Cleaning Equipment

The cleaning device addresses the issue of rotational speed instability in semiconductor wafers by using rollers with protrusions that enter substrate notches, preventing slipping and maintaining stable rotation for effective cleaning.

JP7672293B2Active Publication Date: 2025-05-07SHIBAURA MECHATRONICS CORP
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Patent Information

Application Number
JP2021110014
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-07-01
Publication Date
2025-05-07
Estimated Expiration
2041-07-01

AI Technical Summary

Technical Problem

The existing cleaning devices for semiconductor wafers face instability in rotational speed due to the presence of notches on the substrate, which can cause the rollers to slip and result in reduced or stopped rotation.

Method used

The cleaning device incorporates a rotational driving unit with rollers that have protrusions designed to enter the notches on the substrate, ensuring continuous rotation by preventing slipping and maintaining stable rotational speed.

Benefits of technology

This solution effectively reduces the likelihood of rotational speed decrease and complete stoppage of the substrate, thereby enhancing the cleaning process's reliability and preventing contamination from roller slipping.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a cleaning device that can reduce rotation speed reduction and rotation stoppage of a substrate.SOLUTION: A cleaning device includes a rotation driving unit 10 that rotates a substrate W by rotating a plurality of rollers 10a that hold the outer periphery of the substrate W, a cleaning liquid ejection unit 40 that discharges a cleaning liquid onto the substrate W, and a cleaning unit 20 that cleans the surface of the substrate W by bringing a brush into contact with at least one surface of the rotating substrate W. The roller 10a has a protruding portion that protrudes into a notch N of the substrate W at a position that abuts on the outer periphery of the substrate W.SELECTED DRAWING: Figure 1
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Description

[Technical field]

[0001] The present invention relates to a cleaning device. [Background technology]

[0002] In the manufacturing process of semiconductor devices, it is sometimes required to clean the surface of the semiconductor wafer, which is the substrate, with a high degree of cleanliness. For example, after chemical mechanical polishing (CMP) is performed to flatten the surface of the substrate, particles such as polishing debris containing organic matter and metals and slurry residues (hereinafter referred to as contaminants) are attached to the surface of the substrate.

[0003] Contaminants can cause defects in products because they can hinder flat film formation and lead to short circuits in circuit patterns. Therefore, it is necessary to remove the contaminants by cleaning the substrate with a cleaning liquid. A cleaning device that uses a rotating brush is known as a device for performing such cleaning (see Patent Document 1).

[0004] This cleaning device rotates the substrate and moves a rotating brush in a direction parallel to the substrate while contacting the surface of the substrate with the cleaning liquid in between, whereby contaminants adhering to the surface of the substrate are floated by the cleaning liquid and removed from the substrate by the brush, thereby cleaning the entire substrate.

[0005] The substrate is rotated by holding its periphery with multiple circular rollers and driving the rollers to rotate in the same direction. The rotation speed of the substrate can be adjusted by changing the rotation speed of the rollers, and the rotation speed of the substrate can be detected from the rotation speed of the motor that rotates the rollers. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 7-283180 Summary of the Invention [Problem to be solved by the invention]

[0007] In order to keep the rotation speed of the substrate constant and stable, it is preferable that the rotating roller and the substrate are perfectly circular, however, the outer periphery of the substrate has a small notch that indicates the crystal orientation and serves as a guide for aligning the substrate.

[0008] As a result, the outer periphery of the substrate is not a perfect circle, and a tiny depression occurs in the notch. When the roller comes into contact with the notch in the substrate, the rotation of the roller is no longer transmitted to the substrate and the substrate begins to slip, causing the substrate to slow down and become unstable, or even to stop rotating altogether.

[0009] The present invention has been proposed to solve the above-mentioned problems, and an object of the present invention is to provide a cleaning apparatus that can reduce the occurrence of reductions in the rotation speed and stops of the substrate. [Means for solving the problem]

[0010] In order to solve the above problems, the cleaning apparatus of the present invention has a rotational drive unit that rotates the substrate by rotating a number of rollers that hold the outer periphery of the substrate, a cleaning liquid discharge unit that discharges a cleaning liquid onto the substrate, a cleaning unit that cleans the surface of the substrate by contacting a brush with at least one surface of the rotating substrate, and a protrusion provided at a position on the roller that abuts against the outer periphery of the substrate and that fits into a notch in the substrate. Effect of the Invention

[0011] The cleaning apparatus of the present invention can reduce the occurrence of reductions in rotation speed or stops of rotation of the substrate. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view showing a schematic configuration of a cleaning device according to an embodiment; [Diagram 2]FIG. 1 shows a state in which a roller without a protrusion is in contact with the outer periphery of a substrate (A) and in contact with a notch in the substrate (B). The right figure is a plan view, and the left figure is a vertical cross-sectional view taken along the arrow DD of the right figure. [Diagram 3] FIG. 1 shows a state in which a roller with a protrusion is in contact with the outer periphery of a substrate (A) and a state in which the roller is in contact with a notch in the substrate (B). The right figure is a plan view, and the left figure is a cross-sectional view taken along the arrows DD of the right figure. [Figure 4] Side view showing rollers in released position (A) and in retained position (B) [Diagram 5] Plan view showing rollers in the released position (A) and in the retained position (B) [Figure 6] Side view showing the cleaning unit [Figure 7] Plan view showing the cleaning section in the starting position (A), during cleaning (B) and in the finished position (C) [Figure 8] 1A shows a state where a modified example of the roller of the embodiment is in contact with the outer periphery of a substrate, and FIG. 1B shows a state where the roller is in contact with a notch of the substrate, the right side being a plan view, and the left side being a vertical cross-sectional view taken along the arrow DD. [Figure 9] FIG. 11 is a plan view showing a modified example of the roller according to the embodiment; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, this embodiment is a cleaning apparatus 1 that cleans a substrate W with a cleaning liquid and a brush while rotating the substrate W. The substrate W to be cleaned is typically a semiconductor wafer, but may be a substrate for a display device, etc. The substrate W is circular, and a notch N is formed on its periphery as a notch for positioning in a processing step or for indicating a crystal direction (see FIG. 2, etc.). The shape of the notch N is, for example, V-shaped or U-shaped. In a 300 mm wafer, the radial depth of the notch N is, for example, about 1 mm, but the present invention is not limited to this. In addition, the periphery of the substrate W is beveled. In other words, the corners are ground to provide chamfering.

[0014] [composition] As shown in FIG. 1, the cleaning device 1 includes a rotation drive unit 10, a cleaning unit 20, a brush drive unit 30, and a cleaning liquid discharge unit 40.

[0015] (Rotation drive unit) The rotation drive unit 10 rotates a plurality of rollers 10a that hold the outer periphery of the substrate W, thereby rotating the substrate W. The rotation drive unit 10 has a first holding unit 11, a second holding unit 12, a first driving unit 13, and a second driving unit 14. The first holding unit 11 and the second holding unit 12 are disposed at positions facing each other with the substrate W interposed therebetween.

[0016] Each of the first holding unit 11 and the second holding unit 12 has a pair of rollers 10a. The rollers 10a are provided rotatably about an axis perpendicular to the substrate W. As shown in FIGS. 2A and 2B, each of the rollers 10a in the first holding unit 11 and the second holding unit 12 has a large-diameter cylindrical base unit 101 and a small-diameter cylindrical transmission unit 102 provided coaxially on the upper surface of the base unit 101. The upper surface of the base unit 101 is tapered so as to become higher toward the transmission unit 102. The side surface of the transmission unit 102 abuts against the outer periphery of the substrate W to hold the substrate W. The rollers 10a are formed of a material having resistance to cleaning liquid, such as PEEK.

[0017] 3(A) and 3(B), one of the four rollers 10a is provided with a protrusion 103 that fits into the notch N of the substrate W at a position where it abuts against the outer periphery of the substrate W. A plurality of protrusions 103 are provided along the outer periphery of the roller 10a. Each protrusion 103 is provided to be movable between a protruding position where at least a portion of the protrusion 103 protrudes so as to fit into the notch N of the substrate W, and a retracted position where the protrusion 103 is urged by the outer periphery of the substrate W and retracts.

[0018] In the roller 10a of this embodiment, a plurality of radial accommodation holes 102a are formed at equal intervals along the outer circumferential circle on the side surface of the transmission part 102. In the example of Fig. 3, 12 accommodation holes 102a are formed radially, and each accommodation hole 102a is provided with a protrusion 103.

[0019] The protrusion 103 has an abutment portion 103a and a support portion 103b. The abutment portion 103a is, for example, cylindrical with one end having a rounded corner, and the one end abuts against the outer periphery of the substrate W. The abutment portion 103a has a shape and size (width and depth) that allows a part of the abutment portion 103a to enter the notch N. It is preferable to prevent wobbling by forming a part of the shape and size of the abutment portion 103a so that a gap is minimized when the abutment portion 103a enters the notch N. For example, the shape and size of the part of the abutment portion 103a that enters the notch N may be a shape and size that matches the notch N, that is, a shape and size that is almost the same as the notch N. This can minimize the gap when the abutment portion 103a enters the notch N, so that the substrate W can be rotated more smoothly. Note that, regardless of whether the protrusion 103 has the configuration shown in FIG. 3 or not, the shape and size of the part of the protrusion 103 that enters the notch N may be a shape and size that matches the notch N. The support portion 103b elastically supports the other end of the abutment portion 103a. The support portion 103b is, for example, a compression coil spring. The support portion 103b is inserted into each accommodation hole 102a so that the support portion 103b faces inward and the abutment portion 103a faces outward.

[0020] Therefore, as shown in Fig. 3(A), when the outer periphery of the substrate W contacts the side surface of the transmission part 102, the contact part 103a is pushed in against the biasing force of the support part 103b, so that the protrusion part 103 is in the retracted position. However, as shown in Fig. 3(B), when the notch N of the substrate W comes to the side surface of the transmission part 102, the contact part 103a protrudes and enters the notch N due to the biasing force of the support part 103b, so that the protrusion part 103 is in the protruding position. Note that even when the outer periphery of the substrate W does not contact the side surface of the transmission part 102, the contact part 103a protrudes due to the biasing force of the support part 103b. Note that the contact part 103a and the support part 103b are preferably made of a material having resistance to the cleaning liquid, for example, the same material as the roller 10a.

[0021] 1, the first driving unit 13 and the second driving unit 14 support the first holding unit 11 and the second holding unit 12, respectively, and rotate the roller 10a about its axis and move the roller 10a in a direction toward and away from the substrate W. The first driving unit 13 and the second driving unit 14 house a rotation mechanism (not shown) that drives the roller 10a.

[0022] The rotation mechanism is, for example, a belt drive mechanism. That is, a belt for transmitting a driving force is stretched between a drive shaft of a motor serving as a drive source and a pulley provided on the drive shaft of one roller 10a, and between pulleys provided on the drive shafts of the pair of rollers 10a, so that the pair of rollers 10a can be rotated by the drive source. Note that the rotation mechanism is not limited to this, and for example, each roller 10a may be configured to rotate by a motor provided on each roller 10a.

[0023] As described above, the first driving unit 13 and the second driving unit 14 are configured to be movable in a direction toward and away from the substrate W. That is, a driving mechanism (not shown) is provided at the lower end of each of the first driving unit 13 and the second driving unit 14, and this driving mechanism moves the first driving unit 13 and the second driving unit 14 in a direction toward and away from the substrate W. As a result, the first holding unit 11 and the second holding unit 12 also move in a direction toward and away from the substrate W. For example, as the driving mechanism, a rotary cylinder can be used that moves the driving shafts provided at the lower ends of the first driving unit 13 and the second driving unit 14 in opposite directions along a direction parallel to the surface of the substrate W.

[0024] The drive mechanism moves the first holding portion 11 and the second holding portion 12 in directions away from each other, so that the transmission portion 102 of the roller 10a is in a release position away from the substrate W, as shown in Figures 4(A) and 5(A). The drive mechanism moves the first holding portion 11 and the second holding portion 12 in directions toward each other, so that the transmission portion 102 of the roller 10a is in a holding position where it contacts and holds the substrate W, as shown in Figures 4(B) and 5(B).

[0025] (Cleaning section) The cleaning unit 20 cleans the surface of the substrate W by bringing a rotating brush 25 into contact with the surface of the rotating substrate W. Note that the contact referred to here includes both direct contact by the brush 25 and contact via a cleaning liquid. As shown in the side view of FIG. 6, the cleaning unit 20 has a body 21, a brush holder 23, a support 24, and a brush 25. The body 21 is a cylindrical container and houses a motor (not shown) therein. The motor is a drive source that rotates the brush 25, and is a hollow motor with a cylindrical drive shaft.

[0026] The brush holder 23 is a disk-shaped member attached to the drive shaft of the motor, and to which the support 24 is detachably provided. The brush holder 23 is provided so as to be rotatable independently of the body 21. The support 24 is a disk-shaped member to which the brush 25 is fixed, and which is attached to and detached from the brush holder 23 by a chuck mechanism or the like.

[0027] The brush 25 is a cylindrical member made of a material having flexibility and elasticity. The brush 25 of this embodiment uses a spongy resin such as PVA (nylon resin) or PTFE (fluorine resin). A bristle brush made of a similar resin may also be used. That is, the brush 25 of this embodiment includes a spongy mass and a mass of many densely packed hair bodies. The spongy mass brush also includes a mass of a plurality of densely packed fibrous bodies. The number of brushes 25 provided on the support 24 may be one or more.

[0028] (Brush drive unit) 1, the brush driving unit 30 moves the cleaning unit 20 in a direction parallel to the surface of the substrate W. The brush driving unit 30 has an arm 31 and a driving mechanism 32. The arm 31 is a member in a direction parallel to the substrate W, and has the cleaning unit 20 attached to one end. The driving mechanism 32 has a swinging mechanism and a lifting mechanism.

[0029] 7(A) to 7(C), the swing mechanism reciprocates the arm 31 in parallel to the substrate W from the outer periphery of the substrate W to the outer periphery on the opposite side in an arc trajectory with the end portion opposite the cleaning unit 20 as the axis. The swing mechanism also reciprocates the arm 31 from a standby position to the outer periphery of the substrate W. The swing mechanism has a support shaft extending from the arm 31 in a direction perpendicular to the surface of the substrate W, and a motor (not shown) which is a drive source for swinging the support shaft. When the substrate W is not being cleaned, the arm 31 is positioned at a standby position (not shown) outside the substrate W.

[0030] 4(A) and (B), the lifting mechanism moves the arm 31 in a direction in which the cleaning unit 20 approaches or moves away from the substrate W. As the lifting mechanism, a ball screw mechanism, a cylinder, or the like that raises and lowers the support shaft of the arm 31 can be used.

[0031] (Cleaning liquid discharge part) The cleaning liquid discharge unit 40 discharges the cleaning liquid onto the substrate W. The cleaning liquid discharge unit 40 has a nozzle 41, and discharges the cleaning liquid from a discharge port 41a at the tip of the nozzle 41 onto both sides of the rotating substrate W (see FIGS. 7(A) to (C)). The cleaning liquid in this embodiment is ozone water, pure water, or SC-1 (a cleaning liquid made by mixing ammonia water and hydrogen peroxide). For example, when the brush 25 is made of PVA, cleaning is performed with pure water. Also, when the brush 25 is made of PTFE, ozone water or SC-1 is used. Since PTFE is liquid resistant, it can be used in combination with cleaning liquids such as ozone water and SC1.

[0032] The nozzles 41 are cylindrical bodies provided in a pair above and below sandwiching the substrate W. One end of the nozzle 41 is bent at an angle of, for example, 45° with respect to the surface of the substrate W, and has an outlet 41a for ejecting the cleaning liquid toward the surface of the substrate W. The nozzle 41 ejects the cleaning liquid from the outside of the substrate W toward the vicinity of the center of the surface of the substrate W, that is, in a spraying manner toward the middle of the movement path of the brush 25.

[0033] The other end of the nozzle 41 is connected to a cleaning liquid supply device (not shown) via piping. The supply device has a liquid delivery device, valves, etc. connected to a pure water production device (pure water storage tank), an ozone water production device (ozone water storage tank), and an SC-1 supply device, and can switch between supplying pure water, ozone water, and SC-1. Note that the nozzles 41 may be provided one for each surface of the substrate W, or multiple nozzles may be provided for each surface. Furthermore, the number of nozzles provided on one surface of the substrate W may be different from the number of nozzles provided on the other surface.

[0034] 4, the cleaning unit 20, brush drive unit 30, and cleaning liquid discharge unit 40 as described above are provided in pairs above and below the substrate W so as to be able to clean the upper and lower surfaces (also called the front and back surfaces) of the substrate W. That is, the pair of cleaning units 20 have a pair of arms 31 of the brush drive unit 30 disposed above and below the substrate W so that their respective brushes 25 and discharge ports 41a face the substrate W. The drive mechanism 32 moves the pair of arms 31 between a contact position (FIG. 4(B)) where the pair of brushes 25 are in contact with the substrate W so as to sandwich it therebetween, and a separated position (FIG. 4(A)) where they are separated from the substrate W.

[0035] Moreover, the driving mechanism 32 swings the pair of arms 31 to move the pair of brushes 25 at the contact position along an arc trajectory as shown in Figures 7(A) to 7(C). When viewed in a plan view, the contact position is the start point of the swinging of the brushes 25 as shown in Figure 7(A), and the separated position is the end point of the swinging of the brushes 25 as shown in Figure 7(C). Furthermore, the contact positions are on the outer periphery of the substrate W, and the separated position is on the outer periphery of the substrate W opposite to the contact positions.

[0036] [Operation] The operation of the cleaning device 1 having the above configuration will be described. (Delivery of circuit boards) First, the operation of carrying in the substrate W will be described. That is, in the previous process, ozone water is applied to the surface of the processed substrate W, and an oxide film is formed, thereby making the surface hydrophilic. The surface of the substrate W on which this oxide film is formed has organic contaminants (slurry, etc.) and metal contaminants remaining from the CMP process, which is the process before the previous process, attached thereto. This means that the ozone water is supplied with the contaminants still attached to the front and back surfaces of the substrate W, that is, the oxide film is formed with the contaminants still attached. Although ozone water has the ability to remove organic matter, this previous process is not a process for removing organic matter, but rather a process aimed at making the front and back surfaces of the substrate W hydrophilic.

[0037] The transport robot transports the substrate W from the previous process to the cleaning apparatus 1, and then transports the substrate W between the rollers 10a of the first holding unit 11 and the second holding unit 12, as shown in Fig. 4(A) and Fig. 5(A). The first holding unit 11 and the second holding unit 12 move in a direction approaching each other, as shown in Fig. 4(B) and Fig. 5(B). Then, the four rollers 10a move toward the substrate W, so that the inclination of the upper surface of the base unit 101 pushes up the outer periphery of the substrate W, and the side of the transfer unit 102 comes into contact with the outer periphery of the substrate W, thereby holding the substrate W.

[0038] (Substrate cleaning) Next, the cleaning operation of the substrate W will be described. As shown in FIG. 2 and FIG. 5(B), the roller 10a rotates clockwise in the figure, causing the substrate W to rotate counterclockwise. For example, the roller 10a rotates at a low speed of 20 to 60 rpm. As shown in FIG. 2(A), when the side surface of the transmission portion 102 of the roller 10a is in contact with the outer periphery of the substrate W other than the notch N, the rotation of the roller 10a is transmitted to the substrate W, and the rotation of the substrate W is maintained. At this time, as shown in FIG. 3(A), in the roller 10a provided with the protrusion 103, the contact portion 103a comes in contact with the outer periphery of the substrate W and is pushed into the accommodation hole 102a against the biasing force of the support portion 103b, resulting in a retracted position.

[0039] 3(B), when the notch N of the substrate W comes to a position where it contacts the side surface of the transmission part 102 of the roller 10a provided with the protrusion 103, the biasing force of the support part 103b causes the abutment part 103a to protrude and enter the notch N to assume the protruding position. Then, the abutment part 103a biases the inner wall of the notch N, so that as the roller 10a rotates, the substrate W is pushed out in the rotational direction, and the rotation of the substrate W is maintained. Note that even when the side surface of the transmission part 102 of the roller 10a is not in contact with the outer periphery of the substrate W, the biasing force of the support part 103b causes the abutment part 103a to protrude and assume the protruding position.

[0040] The upper and lower arms 31 are initially in a standby state at a standby position outside the substrate W. The upper and lower arms 31 in the standby position swing to above the outer periphery of the substrate W as shown in Fig. 7(A) while rotating the brushes 25 by the motor 22, and then stop temporarily. Then, as the upper and lower arms 31 move in directions approaching the substrate W, the brushes 25 of the upper and lower cleaning units 20 come into contact with the front and back surfaces of the substrate W as shown in Fig. 4(B), thereby sandwiching the substrate W. The black arrows in the figure indicate the rotation direction of the substrate W.

[0041] Then, the upper and lower arms 31 rotate, causing the upper and lower brushes 25 to move horizontally. At this time, the cleaning liquid is discharged from the discharge port 41a of the nozzle 41, so that the cleaning liquid flows between the brush 25 and the substrate W. That is, as shown in Figures 7(A) and (B), the brush 25 starts moving from one side of the outer periphery of the substrate W, and while moving along the arc trajectory indicated by the white arrow in the figure, pushes out contaminants together with the cleaning liquid to the outer periphery of the substrate W. As shown in Figure 7(C), when the brush 25 passes over the other side of the outer periphery of the substrate W and is separated from the substrate W, the brush 25 stops rotating, stops discharging the cleaning liquid from the discharge port 41a, and ends the cleaning process.

[0042] Note that the circumferential speed differs between the outer periphery and the center of the substrate W, with the circumferential speed being faster on the outer periphery and the area to be cleaned per rotation being larger, so the horizontal movement of the brush 25 is slowed down. That is, the movement speed of the arm 31 caused by the brush drive unit 30 is slowed down. The circumferential speed is slower toward the center and the area to be cleaned per rotation is smaller, so the horizontal movement of the brush 25 is made faster. That is, the movement speed of the arm 31 caused by the brush drive unit 30 is made faster. Note that the movement speed for swinging the brush 25 may be constant.

[0043] Then, the upper and lower arms 31 move in directions away from each other, causing the upper and lower brushes 25 to move away from each other, and the arms 31 further swing to retreat to a standby position outside the outer periphery of the substrate W. Note that the above operation may then be repeated to perform cleaning with the brushes 25 multiple times. In this case, after each cleaning, the arms 31 return to the position where the cleaning starts (see FIG. 4(A) and FIG. 7(A)).

[0044] (Action and effect) (1) The cleaning apparatus 1 of this embodiment as described above includes a rotation drive unit 10 that rotates the substrate W by rotating a plurality of rollers 10a that hold the outer periphery of the substrate W, a cleaning liquid ejection unit 40 that ejects a cleaning liquid onto the substrate W, a cleaning unit 20 that cleans the surface of the substrate W by contacting a brush 25 with at least one surface of the rotating substrate W, and a protrusion 103 provided at a position on the rollers 10a where it abuts against the outer periphery of the substrate W and fits into the notch N of the substrate W.

[0045] Therefore, when the notch N of the rotating substrate W comes to a position where it contacts the roller 10a, the protrusion 103 enters the notch N and biases the notch N, preventing the roller 10a from slipping due to the notch N, and the substrate W is pushed in the rotational direction to maintain rotation. This makes it possible to reduce a decrease in the rotational speed of the substrate W or a stop in rotation.

[0046] If the roller 10a slips on the notch N and rotates idly, the roller 10a may be scraped, generating dust and possibly contaminating the substrate W. However, in this embodiment, the rotation of the substrate W is maintained and the roller 10a is prevented from rotating idly, thereby reducing the possibility of the substrate W being contaminated by dust.

[0047] When the rotation of the substrate W stops, the cleaning unit 20 presses the brush 25 against it and oscillates it, so that only the areas that the brush 25 passes through can be cleaned, making it impossible to uniformly clean the entire surface of the substrate W. However, in this embodiment, this kind of situation can be reduced, and the occurrence of poor cleaning can be suppressed.

[0048] Furthermore, when the brush 25 is located near the outer periphery of the substrate W, the resistance to the rotation of the substrate W by the brush 25 increases, making it easier for the substrate W to stop due to the notch N. In particular, when the brush 25 is pressed against the substrate W from above and below as in the above-mentioned embodiment, the resistance to rotation increases and the substrate W is more likely to stop. However, in this embodiment, even if there is resistance from the brush 25, the protrusion 103 can fit into the notch N to prevent the rotation from stopping.

[0049] Furthermore, even if the force with which the rollers 10a pinch the substrate W is relatively weak, the protrusions 103 can enter the notches N to reduce slippage, thereby preventing damage to the substrate W compared to when the force with which the substrate W is pinched is strong to prevent slippage of the substrate W.

[0050] Furthermore, since roller 10a is required to be liquid resistant and is relatively hard, it is prone to slipping on notch N, but rubber and the like are not liquid resistant and therefore difficult to use as an anti-slip material. In this embodiment, a liquid resistant material is used for roller 10a and protrusion 103, while still providing anti-slip properties.

[0051] (2) A plurality of protrusions 103 are provided along the outer periphery of the roller 10a. This increases the likelihood that the protrusions 103 will enter the notches N, further reducing the possibility that the rotation speed of the substrate W will decrease or the rotation will stop.

[0052] (3) The protrusion 103 is provided so as to be movable between a protruding position where it protrudes so that at least a portion of it enters the notch N of the substrate W, and a retracted position where it is urged against the outer periphery of the substrate W and retracts. Therefore, when the roller 10a comes into contact with the outer periphery of the substrate W other than the notch N, the protrusion 103 is urged to retract, so that the side surface of the transmission part 102 of the roller 10a is in the same state as a portion where the protrusion 103 is not provided. This keeps the amount of unevenness at the portion of the side surface of the transmission part 102 of the roller 10a that comes into contact with the substrate W to a minimum, thereby maintaining smooth rotation.

[0053] (4) The protruding portion 103 has a contact portion 103a, one end of which contacts the outer periphery of the substrate W, and a support portion 103b that elastically supports the other end of the contact portion 103a. Therefore, the protruding portion 103, which has been biased against the outer periphery of the substrate W to the retracted position, can be returned to the protruding position by the support portion 103b without the application of an external force.

[0054] (Modification) This embodiment is not limited to the above embodiment, and the following modified examples are also possible. For example, since it is sufficient for the protrusion 103 to bias the notch N in the rotational direction, the protrusion 103 may be entirely inserted into the notch N, or only partially inserted into the notch N.

[0055] Furthermore, the number of protrusions 103 on one roller 10a is not limited to the above embodiment. At least one protrusion 103 needs to be provided on the roller 10a. Even if there are multiple protrusions, the number may be less or more than the above embodiment. When multiple protrusions 103 are provided, it is preferable that they are provided on the side surface of the roller 10a in point symmetry with respect to the axis of rotation, since this can stabilize the rotation of the substrate W. Furthermore, the protrusions 103 may be provided on multiple rollers 10a. This increases the possibility that the protrusion 103 will hit the notch N, reducing the possibility of slippage. The number of rollers 10a is also not limited to the above embodiment.

[0056] The protrusion 103 may be formed of an elastic body. For example, as shown in Figs. 8(A) and (B), the protrusion 103 may be a plate-shaped elastic member with one side supported on the side surface of the transmission part 102 of the roller 10a, and the protrusion 103 may be curved to follow the outer circumference. The plate-shaped elastic member protrusion 103 has a size and shape to fit into the notch N as shown in Fig. 8(B). Such a protrusion 103 may be integrally formed from the same material as the roller 10a. By making it a thin plate, the protrusion 103 can be made elastic. Such a protrusion 103 is also biased against the outer circumference of the substrate W other than the notch N to a retreated position as shown in Fig. 8(A), and is biased at a position corresponding to the notch N to a protruding position as shown in Fig. 8(B), and biases the notch N to maintain the rotation of the substrate W.

[0057] Furthermore, the protrusion 103 may be fixedly formed on the side surface of the roller 10a. For example, as shown in Fig. 9, the side surface of the transmission part 102 may be formed with unevenness by a gently curved surface without corners, and the convex portion may be the protrusion 103. The protrusion 103, which is a gently curved surface without corners, has a size and shape that allows it to enter part of the notch N. By entering the notch N, this protrusion 103 can also urge the substrate W to maintain rotation.

[0058] The configuration of the cleaning unit 20 is not limited to the above embodiment. For example, the cleaning unit 20 may be configured to clean only one surface of the substrate W with the brush 25. The cleaning unit 20 may be configured to use a cylindrical brush 25 with an axis parallel to the surface of the substrate W, and to bring the side surface of the brush 25 into contact with the substrate W for cleaning.

[0059] [Other embodiments] Although the embodiment of the present invention and the modified examples of each part have been described above, these embodiments and the modified examples of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims. [Explanation of symbols]

[0060] 1 Cleaning equipment 10 Rotation drive unit 10a Lola 11 First holding part 12 Second holding part 13 First Drive Unit 14 Second Drive Unit 20 Cleaning section 21 Torso 22 Motor 23 Brush holder 24 Support 25 Brushes 30 Brush drive unit 31 Arm 32 Drive mechanism 40 Cleaning liquid discharge section 41 Nozzle 41a Discharge port 101 Base part 102 Transmission section 102a Storage Cave 103 Projection 103a Contact part 103b Support part

Claims

1. a rotation drive unit that rotates a plurality of rollers that hold an outer periphery of the substrate to rotate the substrate; a cleaning liquid discharge unit that discharges a cleaning liquid onto the substrate; a cleaning unit that cleans at least one surface of the rotating substrate by bringing a brush into contact with the surface of the substrate; a protrusion provided on the roller at a position where the roller abuts against an outer periphery of the substrate and fits into a notch in the substrate; A cleaning device comprising:

2. 2. The cleaning device according to claim 1, wherein the protrusion is provided in a plurality of portions along the outer periphery of the roller.

3. The cleaning apparatus according to claim 1, wherein the protrusion is movable between a protruding position where it protrudes so that at least a portion of it enters the notch of the substrate, and a retracted position where it is retracted by being biased against the outer periphery of the substrate.

4. The protrusion is a contact portion, one end of which contacts the outer periphery of the substrate; a support portion that elastically supports the other end of the abutment portion; 4. The cleaning apparatus according to claim 3, further comprising:

5. 4. The cleaning device according to claim 3, wherein the protrusion is made of an elastic material.

Citation Information

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