound is 4 to 74 mass% based on the total amount of the cleaning composition, the content of the hydrophobic tertiary amine compound is 0.8 to 16 mass% based on the total amount of the cleaning composition, the content of the phosphonic acid compound is 0.2 to 4 mass% based on the total amount of the cleaning composition, The content of the water is 25 to 95% by mass based on the total amount of the cleaning composition, the hydrophobic tertiary amine compound comprises at least one compound selected from the group consisting of N,N'-dimethylstearylamine, N,N'-dimethylpalmitylamine, N,N'-dimethylmyristylamine, N,N'-dimethyllaurylamine, N,N'-dimethyldecylamine, N,N'-dimethyloctylamine, and N,N'-dimethyldocosylamine; The phosphonic acid compound includes at least one compound selected from the group consisting of alendronic acid, 2-phosphonobutane-1,2,4-tricarboxylic acid, 1-hydroxyethane-1,1-diphosphonic acid, glycine-N,N-bis(methylenephosphonic acid), nitrilotris(methylenephosphonic acid), N,N,N',N'-ethylenediaminetetrakis(methylenephosphonic acid), and pyrophosphoric acid; The hydrophilic glycol ether compound includes at least one compound selected from the group consisting of ethylene glycol monomethyl ether, ethylene glycol monobutyl ether, ethylene glycol monoallyl ether, propylene glycol monopropyl ether, ethylene glycol monoisobutyl ether, ethylene glycol monopropyl ether, ethylene glycol mono-tert-butyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, tripropylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, diethylene glycol monoisobutyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monobenzyl ether, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, diethylene glycol isopropyl methyl ether, triethylene glycol monomethyl ether, triethylene glycol monobutyl ether, triethylene glycol dimethyl ether, diethylene glycol monohexyl ether, ethylene glycol monoisopropyl ether, 2-methoxybutanol, 3-methoxybutanol, and 3-methoxy-3-methylbutanol; The cleaning composition is a liquid, The cleaning composition is for cleaning flux, The cleaning composition is homogeneous in appearance in a temperature range of 10 to 70° C., The hydrophilicity means that the solubility of the target compound in water is more than 50% by mass; The hydrophobicity refers to the property that the solubility of water in a target compound is 50% by mass or less; The term "uniform in appearance" means that the detergent composition does not appear to separate into two or more layers when left to stand.

2. The cleaning composition according to claim 1, wherein the content of the hydrophilic amine compound is more than 0 mass % and less than 0.1 mass % based on the total amount of the cleaning composition.

3. A stock solution for a cleaning composition for flux cleaning, comprising a hydrophilic glycol ether compound, a hydrophobic tertiary amine compound, and a phosphonic acid compound, the hydrophobic tertiary amine compound comprises at least one compound selected from the group consisting of N,N'-dimethylstearylamine, N,N'-dimethylpalmitylamine, N,N'-dimethylmyristylamine, N,N'-dimethyllaurylamine, N,N'-dimethyldecylamine, N,N'-dimethyloctylamine, and N,N'-dimethyldocosylamine; The phosphonic acid compound includes at least one compound selected from the group consisting of alendronic acid, 2-phosphonobutane-1,2,4-tricarboxylic acid, 1-hydroxyethane-1,1-diphosphonic acid, glycine-N,N-bis(methylenephosphonic acid), nitrilotris(methylenephosphonic acid), N,N,N',N'-ethylenediaminetetrakis(methylenephosphonic acid), and pyrophosphoric acid; The hydrophilic glycol ether compound includes at least one compound selected from the group consisting of ethylene glycol monomethyl ether, ethylene glycol monobutyl ether, ethylene glycol monoallyl ether, propylene glycol monopropyl ether, ethylene glycol monoisobutyl ether, ethylene glycol monopropyl ether, ethylene glycol mono-tert-butyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, tripropylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, diethylene glycol monoisobutyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monobenzyl ether, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, diethylene glycol isopropyl methyl ether, triethylene glycol monomethyl ether, triethylene glycol monobutyl ether, triethylene glycol dimethyl ether, diethylene glycol monohexyl ether, ethylene glycol monoisopropyl ether, 2-methoxybutanol, 3-methoxybutanol, and 3-methoxy-3-methylbutanol; The hydrophilicity means that the solubility of the target compound in water is more than 50% by mass; The hydrophobicity refers to the property that the solubility of water in a target compound is 50% by mass or less; the hydrophilic glycol ether compound is contained in the stock solution for the cleaning composition for deflux at a content of 68 to 90% by mass, the hydrophobic tertiary amine compound is contained in the stock solution for the cleaning composition for deflux in an amount of 8 to 24% by mass, the content of the phosphonic acid compound is 2 to 8 mass % based on the total amount of the stock solution for the cleaning composition for deflux; A concentrate for a cleaning composition that is diluted 1.25 to 20 times with water when used to clean objects to be cleaned.

Images